Unit structure and radio wave control plate

Abstract

This unit structure is included in a radio wave control plate. The unit structure comprises: a resonant conductor that is disposed on a first surface; and a ground conductor that is disposed on a second surface separated from the first surface in a first direction, and that is positioned closer to a dielectric medium than the resonant conductor when the radio wave control plate is mounted on the dielectric medium. The ground conductor comprises: a first ground conductor facing the resonant conductor; a second ground conductor surrounding the first ground conductor; and at least one third ground conductor electrically connecting the first ground conductor and the second ground conductor.

Description

Unit Structure and Radio Wave Control Plate

[0001] The present disclosure relates to a unit structure and a radio wave control plate.

[0002] Patent Document 1 discloses a radio wave control plate that includes a plurality of unit structures using a metasurface and transmits or reflects radio waves.

[0003] Japanese Unexamined Patent Application Publication No. 2022 - 165403

[0004] The unit structure of the present disclosure is a unit structure included in a radio wave control plate, and includes a resonant conductor disposed on a first surface and a ground conductor disposed on a second surface spaced apart from the first surface in a first direction and located closer to the dielectric medium than the resonant conductor when the radio wave control plate is installed in the dielectric medium. The ground conductor includes a first ground conductor facing the resonant conductor, a second ground conductor surrounding the first ground conductor, and at least one third ground conductor electrically connecting the first ground conductor and the second ground conductor.

[0005] The radio wave control plate of the present disclosure has at least one unit structure of the present disclosure.

[0006] Figure 1 is a diagram illustrating the outline of a radio wave control board. Figure 2 is a diagram illustrating the installation method of the radio wave control board according to the embodiment. Figure 3 is a diagram showing an example of the configuration of a unit structure according to the embodiment. Figure 4 is a diagram showing an example of the configuration of a first conductor and a second conductor according to the first embodiment. Figure 5 is a diagram showing the frequency characteristics of the unit structure according to the first embodiment. Figure 6 is a diagram showing an example of the configuration of a first conductor and a second conductor according to a modification of the first embodiment. Figure 7 is a diagram showing the frequency characteristics of the unit structure according to a modification of the first embodiment. Figure 8 is a diagram showing an example of the configuration of a first conductor and a second conductor according to the second embodiment. Figure 9 is a diagram showing the frequency characteristics of the unit structure according to the second embodiment. Figure 10 is a diagram showing an example of the configuration of a second conductor according to the first modification of the second embodiment. Figure 11 is a diagram showing an example of the configuration of a second conductor according to the second modification of the second embodiment. Figure 12 is a diagram showing an example of the configuration of a second conductor according to the third modification of the second embodiment. Figure 13 is a diagram showing an example of the configuration of a second conductor according to the first example of the third embodiment. Figure 14 is a diagram showing an example of the configuration of a second conductor according to the second example of the third embodiment. Figure 15 shows an example of the configuration of the second conductor according to the third example of the third embodiment.

[0007] Embodiments of the present invention will be described in detail below with reference to the attached drawings. However, the present invention is not limited by these embodiments, and in the following embodiments, the same parts are denoted by the same reference numerals to omit redundant explanations.

[0008] [Overview] (Radio Control Panel) The overview of the radio control panel will be explained using Figure 1. Figure 1 is a diagram illustrating the overview of the radio control panel.

[0009] The radio wave control plate 1 is configured to control the direction of propagation of incident radio waves. For example, when the radio wave control plate 1 receives radio waves transmitted by a base station, it is configured to reflect or refract those radio waves at a predetermined angle. The radio wave control plate 1 may be composed of, for example, a metamaterial that changes the phase of the incident wave. The radio wave control plate 1 may be capable of controlling not only one of the directions of reflection and / or transmission (refractory) of radio waves, but both. In this disclosure, reflection and refraction together are referred to as emission.

[0010] As shown in Figure 1, the radio wave control board 1 may include, for example, a substrate 2, and unit structures 10a, 10b, 10c, and 10d. When it is not necessary to distinguish between unit structures 10a and 10d, they are collectively referred to as unit structure 10. Unit structure 10 is also called a metasurface element.

[0011] The unit structures 10a, 10b, 10c, and 10d can be formed on a substrate 2. The substrate 2 may be, for example, a dielectric substrate made of a dielectric material. The substrate 2 may, for example, have a rectangular shape, but is not limited thereto. The unit structures 10a, 10b, 10c, and 10d can be arranged in two dimensions.

[0012] In the radio wave control panel 1, multiple unit structures 10a are arranged along the X-axis on each tier. On the tier above where unit structures 10a are located, multiple unit structures 10b are arranged along the X-axis. On the tier above where unit structures 10b are located, multiple unit structures 10c are arranged along the X-axis. On the tier above where unit structures 10c are located, multiple unit structures 10d are arranged along the X-axis. In the example shown in Figure 1, unit structures 10a, 10b, 10c, and 10d are arranged periodically along the Y-axis. Note that each unit structure does not necessarily have to be arranged parallel to the X-axis and Y-axis directions. For example, the direction in which the multiple unit structures 10a are arranged does not have to intersect perpendicularly with the direction in which unit structures 10a, 10b, 10c, and 10d are arranged.

[0013] By making the properties of each unit structure 10a to 10d different, the amount of phase change (the difference between the phase of the incident radio wave and the phase of the emitted radio wave) can be made different for each unit structure 10a to 10d. By making the properties of each unit structure 10a to 10d different so that the amount of phase change increases (or decreases) sequentially, the radio wave control plate 1 has a gradient of phase change. The radio wave control plate 1 can reflect and / or refract the incident radio wave in a predetermined direction due to the gradient of phase change. In Figure 1, the shapes of the unit structures 10a to 10d are rectangular, but the shape of the unit structures is not limited to rectangles.

[0014] (Installation Method of Radio Wave Control Panel) The installation method of the radio wave control panel according to the embodiment will be explained using Figure 2. Figure 2 is a diagram for explaining the installation method of the radio wave control panel according to the embodiment.

[0015] As shown in Figure 2, in this embodiment, the radio wave control plate 1 is installed in a dielectric medium such as glass 100. The radio wave control plate 1 is bonded to the glass 100 with an adhesive or adhesive tape such as OCA (Optical Clear Adhesive). The radio wave control plate 1 may also be installed in a dielectric medium other than glass 100, such as plastic. Furthermore, installing the radio wave control plate 1 in a dielectric medium is not limited to bonding the radio wave control plate 1 to the dielectric medium, but also includes placing the radio wave control plate 1 in the vicinity of the dielectric medium.

[0016] (Example of Unit Structure Configuration) An example of the configuration of a unit structure according to the embodiment will be explained using Figure 3. Figure 3 is a diagram showing an example of the configuration of a unit structure according to the embodiment.

[0017] As shown in Figure 3, the unit structure 10 comprises a substrate 11, a first conductor 12, and a second conductor 13. Figure 3 shows the positional relationship between the unit structure 10 and the glass 100 on which the radio wave control board 1 is installed.

[0018] The substrate 11 is a dielectric substrate. The substrate 11 may be, for example, a PET substrate or an FR4 substrate. The substrate 11 is preferably formed of a dielectric material that is substantially transparent to visible light, such as a PET film.

[0019] The first conductor 12 is positioned on the first surface side of the substrate 11. The first conductor 12 extends in the XY plane. The first conductor 12 is bonded to the first surface of the substrate 11, for example, with an adhesive or adhesive tape. The adhesive or adhesive tape is, for example, substantially transparent to visible light. Examples of adhesives or adhesive tapes include, but are not limited to, OCA. Furthermore, a resin or the like may be present between the first surface of the substrate 11 and the first conductor 12, instead of or in addition to the adhesive or adhesive tape. The same applies to the term "bonding" hereafter.

[0020] The second conductor 13 is positioned on the second surface of the substrate 11 that is opposite to the first surface (the surface that is away from the first surface in the Z direction). The second conductor 13 extends in the XY plane. The second conductor 13 is bonded to the second surface of the substrate 11 with an adhesive such as OCA or adhesive tape.

[0021] [First Embodiment] (Example of Configuration of First and Second Conductors) An example of the configuration of the first and second conductors of the first embodiment will be described using Figure 4. Figure 4 is a diagram showing an example of the configuration of the first and second conductors according to the first embodiment.

[0022] Figure 4(a) shows an example of the configuration of the first conductor 12 according to the first embodiment. The first conductor 12 is, for example, a patch conductor formed in a rectangular shape. The first conductor 12 is not the ground conductor (reference conductor) of the unit structure 10. The first conductor 12 is a conductor that functions as a resonator (resonant conductor).

[0023] Figure 4(b) shows an example of the configuration of the second conductor 13 according to the first embodiment. The second conductor 13 is formed on the second surface of the substrate 11. The second conductor 13 has a first opening 21a, a second opening 21b, a third opening 21c, and a fourth opening 21d. The first opening 21a is formed in the upper left part of the second conductor 13. The second opening 21b is formed in the upper right part of the second conductor 13. The third opening 21c is formed in the lower left part of the second conductor 13. The fourth opening 21d is formed in the lower right part of the second conductor 13. The second conductor 13 is the ground conductor of the unit structure 10. The second conductor 13 contributes to the coupling between a dielectric medium (e.g., glass 100) that functions as a resonator and a conductor (e.g., the first conductor 12) that functions as a resonator. In the first embodiment, when the unit structure 10 is bonded to the dielectric medium, the conductor closest to the dielectric medium among the conductors included in the unit structure 10 becomes the second conductor 13. Here, when the radio wave control board 1 is installed in the dielectric medium, it is conceivable to devise a configuration for the radio wave control board 1 such that the conductor closest to the dielectric medium becomes the second conductor 13. For example, one could consider methods to make it clear to the installer which side of the radio wave control board 1 should face the dielectric medium (or which side should be adhered to the dielectric medium) by looking at the board 1, such as (a) marking the side that should face the dielectric medium (or the side that should be adhered to the dielectric medium), (b) making it a different color from the other sides, or (c) pre-applying adhesive or adhesive tape to it. This is also true for other embodiments.

[0024] The first to fourth openings 21a to 21d are openings for adjusting the coupling between the first conductor 12 and the glass 100. The first to fourth openings 21a to 21d are formed, for example, in the same rectangular shape. The first to fourth openings 21a to 21d are formed with four-way rotational symmetry when viewed from the Z direction of the second conductor 13. That is, the first conductor 12 and the glass 100 are coupled magnetically or capacitively through the first to fourth openings 21a to 21d. The strength of the coupling between the first conductor 12 and the glass 100 changes depending on the size, position, shape, etc., of the openings provided in the second conductor 13.

[0025] In other words, in this disclosure, the first conductor 12 and the glass 100 are connected by a second conductor 13 having an opening, thereby making the glass 100 to which the unit structure 10 is bonded function as one of the resonators constituting the radio wave control plate.

[0026] (Frequency Characteristics) The frequency characteristics of the unit structure according to the first embodiment will be explained using Figure 5. Figure 5 is a diagram showing the frequency characteristics of the unit structure according to the first embodiment.

[0027] In Figure 5, the horizontal axis represents frequency [GHz], the left vertical axis represents the reflection coefficient and transmission coefficient [dB], and the right vertical axis represents the phase change amount [deg.] when radio waves are transmitted. Line 101 represents the simulation result of the transmission coefficient when radio waves incident from the first conductor 12 side are transmitted through the glass 100 when the radio wave control plate 1 is installed on the glass 100. Line 102 represents the simulation result of the reflection coefficient when radio waves incident from the first conductor 12 side are reflected back to the first conductor 12 side when the radio wave control plate 1 is installed on the glass 100. Line 103 represents the simulation result of the phase change amount when radio waves incident from the first conductor 12 side are transmitted through the glass 100 when the radio wave control plate 1 is installed on the glass 100. In the example shown in Figure 5, the unit structure 10 is designed so that the transmission coefficient is high in the 28 [GHz] band.

[0028] As shown by lines 101 and 103, even when the unit structure 10 is bonded to the glass 100, at a frequency of 28 GHz, the transmission coefficient is -1 dB or higher, and the phase change of the transmitted radio waves is approximately 90 degrees, demonstrating excellent transmission characteristics.

[0029] In the radio wave control board 1 shown in Figure 1, in order to change the refraction angle of radio waves, it is necessary to adjust the amount of phase change when radio waves are transmitted through each unit structure included in the radio wave control board 1. When the radio wave control board 1 is installed on glass 100, the presence of glass 100 may also affect the amount of phase change. However, since it is usually not possible to change the thickness or dielectric constant of glass 100, the amount of phase change when radio waves are transmitted through the unit structure 10 is adjusted by changing the pattern shape of the second conductor 13.

[0030] (Modified Example) Using Figure 6, an example of the configuration of the first conductor and the second conductor according to a modified example of the first embodiment will be described. Figure 6 is a diagram showing an example of the configuration of the first conductor and the second conductor according to a modified example of the first embodiment.

[0031] Figure 6(a) shows an example of the configuration of the first conductor 12A according to a modification of the first embodiment. The first conductor 12A is larger than the first conductor 12 shown in Figure 4(a). By making the first conductor 12A larger than the first conductor 12, the filter characteristics can be shifted to the lower frequency side.

[0032] Figure 6(b) shows an example of the configuration of the second conductor 13A according to the first embodiment. The second conductor 13A has a first opening 21Aa, a second opening 21Ab, a third opening 21Ac, and a fourth opening 21Ad. The first opening 21Aa to the fourth opening 21Ad are each smaller than the first opening 21a to the fourth opening 21d shown in Figure 4(b). By making the first opening 21Aa to the fourth opening 21Ad smaller than the first opening 21a to the fourth opening 21d, the transmittance coefficient can be adjusted.

[0033] Hereinafter, the unit structure including the first conductor 12A and the second conductor 13B will be referred to as unit structure 10A.

[0034] (Frequency Characteristics) The frequency characteristics of a unit structure according to a modified example of the first embodiment will be explained using Figure 7. Figure 7 is a diagram showing the frequency characteristics of a unit structure according to a modified example of the first embodiment.

[0035] In Figure 7, the horizontal axis represents frequency [GHz], the left vertical axis represents the reflection coefficient and transmission coefficient [dB], and the right vertical axis represents the phase change amount [deg.] when the radio wave is transmitted. Line 111 represents the simulation result of the transmission coefficient when the radio wave control plate 1 is installed on the glass 100 and the radio wave incident from the first conductor 12A side is transmitted through the glass 100. Line 112 represents the simulation result of the reflection coefficient when the radio wave incident from the first conductor 12A side is reflected back to the first conductor 12A side when the radio wave control plate 1 is installed on the glass 100. Line 113 represents the simulation result of the phase change amount when the radio wave incident from the first conductor 12A side is transmitted through the glass 100 when the radio wave control plate 1 is installed on the glass 100.

[0036] As shown by line 113, at 28 GHz, the phase shift of the transmitted radio waves is approximately 26 degrees, indicating that the filter characteristics are shifted to the lower frequency side compared to the result shown by line 103 in Figure 5. However, as shown by line 111, at 28 GHz, the transmission coefficient is approximately -7.7 dB, which is significantly worse than the transmission coefficient shown by line 101 in Figure 5. This is because simply changing the size of the opening of the second conductor does not ensure proper coupling between the first conductor and the glass.

[0037] Therefore, a unit structure is needed in the radio wave control board that can adjust the filter characteristics while suppressing the degradation of the transmission coefficient.

[0038] [Second Embodiment] (Example of Configuration of First and Second Conductors) An example of the configuration of the first and second conductors of the second embodiment will be described using Figure 8. Figure 8 is a diagram showing an example of the configuration of the first and second conductors according to the second embodiment.

[0039] Figure 8(a) shows an example of the configuration of the first conductor 12B according to the second embodiment. The first conductor 12B is the same as the first conductor 12A shown in Figure 6(a).

[0040] Figure 8(b) shows an example of the configuration of the second conductor 13B according to the second embodiment. The second conductor 13B comprises a frame conductor 31B, an inner conductor 32B, a connecting conductor 33Ba, and a connecting conductor 33Bb. The second conductor 13B is a ground conductor with a unit structure.

[0041] The frame conductor 31B is a frame-shaped conductor formed on the side of the second surface of the substrate 11.

[0042] The inner conductor 32B is a rectangular conductor formed inside the frame conductor 31B. In other words, the frame conductor 31B is formed so as to surround the inner conductor 32B. The inner conductor 32B is preferably formed at a position where the center of the inner conductor 32B coincides with the center of the frame conductor 31B when viewed from the Z direction, but is not limited thereto. In FIG. 8, the sides of the frame conductor 31B and the sides of the inner conductor 32B are formed to face each other. The shape of the inner conductor 32B may be the same as or different from the shape of the first conductor 12B.

[0043] The connection conductor 33Ba and the connection conductor 33Bb are conductors that electrically connect the frame conductor 31B and the inner conductor 32B. Both the thickness of the connection conductor 33Ba and the thickness of the connection conductor 33Bb are shorter than the length of one side of the inner conductor 32B.

[0044] The connection conductor 33Ba electrically connects one vertex of the frame conductor 31B and one vertex of the inner conductor 32B (the vertex facing one vertex of the frame conductor 31B). The connection conductor 33Bb electrically connects another vertex of the frame conductor 31B and another vertex of the inner conductor 32B (the vertex facing another vertex of the frame conductor 31B). In FIG. 8, the shape of the second conductor 13B is rotationally symmetric twice when viewed from the Z direction. However, the positions where the connection conductor 33Ba and the connection conductor 33Bb electrically connect the frame conductor 31B and the inner conductor 32B are not limited to the example shown in FIG. 8. The positions where the connection conductor 33Ba and the connection conductor 33Bb electrically connect the frame conductor 31B and the inner conductor 32B may be arbitrary.

[0045] Two openings, a first opening 34Ba and a second opening 34Bb, are formed in the second conductor 13B. In the case of this embodiment, the edge of the first conductor 12B faces near the first opening 34Ba or the second opening 34Bb.

[0046] Hereinafter, the unit structure including the first conductor 12B and the second conductor 13B is referred to as a unit structure 10B.

[0047] (Frequency Characteristics) Using FIG. 9, the frequency characteristics of the unit structure according to the second embodiment will be described. FIG. 9 is a diagram showing the frequency characteristics of the unit structure according to the second embodiment.

[0048] The horizontal axis of FIG. 9 represents frequency [GHz], the left vertical axis represents the reflection coefficient and the transmission coefficient [dB], and the right vertical axis represents the amount of phase change [deg.] when the radio wave passes through. Line 121 represents the simulation result of the transmission coefficient when the radio wave incident from the first conductor 12B side passes through the glass 100 when the radio wave control plate 1 is installed on the glass 100. Line 122 represents the simulation result of the reflection coefficient when the radio wave incident from the first conductor 12B side is reflected to the first conductor 12B side when the radio wave control plate 1 is installed on the glass 100. Line 123 represents the simulation result of the amount of phase change when the radio wave incident from the first conductor 12B side passes through the glass 100 when the radio wave control plate 1 is installed on the glass 100.

[0049] As shown by line 123, at 28 [GHz], the amount of phase change of the transmitted radio wave is approximately -5 [deg.], and the filter characteristics are shifted to the low-frequency side compared to the result shown by line 103 in FIG. 5. Also, as shown by line 121, at 28 [GHz], the transmission coefficient is approximately -3.2 [dB]. That is, the transmission coefficient at 28 [GHz] is larger than the result (line 111) shown in FIG. 7. That is, even when the filter characteristics are shifted to the low-frequency side by forming the first conductor 12B and the second conductor 13B, deterioration of the transmission coefficient can be suppressed.

[0050] [Modification Example of the Second Conductor According to the Second Embodiment] (First Modification Example) Using FIG. 10, a configuration example of the second conductor according to the first modification example of the second embodiment will be described. FIG. 10 is a diagram showing a configuration example of the second conductor according to the first modification example of the second embodiment. Note that since the first conductor is the same as that in the second embodiment, the description thereof is omitted.

[0051] As shown in the first modification example of the second embodiment, the location where the frame conductor and the inner conductor are electrically connected may be one location.

[0052] As shown in Figure 10(a), the second conductor 13C comprises a frame conductor 31C, an inner conductor 32C, and a connecting conductor 33Ca.

[0053] The frame conductor 31C, the inner conductor 32C, and the connecting conductor 33Ca are the same as the frame conductor 31B, the inner conductor 32B, and the connecting conductor 33Ba shown in Figure 8(b), respectively, so their explanation is omitted. In other words, the frame conductor 31C and the inner conductor 32C are electrically connected at only one point.

[0054] A single opening 34Ca is formed in the second conductor 13C.

[0055] As shown in Figure 10(b), the second conductor 13D comprises a frame conductor 31D, an inner conductor 32D, and a connecting conductor 33Da.

[0056] The frame conductor 31D is the same as the frame conductor 31B shown in Figure 8(b), so its explanation is omitted.

[0057] The inner conductor 32D has the same shape as the inner conductor 32B shown in Figure 8(b). The inner conductor 32D is formed inside the frame conductor 31D such that each of its vertices faces each side of the frame conductor 31D.

[0058] The connecting conductor 33Da electrically connects one vertex of the frame conductor 31D to the side of the inner conductor 32D that is opposite to the vertex of the frame conductor 31D.

[0059] The second conductor 13D has one opening 34Da formed in it.

[0060] As shown in Figure 10(c), the second conductor 13E comprises a frame conductor 31E, an inner conductor 32E, and a connecting conductor 33Ea.

[0061] The frame conductor 31E is the same as the frame conductor 31B shown in Figure 8(b), so its explanation is omitted.

[0062] The inner conductor 32E is a rectangular inner conductor formed inside the frame conductor 31E. The sides of the inner conductor 32E are formed to face the sides of the frame conductor 3.

[0063] The connecting conductor 33Ea is electrically connected to one vertex of the frame conductor 31E and to the long side of the inner conductor 32E opposite the left side of the frame conductor 31E. The thickness of the connecting conductor 33Ea is shorter than the length of the short side of the inner conductor 32E.

[0064] A single opening 34Ea is formed in the second conductor 13E.

[0065] (Second Modification) An example of the configuration of the second conductor according to a second modification of the second embodiment will be described using Figure 11. Figure 11 is a diagram showing an example of the configuration of the second conductor according to a second modification of the second embodiment. Note that the first conductor is the same as in the second embodiment, so its explanation will be omitted.

[0066] As shown in the second modified example of the second embodiment, there may be three locations where the frame conductor and the inner conductor are electrically connected.

[0067] As shown in Figure 11(a), the second conductor 13F comprises a frame conductor 31F, an inner conductor 32F, a connecting conductor 33Fa, a connecting conductor 33Fb, and a connecting conductor 33Fc.

[0068] The frame conductor 31F is the same as the frame conductor 31B shown in Figure 8(b), so its explanation is omitted.

[0069] The inner conductor 32F is a circular conductor formed inside the frame conductor 31F.

[0070] The connecting conductors 33Fa, 33Fb, and 33Fc are conductors that electrically connect the frame conductor 31F and the inner conductor 32F.

[0071] The connecting conductor 33Fa electrically connects one side of the frame conductor 31F to the portion of the inner conductor 32F facing that side of the frame conductor 31F. The connecting conductor 33Fb electrically connects another side of the frame conductor 31F to the portion of the inner conductor 32F facing that side of the frame conductor 31F. The connecting conductor 33Fc electrically connects yet another side of the frame conductor 31F to the portion of the inner conductor 32F facing that side of the frame conductor 31.

[0072] The second conductor 13F has three openings: opening 34Fa, opening 34Fb, and opening 34Fc.

[0073] As shown in Figure 11(b), the second conductor 13G comprises a frame conductor 31G, an inner conductor 32G, a connecting conductor 33Ga, a connecting conductor 33Gb, and a connecting conductor 33Gc.

[0074] The frame conductor 31G is the same as the frame conductor 31B shown in Figure 8(b), so its explanation is omitted.

[0075] The inner conductor 32G is an elliptical conductor formed inside the frame conductor 31G. The inner conductor 32G is formed such that its major axis is approximately parallel to one side of the frame conductor 31G.

[0076] The connecting conductors 33Ga, 33Gb, and 33Gc are conductors that electrically connect the frame conductor 31G and the inner conductor 32G.

[0077] The connecting conductor 33Ga electrically connects one vertex of the frame conductor 31G to the portion of the inner conductor 32G that is opposite to that vertex of the frame conductor 31G.

[0078] The connecting conductor 33Gb electrically connects another vertex of the frame conductor 31G to the portion of the inner conductor 32G that is opposite to that vertex of the frame conductor 31G.

[0079] The connecting conductor 33Gc electrically connects another vertex of the frame conductor 31G to the portion of the inner conductor 32G that is opposite to that vertex of the frame conductor 31G.

[0080] The second conductor 13G has three openings: opening 34Ga, opening 34Gb, and opening 34Gc.

[0081] (Third Modification) An example of the configuration of the second conductor according to the third modification of the second embodiment will be described using Figure 12. Figure 12 is a diagram showing an example of the configuration of the second conductor according to the third modification of the second embodiment. Note that the first conductor is the same as in the second embodiment, so its explanation will be omitted.

[0082] As shown in the third modified example of the second embodiment, the frame conductor may have convex or protruding portions. The contours of the convex or protruding portions may be formed by curves instead of straight lines, or in addition to straight lines.

[0083] As shown in Figure 12(a), the second conductor 13H comprises a frame conductor 31H, an inner conductor 32H, a connecting conductor 33Ha, a connecting conductor 33Hb, a protrusion 35Ha, a protrusion 35Hb, a protrusion 35Hc, and a protrusion 35Hd.

[0084] The frame conductor 31H, the inner conductor 32H, the connecting conductor 33Ha, and the connecting conductor 33Hb are the same as the frame conductor 31B, the inner conductor 32B, the connecting conductor 33Ba, and the connecting conductor 33Bb shown in Figure 8(b), respectively, so their explanation is omitted.

[0085] The protrusion 35Ha is formed to project from the center of one inner side of the frame conductor 31H toward the inner conductor 32H. The protrusion 35Ha is formed integrally with the frame conductor 31H, for example.

[0086] The protrusion 35Hb is formed to project from the center of another inner side of the frame conductor 31H toward the inner conductor 32H. The protrusion 35Hb is formed integrally with the frame conductor 31H, for example.

[0087] The protrusion 35Hc is formed to project from the center of another inner side of the frame conductor 31H toward the inner conductor 32H. The protrusion 35Hc is formed integrally with the frame conductor 31H, for example.

[0088] The protrusion 35Hd is formed to project from the center of the remaining inner side of the frame conductor 31H toward the inner conductor 32H. The protrusion 35Hd is formed integrally with the frame conductor 31H, for example.

[0089] The shapes of the protrusions 35Ha to 35Hd are, for example, the same.

[0090] The second conductor 13H has two openings: opening 34Ha and opening 34Hb.

[0091] As shown in Figure 12(b), the second conductor 13I comprises a frame conductor 31I, an inner conductor 32I, a connecting conductor 33Ia, a protrusion 35Ia, a protrusion 35Ib, a protrusion 35Ic, and a protrusion 35Id.

[0092] The frame conductor 31I is the same as the frame conductor 31B shown in Figure 8(b), except that it has protrusions 35Ia, 35Ib, 35Ic, and 35Id.

[0093] On each side of the frame conductor 31I, protrusions 35Ia, 35Ib, 35Ic, and 35Id are formed. Each of the protrusions 35Ia, 35Ib, 35Ic, and 35Id is formed to protrude toward the side of the inner conductor 32I. Each of the protrusions 35Ia, 35Ib, 35Ic, and 35Id is formed to protrude the most, for example, on the inner side of the center of the side of the frame conductor 31I. Each of the protrusions 35Ia, 35Ib, 35Ic, and 35Id is formed integrally with the frame conductor 31I, for example.

[0094] The shapes of the protrusions 35Ia to 35Id are, for example, the same.

[0095] The connecting conductor 33Ia electrically connects the protruding portion 35Id to the side of the inner conductor 32I that faces the protruding portion 35Id.

[0096] The second conductor 13I has one opening 34Ia formed therein.

[0097] As shown in Figures 12(a) and 12(b), the filter characteristics of the unit structure can also be adjusted by forming a shape on the inside of the frame conductor that protrudes toward the inner conductor.

[0098] As described above, in the second embodiment, the non-resonant conductor of the unit structure comprises a frame conductor formed around it and an inner conductor formed inside the frame conductor, and the frame conductor and the inner conductor are electrically connected at least at one point. As a result, the second embodiment can shift the filter characteristics to the low-frequency side and suppress the deterioration of the transmission coefficient.

[0099] [Third Embodiment] A third embodiment will now be described. In the third embodiment, the second conductor is configured with four rotational symmetry when viewed from the Z direction, thereby providing a unit structure that can appropriately adjust the filter characteristics for two polarizations, orthogonal polarization and horizontal polarization.

[0100] (First Example) Using Figure 13, an example of the configuration of the second conductor according to the first example of the third embodiment will be explained. Figure 13 is a diagram showing an example of the configuration of the second conductor according to the first example of the third embodiment. Note that the first conductor is the same as in the second embodiment, so its explanation will be omitted.

[0101] In the first example of the third embodiment, the inner conductor is formed in a rectangular shape.

[0102] As shown in Figure 13(a), the second conductor 13J comprises a frame conductor 31J, an inner conductor 32J, a connecting conductor 33Ja, a connecting conductor 33Jb, a connecting conductor 33Jc, and a connecting conductor 33Jd.

[0103] The frame conductor 31J and the inner conductor 32J are the same as the frame conductor 31B and the inner conductor 32B shown in Figure 8(b), respectively, so their explanation is omitted.

[0104] The connecting conductor 33Ja electrically connects one vertex of the frame conductor 31J to one vertex of the inner conductor 32J (the vertex opposite to the vertex of the frame conductor 31J).

[0105] The connecting conductor 33Jb electrically connects another vertex of the frame conductor 31J to another vertex of the inner conductor 32J (the vertex opposite the other vertex of the frame conductor 31J).

[0106] The connecting conductor 33Jc electrically connects another vertex of the frame conductor 31J to another vertex of the inner conductor 32J (the vertex opposite to the other vertex of the frame conductor 31J).

[0107] The connecting conductor 33Jd electrically connects the remaining vertices of the frame conductor 31J to the remaining vertices of the inner conductor 32J (the vertices opposite the remaining vertices of the frame conductor 31J).

[0108] The second conductor 13J has four openings: opening 34Ja, opening 34Jb, opening 34Jc, and opening 34Jd. The shapes of openings 34Ja, 34Jb, 34Jc, and 34Jd are all the same.

[0109] Thus, the second conductor 13J is formed with four-way rotational symmetry when viewed from the Z direction.

[0110] As shown in Figure 13(b), the second conductor 13K includes a frame conductor 31K, an inner conductor 32K, a connecting conductor 33Ka, a connecting conductor 33Kb, a connecting conductor 33Kc, and a connecting conductor 33Kd.

[0111] The frame conductor 31K and the inner conductor 32K are the same as the frame conductor 31D and the inner conductor 32D shown in Figure 10(b), respectively, so their explanation is omitted.

[0112] The connecting conductor 33Ka electrically connects one vertex of the frame conductor 31K to the side of the inner conductor 32K that is opposite to the vertex of the frame conductor 31K.

[0113] The connecting conductor 33Kb electrically connects another vertex of the frame conductor 31K to the side of the inner conductor 32K that is opposite to that vertex of the frame conductor 31K.

[0114] The connecting conductor 33Kc electrically connects another vertex of the frame conductor 31K to the side of the inner conductor 32K that is opposite to that vertex of the frame conductor 31K.

[0115] The connecting conductor 33Kd electrically connects the remaining vertices of the frame conductor 31K to the edges of the inner conductor 32K that are opposite to those vertices of the frame conductor 31K.

[0116] The second conductor 13K has four openings: opening 34Ka, opening 34Kb, opening 34Kc, and opening 34Kd. The shapes of openings 34Ka, 34Kb, 34Kc, and 34Kd are all the same.

[0117] Thus, the second conductor 13K is formed with four-way rotational symmetry when viewed from the Z direction.

[0118] As shown in Figure 13(c), the second conductor 13L comprises a frame conductor 31L, an inner conductor 32L, a connecting conductor 33La, a connecting conductor 33Lb, a connecting conductor 33Lc, and a connecting conductor 33Ld.

[0119] The frame conductor 31L and the inner conductor 32L are the same as the frame conductor 31C and the inner conductor 32C shown in Figure 10(a), respectively, so their explanation is omitted.

[0120] The connecting conductor 33La electrically connects the central part of one side of the frame conductor 31L to the central part of one side of the inner conductor 32L (the side opposite to the side of the frame conductor 31L).

[0121] The connecting conductor 33Lb electrically connects the center of another side of the frame conductor 31L to the center of another side of the inner conductor 32L (the side opposite the other side of the frame conductor 31L).

[0122] The connecting conductor 33Lc electrically connects the central part of another side of the frame conductor 31L to the central part of another side of the inner conductor 32L (the side opposite to the other side of the frame conductor 31L).

[0123] The connecting conductor 33Ld electrically connects the center of the remaining side of the frame conductor 31L to the center of the remaining side of the inner conductor 32L (the side opposite the remaining side of the frame conductor 31L). The thickness of each connecting conductor 33La, 33Lb, 33Lc, and 33Ld is shorter than the length of one side of the inner conductor 32L.

[0124] The second conductor 13L has four openings: opening 34La, opening 34Lb, opening 34Lc, and opening 34Ld. The shapes of openings 34La, 34Lb, 34Lc, and 34Ld are all the same.

[0125] Thus, the second conductor 13L is formed with four-way rotational symmetry when viewed from the Z direction.

[0126] (Second Example) Using Figure 14, an example of the configuration of the second conductor according to the second example of the third embodiment will be described. Figure 14 is a diagram showing an example of the configuration of the second conductor according to the second example of the third embodiment. Note that the first conductor is the same as in the second embodiment, so its explanation will be omitted.

[0127] In the second example of the third embodiment, the inner conductor is formed in a circular shape.

[0128] As shown in Figure 14, the second conductor 13M includes a frame conductor 31M, an inner conductor 32M, a connecting conductor 33Ma, a connecting conductor 33Mb, a connecting conductor 33Mc, and a connecting conductor 33Md.

[0129] The frame conductor 31M and the inner conductor 32M are the same as the frame conductor 31F and the inner conductor 32F shown in Figure 11(a), respectively, so their explanation is omitted.

[0130] The connecting conductor 33Ma electrically connects the central part of one side of the frame conductor 31M to the portion of the inner conductor 32M that is opposite to the central part of that side of the frame conductor 31M.

[0131] The connecting conductor 33Mb electrically connects the central part of another side of the frame conductor 31M to the portion of the inner conductor 32M that is opposite to the central part of that side of the frame conductor 31M.

[0132] The connecting conductor 33Mc electrically connects the central part of another side of the frame conductor 31M to the portion of the inner conductor 32M that is opposite to the central part of that side of the frame conductor 31M.

[0133] The connecting conductor 33Md electrically connects the central part of the remaining side of the frame conductor 31M to the portion of the inner conductor 32M that faces the central part of that side of the frame conductor 31M.

[0134] The second conductor 13M has four openings: opening 34Ma, opening 34Mb, opening 34Mc, and opening 34Md. The shapes of openings 34Ma, 34Mb, 34Mc, and 34Md are all the same.

[0135] Thus, the second conductor 13M is formed with four-way rotational symmetry when viewed from the Z direction.

[0136] (Third Example) Using Figure 15, an example of the configuration of the second conductor according to the third example of the third embodiment will be described. Figure 15 is a diagram showing an example of the configuration of the second conductor according to the third example of the third embodiment. Note that the first conductor is the same as in the second embodiment, so its explanation will be omitted.

[0137] In the third example of the third embodiment, a convex or protruding portion is formed on the frame conductor.

[0138] As shown in Figure 15(a), the second conductor 13N includes a frame conductor 31N, an inner conductor 32N, a connecting conductor 33Na, a connecting conductor 33Nb, a connecting conductor 33Nc, and a connecting conductor 33Nd.

[0139] The frame conductor 31N and the inner conductor 32N are the same as the frame conductor 31C and the inner conductor 32C shown in Figure 10(a), respectively, so their explanation is omitted.

[0140] The frame conductor 31N has protrusions 35Na, 35Nb, 35Nc, and 35Nd formed on it. The protrusions 35Na, 35Nb, 35Nc, and 35Nd are the same as the protrusions 35Ha, 35Hb, 35Hc, and 35Hd shown in Figure 12(a), respectively, so their explanation is omitted.

[0141] The connecting conductor 33Na electrically connects one vertex of the frame conductor 31N to one vertex of the inner conductor 32N (the vertex opposite to one vertex of the frame conductor 31N).

[0142] The connecting conductor 33Nb electrically connects another vertex of the frame conductor 31N to another vertex of the inner conductor 32N (the vertex opposite the other vertex of the frame conductor 31N).

[0143] The connecting conductor 33Nc electrically connects another vertex of the frame conductor 31N to yet another vertex of the inner conductor 32N (the vertex opposite to yet another vertex of the frame conductor 31N).

[0144] The connecting conductor 33Nd electrically connects the remaining vertices of the frame conductor 31N to the remaining vertices of the inner conductor 32N (the vertices opposite the remaining vertices of the frame conductor 31N).

[0145] The second conductor 13N has four openings: opening 34Na, opening 34Nb, opening 34Nc, and opening 34Nd. The shapes of openings 34Na, 34Nb, 34Nc, and 34Nd are all the same.

[0146] Thus, the second conductor 13N is formed with four-way rotational symmetry when viewed from the Z direction.

[0147] As shown in Figure 15(b), the second conductor 13O includes a frame conductor 31O, an inner conductor 32O, a connecting conductor 33Oa, a connecting conductor 33Ob, a connecting conductor 33Oc, and a connecting conductor 33Od.

[0148] The frame conductor 31O and the inner conductor 32O are the same as the frame conductor 31I and the inner conductor 32I shown in Figure 12(b), so their explanation is omitted.

[0149] The frame conductor 31O has protrusions 35Oa, 35Ob, 35Oc, and 35Od formed thereon. Protrusions 35Oa, 35Ob, 35Oc, and 35Od are the same as protrusions 35Ia, 35Ib, 35Ic, and 35Id shown in Figure 12(b), respectively, so their explanation is omitted.

[0150] The connecting conductor 33Oa electrically connects the protruding portion 35Oa to the side of the inner conductor 32O that faces the protruding portion 35Oa.

[0151] The connecting conductor 33Ob electrically connects the protruding portion 35Ob to the side of the inner conductor 32O that faces the protruding portion 35Ob.

[0152] The connecting conductor 33Oc electrically connects the protruding portion 35Oc to the side of the inner conductor 32O that faces the protruding portion 35Oc.

[0153] The connecting conductor 33Od electrically connects the protruding portion 35Od to ​​the side of the inner conductor 32O that faces the protruding portion 35Od.

[0154] The second conductor 13O has openings 34Oa, 34Ob, 34Oc, and 34Od. The shapes of openings 34Oa, 34Ob, 34Oc, and 34Od are all the same.

[0155] Thus, the second conductor 13O is formed with four-way rotational symmetry when viewed from the Z direction.

[0156] As described above, in the third embodiment, the second conductor is formed with four-way rotational symmetry when viewed from the Z direction. As a result, the third embodiment can shift the filter characteristics to the lower frequency side and suppress the degradation of the transmission coefficient for two polarizations, orthogonal polarization and horizontal polarization.

[0157] [Summary] By constructing a radio wave control board using at least one of the unit structures shown in the second and third embodiments described above, the degradation of the transmission coefficient of the radio wave control board can be suppressed. In this case, even if the unit structure shown in the first embodiment or other unit structures known at the time of this application are included in the radio wave control board, it will be more effective than if the unit structures shown in the second and third embodiments are not included at all.

[0158] Furthermore, the present disclosure may also take the following configurations: (1) A unit structure included in a radio wave control board, comprising: a resonant conductor disposed on a first surface; and a ground conductor disposed on a second surface separated from the first surface in a first direction, and located closer to the dielectric medium than the resonant conductor when the radio wave control board is installed in the dielectric medium, wherein the ground conductor comprises: a first ground conductor facing the resonant conductor; a second ground conductor surrounding the first ground conductor; and at least one third ground conductor electrically connecting the first ground conductor and the second ground conductor, the unit structure according to (1). (2) The ground conductor comprises a plurality of the third ground conductors, wherein the first ground conductor, the second ground conductor, and the plurality of the third ground conductors are configured to be 4 rotationally symmetric in a plan view from the first direction, the unit structure according to (1). (3) The second ground conductor has a shape that protrudes toward the side where the first ground conductor exists, the unit structure according to (1) or (2). (4) A radio wave control board having at least one unit structure as described in any one of (1) to (3) above.

[0159] 1 Radio wave control board 2, 11 Substrate 10, 10a, 10A, 10b, 10B, 10c, 10d Unit structure 12, 12A, 12B First conductor 13, 13A, 13B, 13C, 13D, 13E, 13F, 13G, 13H, 13I, 13J, 13K, 13L, 13M, 13N, 13O Second conductor 21a, 21Aa, 34Ba First aperture 21Ab, 21b, 34Bb Second aperture 21Ac, 21c Third aperture 21Ad, 21d Fourth aperture 31, 31B, 31C, 31D, 31E, 31F, 31G, 31H, 31I, 31J, 31K, 31L, 31M, 31N, 31O Frame conductors (examples of second ground conductors): 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J, 32K, 32L, 32M, 32N, 32O Inner conductors (examples of first ground conductors) 33Ba, 33Bb, 33Ca, 33Da, 33Ea, 33Fa, 33Fb, 33Fc, 33Ga, 33Gb, 33Gc, 33Ha, 33Hb, 33Ia, 33Ja, 33Jb, 33Jc, 33Jd, 33Ka, 33Kb, 33Kc, 33Kd, 33La, 33Lb, 33Lc, 33Ld, 33Ma, 33Mb, 33Mc, 33Md, 33Na, 33Nb, 33Nc, 33Nd, 33Oa, 33Ob, 33Oc, 33Od Connecting conductor (an example of a third ground conductor) 34Ca, 34Da, 34Ea, 34Fa, 34Fb, 34Fc, 34Ga, 34Gb, 34Gc, 34Ha, 34Hb, 34Ia, 34Ja, 34Jb, 34Jc, 34Jd, 34Ka, 34Kb, 34Kc, 34Kd, 34La, 34Lb, 34Lc, 34Ld, 34Ma, 34Mb, 34Mc, 34Md, 34Na, 34Nb, 34Nc, 34Nd, 34Oa, 34Ob, 34Oc, 34Od Opening 35Ha, 35Hb, 35Hc, 35Hd, 35Na, 35Nb, 35Nc, 35Nd Protrusion 35Ia, 35Ib, 35Ic, 35Id, 35Oa, 35Ob, 35Oc, 35Od Projection 100 Glass 101, 102, 103, 111, 112, 113, 121, 122, 123 Line

Claims

1. A unit structure included in a radio wave control board, comprising: a resonant conductor disposed on a first surface; and a ground conductor disposed on a second surface separated from the first surface in a first direction, and positioned closer to the dielectric medium than the resonant conductor when the radio wave control board is installed in the dielectric medium, wherein the ground conductor comprises: a first ground conductor facing the resonant conductor; a second ground conductor surrounding the first ground conductor; and at least one third ground conductor electrically connecting the first ground conductor and the second ground conductor.

2. The unit structure according to claim 1, wherein the ground conductor comprises a plurality of third ground conductors, and the first ground conductor, the second ground conductor, and the plurality of third ground conductors are configured to be four-way symmetric in a plan view from the first direction.

3. The unit structure according to claim 1 or 2, wherein the second ground conductor has a shape that protrudes toward the side where the first ground conductor is located.

4. A radio wave control board having at least one unit structure according to any one of claims 1 to 3.

Images