Solid carbon dioxide cleaning device for semiconductor package
The solid carbon dioxide cleaning device addresses static electricity and sparks by incorporating an ionizer and conductive pads with grounding, ensuring effective cleaning and preventing adhesion defects in semiconductor packages.
WO2026147179A1PCT designated stage Publication Date: 2026-07-09DIT CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- DIT CORP
- Filing Date
- 2025-12-30
- Publication Date
- 2026-07-09
AI Technical Summary
Technical Problem
Existing solid carbon dioxide cleaning methods for semiconductor packages generate high-voltage static electricity and sparks, which can damage the products due to friction and insulating properties, leading to adhesion defects and yield loss.
Method used
A solid carbon dioxide cleaning device equipped with a nozzle, ionizer, and mounting unit that uses conductive pads and grounding cables to neutralize static electricity and prevent sparks by spraying ions and discharging accumulated charge to ground.
Benefits of technology
Effectively removes static electricity and prevents sparks during cleaning, ensuring product integrity and yield by using conductive pads with controlled surface resistance to neutralize and discharge static charge.
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Smart Images
Figure KR2025023183_09072026_PF_FP_ABST
Abstract
The present invention relates to a solid carbon dioxide cleaning device for a semiconductor package. The solid carbon dioxide cleaning device for a semiconductor package may comprise: a nozzle for cleaning a semiconductor package by spraying solid carbon dioxide from a solid carbon dioxide supply unit; an ionizer installed around the nozzle to remove static electricity from the semiconductor package; and a seating unit providing an upper surface on which the semiconductor package is seated in contact therewith, and preventing static electricity from accumulating in the semiconductor package in contact therewith.
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