Antenna structure and electronic device comprising same

Abstract

According to one embodiment of the present disclosure, an antenna structure and / or an electronic device comprising same may comprise: a thermally conductive member including a first area having a first thickness and a second area having a second thickness greater than the first thickness; a shielding sheet disposed on one surface of the thermally conductive member from at least a portion of the first area to at least a portion of the second area; and an antenna member disposed in the first area while facing the thermally conductive member with a portion of the shielding sheet interposed therebetween. In one embodiment, at a boundary portion between the first area and the second area, a portion of the shielding sheet can be inclined with respect to the thermally conductive member or the antenna member. Other various embodiments are also possible.

Description

Antenna structure and electronic device including the same

[0001] The embodiments of the present disclosure relate to electronic devices, for example, to antenna structures and / or electronic devices including the same.

[0002] The term "electronic device" may refer to devices that perform functions specified according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and / or vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can recently be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and / or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment of the present disclosure, a coil antenna assembly for transmitting and / or receiving a wireless signal through one surface of an electronic device may include a heat-conducting member comprising a first portion having a first thickness in a first region of the coil antenna assembly and a second portion having a second thickness greater than the first thickness in a second region of the coil antenna assembly, a shielding sheet disposed extending from at least a portion of the first region to at least a portion of the second region, and an antenna member disposed in the first region of the coil antenna assembly. In one embodiment, in the first region of the coil antenna assembly, a portion of the shielding sheet is disposed between the first portion of the heat-conducting member and the antenna member, and in the second region of the coil antenna assembly, the antenna member is not disposed, and a portion of the shielding sheet may be disposed at an angle at the boundary between the first region and the second region due to the second portion of the heat-conducting member being thicker than the first portion.

[0005] According to one embodiment of the present disclosure, an antenna structure and / or an electronic device including the same may comprise a thermally conductive member comprising a first region having a first thickness and a second region having a second thickness greater than the first thickness, a shielding sheet disposed on one surface of the thermally conductive member extending from at least a portion of the first region to at least a portion of the second region, and an antenna member disposed in the first region facing the thermally conductive member with a portion of the shielding sheet in between. In one embodiment, at the boundary portion between the first region and the second region, a portion of the shielding sheet may be disposed at an angle with respect to the thermally conductive member or the antenna member.

[0006] According to one embodiment of the present disclosure, an electronic device may include a front plate, a rear plate, a battery disposed in the space between the front plate and the rear plate, and an antenna structure disposed at least partially between the rear plate and the battery. In one embodiment, the antenna structure may include a heat-conducting member comprising a first region having a first thickness and a second region having a second thickness greater than the first thickness, a shielding sheet disposed on one surface of the heat-conducting member extending from at least a portion of the first region to at least a portion of the second region, and an antenna member disposed in the first region facing the heat-conducting member with a portion of the shielding sheet in between. In one embodiment, at the boundary portion between the first region and the second region, a portion of the shielding sheet may be disposed at an angle with respect to the heat-conducting member or the antenna member.

[0007] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram showing an electronic device in a network environment according to one embodiment of the present disclosure.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a perspective view showing the rear side of an electronic device shown in FIG. 2, according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view showing the front of an electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0012] FIG. 5 is an exploded perspective view showing the rear side of an electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0013] FIG. 6 is a drawing showing the antenna structure of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 7 is a drawing showing the alignment state of the components of an antenna structure according to one embodiment of the present disclosure before they are joined or compressed.

[0015] FIG. 8 is a drawing showing the antenna structure of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 9 is an exploded perspective view showing the antenna structure of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 10 is a drawing showing a first graphite sheet of an antenna structure according to one embodiment of the present disclosure.

[0018] FIG. 11 is a drawing showing a second graphite sheet of an antenna structure according to one embodiment of the present disclosure.

[0019] FIG. 12 is a drawing showing a thermal conductive member of an antenna structure according to one embodiment of the present disclosure.

[0020] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0021] Users can perform internet browsing, listen to music or watch videos, and / or perform simple tasks while on the move, even while carrying only a single electronic device. To provide various functions while portable, electronic devices can become more miniaturized and possess advanced performance capabilities. As the performance of electronic devices advances, heat generation from electronic components, such as processors or communication modules, may increase. Heat accumulated inside electronic devices can degrade the operating environment. Therefore, heat dissipation and heat release components, such as vapor chambers or heat pipes, can be installed; however, integrating these components into miniaturized electronic devices may be challenging.

[0022] One embodiment of the present disclosure may provide an antenna structure capable of rapidly dispersing or releasing heat generated internally and / or an electronic device including the same, for at least resolving the problems and / or disadvantages described above and at least providing the advantages described below.

[0023] One embodiment of the present disclosure can provide an electronic device capable of securing a stable operating environment by rapidly dispersing or releasing heat generated internally.

[0024] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs from the description below.

[0025] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described herein may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0026] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0027] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0028] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In one embodiment, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In one embodiment, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0029] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0030] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0031] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0035] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0036] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0041] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0043] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified by the electronic device (101), an external electronic device (e.g., electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0046] An antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0047] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0048] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104 or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] The electronic device according to the embodiment(s) of the present disclosure may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of the present document is not limited to the devices described above.

[0051] The embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it may be understood that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0052] The term “module” as used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] Embodiments of the present disclosure may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., internal memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0054] According to one embodiment, the method according to the embodiment(s) of the present disclosure may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0055] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0056] In the following detailed description, the length direction, width direction, and / or thickness direction of the electronic device may be referred to, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be referred to together with the Cartesian coordinate system illustrated in the drawings. For example, the front of the electronic device and / or housing may be defined as the 'face facing the +Z direction', and the rear may be defined as the 'face facing the -Z direction'. In one embodiment, the side of the electronic device and / or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the Cartesian coordinate system described in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from the present disclosure.

[0057] FIG. 2 is a perspective view showing the front of an electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear of the electronic device (200) shown in FIG. 2 according to one embodiment of the present disclosure.

[0058] Referring to FIGS. 2 and FIGS. 3, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A) of FIG. 2, the second surface (210B) and the side (210C) of FIG. 3. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side structure (or "side bezel structure") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0059] Although not illustrated, the front plate (202) may include region(s) that are curved and seamlessly extended toward the rear plate (211) at least a portion of the edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the regions that are curved and extended toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). According to the embodiment, the front plate (202) or the rear plate (211) may be substantially flat in shape, in which case it may not include the curved and extended region. If it includes the curved and extended region, the thickness of the electronic device (200) in the portion containing the curved and extended region may be smaller than the thickness of the other portion.

[0060] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light-emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0061] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) or through a portion of the side (210C). In one embodiment, the corners of the display (201) may be formed to be generally the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), to expand the area where the display (201) is exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be generally the same.

[0062] In one embodiment (not shown), a recess or opening is formed in a part of the screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen. In one embodiment, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in areas (or spaces) that overlap with the display (201).

[0063] According to one embodiment, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0064] According to one embodiment, the sensor module (204, 219) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the second surface (210B) or side (210C) as well as on the first surface (210A) (e.g., display (201)) of the housing (210). The electronic device (200) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] According to one embodiment, the camera module (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the image signal processor may be implemented as part of the processor (120) of FIG. 1. In one embodiment, the image signal processor may be implemented in a component disposed separately from the processor (120) of FIG. 1. For example, the electronic device (200) may include at least one processor, and when it includes multiple processors, the image signal processor may be mounted in a component separate from the other processors. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device (200). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by an object may be received through a third sensor module (219). The electronic device (200) or the processor of the electronic device (200) may detect depth information of the object based on the time when the infrared light is received by the third sensor module (219).

[0066] According to one embodiment, a key input device (217) may be disposed on a side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may include a sensor module disposed on a second side (210B) of the housing (210).

[0067] According to one embodiment, the light-emitting element (206) may be disposed, for example, on a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (200) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of a camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0068] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0069] FIG. 4 is an exploded perspective view showing the front of an electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0070] Referring to FIGS. 4 and FIGS. 5, an electronic device (300) (e.g., electronic device (200) of FIG. 2 or FIG. 3) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., front plate (202) of FIG. 2), a display (330) (e.g., display (201) of FIG. 2), a printed circuit board (or board assembly) (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., rear plate (211) of FIG. 3). In one embodiment, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0071] According to one embodiment, the first support member (311) may be provided in a flat shape at least partially. In one embodiment, the first support member (311) may be placed inside the electronic device (300) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed, for example, together with the side structure (310), from a metal material and / or a non-metal (e.g., polymer) material. When formed at least partially from a metal material, a part of the side structure (310) or the first support member (311) may function as an antenna. The first support member (311) may have a display (330) attached to one side and a printed circuit board (340) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0072] According to one embodiment, the first support member (311) and the side structure (310) may be combined and referred to as a front case or housing (301). According to one embodiment, the housing (301) may be understood as a structure for generally accommodating, protecting, or housing a printed circuit board (340) or a battery (350). In one embodiment, the housing (301) may be understood to include a structure that a user can visually or tactilely perceive from the exterior of the electronic device (300), such as a side structure (310), a front plate (320), and / or a rear plate (380). For example, the housing (301) may substantially be a structure that forms or provides the exterior of the electronic device (300). In one embodiment, the phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3) and can function as a structure for positioning electrical / electronic components such as a printed circuit board (340) or a camera assembly (307).

[0073] Memory may include, for example, volatile memory or non-volatile memory.

[0074] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0075] According to one embodiment, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be positioned to surround the printed circuit board (340) together with a part of the first support member (311). A circuit device (e.g., a processor, a communication module, or a memory) implemented in the form of an integrated circuit chip or various electrical / electronic components may be placed on the printed circuit board (340), and according to an embodiment, the printed circuit board (340) may be provided with an electromagnetic shielding environment from the upper support member (360a). In one embodiment, the lower support member (360b) may be utilized as a structure capable of placing electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not shown. In this case, the lower support member (360b) may be placed to wrap around the additional printed circuit board together with another part of the first support member (311). The speaker module or interface placed on the additional printed circuit board not shown or on the lower support member (360b) may be placed corresponding to the audio module (207) or connector holes (208, 209) of FIG. 2.

[0076] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the printed circuit board (340). The battery (350) may be disposed integrally inside the electronic device (300) or may be disposed detachably from the electronic device (300).

[0077] In one embodiment, the electronic device (300) and / or antenna may include an antenna structure (309) disposed between the rear plate (380) and the battery (350). In one embodiment, the antenna structure (309) may include an electrically conductive pattern formed on the surface of a thin film. For example, the antenna structure (309) may be understood to be in the form of a film, a sheet, and / or a plate. In one embodiment, the antenna structure (309) may include a coil antenna or a loop antenna. For example, the antenna structure (309) may include a conductive pattern of a coil structure or a loop structure. The antenna structure (309) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna structure (309) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the electronic device (300) may include an antenna implemented on the surface of a second support member (360) through, for example, a laser direct structuring method. In one embodiment, a different antenna structure may be formed by a part or combination thereof of the side structure (310) and / or the first support member (311).

[0078] According to one embodiment, the camera assembly (307) may include at least one camera module, for example, at least one of the camera modules (212, 213) of FIG. 3. Inside the electronic device (300), the camera assembly (307) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be placed on a first support member (311) at a location adjacent to a printed circuit board (340). In one embodiment, the camera module(s) of the camera assembly (307) may be largely aligned with any one of the camera windows (312, 313, 319) and may be wrapped at least partially in a second support member (360) (e.g., an upper support member (360a)). In positioning the camera assembly (307) or the camera module (212, 213) of FIG. 3, the electronic device (300) or the first support member (311) may include at least one structure such as a support wall or an elastic member to mount or fix the camera assembly (307).

[0079] FIG. 6 is a drawing showing an antenna structure (409) (e.g., antenna structure (309) of FIG. 4 or FIG. 5) of an electronic device according to one embodiment of the present disclosure (e.g., electronic device (101, 102, 104, 200, 300) of FIG. 1 to 5). FIG. 7 is a drawing showing the alignment state of the components of the antenna structure (409) according to one embodiment of the present disclosure before they are joined or compressed. FIG. 6 may be a drawing showing a cut along line A-A' in the heat-conducting member (491) and / or the first antenna member (495a) shown in FIG. 12, for example.

[0080] Referring to FIGS. 6 and 7, the antenna structure (409) may include a thermal conductive member (491), a shielding sheet (493), and / or at least one antenna member (495a). The thermal conductive member (491) may include, for example, a first region (A1) having a first thickness (T1) and a second region (A2) having a second thickness (T2). In one embodiment, a first portion of the thermal conductive member (491) may be described as being provided in the first region (A1) having a first thickness (T1), and a second portion of the thermal conductive member (491) may be described as being provided in the second region (A2) having a second thickness (T2). In one embodiment, the second thickness (T2) may be greater than the first thickness (T1), and the antenna member (495a) may be substantially disposed in the first region (A1). In the illustrated embodiment, the heat-conducting member (491) may be exemplified as a structure in which graphite sheets (491a, 491b) having different areas are bonded. However, it should be noted that the embodiment(s) of the present disclosure are not limited thereto. For example, the heat-conducting member (491) may be implemented by a single sheet processed to have partially different thicknesses. In one embodiment, an additional graphite sheet disposed within the second region (A2) may be provided so that the thickness of the second region (A2) may be adjusted (or increased).

[0081] In one embodiment, the antenna structure (409) may further include a first adhesive layer (499a) disposed between a heat-conducting member (491) and a shielding sheet (493). For example, the shielding sheet (493) may be attached to one side of the heat-conducting member (491) by the first adhesive layer (499a). In one embodiment, the antenna structure (409) may further include a reinforcing member (492a) disposed between an antenna member (495a) and a second region (A2). The reinforcing member (492a) may, for example, maintain or improve the strength of the antenna structure (409). In one embodiment, the antenna structure (409) further comprises cover films (497; 497a, 497b) to prevent the thermal conductive member (491), shielding sheet (493), and / or antenna member (495a) from coming into direct contact with other structures within the electronic device (e.g., the electronic device (300) of FIG. 5). In one embodiment, among the cover films (497; 497a, 497b), the second cover film (497b) may be attached to the antenna member (495a) and / or shielding sheet (493) by a third adhesive layer (499c).

[0082] According to one embodiment, the antenna structure (409) and / or the thermal conductive member (491) may absorb, move, disperse, and / or release heat by including a thermally conductive material, e.g., graphite. For example, when placed inside an electronic device (e.g., the electronic device (300) of FIG. 4 or FIG. 5), the antenna structure (409) and / or the thermal conductive member (491) may absorb heat generated in some space and move or disperse it to a wider area or space. It has been previously mentioned that when heat generated in electronic components, such as a processor (e.g., the processor (120) of FIG. 1) or a communication module (e.g., the communication module (190) of FIG. 1), accumulates, the operating environment of the electronic component may degrade. In the embodiments of the present disclosure, the antenna structure (409) may rapidly move, disperse, and / or release heat generated inside the electronic device (300) by including the thermal conductive member (491).

[0083] According to one embodiment, the heat-conducting member (491) may be a film, sheet, and / or plate comprising graphite. In one embodiment, the heat-conducting member (491) may include a first graphite sheet (491a) and a second graphite sheet (491b). In one embodiment, the first graphite sheet (491a) may provide a first region (A1) and a second region (A2), and the second graphite sheet (491b) may provide a second region (A2). In one embodiment, the first graphite sheet (491a) may be described as being disposed over at least a portion of the first region (A1) and at least a portion of the second region (A2), and the second graphite sheet (491b) may be described as being disposed over at least a portion of the second region (A2) while being disposed over a portion of the first graphite sheet (491a). For example, the first thickness (T1) may be the thickness of the first graphite sheet (491a), and the second thickness (T2) may be the sum of the thickness of the first graphite sheet (491a) and the thickness of the second graphite sheet (491b). For convenience of explanation, a configuration in which the thermal conductive member (491) comprises two graphite sheets (491a, 491b) is illustrated, but note that the embodiment(s) of the present disclosure are not limited thereto. For example, as previously mentioned, the thermal conductive member (491) may be implemented by a single sheet processed to have partially different thicknesses, and / or by a combination of three or more graphite sheets.

[0084] According to one embodiment, the antenna structure (409) and / or the thermal conductive member (491) may further include a second adhesive layer (499b). In one embodiment, when the thermal conductive member (491) includes a plurality of graphite sheets (491a, 491b), the graphite sheets (491a, 491b) may be bonded by providing the second adhesive layer (499b)(s). For example, the second adhesive layer (499b) may be placed between the first graphite sheet (491a) and the second graphite sheet (491b). In one embodiment, when the second adhesive layer (499b) is provided, the second thickness (T2) may be the sum of the thickness of the first graphite sheet (491a), the thickness of the second graphite sheet (491b), and the thickness of the second adhesive layer (499b). In one embodiment, the second region (A2) and / or the second graphite sheet (491b) may expand the volume or surface area of ​​the heat-conducting member (491) in the space where the antenna member (495a) is not placed. For example, by expanding the volume or surface area of ​​the heat-conducting member (491) through the second region (A2) and / or the second graphite sheet (491b), the antenna structure (409) and / or the heat-conducting member (491) may be able to absorb, move, and / or dissipate heat more quickly.

[0085] According to one embodiment, the shielding sheet (493) may be disposed on one side of the heat-conducting member (491) from at least a portion of the first region (A1) to at least a portion of the second region (A2). For example, the shielding sheet (493) may be attached to one side of the heat-conducting member (491) by a first adhesive layer (499a). In one embodiment, the shielding sheet (493) may be disposed substantially over the entire first region (A1) and the entire second region (A2). The shielding sheet (493) may include an electromagnetic shielding material, for example, ferrite. In one embodiment, the shielding sheet (493) may provide an electromagnetic shielding environment during the transmission and reception of wireless power or wireless communication operation through the antenna member (495a). For example, the shielding sheet (493) can stabilize the operating environment of the antenna member (495a) and / or suppress the electromagnetic field generated when the antenna member (495a) operates from interfering with the operation of other parts of the electronic device.

[0086] According to one embodiment, the shielding sheet (493) may be positioned at an angle with respect to the heat-conducting member (491) and / or antenna member (495a) at the boundary portion between the first region (A1) and the second region (A2). For example, a portion of the shielding sheet (493) may be positioned at an angle by making the second region (A2) of the coil antenna assembly or the heat-conducting member (491) thicker than the first region (A1). In one embodiment, the portion of the shielding sheet (493) positioned at an angle with respect to the heat-conducting member (491) may be referred to as the 'angled portion (IP)'. The angled portion (IP) may exemplify, for example, the shape (or arrangement state) of the shielding sheet (493) according to the thickness difference between the first region (A1) and the second region (A2). In one embodiment, the inclined portion (IP) can be understood as a structure that provides an environment for expanding the volume or surface area of ​​the heat-conducting member (491) within the antenna structure (409). For example, when the antenna member (495a) is placed on the upper surface of the shielding sheet (493) on one side of the inclined portion (IP), a space for expanding the thickness of the heat-conducting member (491) can be realized on the lower surface of the shielding sheet (493) on the other side of the inclined portion (IP). When viewed in terms of placement on the electronic device (300), the antenna member (495a) can be described as being placed on the lower surface of the shielding sheet (493), and a space for expanding the thickness of the heat-conducting member (491) realized on the upper surface of the shielding sheet (493).

[0087] According to one embodiment, the antenna member (495a) may include a conductive pattern printed on the surface of an insulating film or a dielectric film. In one embodiment, the antenna member (495a) may include a coil antenna. When the antenna member (495a) includes a coil antenna, the antenna structure (409) (e.g., the antenna structure (309) of FIG. 4) may be referred to as a coil antenna assembly. In one embodiment, the antenna member (495a) of FIG. 6 may be described as a first antenna member (495a) in the embodiment of FIG. 9. In one embodiment, the conductive pattern may implement a coil antenna or a loop antenna. For example, the antenna structure (409) and / or the antenna member (495a) may include a coil antenna or a loop antenna. In one embodiment, the antenna member (495a) may transmit or receive a wireless signal or generate an induced current based on an external electromagnetic field. When generating an induced current based on an external electromagnetic field, the antenna member (495a) may be described as an antenna that receives power wirelessly. In one embodiment, the antenna member (495a) may generate an electromagnetic field by receiving a current. The electromagnetic field generated by the antenna member (495a) may cause an adjacent other antenna (or other electronic device) to generate an induced current. When generating an electromagnetic field by receiving a current, the antenna member (495a) may be described as an antenna that transmits power wirelessly.

[0088] According to one embodiment, the antenna member (495a) may be placed in a first area (A1) on one side of the heat-conducting member (491). For example, the antenna member (495a) may be manufactured to be substantially the same size as the first area (A1) or smaller than the first area (A1). Here, the sizes of the antenna member (495a) and the first area (A1) may describe or compare the area when the antenna member (495a) is viewed in a planar view. Considering manufacturing tolerances or assembly tolerances, the antenna member (495a) may be smaller than the first area (A1). For example, when placed on the shielding sheet (493) or the heat-conducting member (491), the antenna member (495a) may be placed at a specified distance (G) from the second area (A2). In one embodiment, on one side of the heat-conducting member (491), the antenna member (495a) may be described as being positioned on one side of the second region (A2) or the second graphite sheet (491b). In one embodiment, since it is manufactured with a size that takes into account manufacturing tolerances or assembly tolerances, the gap (G) between the antenna member (495a) and the second region (A2) may vary slightly depending on the actual manufactured product. In one embodiment, the inclined portion (IP) of the shielding sheet (493) may be substantially implemented in the gap (G) between the antenna member (495a) and the second region (A2).

[0089] According to one embodiment, the gap (G) between the antenna member (495a) and the second region (A2) may be greater than the thickness of the shielding sheet (493). For example, the gap (G) between the antenna member (495a) and the second region (A2) may be approximately 4.5 times or more and approximately 5.5 times or less the thickness of the shielding sheet (493). In one embodiment, the gap (G) between the antenna member (495a) and the second region (A2) may be proportional to the thickness of the shielding sheet (493). In one embodiment, the gap (G) between the antenna member (495a) and the second region (A2) may be selected to be within approximately 0.6 mm. It should be noted that the numerical value regarding the gap (G) between the antenna member (495a) and the second region (A2) is mentioned merely as an example to aid in understanding the embodiment(s) of the present disclosure, and the embodiment(s) of the present disclosure are not limited thereto. For example, when there is a manufacturing tolerance allowed for the antenna member (495a) and the second region (A2) or an assembly tolerance allowed for the placement of the antenna member (495a), the gap (G) between the antenna member (495a) and the second region (A2) in the actual manufactured product may be approximately twice the thickness of the shielding sheet (493). In one embodiment, when there is a manufacturing tolerance allowed for the antenna member (495a) and the second region (A2) or an assembly tolerance allowed for the placement of the antenna member (495a), the gap (G) between the antenna member (495a) and the second region (A2) in the actual manufactured product may reach approximately eight times the thickness of the shielding sheet (493). In one embodiment, the gap (G) between the antenna member (495a) and the second region (A2) can be determined by considering the space for implementing or placing the inclined portion (IP) of the shielding sheet (493) and / or the thickness of the second region (A2) (e.g., second thickness (T2)).

[0090] According to one embodiment, the difference between the second thickness (T2) and the first thickness (T1) of the heat-conducting member (491) may be equal to or smaller than the thickness of the antenna member (495a) (e.g., third thickness (T3)). In one embodiment, the heat-conducting member (491) may be implemented to be thicker within the thickness range of the antenna member (495a) in an area where the antenna member (495a) is not placed, thereby being more useful for absorbing, moving, or dispersing heat. For example, the heat dissipation performance of the antenna structure (409) and / or the heat-conducting member (491) may be improved by expanding the volume of the heat-conducting member (491) in an area or space where the antenna member (495a) is not placed, without affecting the thickness of the antenna structure (409). Thus, even if additional wireless communication frequency bands are secured or wireless power transmission and reception functions are added, miniaturization of the electronic device can be facilitated, and the antenna structure (409) can contribute to stabilizing the operating environment of the electronic device by functioning as a heat dissipation structure.

[0091] According to one embodiment, the cover films (497a, 497b) may include a first cover film (497a) disposed on the other side of the heat-conducting member (491) and a second cover film (497b) disposed on one side of the heat-conducting member (491). For example, the heat-conducting member (491) may be disposed between the shielding sheet (493) and the first cover film (497a), and the shielding sheet (493) may be disposed between the heat-conducting member (491) and the second cover film (497b). As previously mentioned, the cover films (497a, 497b) can prevent components such as the heat-conducting member (491), the shielding sheet (493), and / or the antenna member (495a) from mechanically interfering with other structures of the electronic device (300). In one embodiment, cover films (497a, 497b) may function as electrical insulation structures for components such as a heat-conducting member (491), a shielding sheet (493), and / or an antenna member (495a). In one embodiment, the antenna structure (409) may further include a third adhesive layer (499c). The third adhesive layer (499c) may, for example, attach a portion of the second cover film (497b) to the antenna member (495a) and attach another portion of the second cover film (497b) to the shielding sheet (493). In one embodiment, an additional adhesive layer may be provided when the first cover film (497a) is placed on the other side of the heat-conducting member (491).

[0092] According to one embodiment, the cover films (497a, 497b) may be made of a sponge or a synthetic resin film. In one embodiment, when the cover films (497a, 497b) are made of a synthetic resin film such as PET (polyethylene terephthalate), the shape of the antenna structure (409) can be stably maintained. In one embodiment, when the cover films (497a, 497b) are made of a low-density elastomer such as a sponge, the antenna structure (409) can be stably placed or assembled inside the electronic device (300) even if manufacturing tolerances or assembly tolerances exist. In one embodiment, one of the cover films (497a, 497b) may be made of a synthetic resin film and the other of the cover films (497a, 497b) may be made of a low-density elastomer. For example, when the first cover film (497a) is made of PET, the second cover film (497b) can be made of sponge.

[0093] According to one embodiment, with reference to FIG. 7, after aligning or placing prepared heat-conducting members (491) (e.g., first graphite sheet (491a) and second graphite sheet (491b)), shielding sheet (493), antenna member (495a), and / or cover films (497a, 497b) in appropriate positions, an antenna structure (409) can be assembled or fabricated by compression. In FIG. 7, an arrow indicated by 'PF' may illustrate the direction in which a force is applied to compress the prepared heat-conducting members (491) (e.g., first graphite sheet (491a) and second graphite sheet (491b)), shielding sheet (493), antenna member (495a), and / or cover films (497a, 497b), for example. When the antenna structure (409) further includes a reinforcing member (492a), the reinforcing member (492a) may be placed between the shielding sheet (493) and the heat-conducting member (491). As will be seen with reference to FIG. 8, the antenna structure (409) may include a reinforcing member (492b) placed between the shielding sheet (493) and the second cover film (497b). The reinforcing member (492a) of FIG. 6 or FIG. 7 may be placed, for example, in the first region (A1). The compression process may be performed, for example, using a press machine or a roller machine. Prior to the compression process, the heat-conducting members (491) (e.g., the first graphite sheet (491a) and the second graphite sheet (491b)), the shielding sheet (493), and / or the cover films (497a, 497b) may be substantially flat in shape, and in the process of manufacturing the antenna structure (409), the shielding sheet (493) may be deformed into a shape including an inclined portion (IP).

[0094] FIG. 8 is a drawing showing an antenna structure (409) of an electronic device according to one embodiment of the present disclosure (e.g., the electronic devices of FIG. 1 to 5 (101, 102, 104, 200, 300)).

[0095] Referring to FIG. 6 or FIG. 8, an empty space may be created on one side of the second region (A2) or on one side of the antenna member (495a) by the inclined portion (IP) of the shielding sheet (493). For example, in the gap (G) between the antenna member (495a) and the second region (A2) (or the second graphite sheet (491b)), the rigidity of the antenna structure (409) may be reduced compared to other parts. According to one embodiment, the reinforcing members (492a, 492b) of FIG. 6 or FIG. 8 may be placed substantially in the gap between the antenna member (495a) and the second region (A2) (or the second graphite sheet (491b)). For example, the reinforcing members (492a, 492b) are placed in the empty space on one side of the second area (A2) or in the empty space on one side of the antenna member (495a), thereby maintaining or improving the rigidity of the antenna structure (409) in the section where the inclined portion (IP) is placed.

[0096] In describing the embodiments described below, reference numbers in the drawings may be assigned identically or omitted for configurations that can be easily understood through the prior embodiments, and detailed descriptions thereof may be omitted. For example, descriptions regarding omitted reference numbers or components may be applied mutatis mutandis to the descriptions in the prior embodiments. Even if not directly mentioned, additional embodiments may be implemented by selectively combining the configurations of the prior embodiments and the embodiments described below.

[0097] FIG. 9 is an exploded perspective view showing an antenna structure (409) (e.g., antenna structure (309, 409) of FIG. 4 to 8) of an electronic device according to one embodiment of the present disclosure (e.g., electronic device (101, 102, 104, 200, 300) of FIG. 1 to 5).

[0098] Referring to FIG. 9, the antenna structure (409) may include a heat-conducting member (491; 491a, 491b), a shielding sheet (493), antenna members (495; 495a, 495b), and / or cover films (497a, 497b). In one embodiment, components arranged facing each other may be joined together by an adhesive material (e.g., adhesive layers (499a, 499b, 499c) of FIG. 6). Depending on the specifications of the first region (A1) and the antenna members (495; 495a, 495b) (e.g., the first antenna member (495a)), the reinforcing member (492a, 492b) of FIG. 6 or FIG. 8 may be omitted. For example, when the thickness of the heat-conducting member (491) is partially implemented differently and a portion of the shielding sheet (493) is positioned at an angle corresponding to the partial thickness difference of the heat-conducting member (491), the remaining configuration of the antenna structure (409) can be implemented in various ways. In one embodiment, the first cover film (497a) and the first adhesive layer (499a) may provide a structure that encapsulates the heat-conducting member (491). For example, even if there is partial damage or breakage of the heat-conducting member (491), the first cover film (497a) and the first adhesive layer (499a) may function as a structure that prevents foreign substances from dispersing outside the antenna structure (409). This encapsulating structure may be provided as a structure separate from the first cover film (497a) or the first adhesive layer (499a). In one embodiment, when implemented by the first cover film (497a) and the first adhesive layer (499a), the manufacturing of the antenna structure (409) can be facilitated and the manufacturing cost reduced.

[0099] According to one embodiment, the heat-conducting member (491) may include a first graphite sheet (491a) and a second graphite sheet (491b). The first graphite sheet (491a) may provide, for example, a first region (A1) and a second region (A2) of the heat-conducting member (491), and the second graphite sheet (491b) may provide a second region (A2) of the heat-conducting member (491). Referring to FIG. 9, it can be seen that the first region (A1) and the second region (A2) of the heat-conducting member (491) are more clearly distinguished by the second graphite sheet (491b). In one embodiment, the second graphite sheet (491b) may define at least a portion of the opening corresponding to the first region (A1). For example, the second graphite sheet (491b) may have a shape generally identical to the first graphite sheet (491a) but may provide an opening that penetrates both sides, thereby defining a first region (A1) of the heat-conducting member (491) on the first graphite sheet (491a). Thus, the thickness of the first region (A1) of the heat-conducting member (491) may be the thickness of the first graphite sheet (491a), and the thickness of the second region (A2) of the heat-conducting member (491) may be the sum of the thickness of the first graphite sheet (491a) and the thickness of the second graphite sheet (491b).

[0100] According to one embodiment, the shielding sheet (493) may have a shape corresponding to the heat-conducting member (491) (e.g., the first graphite sheet (491a)). When the shielding sheet (493) is compressed while placed on one side of the heat-conducting member (491), a portion of the shielding sheet (493) in the first region (A1) may be attached to the first graphite sheet (491a), and another portion of the shielding sheet (493) may be attached to the second region (A2) (e.g., the second graphite sheet (491b)). In one embodiment, after being attached to the heat-conducting member (491), a portion of the shielding sheet (493) (e.g., the inclined portion (IP) in FIG. 6) may be positioned at an angle with respect to the heat-conducting member (491).

[0101] According to one embodiment, the illustrated antenna structure (409) may include a plurality of antenna members (495a, 495b). Among the plurality of antenna members (495a, 495b), the first antenna member (495a) may include, for example, a coil antenna or a loop antenna implemented in the form of a film, as the antenna member (495a) of FIG. 6. In one embodiment, the first antenna member (495a) may be disposed on one side of the shielding sheet (493) in a first region (A1) of the heat-conducting member (491). In one embodiment, the first antenna member (495a) may be described as being disposed corresponding to an opening (A1) defined by the second graphite sheet (491b). For example, on one side of the first graphite sheet (491a), the first antenna member (495a) and the second graphite sheet (491b) may be arranged side by side with respect to one side of each other. In one embodiment, it may be understood that the first antenna member (495a) and the second graphite sheet (491b) are arranged side by side with respect to one side of the inclined portion of the shielding sheet (493) (e.g., the inclined portion (IP) of FIG. 6). In one embodiment, among the plurality of antenna members (495a, 495b), the second antenna member (495b) may be arranged on one side of the first antenna member (495a). For example, the antenna members (495a, 495b) may be located at least partially on the same plane and may be arranged on one side of the shielding sheet (493). Similar to including an opening that implements the first region (A1), the second graphite sheet (491b) may further provide another opening into which the second antenna member (495b) is disposed. In one embodiment, when the second antenna member (495b) is thinner than the first antenna member (495a), a third graphite sheet thinner than the first graphite sheet (491a) or the second graphite sheet (491b) may be provided facing the second antenna member.For example, the heat-conducting member (491) may provide a placement area corresponding to the shape and thickness of the first antenna member (495a) or the second antenna member (495b).

[0102] According to one embodiment, one of the antenna members (495a, 495b) may provide a wireless power transmission and reception function, and the other may provide a wireless communication function. For example, the first antenna member (495a) may provide a wireless power transmission and reception function, and the second antenna member (495b) may provide an NFC function. In one embodiment, one of the antenna members (495a, 495b) may further provide an MST function. In one embodiment, the shielding sheet (493) may electromagnetically shield the space (or area) where the antenna members (495a, 495b) are placed from other spaces within the electronic device. For example, the antenna members (495a, 495b) are provided with an environment electromagnetically isolated by the shielding sheet (493), and the electromagnetic field generated from the operation of the antenna members (495a, 495b) may be suppressed from interfering with components in other spaces within the electronic device.

[0103] According to one embodiment, cover films (497a, 497b) are positioned at the outermost edge of the antenna structure (409) to suppress or mitigate exposure of the heat-conducting member (491), shielding sheet (493), and / or antenna members (495a, 495b) to the external environment. For example, the cover films (497a, 497b) can suppress contact between the heat-conducting member (491), shielding sheet (493), and / or antenna members (495a, 495b) and an external mechanical structure. In one embodiment, the cover films (497a, 497b) may be made of a low-density elastomer or a synthetic resin film. The material of the cover films (497a, 497b) may be appropriately selected according to the environment of the space where the antenna structure (409) is to be placed or the specifications of the electronic device to be actually manufactured.

[0104] Referring together to the electronic device (300) of FIG. 4, the antenna structure (409) may be positioned at least partially between the back plate and the battery. In one embodiment, a portion of the antenna structure (409) (e.g., the antenna structure (309) of FIG. 4) may be positioned between the circuit board (e.g., the printed circuit board (340) of FIG. 4) and the back plate. For example, when the first antenna member (495a) of FIG. 9 is defined as being positioned partially facing the battery (e.g., the battery (350) of FIG. 4), the second antenna member (495b) of FIG. 9 may be described as being positioned partially facing the printed circuit board (340). In one embodiment, by including a thermal conductive member (491) such as graphite, the antenna structure (409) and / or the thermal conductive member (491) may function as a heat dissipation structure that absorbs heat within the electronic device (300) or moves or disperses the absorbed heat to other areas. In one embodiment, when a portion of the antenna structure (409) is placed between a circuit board (e.g., printed circuit board (340)) and a back plate (e.g., back plate (380) of FIG. 4) and another portion of the antenna structure (409) is placed between a battery (350) and a back plate (380), the antenna structure (409) and / or the heat-conducting member (491) can transfer or distribute heat between the area where the printed circuit board (340) is placed and the area where the battery (350) is placed.

[0105] According to one embodiment, when the printed circuit board (340) of FIG. 4 includes a heat-generating component such as a processor or a communication module, and a part of the antenna structure (409) is placed between the printed circuit board (340) and the back plate (380), the antenna structure (409) can absorb heat generated on the printed circuit board (340) and move, disperse, or diffuse it to another area inside the electronic device (300) (e.g., an area where the battery (350) is placed). For example, even if heat is generated in some parts of the electronic device (300), the electronic device (300) can secure or maintain a stable operating environment by using the antenna structure (409) to suppress the accumulation of heat around the heat-generating component. In one embodiment, components placed on the printed circuit board (340) may generate more heat than the battery (350), and the antenna structure (409) may absorb the heat generated in the area where the printed circuit board (340) is placed and move or disperse it to the area where the battery (350) is placed.

[0106] FIG. 10 is a drawing showing a first graphite sheet (491a) of an antenna structure (409) according to one embodiment of the present disclosure. FIG. 11 is a drawing showing a second graphite sheet (491b) of an antenna structure (409) according to one embodiment of the present disclosure. FIG. 12 is a drawing showing a thermal conductive member (491) of an antenna structure (409) according to one embodiment of the present disclosure. In the embodiments of FIG. 10 to FIG. 12, the shielding sheet (493) or the antenna member is omitted so as to describe the region(s) where an antenna member (e.g., a first antenna member (495a)) is disposed on the thermal conductive member (491).

[0107] Referring to FIGS. 10 to 12, the thermal conductive member (491) comprises a first graphite sheet (491a) and a second graphite sheet (491b), and may include a first antenna member (495a) disposed in an opening formed in the second graphite sheet (491b), for example, a first region (A1). In one embodiment, when an inclined portion of the shielding sheet (493) (e.g., the inclined portion (IP) of FIG. 6) is provided, a certain gap is formed between the first graphite sheet (491a) and the shielding sheet (493), thereby allowing the thermal conductive member (491) to be made thicker. For example, in an area where the first antenna member (495a) is not placed, the second graphite sheet (491b) is placed between the first graphite sheet (491a) and the shielding sheet (493), thereby improving the heat dissipation performance of the heat-conducting member (491). In the illustrated embodiment, when the area of ​​the first graphite sheet (491a) is defined as approximately 3360 mm², the second area (A2) or the second graphite sheet (491b) may have an area of ​​approximately 2250 mm². The figures mentioned in describing this embodiment are merely for illustrative purposes and may be implemented differently depending on the specifications of the electronic device (300) and / or antenna structure (409) to be actually manufactured. In the embodiment illustrated in FIG. 12, the portion of the first graphite sheet (491a) that is not covered by the second graphite sheet (491b) may be positioned facing or adjacent to any one of the heat-generating components (e.g., a speaker).

[0108] As described above, one embodiment of the present disclosure implements a shielding sheet (e.g., a shielding sheet (493) of FIG. 6 or FIG. 9) to include an inclined portion (e.g., an inclined portion (IP) of FIG. 6), and by extending the thickness of a thermal conductive member (e.g., a thermal conductive member (491) of FIG. 6 or FIG. 9) in an area where an antenna member (e.g., an antenna member (495a) of FIG. 6 or FIG. 9) is not placed, the heat dissipation performance of the thermal conductive member and / or antenna structure (e.g., an antenna structure (309, 409) of FIG. 5, FIG. 6 or FIG. 9) may be improved. In one embodiment, the thickness of the antenna structure may not be increased by making the extended thickness of the thermal conductive member substantially smaller than the thickness of the antenna member. For example, an antenna structure according to the embodiment(s) of the present disclosure can be mounted on a miniaturized electronic device to secure an additional wireless communication band or provide wireless power transmission and reception functions, while rapidly dispersing or releasing heat generated inside the electronic device. Thus, the electronic device can provide an electronic device capable of securing a stable operating environment.

[0109] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description of the above-described embodiment(s).

[0110] As described above, according to one embodiment of the present disclosure, a coil antenna assembly (e.g., antenna structure (309, 409) of FIGS. 4 to 6) for transmitting and / or receiving a wireless signal through one surface of an electronic device may include a heat-conducting member comprising a first portion having a first thickness (T1) in a first region (A1) of the coil antenna assembly and a second portion having a second thickness (T2) greater than the first thickness in a second region (A2) of the coil antenna assembly, a shielding sheet disposed extending from at least a portion of the first region to at least a portion of the second region, and an antenna member (495a) disposed in the first region (A1) of the coil antenna assembly. In one embodiment, in a first region (A1) of the coil antenna assembly, a portion of the shielding sheet is disposed between a first portion of the heat-conducting member and the antenna member, and in a second region (A2) of the coil antenna assembly, the antenna member is not disposed, and a portion (IP) of the shielding sheet may be disposed at an angle at the boundary between the first region and the second region due to a second portion of the heat-conducting member that is thicker than the first portion.

[0111] According to one embodiment, the difference between the second thickness and the first thickness may be equal to or smaller than the thickness (T3) of the antenna member.

[0112] According to one embodiment of the present disclosure, a coil antenna assembly (e.g., antenna structure (309, 409) of FIGS. 4 to 6) for transmitting and / or receiving a wireless signal through one surface of an electronic device may include a heat-conducting member comprising a first portion having a first thickness (T1) in a first region (A1) of the coil antenna assembly and a second portion having a second thickness (T2) greater than the first thickness in a second region (A2) of the coil antenna assembly, a shielding sheet disposed extending from at least a portion of the first region to at least a portion of the second region, and an antenna member (495a) disposed in the first region (A1) of the coil antenna assembly. In one embodiment, in a first region (A1) of the coil antenna assembly, a portion of the shielding sheet is disposed between a first portion of the heat-conducting member and the antenna member, and in a second region (A2) of the coil antenna assembly, the antenna member is not disposed, and a portion (IP) of the shielding sheet may be disposed at an angle at the boundary between the first region and the second region due to a second portion of the heat-conducting member that is thicker than the first portion.

[0113] According to one embodiment, the difference between the second thickness and the first thickness may be equal to or smaller than the thickness (T3) of the antenna member.

[0114] According to one embodiment, the antenna member may include a coil antenna or a loop antenna.

[0115] According to one embodiment, the coil antenna assembly described above may further include a first adhesive layer (499a) disposed between the heat-conducting member and the shielding sheet.

[0116] According to one embodiment, the heat-conducting member may include a first graphite sheet (491a) disposed across at least a portion of the first region (A1) of the coil antenna assembly and at least a portion of the second region, and a second graphite sheet (491b) disposed on a portion of the first graphite sheet and disposed on at least a portion of the second region of the coil antenna assembly.

[0117] According to one embodiment, the antenna member may be disposed on one side of the second graphite sheet.

[0118] According to one embodiment, the heat-conducting member may further include a second adhesive layer (499b) disposed between the first graphite sheet and the second graphite sheet.

[0119] According to one embodiment, the coil antenna assembly described above may further include a reinforcing member (492a; 492b) disposed between the antenna member and the second graphite sheet.

[0120] According to one embodiment, the coil antenna assembly described above may further include a first cover film (497a) disposed on one side of the first graphite sheet, and a second cover film (497b) disposed facing the first cover film with the heat-conducting member in between.

[0121] According to one embodiment, the antenna member may be disposed between the shielding sheet and the second cover film.

[0122] According to one embodiment, the coil antenna assembly described above may further include a third adhesive layer. In one embodiment, the third adhesive layer may be configured to attach a portion of the second cover film to the antenna member and to attach another portion of the second cover film to the shielding sheet.

[0123] According to one embodiment, the second cover film may include a sponge or a synthetic resin film.

[0124] According to one embodiment of the present disclosure, an antenna structure (e.g., antenna structure (309, 409) of FIGS. 4 to 9) and / or an electronic device including the same (e.g., electronic device (101, 102, 104, 200, 300) of FIGS. 1 to 5) comprises a thermally conductive member (e.g., thermally conductive member (491) of FIG. 6 or 9) comprising a first region (e.g., first region (A1) of FIG. 6 or 9) having a first thickness (e.g., first thickness (T1) of FIG. 6) and a second region (e.g., second region (A2) of FIG. 6 or 9) having a second thickness (e.g., second thickness (T2) of FIG. 6) greater than the first thickness (T1), and a shielding sheet disposed on one surface of the thermally conductive member extending from at least a portion of the first region to at least a portion of the second region (e.g., FIG. It may include a shielding sheet (493) of FIG. 6 or FIG. 9, and an antenna member (e.g., antenna member (495a) of FIG. 6 or FIG. 9) disposed in the first region facing the heat-conducting member with a portion of the shielding sheet in between. In one embodiment, at the boundary between the first region and the second region, a portion of the shielding sheet (e.g., the inclined portion (IP) of FIG. 6) may be disposed at an angle with respect to the heat-conducting member or the antenna member.

[0125] According to one embodiment, the difference between the second thickness and the first thickness may be equal to or smaller than the thickness of the antenna member (e.g., the third thickness (T3) of FIG. 6).

[0126] According to one embodiment, the antenna member may include a coil antenna or a loop antenna.

[0127] According to one embodiment, the antenna structure and / or electronic device including the above may further include a first adhesive layer (e.g., the first adhesive layer (499a) of FIG. 6) disposed between the thermal conductive member and the shielding sheet.

[0128] According to one embodiment, the heat-conducting member may include a first graphite sheet (e.g., the first graphite sheet (491a) of FIG. 6 or FIG. 9) providing the first region and the second region, and a second graphite sheet (e.g., the second graphite sheet (491b) of FIG. 6 or FIG. 9) disposed on the first graphite sheet to provide the second region.

[0129] According to one embodiment, the antenna member may be disposed on one side of the second graphite sheet.

[0130] According to one embodiment, the heat-conducting member may further include a second adhesive layer (e.g., the second adhesive layer (499b) of FIG. 6) disposed between the first graphite sheet and the second graphite sheet.

[0131] According to one embodiment, the antenna structure and / or electronic device including the above may further include a reinforcing member disposed between the antenna member and the second graphite sheet (e.g., reinforcing member (492a, 492b) of FIGS. 6 and 7).

[0132] According to one embodiment, the antenna structure and / or electronic device including the above may further include a first cover film disposed on the other side of the heat-conducting member (e.g., the first cover film (497a) of FIG. 6 or FIG. 9), and a second cover film disposed facing the first cover film with the heat-conducting member in between (e.g., the second cover film (497b) of FIG. 6 or FIG. 9).

[0133] According to one embodiment, the antenna member may be disposed between the shielding sheet and the second cover film.

[0134] According to one embodiment, the antenna structure and / or electronic device including the above may further include a third adhesive layer (e.g., the third adhesive layer (499c) of FIG. 6 or FIG. 9). In one embodiment, the third adhesive layer may attach a portion of the second cover film to the antenna member and attach another portion of the second cover film to the shielding sheet.

[0135] According to one embodiment, the second cover film may include a sponge or a synthetic resin film.

[0136] According to one embodiment of the present disclosure, an electronic device (e.g., the electronic device of FIGS. 1 to 5 (101, 102, 104, 200, 300)) may include a front plate (e.g., the front plate of FIG. 4 or 5 (320)), a rear plate (e.g., the rear plate of FIG. 4 or 5 (380)), a battery disposed in the space between the front plate and the rear plate (e.g., the battery of FIG. 4 or 5 (350)), and an antenna structure disposed at least partially between the rear plate and the battery (e.g., the antenna structure of FIGS. 4 to 9 (309, 409)). In one embodiment, the antenna structure may include a heat-conducting member (e.g., a heat-conducting member of FIG. 6 or FIG. 9 (491)) comprising a first region (e.g., a first region (A1) of FIG. 6 or FIG. 9) having a first thickness (e.g., a first thickness (T1) of FIG. 6) and a second region (e.g., a second region (A2) of FIG. 6 or FIG. 9) having a second thickness greater than the first thickness (e.g., a second thickness (T2) of FIG. 6), a shielding sheet (e.g., a shielding sheet (493) of FIG. 6 or FIG. 9) disposed on one surface of the heat-conducting member extending from at least a portion of the first region to at least a portion of the second region), and an antenna member (e.g., an antenna member (495a) of FIG. 6 or FIG. 9) disposed in the first region facing the heat-conducting member with a portion of the shielding sheet in between. In one embodiment, at the boundary between the first region and the second region, a portion of the shielding sheet (e.g., the inclined portion (IP) in FIG. 6) may be positioned at an angle with respect to the heat-conducting member or the antenna member.

[0137] According to one embodiment, the electronic device described above may further include a circuit board (e.g., a printed circuit board (340) of FIG. 4 or FIG. 5) disposed in the space between the front plate and the rear plate on one side of the battery. In one embodiment, a portion of the antenna structure may be disposed between the circuit board and the rear plate.

[0138] According to one embodiment, the antenna structure may be configured to absorb or disperse heat generated in the area where the circuit board is placed or heat generated in the area where the battery is placed.

[0139] According to one embodiment, the heat-conducting member may include a first graphite sheet providing the first region and the second region (e.g., the first graphite sheet (491a) of FIG. 6 or FIG. 9), a second graphite sheet disposed on the first graphite sheet to provide the second region (e.g., the second graphite sheet (491b) of FIG. 6 or FIG. 9), and a second adhesive layer disposed between the first graphite sheet and the second graphite sheet (e.g., the second adhesive layer (499b) of FIG. 6).

[0140] According to one embodiment, the antenna member may be disposed on one side of the second graphite sheet.

[0141] According to one embodiment, the antenna structure may further include a first cover film disposed on the other side of the heat-conducting member (e.g., the first cover film (497a) of FIG. 6 or FIG. 9), and a second cover film disposed facing the first cover film with the heat-conducting member in between (e.g., the second cover film (497b) of FIG. 6 or FIG. 9).

[0142] According to one embodiment, the antenna member may be disposed between the shielding sheet and the second cover film.

[0143] According to one embodiment, the antenna structure may further include a third adhesive layer (e.g., the third adhesive layer (499c) of FIG. 6 or FIG. 9). In one embodiment, the third adhesive layer may attach a portion of the second cover film to the antenna member and attach another portion of the second cover film to the shielding sheet.

[0144] Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the embodiment is for illustrative purposes only and is not intended to limit the present disclosure. It will be obvious to those skilled in the art that various changes in form and detailed configuration may be made without departing from the whole context of the present disclosure, including the appended claims and their equivalents.

Claims

1. A coil antenna assembly (309; 409) for transmitting and / or receiving a wireless signal through one side of an electronic device, A thermally conductive member (491) comprising a first portion having a first thickness (T1) in a first region (A1) of the coil antenna assembly and a second portion having a second thickness (T2) greater than the first thickness in a second region (A2) of the coil antenna assembly; A shielding sheet (493) disposed extending from at least a portion of the first region to at least a portion of the second region; and It includes an antenna member (495a) disposed in a first region (A1) of the above-mentioned coil antenna assembly, and A coil antenna assembly in which, in a first region (A1) of the coil antenna assembly, a portion of the shielding sheet is disposed between a first portion of the heat-conducting member and the antenna member, and in a second region (A2) of the coil antenna assembly, the antenna member is not disposed, and a portion (IP) of the shielding sheet is disposed at an angle at the boundary between the first region and the second region due to a second portion of the heat-conducting member that is thicker than the first portion.

2. In claim 1, the difference between the second thickness and the first thickness is equal to or smaller than the thickness (T3) of the antenna member, in a coil antenna assembly.

3. In any one of claims 1 to 2, the antenna member comprises a coil antenna assembly including a coil antenna or a loop antenna.

4. In any one of paragraphs 1 to 3, A coil antenna assembly further comprising a first adhesive layer (499a) disposed between the heat-conducting member and the shielding sheet.

5. In any one of claims 1 to 3, the heat-conducting member is, A first graphite sheet (491a) disposed across at least a portion of the first region (A1) and at least a portion of the second region of the coil antenna assembly; and A coil antenna assembly comprising a second graphite sheet (491b) disposed in a portion of the first graphite sheet and disposed in at least a portion of the second region of the coil antenna assembly.

6. In claim 5, the coil antenna assembly wherein the antenna member is disposed on one side of the second graphite sheet.

7. A coil antenna assembly according to any one of claims 5 to 6, wherein the heat-conducting member further comprises a second adhesive layer (499b) disposed between the first graphite sheet and the second graphite sheet.

8. In any one of paragraphs 5 through 7, A coil antenna assembly further comprising a reinforcing member (492a; 492b) disposed between the antenna member and the second graphite sheet.

9. In any one of paragraphs 5 through 8, A first cover film (497a) disposed on one side of the first graphite sheet; and A coil antenna assembly further comprising a second cover film (497b) positioned facing the first cover film with the heat-conducting member in between.

10. In claim 9, a coil antenna assembly in which the antenna member is disposed between the shielding sheet and the second cover film.

11. In any one of paragraphs 9 to 10, It further includes a third adhesive layer, The coil antenna assembly is configured such that the third adhesive layer attaches a portion of the second cover film to the antenna member and attaches another portion of the second cover film to the shielding sheet.

12. In any one of claims 9 to 11, the second cover film comprises a sponge or a synthetic resin film, forming a coil antenna assembly.

13. In an electronic device (101; 102; 104; 200; 300), Front plate (320); Rear plate (380); A battery (350) placed in the space between the front plate and the rear plate; and It includes an antenna structure (309; 409) positioned at least partially between the rear plate and the battery, and The above antenna structure is an electronic device comprising a coil antenna assembly according to any one of claims 1 to 12.

14. In Paragraph 13, The above battery further includes a circuit board (340) disposed in the space between the front plate and the rear plate on one side thereof, and An electronic device in which a part of the above antenna structure is disposed between the circuit board and the back plate.

15. In claim 14, the antenna structure is an electronic device configured to absorb or disperse heat generated in the area where the circuit board is placed or heat generated in the area where the battery is placed.

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