Package and electronic module

Abstract

This package comprises: a base substrate; a first electronic component positioned on the base substrate; and a frame body positioned on the base substrate and surrounding the first electronic component. The frame body is composed of a plurality of frame walls. The first electronic component faces one or more of the frame walls. The one or more of the frame walls facing the first electronic component have a first cutout portion cut out along a connection portion with the base substrate at an inner lower portion at a position facing the first electronic component.

Description

Package and Electronic Module

[0001] The present disclosure relates to a package and an electronic module.

[0002] For example, as disclosed in Patent Document 1, a package for housing electronic components is known.

[0003] International Publication No. 2024 / 005052

[0004] The package according to the present disclosure includes a base substrate, a first electronic component, and a frame. The first electronic component is located on the base substrate. The frame is located on the base substrate and surrounds the first electronic component. The frame is composed of a plurality of frame walls. The first electronic component faces one or more of the frame walls. At least one of the frame walls facing the first electronic component has a first notch portion cut along the connection portion with the base substrate at the inner lower portion of the position facing the first electronic component.

[0005] The electronic module according to the present disclosure includes a package, a semiconductor component located on the base substrate, and a lid located on the frame.

[0006] Perspective view of the package. Plan view of the package. Cross-sectional view of the package at the position A - A in FIG. 2. Bottom perspective view of the frame. Bottom view of the frame. Plan view showing another form of the package. Plan view showing another form of the package. Perspective view showing another form of the package. Plan view of the package in FIG. 8. Exploded perspective view of the electronic module.

[0007] Hereinafter, embodiments of the present disclosure will be described based on the drawings. However, each of the drawings referred to below is a diagram that simplifies and shows the main members necessary for explaining the embodiments for the sake of convenience of explanation. Therefore, the embodiments of the present disclosure may include any component members not shown in each of the drawings referred to. Also, each drawing does not necessarily faithfully represent the dimensional ratios of actual members.

[0008] Regarding direction, the direction facing the surface on which the first electronic component 13 of the base substrate 11 is located is defined as upward, and the opposite direction is defined as downward. Note that the direction in this disclosure does not mean the direction in actual use. For convenience, each direction is represented using the Cartesian coordinate system XYZ, with upward being the positive side of the Z direction. In this disclosure, "planar view" means viewing from above (the positive side of the Z direction), and includes planar perspective. The dashed lines in Figures 2, 6 and 7-9 indicate lines that are visible when viewed through.

[0009] In the following descriptions, expressions such as "constant," "orthogonal," "perpendicular," "parallel," and "same" may be used. These expressions do not necessarily strictly mean "constant," "orthogonal," "perpendicular," "parallel," or "same," respectively, and may allow for deviations such as manufacturing precision or installation precision. Numerical ranges indicated using "~" include the numbers before and after them as the lower and upper limits, respectively.

[0010] In electronic component packaging, reducing the overall size of the package or increasing the size of the electronic component tends to bring the frame and the electronic component closer together. When the frame and electronic component are close together, foreign matter that gets mixed in, or bonding materials such as metal brazing used to join the frame and the base substrate, can easily cause a short circuit between the frame and the electronic component.

[0011] The packages and electronic modules of this disclosure can reduce the possibility of short circuits between the frame and the electronic components.

[0012] [Package] As shown in Figures 1 to 3, 6 and 7, the package 10 comprises a base substrate 11, a first electronic component 13 located on the base substrate 11, and a frame 12 located on the base substrate 11 and surrounding the first electronic component 13. The frame 12 is composed of a plurality of frame walls 121. The first electronic component 13 faces one or more frame walls 121. Here, "facing" means that the first electronic component 13 and the frame wall 121 are in close proximity, within a distance of 2 mm or less in a plan view, and also includes the state in which the first electronic component 13 and the frame wall 121 overlap in a plan view.

[0013] The first electronic component 13 may be a wiring board, a ceramic substrate, or the like. The first electronic component 13 may be mounted directly on the base board 11, or it may be mounted via a base, heat sink, or the like. When the first electronic component 13 is mounted on the base board 11 via a base, heat sink, or the like, the base, heat sink, or the like are also considered part of the first electronic component 13. The shape of the first electronic component 13 is not particularly limited, but for example it is approximately rectangular. The planar dimensions of the first electronic component 13 are, for example, 5 mm × 5 mm to 30 mm × 25 mm.

[0014] The base substrate 11 is, for example, a plate-shaped member. The shape of the base substrate 11 is not particularly limited, but is, for example, approximately rectangular. The planar dimensions of the base substrate 11 are, for example, about 10 mm × 5 mm to 50 mm × 30 mm.

[0015] The frame 12 is a frame-shaped member composed of multiple frame walls 121. The shape of the frame 12 is not particularly limited, but they are all, for example, roughly rectangular. The planar dimensions of the frame 12 are, for example, about 10 mm x 5 mm to 50 mm x 30 mm. The thickness of the frame walls 121 is, for example, about 0.5 to 3 mm.

[0016] As shown in Figures 1 to 3, 6 and 7, at least one frame wall 121 facing the first electronic component 13 has a first notch 122 cut out along the connection portion with the base substrate 11 at the lower inner side of the position facing the first electronic component 13. This allows for a clearance between the frame wall 121 and the first electronic component 13 without increasing the overall size of the package 10 and / or expanding the mounting area of ​​the first electronic component 13. This clearance reduces the possibility of short-circuiting the frame wall 121 and the first electronic component 13 due to foreign matter mixed into the mounting area or bonding materials such as metal brazing material used to join the frame 12 and the base substrate 11 wetting and spreading. In addition, the presence of an uncut portion above the first notch 122 increases the strength of the frame wall 121 compared to a case where the frame wall 121 is uniformly thin from top to bottom. In this disclosure, "inside" of the frame 12 and frame wall 121 refers to the side of the region enclosed by the frame 12, that is, the side on which the first electronic component 13 is located. "Outside" of the frame 12 and frame wall 121 refers to the opposite side of the inside.

[0017] The distance d1 between the first electronic component 13 and the side surface of the first notch 122 is, for example, 0.5 to 3 mm. The side surface of the first notch 122 is the surface that faces approximately horizontally among the surfaces cut out by the first notch 122. In this disclosure, "horizontal direction" means the direction parallel to the XY plane, perpendicular to the uncut portion inside the frame wall 121, for example, the inner upper surface of the frame wall 121 at the position facing the first electronic component 13 in Figures 1 and 3. For example, in a plan view, if the frame wall 121 is parallel to the X direction, the horizontal direction is the Y direction perpendicular to the X direction, and if the frame wall 121 is parallel to the Y direction, the horizontal direction is the X direction perpendicular to the Y direction. If the distance d1 between the first electronic component 13 and the side surface of the first notch 122 is 0.5 mm or more, the possibility of the first electronic component 13 coming into contact with the bonding material can be reduced. If the distance d1 between the first electronic component 13 and the side surface of the first notch 122 is 3 mm or less, the possibility of the overall size of the package 10 becoming larger can be reduced.

[0018] The first electronic component 13 may be surrounded by one or more first notches 122. For example, all four sides of the first electronic component 13 may be surrounded by one or more first notches 122.

[0019] As shown in Figures 1 to 3, 6 and 7, when the first electronic component 13 faces two or more frame walls 121, and at least two of the frame walls 121 facing the first electronic component 13 have a first notch 122, it becomes easier to expand the mounting area of ​​the first electronic component 13 compared to when only one frame wall 121 has a first notch 122.

[0020] As shown in Figures 1 to 3, 6 and 7, if the first electronic component 13 faces three or more frame walls 121, and three of the frame walls 121 facing the first electronic component 13 are continuously cut out by a single first notch 122, it becomes easier to expand the mounting area of ​​the first electronic component 13.

[0021] As shown in Figures 1 to 3, 6 and 7, at least one frame wall 121 may have a portion that is not cut out by the first notch 122. This reduces the possibility that the frame 12 may suffer from insufficient strength or that the bonding strength between the frame 12 and the base substrate 11 may decrease. In particular, if at least two frame walls 121 facing the first electronic component 13 have the first notch 122, or if three of the frame walls 121 facing the first electronic component 13 are continuously cut out by a single first notch 122, the possibility of the frame 12 suffering from insufficient strength or that the bonding strength between the frame 12 and the base substrate 11 decreases increases, so it is effective to have at least one frame wall 121 have a portion that is not cut out by the first notch 122.

[0022] As shown in Figure 5, the corner portion 122a of the first notch 122 may be rounded (R-shaped). This makes it easier to relieve the stress applied to the corner portion 122a of the first notch 122. Note that the corner portion 122a of the first notch 122 does not have to be rounded (R-shaped); for example, it may be a chamfered (C-shaped) surface.

[0023] The depth d2 of the first notch 122 is not particularly limited, but is, for example, about 0.3 to 2.5 mm. "Depth d2 of the first notch 122" refers to the dimension of the first notch 122 in the thickness direction of the frame wall 121. The height of the first notch 122 is not particularly limited, but is, for example, about 0.3 to 5 mm. In this disclosure, "height" refers to the dimension in the Z-axis direction, as shown in Figure 3.

[0024] As shown in Figures 1 to 3, 6 and 7, the package 10 may be located on the base substrate 11 and may have a plurality of first protrusions 14 surrounding the first electronic component 13. The first protrusions 14 are used for positioning when mounting the first electronic component 13 on the base substrate 11, which facilitates the positioning of the first electronic component 13 and improves the accuracy of alignment.

[0025] As shown in Figures 1, 2, 6, and 7, at least one first protrusion 14 may be located near a corner of the first electronic component 13. This reduces the possibility of the positioned first electronic component 13 rotating. "Near a corner" refers to a part of the first electronic component 13 that is closer to a corner than to the center of its edge.

[0026] The number of first protrusions 14 is not particularly limited, but if there are at least four, it becomes possible to position the first electronic component 13 on all four sides, and the accuracy of the alignment is further improved.

[0027] The distance d3 between the first protrusion 14 and the side surface of the first notch 122 is, for example, 0.5 to 3 mm. If the distance d3 between the first protrusion 14 and the side surface of the first notch 122 is 0.5 mm or more, the possibility of the first protrusion 14 coming into contact with the bonding material can be reduced. If the distance d3 between the first protrusion 14 and the side surface of the first notch 122 is 3 mm or less, the possibility of the overall size of the package 10 becoming larger can be reduced.

[0028] As shown in Figure 3, the height h1 of the first electronic component 13 may be higher than the height h2 of the first protrusion 14. This reduces the possibility that the bonding material used when joining the first electronic component 13 to the base substrate 11 may flow up to the first protrusion 14 and then crawl up the first protrusion 14 by capillary action, causing the bonding material to reach the upper surface of the first electronic component 13. The height h1 of the first electronic component 13 and the height h2 of the first protrusion 14 are, for example, about 0.1 to 3 mm.

[0029] If all or part of the side surface of the first electronic component 13 is metallized and the first protrusion 14 is made of metal, a fillet of a bonding material such as metal brazing material may be formed between the side surface of the first electronic component 13 and the first protrusion 14. This improves the bonding strength between the first electronic component 13 and the first protrusion 14.

[0030] As shown in Figures 1, 2, and 7, the package 10 may be joined to the frame 12 and may have one or more input / output terminals 17 that penetrate the inside and outside of the package 10. The input / output terminals 17 function as transmission paths for input and output signals inside and outside the package 10.

[0031] As shown in Figures 1, 2, and 7, at least one first protrusion 14 may be located between the first electronic component 13 and the input / output terminal 17. This reduces the possibility of foreign matter entering between the first electronic component 13 and the input / output terminal 17 and causing a short circuit.

[0032] As shown in Figures 4 and 5, if the package 10 is equipped with input / output terminals 17, the frame 12 may have a recessed mating portion 123 on the base substrate 11 side that engages with the input / output terminals 17. In this case, the height of the mating portion 123 may be lower than the height h3 of the first notch 122. The first notch 122 needs to be somewhat high to prevent contact with the first electronic component 13 and / or the first protrusion 14, but the mating portion 123 does not need to be high in terms of design. Therefore, the mating portion 123 can easily be made lower than the first notch 122. The lower the mating portion 123, the stronger the frame 12 tends to be. Therefore, by making the height of the mating portion 123 lower than the height h3 of the first notch 122, the possibility of the frame 12 suffering from insufficient strength is reduced. The heights of the mating portion 123 and the input / output terminals 17 are not particularly limited, but are, for example, about 0.3 to 5 mm.

[0033] As shown in Figure 6, the package 10 does not necessarily have input / output terminals 17. In this case, as shown in Figure 6, the first electronic component 13 and a part of the second electronic component 15 (described later) may extend to the outside of the frame 12, thereby enabling signal transmission both inside and outside the package 10.

[0034] As shown in Figures 2 and 6, the first electronic component 13 does not have to overlap with the first notch 122 in a plan view. This makes it possible to attach the first electronic component 13 to the base substrate 11 even after the frame 12 has been joined to the base substrate 11, thus simplifying the assembly of the package 10. In addition, the increased clearance between the first electronic component 13 and the side surface of the first notch 122 reduces the possibility of foreign matter or bonding material short-circuiting the frame wall 121 and the first electronic component 13 if foreign matter is mixed into the mounting area or if the bonding material used to join the base substrate 11 and the frame 12 becomes wet and spreads.

[0035] As shown in Figures 2 and 6, at least a portion of at least one of the first protrusions 14 may overlap with the first notch 122 in a plan view. This makes it easier to expand the mounting area for the first electronic component 13 without increasing the overall size of the package 10, even when the first protrusions 14 are provided.

[0036] As shown in Figure 7, at least a portion of the first electronic component 13 may overlap the first notch 122 in a plan view, with a gap between it and the side surface of the first notch 122. By having at least a portion of the first electronic component 13 overlap the first notch 122 in a plan view, the package 10 can be made smaller. Furthermore, by leaving a gap between the first electronic component 13 and the side surface of the first notch 122, that is, by having a clearance between the frame wall 121 and the first electronic component 13, the possibility of foreign matter or bonding material short-circuiting the frame wall 121 and the first electronic component 13 in the event of foreign matter being mixed into the mounting area or the bonding material used to join the base substrate 11 and the frame body 12 becoming wet and spreading can be reduced.

[0037] As shown in Figure 6, the package 10 may include a second electronic component 15 located on the base substrate 11. The second electronic component 15 may be a wiring board, a ceramic substrate, or the like. The second electronic component 15 may be mounted directly on the base substrate 11, or it may be mounted via a base, heat sink, or the like. When the second electronic component 15 is mounted on the base substrate 11 via a base, heat sink, or the like, the base, heat sink, or the like are also considered part of the second electronic component 15.

[0038] As shown in Figure 6, the second electronic component 15 may face one or more frame walls 121. The frame wall 121 facing the second electronic component 15 may be the same as the frame wall 121 facing the first electronic component 13. At least one frame wall 121 facing the second electronic component 15 may have a second notch 124 cut out along the connection portion with the base substrate 11 at the lower inner side of the position facing the second electronic component 15. The possible forms of the second notch 124 are the same as the possible forms of the first notch 122 described above.

[0039] As shown in Figure 6, the package 10 may have a plurality of second protrusions 16 that are located on the base substrate 11 and surround the second electronic component 15. The possible forms of the second protrusions 16 are the same as the possible forms of the first protrusions 14 described above.

[0040] The package 10 may be in the form shown in Figures 8 and 9. The base substrate 11 may have a groove 125 on its surface between the first electronic component 13 and at least one frame wall 121 in a plan view. This groove 125 prevents the bonding material, such as metal brazing material used to join the frame 12 and the base substrate 11, from wetting and spreading and entering the mounting area of ​​the first electronic component 13. As shown in Figures 8 and 9, the groove 125 may be provided between the first electronic component 13 and the first notch 122. Alternatively, or in addition to, the groove may be provided between the first electronic component 13 and the portion not cut out by the first notch 122.

[0041] When the groove 125 is provided between the first electronic component 13 and a plurality of frame walls 121, it may be connected as a single unit so as to surround the first electronic component 13. As shown in Figures 8 and 9, the end 125a of the groove 125 may be located around the first electronic component 13, in a portion not facing the frame wall 121, and may be bent outward toward the first electronic component 13. This configuration can prevent metal brazing material remaining at the end of the groove 125 from entering the first electronic component 13. The bent portion including the end 125a of the groove 125 may be located along the frame wall 121 or away from the frame wall 121. When the groove 125 is located along the frame wall 121, the brazing material used when joining the frame body 12 and the base substrate 11 can be more reliably contained in the groove 125, and the spreading of the brazing material to other areas on the surface of the base substrate 11 can be suppressed.

[0042] The groove 125 provided between the first electronic component 13 and at least one frame wall 121 may or may not overlap with the first notch 122 in a plan view, as shown in Figure 9. If at least a portion of the groove 125 overlaps with the first notch 122 in a plan view, the package 10 can be made smaller. If the entire groove 125 overlaps with the first notch 122 in a plan view, the package 10 can be made smaller, and at the same time, the mounting area for the first electronic component 13 can be made larger.

[0043] In a plan view, the outer edge of the groove 125 and the edge of the first notch 122 may overlap. According to such a configuration, the brazing material used for joining the frame body 12 and the base substrate 11 can be more reliably accommodated in the groove 125, and it is possible to suppress the brazing material from spreading and wetting other regions on the surface of the base substrate 11.

[0044] As shown in FIGS. 8 and 9, the first protrusion 14a may have a triangular shape in a plan view. In this case, one vertex of the triangle in the plan view faces the first electronic component 13, and when there is a groove 125 between the other two vertices of the triangle and the sides between these two vertices and the frame wall 121 or between the frame wall 121 and the first electronic component 13, it may face the groove 125. When the first protrusion 14a has a triangular shape and one vertex faces the first electronic component 13, the side between the two vertices of the first protrusion 14a does not face the first electronic component 13. Thereby, even when a fillet of a metal brazing material is formed on the side surface of the first protrusion 14a, the fillet does not face the first electronic component 13, so that the first electronic component 13 can be stably installed on the base substrate 11. In addition, even when the installation space on the base substrate 11 is limited, the first protrusion 14a having a triangular shape with a small number of sides can be installed. Note that the shape of the first protrusion 14 is not limited to a triangular shape, and may be other polygonal shapes as long as the sides between the vertices can be installed so as not to face the first electronic component 13. For example, when the first protrusion 14 is a quadrilateral in a plan view as shown in FIGS. 1 and 2, the first protrusion 14 may be rotated 45 degrees so that the vertices of the quadrilateral face the first electronic component 13.

[0045] When the first protrusion 14a is polygonal in a plan view, the side connected to the vertex closest to the polygonal first electronic component 13 may form an acute angle with the straight line facing the first protrusion 14a on the outer contour line of the first electronic component 13.

[0046] The first protrusions 14 and 14a may be located between the first electronic component 13 and the groove 125 in order to facilitate the alignment and locking of the first electronic component 13.

[0047] Package 10 may be for waveguide connection. At this time, the base substrate 11 may have through holes below the first electronic component 13. A waveguide can be connected to the through holes. When the package 10 includes the second electronic component 15, the base substrate 11 may also have through holes below the second electronic component 15. When the package 10 is for waveguide connection, the first electronic component 13 and the second electronic component 15 may be elements that convert electromagnetic waves and electrical signals.

[0048] The materials of the base substrate 11, the frame 12, the first protrusion 14, and the second protrusion 16 can be metal, ceramic, resin, etc. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper - tungsten alloy, copper - molybdenum alloy, iron - nickel - cobalt alloy, etc. Examples of ceramics include aluminum oxide - based sintered bodies, aluminum nitride - based sintered bodies, silicon carbide - based sintered bodies, mullite - based sintered bodies, glass ceramics, etc. Examples of resins include epoxy resins, polyimides, liquid crystal polymers, etc. The materials of the base substrate 11, the frame 12, the first protrusion 14, and the second protrusion 16 may be the same as each other, or may be different from each other.

[0049] The input / output terminal 17 is composed of an insulating part and a conductor, and the material of the insulating part may be the above - mentioned ceramic or resin. The insulating part of the input / output terminal 17 may be integrally formed with the base substrate 11, or may be separate from the base substrate 11.

[0050] The first protrusion 14 and the second protrusion 16 may be integrally formed with the base substrate 11, or may be separate from the base substrate 11. The frame 12 may be integrally formed with the insulating part of the base substrate 11 and / or the input / output terminal 17, or may be separate from the insulating part of the base substrate 11 and / or the input / output terminal 17. When the frame 12 and the base substrate 11 are separate, they can be joined by a joining material such as a metal brazing material. Also, the frame 12 may be formed by joining a plurality of frame walls 121, or may be formed by integrally molding a plurality of frame walls 121.

[0051] [Electronic Module] As shown in Figure 10, the electronic module 20 may include a package 10, a semiconductor component 21 located on a base substrate 11, and a cover 22 located on a frame 12. The semiconductor component 21 is a separate component from the first electronic component 13 and the second electronic component 15, and may be, for example, a light-emitting element, a photodetector, a power amplifier, etc. If the package 10 is for waveguide connection, the semiconductor component 21 may be an element that converts electromagnetic waves and electrical signals. Note that the electronic module 20 does not necessarily have to include a semiconductor component 21.

[0052] The semiconductor component 21 may be located on a mounting member provided on the base substrate 11. The semiconductor component 21 may be electrically connected to the first electronic component 13, the second electronic component 15, input / output terminals 17, etc., via connecting members such as bonding wires.

[0053] The cover 22 is, for example, a plate-shaped member that can reduce the intrusion of foreign matter such as moisture and fine particles into the interior (cavity) of the electronic module 20. The material of the cover 22 is, like the frame 12, for example, metal, ceramic, resin, etc.

[0054] As shown in Figure 10, the electronic module 20 may include a seal ring 23 located between the frame 12 and the lid 22. The seal ring 23 can function as a sealing material when the package 10 is hermetically sealed using the lid 22. The seal ring 23 may be formed, for example, by joining a frame-shaped metal plate containing an Fe-Ni alloy, Fe-Ni-Co alloy, etc., to a frame formed of a conductive paste containing a high-melting-point metal such as tungsten or molybdenum using metal brazing material or the like.

[0055] The electronic module 20 may be equipped with external terminals. These external terminals can be joined to the input / output terminals 17 by a bonding material such as metal brazing material. Examples of external terminals include lead terminals, bonding wires, and terminals on a printed circuit board (PCB). The printed circuit board (PCB) may be a flexible printed circuit board (FPC).

[0056] The following are further examples of embodiments of the wiring board and electronic component housing package relating to this disclosure.

[0057] (1) One embodiment of the package according to the present disclosure comprises a base substrate, a first electronic component located on the base substrate, and a frame located on the base substrate and surrounding the first electronic component, wherein the frame is composed of a plurality of frame walls, the first electronic component faces one or more of the frame walls, and at least one of the frame walls facing the first electronic component has a first notch cut out along the connection portion with the base substrate at the lower inner side of the position facing the first electronic component.

[0058] (2) One embodiment of the package relating to the present disclosure is the package according to (1) above, wherein the first electronic component faces two or more frame walls, at least two of the frame walls facing the first electronic component have the first notch, and at least one of the frame walls has a portion that is not cut out by the first notch.

[0059] (3) One embodiment of the package relating to the present disclosure is the package of (1) or (2) above, wherein the first electronic component does not overlap with the first notch in a plan view.

[0060] (4) One embodiment of the package relating to the present disclosure is the package according to (1) or (2) above, wherein at least a portion of the first electronic component overlaps the first notch in a plan view with a gap between it and the side surface of the first notch.

[0061] (5) One embodiment of the package relating to the present disclosure is a package of any of (1) to (4) above, comprising a plurality of first protrusions located on the base substrate and surrounding the first electronic component.

[0062] (6) One embodiment of the package relating to the present disclosure is a package according to any of (1) to (5) above, comprising a plurality of first protrusions located on the base substrate and surrounding the first electronic component, wherein at least a portion of at least one of the first protrusions overlaps with the first notch in a plan view.

[0063] (7) One embodiment of the package relating to the present disclosure is the package according to (5) or (6) above, wherein the first projection is polygonal in plan view, and the edge connected to the vertex closest to the first electronic component of the polygon forms an acute angle with the straight line in the outline of the first electronic component that is opposite to the first projection.

[0064] (8) One embodiment of the package relating to the present disclosure is any of the packages described in (1) to (7) above, wherein the base substrate has a groove between the first electronic component and at least one of the frame walls in a plan view.

[0065] (9) One embodiment of the package relating to the present disclosure is the package of (8) above, wherein the entirety of the groove overlaps with the first notch in a plan view.

[0066] (10) One embodiment of the package relating to the present disclosure is a package according to any of (1) to (9) above, comprising one or more input / output terminals that are joined to the frame and penetrate the inside and outside of the package.

[0067] (11) One embodiment of the package relating to the present disclosure is a package according to any of (1) to (10) above, wherein the first electronic component faces three or more frame walls, three of the frame walls facing the first electronic component are continuously cut out by one first notch, and at least one of the frame walls has a portion that is not cut out by the first notch.

[0068] (12) One embodiment of the package relating to the present disclosure is a package according to any of (1) to (11) above, comprising a second electronic component located on the base substrate, wherein the second electronic component faces one or more frame walls, and at least one of the frame walls facing the second electronic component has a second notch cut out along the connection portion with the base substrate at the lower inner side of the position facing the second electronic component.

[0069] (13) One embodiment of the package relating to the present disclosure is a package according to any of (10) to (12) above, wherein the frame has a recessed fitting portion on the base substrate side that fits with the input / output terminals, and the height of the fitting portion is lower than the height of the first notch.

[0070] (14) One embodiment of the package relating to the present disclosure is any of (8) to (13) above, which directly or indirectly references any of (5) to (7), wherein the height of the first electronic component is greater than the height of the first protrusion.

[0071] (15) One embodiment of the package relating to the present disclosure is a package of any of (8) to (13) and (14) that directly or indirectly reference any of (5) to (7) above, comprising one or more input / output terminals joined to the frame and penetrating the inside and outside of the package, wherein at least one of the first protrusions is located between the first electronic component and the input / output terminals.

[0072] (16) One embodiment of the package relating to the present disclosure is any of the packages described in (1) to (15) above, wherein the corner of the first notch is R-shaped.

[0073] (17) One embodiment of the package relating to the present disclosure is any of the packages described in (1) to (16) above, which is for waveguide connection, wherein the base substrate has a through hole below the first electronic component.

[0074] (18) One embodiment of the electronic module relating to the present disclosure comprises any of the packages described in (1) to (17) above, a semiconductor component located on the base substrate, and a lid located on the frame.

[0075] Furthermore, details shown in the embodiments described above may be modified as appropriate without departing from the spirit of this disclosure. The scope of this disclosure includes the scope of the invention as described in the claims and its equivalents. Various combinations of each embodiment are not limited to the examples of embodiments described above. Combinations of each embodiment are also possible.

[0076] 10 Package 11 Base board 12 Frame 121 Frame wall 122 First notch 122a Corner of the first notch 123 Fitting part 124 Second notch 125 Groove 125a End of the groove 13 First electronic component 14, 14a First protrusion 15 Second electronic component 16 Second protrusion 17 Input / output terminal 20 Electronic module 21 Semiconductor component 22 Cover 23 Seal ring

Claims

1. A package comprising a base substrate, a first electronic component located on the base substrate, and a frame located on the base substrate and surrounding the first electronic component, wherein the frame is composed of a plurality of frame walls, the first electronic component faces one or more of the frame walls, and at least one of the frame walls facing the first electronic component has a first notch cut out along the connection portion with the base substrate at the inner lower part of the position facing the first electronic component.

2. The package according to claim 1, wherein the first electronic component faces two or more frame walls, at least two of the frame walls facing the first electronic component have the first notch, and at least one of the frame walls has a portion that is not notched by the first notch.

3. The package according to claim 1 or 2, wherein the first electronic component does not overlap with the first notch in a plan view.

4. The package according to claim 1 or 2, wherein at least a portion of the first electronic component overlaps the first notch in a plan view, with a gap between it and the side surface of the first notch.

5. The package according to any one of claims 1 to 4, comprising a plurality of first protrusions located on the base substrate and surrounding the first electronic component.

6. The package according to any one of claims 1 to 5, comprising a plurality of first protrusions located on the base substrate and surrounding the first electronic component, wherein at least a portion of at least one of the first protrusions overlaps with the first notch in a plan view.

7. The package according to claim 5 or 6, wherein the first projection is polygonal in plan view, and the edge connected to the vertex closest to the first electronic component of the polygon forms an acute angle with the straight line in the outline of the first electronic component that is opposite the first projection.

8. The package according to any one of claims 1 to 7, wherein the base substrate has a groove between the first electronic component and at least one of the frame walls in a plan view.

9. The package according to claim 8, wherein the entirety of the groove overlaps with the first notch in a plan view.

10. The package according to any one of claims 1 to 9, comprising one or more input / output terminals that are joined to the frame and penetrate the inside and outside of the package.

11. The package according to any one of claims 1 to 10, wherein the first electronic component faces three or more frame walls, three of the frame walls facing the first electronic component are continuously cut out by a single first notch, and at least one of the frame walls has a portion that is not cut out by the first notch.

12. The package according to any one of claims 1 to 11, comprising a second electronic component located on the base substrate, wherein the second electronic component faces one or more frame walls, and at least one of the frame walls facing the second electronic component has a second notch cut out along the connection portion with the base substrate at the inner lower part of the position facing the second electronic component.

13. The package according to any one of claims 10 to 12, wherein the frame has a recessed mating portion on the base substrate side that engages with the input / output terminals, and the height of the mating portion is lower than the height of the first notch.

14. The package according to any one of claims 5 to 7, wherein the height of the first electronic component is greater than the height of the first protrusion.

15. The package according to any one of claims 5 to 7 or 14, comprising one or more input / output terminals joined to the frame and penetrating the inside and outside of the package, wherein at least one of the first protrusions is located between the first electronic component and the input / output terminals.

16. The package according to any one of claims 1 to 15, wherein the corner of the first notch is rounded (R-shaped).

17. The package according to any one of claims 1 to 16, wherein the base substrate is for waveguide connection and has a through hole below the first electronic component.

18. An electronic module comprising: a package according to any one of claims 1 to 17; a semiconductor component located on the base substrate; and a lid located on the frame.

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