Electronic device comprising radiation cell

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a housing; a circuit board which is disposed inside the housing and on which a processor is disposed; an ion battery configured to supply power to the circuit board; a heat dissipation member configured to dissipate heat generated by the processor; and a radiation cell disposed between the ion battery and the heat dissipation member so as to exchange heat with the heat dissipation member.

Description

Electronic device including a radiation cell

[0001] This application claims the benefit of priority based on Korean Patent Application No. 2024-0184148 filed on December 11, 2024, and all contents disclosed in the document of said Korean Patent Application are incorporated herein as part of this specification.

[0002] A radioisotope is an element that decays into a stable isotope while emitting radiation. Known modes of radioisotope decay include alpha decay, beta decay, and gamma decay. Depending on the type of radioisotope, it emits alpha, beta, or gamma rays as it decays. Meanwhile, the time it takes for a radioisotope to decay and reduce its radioactivity to half of its initial level is called the half-life. The type of radiation emitted during decay and the half-life are determined by the type of radioisotope.

[0003] Generally, a radiation cell is a battery that utilizes beta rays, which are radiation emitted from radioactive isotopes. Beta rays are absorbed by a semiconductor with a PN junction, forming electron-hole pairs from the depletion layer, and the formed electrons and holes can be used as an electrical power source. In other words, a radiation cell is a battery designed to convert the nuclear fission energy of a radioactive isotope into electrical energy for use as an electrical power source.

[0004] The problem to be solved in the embodiments of the present disclosure may be to provide an electronic device including a radiation cell.

[0005] The problem to be solved in the embodiments of the present disclosure may be to release heat generated from a radiation cell.

[0006] The problem to be solved in the embodiments of the present disclosure may be to release heat from a radiation cell by utilizing a component included in an electronic device.

[0007] The problem to be solved in the embodiments of the present disclosure may be to arrange the radiation cell so as not to affect the thickness of the electronic device.

[0008] The problems to be solved in the embodiments of the present disclosure are not limited to those described above.

[0009] An electronic device according to an embodiment of the present disclosure may include: a housing; a circuit board disposed inside the housing and having a processor disposed thereon; and an ion battery configured to supply power to the circuit board.

[0010] An electronic device according to an embodiment of the present disclosure may include a heat dissipation member configured to dissipate heat generated in the processor.

[0011] An electronic device according to an embodiment of the present disclosure may include a radiation cell disposed between the ion battery and the heat dissipation member so as to be heat-exchangeable with the heat dissipation member.

[0012] An electronic device according to an embodiment of the present disclosure may include an ion battery receiving portion in which the ion battery is disposed, and a support member including an opening formed in the ion battery receiving portion facing the heat dissipation member.

[0013] The radiation cell according to an embodiment of the present disclosure may be arranged to exchange heat with the heat dissipation member inside the opening.

[0014] According to an embodiment of the present disclosure, the ion battery and the heat dissipation member may be located in opposite directions with respect to the support member.

[0015] The radiation cell according to an embodiment of the present disclosure may be disposed inside the opening formed between the ion battery and the heat dissipation member.

[0016] An electronic device according to an embodiment of the present disclosure may include a first adhesive layer disposed between the heat dissipation member and the radiation cell.

[0017] An electronic device according to an embodiment of the present disclosure may include a second adhesive layer disposed between the ion battery and the radiation cell.

[0018] An electronic device according to an embodiment of the present disclosure may include an insulating layer disposed between the heat dissipation member and the ion battery.

[0019] An electronic device according to an embodiment of the present disclosure may include wiring that passes through the interior of the insulating layer and connects the radiation cell and the ion battery.

[0020] The radiation cell according to an embodiment of the present disclosure may be spaced apart from the processor in the direction in which the heat dissipation member extends.

[0021] An electronic device according to an embodiment of the present disclosure may include a case that surrounds the radiation cell and is in contact with the heat dissipation member to exchange heat.

[0022] The circuit board according to an embodiment of the present disclosure may include a first substrate portion on which the processor is disposed.

[0023] The circuit board according to an embodiment of the present disclosure may include a second substrate portion extended in a direction intersecting the first substrate portion.

[0024] The circuit board according to an embodiment of the present disclosure may include a substrate opening formed in an area where the first substrate portion and the second substrate portion intersect.

[0025] According to an embodiment of the present disclosure, the heat dissipation member and the case may come into contact in an area where the first substrate portion and the second substrate portion intersect.

[0026] The case according to an embodiment of the present disclosure may include a metal material and a heat dissipation layer surrounding the radiation cell.

[0027] The case according to an embodiment of the present disclosure may include a shielding layer that is laminated with the heat dissipation layer and surrounds the radiation cell.

[0028] An electronic device according to an embodiment of the present disclosure can dissipate heat from a radiation cell by utilizing a heat dissipation member disposed inside a housing.

[0029] An electronic device according to an embodiment of the present disclosure can dissipate heat from a circuit board and a radiation cell using the same component.

[0030] An electronic device according to an embodiment of the present disclosure can improve space utilization by placing a radiation cell in an opening of a support member.

[0031] The effects according to the embodiments of the present disclosure are not limited to those described above.

[0032] FIG. 1 is a front view of an electronic device according to an embodiment of the present disclosure.

[0033] FIG. 2 is a rear view of an electronic device according to an embodiment of the present disclosure.

[0034] FIG. 3 is an exploded view of an electronic device according to an embodiment of the present disclosure.

[0035] FIG. 4 is a front view of a disassembled portion of an electronic device according to an embodiment of the present disclosure.

[0036] FIG. 5 is an exploded view of some parts of an electronic device according to an embodiment of the present disclosure.

[0037] FIG. 6 is a part of a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0038] FIG. 7 is a conceptual diagram of a radiation cell according to an embodiment of the present disclosure.

[0039] FIG. 8 is a part of an electronic device according to an embodiment of the present disclosure.

[0040] FIG. 9 is a part of a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0041] Prior to the detailed description of the present invention, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, they should be interpreted in a sense and concept consistent with the technical spirit of the present invention, based on the principle that the inventor may appropriately define the concept of the terms to best describe his invention. Accordingly, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all aspects of the technical spirit of the present invention. Therefore, it should be understood that various equivalents and modifications capable of replacing them may exist at the time of filing this application.

[0042] Identical reference numbers or symbols in each drawing attached to this specification represent parts or components that perform substantially the same function. For convenience of explanation and understanding, the same reference numbers or symbols may be used to describe different embodiments. That is, even if components having the same reference number are depicted in multiple drawings, the multiple drawings do not all represent a single embodiment.

[0043] In the following description, singular expressions include plural expressions unless the context clearly indicates otherwise. Terms such as "comprising" or "constituting" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0044] In addition, it should be noted in advance that expressions such as upper side, top, lower side, bottom, side, front, and rear in the following description are based on the direction depicted in the drawings, and may be expressed differently if the direction of the object changes.

[0045] Additionally, in this specification and claims, terms including ordinal numbers, such as "first," "second," etc., may be used to distinguish between components. These ordinal numbers are used to distinguish identical or similar components from one another, and the meaning of the terms should not be limited by the use of such ordinal numbers. For example, the order of use or arrangement of components combined with such ordinal numbers should not be limited by the number. If necessary, each ordinal number may be used interchangeably.

[0046] Embodiments of the present invention will be described below with reference to the attached drawings. However, the scope of the present invention is not limited to the embodiments presented. For example, a person skilled in the art who understands the scope of the present invention may propose other embodiments that fall within the scope of the concept of the present invention by adding, changing, or deleting components, and such embodiments shall also be deemed to be within the scope of the concept of the present invention. In the drawings, the shapes and sizes of elements may be exaggerated for clearer explanation.

[0047] FIG. 1 is a front view of an electronic device (1). FIG. 2 is a rear view of an electronic device (1).

[0048] The electronic device (1) may be a portable electronic device such as a mobile phone. The electronic device (1) may be a device driven by the operation of electrical components that receive power from a charged ion battery (ion battery (150) of FIG. 3).

[0049] The electronic device (1) may include an ion battery (ion battery (150) of FIG. 3) and a radiation cell (radiation cell (180) of FIG. 3). The ion battery (150) may be a battery that generates power using lithium ions. The radiation cell (180) may be a battery that generates power using radiation emitted from a radiation source. The ion battery (150) may be named the “first power supply unit,” and the radiation cell (180) may be named the “second power supply unit.” The ion battery (150) may supply primary power to the electrical components included in the electronic device (1), and the radiation cell (180) may supply secondary power to the electrical components included in the electronic device (1). At this time, the magnitude of power supplied from the ion battery (150) to the electrical components may be greater than the magnitude of power supplied from the radiation cell (180) to the electrical components.

[0050] The electronic device (1) may include a housing (110). The electronic device (1) may include a display (120). The housing (110) and the display (120) may form the exterior of the electronic device (1). The display (120) may be visually exposed on the front of the housing (110). The housing (110) may support the display (120). The housing (110) may include a side wall (115) surrounding the display (120). The display (120) may be supported by a support member (support member (111) of FIG. 3) and the side wall (115).

[0051] The electronic device (1) may include a rear cover (116). The rear cover (116) may cover components placed inside the housing (110). For example, the rear cover (116) may cover a circuit board (circuit board (140) of FIG. 3) and an ion battery (ion battery (150) of FIG. 3) placed inside the housing (110).

[0052] The electronic device (1) may include a camera (190). The camera (190) may be exposed to the outside of the housing (110). The camera (190) may be exposed to the outside of the rear cover (116).

[0053] Figure 3 is an exploded view of the electronic device (1).

[0054] The electronic device (1) may include a support member (111). The support member (111) may be placed inside a housing (housing (110) of FIG. 1). A display (120) may be seated on the support member (111). A rear cover (116) may cover the rear of the support member (111).

[0055] The electronic device (1) may include a window (130). The window (130) may be positioned in front of the display (120). The window (130) may cover the display (120). The window (130) may include a transparent material. The window (130) may be combined with a support member (111).

[0056] The electronic device (1) may include a circuit board (140). The circuit board (140) may be a printed circuit board (PCB). The circuit board (140) may be supported by a support member (111). The support member (111) may include a substrate receiving portion (1112). The substrate receiving portion (1112) may be formed by recessing a part of the support body (1111). The circuit board (140) may be placed inside the substrate receiving portion (1112).

[0057] The circuit board (140) may include a board body (141) and a processor (142). The board body (141) may be received inside the board receiving portion (1112). The processor (142) may be disposed on one side of the board body (141). The processor (142) may include electrical components. For example, the processor (142) may include a plurality of semiconductor components. The processor (142) may be an application processor (AP). The processor (142) may control the operation of various electronic components that operate the electronic device (1).

[0058] The electronic device (1) may include a substrate cover (143). The substrate cover (143) may be a shield can. The substrate cover (143) may surround a circuit board (140). The substrate cover (143) may be placed between the circuit board (140) and the rear cover (116). The substrate cover (143) may cover a processor (142) and may be placed between the processor (142) and the rear cover (116).

[0059] The electronic device (1) may include an ion battery (150). The ion battery (150) may be a lithium-ion battery. The ion battery (150) may be supported by a support member (111). The support member (111) may include an ion battery receiving portion (1113). The ion battery receiving portion (1113) may be formed by indenting a part of the support body (1111). The ion battery (150) may be placed inside the ion battery receiving portion (1113).

[0060] The substrate receiving portion (1112) and the ion battery receiving portion (1113) may be spaced apart from each other. The substrate receiving portion (1112) and the ion battery receiving portion (1113) may be spaced apart from each other in one direction (e.g., the +Y direction).

[0061] The electronic device (1) may include a heat dissipation member (160). The heat dissipation member (160) may be configured to dissipate heat generated from the circuit board (140). For example, the heat dissipation member (160) may dissipate heat generated from the processor (142) to the outside of the electronic device (1).

[0062] The heat dissipation member (160) may be a vapor chamber. A channel may be formed inside the heat dissipation member (160) through which a fluid (e.g., water or water vapor) can flow. The fluid flowing inside the heat dissipation member (160) may be vaporized by heat generated from the processor (142) as it passes through a region near the processor (142). The fluid flowing inside the heat dissipation member (160) may be vaporized through an endothermic reaction that absorbs heat generated from the processor (142). The fluid (water vapor) vaporized by heat generated from the processor (142) may flow away from the processor (142) (e.g., in the -Y direction) and be liquefied through heat exchange with the air outside the electronic device (1). The fluid flowing inside the heat dissipation member (160) may be liquefied through an exothermic reaction that releases heat to the outside of the electronic device (1). The liquefied fluid (water) can flow in a direction toward the processor (142) (e.g., +Y direction) and be re-vaporized in the area near the processor (142). The flow of fluid inside the heat dissipation member (160) can be achieved by capillary action.

[0063] The electronic device (1) may include a frame (170). The frame (170) may surround at least a portion of the heat dissipation member (160). The frame (170) may support the heat dissipation member (160). The frame (170) may be positioned between the support member (111) and the display (120). The heat dissipation member (160) may be fixed to the frame (170).

[0064] The electronic device (1) may include a radiation cell (180). The radiation cell (180) may be placed inside the support member (111). The radiation cell (180) may be placed in an opening (1114) formed in the support member (111). The opening (1114) may be formed by opening a part of the ion battery receiving part (1113). The radiation cell (180) may be placed inside the opening (1114) facing the ion battery (150). The radiation cell (180) may be placed inside the opening (1114) facing the heat dissipation member (160). The meaning of the statement that the radiation cell (180) is placed inside the opening (1114) may be that the radiation cell (180) is surrounded by a part of the support member (1111) that surrounds the opening (1114). The opening (1114) may be a space formed by opening in the support member (1111) and may be surrounded by a part of the support member (1111). The radiation cell (180) may be surrounded by a part of the support member (1111) forming the opening (1114).

[0065] FIG. 4 is a drawing showing the state in which the display (120) is separated from the electronic device (1) of FIG. 1. FIG. 5 is an exploded view of the support member (111), heat dissipation member (160), frame (170), and radiation cell (180).

[0066] The heat dissipation member (160) can be seated on the support member (111) while fixed to the frame (170). The heat dissipation member (160) can dissipate heat generated inside the housing (110) to the outside of the housing (110). For example, the heat dissipation member (160) can dissipate heat generated from the processor (142) to the outside of the housing (110). For example, the heat dissipation member (160) can dissipate heat generated from the ion battery (150) to the outside of the housing (110).

[0067] The heat dissipation member (160) may be extended along the first direction (+Y direction). The heat dissipation member (160) may absorb heat generated from the processor (142) and transfer heat to the second direction (-Y direction) opposite to the first direction (+Y direction). The heat dissipation member (160) may be a vapor chamber and may release heat to the outside of the housing (110) through the liquefaction of a fluid flowing along the second direction (-Y direction).

[0068] The heat dissipation member (160) may face the ion battery (150) through an opening (the opening (1114) in FIG. 3). The heat dissipation member (160) may absorb heat generated from the ion battery (150) through the opening (1114) and release it to the outside of the housing (110).

[0069] The radiation cell (180) may be placed inside the opening (1114). The radiation cell (180) may face the heat dissipation member (160). The heat dissipation member (160) may absorb heat generated from the radiation cell (180) and release it outside the housing (110).

[0070] The heat dissipation member (160) can be fixed to the support member (111) through the frame (170). The support member (111) may include a heat dissipation member receiving portion (1115). The heat dissipation member receiving portion (1115) may be formed by opening in the support member (111). The heat dissipation member (160) may exchange heat with the processor (142) inside the heat dissipation member receiving portion (1115). For example, a substrate cover (substrate cover (143) in FIG. 3) may be placed inside the heat dissipation member receiving portion (1115) and may come into contact with the heat dissipation member (160) inside the heat dissipation member receiving portion (1115). The heat dissipation member receiving portion (1115) may be spatially separated from the opening (1114).

[0071] The frame (170) may include a first frame portion (171) and a second frame portion (172). The second frame portion (172) may provide a space for accommodating a heat dissipation member (160). The second frame portion (172) may protrude in one direction (+Z) from the first frame portion (171). The heat dissipation member (160) may be accommodated inside the second frame portion (172).

[0072] The frame (170) can be joined to the support member (111) through a fastening member (173). The fastening member (173) may be a screw.

[0073] FIG. 6 is a cross-sectional view along the A-A' reference line shown in FIG. 4. FIG. 7 is a conceptual diagram explaining the operation of the radiation cell (180).

[0074] The radiation cell (180) may be placed inside the opening (1114). The radiation cell (180) may be surrounded by an ion battery housing (1113). The radiation cell (180) may be placed between the heat dissipation member (160) and the ion battery (150). The radiation cell (180) may be placed to exchange heat with the heat dissipation member (160). The radiation cell (180) may be electrically connected to the ion battery (150).

[0075] A heat dissipation member (160) may be placed on one side (e.g., +Z direction) of the ion battery receiving portion (1113), and an ion battery (150) may be placed on the other side (e.g., -Z direction) of the ion battery receiving portion (1113).

[0076] The heat dissipation member (160) may include a first wall (161) and a second wall (162). The first wall (161) and the second wall (162) may be spaced apart from each other. The first wall (161) and the second wall (162) may include a metal material with high thermal conductivity.

[0077] The heat dissipation member (160) may include a coupling portion (163). The coupling portion (163) may face the ion battery receiving portion (1113). A fastening member (fastening member (173) of FIG. 5) may penetrate the coupling portion (163) and be coupled to the ion battery receiving portion (1113).

[0078] The heat dissipation member (160) may include a channel (164). The channel (164) may be formed between the first wall (161) and the second wall (162). The channel (164) may provide a fluid flow passage inside the heat dissipation member (160).

[0079] The radiation cell (180) can be arranged to exchange heat with the heat dissipation member (160). The radiation cell (180) can be fixed to the heat dissipation member (160).

[0080] The electronic device (1) may include a first adhesive layer (181). The first adhesive layer (181) may be disposed between a heat dissipation member (160) and a radiation cell (180). The first adhesive layer (181) may attach the radiation cell (180) to the heat dissipation member (160).

[0081] The electronic device (1) may include a second adhesive layer (182). The second adhesive layer (182) may be placed between the radiation cell (180) and the ion battery (150). The second adhesive layer (182) may attach the radiation cell (180) to the ion battery (150).

[0082] The first thermal conductivity of the first adhesive layer (181) may be greater than the second thermal conductivity of the second adhesive layer (182). Heat generated in the radiation cell (180) may be transferred to the heat dissipation member (160) through the first adhesive layer (181). The second adhesive layer (182) may prevent heat generated in the radiation cell (180) from being transferred to the ion battery (150). The second adhesive layer (182) may include an insulating material.

[0083] The radiation cell (180) can be electrically connected to the ion battery (150). The radiation cell (180) and the ion battery (150) can be electrically connected inside the opening (1114).

[0084] The electronic device (1) may include an insulating layer (183). The insulating layer (183) may be disposed on one side of the radiation cell (180). The electronic device (1) may include wiring (184). The wiring (184) may be disposed inside the insulating layer (183). The wiring (184) may extend inside the insulating layer (183) to electrically connect the ion battery (150) and the radiation cell (180).

[0085] An electronic device (1) according to an embodiment of the present disclosure can dissipate heat generated from a radiation cell (180) through a heat dissipation member (160) by placing a radiation cell (180) between an ion battery (150) and a heat dissipation member (160). Additionally, by placing a radiation cell (180) between an ion battery (150) and a heat dissipation member (160), electrical connection between the ion battery (150) and the radiation cell (180) can be facilitated.

[0086] An electronic device (1) according to an embodiment of the present disclosure can shield electromagnetic waves generated from a radiation cell (180) from being transmitted to other electronic components of the electronic device (1) by placing a radiation cell (180) between an ion battery (150) and a heat dissipation member (160). That is, the electronic device (1) according to an embodiment of the present disclosure can improve EMI shielding performance by the radiation cell (180) by placing the radiation cell (180) between the ion battery (150) and the heat dissipation member (160).

[0087] Referring to FIG. 7, the radiation cell (180) can generate power through the movement of holes (P) and electrons (N) from the depletion region at the junction (1804) by beta rays generated from a radiation source (1801) penetrating into the P-type semiconductor (1802) and N-type semiconductor (1803). The radiation cell (180) can store power in a load (1808) by the current flowing within the wire (1807) through the P electrode (1805) and the N electrode (1806). In this process, a technique to prevent beta rays generated from the radiation source (1801) from spreading outside the radiation cell (180) is essential. Beta rays generated from the radiation source (1801) can be transmitted outside the radiation cell (180) and cause EMI problems in other electronic components of the electronic device (1). Accordingly, the electronic device (1) according to the embodiment of the present disclosure can block the propagation of electromagnetic waves generated from the radiation cell (180) by the fluid inside the heat dissipation member (160) and by the electrode plate inside the ion battery (150) by placing the radiation cell (180) between the heat dissipation member (160) and the ion battery (150).

[0088] The radiation source (1801) may include a radioactive isotope. The radioactive isotope is not particularly limited as long as it is a substance that decays and emits radiation. The radiation may be alpha rays, beta rays, or gamma rays. For example, the radioactive isotope is tritium ( 3 H, tritium), calcium-45( 45 Ca), nickel-63 63 Ni), copper-67 67 Cu), strontium-90 ( 90 Sr), promethium-147( 147 Pm), osmium-194( 194 Os), Thulium-171( 171Tm), tantalum-179( 179 Ta), cadmium-109( 109 Cd), germanium-68 68 Ge), cerium-159( 159 Ce) and tungsten-181( 181 It may include one or more selected from the group consisting of W).

[0089] The P-type semiconductor (1802) may include, for example, silicon or diamond doped with impurities such as boron (B), aluminum (Al), gallium (Ga), or indium (In), which are group 13 elements of the periodic table, or may include a compound semiconductor doped with boron (B), aluminum (Al), gallium (Ga), or indium (In), which are group 13 elements of the periodic table.

[0090] The N-type semiconductor (1803) may include, for example, silicon or diamond doped with impurities such as nitrogen (N), phosphorus (P), arsenic (As), or antimony (Sb), which are Group 15 elements of the periodic table, or may include a compound semiconductor doped with nitrogen (N), phosphorus (P), arsenic (As), or antimony (Sb), which are Group 15 elements of the periodic table. At least a portion of the N-type semiconductor (1803) may come into contact with the P-type semiconductor (1802) to form a junction surface. At this time, the junction surface may be a PN junction, and a depletion layer may be formed around the PN junction.

[0091] The electrodes (1805, 1806) may include a conductive material. In this specification, the conductive material has an electrical conductivity of 10 6It may be greater than S / m. For example, the conductive material may include at least one of a metal, a metal alloy, a conductive metal nitride, a metal silicide, a doped semiconductor material, a conductive metal oxide, and a conductive metal oxynitride. For example, conductive materials include titanium nitride (TiN), tantalum carbide (TaC), tantalum nitride (TaN), titanium silicon nitride (TiSiN), tantalum silicon nitride (TaSiN), tantalum titanium nitride (TaTiN), titanium aluminum nitride (TiAlN), tantalum aluminum nitride (TaAlN), tungsten nitride (WN), ruthenium (Ru), titanium aluminum (TiAl), titanium aluminum carbonitride (TiAlC-N), titanium aluminum carbide (TiAlC), titanium carbide (TiC), tantalum carbonitride (TaCN), tungsten (W), aluminum (Al), copper (Cu), cobalt (Co), titanium (Ti), tantalum (Ta), nickel (Ni), platinum (Pt), nickel platinum (Ni-Pt), niobium (Nb), niobium nitride (NbN), niobium carbide (NbC), molybdenum (Mo), molybdenum nitride (MoN), It may include one or more selected from the group consisting of molybdenum carbide (MoC), tungsten carbide (WC), rhodium (Rh), palladium (Pd), iridium (Ir), osmium (Os), silver (Ag), gold (Au), zinc (Zn), and vanadium (V), but is not limited thereto. Conductive metal oxides and conductive metal oxynitrides may include oxidized forms of the materials described above, but are not limited thereto.

[0092] FIG. 8 is an enlarged view of the area near the circuit board (240) and the ion battery (250) of an electronic device (1) according to another embodiment of the present disclosure. FIG. 9 is a cross-sectional view along the B-B' reference line shown in FIG. 8.

[0093] The description of the circuit board (240), ion battery (250), heat dissipation member (260), and radiation cell (180) may have the same features as the description of the circuit board (140), ion battery (150), heat dissipation member (160), and radiation cell (180) described with reference to FIGS. 1 to 7, to the extent that it does not contradict the description.

[0094] The circuit board (240) may have a curved shape different from the circuit board (140) described with reference to FIGS. 1 to 7. For example, the circuit board (240) may include a first substrate portion (2401) and a second substrate portion (2402) extending in a direction intersecting the first substrate portion (2401). A processor (242) may be placed on the first substrate portion (2401).

[0095] The circuit board (240) may include a substrate opening (2403). The substrate opening (2403) may be formed in an area where the first substrate portion (2401) and the second substrate portion (2402) intersect.

[0096] The heat dissipation member (260) may extend along the first substrate portion (2401). The heat dissipation member (260) may be positioned to exchange heat with the processor (242). At least a portion of the heat dissipation member (260) may be positioned inside the substrate opening (2403). The heat dissipation member (260) may extend along the first substrate portion (2401) toward the substrate opening (2403). The heat dissipation member (260) may have a stepped shape. The heat dissipation member (260) may have a shape in which a portion is inserted from the substrate opening (2403) into the inside of the substrate opening (2403).

[0097] The radiation cell (180) may be placed on the second substrate portion (2402). The radiation cell (180) may be placed on one side (+X direction) of the ion battery (250). The ion battery (250) and the radiation cell (180) may be electrically connected through wiring (251).

[0098] The electronic device (1) may include a case (280). The case (280) may surround the radiation cell (180). The case (280) may be placed on a second substrate portion (2402). The case (280) may extend along the second substrate portion (2402). At least a portion of the case (280) may face the substrate opening (2403). At least a portion of the case (280) may be in contact with a heat dissipation member (260). The case (280) may be in contact with the heat dissipation member (260) at the substrate opening (2403). For example, the case (280) may be in contact with a portion of the heat dissipation member (260) located inside the substrate opening (2403).

[0099] The case (280) may include a first case portion (281), a second case portion (282), and a third case portion (283). The first case portion (281) may cover the radiation cell (180). The second case portion (282) may extend in one direction (+Y) from the first case portion (281). The third case portion (283) may extend in one direction (+Y) from the second case portion (282). The third case portion (283) may be in contact with a heat dissipation member (260). Heat generated from the radiation cell (180) may be transferred along the first case portion (281), the second case portion (282), and the third case portion (283) to exchange heat with the heat dissipation member (260).

[0100] The case (280) may include a receiving space (284). The receiving space (284) may be formed between the first case part (281) and the circuit board (240). A radiation cell (180) may be placed inside the receiving space (284).

[0101] The case (280) may include a heat dissipation layer (285). The heat dissipation layer (285) may be in contact with the receiving space (284). The heat dissipation layer (285) may include a metallic material. The heat dissipation layer (285) may include a material with high thermal conductivity. The heat dissipation layer (285) may be in contact with a ground (243) formed on the circuit board (240).

[0102] The case (280) may include a shielding layer (286). The shielding layer (286) may be laminated with a heat dissipation layer (285). The shielding layer (286) may include a material that prevents beta rays from penetrating. For example, the shielding layer (286) may include a metallic material. For example, the shielding layer (286) may include a magnetic material.

[0103] Meanwhile, although terms indicating direction such as up and down have been used in this specification, these terms are used merely for convenience of explanation, and it is obvious to a person skilled in the art that they may vary depending on the location of the object or the position of the observer.

[0104] Although various embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and it will be obvious to those with average knowledge in the art that various modifications and variations are possible within the scope of the technical concept of the present invention as described in the claims. Furthermore, the above-described embodiments may be implemented by deleting some components, and each embodiment may be implemented in combination with one another.

Claims

1. Housing; A circuit board disposed inside the above housing, with a processor disposed on top; An ion battery configured to supply power to the above circuit board; A heat dissipation member configured to dissipate heat generated in the above processor; and An electronic device comprising a radiation cell disposed between the ion battery and the heat dissipation member so as to be heat-exchangeable with the heat dissipation member.

2. In Paragraph 1, The support member further includes an ion battery receiving portion in which the ion battery is disposed and an opening formed in the ion battery receiving portion facing the heat dissipation member. The above radiation cell is, An electronic device positioned to exchange heat with the heat dissipation member inside the above opening.

3. In Paragraph 2, The above-mentioned ion battery and the above-mentioned heat dissipation member are located in opposite directions relative to the opening of the above-mentioned support member, and The above radiation cell is an electronic device disposed inside the opening formed between the ion battery and the heat dissipation member.

4. In Paragraph 1, A first adhesive layer disposed between the heat dissipation member and the radiation cell; and An electronic device further comprising a second adhesive layer disposed between the ion battery and the radiation cell.

5. In Paragraph 4, An electronic device in which the first thermal conductivity of the first adhesive layer is greater than the second thermal conductivity of the second adhesive layer.

6. In Paragraph 1, An insulating layer disposed between the heat dissipation member and the ion battery; and An electronic device further comprising wiring that passes through the interior of the insulating layer and connects the radiation cell and the ion battery.

7. In Paragraph 1, The above radiation cell is, An electronic device spaced apart from the processor in the direction in which the heat dissipation member extends.

8. In Paragraph 1, An electronic device further comprising a case surrounding the radiation cell and in contact with the heat dissipation member to exchange heat.

9. In Paragraph 8, The above circuit board is, A first substrate portion on which the above processor is placed; A second substrate portion extending in a direction intersecting the first substrate portion; and It includes a substrate opening formed in an area where the first substrate portion and the second substrate portion intersect, The above heat dissipation member and the above case are, An electronic device in contact at the area where the first substrate portion and the second substrate portion intersect.

10. In Paragraph 8, The above case is, A heat dissipation layer comprising a metallic material and surrounding the radiation cell; and An electronic device comprising a shielding layer that is laminated with the above-mentioned heat dissipation layer and surrounds the above-mentioned radiation cell.

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