Decomposition device, method for operating decomposition device, method for regenerating decomposition device, and method for producing hydrocarbon compound

Abstract

One aspect of a decomposition device according to the present disclosure comprises: a reaction furnace which has a lower member and an upper member that has a supply part for supplying an object to be processed to the inside of the reaction furnace; a filler layer which is disposed inside the reaction furnace; a heating part which is disposed outside or inside the reaction furnace and heats the filler layer; a through hole which is disposed at the bottom of the lower member of the reaction furnace; and a gap which is formed between the lower member and the upper member.

Description

Decomposition apparatus, method for operating the decomposition apparatus, method for regenerating the decomposition apparatus, and method for producing hydrocarbon compounds

[0001] This disclosure relates to a decomposition apparatus, a method for operating a decomposition apparatus, a method for regenerating a decomposition apparatus, and a method for producing hydrocarbon compounds.

[0002] One method of recycling waste plastics is chemical recycling, which involves decomposing waste plastics, monomerizing and gasifying them, or using them as blast furnace reducing agents or coke oven raw materials. For example, a fluidized bed reactor is generally used in continuous reactors that use mixed plastics containing polyolefins as raw materials to obtain basic chemicals in a single stage without going through intermediate products such as pyrolysis oils.

[0003] Patent Document 1 discloses that a plastic powder, which is a mixture of polyolefins, polystyrene, polyethylene terephthalate (PET), etc., is supplied to a fluidized bed reactor and decomposed to obtain olefins from C2 to C4, the heating medium in the fluidized bed is a mixture of used FCC catalyst and ZSM-5, and these catalysts may contain binder materials such as alumina or silica.

[0004] As a reactor with a simpler structure than a fluidized bed reactor, it is also known that fixed-bed reactors can be used to perform the thermal decomposition of plastics. Patent document 2 discloses an example in which small amounts of plastics such as polyethylene, polypropylene, PET, and polystyrene were decomposed in a batch-type fixed-bed reactor. However, with conventional fixed-bed reactors, when continuously heat-treating raw materials, especially plastics such as PET and polyvinyl chloride that tend to produce carbides as by-products, or waste plastics containing inorganic solids, reaction residue accumulates on the fixed bed as the operating time increases, making long-term continuous operation impossible.

[0005] Japanese Patent Publication No. 2016-513147, Japanese Patent Publication No. 2024-138201

[0006] The purpose of this disclosure is to provide a decomposition apparatus that can operate for a long period of time without the accumulation of reaction residue inside the reactor.

[0007] As means for solving the above problems, it is as follows. That is, <1> a reactor having a lower member and an upper member having a supply unit for supplying a processing object therein; a filler layer disposed inside the reactor; a heating unit disposed outside or inside the reactor for heating the filler layer; a through-hole disposed at the bottom of the lower member of the reactor; and a gap formed between the lower member and the upper member. A decomposition device comprising.

[0008] <2> The decomposition device according to <1>, wherein the lower member and the upper member are cylindrical in shape.

[0009] <3> The decomposition device according to <1> or <2>, wherein the area of the region defining the inside of the upper member on the bottom surface of the upper member is larger than the area of the region defining the outer shape of the lower member on the upper surface of the lower member.

[0010] <4> The decomposition device according to any one of <1> to <3>, wherein the upper member has an inert gas supply unit for supplying an inert gas.

[0011] <5> The decomposition device according to <4>, wherein the upper member has a diffuser having a through-hole through which the inert gas flows, and an opening / closing shutter capable of opening and closing the through-hole of the diffuser.

[0012] <6> The decomposition device according to any one of <1> to <5>, wherein the filler layer is a fixed bed.

[0013] <7> The decomposition device according to any one of <1> to <6>, wherein the heating unit is disposed outside the reactor.

[0014] <8> The decomposition device according to <4>, wherein the upper surface of the upper member has the processing object supply unit and the inert gas supply unit.

[0015] <9> The decomposition device according to any one of <1> to <8>, wherein the through-hole is connected to a tank containing an oxygen-containing gas.

[0016] <10> The upper member has an inert gas supply part on its upper surface, and the supply part is provided on a side surface of the upper member that connects the upper surface and the bottom surface of the upper member. The decomposition apparatus according to <4>.

[0017] <11> Supplying the object to be treated from the supply part inside a reactor having a lower member and an upper member having a supply part for supplying the object to be treated therein; Heating the filler layer arranged inside the reactor while bringing the filler layer into contact with the object to be treated, with a heating part arranged outside or inside the reactor; Supplying a gas containing oxygen into the reactor whose heating has been stopped from the through-hole of an oxygen supply part arranged at the bottom of the lower member of the reactor; Discharging reaction residues generated from the object to be treated inside the reactor from inside the reactor whose heating has been stopped, using the gas containing oxygen, from a gap formed between the lower member and the upper member. A method for operating a decomposition apparatus.

[0018] <12> A regeneration method for a decomposition apparatus, including the method for operating the decomposition apparatus according to <11>.

[0019] <13> Supplying the object to be treated from the supply part inside a reactor having a lower member and an upper member having a supply part for supplying the object to be treated therein; Heating the filler layer arranged inside the reactor while bringing the filler layer into contact with the object to be treated, with a heating part arranged outside or inside the reactor; Discharging reaction residues generated from the object to be treated inside the reactor from inside the reactor whose heating has been stopped, using the gas containing oxygen, from a gap formed between the lower member and the upper member; Generating a hydrocarbon compound by bringing the object to be treated into contact with the heated filler layer inside the reactor. A method for producing a hydrocarbon compound.

[0020] <14> The method for producing a hydrocarbon compound according to <13>, wherein the hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms.

[0021] According to embodiments of this disclosure, it is possible to provide a decomposition apparatus that does not accumulate reaction residue in the reactor and can be operated for a long period of time.

[0022] Figure 1A is a schematic cross-sectional view showing an example of a decomposition apparatus according to the first embodiment of this disclosure. Figure 1B is a block diagram showing an example of a control unit of a decomposition apparatus according to the first embodiment of this disclosure. Figure 2 is a schematic cross-sectional view showing an example of a decomposition apparatus according to the second embodiment of this disclosure. Figure 3 is an example of a flowchart of the operation method of a decomposition apparatus according to one embodiment of this disclosure. Figure 4 is an example of a flowchart of the method for producing a hydrocarbon compound according to one embodiment of this disclosure.

[0023] The disassembly apparatus and disassembly method according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments described below are illustrative examples of disassembly apparatus and disassembly method for realizing the technical concept of this disclosure and are not limited to those described below, and can be modified as appropriate without departing from the gist of this disclosure.

[0024] Furthermore, the dimensions, materials, shapes, numbers, and relative arrangements of the components described in the embodiments are merely illustrative examples and not intended to limit the scope of this disclosure unless otherwise specified. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity. Also, in the following description, the same name and reference numeral indicate the same or identical components, and detailed explanations are omitted as appropriate. To avoid overly complex drawings, schematic diagrams may be used with some elements omitted, or end views showing only the cross-section may be used as cross-sectional views.

[0025] Furthermore, in this disclosure, with regard to polygons such as rectangles, triangles, and quadrilaterals, the term "polygon" shall also include shapes in which the corners of the polygon have been processed, such as rounded corners, chamfers, or bevels. Similarly, shapes in which processing has been applied not only to the corners (ends of the sides) but also to the middle parts of the sides shall also be referred to as polygons. In other words, shapes that retain the shape of a polygon as a base but have been partially processed shall be included in the interpretation of "polygon" as described in this disclosure.

[0026] Furthermore, the same applies not only to polygons, but also to terms describing specific shapes such as cylinders, rectangular prisms, trapezoids, circles, and tapered shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0027] Furthermore, the following description uses terms that indicate specific directions or positions as needed (e.g., "up," "down," "side," "top surface," "bottom surface," "side," "X," "Y," "Z," and other terms including these terms). However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the present invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that faces upwards.

[0028] Furthermore, in this specification, the "~" indicating a numerical range means that the numbers described before and after it are included as the lower and upper limits, unless otherwise specified. In numerical ranges described in stages within this disclosure, the upper or lower limit described in one numerical range may be replaced by the upper or lower limit of another numerical range described in stages.

[0029] (Disassembly Apparatus) <First Embodiment> A disassembly apparatus according to the first embodiment of the present disclosure comprises a reactor having a lower member and an upper member having a material supply unit for supplying a material to be processed to the inside; a filler layer disposed inside the reactor; a heating unit disposed outside or inside the reactor for heating the filler layer; a through hole disposed at the bottom of the lower member of the reactor; and a gap formed between the lower member and the upper member. The disassembly apparatus according to one embodiment may further comprise other members as needed.

[0030] Figure 1A is a schematic cross-sectional view showing an example of a decomposition apparatus according to the first embodiment of the present disclosure. The decomposition apparatus 100 comprises a reactor 1, a heating section 2, a filler layer 3, a gap 4, a material to be processed supply section 5, and a through hole 6.

[0031] The direction in which the filler in filler layer 3 accumulates due to its own weight is defined as the Y-axis direction, the direction approximately perpendicular to the Y-axis direction is defined as the X-axis direction, and the direction approximately perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis are mutually orthogonal.

[0032] In this disclosure, "approximately orthogonal" is not limited to 90°, but allows for a difference of 90° ± 5°.

[0033] <<Reactor 1>> The reactor 1 is configured to accommodate the filler layer 3 and the material to be processed 11, and comprises a lower member 1A and an upper member 1B having a supply section for supplying the material to be processed to the inside. The lower member 1A is a member that accommodates the filler layer at least inside, and the upper member 1B is a member having a supply section for supplying the material to be processed to the inside.

[0034] There are no particular restrictions on the shapes of the lower member 1A and the upper member 1B, and they can be appropriately selected according to the purpose, for example, cylindrical or polygonal shapes. The shape refers to the shape of the cross-section of the reactor 1 in the plane formed in the X-axis and Z-axis directions of the reactor 1.

[0035] Preferably, the area of ​​the region defining the interior of the upper member 1B on the bottom surface of the upper member 1B is larger than the area of ​​the region defining the outer shape of the lower member 1A on the upper surface of the lower member 1A.

[0036] The upper member 1B includes a disperser 41 having through-holes through which inert gas 31 flows, and an openable / closable shutter 8 that can open and close the through-holes of the disperser 41. When the decomposition device 100 is in operation, the openable / closable shutter 8 is in an open state, supplying the material to be processed 11 and inert gas 31 into the reactor 1. When the decomposition device 100 is stopped, the openable / closable shutter 8 is in a closed state, preventing fillers and reaction residues from flowing back into the inert gas supply unit 7 when oxygen-containing gas 40 is flowed from the tank 9 into the reactor 1. In this disclosure, "disperser" means a member having through-holes that allow gases to pass through but not solids such as particles. By arranging the disperser 41, it is possible to prevent particles 3 and solids such as reaction residues 42 from entering the upper member 1B. Also in this disclosure, "openable / closable shutter" means a member having a shutter that can be controlled by a controller to switch between an open state and a closed state.

[0037] In the decomposition apparatus 100 according to the first embodiment, the upper member 1B has an inert gas supply unit 7 and a material to be processed supply unit 5 on its upper surface.

[0038] The material of the reactor 1 is not particularly limited, as long as it is stable in terms of surface temperature and atmosphere on the inside of the reactor 1, that is, on the side where the object to be processed 11 is housed.

[0039] For example, if the inside of reactor 1 is a nitrogen gas atmosphere and the inner surface temperature of reactor 1 is 400°C or less, the material of reactor 1 may be metals such as iron (Fe) or titanium (Ti); alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２Inorganic compounds such as these or their ceramics; alloys such as stainless steel, Inconel (registered trademark), Hastelloy (registered trademark), etc. can be used. These may be used alone or in combination of two or more. Among these, when the inside of the reactor 1 is in a nitrogen gas atmosphere and the surface temperature inside the reactor 1 is 400°C or lower, from the viewpoint of material cost, as the material of the reactor 1, iron (Fe) and general stainless steels such as SUS304, SUS304L, SUS316, SUS316L, etc. are preferable.

[0040] For example, when the inside of the reactor 1 is in a nitrogen gas atmosphere and the surface temperature inside the reactor 1 exceeds 400°C and is 700°C or lower, as the material of the reactor 1, alumina (Al ２ O ３ ), zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ·2SiO ２ ) and other inorganic compounds or their ceramics; alloys such as stainless steel (for example, SUS316L, SUS310S, etc.), Inconel (registered trademark), Hastelloy (registered trademark), etc. can be used.

[0041] For example, when the inside of the reactor 1 is in a nitrogen gas atmosphere and the surface temperature inside the reactor 1 exceeds 700°C and is 950°C or lower, as the material of the reactor 1, alumina (Al ２ O ３ ), zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ·2SiO ２ ) and other inorganic compounds or their ceramics; alloys such as SUS310S, (Inconel (registered trademark)), Hastelloy (registered trademark), etc. can be used.

[0042] For example, if the inside of reactor 1 is a steam atmosphere and the inner surface temperature of reactor 1 is 700°C or less, the material of reactor 1 is alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２ Inorganic compounds such as ) or ceramics thereof; alloys such as stainless steel (e.g., SUS316, SUS316L, SUS310S, etc.), Inconel®, Hastelloy®, etc. can be used.

[0043] For example, if the inside of reactor 1 is a steam atmosphere and the inner surface temperature of reactor 1 is between 700°C and 950°C, the material of reactor 1 is alumina (Al ２ O ３ ), Zirconia (ZrO ３ ), silicon carbide (SiC), silicon nitride (Si ３ N ４ ), mullite (3Al ２ O ３ ・2SiO ２ Inorganic compounds such as ) or ceramics thereof; alloys such as Inconel® and Hastelloy® can be used.

[0044] The shape, structure, and size of the reactor 1 are not particularly limited, as long as they are capable of accommodating the filler layer 3 and the material to be processed 11.

[0045] Examples of the shape of the reactor 1 include cylindrical, rectangular, conical, and frustoconical shapes.

[0046] The size of the reactor 1 is not particularly limited, as long as it has a length and inner diameter that can accommodate the filler layer 3 and the material to be processed 11.

[0047] <<Heating Section 2>> The heating section 2 is a component that heats the filler layer 3. The structure, shape, material, and size of the heating section 2 are not particularly limited as long as they can heat the reactor 1, and can be appropriately selected according to the purpose.

[0048] There are no particular restrictions on the heating method of the heating unit 2. The heating unit 2 may be located outside the reactor and the reactor 1 may be heated by external heat transfer, or the heating unit 2 may be located inside the reactor and the reactor 1 itself may be heated. For example, a known electric furnace can be used as the heating unit 2 in the external heating method. For example, a resistance heating method can be used in which two electrodes are attached to a resistor placed inside the reactor 1 in contact with the filler layer 3, and heat is generated by applying a voltage between the electrodes. Alternatively, if the filler layer 3 is a fixed bed, the filler layer 3 itself can be made into a resistor by using a conductive material as the filler constituting the filler layer 3.

[0049] The temperature of reactor 1 can be measured by inserting a thermocouple into the center of reactor 1.

[0050] <<Filler layer 3>> The filler layer 3 is formed by filling the reactor 1 with filler. In the first embodiment, the filler layer 3 is a fixed bed.

[0051] The filler layer 3 preferably has a certain amount of voids in order to ensure a flow path for the material to be treated 20 and the inert gas when the material to be treated 20 is thermally decomposed. There are no particular restrictions on the void ratio φ of the filler layer 3, and it can be set appropriately depending on the properties of the material to be treated 20 used, the conditions for thermal decomposition of the material to be treated 20, etc. However, from the viewpoint of ensuring a sufficient flow path for the material to be treated 20 and the inert gas and ensuring sufficient contact between the filler and the material to be treated 20, a void ratio of 20% to 80% is preferred, 30% to 70% is more preferred, and 40% to 60% is even more preferred.

[0052] In this disclosure, "porosity φ" is the percentage of voids in the filler layer 3, and is determined based on the following formulas 1 and 2. [Formula 1] Porosity φ (%) = (1 - Vs / V) × 100 (In formula 1, "Vs" is the volume of the filler (cm³) determined by formula 2 below. ３ ) indicates that "V" is the volume of the filler layer (cm³). ３ ) shows. Note that the volume of the filler layer 3 is the volume of the filler-filled section in the reactor 1.) [Equation 2] Vs = Wf / TD (In Equation 2, "Wf" represents the mass (g) of the filler packed into the filler layer 3, and "TD" represents the true density (g / cm³) of the filler. ３ ) indicates.

[0053] There are no particular restrictions on the shape and structure of the filler layer 3, and they can be appropriately selected according to the purpose. However, from the viewpoint of allowing the material to be processed 20 and the generated chemicals to flow smoothly and ensuring sufficient contact time between the material to be processed 20 and the filler, it is preferable that the flow direction of the material to be processed 20 is perpendicular to the flow direction, i.e., longer than the inner diameter of the reactor.

[0054] - Filler - The filler is used to maintain a constant temperature in the reaction system when the material to be processed 20 is thermally decomposed.

[0055] There are no particular restrictions on the filler, and it can be appropriately selected according to the purpose. However, it is preferable that the filler is a material that is stable in the thermal decomposition temperature range when the material to be treated 20 is thermally decomposed, does not undergo reduction by by-products such as carbon and hydrogen generated by the thermal decomposition of the material to be treated 20, and does not react with inert gas. Furthermore, it is preferable that the filler is a material that is stable when "supplying an oxygen-containing gas S103" is performed, as described later.

[0056] Specific examples of fillers include zirconium oxide, yttria-stabilized zirconium oxide, calcia-stabilized zirconium oxide, magnesium oxide, calcium oxide, silicon carbide, silicon nitride, silicon oxide, aluminum oxide, tantalum oxide, niobium oxide, beryllium oxide, lanthanum oxide, manganese(II) oxide, chromium(III) oxide, gallium oxide, silica sand, forstenite, and cordierite. Furthermore, the filler may be a surface-treated version of the above materials for purposes such as surface deactivation or improvement of the fluidity of the object to be treated 20. These may be used individually or in combination of two or more. Among these, it is preferable to use one or more of silicon carbide, aluminum oxide, silicon oxide, or surface-treated versions thereof as fillers. More preferably, one or more selected from the group consisting of silicon carbide and aluminum oxide is used, having an inert surface that does not catalyze the oxidative decomposition reaction between water vapor and hydrocarbons and the carbon deposition reaction, and possessing good thermal conductivity.

[0057] There are no particular restrictions on the surface-treated filler, and it can be appropriately selected according to the purpose. Examples include fillers having an oxide film on the surface and fillers having a carbon film on the surface. Among these, fillers having a carbon film on the surface are preferred as surface-treated fillers because they are less likely to generate active sites due to surface treatment and can prevent side reactions.

[0058] There are no particular restrictions on the method for surface-treating the filler, and any known method can be appropriately selected.

[0059] For example, when preparing a filler having an oxide film on its surface, one method is to form an oxide film on the surface of the filler by oxidation.

[0060] Furthermore, when producing a filler having a carbon film on its surface, one method involves attaching an organic compound to the surface of the filler, followed by firing in the presence of an inert gas to form the carbon film. When producing a filler having a carbon film on its surface, it is preferable to use organic compounds such as hydroxycarboxylic acid, sucrose, hydroxypropyl cellulose, or carboxymethyl cellulose, from the viewpoint of easily forming a uniform and homogeneous carbon film.

[0061] There are no particular restrictions on the hydroxycarboxylic acid, and it can be appropriately selected depending on the purpose. Examples include malic acid, citric acid, tartaric acid, gallic acid, and salicylic acid. These may be used individually or in combination of two or more.

[0062] The structure of surface-treated fillers can be confirmed, for example, by observation using a scanning electron microscope (SEM), a transmission electron microscope (TEM), X-ray photoelectron spectroscopy (XPS), or micro-Raman spectroscopy.

[0063] In a filler having a carbon film on its surface, there are no particular restrictions on the coverage rate of the filler by the carbon film, and it can be appropriately selected according to the purpose. However, the mass ratio [carbon / filler] of carbon forming the carbon film to the filler is preferably 0.0001 or more and 0.5 or less, more preferably 0.0005 or more and 0.3 or less, even more preferably 0.001 or more and 0.1 or less, and particularly preferably 0.002 or more and 0.08 or less. When the mass ratio [carbon / filler] is 0.0001 or more and 0.5 or less, the material to be treated 20 can be efficiently thermally decomposed in the thermal decomposition temperature range when the material to be treated 20 is thermally decomposed while effectively assisting contact between the fillers. The mass ratio [carbon / filler] is calculated from the mass of the organic compound that serves as the carbon source in a filler having a carbon film on its surface and the mass of the filler. Therefore, the coating of the filler with a carbon film may be complete or partial. Therefore, the carbon film includes not only layered structures but also those that appear as sea-island-like structures when observed on the surface.

[0064] In fillers having a carbon film on their surface, the coverage rate of the filler by the carbon film can be determined by methods such as calculating it from the amount of material used, or by analyzing the weight change of the carbon film based on weight changes using thermogravimetric differential thermal analysis (TG-DTA).

[0065] There are no particular restrictions on the size of the filler, and it can be appropriately selected according to the purpose, but a nominal mesh opening of 90 μm to 125 mm is preferred, 100 μm to 100 mm is more preferred, and 125 μm to 90 mm is even more preferred. The size of the filler should be measured in accordance with JIS Z 8801-1:2019.

[0066] There are no particular restrictions on the shape and structure of the filler, and it can be appropriately selected according to the purpose. However, the shape of the filler is preferably such that the molten material of the object to be processed 20 does not easily accumulate on the filler, and a spherical shape is preferred, with a perfectly spherical shape being more preferred.

[0067] <Gap 4> Gap 4 is formed between the lower member 1A and the upper member 1B in the reactor 1 and discharges the reaction residue after the material to be processed 11 has reacted. After the decomposition device 100 is stopped, oxygen-containing gas 40 is circulated from the tank 9 into the reactor 1 through the through hole 6, allowing the reaction residue accumulated on the filler layer 3 to be discharged through gap 4.

[0068] The width W1 of the gap 4 is not particularly limited as long as it can discharge the reaction residue, and can be appropriately selected according to the purpose, but it is preferable that it is less than or equal to the minimum value of the particle size distribution of the filler.

[0069] <<Processing Material Supply Unit 5>> The processing material supply unit 5 is connected to the reactor 1 and supplies the processing material 11 to the reactor 1. The inert gas supply unit 7 is located on the upper surface of the upper member 1B.

[0070] In this disclosure, "connection" of the material to be processed supply unit 5 to the reactor 1 means that the inside of the material to be processed supply unit 5 and the inside of the reactor 1 are in communication so that the material to be processed 11 can pass through them.

[0071] There are no particular restrictions on the material of the material supply unit 5 to be processed; for example, it can be appropriately selected from the same materials as those used for the reactor 1, depending on the purpose.

[0072] The shape, structure, and size of the material to be processed supply unit 5 are not particularly limited as long as it can be connected to the reactor 1 and supply the material to be processed 11 to the reactor 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the reactor 1 has an opening, this opening can be used as the material to be processed supply unit 5. The material to be processed 11 is not particularly limited as long as it is plastic, but it is preferably an industrially discarded waste plastic composition.

[0073] <Through-hole 6> The through-hole 6 is located at the bottom of the lower member 1A of the reactor 1 and is connected to a tank 9 containing oxygen-containing gas 40. After the decomposition device 100 is stopped, the oxygen-containing gas 40 is circulated from the tank 9 into the reactor 1 through the through-hole 6, allowing the reaction residue accumulated on the filler layer 3 to be discharged from the gap 4. In addition, circulating the oxygen-containing gas 40 can promote the combustion of the reaction residue.

[0074] The inner diameter of the through-hole 6 is not particularly limited as long as oxygen-containing gas 40 can be circulated through it, and can be appropriately selected according to the purpose. However, from the viewpoint of preventing the filler from falling out of the filler layer 3, it is preferable that the inner diameter is less than or equal to the minimum value of the filler particle size distribution.

[0075] The shape, structure, and size of the tank 9 are not particularly limited as long as it can be connected to the reactor 1 via the through-hole 6 and supply oxygen-containing gas to the reactor 1. They can be appropriately selected according to the purpose, for example, cylindrical or rectangular.

[0076] -Oxygen-containing gas 40- There are no particular restrictions on the oxygen content of the oxygen-containing gas 40 as long as it contains oxygen, and it can be appropriately selected according to the purpose, but it is preferably 1 volume% or more, more preferably 5 volume% or more, and particularly preferably 20 volume% or more.

[0077] <Inert Gas Supply Unit 7> The inert gas supply unit 7 is connected to the reactor 1 and supplies inert gas 31 to the reactor 1. The inert gas supply unit 7 is located on the upper surface of the upper member 1B.

[0078] In this disclosure, "connection" of the inert gas supply unit 7 to the reactor 1 means that the inside of the inert gas supply unit 7 and the inside of the reactor 1 are in communication so that the inert gas 31 can pass through them.

[0079] There are no particular restrictions on the material of the inert gas supply unit 7; for example, it can be appropriately selected from the same materials as those used for the reactor 1, depending on the purpose.

[0080] The shape, structure, and size of the inert gas supply unit 7 are not particularly limited as long as it can be connected to the reactor 1 and supply the inert gas 31 to the reactor 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the reactor 1 has an opening, this opening can be used as the inert gas supply unit 7.

[0081] The location of the inert gas supply unit 7 is not particularly restricted as long as it can be connected to the reactor 1, and can be appropriately selected depending on the type of material to be processed 11.

[0082] Note that the material to be processed supply unit 5 and the inert gas supply unit 7 may be the same. That is, a single component located at the same position may be both the material to be processed supply unit 5, which supplies the material to be processed 11 to the reactor 1, and the inert gas supply unit 7, which supplies the inert gas 31 to the reactor 1. In this case, both the material to be processed supply rate adjustment unit 14 and the inert gas supply rate adjustment unit 15, which will be described later, are a single component located at the same position.

[0083] -Inert Gas 31- There are no particular restrictions on the type of inert gas, and it can be appropriately selected according to the purpose. Examples include noble gases such as argon, nitrogen gas, and water vapor. These may be used individually or in combination of two or more.

[0084] <<Other Components>> Other components are not particularly limited as long as they do not impair the effectiveness of the decomposition apparatus according to the first embodiment of this disclosure. Examples include a temperature sensor 13, a processing material supply rate adjustment unit 14, an inert gas supply rate adjustment unit 15, a processing material supply rate sensor 16, an inert gas supply rate sensor 17, and a control unit 200.

[0085] -Temperature Sensor 13- The temperature sensor 13 measures the temperature of the filler layer 3. The temperature detection signal from the temperature sensor 13 is preferably transmitted to the first temperature controller 206a of the control unit 200. The decomposition device 100 is preferable in that it has a temperature sensor 13, as the first temperature controller 206a can provide feedback control to the temperature of the filler layer 3.

[0086] There are no particular restrictions on the temperature sensor 13, as long as it can accurately measure the temperature of the filler layer 3. Although the diagram here shows the temperature sensor 13 in contact with the filler layer 3 to measure the temperature, it is not limited to this, and the temperature sensor 13 may measure the temperature without contacting the filler layer 3.

[0087] If the temperature sensor 13 measures temperature by contacting the filler layer 3, examples include thermocouples and platinum thermometers.

[0088] If the temperature sensor 13 measures temperature without contacting the filler layer 3, examples include a radiation thermometer and an infrared thermography camera.

[0089] - Processing material supply speed adjustment unit 14 - The processing material supply speed adjustment unit 14 adjusts the supply speed at which the processing material supply unit 5 supplies the processing material 11 to the reactor 1, or stops the processing material supply unit 5 from supplying the processing material 11 to the reactor 1.

[0090] For example, a known pump, cock, screw feeder, etc., can be used as the material supply speed adjustment unit 14.

[0091] The rate at which the material to be processed 11 is supplied to the reactor 1 by the material to be processed supply rate adjustment unit 14 can be adjusted by the material to be processed supply rate controller 206b of the control unit 200, which will be described later.

[0092] - Processing Material Supply Speed ​​Sensor 16 - The processing material supply speed sensor 16 measures the supply speed of the processing material 11 by the processing material supply speed adjustment unit 14. There are no particular restrictions on the processing material supply speed sensor 16 as long as it can accurately measure the supply speed of the processing material 11 by the processing material supply speed adjustment unit 14. For example, a known flow sensor for solids or liquids can be used.

[0093] The supply speed detection signal from the material supply speed sensor 16 is suitably transmitted to the material supply speed controller 206b of the control unit 200. The decomposition apparatus 100 is preferable because it has a material supply speed sensor 16, which improves the yield of the product 12 and minimizes the power consumption of the filler layer 3, and the material supply speed controller 206b can provide feedback control of the supply speed of the material supply unit 5.

[0094] -Inert gas supply rate adjustment unit 15- The inert gas supply rate adjustment unit 15 adjusts the supply rate at which the inert gas supply unit 7 supplies inert gas 31 to the reactor 1, or stops the supply of inert gas 31 to the reactor 1 by the inert gas supply unit 7.

[0095] For example, a known pump, a cock, or the like can be used as the inert gas supply rate adjustment unit 15.

[0096] The rate at which the inert gas 31 is supplied to the reactor 1 by the inert gas supply rate adjustment unit 15 can be adjusted by the controller 206 of the control unit 200 using the inert gas supply rate controller 206c.

[0097] -Inert Gas Supply Rate Sensor 17- The inert gas supply rate sensor 17 measures the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15. There are no particular restrictions on the inert gas supply rate sensor 17 as long as it can accurately measure the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15. For example, a known flow sensor for liquids or gases can be used.

[0098] -Control Unit 200- Figure 1B is a block diagram showing an example of the control unit of a disassembly apparatus according to the first embodiment of the present disclosure.

[0099] The control unit 200 optimally controls each component of the decomposition apparatus 100. For example, depending on the type of material to be processed 11, it controls each component based on processing recipe data 208, which includes processing conditions such as the temperature of the heating unit 2, the temperature of the filler layer 3, and the rate at which the material to be processed 11 is supplied to the reactor 1 by the material supply rate adjustment unit 14.

[0100] The control unit 200 includes, for example, a CPU (Central Processing Unit) 201, a memory 202, a display unit 203, an input / output unit 204, a communication unit 205, various controllers 206, and a storage unit 207.

[0101] --CPU 201-- The CPU 201 reads various programs and data necessary for program execution from the storage unit 207 as needed and uses them.

[0102] --Memory 202-- Memory 202 is used for various processes performed by the CPU 201.

[0103] --Display Unit 203-- The display unit 203 is a liquid crystal display that displays the operation screen, selection screen, etc., of the disassembly device 100.

[0104] --Input / Output Unit 204-- The input / output unit 204 includes an operation panel, keyboard, etc., for the operator to perform various operations such as inputting various data and outputting various data to a predetermined storage medium.

[0105] --Communications Unit 205-- Communications Unit 205 handles data exchange via networks, etc.

[0106] --Controller 206-- Various controllers 206 control various parts of the decomposition device 100. Examples of various controllers 206 include a first temperature controller 206a, a processing material supply rate controller 206b, an inert gas supply rate controller 206c, and an open / close shutter controller 206d.

[0107] ---First Temperature Controller 206a--- The first temperature controller 206a controls the temperature of the filler layer 3 in the reactor 1 by controlling the temperature of the heating section 2. The first temperature controller 206a can use semiconductor-based phase control, semiconductor-based PWM (Pulse Width Modulation) control, etc. In addition, the first temperature controller 206a can take in the temperature detection signal from the temperature sensor 13 of the filler layer 3 in the reactor 1 and feedback control the temperature of the heating section 2 using PID (Proportional-Integral-Different) control or on-off control. Among these, PID control is preferred for the first temperature controller 206a from the viewpoint of suppressing temperature overshoot in the filler layer 3 in the reactor 1 and suppressing side reactions at high temperatures.

[0108] ---Processing Material Supply Speed ​​Controller 206b--- The processing material supply speed controller 206b controls the supply speed of the processing material 11 to the reactor 1 by the processing material supply speed adjustment unit 14. The processing material supply speed controller 206b takes in the supply speed detection signal from the processing material supply speed sensor 16 and can feedback control the supply speed of the processing material 11 using PID control or on-off control.

[0109] ---Inert Gas Supply Rate Controller 206c--- The inert gas supply rate controller 206c controls the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15. The inert gas supply rate controller 206c receives the inert gas supply rate detection signal from the inert gas supply rate sensor 17 and can feedback control the amount of inert gas 31 supplied by PID control or on-off control.

[0110] ---Open / Close Shutter Controller 206d--- The open / close shutter controller 206d controls the timing of the removal of the filler layer 3 from the reactor 1 by the open / close shutter 8.

[0111] --Storage Unit 207-- The storage unit 207 consists of a hard disk drive (HDD) and other components that store various programs executed by the CPU 201 and data necessary for program execution.

[0112] [Example of operation of the disassembly apparatus 100 according to the first embodiment] Next, a specific example of the operation of the disassembly apparatus 100 according to the first embodiment will be described. First, the material to be processed 11 is supplied into the reactor 1 from the material to be processed supply unit 5. At this time, the material to be processed supply rate adjustment unit 14 adjusts the supply rate of the material to be processed 11 into the reactor 1. The supply rate of the material to be processed 11 is measured by the material to be processed supply rate sensor 16, and the supply rate detection signal is transmitted to the material to be processed supply rate controller 206b of the control unit 200, where it is controlled.

[0113] The material to be processed 11 supplied into the reactor 1 comes into contact with the filler layer 3 and is heated. At this time, the temperature of the filler layer 3 is measured by a temperature sensor 13. The temperature detection signal from the temperature sensor 13 is suitably transmitted to the first temperature controller 206a of the control unit 200. Inside the reactor 1, the material to be processed 11 is heated, and a product 12 and reaction residue 42 are generated. The reaction residue 42 is accumulated on top of the filler layer 3.

[0114] If the temperature of the filler layer 3 is not constant, the temperature of the heating unit 2 is adjusted by feedback control by the first temperature controller 206a of the control unit 200 so that the temperature of the filler layer 3 becomes constant. Also, if the temperature of the filler layer 3 is to be lowered or raised, the operator changes the input value to the input / output unit 204 so that the temperature of the heating unit 2 is adjusted to the desired temperature. In addition, inert gas 31 is supplied into the reactor 1 from the inert gas supply unit 7. At this time, the supply rate of the inert gas 31 into the reactor 1 is adjusted by the inert gas supply rate adjustment unit 15. The supply rate of the inert gas 31 is measured by the inert gas supply rate sensor 17, and the supply rate detection signal is transmitted to the inert gas supply rate controller 206c of the control unit 200 for control.

[0115] After a desired time has elapsed since the supply of the material to be processed 11, a signal is transmitted to the open / close shutter controller 206d. At this time, the open / close shutter 8 is controlled to be in a closed state. Oxygen-containing gas 40 is also supplied from the tank 9 into the reactor 1, burning the reaction residue 42 accumulated on the filler layer 3, and discharging the reaction residue 42 from the gap 4 to the outside of the decomposition device 100. At this time, the open / close shutter 8 is controlled to be in a closed state by the control unit 200. This prevents the filler and reaction residue from flowing back into the inert gas supply unit 7.

[0116] These operations can be stored in the memory unit 207, and the desired reaction conditions can be read from the memory unit 207 and used as appropriate.

[0117] In this way, the decomposition apparatus 100 according to the first embodiment can efficiently discharge the reaction residue 42.

[0118] <Second Embodiment> Figure 2 is a schematic cross-sectional view showing an example of a disassembly apparatus according to the second embodiment of the present disclosure. The disassembly apparatus according to the second embodiment of the present disclosure differs from the disassembly apparatus according to the first embodiment in that the upper member 1B has an inert gas supply unit 7 on its upper surface and a material to be processed supply unit 5 on the side surface of the upper member 1B that connects the upper surface and the bottom surface of the upper member 1B. Furthermore, the disassembly apparatus according to the second embodiment of the present disclosure may further include other members.

[0119] (Operation method of disassembly apparatus and regeneration method of disassembly apparatus) An operation method of a disassembly apparatus according to one embodiment of the present disclosure involves heat-treating an object to be processed using the disassembly apparatus of the present disclosure. A regeneration method of a disassembly apparatus according to one embodiment of the present disclosure includes an operation method of a disassembly apparatus according to one embodiment of the present disclosure.

[0120] A method for operating a decomposition apparatus according to one embodiment of the present disclosure includes: supplying a material to be processed from a material to be processed to the inside of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the inside of the reactor; heating a filler layer located inside the reactor with a heating unit located outside or inside the reactor while bringing the filler layer and the material to be processed into contact; supplying an oxygen-containing gas to the inside of the reactor from a through-hole in an oxygen-treated material supply unit having a through-hole located at the bottom of the lower member of the reactor; and discharging reaction residue generated from the material to be processed inside the reactor from the inside of the reactor, after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member. The decomposition method according to one embodiment of the present disclosure may further include other processes as necessary.

[0121] Figure 3 is an example of a flowchart showing the operation method of a disassembly apparatus according to one embodiment of the present disclosure.

[0122] <Supplying the material to be processed S101> Supplying the material to be processed S101 involves supplying the material to be processed 11 from the material to be processed supply unit 5 to the reactor 1.

[0123] There are no particular restrictions on the supply rate of the filler layer 3 to the reactor 1, and it can be selected as appropriate for the purpose. There are no particular restrictions on the supply rate of the material to be processed 11 to the reactor 1, and it can be selected as appropriate for the type of material to be processed 11, etc.

[0124] <Heating in the heating section S102> Heating in the heating section S102 involves heating the filler layer 3 in the heating section 2 while bringing the filler layer 3 into contact with the object to be processed 11. Supplying the object to be processed S101 and heating in the heating section S102 may be performed separately or simultaneously.

[0125] There are no particular restrictions on the heating temperature in the heating section S102, and it can be appropriately selected according to the purpose, but 400°C to 950°C is preferred, 650°C to 930°C is more preferred, and 700°C to 900°C is even more preferred.

[0126] Furthermore, the heating temperature should be controlled so that the inner surface of the reactor 1 does not become so hot that the material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the reactor 1 varies depending on various conditions such as the distance between the inner surface of the reactor 1 and the filler layer 3, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the reactor 1 and the filler layer 3 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the reactor 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.

[0127] When product 12 is at least one chemical selected from the group consisting of olefins having 1 to 10 carbon atoms and aromatic hydrocarbons, and heating in the heating section S102 is performed without a catalyst, the supply rate of the inert gas 31 v(m ３ The value calculated by the following formula 3 (per minute) is preferably between 0.05 and 10, more preferably between 0.07 and 6, and even more preferably between 0.1 and 4. [Formula 3] 60 × L Ｒ × (A - B) / v However, in equation 3, L Ｒ A represents the length (m) of the filler layer 3, and A represents the cross-sectional area (m) of the reactor 1. ２ ) is shown, and B is the cross-sectional area of ​​the filler layer 3 (m ２ ) indicates that v is the supply rate v (m) of the inert gas 31. ３ It indicates (per minute).

[0128] <Supplying oxygen-containing gas S103> Supplying oxygen-containing gas S103 involves supplying oxygen-containing gas into the inside of the reactor 1, where heating has been stopped, from the through-hole 6 of the oxygen supply unit, which has a through-hole 6 located at the bottom of the lower member 1A of the reactor 1.

[0129] <Discharge S104> Discharge S104 involves discharging the reaction residue generated from the material to be processed 11 inside the reactor 1 through the gap 4 formed between the lower member 1A and the upper member 1B, using an oxygen-containing gas from inside the reactor 1 after heating has been stopped. Discharge S104 is performed simultaneously with supplying the oxygen-containing gas S103 in the flowchart 300.

[0130] <Other Processing> There are no particular restrictions on other processing, and they can be appropriately selected according to the purpose. Examples include a regeneration process, an inert gas supply process, a plastic pretreatment process, a process for recovering useful components from the product 12 obtained by decomposing the plastic, and a process for separating useful components.

[0131] (Method for producing hydrocarbon compounds) A method for producing hydrocarbon compounds according to one embodiment of the present disclosure involves heat-treating the material to be treated using the decomposition apparatus of the present disclosure.

[0132] A method for producing a hydrocarbon compound according to one embodiment of the present disclosure includes supplying a material to be processed from a material to be processed to the inside of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the inside of the reactor; heating a filler layer located inside the reactor with a heating unit located outside or inside the reactor while bringing the filler layer and the material to be processed into contact; discharging reaction residue generated from the material to be processed inside the reactor from the inside of the reactor after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member; and producing a hydrocarbon compound by bringing the material to be processed and the heated filler layer into contact inside the reactor. The decomposition method according to one embodiment of the present disclosure may further include other processes as necessary.

[0133] Figure 4 is an example of a flowchart of a method for producing a hydrocarbon compound according to one embodiment of the present disclosure.

[0134] <Supplying the material to be processed S201> Supplying the material to be processed S201 involves supplying the material to be processed 11 from the material to be processed supply unit 5 to the reactor 1.

[0135] There are no particular restrictions on the supply rate of the filler layer 3 to the reactor 1, and it can be selected as appropriate for the purpose. There are no particular restrictions on the supply rate of the material to be processed 11 to the reactor 1, and it can be selected as appropriate for the type of material to be processed 11, etc.

[0136] <Heating in the heating section S202> Heating in the heating section S202 involves heating the filler layer 3 in the heating section 2 while bringing the filler layer 3 into contact with the object to be processed 11. Supplying the object to be processed S201 and heating in the heating section S202 may be performed separately or simultaneously.

[0137] There are no particular restrictions on the heating temperature in the heating section S202, and it can be appropriately selected according to the purpose, but 400°C to 950°C is preferred, 650°C to 930°C is more preferred, and 700°C to 900°C is even more preferred.

[0138] Furthermore, the heating temperature should be controlled so that the inner surface of the reactor 1 does not become so hot that the material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the reactor 1 varies depending on various conditions such as the distance between the inner surface of the reactor 1 and the filler layer 3, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the reactor 1 and the filler layer 3 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the reactor 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.

[0139] When product 12 is at least one chemical selected from the group consisting of olefins having 1 to 20 carbon atoms and aromatic hydrocarbons, and heating in the heating section S202 is performed without a catalyst, the supply rate of the inert gas 31 v(m ３ The value calculated by the following formula 4 (per minute) is 0.05 m ３ / min~20m ３ It is preferable to have a rate of 0.07 m / min. ３ / min~10m ３ It is more preferable to make it so that it is 0.1 m / min. ３ / min~4m ３ It is even more preferable to make it so that it is per minute. [Equation 4] 60 × L Ｒ × (A - B) / v However, in equation 4, L Ｒ A represents the length (m) of the filler layer 3, and A represents the cross-sectional area (m) of the reactor 1. ２ ) is shown, and B is the cross-sectional area of ​​the filler layer 3 (m ２ ) indicates that v is the supply rate v (m) of the inert gas 31. ３ It indicates (per minute).

[0140] <Supplying oxygen-containing gas S203> Supplying oxygen-containing gas S203 involves supplying oxygen-containing gas into the inside of the reactor 1, where heating has been stopped, from the through-hole 6 of the oxygen supply unit, which has a through-hole 6 located at the bottom of the lower member 1A of the reactor 1.

[0141] <Generating hydrocarbon compounds S204> In generating hydrocarbon compounds S204, the filler layer 3 and the material to be processed 11 are brought into contact inside the reactor 1 to generate hydrocarbon compounds.

[0142] The hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms, and is, for example, at least one chemical selected from the group consisting of olefins and aromatic hydrocarbons.

[0143] <Other Processing> There are no particular restrictions on other processing, and they can be appropriately selected according to the purpose, and can be processed in the same way as other processing in the operation method of the decomposition apparatus. Examples include a regeneration process, an inert gas supply process, a plastic pretreatment process, a recovery process for useful components in the product 12 obtained by decomposing the plastic, and a separation process for useful components.

[0144] As described above, this disclosure has been explained based on specific embodiments, but these embodiments are merely examples, and this disclosure is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, additions, modifications, etc., are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents.

[0145] This application claims priority based on Japanese Patent Application No. 2024-226817, filed on 23 December 2024, which is incorporated herein by reference to the entire contents of the said Japanese Patent Application.

[0146] 1...Reaction furnace 1A...Lower member 1B...Upper member 2...Heating section 3...Filler layer 4...Gap 5...Processing material supply section 6...Through hole 7...Inert gas supply section 8...Open / close shutter 9...Tank 11...Processing material 12...Product 13...Temperature sensor 14...Processing material supply rate adjustment section 15...Inert gas supply rate adjustment section 16...Processing material supply rate sensor 17...Inert gas supply rate sensor 31...Inert gas 40...Oxygen-containing gas 41...Disperser 42...Reaction residue 100...Decomposition device 200...Control unit 202...Memory 203...Display unit 204...Input / output unit 205...Communication unit 206...Various controllers 206a...First temperature controller 206b...Processing material supply rate controller 206c...Inert gas supply rate controller 206d...Open / close shutter controller 207...Storage unit 208... Processing recipe data

Claims

1. A decomposition apparatus comprising: a reactor having a lower member and an upper member having a material supply unit for supplying a material to be processed inside; a filler layer disposed inside the reactor; a heating unit disposed outside or inside the reactor for heating the filler layer; a through hole disposed at the bottom of the lower member of the reactor; and a gap formed between the lower member and the upper member.

2. The disassembly device according to claim 1, wherein the shape of the lower member and the upper member is cylindrical.

3. The disassembly device according to claim 1 or claim 2, wherein the area of ​​the region defining the interior of the upper member on the bottom surface of the upper member is larger than the area of ​​the region defining the outer shape of the lower member on the top surface of the lower member.

4. The decomposition apparatus according to any one of claims 1 to 3, wherein the upper member has an inert gas supply unit for supplying an inert gas.

5. The decomposition apparatus according to claim 4, wherein the upper member comprises a disperser having a through-hole through which the inert gas flows, and an openable / closable shutter capable of opening and closing the through-hole of the disperser.

6. The disassembly apparatus according to any one of claims 1 to 5, wherein the filler layer is a fixed bed.

7. The decomposition apparatus according to any one of claims 1 to 6, wherein the heating unit is located outside the reactor.

8. The decomposition apparatus according to claim 4, wherein the upper surface of the upper member has the processing material supply unit and the inert gas supply unit.

9. The decomposition apparatus according to any one of claims 1 to 8, wherein the through hole is connected to a tank containing an oxygen-containing gas.

10. The decomposition apparatus according to claim 4, wherein the upper surface of the upper member has the inert gas supply unit, and the side surface of the upper member connecting the upper surface and the bottom surface of the upper member has the material to be processed supply unit.

11. A method for operating a decomposition apparatus, comprising: supplying a material to be processed from a material to be processed to the interior of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the interior of the reactor; heating the filler layer, which is disposed inside the reactor, with a heating unit disposed outside or inside the reactor, while bringing the filler layer and the material to be processed into contact; supplying an oxygen-containing gas to the interior of the reactor, after heating has been stopped, from the through-hole of an oxygen supply unit having a through-hole disposed at the bottom of the lower member of the reactor; and discharging reaction residue generated from the material to be processed inside the reactor from the interior of the reactor, after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member.

12. A method for regenerating a disassembly apparatus, comprising the method for operating the disassembly apparatus described in claim 11.

13. A method for producing a hydrocarbon compound, comprising: supplying a material to be processed from a material to be processed to the inside of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the inside of the reactor; heating the filler layer, which is disposed inside the reactor, in a heating unit disposed outside or inside the reactor, while bringing the filler layer into contact with the material to be processed; discharging reaction residue generated from the material to be processed inside the reactor from the inside of the reactor after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member; and producing a hydrocarbon compound by bringing the material to be processed and the heated filler layer into contact inside the reactor.

14. The method for producing a hydrocarbon compound according to claim 13, wherein the hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms.

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