Resin molding device and method for manufacturing resin molded article

Abstract

This resin molding device comprises: a lower mold, an upper mold, and a mold clamping mechanism for clamping the lower mold and the upper mold. One of the lower mold and the upper mold comprises a cavity in which a workpiece to be resin-molded is accommodated, and includes a first block that forms a side surface of the cavity and a second block that forms a bottom surface of the cavity. The resin molding device further comprises a vertical movement mechanism that moves the first block in the vertical direction with respect to the second block. The first block comprises a through hole that communicates with the bottom surface side of the cavity and extends in the horizontal direction for the release film to pass therethrough. As the first block is moved by the vertical movement mechanism, the second block is disposed in the through hole, and the release film disposed in the through hole is disposed on the bottom surface of the cavity.

Description

Resin molding apparatus and method for manufacturing a resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] Patent Document 1 discloses a mold used for resin molding. In this mold, a release film is set on the parting surface of the upper mold. A cavity is formed in the parting surface, and the release film is sucked so as to adhere to the bottom surface and the side surface of the cavity by air suction through the suction holes formed in the upper mold.

[0003] Japanese Patent Application Laid-Open No. 2011-046017

[0004] In the mold of Patent Document 1, since the release film covers the entire bottom surface and side surface of the cavity, it is relatively easy to release the resin molded product molded in the cavity from the cavity. On the other hand, since the cavity has a depth, when the release film is sucked so as to adhere to the bottom surface and the side surface of the cavity, the release film may stretch and break. Also, the release film may stretch and break due to the pressure of the resin when the resin is injected into the cavity. If the release film breaks, molding defects may occur.

[0005] An object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can prevent a release film disposed in a cavity of a mold from stretching and breaking.

[0006] A resin molding apparatus according to a certain aspect of the present invention comprises a lower mold, an upper mold positioned opposite the lower mold, and a mold clamping mechanism for clamping the lower mold and the upper mold. One of the lower mold and the upper mold has a cavity in which a workpiece to be resin molded is contained, and includes a first block that forms the side surface of the cavity and a second block that forms the bottom surface of the cavity. The resin molding apparatus further comprises a vertical movement mechanism for moving the first block vertically relative to the second block. The first block has a horizontally extending through hole that communicates with the bottom surface side of the cavity and through which a release film passes. As the first block is moved by the vertical movement mechanism, the second block is positioned in the through hole, and the release film positioned in the through hole is positioned on the bottom surface of the cavity.

[0007] A method for manufacturing a resin molded article according to another aspect of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus described above. The lower mold and the upper mold having the cavity are provided with one or more pins that are movable to protrude from the second block and for releasing the workpiece from the cavity after resin molding. This manufacturing method includes clamping the lower mold and the upper mold with the clamping mechanism, performing resin molding of the workpiece, releasing the clamping by the clamping mechanism after the resin molding of the workpiece, controlling the vertical movement mechanism to move the first block away from the second block after releasing the clamping by the clamping mechanism, and with the first block and the second block separated, moving the pins to protrude from the second block to release the workpiece from the cavity.

[0008] A method for manufacturing a resin molded article according to yet another aspect of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus described above. The lower mold and the upper mold having the cavity are provided with one or more pins that are movable to protrude from the second block and for releasing the workpiece from the cavity after resin molding. The second block has suction holes that are connected to a suction source and for adsorbing the release film. This manufacturing method includes clamping the lower mold and the upper mold with the clamping mechanism, performing resin molding of the workpiece, releasing the clamping by the clamping mechanism after the resin molding of the workpiece, stopping the adsorption of the release film by the suction source after releasing the clamping by the clamping mechanism, and while the adsorption has stopped, moving the pins to protrude from the second block to release the workpiece from the cavity.

[0009] A method for manufacturing a resin molded product according to yet another aspect of the present invention includes using the resin molding apparatus described above to clamp the lower mold and the upper mold with the mold clamping mechanism, sandwiching the workpiece between them, and while the lower mold and the upper mold are clamped by the mold clamping mechanism, resin molding the workpiece to manufacture a resin molded product.

[0010] The present invention provides a resin molding apparatus and a method for manufacturing a resin molded product that can prevent the release film placed in the cavity of the mold from stretching and tearing.

[0011] A schematic plan view showing a resin molding apparatus according to one embodiment. A bottom view of a workpiece according to one embodiment. A cross-sectional view along line IIB-IIB in Figure 2A. A longitudinal cross-sectional view of the molding mechanism according to one embodiment, viewed from the front. An exploded perspective view of a part of the lower mold according to one embodiment. A bottom view of the first block according to one embodiment. A diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Yet another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Yet another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Yet another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Yet another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. Yet another diagram illustrating the flow of the manufacturing method for a resin molded product according to one embodiment. A front view of the first block according to a modified example. A plan view of the first block according to another modified example.

[0012] Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematic, with parts omitted or exaggerated as appropriate, for ease of understanding.

[0013] <1. Overall Configuration of Resin Molding Apparatus> Figure 1 is a schematic plan view showing a resin molding apparatus 100 according to this embodiment. The resin molding apparatus 100 uses a resin material T to resin mold a workpiece W1 to be molded. In this explanation, a workpiece W1 with the structure shown in Figures 2A and 2B is exemplified. Figure 2A is a bottom view of the resin-molded workpiece W1, and Figure 2B is a cross-sectional view taken along line IIB-IIB in Figure 2A (in Figure 2B, the bottom side of the workpiece W1 is shown on the bottom and the top side of the workpiece W1 is shown on the top). In this example, the workpiece W1 includes a substrate 30 and an electronic component 31 such as a semiconductor chip mounted on the substrate 30, and is processed so that the electronic component 31 is covered with mold resin 35 after resin molding. The workpiece W1 further includes an exposed member 32 having an exposed surface 32a that remains exposed from the mold resin 35 even after resin molding, without being covered by the mold resin 35. Hereinafter, a resin-molded (i.e., covered with molded resin 35) workpiece W1 will be referred to as workpiece W2 to distinguish it from a workpiece W1 before resin molding (i.e., without molded resin 35). Although not limited to this, the resin molding apparatus 100 is suitable for processing (exposed molding) workpieces W1 that include exposed members 32. An example of such a workpiece W1 is a power module as an electronic component 31 with a heat sink as an exposed member 32 mounted on top.

[0014] The resin molding apparatus 100 comprises an in-module M1, a mold module M2, and an out-module M3. These modules M1 to M3 are connected in this order as an integrated apparatus. In Figure 1, two mold modules M2 are shown, but there may be only one mold module M2, or three or more may be provided. The mold module M2 comprises a molding mechanism 2. The molding mechanism 2 uses resin material T to encapsulate the electronic components 31 contained in the workpiece W1 with mold resin 35, and performs resin molding to process the workpiece W1 into a resin molded product, workpiece W2. In this embodiment, exposed molding is performed, and in the workpiece W2 after resin molding, the exposed surface 32a of the exposed member 32 loaded on the electronic components 31 is exposed from the mold resin 35. The in-module M1 comprises an in-magazine 7 that accommodates a plurality of workpieces W1 before resin molding, and a resin supply mechanism 70. The resin supply mechanism 70 is a device that supplies the resin material T. The out-module M3 includes an out-magazine 8 for accommodating multiple resin-molded workpieces W2.

[0015] The in-module M1 further comprises an alignment mechanism 71 positioned adjacent to the in-magazine 7 and a transport mechanism 72 for transporting the workpiece W1 from the in-magazine 7 to the alignment mechanism 71. The transport mechanism 72 includes, for example, an actuator, which pushes the workpiece W1 out of the in-magazine 7 and transfers it to the alignment mechanism 71. The alignment mechanism 71 is a mechanism for aligning the workpiece W1 and has a turntable 71a that can rotate in a horizontal plane. The workpiece W1 pushed out of the in-magazine 7 by the transport mechanism 72 is placed on the turntable 71a. Although not limited to this, in the example of Figure 1, two workpieces W1 can be mounted on the turntable 71a at the same time. When a workpiece W1 is set on the turntable 71a, it rotates and aligns the workpiece W1 so that it is in a position suitable for pickup by the loader 5 described later.

[0016] The resin molding apparatus 100 further comprises a guide G extending in the left-right direction, and a loader 5 and an unloader 6 that move along the guide G. Unless otherwise specified, in the description of this embodiment, front, rear, left, right, top, and bottom are defined as shown in Figures 1, 3, 4, 6A to 6H, 7, and 8. The guide G is a rail on which the loader 5 and the unloader 6 travel. The guide G is provided linearly along the rear side of the resin molding apparatus 100, spanning the in-module M1, mold modules M2, M2, and out-module M3. The molding mechanism 2, transport mechanism 72, alignment mechanism 71, resin supply mechanism 70, in-magazine 7, and out-magazine 8 are arranged on the front side relative to the guide G.

[0017] The loader 5 is a loading mechanism that loads the workpiece W1 and resin material T into the mold 20. One mold 20 is provided in each of the molding mechanisms 2, 2. The loader 5 is equipped with a pickup mechanism (not shown) for picking up the workpiece W1, and is movable in the front-rear direction and vertically movable up and down. The loader 5 moves between the in-module M1 and the mold modules M2, M2 along the guide G. This allows the loader 5 to access the alignment mechanism 71 and resin supply mechanism 70 in the in-module M1, and the mold 20 in the mold module M2. The loader 5 receives the workpiece W1 from the alignment mechanism 71 using the pickup mechanism (multiple pairs of claws in this embodiment), transports it to the mold 20, and places it on the lower mold 22 (see Figure 3). The loader 5 is also equipped with a shutter, which receives the resin material T supplied from the resin supply mechanism 70 located below, holding it from below. The loader 5 then transports the received resin material T to the mold 20, opens the shutter, and supplies it to the pot 23a (see Figure 3) of the lower mold 22.

[0018] The molding die 20 is a mold for resin molding a workpiece W1 using a resin material T. The molding die 20 has an upper mold 21 and a lower mold 22. In Figure 1, the molding mechanism 2 is mainly shown below the upper mold 21. The molding mechanism 2 further includes a mold clamping mechanism 24 (see Figure 3). When the workpiece W1 and the resin material T are placed in a predetermined position in the lower mold 22 by the loader 5, the mold clamping mechanism 24 clamps the upper mold 21 and the lower mold 22. The upper mold 21 and the lower mold 22 are heated, and the resin material T in the pot 23a melts. The molten resin material T is pushed by the plunger 23 from the pot 23a into the cavity C1 (see Figures 6D and 6E) formed between the upper mold 21 and the lower mold 22, and hardens while covering the electronic component 31 on the workpiece W1. As a result, the workpiece W1 is resin molded and workpiece W2 is manufactured. While this example illustrates the transfer molding process, other molding methods, such as compression molding, may also be employed.

[0019] The unloader 6 is an unloading mechanism that unloads the workpiece W2 after resin molding from the mold 20. The unloader 6 is equipped with a pickup mechanism (not shown) for picking up the workpiece W2, and is movable in the front-rear direction and up-down. The unloader 6 moves between the out module M3 and the mold modules M2, M2 along the guide G. This allows the unloader 6 to access the out magazine 8 in the out module M3 and the mold 20 in the mold module M2. The unloader 6 receives the workpiece W2 from the lower mold 22 using the pickup mechanism (multiple pairs of claws in this embodiment), transports it to the out magazine 8, and stores it there.

[0020] The resin molding apparatus 100 includes a control unit 1 that controls the operation of each part. The control unit 1 has a CPU (central processing unit), ROM (read-only memory), RAM (random access memory), and non-volatile memory, and the operation of each part is executed by the CPU executing a control program stored in the non-volatile memory and / or ROM. The resin molding apparatus 100 also includes user interface devices such as an input device and a display device, which in this embodiment is realized as a touch panel 9. Note that the control unit 1 and the touch panel 9 can be installed at any position, not limited to the positions shown in Figure 1.

[0021] <2. Configuration of the Molding Mechanism> The configuration of the molding mechanism 2 according to this embodiment will be described in detail with reference to Figure 3. Figure 3 is a longitudinal cross-sectional view of the molding mechanism 2 as seen from the front.

[0022] The molding mechanism 2 is a mechanism for resin molding a workpiece W1 using a mold 20. As shown in Figure 3, the molding mechanism 2 includes a mold 20 (upper mold 21 and lower mold 22), an upper platen 25 that supports the upper mold 21 from above, and a lower platen 26 that supports the lower mold 22 from below. The upper mold 21 is suspended and held on the upper platen 25, and the lower mold 22 is fixed to the lower platen 26. The upper mold 21 and the lower mold 22 are arranged facing each other in the vertical direction by the upper and lower platens 25 and 26. The upper platen 25 is a fixed platen, and the lower platen 26 is a movable platen that moves in the vertical direction. A mold clamping mechanism 24 is located below the lower platen 26. The control unit 1 raises and lowers the lower platen 26 by controlling a drive source (not shown), such as a servo motor, included in the mold clamping mechanism 24. The mold clamping mechanism 24 is fixed on a base 19 (fixed platen).

[0023] A cavity C11 is formed on the lower surface of the upper mold 21, and a cavity C12 is formed on the upper surface of the lower mold 22. Although not limited to this, both cavities C11 and C12 are substantially rectangular in plan view and have depth in the vertical direction. As shown in Figure 3, when the workpiece W1 is set in the lower mold 22, the electronic components 31 and exposed members 32 included in the workpiece W1 are housed in the cavity C12, and the lower surface (exposed surface 32a) of the exposed member 32 is aligned with the bottom surface of the cavity C12. On the other hand, when the workpiece W1 is set in the lower mold 22, the end of the substrate 30 included in the workpiece W1 is placed on the upper surface of the lower mold 22. A portion of the substrate 30 is not housed inside the cavity C12 and is placed outside the cavity C12. As the lower platen 26 rises and the upper mold 21 and lower mold 22 are closed (clamped), the edge of the substrate 30 is sandwiched between the lower surface of the upper mold 21 and the upper surface of the lower mold 22. When the molds are clamped, a cavity C1 is formed between the upper mold 21 and the lower mold 22 by cavities C11 and C12 (see Figure 6D). Cavity C1 is the space in which the workpiece W1 is placed and resin molding takes place. Although not limited to this, in this embodiment, two workpieces W1 are resin-sealed in one molding mechanism 2, and one cavity C11, C12 is formed in the upper mold 21 and the lower mold 22 for each workpiece W1. That is, two cavities C11 are formed in the upper mold 21, and two cavities C12 are formed in the lower mold 22.

[0024] On the upper surface of the lower mold 22, a pot 23a is formed between two cavities C12 for temporarily storing resin material T. Typically, multiple pots 23a are formed in the lower mold 22. The molding mechanism 2 has a heater (not shown) for heating the mold 20, and when the heater is heated, the resin material T placed in the pots 23a melts. The molding mechanism 2 further has a plunger 23 for supplying the molten resin material T from the pots 23a into the cavities C1. The plunger 23 is controlled by the control unit 1 and pushes the resin material T out of the pots 23a. The pushed-out resin material T reaches the cavities C1 through guide paths (not shown) formed in at least one of the upper mold 21 and the lower mold 22. Inside the cavities C1, the resin material T spreads to fill the gaps where no parts are placed in the workpiece W1, and hardens in that state. This produces the workpiece W2.

[0025] Figure 4 is an exploded perspective view of a part of the lower mold 22. As shown in Figures 3 and 4, the lower mold 22 includes a first block 41 that forms the side surface of the cavity C12 and a second block 42 that forms the bottom surface of the cavity C12. The second block 42 is provided in the same number as the cavity C12. The same applies to the through holes C13 and insertion holes C14, the supply roll 51, the winding roll 52, the set of suction holes 42a, and the set of ejector pins 60, which will be described later. The lower mold 22 also further includes a holder base 43 that supports the second block 42 from below. The second block 42 is fixed to the holder base 43. The holder base 43 is provided with a plurality of rods 29 on the side opposite to the second block 42, and the rods 29 contact the base 28 and support the holder base 43 from below. The holder base 43 is fixed to the base 28 by bolts at its edge, and the base 28 is fixed on the lower platen 26. Therefore, the vertical position of the second block 42 relative to the lower platen 26 is fixed. As a result, when the lower platen 26 moves up or down, the second block 42 also moves up or down by the same amount along with the holder base 43.

[0026] As shown in Figure 4, the outer shape of the first block 41 is generally rectangular, with an upper and lower surface substantially parallel to the horizontal plane, and thickness in the vertical direction. In Figure 4, the internal structure of the first block 41, which is not visible from the outside, is partially shown by dotted lines for reference. The cavity C12 is formed on the upper surface of the first block 41, and the bottom surface (depth) of the cavity C12 does not reach the bottom surface of the first block 41. In addition to the cavity C12, the first block 41 also has a through hole C13 that communicates with the bottom surface of the cavity C12. In a plan view, the bottom surface of the cavity C12 is located inside the contour line of the upper surface of the through hole C13. The through hole C13 extends horizontally and is a space for the release film F2 to pass horizontally through the inside of the first block 41. The through hole C13 penetrates the first block 41 in the front-to-back direction. The bottom surface (depth) of the through-hole C13 does not reach the bottom surface of the first block 41. Therefore, in both front and rear views, the entire circumference of the through-hole C13 is surrounded by the first block 41. As a result, although the first block 41 is a hollow structure with many cavities (cavity C12 and through-hole C13, as well as the insertion hole C14 described later), a solid frame is formed, thus maintaining its strength.

[0027] Figure 5 is a bottom view of the first block 41. In Figure 5, the position of the through hole C13, which is not visible in the bottom view, is indicated by a dotted line for reference. In addition to the cavity C12 and the through hole C13, the first block 41 also has an insertion hole C14 that communicates with the bottom side of the through hole C13. In the bottom view, the bottom surface of the insertion hole C14 is located inside the contour line of the bottom surface of the through hole C13. In the bottom view, the bottom surface of the cavity C12 is located inside the contour line of the bottom surface of the insertion hole C14. Both the through hole C13 and the insertion hole C14 are substantially rectangular in plan view and have depth in the vertical direction. The outer shape of the second block 42 is generally rectangular, with an upper and lower surface substantially parallel to the horizontal plane, and has thickness in the vertical direction. The second block 42 is inserted from below into the insertion hole C14 of the first block 41, and then passes through the insertion hole C14 vertically to be inserted into the through hole C13. In a plan view, the second block 42 is larger than the portion where the cavity C12 and the through hole C13 are in communication (i.e., larger than the bottom surface of the cavity C12), so the second block 42 is not positioned inside the cavity C12.

[0028] The molding mechanism 2 has a vertical movement mechanism 40 that moves the first block 41 vertically relative to the second block 42. The vertical movement mechanism 40 causes the second block 42 to enter the through hole C13 so that the release film F2, which is placed in the through hole C13, is aligned with the bottom surface of the cavity C12. As the vertical movement mechanism 40 moves the first block 41, the second block 42 is positioned inside the through hole C13 and the release film F2 is positioned on the bottom surface of the cavity C12. More specifically, in this embodiment, when the vertical movement mechanism 40 lowers the first block 41, the second block 42 rises relative to the first block 41 and enters deeper (higher) into the through hole C13, bringing the two blocks 41 and 42 closer together. When the upper surface of the second block 42 reaches the upper surface of the through hole C13 (i.e., the bottom surface of the cavity C12), the second block 42 comes into contact with the first block 41 with the release film F2 in between, so the two blocks 41 and 42 can no longer get any closer. In other words, when the upper surface of the second block 42 reaches the upper surface of the through hole C13, the two blocks 41 and 42 are in their closest proximity state. In the closest proximity state, the upper surface of the through hole C13 and the upper surface of the second block 42 are at the same height, and no gap is formed above the second block 42 within the through hole C13. Therefore, in the closest proximity state, the release film F2 is pushed up from below onto the second block 42 and positioned along the bottom surface of the cavity C12. On the other hand, when the vertical movement mechanism 40 raises the first block 41, the first block 41 and the second block 42 are separated. As a result, the upper surface of the through-hole C13 is higher than the upper surface of the second block 42, and a gap is formed above the second block 42 within the through-hole C13. In the most separated state, when the two blocks 41 and 42 are at their furthest distance apart, the second block 42 is positioned outside the through-hole C13.

[0029] In this embodiment, the bottom surface of the cavity C12 is located inside the contour line of the upper surface of the second block 42 (the surface of the second block 42 that forms the bottom surface of the cavity C12) in a plan view (see Figures 3 and 4). Therefore, in the nearest-closest state, the second block 42 covers the entire bottom surface of the cavity C12 via the release film F2. In this embodiment, the release film F2 is placed on the upper surface of the second block 42 so as to cover the entire bottom surface of the cavity C12 in the nearest-closest state. Therefore, the release film F2 is firmly in contact with both the entire bottom surface of the workpiece W1 before resin molding and the entire bottom surface of the workpiece W2 after resin molding, as determined by the second block 42. As a result, the release properties of the workpiece W2 from the lower mold 22 after resin molding are ensured across the entire bottom surface of the workpiece W2. In this embodiment, the sides of the cavity C12, and consequently the sides of the workpieces W1 and W2 placed within the cavity C12, are not covered by the release film F2. Furthermore, the exposed surface 32a of the exposed member 32 is in contact with the release film F2, which is pushed up by the second block 42, when in the nearest-nearest contact state. As a result, resin leakage (flash) onto the exposed surface 32a during resin molding is prevented.

[0030] The molding mechanism 2 further includes a drive source 45 for driving the vertical movement mechanism 40. The drive source 45 is controlled by the control unit 1. In this embodiment, the drive source 45 is composed of a servo motor (hereinafter also denoted by reference numeral 45). In this embodiment, the vertical movement mechanism 40 is realized as a ball screw driven by the servo motor 45 and a rod provided at its tip. Preferably, a plurality of vertical movement mechanisms 40 are provided to stably support the first block 41, and the plurality of vertical movement mechanisms 40 are driven synchronously by the drive source 45.

[0031] The rod of the vertical movement mechanism 40 extends vertically, and the first block 41 is connected to the upper part of the rod. The lower part of the ball screw of the vertical movement mechanism 40 is connected to the output shaft of the servo motor 45. The servo motor 45 is fixed to the lower platen 26. As a result, when the lower platen 26 moves up and down, not only the second block 42 and the holder base 43, but also the first block 41 moves up and down by the same amount via the vertical movement mechanism 40. When the vertical movement mechanism 40 is driven by the servo motor 45, the first block 41 moves up and down. On the other hand, the vertical movement mechanism 40 extends vertically through the holder base 43 without interfering with the holder base 43. Therefore, when the vertical movement mechanism 40 is driven, the first block 41 moves up and down, but the holder base 43 and the second block 42 fixed to it do not move up and down. This allows the vertical movement mechanism 40 to move the first block 41 and the second block 42 closer to and further apart in the vertical direction. Furthermore, the vertical movement mechanism 40 penetrates not only the holder base 43, but also the lower platen 26, the base 28, and the ejector plate 61 and pin plate 65, which will be described later, without interference.

[0032] Referring again to Figure 1, the mold module M2 comprises a supply roll 51 positioned behind the mold 20 and a take-up roll 52 positioned in front of the mold 20. The supply roll 51 is a roll on which the release film F2 is wound, and it feeds the release film F2 into the through hole C13. The take-up roll 52 winds up the release film F2 that has been peeled off from the workpiece W2 after resin molding and has passed through the through hole C13. The width of the release film F2 is wider than the width of the second block 42 (the length in the left-right direction in Figures 3 and 4) and slightly narrower than the width of the through hole C13. Therefore, the release film F2 is contained within the through hole C13 without bending in the width direction (left-right direction) and is conveyed while spreading out planarly within the through hole C13. As a result, the release film F2 can be supplied and recovered with a simple configuration. The width of the release film F2 does not necessarily need to be wider than the width of the second block 42 in the left-right direction, but it is preferable that the release film F2 is large enough to cover the suction holes 42a formed in the second block 42.

[0033] As shown in Figures 3 and 4, the second block 42 has suction holes 42a for adsorbing the release film F2. The suction holes 42a penetrate the second block 42 in the vertical direction. Although not limited to this, in this embodiment, multiple suction holes 42a are formed in one second block 42. The suction holes 42a are connected to a suction source 44 controlled by the control unit 1. When the air in the suction holes 42a is drawn in by the suction source 44, a negative pressure is created inside the suction holes 42a, and the release film F2 is adsorbed onto the upper surface of the second block 42.

[0034] In this embodiment, the release film F2 is positioned planarly within the through hole C13 and covers the bottom surface of the cavity C12, but does not cover the sides of the cavity C12. That is, even when suction is performed by the suction source 44, the release film F2 does not deform along the shape of the cavity C12 and does not spread three-dimensionally. Therefore, even if the cavity C12 has a depth of a certain extent or more, it is prevented that the release film F2 positioned inside the cavity C12 will stretch and tear. Furthermore, it is also prevented that the release film F2 positioned inside the cavity C12 will stretch and tear due to the pressure of the resin material T when the molten resin material T is injected into the cavity C12. Consequently, molding defects due to tearing of the release film F2 are also prevented.

[0035] The lower mold 22 is provided with ejector pins 60 for releasing the workpiece W2 from the cavity C12 after resin molding. The ejector pins 60 are inserted from below into holes that penetrate the second block 42 in the vertical direction, and are moved by the control unit 1 so as to protrude from the upper surface of the second block 42. Typically, one or more ejector pins 60 are provided in one second block 42. In this embodiment, the ejector pins 60 are moved by the drive source of the mold clamping mechanism 24 for raising and lowering the lower platen 26.

[0036] More specifically, the ejector pin 60 is fixed between the pin plate 65 and the ejector plate 61, and protrudes upward from both the pin plate 65 and the ejector plate 61. The pin plate 65 is fixed on the ejector plate 61. A stopper 62 is fixed to the ejector plate 61, extending downward from the ejector plate 61. The lower part of the stopper 62 is inserted into a space 28a formed inside the base 28. The stopper 62 is biased downward by a spring 64, also located in the space 28a, so as to contact the lower surface of the space 28a. Below the stopper 62, in a position overlapping the stopper 62 in a plan view, a rod 63 is positioned extending upward from the base 19. The rod 63 is inserted into a hole that penetrates the lower platen 26 in the vertical direction. When the clamping mechanism 24 raises the lower platen 26, the stopper 62 rises along with the base 28, and the ejector plate 61 to which the stopper 62 is fixed, and the ejector pin 60 fixed to the ejector plate 61 also rise. When the lower platen 26 rises above a predetermined height, the stopper 62 moves away from the rod 63 (see Figures 6D to 6F). On the other hand, when the clamping mechanism 24 lowers the lower platen 26, the stopper 62, ejector plate 61, and ejector pin 60 also descend until the lower platen 26 reaches a predetermined height, and the stopper 62 moves closer to the rod 63. However, once the lower platen 26 has descended to the predetermined height, the stopper 62 comes into contact with the rod 63 and cannot descend any further (see Figure 6G). Therefore, when the clamping mechanism 24 lowers the lower platen 26 further than a predetermined height, the height of the stopper 62 does not change, and the stopper 62 rises relative to the lower platen 26 (see Figure 6H). At this time, within the space 28a of the base 28, the spring 64 contracts due to the pressure from the rod 63, and the stopper 62 rises relative to it. As a result, the ejector pin 60, which is fixed to the stopper 62 via the ejector plate 61, rises relative to the second block 42, which is supported by the lower platen 26 via the rod 29. This causes the ejector pin 60 to protrude from the upper surface of the second block 42.Preferably, multiple sets of stoppers 62, rods 63, and springs 64 are provided to stably support the ejector plate 61.

[0037] In this embodiment, a release film F1 is placed inside the cavity C11 of the upper mold 21. Like the release film F2, the release film F1 is unwound from a supply roll (not shown) and wound up by a winding roll (not shown). The release film F1 unwound from the supply roll is sent to the bottom of the cavity C11 and covers the tops of the workpieces W1 and W2 set in the cavity C11. After resin molding, the release film F1 is peeled off from the top of the workpieces W2 and then recovered by the winding roll. Like the release film F2, the release film F1 is also adsorbed to the bottom surface (surface) of the upper mold 21 through suction holes (not shown) formed in the upper mold 21 by a suction source (not shown).

[0038] <3. Method for Manufacturing Resin Molded Products> Next, referring to Figures 6A to 6H, the flow of the method for manufacturing resin molded products using the resin molding apparatus 100 will be explained, focusing on the molding process in the molding mechanism 2. Figures 6A to 6H are vertical cross-sectional views of the molding mechanism 2 viewed from the front, showing only the left side. When the operator performs a predetermined operation via the touch panel 9, the manufacturing of the resin molded product (workpiece W2) by the resin molding apparatus 100 begins.

[0039] First, as shown in Figure 6A, the control unit 1 lowers the lower platen 26 using the mold clamping mechanism 24, opening the upper mold 21 and the lower mold 22 (opening the molds). In this state, the control unit 1 drives the vertical movement mechanism 40 with the drive source 45, raising the first block 41 relative to the second block 42 until the second block 42 reaches the outside of the through hole C13. As a result, the release film F2 is not pushed up by the second block 42 within the through hole C13, a gap is formed between the release film F2 and the upper surface of the through hole C13, and the release film F2 is released. In this state, the control unit 1 drives the supply roll 51 and the winding roll 52, sending the release film F2 unwound from the supply roll 51 into the through hole C13, and positioning the unused portion of the release film F2 below the cavity C12. Similarly, the control unit 1 also drives the supply roll and winding roll for the upper mold 21, positioning the unused portion of the release film F1 below the cavity C11. It is also possible to supply and wind the release film F2 by driving only the winding roll 52. The same applies to the winding roll for the upper mold 21.

[0040] Next, as shown in Figure 6B, the control unit 1 drives the vertical movement mechanism 40 with the drive source 45 to lower the first block 41 relative to the second block 42 until it is in the closest contact state. In the closest contact state, the upper part of the second block 42 is positioned inside the through hole C13, and the upper surface of the second block 42 reaches the upper surface of the through hole C13 (i.e., the bottom surface of the cavity C12). As a result, the release film F2 is pushed up by the second block 42 along the bottom surface of the cavity C12. At this time, the release film F2 is sandwiched between the first block 41 and the second block 42 and is firmly held in the lower mold 22 in a state where it cannot move up or down. After lowering the first block 41, the control unit 1 drives the suction source 44 to create negative pressure inside the suction hole 42a and attracts the release film F2 to the upper surface of the second block 42. Furthermore, a suction source (not shown) for the upper mold 21 is also driven, causing the release film F1 to deform three-dimensionally and adhere closely to the inner surface (sides and bottom) of the cavity C11.

[0041] Subsequently, as shown in FIG. 6C, the control unit 1 controls the loader 5 to set the workpiece W1 into the cavity C12. In this state, the exposed surface 32a of the exposed member 32 included in the workpiece W1 contacts the release film F2. Further, the control unit 1 controls the loader 5 to supply the resin material T into the pot 23a (not shown in FIG. 6C).

[0042] Subsequently, as shown in FIG. 6D, the control unit 1 raises the lower platen 26 by the clamping mechanism 24 and closes (clamps) the upper mold 21 and the lower mold 22 so as to sandwich the edge of the workpiece W1 between the upper mold 21 and the lower mold 22. Thereby, the cavity C1 is formed between the upper mold 21 and the lower mold 22. The workpiece W1 is firmly sandwiched within the cavity C1 between the upper mold 21 and the lower mold 22. Also, the release film F2 disposed along the bottom surface of the cavity C12 adheres to the bottom surface of the workpiece W1, and thus to the exposed surface 32a of the exposed member 32.

[0043] Subsequently, as shown in FIG. 6E, while the upper mold 21 and the lower mold 22 are clamped, the control unit 1 performs resin molding on the workpiece W1 to manufacture the workpiece W2 which is a resin molded product. More specifically, the control unit 1 melts the resin material T in the pot 23a by a heater and extrudes the melted resin material T into the cavity C1 by the plunger 23. The resin material T spreads to fill the gaps in the cavity C1, and then, when a predetermined time has elapsed, the workpiece W2 having the shape of the cavity C1 is manufactured. At this time, since the release film F2 adheres to the entire exposed surface 32a of the exposed member 32, resin leakage (flash) to the exposed surface 32a is prevented.

[0044] When the above resin molding is completed, as shown in FIG. 6F, the control unit 1 releases the clamping by the clamping mechanism 24, lowers the lower platen 26, and opens (opens the mold) the upper mold 21 and the lower mold 22. At this time, the workpiece W2 remains accommodated in the cavity C12 of the lower mold 22 and descends together with the lower mold 22. Since the release film F1 exists on the surface of the upper mold 21, the workpiece W2 is released from the upper mold 21 by mold opening.

[0045] After the mold clamping is released, the control unit 1 drives the vertical movement mechanism 40 with the drive source 45, as shown in Figure 6G, to raise the first block 41 relative to the second block 42. That is, the control unit 1 controls the vertical movement mechanism 40 to move the first block 41 away from the second block 42. At this time, since the release film F2 is adsorbed to the upper surface of the second block 42, it descends relative to the first block 41 together with the second block 42 and separates from the bottom surface of the cavity C12. As a result, the release film F2 is peeled off from the bottom surface of the workpiece W2 placed inside the cavity C12. Also at this time, a gap is formed above the release film F2 adsorbed to the upper surface of the second block 42 within the through hole C13. In this state, the control unit 1 stops the adsorption of the release film F2 by the suction source 44. Note that the operation shown in Figure 6G can be performed while lowering the lower platen 26.

[0046] Next, as shown in Figure 6H, the control unit 1 controls the ejector pin 60 to protrude from the second block 42 while the first block 41 and the second block 42 are separated. More specifically, the control unit 1 lowers the lower platen 26, and by extension the second block 42, whose vertical position is fixed relative to the lower platen 26, using the mold clamping mechanism 24. Meanwhile, the ejector pin 60 descends to a predetermined height position as the lower platen 26 descends, but even if the lower platen 26 continues to descend further, the function of the stopper 62 prevents it from descending any further. As a result, the ejector pin 60 rises relative to the second block 42 and protrudes from the upper surface of the second block 42. The ejector pin 60 protruding from the upper surface of the second block 42 enters the cavity C12 and pushes up the bottom surface of the workpiece W2, thereby releasing the workpiece W2 from the lower mold 22.

[0047] When the ejector pin 60 protrudes, it pushes up not only the workpiece W2 but also the release film F2. However, at this time, there is a gap above the release film F2 within the through-hole C13. Therefore, when the release film F2 is pushed up by the ejector pin 60, it can escape upward within the gap. As a result, the release film F2 is prevented from being torn due to the upward push by the ejector pin 60. Further, in the present embodiment, the protrusion of the ejector pin 60 as described above is performed in a state where the suction of the release film F2 by the suction source 44 has stopped. Therefore, when the release film F2 is pushed up by the ejector pin 60, no resistance due to the suction force is applied to the release film F2. As a result, the release film F2 is less likely to be torn.

[0048] The workpiece W2 released from the lower mold 22 is taken out from the mold 20 by the unloader 6, and after unnecessary resins such as cal and runner are removed by a removal mechanism (not shown), it is conveyed to the out magazine 8. Thus, the manufacturing operation of the resin molded product is completed.

[0049] <4. Features> In the above embodiment, a cavity C12 is formed in the lower mold 22 in which workpieces W1 and W2 are housed. The lower mold 22 includes a first block 41 and a second block 42. The first block 41 forms the side surface of the cavity C12, and the second block 42 forms the bottom surface of the cavity C12. The first block 41 has a through hole C13 that communicates with the bottom surface of the cavity C12 and extends horizontally for the release film F2 to pass through. The first block 41 is moved vertically relative to the second block 42 by a vertical movement mechanism 40. The movement of the first block 41 by the vertical movement mechanism 40 positions the second block 42 within the through hole C13, and the release film F2 positioned within the through hole C13 is positioned on the bottom surface of the cavity C12. With this configuration, the release film F2 covers the bottom surface of the cavity C12 but does not cover the side surfaces of the cavity C12. Therefore, the release film F2 does not deform to conform to the shape of the cavity C12 and does not spread three-dimensionally. As a result, even if the cavity C12 has a certain depth or more, the release film F2 placed inside the cavity C12 is prevented from stretching and tearing. Consequently, molding defects caused by tearing of the release film F2 are also prevented.

[0050] <5. Modifications> Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the invention. The gist of the following modifications can be combined as appropriate.

[0051] <5-1> In the above embodiment, the lower mold 22 is divided into a first block 41 and a second block 42, but a similar configuration can also be adopted for the upper mold 21 instead of or in addition to the lower mold 22. That is, the upper mold 21 may be configured to be roughly vertically symmetrical with the lower mold 22 described above. In this case, the ejector pins 60 are also arranged in the upper mold 21 in a similar vertically symmetrical manner with the above configuration.

[0052] <5-2> In the above embodiment, cavity C1 was formed by the cavity C11 of the upper mold 21 and the cavity C12 of the lower mold 22. However, one of the cavities C11 of the upper mold 21 and C12 of the lower mold 22 may be omitted, and the molding space cavity C1 may be formed by the other only.

[0053] <5-3> The first block 41 may be constructed by assembling a plurality of divided parts. For example, as shown in Figure 7, the first block 41 may be composed of a plurality of parts 41a, 41b connected in the vertical direction. In this case, the machinability of the first block 41 may be improved.

[0054] <5-4> As shown in Figure 8, multiple rows of the first block 41 may be arranged in the front-to-back direction. In this case, these first blocks 41 may be formed as a single unit, or multiple divided first blocks 41 may be assembled and fixed. Alternatively, the combination of multiple rows of the first block 41 may be formed by assembling multiple parts divided in the left-to-right direction, as shown by the dotted lines in Figure 8. In this case, the cavity C12, through hole C13, insertion hole C14, and pot 23a are formed as separate parts.

[0055] <5-5> In the above embodiment, the suction of the release film F2 by the suction source 44 was stopped after the mold clamping was released. However, the stopping of the suction of the release film F2 may be done simultaneously with or before the release of the mold clamping.

[0056] <5-6> In the above embodiment, when the release film F2 is fed from the supply roll 51 into the through hole C13, the vertical movement mechanism 40 raises the first block 41 relative to the second block 42 until the second block 42 reaches the outside of the through hole C13. However, the first block 41 only needs to be raised to the extent that a gap is created above the second block 42 within the through hole C13, and the second block 42 does not need to reach the outside of the through hole C13.

[0057] <5-7> In the above embodiment, the release film F2 was attached to the upper surface of the second block 42 after the first block 41 was lowered, but the release film F2 may be attached to the upper surface of the second block 42 before or simultaneously with the lowering of the first block 41.

[0058] <6. Notes> <Technology 1> (Configuration) A resin molding apparatus comprising a lower mold, an upper mold positioned opposite the lower mold, and a mold clamping mechanism for clamping the lower mold and the upper mold, wherein one of the lower mold and the upper mold has a cavity in which a workpiece to be resin molded is contained, and includes a first block that forms the side surface of the cavity and a second block that forms the bottom surface of the cavity, the resin molding apparatus further comprises a vertical movement mechanism for moving the first block vertically relative to the second block, the first block has a through hole that communicates with the bottom surface side of the cavity and extends horizontally for a release film to pass through, and the movement of the first block by the vertical movement mechanism positions the second block within the through hole, and the release film positioned within the through hole is positioned within the bottom surface of the cavity, the resin molding apparatus.

[0059] (Effects, etc.) In this resin molding apparatus, the release film covers the bottom surface of the cavity in which the workpiece is placed, but does not cover the sides of the cavity. Therefore, the release film does not deform to conform to the shape of the cavity and does not spread out three-dimensionally. As a result, even if the cavity has a depth of a certain extent or more, the release film placed inside the cavity is prevented from stretching and tearing.

[0060] <Technology 2> (Configuration) The resin molding apparatus according to Technology 1, wherein the lower mold and the upper mold having the cavity are provided with one or more pins that are movable to protrude from the second block and for releasing the workpiece from the cavity after resin molding.

[0061] (Effects, etc.) In this resin molding apparatus, the release film covers the bottom surface of the cavity, but even if the sides of the cavity are not covered, the workpiece after resin molding is poked by pins protruding from the second block, so the workpiece can be easily released from the cavity.

[0062] <Technology 3> (Configuration) The resin molding apparatus according to Technology 1 or 2, further comprising a drive source for driving the vertical movement mechanism.

[0063] (Effects, etc.) In this resin molding apparatus, the vertical movement mechanism receives power from the drive source and can move the first block vertically relative to the second block.

[0064] <Technology 4> (Configuration) The resin molding apparatus according to any one of technologies 1 to 3, wherein, in a plan view, the bottom surface of the cavity is located inside the contour line of the surface forming the bottom surface of the cavity in the second block.

[0065] (Effects, etc.) In this resin molding apparatus, the second block can completely seal the bottom surface of the cavity. Therefore, it is possible to easily demold the resin-molded workpiece from the second block. In addition, when the bottom surface of the workpiece is in contact with the second block for exposed molding, resin leakage (flush) onto the exposed surface can be prevented.

[0066] <Technology 5> (Configuration) A resin molding apparatus according to any one of Technologies 1 to 4, further comprising a supply roll that feeds the release film into the through hole, and a winding roll that winds up the release film that has been peeled off from the workpiece after resin molding and has passed through the through hole.

[0067] (Effects, etc.) In this resin molding apparatus, the release film can be smoothly supplied into the through hole and recovered from within the through hole.

[0068] <Technology 6> (Configuration) The resin molding apparatus according to Technology 2, further comprising a control unit that controls the vertical movement mechanism to move the first block away from the second block after releasing the mold clamping mechanism after resin molding of the workpiece, and controls the pin to protrude from the second block when the first block and the second block are separated.

[0069] (Effects, etc.) In this resin molding apparatus, the workpiece is poked by a pin through the release film while the first block and the second block are separated, that is, while a gap exists above the release film within the through hole. Therefore, when the release film is poked by the pin, it can escape within the gap. As a result, tearing of the release film due to the pin poke is prevented.

[0070] <Technology 7> (Configuration) A method for manufacturing a resin molded product using the resin molding apparatus described in Technology 2 or 6, comprising: clamping the lower mold and the upper mold with the mold clamping mechanism to perform resin molding of the workpiece; releasing the mold clamping by the mold clamping mechanism after the resin molding of the workpiece; controlling the vertical movement mechanism to move the first block away from the second block after releasing the mold clamping by the mold clamping mechanism; and moving the pin so that it protrudes from the second block while the first block and the second block are separated, thereby releasing the workpiece from the cavity.

[0071] (Effects, etc.) In this method of manufacturing resin molded products, the workpiece is poked by a pin through the release film while the first block and the second block are separated, that is, while a gap exists above the release film within the through hole. Therefore, when the release film is poked by the pin, it can escape within the gap. As a result, tearing of the release film due to the pin poke is prevented.

[0072] <Technology 8> (Configuration) A method for manufacturing a resin molded product using the resin molding apparatus described in Technology 2 or 6, wherein the second block has a suction hole formed therein that is connected to a suction source and adsorbs the release film, the manufacturing method comprising: clamping the lower mold and the upper mold with the mold clamping mechanism to perform resin molding of the workpiece, releasing the mold clamping by the mold clamping mechanism after the resin molding of the workpiece, stopping the adsorption of the release film by the suction source after releasing the mold clamping by the mold clamping mechanism, and moving the pin so that it protrudes from the second block while the adsorption has stopped, thereby releasing the workpiece from the cavity.

[0073] (Effects, etc.) In this method of manufacturing resin molded products, the workpiece is poked by a pin through the release film while the suction from the suction source has stopped. Therefore, the release film does not experience resistance due to suction when poked by the pin. As a result, tearing of the release film due to pin poking is prevented.

[0074] <Technology 9> (Configuration) A method for manufacturing a resin molded product, comprising using a resin molding apparatus described in any of Techniques 1 to 6, clamping the lower mold and the upper mold with the mold clamping mechanism so as to sandwich the workpiece between the lower mold and the upper mold, and resin molding the workpiece while the lower mold and the upper mold are clamped by the mold clamping mechanism to manufacture a resin molded product.

[0075] (Effects, etc.) This method of manufacturing resin molded products prevents molding defects caused by tearing of the release film.

[0076] 100 Resin Molding Apparatus 1 Control Unit 2 Molding Mechanism 5 Loader 6 Unloader 7 In-Magazine 8 Out-Magazine 9 Touch Panel 19 Base 20 Molding Mold 21 Upper Mold 22 Lower Mold 23 Plunger 23a Pot 24 Clamping Mechanism 25 Upper Platen 26 Lower Platen 28 Base 29 Rod 30 Substrate 31 Electronic Components 32 Exposed Member 32a Exposed Surface 35 Molded Resin 40 Vertical Movement Mechanism 41 First Block 42 Second Block 42a Suction Hole 44 Suction Source 43 Holder Base 45 Drive Source (Servo Motor) 51 Supply Roll 52 Winding Roll 60 Ejector Pin 61 Ejector Plate 62 Stopper 63 Rod 64 Spring 65 Pin Plate 70 Resin Supply Mechanism 71 Alignment mechanism 71a Rotary disk 72 Conveying mechanism C1, C11, C12 Cavity C13 Through hole C14 Insertion hole F1, F2 Release film M1 In-module M2 Mold module M3 Out-module G Guide W1 Workpiece (object to be molded) W2 Workpiece (resin molded product) T Resin material

Claims

1. A resin molding apparatus comprising a lower mold, an upper mold positioned opposite the lower mold, and a mold clamping mechanism for clamping the lower mold and the upper mold, wherein one of the lower mold and the upper mold has a cavity in which a workpiece to be resin molded is contained, and includes a first block that forms the side surface of the cavity and a second block that forms the bottom surface of the cavity, the resin molding apparatus further comprises a vertical movement mechanism for moving the first block vertically relative to the second block, the first block has a horizontally extending through hole communicating with the bottom surface side of the cavity and through which a release film passes, and the movement of the first block by the vertical movement mechanism positions the second block within the through hole, and the release film positioned within the through hole is positioned within the bottom surface of the cavity.

2. The resin molding apparatus according to claim 1, wherein the lower mold and the upper mold having the cavity are provided with one or more pins that are movable to protrude from the second block and for releasing the workpiece from the cavity after resin molding.

3. The resin molding apparatus according to claim 1 or 2, further comprising a drive source for driving the vertical movement mechanism.

4. The resin molding apparatus according to any one of claims 1 to 3, wherein, in a plan view, the bottom surface of the cavity is located inside the contour line of the surface forming the bottom surface of the cavity in the second block.

5. The resin molding apparatus according to any one of claims 1 to 4, further comprising a supply roll for feeding the release film into the through hole, and a winding roll for winding up the release film that has been peeled off from the workpiece after resin molding and has passed through the through hole.

6. The resin molding apparatus according to claim 2, further comprising a control unit that, after releasing the mold clamping mechanism after resin molding of the workpiece, controls the vertical movement mechanism to move the first block so that it separates from the second block, and controls the pin to protrude from the second block while the first block and the second block are separated.

7. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 2 or 6, comprising: clamping the lower mold and the upper mold with the mold clamping mechanism to perform resin molding of the workpiece; releasing the mold clamping by the mold clamping mechanism after the resin molding of the workpiece; controlling the vertical movement mechanism to move the first block so that it separates from the second block after releasing the mold clamping by the mold clamping mechanism; and moving the pin so that it protrudes from the second block while the first block and the second block are separated, thereby releasing the workpiece from the cavity.

8. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 2 or 6, wherein the second block has a suction hole connected to a suction source for adsorbing the release film, and the manufacturing method includes: clamping the lower mold and the upper mold with the clamping mechanism to perform resin molding of the workpiece; releasing the clamping mechanism after the resin molding of the workpiece; stopping the adsorption of the release film by the suction source after releasing the clamping mechanism; and moving the pin so that it protrudes from the second block while the adsorption has stopped, thereby releasing the workpiece from the cavity.

9. A method for manufacturing a resin molded product, comprising using a resin molding apparatus according to any one of claims 1 to 6, clamping the lower mold and the upper mold with the mold clamping mechanism so as to sandwich the workpiece between the lower mold and the upper mold, and resin molding the workpiece while the lower mold and the upper mold are clamped by the mold clamping mechanism to manufacture a resin molded product.

Images