Plasma treatment device and power supply system
The plasma processing apparatus stabilizes plasma density by using delayed bias pulses, addressing process variations and ensuring uniform substrate treatment.
WO2026141366A1PCT designated stage Publication Date: 2026-07-02TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-12-23
- Publication Date
- 2026-07-02
Smart Images
Figure JP2025044991_02072026_PF_FP_ABST
Abstract
Disclosed is a plasma treatment device comprising: a chamber; a substrate support part in the chamber; a source power supply configured to periodically supply a pulse of a source signal in a pulse cycle, and set a power level of the pulse of the source signal to a first level in a first period within the pulse cycle; and a bias power supply configured to supply a pulse of a bias signal to the substrate support part in a second period that starts from a delay time point at which a delay time of 1-30 microseconds elapses from a start time point of the first period.
Need to check novelty before this filing date? Find Prior Art