Feeding apparatus and feeding method therefor

Abstract

Embodiments of the present application relate to the technical field of glass production, and disclose a feeding apparatus and a feeding method therefor. The feeding apparatus comprises an electric heating element, a hopper, a sheet attachment mechanism, and a resistance sheet. The electric heating element is connected to the hopper, and the hopper comprises a middle section and two end sections. One end section, the middle section, and the other end section are sequentially arranged in the length direction of the hopper. The sheet attachment mechanism is connected to the resistance sheet, the position of the resistance sheet corresponds to the position of the middle section, and the sheet attachment mechanism is configured to drive the resistance sheet to attach to or separate from the middle section. Compared with the existing technology, the feeding apparatus provided by the embodiments of the present application, by virtue of using the middle section arranged between the two end sections and the resistance sheet connected to the sheet attachment mechanism, is capable of achieving rapid adjustment of the temperature at the middle position of the hopper, ensuring uniformity of the hopper temperature, thereby improving feeding uniformity, avoiding the occurrence of local non-formation or deformation of a plate surface, and ensuring product quality.

Description

A feeding device and feeding method thereof

[0001] Cross-reference of related applications

[0002] This application claims priority to Chinese Patent Application No. 202411916573.9, filed on December 24, 2024, entitled “A feeding device and feeding method thereof”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of glass production technology, and more specifically, to a feeding device and a feeding method thereof. Background Technology

[0004] Currently, with the widespread application of microcrystalline glass in industries such as mobile phone cover plates and induction cooker panels, the demand for mass production of large-size, ultra-thin microcrystalline glass has increased dramatically. Microcrystalline glass is characterized by its short material length and easy crystallization. Furthermore, the production of ultra-thin microcrystalline glass requires high standards for lateral thickness variation, surface flatness, and original plate width. Therefore, currently, a feeding funnel is generally used to feed the molten glass flowing from the outlet channel to the forming device to form the microcrystalline glass. However, current feeding funnels are prone to exhibiting a situation where the temperature is higher in the middle and lower at both ends along the length of the feeding funnel (because the ends dissipate heat faster than the middle). This directly results in the viscosity of the molten glass in the middle being lower than that at the ends, causing the flow rate of the molten glass in the middle to be higher than that at the ends. Consequently, this leads to localized incomplete forming or deformation of the plate surface, significantly impacting product quality.

[0005] Therefore, designing a feeding device and feeding method that provides uniform material feeding and produces high-quality products is particularly important in glass production.

[0006] Application content

[0007] The purpose of this application is to provide a feeding device that can quickly adjust the temperature in the middle of the hopper, ensure the uniformity of the hopper temperature, thereby improving the uniformity of feeding, avoiding localized misshapen or deformed areas on the plate surface, and ensuring product quality.

[0008] Another objective of this application is to provide a feeding method for a feeding device that enables rapid adjustment of the temperature in the middle of the hopper, ensuring the uniformity of the hopper temperature, thereby improving the uniformity of feeding, avoiding localized misshapen or deformed areas on the plate surface, and ensuring product quality.

[0009] This application is implemented using the following technical solution.

[0010] A feeding device includes an electric heating element, a hopper, a patching mechanism, and a resistance element. The electric heating element is connected to the hopper, which includes a middle section and two end sections. One end section, the middle section, and the other end section are arranged sequentially along the length of the hopper. The patching mechanism is connected to the resistance element, and the position of the resistance element corresponds to the position of the middle section. The patching mechanism is configured to drive the resistance element to be attached to or separated from the middle section.

[0011] Optionally, there are multiple chip mounting mechanisms and multiple resistors. The multiple chip mounting mechanisms and multiple resistors are divided into two groups. The two groups of chip mounting mechanisms are arranged opposite each other on both sides of the hopper width direction. In each group, multiple chip mounting mechanisms are arranged sequentially along the length direction of the hopper, and each chip mounting mechanism is connected to a resistor.

[0012] Optionally, multiple resistors can be set up independently, and multiple mounting mechanisms can be set up independently.

[0013] Optionally, the mounting mechanism includes a mounting plate and a driver, the driver being mounted on the mounting plate and connected to the resistor.

[0014] Optionally, the mounting mechanism also includes a mounting housing, the drive unit is connected to the mounting housing, and the resistor is mounted on the mounting housing.

[0015] Optionally, the driving component is a lead screw, the axis of which is in the width direction of the hopper. The mounting plate has a threaded hole, the lead screw is threaded into the threaded hole, and is rotatably connected to the fixed shell.

[0016] Optionally, the mounting mechanism further includes a first insulation layer, and the mounting shell is connected to the resistive sheet through the first insulation layer, with the first insulation layer disposed between the resistive sheet and the mounting shell.

[0017] Optionally, the feeding device also includes a housing with a relief opening in the middle. The hopper is connected inside the housing, and the position of the relief opening corresponds to the position of the middle section. The patching mechanism is installed in the housing and extends into the relief opening.

[0018] Optionally, the feeding device also includes two second insulation layers, each of which is disposed between the outer shell and an end section.

[0019] Optionally, the feeding device also includes multiple temperature sensors, which are spaced apart along the length of the hopper and are all connected to the hopper.

[0020] A feeding method for a feeding device, applied to the aforementioned feeding device, the feeding method comprising:

[0021] The discharge temperature of the end section and the middle section were measured separately;

[0022] If the discharge temperature of the middle section is higher than that of the end section, the mounting mechanism is used to bond the resistor sheet to the middle section; if the discharge temperature of the middle section is lower than that of the end section, the mounting mechanism is used to separate the resistor sheet from the middle section.

[0023] Optionally, in the step of using a surface mount mechanism to bond the resistor sheet to the intermediate section, the formula for calculating the thickness of the resistor sheet is: K=(N-1) / (2N+1)*W 总 *a; H=N*h;

[0024] In the formula, K is the temperature difference between the discharge of the middle section and the end section; W 总 denoted as , where is the rated power of the electric heating element; 'a' is the power change required to raise the temperature of the hopper by 1 degree Celsius; 'H' is the thickness of the resistance element; 'h' is the wall thickness of the hopper; and 'N' is the ratio of the resistance element thickness to the hopper wall thickness.

[0025] The feeding device and feeding method provided in this application have the following beneficial effects:

[0026] The feeding device provided in this application has an electric heating element connected to a hopper. The hopper includes a middle section and two end sections, with one end section, the middle section, and the other end section arranged sequentially along the length of the hopper. A mounting mechanism is connected to a resistor sheet, the position of which corresponds to the position of the middle section. The mounting mechanism is configured to drive the resistor sheet to adhere to or separate from the middle section. Compared with the prior art, the feeding device provided in this application, due to the use of a middle section located between the two end sections and a resistor sheet connected to the mounting mechanism, can achieve rapid temperature adjustment in the middle of the hopper, ensuring the uniformity of the hopper temperature, thereby improving the uniformity of feeding and avoiding localized incomplete forming or deformation of the board surface, thus ensuring product quality.

[0027] The feeding method of the feeding device provided in this application, applied to the feeding device, can realize rapid adjustment of the temperature in the middle position of the hopper, ensure the uniformity of the hopper temperature, thereby improving the uniformity of feeding, avoiding the situation of local non-forming or deformation of the plate surface, and ensuring product quality. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 is a schematic diagram of the feeding device provided in an embodiment of this application;

[0030] Figure 2 is a schematic diagram of the hopper in the feeding device provided in the embodiment of this application;

[0031] Figure 3 is a schematic diagram of the connection between the patch mechanism and the resistor sheet in the feeding device provided in the embodiment of this application;

[0032] Figure 4 is a schematic diagram of the structure of the outer shell of the feeding device provided in the embodiment of this application.

[0033] Icons: 100-Feeding device; 110-Electric heating element; 120-Hopper; 121-Intermediate section; 122-End section; 123-Inlet; 124-Outlet; 130-Packing mechanism; 131-Mounting plate; 132-Driver; 133-Fixed shell; 134-Threaded hole; 135-Limit head; 136-Stop sleeve; 137-Handwheel; 138-First insulation layer; 140-Resistant element; 150-Outer shell; 151-Leaning opening; 160-Second insulation layer; 170-Temperature sensor. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this application, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," "third," etc., are only configured to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "installed," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, features in the following embodiments can be combined with each other.

[0040] Referring to Figures 1 to 4, this application embodiment provides a feeding device 100 configured to feed molten glass to a forming device (not shown). It enables rapid temperature adjustment at the center of the hopper 120, ensuring temperature uniformity within the hopper 120, thereby improving feeding uniformity and preventing localized incomplete forming or deformation of the plate surface, thus guaranteeing product quality.

[0041] In an optional embodiment, the forming device is a calendering roller pair, and the feeding device 100 is disposed directly above the calendering roller pair and connected to the discharge channel (not shown). Specifically, in the production process of microcrystalline glass, the discharge channel feeds the molten glass into the feeding device 100, which feeds the molten glass into the calendering roller pair in a waterfall-like manner to form a pool of material in the gap between the rollers. The calendering roller pair extrudes and cools the molten glass to form microcrystalline glass.

[0042] The feeding device 100 includes an electric heating element 110, a hopper 120, a patching mechanism 130, and a resistance element 140. The hopper 120 is connected to a discharge channel configured to feed molten glass into the hopper 120. The electric heating element 110 is connected to the hopper 120, which is made of metal. The electric heating element 110 is configured to supply power to the hopper 120, causing the hopper 120 to heat up by its own resistance, thereby keeping the molten glass inside the hopper 120 warm. Specifically, the hopper 120 includes a middle section 121 and two end sections 122. One end section 122, the middle section 121, and the other end section 122 are arranged sequentially along the length of the hopper 120, that is, the middle section 121 is located between the two end sections 122. The mounting mechanism 130 is connected to the resistor plate 140, whose position corresponds to that of the middle section 121. The resistor plate 140 is made of metal. The mounting mechanism 130 is configured to move the resistor plate 140 to adhere to or separate from the middle section 121, thereby reducing or increasing the resistance in the middle of the hopper 120, and thus reducing or increasing the heat generated in the middle of the hopper 120. This allows for rapid temperature adjustment in the middle of the hopper 120, ensuring temperature uniformity and improving feeding uniformity. It also prevents localized misshapen or deformed areas on the plate surface, ensuring product quality.

[0043] It should be noted that R = ρL / S, where R is resistance, ρ is resistivity, L is length, and S is cross-sectional area. According to the above formula, resistance is directly proportional to length and inversely proportional to cross-sectional area. Applying this to the present application, since the resistivity and length of the hopper 120 remain constant, the resistance can be increased or decreased by increasing or decreasing the cross-sectional area. Furthermore, given that the rated power of the electric heating element 110 remains constant, a higher resistance results in greater heat generation and a higher temperature rise.

[0044] Specifically, when the resistor element 140 is attached to the middle section 121, the cross-sectional area of ​​the middle part of the hopper 120 increases, the resistance of the middle part of the hopper 120 decreases, and the heat generation in the middle part of the hopper 120 decreases, resulting in a lower temperature at the middle part of the hopper 120. When the resistor element 140 is separated from the middle section 121, the cross-sectional area of ​​the middle part of the hopper 120 decreases, the resistance of the middle part of the hopper 120 increases, and the heat generation in the middle part of the hopper 120 increases, resulting in a higher temperature at the middle part of the hopper 120. Regardless of whether the resistor element 140 is attached to or separated from the middle section 121, the resistance of the two end sections 122 remains unchanged, that is, the heat generation and temperature rise of the two end sections 122 remain unchanged. Therefore, by having the resistive sheet 140 bonded or separated from the intermediate section 121 by the patching mechanism 130, the temperature in the middle of the hopper 120 can quickly reach the temperature at both ends of the hopper 120 (cooling or heating), thereby ensuring the uniformity of the temperature in the hopper 120. This makes the viscosity of the glass melt in the intermediate section 121 equal to the viscosity of the glass melt in the end section 122, thereby making the glass melt flow rate in the intermediate section 121 equal to the glass melt flow rate in the end section 122, and thus improving the uniformity of the feeding.

[0045] Furthermore, there are multiple surface mount mechanisms 130 and multiple resistor plates 140, each divided into two groups. The two groups of surface mount mechanisms 130 are positioned opposite each other on both sides of the hopper 120 in the width direction. Within each group, multiple surface mount mechanisms 130 are sequentially arranged along the length direction of the hopper 120. Each surface mount mechanism 130 is connected to one resistor plate 140, and each surface mount mechanism 130 is configured to move one resistor plate 140 closer to or further away from the middle section 121. Specifically, the multiple resistor plates 140 and the multiple surface mount mechanisms 130 are independently arranged, and the multiple surface mount mechanisms 130 can be independently controlled.

[0046] Specifically, two sets of resistors 140 are respectively disposed on both sides of the hopper 120 in the width direction, and multiple resistors 140 in each set are arranged sequentially along the length direction of the hopper 120. In the same set of resistors 140, each resistor 140 corresponds to a part of the middle section 121, and multiple resistors 140 can completely cover the middle section 121. By increasing or decreasing the number of resistors 140 attached to the middle section 121, or by changing the position of the resistors 140 attached to the middle section 121, the temperature control accuracy of the middle position of the hopper 120 can be improved, thereby further ensuring the temperature uniformity of the hopper 120. In addition, the positions of multiple resistors 140 in the two sets are one-to-one. Two resistors 140 in the two sets that correspond to each other need to be attached to or separated from the middle section 121 simultaneously (not absolutely simultaneously, a certain degree of time difference is allowed) to ensure the temperature uniformity on both sides of the middle section 121 and ensure product quality.

[0047] In this embodiment, there are six surface mount devices 130 and six resistor pieces 140, that is, three surface mount devices 130 and three resistor pieces 140 in each group. However, this is not the only limitation. In other embodiments, there may be four surface mount devices 130 and eight resistor pieces 140. The number of surface mount devices 130 and resistor pieces 140 is not specifically limited.

[0048] The surface mount mechanism 130 includes a mounting plate 131, a drive unit 132, and a mounting housing 133. The drive unit 132 is mounted on the mounting plate 131 and connected to the mounting housing 133. The resistor 140 is connected to the mounting housing 133. The drive unit 132 can drive the resistor 140 to move through the mounting housing 133, so that the resistor 140 moves closer to or further away from the intermediate section 121.

[0049] Furthermore, the driving component 132 is a lead screw, the axis of which is in the width direction of the hopper 120. The mounting plate 131 has a threaded hole 134, the lead screw is threaded into the threaded hole 134, and is rotatably connected to the fixed shell 133. Specifically, one end of the lead screw is provided with a limiting head 135, and the fixed shell 133 is provided with a stop sleeve 136. The limiting head 135 is located inside the stop sleeve 136. The limiting head 135 can rotate relative to the stop sleeve 136, and the stop sleeve 136 can stop and limit the limiting head 135 to prevent the limiting head 135 from disengaging from the stop sleeve 136, thereby preventing the lead screw from separating from the fixed shell 133 and ensuring that the fixed shell 133 can move under the drive of the lead screw. In addition, a handwheel 137 is provided at the end of the lead screw away from the limit head 135. By manually turning the handwheel 137, the lead screw is driven to rotate relative to the threaded hole 134, so that the lead screw is displaced along its axial direction, thereby driving the fixed shell 133 to move along the width direction of the hopper 120, and thus driving the resistor sheet 140 to move closer to or away from the middle section 121.

[0050] In this embodiment, the displacement function of the fixed shell 133 is achieved by manual operation, thereby driving the resistor 140 to move closer to or away from the middle section 121. However, it is not limited to this. In other embodiments, the driving component 132 can also be an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder, and the displacement function of the fixed shell 133 can be achieved by mechanical drive. The type of driving component 132 is not specifically limited.

[0051] Optionally, the patch assembly 130 further includes a first insulation layer 138. The mounting shell 133 is connected to the resistive sheet 140 via the first insulation layer 138, which is disposed between the resistive sheet 140 and the mounting shell 133. When the resistive sheet 140 is attached to the intermediate section 121, the first insulation layer 138 is configured to insulate the intermediate section 121, thereby reducing heat loss, ensuring temperature uniformity, and improving product quality. In this embodiment, the first insulation layer 138 is insulation cotton.

[0052] Optionally, the feeding device 100 also includes a housing 150. A clearance opening 151 is provided in the middle of the housing 150, and a hopper 120 is connected inside the housing 150. The housing 150 can limit and fix the hopper 120. Specifically, the position of the clearance opening 151 corresponds to the position of the middle section 121. A patching mechanism 130 is mounted on the housing 150 and extends into the clearance opening 151. The clearance opening 151 is configured to allow clearance for the patching mechanism 130, which can drive the resistor 140 to move within the housing 150, so that the resistor 140 is attached to or separated from the middle section 121. Further, the mounting plate 131 of the patching mechanism 130 is connected to the housing 150, and the housing 150 can limit and fix the mounting plate 131.

[0053] Optionally, the feeding device 100 further includes two second insulation layers 160, each second insulation layer 160 being disposed between the outer shell 150 and an end section 122. The second insulation layer 160 is configured to insulate the end section 122 to reduce heat loss, ensure temperature uniformity, and improve product quality. In this embodiment, the second insulation layer 160 is insulation cotton.

[0054] Optionally, the feeding device 100 also includes a plurality of temperature sensors 170. The plurality of temperature sensors 170 are arranged at intervals along the length of the hopper 120 and are all connected to the hopper 120. The plurality of temperature sensors 170 work together to detect the discharge temperature at various positions when the hopper 120 discharges material, thereby facilitating the adjustment of the temperature at the middle position of the hopper 120 to ensure the uniformity of the temperature of the hopper 120.

[0055] It should be noted that a feed inlet 123 is provided at the top center of the hopper 120. The feed inlet 123 is configured to communicate with the discharge channel, so that the molten glass can quickly enter the hopper 120 and fill it under its own gravity and pressure. A discharge nozzle 124 is provided at the bottom of the hopper 120, and an outlet (not shown) is provided on the outer shell 150. The discharge nozzle 124 is located in the outlet, and the molten glass in the hopper 120 can be output from the discharge nozzle 124 under its own gravity and pressure, thus flowing to the forming device in a waterfall shape.

[0056] This application embodiment also provides a feeding method for a feeding device, the feeding method of which includes the following steps:

[0057] Step S110: Detect the discharge temperature of the end section 122 and the middle section 121 respectively.

[0058] It should be noted that in step S110, multiple temperature sensors 170 are used to detect the real-time temperature at various locations when the hopper 120 discharges material, so as to obtain the discharge temperature of the middle section 121 and the two end sections 122, and to obtain the temperature difference between the middle section 121 and the two end sections 122.

[0059] Step S120: If the discharge temperature of the middle section 121 is greater than that of the end section 122, the mounting mechanism 130 is used to drive the resistor sheet 140 to be attached to the middle section 121; if the discharge temperature of the middle section 121 is less than that of the end section 122, the mounting mechanism 130 is used to drive the resistor sheet 140 to be separated from the middle section 121.

[0060] It should be noted that in step S120, if the discharge temperature of the middle section 121 is greater than that of the end section 122, the patching mechanism 130 drives the resistor sheet 140 to be attached to the middle section 121, so that the cross-sectional area of ​​the middle part of the hopper 120 increases, the resistance decreases, and the heat generation decreases, thereby reducing the temperature of the middle part of the hopper 120 and the temperature of the middle section 121 decreases synchronously until it is the same as the discharge temperature of the end section 122, thereby ensuring the temperature uniformity of the hopper 120 and improving the feeding uniformity.

[0061] Conversely, if the discharge temperature of the middle section 121 is lower than that of the end section 122, the patch mechanism 130 is used to drive the resistor sheet 140 to separate from the middle section 121, so that the cross-sectional area of ​​the middle part of the hopper 120 is reduced, the resistance is increased, and the heat generation is increased, thereby raising the temperature of the middle part of the hopper 120 and raising the temperature of the middle section 121 synchronously until it is the same as the discharge temperature of the end section 122, thus ensuring the uniformity of the temperature of the hopper 120 and improving the uniformity of the feeding.

[0062] Furthermore, if the discharge temperature of the middle section 121 is still higher than that of the end section 122 when the mounting mechanism 130 drives the resistor sheet 140 to be attached to the middle section 121, it indicates that the temperature adjustment range of the resistor sheet 140 is limited and insufficient to reduce the temperature of the middle part of the hopper 120 to the discharge temperature of the end section 122. In this case, a thicker resistor sheet 140 can be replaced to further increase the cross-sectional area of ​​the middle part of the hopper 120, reduce the resistance, reduce the heat generation, and thus further reduce the temperature of the middle part of the hopper 120. The temperature of the middle section 121 will also decrease synchronously until it is the same as the discharge temperature of the end section 122, thereby ensuring the temperature uniformity of the hopper 120 and improving the feeding uniformity.

[0063] Furthermore, when the discharge temperature of the middle section 121 is higher than that of the end section 122, the temperature difference between the middle section 121 and the end section 122 varies due to factors such as the on-site environment and the material of the hopper 120. To ensure the uniformity of the temperature of the hopper 120 after the resistance sheet 140 is bonded to the middle section 121, resistance sheets 140 of different thicknesses are required. Specifically, the rated power of the electric heating element 110 remains constant, and the material of the resistance sheet 140 is the same as that of the hopper 120. When the resistance sheet 140 is bonded to the middle section 121, if the thickness of the resistance sheet 140 increases, the cross-sectional area of ​​the middle part of the hopper 120 increases, the resistance decreases, and the heat generation decreases; if the thickness of the resistance sheet 140 decreases, the cross-sectional area of ​​the middle part of the hopper 120 decreases, the resistance increases, and the heat generation increases.

[0064] In this embodiment, both the resistor 140 and the hopper 120 are made of platinum, but this is not the only embodiment. In other embodiments, the resistor 140 and the hopper 120 may also be made of other metal materials. The materials of the resistor 140 and the hopper 120 are not specifically limited.

[0065] In an optional embodiment, the thickness of the resistor sheet 140 is calculated using the formula: K = (N-1) / (2N+1)*W 总 *a; H=N*h;

[0066] In the formula, K is the difference in discharge temperature between the middle section 121 and the end section 122; W 总 Here, denoted as ...

[0067] Specifically, the end section 122 and the middle section 121 have the same length, the same wall thickness, the same resistance (R), and the same heating power (W). Therefore, when the resistance element 140 is not attached to the middle section 121, the total resistance (R) of the hopper 120 is... 总 =3R, rated power W of electric heating element 110 总 =3W. When the resistor 140 is attached to the middle section 121, the thickness of the middle part of the hopper 120 increases. At this time, since H = N*h, R' = R / N+1, and the heating power W1 at the middle part of the hopper 120 is W1 = R' / (R'+2R)*W. 总 Therefore, W1 = 1 / (2N+1)*W 总 Therefore, the heating power of both end sections 122 can be calculated to be W2 = (1 - 1 / (2N+1)*W). 总 ) / 2=N / (2N+1)*W 总 Therefore, we can derive K = (W1 - W2) * a = (N - 1) / (2N + 1) * W 总 *a.

[0068] Furthermore, since there are two sets of resistor sheets 140, and the two sets of resistor sheets 140 are respectively set on both sides of the middle section 121, after the thickness H of the resistor sheet 140 is calculated, it needs to be evenly distributed to both sides of the middle section 121. That is, the thickness of the resistor sheet 140 on one side of the middle section 121 is H / 2, so as to ensure the temperature uniformity on both sides of the middle section 121, thereby ensuring the uniformity of material supply.

[0069] The feeding device 100 provided in this application embodiment has an electric heating element 110 connected to a hopper 120. The hopper 120 includes a middle section 121 and two end sections 122, which are arranged sequentially along the length of the hopper 120. A patching mechanism 130 is connected to a resistor sheet 140, the position of which corresponds to the position of the middle section 121. The patching mechanism 130 is configured to drive the resistor sheet 140 to adhere to or separate from the middle section 121. Compared with the prior art, the feeding device 100 provided in this application, due to the use of a middle section 121 located between the two end sections 122 and a resistor sheet 140 connected to the patching mechanism 130, can achieve rapid temperature adjustment in the middle position of the hopper 120, ensuring the temperature uniformity of the hopper 120, thereby improving the feeding uniformity, avoiding localized misshapen or deformed board surfaces, and ensuring product quality. This enables the feeding method of the feeding device to achieve uniform feeding and improve the yield of microcrystalline glass.

[0070] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. Industrial applicability

[0071] In summary, this application provides a feeding device that can quickly adjust the temperature in the middle of the hopper, ensuring the uniformity of the hopper temperature, thereby improving the uniformity of feeding, avoiding localized misshapen or deformed areas on the plate surface, and ensuring product quality.

[0072] This application also provides a feeding method for a feeding device, which can quickly adjust the temperature in the middle of the hopper, ensure the uniformity of the hopper temperature, thereby improving the uniformity of feeding, avoiding localized misshapen or deformed areas on the plate surface, and ensuring product quality.

Claims

1. A supply device, characterized in that The device includes an electric heating element, a hopper, a patching mechanism, and a resistor. The electric heating element is connected to the hopper, which includes a middle section and two end sections. One end section, the middle section, and the other end section are arranged sequentially along the length of the hopper. The patching mechanism is connected to the resistor, and the position of the resistor corresponds to the position of the middle section. The patching mechanism is configured to drive the resistor to be attached to or separated from the middle section.

2. The feeding device according to claim 1, characterized in that, The number of the patching mechanism and the resistor is multiple. The multiple patching mechanisms and the multiple resistors are divided into two groups. The two groups of patching mechanisms are arranged opposite each other on both sides of the width direction of the hopper. In each group, the multiple patching mechanisms are arranged sequentially along the length direction of the hopper. Each patching mechanism is connected to one resistor.

3. The feeding device according to claim 2, characterized in that, The multiple resistors are each set independently, and the multiple mounting mechanisms are each set independently.

4. The feeding device according to any one of claims 1-3, characterized in that, The mounting mechanism includes a mounting plate and a driver, the driver being mounted on the mounting plate and connected to the resistor sheet.

5. The feeding device according to claim 4, characterized in that, The mounting mechanism also includes a fixed housing, the driving component is connected to the fixed housing, and the resistor is mounted on the fixed housing.

6. The feeding device according to claim 5, characterized in that, The driving component is a lead screw, the axis of which is the width direction of the hopper. The mounting plate has a threaded hole, the lead screw is threaded into the threaded hole, and is rotatably connected to the fixed shell.

7. The feeding device according to claim 5 or 6, characterized in that, The patch assembly further includes a first insulation layer, and the fixing shell is connected to the resistive sheet through the first insulation layer. The first insulation layer is disposed between the resistive sheet and the fixing shell.

8. The feeding device according to any one of claims 1-7, characterized in that, The feeding device also includes a housing, with a clearance opening in the middle of the housing. The hopper is connected inside the housing, and the position of the clearance opening corresponds to the position of the middle section. The patching mechanism is installed on the housing and extends into the clearance opening.

9. The feeding device according to claim 8, characterized in that, The feeding device further includes two second insulation layers, each of which is disposed between the outer shell and one of the end sections.

10. The feeding device according to any one of claims 1-9, characterized in that, The feeding device also includes multiple temperature sensors, which are spaced apart along the length of the hopper and are all connected to the hopper.

11. A feeding method for a feeding device, characterized in that, The feeding device should be configured as described in any one of claims 1-10, wherein the feeding method of the feeding device includes: The discharge temperature of the end section and the middle section are detected respectively; If the discharge temperature of the middle section is greater than that of the end section, the mounting mechanism is used to bond the resistor sheet to the middle section; if the discharge temperature of the middle section is less than that of the end section, the mounting mechanism is used to separate the resistor sheet from the middle section.

12. The feeding method of the feeding device according to claim 11, characterized in that, In the step of using the patch mechanism to bond the resistor sheet to the intermediate section, the formula for calculating the thickness of the resistor sheet is: K = (N - 1) / (2N + 1) * W 总 a; H = N * h; wherein K is the difference between the discharge temperature of the intermediate section and the end section; W 总 is the rated power of the electric heating element; a is the amount of power change required to raise the temperature of the hopper by 1 degree Celsius; H is the thickness of the electrically resistive sheet; h is the wall thickness of the hopper; and N is the ratio of the thickness of the electrically resistive sheet to the wall thickness of the hopper.

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