Matte wire and preparation method therefor

Abstract

Provided in the present invention are a matte wire and a preparation method therefor. The matte wire comprises a wire core and a matte heat-dissipating layer located on the outer surface of the wire core, wherein the matte heat-dissipating layer comprises a bonding layer and a matte layer, the bonding layer is located on the outer surface of the wire core, the matte layer is located on the outer surface of the bonding layer, an inorganic non-metal powder is located on the matte layer, and the surface emission coefficient of the inorganic non-metal powder is larger than or equal to 0.6. The matte wire has a high surface emission coefficient, and therefore has good heat dissipation performance and a relatively long service life.

Description

A matte optical conductive wire and its preparation method Technical Field

[0001] This invention belongs to the field of power cable technology, specifically relating to a matte wire and its preparation method. Background Technology

[0002] Matte wires generate a lot of heat during operation, which raises their temperature. Therefore, it is necessary to dissipate the heat from the matte wires in a timely manner to avoid excessive heat affecting their performance and service life.

[0003] Currently, the main method to improve the heat dissipation of matte conductors and extend their service life is to spray brown fused alumina and other abrasive materials onto the surface of the conductor core. However, the conductor cores currently used to manufacture matte conductors are mainly made of aluminum, which has a low surface emissivity. Spraying brown fused alumina and other abrasive materials onto the surface of aluminum is insufficient to meet the heat dissipation requirements of matte conductors.

[0004] Therefore, how to develop a sub-optical conductor with a high surface emissivity is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] The present invention provides a matte wire with a high surface emissivity, thereby exhibiting excellent heat dissipation performance and a long service life.

[0006] The present invention also provides a method for preparing the above-mentioned matte wire. The matte wire obtained by using the preparation method has a high surface emissivity and is simple to operate, making it suitable for large-scale production.

[0007] In a first aspect, the present invention provides a matte wire, the matte wire comprising a wire core and a matte heat dissipation layer located on the outer surface of the wire core;

[0008] The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the conductor core, and the matte layer is located on the outer surface of the adhesive layer.

[0009] Inorganic non-metallic powder is located in the matte layer, and the surface emissivity of the inorganic non-metallic powder is ≥0.6.

[0010] In the above-described matte conductive wire, the particle size of the inorganic non-metallic powder is 10μm-25μm.

[0011] In the matte conductive wire described above, the thickness of the adhesive layer is 3μm-10μm.

[0012] The matte conductive wire described above has a matte layer thickness of 10μm-30μm.

[0013] As described above, the diameter of the conductor core is 4.05mm-52.8mm.

[0014] The matte conductive wire described above, wherein the adhesive layer is made of a thermosetting resin.

[0015] As described above, the matte conductive wire, wherein the inorganic non-metallic powder includes silicon powder or silica fume.

[0016] Secondly, the present invention proposes a method for preparing the above-mentioned matte wire, comprising: obtaining the matte wire by forming a matte heat dissipation layer on the outer surface of the wire core.

[0017] The preparation method described above further includes: forming an adhesive layer on the outer surface of the conductor core, and forming a matte layer on the outer surface of the adhesive layer away from the conductor core.

[0018] In the preparation method described above, the matte layer is obtained by spraying inorganic non-metallic powder onto the outer surface of the adhesive layer.

[0019] The implementation of this invention has at least the following beneficial effects:

[0020] 1) The matte wire of the present invention has good heat dissipation capacity, is not prone to aging and cracking during long-term use, and has a long service life;

[0021] 2) This invention uses inorganic non-metallic powder with a surface emissivity ≥ 0.6 to form a matte heat dissipation layer to improve the heat dissipation performance of the matte wire. Compared with the prior art, which uses brown fused alumina and other abrasive materials for sandblasting and to improve the heat dissipation performance of the matte wire, the matte wire of this invention can also avoid the pollution of air and soil caused by the brown fused alumina and other abrasive materials used for sandblasting. Attached Figure Description

[0022] Figure 1 is a schematic diagram of the fabrication apparatus for matte conductive wires in some embodiments of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1: Online resin coating device;

[0025] 2: Sandblasting equipment;

[0026] 3: Online medium-frequency induction heating device;

[0027] 4: Take-up device and reel. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below in conjunction with the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0029] The present invention provides a matte wire, which includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core. The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the wire core, the matte layer is located on the outer surface of the adhesive layer, and inorganic non-metallic powder is located on the matte layer. The surface emissivity of the inorganic non-metallic powder is ≥0.6.

[0030] This invention improves the surface emissivity of matte conductors by forming a matte heat-dissipating layer comprising inorganic non-metallic powder with a surface emissivity ≥ 0.6 on the outer surface of the conductor core. This enhances the heat dissipation capacity of the matte conductor, reducing the risk of aging and breakage, and extending its service life. Furthermore, using an adhesive layer to bond the matte layer to the conductor core allows the matte layer to adhere more firmly to the surface of the conductor core, further improving the surface emissivity and extending the service life of the matte conductor.

[0031] In this invention, the outer surface of the conductor core refers to the outer surface of the conductor core extending radially. The outer surface of the adhesive layer refers to the outer surface of the adhesive layer extending radially. The matte conductor of this invention may include a matte layer, an adhesive layer, and a conductor core from the outside in. The adhesive layer is used to bond the matte layer and the conductor core. Inorganic non-metallic powder is located in the matte layer to improve the heat dissipation of the matte conductor. The conductor core can be formed by stranding multiple individual conductors, the material of which includes copper, aluminum, or aluminum alloy; the stranding form of the individual conductors can be concentric layer stranding; the cross-section of the conductor core can be circular, fan-shaped, or tile-shaped. The matte layer includes inorganic non-metallic powder with a surface emissivity ≥ 0.6. Exemplarily, the surface emissivity of the inorganic non-metallic powder can be any one of 0.6, 0.7, 0.8, 0.9, or a range combining any two of these.

[0032] Surface emissivity refers to the thermal radiation emitted by an object at a certain temperature. The higher the surface emissivity of a matte conductor, the faster it can release heat energy and the shorter the time to reach thermal equilibrium, thus exhibiting superior heat dissipation.

[0033] In some embodiments of the present invention, in order to further improve the surface emissivity of the matte wire and enhance its heat dissipation, inorganic non-metallic powder with a particle size of 10μm-25μm can be selected.

[0034] In this invention, when the thickness of the adhesive layer is set to 3μm-10μm, the matte layer can be firmly bonded to the surface of the conductor core without affecting the heat dissipation of the matte conductor, thus extending the service life of the matte conductor.

[0035] In some implementations, when the thickness of the matte layer is set to 10μm-30μm, the matte conductor can be given excellent heat dissipation without affecting its conductivity.

[0036] In some implementations, the diameter of the conductor core is 4.05mm-52.8mm. Selecting conductor cores within this diameter range can impart excellent conductivity to the matte conductor.

[0037] In this invention, the adhesive layer is made of thermosetting resin, which has good heat resistance, aging resistance and mechanical properties, effectively improving the weather resistance and mechanical properties of the matte wire.

[0038] In some embodiments, the thermosetting resin includes phenolic resin and / or urea-formaldehyde resin, that is, the thermosetting resin may include phenolic resin, or it may include urea-formaldehyde resin, or it may include both phenolic resin and urea-formaldehyde resin.

[0039] In some embodiments, the inorganic non-metallic powder includes silicon powder or silica fume. Using this inorganic non-metallic powder can improve the surface emissivity of the matte wire while maintaining its excellent conductivity and mechanical properties.

[0040] Secondly, the present invention proposes a method for preparing the above-mentioned matte wire, comprising: obtaining the matte wire by forming a matte heat dissipation layer on the outer surface of the wire core.

[0041] Specifically, the matte conductive wire of the present invention is obtained by forming a matte heat dissipation layer on the outer surface of the conductor core. The present invention does not limit the formation method of the matte heat dissipation layer on the outer surface of the conductor core, as long as the matte heat dissipation layer can be located on the outer surface of the conductor core.

[0042] The preparation method of the present invention can produce the first aspect of the matte wire, and the preparation method is simple to operate. It does not use abrasive materials such as brown corundum in the preparation process, which can reduce pollution to the air and soil and has excellent environmental protection.

[0043] In this invention, the method for preparing the matte conductor further includes: forming an adhesive layer on the outer surface of the conductor core, and forming a matte layer on the outer surface of the adhesive layer.

[0044] Specifically, an adhesive layer is formed on the outer surface of the conductor core, and then a matte layer is formed on the outer surface of the adhesive layer, thereby obtaining a matte conductor that includes the conductor core, the adhesive layer, and the matte layer from the inside out.

[0045] This invention does not limit the specific formation method of the adhesive layer and the matte layer, as long as the adhesive layer and the matte layer can be formed.

[0046] This invention forms an adhesive layer and a matte layer sequentially on the outer surface of the conductor core. The matte layer is then bonded to the outer surface of the conductor core using the adhesive layer. This prevents the matte layer from separating from the conductor core during long-term use and further extends the service life of the matte conductor.

[0047] Furthermore, the adhesive layer is formed by coating the outer surface of the conductor core with an online resin coating device, and the matte layer is obtained by spraying inorganic non-metallic powder onto the outer surface of the adhesive layer with a sandblasting device. This preparation method is simple to operate and suitable for large-scale production.

[0048] Figure 1 is a schematic diagram of the fabrication apparatus for the matte optical conductive wire of the present invention. As shown in Figure 1, the fabrication apparatus for the matte optical conductive wire includes an online resin coating device 1, a sandblasting device 2, an online intermediate frequency induction heating device 3, a take-up device, and a reel 4.

[0049] In some embodiments, the method for preparing the matte conductive wire includes the following steps:

[0050] (1) Pass the conductor core through the online resin coating device 1 at a uniform speed so that the thermosetting resin is uniformly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 3-10μm on the outer surface of the conductor core.

[0051] (2) Use sandblasting device 2 to uniformly spray inorganic non-metallic powder onto the outer surface of the adhesive layer to form an intermediate conductor including a matte layer with a thickness of 10-30μm.

[0052] (3) An online medium-frequency induction heating device 3 is used to make the surface temperature of the intermediate conductor 200-230℃ and maintain it for 8min-12min to allow the adhesive layer to be fully cured. The matte layer is then bonded to the outer surface of the conductor core using the adhesive layer. After natural cooling, the conductor enters the take-up device and is taken onto the reel 4 to obtain the matte conductor.

[0053] The matte wires obtained using this preparation method have a high surface emissivity and are simple to operate, making them suitable for large-scale production.

[0054] The present invention will be described in detail below through specific embodiments:

[0055] Example 1

[0056] The matte conductive wire in this embodiment is prepared by a method including the following steps:

[0057] (1) The conductor core is moved at a constant speed through the online coating device under the action of the traction device, so that L872 type phenolic resin is uniformly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 5μm on the outer surface of the conductor core.

[0058] (2) Silicon powder is uniformly sprayed onto the outer surface of the adhesive layer using a sandblasting device to form an intermediate conductor including a matte layer with a thickness of 30μm.

[0059] (3) An online medium-frequency induction heating device is used to make the surface temperature of the intermediate conductor 210℃ and maintain it for 10 minutes. After natural cooling, the conductor enters the take-up device and is taken onto the reel to obtain a matte conductor.

[0060] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core. The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer. Inorganic non-metallic powder is located on the matte layer. The inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.61.

[0061] The conductor core has a diameter of 4.05 mm and is made of aluminum. The adhesive layer includes L872 type phenolic resin with a thickness of 5 μm, the matte layer has a thickness of 30 μm, and the inorganic non-metallic powder has a particle size of 10 μm.

[0062] Example 2

[0063] The matte conductive wire in this embodiment is prepared by a method including the following steps:

[0064] (1) The conductor core is moved at a constant speed through the online coating device under the action of the traction device, so that urea-formaldehyde resin (Mitsui Chemicals) is uniformly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 10 μm on the outer surface of the conductor core.

[0065] (2) Silicon powder is uniformly sprayed onto the outer surface of the adhesive layer using a sandblasting device to form an intermediate conductor including a 15μm thick matte layer.

[0066] (3) An online medium-frequency induction heating device is used to make the surface temperature of the intermediate conductor 220°C and maintain it for 12 minutes. After natural cooling, the conductor enters the take-up device and is taken onto the reel to obtain a matte conductor.

[0067] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core. The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer. Inorganic non-metallic powder is located on the matte layer. The inorganic non-metallic powder is silica fume, and the surface emissivity of the inorganic non-metallic powder is 0.62.

[0068] The conductor core has a diameter of 16.4 mm and is made of copper. The adhesive layer includes urea-formaldehyde resin with a thickness of 10 μm, the matte layer has a thickness of 15 μm, and the inorganic non-metallic powder has a particle size of 13 μm.

[0069] Example 3

[0070] The matte conductive wire in this embodiment is prepared by a method including the following steps:

[0071] (1) The conductor core is made to pass through the online coating device at a uniform speed under the action of the traction device, so that L872 type phenolic resin is uniformly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 7μm on the outer surface of the conductor core.

[0072] (2) Silicon powder is uniformly sprayed onto the outer surface of the adhesive layer using a sandblasting device to form an intermediate conductor including a 20μm thick matte layer.

[0073] (3) An online medium-frequency induction heating device is used to make the surface temperature of the intermediate conductor 230°C and maintain it for 10 minutes. After natural cooling, the conductor enters the take-up device and is taken onto the reel to obtain a matte conductor.

[0074] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core. The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer. Inorganic non-metallic powder is located on the matte layer. The inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.65.

[0075] The conductor core has a diameter of 27.6 mm and is made of aluminum. The adhesive layer includes L872 type phenolic resin with a thickness of 7 μm, the matte layer has a thickness of 20 μm, and the inorganic non-metallic powder has a particle size of 15 μm.

[0076] Example 4

[0077] The preparation method of the matte wire in this embodiment is basically the same as that in Example 1, except that the phenolic resin is replaced with an equal amount of thermoplastic polypropylene resin (model K1020).

[0078] Example 5

[0079] The preparation method of the matte wire in this embodiment is basically the same as that in Example 1, except that the thickness of the adhesive layer is changed from 5μm to 20μm.

[0080] Example 6

[0081] The preparation method of the matte wire in this embodiment is basically the same as that in Example 1, except that the thickness of the matte layer is changed from 5μm to 60μm.

[0082] Example 7

[0083] The preparation method of the matte wire in this embodiment is basically the same as that in Example 1, except that the silicon powder with a particle size of 10 μm is replaced with silicon powder with a particle size of 50 μm in equal amounts.

[0084] Comparative Example 1

[0085] The preparation method of the sub-optical conductive wire in this comparative example is basically the same as that in Example 1, except that the silicon powder with a surface emissivity of 0.61 is replaced by an equal amount of quartz powder with a surface emissivity of 0.3.

[0086] Comparative Example 2

[0087] The matte conductive wire of this comparative example was prepared by a method including the following steps:

[0088] (1) The conductor core is passed through the sandblasting device at a uniform speed under the action of the traction device. The sandblasting device is used to uniformly spray silicon powder onto the outer surface of the conductor core to form an intermediate conductor including a 30μm thick matte heat dissipation layer.

[0089] (2) An online medium-frequency induction heating device is used to make the surface temperature of the intermediate conductor 210°C and maintain it for 10 minutes. After natural cooling, the conductor enters the take-up device and is taken onto the reel to obtain a matte conductor.

[0090] The matte wire in this comparative example includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core. The matte heat dissipation layer includes a matte layer. The matte layer is located on the outer surface of the wire core, and inorganic non-metallic powder is located on the matte layer. The inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.61.

[0091] The conductor core has a diameter of 41.1 mm and is made of aluminum; the matte layer has a thickness of 30 μm and the inorganic non-metallic powder has a particle size of 18 μm.

[0092] Performance testing

[0093] (1) Surface emissivity: Tested according to GJB5023.2-2003 test standard.

[0094] The surface emissivity of the matte wires prepared in the embodiments and comparative examples of the present invention was tested, and the results are shown in Table 1.

[0095] Table 1

[0096] As can be seen from Table 1, the matte wire in the embodiment of the present invention has a better surface emissivity, and thus has better heat dissipation performance and a longer service life.

[0097] In particular, it can be seen from Example 1 and Comparative Example 1 that only by using inorganic non-metallic powder with a surface emissivity greater than or equal to 0.6 can a matte wire with an excellent surface emissivity be obtained; it can be seen from Example 1 and Comparative Example 2 that a matte wire must include not only inorganic non-metallic powder with a surface emissivity greater than or equal to 0.6, but also an adhesive layer in order to have an excellent surface emissivity.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A matte finish wire, characterized in that, The matte conductor includes a conductor core and a matte heat dissipation layer located on the outer surface of the conductor core. The matte heat dissipation layer includes an adhesive layer and a matte layer. The adhesive layer is located on the outer surface of the conductor core, and the matte layer is located on the outer surface of the adhesive layer. Inorganic non-metallic powder is located in the matte layer, and the surface emissivity of the inorganic non-metallic powder is ≥0.

6.

2. The matte finish conductor according to claim 1, characterized in that, The particle size of the inorganic non-metallic powder is 10μm-25μm.

3. The matte finish conductor according to claim 1, characterized in that, The thickness of the adhesive layer is 3μm-10μm.

4. The matte finish conductor according to claim 1, characterized in that, The thickness of the matte layer is 10μm-30μm.

5. The matte finish conductor according to claim 1, characterized in that, The diameter of the conductor core is 4.05mm-52.8mm.

6. The matte finish conductor according to claim 1, characterized in that, The adhesive layer is made of thermosetting resin.

7. The matte finish conductor according to claim 1, characterized in that, The inorganic non-metallic powder includes silicon powder or silica fume.

8. A method for preparing a matte conductive wire according to any one of claims 1-7, characterized in that, The matte conductor is obtained by forming a matte heat dissipation layer on the outer surface of the conductor core.

9. The preparation method according to claim 8, characterized in that, Also includes: An adhesive layer is formed on the outer surface of the conductor core, and a matte layer is formed on the outer surface of the adhesive layer.

10. The preparation method according to claim 9, characterized in that, The matte layer is obtained by spraying inorganic non-metallic powder onto the outer surface of the adhesive layer.

Images