Exhaust gas oxygen measurement device capable of being repaired in non-stop state, and exhaust gas oxygen measurement system having same

Abstract

The present invention relates to an exhaust gas oxygen measurement device provided to measure oxygen in exhaust gas discharged from a semiconductor process and the like, and an exhaust gas oxygen measurement system having same. According to the present invention, the exhaust gas oxygen measurement system comprises an exhaust gas oxygen measurement device, and the exhaust gas oxygen measurement device comprises: a pipe connection body, which is provided on an exhaust pipe and has connection ports at both sides thereof; an oxygen measurement sensor, which is provided at a one-side connection port side of the pipe connection body so as to emit light, thereby measuring an oxygen concentration with reflected light; a reflection device provided at the other-side connection port side of the pipe connection body so as to reflect the light emitted from the oxygen measurement sensor; a protection member composed of a first protection member for protecting the oxygen measurement sensor from exhaust gas and a second protection member for protecting the reflection device; and an exhaust gas blocking member composed of a first blocking valve and a second blocking valve that are provided to open and close the connection ports at both sides.

Description

An exhaust gas oxygen measuring device configured to be repairable without interruption and an exhaust gas oxygen measuring system equipped with the same

[0001] The present invention relates to an exhaust gas oxygen measuring device installed to measure oxygen in hydrogen-containing exhaust gas during various semiconductor processes, and an exhaust gas oxygen measuring system equipped with the same.

[0002] Semiconductor devices are typically manufactured by repeatedly performing a number of processes centered on the deposition of a thin film and etching of the thin film on a semiconductor substrate, such as a wafer, to form a circuit pattern having set characteristics, and then dicing the circuit pattern into chip units and packaging them.

[0003] Processes for producing semiconductor devices include methods that induce chemical reactions between gases by controlling the external environment of gaseous materials, and methods that produce by controlling the external environment of liquid materials; the present invention is primarily used in processes configured to produce by inducing chemical reactions between gases.

[0004] Unit processes involving chemical reactions, such as the aforementioned deposition or etching processes, supply various gases including source and carrier gases to a process chamber and control the internal environment of the chamber to induce a chemical reaction of the source gas. As a result, an etching process is repeatedly performed to form a thin film of appropriate thickness on a substrate or to remove unnecessary parts excluding the circuit pattern from the formed thin film.

[0005] Generally, the reactants generated as a result of a chemical reaction are necessary for the formation of circuit patterns, but the reaction by-products generated during the reaction process and unreacted residual gases that did not participate in the reaction become process by-products, and these process by-products are discharged outside the process chamber in the form of exhaust gas whenever unit processes such as deposition and etching are completed.

[0006] As such, exhaust gases contain corrosive gases, foreign substances, and hydrogen that are harmful to the human body. In particular, in the case of hydrogen, which poses a risk of explosion and ignition, it is necessary to eliminate the possibility of explosions and fires caused by hydrogen by directly measuring its concentration or measuring oxygen concentration.

[0007] In other words, to prevent explosions and fires caused by hydrogen contained in exhaust gases, it is necessary to measure the concentration of oxygen reacting with hydrogen in the emitted exhaust gases in real time.

[0008] Accordingly, an exhaust gas oxygen measuring device (system) capable of measuring the oxygen concentration in the exhaust gas must be installed in the path through which hydrogen-containing exhaust gas is discharged.

[0009]

[0010] If we examine the technology in the prior art documents,

[0011] Korean Patent Publication No. 10-2023-0059926, titled "Explosion Prevention System for Securing Stability in High-Concentration Hydrogen Usage Process and Method of Operating the Same," is a technology aimed at preventing explosions caused by the influx of external air (oxygen) or hydrogen leakage in semiconductor processes using high-concentration hydrogen. It stipulates that if the oxygen concentration in a detection means including an oxygen sensor exceeds a preset value, the operation of the semiconductor equipment is stopped.

[0012]

[0013] Generally, exhaust gases containing hydrogen emitted during semiconductor manufacturing processes contain corrosive gases and foreign substances. Consequently, oxygen measuring devices used to measure oxygen concentration in the exhaust gases experience shortened repair (maintenance and replacement) cycles due to corrosion and contamination, which can lead to problems such as the need to periodically halt the process for repairs.

[0014] The present invention aims to provide an exhaust gas oxygen measuring device and an exhaust gas oxygen measuring system equipped with the same, wherein the oxygen measuring sensor installed to measure the oxygen concentration in the exhaust gas and the protective member installed to protect the sensor from the exhaust gas are configured to be easily repaired (maintenance and replacement).

[0015] In other words, the present invention aims to provide an exhaust gas oxygen measuring device and an exhaust gas oxygen measuring system equipped with the same, which enable operation of exhaust gas-related equipment in a non-stop state during the repair (maintenance and replacement) of the oxygen measuring sensor and the protective member during the semiconductor process.

[0016] The exhaust gas oxygen measuring device of the present invention comprises: a pipe connecting body installed on an exhaust pipe path through which exhaust gas is discharged and having connecting ports on both sides; an oxygen measuring sensor installed on one connecting port of the pipe connecting body to measure oxygen concentration using reflected light by irradiating light; a reflecting device installed on the other connecting port of the pipe connecting body to reflect light irradiated from the oxygen measuring sensor; a protective member consisting of a first protective member protecting the oxygen measuring sensor from the exhaust gas and a second protective member protecting the reflecting device; and an exhaust gas blocking member consisting of a first shut-off valve and a second shut-off valve installed to open and close the connecting ports on both sides; wherein the first shut-off valve and the first protective member, and the second shut-off valve and the second protective member are separable and connectable.

[0017] The above exhaust gas blocking member may use a valve that is easy to open and close.

[0018] Even in a non-stop state where exhaust gas is discharged through the exhaust pipe, the oxygen measuring sensor, reflector, and protective member can be separated from the pipe connection body when the valve of the exhaust gas blocking member is closed.

[0019] The protective member may include a permeable blocking plate protection means that protects the permeable blocking plate from exhaust gas by spraying purge gas onto the surface of the permeable blocking plate.

[0020] The exhaust gas oxygen measuring system of the present invention includes an exhaust gas oxygen measuring device constructed as described above.

[0021] The exhaust gas oxygen measuring system of the present invention may further include a byproduct collecting device for collecting byproducts in the exhaust gas supplied to the exhaust gas oxygen measuring device.

[0022] The exhaust gas oxygen measuring system of the present invention may further include a bypass exhaust line installed in parallel with the oxygen measuring exhaust line in which the exhaust gas oxygen measuring device is installed.

[0023] The exhaust gas oxygen measuring system of the present invention may include a purge supply unit installed to supply purge gas (an inert gas such as nitrogen gas) to an exhaust gas oxygen measuring device according to process conditions.

[0024] The exhaust gas oxygen measuring system of the present invention may further include a purge heating unit installed to heat the purge gas supplied to the purge supply unit and supply it to the exhaust gas oxygen measuring device.

[0025] In the exhaust gas oxygen measuring device of the present invention, which is designed to be repairable in a non-stop state, the protective member is configured to protect the oxygen measuring sensor installed to measure the oxygen concentration in the exhaust gas from the exhaust gas and is made of a light-transmitting material. This protective member is exposed to the exhaust gas and requires periodic repair (maintenance and replacement). During this repair process, the exhaust gas blocking member is used to facilitate non-stop repair work on the exhaust gas-related equipment during the semiconductor process.

[0026] In other words, since the oxygen measuring device in this invention measures oxygen concentration by an optical method, it requires an oxygen measuring sensor that irradiates light and a reflector that reflects the irradiated light back onto the oxygen measuring sensor. A protective member is installed to prevent the oxygen measuring sensor and the reflector from becoming contaminated by process byproducts (powder, crystals, mist, etc.) contained in the exhaust gas, thereby making accurate oxygen concentration measurement impossible. One side of this protective member is exposed to process byproducts (powder, crystals, mist, etc.) contained in the exhaust gas and is easily contaminated, requiring periodic repair work. This invention has the effect of enabling periodic repair work on the protective member to be carried out without interrupting the exhaust gas-related equipment.

[0027] In addition, the present invention includes a permeable blocking plate protection means configured to inject purge gas onto the permeable blocking plate to reduce contamination of the permeable blocking plate of the protective member by exhaust gas, thereby extending the repair (maintenance and replacement) cycle of the permeable blocking plate of the protective member and having the effect of reducing economic loss.

[0028] In addition, the present invention has an exhaust gas blocking member capable of blocking the inflow of exhaust gas to the oxygen measuring sensor and the reflector. When the exhaust gas is blocked using this exhaust gas blocking member, the components of the oxygen measuring sensor, the reflector, and the protective member can be separated and repaired (maintenance and replacement) without stopping, thereby improving the operator's workability and enabling rapid repair.

[0029] The exhaust gas oxygen measuring system of the present invention includes a bypass exhaust line installed in parallel with an oxygen measuring exhaust line in which an exhaust gas oxygen measuring device is installed. When the bypass exhaust line is utilized, exhaust gas is discharged into the bypass exhaust line during the repair (maintenance and replacement) of the exhaust gas oxygen measuring device, thereby enabling the exhaust gas oxygen measuring device to be easily repaired (maintenance and replacement) without interruption.

[0030] In addition, the exhaust gas oxygen measuring system of the present invention is equipped with a purge supply unit capable of supplying purge gas according to process conditions, and the purge gas supplied to the purge supply unit is used as a protective means for a permeable blocking plate to reduce the phenomenon of the permeable blocking plate being contaminated by exhaust gas.

[0031] In addition, the exhaust gas oxygen measuring system of the present invention is equipped with a purge heating unit capable of heating the purge gas supplied from the purge supply unit, and by supplying the heated purge gas, the purge heating unit has the effect of preventing adverse effects such as by-products condensing and adhering to the permeation blocking plate when the exhaust gas cools rapidly, such as in a stationary state.

[0032] FIG. 1 is a schematic diagram of an exhaust gas oxygen measuring system showing an embodiment of the present invention.

[0033] FIG. 2 is a schematic diagram of an oxygen measuring exhaust line in which an oxygen measuring device is installed in an exhaust gas oxygen measuring system showing an embodiment of the present invention.

[0034] FIG. 3 is a front view of an oxygen measuring device showing an embodiment of the present invention.

[0035] FIG. 4 is a front view of the separated state of an oxygen measuring device showing an embodiment of the present invention.

[0036] FIG. 5 is a schematic cross-sectional view of an oxygen measuring device showing an embodiment of the present invention.

[0037] FIG. 6 is a diagram showing the usage state of an oxygen measuring device according to an embodiment of the present invention, a front view illustrating the state in which the exhaust gas is blocked and separated by an exhaust gas blocking member for repair and replacement during operation.

[0038] FIG. 7 is a cross-sectional view of a protective member of an oxygen measuring device showing an embodiment of the present invention.

[0039] To fully understand the present invention, preferred embodiments of the invention are described with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited to the embodiments described in detail below. These embodiments are provided to more completely explain the present invention to those with average knowledge in the art. Accordingly, the shapes of elements in the drawings may be exaggerated to emphasize clearer explanations. It should be noted that in each drawing, identical components may be depicted with the same reference numeral. Detailed descriptions of known functions and configurations that are deemed to unnecessarily obscure the essence of the present invention are omitted.

[0040]

[0041] The exhaust gas oxygen measuring system of the present invention is installed on an exhaust pipe path that guides exhaust gas to measure the concentration of oxygen in the exhaust gas discharged to the outside by the suction of a vacuum pump in semiconductor manufacturing processes such as deposition and etching, which use various gaseous states to induce chemical reactions.

[0042] The exhaust gas oxygen measuring system of the present invention comprises an exhaust gas oxygen measuring device, wherein the exhaust gas oxygen measuring device utilizes the principle of absorption spectroscopy to measure the concentration of a substance to be measured by measuring the absorbance, which is the degree of change after light irradiated from a light source having a specific wavelength passes through the substance to be measured, and is installed in an exhaust pipe path to measure the oxygen concentration in the exhaust gas.

[0043] The exhaust gas oxygen measuring device of the present invention comprises: a pipe connecting body installed on an exhaust pipe path through which exhaust gas is discharged and having a connecting port to allow an oxygen measuring sensor and a reflecting device to be installed on both sides; an oxygen measuring sensor installed on one side of the connecting port of the pipe connecting body to measure oxygen concentration using reflected light by irradiating light; a reflecting device installed on the other side of the connecting port of the pipe connecting body to reflect light irradiated from the oxygen measuring sensor; a protective member consisting of a first protective member that protects the oxygen measuring sensor from the exhaust gas and a second protective member that protects the reflecting device; and an exhaust gas blocking member consisting of a first shut-off valve and a second shut-off valve installed to open and close the connecting ports on both sides; wherein the first shut-off valve and the first protective member, and the second shut-off valve and the second protective member are separable and combined, and the exhaust gas blocking member typically uses a gate valve that is easy to open and close.

[0044] Even when exhaust gas is discharged through the exhaust pipe, when the valve of the exhaust gas blocking member is closed, the connection port where the oxygen measuring sensor and the reflector are installed is closed so that the oxygen measuring sensor, the reflector, and the protective member can be separated from the pipe connection body.

[0045] The protective member includes a permeable blocking plate protection means configured to protect the permeable blocking plate from exhaust gas by injecting purge gas supplied from a purge unit or purge gas heated by a purge heating unit onto the surface of the permeable blocking plate.

[0046]

[0047] Referring to Fig. 1,

[0048] The exhaust gas oxygen measuring system (3) of the present invention is installed on the path of an exhaust pipe (2) that guides the exhaust gas sucked in by a vacuum pump (1) to the outside so as to measure the oxygen concentration in the exhaust gas discharged from a semiconductor process, etc.

[0049] The exhaust gas oxygen measuring system (3) of the present invention has an oxygen measuring exhaust line (4) in which an oxygen measuring device (100) is installed to measure the oxygen concentration in the exhaust gas that is sucked in and discharged by a vacuum pump (1), and a bypass exhaust line (5) installed in parallel with the oxygen measuring exhaust line (4) to allow for repair (maintenance and replacement) of the oxygen measuring device (100) and other components. Unexplained reference numeral 6 is a directional valve, and a 3-way valve can usually be used.

[0050] That is, the above-mentioned bypass exhaust line (5) is an exhaust line that bypasses and discharges exhaust gas that is sucked into and discharged by the vacuum pump (1) during the repair (maintenance and replacement) of the oxygen measuring exhaust line (4) in which the oxygen measuring device (100) is installed, thereby enabling the repair (maintenance and replacement) of the oxygen concentration measurement (100) to be performed without stopping equipment such as a collection device, a dry pump, and a scrubber.

[0051] The above bypass exhaust line (5) may include an expandable exhaust pipe section (5a) that is expandable like a corrugated pipe or adjustable in length so that repair (maintenance and replacement) work on the oxygen measurement exhaust line (4) can be easily performed.

[0052] The above oxygen measuring exhaust line (4) is installed on the exhaust pipe (2) and measures the oxygen concentration in the exhaust gas that is sucked in by the vacuum pump (1) and discharged to the outside (atmosphere).

[0053]

[0054] Referring to Fig. 2,

[0055] The above oxygen measuring exhaust line (4) comprises an oxygen measuring device (100) capable of measuring oxygen concentration using reflected light by irradiating light, a byproduct collecting device (byproduct collecting trap) (200) installed upstream of the oxygen measuring device (100) to collect byproducts (including foreign substances) in the exhaust gas supplied to the oxygen measuring device (100), and a purge gas supply device (300) capable of supplying purge gas to the oxygen measuring device (100) according to process conditions.

[0056] The above-mentioned byproduct collection device (byproduct collection trap) (200) is configured to collect semiconductor byproducts or various foreign substances contained in the exhaust gas.

[0057] The above-mentioned byproduct collection device (byproduct collection trap) (200) is preferably installed so that it can be attached and detached on the path of the exhaust pipe (2) to allow for repair, and so that it can be replaced independently.

[0058] The above purge gas supply device (300) is configured to supply purge gas composed of inert gas according to semiconductor process, exhaust gas conditions, etc. The purge gas mainly uses nitrogen gas, which is an inert gas.

[0059] The above purge gas supply device (300) may consist solely of a purge supply unit configured to control the supply of purge gas and the amount supplied, or it may further include a purge heating unit configured to heat the purge gas supplied from the purge supply unit. The purge heating unit may typically use a heating jacket configured to wrap around a portion of the pipe through which the purge gas is guided, so that the purge gas is heated to the same temperature as the exhaust gas and supplied.

[0060]

[0061] The above oxygen measuring device (100) utilizes the principle of absorption spectroscopy to measure the concentration of a substance to be measured by measuring the absorbance, which is the degree of change after light irradiated from a light source having a specific wavelength passes through the substance to be measured, and is configured to measure the oxygen concentration in the exhaust gas by being installed in the exhaust pipe path.

[0062] Referring to FIGS. 3 and FIGS. 4,

[0063] The above oxygen measuring device (100) is installed on the path of the exhaust pipe (2) and comprises a pipe connecting body (10) having connecting ports (13, 14) so ​​as to allow the installation of an oxygen measuring sensor (20) and a reflecting device (30) on both sides; an oxygen measuring sensor (20) installed on one side of the connecting port (13) of the pipe connecting body (10) to measure oxygen concentration using reflected light by irradiating light; a reflecting device (30) installed on the other side of the connecting port (14) of the pipe connecting body (10) to reflect light irradiated from the oxygen measuring sensor (20); a protective member (40) composed of a first protective member (40a) that protects the oxygen measuring sensor (20) from exhaust gas and a second protective member (40b) that protects the reflecting device (30); and a first shut-off valve (50a) and a second shut-off valve (50b) installed to open and close the connecting ports (13, 14) on both sides. It includes the configuration of an exhaust gas blocking member (50).

[0064] The above pipe connecting body (10) is configured to be installed on the path of the exhaust pipe (2) that guides the exhaust gas.

[0065] The above pipe connecting body (10) has an inlet (11) and an outlet (12) formed so as to be connected to an exhaust pipe (2) and a clamp device at the top and bottom, and has connecting ports (13, 14) that are open so that light irradiated from an oxygen measuring sensor (20) and light reflected from a reflecting device (30) can pass through on both sides, and the opened connecting ports (13, 14) are formed to be usually opposite and located on the same line.

[0066] The above connectors (13, 14) are configured to allow the installation of an exhaust gas blocking member (50) consisting of a first shut-off valve (50a) and a second shut-off valve (50b) by using a clamp device (C). Various fastening members, such as bolts and nuts, may also be used instead of the clamp device (C).

[0067] The oxygen measuring sensor (20) is a sensor device configured to be installed at the end of the sensor-side connector (13) to irradiate light and receive light reflected from a reflector (30) located on the opposite side, thereby measuring the oxygen concentration in the exhaust gas passing through the pipe connection body (10).

[0068] Typically, the oxygen measuring sensor (20) and the reflector (30) are configured such that a light source of a specific wavelength passes through a specific length of light path (OPL), and in order to measure the oxygen concentration accurately, it is necessary to increase the length of the light path. To this end, the oxygen measuring sensor (20) is configured to irradiate light and receive the light reflected from the reflector (30) so that the light path can be doubled.

[0069] The above-described reflector (30) is configured to be positioned at the end of the reflector-side connector (14) and includes a reflector plate (31) configured to reflect light so as to reflect light irradiated from the oxygen measurement sensor (20) back to the oxygen measurement sensor (20). It is preferable that the reflector plate (31) of the above-described reflector (30) be installed so as to be positioned on the same line so as to transmit light irradiated from the oxygen measurement sensor (20) back to the oxygen measurement sensor (20).

[0070] The above protective member (40) is configured to allow light to pass through so that light irradiated from the oxygen measuring sensor (20) is transmitted to the reflecting device (30) and light reflected from the reflecting device (30) is transmitted back to the oxygen measuring sensor (20), while blocking exhaust gas to protect the oxygen measuring sensor (20) and the reflecting device (30) from being contaminated by exhaust gas.

[0071] The above protective member (40) is composed of a first protective member (40a) installed on the sensor-side connector (13) side to protect the oxygen measurement sensor (20), and a second protective member (40b) installed on the reflector-side connector (14) side to protect the reflector device (30).

[0072] Referring to Fig. 5,

[0073] The protective member (40), composed of the first protective member (40a) and the second protective member (40b), each has a permeable blocking plate (41) installed toward the connecting port (13, 14) so ​​as to transmit light and block exhaust gas.

[0074] The above-mentioned transmission blocking plate (41) is made of a material having high transmittance so as not to obstruct the transmission of light of a specific wavelength range for measuring oxygen concentration. In addition, it is desirable to use a material in which haze, refractive index, etc. are minimized. Sapphire glass is a material that possesses such characteristics.

[0075] One side of the above-mentioned permeable blocking plate (41) is exposed to exhaust gas and becomes contaminated, so periodic repair (maintenance and replacement) work is performed.

[0076] The above exhaust gas blocking member (50) is configured to allow the operation of exhaust gas-related equipment, such as a vacuum pump (1), a collection device, and a scrubber, to be carried out without interruption by performing repair (maintenance and replacement) work on the permeation blocking plate (41) of the periodic protection member (40).

[0077] The exhaust gas blocking member (50) is composed of a first blocking valve (50a) installed on the sensor-side connector (13) side and a second blocking valve (50b) installed on the reflection-side connector (14) side.

[0078] The first shut-off valve (50a) and the second shut-off valve (50b) of the exhaust gas shut-off member (50) can be various valves such as ball valves, globe valves, and diaphragm valves, and usually gate valves are used.

[0079] Referring to Fig. 6,

[0080] The exhaust gas blocking member (50) composed of the first shut-off valve (50a) and the second shut-off valve (50b) can be used to open and close the connecting port (13, 14) in an open state, and when closed, exhaust gas is not allowed to flow in toward the protective member (40).

[0081] That is, after closing the open connection port (13, 14) using the exhaust gas blocking member (50), the protective member (40) consisting of the first protective member (40a) and the second protective member (40b) is separated to perform repair (maintenance and replacement) work on the permeation blocking plate (41). At this time, the operation of exhaust gas-related equipment such as the vacuum pump (1), collection device, and scrubber is in a non-stop state.

[0082] One side of the above-mentioned pipe connection body (10) is configured with a plurality of purge gas supply ports (15) connected to a purge gas supply device (300) so that heated purge gas can be supplied according to process conditions.

[0083] The above protective member (40) has a configuration of a permeable blocking plate protection means (60) that can prevent the permeable blocking plate (41) from being contaminated by exhaust gas.

[0084] The above-mentioned permeable blocking plate protection means (60) sprays purge gas onto the surface of the permeable blocking plate (41) that comes into contact with the exhaust gas, thereby preventing contact with the exhaust gas or minimizing contact, so that the surface of the permeable blocking plate (41) is contaminated by process by-products contained in the exhaust gas and does not obstruct the light path between the oxygen measuring sensor (20) and the reflector (30).

[0085] The above-mentioned permeable blocking plate protection means (60) comprises a purge gas flow port (61) connected to a purge gas supply device (300) so that purge gas can be supplied, and a purge gas surface injection part (62) formed to inject the purge gas introduced into the purge gas flow port (61) onto the surface of the permeable blocking plate (41).

[0086] The above purge gas surface injection part (62) is composed of a purge gas guide groove (63) formed to guide the purge gas introduced into the purge gas flow port (61) to the outer circumference of the permeable blocking plate (41), and a purge gas guide (64) having a through hole (64a) in the central part so that the purge gas guided into the purge gas guide groove (63) and sprayed onto the surface of the permeable blocking plate (41) can be discharged toward the pipe connection body (10).

[0087] The permeable blocking plate protection means (60) formed in this way allows the surface of the permeable blocking plate (41) to be contaminated by exhaust gas as much as possible by using purge gas supplied from the purge gas supply device (300) or heated purge gas.

[0088] That is, the permeable blocking plate protection means (60) guides the purge gas (nitrogen gas or heated nitrogen gas) supplied from the purge gas supply device (300) through the purge gas guide groove (63), and the guided purge gas is uniformly sprayed onto the surface of the permeable blocking plate (41), and the sprayed purge gas is discharged through the through hole (64a) formed in the central part of the purge gas guide hole (64), thereby preventing exhaust gas from flowing into the surface of the permeable blocking plate (41) as much as possible and preventing contact phenomena as much as possible, thereby reducing contamination phenomena.

[0089] At this time, it is preferable that the surface of the permeable blocking plate (41) be formed in the shape of a semicircular arc.

[0090]

[0091] Therefore, it will be well understood that the present invention is not limited only to the forms mentioned in the above detailed description. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Furthermore, the present invention should be understood to include all variations, equivalents, and substitutions within the spirit and scope of the invention as defined by the appended claims.

[0092] Generally, exhaust gases containing hydrogen emitted during semiconductor manufacturing processes contain corrosive gases and foreign substances. Consequently, oxygen measuring devices used to measure oxygen concentration in the exhaust gases experience shortened repair (maintenance and replacement) cycles due to corrosion and contamination, which can lead to problems such as the need to periodically halt the process for repairs.

[0093] Accordingly, the present invention provides an exhaust gas oxygen measuring device and an exhaust gas oxygen measuring system equipped with the same, which enable operation of exhaust gas-related equipment in a non-stop state during the repair (maintenance and replacement) of the oxygen measuring sensor and the protective member during the semiconductor process, thereby having industrial applicability for use in the semiconductor manufacturing industry.

Claims

1. A pipe connecting body installed on the path of an exhaust pipe through which exhaust gas is discharged, having connecting ports on both sides; An oxygen measuring sensor installed on one side of the pipe connection body's connector to irradiate light and measure oxygen concentration using the reflected light; A reflector installed on the other side of the pipe connection body to reflect light irradiated from an oxygen measurement sensor; A protective member comprising a first protective member that protects the oxygen measuring sensor from exhaust gas and a second protective member that protects the reflector; An exhaust gas blocking member comprising a first shut-off valve and a second shut-off valve installed to open and close connecting ports on both sides; An exhaust gas oxygen measuring device configured to be repairable in a non-stop state, characterized in that the first shut-off valve and the first protective member, and the second shut-off valve and the second protective member can be separated and combined in a non-stop state.

2. In Paragraph 1, The exhaust gas oxygen measuring device is characterized by using a valve for the exhaust gas blocking member and is configured to be repairable in a non-stop state.

3. In Paragraph 1, Even in a non-stop state where exhaust gas is discharged through the exhaust pipe, An exhaust gas oxygen measuring device configured to be repairable in a non-stop state, characterized by the fact that the oxygen measuring sensor, the reflector, and the protective member can be separated from the pipe connection body when the valve of the exhaust gas blocking member is in a closed state.

4. In Paragraph 1, An exhaust gas oxygen measuring device configured to be repairable in a non-stop state, characterized by having a permeable blocking plate protection means in the protective member to protect the permeable blocking plate from exhaust gas by spraying purge gas onto the surface of the permeable blocking plate.

5. An exhaust gas oxygen measuring system comprising an exhaust gas oxygen measuring device comprising any one of paragraphs 1 to 4.

6. In Paragraph 5, An exhaust gas oxygen measuring system comprising a byproduct collecting device for collecting byproducts in exhaust gas supplied to the exhaust gas oxygen measuring device.

7. In Paragraph 5, An exhaust gas oxygen measuring system comprising a bypass exhaust line installed in parallel with an oxygen measuring exhaust line in which the exhaust gas oxygen measuring device is installed.

8. In Paragraph 5, An exhaust gas oxygen measuring system comprising a purge supply unit installed to supply purge gas to an exhaust gas oxygen measuring device according to process conditions.

9. In Paragraph 8, An exhaust gas oxygen measuring system further comprising a purge heating unit installed to heat the purge gas supplied to the purge supply unit and supply it to the exhaust gas oxygen measuring device.

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