Device support, light-emitting device, and light-emitting apparatus

By designing stepped surfaces and slot structures on the device support, the problem of poor bonding stability of the potting compound was solved, achieving stable climbing control and encapsulation protection of the potting compound, and improving the structural stability of the light-emitting device.

WO2026129079A1PCT designated stage Publication Date: 2026-06-25FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
Filing Date
2024-12-16
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

In the prior art, the smooth surface of the device substrate leads to poor bonding stability between the potting compound and the device substrate surface, making it difficult to control the climbing height of the potting compound on the side of the device substrate, thus affecting the encapsulation and protection effect.

Method used

A device support is designed, including a housing and a lead frame. The housing has a stepped surface and a slot structure to control the rise height of the potting compound, and the bonding stability is improved by setting a rough bottom surface of the potting groove in the base portion.

Benefits of technology

It improves the bonding stability between the potting compound and the device substrate, makes it easier to control the rise height of the potting compound, enhances the encapsulation and protection effect, and improves the structural stability of the light-emitting device.

✦ Generated by Eureka AI based on patent content.

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    Figure CN2024139563_25062026_PF_FP_ABST
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Abstract

A device support, a light-emitting device, and a light-emitting apparatus. The device support (10) comprises a housing (1) and a lead frame (2); side surfaces of the housing (1) in a first direction (S1) include a first side surface (141), a second side surface (142), and a third side surface (143); a first stepped surface (144) is formed between the second side surface (142) and the first side surface (141); a second stepped surface (145) is formed between the second side surface (142) and the third side surface (143); side surfaces of the housing (1) in a second direction (S2) include a fourth side surface (151) and a fifth side surface (152); a third stepped surface (153) is formed between the fifth side surface (152) and the fourth side surface (151); the width d3 of the second stepped surface (145) is less than the width d4 of the third stepped surface (153); an encapsulant injection recess (121) is formed in a base portion (12); the roughness of a middle sub-surface (1210) of the encapsulant injection recess (121) is greater than the roughness of an annular sub-surface (1211); and the lead frame (2) comprises a plurality of pins (21).
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