Ceramic substrate and method for manufacturing same

A ceramic substrate with a sintered α-alumina coating on a ceramic particle base addresses smoothness and thermal conductivity issues, enhancing ESD resistance and thermal conductivity in electronic devices.

WO2026141273A1PCT designated stage Publication Date: 2026-07-02PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2025-12-22
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Existing ceramic substrates used in electronic devices often suffer from insufficient smoothness of the support surface, leading to potential electrostatic discharge (ESD) issues and impaired thermal conductivity due to the formation of irregularities during sintering.

Method used

A ceramic substrate is manufactured with a base material containing a sintered body of ceramic particles, covered by a coating of sintered α-alumina particles with a smaller average diameter, which fills in irregularities and provides a smooth, high thermal conductivity surface.

Benefits of technology

The substrate achieves improved thermal conductivity and ESD resistance by ensuring a smooth surface for electronic components, reducing the likelihood of electrostatic discharge and enhancing the reliability of electronic devices.

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Abstract

This ceramic substrate comprises a base material that contains a sintered body of ceramic particles (A) and a covering material that contains a sintered body of α-alumina particles (B). The base material has a support surface. The covering material covers the entire support surface of the base material. The average particle diameter of the α-alumina particles (B) is smaller than the average particle diameter of the ceramic particles (A).
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