Adhesion determination device and adhesion determination method

Abstract

This adhesion determination device is provided with a lifting / lowering unit, an imaging unit, and a determination unit. In a printing machine that prints solder on a substrate via an opening of a mask by sliding a squeegee on the mask, the lifting / lowering unit lifts and lowers a pressing member capable of pressing a predetermined portion of the mask from above in a vertical direction to press the mask in a state where the mask and the substrate are disposed at a height position that allows for printing. Before and after the mask is pressed by the pressing member, the imaging unit causes an imaging device to image an imaging target, which is a pattern projected onto the mask or a pattern formed on the mask, in the vicinity of a predetermined portion of the mask. The determination unit determines that the mask and the substrate are adhered to each other when the amount of change in the imaging target before and after the mask is pressed is within an allowable range, and determines that the mask and the substrate are not adhered to each other when the amount of change in the imaging target before and after the mask is pressed exceeds the allowable range.

Description

Adhesion determination device and adhesion determination method

[0001] This specification discloses a technique related to an adhesion determination device and an adhesion determination method.

[0002] The screen printer described in Patent Document 1 includes a mask measuring device that measures the height of a mask. Specifically, an air cylinder disposed at a measurement position has a piston rod that extends to push down a measurement portion of the mask by a pressing member at the tip. Also, the measurement of the lower surface height of the mask by a laser displacement meter is performed before and after being pressed by the air cylinder and being bent. Furthermore, the mask measuring device can also obtain the height of the mask by image analysis of imaging data using a camera instead of a laser displacement meter.

[0003] International Publication No. 2019 / 116545

[0004] As an element for keeping the printing quality of solder constant, the adhesion between the mask and the substrate is mentioned. Specifically, it is important that the mask and the substrate are in contact with each other in a state where the mask and the substrate are disposed at printable height positions in a printing machine, but it is unclear whether the mask and the substrate are actually in contact with each other in this state.

[0005] In view of such circumstances, this specification discloses an adhesion determination device and an adhesion determination method capable of determining whether a mask and a substrate are in contact with each other in a state where the mask and the substrate are disposed at printable height positions in a printing machine.

[0006] This specification discloses an adhesion determination device comprising a lifting unit, an imaging unit, and a determination unit. The lifting unit presses the mask by raising and lowering a pressing member capable of pressing a predetermined portion of the mask from vertically above, when the mask and the substrate are positioned at a height where printing is possible in a printing machine that slides a squeegee over the mask to print solder onto a substrate through an opening in the mask. The imaging unit causes an imaging device to image an object that is near the predetermined portion of the mask and is irradiated onto the mask or formed on the mask, before and after the mask is pressed by the pressing member. The determination unit determines that the mask and the substrate are in close contact if the amount of change of the object being imaged before and after the mask is pressed falls within an acceptable range, and determines that the mask and the substrate are not in close contact if the amount of change of the object being imaged before and after the mask is pressed exceeds the acceptable range.

[0007] This specification also discloses a method for determining adhesion, comprising a lifting step, an imaging step, and a determination step. The lifting step involves, in a printing machine that prints solder onto a substrate through an opening in a mask by sliding a squeegee over the mask, the mask and the substrate are positioned at a height where printing is possible, and a pressing member capable of pressing a predetermined portion of the mask from above in a vertical direction is raised and lowered to press the mask. The imaging step involves causing an imaging device to image an object, which is a pattern irradiated onto the mask or a pattern formed on the mask, in the vicinity of the predetermined portion of the mask before and after the mask is pressed by the pressing member. The determination step determines that the mask and the substrate are in close contact if the amount of change of the object being imaged before and after the mask is pressed falls within an acceptable range, and determines that the mask and the substrate are not in close contact if the amount of change of the object being imaged before and after the mask is pressed exceeds the acceptable range.

[0008] Furthermore, this specification discloses a technical concept in which, in claim 4 of the claims initially attached to the application (hereinafter referred to as the "original claims"), "the adhesion determination device described in claim 1" is changed to "the adhesion determination device described in any one of claims 1 to 3". Also, this specification discloses a technical concept in which, in claim 6 of the original claims, "the adhesion determination device described in claim 1" is changed to "the adhesion determination device described in any one of claims 1 to 5".

[0009] Furthermore, this specification discloses a technical concept in which, in claim 7 of the original claims, "the adhesion determination device described in claim 1" is changed to "the adhesion determination device described in any one of claims 1 to 5". Also, this specification discloses a technical concept in which, in claim 8 of the original claims, "the adhesion determination device described in claim 1" is changed to "the adhesion determination device described in any one of claims 1 to 7". Furthermore, this specification discloses a technical concept in which, in claim 11 of the original claims, "the adhesion determination device described in claim 1" is changed to "the adhesion determination device described in any one of claims 1 to 10".

[0010] According to the above-described adhesion determination device, when the mask and substrate are positioned at a printable height in the printing press, it is possible to determine whether or not the mask and substrate are in close contact based on the amount of change in the image target before and after the mask is pressed by the pressing member. The same applies to the adhesion determination method as described above regarding the adhesion determination device.

[0011] This is a configuration diagram showing an example of the configuration of a substrate work line. This is a partial cross-sectional view showing an example of the configuration of a printing press. This is a block diagram showing an example of a control block for a contact determination device. This is a flowchart showing an example of a control procedure by a contact determination device. This is a perspective view showing an example of a lifting device, an imaging device, and an irradiator. This is a perspective view showing an example of a state in which the pressing member is lowered by the lifting device of Figure 5 and the mask is pressed by the pressing member. This is a plan view showing an example of a mask. This is a schematic diagram showing another example of an object to be imaged. This is a schematic diagram showing another example of an object to be imaged. This is a schematic diagram showing another example of an object to be imaged. This is a schematic diagram showing an example of the amount of change of the object to be imaged. This is a schematic diagram showing an example of the relationship between the separation distance between the mask and the substrate and the amount of change of the object to be imaged.

[0012] 1. Embodiment 1-1. Example of the configuration of the substrate processing line WML In the substrate processing line WML, the substrate processing machine WM0 performs predetermined substrate processing on the substrate 90 to produce the product substrate 900. The substrate processing line WML of this embodiment only needs to be equipped with a printing machine WM1, and the type and number of substrate processing machines WM0 that constitute the substrate processing line WML are not limited. As shown in Figure 1, the substrate processing line WML of this embodiment is equipped with a plurality (five) of substrate processing machines WM0, which include a printing machine WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and an appearance inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0013] The printing press WM1 prints solder 80 onto the mounting positions of multiple components on the circuit board 90. The printing inspection machine WM2 inspects the printing condition of the solder 80 printed by the printing press WM1. The component mounting machine WM3 mounts multiple components onto the circuit board 90 on which the solder 80 has been printed by the printing press WM1. There may be one component mounting machine WM3 or multiple component mounting machines. If multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting multiple components.

[0014] The reflow oven WM4 heats the substrate 90 on which multiple components have been mounted by the component mounting machine WM3, melts the solder 80, and performs soldering. The visual inspection machine WM5 inspects the mounting condition of the multiple components mounted by the component mounting machine WM3. In this way, the substrate processing line WML can produce product substrates 90 by sequentially transporting the substrate 90 using multiple (five) substrate processing machines WM0 and performing production processes including inspection. The substrate processing line WML can also be equipped with substrate processing machines WM0 as needed, such as a functional inspection machine, buffer device, substrate supply device, substrate inversion device, shield mounting device, adhesive coating device, and ultraviolet irradiation device.

[0015] Multiple (five) board-to-board work machines WM0 and management device WMC, which constitute the board-to-board work line WML, are connected to each other via a communication unit LC0. The communication unit LC0 may communicate via wired or wireless means. Various communication methods are possible. In this embodiment, the multiple (five) board-to-board work machines WM0 and management device WMC constitute a local area network (LAN). As a result, the multiple (five) board-to-board work machines WM0 can communicate with each other via the communication unit LC0. Furthermore, the multiple (five) board-to-board work machines WM0 can communicate with the management device WMC via the communication unit LC0.

[0016] The WMC control unit controls the five board-to-board work machines (WM0) that make up the WML board-to-board work line and monitors the operating status of the WML board-to-board work line. The WMC control unit stores various control data for controlling the five board-to-board work machines (WM0). The WMC control unit transmits control data to each of the five board-to-board work machines (WM0). In addition, each of the five board-to-board work machines (WM0) transmits its operating status and production status to the WMC control unit.

[0017] The WMC management device can be equipped with a DSV data server. The DSV data server can store, for example, data acquired by the WM0 board handling machine regarding board handling operations. For example, various image data captured by the WM0 board handling machine are included in the acquired data. Records of operating status (log data) acquired by the WM0 board handling machine are also included in the acquired data.

[0018] Furthermore, the data server DSV can also store various production information related to the production of the circuit board 90. For example, component data such as information on the shape of each type of component, information on electrical characteristics, and information on how to handle components are included in the production information. In addition, inspection results from inspection machines such as the printing inspection machine WM2 and the visual inspection machine WM5 are included in the acquired data as well as the production information.

[0019] 1-2. Configuration Example of Printing Press WM1 In the embodiment, the printing press WM1 prints solder 80 onto the substrate 90 through the opening 71 of the mask 70 by sliding a squeegee 34 over the mask 70. As shown in Figure 2, the printing press WM1 of the embodiment includes a substrate transport device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the plane of the paper in Figure 2) is defined as the X-axis direction. The direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-back direction of the printing press WM1, and the left-to-right direction of the plane of the paper in Figure 2) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-and-down direction of the plane of the paper in Figure 2) is defined as the Z-axis direction.

[0020] The substrate transport device 10 transports the substrate 90 to be printed. The substrate 90 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The substrate transport device 10 is installed on the base BS1 of the printing press WM1. The substrate transport device 10 transports the substrate 90 by, for example, a belt conveyor extending in the X-axis direction.

[0021] The substrate transport device 10 includes a substrate holding unit 11 for holding the substrate 90 that has been loaded into the printing press WM1. The substrate holding unit 11 is located below the mask 70 and is configured to be able to move up and down in the Z-axis direction by a linear motion mechanism, such as a lead screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is being transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 in close contact with the lower surface of the mask 70.

[0022] The mask support device 20 is located above the substrate transport device 10. The mask support device 20 supports the mask 70 with a pair of support bases. The pair of support bases are located on the left side (the far side of the page in Figure 2, which is shown) and the right side (the near side of the page in Figure 2, which is not shown) of the printing press WM1 when viewed from the front, and are formed to extend along the Y-axis.

[0023] Figure 2 is a partial cross-sectional view of the printing press WM1 cut along the Y-axis, schematically showing the interior of the printing press WM1 in a side view, as well as cross-sections of the mask 70 and substrate 90. The mask 70 has openings 71 that penetrate at predetermined positions on the wiring pattern of the substrate 90. The mask 70 is supported by a mask support device 20, for example, via a frame member provided on its outer edge.

[0024] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the mask 70 (Z-axis direction), and also moves the squeegee 34 in the Y-axis direction on the upper surface of the mask 70. The squeegee moving device 30 comprises a head drive device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head drive device 31 is located on the upper side of the printing press WM1. The head drive device 31 can move the squeegee head 32 in the Y-axis direction by a linear motion mechanism such as a feed screw mechanism.

[0025] The squeegee head 32 is clamped and fixed to the moving body that constitutes the linear motion mechanism of the head drive unit 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator, such as an air cylinder, to raise or lower the squeegee 34 it holds.

[0026] The squeegee 34 slides along the upper surface of the mask 70, moving the solder 80 supplied to the upper surface of the mask 70 along the mask 70. Solder 80 can be solder paste. The solder 80 is pressed into the substrate 90 through the opening 71 of the mask 70, printing the solder 80 onto the substrate 90 positioned on the lower side of the mask 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-shaped member formed to extend along the width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in the horizontal plane (XY plane).

[0027] The front squeegee 34 of the pair of squeegees 34, 34 (left side of the paper in Figure 2) is used in a printing process that moves solder 80 from front to back, with the direction of travel being from front to back of the printing press WM1. The rear squeegee 34 of the pair of squeegees 34, 34 (right side of the paper in Figure 2) is used in a printing process that moves solder 80 from back to front, with the direction of travel being from back to front of the printing press WM1. In addition, for both squeegees 34, the direction opposite to the direction of travel is the direction of reversal.

[0028] Each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that its front end, located in the direction of travel, faces downward. In other words, each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that its rear end, located in the direction of reversal, faces upward. The inclination angle of each of the pair of squeegees 34, 34 can also be adjusted, for example, by an adjustment mechanism provided at the bottom of the lifting device 33.

[0029] The control device 40 is equipped with a known arithmetic unit and memory device, and a control circuit is configured. The control device 40 is connected to the management device WMC via the communication unit LC0 shown in Figure 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, the mask support device 20, the squeegee moving device 30, and the display device 41 based on the production program, the detection results of various sensors, etc.

[0030] Furthermore, the control device 40 is equipped with a storage device. The storage device can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device stores production programs for driving the WM1 printer. The control device 40 acquires various information stored in the storage device and detection results from various sensors provided on the WM1 printer.

[0031] The control device 40, for example, drives and controls the squeegee moving device 30. Based on the various information and detection results described above, the control device 40 sends control signals to the squeegee moving device 30. This controls the Y-axis position, Z-axis position (height), and moving speed of the pair of squeegees 34, 34 held by the squeegee head 32. As previously described, the pair of squeegees 34, 34 are driven and controlled to print solder 80 onto the substrate 90 located on the lower side of the mask 70.

[0032] As shown in Figures 2 and 3, the control device 40 is equipped with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations from the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. In addition, the operator can configure the printing press WM1 and give instructions to the printing press WM1 via the display device 41.

[0033] 1-3. Example of the configuration of the adhesion determination device 50 One of the elements that maintains a constant printing quality of the solder 80 is the adhesion between the mask 70 and the substrate 90. Specifically, as shown in Figure 2, it is important that the mask 70 and the substrate 90 are in close contact when the mask 70 and the substrate 90 are positioned at a height that allows printing in the printing press WM1, but it is unclear whether the mask 70 and the substrate 90 are actually in close contact in that state.

[0034] Therefore, the substrate work line WML of this embodiment is provided with a contact determination device 50. According to the contact determination device 50, when the mask 70 and the substrate 90 are positioned at a height position where they can be printed in the printing press WM1, it is possible to determine whether or not the mask 70 and the substrate 90 are in close contact based on the amount of change 52v of the image target 52t before and after the mask 70 is pressed by the pressing member 60.

[0035] Specifically, the contact determination device 50, when considered as a control block, comprises a lifting unit 51, an imaging unit 52, and a determination unit 53. The contact determination device 50 may also include an illumination unit 54. The contact determination device 50 may also include a moving unit 55. The contact determination device 50 may also include a guide unit 56. The contact determination device 50 may also include a print control unit 57. As shown in Figure 3, the contact determination device 50 of the embodiment comprises a lifting unit 51, an imaging unit 52, a determination unit 53, an illumination unit 54, a moving unit 55, a guide unit 56, and a print control unit 57.

[0036] The lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and printing control unit 57 can be installed in various control devices such as the control device for the substrate work machine WM0, and various management devices such as the management device WMC. For example, at least one of the lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and printing control unit 57 can be installed in the control device 40 of the printing machine WM1. At least one of the lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and printing control unit 57 can also be installed in the management device WMC.

[0037] At least one of the lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and print control unit 57 can also be formed on the cloud. The lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and print control unit 57 can also be distributed across various control devices, various management devices, the cloud, etc. As shown in Figure 3, in the adhesion determination device 50 of the embodiment, the lifting unit 51, imaging unit 52, determination unit 53, irradiation unit 54, moving unit 55, guide unit 56, and print control unit 57 are provided on the control device 40 of the printing machine WM1.

[0038] Furthermore, the contact determination device 50 can perform control according to the flowchart shown in Figure 4. The lifting unit 51 performs the process shown in step S13. The imaging unit 52 performs the processes shown in steps S12 and S14. The determination unit 53 performs the judgment and processing shown in steps S15 to S17. The irradiation unit 54 performs the process shown in step S11. The moving unit 55 or guide unit 56 performs the process shown in step S18. The printing control unit 57 performs the judgment and processing shown in steps S19 and S20. Note that the matters described herein can be selected and applied as appropriate. Furthermore, the matters described herein can be combined as appropriate. In addition, the matters described herein can be modified as appropriate.

[0039] 1-3-1. Lifting Unit 51, Imaging Unit 52, Determination Unit 53, and Irradiation Unit 54 As shown in Figures 5 and 6, for example, consider a case where the irradiator 54a irradiates a linear pattern (corresponding to the imaging target 52t shown in the same figure) onto the mask 70, and the pressing member 60 presses near the pattern. If the mask 70 and the substrate 90 are not in close contact, the amount of displacement of the mask 70 due to pressing will be greater than when the mask 70 and the substrate 90 are in close contact. Therefore, the amount of change in the shape and position of the pattern before and after pressing when the mask 70 and the substrate 90 are not in close contact will be greater than when the mask 70 and the substrate 90 are in close contact. The contact determination device 50 determines whether or not the mask 70 and the substrate 90 are in close contact by evaluating the amount of change.

[0040] Specifically, the lifting unit 51, with the mask 70 and substrate 90 positioned at a height where they can be printed in the printing press WM1, moves a pressing member 60 that can press a predetermined part AR0 of the mask 70 from above in the vertical direction (Z-axis direction) to press the mask 70 (step S13 shown in Figure 4). As previously described, the printing press WM1 slides the squeegee 34 over the mask 70 to print solder 80 onto the substrate 90 through the opening 71 of the mask 70.

[0041] Furthermore, the imaging unit 52 causes the imaging device 52a to image the imaging target 52t, which is a pattern irradiated onto the mask 70 or a pattern formed on the mask 70, near a predetermined area AR0 of the mask 70, before and after the mask 70 is pressed by the pressing member 60 (steps S12 and S14). In addition, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact if the amount of change 52v of the imaging target 52t before and after the mask 70 is pressed is within an acceptable range (if the result is Yes in step S15) (step S16). The determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact if the amount of change 52v of the imaging target 52t before and after the mask 70 is pressed exceeds an acceptable range (if the result is No in step S15) (step S17).

[0042] The lifting unit 51 only needs to be able to move the pressing member 60 up and down to press the mask 70, and can take various forms. As shown in Figures 5 and 6, the lifting unit 51 can move the pressing member 60 along the vertical direction (Z-axis direction) using a lifting device 51a equipped with a linear motion mechanism such as a cylinder, and can press the mask 70 with the tip 60a of the pressing member 60. Similarly, the pressing member 60 only needs to be able to press the mask 70, and can take various forms. The pressing member 60 shown in Figures 5 and 6 is formed in a cylindrical shape, for example. In addition, at least the tip 60a of the pressing member 60 is made of resin, which can suppress damage to the surface of the mask 70 compared to metal or the like.

[0043] Further, the lifting device 51a can be provided on an XY table or the like that is movable in the conveyance direction (X-axis direction) of the substrate 90 and the printing direction (Y-axis direction) of the solder 80, and can move horizontally on a horizontal plane (XY plane). For example, the lifting device 51a shown in FIGS. 5 and 6 is provided in the solder supply unit 80u. The solder supply unit 80u horizontally moves the solder container 80c in which the solder 80 is accommodated by the XY table to supply the solder 80. Thus, the lifting device 51a can move to an arbitrary position on the mask 70, and the lifting unit 51 can move the pressing member 60 up and down at an arbitrary position of the mask 70 to press the mask 70.

[0044] For example, the smaller the opening dimension of the opening 71 of the mask 70, the higher the printing difficulty of the solder 80. In particular, when the mask 70 and the substrate 90 are not in close contact, the smaller the opening dimension of the opening 71, the greater the influence on the printing quality of the solder 80. Therefore, as shown in FIG. 7, it is preferable that the lifting unit 51 presses a predetermined portion AR0 including the vicinity of the minimum opening 71t having the smallest opening dimension among the openings 71 formed in the mask 70 with the pressing member 60.

[0045] Further, the lifting unit 51 can also press a plurality of predetermined portions AR0 of the mask 70 with the pressing member 60 respectively. The plurality of predetermined portions AR0 can be set at arbitrary portions of the mask 70. For example, the plurality of predetermined portions AR0 can include at least one of the vicinity of the four corners, the vicinity of the central portion, and the vicinity of the intermediate portions of a rectangular mask 70. Also, the plurality of predetermined portions AR0 can include the vicinity of the minimum opening 71t described above. In the example shown in FIG. 7, the plurality of predetermined portions AR0 include 10 portions, namely, the vicinity of the four corners of the rectangular mask 70, the vicinity of the central portion, the vicinity of the intermediate portions of the four corners, and the vicinity of the minimum opening 71t.

[0046] In any case, the imaging unit 52 causes the imaging device 52a to image the imaging target 52t at each of the plurality of predetermined parts AR0. Then, when the average value of the change amount 52v of the imaging target 52t imaged at the plurality of predetermined parts AR0 is included in the allowable range, the determination unit 53 can determine that the mask 70 and the substrate 90 are in close contact. Further, when the average value of the change amount 52v of the imaging target 52t exceeds the allowable range, the determination unit 53 can determine that the mask 70 and the substrate 90 are not in close contact.

[0047] In the example shown in FIG. 7, the determination unit 53 calculates the average value of the change amount 52v of the imaging target 52t imaged at the 10 predetermined parts AR0. Then, when the average value of the 10 change amounts 52v is included in the allowable range, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact. When the average value of the 10 change amounts 52v exceeds the allowable range, the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact.

[0048] Further, when the maximum value of the change amount 52v of the imaging target 52t imaged at the plurality of predetermined parts AR0 is included in the allowable range, the determination unit 53 can also determine that the mask 70 and the substrate 90 are in close contact. When the maximum value of the change amount 52v of the imaging target 52t exceeds the allowable range, the determination unit 53 can also determine that the mask 70 and the substrate 90 are not in close contact.

[0049] In the example shown in FIG. 7, the determination unit 53 calculates the maximum value of the change amount 52v of the imaging target 52t imaged at the 10 predetermined parts AR0. Then, when the maximum value of the 10 change amounts 52v is included in the allowable range, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact. When the maximum value of the 10 change amounts 52v exceeds the allowable range, the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact.

[0050] The imaging unit 52 only needs to be able to cause the imaging device 52a to image the object to be imaged 52t before and after the mask 70 is pressed by the pressing member 60, and can take various forms. Similarly, the object to be imaged 52t can be a pattern irradiated onto the mask 70 or a pattern formed on the mask 70, located near a predetermined part AR0 of the mask 70, and can take various forms. For example, if the object to be imaged 52t is a pattern irradiated onto the mask 70, the contact determination device 50 can be equipped with an irradiation unit 54 that irradiates a linear pattern onto the mask 70 from an irradiator 54a capable of irradiating a laser beam.

[0051] The irradiator 54a only needs to be capable of irradiating the mask 70 with a laser beam, and any known irradiator can be used. As shown by the solid line in Figures 5 and 6, the irradiator 54a can be installed, for example, on a component equipped with an XY table. The irradiator 54a shown in the same figure is installed on a solder supply unit 80u that supplies solder 80. Also, as shown by the dashed line in Figures 5 and 6, the irradiator 54a can be installed on the housing of the printing press WM1.

[0052] The irradiation unit 54 starts irradiating the irradiator 54a with a linear pattern before the mask 70 is pressed by the pressing member 60 (step S11 shown in Figure 4). The imaging unit 52 then causes the imaging device 52a to capture the linear pattern irradiated from the irradiator 54a before and after the mask 70 is pressed by the pressing member 60 (steps S12 and S14). The irradiation unit 54 continues irradiating the irradiator 54a with a linear pattern until the mask 70 is pressed by the pressing member 60 (step S13) and at least the linear pattern is captured by the imaging device 52a (step S14).

[0053] Similarly, the imaging device 52a only needs to be able to image the object to be imaged 52t before and after the mask 70 is pressed by the pressing member 60, and any known imaging device can be used. As shown in Figures 5 and 6, the imaging device 52a can be installed, for example, on a member equipped with an XY table. The imaging device 52a shown in the same figure is installed on a solder supply unit 80u that supplies solder 80. The imaging device 52a can also be installed on the housing of the printing press WM1. The imaging unit 52 sets the imaging conditions (e.g., exposure time, aperture, illumination time, etc.) that can be set by the imaging device 52a to be the same, and causes the imaging device 52a to image the object to be imaged 52t before and after the mask 70 is pressed by the pressing member 60.

[0054] Furthermore, the pattern irradiated from the irradiator 54a can be linear, but is not limited to that. The pattern irradiated from the irradiator 54a can be, for example, a straight line or a curve. As shown in the imaging target 52t in Figures 5 and 6, the irradiation unit 54 can irradiate, for example, a linear pattern formed by a single straight line from the irradiator 54a. Also, as shown in the imaging target 52t in Figures 8 and 9, the irradiation unit 54 can irradiate, for example, a striped pattern formed by multiple straight lines arranged at regular intervals from the irradiator 54a. The striped patterns shown in Figures 8 and 9 are orthogonal in the horizontal plane (XY plane).

[0055] Furthermore, as shown in the imaging target 52t in Figure 10, the illumination unit 54 can also irradiate, for example, a grid pattern formed by multiple straight lines arranged at regular intervals from the irradiator 54a. In this way, the illumination unit 54 can irradiate a linear pattern formed by a single straight line, or a striped pattern or grid pattern formed by multiple straight lines arranged at regular intervals from the irradiator 54a.

[0056] Even when the object to be imaged 52t is a pattern formed on the mask 70, the imaging unit 52 can cause the imaging device 52a to image the object to be imaged 52t in the same manner as when a pattern is illuminated on the mask 70. Furthermore, when the object to be imaged 52t is a pattern formed on the mask 70, the imaging unit 52 can illuminate the pattern formed on the mask 70 with the imaging device 52a, causing the imaging device 52a to image the pattern formed on the mask 70. The pattern formed on the mask 70 is not limited to linear patterns. For example, the pattern formed on the mask 70 may be a linear pattern formed by a single straight line, or a striped or grid pattern formed by multiple straight lines arranged at regular intervals, similar to the case of a pattern illuminated on the mask 70.

[0057] In either case, the imaging target 52t is a pattern irradiated onto the mask 70 or a pattern formed on the mask 70, the determination unit 53 can determine whether the mask 70 and the substrate 90 are in close contact based on the amount of change 52v of the imaging target 52t before and after the mask 70 is pressed. Specifically, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact if the amount of change 52v of the imaging target 52t before and after the mask 70 is pressed falls within an acceptable range. The determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact if the amount of change 52v of the imaging target 52t before and after the mask 70 is pressed exceeds an acceptable range.

[0058] When the mask 70 and the substrate 90 are not in close contact, pressing the mask 70 with the pressing member 60 causes the mask to displace, changing the shape and position of the pattern on the mask 70 before and after pressing. Therefore, the change amount 52v of the image target 52t may be the change in the shape of the pattern on the mask 70 before and after pressing, or it may be the change in the position of the pattern on the mask 70 before and after pressing. For example, the image target 52t shown by the dashed line in Figure 11 represents the linear pattern of the mask 70 before pressing. The image target 52t shown by the solid line in the same figure represents the pattern of the mask 70 after pressing. In the pattern of the mask 70 after pressing, a part of the linear pattern of the mask 70 before pressing is deformed into a roughly V-shape.

[0059] The determination unit 53 can obtain the amount of change in the shape of the pattern before and after pressing the mask 70 by processing the image of the object to be captured 52t captured by the imaging device 52a. In the example shown in Figure 11, the amount of change 52v of the object to be captured 52t corresponds to the distance from the straight line pattern before pressing the mask 70 to the recess of the pattern which has been deformed into a roughly V shape. Similarly, the determination unit 53 can also obtain the amount of change in the position of the pattern before and after pressing the mask 70 by processing the image of the object to be captured 52t captured by the imaging device 52a.

[0060] 1-3-2. Moving Unit 55, Guide Unit 56, and Printing Control Unit 57 If the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact (as in step S17 shown in Figure 4), it is necessary to improve the state in which the mask 70 and the substrate 90 are not in close contact. Therefore, when the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact (as in step S17), the moving unit 55 moves one of the mask 70 and the substrate 90 closer to the other (step S18).

[0061] Specifically, the moving unit 55 can raise the substrate 90, bringing it closer to the mask 70. The moving unit 55 can also lower the mask 70, bringing it closer to the substrate 90. For example, in the printing press WM1 shown in Figure 2, the substrate holding unit 11 of the substrate transport device 10 moves up and down relative to the mask 70 fixed to the housing to raise and lower the substrate 90. In this case, the moving unit 55 can raise the substrate 90 to the substrate holding unit 11, bringing the substrate 90 closer to the mask 70.

[0062] If the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact (in the case of step S17), the guide unit 56 guides the operator to bring the mask 70 and the substrate 90 into close contact (step S18). The guide unit 56 only needs to be able to provide the above guidance to the operator and can take various forms. For example, the guide unit 56 can notify the operator via the display device 41 of the printing press WM1 that the mask 70 and the substrate 90 are not in close contact and instruct the operator to bring the mask 70 and the substrate 90 into close contact.

[0063] Furthermore, the guidance unit 56 can also notify the worker via a portable terminal that the mask 70 and the substrate 90 are not in close contact, and instruct the worker to bring the mask 70 and the substrate 90 into close contact. In either case, the worker can, for example, adjust the horizontal position of the mask 70 or the substrate 90 based on the guidance, thereby bringing the mask 70 and the substrate 90 into close contact.

[0064] Furthermore, the smaller the amount of insufficient adhesion between the mask 70 and the substrate 90, the smaller the change in the image target 52t 52v before and after the mask 70 is pressed. As a result, it may become difficult for the determination unit 53 to determine whether or not the mask 70 and the substrate 90 are in close contact. In this case, it is advisable to separate the mask 70 and the substrate 90 to a distance at which it can be determined that the mask 70 and the substrate 90 are not in close contact, then press the mask 70, and evaluate the change in the image target 52t 52v before and after the mask 70 is pressed.

[0065] Specifically, the lifting unit 51 moves one of the mask 70 and the substrate 90 a predetermined distance away from the other so that the mask 70 and the substrate 90 are not in close contact, and then moves the pressing member 60 up and down to press the mask 70. The predetermined distance can be any distance at which it can be determined that the mask 70 and the substrate 90 are not in close contact based on the image of the object to be captured 52t captured by the imaging device 52a. The mask 70 and the substrate 90 can also be separated by the moving unit 55 described above. In this configuration as well, the imaging unit 52 causes the imaging device 52a to capture the object to be captured 52t before and after the mask 70 is pressed by the pressing member 60.

[0066] Since the mask 70 was pressed while separated by a predetermined distance such that it could be determined that the mask 70 and the substrate 90 were not in close contact, it is considered that a gap of at least the predetermined distance was created between the mask 70 and the substrate 90. In this case, if the amount of change 52v of the imaging target 52t before and after the mask 70 was pressed is less than or equal to the predetermined distance that separated the mask 70 and the substrate 90, then it can be said that the mask 70 and the substrate 90 were in close contact at the predetermined distance and before separation.

[0067] In contrast, if the change amount 52v of the imaging target 52t before and after the mask 70 is pressed exceeds a predetermined distance that separates the mask 70 and the substrate 90, then it can be said that the mask 70 and the substrate 90 are not in close contact by the amount exceeding the predetermined distance, both before and after the separation. Therefore, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact if the change amount 52v of the imaging target 52t before and after the mask 70 is pressed is less than or equal to the predetermined distance. Also, the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact if the change amount 52v of the imaging target 52t before and after the mask 70 is pressed exceeds a predetermined distance.

[0068] Furthermore, compared to making the judgment described above based on only one separation distance, making the judgment described above based on multiple separation distances results in a more accurate determination of whether or not the mask 70 and the substrate 90 are in close contact. Therefore, the lifting unit 51 should raise and lower the pressing member 60 to press the mask 70 at each of the multiple predetermined distances where the mask 70 and the substrate 90 are not in close contact. The imaging unit 52 should then have the imaging device 52a image the object to be imaged 52t before and after the mask 70 is pressed by the pressing member 60 at each of the multiple predetermined distances.

[0069] In this configuration, the determination unit 53 can estimate the amount exceeding a predetermined distance based on the rate of change of the image target 52t 52v at multiple predetermined distances, if the amount of change 52v of the image target 52t before and after the mask 70 is pressed exceeds a predetermined distance. Figure 12 shows an example of the relationship between the distance between the mask 70 and the substrate 90 and the amount of change 52v of the image target 52t. The horizontal axis of the figure shows the distance between the mask 70 and the substrate 90. The vertical axis of the figure shows the amount of change 52v of the image target 52t. Line L1 shows an example of the above relationship when the mask 70 and the substrate 90 are in close contact. Line L2 shows an example of the above relationship when the mask 70 and the substrate 90 are not in close contact.

[0070] Furthermore, distance X0 indicates the minimum distance at which it can be determined that the mask 70 and the substrate 90 are not in close contact, based on the image of the object to be imaged 52t captured by the imaging device 52a. In other words, it can be determined that the mask 70 and the substrate 90 are not in close contact at distances X0 or greater, as indicated by the solid lines in the straight lines L1 and L2. Distances X1 and X2 indicate a plurality of predetermined distances (two) at which the mask 70 and the substrate 90 are not in close contact. The division value obtained by subtracting the change in the amount of the object to be imaged 52t at distance X1 from the change in the amount of the object to be imaged 52t at distance X2, and then dividing this value by the division value obtained by subtracting distance X1 from distance X2, corresponds to the rate of change in the amount of the amount of the object to be imaged 52t at the plurality of predetermined distances (two).

[0071] In Figure 12, the straight line L1 represents a change in the image target 52t, 52v, when the separation distance is zero. In this case, it can be said that the mask 70 and the substrate 90 are in close contact before being separated by a predetermined distance. Therefore, in this case, the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact. In contrast, in the same figure, the straight line L2 represents a change in the image target 52t, 52v, when the separation distance is zero, ΔX. In this case, it can be said that the mask 70 and the substrate 90 are not in close contact by the amount of change ΔX that exceeds the predetermined distance before being separated by a predetermined distance. Therefore, in this case, the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact.

[0072] If the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact (as in step S17 shown in Figure 4), the moving unit 55 moves one of the mask 70 and the substrate 90 toward the other by a predetermined distance plus the amount exceeding the predetermined distance (step S18). In the example shown on the straight line L2 in Figure 12, the moving unit 55 moves one of the mask 70 and the substrate 90 toward the other by a predetermined distance plus the amount of change ΔX that exceeds the predetermined distance. As a result, the moving unit 55 can bring the mask 70 and the substrate 90 into close contact.

[0073] As previously described, for example, the moving part 55 can move the mask 70 or the substrate 90, and it is expected that the state in which the mask 70 and the substrate 90 are not in close contact will be improved. Also, for example, the guide part 56 can guide the operator, and the operator can perform horizontal adjustments of the mask 70 or the substrate 90, and it is expected that the state in which the mask 70 and the substrate 90 are not in close contact will be improved. However, there is a possibility that the state in which the mask 70 and the substrate 90 are not in close contact will not be sufficiently improved. In this case, solder 80 may get between the mask 70 and the substrate 90, and the print quality may deteriorate.

[0074] Therefore, if the determination unit 53 determines that the mask 70 and the substrate 90 are not in close contact, and the condition of the mask 70 and the substrate 90 not being in close contact does not improve (the case of No in step S19 shown in Figure 4), the print control unit 57 should shorten the cleaning interval of the mask 70 compared to when the determination unit 53 determines that the mask 70 and the substrate 90 are in close contact (step S20). This makes it easier to clean off the solder 80 that has gotten onto the back side of the mask 70 (the side facing the substrate 90) due to insufficient contact between the mask 70 and the substrate 90, thereby suppressing a decrease in print quality. Then, the control by the contact determination device 50 is terminated for the time being.

[0075] Furthermore, the determination unit 53, for example, after the mask 70 or substrate 90 has been moved by the moving unit 55, determines again whether the mask 70 and substrate 90 are in close contact. If it determines that the mask 70 and substrate 90 are not in close contact, it can determine that the condition in which the mask 70 and substrate 90 are not in close contact has not been improved (if the result in step S19 is No). Alternatively, the determination unit 53, for example, after the mask 70 or substrate 90 has been moved by the moving unit 55, determines again whether the mask 70 and substrate 90 are in close contact. If it determines that the mask 70 and substrate 90 are in close contact, it can determine that the condition in which the mask 70 and substrate 90 are not in close contact has been improved (if the result in step S19 is Yes). In this case, the control by the contact determination device 50 is terminated. The above description regarding the period after the mask 70 or substrate 90 has been moved by the moving unit 55 also applies after the guide unit 56 has guided the worker through the process and the worker has performed horizontal adjustments to the mask 70 or substrate 90.

[0076] 2. Adhesion Determination Method The same applies to the adhesion determination method as described above for the adhesion determination device 50. Specifically, the adhesion determination method comprises a lifting step, an imaging step, and a determination step. The lifting step corresponds to the control performed by the lifting unit 51. The imaging step corresponds to the control performed by the imaging unit 52. The determination step corresponds to the control performed by the determination unit 53. The adhesion determination method may also include an irradiation step. The adhesion determination method may also include a moving step. The adhesion determination method may also include a guiding step. The adhesion determination method may also include a printing control step. The irradiation step corresponds to the control performed by the irradiation unit 54. The moving step corresponds to the control performed by the moving unit 55. The guiding step corresponds to the control performed by the guiding unit 56. The printing control step corresponds to the control performed by the printing control unit 57. Note that redundant explanations have been omitted in this specification.

[0077] 3. An example of the effects of the embodiment According to the adhesion determination device 50, when the mask 70 and substrate 90 are positioned at a height where they can be printed in the printing press WM1, it is possible to determine whether the mask 70 and substrate 90 are in close contact based on the amount of change 52v of the image target 52t before and after the mask 70 is pressed by the pressing member 60. The same can be said for the adhesion determination method as well as for the adhesion determination device 50.

[0078] 34: Squeegee, 50: Contact determination device, 51: Lifting unit, 52: Imaging unit, 52a: Imaging device, 52t: Target to be imaged, 52v: Amount of change, 53: Determination unit, 54: Irradiation unit, 54a: Irradiator, 55: Moving unit, 56: Guide unit, 57: Printing control unit, 60: Pressing member, 70: Mask, 71: Opening, 71t: Minimum opening, 80: Solder, 90: Substrate, AR0: Determined area, WM1: Printing machine.

Claims

1. A contact determination device comprising:

1. A printing machine that prints solder onto a substrate through an opening in a mask by sliding a squeegee over the mask, and the mask and the substrate are positioned at a height where printing is possible, and the device moves a pressing member up and down to press the mask, thereby pressing the mask from above in a vertical direction; 2. An imaging unit that causes an imaging device to image an object, which is a pattern irradiated onto the mask or a pattern formed on the mask, near the predetermined portion of the mask before and after the mask is pressed by the pressing member; 3. A determination unit that determines that the mask and the substrate are in close contact if the amount of change in the object before and after the mask is pressed falls within an acceptable range, and determines that the mask and the substrate are not in close contact if the amount of change in the object before and after the mask is pressed exceeds the acceptable range; 2. The contact determination device according to claim 1, wherein the lifting part presses the predetermined portion, including the vicinity of the smallest opening among the openings formed in the mask, with the pressing member.

3. The adhesion determination device according to claim 1 or 2, wherein the lifting unit presses each of the plurality of predetermined parts of the mask with the pressing member, the imaging unit causes the imaging device to image the object to be imaged at each of the plurality of predetermined parts, and the determination unit determines that the mask and the substrate are in close contact when the average or maximum value of the amount of change of the object to be imaged at the plurality of predetermined parts falls within the allowable range, and determines that the mask and the substrate are not in close contact when the average or maximum value of the amount of change of the object to be imaged exceeds the allowable range.

4. The adhesion determination device according to claim 1, further comprising an irradiation unit that irradiates a linear pattern onto the mask from an irradiator capable of irradiating a laser beam.

5. The contact determination device according to claim 4, wherein the irradiation unit irradiates a linear pattern formed by a single straight line, or a striped pattern or grid pattern formed by a plurality of straight lines arranged at regular intervals, from the irradiator.

6. The adhesion determination device according to claim 1, further comprising a moving unit that brings one of the mask and the substrate closer to the other when the determination unit determines that the mask and the substrate are not in close contact.

7. The adhesion determination device according to claim 1, further comprising a guide unit that guides an operator to bring the mask and the substrate into close contact when the determination unit determines that the mask and the substrate are not in close contact.

8. The contact determination device according to claim 1, wherein the lifting unit moves one of the mask and the substrate a predetermined distance away from the other so that the mask and the substrate are not in close contact, and moves the pressing member up and down to press the mask, and the determination unit determines that the mask and the substrate are in close contact if the amount of change of the imaging target before and after the mask is pressed is less than or equal to the predetermined distance, and determines that the mask and the substrate are not in close contact if the amount of change of the imaging target before and after the mask is pressed exceeds the predetermined distance.

9. The contact determination device according to claim 8, wherein the lifting unit lifts and lowers the pressing member to press the mask at each of the plurality of predetermined distances where the mask and the substrate are not in close contact, and the determination unit estimates the amount exceeding the predetermined distance based on the rate of change of the imaging target at the plurality of predetermined distances when the amount of change of the imaging target before and after the mask is pressed exceeds the predetermined distance.

10. The adhesion determination device according to claim 8 or 9, further comprising a moving unit that, when the determination unit determines that the mask and the substrate are not in close contact, moves one of the mask and the substrate toward the other by the predetermined distance plus the amount exceeding the predetermined distance.

11. The adhesion determination device according to claim 1, further comprising a printing control unit that shortens the cleaning interval of the mask compared to the case where the determination unit determines that the mask and the substrate are in close contact, when the determination unit determines that the mask and the substrate are in close contact and the condition of the mask and the substrate not being in close contact is not improved.

12. A method for determining adhesion in a printing machine that prints solder onto a substrate through an opening in a mask by sliding a squeegee over the mask, comprising: a lifting step of raising and lowering a pressing member capable of pressing a predetermined part of the mask from above in a vertical direction to press the mask, while the mask and the substrate are positioned at a height where printing is possible; an imaging step of causing an imaging device to image an object that is near the predetermined part of the mask and is irradiated onto the mask or formed on the mask, before and after the mask is pressed by the pressing member; and a determination step of determining that the mask and the substrate are in close contact if the amount of change of the object being imaged before and after the mask is pressed is within an acceptable range, and determining that the mask and the substrate are not in close contact if the amount of change of the object being imaged before and after the mask is pressed exceeds the acceptable range.

Images