Processing device for processing a substrate for an electrochemical cell, method for processing a substrate for an electrochemical cell, and substrate for an electrochemical cell
A cylindrical holder and laser processing unit with active and passive cooling facilitate efficient, single-step machining of electrochemical cell substrates, addressing inefficiencies in existing devices and enhancing series production efficiency.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ROBERT BOSCH GMBH
- Filing Date
- 2025-12-09
- Publication Date
- 2026-06-18
AI Technical Summary
Existing processing devices for electrochemical cell substrates are inefficient in machining, particularly in creating recesses and through-holes, due to non-optimal holder design and lack of efficient cooling and multi-step processing.
A cylindrical holder that clamps substrates circumferentially, combined with a laser processing unit that creates through-holes using pulsed laser beams, and includes active and passive cooling, allowing for efficient, single-step processing without permanent deformation.
Enables efficient, deformation-free, and high-quality machining of electrochemical cell substrates, particularly in series production, by reducing cycle time and increasing process reliability.
Smart Images
Figure EP2025085996_18062026_PF_FP_ABST
Abstract
Description
[0001] R. 417231
[0002] -1 -
[0003] Description
[0004] title
[0005] Processing device for processing a substrate for an electrochemical cell, method for processing a substrate for an electrochemical cell, and substrate for an electrochemical cell
[0006] The present invention relates to a processing device for processing a substrate for an electrochemical cell, comprising a holder for the substrate and a processing unit for processing the substrate, as well as a method for processing a substrate for an electrochemical cell, wherein the substrate is held by means of a holder and processed by means of a processing unit. Furthermore, the invention also relates to a substrate for an electrochemical cell which has been processed by means of such a processing device and / or by means of such a method.
[0007] State of the art
[0008] Processing devices for processing substrates for electrochemical cells are known. Such a processing device typically includes a holder for a substrate and a processing unit for processing the substrate.
[0009] Disclosure of the invention
[0010] In contrast, the present machining device with the features of the main claim has the advantage that the holder is at least partially, and in particular substantially, cylindrical. This enables more efficient machining of the substrate. R. 417231
[0011] -2-
[0012] In this context, a "processing device" can be understood to mean, in particular, a device designed for processing a substrate. Preferably, the processing device is multi-part. Preferably, direct processing of the substrate is carried out in one processing step. Alternatively, indirect processing of the substrate by the processing device is also conceivable. Particularly preferably, the processing device is designed to perform all necessary steps, for example, a processing step.
[0013] In this context, a "processing unit" can be understood to mean, in particular, a unit designed to process a substrate. Preferably, the processing unit is designed to create recesses, especially through-holes, in the substrate. Preferably, the processing unit is designed to produce a laser beam. Preferably, the processing unit is designed to produce a pulsed laser beam. Preferably, the processing unit is designed to produce a single laser pulse and / or several successive laser pulses. Particularly preferably, the processing unit is designed as a laser drilling unit, in particular as a laser drill. In particular, the processing unit is designed to process at least one surface of the substrate for an electrochemical cell.
[0014] Preferably, energy is locally introduced by the laser beam generated by the processing unit. Particularly preferably, the local energy is high enough that the surface of the substrate is at least substantially partially, preferably largely, and particularly preferably completely melted and / or vaporized. Alternatively, particularly complete melting combined with at least substantially partial vaporization is also conceivable. Preferably, at least one recess is created in the substrate for an electrochemical cell by processing the surface. Particularly preferably, a through-hole is formed in the substrate for an electrochemical cell by processing the surface. Preferably, the through-hole is formed perpendicular to a principal plane of extension of the substrate for an electrochemical cell.
[0015] In this context, a "substrate for an electrochemical cell" can preferably be understood to mean a substrate intended for use in a fuel cell. Alternatively, the substrate can also preferably be intended for use in an electrolyte cell. The substrate for R. 417231 is particularly preferred.
[0016] -3- used in a solid oxide fuel cell. Preferably, the substrate for an electrochemical cell is designed as a sheet. Furthermore, other materials that appear suitable to a person skilled in the art are also conceivable.
[0017] In this context, the phrase "at least substantially" can be understood to mean, in particular, that a condition or property to which the phrase refers is present or fulfilled in its basic or important aspects or characteristics, but possibly not in all details or with perfect accuracy. Specifically, the phrase indicates that, although there may be some minor tolerances, deviations, variations, or imperfections, the condition or property is nevertheless present. Specifically, the phrase indicates that a close approximation to the condition or property has been achieved, even if it is not 100% perfect or exact. Specifically, the phrase indicates that the condition or property can be achieved at least 90%, preferably at least 95%.
[0018] The features listed in the dependent claims enable advantageous further developments of the machining device according to the main claim. For example, it is advantageous if the holder is designed to hold the substrate circumferentially. This allows for particularly efficient machining.
[0019] Within the scope of the present invention, the term "provided for" can be understood to mean, in particular, specifically designed, programmed, configured, and / or equipped. The fact that an object is provided for a specific function is understood to mean, in particular, that the object fulfills and / or performs this specific function in at least one application and / or operating state, or that the object fulfills and / or performs this specific function in at least one application and / or operating state.
[0020] In this context, the term "circumferential" can be understood to refer in particular to a side surface of an object that contains a perimeter and / or is defined by a perimeter. Specifically, this can be an actual side surface of the object and / or a side surface of the smallest imaginary form that just completely encloses the object. Particularly preferably, the phrase "the holder is designed to hold the substrate circumferentially" can be understood to mean that the substrate is in and / or attached to a R. 417231
[0021] -4-
[0022] The side surface of the bracket, for example on a cylindrical surface of the bracket, is held.
[0023] It is also advantageous if the holder is designed to clamp the substrate, particularly around its circumference, especially in such a way that the substrate has a curved surface, but no permanent deformation occurs. This also enables particularly efficient processing.
[0024] It is particularly advantageous if the holder includes means for cooling the substrate, especially actively and / or passively. This also enables particularly efficient processing.
[0025] In this context, "active cooling" can be understood to mean, in particular, the active extraction and / or removal of thermal energy from an object and / or its environment. This is preferably achieved through the use of means such as nozzles, fans, cooling systems, and cooling media, which typically consume additional energy to enable the extraction and / or removal of thermal energy.
[0026] In this context, "passive cooling" can be understood to mean, in particular, the passive extraction and / or removal of thermal energy from an object and / or its environment. This preferably occurs through natural physical processes such as convection, radiation, or heat dissipation, which typically do not consume additional energy to enable the extraction and / or removal of thermal energy.
[0027] It is also advantageous if the bracket is rotationally symmetrical and / or, in particular, arranged to rotate around its axis of symmetry as the axis of rotation.
[0028] This enables more efficient processing of substrates, especially in series production.
[0029] It is also advantageous if the holder is designed to hold, and preferably clamp, a large number of substrates, particularly around their circumference. This also enables more efficient processing of substrates, especially in series production. R. 417231
[0030] -5-
[0031] It is also advantageous if the processing device is characterized by a large number of processing units for processing the substrate, especially the large number of substrates. This also enables more efficient processing of substrates, especially in series production.
[0032] The present method has the advantage that the substrate is held by means of a holder that is at least partially, and in particular essentially, cylindrical. This also enables more efficient processing of the substrate.
[0033] The features listed in the dependent claims allow for advantageous further developments of the method. For example, it is advantageous if the substrate is held circumferentially by means of the holder. This also enables particularly efficient processing.
[0034] It is also advantageous if the substrate is clamped by means of the holder, particularly around its circumference, especially in such a way that the substrate has a curved surface, but no permanent deformation occurs. This also enables particularly efficient processing.
[0035] It is particularly advantageous if the substrate is cooled, especially actively and / or passively. This also enables particularly efficient processing.
[0036] It is also advantageous if the bracket is rotationally symmetrical and / or, in particular, arranged to rotate around its axis of symmetry as the axis of rotation.
[0037] This enables more efficient processing of substrates for series production.
[0038] It is also advantageous if the holder can accommodate a large number of substrates, particularly around their circumference, preferably by clamping them. This also enables more efficient processing of substrates for series production.
[0039] It is also advantageous if the substrate, especially the multitude of substrates, is processed using a large number of processing units. This also enables more efficient processing of substrates for series production.
[0040] Drawings R. 417231
[0041] -6- The drawings schematically illustrate embodiments of the invention, which are explained in more detail in the following description. They show
[0042] Fig. 1 shows a schematic, perspective view of an embodiment of a machining device for machining a substrate for an electrochemical cell, and
[0043] Fig. 2 shows an exemplary comparison of machining a stressed substrate (top) versus machining a non-stressed substrate (bottom).
[0044] Description of the exemplary implementations
[0045] Figure 1 shows a schematic, perspective view of an embodiment of a processing device 10 for processing at least one substrate 12, or in the case shown, two substrates 12, for an electrochemical cell. The processing device 10 shown comprises a holder 14 for the substrate 12, as well as at least one processing unit 16, or in the case shown, two processing units 16, for processing the substrate 12.
[0046] In the case shown, the processing units 16 are configured as laser drilling units 18. The processing units 16, or the laser drilling units 18, each comprise a laser unit 20, which is designed to generate a laser beam 22, in the case shown a pulsed laser beam 24, for processing the substrates 12, and a deflection unit 26, which is designed to deflect the laser beam 22 onto the substrates 12.
[0047] In the illustrated embodiment, the holder 14 is at least partially, and in particular substantially, and in the illustrated case even completely, cylindrical. This enables more efficient machining of the substrates 12.
[0048] Furthermore, in the illustrated embodiment, the holder 14 is designed to hold the substrates 12 circumferentially. This allows the substrates 12 to be flexibly arranged for processing, which in turn enables particularly efficient processing of the substrates 12. R. 417231
[0049] -7-
[0050] Furthermore, in the case shown, the holder 14 is designed to clamp the substrate 12, in this case circumferentially. This reduces distortion of the substrate 12 and, consequently, enables particularly efficient processing of the substrate 12.
[0051] Figure 2 illustrates this by showing an example of machining a stressed substrate (top) versus machining an unstressed substrate (bottom). In the top row, Figure 2 shows, from left to right, an example of the machining process of a substrate 12, which is first stressed (left) and then released (right) after machining (center). In the bottom row, Figure 2 again shows, from left to right, an example of the machining process of a substrate 12 that is unstressed before machining (center) (left) and deforms during machining (right).
[0052] In the case shown, the holder 14 is specifically designed to clamp the substrate 12 in such a way that the substrate 12 has a curved surface 28, but without any permanent deformation of the substrate 12. This allows the substrate to be clamped for machining particularly easily, and after the clamping is released, it essentially returns to its original, straight state. Therefore, no further steps are necessary to return the substrate 12 to a largely straight state. Accordingly, this also enables particularly efficient machining. Furthermore, it can increase process reliability and the quality of the machined substrates 12.
[0053] As shown in Fig. 2 (top left), the tension on the substrate 12 generates a tensile stress 32 on a first side 30 of the substrate 12, which in this case is where the laser beam 22 strikes during processing, whereas a compressive stress 36 is generated on a second side 34, which in this case is opposite. These stresses counteract the energy input of the laser beam 22 and the associated distortion of the substrate 12 during processing (top center), or when creating a recess 38 in the substrate 12. As a result, after the substrate 12 is released, it returns to a state that is at least substantially flat and not curved (top right).In contrast, energy input by the laser beam 22 to an unstrained substrate 12 (bottom left) during processing of the substrate 12 (bottom center) leads to distortion of the substrate 12, which in turn results in a substrate 12 that is at least substantially not flat, but curved (bottom right). R. 417231.
[0054] -8-
[0055] Furthermore, in the embodiment of the machining device 10 shown in Fig. 1, the holder 14 includes means 42 for cooling the substrates 12, in particular actively or passively. This further reduces distortion of the substrates 12 during machining. Accordingly, this also enables particularly efficient machining.
[0056] In the case shown, the cooling means 42 for the substrates 12 are nozzles 42 on the substrates 12. The nozzles 12 generate an airflow directed towards the substrates 12, resulting in active cooling of the substrates. Alternatively, other cooling means would also be possible. For example, flow channels for coolant could be formed in the holder 14, through which passive cooling of the substrates 14 could then be achieved via the holder 14.
[0057] Furthermore, the holder 14 in the illustrated embodiment is rotationally symmetrical. In this case, the holder 14 can be rotated about its axis of symmetry 42 as the axis of rotation 44. This makes it advantageously possible to design the holder 14 to be movable, which in turn allows for greater flexibility in the processing of substrates 12. In particular, this allows the processable area per substrate 12 to be increased, as well as enabling on-the-fly processing. This also reduces non-productive time, especially in series production, for example, for changing and / or turning individual substrates 12. Accordingly, this enables more efficient processing of substrates 12, especially in series production.
[0058] As can be seen in Fig. 1, the holder 14 in the illustrated embodiment is designed to hold, or in this case clamp, a plurality of substrates 12, in this case circumferentially. This allows the plurality of substrates 14 to be mounted in and / or onto the holder 14 in a single step, thereby reducing non-productive time, particularly in series production, for example, for replacing and / or turning individual substrates 12. This, in turn, reduces the cycle time for processing the substrates 12. Accordingly, this also enables more efficient processing of substrates 12, especially in series production.
[0059] As can also be seen in Fig. 1, the machining device 10 in the illustrated embodiment comprises a plurality of machining units 16 for machining the substrate, in the illustrated case the plurality of substrates 12. Thus, the R. 417231
[0060] -9-
[0061] Substrates 14 can be processed simultaneously by the large number of processing units 16, which also reduces non-productive time, especially in series production, for example for changing and / or turning individual substrates 12.
[0062] This in turn also reduces the cycle time when processing substrates 12. Accordingly, this also enables more efficient processing of substrates 12, especially in series production.
Claims
R. 417231 -10- Claims 1. Machining device (10) for machining a substrate (12) for an electrochemical cell, comprising a holder (14) for the substrate (12) and a machining unit (16) for machining the substrate (12), characterized in that the holder (14) is at least partially, in particular substantially, cylindrical.
2. Processing device (10) according to claim 1 , characterized in that the holder (14) is provided to hold the substrate circumferentially.
3. Machining device (10) according to one of the preceding claims, characterized in that the holder (14) is provided to clamp the substrate (12), in particular circumferentially, in particular such that the substrate (12) has a curved surface (28), but no permanent deformation occurs.
4. Processing device (10) according to one of the preceding claims, characterized in that the holder (14) comprises means (40) for, in particular active and / or passive, cooling of the substrate (12).
5. Machining device (10) according to one of the preceding claims, characterized in that the holder (14) is rotationally symmetrical and / or is arranged to rotate about its axis of symmetry (44) as the axis of rotation (46).
6. Machining device (10) according to one of the preceding claims, characterized in that the holder (12) is provided to hold a plurality of substrates (12), in particular circumferentially, preferably to clamp them. R. 417231 -11 - 7. Machining device (10) according to one of the preceding claims, characterized by a plurality of machining units (10) for machining the substrate (12), in particular the plurality of substrates (12).
8. Method for processing a substrate (12) for an electrochemical cell, in particular by means of a processing device (10), preferably a processing device (10) according to one of claims 1 to 7, wherein the substrate (12) is held by means of a holder (14) and processed by means of a processing unit (16), characterized in that the substrate (12) is held by means of a holder (14) that is at least partially, in particular substantially, cylindrical.
9. Method according to claim 8, characterized in that the substrate (12) is held circumferentially by means of the holder (14).
10. Method according to one of claims 8 or 9, characterized in that the substrate (12) is clamped by means of the holder (14), in particular circumferentially, in particular such that the substrate (12) has a curved surface (28), but no permanent deformation occurs.
11. Method according to one of claims 8 to 10, characterized in that the substrate (12) is cooled, in particular actively and / or passively.
12. Method according to one of claims 8 to 11, characterized in that the holder (14), which is preferably rotationally symmetrical, is rotated, in particular about its axis of symmetry (44) as the axis of rotation (46).
13. Method according to one of claims 8 to 12, characterized in that a plurality of substrates (12), in particular circumferentially, are held, preferably clamped, by means of the holder (14).
14. Method according to one of claims 8 to 13, characterized in that the substrate (12), in particular the plurality of substrates (12), is processed by means of a plurality of processing units (16). R. 417231 -12- 15. Substrate (12) for an electrochemical cell, which was processed by means of a processing device (10) according to one of claims 1 to 7 and / or by means of a method according to one of claims 8 to 14.