Actuator-based active self-cleaning device for inducing multiple physical phenomena and method for cleaning multi-phase contaminants

Abstract

The present invention relates to a self-cleaning device based on multiple physical phenomena, and more specifically, to a technology integrating components for implementing various cleaning functions such as an electric field, ultrasonic waves, and heating in order to effectively remove various contaminants occurring on a target surface. The present invention can be applied to automotive cameras, light detection and ranging or laser imaging, detection and ranging (LiDAR) sensors, autonomous driving sensors, video surveillance cameras, security cameras, video surveillance devices, CCTVs, thermal imaging cameras, and electro-optical (EO) sensors. In addition to the described devices, the present invention can also be applied to automotive windshield glass, windshields, vehicle windows, side windows, rear windows, panoramic sunroofs, and cover windows (displays, smartphones, LIDAR sensors and the like). Additionally, although not described, the present invention is a technology that can also be applied to glass, various panels, covers, and windows for providing protection, defense, anti-fouling, dust-proof, contamination prevention and optical transmittance for an object.

Description

Actuator-based active self-cleaning device inducing multiphysical phenomena and multiphase contamination cleaning method

[0001] The present invention relates to an actuator-based active self-cleaning device capable of inducing multiple physical phenomena and a cleaning method for multi-phase contaminants, and more specifically, to a technology that provides an active self-cleaning device that integrates components for implementing a cleaning function using various multiple physical phenomena, such as electric fields, heat, and ultrasound, in order to effectively remove various contaminants occurring on a target surface.

[0002] Optical devices used in various industrial fields, such as automotive cameras, LiDAR sensors (light detection and ranging or laser imaging, detection and ranging), autonomous driving sensors, video surveillance cameras, security cameras, CCTVs, thermal imaging cameras, and EO sensors (electro-optical sensors), may experience unintended refraction or blockage due to surface contamination, which can lead to temporary functional failures and potentially escalate into serious safety accidents.

[0003] For this reason, a cleaning function for optical devices is highly required for the commercialization of Level 3 or higher autonomous driving technology.

[0004] To implement effective cleaning functions in outdoor or special environments where various types of contamination occur, there are methods that utilize physical phenomena such as electric fields, heat, and ultrasound, which can directly apply energy to the contaminants.

[0005] For example, an electric field can be used to move and remove droplets or dust, heat can be used to remove snow and frost accumulated on the surface, and ultrasound can be used to vibrate or atomize droplets or reduce the adhesion of contaminants attached to the surface.

[0006] While this cleaning method can remove specific contaminants using a single physical phenomenon, effective cleaning of contaminants is possible by using a combination of various physical phenomena for contaminants where the phase of the substance changes during the removal process, contaminants with easily removable characteristics such as high-viscosity liquids, or contaminants composed of two or more substances.

[0007] As a representative prior art document regarding such a cleaning method, Prior Art Document 1, Korean Registration No. 10-2070495, relates to a self-cleaning device and method for removing droplets using heat generation, and describes a method of detecting droplets occurring on the surface of a camera cover glass using the impedance of the camera cover glass or an image captured by the camera, and removing the detected droplets, dust, or frost by applying electro-wetting technology.

[0008] Next, prior art document 2, European Patent No. 3733461, Cleaning device having multi layer structure and method of operating the same, describes a method of removing droplets formed on the surface of a cleaning device by applying voltage through a substrate, a multi layer sequentially arranged on the substrate, electrodes of each layer, and a dielectric layer covering the electrodes.

[0009] In addition, Prior Art Document 3, U.S. Patent No. 10823956, Device and method for cleaning camera lens part, and Prior Art Document 4, U.S. Patent No. 11300533, Cleaning apparatus and method, describe a method of moving water droplets from the center of the cover glass outward by applying different DC voltages to a plurality of electrodes sequentially arranged on the upper surface of the cover glass.

[0010] In addition, Prior Art Document 5, Korean Registration No. 10-2529598, Self-cleaning device and method using electrical oscillation and mechanical oscillation, and Prior Art Document 6, U.S. Registration No. 11833556, Self-cleaning device and method using electrical oscillation and mechanical oscillation, describe a method of removing droplets using vibration as the main physical phenomenon, but using electrical vibration and mechanical vibration flexibly depending on the situation.

[0011] However, these methods have the problem that it is difficult to completely remove all types of contamination because they utilize only a single physical phenomenon, and they are lacking in terms of detailed methodologies for removing specific contaminants due to the lack of standardized cleaning technologies.

[0012] Therefore, in order to solve the problems of such conventional technology, there is a need for technology related to an active self-cleaning device and method based on multiphysics phenomena.

[0013] The present invention aims to solve the problems of the aforementioned prior art and provides an active self-cleaning device and method utilizing multiple physical phenomena.

[0014] To this end, the purpose is to detect contaminants generated on a target surface and, depending on the type of contaminant, to simultaneously or selectively exert at least one of three functions—electric field generation, ultrasonic generation, and heating—to provide the most suitable cleaning function.

[0015] In addition, the present invention aims to provide a self-cleaning device for multiphase contamination cleaning based on a non-uniform electrode.

[0016] To this end, the purpose is to design the width of the electrodes or the gap between electrodes non-uniformly to form an electric field gradient, thereby providing additional transport force in the direction in which the electrodes are arranged perpendicular to the contaminant as well as in the electrode length direction, and to define a cleaning path within the surface through a convergence axis and an inflection region to guide it to final discharge.

[0017] In addition, the present invention aims to provide an active self-cleaning device based on a thin-film actuator for multiphase contamination cleaning, which enables miniaturization and reduces product manufacturing costs by generating multiple physical phenomena with a single electrode material.

[0018] In addition, the purpose is to overcome the limitations of existing cleaning technologies by implementing a structure capable of actively operating according to the physical and chemical properties of the material to be cleaned, by inducing physical phenomena such as electric fields, ultrasound, and heat, either individually or in combination.

[0019] In addition, the present invention aims to provide a self-cleaning device for removing multiphase contamination using a thin-film actuator having an exposed electrode structure.

[0020] In addition, the purpose is to maximize the removal performance for various types of contaminants by inducing polarity charging or neutralization of contaminants through an exposed electrode, controlling the contaminants to a desired polarity, and then removing them through the electrode.

[0021] The purpose is to provide a self-cleaning device capable of applying various cleaning mechanisms in stages, such as inductive charging, polarity control, capture, vibration, transport, and removal of contaminants.

[0022] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood from the description below.

[0023] As a technical means for achieving the aforementioned technical problem, an active self-cleaning device utilizing multiple physical phenomena according to a first embodiment of the present invention comprises: a functional film; a substrate disposed below the functional film; a contaminant removal unit formed below the functional film; and a control unit that detects contaminants generated on the surface of the functional film and applies a control signal to the contaminant removal unit to remove the contaminants; wherein the contaminant removal unit comprises: a heating layer that generates heat to evaporate contaminants on the functional film; and an electric field generating layer that generates an electric field to detach contaminants from the functional film or move them outside the functional film. and an ultrasonic generating layer for generating ultrasonic waves to vibrate the functional film contaminant and separate it from the functional film; wherein the heating layer, the electric field generating layer, and the ultrasonic generating layer are formed on the upper or lower part of the substrate, and each is composed of an independent layer, or any two layers are composed of a single integrated layer, and after receiving the control signal, at least one of the heating layer, the electric field generating layer, and the ultrasonic generating layer may be operated.

[0024] In addition, the contaminant removal unit may be disposed between the substrate and the functional film, and the heating layer, electric field generating layer, and ultrasonic generating layer may each be configured to be independently disposed in different layers.

[0025] In addition, the contaminant removal unit is disposed between the functional film and the substrate, and any two of the heating layer, the electric field generating layer, and the ultrasonic generating layer are composed of an integrated layer, so that when the control signal is applied, the integrated layer may exhibit two physical phenomena independently or simultaneously.

[0026] Additionally, the contaminant removal unit comprises a thermal-ultrasonic generating layer in which the heating layer and the ultrasonic generating layer are integrated; and an electric field generating layer disposed below or above the thermal-ultrasonic generating layer, wherein the thermal-ultrasonic generating layer has a structure in which a converter capable of converting ultrasound into heat is disposed on an ultrasonic transducer, and when the control signal is applied, it may generate ultrasound of a preset frequency and generate heat simultaneously or independently.

[0027] Additionally, the contaminant removal unit comprises: an ultrasonic-electric field generating layer in which the ultrasonic generating layer and the electric field generating layer are integrated; and a heating layer disposed below or above the ultrasonic-electric field generating layer; wherein the ultrasonic-electric field generating layer is composed of an electrode material and is formed with a circuit structure with one side open, so that when the control signal is applied, an electric field is generated at the open end and simultaneously a surface acoustic wave having a preset frequency is generated to cause ultrasonic vibration, or an electrode having an open circuit structure is disposed above or below the ultrasonic transducer, so that when the control signal is applied, ultrasonic vibration is generated through the ultrasonic transducer and an electric field is generated at the open end of the open circuit structure simultaneously or independently.

[0028] Additionally, the contaminant removal unit comprises an electric field-heat generating layer in which the electric field generating layer and the heating layer are integrated; and an ultrasonic generating layer disposed above or below the electric field-heat generating layer; wherein the electric field-heat generating layer comprises an electrode with an open circuit structure and an electrode with a closed circuit structure, and when the control signal is applied, it may generate an electric field by a potential difference at the open end through the open circuit structure and generate heat through a current flowing independently or simultaneously through the closed circuit structure.

[0029] In addition, among the plurality of layers constituting the contaminant removal unit, one layer may be disposed on the lower part of the substrate, and the remaining layers may be disposed between the substrate and the functional film. When an electric field generating layer is disposed on the lower part of the substrate, the heating layer and the ultrasonic generating layer may be disposed between the substrate and the functional film. When an ultrasonic generating layer is disposed on the lower part of the substrate, the heating layer and the electric field generating layer may be disposed between the substrate and the functional film. When a heating layer is disposed on the lower part of the substrate, the electric field generating layer and the ultrasonic generating layer may be disposed between the substrate and the functional film.

[0030] In addition, the control unit may operate in a preset mode, receiving as setting information one of electric field formation using the electric field generating layer, ultrasonic generation using the ultrasonic generating layer, or heating using the heating layer, and performing a self-cleaning operation in accordance with the received setting information.

[0031] In addition, the control unit may operate in a condition mode, receiving as an operating condition any one of a critical temperature value, a critical humidity value, a rainfall probability value, and a power supply state of a higher device or system equipped with a self-cleaning device, and controlling the contaminant removal unit to perform a self-cleaning operation when the operating condition is satisfied.

[0032] In addition, the control unit may operate in a detection mode that detects the presence of contaminants and performs an operation in combination of at least one or two of forming an electric field, heating, and generating ultrasound to remove contaminants generated on the surface of the functional film.

[0033] In addition, the control unit may operate in a detection mode that detects the types of contaminants classified into liquid contaminants, solid contaminants, and mixture contaminants, and performs an operation in combination of at least one or two of electric field formation, heating, and ultrasonic generation to remove contaminants generated on the surface of the functional film.

[0034] Additionally, the control unit applies an electric signal to the contaminated part and measures the degree of change in resistance, capacitance, or inductive capacitance caused by the contaminated part to detect the type or amount, degree, or level of the contaminated part, and performs a contaminated removal operation using at least one preset method among an electric field, ultrasound, and heating according to the measured result, and after determining whether the contaminated part has been removed by applying an electric signal to the contaminated part, if it is determined that the contaminated part still exists, it performs the contaminated removal operation again, and if it is determined that the contaminated part has been removed, it may not perform the contaminated removal operation.

[0035] The control unit comprises: a preset mode in which it receives as setting information one of electric field generation using the electric field generation layer, ultrasonic generation using the ultrasonic generation layer, or heating using the heating layer, and performs a self-cleaning operation in accordance with the received setting information; a condition mode in which it receives as operating conditions any one of a critical temperature value, a critical humidity value, a rainfall probability value, whether a vehicle starts, condensation condition information based on a dew point approximation formula defined based on temperature and humidity, a contamination value identified by an optical sensor, and a control command of the control unit generated based on GPS or weather data, and when the operating conditions are satisfied, it controls the contaminant removal unit to perform a self-cleaning operation; and a detection mode in which it detects the presence of contaminants or detects the amount, degree, and level of contaminants classified into liquid contaminants, solid contaminants, and mixture contaminants, and performs an operation in combination of at least one or two of electric field generation, heating, and ultrasonic generation to remove contaminants generated on the surface of the functional film. It can operate in any one of the modes, and may be designed to operate in a mode selected by the user among multiple modes.

[0036] In addition, the control unit may change to and operate in the other mode when a different mode is selected by the user's re-selection, even if one mode is selected and operated according to the user's selection.

[0037] A self-cleaning device for cleaning multiphase contaminants based on a non-uniform electrode according to a second embodiment of the present invention comprises: a functional film; a substrate disposed below the functional film; an electrode layer formed between the functional film and the substrate and including a plurality of electrodes; and a control unit that applies a control signal to the electrode layer to remove contaminants generated on the surface of the functional film; wherein each electrode is formed to extend in the longitudinal direction and is formed in a non-uniform pattern with a gap between adjacent electrodes or a width of the electrodes, and is formed to gradually contract or expand in at least one region along each of the longitudinal directions, thereby inducing the contaminants to move through a control signal received from the control unit.

[0038] In addition, the shape of each of the above electrodes may be formed such that the contaminant receives increasingly greater physical force in a specific direction as it moves along the longitudinal direction of the electrode.

[0039] In addition, when the width of the electrode is formed in a non-uniform pattern, the shape of each electrode is formed such that the two opposing sides extending in the longitudinal direction are formed with different slopes, and the longitudinal axes of each electrode are arranged parallel to each other; and when the gap between the adjacent electrodes is formed in a non-uniform pattern, the shape of each electrode is formed such that the two opposing sides extending in the longitudinal direction are formed with the same slope parallel to each other, and the longitudinal axes of each electrode are arranged differently, and the longitudinal axes of each electrode are arranged to converge toward a virtual point.

[0040] Additionally, the shape of each of the above electrodes may be a polygon with non-uniform width between opposite hypotenuses or a polygon with uniform width between opposite hypotenuses, wherein the polygon with non-uniform width includes any one of an asymmetric trapezoid, a symmetric trapezoid, or a triangle, and the polygon with uniform width includes any one of a rectangle or a parallelogram.

[0041] In addition, when the width of the electrode is formed in a non-uniform pattern and the gap between adjacent electrodes is formed in a non-uniform pattern, a plurality of electrodes of different shapes may be arranged such that the longitudinal axes of each electrode are parallel to each other.

[0042] In addition, two or more electrodes of two different shapes may be arranged alternately.

[0043] In addition, the shape of each of the above electrodes may be configured to have at least one inflection region, and may be formed so that physical force is applied to the contaminants in different directions based on each inflection region.

[0044] In addition, if the gap between the adjacent electrodes is formed in a non-uniform pattern and the gap between the electrodes is configured to gradually expand and then gradually contract based on an inflection region, or gradually contract and then gradually expand based on an inflection region, the inflection region may be composed of at least one region within the region where the plurality of electrodes are formed.

[0045] In addition, the shape of each electrode may be such that the longitudinal axes of each electrode are parallel to each other, and the width of each electrode contracts and then expands or expands and then contracts based on the inflection region, or the width of each electrode is configured to be the same, and each electrode is configured to bend at the inflection region.

[0046] In addition, each of the above electrodes may be formed such that its internal region is divided into a plurality of openings while maintaining the outer shape of the electrode.

[0047] In addition, the control unit may detect the presence of contaminants and, depending on the type of contaminants, perform an operation in at least one or a combination of two or more of electrowetting, dielectrophoresis, and electrostatic force generation to remove contaminants generated on the surface of the functional film.

[0048] In addition, the electrode layer may receive a control signal from the control unit and additionally perform at least one operation among electrostatic force, electrowetting, and dielectrophoresis to detach the functional film contaminant from the functional film or move it outside the functional film.

[0049] In addition, the electrode layer may be disposed between the substrate and the functional film and may be composed of at least one electrode layer to perform at least one operation among electrowetting, dielectrophoresis, and electrostatic force generation, wherein each electrode layer may be disposed independently on different layers.

[0050] An active self-cleaning device based on a thin-film actuator for multi-phase contamination cleaning using the induction of multiple physical phenomena according to the third embodiment of the present invention comprises: a substrate; an electrode layer formed on the substrate; a functional film formed by coating on the electrode layer; and a control unit that applies an electrical signal to the electrode layer. The electrode layer has a pattern in which an electrode having a first width and an electrode having a second width smaller than the first width are alternately arranged. The control unit may control an electrical signal to remove contaminants placed on the functional film, thereby causing at least one physical phenomenon among an electric field, ultrasound, and heat through the electrode layer.

[0051] Additionally, the electrode layer comprises a first electrode pattern having a closed circuit structure in which one end and the other end of the electrode are connected to the control unit, and a second electrode pattern having an open circuit structure in which only one of the one end and the other end of the electrode is connected to the control unit, and the first electrode pattern or the second electrode pattern may be composed of a plurality of electrodes arranged alternately, wherein an electrode having a first width and an electrode having a second width smaller than the first width are arranged.

[0052] In addition, the electrode layer may be formed in a structure in which the first electrode pattern and the second electrode pattern are arranged alternately.

[0053] In addition, the electrode layer may be formed such that each electrode is formed in a bar shape, or is formed concentrically or spirally so that the electrodes are arranged in a radial direction. When the electrode is formed spirally, the diameter of the spiral circle formed by the adjacent electrode may be configured to gradually decrease or increase.

[0054] In addition, when the electrodes of the electrode layer are configured in a spiral shape, the spiral shape of the electrode included in the first electrode pattern may converge to a point to form a closed circuit structure, and the spiral shape of the electrode included in the second electrode pattern may form an open circuit structure at a position where the first electrode pattern converges to the center point of the spiral.

[0055] Additionally, the control unit may perform at least one of the following operations: generating heat by applying a direct current or alternating current signal to the first electrode pattern; generating ultrasound by applying a direct current or alternating current signal to at least one of the first electrode pattern and the second electrode pattern, which are in an open state; and generating an electric field by applying a direct current or alternating current signal to at least one of the first electrode pattern and the second electrode pattern, which are in an open state.

[0056] Additionally, the control unit may apply a high-frequency alternating current signal of a frequency higher than a preset frequency to the first electrode pattern for the operation of generating the ultrasound, and apply a high-frequency alternating current signal having a phase different from the high-frequency alternating current signal to any one type of electrode among the first width electrodes and the second width electrodes included in the second electrode pattern, and for the operation of generating the electric field, apply a low-frequency alternating current signal of a frequency lower than the preset frequency or apply a direct current signal to any one of the electrodes included in the first electrode pattern and the second electrode pattern.

[0057] Additionally, the control unit may, in order to generate a static electric field, (i) apply a DC electric signal to the first electrode pattern while controlling the second electrode pattern to a ground signal application state, a 0V application state, a floating voltage state, or a DC electric signal application state of a different polarity, or (ii) apply a DC electric signal to the first electrodes within the second electrode pattern while controlling the first electrode pattern to a ground signal application state, a 0V application state, or a floating voltage state, and controlling the second electrodes within the second electrode pattern to a ground signal application state, a 0V application state, a floating voltage state, or a DC electric signal application state of a different polarity.

[0058] Additionally, the control unit may, in order to generate a time-variable electric field, (i) apply the low-frequency AC signal to the first electrode pattern and control the electrodes of the second electrode pattern to a ground signal application state, a 0V application state, a floating voltage state, or a low-frequency AC signal application state of another phase, or (ii) apply the low-frequency AC signal to the electrodes of the first width within the second electrode pattern and control the first electrode pattern to a ground signal application state, a 0V application state, or a floating voltage state, and control the electrodes of the second width within the second electrode pattern to a ground signal application state, a 0V application state, a floating voltage state, or a low-frequency AC signal application state of another phase.

[0059] Additionally, for the operation of generating heat, the control unit may (i) apply a DC signal to generate a DC-based voltage difference between the electrodes of the first width and the electrodes of the second width of the first electrode pattern and control the second electrode pattern to a ground signal application state, a 0V application state, or a floating voltage state, or (ii) apply an AC signal to generate an AC-based voltage difference between the electrodes of the first width and the electrodes of the second width of the first electrode pattern and control the second electrode pattern to a ground signal application state, a 0V application state, or a floating voltage state.

[0060] In addition, the control unit may generate at least two of heat, an electric field, and ultrasound together.

[0061] In addition, the control unit may, in order to generate an electric field and ultrasound together, open one of the ends of the electrodes constituting the first electrode pattern to change the first electrode pattern into an open circuit structure, apply a high-frequency AC signal of a frequency higher than a preset frequency to the first electrode pattern, apply a high-frequency AC signal having a phase different from the high-frequency AC signal to at least one type of electrode among the first width electrodes and the second width electrodes constituting the second electrode pattern, and apply a low-frequency AC signal or a DC signal of a frequency lower than or equal to the preset frequency to the remaining types of electrodes within the second electrode pattern.

[0062] In addition, the control unit may apply a high-frequency AC signal of a frequency greater than or equal to a preset frequency to generate an AC-based voltage difference between the first width electrodes and the second width electrodes of the first electrode pattern in order to generate ultrasound and heat together, control one type of electrode among the first width electrodes and the second width electrodes constituting the second electrode pattern to a floating state, and apply the high-frequency AC signal to the remaining type of electrode.

[0063] Additionally, the control unit may apply a high-frequency AC signal of a frequency higher than a preset frequency or a low-frequency AC signal of a frequency lower than a preset frequency to generate an AC-based voltage difference between the electrodes of the first width and the electrodes of the second width of the first electrode pattern in order to generate heat and an electric field together, and apply a DC signal of different polarities to each electrode to generate a voltage difference between the electrodes of the first width and the electrodes of the second width constituting the second electrode pattern, or apply an AC signal to one type of electrode and apply a ground signal to the remaining type of electrode.

[0064] A self-cleaning device for removing multiphase contamination using a thin-film actuator having an exposed electrode structure according to the fourth embodiment of the present invention may include: a functional film; a substrate disposed below the functional film; an electrode layer formed on the substrate and comprising at least one buried electrode embedded by the functional film and at least one exposed electrode exposed outside the functional film and capable of contacting contaminants; and a control unit that applies an electrical signal to remove contaminants to the electrode layer. Additionally, the exposed electrode may be arranged alternately with the buried electrode, and the control unit may control the electrode layer by applying a signal identical or different from that of the buried electrode to the exposed electrode according to an operation mode.

[0065] In addition, the exposed electrode may be formed on the same or a different layer as the buried electrode.

[0066] In addition, when the exposed electrode is formed on the same layer as the buried electrode, the exposed electrode and the buried electrode of the electrode layer are formed on the substrate, and the functional film may be formed on the remaining area excluding the area where the exposed electrode is located to bury the buried electrode. In addition, when the exposed electrode is formed on a different layer from the buried electrode, the buried electrode of the electrode layer is formed on the substrate, the functional film is formed on the substrate while burying the buried electrode, and the exposed electrode may be formed on the functional film.

[0067] In addition, if the exposed electrode is formed on the same layer as the buried electrode, the thickness of the exposed electrode is equal to or greater than that of the buried electrode, and if the exposed electrode is formed on a different layer from the buried electrode, the exposed electrode may be formed on the functional film so that the top surface and side surface are exposed, or the side surface and bottom surface may be buried by the functional film so that only the top surface is exposed.

[0068] In addition, when the exposed electrode and the buried electrode are arranged alternately with each other and each form an independent channel receiving an independent electrical signal, the exposed electrode may be formed on the same or a different layer as the buried electrode.

[0069] In addition, when the exposed electrode and the buried electrode each form a closed loop and are arranged alternately in the radial direction and each form an independent channel receiving an independent electrical signal, the exposed electrode may be formed on a different layer from the buried electrode, or the exposed electrode and the buried electrode may be formed on the same layer.

[0070] In addition, the control unit may operate in a first mode in which the exposed electrode is connected to ground.

[0071] In addition, the control unit may operate in a second mode of controlling the exposed electrode to a floating state or applying 0V to the exposed electrode while applying a DC power supply of positive or negative polarity to the buried electrode.

[0072] In addition, the control unit may operate in a third mode of applying a DC power of positive or negative polarity to the buried electrode while the exposed electrode is connected to ground.

[0073] In addition, the control unit may operate in a fourth mode of applying a DC power of the same polarity to the buried electrode and the exposed electrode, or applying a DC power of different polarities.

[0074] In addition, the control unit may operate in a fifth mode by applying an AC power source with a frequency lower than or equal to a preset frequency to at least one of the buried electrode or the exposed electrode to move and remove the contaminant.

[0075] In addition, the control unit may operate in a sixth mode by applying an alternating current power of a frequency higher than a preset frequency to at least one of the buried electrode or the exposed electrode to vibrate and remove the contaminant.

[0076] Additionally, the control unit may operate any one of the following modes after operating the first mode for neutralizing the polarity of the contaminant: i) a second mode of controlling the exposed electrode to a floating state or applying 0V to the exposed electrode while a DC power source of + or - polarity is applied to the buried electrode; ii) a third mode of applying a DC power source of + or - polarity to the buried electrode while the exposed electrode is connected to ground; iii) a fourth mode of applying a DC power source of the same polarity or a DC power source of different polarities to the buried electrode and the exposed electrode; iv) a fifth mode of removing the contaminant by moving it by applying an AC power source of a frequency lower than or equal to a preset frequency to at least one of the buried electrode or the exposed electrode; v) a sixth mode of removing the contaminant by vibrating it by applying an AC power source of a frequency higher than or equal to the preset frequency to at least one of the buried electrode or the exposed electrode.

[0077] In addition, the control unit may operate the fourth mode for removing contaminants when the second mode is operated after the first mode is operated.

[0078] In addition, the control unit may operate the second mode to fix the polarity of the contaminant when the third mode is operated after the first mode is operated.

[0079] In addition, the control unit may operate the second mode or the fourth mode for removing contaminants when the fifth mode is operated after the first mode is operated.

[0080] The present invention provides an active self-cleaning device and method utilizing multiple physical phenomena, thereby enabling the identification of whether contaminants have occurred on the surface of a functional membrane and the type of said contaminants, and providing the most suitable cleaning according to the type of contaminants that have occurred.

[0081] In addition, by providing multiple cleaning modes, efficient cleaning is provided, and at the same time, the self-cleaning device can effectively cope with environmental factors to which it is exposed.

[0082] Furthermore, by removing contaminants using the most suitable cleaning method, the present invention minimizes damage to the functional film, contaminant removal unit, substrate, or upper device or system equipped with a self-cleaning device caused by an incorrect cleaning method during the contaminant removal operation, thereby extending the lifespan of the functional film and optimizing its performance.

[0083] In addition, the present invention provides a self-cleaning device for multiphase contamination cleaning based on non-uniform electrodes, thereby forming an asymmetric electric field and force structure through a non-uniform design of electrode width and gap, so as to provide additional transport force in the electrode length direction as well as in the direction in which electrodes perpendicular to the contaminant are arranged, and to minimize cleaning blind spots.

[0084] In addition, power efficiency and driving reliability can be improved by concentrating energy only where needed through a combination of electric fields, heating, and ultrasound, as well as multilayer electrode splitting.

[0085] Furthermore, it is possible to operate repeatedly with low power and low noise without cleaning fluid or wipers, and it can be applied to various shapes such as large areas, curved surfaces, and narrow spaces. It also reduces residual stains by suppressing overheating, hot spots, and re-attachment, and ensures mass production suitability through the freedom of process selection.

[0086] Furthermore, the present invention can be designed to generate various physical phenomena, such as electric fields, ultrasound, and heat, using a single electrode structure. Accordingly, compared to conventional technologies where costs or volumes increased by providing an electrode and an ultrasonic transducer together, or by providing an electrode for generating an electric field and an electrode for heating separately, a self-cleaning device capable of miniaturization at a lower cost can be realized.

[0087] In addition, as it operates to generate various physical phenomena, it exhibits various cleaning functions depending on the physical characteristics of contaminants and cleaning conditions, thereby achieving a higher cleaning effect.

[0088] Furthermore, customized cleaning systems can be applied to various industrial sites depending on the configuration of electrode patterns and control signals.

[0089] In addition, the present invention can effectively remove various contaminants by controlling or neutralizing the polarity of the contaminants through an exposed electrode and controlling the contaminants with the electrode.

[0090] In addition, fluorine-based contaminants have a strong tendency to easily absorb charge and become negatively charged, while nylon-based contaminants have a strong tendency to easily lose charge and become positively charged. By designing a thin-film actuator to respond to the diverse characteristics of these contaminants, various contaminants can be removed easily, effectively, and quickly.

[0091] In particular, by defining various control modes, optimized contaminant removal can be performed according to the environment in which the self-cleaning device is placed or the type of contaminant. Furthermore, since the prevention of contaminant adhesion and removal can be performed simultaneously through electrical control alone, it is possible to realize miniaturization and eco-friendly cleaning technology.

[0092] FIG. 1 is an exemplary diagram showing the configuration of a multi-physical phenomenon-based self-cleaning device according to a first embodiment of the present invention.

[0093] FIG. 2a is a block diagram showing an example in which a contaminant removal unit of a self-cleaning device according to a first embodiment of the present invention is configured in the order of an electric field generating layer, a heating layer, and an ultrasonic generating layer from the outside to the inside.

[0094] FIG. 2b is a block diagram showing an example in which a contaminant removal unit of a self-cleaning device according to a first embodiment of the present invention is configured in the order of a heating layer, an ultrasonic generating layer, and an electric field generating layer from the outside to the inside.

[0095] FIG. 2c is a block diagram showing an example in which a contaminant removal unit of a self-cleaning device according to the first embodiment of the present invention is configured in the order of an ultrasonic generating layer, an electric field generating layer, and a heating layer from the outside to the inside.

[0096] FIG. 3a is a block diagram showing an example in which a contaminant removal unit of a self-cleaning device according to a first embodiment of the present invention is composed of a thermal-ultrasonic generating layer that integrates an electric field generating layer, a heating layer, and an ultrasonic generating layer.

[0097] FIG. 3b is a block diagram showing an example in which a contaminant removal unit of a self-cleaning device according to a first embodiment of the present invention is composed of an ultrasonic-electric field generating layer that integrates a heating layer, an ultrasonic generating layer, and an electric field generating layer.

[0098] FIG. 3c is a block diagram showing an example in which the contaminant removal unit of a self-cleaning device according to the first embodiment of the present invention is composed of an electric field-heat generation layer that integrates an ultrasonic generating layer, an electric field generating layer, and a heating layer.

[0099] FIG. 4a is a block diagram showing an embodiment in which an electric field generating layer among a plurality of layers constituting a contaminant removal unit is formed on the lower part of a substrate, according to the first embodiment of the present invention.

[0100] FIG. 4b is a block diagram showing an embodiment in which a heating layer is formed on the lower part of a substrate among a plurality of layers constituting a contaminant removal unit according to the first embodiment of the present invention.

[0101] FIG. 4c is a block diagram showing an embodiment according to the first embodiment of the present invention in which an ultrasonic generating layer is formed on the lower part of a substrate among a plurality of layers constituting a contaminant removal unit.

[0102] FIG. 5 is a flowchart showing a plurality of mode-specific operation processes according to a first embodiment of the present invention.

[0103] FIG. 6 is a structural diagram showing the configuration of a self-cleaning device for multiphase contamination cleaning based on a non-uniform electrode according to a second embodiment of the present invention.

[0104] FIG. 7 is an example diagram comparing the multi-phase contamination cleaning operation of a self-cleaning device according to the prior art and the second embodiment of the present invention.

[0105] FIG. 8 is a drawing showing an example in which the electrode layer of a self-cleaning device is configured in an asymmetric trapezoidal shape according to a second embodiment of the present invention.

[0106] FIG. 9 is a drawing showing an example in which the electrode layer of a self-cleaning device is configured in a symmetric trapezoidal shape according to a second embodiment of the present invention.

[0107] FIG. 10 is a drawing showing an example in which the electrode layer of a self-cleaning device is configured in a parallelogram shape according to a second embodiment of the present invention.

[0108] FIG. 11 is a drawing showing an example in which the electrode layer of a self-cleaning device according to a second embodiment of the present invention has an inflection region.

[0109] FIG. 12 is an exemplary diagram showing electrode patterns of a self-cleaning device defined in various ways based on the gap between electrodes, according to a second embodiment of the present invention.

[0110] FIG. 13 is an exemplary diagram showing the openings of the outer and inner regions of an electrode according to a second embodiment of the present invention.

[0111] FIG. 14 is a structural diagram showing the configuration of an active self-cleaning device based on a thin-film actuator for multiphase contamination cleaning using multi-physical phenomenon induction according to the third embodiment of the present invention.

[0112] FIG. 15 is a cross-sectional view illustrating the cross-sectional structure of a thin-film actuator-based active self-cleaning device according to a third embodiment of the present invention and the physical phenomena caused by the thin-film actuator-based active self-cleaning device.

[0113] FIG. 16 is a plan view of an active self-cleaning device based on a thin-film actuator composed of a bar-shaped electrode according to a third embodiment of the present invention.

[0114] FIG. 17 is a plan view of an active self-cleaning device based on a thin-film actuator composed of a spiral electrode according to a third embodiment of the present invention.

[0115] FIG. 18 is a diagram showing a first mode (M1) among the modes causing a single physical phenomenon of a thin-film actuator-based active self-cleaning device according to a third embodiment of the present invention.

[0116] FIG. 19 is a diagram showing a second mode (M2) among the modes causing a single physical phenomenon of a thin-film actuator-based active self-cleaning device according to a third embodiment of the present invention.

[0117] FIG. 20 is a diagram showing a third mode (M3) among the modes causing a single physical phenomenon of a thin-film actuator-based active self-cleaning device according to a third embodiment of the present invention.

[0118] FIG. 21 is a diagram showing a fourth mode (M4) among the modes causing a single physical phenomenon of a thin-film actuator-based active self-cleaning device according to a third embodiment of the present invention.

[0119] FIG. 22 is a diagram showing the fifth mode (M5) among the modes causing a single physical phenomenon of a thin-film actuator-based active self-cleaning device according to the third embodiment of the present invention.

[0120] FIG. 23 is a diagram showing an electric field and surface acoustic wave mixed mode among dual modes that cause two or more physical phenomena together, according to a third embodiment of the present invention.

[0121] FIG. 24 is a diagram showing a heating and ultrasonic mixed mode among dual modes that cause two or more physical phenomena together, according to the third embodiment of the present invention.

[0122] FIG. 25 is a diagram showing an electric field and heating mixed mode among dual modes that cause two or more physical phenomena together, according to a third embodiment of the present invention.

[0123] FIG. 26 is an exploded perspective view showing the configuration of a self-cleaning device for removing multiphase contamination using a thin-film actuator having an exposed electrode structure according to the fourth embodiment of the present invention.

[0124] FIG. 27 is a conceptual diagram showing the contamination cleaning operation of a self-cleaning device according to the fourth embodiment of the present invention and a cleaning device according to the prior art.

[0125] FIG. 28 is a cross-sectional view showing the structural cross-section of a self-cleaning device according to the fourth embodiment of the present invention when an exposed electrode is placed in the same layer as a buried electrode.

[0126] FIG. 29 is a cross-sectional view showing the structural cross-section of a self-cleaning device according to another embodiment of the present invention, in which an exposed electrode is placed on a different layer from a buried electrode.

[0127] FIG. 30 is a conceptual diagram regarding the inductive charging operation of a self-cleaning device according to the fourth embodiment of the present invention.

[0128] FIG. 31 is a diagram illustrating the electrical signals applied to each electrode during the first mode operation of a self-cleaning device according to the fourth embodiment of the present invention.

[0129] FIG. 32 is a diagram illustrating the electrical signals applied to each electrode during the second mode operation of the self-cleaning device according to the fourth embodiment of the present invention.

[0130] FIG. 33 is a diagram illustrating the electrical signals applied to each electrode during the third mode operation of the self-cleaning device according to the fourth embodiment of the present invention.

[0131] FIG. 34 is a diagram illustrating the electrical signals applied to each electrode during the operation of the fourth mode of the self-cleaning device according to the fourth embodiment of the present invention.

[0132] FIG. 35 is a diagram illustrating the electrical signals applied to each electrode during the operation of the fifth mode of the self-cleaning device according to the fourth embodiment of the present invention.

[0133] FIG. 36 is a diagram illustrating the electrical signals applied to each electrode during the operation of the 6th mode of the self-cleaning device according to the 4th embodiment of the present invention.

[0134] FIG. 37 is a plan view showing the electrode structure of a self-cleaning device having three or more channels and including a bridge, according to a fourth embodiment of the present invention.

[0135] FIG. 38 is a plan view showing a self-cleaning device electrode structure formed in a single layer without bridges according to a fourth embodiment of the present invention.

[0136] FIG. 39 is a plan view showing a circular closed-loop type self-cleaning device electrode structure according to the fourth embodiment of the present invention.

[0137] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement the invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0138] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "electrically connected" with other components interposed between them. Furthermore, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0139] In this specification, the term "part" includes a unit realized by hardware, a unit realized by software, and a unit realized using both. Additionally, one unit may be realized using two or more pieces of hardware, and two or more units may be realized by one piece of hardware. Meanwhile, "part" is not limited to software or hardware, and "part" may be configured to reside in an addressable storage medium or configured to run on one or more processors. Accordingly, as an example, "part" includes components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functions provided within the components and "parts" may be combined into a smaller number of components and "parts" or further separated into additional components and "parts." In addition, the components and '~parts' may be implemented to play one or more CPUs within the device or secure multimedia card.

[0140] The "user terminal" mentioned below may be implemented as a computer or portable terminal capable of connecting to a server or other terminal via a network. Here, the computer may include, for example, a laptop, desktop, or notebook equipped with a web browser, and VR HMDs (e.g., HTC VIVE, Oculus Rift, GearVR, DayDream, PSVR, etc.). Here, the VR HMD includes PC models (e.g., HTC VIVE, Oculus Rift, FOVE, Deepon, etc.), mobile models (e.g., GearVR, DayDream, Storm Mirror, Google Cardboard, etc.), console models (PSVR), and stand-alone models implemented independently (e.g., Deepon, PICO, etc.). Portable terminals are wireless communication devices that ensure portability and mobility, and may include, for example, smartphones, tablet PCs, and wearable devices, as well as various devices equipped with communication modules such as Bluetooth (BLE, Bluetooth Low Energy), NFC, RFID, Ultrasonic, Infrared, WiFi, and LiFi. Additionally, "network" refers to a connection structure capable of exchanging information between each node, such as terminals and servers, and includes Local Area Networks (LAN), Wide Area Networks (WAN), the World Wide Web (WWW), wired and wireless data communication networks, telephone networks, wired and wireless television communication networks, etc.Examples of wireless data communication networks include, but are not limited to, 3G, 4G, 5G, 3GPP (3rd Generation Partnership Project), LTE (Long Term Evolution), WIMAX (World Interoperability for Microwave Access), Wi-Fi, Bluetooth communication, infrared communication, ultrasonic communication, Visible Light Communication (VLC), and LiFi.

[0141] The present invention may be implemented in different forms according to various embodiments. First, in the first embodiment, an embodiment is disclosed that provides an active self-cleaning device and method utilizing multiple physical phenomena. In the second embodiment, an embodiment is disclosed that provides an active self-cleaning device based on a thin-film actuator having a non-uniform electrode structure and a multiphase contamination cleaning method. Subsequently, in the third embodiment, an embodiment is disclosed that provides an active self-cleaning device based on a thin-film actuator capable of inducing multiple physical phenomena with a single structure and a multiphase contamination cleaning method. Finally, in the fourth embodiment, an embodiment is disclosed that provides an active self-cleaning device based on a thin-film actuator having an exposed electrode structure and a multiphase contamination cleaning method. In the embodiments described below, reference numerals may be set differently for each embodiment, so the reference numerals set for the corresponding embodiment are listed in the last paragraph of each embodiment.

[0142] Each embodiment of the present invention as described above will be explained in detail below.

[0143] <First Example>

[0144] The first embodiment of the present invention relates to a multi-physical phenomenon-based self-cleaning device and method, and can be implemented to identify various contaminants occurring on a target surface and to efficiently remove contaminants on the surface by performing cleaning operations of various functions.

[0145] The self-cleaning device according to the first embodiment of the present invention can be applied to automotive cameras, LiDAR sensors (Light Detection And Ranging or Laser Imaging, Detection and Ranging), autonomous driving sensors, video surveillance cameras, security cameras, video surveillance devices, CCTVs, thermal imaging cameras, and EO sensors (Electro-Optical sensors). In addition to the devices described above, it can also be applied to vehicle front windshields, windshields, windows, side windows, rear windows, panoramic sunroofs, and cover windows (displays, smartphones, LiDAR sensors, etc.). Furthermore, although not described, it can also be applied to glass, various panels, covers, and windows that provide protection, protection, anti-fouling, anti-dusting, anti-contamination, and light transmission to an object.

[0146] Referring to FIG. 1, for this purpose, a multi-physical phenomenon-based self-cleaning device (10) according to a first embodiment of the present invention may include a substrate (100), a contaminant removal unit (200), a functional film (300), a housing (400), and a control unit (500). The substrate (100) is positioned below the functional film (300), the contaminant removal unit (200) detects contaminants generated on the surface of the functional film (300), the control unit applies a control signal to the contaminant removal unit (200) to remove contaminants, and the housing (400) may be formed in a structure that encloses the control unit (500).

[0147] Meanwhile, additional functional membranes performing different roles may be additionally placed between the functional membrane (300) and the contaminant removal unit (200). Alternatively, the functional membrane (300) may be omitted, and the contaminant removal unit (200) itself may form the outermost surface.

[0148] The functional film (300) in the present invention is positioned on the outermost surface of an active self-cleaning device and may have low surface energy to prevent contamination generated on the surface of the functional film from adhering easily and to facilitate removal, or may have low friction and low adhesion surface characteristics suitable for the characteristics of the contaminants. Alternatively, it may be used as a protective element to prevent mechanical, electrical, or thermal damage from the external environment. Alternatively, it performs effective transmission, reflection, and absorption of visible light or light of a specific wavelength or radio waves. In addition, it may be an engineering functional element that incorporates an intended design to improve the function and performance of the object to which it is applied.

[0149] Here, various types of glass (amorphous solid) can be used as the material for the functional film (300) or substrate (100), and representative examples include quartz, soda-lime glass, silicate glass, borosilicate glass, aluminum silicate glass, aminosilicate glass, sapphire, and tempered glass. Meanwhile, according to an additional embodiment of the present invention, the functional film (300) or substrate (100) may be implemented with various materials other than glass. In this case, the functional film (300) or substrate (100) may be implemented with a ceramic, metalloid, or polymer (plastic) composite material that exhibits optical transmittance in visible light, infrared light, and other wavelengths. As a preferred example, Ge (germanium), Si (silicon), ZnSe (zinc selenide), ZnS (zinc sulfide), and AMTIR, which have higher infrared transmittance than visible light transmittance and can be used as thermal imaging camera lenses, may be included here.

[0150] Meanwhile, according to another embodiment of the present invention, the functional film (300) can be produced by applying a functional thin film to a lens using an industrial thin film processing method such as physical vapor deposition, chemical vapor deposition, solution processing, self-assembly, lamination, stacking, surface treatment, plating, patterning, imprinting, laser processing, etc., using materials such as inorganic materials, organic materials, organic-inorganic composites, nanomaterials, and films. In the corresponding embodiment, the functional thin film may be composed in the form of a thin film having hydrophilicity in addition to the functional film (300). In the corresponding embodiment, the thin film may be made of a material having various light transmittances and reflectances, and material characteristics such as electrical conductivity, thermal conductivity, and adhesion.

[0151] Next, the substrate (100) serves as a base for the self-cleaning device (10) according to the first embodiment of the present invention and can be implemented in different forms according to various embodiments. The substrate (100) includes the substrate of the device in which the functional film (300) described above is utilized, and may be composed of the same material as the material constituting the functional film (300).

[0152] Next, the contaminant removal unit (200) may be configured to be in contact with or adjacent to the functional membrane (300), and may include a plurality of means for removing contaminants generated on the surface of the functional membrane (300) according to a control signal. The contaminant removal unit (200) of the present invention may be implemented in different forms according to various embodiments, but in a representative embodiment, it includes an ultrasonic generating layer (210), a heating layer (220), and an electric field generating layer (230). The ultrasonic generating layer (210) may generate ultrasonic waves to vibrate contaminants and separate them from the functional membrane (300). The heating layer (220) may generate heat to evaporate contaminants on the functional membrane (300). The electric field generating layer (230) may generate an electric field to detach contaminants from the functional membrane (300) or move them outside the functional membrane (300). In the present invention, the heating layer (220), the electric field generating layer (230), and the ultrasonic generating layer (210) may be formed on the upper or lower part of the substrate (100). At this time, each layer may be composed of independent layers, or any two layers may be composed of a single integrated layer. Each layer may perform a contaminant removal operation by operating at least one of the heating layer (220), the electric field generating layer (230), and the ultrasonic generating layer (210) after receiving a control signal.

[0153] To this end, the control unit (500) may be configured to be electrically connected to each layer of the contaminant removal unit (200) so as to detect contaminants generated on the surface of the functional film (300) and apply a control signal to the contaminant removal unit (200) to remove the contaminants.

[0154] In this regard, looking closely at each layer controlled by the control unit (500), first, the heating layer (220) may include heating electrodes. The heating layer (220) transfers heat generated as current flows to the functional film (300) through a plurality of heating electrodes composed of a conventional electrode or a dedicated heating material (such as a nichrome wire). The transferred heat may evaporate contaminants on the functional film (300). Additionally, the heating layer (220) may be implemented with a specific pattern (such as a branch structure) to effectively transfer heat to the surface of the functional film (300), and the heating temperature may be controlled by the control unit (500).

[0155] Next, the electric field generating layer (230) may generate a specific electric field as a plurality of electrodes are arranged in a preset structure and pattern to move and remove contaminants generated on the surface of the functional film (300). The electric field generating layer (230) is a method of controlling the shape or location of contaminants by utilizing the effect generated by applying voltage to the arranged electrodes. In particular, when a voltage having a type of voltage (DC, AC), polarity (positive, negative), waveform (sine wave, square wave, sinusoidal wave, etc.), magnitude (amplitude), and temporal characteristics (frequency, period, etc.) is applied to the electrodes, it can generate an electric force on the contaminants by interacting with the electrical characteristics of the contaminants in a phase or composite state such as a solid or liquid. For example, depending on the target to which the electric force is applied and the range of influence, it may be expressed in various academic and industrial terms such as electrostatic force, Coulomb force, electrodynamic force, electrohydrodynamic force, electrowetting phenomenon, and dielectrophoresis phenomenon. In addition, according to the embodiments described below, other removal operations may be performed in addition to generating an electric field.

[0156] Next, the ultrasonic generating layer (210) generates ultrasonic waves to cause physical vibrations, and may perform the function of separating contaminants attached to the surface of the functional membrane (300) from the membrane by transmitting the generated vibrations to the surface of the membrane. The ultrasonic generating layer (210) may also be interchangeable with the term mechanical vibration generating layer. Although this ultrasonic generating layer (210) may be implemented in different forms according to various embodiments, in a preferred embodiment, it may be implemented through a piezoelectric element. A piezoelectric element is a device that converts mechanical energy into electrical energy or converts electrical energy into mechanical energy, and may vibrate by mechanically deforming (contracting or expanding) when voltage is applied.

[0157] [Basic Structure of the Combined Cleaning Device]

[0158] The heating layer (220), electric field generating layer (230), and ultrasonic generating layer (210) of the present invention may be disposed between the substrate (100) and the functional film (300), and each may be configured to be disposed independently on different layers.

[0159] Referring to FIG. 2A, the ultrasonic generating layer (210) may be positioned directly above the substrate (100), the heating layer (220) may be positioned above the ultrasonic generating layer (210), and the electric field generating layer (230) may be positioned above it. At this time, the arrangement order of the heating layer (220), the ultrasonic generating layer (210), and the electric field generating layer (230) may be formed differently depending on the embodiment. In the corresponding embodiment, as shown in FIG. 2B and FIG. 2C, the electric field generating layer (230) may be positioned first directly above the substrate (100), followed by the ultrasonic generating layer (210) and the heating layer (220) in order, or the heating layer (220) may be positioned directly above the substrate (100), followed by the electric field generating layer (230) and the ultrasonic generating layer (210) in order. The arrangement of such a structure must be determined by considering the energy transfer efficiency and adhesion between the substrate and each generating layer. In addition, these structural features may take into account environmental factors in which the self-cleaning device (10) of the present invention is installed, in addition to the aspect of ease of design. This structure is intended to provide a strong cleaning effect by having the layer that will perform more cleaning operations located at the very bottom of the functional film (300), and to provide efficient cleaning by having the layer that will perform relatively fewer cleaning operations located directly above the substrate (100).

[0160] For example, in the case of a cleaning device installed in an environment with heavy snowfall, the operation of the heating layer (220) may be performed most frequently to melt and remove snow accumulated on the functional film (300). In this case, as shown in Fig. 2B, the heating layer (220) may be designed to be located directly below the functional film (300) so that effective heat transfer is possible with less power. On the other hand, in the case of a cleaning device installed in an area with frequent yellow dust, the electric field generating layer (230) may be used most frequently to remove yellow dust, which is a solid foreign substance capable of charging. In this case, as shown in Fig. 2A, the electric field generating layer (230) may be designed to be located directly below the functional film (300) so that efficient dust removal is possible. Meanwhile, in addition to the layer used most frequently, a layer that is judged not to be used least frequently may be implemented to be formed directly above the substrate (100).

[0161] [Modified Structure of the Combined Cleaning Device 1]

[0162] According to the first embodiment of the present invention, in addition to the example in which separate layers are formed as described above, the contaminant removal unit (200) may be composed of any two layers among the heating layer (220), the electric field generating layer (230), and the ultrasonic generating layer (210) as an integrated layer. In this case, when a control signal is applied, the integrated layer may be implemented to simultaneously exhibit two physical phenomena.

[0163] Typically, a heat-ultrasonic generating layer (240) in which a heating layer (220) and an ultrasonic generating layer (210) are integrated, an ultrasonic-electric field generating layer (250) in which an ultrasonic generating layer (210) and an electric field generating layer (230) are integrated, and an electric field-heat generating layer (260) in which an electric field generating layer (230) and a heating layer (220) are integrated can be utilized as a contaminant removal unit (200).

[0164] FIG. 3A is a block diagram showing two embodiments including a thermal-ultrasonic generating layer. The thermal-ultrasonic generating layer (240) according to the first embodiment of the present invention may be formed in a structure in which a converter capable of converting ultrasound into heat is placed above or below an ultrasonic transducer (piezoelectric element). When such a thermal-ultrasonic generating layer (240) receives a control signal from a control unit (500), it generates ultrasound of a preset frequency and simultaneously generates heat, thereby enabling multiple contaminant removal operations to be performed at once. At this time, as illustrated, an electric field generating layer (230) may be placed below or above the thermal-ultrasonic generating layer (240) so as to operate in succession or simultaneously with the thermal-ultrasonic generating layer (240).

[0165] Here, the operation of each layer can be controlled differently, independently, or simultaneously depending on the presence and type of foreign substance determined by the control unit (500), and the control principle of such control unit (500) will be explained in detail later.

[0166] FIG. 3B is a block diagram showing two embodiments including an ultrasonic-electric field generating layer. The ultrasonic-electric field generating layer (250) according to the first embodiment of the present invention may be composed of an electrode material. The ultrasonic-electric field generating layer (250) is formed with a circuit structure with one side open, so that when a control signal is applied, an electric field is generated at the open end and simultaneously a surface acoustic wave having a preset frequency is generated to cause ultrasonic vibration. Additionally, the ultrasonic-electric field generating layer (250) may be configured such that an electrode having an open circuit structure is disposed on the upper or lower side of an ultrasonic transducer. In this case, when a control signal is applied, ultrasonic vibration is generated through the ultrasonic transducer and an electric field is generated at the open end of the open circuit structure. Additionally, a heating layer (220) may be disposed on the lower or upper side of the ultrasonic-electric field generating layer (250) and may operate sequentially or simultaneously with the ultrasonic-electric field generating layer (250).

[0167] Next, FIG. 3C is a block diagram showing two embodiments including an electric field-heat generating layer. The electric field-heat generating layer (260) according to the first embodiment of the present invention may include an electrode with an open circuit structure and an electrode with a closed circuit structure. When a control signal is applied, the electric field-heat generating layer (260) may generate an electric field by a potential difference at the open end through the open circuit structure and generate heat by a current flowing through the closed circuit structure. At this time, the materials of the open circuit structure and the closed circuit structure may be the same, but may also be different.

[0168] In this way, integrating generation layers that generate two or more different physical phenomena is possible when the energy source (electricity, pressure, etc.) or components (electrode thin film, ceramic structure, etc.) of each physical phenomenon generation layer are the same. Furthermore, when structurally integrated, two or more physical phenomena can be generated in a single generation layer, making it suitable for miniaturization.

[0169] [Modified Structure of the Combined Cleaning Device 2]

[0170] Meanwhile, the contaminant removal unit (200) of the present invention may be implemented such that one of the plurality of layers is disposed on the lower part of the substrate (100), and the remaining layers are disposed on the upper part of the substrate (100).

[0171] FIG. 4A illustrates two embodiments of a structure in which an electric field generating layer (230) is disposed on the lower part of a substrate (100). When the electric field generating layer (230) is disposed on the lower part of the substrate (100), a heating layer (220) and an ultrasonic generating layer (210) may be disposed on the upper part of the substrate (100). FIG. 4B illustrates two embodiments of a structure in which a heating layer (220) is disposed on the lower part of the substrate (100). When the heating layer (220) is disposed on the lower part of the substrate (100), an ultrasonic generating layer (210) and an electric field generating layer (230) may be disposed on the upper part of the substrate (100). FIG. 4C illustrates two embodiments of a structure in which an ultrasonic generating layer (210) is disposed on the lower part of the substrate (100). In this case, the electric field generating layer (230) and the heating layer (220) are disposed on the upper part of the substrate (100). At this time, more power or resources must be applied so that the influence of the physical phenomenon generated by the layer located below the substrate (100) can sufficiently reach the outside of the functional film (300).

[0172] The reason for designing with such a structure is that each generating layer may be exposed to various harsh environments (ultraviolet rays, friction, impact, etc.) from the outside, and damage or functional failure may occur due to other physical phenomenon generating layers. Therefore, the structure described above is intended to enhance performance and durability by placing one or more generating layers on the underside of the substrate (100) to reduce the influence from the external environment and other generating layers. For example, in the basic structure of FIGS. 2A-2C, there is a possibility that all three generating layers (210, 220, 230) located on the outside may be damaged by external physical forces, but if configured as in FIGS. 4A-4C, at least one generating layer located on the underside of the substrate may not be damaged.

[0173] In particular, as shown in FIG. 4B, when the heating layer (220) is located at the bottom of the substrate (100), delamination between the heating layer (220) and other generating layers (ultrasonic generating layer, electric field generating layer) placed adjacent to it can be prevented due to different thermal expansion rates caused by repeated heating and cooling processes compared to the basic structure.

[0174] In addition, as shown in FIG. 4C, when the ultrasonic generating layer (230) is located at the bottom of the substrate (100), the physical effect of the ultrasonic vibration is 'directly' transmitted to other generating layers, thereby minimizing the separation between each generating layer.

[0175] In this case, according to an additional embodiment of the present invention, the substrate (100) must be used as a very thin substrate (substrate with a thickness less than or equal to a preset thickness), such as a film, so that physical phenomena at the bottom of the substrate (100) can be transmitted to the opposite side. In this case, the thin substrate is composed of various materials such as glass or polycarbonate, and can be implemented in the form of a flat plate or a curved lens, such that when the ultrasonic generating layer is located at the bottom of the substrate, the acoustic impedance of the acoustic generating device and the substrate is matched to a preset value to minimize reflection. Meanwhile, when the electric field generating layer is located at the bottom of the substrate, it is configured to have a dielectric constant greater than or equal to a preset value, stores charge to induce an external electric field, and can be implemented with an electrical conductivity lower than a preset value. When the heating layer is located at the bottom of the substrate, it may be composed of a material having a thermal conductivity and a heat retention rate (ratio) greater than or equal to a preset value.

[0176] In addition, means to prevent damage to adjacent layer components caused by the physical phenomenon may be further included as components of the self-cleaning device (10). For example, as shown in FIG. 4A, when an electric field generating layer (230) is located below the substrate (100), an insulating film may be further included on the upper part of the substrate (100) so that the components of the self-cleaning device (10) located inside are not damaged by the output generated for the electric field generated by the layer to reach the outside of the functional film (300).

[0177] Below, the operation process of the self-cleaning device (10) according to the first embodiment of the present invention will be described.

[0178] Depending on the type and presence of contaminants detected in this manner, the control unit (500) can perform different contaminant removal operations.

[0179] [Multiple Operation Modes]

[0180] Referring to FIG. 5, the contamination removal operation performed by the control unit (500) can be provided through a plurality of modes, and these modes may include a preset mode, a condition mode, and a detection mode.

[0181] First, the preset mode begins by receiving one of the following as setting information (S11): electric field generation using an electric field generating layer (230), ultrasonic generation using an ultrasonic generating layer (210), or heating using a heating layer (220). This mode is a mode that performs self-cleaning operations (S12) according to the received setting information, and may operate only in a fixed mode according to the setting information entered by the user into the control unit (500). In the case of the detection mode described later, a removal operation is performed after detecting contaminants, whereas the preset mode is a mode that allows the user to select only the desired function to operate efficiently. In this mode, the user can input setting information to operate only one of electric field generation, ultrasonic generation, or heating, so that the self-cleaning device (10) always performs self-cleaning only in a predetermined way. For example, near a sandy beach where sand is blowing, a lot of sand accumulates on the security camera, so it can be pre-set to operate only ultrasonic generation and electric field. On the other hand, security cameras installed inside cold storage warehouses where freezing and frost frequently occur can be pre-set to operate only the heating and electric fields to prevent frost from forming.

[0182] The reason for providing such a mode is that even if the user operates three functions together in such an environment, it may be judged that it is not more economical than having one additional function added. Since fewer functions than three are used, the power consumption of the self-cleaning device (10) can also be reduced. That is, although the actual self-cleaning device (10) is equipped with various functions such as three functions and contaminant detection, by operating a more limited function through user settings, power consumption can be minimized and durability enhanced. Furthermore, as in the example described above, the self-cleaning device (10) of the CCTV near the beach mainly used only ultrasonic and electric field functions, but when the self-cleaning device (10) is repurposed for use in a cold storage warehouse, the settings can be changed to utilize heating and electric field functions. In this case, there is an advantage that a single product can be repurposed and modified for various uses. In addition, in an additional embodiment of the present invention, the user can also input cleaning conditions. For example, the user may input a setting to perform cleaning after detecting contaminants, or input a setting to always operate when a specific threshold condition is met so that cleaning is performed.

[0183] Next, the condition mode receives as an operating condition any one of the following: a critical temperature value, a critical humidity value, a rainfall probability value, whether the vehicle starts, condensation condition information based on a dew point approximation formula defined based on temperature and humidity, a contamination value detected by an optical sensor, and a control command from a control unit based on GPS or weather data (S21). When the operating condition is satisfied, the contaminant removal unit (200) is controlled to perform a self-cleaning operation. That is, through the condition mode, the user can check whether a specific critical condition (operating condition) is achieved regardless of the presence of contaminants (S22), and if achieved, the cleaning operation is always performed (S23). At this time, the condensation point refers to the condition in which dew occurs, calculated using an external temperature / humidity value and a dew point approximation formula (Magnus formula, etc.). It may be determined that condensation occurs when the surface temperature of the self-cleaning glass drops below the dew point. In the case of the contamination value detected by the optical sensor, it may include a threshold value detected by an optical sensor capable of directly determining sensor contamination caused by external environments such as rain, snow, or dust, such as a camera, LiDAR, or rain sensor, or a control command (trigger signal) generated by the controller of the said sensor or the control unit of the present invention. Through this, the present invention prevents the adhesion of contaminants by performing an operation in advance before the contaminants adhere to the target surface. Specific conditions in the corresponding mode may include, for example, the temperature becoming 3°C or lower (below a specific threshold temperature), humidity being above a specific threshold humidity, the probability of rainfall in weather data being reported as being above a preset probability, or the recognition that the vehicle ignition is turned on. In the condition mode, the cleaning operation may be composed of at least one of an electric field, ultrasonic generation, and heat generation, or a combination thereof. Alternatively, the condition mode may be automatically terminated if the aforementioned specific conditions are not met.In addition, specific conditions based on various criteria may be established.

[0184] Meanwhile, the detection mode is an active mode in which the control unit (500) identifies at least one of the presence and type of contaminant (S31), and, depending on the type of contaminant identified, performs an operation in combination of at least one or two of electric field formation, heating, and ultrasonic generation (S32) to remove contaminant generated on the surface of the functional film (300).

[0185] First, for the detection of contaminants, the control unit (500) may apply an electrical signal to the electrode of the contaminant removal unit (200), and after receiving it, measure the degree of change in resistance, capacitance, or inductive capacitance from the received value to detect the type of contaminant or the presence of the contaminant. Alternatively, the functional membrane (300) may contain an electrode of a preset pattern and apply an electrical signal to the electrode. In this case, an insulating membrane may be further included below the functional membrane (300) so that the layer of the contaminant removal unit located below the functional membrane (300) is not affected by the electrode generated during the operation to detect the type of contaminant or the presence of the contaminant. The control unit (500) may classify the types of contaminants into liquid contaminants, solid contaminants, and mixture contaminants. Alternatively, in additional embodiments, the types of contaminants may be further classified into inviscous droplets (water droplets, rain, acid rain, contaminated water on the road, water stains remaining after washing, sugar water, salt water, seawater, mixture of calcium chloride and water on the road, etc.), viscous droplets (oil, honey, etc.), solids other than water (soil, dust, sand, pollen, tire dust, metal particles, salt, mud, heavy metal yellow dust, brake pad dust, paint chips or sap coagulations, residues remaining from solution evaporation, bird manure, insect carcasses, protein-fat-chitin mixtures), and freezing deposits (frost, frost and ice, snow, etc.).

[0186] The control unit (500) can determine whether contaminants are present by utilizing the resistance, capacitance, or inductive capacitance that changes when contaminants are present or not present on the surface of the functional membrane (300). Next, regarding the detection of the type of contaminant, the control unit (500) can determine the type of contaminant by sending multiple electrical signals through the electrodes and determining that the contaminant is a liquid contaminant if the location of the contaminant is considered to have moved or flowed even slightly. On the other hand, the type of contaminant can be determined by determining that it is a solid if the contaminant is considered to have a fixed location as it has not moved. Additionally, the location of the contaminant can be determined as the point where the electrode is located where a change in resistance, capacitance, or inductive capacitance occurs according to the electrode structure. Meanwhile, since freezing deposits have low temperature characteristics, it is possible to detect freezing deposits by monitoring the operating characteristics that change according to temperature among the components of the contaminant removal unit. Alternatively, temperature data of the functional film (300) may be additionally collected to determine whether frost or freezing has occurred, and for this purpose, a separate temperature sensor may be additionally configured on the functional film (300) or on a layer adjacent to the functional film (300).

[0187] Meanwhile, if the control unit (500) determines that the type of contaminant is a water droplet, which is a non-viscous contaminant, the control unit (500) first controls the electrode to generate an electric field and performs an operation to push the target contaminant out of the functional membrane (300), thereby removing large water droplets. Afterwards, the control unit (500) can remove the contaminant by controlling the vibration generating layer to generate ultrasound and perform an operation to shake off small water droplets remaining on the surface of the functional membrane (300).

[0188] At this time, as electric field generation and ultrasonic generation operations are utilized, if the self-cleaning device (10) is implemented in the form of FIG. 3B, water droplets may be removed by operating only the ultrasonic-electric field generation layer (250).

[0189] Next, when the control unit (500) determines that the type of contaminant is a viscous liquid, and when heating and electric fields operate simultaneously, the electric field-heat generation layer (260) can operate to remove the contaminant as shown in FIG. 3C. If the operation is performed sequentially, and heating is included in the operation function, heating can be executed with the highest priority. After heating is executed, the electric field or ultrasonic generation is applied in order of priority, and through this, the present invention can maximize removal efficiency by lowering the viscosity of the contaminant through heating and then moving the contaminant. Meanwhile, regarding this order of operation, it may be input by the user or pre-set and stored according to the type of contaminant.

[0190] Next, when the control unit (500) determines that the type of contaminant is a solid substance, namely condensation, frost, and ice, or a combination thereof, it can remove the contaminant by executing only one of the heating, electric field, and ultrasonic generation, or by executing multiple of them sequentially or simultaneously. At this time, since the ice must be melted through heating, the heating function must be included and may be operated as the highest priority. In this way, the control unit (500) can melt the frozen foreign substance to make it into a liquid, and then remove the liquid by shaking it off with ultrasound or moving it with an electric field.

[0191] Next, when it is determined that the type of contaminant is a solid rather than a water component, the control unit (500) may operate in a manner that combines two or more functions among electric field, heating, and ultrasonic generation. In the case of a solid rather than water, the difficulty of removal is higher than that of a droplet. Therefore, two or more functions must be combined, and when the electrode and the heating electrode operate with two or more functions in this way, the removal operation can be performed by switching the order of each function operation.

[0192] For example, the control unit (500) can perform a removal operation by switching combinations in various ways, such as generating an electric field with an electrode, changing the current source with a switch applied to the electrode, generating heat with the electrode, moving contaminants by generating an electric field, and then operating ultrasonic generation to eject contaminants from the functional membrane (300).

[0193] Additionally, after the contaminant removal operation is performed, the control unit (500) may apply an electrical signal to the functional membrane (300) to determine whether the contaminant has been removed. If, as a result of the determination, it is determined that the contaminant still exists, the contaminant removal operation may be repeated (S33) until the contaminant is removed. At this time, the control unit (500) performs an operation to check whether the contaminant has been removed in the same manner as the contaminant type and presence detection operation. That is, the control unit (500) checks whether the contaminant has been removed by applying an electrical signal, and if it has not been removed, it removes the contaminant by re-executing the previously performed function.

[0194] In an additional embodiment, if the removal of contaminants is not performed smoothly and the same contaminant removal operation is repeated a preset number of times, the level of each removal operation function (electric field, ultrasound, and heating) can be enhanced to perform the operation again. For example, assume a situation where, after a contaminant is first detected, contaminant removal is performed using a preset function, heating, according to the type of contaminant, but it is determined that the contaminant still remains. In this situation, the control unit (500) can compare the initial amount of contaminant with the amount of contaminant remaining after the removal operation. This comparison operation can be performed by applying an electric signal as described above, or by determining the amount of contaminant based on the magnitude of the impedance value. At this time, if the control unit (500) determines that more than 50% of the contaminant still remains compared to before removal, it can control the heating layer (220) to heat at a higher temperature than the existing heating temperature for a longer period of time by enhancing the level of the heating function. Alternatively, other removal means may be utilized in addition to simply enhancing the numerical level. For example, if only an electric field was applied during the first contaminant removal process, ultrasonic waves may be additionally applied during the second contaminant removal process. In this case, the additional function during the second contaminant removal process can be operated differently depending on the type of contaminant identified after the type of contaminant is re-identified, thereby enabling a more accurate cleaning operation. Furthermore, even after this process is performed, if it is determined during the next contaminant detection that there are still remaining contaminants, all three functions (electric field, ultrasonic waves, and heating) can be executed together to remove the contaminants. Meanwhile, the control unit (500) may not perform the contaminant removal operation if it is determined that the contaminants have been removed.

[0195] <Second Embodiment>

[0196] The second embodiment of the present invention relates to a self-cleaning device for multiphase contamination cleaning using a thin-film actuator based on non-uniform electrodes, wherein the gap or width between electrodes is designed in a non-uniform pattern to guide contaminants in a specific direction, and can be implemented to perform effective cleaning using various means such as electric fields, heating, and ultrasound depending on the characteristics and location of the contaminants.

[0197] The self-cleaning device (100) according to the second embodiment of the present invention can be applied to an automotive camera, a LiDAR sensor (Light Detection And Ranging or Laser imaging, Detection and Ranging), an autonomous driving sensor, a video surveillance camera, a security camera, a video surveillance device, a CCTV, a thermal imaging camera, and an EO sensor (Electro-Optical sensor). In addition to the devices described above, it can also be applied to a vehicle front windshield, a windshield, a car window, a side window, a rear window, a panoramic sunroof, and a cover window (display, smartphone, LiDAR sensor, etc.). Furthermore, although not described, it can also be applied to glass, various panels, covers, and windows that provide protection, protection, anti-fouling, anti-dusting, anti-contamination, and light transmission to an object.

[0198] Referring to FIG. 6, for this purpose, a self-cleaning device (100) for cleaning multiphase contaminants based on a non-uniform electrode according to a second embodiment of the present invention may include a functional film (110), an electrode layer (120), and a substrate (130). Here, the substrate (130) and the electrode layer (120) are disposed below the functional film (110). In addition, the electrode layer (120) detects contaminants (600) generated on the surface of the functional film (110). In addition, it may be formed in a structure in which a control unit applies a control signal to the electrode layer (120) so that the contaminants (600) can be removed.

[0199] In the present invention, the functional film (110) is placed on the outermost surface of the self-cleaning device (100). Additionally, the functional film (110) may have low surface energy or low friction and low adhesion surface characteristics suitable for the characteristics of the contaminant (600) so that contaminants generated on the surface do not easily adhere and are easy to remove. Alternatively, the functional film (110) may perform a protective role to prevent mechanical, electrical, and thermal damage from the external environment. Furthermore, the functional film (110) may perform effective transmission, reflection, and absorption of visible light, light of a specific wavelength, or radio waves. In addition, it may include engineering functional elements that reflect an intended design to improve the function and performance of the applied object.

[0200] Here, various types of glass (amorphous solid) can be used as the material for the functional film (110) or the substrate (130). Representative examples include quartz, soda-lime glass, silicate glass, borosilicate glass, aluminum silicate glass, aminosilicate glass, sapphire, and tempered glass. Meanwhile, according to an additional embodiment of the present invention, the functional film (110) and the substrate (130) can be implemented with various materials other than glass. In this case, the functional film (110) or the substrate (130) can be implemented with a ceramic, metalloid, or polymer (plastic) composite material that exhibits optical transmittance in visible light, infrared light, and other wavelengths. As a preferred example, Ge (germanium), Si (silicon), ZnSe (zinc selenide), ZnS (zinc sulfide), and AMTIR, which have higher infrared transmittance than visible light transmittance and can be used as thermal imaging camera lenses, may be included here.

[0201] Meanwhile, according to another embodiment of the present invention, the functional film (110) can be produced by applying a functional thin film to a lens using an industrial thin film processing method such as physical vapor deposition, chemical vapor deposition, solution processing, self-assembly, lamination, stacking, surface treatment, plating, patterning, imprinting, laser processing, etc., using materials such as inorganic materials, organic materials, organic-inorganic composites, nanomaterials, and films. In the corresponding embodiment, the functional thin film may be composed in the form of a thin film having hydrophilicity in addition to the functional film (110). Here, the thin film may be made of a material having various light transmittances and reflectances, and material characteristics such as electrical conductivity, thermal conductivity, and adhesion.

[0202] Next, the substrate (130) serves as a base for the self-cleaning device (100) according to the second embodiment of the present invention and can be implemented in different forms according to various embodiments. The substrate (130) includes the substrate of the device in which the functional film (110) described above is utilized, and may be composed of the same material as the material constituting the functional film (110).

[0203] Next, the electrode layer (120) may be configured to include an electrode (200) structure for removing contaminants (600) generated on the surface of the functional film (110) according to a control signal, and may be configured to be in contact with or adjacent to the functional film (110). The electrode layer (120) of the present invention may be implemented in different forms according to various embodiments. In a representative embodiment, it may be implemented as an electrode (200) structure for generating ultrasound to vibrate the contaminants (600) to separate them from the functional film (110), generating heat to evaporate the contaminants (600) on the functional film (110), or generating an electric field to detach the contaminants (600) from the functional film (110) or move them outside the functional film (110). The electrode (200) structure for performing such removal operations may be composed of a single unit, but may also be implemented in the form of a plurality of independent layers. At this time, each layer may be independently arranged on different layers, and after receiving a control signal from the control unit, at least one layer may operate to perform a contaminant (600) removal operation.

[0204] For this purpose, the control unit of the present invention may be configured to be electrically connected to an electrode layer so as to detect contaminants (600) generated on the surface of a functional film (110) and to remove the detected contaminants (600).

[0205] In this regard, the control unit may detect the presence of contaminants (600) and, depending on the type of contaminants (600), perform an operation in at least one or a combination of electrowetting, dielectrophoresis, and electrostatic force generation to remove contaminants (600) generated on the surface of the functional film (110).

[0206] Next, the control unit may generate a specific electric field as a plurality of electrodes (200) are arranged in a preset structure and pattern to move and remove contaminants (600) generated on the surface of the functional film (110). Referring to FIG. 7, the multi-phase contaminant cleaning operation of the self-cleaning device (100) may be described as a method of controlling the shape or position of contaminants (600) by utilizing the effect generated by applying voltage to the arranged electrodes (200). This may be a principle in which, when a voltage having a type of voltage (DC, AC), polarity (positive, negative), waveform (sine wave, square wave, etc.), magnitude (amplitude), and temporal characteristics (frequency, period, etc.) is applied to the electrodes (200), it interacts with the electrical characteristics of the contaminants (600) in a phase such as solid or liquid or a composite state, and generates an electric force on the contaminants (600). These operations can be expressed in various academic and industrial terms, such as electrostatic force, Coulomb force, electrodynamic force, electrohydrodynamic force, electrowetting phenomenon, and dielectrophoresis phenomenon, depending on the target and range of influence to which the electric force is applied. Additionally, as shown in FIG. 2 (a), when a droplet is to be removed, the droplet may be removed while in contact with the surface of the self-cleaning device (100). On the other hand, as shown in FIG. 2 (b), when dust (patricle) is to be removed, the dust may be removed by floating (due to the electric field) at a predetermined distance from the surface of the self-cleaning device (100).

[0207] Through the above-described operation, the self-cleaning device (100) of the present invention can not only remove liquids, typically droplets, but also perform a multi-phase contamination cleaning operation that removes solids, typically particles.

[0208] Meanwhile, each of the plurality of electrodes (200) constituting the electrode layer (120) of the present invention may be formed in the shape of a bar extending in the longitudinal direction. The electrode may form a physical force along the direction in which the gap or width between the electrodes (200) is reduced or expanded, and may induce the contaminant (600) to move by this force. To this end, the shape of the electrode (200) may be formed so that the contaminant (600) receives increasingly greater physical force in a specific direction as it moves along the longitudinal direction of the electrode (200). Additionally, the width of the electrode (200) itself or the gap between the plurality of electrodes (200) may be formed to have a uniform or non-uniform pattern.

[0209] At this time, when the width of the electrode (200) is formed in a non-uniform pattern, the shape of each electrode (200) is formed such that the two opposing sides extending in the longitudinal direction are formed with different slopes, and the longitudinal axes of each electrode (200) can be arranged parallel to each other.

[0210] Additionally, when the gap between the electrodes (200) is formed in a non-uniform pattern, the shape of each electrode (200) is formed such that the two opposing sides extending in the longitudinal direction are parallel to each other and have the same slope. At the same time, the longitudinal axes of each electrode (200) are arranged differently from each other, and the longitudinal axes of each electrode (200) may be arranged to converge toward a virtual point.

[0211] Additionally, the shape of the electrode (200) is configured as one of an asymmetric trapezoid, a symmetric trapezoid, or a triangle when the width of the electrode (200) is formed in a non-uniform pattern. Meanwhile, when the gap is formed in a non-uniform pattern, it can be implemented as one of a rectangle or a parallelogram. However, this is only a second embodiment, and any polygon that can be formed in a non-uniform pattern may also be included.

[0212] Referring to FIG. 8, first, the asymmetric trapezoidal shape may be such that the length of the upper side (210) of the asymmetric trapezoidal electrode is shorter than the length of the lower side (220) of the asymmetric trapezoidal electrode, and only one of the left side and the right side is tilted at a predetermined angle. Thus, the asymmetric trapezoidal shape is formed with a non-uniform pattern of electrode widths (200) and has a non-uniform pattern of gaps between adjacent electrodes (200). Therefore, in the case of the asymmetric trapezoidal shape, a plurality of electrodes (200) of different shapes may be arranged such that the longitudinal axes of each electrode (200) are parallel to each other to form an electrode layer (120). At this time, each electrode (200) may be connected to an electrode connection pad (400). At this time, the electrode connection pad (400) is for connecting to a driving electrode within the region of interest to be cleaned, and each pad may receive a driving signal from a large channel power supply. In the corresponding embodiment, the electrode (200) is formed such that the electrode width between the inclined side of the asymmetric trapezoid and the vertical side of the adjacent asymmetric trapezoid gradually narrows according to the shape of the electrode (200). Accordingly, as the magnitude of the electric field increases in the direction in which the width gradually narrows, the movement of contaminants (600) can be induced in that direction.

[0213] Meanwhile, referring to FIG. 9, the symmetric trapezoidal shape may be such that the length of the upper side (230) of the symmetric trapezoidal electrode is shorter than the length of the lower side (240) of the symmetric trapezoidal electrode, and both the left side and the right side are tilted at the same predetermined angle. Thus, the symmetric trapezoidal shape is formed with a non-uniform pattern of electrode width (200) and a non-uniform pattern of gaps between adjacent electrodes (200). Therefore, in this case, the electrode layer (120) may be formed such that a plurality of electrodes (200) of different shapes are arranged so that the longitudinal axes of each electrode (200) are parallel to each other. In this case, depending on the shape of the electrode (200), contaminants (600) may be guided toward the lower side (240) of the symmetric trapezoidal shape. At this time, since the shape of the electrode (200) is a perfectly symmetrical symmetric trapezoidal shape, contaminants (600) may be guided toward the lower side of the symmetric trapezoidal shape, that is, the vertical downward direction of movement (300).

[0214] Next, in the case of a parallelogram shape, as illustrated in FIG. 10, the length of the upper side (250) of the parallelogram electrode and the length of the lower side (260) of the parallelogram electrode are equal to each other, and the angle of inclination of the left side and the right side may be equal to each other. At this time, the plurality of electrodes (200) each have a parallelogram shape with different angles. As illustrated, accordingly, the width of the electrodes (200) is the same, but the gap between adjacent electrodes (200) may be formed in a non-uniform pattern. In this case, the electrode layer (120) may be formed such that the longitudinal axis of each electrode (200) having different angles is arranged parallel to each other. At this time, depending on the angle of inclination of the parallelogram electrode (200), contaminants (600) may be guided in a direction in which the parallelogram electrode (200) converges. At this time, assuming that multiple parallelogram electrodes (200) have the same area, and that the number of parallelogram electrodes (200) arranged in order on the left and right layers and the angle of inclination are symmetric to each other, the contaminant (600) can be guided in a direction of movement (300) that converges, that is, in a vertical downward direction, where the electrodes (200) converge.

[0215] Meanwhile, in another embodiment of the present invention, a plurality of electrodes (200) may form an inflection region (500) where the energy of the operations performed by each electrode (200) for removing contaminants (600) is relatively weak, and a region where it is relatively strong. Through this, the present invention may be configured such that the gap between adjacent electrodes (200) is formed in a non-uniform pattern, and the gap between the electrodes (200) gradually expands and then gradually contracts based on the inflection region (500), or gradually contracts and then gradually expands based on the inflection region (500). Through this, the inflection region (500) may be configured as a region that crosses the plurality of electrodes (200) between one end and the other end of the plurality of electrodes (200). At this time, the shape of each electrode (200) may be such that the longitudinal axes of each electrode (200) are parallel to each other, and the width of each electrode (200) contracts and then expands or expands and then contracts based on the inflection region (500). Alternatively, the width of each electrode (200) may be configured to be the same, but each electrode (200) may be configured to bend at the inflection region (500).

[0216] Referring to FIG. 11, as illustrated in (a), each electrode may be formed such that the lengths of the upper and lower sides are equal, but the width becomes smaller than the lengths of the upper and lower sides as it approaches the center. Alternatively, each electrode may be formed as a symmetrical trapezoid that faces each other and meets at the upper sides to form an integrated shape. In this case, an inflection region (500) may be formed in the center of the longitudinal direction of the electrode layer (120). Meanwhile, depending on where the narrowest region of the electrode is located, the inflection region may be formed at a location other than the center. This inflection region (500) may be formed such that contaminants (600) receive increasingly greater physical force as they travel along different longitudinal directions of the electrode (200) relative to the inflection region (500). This structure allows the energy of the operations performed to remove contaminants (600) to become relatively stronger as the gap between neighboring electrodes becomes smaller from the inflection region of the electrode layer (i.e., upward or downward from the inflection region), so that the contaminants (600) can be removed preferentially from the inflection region (500).

[0217] Next, as illustrated in (b), each electrode may have a structure in which two rectangles or two parallelograms meet in a bent shape. Each electrode is formed symmetrically with respect to the bent position. The angle of inclination between the two facing rectangles or two parallelograms within each electrode is the same. However, between adjacent electrodes, the angle of inclination may differ depending on the position of each electrode. When the bending angle of the outermost electrode is the largest and the bending angle of the middle electrode is close to zero, the inflection region may be located at the center of the electrode layer in the longitudinal direction. Meanwhile, the inflection region may be set differently depending on the bent position. Since the gap between the electrodes (200) narrows as it moves upward or downward in the inflection region, the energy of the operations performed to remove contaminants (600) becomes relatively stronger as it moves upward, so the effect of removing contaminants (600) preferentially in the inflection region (500) can be produced. That is, this structure can solve the problem that cleaning efficiency decreases when the distance that contaminants (600) must travel out of the functional film (110) to be removed increases as the size of the functional film (110) increases. This is because the present invention is designed so that contaminants are preferentially moved away from that point by intentionally placing the inflection region (500) in the center of the functional film (110) or in a specific area where contamination needs to start to be controlled.

[0218] Referring to FIG. 12, the electrode (200) arrangement pattern of the present invention can be implemented in various embodiments. In each embodiment shown in FIG. 12, the contaminant (600) moves toward the side with the narrower gap between the electrodes (200). As for the electrode (200) pattern having a uniform gap, there may be only the electrode pattern designated as 'A' as shown in FIG. 12 (a), or there may be a form in which electrode patterns designated as 'A' and 'B' alternate as shown in FIG. 12 (b). The term 'alternating' as used in the present invention encompasses all cases where different electrodes are arranged alternately, whether regularly or irregularly. It may include cases where different electrode patterns are arranged alternately (e.g., ABABAB), cases where they are arranged according to a specific rule (e.g., AB-AAB-AAAB-AAAB), and cases where they are arranged irregularly or non-periodically (e.g., AA-BAB-AAA-BB-A). In addition, within a single self-cleaning device (100), arrangement in one or more combinations of the above methods is also included in the alternation in the present invention. Furthermore, as shown in FIG. 12 (c), the A electrode pattern may be arranged in succession such as AABCB, and then the B and C electrode patterns may be implemented alternately. Additionally, these electrode patterns may be implemented such that each electrode has a different gap. Even if only the A electrode pattern exists as shown in FIG. 12 (d), the distance between each electrode may be defined differently. For example, the gap between electrodes may be defined as 1 mm, 0.5 mm, 1 mm, 0.5 mm. FIG. 12 (e) shows a case where the electrode pattern arrangement is the same as FIG. 12 (b), but the gap between electrodes is defined differently as in FIG. 12 (d). FIG. 12(f) shows a case where the electrode pattern arrangement is the same as FIG. 12(c), but the gap between the electrodes is defined differently as in FIG. 12(c).

[0219] Meanwhile, although not illustrated, in addition to the structure described above, the electrode (200) of the present invention may be implemented in a structure in which the width of the electrode (200) itself or the gap between multiple electrodes (200) is expanded and contracted, or in which such expansion and contraction are repeated multiple times.

[0220] This structure is intended to solve the problem of causing spatial frequency interference in optical sensor images, which occurred when the conventional technology adopted a periodic electrode (200) pattern. The present invention can solve the conventional problem by classifying the electrodes (200) arranged for removing contaminants (600) into types according to their shape and dimensions, and arranging them in any order and with a gap. Furthermore, the present invention is superior in that it can also reduce the visibility of specific patterns observed by the naked eye or an optical sensor through this structure.

[0221] In addition, the electrode (200) according to the second embodiment of the present invention may be formed such that the inner region is divided into a plurality of openings while maintaining the outer shape of the electrode (200). Referring to FIG. 13, in the case of a rectangular electrode (200) as shown in (a), the electrode (200) is formed with a border having a predetermined thickness to maintain the outer shape constituting the rectangle and an opening in which a part of the inner region is opened. In the case of multiple openings, a border having a predetermined thickness surrounding the openings may be included in the inner region. Meanwhile, in the case of a symmetrical trapezoidal electrode (200) as shown in (b), a border having a predetermined thickness and an inner opening may be formed to maintain the outer shape constituting the trapezoid, and a plurality of openings may be formed in the same manner as the rectangular electrode (200).

[0222] <Third Embodiment>

[0223] The third embodiment of the present invention relates to an active self-cleaning device based on a thin-film actuator for multiphase contamination cleaning using multi-physical phenomenon induction, and can be implemented to respond to various contamination situations by generating one or more of an electric field, ultrasound, and heat through various electrode patterns and functional films alternately arranged on a substrate, using a time-varying electric field, a high-frequency signal, etc.

[0224] When the electrode layer (120) is formed in a spiral shape, the diameter of the spiral shape formed by adjacent electrodes can be configured to become progressively smaller or larger. As such, the spiral electrode of the present invention may be configured to have a specific outer contour, such as a circular spiral, a square spiral, or a polygonal spiral.

[0225] Additionally, when the electrodes of the electrode layer (120) are configured in a spiral shape, as illustrated, the spiral electrode included in the first electrode pattern (121) forms a closed circuit structure in a shape that starts from one end (Ain) at the outer edge, rotates toward the center of the spiral, approaches, and then returns from the center to the other end (Aout) of the outer edge, and the first width electrode (122a) and the second width electrode (122b) included in the second electrode pattern (122) can form an open circuit structure at a position where the first electrode pattern (121) converges to the center point of the spiral.

[0226] Along with this structure, the control unit controls each electrode differently according to electric field, ultrasonic, and heating operations. First, in the case of an electric field generation operation, it may be performed by applying a direct current or alternating current signal to at least one of the first electrode pattern (121) and the second electrode pattern (122) which are in an open state to generate an electric field. Meanwhile, in the case of an ultrasonic generation operation, it may be performed by applying a direct current or alternating current signal to at least one of the first electrode pattern (121) and the second electrode pattern (122) which are in an open state to generate ultrasonic waves. In addition, in the case of a heating operation, it may be performed by applying a direct current or alternating current signal to the first electrode pattern (121) to generate heat. That is, the electric field generation operation and the ultrasonic generation operation may be performed in an open circuit, and the heating operation may be performed in a closed circuit.

[0227] The control unit can perform various modes of operation to remove contaminants in the manner described above.

[0228] Referring to FIG. 18, first, the first mode (M1) is a static electric field mode, wherein the control unit applies a DC electric signal to the first electrode pattern (121) and controls the second electrode pattern (122) to a ground signal application state, a 0V application state, a floating voltage state, or a DC electric signal application state of a different polarity. Alternatively, the control unit may apply a DC electric signal to the first width electrodes within the second electrode pattern (122), control the first electrode pattern (121) to a ground signal application state, a 0V application state, or a floating voltage state, and control the second width electrodes within the second electrode pattern (122) to a ground signal application state, a 0V application state, a floating voltage state, or a DC electric signal application state of a different polarity.

[0229] Specifically, as illustrated in FIG. 18(a), in the first mode, a positive voltage (+V) is applied to the first electrode pattern (121), and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, or a floating voltage state. Alternatively, as illustrated in FIG. 18(b), the first electrode pattern (121) can be controlled to have a positive voltage applied, and among the second electrode patterns (122), the second width electrode (122b) can be controlled to have a negative voltage (-V) applied. This can be applied equally to the first width electrode (122a), and such an embodiment is illustrated in FIG. 18(c). Meanwhile, a negative voltage may be applied to both the first width electrode (122a) and the second width electrode (122b). Such an embodiment is illustrated in FIG. 18(d). Meanwhile, as shown in (e) and (f) of FIG. 18, a positive voltage may be applied only to the first width electrode (122a), and the second width electrode (122b) and the first electrode pattern (121) may be controlled to a ground signal application state, a 0V application state, or a floating voltage state. Alternatively, as shown in (g) of FIG. 18, the first electrode pattern (121) may be controlled to a ground signal application state, a 0V application state, or a floating voltage state, and a positive voltage may be applied to the second electrode pattern (122). At this time, referring to (h) of FIG. 18, voltages of different polarities may be applied to the first width electrode (122a) and the second width electrode (122b) of the second electrode pattern (122).

[0230] Meanwhile, the control unit may also operate by applying a low-frequency alternating current signal of a frequency lower than a preset frequency to any one of the electrodes included in the first electrode pattern (121) and the second electrode pattern (122) in order to generate a time-variable electric field.

[0231] Referring to FIG. 19, for this purpose, the second mode (M2) is a time-varying electric field mode for generating a time-varying electric field, and the control unit may apply a low-frequency AC signal to the first electrode pattern (121) and control the electrodes of the second electrode pattern (122) to a ground signal application state, a 0V application state, a floating voltage state, or a low-frequency AC signal application state of another phase. Alternatively, the control unit may operate by applying a low-frequency AC signal to the electrodes of the first width within the second electrode pattern (122), controlling the first electrode pattern (121) to a ground signal application state, a 0V application state, or a floating voltage state, and controlling the electrodes of the second width within the second electrode pattern (122) to a ground signal application state, a 0V application state, a floating voltage state, or a low-frequency AC signal application state of another phase.

[0232] Specifically, as illustrated in FIG. 19 (a), in the second mode, a positive phase AC voltage is applied to the first electrode pattern (121), and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, or a floating voltage state. Alternatively, as illustrated in FIG. 19 (b), the first electrode pattern (121) may be controlled by applying a positive phase low-frequency AC power, and the second electrode pattern (122) may be controlled by applying a reverse phase low-frequency AC power to the second width electrode (122b). This can be applied equally to the first width electrode (122a), and such an embodiment is illustrated in FIG. 19 (c). Meanwhile, a method in which a positive phase low-frequency AC power is connected to the first electrode pattern (121) and a reverse phase low-frequency AC power is applied to the second electrode pattern (122) is also possible. Such an embodiment is illustrated in FIG. 19 (d). As in FIG. 19 (e), the first electrode pattern (121) may be connected to ground (GND) or 0V, and a low-frequency AC power source in phase may be connected to the first electrode pattern (121). Alternatively, as in FIG. 19 (f), the first electrode pattern (121) may be controlled in a ground signal application state, a 0V application state, and a floating voltage state, and a low-frequency AC power source in phase may be applied only to the first width electrode (122a), and the second width electrode (122b) may be controlled in a ground signal application state, a 0V application state, and a floating voltage state. Alternatively, as illustrated in FIG. 19 (g), the first electrode pattern (121) may be controlled in a ground signal application state, a 0V application state, and a floating voltage state, and a AC power source in phase may be applied to the second electrode pattern (122). At this time, referring to (h) of FIG. 19, an AC power source of different phases may be applied to the first width electrode (122a) and the second width electrode (122b) of the second electrode pattern (122).

[0233] Next, referring to FIG. 20, the third mode (M3) is an ultrasonic mode for generating ultrasound, wherein the control unit applies a high-frequency AC signal with a frequency greater than or equal to a preset frequency to the first electrode pattern (121), and applies a high-frequency AC signal with a phase different from the high-frequency AC signal to any one type of electrode among the first width electrodes and the second width electrodes included in the second electrode pattern (122). As shown in FIG. 20 (a), in the third mode, a high-frequency AC power source (AC) in the correct phase is applied to the first electrode pattern (121) and the first width electrode (122a), and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, and a floating voltage state. Alternatively, as shown in FIG. 20 (b), the first electrode pattern (121) may be controlled by applying a high-frequency AC power source in positive phase, and the second electrode pattern (122) may be controlled by applying a high-frequency AC power source in reverse phase to the second width electrode (122b).

[0234] Next, referring to FIG. 21, the fourth mode (M4) is a mode for generating heat using a DC power source (DC-based heating mode), wherein the control unit applies a DC signal to create a DC-based voltage difference between the first width electrodes and the second width electrodes of the first electrode pattern (121), and can control the second electrode pattern (122) to a ground signal application state, a 0V application state, or a floating voltage state. At this time, since heat generation can only occur when current flows, the mode may operate by temporarily closing the electrode layer (120) of the first electrode pattern into a closed circuit through a switch or the like.

[0235] Specifically, as illustrated in FIG. 21 (a), in the fourth mode, the first width electrode (121a) of the first electrode pattern, i.e., the input terminal (hereinafter, input terminal), is connected to a positive voltage source (+V), and the first width electrode (121b) of the first electrode pattern, i.e., the output terminal (hereinafter, output terminal), is connected to ground, and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, and a floating voltage state. Alternatively, as illustrated in FIG. 21 (b), a positive voltage source (+V) is connected to the input terminal of the first electrode pattern (121), a negative voltage source (-V) is connected to the output terminal, and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, and a floating voltage state.

[0236] Next, referring to FIG. 22, the fifth mode (M4) is a mode for generating heat using an AC power source (AC based heating mode), wherein the control unit applies an AC signal to create an AC-based voltage difference between the first width electrodes and the second width electrodes of the first electrode pattern (121), and can control the second electrode pattern (122) to a ground signal application state, a 0V application state, or a floating voltage state. Referring to FIG. 22 (a), in the fifth mode, the input terminal of the first electrode pattern (121) is connected to a high-frequency or low-frequency AC power source in positive phase, the output terminal is connected to ground, and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, or a floating voltage state. Alternatively, as shown in FIG. 22 (b), the input terminal of the first electrode pattern (121) is connected to ground, and the output terminal is connected to a high-frequency or low-frequency AC power source in positive phase, and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, or a floating voltage state. Alternatively, as shown in FIG. 22 (c), the input terminal and the output terminal of the first electrode pattern (121) are input to a high-frequency or low-frequency AC power source in opposite phase to each other, and the second electrode pattern (122) can be controlled to a ground signal application state, a 0V application state, or a floating voltage state.

[0237] Meanwhile, the control unit of the present invention may perform contaminant removal by generating at least two of heat, an electric field, and ultrasound together.

[0238] Referring to FIG. 23, first, in order to generate an electric field and ultrasonic waves together as an electric field and ultrasonic mixed mode, either one of the ends of the electrodes constituting the first electrode pattern (121) or the other end can be opened so that the first electrode pattern (121) can be changed to an open circuit structure. The control unit can apply a high-frequency AC signal with a frequency higher than a preset frequency to the first electrode pattern (121), and can apply a high-frequency AC signal with a different phase from the high-frequency AC signal to at least one type of electrode among the first width electrodes and the second width electrodes constituting the second electrode pattern (122). At the same time, the control unit can apply a low-frequency AC signal or a DC signal with a frequency lower than or equal to a preset frequency to the remaining types of electrodes within the second electrode pattern. As illustrated in FIG. 23 (a), a high-frequency AC power source in positive phase may be applied to the first electrode pattern (121) and the first width electrode (122a), and a positive voltage source (+V) may be connected to the second width electrode (122b). Additionally, as illustrated in FIG. 23 (b), a high-frequency AC power source in positive phase may be applied to the first electrode pattern (121) and the second width electrode (122b), and a positive voltage source (+V) may be connected to the first width electrode (122a). Alternatively, as illustrated in FIG. 23 (c), a high-frequency AC power source in positive phase may be applied to the first electrode pattern (121), a high-frequency AC power source in reverse phase may be applied to the first width electrode (122a), and a low-frequency AC power source in positive phase may be applied to the second width electrode (122b). Additionally, as shown in (d) of FIG. 23, a high-frequency AC power source in positive phase may be applied to the first electrode pattern (121) and the second width electrode (122b), and a low-frequency AC power source in reverse phase may be applied to the first width electrode (122a).

[0239] Next, referring to FIG. 24, in a heating and ultrasonic mixed mode, the control unit may apply a high-frequency AC signal of a frequency greater than a preset frequency to generate an AC-based voltage difference between the first width electrodes and the second width electrodes of the first electrode pattern (121) in order to generate both ultrasound and heat. At the same time, the control unit may control one type of electrode among the first width electrodes and the second width electrodes constituting the second electrode pattern (122) to a floating state and apply a high-frequency AC signal to the remaining type of electrode. At this time, since a heating operation is accompanied, the first electrode pattern (121) is set as a closed circuit. Different voltage signals may be applied to the input terminal (Ain) and the output terminal (Aout) to form different potentials. Referring to FIG. 24 (a), a positive phase high-frequency AC power source is connected to the input terminal of the first electrode pattern (121), a negative phase high-frequency AC power source is connected to the output terminal and the first width electrode (122a), and the second width electrode (122b) can be controlled to float. Alternatively, as shown in FIG. 24 (b), a positive phase high-frequency AC power source is connected to the input terminal of the first electrode pattern (121) and the second width electrode (122b), a negative phase high-frequency AC power source is connected to the output terminal, and the first width electrode (122a) can be controlled to float.

[0240] Next, referring to FIG. 25, in an electric field and heating mode, the control unit may apply a high-frequency AC signal of a frequency higher than a preset frequency or a low-frequency AC signal of a frequency lower than a preset frequency to generate an AC-based voltage difference between the first width electrodes and the second width electrodes of the first electrode pattern (121) in order to generate an electric field and heat together. At the same time, the control unit may apply a DC signal of different polarities to each electrode to generate a voltage difference between the first width electrodes and the second width electrodes constituting the second electrode pattern (122), or apply an AC signal to one type of electrode and apply a ground signal to the remaining type of electrode. As illustrated in FIG. 25 (a), a positive phase high-frequency or low-frequency AC power source may be connected to the input terminal of the first electrode pattern (121) and a negative phase high-frequency or low-frequency AC power source may be connected to the output terminal, and the first width electrode (122a) may be connected to a positive voltage source (+V) and the second width electrode (122b) may be connected to a negative voltage source (-V). Alternatively, as illustrated in FIG. 25 (b), a positive phase high-frequency or low-frequency AC voltage source may be connected to the input terminal of the first electrode pattern (121) and a negative phase high-frequency or low-frequency AC voltage source may be connected to the output terminal, and the first width electrode (122a) may be connected to a positive phase high-frequency or low-frequency AC voltage source and the second width electrode (122b) may be controlled to be connected to ground. Alternatively, as shown in (c) of FIG. 25, the input terminal of the first electrode pattern (121) and the second width electrode (122b) may be connected to a positive phase high-frequency or low-frequency AC voltage source, the output terminal may be connected to an out-of-phase high-frequency or low-frequency AC voltage source, and the first width electrode (122a) may be controlled in such a way that it is connected to ground.

[0241] Meanwhile, the control unit may perform various sequences that selectively utilize multiple modes. The multiple sequences performed by the control unit in the present invention are as shown in the following [Table 1].

[0242] Sequence Purpose Mode Combination Example Principles and Effects by Step Example S1 Dry: Removal and prevention of dust contamination (sand, dust, pollen, heavy metals, etc.) M3 → M2 → M1 1. M3 (Ultrasonic): Surface elastic waves → Weakening of surface adhesion → Induction of lifting 2. M2 (Dynamic-Electric Field): Electric force gradient → Generation of dust charging or repulsion → Partial discharge 3. M1 (Static-Electric Field): Time-varying dynamic electric field → Continuous particle movement / dispersion → Continuous discharge and contamination prevention S2 Liquid: Removal and prevention of liquid contamination (water film, condensation, droplets, etc.) M2 → M3 → M4 1. M2 (Dynamic-Electric Field): Electrowetting / dielectrophoretic phenomena → Promotion of micro-droplet vibration / merging / movement 2. M3 (Ultrasonic): Surface elastic waves → Atomization (bursting) of clustered droplets and water films 3. M4 (AC Heating): Continuous uniform heating → Evaporation of residual droplets / moisture → Surface drying S3 Removal and prevention of frozen substances (ice, frost, etc.) M4 → M3 → M5 1. M4 (DC Heating): High-speed heating → Freezing → Conversion into a water film 2. M3 (Ultrasonic): Surface acoustic waves → Liquid atomization → Outer discharge 3. M5 (AC Heating): Continuous uniform heating → Removal of residual moisture and inhibition of refreezing S4 Removal of viscous liquid contaminants (oil, etc.) M4 → M2 → M3 1. M4 (DC Heating): High-speed heating → Reduction of viscous liquid viscosity 2. M2 (Cyber-Electric Field): Electrowetting / Dielectrophoresis phenomenon → Promotion of microdroplet movement 3. M3 (Ultrasonic): Surface acoustic waves → Atomization (bursting) of clustered droplets and water film

[0243] First, Sequence 1 (S1) is a dry dust contamination removal sequence that primarily targets the removal of sand, dust, pollen, heavy metals, etc., and can operate in the order of the third mode, the second mode, and the first mode. The control unit induces lifting by weakening the surface adhesion of the foreign substances to be removed using ultrasonic waves (surface elastic waves) generated through the third mode, and removes them by partially discharging them through an electric force gradient, charging the foreign substances, or generating repulsion through the second mode. Subsequently, the control unit generates a time-varying dynamic electric field through the first mode to perform continuous particle movement and scattering, thereby continuously discharging foreign substances or preventing contamination.

[0244] Next, Sequence 2 (S2) is a liquid contaminant removal sequence that targets the removal of water films, condensation, droplets, etc., and can operate in the order of the second mode, the third mode, and the fourth mode. Through the second mode, the control unit causes electrowetting and dielectrophoretic phenomena to vibrate, merge, and move fine droplets, and through the third mode, generates surface acoustic waves to atomize (burst) the clustered droplets and water films. Afterwards, the control unit performs the fourth mode to continuously generate uniform heat, thereby evaporating residual droplets or moisture to completely remove contaminants.

[0245] Next, Sequence 3 (S3) is a freezing material removal sequence that primarily targets the removal of ice, frost, etc., and can operate in the order of the 4th mode, the 3rd mode, and the 5th mode. The control unit releases the freezing by generating heat at high speed through the 4th mode and converts it into a water film. Next, it operates in the 3rd mode to atomize the liquid in the water film using surface acoustic waves and discharge it to the outside. Subsequently, it performs the 5th mode to remove residual moisture through continuous uniform heating and suppress re-freezing.

[0246] Next, Sequence 4 (S4) is a viscous liquid contaminant removal sequence, which targets oil or complex contaminants for removal, and operates in the order of the fourth mode, the second mode, the third mode, and the fourth mode. The control unit performs the fourth mode to reduce the viscosity of the viscous liquid of the contaminant to be removed through high-speed heating, and performs the second mode to promote the movement of micro-droplets by causing electrowetting and dielectrophoretic phenomena. Next, the third mode is performed to atomize the droplets and water film clustered by surface acoustic waves, and the fourth mode is performed again to evaporate the remaining contaminants through heating. Meanwhile, the sequences described above are only representative examples among the various sequences that the control unit of the present invention can perform, and the control unit of the present invention can perform a greater number of sequences with combinations of different modes according to various embodiments.

[0247] <Fourth Example>

[0248] The fourth embodiment of the present invention relates to a self-cleaning device for removing multiphase contamination using a thin-film actuator having an exposed electrode structure, and can be implemented in a form that maximizes removal efficiency by controlling the attachment and removal of contaminants using the exposed electrode structure.

[0249] The self-cleaning device (100) according to the fourth embodiment of the present invention can be applied to an automotive camera, a LiDAR sensor (Light Detection And Ranging or Laser imaging, Detection and Ranging), an autonomous driving sensor, a video surveillance camera, a security camera, a video surveillance device, a CCTV, a thermal imaging camera, and an EO sensor (Electro-Optical sensor). In addition to the devices described above, it can also be applied to a vehicle front windshield, a windshield, a car window, a side window, a rear window, a panoramic sunroof, and a cover window (display, smartphone, LiDAR sensor, etc.). Furthermore, although not described, it can also be applied to glass, various panels, covers, and windows that provide protection, protection, anti-fouling, anti-dusting, anti-contamination, and light transmission to an object.

[0250] Referring to FIG. 26, for this purpose, a self-cleaning device (100) for removing multiphase contamination using a thin-film actuator having an exposed electrode structure according to the fourth embodiment of the present invention may include a functional film (110), an electrode layer (111), a substrate (130), and a control unit (not shown). Here, the substrate (130) and the electrode layer (111) are disposed below the functional film (110). Additionally, the electrode layer (111) is formed on the substrate (130) and may be composed of a buried electrode (120) and an exposed electrode (140). The buried electrode (120) may be a plurality of electrodes buried by the functional film (110), and the exposed electrode (140) may be implemented so that it is exposed outside the functional film (110) and can come into contact with contaminants (600). The electrode section can be formed to detect contaminants (600) generated on the surface of the functional film (110) using these, and the control section can be formed to apply a control signal to the electrode layer (111) so as to remove the contaminants (600). The control section can be composed of a PCB that is connected to each electrode and can apply an electrical signal. The PCB may be placed on the side of the electrode or substrate, or on the bottom of the substrate, or may be placed at various locations depending on various design variations. FIG. 26 (a) is an exploded perspective view in which the exposed electrode and the buried electrode are placed on the same layer, and FIG. 26 (b) is an exploded perspective view in which the exposed electrode is placed on a higher layer than the buried electrode.

[0251] In the present invention, the functional film (110) is placed on the outermost surface of the self-cleaning device (100). Additionally, the functional film (110) may have low surface energy or low friction and low adhesion surface characteristics suitable for the characteristics of the contaminant (600) so that contaminants generated on the surface do not easily adhere and are easy to remove. Alternatively, the functional film (110) may perform a protective role to prevent mechanical, electrical, and thermal damage from the external environment. Furthermore, the functional film (110) may perform effective transmission, reflection, and absorption of visible light, light of a specific wavelength, or radio waves. In addition, it may include engineering functional elements that reflect an intended design to improve the function and performance of the applied object.

[0252] Here, various types of glass (amorphous solid) can be used as the material for the functional film (110) or the substrate (130). Representative examples include quartz, soda-lime glass, silicate glass, borosilicate glass, aluminum silicate glass, aminosilicate glass, sapphire, and tempered glass. Meanwhile, according to an additional embodiment of the present invention, the functional film (110) and the substrate (130) can be implemented with various materials other than glass. In this case, the functional film (110) or the substrate (130) can be implemented with a ceramic, metalloid, or polymer (plastic) composite material that exhibits optical transmittance in visible light, infrared light, and other wavelengths. As a preferred example, Ge (germanium), Si (silicon), ZnSe (zinc selenide), ZnS (zinc sulfide), and AMTIR, which have higher infrared transmittance than visible light transmittance and can be used as thermal imaging camera lenses, may be included here.

[0253] Meanwhile, according to another embodiment of the present invention, the functional film (110) can be produced by applying a functional thin film to a lens using an industrial thin film processing method such as physical vapor deposition, chemical vapor deposition, solution processing, self-assembly, lamination, stacking, surface treatment, plating, patterning, imprinting, laser processing, etc., using materials such as inorganic materials, organic materials, organic-inorganic composites, nanomaterials, and films. In the corresponding embodiment, the functional thin film may be composed in the form of a thin film having hydrophilicity in addition to the functional film (110). Here, the thin film may be made of a material having various light transmittances and reflectances, and material characteristics such as electrical conductivity, thermal conductivity, and adhesion.

[0254] Next, the substrate (130) serves as a base for the self-cleaning device (100) according to the fourth embodiment of the present invention and can be implemented in different forms according to various embodiments. The substrate (130) includes the substrate (130) of the devices in which the functional film (110) described above is utilized, and may be composed of the same material as the material constituting the functional film (110).

[0255] Next, the electrode layer (111) may include an electrode structure in which an exposed electrode (140) and a buried electrode (120) are alternately arranged to remove contaminants (600) generated on the surface of the functional membrane (110) according to a control signal. The term "alternating" as used in the present invention includes all cases where different electrodes are arranged alternately, whether regularly or irregularly. It may include cases where a regular pattern is alternately arranged (e.g., ABABAB), cases where they are arranged according to a specific rule (e.g., AB-AAB-AAAB-AAAB), and cases where they are arranged irregularly or non-periodically (e.g., AA-BAB-AAA-BB-A). Furthermore, within a single self-cleaning device (100), arrangement in one or more combinations of the above methods is also included in the alternation in the present invention. To this end, the electrode layer (111) may be provided to be in contact with or adjacent to the functional membrane (110). The electrode layer (111) of the present invention may be implemented in different forms according to various embodiments. In a representative embodiment, it may be implemented as an electrode structure for generating phenomena such as dielectrophoresis, electrostatic force, and induced charging to vibrate contaminants (600) and separate them from the functional membrane (110). The electrode structure for performing such removal operations may be composed of a single layer, but may also be implemented in the form of a plurality of independent layers. In this case, each layer may be independently arranged on a different layer, and after receiving a control signal from a control unit, at least one layer may operate to perform a contaminant (600) removal operation.

[0256] For this purpose, the control unit of the present invention may be configured to be electrically connected to an electrode layer (111) so as to detect contaminants (600) generated on the surface of a functional film (110) and to remove the detected contaminants (600).

[0257] In this regard, the control unit may detect the presence of contaminants (600) and, depending on the type of contaminants (600), perform an operation using at least one or a combination of two or more of dielectrophoresis, electrostatic force, and induced charging to remove contaminants (600) generated on the surface of the functional film (110).

[0258] Next, the control unit may control the electrode layer (111) by applying a signal to the exposed electrode (140) that is the same as or different from the embedded electrode (120) according to the operating mode. Referring to FIG. 27, as illustrated in FIG. 27 (a), in a cleaning device according to the prior art, when a plurality of contaminant particles (600) appear, the contaminant particles (600) may come into contact with other particles or come into contact with the surface functional film (110) of the cleaning device. At this time, when a substance with a large work function comes into contact with a substance with a small work function, electrons move to the substance with a small work function. For example, fluorine-based contaminants have the property of easily absorbing charge and becoming negatively (-), and a substance that comes into contact with fluorine-based contaminants becomes positively (+). On the other hand, nylon-based contaminants have the property of easily losing charge and becoming positively (+), and a substance that comes into contact with nylon-based contaminants becomes negatively (-). Therefore, in general, the polarity of contaminants in contact with the surface of a self-cleaning device can be defined differently depending on the type of contaminant. In other words, it is difficult to accurately predict the polarity of the contaminants.

[0259] On the other hand, as illustrated in FIG. 27 (b), the self-cleaning device (100) of the present invention allows the polarity of the contaminant to be arbitrarily adjusted by the exposed electrode (140) by causing the contaminant to come into contact with the exposed electrode (140) exposed over the surface of the functional film (110). For example, the polarity of the contaminant can be adjusted as desired by grounding the exposed electrode or by setting a voltage of a specific shape and size. Through this, the self-cleaning device (100) of the present invention can maximize cleaning efficiency by controlling the polarity of the target contaminant to be removed.

[0260] At this time, the removal of contaminants may be based on the principle that when voltage is applied to the electrode, the electrical characteristics of the contaminant (600), which is in a phase such as a solid or liquid or in a composite state, interact with the polarity of the electrode and apply an electrical force to the contaminant (600). At this time, the voltage applied to the electrode layer (111) can be defined in various ways according to the type of voltage (DC, AC), polarity (positive, negative), waveform (sine wave, square wave, sinusoidal wave, etc.), magnitude (amplitude), and temporal characteristics (frequency, period, etc.). In addition, this operation may be expressed in various academic and industrial terms, such as electrostatic force, Coulomb force, electrodynamic force, electrohydrodynamic force, electrowetting phenomenon, dielectrophoresis phenomenon, etc., depending on the target and range of influence to which the electrical force is applied. In addition, the cleaning device of the present invention can remove both solid contaminants (typically dust (patricle)) and liquid contaminants (typically droplets) by utilizing various phenomena as described above. In this case, when a droplet is the target for removal, the droplet may be removed while in contact with the surface of the self-cleaning device (100). On the other hand, when dust is the target for removal, the dust may be removed by floating (due to an electric field) at a predetermined distance from the surface of the self-cleaning device (100).

[0261] Through the above-described operation, the self-cleaning device (100) of the present invention can not only remove liquids, typically water droplets, but also perform a multi-phase contamination cleaning operation that removes solids, typically dust.

[0262] To this end, the exposed electrode (140) of the present invention may be formed on the same or different layer as the buried electrode (120). Referring to FIG. 28, when the exposed electrode (140) is formed on the same layer as the buried electrode (120), both the exposed electrode (140) and the buried electrode (120) are formed on the substrate (130), and the functional film (110) may be formed on the remaining area excluding the area where the exposed electrode (140) is located, so as to be formed in a form that buries the buried electrode (120). At this time, the thicknesses of the buried electrode (120) and the exposed electrode (140) may be the same or different. First, when the thickness of the buried electrode (120) and the exposed electrode (140) are the same, referring to FIG. 3 (a), the functional film (110) corresponding to the area where the buried electrode (120) is buried can be implemented to have a step difference equal to the higher value of the thickness of the buried electrode (120). Alternatively, as shown in FIG. 3 (b), the functional film (110) can be implemented in a structure that gradually rises by the higher value of the buried electrode (120). When the thickness of the exposed electrode (140) is formed differently, the thickness of the exposed electrode (140) can be formed to be greater than that of the buried electrode (120). Referring to (c) of FIG. 28, the thickness of the exposed electrode (140) and the buried electrode (120) is adjusted so that only the upper part of the exposed electrode (140) is exposed outside the functional film (110), thereby allowing the functional film (110) to be implemented in a flat structure.

[0263] Meanwhile, as illustrated in FIG. 29, when the exposed electrode (140) is formed on a different layer from the buried electrode (120), the buried electrode (120) of the electrode layer (111) is formed on the substrate (130), the functional film (110) is formed on the substrate (130) while burying the buried electrode (120), and the exposed electrode (140) can be formed on the functional film (110). At this time, the thickness of the exposed electrode (140) and the buried electrode (120) are formed to be the same, and as illustrated in (d), the functional film (110) can be formed such that the portion where the buried electrode (120) is buried has a step difference equal to the thickness of the electrode. In this case, the exposed electrode (140) is formed so that the top surface and the side surface are exposed. Alternatively, as shown in FIG. 3(e), the exposed electrode (140) may be formed on the functional film (110) without contacting the substrate (130), so that the side and bottom surfaces are buried by the functional film (110), thereby forming it so that only the top surface of the exposed electrode (140) is exposed.

[0264] Next, the principle of charging contaminants for cleaning performed by the self-cleaning device (100) of the present invention through the above configuration will be explained. The present invention can charge contaminants that come into contact with the exposed electrode (140) with one polarity. Referring to FIG. 30, as shown in FIG. 30 (a), when a positively charged body is brought close to a specific material having any polarity, negative charges become concentrated on the side adjacent to the charged body, and positive charges become concentrated on the side opposite the charged body. As shown in FIG. 30 (b), when the opposite side of the material is subsequently grounded (GND), the positive charges are removed. Accordingly, as shown in FIG. 30 (c), only negative charges remain in the material. Then, when the charged body is removed, only negative charges remain in the material, evenly distributed, as shown in FIG. 30 (d).

[0265] This method can also be applied between the exposed electrode (140) and the contaminant. For example, by inducing charge of the contaminant with a specific charge and then grounding it through the exposed electrode in contact with the contaminant, the desired charge can be controlled to be distributed only on the contaminant.

[0266] Hereinafter, an operation mode according to the fourth embodiment of the present invention will be described in detail. The control unit can implement various operation modes using an exposed electrode and a buried electrode, and thereby effectively remove contaminants.

[0267] Referring to FIG. 31, in order to perform the above operation, the control unit may operate in a first mode (Ground Mode) by connecting the exposed electrode (140) to ground (300). As illustrated, in this mode, the exposed electrode (140) is grounded, and the buried electrode (120) may be grounded, 0V may be applied, or the connection may be disconnected and floated. This may correspond to (b) of FIG. 30 described above.

[0268] Also, referring to FIG. 32, the control unit may operate in a second mode (DC Bias Mode) by applying a DC power supply of positive or negative polarity to the buried electrode (120). As illustrated, in this mode, the exposed electrode (140) may be 0V or in a Float state. A DC power supply (+ or -) may be connected to the buried electrode (120). The second mode is intended to guide the contaminant (600) to a desired polarity, either negative or positive. That is, this may correspond to (c) of FIG. 30 described above. Meanwhile, the control unit may perform various types of operations as illustrated. FIG. 32 (a) shows an embodiment in which a positive DC power source (DC +V) is connected to the buried electrode (120) and 0V is applied or floating to the exposed electrode (140). In this case, the operation of removing contaminants charged with negative polarity by pushing them away and scattering them from the exposed electrode, or by pulling them toward the vicinity of the exposed electrode (140) and collecting them, can be performed. Meanwhile, FIG. 32 (b) shows an embodiment in which a negative DC power source (DC -V) is connected to the buried electrode (120) and 0V is applied or floating to the exposed electrode (140). In this case, the operation of removing contaminants charged with positive polarity by pulling them toward the vicinity of the exposed electrode (140) or by pushing them away and scattering them, can be performed. Alternatively, as shown in (c) of FIG. 32, a negative or positive DC power source may be separately connected to each of the buried electrodes (120). In this case, the negative DC power source and the positive DC power source may be flexibly connected in an alternating or non-alternating manner, and when applied alternately as in the corresponding embodiment, each buried electrode (120) can simultaneously perform the collection and scattering of contaminants described above.

[0269] Referring to FIG. 33, the third mode (Ground-DC Bias Mode) may be a DC power source of positive or negative polarity (+ or -) connected to the buried electrode (120) while the exposed electrode (140) is connected to ground (300). The third mode may be a process of removing charges of a polarity opposite to the induced polarity so that only charges of an arbitrarily charged polarity remain on the contaminant (600). As illustrated in FIG. 33 (a), the control unit may connect a positive DC power source to the buried electrode (120) while the exposed electrode (140) is connected to ground, thereby removing charges of a polarity (+) opposite to the induced polarity (-) from the contaminant. Alternatively, as illustrated in FIG. 33 (b), the control unit may connect a negative DC power source to the buried electrode (120) while the exposed electrode (140) is connected to ground, thereby removing charges of the polarity (-) opposite to the induced charged polarity (+) from the contaminant. Meanwhile, as illustrated in FIG. 33 (c), a negative or positive DC power source may be separately connected to each buried electrode (120). In this case, the negative DC power source and the positive DC power source may be flexibly connected in a manner that alternates or does not alternate with each other, and when applied alternately as in the corresponding embodiment, each buried electrode (120) may simultaneously perform the operation of removing the aforementioned charges of the opposite polarity within the area where the magnetic field of the buried electrode (120) is affected.

[0270] Next, referring to FIG. 34, the fourth mode (Global DC Bias Mode) may be one in which the control unit applies a DC power of the same polarity to the buried electrode (120) and the exposed electrode (140) or applies a DC power of different polarities. The fourth mode is a mode that generates an attractive or repulsive force against the contaminant (600) charged with any polarity (+ or -) to collect or scatter and remove the contaminant (600), and may be selectively operated with the second mode, which can provide some of the same effect. Referring to FIG. 34 (a), the control unit may apply the same amount of DC power to the buried electrode (120) and the exposed electrode (140) to strongly attract the contaminant charged with - or strongly repel the contaminant charged with +. On the other hand, when the same negative DC power is applied to the buried electrode (120) and the exposed electrode (140), negatively charged contaminants may be strongly repelled or positively charged contaminants may be strongly attracted. Meanwhile, the buried electrode (120) and the exposed electrode (140) may be flexibly connected in a form where negative DC power and positive DC power alternate or do not alternate. In this case, the buried electrode (120) and the exposed electrode (140) connected with DC power of the same polarity may have the magnitude of the magnetic field generated by the two electrodes amplified, thereby selectively generating stronger attractive and repulsive forces within the sphere of influence of the magnetic field.

[0271] Next, referring to FIG. 35, the fifth mode (LF-AC Mode) may involve applying a low-frequency AC power source with a frequency lower than or equal to a preset frequency to at least one of the buried electrode (120) or the exposed electrode (140). The fifth mode is a mode for moving charged contaminants (600) using AC power. That is, it is a mode for repelling contaminants (600) in a specific direction. To this end, the frequency of the AC power source may be set to various low-frequency bands, but typically, it may be a frequency of less than 1 kHz. However, this frequency value is merely an example, and the fourth embodiment of the present invention is not limited to this range. Additionally, adjacent buried electrodes (120) and adjacent exposed electrodes (140) may be controlled such that an AC power source with opposite phase is applied to each other, thereby forming a strong electric field in the area where the magnetic fields of the two electrodes overlap. Referring to FIG. 35 (a), a low-frequency AC power source may be applied to both the buried electrode (120) and the exposed electrode (140). In this case, each electrode may be dynamically controlled to have the same waveform or different waveforms. For example, in the case of two adjacent electrodes, waveforms of opposite phase may be applied to each other so that a stronger magnetic field is formed for the contaminant. Meanwhile, as shown in FIG. 35 (b), a low-frequency AC power source may be applied to the buried electrode (120) and ground may be connected to the exposed electrode (140) to neutralize the contaminant in contact with the exposed electrode (140) and then move the contaminant. Alternatively, as shown in FIG. 35 (c), a low-frequency AC power source may be applied to the buried electrode (120) and 0V may be applied to the exposed electrode (140), or the electrode may be controlled to be Floated, thereby allowing the operation of moving the already charged contaminant without removing its polarity.

[0272] Finally, referring to FIG. 36, the sixth mode (HF-AC Mode) may involve applying a high-frequency AC power source with a frequency greater than or equal to a preset frequency to at least one of the buried electrode (120) or the exposed electrode (140). The sixth mode is a mode for vibrating contaminants (600). That is, in the case of contaminants attached to and fixed on the lens surface, it is necessary to cause vibration to detach them from the surface, and this mode is for this purpose. To this end, the frequency of the AC power source may be set to various high-frequency bands, but typically it may be a frequency of 1 kHz or higher. Likewise, in the sixth mode, the adjacent buried electrode (120) and the adjacent exposed electrode (140) may be controlled such that an AC power source with opposite phase is applied to each other, thereby forming a strong electric field in the area where the magnetic fields of the two electrodes overlap. Referring to FIG. 36 (a), a high-frequency AC power source may be applied to both the buried electrode (120) and the exposed electrode (140). In this case, each electrode can be dynamically controlled to have the same waveform or different waveforms. For example, two adjacent electrodes may be operated so that waveforms in opposite phases are applied to each other, thereby forming a stronger magnetic field applied to the contaminant. Meanwhile, as shown in FIG. 36 (b), a high-frequency AC power supply is applied to the buried electrode (120) and ground is connected to the exposed electrode (140), so that the contaminant in contact with the exposed electrode (140) is neutralized and then removed by repelling the contaminant. Alternatively, as shown in FIG. 36 (c), a high-frequency AC power supply is applied to the buried electrode (120) and 0V is applied to the exposed electrode (140), or by controlling it to be Float, so that the operation of repelling the already charged contaminant without removing its polarity may be performed.

[0273] The control unit can perform a contaminant (600) removal operation through a plurality of sequences that selectively utilize these plurality of modes. The plurality of sequences performed by the control unit are as shown in the following [Table 2].

[0274] Code Sequence Name Structure Mode Summary Description Principle Effect S1 Neutralization-based Cleaning Sequence Mode 1 → Mode 5 A universal cleaning sequence that neutralizes and moves all particles based on particle type (insulating / conductive) and charge state (+ / - / neutral). Potential equalization, charge outflow, and neutralization in Mode 1 → Movement via low frequency in Mode 5. After stabilization, aggregation and residual charge removal are performed, followed by transport and cleaning. S2 Vibration-based Cleaning Sequence Mode 6 → Mode 5 Weakening and decomposing particle-particle or particle-solid surface adhesion forces using high-frequency vibration, followed by wide-area movement and discharge using low-frequency signals. Vibration with high-frequency AC power in Mode 6, movement via low frequency in Mode 5. After adhesion force breakdown due to strong vibration, particles are transported over long distances. S3 Charged State Separation Sequence (Positive, Negative, Neutral Separation) Mode 1 → Mode 5 → Mode 2 or 4 Polarization of different signs (+, -, Neutral) using low frequency, followed by separation of left / right and front / back based on the directionality of the DC power source. In Mode 1 Initialization of charge, polarization shift in 5th mode, integration of the starting point for DC power separation in 4th mode, and separation of particle-specific spaces through reaction by symbol. S4 Sequence for assigning specific polarity (charge imprinting): 1st mode → 3rd mode → 2nd mode. Assigning a target symbol to conductive or weakly conductive particles and fixing polarity with a DC power source. Initialization in 1st mode, induced charging in 3rd mode, fixing DC power polarity in 2nd mode. After removing existing charge, form target polarity, and then perform stabilization. S5 High-performance detachment sequence based on strong repulsion: 1st mode → 2nd mode → 4th mode. A sequence that strongly detaches difficult-to-detach particles by maximizing repulsion based on a DC power source. Stabilization in 1st mode, DC polarization in 2nd mode, strengthening repulsion with a DC power source in 4th mode. Perform post-polarization to suppress malfunctions, followed by instantaneous detachment.

[0275] First, Sequence 1 (S1) is a neutralization-based cleaning sequence, which may first perform a first mode and then perform a fifth mode. The control unit may perform the first mode to neutralize the polarity of the contaminant (600) through the exposed electrode (140), and apply a low-frequency AC power source to transfer and clean the contaminant (600).

[0276] Next, sequence 2 (S2) is a vibration-based cleaning sequence, which may involve first executing the 6th mode and then executing the 5th mode. The control unit may perform an operation in which vibration is generated on the contaminant through the 6th mode to break down the adhesion force of the contaminant with strong vibration, and then the 5th mode is executed to transport and clean the contaminant (600).

[0277] Next, sequence 3 (S3) is a charge state separation sequence, which may first execute the first mode, then sequentially execute the fifth mode, and then optionally execute the second mode or the fourth mode. The control unit can neutralize the polarity of the contaminant (600) through the first mode, and after transferring the contaminant (600) to a certain extent by executing the fifth mode, it can clean the contaminant (600) by generating vibration through the second or fourth mode.

[0278] Next, sequence 4 (S4) is a specific polarity assignment sequence, which may involve first executing a first mode, then executing a third mode, and then executing a second mode. This is in the same manner as the example of arbitrary polarity assignment described earlier, in which the control unit executes the first mode to neutralize the polarity of the contaminant (600), executes the third mode to induce only electrons of arbitrary polarity to remain in the contaminant (600), and then executes the second mode to remove grounding, thereby controlling the contaminant (600) to retain only electrons of arbitrary polarity.

[0279] Finally, Sequence 5 (S5) is a high-performance detachment sequence based on strong repulsion, which may execute a first mode, execute a second mode, and then execute a fourth mode. The control unit may neutralize the polarity of the contaminant (600) through the first mode, execute the second mode to control the charge of any polarity within the contaminant (600) to be concentrated on one side (in the case of the corresponding embodiment, towards the buried electrode (120)), and then execute the fourth mode to generate a strong attractive or repulsive force against the concentrated charge of polarity to remove the contaminant (600).

[0280] In the example described above, the case in which the exposed electrode and the buried electrode constitute two channels was assumed and explained, but the electrode layer (111) of the present invention can be implemented with three or more channels.

[0281] Meanwhile, referring to FIG. 37, the electrode layer (111) according to the fourth embodiment of the present invention may be formed in the form of interlocking branches, in which exposed electrodes (140) and buried electrodes (120) are arranged alternately in a bar shape, as shown on the left side of FIG. 12. At least one of the three channels may be composed of an exposed electrode. In this structure, each electrode may be formed on the same layer or on different layers.

[0282] Meanwhile, as illustrated on the right side of FIG. 37, the exposed electrode (140) and the buried electrode (120) of the electrode layer (111) each form a closed loop and are arranged alternately in a radial direction, and each can be connected to a connection pad (400). At this time, the connection pad (400) is for connecting to a driving electrode within the region of interest to be cleaned, and each pad may receive a driving signal from a multi-channel power supply. In this case, each channel is composed of multiple shapes of different diameters configured as a closed loop. For example, if the closed loop electrode layer is implemented as a circle, multiple electrodes may be arranged concentrically like a circle, and a transport force may be applied in a direction away from or closer to the center of the circle. At this time, a bridge (500) connecting these shapes must exist. In the present invention, the bridge (500) may include an insulating material that allows the upper electrode to pass over the lower electrode. In addition, in the present invention, the bridge may serve as a "bridge" to solve the problem of electrode path collisions occurring when it is in the same layer as the electrode layer (111), allowing the upper electrode to pass over the lower electrode. However, the bridge may overlap with the closed loop of another channel. Therefore, all bridge portions may be formed in a different layer from the closed loop portions. Here, the exposed electrode (140) may be composed of at least one closed loop structure. Meanwhile, in another embodiment of the present invention, only a part of the bridge may be formed as a multilayer by adding an insulating material only to the point or area crossing the loop to create a localized multilayer. Meanwhile, the bridge may be composed of a buried electrode (120), but may also be composed of other electrodes. In another embodiment of the present invention, the exposed electrode may be formed in the lower layer and the buried electrode may be formed in the upper layer. In such cases, even if each electrode is located on a different layer, a situation can be realized in which closed-loop electrode elements are radially arranged in a multi-channel manner on each layer.At this time, if both the exposed electrode (140) and the buried electrode (120) have two or more channels in each layer, an additional bridge is required. In that case, since both the buried electrode (120) and the exposed electrode (140) require their own bridges in each layer, the exposed electrode (140) rather than the buried electrode (120) may be designed to perform the role of a bridge.

[0283] In addition, as shown in FIG. 38, the electrode structure of the present invention may be implemented in a bar shape in a single layer without the need for a bridge.

[0284] Alternatively, as shown in FIG. 39, it may be implemented as a single-layer spiral electrode structure without the need for a bridge.

[0285] Meanwhile, embodiments of the present invention may also be implemented in the form of a recording medium containing computer-executable instructions, such as program modules executed by a computer. A computer-readable medium may be any available medium accessible by a computer and includes both volatile and non-volatile media, and both removable and non-removable media. Additionally, a computer-readable medium may include all computer storage media. A computer storage medium includes both volatile and non-volatile, removable and non-removable media implemented by any method or technique for storing information, such as computer-readable instructions, data structures, program modules, or other data.

[0286] Although the method and system of the present invention have been described in relation to specific embodiments, some or all of their components or operations may be implemented using a computer system having a general-purpose hardware architecture.

[0287] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will understand that other specific forms can be easily modified without altering the technical spirit or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may likewise be implemented in a combined form.

[0288] The scope of the present invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention.

Claims

1. In a multi-physical phenomenon-based self-cleaning device, Functional membrane; A substrate disposed below the above-mentioned functional film; A contaminant removal section formed at the lower part of the above functional membrane; and A control unit that detects contaminants generated on the surface of the functional film and applies a control signal to the contaminant removal unit to remove the contaminants; is included. The above-mentioned contaminant removal unit is, A heating layer that generates heat to evaporate functional membrane contaminants; An electric field generating layer for generating an electric field to detach the functional membrane contaminant from the functional membrane or move it outside the functional membrane; and It includes an ultrasonic generating layer for generating ultrasound to vibrate the functional membrane contaminant and separate it from the functional membrane; The above heating layer, electric field generating layer, and ultrasonic generating layer It is formed on the upper or lower part of the above substrate, and Each is composed of independent layers, or any two layers are composed of a single integrated layer, and A multi-physics-based self-cleaning device in which at least one of the heating layer, the electric field generating layer, and the ultrasonic generating layer operates after receiving the above control signal.

2. In Paragraph 1, The above-mentioned contaminant removal unit is, disposed between the above substrate and the above functional film, and A multi-physics-based self-cleaning device in which the heating layer, the electric field generating layer, and the ultrasonic generating layer are each independently arranged in different layers.

3. In Paragraph 1, The above-mentioned contaminant removal unit is, disposed between the above functional film and the above substrate, and A multi-physical phenomenon-based self-cleaning device in which any two of the heating layer, electric field generating layer, and ultrasonic generating layer are composed of an integrated layer, and when the control signal is applied, the integrated layer simultaneously exhibits two physical phenomena.

4. In Paragraph 3, The above-mentioned contaminant removal unit is, A thermal-ultrasonic generating layer in which the heating layer and the ultrasonic generating layer are integrated; and It includes the electric field generating layer disposed below or above the thermal-ultrasonic generating layer, and The above thermal-ultrasonic generating layer is, A multi-physics-based self-cleaning device having a structure in which a converter capable of converting ultrasound into heat is disposed on an ultrasonic transducer, and when the control signal is applied, it generates ultrasound of a preset frequency and simultaneously generates heat.

5. In Paragraph 3, The above-mentioned contaminant removal unit is, Ultrasonic-electric field generating layer in which the ultrasonic generating layer and the electric field generating layer are integrated; and The heating layer disposed below or above the ultrasonic-electric field generating layer; comprising The above ultrasonic-electric field generating layer is, It is composed of an electrode material and formed with a circuit structure with one side open, so that when the control signal is applied, an electric field is generated at the open end and simultaneously generates a surface acoustic wave having a preset frequency to induce ultrasonic vibration, or A multi-physics-based self-cleaning device having an electrode having an open circuit structure disposed on the upper or lower part of an ultrasonic transducer, wherein, upon application of the control signal, ultrasonic vibration is generated through the ultrasonic transducer and an electric field is generated at the open end of the open circuit structure.

6. In Paragraph 3, The above-mentioned contaminant removal unit is, An electric field-heat generation layer in which the electric field generation layer and the heating layer are integrated; and The ultrasonic generating layer disposed above or below the electric field-heat generating layer; comprising The above electric field-heat generating layer is, A multi-physics-based self-cleaning device comprising an electrode of an open circuit structure and an electrode of a closed circuit structure, wherein, upon application of the control signal, an electric field is generated by a potential difference at the open end through the open circuit structure and heat is generated through a current flowing through the closed circuit structure.

7. In Paragraph 1, Among the plurality of layers constituting the contaminant removal unit, any one layer, A multi-physical phenomenon-based self-cleaning device having layers disposed below the substrate and the remaining layers disposed between the substrate and the functional film.

8. In Paragraph 7, When an electric field generating layer is disposed on the lower part of the above substrate, the heating layer and the ultrasonic generating layer are disposed between the substrate and the functional film, and When an ultrasonic generating layer is disposed on the lower part of the above substrate, the heating layer and the electric field generating layer are disposed between the substrate and the functional film, and A multi-physical phenomenon-based self-cleaning device in which, when a heating layer is disposed on the lower part of the substrate, the electric field generating layer and the ultrasonic generating layer are disposed between the substrate and the functional film.

9. In Paragraph 1, The above control unit is, A multi-physical phenomenon-based self-cleaning device that operates in a preset mode, receiving as setting information one of electric field generation using the electric field generation layer, ultrasonic generation using the ultrasonic generation layer, or heating using the heating layer, and performing a self-cleaning operation in accordance with the received setting information.

10. In Paragraph 1, The above control unit is, A multi-physical phenomenon-based self-cleaning device that operates in a condition mode, receiving as an operating condition any one of a critical temperature value, a critical humidity value, a rainfall probability value, whether a power supply to an upper device or system is applied, condensation condition information based on a dew point approximation formula defined based on temperature and humidity, a contamination value detected by an optical sensor, and a control command from a control unit generated based on GPS or weather data, and controlling the contaminant removal unit to perform a self-cleaning operation when the operating condition is satisfied.

11. In Paragraph 1, The above control unit is, A multi-physical phenomenon-based self-cleaning device that operates in a detection mode to detect the presence of contaminants and perform operations in combination of at least one or two of electric field formation, heating, and ultrasonic generation to remove contaminants generated on the surface of the functional film.

12. In Paragraph 1, The above control unit is, A multi-physical phenomenon-based self-cleaning device that operates in a detection mode to detect the types of contaminants classified into liquid contaminants, solid contaminants, and mixture contaminants, and to perform an operation in combination of at least one or two of electric field generation, heat generation, and ultrasonic generation to remove contaminants generated on the surface of the functional film.

13. In Paragraph 12, The above control unit is, An electrical signal is applied to the contaminated area, and the type of contaminant is detected by measuring the degree of change in resistance, capacitance, or inductance caused by the contaminant. Depending on the viscosity of the contaminant, a contaminant removal operation is performed using at least one preset method among an electric field, ultrasound, and heating. A multi-physical phenomenon-based self-cleaning device that applies an electrical signal to the contaminated part to determine whether the contaminated material has been removed, performs a contaminated material removal operation again if it is determined that the contaminated material still exists, and does not perform the contaminated material removal operation if it is determined that the contaminated material has been removed.

14. In Paragraph 1, The above control unit is, A preset mode that receives as setting information one of electric field formation using the electric field generating layer, ultrasonic generation using the ultrasonic generating layer, or heating using the heating layer, and performs a self-cleaning operation in accordance with the received setting information; A condition mode that receives one of a critical temperature value, a critical humidity value, a rainfall probability value, and whether a vehicle starts, as an operating condition, and when the operating condition is satisfied, controls the contaminant removal unit to perform a self-cleaning operation; and A detection mode for detecting the presence of contaminants, or detecting the types of contaminants classified as liquid contaminants, solid contaminants, and mixture contaminants, and performing an operation in combination of at least one or two of electric field formation, heating, and ultrasonic generation to remove contaminants generated on the surface of the functional film; It can operate in any one of the modes, A multi-physics-based self-cleaning device designed to operate in a mode selected by the user among multiple modes.

15. In Paragraph 14, The above control unit is, Even if one mode is selected and operated according to the user's choice, A multi-physics-based self-cleaning device that operates by changing to the other mode when a different mode is selected based on the user's re-selection.

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