Photonic integrated circuit chip, optical interconnection module, optical interconnection device, computing device, and system

Abstract

The present disclosure relates to a photonic integrated circuit chip, an optical interconnection module, an optical interconnection device, a computing device, and a system. A plurality of computing devices in the system are connected via optical fibers using optical interconnection devices, and external optical links are switched by controlling optical switching units in the optical interconnection devices, so that communication paths of the plurality of computing devices can be changed.

Description

Photonic integrated circuit chips, optical interconnect modules, optical interconnect devices, computing devices and systems

[0001] This application claims priority to Chinese Patent Application No. 2024119070902, filed on December 23, 2024, entitled "Photonic Integrated Circuit Chip, Optical Interconnect Module, Optical Interconnect Device, Computing Device and System", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of computer technology, and more specifically, to photonic integrated circuit chips, optical interconnect modules, optical interconnect devices, computing devices, and systems. Background Technology

[0003] According to OpenAI data, the computational load of artificial intelligence models is growing far faster than the computing power of computing hardware. As AI (Artificial Intelligence) accelerators achieve continuous computing power improvements through process technology iterations and chip architecture innovations, the interconnect bandwidth between AI accelerators is also constantly increasing. AI accelerator interconnect networks have become crucial for improving overall computing power. The Open Compute Project (OCP) has launched the general-purpose OCP Accelerator Module (OAM), which has been adopted by leading GPU (Graphics Processing Unit) vendors. Currently, to enhance communication between computing modules, eight computing modules are fully interconnected point-to-point on a universal base board (UBB) via PCB (printed circuit board) traces. Due to the need for long PCB traces, computing modules generally require long-range (LR) SerDes interfaces similar to CEI. For full connectivity, each SerDes interface needs to access a specific single computing module, further reducing the bandwidth between each pair of computing modules.

[0004] Furthermore, since the response of electrical channels attenuates with increasing signal rate, higher-speed interfaces often involve more complex architectures and circuit designs, introducing latency costs, consuming more power, and occupying a larger chip area, thus limiting chip I / O bandwidth. Additionally, longer metal wiring distances further deteriorate circuit loss characteristics, limiting the interconnect distance between AI accelerators. Summary of the Invention

[0005] This invention provides a photonic integrated circuit chip, an optical interconnect module, an optical interconnect device, a computing device, and a system. To overcome the shortcomings of existing electrical interconnects, multiple computing devices in this invention are connected by optical fiber using an optical interconnect device. Furthermore, by controlling the optical switching unit within the optical interconnect device to switch the external optical links of the computing devices, the connection topology of the multiple computing devices can be changed.

[0006] An embodiment of the present invention provides a photonic integrated circuit chip, which includes one or more photonic integrated circuit sub-modules, each of the photonic integrated circuit sub-modules comprising:

[0007] Multiple electro-optic conversion modules are configured to carry information from electrical signals into light waves to obtain optical signals;

[0008] A plurality of first optical switching units, each first optical switching unit including a first optical input port, a first optical output port and a second optical output port, the first optical input port being optically communicated with at least a portion of the plurality of electro-optical conversion modules, and each first optical switching unit being configured to selectively output the optical signal input to its first optical input port via its first optical output port or its second optical output port;

[0009] A first optical coupler, which optically communicates with the first optical output port, is configured to optically connect the first optical output ports of a plurality of first optical switching units to a first external fiber optic array for transmission.

[0010] The second optical coupler, which is optically in communication with the second optical output port, is configured to optically connect the second optical output ports of the plurality of first optical switching units to the second external fiber optic array for transmission.

[0011] Multiple photoelectric conversion modules are configured to convert received optical signals into electrical signals;

[0012] A third optical coupler, which optically communicates with a first portion of the plurality of photoelectric conversion modules, and is configured to transmit optical signals from a first receiving external fiber optic array to that portion of the plurality of photoelectric conversion modules; and

[0013] A fourth optical coupler is optically connected to the second part of the plurality of optoelectronic conversion modules and configured to transmit optical signals from the second receiving external fiber array to the plurality of optoelectronic conversion modules of that part.

[0014] In some embodiments, each of the photonic integrated circuit submodules further includes multiple wavelength multiplexers and multiple demultiplexers; the multiple electro-optic conversion modules are configured as multiple electro-optic conversion module arrays, and the multiple photoelectric conversion modules are configured as multiple photoelectric conversion module arrays.

[0015] The electro-optical conversion module array is optically connected to the corresponding first optical switching unit through the wavelength multiplexer. Each wavelength multiplexer has multiple optical input ports and one optical output port. Each of the multiple optical input ports of the wavelength multiplexer is optically connected to one electro-optical conversion module in the electro-optical conversion module array, and one optical output port of the wavelength multiplexer is optically connected to the first optical input port of one of the first optical switching units.

[0016] The photoelectric conversion module array is optically connected to the third optical coupler or the fourth optical coupler through the demultiplexer. Each of the demultiplexers has one optical input port and multiple optical output ports. One optical input port of the demultiplexer is connected to the third optical coupler or the fourth optical coupler, and each of the multiple optical output ports of the demultiplexer is optically connected to one photoelectric conversion module in the photoelectric conversion module array.

[0017] In some implementations, the first optical switching unit is a MEMS optical path switching unit or an MZI optical path switching unit.

[0018] In some embodiments, the first optical switching unit is an MZI optical path switching unit, which includes:

[0019] The first beam splitter has one optical input port and two optical output ports;

[0020] The second beam splitter has two optical input ports and two optical output ports; and

[0021] Two phase shifters are respectively connected between the two optical output ports of the first beam splitter and the two optical input ports of the second beam splitter.

[0022] In some embodiments, the electro-optical conversion module includes a modulator, and the photoelectric conversion module includes a detector. In some embodiments, the modulator includes at least one of the following: a micro-ring modulator, a Mach-Zehnder modulator, an electroabsorption modulator; and / or, the detector includes a micro-ring detector or a photodiode.

[0023] In some embodiments, each of the photonic integrated circuit submodules further includes:

[0024] The fifth optical coupler is configured to input light waves from an off-chip light source into the photonic integrated circuit submodule;

[0025] An optical power splitter, which is optically connected to the fifth optical coupler, is configured to split an input light wave into multiple output light waves, each of which has substantially the same power, and the multiple output light waves are transmitted to each electro-optical conversion module.

[0026] Embodiments of the present invention also provide an optical interconnect module, which includes: a photonic integrated circuit chip as described in any embodiment of the present invention; and an analog electrical chip for transceiver.

[0027] The transceiver analog electrical chip is configured to convert a received first digital electrical signal into a driving analog electrical signal and transmit the driving analog electrical signal carrying information to at least one of the plurality of electro-optical conversion modules in the photonic integrated circuit chip, or to receive a received analog electrical signal output by at least one of the plurality of photoelectric conversion modules in the photonic integrated circuit chip and convert the received analog electrical signal into a second digital electrical signal.

[0028] In some embodiments, the optical interconnect module further includes a substrate. The photonic integrated circuit chip is mounted on the substrate, and the transceiver analog electrical chip is disposed above the photonic integrated circuit chip. The transceiver analog electrical chip receives the first digital electrical signal and / or transmits the second digital electrical signal through conductive vias penetrating the photonic integrated circuit chip.

[0029] In some embodiments, the optical interconnect module further includes a substrate. The photonic integrated circuit chip is mounted on the substrate, and the transceiver analog electrical chip is mounted on the photonic integrated circuit chip on the opposite side of the substrate. The transceiver analog electrical chip receives the first digital electrical signal and / or transmits the second digital electrical signal through wiring on the substrate.

[0030] In some embodiments, the optical interconnect module further includes an optical switching control analog electrical chip for controlling the output of the first optical switching unit, which controls the output of the first optical switching unit so that the optical signal input to the first optical input port of the first optical switching unit is output from the first optical output port or the second optical output port.

[0031] In some embodiments, the optical switching control analog electrical chip is disposed above the photonic integrated circuit, and receives the optical switching control analog signal through a conductive via penetrating the photonic integrated circuit chip.

[0032] Furthermore, embodiments of the present invention provide an optical interconnect device comprising:

[0033] First PCB board;

[0034] The optical interconnect module according to any embodiment of the present invention is disposed on the first PCB board;

[0035] The fiber optic array includes a first external fiber optic array for transmitting, a second external fiber optic array for transmitting, a first external fiber optic array for receiving, and a second external fiber optic array for receiving.

[0036] The fiber optic interface includes a first fiber optic interface and a second fiber optic interface, which are disposed on the first PCB board. The first fiber optic interface is optically connected to the optical interconnect module through the first external fiber optic array for transmitting and the first external fiber optic array for receiving. The second fiber optic interface is optically connected to the optical interconnect module through the second external fiber optic array for transmitting and the second external fiber optic array for receiving.

[0037] An electrical communication interface is disposed on the first PCB board for receiving a first digital signal and / or sending a second digital electrical signal;

[0038] A re-timer, mounted on the first PCB board, is communicatively connected to the electrical communication interface and the optical interconnect module. It is used to reshape the first digital electrical signal and transmit the reshaped electrical signal to the optical interconnect module; and / or reshape the second digital electrical signal received from the optical interconnect module and transmit it out through the electrical communication interface.

[0039] In some embodiments, the retimer is communicatively connected to the optical interconnect module via traces on the first PCB board. In some embodiments, the retimer is also used to receive a first optical switching control signal and / or transmit a second optical switching control signal.

[0040] In some embodiments, the optical interconnect device further includes a laser module for generating light waves, which is disposed on the first PCB board and optically connected to the optical interconnect module via an input fiber array to input light waves to the optical interconnect module.

[0041] Furthermore, embodiments of the present invention provide a computing device comprising:

[0042] Multiple computing modules;

[0043] Optical interconnect devices according to any one embodiment of the present invention;

[0044] The first part of the electrical communication interface of the plurality of computing modules is communicatively connected to the plurality of optical interconnect devices.

[0045] In some embodiments, the computing device further includes a second PCB board. The plurality of computing modules are disposed on the second PCB board, and the plurality of optical interconnect devices are also disposed on the second PCB board. The plurality of computing modules are communicatively connected to the plurality of optical interconnect devices via traces on the second PCB board. A second portion of the electrical communication interface of each of the plurality of computing modules is communicatively connected to another of the plurality of computing modules via additional traces on the second PCB board.

[0046] In some embodiments, at least one of the plurality of optical interconnect devices communicates with each of the plurality of computing modules.

[0047] Furthermore, embodiments of the present invention also provide a computing system comprising a plurality of computing devices as described in any one embodiment of the present invention. Optical fiber interfaces of a plurality of optical interconnects of the plurality of computing devices are physically connected via optical fibers to communicatively connect the plurality of computing devices; wherein the plurality of computing devices includes a first computing device, a second computing device, and a third computing device; a first optical fiber interface of a first portion of the optical interconnect of the first computing device is physically connected to a first optical fiber interface of a first portion of the optical interconnect of the second computing device via optical fibers, and a second optical fiber interface of a first portion of the optical interconnect of the first computing device is physically connected to a second optical fiber interface of a first portion of the optical interconnect of the third computing device via optical fibers; and the communication path of the plurality of computing devices or their plurality of computing modules can be changed by controlling a first optical switching unit on the optical interconnect of the plurality of computing devices.

[0048] In some embodiments, the first portion of the optical interconnect of the first computing device enables the first computing device to selectively communicate with the second computing device or the third computing device. The first portion of the optical interconnect of the first computing device enables the first computing device to communicate with the second computing device, and when the second computing device malfunctions, the first portion of the optical interconnect of the first computing device enables the first computing device to communicate with the third computing device.

[0049] In some embodiments, in a computing system where the communication paths of the plurality of computing devices can be changed, at least one of the plurality of computing devices serves as a backup device, while the remaining computing devices are operating devices in normal operation.

[0050] When one or more of the multiple working devices fail, the communication paths of the multiple computing devices are changed by controlling the first optical switching unit on the optical interconnect device of the multiple computing devices, so as to isolate the failed working device and make an equal number of backup devices as normal working devices.

[0051] As can be seen from the above, the optical interconnect structure of the present invention breaks through the interconnection distance limitation of traditional PCB board traces. By connecting long distances through optical fibers, the existing multi-card computing system can be decoupled, so that the computing power improvement of nodes (i.e. node computing devices) is no longer hierarchical, which is conducive to the large-scale expansion of computing systems.

[0052] The embodiments of the present invention connect multiple computing devices through optical interconnection devices and direct fiber optic connections, avoiding the use of external electrical switches and optical switches, thus saving interconnection costs.

[0053] The embodiments of this invention can perform redundant configuration of the computing system. The redundancy granularity can be a single computing device. By changing the communication path through optical interconnect devices and removing / isolating faulty computing devices, several other computing devices can form a new supernode without affecting the operation of the system. Compared with replacing the entire supernode, this can significantly reduce the deployment cost of the computing system and achieve millisecond-level topology reset time, resulting in low latency and high cluster operating efficiency.

[0054] Various aspects, features, and advantages of the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Attached Figure Description

[0055] Figure 1 is a cross-sectional schematic diagram showing an example structure of an optical interconnect module according to an embodiment of the present invention.

[0056] Figure 2A is a schematic diagram showing an example of the photonic circuit structure formed on the photonic integrated circuit chip in the optical interconnect module shown in Figure 1; Figure 2B is a schematic diagram showing another example of the photonic circuit structure formed on the photonic integrated circuit chip in the optical interconnect module shown in Figure 1.

[0057] Figure 3 is a schematic diagram showing an example structure of the first optical switching unit on the photonic integrated circuit chip shown in Figures 2A and 2B.

[0058] Figure 4 is a schematic diagram showing the planar layout of an optical interconnect device according to an embodiment of the present invention.

[0059] Figure 5 is a schematic diagram showing the packaging structure of the optical interconnect device shown in Figure 4.

[0060] Figure 6 is a schematic diagram illustrating an example structure of a computing device according to an embodiment of the present invention.

[0061] Figure 7 is a schematic diagram illustrating the communication path of the computing module in the computing device according to an embodiment of the present invention.

[0062] Figure 8 is a schematic diagram illustrating the communication path between multiple computing devices in a computing system according to an embodiment of the present invention.

[0063] Figures 9 and 10 illustrate the changes in communication paths between multiple computing modules in a computing device according to an embodiment of the present invention. Detailed Implementation

[0064] Exemplary embodiments will now be described in more detail with reference to the accompanying drawings. Certain terms may be used for reference only and are not intended to limit the scope of protection. For example, terms such as “top,” “bottom,” “upper,” “lower,” “above,” and “below” may be used to refer to orientations in the accompanying drawings. Terms such as “front,” “back,” “rear,” “side,” “outer,” and “inner” may be used to describe the orientation and / or position of parts of a component within a consistent but arbitrary frame of reference, which can be clearly understood by referring to the text describing the component in question and the associated drawings. The terms “first,” “second,” and other similar numerical terms are used to denote different objects and do not imply order or sequence unless the context otherwise defines them.

[0065] It should be understood that when an element or feature is referred to as "on another element or layer" or "connected to or linked to another element or layer," it may be directly on, connected to, or linked to another element or feature, or there may be one or more intermediate elements or features. Furthermore, it should be understood that when an element or feature is referred to as "between" two elements or features, it may be the only element or feature between the two elements or features, or there may be one or more intermediate elements or features.

[0066] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the invention. Such terms may include words specifically mentioned herein, derivatives thereof, and words with similar meanings. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” and “having” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of…” modify the entire list of elements when preceding a list of elements, rather than modifying individual elements of that list.

[0067] As used herein, the terms “basically,” “about,” and similar terms are used as approximations rather than as terms of degree, and are intended to take into account the inherent variations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. As used herein, the terms “use,” “being used,” and “being used” are to be regarded as synonymous with the terms “utilization,” “being utilized,” and “being exploited,” respectively.

[0068] Figures 1 to 3 illustrate exemplary embodiments of an optical interconnect module according to an embodiment of the present invention. In an exemplary embodiment, the optical interconnect module includes a photonic integrated circuit chip 201 and a transceiver analog electrical chip 202. In some embodiments, as shown in Figure 1, the photonic integrated circuit chip 201 is disposed on a substrate 204, and the transceiver analog electrical chip 202 is disposed on the photonic integrated circuit chip 201. The photonic integrated circuit chip includes one or more photonic integrated circuit sub-modules. As shown in Figure 2A, each photonic integrated circuit sub-module includes multiple modulators 302 (which serve as an example of an electro-optical conversion module), multiple wavelength multiplexers 303, multiple first optical switching units 304, multiple demultiplexers 305, multiple detectors 306 (which serve as an example of a photoelectric conversion module), a first optical coupler 307, a second optical coupler 308, a third optical coupler 309, and a fourth optical coupler 310, etc.

[0069] In an exemplary embodiment, a group of modulators (which may also be configured as a "modulator array") among a plurality of modulators 302 are optically connected to a first optical switching unit 304 via a wavelength multiplexer 303. Specifically, the wavelength multiplexer 303 has a plurality of optical input ports and an optical output port. Each of the plurality of optical input ports of the wavelength multiplexer is connected to a modulator 302, and one of the optical output ports of the wavelength multiplexer is connected to a first optical switching unit 304.

[0070] Each of the plurality of first optical switching units 304 is optically connected to a set of modulators 303 via a wavelength multiplexer 303. Specifically, each first optical switching unit 304 includes a first optical input port, a first optical output port, and a second optical output port. The first optical input port of the first optical switching unit 304 is connected to the optical output port of the wavelength multiplexer 303. The first optical output port of the first optical switching unit 304 is connected to a first optical coupler 307, which is configured to optically connect the first optical output ports of the plurality of first optical switching units 304 to a first external fiber optic for transmission. The second optical output port of the first optical switching unit 304 is connected to a second optical coupler 308, which is configured to optically connect the second optical output ports of the plurality of first optical switching units 304 to a second external fiber optic for transmission. Each first optical switching unit 304 is configured to selectively output the optical signal input to its first optical input port via either the first optical output port or the second optical output port.

[0071] The third optical coupler 309 and the fourth optical coupler 310 are optically connected to a plurality of demultiplexers 305, each demultiplexer 305 being connected to a group of detectors (or configured as a "detector array") among a plurality of detectors 306. Specifically, each of the demultiplexers 305 has an optical input port and a plurality of optical output ports. One optical input port of the demultiplexer 305 is connected to either the third optical coupler 309 or the fourth optical coupler 310, and each of the plurality of optical output ports of the demultiplexer 305 is connected to one detector 306. The third optical coupler 309 optically communicates with a portion of the plurality of detectors 306 through a first portion of the plurality of demultiplexers 305 to transmit optical signals from a first receiving external fiber array to the plurality of detectors in that portion; the fourth optical coupler 310 optically communicates with a second portion of the plurality of detectors 306 to transmit optical signals from a second receiving external fiber array to the plurality of detectors in that portion. The first and second external fiber optic arrays for receiving can be respectively connected to the first optical coupler 307 and the second optical coupler 308 of another optical interconnect module.

[0072] The plurality of detectors 306 are configured to convert the received optical signals into electrical signals.

[0073] In an exemplary embodiment, each modulator array modulates light waves of different wavelengths, and each modulator 302 modulates the input light wave 301 according to the electrical signal received from the transceiver analog electrical chip 202, thereby loading the information carried by the electrical signal into the input light wave to obtain an optical signal carrying information. The wavelength multiplexer 303 integrates the optical signals of different wavelengths into a single optical signal, which is then path-selected by the first optical switching unit 304 and enters either the first external optical fiber array (not shown) through the first optical coupler 307 or the second external optical fiber array (not shown) through the second optical coupler 308, thus transmitting the optical signal.

[0074] In an exemplary embodiment, the optical signals received by the third optical coupler 309 and the fourth optical coupler 310 are demultiplexed by the corresponding demultiplexers 305 to obtain multiple optical signals. These multiple optical signals are then transmitted to corresponding detectors 306, where they undergo photoelectric conversion to obtain received analog electrical signals. These received analog electrical signals can be processed by the transceiver analog electrical chip 202 and sent to the data processing module.

[0075] In some embodiments, the transceiver analog electrical chip 202 is configured to convert a received first digital electrical signal into a driving analog electrical signal and transmit the driving analog electrical signal carrying the information to at least one of a plurality of modulators 302 in the photonic integrated circuit chip 201. The modulator 302 is configured to modulate the information carried by the driving analog electrical signal onto the optical signal. The transceiver analog electrical chip 202 is also configured to receive a received analog electrical signal output from at least one of a plurality of detectors 306 in the photonic integrated circuit chip 201, and convert the received analog electrical signal into a second digital electrical signal, which can be sent to a data processing module.

[0076] In some embodiments, as shown in FIG1, the transceiver analog electrical chip 202 is disposed above the photonic integrated circuit chip 201, and receives the first digital electrical signal and / or transmits the second digital electrical signal through conductive vias penetrating the photonic integrated circuit chip 201. Specifically, the transceiver analog electrical chip 202 is mounted on the opposite side of the photonic integrated circuit optical chip 201 relative to the substrate 204.

[0077] In an optional implementation, when the input light wave 301 is single-wavelength light, the photonic integrated circuit chip 201 can be configured without the wavelength multiplexer 303 and demultiplexer 305. Specifically, as shown in FIG2B, a first optical input port of a first optical switching unit 304 is connected to a modulator 302, a first optical output port is connected to a first optical coupler 307, and a second optical output port is connected to a second optical coupler 308. The third optical coupler 309 can be directly connected to a portion of the plurality of detectors 306, and the fourth optical coupler 310 can be directly connected to another portion of the plurality of detectors 306.

[0078] In an optional implementation, as shown in FIG2B, the photonic integrated circuit chip includes multiple photonic integrated circuit sub-modules, each having the same circuit structure. For example, each photonic integrated circuit sub-module includes: eight modulators 302 and corresponding eight first optical switching units 304, sixteen detectors 306, a first optical coupler 307, a second optical coupler 308, a third optical coupler 309, and a fourth optical coupler 310.

[0079] In an optional embodiment, the photonic integrated circuit chip 201 further includes a fifth optical coupler (not shown) and an optical power splitter (not shown). The fifth optical coupler is configured to input light waves from an off-chip light source into the photonic integrated circuit chip 201. The optical power splitter is optically connected to the fifth optical coupler and is configured to split one input light wave into multiple output light waves 301, each of which has substantially the same power. The multiple output light waves 301 are transmitted to respective modulators 302.

[0080] In some embodiments, the first optical switching unit 304 can be a 1×2 optical switching unit. In some embodiments, the first optical switching unit 304 can be a MEMS optical path switching unit or a Mach-Zehnder interferometer (MZI) optical path switching unit. As shown in Figure 3, the first optical switching unit 304 can adopt a Mach-Zehnder interferometer structure, specifically including: a first beam splitter 408, which has one optical input port and two optical output ports; a second beam splitter 407, which has two optical input ports and two optical output ports; and two phase shifters 406, which are respectively connected between the two optical output ports of the first beam splitter 408 and the two optical input ports of the second beam splitter 407. In some embodiments, the phase shifter 406 is an electro-optic or thermo-optic phase shifter. By controlling the upper and lower arms of the electro-optic or thermo-optic phase shifter 406, the phase of the optical signal can be changed and the output port of the optical signal can be selected by using the interference effect. In optional embodiments, the first optical switching unit 304 can be a 1×n optical switching unit, where n can be an integer greater than 2.

[0081] In some embodiments, the modulator 302 includes at least one of the following: a micro-ring modulator, a Mach-Zehnder modulator, and an electroabsorption modulator. The detector 306 includes a micro-ring detector or a photodiode.

[0082] In an optional embodiment, although not illustrated, it is understood that each photonic integrated circuit submodule may further include a second optical switching unit, a sixth optical coupler, and a seventh optical coupler. The third optical input port of the second optical switching unit is connected to the first optical output port of the first optical switching unit, and the second output port of the first optical switching unit is connected to the second optical coupler 308. The fourth optical output port of the second optical switching unit is connected to the first optical coupler 307, and the fifth optical output port is connected to the sixth optical coupler. Here, this embodiment allows the input optical signal to be output from any one of three paths via the first and second optical switching units. Optionally, the second optical switching unit has the same structure as the first optical switching unit. The invention is not limited to this; multiple first and second optical switching units can be configured to provide more output ports, thereby enabling more path selection. The seventh optical coupler communicates optically with a portion of the plurality of detectors to transmit optical signals from the third receiving external fiber optic array to that portion of the plurality of detectors.

[0083] As shown in Figures 2A and 2B, the number of detectors 306 is twice that of modulators 302. In an optional embodiment, each photonic integrated circuit submodule further includes a third optical switching unit (not shown). The detectors or demultiplexers are optically connected to the third optical coupler 309 and the fourth optical coupler 310 through the third optical switching unit, thereby making the number of detectors or detector arrays equal to the number of modulators or modulator arrays. Specifically, the third optical switching unit includes a first optical input port, a second optical input port, and an optical output port. The first optical input port of the third optical switching unit is connected to the third optical coupler 309, the second optical input port of the third optical switching unit is connected to the fourth optical coupler 310, and the optical output port of the third optical switching unit is connected to the detector or the demultiplexer. By controlling the third optical switching unit, the first optical input port of the third optical switching unit can be connected to the optical output port of the third optical switching unit, or the second optical input port of the third optical switching unit can be connected to the optical output port of the third optical switching unit. This allows the number of detectors to be configured to be the same as the number of modulators.

[0084] In some embodiments, the third optical switching unit is a MEMS optical path switching unit or an MZI optical path switching unit. By setting up the third optical switching unit, a detector / detector array can be used to receive optical signals from the third optical coupler and the fourth optical coupler at different times, thereby reducing the number of detectors / detector arrays.

[0085] It should be understood that the aforementioned optical interconnect module can be placed in an optical interconnect device, for example, it can be an optical interconnect expansion card that is connected (e.g., plugged in) to a corresponding computing device.

[0086] Figures 4 and 5 illustrate an exemplary embodiment of an optical interconnect device. As shown in Figures 4 and 5, the optical interconnect device 100 includes a PCB board 207, an optical interconnect module 200, a laser module 205, fiber optic interfaces (including a first fiber optic interface 206-1 and a second fiber optic interface 206-2), an electrical communication interface (e.g., a high-speed interface 211), a retimer 208, a voltage regulation module 209 (e.g., 54V to 12V), a voltage regulation module 210 (12V to a voltage rail (i.e., the maximum voltage input range)), etc.

[0087] The optical interconnect module 200 is disposed on the PCB board 207 and can be any of the optical interconnect modules described in the above embodiments or implementations. This optical interconnect module includes a photonic integrated circuit chip 201, a transceiver analog electrical chip 202, and a corresponding substrate 204. A laser module 205 is disposed on the PCB board 207 and is used to generate light waves. The laser module 205 is optically connected to the optical interconnect module 200 via an input fiber array 203 to input light waves into the optical interconnect module 200.

[0088] The fiber optic interface is disposed on the PCB board 207 and is optically connected to the optical interconnect module 200 via a communication fiber optic array to realize optical communication with the optical interconnect module 200. The communication fiber optic array includes a first external fiber optic array for transmitting, a second external fiber optic array for transmitting, a first external fiber optic array for receiving, and a second external fiber optic array for receiving. A high-speed interface 211 is disposed on the PCB board 207 for receiving the first digital signal and / or transmitting a second digital electrical signal.

[0089] The optical fiber interface includes a first optical fiber interface 206-1 and a second optical fiber interface 206-2 arranged side by side. The first optical fiber interface 206-1 is optically connected to the optical interconnect module via a first external optical fiber array for transmitting and a first external optical fiber array for receiving. The second optical fiber interface 206-2 is optically connected to the optical interconnect module via a second external optical fiber array for transmitting and a second external optical fiber array for receiving. Specifically, the first optical fiber interface 206-1 is optically connected to a first optical coupling interface on a photonic integrated circuit chip 201 in the optical interconnect module via the first external optical fiber array for transmitting, and to a third optical coupling interface on the photonic integrated circuit chip 201 in the optical interconnect module via the first external optical fiber array for receiving. The second optical fiber interface 206-2 is optically connected to a second optical coupling interface on the photonic integrated circuit chip 201 in the optical interconnect module via the second external optical fiber array for transmitting, and to a fourth optical coupling interface on the photonic integrated circuit chip 201 in the optical interconnect module via the second external optical fiber array for receiving.

[0090] The re-timer 208 is mounted on the PCB board 207 and is communicatively connected to the high-speed interface 211 and the optical interconnect module 200. It is used to reshape the first digital electrical signal and transmit the reshaped signal to the optical interconnect module 200; and / or to reshape the second digital electrical signal received from the optical interconnect module 200 and transmit it via the electrical communication interface. Each re-timer 208 has multiple communication channels, and multiple electrical communication interfaces have multiple communication channels. The total number of communication channels of the re-timer 208 is equal to the total number of telecommunication channels of the electrical communication interfaces. The re-timer 208 is communicatively connected to the optical interconnect module 200 via PCB board traces. In some embodiments, the re-timer 208 is also used to receive a first optical switching control signal and / or send a second optical switching control signal, which is converted into an analog optical switching control signal for controlling the optical switching unit after digital-to-analog conversion.

[0091] The high-speed interface 211 receives an electrical signal from a transmitting end, such as a computing module. This electrical signal is re-formed via a re-timer 208. The re-formed high-speed electrical signal is transmitted to the edge of the optical interconnect module 200 via traces on the packaging substrate and the shorter PCB board 207. It is further transmitted to the corresponding transceiver analog electrical chip 202 via metal traces and through-silicon vias 212 on the substrate 204. After signal amplification and electro-optic / photoelectric conversion by the components of the analog electrical chip 202 and the photonic integrated circuit chip 201, it is transmitted via optical fiber. For example, the optical interconnect module 200 receives a laser (light wave) generated by the laser module 205, and modulates the electrical signal received by the transceiver analog electrical chip 202 into the laser through a modulator to obtain an information-carrying optical signal. After optical path selection by the first optical switching unit in the photonic integrated circuit chip, the optical signal is output to the communication peer (e.g., a computing module on another computing device) via optical fiber and optical fiber interface (first optical fiber interface 206-1 and / or second optical fiber interface 206-2). On the other hand, the optical signal received through the optical fiber interface and optical fiber is photoelectrically converted by the detector of the optical interconnect module 200, and the resulting electrical signal is sent to the receiving end (e.g., a computing module) through the transceiver analog electrical chip 202, the retimer 208 and the high-speed interface 211.

[0092] In an exemplary embodiment, the optical interconnect device 100 can be used to communicatively connect multiple computing modules to form a computing device. As shown in FIG6, the computing device includes eight computing modules (M1 to M8) and four optical interconnect devices 100 disposed on a PCB board 102. In some embodiments, computing modules M1 to M8 are connected to the optical interconnect devices 100 via PCB board traces 103 on the PCB board 102 to form a computing device called an eight-card system. The computing modules M1 to M8 are equipped with high-speed long-distance SerDes interfaces to communicate with the high-speed interface 211 of the optical interconnect devices 100. Any computing module within a computing device can communicate with a corresponding computing module on another computing device via optical interconnect devices and optical fibers.

[0093] In an exemplary embodiment, multiple computing modules within each computing device (e.g., the eight computing modules illustrated in FIG. 6) communicate with each other via PCB board traces. Each computing module has multiple electrical communication interfaces (e.g., high-speed long-distance SerDes interfaces). For each computing module, a portion of the electrical communication interfaces are connected to an optical interconnect device via PCB board traces for communication between computing modules on different computing devices, while another portion of the electrical communication interfaces are connected to other computing modules within the same computing device via additional PCB board traces for communication between computing modules within the same computing device.

[0094] In an exemplary embodiment, each of the optical interconnect devices 100 is interconnected with each of the computing modules within the computing device. For example, the first optical interconnect device 100 is connected to the first electrical communication interface of each of the computing modules M1-M8; the second optical interconnect device 100 is connected to the second electrical communication interface of each of the computing modules M1-M8; the third optical interconnect device 100 is connected to the third electrical communication interface of each of the computing modules M1-M8; and the fourth optical interconnect device 100 is connected to the fourth electrical communication interface of each of the computing modules M1-M8.

[0095] In optional embodiments, the computing module can be, for example, a GPU (Graphics Processing Unit), an NPU (Network Processing Unit), etc. For example, as shown in Figure 7, the four electrical communication interfaces of GPU1 to GPU8 are directly interconnected via PCB traces. In Figure 7, GPU1 to GPU4 are interconnected in pairs to form a first module, and GPU5 to GPU8 are interconnected in pairs to form a second module, serving as the first level. Then, GPU1 of the first module is connected to GPU8 of the second module, GPU2 of the first module is connected to GPU7 of the second module, GPU3 of the first module is connected to GPU6 of the second module, and GPU4 of the first module is connected to GPU5 of the second module, serving as the second level. Thus, GPU1 to GPU8 are configured in a two-level connection structure.

[0096] In an exemplary embodiment, a plurality of computing devices are connected via a plurality of optical interconnects 100 and optical fibers to form a computing system, wherein the communication paths of the plurality of computing devices in the computing system can be changed by controlling the first optical switching unit 304 on the optical interconnects 100.

[0097] As shown in Figure 8, the computing system includes N (N is an integer greater than 2) computing devices S1 to S2. N For example, multiple computing devices S1 to S2 NA one-dimensional (1D) ring is formed by interconnecting optical fibers using optical interconnect devices. Exemplarily, as shown in FIG6, each computing device has four optical interconnect devices, referred to as the first optical interconnect device, the second optical interconnect device, the third optical interconnect device, and the fourth optical interconnect device. As shown in FIG2A, the photonic integrated circuit chip in each optical interconnect device has at least four optical couplers connected to external optical fibers. Each optical coupler of one computing device's optical interconnect device can be connected to a corresponding optical coupler of another computing device's optical interconnect device via optical fiber. The optical fiber connection described herein includes: an optical coupler of one computing device's optical interconnect device being connected to a corresponding optical fiber interface via an internal optical fiber (e.g., a transmitting fiber array or a receiving fiber array), which is connected to an external optical fiber (e.g., a transmission fiber) to an optical fiber interface of another computing device's optical interconnect device; and the optical fiber interface of the other computing device's optical interconnect device being connected to a corresponding optical coupler via a corresponding internal optical fiber.

[0098] For example, in the computing system shown in FIG8, the first optical coupler in the first and second optical interconnect devices on the first computing device S1 is connected to the Nth computing device S... N The third optical couplers of the third and fourth optical interconnect devices on the first computing device S1 are connected one-to-one via optical fibers; the third optical couplers of the first and second optical interconnect devices on the first computing device S1 are connected to the third optical coupler of the Nth computing device S1. N The third and fourth optical interconnects on the first computing device S1 are connected one-to-one with the first optical coupler via optical fibers. The first optical coupler in the third and fourth optical interconnects on the first computing device S1 is connected one-to-one with the third optical coupler in the first and second optical interconnects on the second computing device S2 via optical fibers; the third optical coupler in the third and fourth optical interconnects on the first computing device S1 is connected one-to-one with the first optical coupler in the first and second optical interconnects on the second computing device S2 via optical fibers. The second optical coupler in the first and second optical interconnects on the first computing device S1 is connected one-to-one with the first optical coupler in the (N-1)th computing device S2. N-1 The fourth optical couplers of the third and fourth optical interconnect devices on the first computing device S1 are connected one-to-one via optical fibers; the fourth optical couplers of the first and second optical interconnect devices on the first computing device S1 are connected to the (N-1)th computing device S... N-1 The third and fourth optical interconnects on the first computing device S1 are connected to the second optical coupler via optical fibers. The second optical coupler in the third and fourth optical interconnects on the first computing device S1 is connected to the fourth optical coupler in the first and second optical interconnects on the third computing device S3 via optical fibers; the fourth optical coupler in the third and fourth optical interconnects on the first computing device S3 is connected to the second optical coupler in the first and second optical interconnects on the third computing device S3 via optical fibers.

[0099] The Mth (where 2 < M < N-1)th computing device S M The first optical coupler in the first and second optical interconnect devices on the M-1th computing device S M-1 The third and fourth optical interconnect devices on the upper part are connected one-to-one via optical fibers; the Mth computing device S M The third optical coupler in the first and second optical interconnect devices on the M-1th computing device S M-1 The third and fourth optical interconnect devices are connected one-to-one with the first optical coupler via optical fibers. The Mth computing device S... M The first optical coupler in the third and fourth optical interconnect devices is connected to the (M+1)th computing device S. M+1 The third optical couplers of the first and second optical interconnect devices are connected one-to-one via optical fibers; the Mth computing device S M The third optical coupler in the third and fourth optical interconnect devices is connected to the (M+1)th computing device S. M+1 The first and second optical interconnect devices are connected one-to-one with the first optical coupler via optical fibers. The Mth computing device S... M The second optical coupler in the first and second optical interconnect devices on the M-2th computing device S M-2 The fourth optical coupler of the third and fourth optical interconnect devices are connected one-to-one via optical fibers; the Mth computing device S M The fourth optical coupler in the first and second optical interconnect devices on the M-2th computing device S M-2 The third and fourth optical interconnects are connected one-to-one with the second optical coupler via optical fibers. The Mth computing device S... M The second optical coupler in the third and fourth optical interconnect devices is connected to the (M+2)th computing device S. M+2 The fourth optical couplers of the first and second optical interconnect devices are connected one-to-one via optical fibers; the Mth computing device S M The fourth optical coupler in the third and fourth optical interconnect devices is connected to the (M+2)th computing device S. M+2 The first and second optical interconnect devices are connected to the second optical coupler via optical fibers in a one-to-one correspondence.

[0100] The Nth computing device S N The first optical coupler in the first and second optical interconnect devices on the N-1th computing device S N-1 The third and fourth optical interconnect devices on the upper part are connected one-to-one via optical fibers to their respective third optical couplers; the Nth computing device S N The third optical coupler in the first and second optical interconnect devices on the N-1th computing device S N-1 The third and fourth optical interconnect devices are connected one-to-one with the first optical coupler via optical fibers. The Nth computing device S NThe first optical coupler in the third and fourth optical interconnect devices on the first computing device S1 is connected one-to-one with the third optical coupler in the first and second optical interconnect devices on the first computing device S1 via optical fiber; the Nth computing device S N The third optical coupler in the third and fourth optical interconnect devices on the first computing device S1 is connected one-to-one with the first optical coupler in the first and second optical interconnect devices on the first computing device S1 via optical fibers. The Nth computing device S1 N The second optical coupler in the first and second optical interconnect devices on the N-2th computing device S N-2 The fourth optical coupler of the third and fourth optical interconnect devices are connected one-to-one via optical fibers; the Nth computing device S N The fourth optical coupler in the first and second optical interconnect devices on the N-2th computing device S N-2 The third and fourth optical interconnect devices are connected one-to-one with the second optical coupler via optical fibers. The Nth computing device S N The second optical coupler in the third and fourth optical interconnect devices on the first computing device S2 is connected one-to-one with the fourth optical coupler in the first and second optical interconnect devices on the second computing device S2 via optical fibers; the Nth computing device S N The fourth optical coupler in the third and fourth optical interconnect devices on the first computing device S2 is connected to the second optical coupler in the first and second optical interconnect devices on the second computing device S2 via optical fibers.

[0101] For example, when the system is operating, at least one computing device serves as a backup device, while the rest serve as active devices. When a failure occurs in one or more active devices, the communication paths in the optical interconnect device are changed, allowing an equal number of backup devices to join the communication and become active devices, thus isolating the failed active devices.

[0102] As shown in Figure 9, computing device S M The first device is a backup unit; the remaining computing devices are active. Solid black lines indicate signal transmission, while dashed lines indicate no signal transmission. Specifically, computing device S... M With computing device S M-1 Computing device S M+1 No signal passes through the connection link between them, indicated by a dashed line. As shown in Figure 10, when one of the working devices, such as computing device S2, malfunctions, the optical switching unit in the optical interconnect module of the system is controlled to prevent computing device S from... M The communication device becomes the working device, and the computing device S2 is isolated. The connection links between computing devices S1 and S2, and between computing devices S3 and S2, have no signal transmission and are represented by dashed lines. The connection link between computing devices S1 and S3 has signal transmission and is represented by a solid line. Meanwhile, computing device S... M-1 With computing device SM The connection link and computing device S between M With computing device S M+1 The connection links between them are represented by solid lines when signals pass through them, while everything else remains unchanged.

[0103] Those skilled in the art should understand that the above-disclosed embodiments are merely implementations of the present invention and should not be construed as limiting the scope of the patent protection claimed in the present invention. Equivalent variations made according to the implementations of the present invention are still within the scope of the claims of the present invention.

Claims

1. A photonic integrated circuit chip, comprising one or more photonic integrated circuit sub-modules, each of the photonic integrated circuit sub-modules comprising: Multiple electro-optic conversion modules are configured to carry information from electrical signals into light waves to obtain optical signals; A plurality of first optical switching units, each first optical switching unit including a first optical input port, a first optical output port and a second optical output port, the first optical input port being optically communicated with at least a portion of the plurality of electro-optical conversion modules, and each first optical switching unit being configured to selectively output the optical signal input to its first optical input port via its first optical output port or its second optical output port; A first optical coupler, which optically communicates with the first optical output port, is configured to optically connect the first optical output ports of a plurality of first optical switching units to a first external fiber optic array for transmission. The second optical coupler, which is optically in communication with the second optical output port, is configured to optically connect the second optical output ports of the plurality of first optical switching units to the second external fiber optic array for transmission. Multiple photoelectric conversion modules are configured to convert received optical signals into electrical signals; A third optical coupler is optically connected to a first portion of the plurality of photoelectric conversion modules and is configured to transmit optical signals from a first receiving external fiber array to the plurality of photoelectric conversion modules in that portion. as well as A fourth optical coupler is optically connected to the second part of the plurality of optoelectronic conversion modules and configured to transmit optical signals from the second receiving external fiber array to the plurality of optoelectronic conversion modules of that part.

2. The photonic integrated circuit chip as described in claim 1, wherein, Each of the aforementioned photonic integrated circuit submodules also includes multiple wavelength multiplexers and multiple demultiplexers; The plurality of electro-optic conversion modules are configured into a plurality of electro-optic conversion module arrays, and the plurality of photoelectric conversion modules are configured into a plurality of photoelectric conversion module arrays; The electro-optic conversion module array is optically connected to the corresponding first optical switching unit through the wavelength multiplexer. Each wavelength multiplexer has multiple optical input ports and one optical output port. Each of the multiple optical input ports of the wavelength multiplexer is optically connected to one electro-optic conversion module in the electro-optic conversion module array, and one optical output port of the wavelength multiplexer is optically connected to the first optical input port of one of the first optical switching units. The photoelectric conversion module array is optically connected to the third optical coupler or the fourth optical coupler through the demultiplexer. Each of the demultiplexers has one optical input port and multiple optical output ports. One optical input port of the demultiplexer is connected to the third optical coupler or the fourth optical coupler, and each of the multiple optical output ports of the demultiplexer is optically connected to one photoelectric conversion module in the photoelectric conversion module array.

3. The photonic integrated circuit chip of claim 1, wherein, The electro-optic conversion module includes a modulator, and the photoelectric conversion module includes a detector.

4. The photonic integrated circuit chip of claim 3, wherein, The modulator includes at least one of the following: a micro-ring modulator, a Mach-Zehnder modulator, and an electroabsorption modulator; And / or, the detector includes a microring detector or a photodiode.

5. The photonic integrated circuit chip as described in claim 1, wherein, The first optical switching unit is a MEMS optical path switching unit or an MZI optical path switching unit.

6. The photonic integrated circuit chip as described in claim 5, wherein, The first optical switching unit is an MZI optical path switching unit, which includes: The first beam splitter has one optical input port and two optical output ports; The second beam splitter has two optical input ports and two optical output ports; and Two phase shifters are respectively connected between the two optical output ports of the first beam splitter and the two optical input ports of the second beam splitter.

7. The photonic integrated circuit chip as described in claim 1, wherein, Each of the aforementioned photonic integrated circuit sub-modules also includes: The fifth optical coupler is configured to input light waves from an off-chip light source into the photonic integrated circuit submodule; An optical power splitter, which is optically connected to the fifth optical coupler, is configured to split one input optical wave into multiple output optical waves, each of which has substantially the same power, and the multiple output optical waves are transmitted to each electro-optical conversion module.

8. An optical interconnect module, comprising: The photonic integrated circuit chip as described in any one of claims 1 to 7; and Analog electronic chip for transmitting and receiving; The transceiver analog electrical chip is configured to convert a received first digital electrical signal into a driving analog electrical signal and transmit the driving analog electrical signal carrying information to at least one of the plurality of electro-optical conversion modules in the photonic integrated circuit chip, or to receive a received analog electrical signal output by at least one of the plurality of photoelectric conversion modules in the photonic integrated circuit chip and convert the received analog electrical signal into a second digital electrical signal.

9. The optical interconnect module as described in claim 8, wherein, It also includes the substrate, The photonic integrated circuit chip is mounted on the substrate, and the transceiver analog electrical chip is disposed above the photonic integrated circuit chip. The transceiver analog electrical chip receives the first digital electrical signal and / or transmits the second digital electrical signal through a conductive via penetrating the photonic integrated circuit chip.

10. The optical interconnect module as claimed in claim 8, wherein, It also includes the substrate, The photonic integrated circuit chip is mounted on the substrate, and the transceiver analog electrical chip is mounted on the photonic integrated circuit chip on the opposite side of the substrate. The transceiver analog electrical chip receives the first digital electrical signal and / or transmits the second digital electrical signal through wiring on the substrate.

11. The optical interconnect module as claimed in claim 8, wherein, The optical interconnect module also includes an optical switching control analog electrical chip for controlling the first optical switching unit, which controls the output of the first optical switching unit so that the optical signal input to the first optical input port of the first optical switching unit is output from the first optical output port or the second optical output port.

12. The optical interconnect module as claimed in claim 11, wherein, The optical switching control analog electrical chip is disposed above the photonic integrated circuit, and receives the optical switching control analog signal through a conductive via penetrating the photonic integrated circuit chip.

13. An optical interconnect device, comprising: First PCB board; The optical interconnect module as described in any one of claims 8 to 12, wherein the optical interconnect module is disposed on the first PCB board; The fiber optic array includes a first external fiber optic array for transmitting, a second external fiber optic array for transmitting, a first external fiber optic array for receiving, and a second external fiber optic array for receiving. The fiber optic interface includes a first fiber optic interface and a second fiber optic interface, which are disposed on the first PCB board. The first fiber optic interface is optically connected to the optical interconnect module through the first external fiber optic array for transmitting and the first external fiber optic array for receiving. The second fiber optic interface is optically connected to the optical interconnect module through the second external fiber optic array for transmitting and the second external fiber optic array for receiving. An electrical communication interface is disposed on the first PCB board for receiving a first digital signal and / or sending a second digital electrical signal; A re-timer, mounted on the first PCB board, is communicatively connected to the electrical communication interface and the optical interconnect module. It is used to reshape the first digital electrical signal and transmit the reshaped electrical signal to the optical interconnect module; and / or reshape the second digital electrical signal received from the optical interconnect module and transmit it out through the electrical communication interface.

14. The optical interconnect device as claimed in claim 13, wherein, The re-timer is communicatively connected to the optical interconnect module via traces on the first PCB board.

15. The optical interconnect device as claimed in claim 13, wherein, It also includes a laser module for generating light waves, which is mounted on the first PCB board and optically connected to the optical interconnect module via an input fiber array to input light waves to the optical interconnect module.

16. The optical interconnect device as claimed in claim 13, wherein, The retimer is also used to receive the first optical switching control signal and / or send the second optical switching control signal.

17. A computing device comprising: Multiple computing modules; Multiple optical interconnect devices as described in any one of claims 13 to 16; The first part of the electrical communication interface of the plurality of computing modules is communicatively connected to the plurality of optical interconnect devices.

18. The computing device of claim 17, wherein, It also includes a second PCB board. The multiple computing modules are mounted on the second PCB board. The plurality of optical interconnect devices are mounted on the second PCB board. The multiple computing modules are communicatively connected to the multiple optical interconnect devices via traces on the second PCB board.

19. The computing device of claim 18, wherein, The second part of the electrical communication interface of each of the plurality of computing modules is connected to another of the plurality of computing modules via additional traces on the second PCB board.

20. The computing device of claim 17, wherein, At least one of the plurality of optical interconnect devices communicates with each of the plurality of computing modules.

21. A computing system comprising a plurality of computing devices as described in any one of claims 17 to 20; The optical fiber interfaces of the multiple optical interconnects of the multiple computing devices are physically connected via optical fibers to enable communication between the multiple computing devices. in The plurality of computing devices includes a first computing device, a second computing device, and a third computing device; The first optical fiber interface of the first part of the optical interconnect device of the first computing device is physically connected to the first optical fiber interface of the first part of the optical interconnect device of the second computing device through optical fiber, and the second optical fiber interface of the first part of the optical interconnect device of the first computing device is physically connected to the second optical fiber interface of the first part of the optical interconnect device of the third computing device through optical fiber. Furthermore, the communication paths of the plurality of computing devices or their plurality of computing modules can be changed by controlling the first optical switching unit on the optical interconnect device of the plurality of computing devices.

22. The computing system of claim 21, wherein, The first portion of the optical interconnect device of the first computing device enables the first computing device to selectively communicate with the second computing device or the third computing device.

23. The computing system of claim 21, wherein, In a computing system in which the communication paths of the plurality of computing devices can be changed, at least one of the plurality of computing devices serves as a backup device, while the remaining computing devices are operating devices in normal operation. When one or more of the multiple working devices fail, the communication paths of the multiple computing devices are changed by controlling the first optical switching unit on the optical interconnect device of the multiple computing devices, so as to isolate the failed working device and make an equal number of backup devices as normal working devices.

24. The computing system of claim 22, wherein, The first portion of the optical interconnect device of the first computing device enables the first computing device to communicate with the second computing device, and When the second computing device malfunctions, the first portion of the optical interconnect of the first computing device enables the first computing device to communicate with the third computing device.

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