Laser cutting and oxidation prevention processing method for inner-layer resistor to improve resistance precision

Abstract

Disclosed in the present invention are a laser cutting and oxidation prevention processing method for an inner-layer resistor to improve resistance precision. The method comprises: determining parameters of laser cutting on the basis of the material, dimensions and required resistance change of a resistor, and making preparations before laser cutting of the resistor; accurately positioning the prepared resistor on a laser cutting workstation, and selecting a suitable cutting method to cut the resistor on the laser cutting workstation; and a laser cutting machine cutting the resistor on the basis of the preset parameters, and testing the surface of the cut resistor. By trimming the edges of the resistor that has been etched twice, the width direction precision of the resistor can reach + / -5 μm, thereby improving the resistance tolerance from + / -10 % to + / -2 %. Resistor laser cutting is used to dimensionally trim a completed resistor, and the resistor with uneven edges is trimmed by a CO2 laser optical path, such that the resistor dimensions become uniform and the dimensions are closer to the theoretical width. After etching and laser trimming of the resistor are completed, resin is coated on the resistor to achieve protection of a resistor layer.

Description

Inner layer resistor laser cutting and anti-oxidation method to improve resistor precision machining Technical Field

[0001] This invention belongs to the field of laser trimming technology, specifically relating to a method for laser cutting of inner layer resistors and anti-oxidation to improve resistor precision processing. Background Technology

[0002] Laser cutting to correct resistor dimensions is a widely used process in the microelectronics industry. Laser trimming technology uses an extremely fine laser beam to vaporize and evaporate the resistive element, thus cutting the resistor. By changing the resistor's geometry, such as its cross-sectional area and conductive length, the resistance value can be altered. This technology offers advantages such as high adjustment precision, good repeatability, high speed, and low cost, and is therefore widely used in the production of chip resistors and thick / thin film circuits.

[0003] Conventional resistor manufacturing requires acid etching to determine the resistor width, followed by alkaline etching to determine the resistor length, thus forming a resistor with both length and width dimensions. The resistance value is directly proportional to the length and inversely proportional to the width, therefore the size of the resistor and its resistance value are linearly related. The length and width of the resistor directly affect the resistance value. In traditional processes, the resistance value is entirely determined by the accuracy of the etching. The etching accuracy tolerance is + / -10%, and the superposition accuracy of two etching processes is + / -20%. In addition, the material itself has a tolerance greater than 5%, and the influence of subsequent processes can easily lead to the finished product resistance value exceeding the customer's required tolerance of + / -20%. Furthermore, there is a lack of protection for the resistive layer. The roughening process affects the resistance value, and the subsequent acid and micro-etching solutions attack the resistive layer, causing resistance dispersion and making it impossible to guarantee resistance stability. Therefore, we need to provide a method for laser cutting of the inner layer resistor and anti-oxidation processing to improve resistor accuracy. Summary of the Invention

[0004] The purpose of this invention is to provide a method for laser cutting and anti-oxidation of inner layer resistors to improve resistor precision. By trimming the resistor edges after two etching processes, a width accuracy of + / -5μm can be achieved, reducing the resistance tolerance from + / -10% to + / -2%. Laser cutting trims the dimensions of the completed resistor, making the resistor dimensions more uniform and closer to the theoretical width after CO2 laser optical path trimming of irregular edges. After etching and laser trimming, the resistor layer is protected by covering it with resin. This addresses the problem mentioned in the background art that conventional resistor manufacturing requires acid etching to determine the resistor width, followed by alkaline etching... Etching determines the length of the resistor, thus forming its shape in both length and width. The resistance value is directly proportional to the length of the resistor and inversely proportional to its width. Therefore, the size of the resistor and its resistance value are linearly related. The length and width of the resistor directly affect the resistance value. In traditional processes, the resistance value is entirely determined by the accuracy of etching. The tolerance for etching accuracy is + / -10%, and the superposition accuracy of two etching operations is + / -20%. In addition, the material itself has a tolerance greater than 5%, and the influence of subsequent processes can easily lead to the finished product's resistance value exceeding the customer's required tolerance of + / -20%. Furthermore, there is a lack of protection for the resistive layer. The roughening process affects the resistance value, and subsequent processes using acidic and micro-etching solutions attack the resistive layer, causing resistance dispersion.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a method for laser cutting and anti-oxidation to improve the precision of inner layer resistance processing, comprising the following steps:

[0006] Based on the material, size, and required resistance value of the resistor, determine the parameters for laser cutting and prepare for the laser cutting of the resistor.

[0007] The prepared resistor is precisely positioned on the laser cutting station, and a suitable cutting method is used to cut the resistor on the laser cutting station.

[0008] The laser cutting machine is installed with preset parameters to perform resistance cutting, and the surface of the cut resistor is inspected. Resistors that meet the standards after cutting are protected.

[0009] Prepare a resin solution to protect the resistor that meets the standard, coat the prepared resin solution onto the resistor, and then cure the resin coating.

[0010] Preferably, the step of determining the laser cutting parameters based on the resistor's material, size, and required resistance value, and preparing for resistor laser cutting, includes:

[0011] Laser cutting parameters include: laser power, cutting speed, and number of cuts.

[0012] Preferably, the preparation for resistive laser cutting includes determining the cutting area.

[0013] Preferably, the step of precisely positioning the prepared resistor on the laser cutting station and cutting the resistor on the laser cutting station using a suitable cutting method includes:

[0014] Use appropriate clamps or adhesives to fix the resistor.

[0015] Preferably, the cutting operation is as follows: the cutting width is less than half of the total width of the resistor, and a rounded "L" shaped cut is preferred.

[0016] Preferably, the laser cutting machine is installed with preset parameters to perform resistance cutting, and the surface of the cut resistor is inspected. Resistors that meet the standards after cutting are protected, including:

[0017] The laser cutting machine is started according to the preset parameters to perform the cutting process, and the resistance value is monitored in real time.

[0018] Preferably, the required resistance value is achieved through multiple cuts, and the subsequent cutting parameters are adjusted based on the measurement results.

[0019] Preferably, after cutting, a high-precision resistance measuring instrument is used to test the resistance value of the cut material to determine whether it meets the standard.

[0020] Preferably, the protective treatment of the standard-compliant resistor by preparing the resin solution involves coating the resistor with the prepared resin solution and then curing the resin coating layer, including:

[0021] Select a suitable resin material based on the resistor's material, operating environment, and performance requirements;

[0022] Mix the resin, curing agent, and other additives evenly according to the ratio provided by the resin supplier to form a resin solution.

[0023] Preferably, when applying the resin solution, a suitable coating tool is used to uniformly coat the resin solution onto the surface of the resistor;

[0024] Controlling curing conditions: Based on the resin's curing temperature and curing time.

[0025] Technical effects and advantages of the present invention: The laser cutting and anti-oxidation method for improving the precision of inner layer resistance proposed in this invention has the following advantages compared with the prior art:

[0026] This invention achieves a resistor width accuracy of + / -5μm by trimming the resistor edges after two etching processes, reducing the resistance tolerance from + / -10% to + / -2%. Laser cutting trims the dimensions of the completed resistor, making the resistor dimensions more uniform and closer to the theoretical width after the CO2 laser optical path trims the edges of the resistor. After etching and laser trimming, the resistor is protected by covering it with resin.

[0027] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description

[0028] Figure 1 is a flowchart of the structural steps of the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] This invention provides a method for laser cutting and anti-oxidation processing to improve the precision of inner layer resistors, as shown in Figure 1, comprising the following steps:

[0031] Based on the material, size, and required resistance value of the resistor, determine the parameters for laser cutting and prepare for the laser cutting of the resistor.

[0032] The prepared resistor is precisely positioned on the laser cutting station, and a suitable cutting method is used to cut the resistor on the laser cutting station.

[0033] The laser cutting machine is installed with preset parameters to perform resistance cutting, and the surface of the cut resistor is inspected. Resistors that meet the standards after cutting are protected.

[0034] Prepare a resin solution to protect the resistor that meets the standard, coat the prepared resin solution onto the resistor, and then cure the resin coating.

[0035] The process involves determining the laser cutting parameters based on the resistor's material, size, and required resistance value, and preparing for the resistor laser cutting process, including:

[0036] Laser cutting parameters include: laser power, cutting speed, and number of cuts;

[0037] Specifically, selecting a resistor material with good thermal stability can reduce the thermal expansion effect during laser cutting, thereby maintaining the stability of the resistance value.

[0038] The cutting speed should be matched with the laser power to ensure stable cutting quality and resistance change. Too fast a cutting speed may result in the laser beam's energy not being enough to completely melt the material, leading to incomplete cutting. Too slow a cutting speed may result in the laser beam leaving too much energy on the material surface, causing overburning. The number of cuts depends on the required resistance change range and the precision of laser cutting. Multiple cuts can gradually approach the required resistance change, but each cut will increase the heat-affected zone and resistance instability. Therefore, it is necessary to minimize the number of cuts while ensuring resistance precision.

[0039] The preparations for resistive laser cutting include determining the cutting area;

[0040] Specifically, the cutting area should be much smaller than the surface of the resistor sheet to avoid excessive impact on the overall resistance value. The dimensions of the cutable area can usually be found in the supplier's database. Ensure that the cutting position is within the effective range. To obtain a stable resistance value, the resistance after cutting should generally be about 1.5 times the original resistance value. The cutting width should be less than half of the total width to ensure the stability of the resistance change. Adjust the laser power according to the thermal stability of the resistor material and the required resistance change range. Lower laser power can reduce the heat-affected zone, but may require multiple cuts to achieve the desired resistance change. Higher laser power can speed up the cutting process, but may increase the risk of thermal damage.

[0041] The process of precisely positioning the prepared resistor on the laser cutting stage and then cutting the resistor on the laser cutting stage using a suitable cutting method includes:

[0042] Use appropriate clamps or adhesives to secure the resistor;

[0043] Specifically, use precision measuring tools (such as vernier calipers, micrometers, etc.) to measure the dimensions of the resistor, including its length, width, and thickness. Based on the measurement results, mark the exact position of the resistor on the laser cutting station. Use calibration tools to calibrate the cutting head of the laser cutting machine to ensure that it can accurately align with the marked position. Adjust the cutting parameters of the laser cutting machine (such as laser power, cutting speed, etc.) according to the size and shape of the resistor to ensure cutting accuracy. Select the appropriate type of fixture according to the size, shape, and material of the resistor. Common types of clamps include pneumatic clamps, manual clamps, and automatic clamps. Ensure the clamping force is appropriate—enough to securely hold the resistor without damaging it. Install the clamp on the laser cutting station and adjust its position to accurately hold the resistor. For pneumatic clamps, ensure a stable air supply and adjust the clamping force. For manual clamps, manually adjust the screw to tighten the resistor, carefully controlling the force. For automatic clamps, set appropriate clamping programs and parameters, and check for proper operation. Use the clamp to fix the resistor on the laser cutting station, ensuring its position is accurate and stable. Before cutting, double-check the resistor's fixation to ensure it is not loose or misaligned.

[0044] Cutting operation: The cutting width should be less than half of the total width of the resistor, and "L" shaped cuts with rounded corners should be preferred;

[0045] Specifically, the rounded "L"-shaped cut ensures that the resistance changes uniformly throughout the cutting process. Because the cutting shape is a continuous rounded "L" shape, the resistance value increases gradually and steadily as the cutting length increases, avoiding sudden changes in resistance caused by abrupt changes in the cutting shape.

[0046] Reduced thermal impact: Compared to other cutting shapes, the rounded "L" shape reduces the heat-affected zone, thereby reducing resistance fluctuations caused by thermal effects. The rounded corner design helps disperse laser beam energy, reducing heat concentration in the resistive material and thus maintaining resistance stability.

[0047] The rounded "L" shaped cut is relatively simple and continuous, making it easy for laser cutting machines to control precisely. The laser beam can move stably along a preset path, ensuring the accuracy of the cutting width and depth.

[0048] Reduced Errors: Due to the rounded corner design, the errors generated during the cutting process are relatively small. Even if there are minor cutting deviations, the impact on the overall resistance value will be controlled within a small range, thereby improving cutting accuracy. The rounded "L"-shaped cut can significantly reduce stress concentration. At right angles or sharp corners, stress is often higher, which can easily lead to damage or deformation of the resistor material. The rounded corner design can disperse stress, making its distribution more uniform, thereby extending the life of the resistor.

[0049] The laser cutting machine is installed with preset parameters to cut resistors, and the surface of the cut resistors is inspected. Resistors that meet the standards after cutting are protected, including:

[0050] The laser cutting machine is started according to the preset parameters to perform the cutting process, and the resistance value is monitored in real time.

[0051] Specifically, select a resistance measuring instrument with high precision and high resolution, such as a digital multimeter or a high-precision resistance meter, to ensure that the measuring instrument can accurately measure the resistance value and has a real-time monitoring function. Set the monitoring parameters on the measuring instrument, including the monitoring frequency and monitoring range, to ensure that the monitoring parameters can accurately reflect the changes in the resistance value before laser cutting.

[0052] The required resistance value is achieved through multiple cuts, and subsequent cutting parameters are adjusted based on the measurement results.

[0053] After cutting, a high-precision resistance measuring instrument is used to test the resistance value of the cut resistor to determine whether it meets the standard.

[0054] Specifically, activate the real-time monitoring function of the measuring instrument to monitor the resistance value change in real time, record the data, and determine whether it meets the standard. If an abnormal resistance value change is found (such as a sudden increase or decrease), cutting should be stopped immediately and the cause should be checked.

[0055] The protective treatment of the standard-compliant resistor by the prepared resin solution involves coating the resistor with the prepared resin solution and then curing the resin coating layer, including:

[0056] Select a suitable resin material based on the resistor's material, operating environment, and performance requirements;

[0057] According to the ratio provided by the resin supplier, the resin, curing agent and other additives are mixed evenly to form a resin solution;

[0058] Specifically, commonly used resin materials include epoxy resin and acrylic resin. These resins have good adhesion, insulation and moisture resistance. According to the ratio provided by the resin supplier, the resin, curing agent and other additives are mixed evenly to form a resin solution. Attention should be paid to controlling parameters such as the viscosity of the resin solution, curing time and curing temperature to ensure the quality and performance of the coating.

[0059] When applying the resin solution, use an appropriate coating tool to evenly coat the resin solution onto the surface of the resistor;

[0060] Controlling curing conditions: based on the resin's curing temperature and curing time;

[0061] Specifically, using appropriate coating tools, the resin solution is evenly coated onto the surface of the resistor. During coating, air bubbles and missed areas should be avoided to ensure that the resin solution completely covers the surface of the resistor. Appropriate curing conditions are set according to the required curing temperature and time of the resin. During the curing process, the curing temperature should be kept constant and uniform to avoid the impact of temperature fluctuations on the curing effect. After curing, the quality and performance of the resin coating are checked to ensure that there are no defects such as air bubbles and cracks. If necessary, the resin coating can be sanded or polished to improve its surface smoothness and aesthetics.

[0062] Resin materials should be stored in a dry, cool, and well-ventilated place, avoiding direct sunlight and high temperatures. Resin materials have a limited shelf life and should be used within their expiration date to avoid performance degradation. Environmental control is crucial: when applying the resin solution, the operating environment should be kept clean and dry to prevent dust, moisture, and other contaminants from affecting the resin coating. Operators should wear appropriate protective equipment, such as gloves and masks, to prevent skin irritation and damage from the resin solution.

[0063] After the resin coating has cured, the resistance should be inspected to ensure that the quality of the resin coating meets the design requirements. If any defects or problems are found in the resin coating, it should be repaired or replaced in a timely manner.

[0064] Working principle: Based on the material, size, and required resistance value of the resistor, determine the laser cutting parameters and prepare for laser cutting. Precisely position the prepared resistor on the laser cutting platform and select a suitable cutting method to cut it. The laser cutting machine is installed with preset parameters to cut the resistor, and the surface of the cut resistor is inspected. Resistors that meet the standards after cutting are protected. A resin solution is prepared to protect the standard-compliant resistors; the prepared resin solution is coated onto the resistor, and the resin coating is cured.

[0065] In addition, the aforementioned text creation unit, image generation unit, high-quality image training unit, and model optimization processing unit are also used to implement other functions of the aforementioned inner layer resistor laser cutting and anti-oxidation improved resistor precision processing method, which will not be elaborated here.

[0066] In addition, the present invention also provides a terminal device. The inner layer resistor laser cutting and anti-oxidation improvement resistor precision processing method involved in this embodiment is mainly applied to the terminal device, which can be a PC, portable computer, mobile terminal or other device with display and processing functions.

[0067] Specifically, the terminal device may include a processor (e.g., CPU), a communication bus, a user interface, a network interface, and memory. The communication bus is used to enable communication between these components; the user interface may include a display screen or an input unit such as a keyboard; the network interface may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface); the memory may be high-speed RAM or stable non-volatile memory, such as disk storage, and may also optionally be a storage device independent of the aforementioned processor.

[0068] The memory stores a readable storage medium, which stores a program for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy. The processor can call the program for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy stored in the memory and execute the processing method for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy provided in this embodiment of the invention.

[0069] Understandably, a readable storage medium can be a tangible device capable of holding and storing instructions for use by an instruction execution device. A computer-readable storage medium can be, for example—but not limited to—an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. The computer-readable storage medium as used herein is not to be construed as a transient signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.

[0070] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0071] Computer program instructions used to perform operations of this disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing the status information of the computer-readable program instructions to implement various aspects of this disclosure.

[0072] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for processing the inner layer resistance laser cutting and preventing oxidation to improve resistance precision, characterized in that, Includes the following steps: Based on the material, size, and required resistance value of the resistor, determine the parameters for laser cutting and prepare for the laser cutting of the resistor. The prepared resistor is precisely positioned on the laser cutting station, and a suitable cutting method is used to cut the resistor on the laser cutting station. The laser cutting machine is installed with preset parameters to perform resistance cutting, and the surface of the cut resistor is inspected. Resistors that meet the standards after cutting are protected. Prepare a resin solution to protect the resistor that meets the standard, coat the prepared resin solution onto the resistor, and then cure the resin coating.

2. The method of claim 1, wherein the method further comprises: The process involves determining the laser cutting parameters based on the resistor's material, size, and required resistance value, and preparing for the resistor laser cutting process, including: Laser cutting parameters include: laser power, cutting speed, and number of cuts.

3. The method of claim 2, wherein the method further comprises: The preparations for resistance laser cutting include determining the cutting area.

4. The method of claim 1, wherein the method further comprises: The process of precisely positioning the prepared resistor on the laser cutting stage and then cutting the resistor on the laser cutting stage using a suitable cutting method includes: Use appropriate clamps or adhesives to fix the resistor.

5. The method of claim 4, wherein the method further comprises: Cutting operation: The cutting width should be less than half of the total width of the resistor, and "L" shaped cuts with rounded corners should be preferred.

6. The method of claim 1, wherein the method further comprises: The laser cutting machine is installed with preset parameters to cut resistors, and the surface of the cut resistors is inspected. Resistors that meet the standards after cutting are protected, including: The laser cutting machine is started according to the preset parameters to perform the cutting process, and the resistance value is monitored in real time.

7. The method of claim 6, wherein the method further comprises: The required resistance value is achieved through multiple cuts, and subsequent cutting parameters are adjusted based on the measurement results.

8. The method of claim 7, wherein the method further comprises: After cutting, a high-precision resistance measuring instrument is used to test the resistance value of the cut material to determine whether it meets the standard.

9. The method of claim 1, wherein the method further comprises: applying a laser to the inner layer of the printed circuit board to cut the inner layer of the printed circuit board and to prevent oxidation of the inner layer of the printed circuit board. The protective treatment of the standard-compliant resistor by the prepared resin solution involves coating the resistor with the prepared resin solution and then curing the resin coating layer, including: Select a suitable resin material based on the resistor's material, operating environment, and performance requirements; Mix the resin, curing agent, and other additives evenly according to the ratio provided by the resin supplier to form a resin solution.

10. The method of claim 9, wherein the method further comprises: When applying the resin solution, use an appropriate coating tool to evenly coat the resin solution onto the surface of the resistor; Controlling curing conditions: Based on the resin's curing temperature and curing time.

Images