Substrate processing apparatus and temperature sensing module used therefor

Abstract

Disclosed are a substrate processing apparatus and a temperature sensing module used therefor. The temperature sensing module may comprise a temperature sensor and a level-maintaining unit. The temperature sensor extends along the length direction in a chamber of the substrate processing apparatus, and may have a protruding portion protruding in a direction intersecting the length direction. The level-maintaining unit may support the protruding portion so that the temperature sensor maintains an installation level along the length direction.

Description

Substrate processing device and temperature sensing module used therein

[0001] The present invention relates to a substrate processing device and a temperature sensing module used therein.

[0002]

[0003] Generally, various processing steps are performed on the semiconductor substrate during the semiconductor device manufacturing process. Examples of such processing steps include oxidation, nitridation, ion implantation, and deposition. There is also a hydrogen or deuterium heat treatment process to improve the interface characteristics of the semiconductor device.

[0004] The gas used for the process is supplied into the chamber and acts on the semiconductor substrate. The temperature and pressure of the gas inside the chamber must be adjusted to values ​​set according to the process. A heater is used to raise the chamber temperature, and a temperature sensor may be used to measure the chamber temperature.

[0005]

[0006] As determined by the inventors, temperature sensors installed in each piece of equipment may not accurately maintain a set positional relationship with the heater. This is because the positional relationship between the temperature sensor and the heater differs from the design specifications due to manufacturing or assembly errors. Furthermore, even if the temperature sensor is set to an appropriate height, the set height may not be maintained due to imperfections in the configuration holding the sensor. Consequently, the temperature sensor may not be able to accurately measure the temperature resulting from the operation of the heater.

[0007] One objective of the present invention, devised in consideration of these problems, is to provide a substrate processing device and a temperature sensing module used therein, which can position a temperature sensor and stably maintain its state.

[0008] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0009]

[0010] A substrate processing apparatus according to one aspect of the present invention for realizing the above-mentioned problem comprises: a chamber formed to accommodate a substrate and a process gas; and a temperature sensing module installed in the chamber, wherein the temperature sensing module may include a temperature sensor having a protrusion extending along a longitudinal direction and protruding in a direction intersecting the longitudinal direction; and a level maintaining unit that supports the protrusion so that the temperature sensor maintains an installation level along the longitudinal direction.

[0011] Here, the level maintaining unit includes an installation bracket having a bottom portion that supports the protrusion, and a through hole may be formed in the bottom portion into which a portion of the temperature sensor excluding the protrusion is inserted.

[0012] Here, the through hole can be opened to the outside through one end of the bottom surface.

[0013] Here, the installation bracket further includes a mounting portion connected to the bottom portion and facing the chamber, and the level maintaining unit may further include a first fastening element that fastens the mounting portion to the chamber.

[0014] Here, a screw hole is formed in the mounting portion, and the level maintaining unit may include a spacing adjustment screw that is screw-coupled to the screw hole and supported in the chamber.

[0015] Here, the temperature sensing module may further include a position fixing unit formed to fix the temperature sensor at a position within the through hole.

[0016] Here, the position fixing unit may include a fixing member coupled to the installation bracket.

[0017] Here, the fixing member may be formed to be connectable at multiple positions in a horizontal direction with respect to the installation bracket.

[0018] Here, the position fixing unit further includes a second fastening element for fastening the fixing member to the installation bracket, and the second fastening element can be coupled to the fixing member and the installation bracket along an anti-gravity direction opposite to the direction of gravity.

[0019] Here, the fixing member may include a coupling portion coupled to the installation bracket by the second fastening element; and a pressing portion spaced apart from the coupling portion in the anti-gravity direction and pressing the protrusion against the installation bracket.

[0020] Here, a seating groove for accommodating the protrusion may be formed in the above-mentioned pressure part.

[0021] Here, the direction in which the second fastening element is fastened to the coupling part and the installation bracket may be perpendicular to the direction in which the pressing part presses the second part.

[0022] Herein, the chamber comprises a housing and a door for opening and closing the housing, wherein the housing comprises an inner housing formed to accommodate a reaction gas acting as a first pressure on the substrate and the substrate; and an outer housing formed to accommodate the inner housing and a protective gas forming a second pressure set in relation to the first pressure, and the door may be formed to close at least one of the inner housing and the outer housing.

[0023] A temperature sensing module for a substrate processing apparatus according to another aspect of the present invention may include: a temperature sensor having a protrusion that extends along a longitudinal direction within a chamber of the substrate processing apparatus and protrudes in a direction intersecting the longitudinal direction; and a level maintaining unit that supports the protrusion so that the temperature sensor maintains an installation level along the longitudinal direction.

[0024] Here, the level maintaining unit includes an installation bracket having a bottom portion that supports the protrusion, and a through hole may be formed in the bottom portion into which a portion of the temperature sensor excluding the protrusion is inserted.

[0025]

[0026] According to the substrate processing device and the temperature sensing module used therein configured as described above, the temperature sensing module installed in the chamber includes a temperature sensor having a protrusion and a level maintaining unit that supports the protrusion to maintain the level of the temperature sensor, thereby enabling the temperature sensor to be positioned correctly and its state to be maintained stably. Consequently, the temperature sensor in the substrate processing device can accurately measure the temperature of the chamber.

[0027] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0028]

[0029] FIG. 1 is a conceptual diagram of a substrate processing apparatus according to one embodiment of the present invention.

[0030] Figure 2 is a perspective view showing the installation state of the temperature sensing module.

[0031] Figure 3 is an exploded perspective view of the temperature sensing module of Figure 2.

[0032] Figure 4 is a conceptual diagram showing the horizontal positional movement of the temperature sensor relative to the mounting bracket of Figure 3.

[0033] FIG. 5 is a perspective view showing a temperature sensing module according to another embodiment of the present invention.

[0034] Figure 6 is a perspective view of the temperature sensing module of Figure 5 viewed from a different direction.

[0035]

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] The present invention is not limited to the embodiments disclosed below, but can be modified and implemented in various different forms. The embodiments provided are merely intended to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Accordingly, the present invention should be understood not to be limited to the embodiments disclosed below, but to include all modifications, equivalents, and substitutions that fall within the technical spirit and scope of the present invention, as well as substituting or adding the configuration of any one embodiment with the configuration of another embodiment.

[0038] The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; rather, it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the invention. In the drawings, components may be depicted as being exaggeratedly large or small in size or thickness for the sake of convenience of understanding, but the scope of protection of the invention should not be interpreted restrictively as a result thereof.

[0039] The terms used in this specification are used merely to describe specific embodiments or examples and are not intended to limit the invention. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise. Terms such as "includes" or "consists of" in this specification are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this specification. That is, terms such as "includes" or "consists of" in this specification should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0040] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0041] When it is stated that one component is "connected / communicated" or "connected" to another component, it should be understood that while it may be directly connected / communicated or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected / communicated" or "directly connected" to another component, it should be understood that there are no other components in between.

[0042] When it is stated that one component is "above" or "below" another component, it should be understood that it is not only placed directly above the other component, but that another component may also exist in between.

[0043] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0044] FIG. 1 is a conceptual diagram of a substrate processing apparatus according to one embodiment of the present invention.

[0045] Referring to the drawing, the substrate processing device (100) may include an inner chamber (110), an outer chamber (120), an air supply module (130), and an exhaust module (140).

[0046] The inner chamber (110) may have a housing (inner housing) having a reaction space for accommodating a substrate. A door for opening and closing the reaction space may be provided at the bottom of the housing. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce the risk of contamination of the substrate in a high-temperature and high-pressure working environment. Depending on the operation of a heater (not shown) placed on the outside of the inner chamber (110), the temperature of the inner chamber (110) may reach hundreds to one thousand degrees Celsius or higher. The substrate may be, for example, a semiconductor wafer mounted on a loading platform. The substrate is not limited to the wafer and may be anything other than a base structure for making circuits. For example, the substrate may also include glass for making displays. The loading platform may be a boat for loading one or more substrates.

[0047] The outer chamber (120) may be provided with an (outer) housing (121) having a protective space that accommodates the inner chamber (110). A door is also provided at the bottom of the housing (121), and the door (outer door) can descend together with the door (inner door) of the inner chamber (110) to open the protective space. The inner chamber (110) may be mounted on the outer chamber (120). Unlike the inner chamber (110), the outer chamber (120) may be made of metal because it is free from concerns about causing contamination to the substrate.

[0048] The above protective chamber may be divided into two zones by a partition plate (123). The lower side of the partition plate (123) may be a high-temperature zone (125) where the inner chamber (110) and the heater are located, and the upper side may be a low-temperature zone (127) having a lower temperature than the high-temperature zone (125). The low-temperature zone (127) may be cooled by a cooling medium flowing inside the partition plate (123), etc. The high-temperature zone (125) may have a temperature comparable to that of the inner chamber (110) depending on the operation of the heater, but the low-temperature zone (127) may have a significantly lower temperature compared to the high-temperature zone (125). Although the partition plate (123) divides the high-temperature zone (125) and the low-temperature zone (127), it may be formed to allow gas flow below a certain flow rate between them. Accordingly, the high-temperature zone (125) and the low-temperature zone (127) may have generally the same pressure. In contrast, the above-mentioned protective chamber may be configured without area division by partition plates (123).

[0049] The supply module (130) is configured to supply gas to the reaction chamber and the protection chamber. The supply module (130) has a gas supply unit (131) connected to a utility (gas supply facility) of a semiconductor factory. The gas supply unit (131) can selectively provide, for example, hydrogen gas (H2), deuterium gas (D2), fluorine gas (F2), ammonia gas (NH3), chlorine gas (Cl2), nitrogen gas (N2), etc. as a reaction gas to the inner chamber (110). The gas supply unit (131) can provide, for example, inert gas such as nitrogen gas or argon gas (Ar) as a protection gas to the outer chamber (120). The reaction gas and the protection gas are each injected into the reaction chamber or the protection chamber through a reaction gas line (133) or a protection gas line (135). The protective gas injected into the protective chamber is specifically injected into a protective region excluding the space occupied by the inner chamber (110) within the protective chamber. The reaction gas and the protective gas may simply be referred to as process gas.

[0050] The pressure of the process gas may be higher than atmospheric pressure (high pressure) in the reaction chamber and the protection chamber, for example, from several atmospheres to tens of atmospheres or higher. When the pressure of the reaction gas in the reaction chamber is a first pressure and the pressure of the protection gas in the protection chamber is a second pressure, the first pressure and the second pressure may be maintained in a set relationship (range). For example, the second pressure may be set to be substantially equal to or slightly higher than the first pressure. Such a pressure relationship provides the advantage of preventing the reaction gas from leaking from the reaction chamber and preventing the inner chamber (110) from breaking. The second pressure may also be set to be slightly lower than the first pressure, and in that case, the effect of preventing the inner chamber (110) from breaking can also be achieved.

[0051] The exhaust module (140) is configured to exhaust the process gas. To exhaust the reaction gas from the reaction chamber, an exhaust pipe (141) may be connected to the upper part of the inner chamber (110). To exhaust the protection gas from the protection chamber, an exhaust pipe (145) may also be connected to the outer chamber (120). If the exhaust pipes (141 and 145) are integrated into one, the reaction gas is diluted by the protection gas during the exhaust process, and its concentration is lowered.

[0052] Figure 2 is a perspective view showing the installation state of the temperature sensing module.

[0053] Referring to the drawing (and FIG. 1), a temperature sensing module (200) may be adopted to measure the internal temperature of the chamber (110, 120). The temperature sensing module (200) may be installed on the bottom surface of the chamber (110, 120), for example, the inner chamber (110), specifically the inner door (115).

[0054] The temperature sensing module (200) may include a temperature sensor (210) and a level maintaining unit (230).

[0055] The temperature sensor (210) may generally have the form of a rod arranged along the vertical direction (V). In the case of a vertical chamber, the vertical direction (V) may be a direction perpendicular to the ground and also a direction penetrating the main surface of the inner door (115). The temperature sensor (210) may be inserted into an installation hole (117) formed in the inner door (115). The free end (measuring part) of the temperature sensor (210) may measure the operating temperature of a heater (not shown) installed in the inner door (115) or the temperature of the reaction gas supplied to the reaction chamber through a pipe passing through the inner door (115).

[0056] The level maintenance unit (230) may have an installation bracket (231) mounted on the inner door (115). The installation bracket (231) supports the temperature sensor (210) so that the temperature sensor (210) can be stably positioned at an installation level along the vertical direction (V).

[0057] A through hole (234) extending along the horizontal direction (H) may be formed in the mounting bracket (231). The horizontal direction (H) may be a direction generally perpendicular to the vertical direction (V). A temperature sensor (210) may be located at one of a plurality of points along the horizontal direction (H) from the through hole (234).

[0058] In an alternative embodiment, the temperature sensing module may be installed in the partition plate (123) to measure the temperature of the high-temperature zone (125). For example, the temperature sensor may be positioned adjacent to the inner housing along the horizontal direction (H) to indirectly measure the temperature of the reaction chamber. In this case, the temperature sensor may be arranged along the opposite direction to that in FIG. 2, that is, so that the first part (211, see FIG. 3) faces downward.

[0059] In an alternative embodiment, the temperature sensing module may be installed on the outer door. In that case, to prevent leakage of the protective gas through the installation hole, a sealing material may be introduced into the installation hole, or a casing that encloses and seals the installation hole and the temperature sensing module may be additionally provided.

[0060] Figure 3 is an exploded perspective view of the temperature sensing module of Figure 2.

[0061] Referring to the drawing (and FIG. 2), the temperature sensor (210) may be, for example, a thermocouple. The thermocouple may contain different types of metal wires to produce a thermoelectric effect.

[0062] The thermocouple described above is formed to extend along the longitudinal direction (vertical direction (V) in this drawing) and can be divided into a first part (211), a second part (213), and a third part (215). The first part (211) may include a contact portion (211a) of the metal wires. The contact portion (211a) is located at the free end of the first part (211) and may be located at a sensing point. The first part (211) may be coated with a material that is susceptible to brittle fracture but resistant to high temperatures, such as ceramic. The second part (213) may be coated with a material that is more resistant to brittle fracture than the first part (211), such as synthetic resin. The synthetic resin is a material that exhibits characteristics of ductile fracture rather than brittle fracture. The second part (213) may be referred to as a protrusion as it protrudes along a direction intersecting the length direction, for example, the horizontal direction (H), and forms an outer diameter larger than that of the first part (211). The lower surface (213a) along the length direction of the second part (213) may be supported by an installation bracket (231). The third part (215) may be a cable.

[0063] The mounting bracket (231) may have a bottom portion (233), a mounting portion (235), and a connecting portion (237).

[0064] The bottom portion (233) may be a part that supports the protrusion of the temperature sensor (210). The bottom portion (233) may generally be a plate perpendicular to the vertical direction (V). A through hole (234) may be formed in the bottom portion (233). The through hole (234) may have a size into which a part other than the protrusion of the temperature sensor (210), specifically a third part (215), is inserted. The protrusion, specifically its lower surface (213a), may not pass through the through hole (234) and may be supported by the bottom portion (233). Alternatively, if the outer diameter of the protrusion is formed differently along the height direction (V), a part of the protrusion may be inserted into the through hole (234), and a part of the protrusion that protrudes more than the part may be supported by the bottom portion (233).

[0065] The through hole (234) may be a slot extending in one direction, for example, along the horizontal direction (H). The through hole (234) may also have a shape that is open to the outside through one end along the horizontal direction (H) of the bottom portion (233). The temperature sensor (210) may be inserted into the through hole (234) along the horizontal direction (H) rather than the vertical direction (V). As the temperature sensor (210) has a long length, it will be easier for the operator to insert the temperature sensor (210) into the through hole (234) in the horizontal direction (H) rather than the vertical direction (V).

[0066] The mounting portion (235) may be a plate facing the inner door (115). The mounting portion (235) may be fastened to the inner door (115) by a first fastening element (241), for example, a screw. Corresponding to the first fastening element (241), a receiving hole (236a) may be formed in the mounting portion (235). The first fastening element (241) may be inserted into the receiving hole (236a) in a vertical direction (V). It will be easier for the worker to insert the first fastening element (241) in a vertical direction (V) rather than a horizontal direction (H). The mounting bracket (231) may rotate around the first fastening element (241), and in that case, the arrangement direction of the bottom portion (233) and the through hole (234) may also be rotated. The first fastening element (241) is not limited to the screw and may be other fastening means such as a hook or a magnet.

[0067] A screw hole (236b) is formed in the mounting portion (235), and a spacing adjustment screw (243) can be inserted into the screw hole (236b) and screw-coupled with the threads of the screw hole (236b). The free end of the shank of the spacing adjustment screw (243) can be supported on the bottom surface of the inner door (115). As the spacing adjustment screw (243) is rotated while the first fastening element (241) is slightly loosened, the level and / or horizontality of the mounting bracket (231) can be adjusted.

[0068] The connecting portion (237) is a part that connects the bottom portion (233) to the mounting portion (235). The connecting portion (237) may generally be a plate extending along the vertical direction (V). Based on the connecting portion (237), the bottom portion (233) and the mounting portion (235) may extend in opposite directions along the horizontal direction (H).

[0069] In an alternative embodiment, the through hole may not be open to the outside through one end of the bottom portion (233). In that case, the temperature sensor (210) may be displaced along the horizontal direction (H) after being inserted into the through hole along the vertical direction (V). To facilitate the insertion of the temperature sensor (210), one part of the through hole may have a greater width than the rest of the part.

[0070] In an alternative embodiment, the connecting portion may be formed to be adjustable in length. For example, the connecting portion may be composed of two members, and the relative position between the two members may be adjusted. Alternatively, the connecting portion may be excluded from the mounting bracket, and the mounting portion may be directly connected to the bottom portion.

[0071] Figure 4 is a conceptual diagram showing the horizontal positional movement of the temperature sensor relative to the mounting bracket of Figure 3.

[0072] Referring to the drawing, the through hole (234) may be a slot extending in one direction, for example, the horizontal direction (H, see FIG. 3). As the through hole (234) has a slot shape, the operator can adjust the horizontal position / angle of the temperature sensor (210) by moving the temperature sensor (210) in the horizontal direction (H) within the through hole (234).

[0073] In FIG. 4 (a), the second part (213) is located at the closed end of the through hole (234), whereas in (b), the second part (213) is shown to be located somewhat spaced apart from the closed end.

[0074] A temperature sensing module of a different form from the one described above will be explained with reference to FIGS. 5 and 6. FIG. 5 is a perspective view showing a temperature sensing module according to another embodiment of the present invention, and FIG. 6 is a perspective view of the temperature sensing module of FIG. 5 viewed from a different direction.

[0075] Referring to the drawings, the temperature sensing module (300) has a temperature sensor (310) and a level maintaining unit (330) that are generally the same as the temperature sensing module (200) according to the preceding embodiment, and may further have a position fixing unit (350).

[0076] A second part (313) of the temperature sensor (310), having an outer diameter larger than that of the first part (311), can be supported by the bottom part (333) of the level maintenance unit (330). A third part (315) of the temperature sensor (310) can be inserted into the through hole (334) of the installation bracket (331).

[0077] The mounting portion (335) and connecting portion (337) of the mounting bracket (331) are generally the same as in the preceding embodiment, but a screw hole (334') may be additionally formed in the bottom portion (333). The screw hole (334') may extend along the vertical direction (V).

[0078] The position fixing unit (350) may be formed to fix the temperature sensor (310) to a position within the through hole (334). Although the temperature sensor (310) is supported by the bottom portion (333) and is unlikely to move along the horizontal direction (H) due to its own weight, the position fixing unit (350) can more reliably maintain the correct position / orientation of the temperature sensor (310) and prevent the temperature sensor (310) from moving out of the through hole (334) even under situations such as external impact. The position fixing unit (350) may have a fixing member (351) that is coupled to the installation bracket (331). The fixing member (351) may have a pressing portion (353) and a coupling portion (355).

[0079] The pressurizing part (353) may be a part that pressurizes the second part (313) against the installation bracket (331), specifically the connecting part (337). A seating groove (354) that accommodates the second part (313) may be formed in the pressurizing part (353). The seating groove (354) may have a shape corresponding to the outer circumference of the second part (313), for example, a semicircular shape, so that the possibility of particle generation due to deformation of the second part (313) can be more reliably eliminated. Alternatively, since the second part (313) is resistant to brittle fracture, the seating groove (354) may not be adopted.

[0080] By the pressurizing part (353) pressing the second part (313) instead of the first part (311), the concern regarding particle generation due to damage to the first part (311) can be eliminated.

[0081] The connecting portion (355) may be a part that is connected to the mounting bracket (331), for example, the bottom portion (333). The connection between the connecting portion (355) and the bottom portion (333) may be achieved through a second fastening element (361), for example, a screw. To accommodate the second fastening element (361), a receiving hole (356) corresponding to the screw hole (334') may be formed in the connecting portion (355). The receiving hole (356) may be formed, for example, as an elongated hole, so that the fixing member (351) may be connected at one of a plurality of positions along the horizontal direction (H) with respect to the bottom portion (333). The receiving hole (356) may extend parallel to the through hole (334). The second fastening element (361) is not limited to the screw and may be other fastening means such as a hook or a magnet.

[0082] The second fastening element (361) may be connected to the coupling part (355) and the bottom part (333) along the anti-gravity direction (U) opposite to the downward direction (gravity direction) of the vertical direction (V). To this end, the coupling part (355) may be located on the lower side of the bottom part (333), but is not limited thereto. It may be easier for the operator installing the temperature sensing module (300) inside the outer chamber (120, see FIG. 1) to operate the second fastening element (361) along the anti-gravity direction (U). The direction in which the second fastening element (361) is connected to the coupling part (355) may be generally perpendicular to the direction in which the pressing part (353) presses the second part (313). As a result, even if the screw of the second fastening element (361) is slightly loosened, there may be little change in the force with which the pressing part (353) presses the second part (313).

[0083] The pressurizing member (353) may be positioned spaced apart from the connecting member (355) along the vertical direction (V). Specifically, the pressurizing member (353) may be located above the bottom member (333), and the connecting member (355) may be located below the bottom member (333). Corresponding to this arrangement, the fixing member (351) may have a tubular body that accommodates the bottom member (333), for example, a square tube shape.

[0084] In an alternative embodiment, the fixing member may be a block disposed on the upper surface of the bottom portion (333) while the protrusion is pressed against the connecting portion (337). The block may be coupled to the upper surface of the bottom portion (333) by means of a projection-groove structure, a hook coupling structure, or a magnetic coupling, etc.

[0085] In an alternative other embodiment, the fixing member may be a member that binds the protrusion to the connecting part (337), such as a cable tie, wire, or rubber band.

[0086] In this specification, a processing device having a double chamber is described as an example of a substrate processing device (100), but the present invention is not limited thereto. Configurations such as a temperature sensing module (200, 300) can also be applied to a processing device having a single chamber. The single chamber consists of a housing and a door. A substrate is placed in the reaction chamber of the chamber, and a reaction gas for processing the substrate is supplied. The housing and the door may correspond to the inner housing and inner door in the aforementioned double chamber. The reaction gas may have a pressure equal to atmospheric pressure, or a pressure less than or greater than atmospheric pressure. If necessary, a configuration (casing, sealing material, etc.) for sealing the reaction gas may be added to the temperature sensing module (200, 300).

[0087] The configuration of the temperature sensing module (200, 300), etc., may also be applied to a semi-double chamber, which is an intermediate form between the double chamber and the single chamber. The semi-double chamber may have two housings {inner housing and outer housing} and one door. The two housings may be combined by their own shapes or with the intervention of separate members to form a closed space (corresponding to the protection zone). As in the previous embodiment, the substrate is placed in the reaction chamber of the inner housing and the reaction gas is injected, and the protection gas may be injected into the closed space. Unlike the previous embodiment, the door is not fully protected by the protection gas and is exposed to the outside. In this respect, the door may correspond to the outer door in the previous embodiment. The door can open and close the reaction chamber.

[0088] This specification exemplifies a batch-type processing apparatus, but the invention is not limited thereto. The invention may be applied as is to a single-wafer-type processing apparatus.

[0089]

[0090] The present invention has industrial applicability in the field of manufacturing substrate processing devices.

Claims

1. A chamber formed to accommodate a substrate and a process gas; and It includes a temperature sensing module installed in the above chamber, and The above temperature sensing module is, A temperature sensor having a protrusion that extends along the longitudinal direction and protrudes in a direction intersecting the longitudinal direction; and A substrate processing device comprising a level-maintaining unit that supports the protrusion so that the temperature sensor maintains an installation level along the length direction.

2. In Paragraph 1, The above level maintenance unit is, It includes an installation bracket having a bottom portion that supports the above-mentioned protrusion, and A substrate processing device having a through hole formed in the bottom portion of the above-mentioned temperature sensor, into which the portion excluding the protrusion is inserted.

3. In Paragraph 2, The above through hole is, A substrate processing device that is open to the outside through one end of the bottom surface.

4. In Paragraph 2, The above installation bracket is, It further includes a mounting portion connected to the bottom portion and facing the chamber, The above level maintenance unit is, A substrate processing device further comprising a first fastening element that fastens the above-mentioned mounting portion to the chamber.

5. In Paragraph 4, A screw hole is formed in the above mounting part, and The above level maintenance unit is, A substrate processing device further comprising a spacing adjustment screw that is screw-coupled to the above screw hole and supported in the above chamber.

6. In Paragraph 2, The above temperature sensing module is, A substrate processing device further comprising a position fixing unit formed to fix the temperature sensor at a position within the through hole.

7. In Paragraph 6, The above position fixing unit is, A substrate processing device comprising a fixing member coupled to the above-mentioned installation bracket.

8. In Paragraph 7, The above-mentioned fixing member is, A substrate processing device formed to be connectable at multiple positions in a horizontal direction with respect to the above-mentioned installation bracket.

9. In Paragraph 7, The above position fixing unit is, It further includes a second fastening element for fastening the above-mentioned fixing member to the above-mentioned installation bracket, and The above second fastening element is, A substrate processing device coupled to the fixed member and the mounting bracket along an anti-gravity direction opposite to the direction of gravity.

10. In Paragraph 9, The above-mentioned fixing member is, A coupling part coupled to the installation bracket by the second fastening element; and A substrate processing device comprising a pressurizing member that is spaced apart from the coupling member in the above anti-gravity direction and presses the protrusion against the installation bracket.

11. In Paragraph 10, A substrate processing device in which a seating groove for accommodating the protrusion is formed in the above-mentioned pressure portion.

12. In Paragraph 10, A substrate processing device in which the direction in which the second fastening element is fastened to the coupling part and the installation bracket is perpendicular to the direction in which the pressing part presses the second part.

13. In Paragraph 1, The above chamber is, It includes a housing and a door for opening and closing the housing, The above housing is, An inner housing formed to accommodate the substrate and a reaction gas acting as a first pressure on the substrate; and It includes a protective gas that forms a second pressure set in relation to the first pressure and an outer housing formed to accommodate the inner housing, and The above door is, A substrate processing device formed to close at least one of the inner housing and the outer housing.

14. A temperature sensor having a protrusion that extends along the longitudinal direction within the chamber of a substrate processing device and protrudes in a direction intersecting the longitudinal direction; and A temperature sensing module for a substrate processing device, comprising a level-maintaining unit that supports the protrusion so that the temperature sensor maintains an installation level along the length direction.

15. In Paragraph 14, The above level maintenance unit is, It includes an installation bracket having a bottom portion that supports the above-mentioned protrusion, and A temperature sensing module for a substrate processing device, wherein a through hole is formed in the bottom portion of the above temperature sensor into which a portion excluding the protrusion is inserted.

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