Heat treatment device, heat treatment method, and production method for chemical product

Abstract

One embodiment of a heat treatment device 100 according to the present disclosure comprises a first heating unit 1 that heats a target substance 5, a heat-generating resistance body 2 that passes through the first heating unit 1 from a first surface 1a to a second surface 1b of the first heating unit 1 and is provided so as to be capable of moving back and forth with respect to the first heating unit 1, a target substance supply unit 3 that is connected to the first heating unit 1 and supplies the target substance 5 to the first heating unit 1, and a treated substance removal unit 4 that is connected to the first heating unit 1 and removes a treated substance 6 that has been treated at the first heating unit 1.

Description

Heat treatment apparatus, heat treatment method, and method for producing chemical products

[0001] This disclosure relates to a heat treatment apparatus, a heat treatment method, and a method for producing chemical products.

[0002] Basic chemicals such as ethylene, propylene, benzene, toluene, and xylene primarily use naphtha derived from petroleum, a fossil resource, as their raw material. These basic chemicals are produced by thermally decomposing naphtha with 5 to 10 carbon atoms using superheated steam at reaction temperatures of 700°C to 850°C, followed by separation through distillation and purification. Therefore, the reactors used to decompose naphtha require heating their external surfaces to approximately 1,000°C using burners or the like, resulting in poor energy efficiency and a tendency for the reactors to deteriorate.

[0003] Conventional reactors require long-term durability under such high-temperature and steam exposure conditions, necessitating special metal alloy compositions capable of withstanding these environments, which is costly.

[0004] Therefore, a method has been proposed in which coiled metal wires of tungsten, molybdenum, or nichrome are placed in a reactor, and an electric current is passed through these metal wires to heat them to 300°C to 600°C, thereby decomposing petroleum gas with 1 to 4 carbon atoms into ethylene and propylene (see Non-Patent Document 1).

[0005] V. M. Shekunova et al. , Petroleum Chemistry, 2017, Volume 57, pages 446-451

[0006] The purpose of this disclosure is to provide a heat treatment apparatus that can operate stably for a long period of time, efficiently thermally decompose the material to be treated, and prevent deterioration due to heat.

[0007] The means for solving the above-mentioned problems are as follows: <1> A heat treatment apparatus comprising: a first heating section for heating an object to be processed; a heat-generating resistor that penetrates from a first surface to a second surface of the first heating section and is arranged to move back and forth relative to the first heating section; an object to be processed supply section connected to the first heating section and for supplying the object to be processed to the first heating section; and an object to be processed removal section connected to the first heating section and for removing the object processed in the first heating section. <2> The heat treatment apparatus according to <1>, further comprising a winding section for winding the heat-generating resistor. <3> The heat treatment apparatus according to <1> or <2>, further comprising an inert gas supply section connected to the first heating section and for supplying an inert gas to the first heating section. <4> The heat treatment apparatus according to any one of <1> to <3> above, wherein the heat-generating resistor is thread-like, drawn-wire-like, film-like, plate-like, coil-like, double-helix coil-like, mesh-like, foil-like, fabric-like, film-like, or layer-like. <5> The heat treatment apparatus according to any one of <1> to <4> above, comprising a second heating section for heating carbon attached to the heat-generating resistor, wherein the heat-generating resistor penetrates from the first surface of the second heating section to the second surface of the second heating section and is arranged to move back and forth relative to the second heating section. <6> The heat treatment apparatus according to <5> above, comprising a gas supply section connected to the second heating section for supplying gas containing oxygen to the second heating section, and a gas discharge section connected to the second heating section for discharging gas containing carbon dioxide from the second heating section. <7> The heat treatment apparatus according to <5> or <6>, wherein the heating resistor is endless, and the heating resistor moves from the first surface of the first heating section toward the first surface of the second heating section and moves from the second surface of the second heating section toward the second surface of the first heating section, or the heating resistor moves from the second surface of the first heating section toward the second surface of the second heating section and moves from the first surface of the second heating section toward the first surface of the first heating section. <8> A heat treatment method characterized by heat treating the object to be treated using the heat treatment apparatus according to any one of <1> to <7>.<9> A heat treatment method according to <8>, comprising: supplying the object to be treated from the object to be treated supply unit to the first heating unit; heating the object to be treated with the heating resistor in the first heating unit; and removing the processed product generated by heating the object to be treated from the processed product removal unit, wherein the heating resistor moves to move forward and backward relative to the first heating unit during the supplying, heating, and removal. <10> A heat treatment method according to <9>, wherein the heating is performed by heating the object to be treated with the heating resistor to 650°C or higher in the first heating unit. <11> A method for producing a chemical product, comprising heat treating the object to be treated using a heat treatment apparatus according to any one of <1> to <7>, wherein the object to be treated is a plastic, and the chemical product is at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

[0008] According to embodiments of this disclosure, it is possible to provide a heat treatment apparatus that can operate stably for a long period of time, efficiently thermally decompose the material to be processed, and prevent deterioration due to heat.

[0009] Figure 1A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the first embodiment of the present disclosure. Figure 1B is a schematic cross-sectional view showing an example of the first surface of the first heating section of the heat treatment apparatus according to the first embodiment of the present disclosure. Figure 1C is a schematic cross-sectional view showing an example of the second surface of the first heating section of the heat treatment apparatus according to the first embodiment of the present disclosure. Figure 1D is a block diagram showing an example of a control unit of the heat treatment apparatus according to the first embodiment of the present disclosure. Figure 2A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the second embodiment of the present disclosure. Figure 2B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the second embodiment of the present disclosure. Figure 3A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the third embodiment of the present disclosure. Figure 3B is a block diagram showing an example of a control unit of the heat treatment apparatus according to the third embodiment of the present disclosure. Figure 4A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the fourth embodiment of the present disclosure. Figure 4B is a schematic cross-sectional view showing an example of the first surface of the second heating section of the heat treatment apparatus according to the fourth embodiment of the present disclosure. Figure 4C is a schematic cross-sectional view showing an example of the second surface of the second heating section of the heat treatment apparatus according to the fourth embodiment of the present disclosure. Figure 4D is a block diagram showing an example of a control unit of the heat treatment apparatus according to the fourth embodiment of the present disclosure. Figure 5A is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the fifth embodiment of this disclosure. Figure 5B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the fifth embodiment of this disclosure. Figure 6 is a schematic cross-sectional view showing an example of a heat treatment apparatus according to the sixth embodiment of this disclosure. Figure 7 is an example of a flowchart of a heat treatment method according to one embodiment of this disclosure. Figure 8 is an example of a flowchart of a method for producing a chemical product according to one embodiment of this disclosure.

[0010] A heat treatment apparatus, a heat treatment method, and a method for manufacturing chemical products according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments described below are illustrative examples of a heat treatment apparatus, a heat treatment method, and a method for manufacturing chemical products that embody the technical concept of this disclosure, and are not limited to those described below. They can be modified as appropriate without departing from the gist of this disclosure.

[0011] Also, the dimensions, materials, shapes, numbers, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present disclosure only to those, but are merely illustrative examples, unless otherwise specifically described. Note that the sizes, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. Also, in the following description, the same names and reference numerals indicate the same or similar members, and detailed descriptions will be omitted as appropriate. In order to avoid excessive complexity of the drawings, schematic diagrams with some elements omitted or end views showing only the cut surface as cross-sectional views may be used.

[0012] In the present disclosure, with respect to polygons such as rectangles, triangles, and quadrilaterals, those having shapes subjected to processing such as rounding, chamfering, corner rounding, and edge rounding at the corners of the polygon are also referred to as polygons. Also, not limited to the corners (ends of the sides), those having shapes subjected to processing in the middle part of the sides are likewise referred to as polygons. That is, shapes with partial processing while leaving the polygon as a base are included in the interpretation of the "polygon" described in the present disclosure.

[0013] Further, not limited to polygons, the same applies to terms representing specific shapes such as cylindrical, rectangular parallelepiped, trapezoidal, circular, and tapered shapes. The same also applies when dealing with each side forming the shape. That is, even if a particular side has been processed at the corner or in the middle part, the processed part is included in the interpretation of the "side". When distinguishing a "polygon" or "side" without partial processing from the processed shape, the term "strict" is added, for example, described as "strict quadrilateral", etc.

[0014] Also, in the following description, terms indicating specific directions and positions (for example, "up", "down", "sideways", "upper surface", "lower surface", "side surface", "X", "Y", "Z", and other terms including those terms) are used as necessary. However, the use of those terms is for facilitating the understanding of the invention by referring to the drawings, and the technical scope of the present invention is not excessively limited by the meanings of those terms. For example, when described as the "upper surface", it is not necessary that the invention must always be used facing upwards.

[0015] In addition, in this specification, "~" indicating a numerical range means including the numerical values described before and after it as the lower limit value and the upper limit value, unless otherwise specified.

[0016] (Heat treatment apparatus) [First Embodiment] The heat treatment apparatus according to the first embodiment of the present disclosure includes a first heating unit that heats a processing object, a heating resistor that penetrates from a first surface of the first heating unit to a second surface of the first heating unit and is arranged to be able to advance and retreat with respect to the first heating unit, a processing object supply unit that is connected to the first heating unit and supplies the processing object to the first heating unit, and a processed object extraction unit that is connected to the first heating unit and extracts the processed object processed by the first heating unit. The heat treatment apparatus according to an embodiment may further have other members as required.

[0017] FIG. 1A is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the first embodiment of the present disclosure. The heat treatment apparatus 100 includes a first heating unit 1, a heating resistor 2, a processing object supply unit 3, and a processed object extraction unit 4.

[0018] The direction in which the heating resistor 2 penetrates the first heating unit is defined as the Y-axis direction, the direction substantially orthogonal to the Y-axis direction is defined as the X-axis direction, and the direction substantially orthogonal to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. The X-axis, the Y-axis, and the Z-axis are orthogonal to each other. The plane directions of the first surface 1a and the second surface 1b of the first heating unit 1 are preferably in the XZ plane direction composed of the X-axis and the Z-axis, but the first surface 1a and the second surface 1b are not limited to being parallel. For example, the first surface 1a may be parallel to the XZ plane, and the second surface 1b may be inclined with respect to the XZ plane.

[0019] In the present disclosure, "substantially orthogonal" is not limited to 90°, and a difference within 90° ± 5° is allowed.

[0020] Conventional technologies, such as the reactor described in Non-Patent Document 1, allow for lower heating temperatures of the reaction tube compared to external heating methods. However, there is a problem in that the raw material, petroleum gas, and the products, ethylene and propylene, carbonize (sometimes referred to as "coking" in this disclosure) inside the reactor and on the surface of the metal wire that acts as a heating element, leading to a decrease in the efficiency of product production over time. Furthermore, if the reactor is made of metal, carbon can penetrate the metal structure of the metal wire or, if the reactor is made of metal, the metal can become brittle. In addition, if the material being processed is a plastic containing chlorine, chlorine-containing and other acidic compounds generated during thermal decomposition can accelerate metal corrosion. Therefore, there is also the problem of complicated handling, as it requires periodic maintenance such as flowing air into the reactor to burn off the carbon, or cutting and replacing the reactor or metal wire.

[0021] In contrast, the heat treatment apparatus 100 of this disclosure brings the object to be treated 5 into contact with the heating resistor 2 and directly heats the object to be treated 5 with the heating resistor 2. Therefore, compared to conventional technology in which a conventional reactor corresponding to the first heating unit 1 is heated from the outside with a burner or the like, the temperature of the first heating unit 1 that heats the object to be treated 5 does not become high, and deterioration of the heat treatment apparatus 100 including the first heating unit 1 can be suppressed.

[0022] Furthermore, in the heat treatment apparatus 100 of this disclosure, the heating resistor 2 is positioned to move back and forth relative to the first heating section 1, thereby preventing deterioration of the heating resistor 2 due to heat. Moreover, even if the heating resistor 2 deteriorates or becomes caulked due to prolonged use, the heating resistor 2 can be moved outside the first heating section 1, and the heat treatment apparatus 100 can be operated while replacing the deteriorated and / or caulked parts. As a result, the heat treatment apparatus 100 can operate stably for a long time, efficiently thermally decompose the material to be treated 5, and increase the production volume of the treated material 6.

[0023] In this disclosure, "movable in both directions" means that the heating resistor 2 is movable in any direction in which it penetrates the first heating section 1. Specifically, "movable in both directions" means that the heating resistor 2 can move from the first surface 1a side to the second surface 1b side of the first heating section 1 (i.e., in the -Y axis direction), and can also move from the second surface 1b side to the first surface 1a side of the first heating section 1 (i.e., in the -Y axis direction). The direction in which the heating resistor 2 moves can be controlled by the control unit 200, which will be described later.

[0024] <First Heating Unit 1> The first heating unit 1 heats the object to be processed 5. More specifically, the first heating unit 1 is configured to accommodate the object to be processed 5, and the object to be processed 5 is heated by a heating resistor 2 placed inside the first heating unit 1. As a result, the object to be processed 5 is decomposed, and a processed product 6 is obtained.

[0025] The first heating section 1 has a first surface 1a and a second surface 1b. The terms "first surface 1a" and "second surface 1b" are used for convenience to explain that the heating resistor 2 is positioned to penetrate the first heating section 1, and do not indicate the orientation of the first heating section 1, such as the upper or lower part of the first heating section 1, the processing direction of the object to be processed 5, or the direction of movement of the heating resistor 2.

[0026] The material of the first heating section 1 is not particularly limited, as long as it is stable in terms of surface temperature and atmosphere on the inside of the first heating section 1, that is, on the side of the first heating section 1 that houses the object to be processed 5.

[0027] For example, if the interior of the first heating section 1 is in a nitrogen gas atmosphere and the inner surface temperature of the first heating section 1 is 400°C or less, the material of the first heating section 1 may be a metal such as iron (Fe) or titanium (Ti); alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２inorganic compounds such as ); alloys such as stainless steel, Inconel (registered trademark), Hastelloy (registered trademark), etc. can be used. These may be used alone or in combination of two or more. Among these, when the inside of the first heating unit 1 is in a nitrogen gas atmosphere and the surface temperature inside the first heating unit 1 is 400°C or lower, from the viewpoint of material cost, as the material of the first heating unit 1, iron (Fe) and general stainless steels such as SUS304, SUS304L, SUS316, SUS316L, etc. are preferable.

[0028] For example, when the inside of the first heating unit 1 is in a nitrogen gas atmosphere and the surface temperature inside the first heating unit 1 is over 400°C and 700°C or lower, as the material of the first heating unit 1, alumina (Al ２ O ３ ), zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ·2SiO ２ ) and other inorganic compounds; alloys such as stainless steel (for example, SUS316L, SUS310S, etc.), Inconel (registered trademark), Hastelloy (registered trademark), etc. can be used.

[0029] For example, when the inside of the first heating unit 1 is in a nitrogen gas atmosphere and the surface temperature inside the first heating unit 1 is over 700°C and 950°C or lower, as the material of the first heating unit 1, alumina (Al ２ O ３ ), zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ·2SiO ２ ) and other inorganic compounds; alloys such as SUS310S, (registered trademark), Hastelloy (registered trademark), etc. can be used.

[0030] For example, if the inside of the first heating section 1 is a water vapor atmosphere and the inner surface temperature of the first heating section 1 is 700°C or less, the material of the first heating section 1 is alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２ Inorganic compounds such as ) and alloys such as stainless steel (e.g., SUS316, SUS316L, SUS310S, etc.), Inconel®, and Hastelloy® can be used.

[0031] For example, if the inside of the first heating section 1 is a water vapor atmosphere and the inner surface temperature of the first heating section 1 is more than 700°C and 950°C or less, the material of the first heating section 1 is alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２ Inorganic compounds such as ) and alloys such as Inconel® and Hastelloy® can be used.

[0032] The shape, structure, and size of the first heating section 1 are not particularly limited, as long as they are capable of accommodating the object to be processed 5, and the heating resistor 2 penetrates from the first surface 1a to the second surface 1b and can be positioned to move back and forth relative to the first heating section 1.

[0033] Examples of the shape of the first heating section 1 include cylindrical, rectangular parallelepiped, tapered, and columnar, where the cross-section parallel to the first surface 1a and / or second surface 1b of the first heating section 1 is polygonal. Among these, it is preferable that the shape of the first heating section 1 is such that the cross-sectional area A of the first heating section 1 in the plane direction substantially perpendicular to the Y-axis direction, which is the direction in which the heating resistor 2 penetrates the first heating section 1, continuously decreases in the direction from the material supply section 3 to the material removal section 4, that is, the cross-sectional shape of the first heating section 1 in the Y-axis direction is tapered. When the cross-sectional shape of the first heating section 1 in the Y-axis direction is tapered, the flow velocity of the material to be processed 5 tends to increase from the material supply section 3 to the material removal section 4, improving the yield of the processed material 6 and minimizing the power consumption of the heating resistor 2.

[0034] The size of the first heating section 1 is not particularly limited, as long as it has a length and inner diameter that allows the heating resistor 2 to move freely back and forth.

[0035] Figure 1B is a schematic cross-sectional view showing an example of the first surface of the first heating section of a heat treatment apparatus according to the first embodiment of the present disclosure. Figure 1C is a schematic cross-sectional view showing an example of the second surface of the first heating section of a heat treatment apparatus according to the first embodiment of the present disclosure.

[0036] If the cross-sectional area B of the heating resistor 2 in a direction substantially perpendicular to the Y-axis direction is significantly smaller than the cross-sectional area A of the inner diameter of the first heating section 1 in a plane direction substantially perpendicular to the Y-axis direction in which the heating resistor 2 penetrates the first heating section 1, the probability of the object to be processed 5 coming into contact with the heating resistor 2 decreases, which causes a decrease in reaction efficiency. Therefore, the ratio of the cross-sectional area A of the inner diameter of the first heating section 1 to the cross-sectional area B of the heating resistor 2 [cross-sectional area A of the inner diameter of the first heating section 1 / cross-sectional area B of the heating resistor 2] is preferably 1.01 to 10.00, more preferably 1.05 to 7.50, and even more preferably 1.10 to 5.00.

[0037] <Heat-generating resistor 2> The heat-generating resistor 2 penetrates from the first surface 1a to the second surface 1b of the first heating section 1 and is positioned to move back and forth relative to the first heating section 1. Therefore, the heat-generating resistor 2 is capable of both movement in the direction from the first surface 1a to the second surface 1b of the first heating section 1, and movement in the direction from the second surface 1b to the first surface 1a of the first heating section 1.

[0038] The heating resistor 2 may operate continuously when the heat treatment apparatus 100 is in operation, or it may operate intermittently at desired timings. The operation of the heating resistor 2 can be suitably controlled by the control unit 200, which will be described later.

[0039] There are no particular restrictions on the material of the heat-generating resistor 2, and it can be appropriately selected according to the purpose, but a material that is stable at the temperature and atmosphere in which it is used is preferred. For example, if the inside of the first heating section 1 is in a nitrogen gas atmosphere, the material of the heat-generating resistor 2 can be nichrome, kanthal, tungsten, molybdenum, tantalum, etc., and can be appropriately selected according to the purpose. Also, if durability is required, such as when the inside of the first heating section 1 is in a water vapor atmosphere, tantalum can be used as the material of the heat-generating resistor 2.

[0040] Furthermore, the heating resistor 2 may be made by coating the surface of the material with a conductive ceramic such as tungsten oxide, molybdenum(VI) oxide, molybdenum disilide, lanthanum chromite, triiron tetroxide, copper(I) oxide, tin dioxide, or indium oxide, so as to stabilize it in the atmosphere inside the first heating section 1.

[0041] There are no particular restrictions on the thickness of the coating on the heat-generating resistor 2, but from the viewpoint of not hindering the electrical connection and heat conduction between the particles of the heat-generating resistor 2, it is preferably 0.001 μm to 5 μm.

[0042] There are no particular limitations on the method for coating the surface of the heat-generating resistor 2. A known method can be appropriately selected depending on the material, shape, structure, and size of the heat-generating resistor 2. For example, a method of coating with a ceramic raw material such as tungsten oxide using a spray coating method, printing method, immersion method, dispenser coating method, etc. The heat-generating resistor 2 coated with the ceramic raw material can be fired using a known method to form a ceramic coating on its surface.

[0043] Furthermore, the heating resistor 2 may be coated by a dry method such as physical vapor deposition, chemical vapor deposition, or sputtering, or the surface of the heating resistor 2 itself may be oxidized to form an oxide film of the aforementioned thickness.

[0044] The shape, structure, and size of the heating resistor 2 are not particularly limited as long as it penetrates from the first surface 1a to the second surface 1b of the first heating section 1 and can move freely in relation to the first heating section 1. They can be appropriately selected according to the purpose. Examples include thread-like, drawn wire-like, film-like, plate-like, coil-like, double helix coil-like, mesh-like, foil-like, fabric-like, film-like, and layer-like shapes. The heat treatment apparatus 100 may be equipped with one type of heating resistor 2 of these shapes, or with two or more types.

[0045] For example, if the shape of the heating resistor 2 is coil-shaped or double-helix coil-shaped, the heating resistor 2 can be arranged without gaps within the first heating section 1, making it easier for the object to be processed 5 to come into contact with the heating resistor 2, and improving the yield of the processed material 6.

[0046] There are no particular restrictions on the number of heating resistors 2 in the first heating section 1; there may be one or two or more. For example, if the heating resistor 2 is thread-shaped, two or more thread-shaped heating resistors 2 may be bundled together and used.

[0047] The length of the heating resistor 2 within the first heating section 1 (i.e., the length of the heating resistor 2 in the Y-axis direction) is not particularly limited and can be appropriately selected according to the purpose, but the value calculated by the following formula 1 is preferably 0.0001 to 5, more preferably 0.005 to 3, and even more preferably 0.001 to 0.5. [Formula 1] L Ｒ × (A - B) However, in equation 1, L Ｒ A represents the length (m) of the heating resistor 2, and A represents the cross-sectional area (m) of the first heating section 1. ２ ) is shown, and B is the cross-sectional area (m²) of the heat-generating resistor 2. ２ ) indicates.

[0048] There are no particular restrictions on the size of the cross-section of the heat-generating resistor 2 in the direction perpendicular to its length (i.e., the cross-section of the XZ plane), and it can be appropriately selected according to the purpose. However, a larger size is preferable in that it provides higher durability against tension during the operation of the heat-generating resistor 2. On the other hand, keeping the size of the cross-section of the heat-generating resistor 2 in the direction perpendicular to its length (i.e., the cross-section of the XZ plane) within a certain size makes manufacturing and installation easier, so 0.01 cm is preferable. ２ ~500cm ２ Preferably, 0.05 cm ２ ~300cm ２ More preferably, 0.1 cm ２ ~250cm ２ That is even more preferable.

[0049] The amount of deflection of the heat-generating resistor 2 is, in the longitudinal direction of the heat-generating resistor 2, the length L of the heat-generating resistor 2. Ｒ It is preferable that the deflection is 20% or less, more preferably 15% or less, and even more preferably 10% or less. Furthermore, in the direction perpendicular to the length of the heating resistor 2, it is preferable that the deflection is 50% or less, and more preferably 20% or less, of the distance between the outer circumference of the portion with the largest area in the cross-section of the XZ plane of the heating resistor 2 and the inner surface of the first heating section 1. In any direction, the smaller the deflection, the better, and it may even be substantially 0%. The shape of the heating resistor 2 is preferably selected in conjunction with the method of supporting the heating resistor 2 so as to satisfy these deflection amounts.

[0050] A catalyst may be supported on the surface of the heat-retaining resistor 2, depending on the purpose of the heat treatment. There are no particular restrictions on the type of catalyst, but when the material to be treated 5 is one or more selected from the group consisting of naphtha, hydrocarbons, plastics, and biomass, and the material to be treated 6 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, examples of catalysts include various zeolites and fluid catalytic cracking (FCC) catalysts. The catalyst supported on the surface of the heat-retaining resistor 2 may be an unused catalyst or a catalyst that has been used in heat treatment one or more times.

[0051] <Processing Material Supply Unit 3> The processing material supply unit 3 is connected to the first heating unit 1 and supplies the processing material 5 to the first heating unit 1.

[0052] In this disclosure, "connection" of the material to be processed supply unit 3 to the first heating unit 1 means that the inside of the material to be processed supply unit 3 and the inside of the first heating unit 1 are in communication so that the material to be processed 5 can pass through them.

[0053] There are no particular restrictions on the material of the material supply unit 3 to be processed; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0054] The shape, structure, and size of the material supply unit 3 are not particularly limited as long as it can be connected to the first heating unit 1 and supply the material to be processed 5 to the first heating unit 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the first heating unit 1 has an opening, this opening can be used as the material supply unit 3.

[0055] The position of the material to be processed supply unit 3 is not particularly restricted as long as it can be connected to the first heating unit 1, and can be appropriately selected according to the type of material to be processed 5. In Figure 1A, the material to be processed supply unit 3 is shown to be placed on the side surface of the first heating unit 1 near the first surface 1a of the first heating unit 1, but the material to be processed supply unit 3 may be placed at any position on the side surface of the first heating unit 1, or on the first surface 1a of the first heating unit 1, or on the second surface 1b of the first heating unit 1.

[0056] -Materials to be processed 5- There are no particular restrictions on materials to be processed 5, and they can be appropriately selected according to the purpose. Examples include naphtha, hydrocarbons, plastics, and biomass.

[0057] <Processed material removal unit 4> The processed material removal unit 4 is connected to the first heating unit 1 and removes the processed material 6 that has been processed in the first heating unit 1.

[0058] In this disclosure, "connection" of the processed material removal section 4 to the first heating section 1 means that the inside of the processed material removal section 4 and the inside of the first heating section 1 are in communication so that the processed material 6 can pass through them.

[0059] There are no particular restrictions on the material of the processed material removal section 4; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0060] The shape, structure, and size of the processed material removal section 4 are not particularly limited as long as the processed material 6 processed in the first heating section 1 can be removed, and can be appropriately selected according to the purpose. Examples include cylindrical shapes and rectangular parallelepipeds. Furthermore, if a part of the first heating section 1 has an opening, this opening can also be used as the processed material removal section 4.

[0061] The position of the material removal section 4 is not particularly restricted as long as it can be connected to the first heating section 1, and can be appropriately selected according to the type of material to be processed 6. Figure 1A shows the material removal section 4 being placed on the side surface of the first heating section 1 near the second surface 1b of the first heating section 1, but the material removal section 4 may be placed at any position on the side surface of the first heating section 1, or on the first surface 1a of the first heating section 1, or on the second surface 1b of the first heating section 1.

[0062] In the first heating section 1, processed material 6 is generated from the material to be processed 5, so the material to be processed 5 and processed material 6 may be mixed within the first heating section 1. Therefore, the processed material removal section 4 may remove not only the processed material 6 but also a mixture of processed material 6 and the material to be processed 5. Furthermore, if by-products are generated within the first heating section 1, the processed material removal section 4 may also remove the by-products.

[0063] Furthermore, when the first heating unit 1 is used as a batch reaction vessel, the material supply unit 3 and the material removal unit 4 may be the same. That is, a single component located in the same position may serve as both the material supply unit 3, which supplies the material 5 to the first heating unit 1, and the material removal unit 4, which removes the material 6 processed in the first heating unit 1. In this case, both the supply speed adjustment unit 11 and the removal speed adjustment unit 13, which will be described later, are also a single component located in the same position.

[0064] -Processed Material 6- There are no particular restrictions on processed material 6, and it can be appropriately selected depending on the type of object to be processed 5. For example, if the object to be processed 5 is plastic, processed material 6 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. Therefore, the heat treatment apparatus 100 can be suitably used as a production apparatus for at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. In the case of the object to be processed 5 being plastic, processed material 6 may also contain by-products in addition to at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, but in that case, processed material 6 will include at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons and the by-products.

[0065] <Other Components> Other components are not particularly limited as long as they do not impair the effects of the heat treatment apparatus according to the first embodiment of this disclosure. Examples include the exterior 7, the sealing portion 8, the current introduction terminal 9, the temperature measuring sensor 10, the supply speed adjustment unit 11, the supply speed sensor 12, the extraction speed adjustment unit 13, the extraction speed sensor 14, and the control unit 200.

[0066] -Outer Covering 7- The outer covering 7 is connected to the first heating section 1 and surrounds the heat-generating resistor 2 outside the first heating section 1. This protects the heat-generating resistor 2 outside the first heating section 1. In addition, since the heat-generating resistor 2 is not exposed, the heat treatment apparatus 100 is easy to handle.

[0067] In order to position the heat-generating resistor 2 so that it can move back and forth relative to the first heating section 1, it is preferable that the heat-generating resistor 2 is connected to the outside of the first heating section 1. For this reason, it is preferable that the heat treatment apparatus 100 according to the first embodiment has an outer casing 7.

[0068] In this disclosure, "connecting" the outer casing 7 to the first heating unit 1 means that the inside of the outer casing 7 and the inside of the first heating unit 1 are in communication such that the heating resistor 2 can move freely back and forth.

[0069] There are no particular restrictions on the material of the outer casing 7; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0070] The shape, structure, and size of the outer casing 7 are not particularly limited as long as it can be connected to the first heating section 1 and enclose the heat-generating resistor 2 outside the first heating section 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped.

[0071] There are no particular restrictions on the number of outer casings 7, but it is preferable to have two: one outer casing 7 connected to the first heating section 1 from the first surface 1a side of the first heating section 1, and another outer casing 7 connected to the first heating section 1 from the second surface 1b side of the first heating section 1.

[0072] -Seal portion 8- The seal portion 8 seals the space between the first surface 1a or the second surface 1b of the first heating portion 1 and the outer casing 7. The presence of the seal portion 8 in the heat treatment apparatus 100 according to the first embodiment is preferable because it prevents the object to be processed 5 and the processed material 6 from leaking out of the first heating portion 1.

[0073] There are no particular restrictions on the material of the sealing portion 8, and it can be appropriately selected depending on the purpose. However, it is preferable that the material has thermal resistance to the temperature of the heating resistor 2, as well as resistance to the object to be processed 5 and the processed object 6. For example, a member that can generate a sealing gas such as nitrogen gas can be used.

[0074] There are no particular restrictions on the shape, structure, and size of the sealing portion 8, and they can be appropriately selected according to the purpose. However, it is preferable that the shape, structure, and size allow the heating resistor 2 to move freely in relation to the first heating portion 1, and that the object to be processed 5 and the processed material 6 do not leak out of the first heating portion 1.

[0075] Specific examples of the seal section 8 include the gas seal unit GU-10 series, GU-25 series (both manufactured by Kaneko Sangyo Co., Ltd.), N ２ Examples include the blanketing system (manufactured by Iwatani Corporation).

[0076] -Current Inlet Terminal 9- The current inlet terminal 9 is electrically connected to the heating resistor 2 and applies current to the heating resistor 2. When the current inlet terminal 9 applies current to the heating resistor 2, the heating resistor 2 heats up.

[0077] The current input terminal 9 can be appropriately selected from known options, for example, a known current input terminal such as a field-through terminal (manufactured by Cosmo-Tec Co., Ltd.) can be used.

[0078] The number of current input terminals 9 is two or more.

[0079] Furthermore, there are no particular restrictions on the material used for the electrical connection between the current input terminal 9 and the heating resistor 2, but it is preferable to use a material that has conductivity and sliding properties. For example, carbon brushes commonly used in motors (e.g., manufactured by Fuji Carbon Manufacturing Co., Ltd.), ceramics, metals, etc., can be used.

[0080] The current input terminal 9 is electrically connected to a current circuit (not shown), and the current circuit is electrically connected to a current generator (not shown).

[0081] The current applied to the heating resistor 2 may be a direct current or an alternating current, but from the viewpoint of minimizing energy consumption during temperature control, it is preferable to use the AC current without rectification when using commercial power.

[0082] There are no particular restrictions on the maximum current applied to the heating resistor 2, and it can be appropriately selected according to the desired temperature in the first heating section 1, the size (diameter, thickness, etc.) of the heating resistor 2, the tension of the heating resistor 2, etc.

[0083] -Temperature Sensor 10- The temperature sensor 10 measures the temperature of the heat-generating resistor 2. The temperature detection signal from the temperature sensor 10 is preferably transmitted to the first temperature controller 206a of the control unit 200. The presence of the temperature sensor 10 in the heat treatment apparatus 100 is preferable because the first temperature controller 206a can provide feedback control over the temperature of the heat-generating resistor 2.

[0084] There are no particular restrictions on the temperature sensor 10, as long as it can accurately measure the temperature of the heat-generating resistor 2. Here, the diagram shows the temperature sensor 10 in contact with the heat-generating resistor 2 to measure the temperature, but it is not limited to this, and the temperature sensor 10 may measure the temperature without contacting the heat-generating resistor 2.

[0085] If the temperature sensor 10 measures temperature by contacting the heat-generating resistance element 2, examples include thermocouples and platinum thermometers.

[0086] If the temperature sensor 10 measures temperature without contact with the heat-generating resistance element 2, examples include a radiation thermometer and an infrared thermographic camera.

[0087] - Supply Speed ​​Adjustment Unit 11 - The supply speed adjustment unit 11 adjusts the supply speed at which the material to be processed supply unit 3 supplies the material to be processed 5 to the first heating unit 1, or stops the material to be processed supply unit 3 from supplying the material to be processed 5 to the first heating unit 1.

[0088] For example, a known pump, a cock, etc., can be used as the supply speed adjustment unit 11.

[0089] The rate at which the material to be processed 5 is supplied to the first heating unit 1 by the supply rate adjustment unit 11 can be adjusted by the supply rate controller 206b of the control unit 200, which will be described later.

[0090] - Supply Speed ​​Sensor 12 - The supply speed sensor 12 measures the supply speed of the material to be processed 5 by the supply speed adjustment unit 11. There are no particular restrictions on the supply speed sensor 12 as long as it can accurately measure the supply speed of the material to be processed 5 by the supply speed adjustment unit 11. For example, a known flow sensor for liquids or gases can be used.

[0091] The supply speed detection signal from the supply speed sensor 12 is suitably transmitted to the supply speed controller 206b of the control unit 200. The heat treatment apparatus 100 is preferable because it has a supply speed sensor 12, which improves the yield of the processed material 6 and minimizes the power consumption of the heating resistor 2, and the supply speed controller 206b can provide feedback control of the supply speed of the processed material supply unit 3.

[0092] -Removal speed adjustment unit 13- The removal speed adjustment unit 13 adjusts the removal speed at which the processed material removal unit 4 removes the processed material 6 from the first heating unit 1, or stops the processed material removal unit 4 from removing the processed material 6 from the first heating unit 1.

[0093] For example, a known pump, a cock, etc., can be used as the extraction speed adjustment unit 13.

[0094] The speed at which the material 6 is removed from the first heating unit 1 by the removal speed adjustment unit 13 can be adjusted by the removal speed controller 206c of the control unit 200, which will be described later.

[0095] By adjusting the supply of the material to be processed 5 to the first heating section 1 by the supply speed adjustment unit 11 and the removal of the material to be processed 6 from the first heating section 1 by the removal speed adjustment unit 13, the first heating section 1 can be used as a batch reaction vessel or a continuous reaction vessel.

[0096] For example, by stopping the removal of the material 6 from the first heating unit 1 by the removal speed adjustment unit 13, supplying a certain amount of the material to be processed 5 to the first heating unit 1 by the supply speed adjustment unit 11, then stopping the supply of the material to be processed 5 to the first heating unit 1 by the supply speed adjustment unit 11, and then heating the material to be processed 5 with the heating resistor 2, the first heating unit 1 can be used as a batch reaction vessel to perform a batch reaction.

[0097] Furthermore, for example, if the removal speed adjustment unit 13 continuously removes the processed material 6 from the first heating unit 1, while the supply speed adjustment unit 11 continuously supplies the material to be processed 5 to the first heating unit 1, the first heating unit 1 can be used as a continuous reaction tank to carry out a continuous reaction.

[0098] - Dispensing Speed ​​Sensor 14 - The dispensing speed sensor 14 measures the dispensing speed of the processed material 6 by the dispensing speed adjustment unit 13. There are no particular restrictions on the dispensing speed sensor 14 as long as it can accurately measure the dispensing speed of the processed material 6 by the dispensing speed adjustment unit 13. For example, a known flow sensor for liquids or gases can be used.

[0099] The extraction speed detection signal from the extraction speed sensor 14 is suitably transmitted to the extraction speed controller 206c of the control unit 200. The inclusion of the extraction speed sensor 14 in the heat treatment apparatus 100 is preferable because it improves the yield of the processed material 6 and minimizes the power consumption of the heating resistor 2, and the extraction speed controller 206c can provide feedback control of the extraction speed of the processed material extraction unit 4.

[0100] -Control Unit 200- Figure 1D is a block diagram showing an example of the control unit of a heat treatment apparatus according to the first embodiment of the present disclosure.

[0101] The control unit 200 optimally controls each component of the heat treatment apparatus 100. For example, depending on the type of object to be processed 5, it controls each component based on processing recipe data 208 consisting of processing conditions such as the amount of current applied by the current circuit to the heating resistor 2, the operating direction of the heating resistor 2, the temperature of the heating resistor 2, the speed at which the object to be processed 5 is supplied to the first heating unit 1 by the supply speed adjustment unit 11, and the speed at which the processed object 6 is removed from the first heating unit 1 by the removal speed adjustment unit 13.

[0102] The control unit 200 includes, for example, a CPU (Central Processing Unit) 201, a memory 202, a display unit 203, an input / output unit 204, a communication unit 205, various controllers 206, and a storage unit 207.

[0103] The CPU 201 reads various programs and data necessary for program execution from the storage unit 207 as needed and uses them.

[0104] Memory 202 is used for various processes performed by the CPU 201.

[0105] The display unit 203 is a liquid crystal display that displays the operation screen, selection screen, etc., of the heat treatment apparatus 100.

[0106] The input / output unit 204 consists of an operation panel, keyboard, etc., for the operator to perform various operations such as inputting various data and outputting various data to a predetermined storage medium. For example, the operator can input the direction and timing of the operation of the heating resistor 2.

[0107] The communications unit 205 handles data exchange via networks and other means.

[0108] The various controllers 206 control various parts of the heat treatment apparatus 100. Examples of the various controllers 206 include a first temperature controller 206a, a supply rate controller 206b, and a removal rate controller 206c.

[0109] The first temperature controller 206a controls the temperature of the heating resistor 2 in the first heating unit 1 by controlling the amount of current applied to the heating resistor 2 in the first heating unit 1. The first temperature controller 206a can use semiconductor-based phase control, semiconductor-based PWM (Pulse Width Modulation) control, etc. Furthermore, the first temperature controller 206a can take in the temperature detection signal from the temperature sensor 10 of the heating resistor 2 in the first heating unit 1 and feedback control the amount of current applied to the heating resistor 2 in the first heating unit 1 using PID (Proportional-Integral-Differental) control or on-off control. Among these, PID control is preferred for the first temperature controller 206a from the viewpoint of suppressing temperature overshoot in the heating resistor 2 in the first heating unit 1 and suppressing side reactions at high temperatures.

[0110] The supply speed controller 206b controls the supply speed of the object to be processed 5 to the first heating unit 1 by the supply speed adjustment unit 11. The supply speed controller 206b receives the supply speed detection signal from the supply speed sensor 12 and can feedback control the supply speed of the object to be processed 5 using PID control or on-off control.

[0111] The removal speed controller 206c controls the removal speed of the processed material 6 from the first heating unit 1 by the removal speed adjustment unit 13. The removal speed controller 206c receives the removal speed detection signal from the removal speed sensor 14 and can feedback control the removal speed of the processed material 6 using PID control or on-off control.

[0112] The memory unit 207 consists of a hard disk drive (HDD) and other components that store various programs executed by the CPU 201 and data necessary for program execution.

[0113] Next, a specific example of the operation of the heat treatment apparatus 100 according to the first embodiment will be described. First, the object to be processed 5 is supplied from the object to be processed supply unit 3 into the first heating unit 1. At this time, the supply speed adjustment unit 11 adjusts the supply speed of the object to be processed 5 into the first heating unit 1. The supply speed of the object to be processed 5 is measured by the supply speed sensor 12, and the supply speed detection signal is transmitted to the supply speed controller 206b of the control unit 200.

[0114] The object to be processed 5 supplied into the first heating unit 1 comes into contact with the heat-generating resistor 2 and is heated. At this time, the temperature of the heat-generating resistor 2 is measured by the temperature sensor 10. The temperature detection signal from the temperature sensor 10 is suitably transmitted to the first temperature controller 206a of the control unit 200. Inside the first heating unit 1, the object to be processed 5 is heated and processed material 6 is generated.

[0115] If the temperature of the heating resistor 2 is not constant, the amount of current applied to the current input terminal 9 is adjusted by feedback control by the first temperature controller 206a of the control unit 200 so that the temperature of the heating resistor 2 becomes constant. Also, if the temperature of the heating resistor 2 is to be lowered or raised, the amount of current applied to the current input terminal 9 is adjusted so that the desired temperature is achieved by changing the input value to the input / output unit 204 by the operator.

[0116] In the case of a batch reaction, the processed material removal unit 4 operates after a desired time has elapsed since the supply of the material to be processed 5. In the case of a continuous reaction, the processed material removal unit 4 operates together with the processed material supply unit 3. As a result, the processed material 6 is removed from the processed material removal unit 4. At this time, the removal speed adjustment unit 13 adjusts the removal speed of the processed material 6 from the first heating unit 1. The removal speed of the processed material 6 is measured by the removal speed sensor 14, and the removal speed detection signal is transmitted to the removal speed controller 206c of the control unit 200.

[0117] In a continuous reaction, if the supply rate of the material to be processed 5 exceeds the removal rate of the material to be processed 6, and the material to be processed 5 in the first heating unit 1 is likely to overflow, feedback control slows down the supply rate of the material to be processed 5 or speeds up the removal rate of the material to be processed 6. This allows a constant amount of the material to be processed 5 to come into contact with the heating resistor 2.

[0118] In the series of reactions described above, the heating resistor 2 moves intermittently or continuously, freely moving forward and backward relative to the first heating section 1. The operation of the heating resistor 2 is performed based on data input by the operator to the input / output section 204. For example, if the heating resistor 2 is stopped during the series of reactions, the heating resistor 2 will operate when deterioration and / or coking of the heating resistor 2 is detected, and the heating resistor 2 within the first heating section 1 will be replaced with a region of the heating resistor 2 that is not deteriorated and / or coked. This allows the heat treatment apparatus 100 to operate continuously and stably. As another example, if the heating resistor 2 operates continuously during the series of reactions, deterioration and / or coking of the heating resistor 2 can be prevented, and the heat treatment apparatus 100 can operate continuously and stably.

[0119] These operations can be stored in the memory unit 207, and the desired reaction conditions can be read from the memory unit 207 and used as appropriate.

[0120] In this way, the heat treatment apparatus 100 according to the first embodiment can operate stably for a long time, efficiently thermally decompose the object to be treated 5, and prevent deterioration due to heat.

[0121] [Second Embodiment] The heat treatment apparatus according to the second embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it includes a winding section 20 instead of an outer casing 7. Figure 2A is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the second embodiment of the present disclosure.

[0122] <Winding section 20> The winding section 20 winds up the heat-generating resistor 2. There are no particular restrictions on the number of winding sections 20; there may be one or two or more. However, it is preferable to have two winding sections 20: one for winding up the heat-generating resistor 2 from the first surface 1a side of the first heating section 1, and another for winding up the heat-generating resistor 2 from the second surface 1b side of the first heating section 1.

[0123] The winding unit 20 preferably comprises a winding drum 21 and a gear 22. The winding unit 20 drives the winding drum 21 with the gear 22, thereby winding the heating resistor 2 onto the winding drum 21. This makes it easy to replace the heating resistor 2 inside the first heating unit 1 with the heating resistor 2 outside the first heating unit 1.

[0124] There are no particular restrictions on the material of the winding section 20, the winding drum 21, and the gear 22, and they can be appropriately selected according to the purpose. For example, they can be appropriately selected from the same materials as the first heating section 1, depending on the purpose. Among these, the material of the winding section 20, the winding drum 21, and the gear 22 is preferably a metal such as iron or titanium from the viewpoint of heat resistance.

[0125] The shape, structure, and size of the winding section 20 are not particularly limited, as long as they can accommodate the winding drum 21 and the gear 22 and allow the heat-generating resistor 2 to be wound onto the winding drum 21. Examples include cylindrical shapes and rectangular parallelepipeds.

[0126] For example, a V-sheave (manufactured by Sanko Mechanics Co., Ltd.) can be used as the winding drum 21. For example, a magnetic coupling (manufactured by Miki Pulley Co., Ltd.) can be used as the gear 22.

[0127] In the heat treatment apparatus 100 according to the second embodiment, the winding section 20 and the first heating section 1 may be connected via the sealing section 8, or they may be directly connected.

[0128] If the heat treatment apparatus 100 according to the second embodiment has a sealing portion 8, the sealing portion 8 seals the space between the first surface 1a or the second surface 1b of the first heating portion 1 and the winding portion 20.

[0129] In the heat treatment apparatus 100 according to the second embodiment, if the sealing portion 8 is not present and the winding portion 20 and the first heating portion 1 are directly connected, a space, for example, a hole, is provided between the winding portion 20 and the first heating portion 1 through which the heat-generating resistor 2 can move freely.

[0130] In the heat treatment apparatus 100 according to the second embodiment, it is preferable that the current input terminal 9 is electrically connected to the gear 22.

[0131] <Other Components> In the heat treatment apparatus 100 according to the second embodiment of this disclosure, other components may include, for example, the control unit 200 having a winding controller 206d.

[0132] Figure 2B is a block diagram showing an example of a control unit of a heat treatment apparatus according to a second embodiment of the present disclosure.

[0133] - Winding Controller 206d - The winding controller 206d controls the drive, rotation speed, and rotational speed of the drum 21. The winding controller 206d can take in input data related to the winding unit 20 from the operator in the input / output unit 204, or a temperature detection signal from the temperature sensor 10 of the heating resistor 2, and control the winding of the heating resistor 2 to the winding unit 20 using PID control or on-off control.

[0134] If the heating resistor 2 deteriorates or becomes coated with coking, it becomes more difficult to control the temperature to the desired level compared to when the heating resistor 2 is not deteriorated or coated. Therefore, the first temperature controller 206a takes in the temperature detection signal from the temperature sensor 10 of the heating resistor 2 and, through feedback control, if the temperature of the heating resistor 2 does not rise or rises slowly even when the amount of current applied to the heating resistor 2 is increased, or if the temperature of the heating resistor 2 does not decrease or decreases slowly even when the amount of current applied to the heating resistor 2 is decreased through feedback control by the first temperature controller 206a, the winding controller 206d takes in the temperature detection signal, the winding unit 20 operates and winds the heating resistor 2 onto the winding drum 21.

[0135] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the second embodiment, highlighting the differences from the heat treatment apparatus 100 according to the first embodiment.

[0136] In the heat treatment apparatus 100 according to the second embodiment, the intermittent or continuous movement of the heat-generating resistor 2 in a series of reactions, which is free to move forward and backward relative to the first heating section 1, is performed by driving the gear 22 and the winding drum 21 in the winding section 20. This makes it possible to replace the heat-generating resistor 2 in the first heating section 1 with a region of the heat-generating resistor 2 that is free from deterioration and / or coking.

[0137] [Third Embodiment] The heat treatment apparatus according to the third embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises an inert gas supply unit 30. Figure 3A is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the third embodiment of the present disclosure. The heat treatment apparatus according to the third embodiment may further comprise the winding unit 20 described in the heat treatment apparatus according to the second embodiment instead of the outer casing 7.

[0138] <Inert Gas Supply Unit 30> The inert gas supply unit 30 is connected to the first heating unit 1 and supplies inert gas 31 to the first heating unit 1.

[0139] In this disclosure, "connecting" the inert gas supply unit 30 to the first heating unit 1 means that the inside of the inert gas supply unit 30 and the inside of the first heating unit 1 are in communication so that the inert gas 31 can pass through them.

[0140] There are no particular restrictions on the material of the inert gas supply unit 30; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0141] The shape, structure, and size of the inert gas supply unit 30 are not particularly limited as long as it can be connected to the first heating unit 1 and supply inert gas 31 to the first heating unit 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the first heating unit 1 has an opening, this opening can be used as the inert gas supply unit 30.

[0142] There are no particular restrictions on the position of the inert gas supply unit 30, as long as it can be connected to the first heating unit 1, and it can be appropriately selected according to the type of object to be processed 5. In Figure 3A, the inert gas supply unit 30 is shown to be placed on the side surface of the first heating unit 1 near the first surface 1a of the first heating unit 1, but the inert gas supply unit 30 may be placed at any position on the side surface of the first heating unit 1, on the first surface 1a of the first heating unit 1, or on the second surface 1b of the first heating unit 1.

[0143] Note that the material to be processed supply unit 3 and the inert gas supply unit 30 may be the same. That is, a single component located at the same position may be both the material to be processed supply unit 3, which supplies the material to be processed 5 to the first heating unit 1, and the inert gas supply unit 30, which supplies the inert gas 31 to the first heating unit 1. In this case, both the supply speed adjustment unit 11 and the inert gas supply speed adjustment unit 32, which will be described later, are a single component located at the same position.

[0144] -Inert Gas- There are no particular restrictions on the type of inert gas, and it can be appropriately selected according to the purpose. Examples include nitrogen gas, argon gas, and water vapor. These may be used individually or in combination of two or more.

[0145] <Other components> The heat treatment apparatus 100 according to the third embodiment of this disclosure may also include other components such as an inert gas supply rate adjustment unit 32, an inert gas supply rate sensor 33, and an inert gas supply rate controller 206e.

[0146] Figure 3B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the third embodiment of the present disclosure.

[0147] -Inert gas supply rate adjustment unit 32- The inert gas supply rate adjustment unit 32 adjusts the supply rate at which the inert gas supply unit 30 supplies inert gas 31 to the first heating unit 1, or stops the supply of inert gas 31 to the first heating unit 1 by the inert gas supply unit 30.

[0148] For example, a known pump, a cock, or the like can be used as the inert gas supply rate adjustment unit 32.

[0149] The rate at which the inert gas 31 is supplied to the first heating unit 1 by the inert gas supply rate adjustment unit 32 can be adjusted by the inert gas supply rate controller 206e of the control unit 200.

[0150] -Inert Gas Supply Rate Sensor 33- The inert gas supply rate sensor 33 measures the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32. There are no particular restrictions on the inert gas supply rate sensor 33 as long as it can accurately measure the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32. For example, a known flow sensor for liquids or gases can be used.

[0151] -Inert Gas Supply Rate Controller 206e- The inert gas supply rate controller 206e controls the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 32. The inert gas supply rate controller 206e receives the inert gas supply rate detection signal from the inert gas supply rate sensor 33 and can feedback control the amount of inert gas 31 supplied by PID control or on-off control.

[0152] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the third embodiment, highlighting the differences from the heat treatment apparatus 100 according to the first or second embodiment.

[0153] First, inert gas 31 is supplied from the inert gas supply unit 30 into the first heating unit 1. At this time, the inert gas supply rate adjustment unit 32 adjusts the supply rate of inert gas 31 into the first heating unit 1. The supply rate of inert gas 31 is measured by the inert gas supply rate sensor 33, and the inert gas supply rate detection signal is transmitted to the inert gas supply rate controller 206e of the control unit 200.

[0154] The inert gas 31 supplied into the first heating section 1 generates turbulence around the object to be processed 5. As a result, the object to be processed 5 comes into contact with the heating resistor 2 at a high frequency, further improving the production efficiency of the processed material 6.

[0155] The inert gas 31 supplied into the first heating section 1 is discharged to the outside of the first heating section 1 from the processed material removal section 4 together with the processed material 6. Therefore, in the heat treatment apparatus 100 according to the third embodiment, the inert gas 31 is discharged from the processed material removal section 4 along with the removal of the processed material 6. For this reason, the discharge rate of the inert gas 31 from the processed material removal section 4 is adjusted by the removal rate adjustment section 13 together with the removal rate of the processed material 6 from the first heating section 1. The removal rates of the processed material 6 and the inert gas 31 are measured by the removal rate sensor 14, and the removal rate detection signal is transmitted to the removal rate controller 206c of the control unit 200.

[0156] [Fourth Embodiment] The heat treatment apparatus according to the fourth embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises a second heating section 40. Furthermore, in the heat treatment apparatus according to the fourth embodiment of the present disclosure, it is preferable that the heating resistor 2 is endless. Figure 4A is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the fourth embodiment of the present disclosure.

[0157] Furthermore, the heat treatment apparatus according to the fourth embodiment may further include the winding unit 20 described in the heat treatment apparatus according to the second embodiment and the inert gas supply unit 30 described in at least one of the heat treatment apparatus according to the third embodiment. The heat treatment apparatus 100 according to the fourth embodiment, which includes the winding unit 20 and the inert gas supply unit 30, will be described below.

[0158] <Second Heating Section 40> The second heating section 40 heats the carbon adhering to the heat-generating resistor 2. More specifically, the second heating section 40 heats the heat-generating resistor 2, which is placed inside the second heating section 40, thereby heating and removing the carbon adhering to the heat-generating resistor 2. Therefore, the heat treatment apparatus 100 according to the fourth embodiment can be suitably used when a material to be treated 5 that is easily caulked to the heat-generating resistor 2 is used, for example, when the material to be treated 5 is plastic.

[0159] The second heating section 40 has a first surface 40a and a second surface 40b. The terms "first surface 40a" and "second surface 40b" are used for convenience to explain that the heating resistor 2 is positioned to penetrate the second heating section 40, and do not indicate the orientation of the second heating section 40, such as the upper or lower part of the second heating section 40, or the direction of movement of the heating resistor 2.

[0160] The material of the second heating section 40 is not particularly limited as long as it is stable in terms of surface temperature and atmosphere on the inside of the second heating section 40, that is, on the side of the second heating section 40 that houses the heat-generating resistor 2. It can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0161] The shape, structure, and size of the second heating section 40 are not particularly limited, as long as the heating resistor 2 penetrates from the first surface 40a to the second surface 40b and can be positioned to move back and forth relative to the second heating section 40.

[0162] Examples of the shape of the second heating section 40 include a cylindrical shape, a rectangular parallelepiped, a tapered shape, and a columnar shape in which the cross-section parallel to at least one of the first surface 40a and the second surface 40b of the second heating section 40 is polygonal.

[0163] The size of the second heating section 40 is not particularly limited, as long as it has a length and inner diameter that allows the heating resistor 2 to move freely back and forth.

[0164] Figure 4B is a schematic cross-sectional view showing an example of the first surface of the second heating section of the heat treatment apparatus according to the fourth embodiment of this disclosure. Figure 4C is a schematic cross-sectional view showing an example of the second surface of the second heating section of the heat treatment apparatus according to the fourth embodiment of this disclosure.

[0165] <Heat-generating resistor 2> In the heat treatment apparatus 100 according to the fourth embodiment of the present disclosure, the heat-generating resistor 2 is preferably endless. When the heat-generating resistor 2 is endless, the heat-generating resistor 2 penetrates from the first surface 1a of the first heating section 1 to the second surface 1b of the first heating section 1 and is arranged to move back and forth relative to the first heating section 1, and penetrates from the first surface 40a of the second heating section 40 to the second surface 40b of the second heating section 40 and is arranged to move back and forth relative to the second heating section 40.

[0166] Specifically, the heating resistor 2 moves in the direction from the first surface 1a of the first heating section 1 to the first surface 40a of the second heating section 40, and also moves in the direction from the second surface 40b of the second heating section 40 to the second surface 1b of the first heating section 1, or moves in the direction from the second surface 1b of the first heating section 1 to the second surface 40b of the second heating section 40, and also moves in the direction from the first surface 40a of the second heating section 40 to the first surface 1a of the first heating section 1.

[0167] Therefore, it is preferable that the operation of the heating resistor 2 in the first heating section 1 and the operation of the heating resistor 2 in the second heating section 40 proceed simultaneously. However, the heating resistor 2 in the first heating section 1 may be wound onto one winding drum 21, and the heating resistor 2 in the second heating section 40 may not operate at this time, or the heating resistor 2 in the second heating section 40 may be wound onto another winding drum 21, and the heating resistor 2 in the first heating section 1 may not operate at this time.

[0168] The length of the heating resistor 2 within the second heating section 40 is not particularly limited as long as it can heat and remove the carbon attached to the heating resistor 2, and can be appropriately selected depending on the purpose.

[0169] There are no particular restrictions on the number of winding sections 20, but from the viewpoint of suitably operating the endless heat-generating resistor 2, two or more are preferred, three or more are more preferred, and four or more are even more preferred.

[0170] In the case of multiple winding sections 20, the gears 22 in one winding section 20 may be electrically connected to the current input terminal 9, or two or more gears 22 in winding sections 20 may be electrically connected to the current input terminal 9. For example, if there are gears 22a, 22b, 22c, and 22d in four winding sections 20, and the gear 22a in the winding section 20 located on the first surface 1a side of the first heating section 1 is electrically connected to the current input terminal 9, and the gear 22c in the winding section 20 located opposite the gear 22a is also electrically connected to the current input terminal 9, then the heating resistor 2 moves from the first surface 1a side to the second surface 1b side of the first heating section 1, allowing the current input terminal 9 electrically connected to the gear 22a to suitably control the temperature of the heating resistor 2 in the first heating section 1. Furthermore, the current input terminal 9 electrically connected to the gear 22c can suitably control the temperature of the heating resistor 2 in the second heating section 40.

[0171] The temperature of the heat-generating resistor 2 in the first heating section 1 and the temperature of the heat-generating resistor 2 in the second heating section 40 may be the same or different.

[0172] For example, if the object to be processed 5 is plastic, the temperature inside the second heating section 40 is preferably 500°C to 1,000°C, more preferably 550°C to 950°C, and even more preferably 600°C to 900°C, from the viewpoint of heating and removing the carbon derived from the plastic attached to the heating resistor 2.

[0173] <Other Components> The heat treatment apparatus 100 according to the fourth embodiment of the present disclosure may have other components, for example, the second heating unit 40 may have a sealing unit 8 and a temperature measuring sensor 10, similar to the first heating unit 1, and the control unit 200 may have a second temperature controller 206f.

[0174] Figure 4D is a block diagram showing an example of a control unit of a heat treatment apparatus according to the fourth embodiment of the present disclosure.

[0175] -Sealing section 8- The sealing section 8 seals the space between the first surface 1a or the second surface 1b of the first heating section 1 and the winding section 20, and further seals the space between the first surface 40a or the second surface 40b of the second heating section 40 and the winding section 20.

[0176] -Temperature Sensor 10- In addition to the temperature sensor 10 that measures the temperature of the heat-generating resistor 2 in the first heating section 1, it is preferable to have a temperature sensor 10 that measures the temperature of the heat-generating resistor 2 in the second heating section 40. The temperature detection signal from the temperature sensor 10 in the second heating section 40 is preferably transmitted to the second temperature controller 206f of the control unit 200. It is preferable for the heat treatment apparatus 100 to have a temperature sensor 10 in the second heating section 40 in order that the temperature of the heat-generating resistor 2 can be feedback controlled by the second temperature controller 206f.

[0177] -Second Temperature Controller 206f- The second temperature controller 206f controls the temperature of the heating resistor 2 in the second heating unit 40 by controlling the amount of current applied to the heating resistor 2 in the second heating unit 40. The second temperature controller 206f can use semiconductor-based phase control, semiconductor-based PWM control, etc. Furthermore, the second temperature controller 206f can take in the temperature detection signal from the temperature sensor 10 of the heating resistor 2 in the second heating unit 40 and feedback control the amount of current applied to the heating resistor 2 in the second heating unit 40 using PID control or on-off control. Among these, PID control is preferred for the second temperature controller 206f from the viewpoint of suppressing temperature overshoot in the heating resistor 2 in the second heating unit 40 and suppressing side reactions at high temperatures.

[0178] Next, we will describe specific examples of the operation of the heat treatment apparatus 100 according to the fourth embodiment, highlighting the differences from the heat treatment apparatus 100 according to the first, second, or third embodiment.

[0179] In the heat treatment apparatus 100 according to the fourth embodiment, the heating resistor 2 is preferably endless, so it is preferable that the heating resistor 2 operates by driving four winding sections 20, which are a drum 21 having a gear 22a, a drum 21 having a gear 22b, a drum 21 having a gear 22c, and a drum 21 having a gear 22d. As a result, the heating resistor 2 in the first heating section 1 is replaced with a region of the heating resistor 2 without coking, and the heating resistor 2 with coking moves to the second heating section 40, where the coking of the heating resistor 2 is heated and removed. Then, the heating resistor 2 from which the coking has been removed in the second heating section 40 moves back into the first heating section 1, where it heats the object to be processed 5.

[0180] Therefore, the heat treatment apparatus 100 according to the fourth embodiment can remove the coking of the heat-generating resistor 2, can operate stably for a long time, can efficiently thermally decompose the material to be treated, and can prevent deterioration due to heat.

[0181] [Fifth Embodiment] The heat treatment apparatus according to the fifth embodiment of the present disclosure differs from the heat treatment apparatus according to the fourth embodiment in that it further comprises a gas supply unit 42 and a gas discharge unit 45. Figure 5A is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the fifth embodiment of the present disclosure.

[0182] The heat treatment apparatus according to the fifth embodiment may or may not include the winding unit 20 described in the heat treatment apparatus according to the second embodiment and / or the inert gas supply unit 30 described in the heat treatment apparatus according to the third embodiment. The heat treatment apparatus 100 according to the fifth embodiment, which includes the winding unit 20 and the inert gas supply unit 30, will be described below.

[0183] <Gas supply unit 42> The gas supply unit 42 is connected to the second heating unit 40 and supplies oxygen-containing gas 41 to the second heating unit 40.

[0184] In this disclosure, "connection" of the gas supply unit 42 to the second heating unit 40 means that the inside of the gas supply unit 42 and the inside of the second heating unit 40 are in communication so that an oxygen-containing gas 41 can pass through them.

[0185] There are no particular restrictions on the material of the gas supply unit 42; for example, it can be appropriately selected from the same materials as the second heating unit 40, depending on the purpose.

[0186] The shape, structure, and size of the gas supply unit 42 are not particularly limited as long as it can be connected to the second heating unit 40 and supply oxygen-containing gas 41 to the second heating unit 40. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the second heating unit 40 has an opening, this opening can be used as the gas supply unit 42.

[0187] The position of the gas supply unit 42 is not particularly restricted as long as it can be connected to the second heating unit 40, and can be selected as appropriate. Figure 5A shows the gas supply unit 42 being placed on the side surface of the second heating unit 40 near the first surface 40a of the second heating unit 40, but the gas supply unit 42 may be placed at any position on the side surface of the second heating unit 40, or it may be placed on the first surface 40a of the second heating unit 40, or it may be placed on the second surface 40b of the second heating unit 40.

[0188] -Oxygen-containing gas 41- There are no particular restrictions on the oxygen content in the oxygen-containing gas 41, and it can be appropriately selected depending on the purpose, and it may be a gas consisting only of oxygen.

[0189] If the oxygen-containing gas 41 also contains gases other than oxygen, examples of these other gases include nitrogen, water vapor, and carbon dioxide. These may be present individually or in combination of two or more.

[0190] The content of gases other than oxygen in the oxygen-containing gas 41 is not particularly limited as long as it can remove the coking of the heat-generating resistor 2, and can be appropriately selected depending on the purpose. However, from the viewpoint of efficiently removing carbon, it is usually preferable to have 95% or less, more preferably 90% or less, and even more preferably 85% or less. When the content of gases other than oxygen in the oxygen-containing gas 41 is 95% or less, the coking of the heat-generating resistor 2 can be efficiently removed.

[0191] <Gas discharge section 45> The gas discharge section 45 is connected to the second heating section 40 and discharges a gas 46 containing carbon dioxide from the second heating section 40.

[0192] In this disclosure, "connection" of the gas discharge section 45 to the second heating section 40 means that the inside of the gas discharge section 45 and the inside of the second heating section 40 are in communication so that a gas 46 containing carbon dioxide can pass through them.

[0193] There are no particular restrictions on the material of the gas discharge section 45; for example, it can be appropriately selected from the same materials as the second heating section 40, depending on the purpose.

[0194] The shape, structure, and size of the gas discharge section 45 are not particularly limited as long as they can extract the gas 46 containing carbon dioxide generated in the second heating section 40, and can be appropriately selected according to the purpose. Examples include cylindrical and rectangular parallelepiped shapes. Furthermore, if a part of the second heating section 40 has an opening, this opening can also be used as the gas discharge section 45.

[0195] The location of the gas discharge section 45 is not particularly limited as long as it can be connected to the second heating section 40, and can be appropriately selected depending on the type of gas 46 containing carbon dioxide. Figure 5A shows the gas discharge section 45 being located on the side surface of the second heating section 40 near the second surface 1b of the second heating section 40, but the gas discharge section 45 may be located at any position on the side surface of the second heating section 40, or it may be located on the first surface 40a of the second heating section 40, or it may be located on the second surface 40b of the second heating section 40.

[0196] In the second heating section 40, a gas containing carbon dioxide 46 is produced by the reaction of oxygen-containing gas 41 with carbon in the heating resistor 2. Therefore, within the second heating section 40, the gas containing carbon dioxide 46 and the gas containing oxygen 41 may be mixed. For this reason, the gas discharge section 45 may not only remove the gas containing carbon dioxide 46, but also remove a mixed gas of the gas containing carbon dioxide 46 and the gas containing oxygen 41. Furthermore, if by-products are generated within the second heating section 40, the gas discharge section 45 may also remove the by-products.

[0197] Furthermore, the gas supply unit 42 and the gas discharge unit 45 may be the same. That is, a single component located in the same position may be the gas supply unit 42 that supplies oxygen-containing gas 41 to the second heating unit 40 and the gas discharge unit 45 that extracts the carbon dioxide-containing gas 46 processed in the second heating unit 40. In this case, the gas supply rate adjustment unit 43 and the gas discharge rate adjustment unit 47, which will be described later, are also a single component located in the same position.

[0198] <Other Components> Other components of the heat treatment apparatus 100 according to the fifth embodiment of this disclosure include, for example, a gas supply rate adjustment unit 43, a gas supply rate sensor 44, a gas discharge rate adjustment unit 47, and a gas discharge rate sensor 48. Furthermore, the heat treatment apparatus 100 according to the fifth embodiment of this disclosure may also have a control unit 200 which includes a gas supply rate controller 206g and a gas discharge rate controller 205h.

[0199] Figure 5B is a block diagram showing an example of a control unit of a heat treatment apparatus according to the fifth embodiment of the present disclosure.

[0200] -Gas supply rate adjustment unit 43- The gas supply rate adjustment unit 43 adjusts the supply rate at which the gas supply unit 42 supplies oxygen-containing gas 41 to the second heating unit 40, or stops the gas supply unit 42 from supplying oxygen-containing gas 41 to the second heating unit 40.

[0201] For example, a known pump, a cock, etc., can be used as the gas supply rate adjustment unit 43.

[0202] The rate at which the oxygen-containing gas 41 is supplied to the second heating unit 40 by the gas supply rate adjustment unit 43 may be manually adjusted by the operator, or it may be adjusted by the gas supply rate controller 206g of the control unit 200, which will be described later.

[0203] -Gas supply rate sensor 44- The gas supply rate sensor 44 measures the supply rate of the oxygen-containing gas 41 by the gas supply rate adjustment unit 43. There are no particular restrictions on the gas supply rate sensor 44 as long as it can accurately measure the supply rate of the oxygen-containing gas 41 by the gas supply rate adjustment unit 43. For example, a known flow sensor for liquids or gases can be used.

[0204] The gas supply rate detection signal from the gas supply rate sensor 44 is suitably transmitted to the gas supply rate controller 206g of the control unit 200. The presence of the gas supply rate sensor 44 in the heat treatment apparatus 100 is preferable because it minimizes the power consumption of the heating resistor 2, and the gas supply rate controller 206g can provide feedback control of the gas supply rate of the gas supply unit 42.

[0205] -Gas discharge rate adjustment unit 47- The gas discharge rate adjustment unit 47 adjusts the discharge rate at which the gas discharge unit 45 discharges gas 46 containing carbon dioxide from the second heating unit 40, or stops the gas discharge unit 45 from taking out gas 46 containing carbon dioxide from the second heating unit 40.

[0206] For example, a known pump, a cock, etc., can be used as the gas discharge rate adjustment unit 47.

[0207] The rate at which the gas discharge rate adjustment unit 47 extracts the gas 46 containing carbon dioxide from the second heating unit 40 may be manually adjusted by the operator, or it may be adjusted by the gas discharge rate controller 205h of the control unit 200, which will be described later.

[0208] -Gas discharge rate sensor 48- The gas discharge rate sensor 48 measures the discharge rate of the gas 46 containing carbon dioxide by the gas discharge rate adjustment unit 47. There are no particular restrictions on the gas discharge rate sensor 48 as long as it can accurately measure the discharge rate of the gas 46 containing carbon dioxide by the gas discharge rate adjustment unit 47. For example, a known flow sensor for liquids or gases can be used.

[0209] The gas discharge rate detection signal from the gas discharge rate sensor 48 is suitably transmitted to the gas discharge rate controller 205h of the control unit 200. The presence of the gas discharge rate sensor 48 in the heat treatment apparatus 100 is preferable because it minimizes the power consumption of the heating resistor 2, and the gas discharge rate controller 205h can provide feedback control of the gas discharge rate of the gas discharge unit 45.

[0210] -Gas supply rate controller 206g- The gas supply rate controller 206g controls the supply rate of the oxygen-containing gas 41 to the second heating unit 40 by the gas supply rate adjustment unit 43. The gas supply rate controller 206g takes in the supply rate detection signal from the gas discharge rate sensor 48 and can feedback control the supply rate of the oxygen-containing gas 41 using PID control or on-off control.

[0211] -Gas discharge rate controller 205h- The gas discharge rate controller 205h controls the discharge rate of the gas 46 containing carbon dioxide from the second heating unit 40 by the gas discharge rate adjustment unit 47. The gas discharge rate controller 205h receives the gas discharge rate detection signal from the gas discharge rate sensor 48 and can feedback control the discharge rate of the gas 46 containing carbon dioxide using PID control or on-off control.

[0212] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the fifth embodiment, highlighting the differences from the heat treatment apparatus 100 according to the fourth embodiment.

[0213] First, an oxygen-containing gas 41 is supplied from the gas supply unit 42 into the second heating unit 40. At this time, the gas supply rate adjustment unit 43 adjusts the supply rate of the oxygen-containing gas 41 into the second heating unit 40. The supply rate of the oxygen-containing gas 41 is measured by the gas supply rate sensor 44, and the gas supply rate detection signal is transmitted to the gas supply rate controller 206g of the control unit 200.

[0214] The oxygen-containing gas 41 supplied into the second heating section 40 is used to heat and remove carbon in the heating resistor 2 and is converted into a carbon dioxide-containing gas 46.

[0215] The carbon dioxide-containing gas 46 inside the second heating section 40 is discharged outside the second heating section 40 from the gas discharge section 45. At this time, the gas discharge rate adjustment section 47 adjusts the discharge rate of the carbon dioxide-containing gas 46 outside the second heating section 40. The discharge rate of the carbon dioxide-containing gas 46 is measured by the gas discharge rate sensor 48, and the gas discharge rate detection signal is transmitted to the gas discharge rate controller 206h of the control unit 200.

[0216] In the fifth embodiment, the heat treatment apparatus 100 can more efficiently heat and remove the coking of the heat-generating resistor 2 with the oxygen-containing gas 41 supplied from the gas supply unit 42 when heating the heat-generating resistor 2 in the second heating unit 40.

[0217] [Sixth Embodiment] The heat treatment apparatus according to the sixth embodiment of the present disclosure differs from the heat treatment apparatus according to the first embodiment in that it further comprises a material recovery unit 50 and a cooling unit 51. Figure 6 is a schematic cross-sectional view showing an example of the heat treatment apparatus according to the sixth embodiment of the present disclosure.

[0218] The heat treatment apparatus according to the sixth embodiment may or may not include the winding unit 20 described in the heat treatment apparatus according to the second embodiment, the inert gas supply unit 30 described in the heat treatment apparatus according to the third embodiment, the second heating unit 40 described in the heat treatment apparatus according to the fourth embodiment, and / or the gas supply unit 42 and gas discharge unit 45 of the heat treatment apparatus according to the fifth embodiment. The heat treatment apparatus 100 according to the sixth embodiment will be described below.

[0219] <Processed Material Recovery Unit 50> The processed material recovery unit 50 is connected to the processed material removal unit 4 and recovers the processed material 6. There may be only one processed material recovery unit 50, or there may be two or more.

[0220] There are no particular restrictions on the structure, shape, material, and size of the processed material collection section 50, and they can be appropriately selected according to the purpose and the type of processed material 6, including known containers.

[0221] Furthermore, the treated material recovery section 50 may contain a solvent capable of separating useful components from the treated material 6. There are no particular restrictions on the solvent, and it can be appropriately selected depending on the type of useful components to be recovered. For example, if plastic is used as the material to be treated 5, solvents for extracting basic chemicals, such as olefins or aromatic compounds having 2 to 5 carbon atoms, from the treated material 6, which is a decomposition product of the plastic, include ethanol, hexane, dimethylformamide, cyclopentane, and water.

[0222] <Cooling section 51> The cooling section 51 is positioned between the first heating section 1 and the processed material recovery section 50. The cooling section 51 is a component that cools the processed material 6. This can preferably allow the desired components to be obtained from the processed material 6. For example, when using plastic as the material to be processed 5, and extracting basic chemicals, such as olefins or aromatic compounds having 2 to 5 carbon atoms, from the processed material 6 which is a decomposition product of the plastic, it is preferable to cool the processed material 6 in the cooling section 51.

[0223] The cooling unit 51 includes a cooling trap 51a for cooling the workpiece 6 and a cooling unit 51b for cooling the cooling trap 51a. The structure, shape, material, and size of the cooling trap 51a and the cooling unit 51b are not particularly limited as long as they can cool the workpiece 6, and can be appropriately selected according to the purpose.

[0224] The cooling trap 51a may contain an organic solvent 51c for dissolving the material to be processed 6. The organic solvent 51c may condense useful components in the material to be processed 6, particularly liquid useful components. The organic solvent for dissolving the material to be processed 6 can be appropriately selected depending on the type of material to be processed 6 and the target components. For example, when using plastic as the material to be processed 5, and obtaining basic chemicals, such as olefins having 2 to 5 carbon atoms or aromatic compounds, from the material to be processed 6 as a decomposition product of the plastic, a non-aqueous solvent is preferred for the organic solvent 51c. Examples of non-aqueous solvents include aromatic organic solvents such as monochlorobenzene, o-dichlorobenzene, and mesitylene. It is preferable that the outlet of the material removal section 4 is placed in the organic solvent 51c so that the material to be processed 6 (e.g., the generated gas) bubbles in the organic solvent 51c.

[0225] Useful components dissolved in a non-aqueous solvent can sometimes be suitably separated by further distillation at atmospheric pressure.

[0226] The cooling section 51b is not particularly limited as long as it can cool the cooling trap 51a, and may, for example, contain a refrigerant 51d. Examples of refrigerant 51d include ice water.

[0227] The heat treatment apparatus 100 according to the sixth embodiment of this disclosure may also have other components, such as a pre-processing unit, a post-processing unit, a separation unit, etc. (not shown).

[0228] <Pre-processing section> The pre-processing section is a component that pre-processes the object to be processed 5. It is preferable that the pre-processing section is connected to the object to be processed supply section 3.

[0229] In this disclosure, "connecting" the pre-processing unit to the processing material supply unit 3 means that the inside of the pre-processing unit and the inside of the processing material supply unit 3 are in communication so that the processing material 5 can pass through them.

[0230] The pre-processing unit, for example, when the object to be processed 5 is plastic, performs the task of transforming the plastic into a form or state that is easily decomposed.

[0231] There are no particular restrictions on the material of the pre-processing section; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0232] The shape, structure, and size of the pre-processing unit are not particularly limited as long as it can be connected to the material supply unit 3 and perform pre-processing on the material to be processed 5. They can be appropriately selected according to the purpose, and examples include cylindrical and rectangular parallelepiped shapes.

[0233] <Post-processing section> The post-processing section is a component that decomposes unwanted components such as by-products from the processed material 6. It is preferable that the post-processing section is connected to the processed material recovery section 50.

[0234] In this disclosure, "connecting" the post-processing unit to the processed material recovery unit 50 means that the inside of the post-processing unit and the inside of the processed material recovery unit 50 are in communication so that the processed material 6 can pass through them.

[0235] The post-processing unit, for example, removes paraffin, halogens, etc. generated from plastic when the object to be processed 5 is plastic.

[0236] There are no particular restrictions on the material of the post-processing section; for example, it can be appropriately selected from the same materials as the first heating section 1, depending on the purpose.

[0237] The shape, structure, and size of the post-processing unit are not particularly limited as long as it can be connected to the processed material recovery unit 50 and decompose unwanted components in the processed material 6. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped.

[0238] <Separation Processing Unit> The separation processing unit is a component that separates useful components from the processed material 6 collected in the processed material recovery unit 50. It is preferable that the separation processing unit is connected to the processed material recovery unit 50 or the post-processing unit.

[0239] In this disclosure, "connecting" the separation processing unit to the processed material recovery unit 50 or the post-processing unit means that the inside of the post-separation processing unit and the inside of the processed material recovery unit 50 or the post-processing unit are in communication so that the processed material 6 can pass through them.

[0240] There are no particular restrictions on the material of the separation processing unit; for example, it can be appropriately selected from the same materials as the first heating unit 1, depending on the purpose.

[0241] The shape, structure, and size of the separation processing unit are not particularly limited as long as it can be connected to the processed material recovery unit 50 or the post-processing unit and separate useful components from the processed material 6. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped.

[0242] The separation unit includes, for example, a pressurized distillation apparatus. This separates the useful components from the treated material 6. For example, if the object to be treated 5 is plastic, and the treated material 6, which is a decomposition product of the plastic, contains olefins or aromatic compounds having 2 to 5 carbon atoms, these useful components can be suitably separated from the treated material 6 by pressurized distillation.

[0243] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the sixth embodiment, highlighting the differences from the heat treatment apparatus 100 according to the first embodiment.

[0244] The processed material 6 removed from the processed material removal section 4 is transferred to the cooling trap 51a of the cooling section 51. When the processed material 6 is cooled in the cooling section 51, which contains organic solvent 51c cooled by the refrigerant 51d in the cold-insulation section 51b, components in the processed material 6 that can dissolve in the organic solvent 51c condense in the organic solvent 51c. On the other hand, components in the processed material 6 that do not dissolve in the organic solvent 51c are transferred as is to the processed material recovery section 50. As a result, the target components can be recovered in the organic solvent 51c and in the processed material recovery section 50.

[0245] If necessary, the material to be processed 5 is pre-processed in a pre-processing unit before being supplied to the first heating unit 1. Furthermore, the processed material 6 recovered in the processed material recovery unit 50 undergoes post-processing in a post-processing unit according to the type of processed material 6 to decompose unwanted components. Additionally, the processed material 6 recovered in the processed material recovery unit 50, or the processed material 6 from which unwanted components have been decomposed in the post-processing unit, undergoes decomposition processing in a separation unit according to the type of useful components to separate the useful components from the processed material 6.

[0246] (Heat Treatment Method) A heat treatment method according to one embodiment of the present disclosure is a method of heat treating an object to be treated using the heat treatment apparatus of the present disclosure.

[0247] A heat treatment method according to one embodiment of the present disclosure includes supplying the object to be treated from the object to be treated supply unit to the first heating unit, heating the object to be treated with the heating resistor in the first heating unit, and removing the heated object from the object to be treated removal unit, wherein in the supplying, heating, and removal, the heating resistor is preferably able to move back and forth relative to the first heating unit. The heat treatment method according to one embodiment of the present disclosure may further include other processes as necessary.

[0248] Figure 7 is an example of a flowchart of a heat treatment method according to one embodiment of the present disclosure.

[0249] A heat treatment method according to one embodiment of the present disclosure includes supplying S1, heating S2, and removing S3.

[0250] <Supplying S1> Supplying S1 involves supplying the material to be processed 5 from the material to be processed supply unit 3 to the first heating unit 1.

[0251] There are no particular restrictions on the supply speed of the material to be processed 5 to the first heating unit 1, and it can be appropriately selected depending on the type of material to be processed 5.

[0252] <Heating S2> Heating S2 involves heating the material to be processed 5 to 400°C or higher using the heating resistor 2 within the first heating section 1. Supplying S1 and heating S2 may be performed separately or simultaneously, but from the viewpoint of improving the yield of the processed material 6, it is preferable to first perform heating S2 to bring the first heating section 1 to a desired temperature according to the type of material to be processed 5, and then perform supplying S1 and heating S2 simultaneously.

[0253] The heating temperature in heating S2 is 400°C or higher, but when the treated product 6 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and heating S2 is carried out without a catalyst, from the viewpoint of yield of the treated product 6, a temperature of 650°C to 950°C is preferred, 675°C to 925°C is more preferred, and 700°C to 900°C is even more preferred.

[0254] Furthermore, the heating temperature should be controlled so that the inner surface of the first heating section 1 does not become so hot that its material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the first heating section 1 varies depending on various conditions such as the distance between the inner surface of the first heating section 1 and the heat-generating resistor 2, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the first heating section 1 and the heat-generating resistor 2 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the first heating section 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.

[0255] In heating S2, from the viewpoint of improving the yield of the processed material 6 and minimizing the power consumption of the heating resistor 2, it is preferable that the material to be processed 5 becomes turbulent within the first heating section 1 and comes into frequent contact with the heating resistor 2. Turbulence of the material to be processed 5 within the first heating section 1 can be suitably achieved by supplying an inert gas 31 into the first heating section 1. In this case, it is preferable to use the heat treatment apparatus according to the third embodiment of this disclosure, the heat treatment apparatus according to the fourth embodiment of this disclosure, or the heat treatment apparatus according to the fifth embodiment of this disclosure.

[0256] When the object to be processed 5 is plastic, and the processed material 6 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and heating S2 is performed without a catalyst, the supply rate v(m) of the inert gas 31 ３ The value calculated by the following formula 2 (per minute) is 0.05 m ３ / min~10m ３ It is preferable to make it so that it is 0.5 m / min. ３ / min~7m ３ It is more preferable to make it so that it is 0.1 m / min. ３ / min~4m ３ It is even more preferable to make it so that it is per minute. [Equation 2] 60 × L Ｒ × (A - B) / v However, in equation 2, L Ｒ A represents the length (m) of the heating resistor 2, and A represents the cross-sectional area (m) of the first heating section 1. ２ ) is shown, and B is the cross-sectional area (m²) of the heat-generating resistor 2. ２ ) indicates that v is the supply rate v (m) of the inert gas 31. ３ It indicates (per minute).

[0257] <Removal S3> Removal S3 involves removing the heated processed object 6 from the processed object removal unit 4.

[0258] <Other Processing> The heat treatment method according to one embodiment of the present disclosure may further include other processing steps other than supplying S1, heating S2, and removing S3, as needed. There are no particular limitations on the other processing steps, and they can be appropriately selected depending on the purpose. Examples include recovering useful components from the treated material 6, separating useful components, etc. The process may also include pre-treatment by a known method depending on the type of treated material 5 in order to facilitate thermal decomposition by heating S2, post-treatment by a known method depending on the type of treated material 6 in order to remove by-products from the treated material 6, or decomposing only the useful components from the treated material 6.

[0259] (Method for Manufacturing Chemicals) A method for manufacturing chemicals according to one embodiment of the present disclosure is a method for manufacturing chemicals by heat-treating the object to be treated using a heat treatment apparatus according to one embodiment of the present disclosure. In the method for manufacturing chemicals according to one embodiment of the present disclosure, the object to be treated 5 is a plastic, and the treated product 6 contains at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

[0260] A method for producing a chemical product according to one embodiment of the present disclosure includes supplying the product to be treated from the product supply unit to the first heating unit, heating the product to be treated with the heating resistor in the first heating unit, and removing the heated product from the product removal unit, wherein, in the supplying, heating, and removal, the heating resistor is preferably able to move back and forth relative to the first heating unit. The heat treatment method according to one embodiment of the present disclosure may further include other treatments as necessary.

[0261] Figure 8 is an example of a flowchart of a method for producing a chemical product according to one embodiment of the present disclosure.

[0262] A method for producing a chemical product according to one embodiment of the present disclosure includes supplying S13, heating S14, and taking out S15.

[0263] In the method for producing a chemical product according to one embodiment of the present disclosure, supplying S13, heating S14, and removing S15 are the same as supplying S1, heating S2, and removing S3 in the heat treatment method according to one embodiment of the present disclosure, and are as described in the (heat treatment method) section above.

[0264] An example of a method for producing a chemical product according to one embodiment of the present disclosure is described below, in which the object to be treated 5 is a plastic, and the treated product 6 obtained by heat-treating the object to be treated 5 contains at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and involves pre-treatment S11, decomposition treatment S12, recovery of useful components in the treated product S16, post-treatment S17, and separation of useful components S18.

[0265] <<Pre-treatment S11>> Pre-treatment S11 is a pre-treatment of the plastic before supplying S13 and heating S14. Pre-treatment S11 is performed by a pre-treatment unit.

[0266] By pre-treating the plastic in S11, it can be made into a form or state that is easily decomposed, and by heating it in S14, the plastic can be decomposed more efficiently.

[0267] Examples of pretreatments performed in S11 include plastic crushing, pelletizing (chip) the crushed plastic, and melting the plastic.

[0268] There are no particular restrictions on the method for obtaining pulverized plastic, and any conventionally known method can be appropriately selected. For example, a method of crushing plastic with a pulverizer to obtain powder or flakes can be used.

[0269] Furthermore, there are no particular restrictions on the method of pelletizing (chipping) the pulverized material, and any conventionally known method can be appropriately selected. For example, one method is to melt-extrude the pulverized material and then cut the strand-shaped melt-extruded material to obtain chipped raw material.

[0270] There are no particular restrictions on the melting treatment of the plastic, and a suitable method can be selected from conventionally known methods. However, it is preferable to treat the plastic at a temperature above its melting point and below its thermal decomposition temperature, and more preferably at a temperature of 100°C to 300°C.

[0271] Plastics can also be supplied to the heat treatment as a molten material; for example, this can be done by supplying them to the heat treatment using a molten extruder.

[0272] <<Disassembly Treatment S12>> Disassembly treatment S12 is a process of disassembling the plastic before it is subjected to supplying S13 and heating S14. Disassembly treatment S12 can be preferably carried out by a pre-treatment unit.

[0273] In the decomposition process S12, the plastic may be the raw material as is, or it may be the plastic that has been pre-treated in the pre-treatment process S11. Therefore, in the method for producing a chemical product according to one embodiment of this disclosure, the pre-treatment process S11 and the decomposition process S12, which are other processes performed as needed, may be either performed alone or both.

[0274] There are no particular restrictions on the method of decomposing plastic, and any conventionally known method can be appropriately selected. For example, one method is to heat-treat the plastic at a temperature above its decomposition temperature (e.g., 200°C or higher).

[0275] Thus, the object to be processed 5 can also be the decomposed plastic material obtained by the decomposition process S12.

[0276] <<Recovery S16>> Recovery S16 is a process of recovering gases, which are products containing ethylene and other lower olefins obtained by thermal decomposition of the plastic by heating S14, and liquid substances as needed. Recovery S16 is carried out by the processed material recovery unit 50 and the cooling unit 51.

[0277] There are no particular restrictions on the recovery method, and a method can be appropriately selected from known methods depending on the type of product obtained. For example, gaseous products can be separated by pressurized distillation at atmospheric pressure, and liquid hydrocarbons can be separated by atmospheric pressure and reduced pressure distillation.

[0278] <<Post-treatment S17>> Post-treatment S17 is a process to decompose the by-products generated by the thermal decomposition of the plastic by heating S14. Post-treatment S17 is performed in the post-treatment unit.

[0279] By-products generated by the thermal decomposition of plastics include, for example, paraffin and halogens.

[0280] Post-treatment methods performed in post-treatment S17 include, for example, the removal of halogen compounds. Methods for removing halogen compounds include a fixed bed filled with an oxide or hydroxide of one metal selected from alkali metals and alkaline earth metals, or a method of passing an aqueous solution of the oxide or hydroxide of the said metal through the bed.

[0281] <<Separation S18>> Separation S18 is a process of separating useful components from the gas and liquid substances recovered in recovery S16. Alternatively, separation S18 may be a process of further removing unwanted components from the post-processed material obtained in post-processing S17. The separation process is performed by the separation unit.

[0282] By decomposing plastics, useful components such as ethylene and other lower olefins may be generated, as well as by-components such as paraffins with 2 to 5 carbon atoms.

[0283] In separation S18, there are no particular restrictions on the method used to separate the useful components from the minor components, and a known method can be appropriately selected depending on the type of product obtained or the type of minor components.

[0284] As described above, this disclosure has been explained based on specific embodiments, but these embodiments are merely examples, and this disclosure is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, additions, modifications, etc., are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents.

[0285] This international application claims priority under Japanese Patent Application No. 2024-225814, filed on 20 December 2024, which is incorporated herein by reference to the entire contents of Japanese Patent Application No. 2024-225814.

[0286] 1...First heating section 1a...First surface of the first heating section 1b...Second surface of the first heating section 2...Heating resistor 3...Processing material supply section 4...Processing material removal section 5...Processing material 6...Processing material 7...Outer casing 8...Seal section 9...Current introduction terminal 10...Temperature sensor 11...Supply speed adjustment section 12...Supply speed sensor 13...Removal speed adjustment section 14...Removal speed sensor 20...Winding section 21...Drum 22, 22a, 22b, 22c, 22d...Gear 30...Inert gas supply section 31...Inert gas 32...Inert gas supply speed adjustment section 33...Inert gas supply speed sensor 40...Second heating section 40a...First surface of the second heating section 40b...Second surface of the second heating section 41...Oxygen-containing gas 42...Gas supply section 43...Gas supply speed adjustment section 44...Gas supply rate sensor 45...Gas discharge unit 46...Gas containing carbon dioxide 47...Gas discharge rate adjustment unit 48...Gas discharge rate sensor 50...Processed material recovery unit 51...Cooling unit 51a...Cooling trap 51b...Insulation unit 51c...Organic solvent 51d...Refrigerant 100...Heat treatment device 200...Control unit 202...Memory 203...Display unit 204...Input / output unit 205...Communication unit 206...Various controllers 206a...First temperature controller 206b...Supply rate controller 206c...Removal rate controller 206d...Winding controller 206e...Inert gas supply rate controller 206f...Second temperature controller 206g...Gas supply rate controller 206h...Gas discharge rate controller 207...Storage unit 208...Processing recipe data

Claims

1. A heat treatment apparatus comprising: a first heating section for heating an object to be processed; a heat-generating resistor that penetrates from a first surface to a second surface of the first heating section and is positioned to move back and forth relative to the first heating section; an object supply section connected to the first heating section for supplying the object to be processed to the first heating section; and an object removal section connected to the first heating section for removing the object processed in the first heating section.

2. The heat treatment apparatus according to claim 1, further comprising a winding section for winding the heat-generating resistor.

3. The heat treatment apparatus according to claim 1 or claim 2, further comprising an inert gas supply unit connected to the first heating unit and supplying an inert gas to the first heating unit.

4. The heat treatment apparatus according to any one of claims 1 to 3, wherein the heat-generating resistor is in the form of a thread, drawn wire, film, plate, coil, double helix coil, mesh, foil, fabric, film, or layer.

5. The heat treatment apparatus according to any one of claims 1 to 4, further comprising a second heating section for heating carbon attached to the heating resistor, wherein the heating resistor penetrates from the first surface of the second heating section to the second surface of the second heating section and is arranged to move back and forth relative to the second heating section.

6. The heat treatment apparatus according to claim 5, comprising: a gas supply unit connected to the second heating unit and supplying an oxygen-containing gas to the second heating unit; and a gas discharge unit connected to the second heating unit and discharging a carbon dioxide-containing gas from the second heating unit.

7. The heat treatment apparatus according to claim 5 or 6, wherein the heat-generating resistor is endless, and the heat-generating resistor moves from the first surface of the first heating section toward the first surface of the second heating section and moves from the second surface of the second heating section toward the second surface of the first heating section, or the heat-generating resistor moves from the second surface of the first heating section toward the second surface of the second heating section and moves from the first surface of the second heating section toward the first surface of the first heating section.

8. A heat treatment method characterized by heat treating the object to be treated using a heat treatment apparatus described in any one of claims 1 to 7.

9. The heat treatment method according to claim 8, comprising: supplying the object to be treated from the object to be treated supply unit to the first heating unit; heating the object to be treated with the heating resistor in the first heating unit; and removing the processed object generated by heating the object to be treated from the processed object removal unit, wherein the heating resistor moves freely relative to the first heating unit during the supplying, heating, and removal.

10. The heat treatment method according to claim 9, wherein the heating is performed by heating the object to be treated to 400°C or higher in the first heating section with the heat-generating resistor.

11. A method for producing a chemical product, comprising heat-treating a target object using a heat treatment apparatus described in any one of claims 1 to 7, wherein the target object is a plastic, and the chemical product is at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

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