Front-end module

Abstract

This front-end module comprises a first substrate that has a first amplifier which amplifies a transmission signal of a first radio frequency band, a switch component that includes a switch circuit and that is mounted to the first substrate, and a filter circuit. The switch circuit includes: a first switch element having a first end that is connected to a first power source supply terminal, and a second end that is connected to the ground via the filter circuit and that is connected to the first amplifier; and a second switch element having a first end that is connected to a second power source supply terminal, and a second end that is connected to the second end of the first switch element.

Description

Front-end module

[0001] The present invention relates to a front-end module.

[0002] There is a high-frequency circuit device that reduces power consumption by synchronizing the drain power supply of the unused amplifier side of two amplifiers with the selection frequency of a multiplier and disconnecting it with a drain power supply switching switch (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2005-175768

[0004] In recent years, for the purpose of miniaturization and cost reduction, the power supplies of amplifiers may be shared. For example, when power is supplied to one amplifier through a switch that selects either of two power supplies, noise (e.g., harmonics) may propagate from one power line to the other power line through the switch.

[0005] In order to suppress such noise, it may be considered to ensure isolation by connecting the power line to ground using a T-type switch. However, the size of the switch increases.

[0006] The present invention has been made in view of such circumstances, and in a configuration in which power is supplied to one amplifier through a switch that selects either of two power supplies, an object is to provide a front-end module capable of suppressing an increase in the size of the switch and ensuring isolation.

[0007] A front-end module according to one aspect of the present invention includes a first substrate having a first amplifier that amplifies a transmission signal in a first radio frequency band, a switch component that includes a switch circuit and is mounted on the first substrate, and a filter circuit. The switch circuit includes a first switch element having a first end connected to a first power supply terminal and a second end connected to ground through the filter circuit and connected to the first amplifier, and a second switch element having a first end connected to a second power supply terminal and a second end connected to the second end of the first switch element.

[0008] According to the present invention, in a configuration in which power is supplied to one amplifier through a switch that selects one of two power sources, it is possible to provide a front-end module that can suppress an increase in the size of the switch and ensure isolation.

[0009] Figure 1 is a diagram showing the configuration of the power supply system 301. Figure 2 is a diagram showing an example of a block diagram of the front-end module 101. Figure 3 is a diagram showing the circuit formed on the front-end module 101. Figure 4 is a schematic perspective view showing the arrangement of the switch component 121 mounted on the front-end module 101. Figure 5 is a circuit diagram of a power amplifier circuit 291, which is a reference example. Figure 6 is a schematic perspective view showing a part of the reference example front-end module. Figure 7 is a schematic perspective view showing the arrangement of the switch component 121 and capacitor component 132 mounted on the front-end module 101. Figure 8 is a schematic perspective view showing the arrangement of the switch component 121 and inductor component 133 mounted on the front-end module 101. Figure 9 is a schematic perspective view showing the arrangement of the switch component 121, capacitor component 132 and inductor component 133 mounted on the front-end module 101.

[0010] Embodiments of the present invention will be described in detail below with reference to the drawings. The same reference numerals are used for identical elements, and redundant explanations will be omitted as much as possible.

[0011] [First Embodiment] The front-end module 101 according to the first embodiment will now be described. Figure 1 is a diagram showing the configuration of the power supply system 301. The power supply system 301 comprises the front-end module 101, front-end modules 102A, 102B and 102C, and power management integrated circuits 111A and 111B.

[0012] The front-end module 101 includes a laminated substrate 151 (first substrate). The laminated substrate 151 has a switch circuit 21 and a power amplifier 211A (first amplifier) ​​that amplifies the transmission signal in the first radio frequency band. The first radio frequency band is, for example, the ultra-high band (UHB).

[0013] The front-end module 102A includes a laminated substrate 152A. The laminated substrate 152A has a power amplifier 211B (second amplifier) ​​that amplifies the transmission signal in the second radio frequency band. The laminated substrate 152A may also be provided with, for example, a low-noise amplifier that amplifies the received signal in the second radio frequency band, or a low-noise amplifier that amplifies the received signal in other frequency bands.

[0014] The second radio frequency band is lower than the first radio frequency band. The harmonics of the transmitted signal included in the second radio frequency band, such as the fourth harmonic, are included in the first radio frequency band. Specifically, the second radio frequency band is, for example, the low band (LB).

[0015] The front-end module 102B includes a laminated substrate 152B. The laminated substrate 152B has a power amplifier 211C (third amplifier) ​​that amplifies the transmitted signal in the third radio frequency band. The laminated substrate 152B may also be provided with, for example, a low-noise amplifier that amplifies the received signal in the third radio frequency band, or a low-noise amplifier that amplifies the received signal in other frequency bands.

[0016] The third radio frequency band is lower than the first radio frequency band and higher than the second radio frequency band. The harmonics of the transmitted signal included in the second radio frequency band, such as the second harmonic, are included in the third radio frequency band. Specifically, the third radio frequency band is, for example, the mid-high band (MHB).

[0017] The front-end module 102C includes a multilayer substrate 152C. The multilayer substrate 152C has a power amplifier 211D that amplifies the transmitted signal in the fourth radio frequency band. The multilayer substrate 152C may also be provided with, for example, a low-noise amplifier that amplifies the received signal in the fourth radio frequency band, or a low-noise amplifier that amplifies the received signal in other frequency bands. The fourth radio frequency band is, for example, the ultra-high band (UHB).

[0018] Hereinafter, power amplifiers 211A, 211B, 211C, and 211D may each be referred to as power amplifier 211. Laminated substrates 152A, 152B, and 152C may each be referred to as laminated substrate 152.

[0019] The power amplifier 211 is formed, for example, on a semiconductor chip. The semiconductor chip is provided on a multilayer substrate 152. Specifically, the semiconductor chip is, for example, flip-chip connected to the multilayer substrate 152.

[0020] The power management integrated circuits 111A and 111B are PMICs (Power Management Integrated Circuits). Power management integrated circuit 111A supplies power to the power amplifier 211B in the front-end module 102A. Power management integrated circuit 111A also supplies power to the power amplifier 211A in the front-end module 101 and the power amplifier 211D in the front-end module 102C through the switch circuit 21.

[0021] The power management integrated circuit 111B supplies power to the power amplifier 211C in the front-end module 102B. The power management integrated circuit 111B also supplies power to power amplifiers 211A and 211D through the switch circuit 21.

[0022] The switch circuit 21 switches the power supply source for the power amplifiers 211A and 211D to either the power management integrated circuit 111A or 111B.

[0023] Figure 2 shows an example of a block diagram of the front-end module 101. As shown in Figures 1 and 2, the laminated substrate 151 is further provided with a low-noise amplifier 221A, which is an example of a low-noise amplifier 221; filters 212A and 222A, which are examples of filters 212 and 222, respectively; and an antenna switch section 213A, which is an example of an antenna switch section 213.

[0024] The power amplifier 211A amplifies the transmission signal supplied from the transmission signal input terminal 231 and outputs the transmission signal to the antenna switch unit 213A through the filter 212A.

[0025] The low-noise amplifier 221A amplifies the received signal supplied from the antenna switch unit 213A through the filter 222A and outputs the received signal to the received signal output terminal 234.

[0026] The antenna switch unit 213A switches the connection destination of the antenna terminal 232 to either filter 212A or filter 222A. The antenna switch unit 213A also switches the connection destination of the antenna terminal 233 to either filter 212A or filter 222A.

[0027] The voltage terminal 241 (first power supply terminal) is connected to the power management integrated circuit 111A and the power amplifier 211B. The power supply voltage VCC1 is supplied to the voltage terminal 241 from the power management integrated circuit 111A.

[0028] The voltage terminal 242 (second power supply terminal) is connected to the power management integrated circuit 111B and the power amplifier 211C. The power supply voltage VCC2 is supplied to the voltage terminal 242 from the power management integrated circuit 111B.

[0029] The power amplifier 211D in the front-end module 102C is supplied with power supply voltage VCC1 or VCC2 from the switch circuit 21 via the voltage terminal 243.

[0030] Furthermore, each laminated substrate 152 may be provided with a low-noise amplifier 221, filters 212 and 222, and an antenna switch unit 213.

[0031] Figure 3 shows the circuit formed on the front-end module 101. As shown in Figures 1 to 3, the front-end module 101 further comprises a filter circuit 31 and a capacitor 51. The filter circuit 31 and the capacitor 51 are provided on the laminated substrate 151.

[0032] The switch circuit 21 includes switch elements 21A (first switch element) and 21B (second switch element). The filter circuit 31 includes a capacitor 32 and an inductor 33.

[0033] The switch element 21A in the switch circuit 21 has a first end connected to the voltage terminal 241 and a second end connected to ground through the filter circuit 31 and also connected to the power amplifier 211A.

[0034] The switch element 21B has a first end connected to the voltage terminal 242 and a second end connected to the second end of the switch element 21A.

[0035] The filter circuit 31 includes a capacitor 32 and an inductor 33 connected in series. In this embodiment, the capacitor 32 has one end connected to the second end of the switch element 21A and the other end connected to ground through the inductor 33. Alternatively, the capacitor 32 may have one end connected to the second end of the switch element 21A through the inductor 33 and the other end connected to ground.

[0036] The power amplifier 211 is composed of bipolar transistors, such as heterojunction bipolar transistors (HBTs). Note that the transistors in the power amplifier 211 may be composed of other transistors, such as metal-oxide-semiconductor field-effect transistors (MOSFETs). In that case, the base, collector, and emitter should be read as gate, drain, and source, respectively.

[0037] The power amplifier 211A has a collector connected to the second terminal of the switching element 21A, the voltage terminal 243, and the filter 212, a base connected to the transmit signal input terminal 231, and an emitter. The emitter in the power amplifier 211A is connected to, for example, ground.

[0038] Capacitor 51 has one end connected to the second terminal of the switching element 21A and the other end connected to ground. Capacitor 51 functions, for example, as a noise-reducing filter and also matches the impedance between the power amplifier 211A and the subsequent circuit.

[0039] Figure 4 is a schematic perspective view showing the arrangement of switch components 121 mounted on the front-end module 101. Each drawing may show the x-axis, y-axis, and z-axis. The x-axis, y-axis, and z-axis form a right-handed three-dimensional Cartesian coordinate system. Hereinafter, the direction of the arrow on the x-axis may be called the x-axis+ side, and the direction opposite to the arrow may be called the x-axis- side, and the same applies to the other axes. The z-axis+ side and z-axis- side may also be called the "upper side" and the "lower side," respectively. The z-axis direction may also be called the "stack direction." Furthermore, the planes perpendicular to the x-axis, y-axis, or z-axis may be called the yz plane, zx plane, or xy plane, respectively. Here, the direction of rotation clockwise when viewed from the upper side to the lower side is defined as the clockwise direction cw. The direction of rotation counterclockwise when viewed from the upper side to the lower side is defined as the counterclockwise direction ccw.

[0040] As shown in Figure 4, the laminated substrate 151 includes a plurality of electrode layers and a plurality of dielectric layers that are alternately stacked along the stacking direction and extend along the x and y planes. The bottommost layer 151b of the laminated substrate 151 is, for example, an electrode layer having a ground potential (hereinafter sometimes referred to as the ground electrode layer 151b). The topmost layer 151a of the laminated substrate 151 may be, for example, a dielectric layer on which an electrode pattern is formed.

[0041] A switch component 121 is mounted on the upper side of the top layer 151a. The switch component 121 is, for example, a surface mount device (SMD). The switch component 121 is soldered to the upper surface of the top layer 151a, for example. Alternatively, the switch component 121 may be fixed to the upper surface of the top layer 151a with an adhesive or the like. The switch component 121 includes a switch circuit 21.

[0042] In this embodiment, the capacitor 32 and inductor 33 in the filter circuit 31 are formed inside the laminated substrate 151.

[0043] In detail, the capacitor 32 includes electrodes 162 and 163 that face each other across a dielectric layer. Electrodes 162 and 163 are, for example, part of the electrode layer.

[0044] When the uppermost layer 151a is viewed from above in a plan view, the electrodes 162 and 163 overlap with the switch component 121. Thus, with the configuration in which the capacitor 32 is provided below the switch component 121, the space below the switch component 121 can be effectively utilized. Note that when the uppermost layer 151a is viewed from above in a plan view, the electrodes 162 and 163 may be configured not to overlap with the switch component 121.

[0045] Above the electrode 163, a via 171 extending along the z-axis is provided. The lower end of the via 171 contacts the upper surface of the electrode 163. The upper end of the via 171 is electrically connected to the second end of the switch element 21A included in the switch component 121.

[0046] The electrode 162 is provided below the electrode 163. An inductor 33 is provided between the electrode 162 and the ground electrode layer 151b. A dielectric layer in which a via 172 is formed is provided between the electrode 162 and the inductor 33. The upper end of the via 172 contacts the lower surface of the electrode 162.

[0047] The inductor 33 includes the electrode 161. The electrode 161 is, for example, a part of an electrode layer. The electrode 161 has a first end that contacts the lower end of the via 172 and a second end.

[0048] When the laminated substrate 151 is viewed from above, the electrode 161 is wound, for example, 1 / 2 turn clockwise cw in the xy plane from the first end to the second end. Note that the direction, angle, number of rotations, etc. in which the electrode 161 is wound may be arbitrary.

[0049] A dielectric layer in which a via 173 is formed is provided between the electrode 161 and the ground electrode layer 151b. The upper end of the via 173 contacts the second end of the electrode 161. The lower end of the via 173 contacts the ground electrode layer 151b. <00​​​​[Reference Example] A reference example of switch circuit 21, switch circuit 91, will be described. Figure 5 is a circuit diagram of the reference example switch circuit 91.

[0052] As shown in Figure 5, the switch circuit 91 further includes switch elements 91A, 91B, 91C, and 91D compared to the switch circuit 21 shown in Figure 3.

[0053] In the switch circuit 91, a T-shaped switch is formed between the power amplifier 211A and the voltage terminal 241 by the switch elements 21A, 91A, and 91C.

[0054] In detail, the switch element 91A has a first end connected to the voltage terminal 241 and a second end. The switch element 91C has a first end connected to the second end of the switch element 91A and a second end connected to ground. The switch element 21A has a first end connected to the second end of the switch element 91A and a second end connected to the collector of the power amplifier 211A, the voltage terminal 243, and the filter 212.

[0055] Furthermore, in the switch circuit 91, a T-shaped switch is formed between the power amplifier 211A and the voltage terminal 242 by the switch elements 21B, 91B, and 91D.

[0056] In detail, the switch element 91B has a first end connected to the voltage terminal 242 and a second end. The switch element 91D has a first end connected to the second end of the switch element 91B and a second end connected to ground. The switch element 21B has a first end connected to the second end of the switch element 91B and a second end connected to the second end of the switch element 21A.

[0057] As shown in Figures 1 and 5, when power is supplied from the power management integrated circuit 111A to the power amplifiers 211A and 211D, the switch elements 21A, 91A, and 91C become closed, closed, and open, respectively, and the switch elements 21B and 91B both become open.

[0058] At this time, the switch element 91D is closed to isolate the front-end modules 101 and 102B, and the potential of the second terminal of the switch element 91B and the potential of the first terminal of the switch element 21B become the ground potential.

[0059] On the other hand, when power is supplied from the power management integrated circuit 111B to the power amplifiers 211A and 211D, the switch elements 21B, 91B, and 91D become closed, closed, and open, respectively, and both switch elements 21A and 91A become open.

[0060] At this time, the switch element 91C is closed to isolate the front-end modules 101 and 102A, and the potential of the second terminal of the switch element 91A and the potential of the first terminal of the switch element 21A become the ground potential.

[0061] Figure 6 is a schematic perspective view showing a part of the front-end module of a reference example. As shown in Figure 6, a switch component 191 is mounted on the upper side of the top layer 151a. The switch component 191 includes a switch circuit 91.

[0062] Because the switch circuit 91 contains six switch elements, the size of the switch component 191 increases, and the area occupied by the switch component 191 on the upper surface of the top layer 151a becomes larger. In addition, the manufacturing cost of the switch component 191 increases.

[0063] [Effect] As shown in Figures 1 and 3, when power is supplied from the power management integrated circuit 111A to the power amplifiers 211A and 211D, the switch elements 21A and 21B in the switch circuit 21 become closed and open, respectively.

[0064] On the other hand, when power is supplied from the power management integrated circuit 111B to the power amplifiers 211A and 211D, the switch elements 21A and 21B become open and closed, respectively.

[0065] In the front-end module 101, a filter circuit 31 is provided between the second terminal of the switch element 21A and ground. Noise propagating from the power amplifiers 211B and 211C to the voltage terminals 241 and 242, respectively, specifically in the frequency band of the harmonics of the transmitted signal, can be reduced by decreasing the impedance of the series circuit of the capacitor 32 and the inductor 33.

[0066] Furthermore, since the number of switch elements included in the switch circuit 21 can be limited to just two, switch elements 21A and 21B, the size of the switch component 121 can be reduced. This reduces the area occupied by the switch component 121 on the upper surface of the top layer 151a. In addition, the manufacturing cost of the switch component 121 can be reduced.

[0067] As shown in Figure 4, the capacitor 32 and inductor 33 are formed inside the laminated substrate 151, so the capacitor 32 and inductor 33 do not occupy the upper surface of the uppermost layer 151a. This allows for a large empty area on the upper surface of the uppermost layer 151a. This improves the mounting density of the front-end module 101 and reduces the size of the front-end module 101.

[0068] [Second Embodiment] The front-end module 101 according to the second embodiment will be described. In the second embodiment and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects and advantages due to similar configurations will not be mentioned sequentially for each embodiment.

[0069] Figure 7 is a schematic perspective view showing the arrangement of the switch component 121 and the capacitor component 132 mounted on the front-end module 101.

[0070] As shown in Figure 7, the front-end module 101 according to the second embodiment differs from the front-end module 101 according to the first embodiment in that a capacitor component 132 is further mounted on the uppermost layer 151a of the laminated substrate 151.

[0071] The capacitor component 132 is, for example, an SMD (Small Medium-Density) component. The capacitor component 132 is soldered, for example, to the upper surface of the top layer 151a. The capacitor component 132 includes a capacitor 32.

[0072] The capacitor component 132 is provided alongside the switch component 121. In this embodiment, the capacitor component 132 is provided, for example, on the x-axis + side of the switch component 121. The inductor 33 is formed inside the laminated substrate 151.

[0073] In detail, the electrodes 161 that form the inductor 33 are provided on the underside of the capacitor component 132. When the uppermost layer 151a is viewed from above in a plan view, the electrodes 161 overlap with the capacitor component 132. In this configuration, the inductor 33 is provided on the underside of the capacitor component 132, allowing for effective use of the space below the capacitor component 132. However, when the uppermost layer 151a is viewed from above in a plan view, the electrodes 161 may not overlap with the capacitor component 132.

[0074] A dielectric layer with vias 174 is provided between the capacitor component 132 and the electrode 161. The upper end of the via 174 is electrically connected to the second end of the capacitor 32 included in the capacitor component 132. The lower end of the via 174 is in contact with the first end of the electrode 161.

[0075] In this embodiment, the electrode 161 is wound, for example, 1 / 2 turn counterclockwise in the xy plane from the first end to the second end of the laminated substrate 151 when viewed from above. The direction, angle, and number of rotations of the electrode 161 may be arbitrary.

[0076] The upper and lower ends of via 173 are in contact with the second end of electrode 161 and the laminated substrate 151, respectively.

[0077] [Third Embodiment] A front-end module 101 according to the third embodiment will now be described. Figure 8 is a schematic perspective view showing the arrangement of the switch component 121 and the inductor component 133 mounted on the front-end module 101. As shown in Figure 8, the front-end module 101 according to the third embodiment differs from the front-end module 101 according to the first embodiment in that the inductor component 133 is further mounted on the uppermost layer 151a of the laminated substrate 151.

[0078] The inductor component 133 is, for example, an SMD (Small Medium Doll). The inductor component 133 is soldered, for example, to the upper surface of the top layer 151a. The inductor component 133 includes an inductor 33.

[0079] The inductor component 133 is provided alongside the switch component 121. In this embodiment, the inductor component 133 is provided, for example, on the x-axis + side of the switch component 121. The capacitor 32 is formed inside the laminated substrate 151.

[0080] In detail, electrodes 162 and 163 that form the capacitor 32 are provided on the underside of the inductor component 133. When the uppermost layer 151a is viewed from above in a plan view, electrodes 162 and 163 overlap with the inductor component 133. In this configuration, the capacitor 32 is provided on the underside of the inductor component 133, allowing for effective use of the space below the inductor component 133. However, when the uppermost layer 151a is viewed from above in a plan view, electrodes 162 and 163 may not overlap with the inductor component 133.

[0081] An electrode 164 extending along the x-axis is connected to the x-axis-minus side of electrode 162. A dielectric layer with vias 175 is provided between the switch component 121 and electrode 164. The upper end of via 175 is electrically connected to the second end of the switch element 21A included in the switch component 121. The lower end of via 175 is in contact with the upper surface of electrode 164.

[0082] Electrode 163 is provided above electrode 162. A via 174 extending along the z-axis is provided above electrode 163. The lower end of via 174 is in contact with the upper surface of electrode 163. The upper end of via 174 is electrically connected to the first end of inductor 33 included in inductor component 133.

[0083] [Fourth Embodiment] A front-end module 101 according to the fourth embodiment will now be described. Figure 9 is a schematic perspective view showing the arrangement of the switch component 121, capacitor component 132, and inductor component 133 mounted on the front-end module 101.

[0084] As shown in Figure 9, the front-end module 101 according to the fourth embodiment differs from the front-end module 101 according to the second embodiment in that an inductor component 133 is further mounted on the uppermost layer 151a of the laminated substrate 151.

[0085] The capacitor component 132 and the inductor component 133 are provided side by side with the switch component 121. In this embodiment, the inductor component 133 is located on the x-axis + side of the switch component 121 and on the y-axis + side of the capacitor component 132. Alternatively, the inductor component 133 may be located on the y-axis - side of the capacitor component 132.

[0086] The configuration, in which the switch component 121 and at least one of the capacitor component 132 and the inductor component 133 are arranged side by side, allows for shorter wiring to connect each component.

[0087] In this embodiment, the filter circuit 31 has been described in which the capacitor 32 and the inductor 33 are connected in series, but it is not limited to this configuration. The capacitor 32 and the inductor 33 may be connected in other ways.

[0088] Furthermore, although this embodiment describes a filter circuit 31 that includes a capacitor 32 and an inductor 33, it is not limited to this configuration. The filter circuit 31 may include one or more capacitors 32, one or more inductors 33, or multiple capacitors 32 and inductors 33.

[0089] The above describes exemplary embodiments of the present invention. The front-end module 101 comprises a laminated substrate 151 having a power amplifier 211A for amplifying a transmission signal in a first radio frequency band, a switch component 121 including a switch circuit 21 and mounted on the laminated substrate 151, and a filter circuit 31. The switch circuit 21 includes switch elements 21A and 21B. The switch element 21A has a first end connected to a voltage terminal 241 and a second end connected to ground through the filter circuit 31 and also connected to the power amplifier 211A. The switch element 21B has a first end connected to a voltage terminal 242 and a second end connected to the second end of the switch element 21A.

[0090] For example, to connect a power line to ground using a T-type switch, it is necessary to provide three switch elements for each power line. As described above, by providing switch elements 21A and 21B between voltage terminals 241 and 242 and the power amplifier 211A, the number of switch elements per power line can be reduced to one. This makes it possible to reduce the size of the switch component 121. Furthermore, by providing a filter circuit 31 between the second end of switch element 21A and ground, the wiring including voltage terminal 241, switch circuit 21, and voltage terminal 242 can be electrically connected to ground through the filter circuit 31 with a low impedance for noise components outside the first radio frequency band. This makes it possible to reduce the power of noise components propagating through the wiring. In other words, isolation can be ensured between the power line on the voltage terminal 241 side and the power line on the voltage terminal 242 side. Therefore, in a configuration in which power is supplied to one amplifier through a switch that selects one of two power sources, it is possible to suppress an increase in the size of the switch and ensure isolation.

[0091] Furthermore, in the front-end module 101, the filter circuit 31 includes a capacitor 32 and an inductor 33. The capacitor 32 and the inductor 33 are formed inside the laminated substrate 151.

[0092] In this configuration, the capacitor 32 and inductor 33 are formed inside the laminated substrate 151, allowing for effective use of the space inside the laminated substrate 151. Furthermore, since the capacitor 32 and inductor 33 do not occupy the surface of the laminated substrate 151, only the switch component 121 is mounted on that surface, allowing for a large empty area on that surface. This significantly improves the mounting density of the front-end module 101 and effectively reduces the size of the front-end module 101.

[0093] Furthermore, in the front-end module 101, the filter circuit 31 includes a capacitor 32 and an inductor 33. The front-end module 101 further includes an inductor component 133 that is mounted on the laminated substrate 151. The inductor 33 is included in the inductor component 133. The capacitor 32 is formed inside the laminated substrate 151.

[0094] With this configuration, even when the number of layers in the laminated substrate 151 is small, the capacitor 32 can be formed inside the laminated substrate 151. Furthermore, since the capacitor 32 does not occupy the surface of the laminated substrate 151, the switch component 121 and the inductor component 133 can be mounted on that surface, and a large empty area can be secured on that surface. This improves the mounting density of the front-end module 101 and makes it possible to reduce the size of the front-end module 101.

[0095] Furthermore, in the front-end module 101, the filter circuit 31 includes a capacitor 32 and an inductor 33. The front-end module 101 further includes a capacitor component 132 mounted on the laminated substrate 151. The capacitor 32 is included in the capacitor component 132. The inductor 33 is formed inside the laminated substrate 151.

[0096] With this configuration, even when the number of layers in the laminated substrate 151 is small, the inductor 33 can be formed inside the laminated substrate 151. Furthermore, since the inductor 33 does not occupy the surface of the laminated substrate 151, the switch component 121 and the capacitor component 132 can be mounted on that surface, and a large empty area can be secured on that surface. This improves the mounting density of the front-end module 101 and makes it possible to reduce the size of the front-end module 101.

[0097] Furthermore, in the front-end module 101, the filter circuit 31 includes a capacitor 32 and an inductor 33. The front-end module 101 further includes a capacitor component 132 and an inductor component 133 mounted on the laminated substrate 151. The capacitor 32 is included in the capacitor component 132. The inductor 33 is included in the inductor component 133.

[0098] If the number of layers in the laminated substrate 151 is small, or if there is no available space inside the laminated substrate 151, the switch component 121, the capacitor component 132, and the inductor component 133 may be mounted on the surface of the laminated substrate 151. Even in the above case, the switch component 121, the capacitor component 132, and the inductor component 133 can be mounted in an area smaller than the area occupied by the switch component 191, including the T-type switch. This improves the mounting density of the front-end module 101 and reduces the size of the front-end module 101.

[0099] Furthermore, in the front-end module 101, the voltage terminal 241 is further connected to a power amplifier 211B that amplifies the transmission signal in the second radio frequency band.

[0100] This configuration ensures isolation between power amplifier 211A and power amplifier 211B. For example, it is possible to suppress the power of harmonics of the transmitted signal in the second radio frequency band entering the received signal in the first radio frequency band, thereby preventing a deterioration in the quality of the received signal.

[0101] Furthermore, in the front-end module 101, the voltage terminal 242 is further connected to a power amplifier 211C that amplifies the transmission signal in the third radio frequency band.

[0102] This configuration ensures isolation between power amplifiers 211A and 211B and power amplifier 211C. For example, it is possible to suppress the power of harmonics of the transmitted signal in the second radio frequency band entering the received signal in the third radio frequency band, thereby preventing a deterioration in the quality of the received signal.

[0103] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention can be modified or improved without departing from its spirit, and equivalents thereof are also included. That is, any design modifications made to each embodiment by a person skilled in the art are also included within the scope of the present invention, as long as they retain the features of the present invention. For example, the elements and their arrangement, materials, conditions, shapes, sizes, etc., of each embodiment are not limited to those exemplified and can be modified as appropriate. Furthermore, each embodiment is illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible, and these are also included within the scope of the present invention as long as they retain the features of the present invention.

[0104] <1> A front-end module comprising: a first board having a first amplifier for amplifying a transmission signal in a first radio frequency band; a switch circuit including a switch component mounted on the first board; and a filter circuit, wherein the switch circuit includes a first switch element having a first end connected to a first power supply terminal and a second end connected to the first amplifier through the filter circuit and to ground; and a second switch element having a first end connected to a second power supply terminal and a second end connected to the second end of the first switch element.

[0105] <2> A front-end module as described in <1>, wherein the filter circuit includes a capacitor and an inductor, and the capacitor and the inductor are formed inside the first substrate.

[0106] <3> A front-end module as described in <1>, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises an inductor component mounted on the first substrate, the inductor is included in the inductor component, and the capacitor is formed inside the first substrate.

[0107] <4> A front-end module as described in <1>, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises a capacitor component mounted on the first substrate, the capacitor is included in the capacitor component, and the inductor is formed inside the first substrate.

[0108] <5> A front-end module as described in <1>, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises a capacitor component and an inductor component mounted on the first substrate, the capacitor is included in the capacitor component, and the inductor is included in the inductor component.

[0109] <6> A front-end module according to any one of <1> to <5>, wherein the first power supply terminal is further connected to a second amplifier that amplifies a transmission signal in the second radio frequency band.

[0110] <7> A front-end module as described in <6>, wherein the second power supply terminal is further connected to a third amplifier that amplifies a transmission signal in the third radio frequency band.

[0111] 21...Switch circuit 21A, 21B...Switch element 31...Filter circuit 32...Capacitor 33...Inductor 51...Capacitor 101, 102A, 102B, 102C...Front-end module 111A, 111B...Power management integrated circuit 121...Switch component 132...Capacitor component 133...Inductor component 151, 152A, 152B, 152C...Laminated substrate 151a...Top layer 151b...Bottom layer 151b...Ground electrode layer 161, 162, 163, 164...Electrode 171, 172, 173, 174, 175...Via 211A, 211B, 211C, 211D...Power amplifier 212, 222...Filter 213...Antenna switch section 221...Low-noise amplifier 231...Transmit signal input terminal 232, 233... Antenna terminals 234... Receive signal output terminal 241, 242, 243... Voltage terminals 301... Power supply system

Claims

1. A front-end module comprising: a first board having a first amplifier for amplifying a transmission signal in a first radio frequency band; a switch circuit including a switch component mounted on the first board; and a filter circuit, wherein the switch circuit includes a first switch element having a first end connected to a first power supply terminal and a second end connected to the first amplifier through the filter circuit and to ground; and a second switch element having a first end connected to a second power supply terminal and a second end connected to the second end of the first switch element.

2. A front-end module according to claim 1, wherein the filter circuit includes a capacitor and an inductor, and the capacitor and the inductor are formed inside the first substrate.

3. A front-end module according to claim 1, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises an inductor component mounted on the first substrate, the inductor is included in the inductor component, and the capacitor is formed inside the first substrate.

4. A front-end module according to claim 1, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises a capacitor component mounted on the first substrate, the capacitor is included in the capacitor component, and the inductor is formed inside the first substrate.

5. A front-end module according to claim 1, wherein the filter circuit includes a capacitor and an inductor, the front-end module further comprises a capacitor component and an inductor component mounted on the first substrate, the capacitor is included in the capacitor component, and the inductor is included in the inductor component.

6. A front-end module according to any one of claims 1 to 5, wherein the first power supply terminal is further connected to a second amplifier for amplifying a transmission signal in a second radio frequency band.

7. The front-end module according to claim 6, wherein the second power supply terminal is further connected to a third amplifier for amplifying a transmission signal in a third radio frequency band.

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