Rotating apparatus for semiconductor device

Abstract

The present application discloses a rotating apparatus for a semiconductor device. The semiconductor device comprises a chamber (200) and a susceptor (300) located in the chamber (200). The rotating apparatus (100) comprises a driving member (110) and a transmission mechanism (120). The driving member (110) is located outside the chamber (200). An input end of the transmission mechanism (120) is connected to the driving member (110), and an output end of the transmission mechanism (120) is connected to the susceptor (300). The driving member (110) drives, by means of the transmission mechanism (120), the susceptor (300) to rotate. The transmission mechanism (120) is hermetically connected to the chamber (200), and the transmission mechanism (120) is made of a high-temperature-resistant and wear-resistant metal material.

Description

Rotating device for semiconductor equipment

[0001] This application claims priority to Chinese Patent Application No. 202510019289.X, filed with the Chinese Patent Office on January 6, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of semiconductor equipment technology, and for example to a rotating device for semiconductor equipment. Background Technology

[0003] Silicon carbide epitaxial growth refers to the growth of a single crystal layer with certain requirements on a silicon carbide substrate. Silicon carbide epitaxial growth is generally achieved using chemical vapor deposition (CVD) technology. This process has strict requirements for the growth environment (100mbar low pressure, 1600℃ high temperature), which leads to high requirements for the structure of the rotating tray used to support the silicon carbide.

[0004] In related technologies, a rotating tray includes a tray, a graphite support, and a central column. The center of the tray is located on top of the central column and the tray is placed on the support. The lower support has an air passage inside, and gas guide grooves are evenly distributed on the back of the tray. As the amount of gas in the air passage increases, the upper tray floats and rotates in the direction of gas flow, that is, the tray is driven to rotate by airflow.

[0005] However, the uniformity of the tray rotation speed is closely related to the design of the air ducts and gas guide channels. For example, if the number of air holes is only two or three, it is impossible to achieve completely uniform airflow, which can easily cause the tray to shake up and down, resulting in changes in the tray rotation speed. In addition, as the air-floating tray continuously rubs against the support during rotation, graphite particles are generated. These particles can easily enter the reaction chamber under the blowing of the gas, affecting the process environment and causing fatal defects in the silicon carbide substrate. Summary of the Invention

[0006] This application provides a rotating device for semiconductor equipment, suitable for silicon carbide epitaxial growth environments, ensuring the uniformity and stability of the tray rotation speed, avoiding the influence of particles and other contaminants on the process environment, and improving product quality.

[0007] This application provides a rotating device for a semiconductor device, the semiconductor device including a cavity and a tray located within the cavity, the rotating device comprising:

[0008] A driving element, the driving element being located outside the cavity;

[0009] A transmission mechanism, wherein the input end of the transmission mechanism is connected to the driving member, and the output end of the transmission mechanism is connected to the tray, and the driving member is configured to drive the tray to rotate through the transmission mechanism; the transmission mechanism and the cavity are sealed together.

[0010] The transmission mechanism is made of high-temperature resistant and wear-resistant metal material.

[0011] In some embodiments, the transmission mechanism includes a shaft assembly that passes through and is sealed to the cavity, with one end of the shaft assembly extending into the cavity and the other end connected to the drive member.

[0012] In some embodiments, the rotating shaft assembly includes at least two rotating shafts and a coupling connecting two adjacent rotating shafts; the coupling is located within the cavity, one rotating shaft passes through the cavity, and at least one rotating shaft is located within the cavity.

[0013] In some embodiments, the transmission mechanism further includes a driving bevel gear and a driven bevel gear meshing with each other, and a central column perpendicular to the rotating shaft assembly, wherein the tray and the driven bevel gear are both connected to the central column, and the driving bevel gear is connected to the rotating shaft assembly.

[0014] In some embodiments, the rotating device further includes a bearing, the shaft assembly being mounted to the cavity via the bearing, the bearing being made of a high-temperature resistant, self-lubricating material.

[0015] In some embodiments, the high-temperature resistant and wear-resistant metallic material is molybdenum or tungsten; and / or, the high-temperature resistant and self-lubricating material is graphite or modified ceramic.

[0016] In some embodiments, the rotating device further includes a magnetic fluid sealing mechanism, the housing of which is hermetically connected to the outside of the cavity, the rotating shaft assembly passing through the magnetic fluid sealing mechanism, with one end extending out of the magnetic fluid sealing mechanism to enter the cavity and connect with the transmission mechanism, and the other end extending out of the magnetic fluid sealing mechanism to connect with the drive element.

[0017] In some embodiments, the magnetic fluid sealing mechanism is located outside the cavity, and the magnetic fluid sealing mechanism includes a housing, to which the drive member is fixed.

[0018] In some embodiments, the rotating device further includes a speed measuring component configured to measure the rotational speed of the shaft assembly.

[0019] In some embodiments, the speed measuring component includes a sensor and a measuring block, the measuring block being disposed at one end of the shaft assembly extending out of the cavity, the sensor being fixed outside the cavity, and the sensor being configured to detect the measuring block to measure the rotational speed of the shaft assembly. Attached Figure Description

[0020] Figure 1 is a schematic diagram of a semiconductor device provided in an embodiment of this application;

[0021] Figure 2 is a cross-sectional view of a semiconductor device provided in an embodiment of this application;

[0022] Figure 3 is a magnified view of part A in Figure 2;

[0023] Figure 4 is a magnified view of part B in Figure 2.

[0024] In the picture:

[0025] 100. Rotating device; 110. Driving component; 120. Transmission mechanism; 121. Driving bevel gear; 122. Driven bevel gear; 124. Central column; 130. Shaft assembly; 131. Rotating shaft; 132. Coupling; 140. Bearing; 150. Magnetic fluid sealing mechanism; 160. Speed ​​measuring assembly; 161. Sensor; 162. Measuring block; 170. Belt drive assembly; 171. Driving pulley; 172. Driven pulley; 173. Synchronous belt; 180. Fixed base; 181. Ear plate; 190. Protective cover;

[0026] 200, cavity; 210, mounting block; 220, shell; 230, first cover plate; 240, second cover plate; 250, cylinder; 300, tray; 400, support; 410, accommodating cavity; 420, first mounting hole; 430, second mounting hole; 440, limiting groove. Detailed Implementation

[0027] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application according to the circumstances.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] As shown in Figures 1-4, this embodiment provides a rotating device for a semiconductor device. The semiconductor device includes a cavity 200 arranged in a horizontal direction and a tray 300 located within the cavity 200. The rotating device 100 includes a driving member 110 and a transmission mechanism 120. The input end of the transmission mechanism 120 is connected to the driving member 110, and the output end of the transmission mechanism 120 is connected to the tray 300. The driving member 110 drives the tray 300 to rotate through the transmission mechanism 120. By replacing the airflow-driven tray 300 rotation structure in related technologies with the mechanical transmission of the driving member 110 and the transmission mechanism 120, the uniformity and stability of the rotation speed of the tray 300 can be achieved, while also avoiding the blowing of particles into the cavity 200 under the blowing of gas, which would affect product quality.

[0030] The drive component 110 is located outside the cavity 200, while the transmission mechanism 120 is sealed to the cavity 200, meaning at least a portion of the transmission mechanism 120 is located inside the cavity 200, ensuring the cavity 200's sealing requirements. Because the drive component 110 is located outside the cavity 200, the material requirements for it are reduced. The transmission mechanism 120, located inside the cavity 200, is made of a high-temperature resistant and wear-resistant metal material, making it suitable for the harsh epitaxial growth environment of silicon carbide (e.g., 100 mbar low pressure, 1600℃ high temperature), thus making the rotating device 100 suitable for the epitaxial growth environment. This solves the problem that rotating the tray 300 under low-pressure and high-temperature conditions during silicon carbide epitaxy is difficult to achieve using conventional structures, such as directly driving the tray 300 to rotate with a motor.

[0031] The cavity 200 includes a shell 220, a first cover plate 230, a cylinder 250, and a second cover plate 240. The first cover plate 230 is installed at the opening of the shell 220, and its outer side is installed at one end of the cylinder 250. The second cover plate 240 is installed at the other end of the cylinder 250. The tray 300 and part of the transmission mechanism 120 are installed inside the shell 220. By setting the first cover plate 230 and the second cover plate 240, the sealing performance of the cavity 200 is improved. When the cavity 200 has a heating element to perform a heating operation, the two cover plates can improve the heat preservation effect. The cavity 200 can be used as a reaction chamber for depositing silicon carbide placed on the tray 300, or it can be used as other transfer chambers, depending on the requirements, without limitation.

[0032] The shell 220 has a flange on the side with the opening, and both the cylinder 250 and the first cover plate 230 are mounted on the flange. The cylinder 250 has a flange on the side facing the second cover plate 240, and the second cover plate 240 is mounted on the flange for easy installation.

[0033] The rotating device 100 also includes a rotating shaft assembly 130, which passes through and is sealed to the cavity 200. One end of the rotating shaft assembly 130 is connected to the transmission mechanism 120, and the other end is connected to the drive component 110. That is, the rotating shaft assembly 130 is the connection structure between the transmission mechanism 120 and the drive component 110. Since part of the rotating shaft assembly 130 is located inside the cavity 200, the rotating shaft 131 and the coupling 132 that make up the rotating shaft assembly 130 are both made of high temperature resistant and wear-resistant metal materials, so that the rotating shaft assembly 130 is suitable for the harsh epitaxial growth environment of silicon carbide.

[0034] The rotating shaft assembly 130 includes at least two rotating shafts 131 and a coupling 132 connecting two adjacent rotating shafts 131; exemplaryly, the two rotating shafts 131 are coaxially arranged. The coupling 132 is located within the cavity 200, one rotating shaft 131 passes through the cavity 200, and at least one rotating shaft 131 is located within the cavity 200. Exemplarily, three rotating shafts 131 and two couplings 132 are provided. The coupling 132 may be a slider coupling, with two adjacent rotating shafts 131 connected by the slider coupling. The first rotating shaft 131 extends from the second mounting hole 430 of the support member 400, the second rotating shaft 131 is mounted on the mounting block 210 and the first cover plate 230 respectively by two bearings 140, and the third rotating shaft 131 passes through the second cover plate 240, with part of it located inside the cylinder 250 and another part located outside the cylinder 250 for connection with the drive member 110. By setting multiple rotating shafts 131 and connecting adjacent rotating shafts 131 through couplings 132, the internal space of the cavity 200 can be matched, that is, the rotating shaft assembly 130 of the split structure can avoid the problem of the rotating shaft 131 of the integrated structure being too long, which would affect the structural accuracy, and is convenient for installation.

[0035] In one embodiment, the transmission mechanism 120 includes a driving bevel gear 121 and a driven bevel gear 122 meshing with each other, and a central column 124 perpendicular to the rotating shaft 131. The tray 300 and the driven bevel gear 122 are both connected to the central column 124. The driving bevel gear 121 is connected to the rotating shaft 131, which passes through and is rotatably connected to the cavity 200. The driving bevel gear 121, the driven bevel gear 122, the central column 124, and at least part of the rotating shaft 131 are all located within the cavity 200. That is, the above structures are all made of high-temperature resistant and wear-resistant metal materials. In this embodiment, the rotating shaft 131 passes through the first cover plate 230, the cylinder 250, and the second cover plate 240. One end is located inside the cavity 200 and connected to the driving bevel gear 121, and the other end is located outside the cavity 200 and connected to the drive member 110. The transmission is achieved by the meshing connection of the driving bevel gear 121 and the driven bevel gear 122, resulting in a compact structure, high transmission efficiency, and good stability. For example, the driving bevel gear 121 and the rotating shaft 131 are separate structures. The driven bevel gear 122 is sleeved on the central column 124 and fixed by a plug screw. In addition, by setting the rotating shaft assembly 130 separately, when there is slight vibration during the transmission mechanism 120, i.e., the bevel gear assembly, the rotating shaft 131 is connected by the coupling 132 to buffer the vibration.

[0036] In other embodiments, the transmission mechanism 120 includes a worm gear, a worm, and a central column 124. The tray 300 and the worm gear are both mounted on the central column 124. The worm gear and the worm are meshed together. The worm and the central column 124 are perpendicular. The worm is connected to the driving member 110, passes through and is rotatably connected to the cavity 200. The worm gear, the central column 124, and at least a portion of the worm are all located within the cavity 200. The driving member 110 drives the worm to rotate, which in turn drives the worm gear and the central column 124 to rotate, thereby driving the tray 300 to rotate. In this embodiment, the worm passes through the first cover plate 230, the cylinder 250, and the second cover plate 240. One end of the worm is located inside the cavity 200 and meshes with the worm gear, while the other end is located outside the cavity 200 and connected to the driving member 110.

[0037] The semiconductor device also includes a support member 400 installed within the cavity 200. The support member 400 has a receiving cavity 410. Both the driving bevel gear 121 and the driven bevel gear 122 are located within the receiving cavity 410. A central column 124 and a rotating shaft 131 are respectively installed in the first mounting hole 420 and the second mounting hole 430 of the support member 400. One end of the central column 124 extends out of the support member 400 to connect with a tray 300, which is supported by the support member 400. The support member 400 is made of a high-temperature resistant, self-lubricating material. The support member 400 serves a supporting function, supporting the transmission mechanism 120 and the tray 300 within the cavity 200. By placing the driving bevel gear 121, the driven bevel gear 122, and the central column 124 within the receiving cavity 410, the structure is made more compact. Because the support member 400 has high-temperature resistance, it is suitable for epitaxial growth environments.

[0038] The support member 400 has a limiting groove 440, within which the tray 300 is circumferentially confined, with its bottom located at the bottom of the limiting groove 440. Due to the self-lubricating properties of the support member 400, the tray 300 and the limiting groove 440 are smoothly connected, reducing rotational resistance. The central column 124 is smoothly connected to the wall of the first mounting hole 420, and the rotating shaft 131 is smoothly connected to the wall of the second mounting hole 430, thereby reducing rotational resistance.

[0039] The support member 400 can be directly installed on the inner wall of the cavity 200, i.e., the housing 220, or installed on the inner wall of the housing 220 through an adapter, without limitation.

[0040] The rotating device 100 also includes bearings 140, such as fisheye bearings, through which the rotating shaft 131 is mounted to the cavity 200. A mounting block 210 is provided within the cavity 200, and fisheye bearings are respectively mounted on the mounting block 210 and the first cover plate 230. These multiple fisheye bearings guide, protect, and reduce friction on the rotating shaft 131, ensuring transmission level and improving the durability of the rotating device 100. The bearings 140 are made of high-temperature resistant, self-lubricating materials, ensuring their suitability for the silicon carbide epitaxial growth environment. Furthermore, in vacuum reactions, grease lubrication of the bearings 140 would contaminate the process; therefore, self-lubricating materials are required. High-temperature resistant, self-lubricating materials include graphite or modified ceramics. The strength of parts made of graphite also increases with increasing temperature.

[0041] The high-temperature resistant and wear-resistant metal material is molybdenum or tungsten, ensuring the service life of the rotating device is 100%.

[0042] The rotating device 100 also includes a magnetic fluid sealing mechanism 150. The outer shell of the magnetic fluid sealing mechanism 150 is sealed to the outside of the cavity 200. A rotating shaft 131 passes through the magnetic fluid sealing mechanism 150, with one end extending out of the magnetic fluid sealing mechanism 150 to enter the cavity 200. The outer shell of the magnetic fluid sealing mechanism 150 is mounted on the outside of the second cover plate 240, and a sealing connection is achieved through a sealing ring, thus realizing a sealed connection between the magnetic fluid sealing mechanism 150 and the cavity 200. A third rotating shaft 131 passes through the magnetic fluid sealing mechanism 150, achieving a rotational sealing connection between the rotating shaft 131 and the magnetic fluid sealing mechanism 150, thereby realizing a rotational sealing connection between the rotating shaft 131 and the cavity 200. The rotating shaft 131 and the cavity 200 achieve a dynamic seal with a vacuum leakage rate of less than 5e9 mbar·L / s and the transmission of rotational motion through the magnetic fluid sealing mechanism 150. Under the influence of a uniform and stable magnetic field, the magnetic fluid can form a multi-stage liquid "O-ring" around the rotating shaft 131. Even when the rotating shaft 131 rotates at high speed, no friction occurs between solids, thus forming a high-performance dynamic seal. The magnetic fluid sealing mechanism 150 is related technology. The drive component 110 is fixed to the outer shell of the magnetic fluid sealing mechanism 150 located outside the cavity 200.

[0043] The drive component 110 can be a stepper motor, a servo motor, or a cylinder, etc., and is not limited to any particular type. Motor drive allows for easy adjustment of the tray's 300° rotation speed, providing optimal operating speed during the extension process, and offering overall convenience and ease of control.

[0044] In this embodiment, the driving component 110 is a motor as an example for illustrative purposes. A fixing seat 180 is mounted on the outer shell of the magnetic fluid sealing mechanism 150, and the motor is mounted through the fixing seat 180, thus achieving stable installation of the motor.

[0045] The fixed base 180 is a hollow structure, and a belt drive assembly 170 is installed inside, including a driving pulley 171, a driven pulley 172, and a synchronous belt 173. The synchronous belt 173 is wound around the driving pulley 171 and the driven pulley 172. The motor's output shaft drives the driving pulley 171, and the driven pulley 172 is connected to the rotating shaft 131, thus the motor drives the rotating shaft 131 to rotate through the belt drive assembly 170. The motor's output shaft and the driving pulley 171 can be directly connected, or indirectly connected through a transmission shaft, such as by a coupling connecting the motor's output shaft and the transmission shaft, with the transmission shaft connected to the driving pulley 171. The driven pulley 172 and the rotating shaft 131 can be directly connected, or indirectly connected through an intermediate sleeve, such as by the intermediate sleeve connecting the driven pulley 172 and the rotating shaft 131.

[0046] The motor drives the belt drive assembly 170 to drive the third rotating shaft 131 to rotate, which in turn drives the coupling 132 in the cavity 200, as well as the first and second rotating shafts 131 to rotate. Through the driving bevel gear 121 and the driven bevel gear 122, the central column 124 is driven to rotate, thereby driving the tray 300 to rotate.

[0047] The rotating device 100 also includes a speed measuring component 160, which is configured to measure the rotational speed of the rotating shaft 131. The speed measuring component 160 can calculate the current rotational speed of the tray 300 in real time. The speed measuring component 160 includes a sensor 161 and a measuring block 162. The sensor 161 is, for example, a non-contact proximity switch. The measuring block 162 is located at the end of the rotating shaft 131 extending out of the cavity 200. The sensor 161 is fixed to the outside of the cavity 200 and is configured to detect the measuring block 162 to measure the rotational speed of the rotating shaft 131. Exemplarily, the measuring block 162 is mounted on a mounting sleeve, and a mounting sleeve is fitted onto the end of the third rotating shaft 131 located outside the cavity 200, or a mounting sleeve is mounted on the driven pulley 172. Since the driven pulley 172 and the rotating shaft 131 are fixedly connected and rotate simultaneously, the mounting sleeve can be installed as needed. A lug 181 is mounted on the fixed base 180, and a non-contact proximity switch is mounted on the lug 181. The rotational speed of the rotating shaft 131 can be measured by the frequency of the non-contact proximity switch sensing the measuring block 162. The rotational speed of the tray 300 can then be calculated based on the transmission ratio of the driving bevel gear 121 and the driven bevel gear 122. A protective cover 190 is provided on the lug 181 to protect all structures at the tail of the rotating shaft 131.

Claims

1. A rotating device for a semiconductor device, the semiconductor device including a cavity (200) and a tray (300) located within the cavity (200), the rotating device (100) comprising: A drive unit (110) is located outside the cavity (200); A transmission mechanism (120) is provided, the input end of which is connected to the drive member (110), and the output end of which is connected to the tray (300). The drive member (110) is configured to drive the tray (300) to rotate via the transmission mechanism (120). The transmission mechanism (120) and the cavity (200) are sealed together. The transmission mechanism (120) is made of high-temperature resistant and wear-resistant metal material.

2. The rotating device for a semiconductor device according to claim 1, wherein, The transmission mechanism (120) includes a rotating shaft assembly (130) that passes through and is sealed to the cavity (200). One end of the rotating shaft assembly (130) extends into the cavity (200), and the other end is connected to the drive member (110).

3. The rotating device for a semiconductor device according to claim 2, wherein, The rotating shaft assembly (130) includes at least two rotating shafts (131) and a coupling (132) connecting two adjacent rotating shafts (131); the coupling (132) is located inside the cavity (200), one rotating shaft (131) passes through the cavity (200), and at least one rotating shaft (131) is located inside the cavity (200).

4. The rotating device for a semiconductor device according to claim 2, wherein, The transmission mechanism (120) further includes a driving bevel gear (121) and a driven bevel gear (122) that mesh with each other, and a central column (124) that is perpendicular to the rotating shaft assembly (130). The tray (300) and the driven bevel gear (122) are both connected to the central column (124), and the driving bevel gear (121) is connected to the rotating shaft assembly (130).

5. The rotating device for a semiconductor device according to claim 2, wherein, The rotating device (100) also includes a bearing (140), and the rotating shaft assembly (130) is mounted on the cavity (200) via the bearing (140). The bearing (140) is made of a high-temperature resistant, self-lubricating material.

6. The rotating device for a semiconductor device according to claim 5, wherein, Meet at least one of the following: The high-temperature resistant and wear-resistant metal material is molybdenum or tungsten; The high-temperature resistant, self-lubricating material is graphite or modified ceramic.

7. The rotating device for a semiconductor device according to claim 2, wherein, The rotating device (100) further includes a magnetic fluid sealing mechanism (150), the outer shell of which is sealed to the outside of the cavity (200). The rotating shaft assembly (130) passes through the magnetic fluid sealing mechanism (150), with one end extending out of the magnetic fluid sealing mechanism (150) to enter the cavity (200) and the other end extending out of the magnetic fluid sealing mechanism (150) to connect with the drive member (110).

8. The rotating device for a semiconductor device according to claim 7, wherein, The magnetic fluid sealing mechanism (150) is located outside the cavity (200), and the magnetic fluid sealing mechanism (150) includes a housing, to which the drive member (110) is fixed.

9. The rotating device for a semiconductor device according to any one of claims 2-8, wherein, The rotating device (100) further includes a speed measuring component (160), which is configured to measure the rotational speed of the rotating shaft assembly (130).

10. The rotating device for a semiconductor device according to claim 9, wherein, The speed measuring component (160) includes a sensor (161) and a measuring block (162). The measuring block (162) is located at one end of the rotating shaft assembly (130) that extends out of the cavity (200). The sensor (161) is fixed outside the cavity (200). The sensor (161) is configured to detect the measuring block (162) to measure the rotational speed of the rotating shaft assembly (130).

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