Cooling device and server

Abstract

A cooling device and a server. The cooling device comprises a housing, and a heat exchanger, heat dissipation fans, and a cold plate which are arranged in the housing. A first pipe is connected between a liquid outlet of the heat exchanger and the cold plate, and a second pipe is connected between a liquid return port of the heat exchanger and the cold plate, so that a closed circulation of a cooling medium is formed between the heat exchanger and the cold plate. The housing is provided with an air inlet, the air inlet being used for introducing airflow into the heat exchanger. The housing is provided with an air outlet. The heat dissipation fans are arranged on the side of the housing close to the air outlet, so as to discharge the airflow passing through the heat exchanger. Air cooling and liquid cooling are combined to form an integrated air-liquid cooling device. Under the combined action of the heat exchanger and the heat dissipation fans, a device to be cooled connected to the cold plate is cooled, so that the cooling device has high heat exchange performance, thereby facilitating the reduction of energy consumption. The closed circulation of the cooling medium is formed between the cold plate and the heat exchanger, thereby facilitating water saving and power saving, thus further reducing energy consumption, and achieving a high energy efficiency ratio of the cooling device.

Description

A cooling device and server

[0001] This application claims priority to Chinese Patent Application No. 202411998905.2, filed with the Chinese Patent Office on December 31, 2024, entitled "A Cooling Device and Server", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of cooling equipment technology, and more specifically, to a cooling device. Furthermore, this invention also relates to a server including the aforementioned cooling device. Background Technology

[0003] In the field of information technology, with the development of big data and supercomputing technologies, the requirements for heat dissipation are becoming increasingly stringent. Among related technologies, air cooling is employed, utilizing fans as the primary heat dissipation device.

[0004] However, in the process of developing this application, the inventors discovered that the prior art has at least the following problems:

[0005] As the computing power field develops rapidly, the demand for heat dissipation is increasing, which in turn requires higher performance from fans, resulting in a significant increase in energy consumption.

[0006] Therefore, how to improve the heat exchange performance of cooling devices and reduce energy consumption is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0007] In view of this, the purpose of the present invention is to provide a cooling device with high heat exchange performance and low energy consumption.

[0008] Another object of the present invention is to provide a server including the above-mentioned cooling device, wherein the cooling device has high heat exchange performance and low energy consumption.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] A cooling device includes a housing and a heat exchanger, a cooling fan, and a cold plate disposed on the housing;

[0011] A first pipeline connects the outlet of the heat exchanger to the cold plate, and a second pipeline connects the return outlet of the heat exchanger to the cold plate, so that the cooling medium forms a closed loop between the heat exchanger and the cold plate.

[0012] The housing is provided with an air inlet, which is used to introduce airflow into the heat exchanger;

[0013] The housing is provided with an air outlet, and the cooling fan is located on the side of the housing near the air outlet to discharge the airflow passing through the heat exchanger.

[0014] Optionally, the heat exchanger is arranged in a V-shape, and the V-shaped sharp corners of the heat exchanger are sealed together.

[0015] Optionally, the heat exchanger is provided with a cover plate at its top, and the cover plate has a V-shaped opening corresponding to the position of the heat exchanger.

[0016] Optionally, a power supply is provided above the heat exchanger, and the cold plate includes a first cold plate and a second cold plate. The first cold plate is integrated into the power supply, and the second cold plate is located on the side of the heat exchanger. The second cold plate is used to connect the heating element.

[0017] Optionally, the first pipeline is connected to a distributor, which is connected to the first cold plate and the second cold plate respectively, so that the cooling medium is split and enters the first cold plate and the second cold plate respectively;

[0018] The second pipeline is connected to a liquid collector, which is connected to the first cold plate and the second cold plate respectively, so that the cooling medium flowing out from the first cold plate and the second cold plate converges and enters the second pipeline.

[0019] Optionally, a control panel is provided inside the housing, the control panel and the second cold plate are located on the same side of the heat exchanger, the liquid distributor is located on the upper part of the control panel, and the liquid collector is located on the side of the control panel facing the heat exchanger.

[0020] Optionally, the cooling fan is plugged into the housing.

[0021] Optionally, the second pipeline is connected to an expansion and pressure stabilizing device 10, so that when the pressure in the second pipeline exceeds a preset pressure value, a portion of the cooling medium in the second pipeline enters the expansion and pressure stabilizing device 10, and when the pressure in the second pipeline is lower than the preset pressure value, the cooling medium in the expansion and pressure stabilizing device 10 enters the second pipeline.

[0022] Optionally, the housing is provided with a self-sealing vent connector and a self-sealing drain connector.

[0023] A server comprising any of the cooling devices described above.

[0024] The cooling device provided by the present invention has the following beneficial effects:

[0025] During operation, airflow enters the heat exchanger through the air inlet and exchanges heat with the cooling medium passing through the heat exchanger, causing the temperature of the cooling medium to decrease. This results in the cooling medium discharged from the heat exchanger's outlet being a low-temperature cooling medium. After being discharged from the heat exchanger's outlet, the low-temperature cooling medium enters the cold plate through the first pipe. The cold plate is connected to the device to be cooled. Through heat transfer via the cold plate, the low-temperature cooling medium carries away the heat from the cold plate as it passes through, thereby achieving cooling and heat dissipation for the device to be cooled. The cooling medium that has passed through the cold plate then flows back into the heat exchanger through the second pipe, thus forming a closed-loop circulation of the cooling medium. At the same time, the airflow passing through the heat exchanger is discharged from the air outlet and is discharged outside the casing by the action of the cooling fan.

[0026] Therefore, this cooling device combines air cooling and liquid cooling to form an integrated air-liquid cooling system. Before the cooling fan removes the heat from the casing, the cooling medium and airflow are first exchanged through a heat exchanger. The cooling medium then cools the device connected to the cold plate. Simultaneously, the cooling fan exhausts the heat-exchanged airflow. In other words, the cooling device, through the combined action of the heat exchanger and the cooling fan, achieves cooling of the device connected to the cold plate, resulting in high heat exchange performance and thus reducing energy consumption. Furthermore, the cooling medium forms a closed loop between the cold plate and the heat exchanger, which helps save water and electricity, further reducing energy consumption and resulting in a high energy efficiency ratio for the cooling device.

[0027] The server provided by the present invention includes the above-described cooling device and has at least the beneficial effects of the above-described cooling device. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 is a schematic diagram of the cooling device provided in a specific embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the cooling device provided in a specific embodiment of the present invention;

[0031] Figure 3 is a structural schematic diagram from another perspective of Figure 2;

[0032] Figure 4 is a schematic diagram of the heat exchanger structure;

[0033] Figure 5 is a schematic diagram of the structure when the heat exchanger is installed inside the shell.

[0034] Reference numerals: 1-Shell; 2-Heat exchanger; 3-Heat dissipation fan; 4-Cold plate; 41-First cold plate; 42-Second cold plate; 51-First pipeline; 52-Second pipeline; 6-Power supply; 7-Distributor; 8-Collector; 9-Control board; 10-Expansion and pressure stabilizing device; 101-Expansion and pressure stabilizing device mounting position; 11-Exhaust connector; 12-Drain connector; 13-Water pump; 14-Air inlet; 15-Cover plate; 151-V-shaped port; 152-Reinforcing beam; 16-First baffle; 17-Second baffle; 18-Filter screen; 19-Air guide hood. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] The core of this invention is to provide a cooling device with high heat exchange performance and low energy consumption. Another core aspect of this invention is to provide a server including the above-mentioned cooling device, wherein the cooling device has high heat exchange performance and low energy consumption.

[0037] Please refer to Figures 1, 2, and 3. An embodiment of the present invention provides a cooling device, including a housing 1 and a heat exchanger 2, a cooling fan 3, and a cold plate 4 disposed on the housing 1. A first pipe 51 is connected between the liquid outlet of the heat exchanger 2 and the cold plate 4, and a second pipe 52 is connected between the liquid return port of the heat exchanger 2 and the cold plate 4, so that the cooling medium forms a closed loop between the heat exchanger 2 and the cold plate 4. The housing 1 is provided with an air inlet 14 for introducing airflow into the heat exchanger 2. The housing 1 is provided with an air outlet, and the cooling fan 3 is disposed on the side of the housing 1 near the air outlet to discharge the airflow passing through the heat exchanger 2.

[0038] It should be noted that the airflow in this embodiment of the invention can be air at a naturally low temperature, or other airflows with a preset temperature, as long as the temperature of the airflow is lower than the temperature of the cooling medium flowing back to the heat exchanger 2 from the second pipe 52. Furthermore, the cooling medium in this embodiment of the invention can be water or an ethylene glycol solution, etc.

[0039] During operation, airflow enters heat exchanger 2 through air inlet 14 and exchanges heat with the cooling medium passing through heat exchanger 2, thereby lowering the temperature of the cooling medium passing through heat exchanger 2. This results in the cooling medium discharged from the outlet of heat exchanger 2 being a low-temperature cooling medium. After being discharged from the outlet of heat exchanger 2, the low-temperature cooling medium enters cold plate 4 through the first pipe 51. Cold plate 4 is connected to the device to be cooled. Through heat transfer via cold plate 4, the low-temperature cooling medium carries away the heat from cold plate 4 as it passes through it, thus achieving cooling and heat dissipation of the device to be cooled. The cooling medium passing through cold plate 4 then flows back to heat exchanger 2 through the second pipe 52, thus forming a closed-loop circulation of the cooling medium. At the same time, the airflow passing through heat exchanger 2 is discharged from the air outlet and discharged outside the casing 1 under the action of the cooling fan 3.

[0040] Therefore, this embodiment of the invention combines air cooling and liquid cooling to form an integrated air-liquid cooling device. Before the heat is carried away from the shell 1 by the cooling fan 3, the cooling medium and airflow are first exchanged through the heat exchanger 2 to cool the device to be cooled connected to the cold plate 4. At the same time, the cooling fan 3 discharges the heat-exchanged airflow. That is, the cooling device achieves cooling of the device to be cooled connected to the cold plate 4 under the joint action of the heat exchanger 2 and the cooling fan 3, so that the cooling device has high heat exchange performance, which helps to reduce energy consumption. Moreover, the cooling medium forms a closed loop between the cold plate 4 and the heat exchanger 2, which helps to save water and electricity, thereby further reducing energy consumption and making the cooling device have a high energy efficiency ratio.

[0041] Furthermore, as shown in Figure 4, in order to improve the heat exchange effect, in some embodiments, the heat exchanger 2 is arranged in a V-shape, and the V-shaped sharp corner of the heat exchanger 2 is sealed and connected.

[0042] Understandably, the V-shaped arrangement of heat exchanger 2 provides a large heat exchange area. Furthermore, the V-shaped structure of heat exchanger 2 has a certain airflow space between the two V-shaped sides, allowing the airflow to exchange heat independently at each of the two V-shaped sides. This avoids heat radiation between the two V-shaped sides, which could affect the heat exchange efficiency, and ensures a relatively uniform airflow. Additionally, the sealed connection at the V-shaped sharp corners of heat exchanger 2 prevents cross-flow and avoids affecting the overall heat exchange efficiency.

[0043] Furthermore, as shown in Figure 5, in some embodiments, the top of the heat exchanger 2 is provided with a cover plate 15, and the cover plate 15 is provided with a V-shaped opening 151 corresponding to the position of the heat exchanger 2.

[0044] Understandably, the V-shaped opening 151 allows natural air to pass through, which helps reduce wind resistance and further improves the overall heat exchange efficiency of the heat exchanger 2.

[0045] In addition, considering the specific arrangement of the heat exchanger 2 within the housing 1, in some embodiments, the housing 1 is provided with an installation cavity, and the heat exchanger 2 is disposed within the installation cavity.

[0046] Furthermore, as shown in Figure 5, in some embodiments, the housing 1 is provided with a first baffle 16 and a second baffle 17 disposed opposite to each other. The first baffle 16 and the second baffle 17 respectively serve as the cavity walls of the mounting cavity. The first baffle 16 is provided with an air inlet 14, and the second baffle 17 is provided with an air outlet. Airflow enters the mounting cavity from the air inlet 14, undergoes heat exchange in the heat exchanger 2, and then flows out from the air outlet.

[0047] It should be noted that this embodiment does not limit the specific number of air inlets 14 and air outlets. For example, there may be one air inlet 14 and two air outlets, with the two air outlets located near or corresponding to the two ends of the openings of the two V-shaped sides of the heat exchanger 2 V-shaped structure.

[0048] Furthermore, as shown in Figure 5, in some embodiments, the air inlet 14 is equipped with a filter screen 18. That is to say, in this embodiment, the filter screen 18 can effectively reduce the entry of larger foreign objects into the heat exchanger 2 through the air inlet 14, thereby improving the reliability of the heat exchanger 2.

[0049] In addition, it is understood that, in order to facilitate the smooth circulation of the cooling medium, in some embodiments, the first pipeline 51 is connected to the water pump 13 so that the cooling medium from the heat exchanger 2 can be sent into the cold plate 4 by the water pump 13 as power.

[0050] In addition, in some embodiments, a power supply 6 is provided above the heat exchanger 2, and the cold plate 4 includes a first cold plate 41 and a second cold plate 42. The first cold plate 41 is integrated into the power supply 6, and the second cold plate 42 is provided on the side of the heat exchanger 2. The second cold plate 42 is used to connect the heating element.

[0051] Understandably, the power supply 6 is positioned above the heat exchanger 2, allowing the heat exchanger 2 to provide support for the power supply 6. For example, when the top of the heat exchanger 2 has a cover plate 15, the power supply 6 can be directly mounted on the cover plate 15, which also serves as a mounting bracket for the power supply 6. This reduces the need for mounting structures and minimizes the space occupied by the cooling device. Furthermore, the first cold plate 41 is integrated within the power supply 6, which helps prevent overheating, ensures the reliability of the power supply 6, and saves space.

[0052] Furthermore, to enhance structural strength, in some embodiments, when the cover plate 15 has a V-shaped opening 151 corresponding to the position of the heat exchanger 2, a reinforcing beam 152 is provided at the V-shaped opening 151. That is, this embodiment utilizes the reinforcing beam 152 to improve the structural strength at the V-shaped opening 151, so that the cover plate 15 can provide sufficient support for the power supply 6 and ensure the reliability of the structure. In addition, this embodiment does not limit the specific number and distribution of the reinforcing beams 152, as long as the reinforcing beams 152 have little impact on the air intake of the V-shaped opening 151.

[0053] In some embodiments, the second cold plate 42 is connected to a cold plate 4 reinforcement plate, and an air guide shroud 19 is provided at the connection between the cold plate 4 reinforcement plate and the cooling fan 3. The air guide shroud 19 communicates with the mounting cavity of the heat exchanger 2. That is to say, in this embodiment, by setting the air guide shroud 19, the cooling fan 3 is connected to the mounting cavity of the heat exchanger 2, thus avoiding cross-flow between the cooling fan 3 and the second cold plate 42, which would affect the heat dissipation performance.

[0054] In some embodiments, the first pipe 51 is connected to a distributor 7, which is connected to the first cold plate 41 and the second cold plate 42 respectively, so that the cooling medium is split and enters the first cold plate 41 and the second cold plate 42 respectively; the second pipe 52 is connected to a collector 8, which is connected to the first cold plate 41 and the second cold plate 42 respectively, so that the cooling medium flowing out from the first cold plate 41 and the second cold plate 42 merges and enters the second pipe 52.

[0055] In other words, during operation, the low-temperature cooling medium flowing from the outlet of heat exchanger 2 passes through the first pipe 51 and enters the distributor 7. The distributor 7 then divides the medium into the first cold plate 41 and the second cold plate 42. The cooling medium passing through the first cold plate 41 and the second cold plate 42 then converge into the collector 8, and finally enters the second pipe 52, ultimately reaching the heat exchanger 2 for heat exchange. It is understandable that the distributor 7 facilitates the rational distribution of the cooling medium, directing it to the first cold plate 41 and the second cold plate 42, while the collector 8 facilitates the convergence of the cooling medium passing through the first cold plate 41 and the second cold plate 42 before it flows into the second pipe 52. This reduces the overall system resistance and improves the efficiency of the water pump 13.

[0056] Furthermore, in some embodiments, a control plate 9 is provided inside the housing 1, the control plate 9 and the second cold plate 42 are located on the same side of the heat exchanger 2, the liquid distributor 7 is located on the upper part of the control plate 9, and the liquid collector 8 is located on the side of the control plate 9 facing the heat exchanger 2.

[0057] In other words, this embodiment makes full use of the space between the control board 9 and the heat exchanger 2, making the structure compact and avoiding the need to develop space in other locations for installing the distributor 7 and the collector 8. At the same time, the controller helps to provide some structural support for the distributor 7, and the collector 8 also helps to provide some structural support for the control board 9.

[0058] Furthermore, to further save space, in some embodiments, the water pump 13 is located between the control panel 9 and the heat exchanger 2. Further, in some embodiments, the expansion pressure stabilizing device 10, described below, is located between the second cold plate 42 and the heat exchanger 2. Additionally, in some embodiments, the water pump 13 and the expansion pressure stabilizing device 10 are arranged side-by-side along the length of the housing 1, as shown in FIG2, which illustrates the expansion pressure stabilizing device mounting position 101 for mounting the expansion pressure stabilizing device 10, such as an expansion pressure stabilizing tank; the control panel 9 and the second cold plate 42 are arranged side-by-side along the length of the housing 1. Further, in some embodiments, the air inlet 14 is located on the side wall of the housing 1 along its width.

[0059] Furthermore, considering the installation of the cooling fan 3, and to facilitate later maintenance of the cooling device, in some embodiments, the cooling fan 3 is plugged into the housing 1. That is, this embodiment uses a plug-in method to connect the cooling fan 3 to the housing 1, making the connection between the cooling fan 3 and the housing 1 a point-to-point fixation. This installation method facilitates the fixing or disassembly of the cooling fan 3 by direct plugging and unplugging, making it easier to individually control the installation of the cooling fan 3 and facilitating later maintenance of the cooling device.

[0060] In addition, this embodiment does not limit the specific number of cooling fans 3. In some embodiments, the number of cooling fans 3 is two, and the two cooling fans 3 are symmetrically distributed so as to make reasonable use of the airflow curve of the cooling fans 3, increase the air volume while reducing the energy consumption of the cooling fans 3.

[0061] In addition, in some embodiments, the second pipeline 52 is connected to an expansion and pressure stabilizing device 10, so that when the pressure in the second pipeline 52 exceeds a preset pressure value, a portion of the cooling medium in the second pipeline 52 enters the expansion and pressure stabilizing device 10, and when the pressure in the second pipeline 52 is lower than the preset pressure value, the cooling medium in the expansion and pressure stabilizing device 10 enters the second pipeline 52.

[0062] It is understandable that the temperature of the cooling medium increases after passing through the cold plate 4. At higher temperatures, the cooling medium expands, causing the pressure in the cooling medium circulation system to rise. This embodiment uses an expansion and pressure stabilizing device 10 to stabilize the pressure in the cooling medium circulation system. When the pressure in the second pipe 52 exceeds a preset pressure value, the expansion and pressure stabilizing device 10 returns the cooling medium. Conversely, when the pressure in the second pipe 52 falls below the preset pressure value, the expansion and pressure stabilizing device 10 sends the cooling medium back into the second pipe 52. Therefore, the expansion and pressure stabilizing device 10 ensures the pressure in the cooling medium circulation system, thus extending the service life of the cooling device.

[0063] In some embodiments, the housing 1 is provided with a self-sealing vent connector 11 and a self-sealing drain connector 12. It should be noted that during operation, both the vent connector 11 and the drain connector 12 are in a self-sealing state. When pressure maintenance is required, the pressure-maintaining device can be directly connected to the vent connector 11 and the drain connector 12 without the need for an external sealing device. Furthermore, when the cooling device is connected to a liquid replenishment device, the liquid replenishment device can be directly connected to the drain connector 12, and the vent connector can be directly connected to the vent connector 11, thus enabling simultaneous liquid replenishment and venting during replenishment. Therefore, the self-sealing vent connector 11 and the self-sealing drain connector 12 help ensure stable pressure operation of the cooling device and avoid leakage risks, preventing air intake or liquid leakage from the cooling device.

[0064] Furthermore, in some embodiments, the vent connector 11 is located at the top of one side of the housing 1, and the drain connector 12 is located at the bottom of one side of the housing 1. Additionally, to facilitate connection with external devices, in some embodiments, the vent connector 11 and the drain connector 12 are located on the same side of the housing 1.

[0065] In addition to the cooling device described above, the present invention also provides a server including the cooling device disclosed in the above embodiments. For the structure of other parts of the server, please refer to the relevant technology, which will not be repeated here.

[0066] The key point of this embodiment is that the server uses the cooling device disclosed in any of the above embodiments, therefore, the server at least includes the beneficial effects of the above cooling device.

[0067] It should also be noted that, in this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0068] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0069] The cooling device and server provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A cooling device, characterized in that, It includes a housing (1) and a heat exchanger (2), a cooling fan (3) and a cold plate (4) disposed in the housing (1); A first pipe (51) is connected between the liquid outlet of the heat exchanger (2) and the cold plate (4), and a second pipe (52) is connected between the liquid return port of the heat exchanger (2) and the cold plate (4) so ​​that the cooling medium forms a closed loop between the heat exchanger (2) and the cold plate (4). The housing (1) is provided with an air inlet (14), which is used to introduce airflow into the heat exchanger (2); The housing (1) is provided with an air outlet, and the heat dissipation fan (3) is located on the side of the housing (1) near the air outlet to discharge the airflow passing through the heat exchanger (2).

2. The cooling device according to claim 1, characterized in that, The heat exchanger (2) is arranged in a V-shape, and the V-shaped sharp corners of the heat exchanger (2) are sealed together.

3. The cooling device according to claim 2, characterized in that, The heat exchanger (2) is provided with a cover plate (15) at the top, and the cover plate (15) is provided with a V-shaped opening (151) corresponding to the position of the heat exchanger (2).

4. The cooling device according to any one of claims 1-3, characterized in that, A power supply (6) is provided above the heat exchanger (2). The cold plate (4) includes a first cold plate (41) and a second cold plate (42). The first cold plate (41) is integrated into the power supply (6). The second cold plate (42) is located on the side of the heat exchanger (2). The second cold plate (42) is used to connect the heating element.

5. The cooling device according to claim 4, characterized in that, The first pipeline (51) is connected to a distributor (7), which is connected to the first cold plate (41) and the second cold plate (42) respectively, so that the cooling medium is split and enters the first cold plate (41) and the second cold plate (42) respectively; The second pipeline (52) is connected to a liquid collector (8), which is connected to the first cold plate (41) and the second cold plate (42) respectively, so that the cooling medium flowing out from the first cold plate (41) and the second cold plate (42) converges and enters the second pipeline (52).

6. The cooling device according to claim 5, characterized in that, The housing (1) is provided with a control board (9), the control board (9) and the second cold plate (42) are located on the same side of the heat exchanger (2), the liquid distributor (7) is located on the upper part of the control board (9), and the liquid collector (8) is located on the side of the control board (9) facing the heat exchanger (2).

7. The cooling device according to any one of claims 1-3, characterized in that, The cooling fan (3) is plugged into the housing (1).

8. The cooling device according to any one of claims 1-3, characterized in that, The second pipeline (52) is connected to an expansion pressure stabilizing device 10 (10) so that when the pressure in the second pipeline (52) exceeds a preset pressure value, a portion of the cooling medium in the second pipeline (52) enters the expansion pressure stabilizing device 10 (10), and when the pressure in the second pipeline (52) is lower than the preset pressure value, the cooling medium in the expansion pressure stabilizing device 10 (10) enters the second pipeline (52).

9. The cooling device according to any one of claims 1-3, characterized in that, The housing (1) is provided with a self-sealing vent joint (11) and a self-sealing drain joint (12).

10. A server, characterized in that, Includes the cooling device as described in any one of claims 1-9.

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