Heat dissipating molded body and electronic component device

Abstract

A heat dissipating molded body 10 comprises a thermally conductive resin member, and has a cap shape including a top surface section 11 and a wall surface section 12. The heat dissipating molded body 10 is at least partially in contact with a heat producing conductive member 21 of an electronic component device 20, and is used for dissipating heat that is produced from the heat producing conductive member 21.

Description

Heat dissipation molded body and electronic component device

[0001] The present invention relates to a heat-dissipating molded body and an electronic component device equipped with a heat-dissipating molded body.

[0002] Electronic devices and automotive electronic components generate heat, so conventionally, thermal problems have been solved by efficiently cooling the casing using thermal conductive materials such as heat dissipation materials. Examples of heat dissipation materials used in devices include thermal sheets and thermal grease. In recent years, due to the increasing performance of devices, the voltage values ​​of electronic components such as busbars have been rising. Also, with the need to save space in devices, conductive parts tend to be closer to the casing. Therefore, in addition to heat dissipation, dielectric breakdown performance is increasingly required of heat dissipation materials.

[0003] If the amount of heat dissipation sheet or heat dissipation grease used is insufficient, surface discharge can occur, making dielectric breakdown more likely. Therefore, conventional attempts have been made to ensure insulation by increasing the amount of heat dissipation sheet or heat dissipation grease used. For example, Patent Document 1 shows a heat dissipation structure for an electronic device in which a heating element and a heat sink are integrated via an electrically insulating thermal conductive sheet, and a thermal conductive grease layer that is incompatible with the thermal conductive sheet is provided between the thermal conductive sheet and the heating element or heat sink. Furthermore, Patent Document 2 discloses that in order to dissipate heat from a busbar to a case member constituting a battery case, a highly heat-dissipating resin member is provided between the busbar and the case member, and a thermal conductive sheet is provided between the busbar and the resin member, and between the resin member and the case member.

[0004] Furthermore, various methods other than those mentioned above have been used to ensure insulation. For example, Patent Document 3 discloses an electronic component cover, which is a rectangular cylindrical member with one end open and the other end closed, and which houses heat-generating electronic components such as power transistors. The electronic component cover is formed such that one of the top plate portion and the bottom plate portion is thicker than the other, and it has been shown that a cover with excellent electrical insulation effect can be made by bringing the heat sink of the heat-generating electronic component into contact with an external heat sink via the thicker plate portion.

[0005] Patent No. 4413649 Patent No. 6461291 Patent No. 4591699

[0006] However, as shown in Patent Documents 1 and 2, if the amount of heat dissipation material used, such as thermal grease or thermal conductive sheets, is increased, there is a risk that the heat dissipation material may not fit inside the device if the device is made more space-saving. In the case of grease, there is a risk that the grease may drip and contaminate other components, or that materials produced by the dripping may become electrically conductive. On the other hand, as shown in Patent Document 3, if insulation is ensured by increasing the thickness of the plate portion constituting the cover, there are limits to how much creepage distance can be extended in a space-saving manner.

[0007] Therefore, the object of the present invention is to provide a heat-dissipating molded body and an electronic component device that can ensure appropriate heat dissipation and insulation while reducing the amount of heat dissipation material used.

[0008] As a result of diligent research, the inventors have found that the above problems can be solved by giving the heat dissipation molded body a specific three-dimensional shape and using it in contact with a heat-generating conductive member, and have completed the present invention as follows. That is, the present invention provides the following [1] to

[13] . [1] A heat dissipation molded body made of a heat-conductive resin member, having a cap shape including a top surface and a wall surface, wherein at least a part of the heat dissipation molded body is in contact with a heat-generating conductive member of an electronic component device and is used to dissipate heat generated from the heat-generating conductive member. [2] The heat dissipation molded body according to [1], wherein the thickness of at least one of the top surface and the wall surface is 0.5 mm or more. [3] The heat dissipation molded body according to [1] or [2], wherein the length of the wall surface is 2 mm or more. [4] The heat dissipation molded body according to any one of [1] to [3], wherein the end of the wall surface has a flange portion that protrudes outward from the outer peripheral surface of the wall surface. [5] The heat dissipation molded body according to any one of [1] to [4] above, wherein the type E durometer hardness of the thermal conductive resin member is 10 or more and 80 or less. [6] The heat dissipation molded body according to any one of [1] to [5] above, wherein the dielectric breakdown strength of the thermal conductive resin member is 1 kV / mm or more. [7] The heat dissipation molded body according to any one of [1] to [6] above, wherein the thermal conductive resin member comprises a polymer matrix and a thermal conductive filler. [8] The heat dissipation molded body according to any one of [1] to [7] above, wherein the thermal conductive resin member is a cured product of a thermal conductive resin composition. [9] An electronic component device comprising a heat-generating conductive member, a housing, and a heat dissipation molded body made of a thermal conductive resin member, wherein the heat dissipation molded body has a cap shape including a top surface and a wall surface, and either the inner surface or the outer surface of the top surface of the heat dissipation molded body is in contact with the housing and the other is in contact with the heat-generating conductive member.

[10] The electronic component device according to [9], wherein either the inner surface or the outer surface of the top surface is adhered to the housing.

[11] The electronic component device according to [9] or

[10] , wherein the housing is arranged to enclose the top surface with the inner surface of the top surface and the inner circumferential surface of the wall surface.

[12] The electronic component device according to any one of [9] to

[11] , wherein the heat dissipation molded body extends the creepage distance between the heat-generating conductive member and the housing with the wall surface.

[13] The electronic component device according to any one of [9] to

[12] above, wherein the ratio of the creepage distance between the heat-generating conductive member and the housing to the length of the longest part of the heat-dissipating molded body that contacts the heat-generating conductive member is 0.3 or more.

[0009] According to the present invention, it is possible to provide a heat-dissipating molded body that can appropriately ensure heat dissipation and insulation while reducing the amount of heat dissipation material used.

[0010] This is a schematic perspective view showing a heat dissipation molded body and electronic component device according to the first embodiment. This is a schematic cross-sectional view showing a heat dissipation molded body and electronic component device according to the first embodiment. This is a schematic perspective view showing a heat dissipation molded body according to the second embodiment. This is a schematic perspective view showing a heat dissipation molded body according to the third embodiment. This is a schematic perspective view showing a heat dissipation molded body according to the fourth embodiment. This is a schematic cross-sectional view showing a heat dissipation molded body and electronic component device according to the fourth embodiment. This is a schematic perspective view showing one usage mode of the heat dissipation molded body according to the second embodiment. This is a schematic cross-sectional view showing the heat dissipation molded body and electrode jig in Examples 1 to 3. This is a schematic cross-sectional view showing the heat dissipation molded body and electrode jig in Examples 4 to 6. This is a schematic cross-sectional view showing the heat dissipation molded body and electrode jig in Example 7, and the heat dissipation sheet and electrode jig in Comparative Examples 1 and 2.

[0011] [First Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1 and 2 show a heat dissipation molded body 10 and an electronic component device 20 equipped with the heat dissipation molded body 10 according to the first embodiment. The heat dissipation molded body 10 is made of a heat-conductive resin material and has a cap shape including a top surface portion 11 and a wall surface portion 12, as shown in Figures 1 and 2. As shown in Figure 2, the heat dissipation molded body 10 has a recess 14 formed by the top surface portion 11 and the wall surface portion 12. The wall surface portion 12 is formed to surround the recess 14 around its entire circumference. The top surface portion 11 is connected to the tip of the wall surface portion 12, and the inner surface 11B of the top surface portion 11 becomes the bottom surface of the recess 14. The top surface portion 11 is preferably flat on both its outer surface 11A and inner surface 11B. Having flat surfaces makes it easier for components such as the housing 22 and the heat-generating conductive member 21 to adhere closely to the top surface portion 11, as will be described later. Furthermore, the top surface 11 has a flat outer surface 11A, which makes it easier for the heat dissipation molded body 10 to be adsorbed by the suction device described later.

[0012] The heat dissipation molded body 10 has a wall portion 12, which extends the creepage distance between the member placed inside the recess 14 and the member placed on the outer surface 11A of the top portion 11. Therefore, insulation between the member inside the recess 14 and the member on the outer surface 11A of the top portion 11 can be ensured while reducing the amount of heat dissipation material used. In this specification, extending the creepage distance means that the creepage distance is longer when the heat dissipation molded body has a wall portion compared to when it does not have a wall portion. Furthermore, the member inside the recess 14 and the member on the outer surface 11A of the top portion 11 may be in contact with the inner surface 11B and outer surface 11A, respectively, and as will be described later, one may be a heat-generating element such as a heat-generating conductive member 21 and the other may be a heat-dissipating element such as a housing 22. In addition, since the heat dissipation molded body 10 can be placed inside the recess 14, the space required for the heat dissipation molded body 10 can be minimized, so it can be used in space-saving devices. In addition, because the heat dissipation molded body 10 has a cap shape, the contact area between the member inside the recess 14 and the heat dissipation molded body 10 is easily improved, thus improving heat dissipation.

[0013] Furthermore, the heat dissipation molded body 10 may be compressed and used in electronic component devices, etc., as described later, by a member placed inside the recess 14 or a member placed on the outer surface 11A of the top surface 11. By being used in a compressed state, the heat dissipation molded body 10 improves its heat conductivity and heat dissipation performance by increasing its contact with the member inside the recess 14 and the member on the outer surface 11A of the top surface 11.

[0014] Preferably, the heat dissipation molded body 10 has adhesive properties on at least one of its top surface 11 or wall surface 12. Adhesion makes it easier to position the heat dissipation molded body 10 in a predetermined location without it adhering to other components and shifting position. More preferably, the heat dissipation molded body 10 has adhesive properties on either the outer surface 11A or the inner surface 11B of the top surface 11. In this case, both the outer surface 11A and the inner surface 11B may be adhesive, but it is even more preferable that at least the inner surface 11B is adhesive. The adhesive inner surface 11B of the heat dissipation molded body 10 allows it to adhere to components such as the housing 22 inserted into the recess 14, making it easier to assemble into the electronic component device 20. However, the adhesive surface is not limited to the above configuration; the inner circumferential surface of the wall surface 12 may also be adhesive. In this case as well, the heat dissipation molded body 10 can adhere to components such as the housing 22 inserted into the recess 14, making it easier to assemble into the electronic component device 20. If the inner circumferential surface of the wall portion 12 is adhesive, it is preferable that the inner surface 11B of the top portion 11 is also adhesive, however, the inner surface 11B of the top portion 11 does not necessarily have to be adhesive.

[0015] The method for imparting tackiness to the heat-dissipating molded body 10 is not particularly limited, but preferably, tackiness may be imparted by a polymer matrix as described later. For example, using rubber in the polymer matrix makes it easier to impart tackiness. Also, when using a curable component, tackiness can be increased by increasing the mixing ratio of the main agent to the curing agent. Specifically, when the matrix is ​​silicone rubber and an alkenyl group-containing organopolysiloxane and a hydrosilyl group-containing organopolysiloxane are used, tackiness can be increased by reducing the ratio of hydrosilyl groups to alkenyl groups contained in the curable component. Furthermore, tackiness can be increased by methods other than the ratio of hydrosilyl groups to alkenyl groups, and can be appropriately adjusted, for example, by the properties of the organopolysiloxane itself. And, for example, when using a two-component type and the volume ratio of the first agent to the second agent is 1:1 or approximately 1:1, tackiness can also be increased by increasing the ratio of hydrosilyl groups to alkenyl groups. In this case, for example, as the alkenyl group-containing organopolysiloxane, a polymer with a low alkenyl group content may be used. Furthermore, the method for imparting tackiness to the polymer matrix is ​​not limited to the above; for example, tackiness may be imparted by applying an adhesive by spray coating or the like.

[0016] The adhesive portion of the heat-dissipating molded body 10 should have a tack value above a certain level. Specifically, the tack value of the adhesive portion (hereinafter also referred to as "tack value T1") should be, for example, 50 mN / mm ２ It is good if it is above 60 mN / mm ２ Preferably, it is 70 mN / mm ２ More preferably, the value is 90 mN / mm ２ It is even more preferable that the above is true. If the tack value T1 is above a certain value, misalignment will be less likely to occur after the heat dissipation molded body 10 is attached to the housing 22 or the like. The upper limit of the tack value T1 of the adhesive part is not particularly limited, but for example it is 1000 mN / mm ２ Therefore, 200 mN / mm ２It may be. In the present embodiment, as described above, it is preferable that the inner surface 11B of the top surface portion 11 of the heat dissipation molded body 10 has adhesiveness. Therefore, it is preferable that the inner surface 11B of the top surface portion 11 has the above-mentioned tack value T1.

[0017] Also, a part of the heat dissipation molded body 10 may have adhesiveness, and the tack value of another part may be lower than that of the part having adhesiveness. For example, as described above, the heat dissipation molded body 10 has adhesiveness on the inner surface 11B of the top surface portion 11 or the inner peripheral surface of the wall surface portion 12, and the tack value of the outer surface 11A of the top surface portion 11 or the outer peripheral surface of the wall surface portion 12 may be lower than the tack value T1 of the inner surface 11B of the top surface portion 11 or the inner peripheral surface of the wall surface portion 12. By thus lowering the tack value of the outer peripheral surface of the wall surface portion 12 or the outer surface 11A of the top surface portion 11, when holding the heat dissipation molded body 10 and incorporating it into the electronic component device 20, stickiness is less likely to occur and workability is improved. Among them, it is preferable that the tack value of the outer surface 11A of the top surface portion 11 is lower than the tack value T1 of the inner surface 11B of the top surface portion 11 or the inner peripheral surface of the wall surface portion 12, and it is more preferable that the tack value of the outer surface 11A of the top surface portion 11 is lower than the tack value T1 of the inner surface 11B of the top surface portion 11. By lowering the tack value of the outer surface 11A of the top surface portion 11, for example, when incorporating the heat dissipation molded body 10 into the electronic component device 20 using a suction device, the outer surface 11A of the top surface portion 11 sucked by the suction device can be easily detached from the suction device by stopping the suction and attached to the housing 22, and the workability becomes better.

[0018] As described above, the tack value (hereinafter, also referred to as "tack value T2") of the portion where the tack value is lower than the tack value T1, such as the outer surface 11A of the top surface portion 11 and the outer peripheral surface of the wall surface portion 12, is, for example, 50 mN / mm ２ or less, preferably 40 mN / mm ２ or less, more preferably 30 mN / mm ２ or less, still more preferably 25 mN / mm ２ or less. Also, from the viewpoint of workability, the lower the tack value T2, the better, and 0 mN / mm ２The above is sufficient, but when incorporating it into the electronic component device 20, in order to give it a certain degree of flexibility to other components such as heat-generating conductive members, for example, 1 mN / mm ２ It may be greater than or equal to 5 mN / mm ２ It may be greater than or equal to 10 mN / mm ２ It may be greater than or equal to 15 mN / mm ２ That's fine too.

[0019] The method for lowering the tack value in the heat-dissipating molded body 10 is not particularly limited. For example, when providing tackiness with a polymer matrix, it is preferable to form a skin layer with low tackiness using a reactive resin or the like, as described in the manufacturing method described later, thereby lowering the tack value with the skin layer. Also, when providing tackiness by applying an adhesive by spray coating or the like, it is preferable to lower the tack value by providing a portion of the heat-dissipating molded body 10 where the adhesive is not applied.

[0020] The tack value should be measured using the following method: Attach the evaluation sample of the heat-dissipating molded body to the jig of the tack tester, and in an environment of 23°C and 50% relative humidity, measure the tack value at a speed of 0.7 mm / second and a contact time of 10 seconds using a probe (cross-sectional area 0.195 cm²). ２ The tack value is measured from the maximum load when the tester is pressed against the surface of the evaluation sample and pulled at a speed of 0.7 mm / second. A TA-500 tack tester manufactured by UBM Co., Ltd. can be used.

[0021] In this embodiment, the wall portion 12 comprises first and second side wall portions 13A and 13B facing each other, and third and fourth side wall portions 13C and 13D facing each other, and these side wall portions 13A to 13D are connected to form the wall portion 12. As a result, the wall portion 12 has a rectangular cross-section, and the top portion 11 is also rectangular. In addition, adjacent side wall portions of the wall portion 12 (for example, side wall portion 13A and side wall portion 13C) are connected via curved corners, but the corners do not need to be curved. Furthermore, the recess 14 is preferably tapered toward the top portion 11, and therefore, it is preferable that the opposing inner surfaces of the wall portion 12 (the inner surfaces of side wall portions 13A and 13B, and the inner surfaces of side wall portions 13C and 13D) are inclined in the height direction so that they are closer to each other. Because the recess 14 is tapered, the end of the wall portion 12 widens outward, making it easier to insert a component such as the housing 22 into the recess 14. However, the recess 14 does not need to be tapered; in that case, the opposing inner surfaces of the wall portion 12 (the inner surfaces of side wall portions 13A and 13B, and the inner surfaces of side wall portions 13C and 13D) may be parallel to each other.

[0022] The heat dissipation molded body 10 preferably has a thickness of 0.5 mm or more at least of the thickness D1 of the top surface portion 11 and the thickness D2 of the wall surface portion 12, and more preferably both thicknesses are 0.5 mm or more. Having a certain thickness or more for the top surface portion 11 and the wall surface portion 12 prevents dielectric breakdown from occurring due to damage or wear of the top surface portion 11 and the wall surface portion 12.

[0023] As described above, the thickness D1 of the top surface 11 is preferably 0.5 mm or more, but from the viewpoint of dielectric breakdown performance, it is more preferably 1 mm or more, even more preferably 1.5 mm or more, and even more preferably 1.8 mm or more. Furthermore, from the viewpoint of improving heat dissipation and suppressing the amount of heat dissipation material used, the thickness D1 of the top surface 11 is preferably 5 mm or less, more preferably 4 mm or less, and even more preferably 3 mm or less. The wall surface 12 is less likely to be subjected to external force during use and is less likely to be damaged than the top surface 11. Therefore, from the viewpoint of suppressing the amount of heat dissipation material used, the thickness D2 of the wall surface 12 is preferably smaller than the thickness D1 of the top surface 11. As described above, the thickness D2 of the wall surface 12 is preferably 0.5 mm or more, but from the viewpoint of improving dielectric breakdown performance, it is more preferably 0.6 mm or more, even more preferably 0.7 mm or more, and even more preferably 0.8 mm or more. Furthermore, from the viewpoint of reducing the amount of heat dissipation material used, the thickness D2 of the wall portion 12 is preferably 3 mm or less, more preferably 2 mm or less, and even more preferably 1.8 mm or less.

[0024] Furthermore, the length L1 of the wall portion 12 is preferably 2 mm or more. When the length L1 of the wall portion 12 is 2 mm or more, the creepage distance between the member placed inside the recess 14 of the heat dissipation molded body 10 and the member placed on the outer surface 11A of the top portion 11 can be increased. From the viewpoint of further increasing the creepage distance, the length L1 is more preferably 3 mm or more, and even more preferably 3.5 mm or more. Also, from the viewpoint of reducing the amount of heat dissipation material used, the length L1 should be kept below a certain level, for example, 50 mm or less, preferably 30 mm or less, more preferably 20 mm or less, and even more preferably 15 mm or less. Note that the length L1 is the shortest distance from the inner surface 11B of the top portion 11 to the end of the wall portion 12.

[0025] The heat-dissipating molded body 10 is used for an electronic component device 20 equipped with a heat-generating conductive member 21. At least a portion of the heat-dissipating molded body 10 is in contact with the heat-generating conductive member 21 and is used to dissipate the heat generated from the heat-generating conductive member 21.

[0026] Referring to Figures 1 and 2, a specific embodiment of how the heat dissipation molded body 10 is used in an electronic component device 20 will be described. The electronic component device 20 includes a housing 22 in addition to the heat dissipation molded body 10 and the heat-generating conductive member 21. The heat-generating conductive member 21 is an electrode member or the like, as will be described later, and preferably has one surface that is in close contact with the outer surface 11A of the top surface portion 11. In this embodiment, the housing 22 has a columnar portion 22A, and the columnar portion 22A is inserted into the recess 14 of the heat dissipation molded body 10. The columnar portion 22A of the housing 22 is positioned so that its tip surface is in contact with the inner surface 11B of the top surface portion 11. On the other hand, the heat-generating conductive member 21 is positioned so as to be in contact with the outer surface 11A of the top surface portion 11. With the above configuration, the heat generated by the heat-generating conductive member 21 can be easily conducted to the housing 22 via the top surface portion 11 and dissipated from the housing 22. Furthermore, since the heat dissipation molded body 10 has a wall portion 12, the creepage distance between the heat-generating conductive member 21 and the housing 22 can be increased, thereby ensuring insulation between the heat-generating conductive member 21 and the housing 22.

[0027] The housing 22 is preferably arranged so that at least one surface (in this embodiment, the tip surface of the columnar portion 22A) is in close contact with the inner surface 11B of the top surface 11. As described above, it is preferable that the inner surface 11B of the top surface 11 is adhesive, and it is preferable that the tip surface of the columnar portion 22A of the housing 22 adheres to the inner surface 11B of the top surface 11. Furthermore, the outer circumferential surface of the columnar portion 22A of the housing 22 may have a shape corresponding to the inner circumferential surface of the wall portion 12, and specifically has four sides corresponding to the side wall portions 13A to 13D. The housing 22 is preferably fitted into the recess 14 and positioned so as to enclose the top surface 11 and the wall portion 12. The heat dissipation molded body 10 can be incorporated into the electronic component device 20 without displacement from the housing 22 by inserting the columnar portion 22A into its recess 14 and attaching it to the housing 22. Furthermore, the outer surface of the columnar portion 22A may be in close contact with the wall portion 12 of the heat dissipation molded body 10 (i.e., the side wall portions 13A to 13D), and may even be adhesive, thereby more effectively preventing displacement of the heat dissipation molded body 10. In addition, the columnar portion 22A may have a tapered shape corresponding to the recess 14, but it does not have to be tapered.

[0028] In the electronic component device 20, the creepage distance (hereinafter sometimes referred to as "creepage distance L2") between the member (housing 22) disposed inside the recess 14 of the heat dissipation molded body 10 and the member (heat-generating conductive member 21) disposed on the outer surface 11A of the top surface portion 11 is preferably 4 mm or more, more preferably 5 mm or more, and even more preferably 7 mm or more. By increasing the creepage distance, creepage discharge can be appropriately prevented and dielectric breakdown performance can be improved. The creepage distance is not particularly limited, but from the viewpoint of suppressing the amount of heat dissipation material used, it is preferably 50 mm or less, more preferably 30 mm or less, and even more preferably 20 mm or less. In this embodiment, the creepage distance L2 is typically the sum of the thickness D1 of the top surface portion 11, the thickness D2 of the wall portion 12, and the length L1 of the wall portion 12.

[0029] The length of the longest portion of the heat-dissipating molded body 10 that contacts the heat-generating conductive member 21 (hereinafter sometimes referred to as "contact length L3") is not particularly limited, but is often 5 mm to 150 mm, preferably 10 mm to 100 mm, and more preferably 15 mm to 50 mm. By keeping the contact length L3 within a certain range, the heat-generating conductive member 21 can be properly heated by the heat-dissipating molded body 10. In this embodiment, the heat-dissipating molded body 10 is in close contact with one surface of the heat-generating conductive member 21 at the outer surface 11A of its top surface 11. Therefore, in this embodiment, the contact length L3 is the contact length of the outer surface 11A of the heat-dissipating molded body 10 with respect to the heat-generating conductive member 21. In this embodiment, the contact length L3 is the length of the longest portion of the outer surface 11A of the top surface 11. For example, if the shape of the outer surface 11A is a circle, it is the diameter; if it is an ellipse, it is the length of the major axis; and if it is a square, it is usually the length of the diagonal.

[0030] The ratio of creepage distance L2 to contact length L3 (L2 / L3) is preferably 0.3 or greater. In the electronic component device 20, a ratio (L2 / L3) of a certain level or greater makes it easier to appropriately prevent dielectric breakdown by the heat dissipation molded body 10. The ratio (L2 / L3) is preferably 0.35 or greater, and more preferably 0.4 or greater. Furthermore, although the ratio (L2 / L3) is not particularly limited, from the viewpoint of suppressing the amount of heat dissipation material used, it is preferable to keep it below a certain level, preferably 1.5 or less, more preferably 1.2 or less, and even more preferably 1.0 or less.

[0031] In the electronic component device 20, the heat-generating conductive member 21 is a member that generates heat when an electric current flows through it, and electrode members are preferred, with busbars being a prime example. Other examples include conductive members in lithium-ion batteries, onboard chargers, battery disconnection units, and junction boxes. Among these, busbars are more preferred. Busbars are often used with high voltages applied, making them prone to overheating and dielectric breakdown. However, by using the heat-dissipating molded body of the present invention, heat can be efficiently dissipated, and dielectric breakdown can be appropriately suppressed. The materials constituting the heat-generating conductive member 21 include metallic materials such as gold, silver, copper, or alloys containing any of these, carbon materials such as graphite, and metal oxides such as indium tin oxide, tin oxide conductive film, and zinc oxide. Among these, metallic materials are preferred from the viewpoint of high conductivity.

[0032] The housing 22 is a member through which the heat generated by the heat-generating conductive member 21 is propagated via the heat-radiating molded body. The housing 22 serves as a heat radiator that further releases the propagated heat to the outside. The housing 22 may form part of the casing of the electronic component device 20 or may be a member other than the casing. The housing 22 is preferably made of a metal material such as aluminum, a resin material, graphite, or the like. Also, a chiller may flow inside the housing 22. In this embodiment, for example, a chiller may flow inside the columnar portion 22A. By having a chiller flow inside the housing 22, the heat dissipation performance is improved. Also, the housing 22 does not necessarily need to have a columnar portion as long as it can be inserted into the recess 14 and contact the inner surface 11B, and other members may be inserted into the recess 14.

[0033] The electronic component device 20 is not particularly limited as long as it has the heat-radiating molded body 10, the heat-generating conductive member 21, and the housing 22, and it may be used as an electrical component of various electrical devices or as an in-vehicle electrical component. Since the electronic component device 20 can accommodate space savings, it can be suitably used for various miniaturized electrical devices and in-vehicle electrical components. Also, the electronic component device 20 is preferably used, for example, in a battery, more preferably in a lithium battery, and even more preferably in an in-vehicle lithium battery.

[0034] Also, when incorporating the heat-radiating molded body 10 into the electronic component device 20, the heat-radiating molded body 10 is lifted by suction with a known suction device (not shown), then moved onto a member inserted into the recess 14 such as on the housing 22, and the suction is stopped to attach the heat-radiating molded body 10 to a member such as the housing 22. At this time, for example, after a member such as the housing 22 (for example, the tip surface of the columnar portion of the housing 22) contacts the inner surface 11B of the top surface portion 11 of the heat-radiating molded body 10, the suction may be stopped. By using a suction device to incorporate the heat-radiating molded body 10 into the electronic component device 20, the heat-radiating molded body 10 can be easily incorporated into the electronic component device 20 by pick-and-place or the like, and the workability is further improved.

[0035] [Second Embodiment] In the heat dissipation molded body 10 of the first embodiment described above, the wall portion 12 had a rectangular cross-section, but it may have a shape other than a rectangle, or it may be a polygon other than a rectangle. The polygon may have curved corners as described above, and the inner circumferential surface may be composed of a flat surface and a curved surface, or the corners may not be curved, and the inner circumferential surface may be a flat surface. Furthermore, the wall portion 12 may have an inner circumferential surface that is curved, such as a circular or elliptical shape, or it may be a deformed circular or elliptical shape, or it may be a shape other than these. Figure 3 shows a heat dissipation molded body 25 in which the wall portion 12 is circular as the second embodiment. The differences between the second embodiment and the first embodiment will be described below. Note that the configuration of the heat dissipation molded body 25 and the electronic component device in this embodiment is the same as in the first embodiment described above.

[0036] As shown in Figure 3, if the wall portion 12 is circular in shape, the inner circumferential surface of the wall portion 12 will also be circular, and the outer surface 11A of the top portion 11 will also be circular. In this embodiment as well, it is preferable to arrange a component such as a heat-generating conductive member 21 on the outer surface 11A of the top portion 11, and arrange a component such as a housing 22 inside the cap-shaped recess to constitute an electronic component device. In this case, the shape of the housing should match the shape of the side wall portion, and the shape of the columnar portion of the housing should be cylindrical, thereby allowing the housing to be enclosed by the top portion 11 and the wall portion 12. The shape of the columnar portion of the housing may, for example, be a polygon if the wall portion 12 is polygonal, and an elliptical if the wall portion 12 is elliptical. However, it is not necessarily required to match the shape of the wall portion 12, and it may have a different shape from the wall portion 12.

[0037] [Third Embodiment] In the heat dissipation molded body 10 in the first and second embodiments described above, the cap shape including the top surface portion 11 and the wall surface portion 12 is shown as one, but the heat dissipation molded body may have a plurality of cap shapes. A heat dissipation molded body having a plurality of cap shapes is shown in FIG. 4 as the heat dissipation molded body 30 according to the third embodiment. Hereinafter, the differences from the first embodiment will be described for the third embodiment. Note that the configurations of the parts omitted in the description of the heat dissipation molded body 30 and the electronic component device according to the present embodiment are the same as those in the first embodiment above.

[0038] The heat dissipation molded body 30 according to the third embodiment has two cap shapes, and adjacent cap shapes are connected to each other via a connection portion 15. Here, the connection portion 15 may be configured to connect the wall surface portions 12 to each other. Note that the inside of the connection portion 15 is hollow, and the concave portions inside each cap may be connected via the hollow. That is, the hollow inside the connection portion may be connected to the concave portions inside each cap without passing through the wall surface portion. The heat dissipation molded body 30 according to the third embodiment can insert members such as a plurality of housings into the inside of the concave portion by having a plurality of cap shapes. Therefore, it can be suitably used for an electronic component device having a plurality of housings.

[0039] The wall surface portion 12 constituting each cap shape of the heat dissipation molded body 30 according to the third embodiment is circular as in the second embodiment (FIG. 3), but the cross-sectional shape of the wall surface portion in this embodiment is not limited to a circle, and may have a square shape as in the first embodiment, or may have a shape other than a circle or a square as described in the second embodiment. Also, in the heat dissipation molded body 30, the number of cap shapes is not particularly limited, and may be three, or four or more.

[0040] [Fourth Embodiment] Next, a fourth embodiment of the heat dissipation molded body of the present invention will be described. The heat dissipation molded body 40 according to the fourth embodiment has a flange portion 26 at the end of the wall portion 12 that protrudes outward from the outer peripheral surface of the wall portion 12, as shown in Figures 5 and 6. The heat dissipation molded body 40 according to this embodiment can further extend the creepage distance by having the flange portion 26. The differences between the fourth embodiment and the first embodiment will be described below. Note that the configuration of the heat dissipation molded body 40 and the electronic component device 50 according to this embodiment is the same as in the first embodiment described above.

[0041] Here, the flange portion 26 should protrude outward around the entire circumference of the wall portion 12. The length L4 of the flange portion 26 is preferably 0.5 mm or more. By having a wall portion 12 length L1 of 0.5 mm or more, the creepage distance L2 can be significantly extended by the flange portion 26, and the dielectric breakdown performance can be further improved. The length L4 of the flange portion 26 is preferably 1 mm or more, and more preferably 2 mm or more. Also, from the viewpoint of reducing the amount of heat dissipation material used, the length L4 should be kept below a certain level, for example, 30 mm or less, preferably 15 mm or less, and more preferably 10 mm or less. Note that the length L4 is the shortest distance from the inner circumferential surface of the wall portion 12 to the tip of the flange portion 26.

[0042] The thickness D3 of the flange portion 26 is not particularly limited, but from the viewpoint of being less susceptible to damage by external forces, it is preferably 0.2 mm or more, more preferably 0.3 mm or more, and even more preferably 0.4 mm or more. Also, although the thickness D3 of the flange portion 26 is not particularly limited, from the viewpoint of suppressing the amount of heat dissipation material used, it is preferably 15 mm or less, more preferably 8 mm or less, and even more preferably 3 mm or less. When the flange portion 26 is provided, the creepage distance L2 can typically be extended further by a length obtained by subtracting twice the thickness D2 of the wall portion 12 from twice the length L4 of the flange portion 26, compared to the case where the flange portion 26 is not provided. The preferred value of the creepage distance L2 is as described in the first embodiment.

[0043] In this embodiment as well, as described in the second embodiment, the cross-sectional shape of the wall portion 12 may not be a rectangle, but may be circular, elliptical, or any other shape. Also, when a flange portion 26 is provided, as described in the third embodiment, two or more cap shapes may be provided on one heat dissipation molded body. In that case, it is preferable that adjacent cap shapes be connected to each other, as described in the third embodiment. However, in the third embodiment described above, the wall portions 12 were connected to each other by a connecting portion 15, but in this embodiment, although not shown, the flange portions 26 may be connected to each other. Of course, in this embodiment as well, the wall portions 12 may be connected to each other, or the wall portions 12 and the flange portions 26 may be connected. Also, when one heat dissipation molded body has two or more cap shapes, some of the cap shapes may have flange portions, while the rest do not. In this embodiment, the flange portion 26 protrudes outward from the end of the wall portion 12, but it is not necessary for it to protrude outward from the end of the wall portion 12; it may protrude outward from any position on the outer surface of the wall portion 12. However, from the viewpoint of moldability and other factors, it is preferable for the flange portion 26 to protrude outward from the end of the wall portion 12.

[0044] Next, we will explain in more detail the usage configuration when the heat-generating conductive member 21 is a busbar 21A, using Figure 7. In the following explanation, the heat-dissipating molded body 25 shown in the second embodiment will be used as the heat-dissipating molded body, but of course, other heat-dissipating molded bodies may also be used. In this usage configuration, the electronic component device 55 is provided with a busbar 21A, and the outer surface 11A of the top surface 11 of the heat-dissipating molded bodies 25, 25 is in close contact with one surface 21X of the busbar 21A and the opposite surface 21Y of the surface 21X. Housings 22, 22 are inserted into the recesses 14, 14 of each heat-dissipating molded body 25, 25, and the tip surface of the columnar portion 22A of the housing 22 is in close contact with the inner surface 11B of the top surface 11. In the electronic component device 55 having the above configuration, the heat generated by the busbar 21A is transmitted to the housings 22, 22 via each heat-dissipating molded body 25, 25, and the heat can be efficiently dissipated from the housings 22, 22. Furthermore, in this configuration, the heat generated by the busbar 21A is transmitted from both sides 21X and 21Y of the busbar 21A to the housing 22, 22 via the two heat dissipation molded bodies 25, 25, so that the heat generated by the busbar 21A can be dissipated more efficiently. However, only one heat dissipation molded body may be in close contact with the busbar 21A, or three or more heat dissipation molded bodies may be in close contact. Also, when multiple heat dissipation molded bodies are in close contact with the busbar 21A, the shapes of the heat dissipation molded bodies may be two or more types. Therefore, when two heat dissipation molded bodies are in close contact with the busbar 21A, the shape of the wall portion of one heat dissipation molded body may be circular and the shape of the wall portion of the other heat dissipation molded body may be square. Also, the heat dissipation molded body that comes into contact with the busbar 21A may be a single heat dissipation molded body provided with two or more cap shapes.

[0045] In the above descriptions of each embodiment, the heat dissipation molded body was described as having a heat-generating conductive member in contact with the outer surface 11A of the top surface 11, and a housing inserted into the recess 14, with the housing in contact with the inner surface 11B of the top surface 11. However, the heat-generating conductive member and the housing may be arranged in the reverse order. That is, the heat-generating conductive member may be inserted into the recess 14 of the heat dissipation molded body and in contact with the inner surface 11B of the top surface 11, and the housing 22 may be arranged in contact with the outer surface 11A of the top surface 11. Even with such a configuration, the heat generated by the heat-generating conductive member 21 can be transmitted to the housing 22 via the heat dissipation molded body and dissipated from the housing 22. Furthermore, by having a wall surface 12 or a wall surface 12 and a flange 26 in the heat dissipation molded body, the creepage distance between the housing 22 and the heat-generating conductive member 21 can be extended. Furthermore, even with the above configuration, it is preferable that one surface of the heat-generating conductive member is in close contact with the inner surface 11B of the top surface 11, and that one surface of the housing is in close contact with the outer surface 11A of the top surface 11. In addition, the heat-generating conductive member inside the recess 14 may be in contact with the inner circumferential surface of the wall surface 12, and it is preferable that the heat-generating conductive member inside the recess 14 is in close contact with the inner circumferential surface of the wall surface 12.

[0046] Furthermore, when the housing 22 comes into contact with the outer surface 11A of the top surface 11, the outer surface 11A of the top surface 11 may be adhesive, thereby allowing the housing 22 to adhere to the outer surface 11A of the top surface 11, and thus the heat dissipation molded body can be easily attached to the housing 22. In this case, the inner surface 11B of the top surface 11 may be adhesive, or it may have a tack value T2 that is lower than the tack value T1 of the outer surface 11A of the top surface 11. Also, the inner and outer circumferential surfaces of the wall surface 12 of the heat dissipation molded body may be adhesive, or they may have a tack value T2 that is lower than the tack value T1 of the outer surface 11A of the top surface 11.

[0047] Furthermore, although the above description illustrates a configuration in which the top surface portion 11 is positioned approximately perpendicular to the vertical direction, the top surface portion 11 does not need to be positioned approximately perpendicular to the vertical direction. For example, it may be positioned at an angle to the vertical direction, or it may be positioned parallel to the vertical direction.

[0048] <Heat Dissipating Molded Body> Next, the heat dissipating molded body used in the present invention will be described in more detail. The heat dissipating molded body of the present invention consists of a thermally conductive resin member. Furthermore, the thermally conductive resin member is preferably a cured product of a thermally conductive resin composition, as will be described later. Furthermore, the thermally conductive resin member preferably contains a polymer matrix and a thermally conductive filler.

[0049] The heat-conductive resin component constituting the heat-dissipating molded body preferably uses rubber as the polymer matrix and has rubber elasticity. Furthermore, the Type E durometer hardness of the heat-conductive resin component constituting the heat-dissipating molded body is preferably 10 or more and 80 or less. A hardness of 80 or less improves the conformability of the heat-dissipating molded body to the heat-generating conductive component and housing, thereby improving the heat dissipation performance of the heat-dissipating molded body. It also makes it easier to impart tackiness to the heat-dissipating molded body. On the other hand, a hardness of 10 or more makes it easier to ensure a certain level of moldability. A Type E durometer hardness of 20 or more and 65 or less is more preferable, and 30 or more and 55 or less is even more preferable.

[0050] Furthermore, the dielectric breakdown strength of the thermally conductive resin component constituting the heat dissipation molded body is preferably 1 kV / mm or higher. If the dielectric breakdown strength is 1 kV / mm or higher, the heat dissipation molded body can be said to be molded from a material that is substantially insulating. From the viewpoint of improving dielectric breakdown performance, the dielectric breakdown strength is more preferably 3 kV / mm or higher, even more preferably 5 kV / mm or higher, and still more preferably 8 kV / mm or higher. The dielectric breakdown strength can be determined by preparing a sample of 1 mm thick and 50 mm x 50 mm using the thermally conductive resin component and measuring the dielectric breakdown strength in the thickness direction.

[0051] The thermal conductivity of the heat-conductive resin member constituting the heat-dissipating molded body is preferably 1.0 W / (m·K) or higher. A thermal conductivity of 1.0 W / (m·K) or higher allows for good heat dissipation. From the viewpoint of further improving heat dissipation, the thermal conductivity is more preferably 1.5 W / (m·K) or higher, and even more preferably 2.0 W / (m·K) or higher. The upper limit of the thermal conductivity is not particularly limited, but practically, it is, for example, 30 W / (m·K) or lower, and preferably 10 W / (m·K) or lower. The thermal conductivity (W / m·K) can be measured, for example, by a method compliant with ASTM D5470-06.

[0052] (Polymer Matrix) The polymer matrix used in the heat-dissipating molded article is a polymer compound such as elastomer or rubber, and preferably one formed by curing a liquid curable component consisting of a mixed system such as a main agent and a curing agent. The curable component may consist of, for example, uncrosslinked rubber and a crosslinking agent, or it may contain monomers, prepolymers, etc., and a curing agent. Furthermore, the curing reaction may be room temperature curing or thermal curing.

[0053] Examples of polymer matrices include acrylic rubber, nitrile rubber, isoprene rubber, urethane rubber, ethylene propylene rubber, styrene-butadiene rubber, butadiene rubber, fluororubber, and butyl rubber. Other materials besides rubber may also be used, such as epoxy resin, phenolic resin, unsaturated polyester resin, polyimide resin, acrylic resin, and polyamide resin. Among these, rubber is preferred from the viewpoint of ease of casting and ease of imparting tackiness, with urethane rubber and silicone rubber being more preferred, and silicone rubber being even more preferred. In particular, among polymer matrices, silicone rubber is preferred from the viewpoint of ease of imparting tackiness to the heat-dissipating molded article, as well as from the viewpoint of insulation and heat dissipation. Furthermore, the polymer matrix consists of a resin component, and it is preferable that it is a cured product of a resin component containing a curable component. The polymer matrix may be used alone or in combination of two or more types.

[0054] In a heat-dissipating molded article, if the polymer matrix is ​​silicone rubber, the silicone rubber is preferably a cured product of an organopolysiloxane, and preferably formed from a curable component containing an organopolysiloxane. Furthermore, the heat-conductive resin member is preferably a cured product obtained by curing a heat-conductive resin composition containing a curable component such as an organopolysiloxane and a heat-conductive filler. The polymer matrix is ​​more preferably a cured product of an addition-reaction type organopolysiloxane. The addition-reaction type organopolysiloxane may include an alkenyl group-containing organopolysiloxane and a hydrosilyl group-containing organopolysiloxane. Examples of alkenyl groups include vinyl groups. In addition, the heat-conductive resin member may appropriately contain components other than the heat-conductive filler and polymer matrix (such as additives), as described later.

[0055] The thermally conductive resin composition may contain resin components other than the curable component as a resin component. For example, in the case of silicone rubber, it may contain organopolysiloxanes other than hydrosilyl group-containing organopolysiloxanes and alkenyl group-containing organopolysiloxanes (also called other organopolysiloxanes). Specifically, examples include silicone oil, organopolysiloxanes having at least one alkoxy group (alkoxy group-containing organopolysiloxanes), organopolysiloxanes having at least one hydroxyl group (hydroxyl group-containing organopolysiloxanes), organopolysiloxanes having groups with aromatic structures such as pyrene and perylene, preferably polycyclic aromatic structures (aromatic group-containing organopolysiloxanes).

[0056] The content of the polymer matrix in the thermally conductive resin member is not particularly limited, but for example, it is 10% by volume or more and 70% by volume or less, preferably 20% by volume or more and 60% by volume or less, and more preferably 30% by volume or more and 50% by volume or less. When the content is 10% by volume or more, the polymer matrix can properly hold the thermally conductive filler. Furthermore, when it is 70% by volume or less, it becomes easier to incorporate components other than the polymer matrix, such as thermally conductive fillers, in an appropriate amount into the heat-dissipating molded body.

[0057] (Thermally conductive fillers) Examples of thermally conductive fillers include metal oxides, metal nitrides, metal hydroxides, carbon materials, non-metallic oxides, nitrides, carbides, and organic fibers. Using these thermally conductive fillers makes it easier to ensure the insulation properties of the heat-dissipating molded body and also makes it easier to increase the dielectric breakdown strength. The shape of the thermally conductive fillers can be spherical, irregularly shaped powder, etc. Examples of metal oxides in thermally conductive fillers include aluminum oxide, represented by alumina, magnesium oxide, and zinc oxide. Examples of metal nitrides include aluminum nitride. Examples of metal hydroxides include aluminum hydroxide. Examples of carbon materials include diamond. Examples of non-metallic oxides, nitrides, and carbides include quartz, boron nitride, and silicon carbide. Examples of organic fibers include poly(p-phenylenebenzoxazole) fibers. Among these, from the viewpoint of improving thermal conductivity, metal oxides, nitrides, metal hydroxides, and carbon materials are preferred as thermally conductive fillers, and among these, metal oxides or metal hydroxides are more preferred. Specifically, aluminum oxide, aluminum hydroxide, and boron nitride are preferred as thermally conductive fillers, aluminum oxide and aluminum hydroxide are more preferred, and it is even more preferable that at least one selected from the group consisting of aluminum oxide and aluminum hydroxide is included. The thermally conductive filler may be used alone or two or more may be used in combination. The thermally conductive filler may also be surface-treated with a surface treatment agent such as a silane coupling agent.

[0058] The average particle size of the thermal conductive filler is not particularly limited, but is preferably 0.1 μm to 200 μm, more preferably 0.3 μm to 100 μm, and even more preferably 0.5 μm to 70 μm. The average particle size of the thermal conductive filler is D50, which can be calculated by observing the thermal conductive filler under a microscope and taking the major axis as the diameter. For example, by measuring the major axis of 500 or more arbitrary particles using an electron microscope or optical microscope, it means the particle size corresponding to the cumulative frequency of 50%. Specifically, it can be determined from a particle size distribution curve with particle size on the horizontal axis and cumulative frequency on the vertical axis, using the thermal conductive filler as a sample. This particle size distribution curve is a number-based particle size distribution curve obtained by sequentially accumulating from the smallest particle size of the thermal conductive filler.

[0059] The content of the thermal conductive filler in the thermal conductive resin member is not particularly limited, but for example, it is 30% by volume or more and 90% by volume or less, preferably 40% by volume or more and 80% by volume or less, and more preferably 50% by volume or more and 70% by volume or less. A content of 30% by volume or more makes it easier to improve the thermal conductivity of the heat dissipation molded body. Furthermore, setting the content to 90% by volume or less makes it easier to incorporate components other than the thermal conductive filler, such as a polymer matrix, in an appropriate amount into the heat dissipation molded body.

[0060] A thermally conductive resin composition (i.e., a thermally conductive resin component) may contain a curing catalyst. In the case of silicone rubber, for example, the curing catalyst may be any catalyst that promotes the addition reaction between an alkenyl group-containing organopolysiloxane and a hydrosilyl group-containing polysiloxane. Examples of curing catalysts include platinum group curing catalysts. In addition to the curing catalyst, a thermally conductive resin composition (i.e., a thermally conductive resin component) may contain various additives. Examples of such additives include silane coupling agents, reaction control agents, dispersants, flame retardants, plasticizers, antioxidants, colorants, surface treatment agents, and thixotropic agents.

[0061] The thermally conductive resin composition in the present invention may be a one-component type or a two-component type comprising a first agent and a second agent. In the two-component type, the first agent and the second agent are mixed at the time of use to obtain the thermally conductive resin composition. In the case of the two-component type, it is preferable to appropriately distribute each component of the thermally conductive resin composition between the first agent and the second agent. For example, in the case of silicone rubber, in a two-component thermally conductive resin composition, the first agent may contain an alkenyl group-containing organopolysiloxane and a curing catalyst, while not containing a hydrosilyl group-containing organopolysiloxane. In this case, the second agent may contain a hydrosilyl group-containing organopolysiloxane but not a curing catalyst. Furthermore, the second agent may further contain an alkenyl group-containing organopolysiloxane. It is also preferable that at least one of the first agent and the second agent contains a thermally conductive filler, but it is preferable that both the first agent and the second agent contain a thermally conductive filler. Furthermore, other organopolysiloxanes, other resin components, and additives should be appropriately allocated to the first and second components.

[0062] [Method for Manufacturing a Heat Dissipating Molded Body] A heat dissipating molded body may be manufactured by molding a thermally conductive resin composition using a mold. The mold may have a cavity that matches the shape of the heat dissipating molded body. The mold is usually a metal mold. The method for molding the heat dissipating molded body is not particularly limited, but examples include compression molding, injection molding, and transfer molding, and among these, compression molding is preferred. The heat dissipating molded body may be molded by curing the thermally conductive resin composition. The curing conditions are not particularly limited, but for example, it may be done by heating to about 80°C to 200°C, and the heat dissipating molded body may also be further heated after molding to undergo secondary curing. The heating temperature for secondary curing may be, for example, about 150°C to 200°C.

[0063] The following describes in more detail the method for manufacturing a heat-dissipating molded body, using an example of manufacturing a heat-dissipating molded body by compression molding as a reference. When manufacturing a heat-dissipating molded body by compression molding, the manufacturing method includes, for example, the following steps (1) to (3): Step (1): A step of pouring a heat-conductive resin composition into a compression mold. Step (2): A step of heat-curing the heat-conductive resin composition. Step (3): A step of demolding the cured product of the heat-conductive resin composition from the mold.

[0064] Step (1) is the step of pouring a thermally conductive resin composition into a compression mold. In this step, it is preferable to use a compression mold in which the cavity has a shape corresponding to the heat-dissipating molded body, and pour the thermally conductive resin composition into the mold.

[0065] In step (1), if the tackiness is to be reduced by the skin layer described above, it is preferable to apply the reactive resin to at least a part of the inner surface of the compression mold before casting the thermal conductive resin composition. The method of applying the reactive resin is not particularly limited; for example, it may be applied by spraying or by using a brush, but spraying is preferred. In this case, the reactive resin does not have to be applied directly to the inner surface of the mold for the heat-dissipating molded body, and if a release film is installed inside the mold, the reactive resin may be applied to the surface of the release film. Here, the reactive resin only needs to be applied to the inner surface of the mold that forms the part of the heat-dissipating molded body where the tack value is low, for example, it is preferable to apply it to the inner surface of the mold that forms at least the outer surface of the top surface.

[0066] The reactive resin is not particularly limited as long as it is a resin that can react with the curable component constituting the polymer matrix and form a skin layer by reacting with the curable component. For example, components constituting the curing agent can be cited. For example, when the polymer matrix is ​​silicone rubber and an alkenyl group-containing organopolysiloxane and a hydrosilyl group-containing organopolysiloxane are used, the reactive resin is preferably a hydrosilyl group-containing organopolysiloxane. By using a curing agent such as a hydrosilyl group-containing organopolysiloxane, a highly cured skin layer is formed on the surface of the heat-dissipating molded article formed by the surface of the mold mold to which the reactive resin is applied, resulting in a surface with a lower tack value compared to other surfaces. The amount of reactive resin applied is not particularly limited, but is 0.37 mg / cm². ２ 20mg / cm or more ２ The following is preferred, and more preferably, 0.6 mg / cm³. ２ 10mg / cm or more ２ The following applies:

[0067] It should be noted that the application of the reactive resin does not necessarily have to be done in step (1). For example, the reactive resin may be applied to the heat-dissipating molded body that has been cured (primary cured) in step (2) before the secondary curing described later. Alternatively, the reactive resin may be applied directly to the heat-dissipating molded body after secondary curing. In this case, the heat-dissipating molded body may be heated as appropriate after application. In this case, the reactive resin may be applied by spray application, by applying it with a brush, or by immersing the heat-dissipating molded body in the reactive resin.

[0068] Step (2) is a step of heat curing the heat-conductive resin composition that has been cast into a compression mold. The curing conditions in this step are not particularly limited, but for example, it is preferable to heat it at a temperature of 80°C to 200°C. The heating time at the above temperature is not particularly limited, but for example, it is about 30 seconds to 30 minutes.

[0069] Step (3) is the step of demolding the cured product of the thermal conductive resin composition from the mold. The method of demolding is not particularly limited, and for example, demolding may be performed using a known demolding jig. The heat-dissipating molded body obtained after demolding may be further second-cured. Secondary curing may be performed by heating the heat-dissipating molded body. The heating conditions during secondary curing are not particularly limited, but for example, secondary curing may be performed at 100 to 200°C for about 30 minutes to 24 hours.

[0070] The present invention will be described in more detail below with reference to examples, but the present invention is not limited in any way by these examples.

[0071] In this example and comparative example, the evaluation was performed by the following methods: [Hardness (E hardness)] The Type E durometer hardness of the thermally conductive resin component constituting the heat dissipation molded body was measured according to JIS K 6253. The measurement sample was made using a mold with a length of 70 mm x width of 40 mm and a thickness of 10 mm. [Tack value and thermal conductivity] These were measured according to the method described in the specification.

[0072] [Dielectric Breakdown Strength] A sheet-like measurement sample of 1 mm thickness and 50 mm x 50 mm was prepared from a thermally conductive resin composition for forming a heat-dissipating molded body under the same curing conditions as the examples and comparative examples. The dielectric breakdown strength of the thermally conductive resin component constituting the heat-dissipating molded body was determined using the measurement sample and the following measurement method. The dielectric breakdown strength and the voltage at flashover, as described later, were measured using the "AC / DC Withstand Voltage Tester TOS5101" manufactured by Kikusui Electronics Co., Ltd. The measurement sample was placed on an electrode jig so that the center of the electrode jig and the measurement sample coincided, and another electrode jig was placed closely on top of it. The voltage was applied to the sample at a boosting rate of 0.5 kV / s with a maximum voltage of 10.0 kV, and the voltage at which flashover occurred was recorded. If flashover did not occur even when the voltage reached 10.0 kV, the dielectric breakdown strength was considered to be ≥ 10.0 kV / mm. For the electrode fixtures, cylindrical stainless steel fixtures with a diameter of 25 mm and a height of 25 mm were used, and the measurement sample was sandwiched between the bottom surfaces of a pair of cylindrical electrode fixtures.

[0073] [Voltage during flashover] In each embodiment, the heat dissipation molded body 25 was placed so as to enclose the electrode jig, as shown in Figures 8 to 10, and another electrode jig was placed in close contact with the outer surface of the top surface 11 of the heat dissipation molded body 25. However, in the case of the comparative example, the heat dissipation sheet 100 was placed so that the center of the heat dissipation sheet 100 coincided with the electrode jig, and another electrode jig was placed in close contact with the sheet. As for the electrode jig, as shown in Figures 8 and 9, either a first electrode jig 61 with a diameter of 25 mm and a height of 25 mm, or a second electrode jig 62 having a shape in which a cylinder with a diameter of 25 mm and a height of 10 mm and a frustoconical base with a height of 15 mm connected to the upper end of the cylinder are integrated, and the diameter of the upper surface is 17 mm was used. The first and second electrode jigs 61 and 62 were made of stainless steel. In each embodiment, the top surface 11 of the heat dissipation molded body 25 was sandwiched between the electrode jigs, and in each comparative example, the heat dissipation sheet 100 was sandwiched between the electrode jigs. A voltage of 10.0 kV was set as the upper limit between the electrode jigs, and the voltage was applied to the sample at a boosting rate of 0.5 kV / s, and the voltage at which flashover occurred was recorded. If flashover did not occur even when the voltage reached 10.0 kV, it was defined as ≥ 10.0 kV.

[0074] [Example 1] A thermally conductive resin composition was obtained by mixing 115 parts by mass of organopolysiloxane (a mixture of vinyl group-containing organopolysiloxane and hydrosilyl group-containing organopolysiloxane: ratio of hydrosilyl groups to alkenyl groups 0.62), a catalytic amount of platinum-based catalyst, 550 parts by mass of aluminum oxide with an average particle size of 45 μm, 55 parts by mass of aluminum oxide with an average particle size of 2.4 μm, and 220 parts by mass of aluminum oxide with an average particle size of 4.7 μm. The thermally conductive filler content in the thermally conductive resin composition (thermally conductive resin member) was 65 volume%. A compression molding die having a cavity corresponding to the heat-dissipating molded body 25 having the shape shown in Figure 8(A) was prepared, the thermally conductive resin composition was poured into the die, and the thermally conductive resin composition was cured by heating the die at a temperature of 110°C for 6 minutes, and then demolded to obtain the heat-dissipating molded body 25. As shown in Figure 8(A), the obtained heat-dissipating molded body 25 had a top surface portion 11 and a wall surface portion 12, with the wall surface portion 12 having a circular cross-section and the top surface portion 11 also being circular. The detailed dimensions of the heat-dissipating molded body 25 are shown in Table 1. The tack values ​​of the outer surface 11A and inner surface 11B of the top surface portion 11 of the heat-dissipating molded body 25 were 66.77 mN / mm ２ The thermal conductivity of the heat-conductive resin member constituting the heat-dissipating molded body 25 was 2.2 W / (m·K). In each embodiment, the size of the outer surface 11A of the top surface portion 11 is the diameter and corresponds to the contact length L3.

[0075] [Examples 2-7] The same procedure as in Example 1 was followed, except that the shape and dimensions of the heat dissipation molded body were changed as shown in Figures 8, 9, 10 and Table 1. In Example 5, a heat dissipation molded body 45 having a flange portion 26 was manufactured as the heat dissipation molded body.

[0076] [Comparative Examples 1 and 2] As shown in Figure 10, the same procedure as in Example 1 was followed, except that a circular heat dissipation sheet 100 with a diameter of 17 mm or 25 mm and a thickness of 2.25 mm was prepared instead of the heat dissipation molded body.

[0077]

[0078] As shown in Table 1 above, the heat dissipation molded bodies in each embodiment had a cap shape with a top surface and a wall surface. Compared to Comparative Examples 1 and 2, which were heat dissipation sheets, the creepage distance between the two members could be extended, resulting in a higher voltage during flashover and improved dielectric breakdown performance. Furthermore, since the two members of the heat dissipation molded body can be connected via the top surface, the heat conductivity is also good.

[0079] 10, 25, 30, 40, 45 Heat dissipation molded body 11 Top surface 11A Outer surface 11B Inner surface 12 Wall surface 14 Recess 20, 50, 55 Electronic component device 21 Heat-generating conductive member 21A Busbar 22 Housing 26 Flange 61, 62 Electrode jig 100 Heat dissipation sheet D1 Thickness of top surface D2 Thickness of wall surface D3 Thickness of flange L1 Length of wall surface L2 Creepage distance L3 Contact length L4 Length of flange

Claims

A heat-dissipating molded body made of a heat-conductive resin member, It has a cap shape that includes the top surface and the wall surface, A heat-dissipating molded body, wherein at least a portion of the heat-dissipating molded body is in contact with a heat-generating conductive member of an electronic component device, and is used to dissipate heat generated from the heat-generating conductive member. 　 The heat dissipation molded body according to claim 1, wherein the thickness of at least one of the top surface and the wall surface is 0.5 mm or more. 　 The heat-dissipating molded body according to claim 1 or 2, wherein the length of the wall portion is 2 mm or more. 　 The heat dissipation molded body according to claim 1 or 2, wherein the end of the wall portion has a flange portion that protrudes outward from the outer peripheral surface of the wall portion. 　 The heat-dissipating molded body according to claim 1 or 2, wherein the type E durometer hardness of the thermally conductive resin member is 10 or more and 80 or less. 　 The heat-dissipating molded body according to claim 1 or 2, wherein the dielectric breakdown strength of the thermally conductive resin member is 1 kV / mm or more. 　 The heat-dissipating molded article according to claim 1 or 2, wherein the heat-conductive resin member comprises a polymer matrix and a heat-conductive filler. 　 The heat-dissipating molded body according to claim 1 or 2, wherein the heat-conductive resin member is a cured product of a heat-conductive resin composition. 　 It comprises a heat-generating conductive member, a housing, and a heat-dissipating molded body made of a heat-conductive resin member, The heat dissipation molded body has a cap shape including a top surface and a wall surface, An electronic component device in which either the inner or outer surface of the top surface of the heat dissipation molded body is in contact with the housing, and the other surface is in contact with the heat-generating conductive member. 　 The electronic component device according to claim 9, wherein either the inner surface or the outer surface of the top surface is adhered to the housing. 　 The electronic component device according to claim 9 or 10, wherein the housing is arranged to enclose the top surface and the inner circumferential surface of the wall surface. 　 The electronic component device according to claim 9 or 10, wherein the heat dissipation molded body extends the creepage distance between the heat-generating conductive member and the housing by the wall portion. 　 The electronic component device according to claim 9 or 10, wherein the ratio of the creepage distance between the heat-generating conductive member and the housing to the length of the longest portion of the heat-dissipating molded body that contacts the heat-generating conductive member is 0.3 or more.

Images