Thermal management system and vehicle

Abstract

A thermal management system and a vehicle. The thermal management system comprises a solid-state cooling module (104) and a compressor (101), wherein the solid-state cooling module is used for releasing heat to a thermal management loop in which the compressor is located when the thermal management system is executing a heating function; and / or, the solid-state cooling module is used for absorbing heat from the thermal management loop in which the compressor is located when the thermal management system is executing a cooling function. The solid-state cooling module comprises a first metal plate (201), a solid-state cooler (203) and a second metal plate (202), wherein the first metal plate is internally provided with a flow channel that allows a fluid to flow therethrough, and the solid-state cooler is used for implementing heat exchange between the first metal plate and the second metal plate. By means of such a configuration, the thermal management system can maintain efficient operation even in an overly cold or overly hot environment.

Description

Thermal management system and vehicle Technical Field

[0001] This application relates to the field of thermal management technology, specifically to thermal management systems and vehicles. Background Technology

[0002] The development of new energy vehicles is extremely rapid, and more and more vehicles are adopting thermal management systems (TMS) to regulate cabin temperature. For example, TMS heats the cabin in winter and cools it in summer. TMS primarily achieves heating or cooling through heat exchange with the environment. If the ambient temperature is too cold, for example below -10°C, the compressor inlet pressure will be below its operating range, preventing the compressor from starting properly and causing the TMS to malfunction and fail to heat. If the ambient temperature is too hot, for example above 40°C, the TMS will be unable to dissipate heat from the cabin to the environment, resulting in poor cooling or even complete failure to cool. Therefore, further research is needed on how to achieve high-efficiency heating through TMS in excessively cold environments or high-efficiency cooling through TMS in excessively hot environments. Summary of the Invention

[0003] This application provides a thermal management system and a vehicle capable of high-efficiency heating even in sub-cold environments. For example, the thermal management system can operate with high energy efficiency for heating even when the ambient temperature drops to -40°C. Alternatively, the thermal management system can operate with high energy efficiency for cooling even in overheated environments. For example, the thermal management system can operate with high energy efficiency for cooling even when the ambient temperature is above 40°C.

[0004] In a first aspect, this application provides a thermal management system, characterized in that the thermal management system includes a solid-state refrigeration module and a compressor. The solid-state refrigeration module is used to release heat to the thermal management circuit containing the compressor when the thermal management system performs a heating function. And / or, the solid-state refrigeration module is used to absorb heat from the thermal management circuit containing the compressor when the thermal management system performs a cooling function. Furthermore, the solid-state refrigeration module includes a first metal plate, a solid-state cooler, and a second metal plate. The first metal plate has a flow channel for fluid circulation, and the solid-state cooler is used to achieve heat exchange between the first metal plate and the second metal plate.

[0005] In the above scheme, the solid-state cooler in the solid-state refrigeration module can absorb or release heat. Utilizing this principle, in excessively cold environments, the solid-state cooler can release heat to the fluid in the thermal management circuit where the compressor is located, raising the fluid's temperature. This allows the compressor in the thermal management system to start and operate normally for heating. Alternatively, utilizing this principle, in excessively hot environments, the solid-state cooler can absorb heat from the thermal management circuit, lowering the system temperature. This allows the thermal management system to cool normally and improves cooling efficiency.

[0006] In one possible implementation, the flow channels in the first metal plate of the aforementioned solid-state refrigeration module are disposed in a first thermal management loop of the thermal management system. The first thermal management loop also includes a first heat exchange channel of a first heat exchanger. The first heat exchanger is used to realize heat exchange between the first thermal management loop and a second thermal management loop in the thermal management system, the second thermal management loop including a compressor and a second heat exchange channel of the first heat exchanger.

[0007] In the above scheme, the solid-state refrigeration module can be installed in the first thermal management loop, which can exchange heat with the second thermal management loop containing the compressor through a first heat exchanger. This allows the solid-state refrigeration module to release heat to the first thermal management loop when the environment is too cold, and the first thermal management loop then transfers the heat to the second thermal management loop. This increases the temperature and / or pressure at the compressor inlet, enabling the compressor to start and operate normally for heating. Alternatively, using this principle, when the environment is too hot, the solid-state refrigeration module can absorb heat from the first thermal management loop, which then absorbs heat from both the first and second thermal management loops, lowering the system temperature. This allows the thermal management system to cool normally and improves cooling efficiency.

[0008] In one possible implementation, the flow channels in the first metal plate of the solid-state refrigeration module are located in the thermal management circuit where the compressor is located. With this implementation, the solid-state refrigeration module can more efficiently release heat to the thermal management circuit where the compressor is located, or more efficiently absorb heat from the thermal management circuit where the compressor is located.

[0009] In one possible implementation, if the flow channel in the first metal plate of the solid-state refrigeration module is located in the thermal management circuit where the compressor is located, and the thermal management system performs a heating function, the flow channel in the first metal plate of the solid-state refrigeration module is connected to the compressor inlet. Alternatively, if the thermal management system performs a cooling function, the flow channel in the first metal plate of the solid-state refrigeration module is connected to the compressor outlet.

[0010] In the above scheme, when the thermal management system performs its heating function, placing the solid-state refrigeration module at the compressor inlet allows for a faster increase in the temperature and / or pressure of the refrigerant at the compressor inlet. This promotes efficient compressor operation. Especially in low ambient temperatures, the solid-state refrigeration module can more quickly release heat to the first thermal management loop, raising the temperature and / or pressure at the compressor inlet to the range required for normal compressor start-up and operation. This enables the compressor to start normally in low-temperature environments.

[0011] Furthermore, when the thermal management system performs its cooling function, the solid-state refrigeration module is placed at the outlet of the compressor 101. This allows the solid-state refrigeration module to more quickly absorb heat from the first thermal management circuit, thereby reducing the temperature within the circuit and improving the compressor's operating efficiency. Especially under high ambient temperatures, the solid-state refrigeration module can absorb heat from the first thermal management circuit, ensuring that the temperature and / or pressure at the compressor inlet remains within the normal operating range. This, in turn, enables the compressor to operate efficiently.

[0012] For example, a solid-state cooler is any of the following: a thermoelectric semiconductor cooler, an electric card cooler, a magnetic cooler, a piezoelectric cooler, a torsional heat cooler, or an elastic heat cooler.

[0013] In the above scheme, various types of solid-state coolers can be used, without limiting the types of solid-state coolers, thus expanding the application range.

[0014] In one possible implementation, the solid-state cooler may include multiple solid-state cooling modules, which are laid flat between the first metal plate and the second metal plate.

[0015] In the above scheme, arranging multiple cooling modules in a flat layout can increase the heat exchange capacity and improve the efficiency of heat exchange.

[0016] In one possible implementation, the solid-state cooler may include multiple solid-state cooling modules, which are stacked between a first metal plate and a second metal plate.

[0017] In the above scheme, stacking multiple cooling modules can control the formation of a large temperature difference between the two metal plates to meet the heat exchange needs of heating or cooling in practical applications.

[0018] In one possible implementation, the solid-state cooler may include multiple solid-state cooling modules, which are arranged in a flat and stacked manner between the first metal plate and the second metal plate.

[0019] In the above scheme, multiple solid-state cooling modules are arranged in a combination of flat and stacked configurations, which can increase the heat exchange capacity and control the formation of a large temperature difference between the two metal plates to meet the heat exchange requirements for heating or cooling in practical applications.

[0020] In one possible implementation, where the flow channels in the first metal plate of the solid-state cooling module are located in the first thermal management loop of the thermal management system, the thermal management system further includes a third thermal management loop. The third thermal management loop includes a first water pump, a second heat exchange channel of the first heat exchanger, and a radiator.

[0021] Optionally, the thermal management system also includes a three-way valve. The first port of the three-way valve is connected to the second heat exchange channel of the first heat exchanger, the second port of the three-way valve is connected to the solid-state refrigeration module, and the third port of the three-way valve is connected to the radiator.

[0022] The above solution also includes a third thermal management loop for heat dissipation, which can quickly dissipate heat from the thermal management system when heat dissipation is needed, thus maintaining the working performance of the thermal management system.

[0023] In one possible implementation, the solid-state cooling module is located inside the air intake duct of the heat sink.

[0024] In the above solution, the solid-state cooling module and the heat sink can share a single fan, thus saving one fan and the space required for fan placement.

[0025] In one possible implementation, where the flow channels in the first metal plate of the solid-state cooling module are arranged in the first thermal management loop of the thermal management system, the first thermal management loop also includes a heat sink.

[0026] In the above solution, the solid-state cooling module and the heat sink can be connected in series in the first thermal management loop. This simplifies the coolant flow path and reduces the cost of a three-way valve.

[0027] In one possible implementation, the solid-state cooling module also includes a fan.

[0028] In the above scheme, the fan can be used to accelerate the airflow, thereby accelerating the heat exchange between the second metal plate in the solid-state cooling module and the air, and improving the heat exchange efficiency.

[0029] In a second aspect, this application provides a vehicle that includes a thermal management system as described in any of the first aspects above. Attached Figure Description

[0030] Figure 1 is a schematic diagram of the thermal management loop included in the thermal management system provided in an embodiment of this application;

[0031] Figures 2 to 5 are schematic diagrams of the solid-state cooling module provided in the embodiments of this application;

[0032] Figures 6 and 7 are schematic diagrams of the thermal management loops included in the thermal management system provided in the embodiments of this application;

[0033] Figures 7A to 7D are schematic diagrams of the thermal management loops included in the thermal management system provided in the embodiments of this application;

[0034] Figures 8 to 12 are schematic diagrams of the thermal management loops included in the thermal management system provided in the embodiments of this application;

[0035] Figure 13 is a schematic diagram comparing the operating temperature range and energy efficiency of the thermal management system provided in this solution with that of the traditional thermal management system;

[0036] Figure 14 is a schematic diagram of the thermal management loop included in the thermal management system provided in the embodiment of this application.

[0037] Reference numerals: 101-Compressor; 102-First heat exchanger; 103-First water pump; 104-Solid-state refrigeration module; 105-Second heat exchanger; 106-First expansion valve; 107-Second water pump; 108-Heat air core; 109-Second expansion valve; 110-Evaporator; 111-Radiator; 112-Three-way valve; 113-Three-way connector; 201-First metal plate; 202-Second metal plate; 203-Solid-state refrigerator; 2031-Solid-state refrigeration module. Detailed Implementation

[0038] In this application embodiment, "multiple" refers to two or more. In this application embodiment, "and / or" is used to describe the association relationship of related objects, indicating three relationships that can exist independently. For example, A and / or B can mean: A exists alone, B exists alone, or A and B exist simultaneously. The description methods used in this application embodiment, such as "at least one of a1, a2, ... and an (or at least one of them)," include the case where any one of a1, a2, ... and an exists alone, as well as the case where any combination of any multiple of a1, a2, ... and an exists alone. Each case can exist alone. For example, the description method of "at least one of a, b, and c" includes the cases where a, b, c, a and b combined, a and c combined, b and c combined, or a, b, and c combined.

[0039] In this application, the terms "first," "second," etc., are used to distinguish identical or similar items with substantially the same function. It should be understood that there is no logical or temporal dependency between "first," "second," and "nth," nor does it limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," etc., to describe various elements, these elements should not be limited by the terms. These terms are merely used to distinguish one element from another.

[0040] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between the various embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0041] For example, the connection described in the embodiments of this application refers to the connection of coolant passages or refrigerant passages, or the connection achieved by adjusting related valve devices, etc.

[0042] This application provides a thermal management system and a vehicle that can achieve high-efficiency heating in an environment that is too cold, or high-efficiency cooling in an environment that is too hot.

[0043] The thermal management system provided in this application can be applied to vehicles, as well as other thermal management scenarios with cooling (heat dissipation) and / or heating requirements. For example, it is applicable to thermal management scenarios such as household air conditioners, central air conditioners, refrigerators, or cold storage. This application does not limit the specific application scenario.

[0044] Exemplarily, this application primarily uses vehicle application scenarios as examples. Exemplarily, the embodiments of this application can be applied to both new energy vehicles and traditional fuel vehicles. The new energy vehicle is a mode of transportation driven by an electric drive system. New energy vehicles can be pure electric vehicles (pure EV / battery EV), hybrid electric vehicles (HEV), range-extended electric vehicles (REEV), plug-in hybrid electric vehicles (PHEV), etc. It is understood that the examples listed here are merely illustrative, and there are many types of new energy vehicles, which will not be described in detail in this application.

[0045] Exemplarily, the thermal management system of this application embodiment can heat or dissipate heat to the managed object using a coolant. In some possible implementations, the managed object can be a passenger compartment, battery, electric drive unit, and control system, etc. In this application, the coolant is used to transfer heat energy. In some possible implementations, the thermal management system of this application can also use a coolant and a refrigerant to heat or dissipate heat to the managed object. The refrigerant can transfer heat through evaporation and condensation.

[0046] The following is an exemplary description of the thermal management system provided in the embodiments of this application.

[0047] Exemplarily, the thermal management system provided in this application includes a solid-state refrigeration module and a compressor. The solid-state refrigeration module is used to release heat to the thermal management circuit where the compressor is located when the thermal management system performs a heating function. Alternatively, the solid-state refrigeration module is used to absorb heat from the thermal management circuit where the compressor is located when the thermal management system performs a cooling function. Furthermore, the solid-state refrigeration module includes a first metal plate, a solid-state cooler, and a second metal plate. The first metal plate has a flow channel for fluid circulation, and the solid-state cooler is used to achieve heat exchange between the first and second metal plates. For ease of understanding, an exemplary description follows.

[0048] For example, in one possible implementation, the thermal management system provided in this application embodiment may include a first thermal management loop L1 and a second thermal management loop L2.

[0049] In one possible implementation, see Figure 1 for an example, which shows a possible schematic diagram of a first thermal management loop L1 and a second thermal management loop L2.

[0050] As shown in Figure 1, the first thermal management loop L1 includes a first heat exchange channel of a first heat exchanger 102 and a solid-state refrigeration module 104. The first heat exchanger 102 includes a first heat exchange channel and a second heat exchange channel. As shown in Figure 1, d 11 d represents the inlet of the first heat exchange channel of the first heat exchanger 102. 12 d represents the outlet of the first heat exchange channel of the first heat exchanger 102. 13 d represents the inlet of the second heat exchange channel of the first heat exchanger 102. 14 This indicates the outlet of the second heat exchange channel of the first heat exchanger 102. Exemplarily, the first heat exchanger 102 may be a cooler or an evaporator, etc. Optionally, the first thermal management loop L1 may also include a first water pump 103.

[0051] For example, the solid-state cooling module 104 can be used to release heat to the first thermal management circuit L1 when the thermal management system performs a heating function, or to absorb heat from the first thermal management circuit L1 when the thermal management system performs a cooling function. To facilitate understanding of the working principle of the solid-state cooling module 104, its structure is described below by way of example.

[0052] For example, referring to Figure 2, a schematic diagram of the solid-state cooling module 104 is shown. It can be seen that the solid-state cooling module 104 may include a first metal plate 201, a second metal plate 202, and a solid-state cooler 203. The solid-state cooler 203 is disposed between the first metal plate 201 and the second metal plate 202. As shown in Figure 2, the solid-state cooler 203 includes a first side and a second side. The first side is in contact with the first metal plate 201, and the second side is in contact with the second metal plate 202. Optionally, to reduce contact thermal resistance and improve thermal conductivity, a thermal interface material (TIM) such as thermally conductive gel or silicone grease may be added between the first side of the solid-state cooler 203 and the first metal plate 201. Similarly, TIM material may also be added between the second side of the solid-state cooler 203 and the second metal plate 202. For example, the materials of the first metal plate 201 and the second metal plate 202 may be various single metal materials or composite metal materials such as aluminum, magnesium, titanium, iron, copper, aluminum alloy, magnesium alloy, titanium alloy or iron-carbon alloy, and this application embodiment does not limit this.

[0053] Exemplarily, the first metal plate 201 is provided with a flow channel for fluid circulation. This flow channel can be exemplarily shown in Figure 2. Exemplarily, the flow channel in the first metal plate 201 can be configured in a shape that extends the flow channel length, such as a serrated, meandering, or nested loop shape, thereby increasing the heat exchange area between the fluid in the flow channel and the first metal plate 201 and improving heat exchange efficiency. Optionally, the flow channel in the first metal plate 201 can also be configured in any other arbitrary shape; this embodiment does not limit this. Figure 2 shows an example with a serrated flow channel. Exemplarily, the first metal plate 201 also includes a first side and a second side, the second side of which is opposite to the first side. Assuming the first side of the first metal plate 201 is the side in contact with the solid-state cooler 203, then the inlet and outlet of the flow channel can be located on the second side of the first metal plate 201, as shown in Figure 2. Alternatively, by way of example, the inlet and outlet of the flow channel can be located at any possible position in the first metal plate 201, and this application embodiment does not limit this.

[0054] For example, the second metal plate 202 also includes a first side and a second side, wherein the second side of the second metal plate 202 is the side opposite to the first side of the second metal plate 202. Assuming that the first side of the second metal plate 202 is the side in contact with the solid-state cooler 203, then, for example, the second side of the second metal plate 202 can be configured as a sawtooth shape or any other shape that increases the contact area between the second metal plate 202 and the air, thereby increasing the heat exchange efficiency between the second metal plate 202 and the air. Alternatively, for example, the second side of the second metal plate 202 can also be a perforated or non-perforated surface, etc., and this embodiment does not limit this.

[0055] For example, the solid-state cooler 203 described above may be, but is not limited to, a thermoelectric semiconductor cooler, an electric card cooler, a magnetic cooler, a piezoelectric cooler, a torsional heat cooler, or an elastic heat cooler, etc. The working principle of each cooler is described below by example.

[0056] For example, the aforementioned thermoelectric semiconductor cooler is a device that generates cold or heat using the thermoelectric effect of semiconductors, and can also be simply referred to as a thermoelectric cooler. When a power source is applied to the thermoelectric semiconductor cooler, i.e., current is switched on, the temperature on one side of the thermoelectric semiconductor cooler rises, releasing heat, while the temperature on the other side decreases, absorbing heat from the surrounding environment. For example, the temperature changes on both sides of the thermoelectric semiconductor cooler are opposite depending on the direction of the current applied. For instance, if the current applied to the thermoelectric semiconductor cooler is in a first direction, then the first side of the thermoelectric semiconductor cooler releases heat, causing the surrounding temperature to rise, while the second side of the thermoelectric semiconductor cooler absorbs heat, causing the surrounding temperature to fall. Since the first metal plate 201 is in contact with the first side of the thermoelectric semiconductor cooler, the temperature of the first metal plate 201 also rises, thereby releasing heat to the fluid in the flow channel of the first metal plate 201, thus raising the temperature of the fluid in the flow channel of the first metal plate 201. As another example, if the direction of the current applied to the thermoelectric semiconductor cooler is a second direction opposite to the first direction... The thermoelectric semiconductor cooler absorbs heat from its first side, lowering the surrounding temperature, while its second side releases heat, raising the surrounding temperature. Since the first metal plate 201 is in contact with the first side of the thermoelectric semiconductor cooler, its temperature also decreases, allowing it to absorb heat from the fluid flowing through its channels. This further lowers the temperature of the fluid flowing through the channels of the first metal plate 201. Therefore, the thermoelectric semiconductor cooler can either release heat to the surroundings, raising the surrounding temperature, or absorb heat from the surroundings, lowering the surrounding temperature.

[0057] For example, the above-mentioned electrocaloric cooler is a device that generates cold or heat based on the electrocaloric effect. The electrocaloric effect is a phenomenon in which a material undergoes a reversible temperature change under a changing electric field. For example, under the influence of an electric field, the electric dipoles in the dielectric of the electrocaloric cooler undergo entropy change, thereby releasing or absorbing heat. For example, the working process of the electrocaloric cooler includes an adiabatic polarization process, an isoelectric field polarization process, an adiabatic depolarization process, and an isoelectric field entropy transfer process. During the adiabatic polarization process, an external electric field is applied to the dielectric of the electrocaloric cooler, causing the dipoles in the dielectric to align along the direction of the electric field. This process releases heat, causing the temperature of the electrocaloric cooler to rise. During the isoelectric field polarization process, the electric field remains constant, and the temperature of the electrocaloric cooler is higher than the ambient temperature, releasing heat to the surroundings, causing the ambient temperature to rise, and the electric dipoles to further align along the direction of the electric field. During the adiabatic depolarization process, the electric field is removed, and the electric dipoles become randomly distributed. This process absorbs heat, causing the temperature of the electrocaloric cooler to drop. During the entropy transfer process in the isoelectric field, the temperature of the electric card cooler is lower than the ambient temperature, thus absorbing heat from the surroundings and causing the ambient temperature to decrease. It can be seen that the electric card cooler can release heat to the surroundings, causing the ambient temperature to increase. For example, referring to the structure of the solid-state refrigeration module 104 shown in Figure 2, the electric card cooler is a solid-state cooler 203. The electric card cooler can release heat to the fluid in the flow channel of the first metal plate 201 through the first side, causing the fluid temperature to increase. Alternatively, the electric card cooler can absorb heat from the surroundings, causing the ambient temperature to decrease. For example, referring to the structure of the solid-state refrigeration module 104 shown in Figure 2, the electric card cooler can absorb heat from the fluid in the flow channel of the first metal plate 201 through the first side, causing the fluid temperature to decrease.

[0058] For example, a magnetic cooler is a device that utilizes the magnetocaloric effect of magnetic materials to generate cold or heat. The magnetocaloric effect refers to the change in the ordered arrangement of magnetic moments in a magnetic material when an external magnetic field changes, i.e., a change in magnetic entropy, leading to the material absorbing or releasing heat. Without an external magnetic field, the directions of the magnetic moments within the magnetic material are random, resulting in a relatively high magnetic entropy. With an external magnetic field, the orientation of the magnetic moments gradually becomes more uniform, resulting in a relatively low magnetic entropy. The working process of a magnetic cooler includes excitation and demagnetization. During excitation, an external magnetic field is applied to the magnetic material in the cooler, causing the magnetic moments to change from disordered to ordered along the direction of the magnetic field, decreasing the magnetic entropy. According to thermodynamics, the magnetic material releases heat, raising the surrounding temperature. During demagnetization, the magnetic moments change from ordered to disordered along the direction of the magnetic field, increasing the magnetic entropy. The magnetic material absorbs heat from the outside, lowering the surrounding temperature. Thus, a magnetic cooler can release heat to its surroundings, raising the ambient temperature. For example, referring to the structure of the solid-state cooling module 104 shown in Figure 2, the magnetic cooler is a solid-state cooler 203. The magnetic cooler can release heat through the fluid flowing in the channel of the first metal plate 201 from the first side, thereby increasing the temperature of the fluid. Alternatively, the magnetic cooler can absorb heat from the surrounding environment, thereby decreasing the ambient temperature. For example, referring to the structure of the solid-state cooling module 104 shown in Figure 2, the magnetic cooler can absorb heat from the fluid flowing in the channel of the first metal plate 201 from the first side, thereby decreasing the temperature of the fluid.

[0059] For example, the piezoelectric cooler described above is a device that generates cold or heat based on the piezoelectric effect. When the piezoelectric material in the piezoelectric cooler is subjected to external force, it generates an electric charge, absorbing heat in the process and lowering the surrounding temperature. When an electric field is applied, the piezoelectric material in the piezoelectric cooler heats up, raising the surrounding temperature. This phenomenon of applying an electric field to a piezoelectric material causing it to deform and heat up can be called the inverse piezoelectric effect. It can be seen that the piezoelectric cooler can release heat to the surroundings, raising the surrounding temperature. For example, referring to the structure of the solid-state cooling module 104 shown in Figure 2, the piezoelectric cooler is a solid-state cooler 203. The piezoelectric cooler can release heat to the fluid in the flow channel of the first metal plate 201 through the first side, raising the fluid temperature. Alternatively, the piezoelectric cooler can absorb heat from the surroundings, lowering the surrounding temperature. For example, referring to the structure of the solid-state cooling module 104 shown in Figure 2, the piezoelectric cooler can absorb heat from the fluid in the flow channel of the first metal plate 201 through the first side, lowering the fluid temperature.

[0060] For example, the aforementioned torsional heat cooler is a device that generates cold or heat based on energy conversion during the mechanical deformation and recovery process of materials. Specifically, torsional heat cooling achieves heat absorption or release by changing the twist of the material. Torsional heat cooling typically uses fibrous materials, such as rubber elastomers, nylon threads, polyethylene fishing lines, or nickel-titanium alloy threads. These materials exhibit unique thermodynamic properties under specific conditions. For example, one end of the fibrous material is fixed, and then twisted and stretched from the other end to form a superspiral structure. During this process, heat is generated inside the fibrous material, causing the surrounding temperature to rise. After twisting and stretching, the twist force is quickly released, allowing the fibrous material to return to its original shape. During this process, the temperature of the fibrous material decreases, thereby absorbing heat from the surroundings and lowering the surrounding temperature. As can be seen, the torsional heat cooler can release heat to the surroundings, causing the surrounding temperature to rise. For example, in conjunction with the structure of the solid-state cooling module 104 shown in Figure 2, the torsional heat cooler is a solid-state cooler 203. The torsional heat cooler can release heat through the fluid flowing through the first side of the first metal plate 201, causing the fluid temperature to rise. Alternatively, the heat-twisting cooler can absorb heat from the surroundings, thereby lowering the ambient temperature. For example, based on the structure of the solid-state cooling module 104 shown in Figure 2, the heat-twisting cooler can absorb heat from the fluid in the flow channel of the first metal plate 201 through the first side, thereby lowering the temperature of the fluid.

[0061] For example, the aforementioned elastomeric cooler is a device that utilizes the reversible phase transformation of shape memory alloys (SMAs) under uniaxial stress to generate cold or heat. Its basic principle is as follows: When an axial force (tension or compression) is applied externally, the stress inside the shape memory alloy exceeds its critical phase transformation stress, releasing heat and causing the shape memory alloy's own temperature to rise, thereby raising the surrounding temperature. After the external force is removed, the internal stress of the material is less than its critical phase transformation stress, the shape memory alloy recovers, absorbs heat, and causes its own temperature to drop, thereby lowering the surrounding temperature. It can be seen that the elastomeric cooler can release heat to the surroundings, causing the surrounding temperature to rise. For example, in conjunction with the structure of the solid-state cooling module 104 shown in Figure 2, the elastomeric cooler is a solid-state cooler 203. The elastomeric cooler can release heat through the fluid flowing through the first side channel in the first metal plate 201, causing the fluid temperature to rise. Alternatively, the elastomeric cooler can absorb heat from the surroundings, causing the surrounding temperature to drop. For example, based on the structure of the solid-state cooling module 104 shown in Figure 2, the thermoelectric cooler can absorb the fluid heat in the flow channel of the first metal plate 201 through the first side, thereby reducing the temperature of the fluid.

[0062] It is understood that the various solid-state coolers described above are merely examples and do not constitute a limitation on the embodiments of this application.

[0063] In one possible implementation, the solid-state cooler 203 may include multiple solid-state cooling modules. These multiple solid-state cooling modules are laid flat between the first metal plate 201 and the second metal plate 202. For ease of understanding, this is illustrated in Figure 3. Figure 3 exemplarily shows multiple solid-state cooling modules 2031 included in the solid-state cooler 203. Each solid-state cooling module 2031 can perform the functions described in Figure 2 for the solid-state cooler 203. For example, taking the solid-state cooler 203 as a thermoelectric semiconductor cooler, the thermoelectric semiconductor cooler includes multiple thermoelectric semiconductor cooling modules, i.e., the solid-state cooling module 2031 is the thermoelectric semiconductor cooling module. The thermoelectric semiconductor cooling module also includes a first side and a second side. Applying a current in the first direction to the thermoelectric semiconductor cooling module causes the first side of the thermoelectric semiconductor cooling module to release heat, raising the surrounding temperature, while the second side of the thermoelectric semiconductor cooling module absorbs heat, lowering the surrounding temperature. Alternatively, applying the aforementioned second-direction current to the thermoelectric semiconductor cooling module can cause the first side of the thermoelectric semiconductor cooling module to absorb heat, thus lowering the surrounding temperature, while the second side of the thermoelectric semiconductor cooling module releases heat, thus raising the surrounding temperature. Other solid-state coolers 203, including solid-state cooling modules 2031, can similarly achieve the functions described in Figure 2 for the solid-state cooler 203, and will not be elaborated further.

[0064] For example, in a specific implementation, since the heat released or absorbed by a single solid-state cooling module 2031 is limited, multiple solid-state cooling modules 2031 can be laid flat between the first metal plate 201 and the second metal plate 202 to form a solid-state cooler 203. This increases the heat released or absorbed by the solid-state cooler 203, allowing for faster heat release or absorption. As shown in Figure 3, the first side of each solid-state cooling module 2031 is in contact with the first metal plate 201, and the second side of each solid-state cooling module 2031 is in contact with the second metal plate 202. For example, the number of solid-state cooling modules 2031 laid flat is determined according to actual application requirements, and this embodiment does not limit this.

[0065] In one possible implementation, the solid-state cooler 203 may include multiple solid-state cooling modules. These multiple solid-state cooling modules are stacked between the first metal plate 201 and the second metal plate 202. For ease of understanding, please refer to FIG4. FIG4 exemplarily illustrates multiple solid-state cooling modules 2031 included in the solid-state cooler 203. These multiple solid-state cooling modules 2031 are stacked between the first metal plate 201 and the second metal plate 202. Exemplarily, as shown in FIG4, a first side of one solid-state cooling module 2031 is in contact with the first metal plate 201, and a second side of another solid-state cooling module 2031 is in contact with the second metal plate 202. In the remaining solid-state cooling modules 2031, the second side of each solid-state cooling module 2031 is in contact with the first side of another adjacent stacked solid-state cooling module 2031. Exemplarily, since the temperature difference formed between a single solid-state cooling module 2031 and the first metal plate 201 and the second metal plate 202 is limited, a larger temperature difference can be formed between the first metal plate 201 and the second metal plate 202 by stacking them. This is used to rapidly raise or lower the temperature of the fluid flowing through the channels in the first metal plate 201. Exemplarily, the number of stacked solid-state cooling modules 2031 is determined according to actual application requirements, and this application embodiment does not impose any limitations on this.

[0066] In one possible implementation, the solid-state cooler 203 may include multiple solid-state cooling modules. These multiple solid-state cooling modules are arranged in a combination of flat and stacked configurations between the first metal plate 201 and the second metal plate 202. For ease of understanding, please refer to Figure 5. Figure 5 shows a solid-state cooler 203 arranged by combining the flat arrangement shown in Figure 3 and the stacking arrangement shown in Figure 4. For example, the solid-state cooler 203 shown in Figure 5 may be obtained by stacking multiple solid-state coolers 203 as shown in Figure 3. Alternatively, the solid-state cooler 203 shown in Figure 5 may be obtained by flatly arranging multiple solid-state coolers 203 as shown in Figure 4. Specific placement methods will not be elaborated further. The solid-state cooler 203 shown in Figure 5 can both increase the heat released or absorbed by the solid-state cooler 203 and create a large temperature difference between the first metal plate 201 and the second metal plate 202.

[0067] Optionally, thermal conductive gel or silicone grease or other TIM materials can be added between two adjacent solid-state cooling modules to reduce contact thermal resistance and improve thermal conductivity.

[0068] It is understood that the structures shown in Figures 2 to 5 above are merely examples and do not constitute a limitation on the embodiments of this application.

[0069] For example, in conjunction with the structure of the solid-state refrigeration module 104 described above, the flow channel of the first metal plate 201 in the solid-state refrigeration module 104 is connected in series in the first thermal management loop L1 shown in FIG1. ​​For example, in this first thermal management loop L1, the inlet of the flow channel of the first metal plate 201 in the solid-state refrigeration module 104 can be connected to the first heat exchange channel of the first heat exchanger 102. The outlet of the flow channel of the first metal plate 201 in the solid-state refrigeration module 104 can be connected to the first water pump 103. It is understood that the position of the solid-state refrigeration module 104 in the first thermal management loop L1 shown in FIG1 is only an example and does not constitute a limitation on the embodiments of this application. In some possible implementations, the solid-state refrigeration module 104 can be set at any position in the first thermal management loop L1.

[0070] For example, the flow direction of the first thermal management circuit L1 is shown in Figure 1. For instance, coolant flows through the first thermal management circuit L1, meaning it is a coolant circuit. For example, the first water pump 103 can drive the coolant in the first thermal management circuit L1 to flow to the first heat exchange channel of the first heat exchanger 102 for heat exchange. After heat exchange, the coolant can flow to the flow channel of the first metal plate 201 in the solid-state refrigeration module 104. After heat exchange in this flow channel, the coolant flows back to the first water pump 103, forming the first thermal management circuit L1.

[0071] It is understood that the above description of the first thermal management circuit L1 is merely an example and does not constitute a limitation on the embodiments of this application.

[0072] Additionally, as can be seen in Figure 1, the second thermal management loop L2 includes a second heat exchange channel for the compressor 101 and the first heat exchanger 102.

[0073] For example, the second thermal management loop L2 may further include a first heat exchange passage of the second heat exchanger 105 and a first expansion valve 106. As shown in Figure 1, d 21 d represents the inlet of the first heat exchange channel of the second heat exchanger 105. 22 This indicates the outlet of the first heat exchange channel of the second heat exchanger 105. For example, the second heat exchanger 105 may be a condenser or an evaporator for refrigeration.

[0074] For example, the flow direction of the second thermal management circuit L2 is shown in Figure 1. Refrigerant flows through the second thermal management circuit L2; that is, the second thermal management circuit L2 is a refrigerant circuit. For example, after the compressor 101 starts working, it can output high-temperature, high-pressure refrigerant and drive the refrigerant to the first heat exchange channel of the second heat exchanger 105. After flowing out of the first heat exchange channel of the second heat exchanger 105, the refrigerant flows through the first expansion valve 106 to the second heat exchange channel of the first heat exchanger 102 after pressure reduction and throttling. After flowing out of the second heat exchange channel of the first heat exchanger 102, the refrigerant flows back to the compressor 101, forming the second thermal management circuit L2.

[0075] For example, in one possible implementation, when the thermal management system performs the heating function, the solid-state cooling module 104 releases heat to the first thermal management loop L1. For clarity on the specific implementation process, please refer to Figure 6. As shown in Figure 6, the second heat exchanger 105 may further include a second heat exchange channel. Wherein, d 23 d represents the inlet of the second heat exchange channel of the second heat exchanger 105. 24 This indicates the outlet of the second heat exchange channel of the second heat exchanger 105. In this case, the second heat exchanger 105 is a condenser. Furthermore, the aforementioned thermal management system may also include a heating air circuit Lh. This heating air circuit Lh includes the second heat exchange channel of the second heat exchanger 105, a second water pump 107, and a heating air core 108.

[0076] For example, the flow direction of the aforementioned warm air circuit Lh is shown in Figure 6. Coolant flows through the warm air circuit Lh; that is, the warm air circuit Lh is a coolant circuit. For example, the coolant, after heat exchange in the second heat exchanger 105, can flow to the warm air core 108 under the drive of the second water pump 107. After flowing out of the warm air core 108, it flows back to the second heat exchange channel of the second heat exchanger 105, forming the warm air circuit Lh.

[0077] For example, when the heating function of the thermal management system shown in Figure 6 is activated, if the ambient temperature is low, for example, below a preset first temperature threshold, the solid-state cooling module 104 in the first thermal management loop L1 can be activated. This causes the solid-state cooling module 104 to release heat into the first thermal management loop L1. For example, the solid-state cooler 203 in the solid-state cooling module 104 releases heat to the fluid in the flow channel of the first metal plate 201. This causes the temperature of the coolant in the flow channel of the first metal plate 201 to rise. For example, the first temperature threshold can be any value between -5°C and -20°C, specifically set according to actual application requirements; this embodiment does not limit this. In the first thermal management loop L1, the cooled fluid, after its temperature rises, flows to the first heat exchanger 102 driven by the first water pump 103. It exchanges heat with the second thermal management loop L2 through the first heat exchanger 102, causing the temperature of the refrigerant in the second thermal management loop L2 to rise. The refrigerant, after its temperature rises, flows to compressor 101, increasing the temperature and pressure at the compressor inlet to reach the range required for normal compressor start-up and operation. This allows compressor 101 to start normally even in low-temperature environments. Once started, compressor 101 outputs high-temperature, high-pressure refrigerant. This high-temperature, high-pressure refrigerant is fed into the second heat exchanger 105 to exchange heat with the aforementioned warm air circuit Lh. In the warm air circuit Lh, the high-temperature coolant, after heat exchange in the second heat exchanger 105, flows to the warm air core under the drive of the second water pump 107. The warm air core then transfers heat to the surrounding air to achieve heating.

[0078] It is understood that Figure 6 above is merely an example and does not constitute a limitation on the embodiments of this application. The devices included in the first thermal management circuit L1, the second thermal management circuit L2, and the heater circuit Lh shown in Figure 6 are merely examples. In some possible implementations, these thermal management circuits may also include other devices, such as multi-way valves, one-way valves, expansion valves, or three-way interfaces, etc. Alternatively, for example, in some possible implementations, the heater circuit Lh may also include a heater. The heater can be used to heat the coolant in the circuit at low temperatures. The embodiments of this application do not limit the other devices included in each circuit.

[0079] For example, in one possible implementation, when the thermal management system performs a cooling function, the solid-state cooling module 104 absorbs heat from the first thermal management loop L1. For clarity on the specific implementation process, please refer to Figure 7. As shown in Figure 7, the aforementioned thermal management system may also include a cooling loop Lc. For example, Figure 7 is obtained by adding a cooling loop Lc to Figure 6. This cooling loop Lc includes a compressor 101, a second heat exchange channel of the first heat exchanger 102, a second expansion valve 109, and an evaporator 110.

[0080] For example, the flow direction of the refrigeration circuit Lc is shown in Figure 7. Refrigerant flows through the refrigeration circuit Lc; that is, the refrigeration circuit Lc is a refrigerant circuit. For example, after the compressor 101 starts working, it can output high-temperature, high-pressure refrigerant and drive the refrigerant to flow into the first heat exchange channel of the second heat exchanger 105. Part of the refrigerant flowing out of the first heat exchange channel of the second heat exchanger 105 participates in the circulation of the second thermal management circuit L2. The other part flows to the evaporator 110 through the second expansion valve 109. The refrigerant flowing out of the evaporator 110 returns to the compressor 101, forming the refrigeration circuit Lc.

[0081] For example, in the thermal management system shown in Figure 7 above, when the cooling function is activated, the compressor 101 can be started. After the compressor 101 starts, it can output high-temperature and high-pressure refrigerant. The high-temperature and high-pressure refrigerant is input into the second heat exchanger 105 for heat exchange. After heat exchange, the high-temperature and high-pressure liquid refrigerant is output from the second heat exchanger 105. A portion of this high-temperature and high-pressure refrigerant is cooled and depressurized by the second expansion valve 109 to obtain low-temperature and low-pressure refrigerant. This low-temperature and low-pressure refrigerant is input into the evaporator 110 to achieve cooling. Another portion of the high-temperature and high-pressure refrigerant is depressurized and throttled by the first expansion valve 106 and flows to the first heat exchanger 102 for heat exchange. After heat exchange, it flows back to the compressor 101. The purpose of depressurizing and throttling by the first expansion valve 106 and flowing to the first heat exchanger 102 for heat exchange is to regulate the temperature and / or pressure of the refrigerant at the inlet of the compressor 101. When the temperature and / or pressure of the refrigerant at the compressor inlet 101 is too high, such as exceeding a preset refrigerant temperature threshold and / or a preset pressure threshold, the compressor efficiency will decrease, resulting in poor cooling performance or even failure to cool normally. In this case, heat exchange between the first heat exchanger 102 and the first thermal management circuit L1 can reduce the temperature and / or pressure of the refrigerant flowing to the compressor inlet 101. However, if the ambient temperature is high, such as exceeding a preset second temperature threshold, the heat in the first thermal management circuit L1 cannot be released into the environment. In this case, the solid-state refrigeration module 104 in the first thermal management circuit L1 can be activated. This allows the solid-state refrigeration module 104 to absorb the heat in the first thermal management circuit L1. For example, the solid-state cooler 203 in the solid-state refrigeration module 104 absorbs the fluid heat from the flow channels in the first metal plate 201, thereby lowering the temperature of the coolant in the flow channels of the first metal plate 201. This further reduces the temperature and / or pressure of the refrigerant flowing to the compressor inlet 101 after heat exchange through the first heat exchanger 102, thus improving the compressor efficiency. For example, the second temperature threshold can be any value between 30° and 50°, and can be set according to the actual application requirements. This application embodiment does not limit this.

[0082] It is understood that Figure 7 above is merely an example and does not constitute a limitation on the embodiments of this application. The devices included in the first thermal management circuit L1, the second thermal management circuit L2, the heating circuit Lh, and the cooling circuit Lc shown in Figure 7 are merely examples. In some possible implementations, these thermal management circuits may also include other devices, such as multi-way valves, one-way valves, expansion valves, or three-way interfaces, etc., and the embodiments of this application do not impose any limitations on this.

[0083] In another possible implementation, the thermal management system shown in Figure 7 may not include the heating circuit Lh and the second heat exchanger 105. In this case, the refrigeration circuit Lc includes the compressor 101, the second expansion valve 109, and the evaporator 110. The evaporator 110 can be considered as the second heat exchanger 105 shown in Figure 1. The refrigeration function can still be achieved in this case. The specific refrigeration process, and the refrigeration process under high ambient temperatures, can be exemplified in the above description and will not be repeated here.

[0084] In another possible implementation, the first thermal management loop L1 provided in this application embodiment includes a solid-state refrigeration module 104 and a compressor 101. For ease of understanding, please refer to FIG7A. FIG7A exemplarily shows a possible schematic diagram of the first thermal management loop L1. It can be seen that the first thermal management loop L1 includes a solid-state refrigeration module 104 and a compressor 101. Optionally, the first thermal management loop L1 may also include a second heat exchanger 105 and a first expansion valve 106. For details regarding the second heat exchanger 105 and the first expansion valve 106, please refer to the foregoing description, which will not be repeated here. Furthermore, exemplarily, the first thermal management loop L1 shown in FIG7A is a refrigerant loop, and the flow direction is shown in FIG7A. Further details will not be elaborated here.

[0085] For example, in conjunction with the structure of the solid-state cooling module 104 described above, the flow channel of the first metal plate 201 in the solid-state cooling module 104 is connected in series in the first thermal management circuit L1 shown in FIG. 7A. For example, in one possible implementation, the solid-state cooling module 104 is connected to the inlet of the compressor 101, as shown in FIG. 7A. For example, the outlet of the flow channel of the first metal plate 201 in the solid-state cooling module 104 can be connected to the inlet of the compressor 101. Alternatively, in another possible implementation, the solid-state cooling module 104 is connected to the outlet of the compressor 101, as shown in FIG. 7B. For example, the inlet of the flow channel of the first metal plate 201 in the solid-state cooling module 104 can be connected to the outlet of the compressor 101. It is understood that the position of the solid-state cooling module 104 in the first thermal management circuit L1 shown in FIG. 7A and FIG. 7B is only an example and does not constitute a limitation on the embodiments of this application. In some possible implementations, the solid-state cooling module 104 can be set at any position in the first thermal management circuit L1.

[0086] For example, in the first thermal management circuit L1 shown in Figure 7A or Figure 7B above, the solid-state cooling module 104 can also release heat into the first thermal management circuit L1 when the thermal management system is performing a heating function. Alternatively, when the thermal management system is performing a cooling function, it can absorb heat from the first thermal management circuit L1. For details on the implementation process, please refer to the foregoing description, which will not be repeated here.

[0087] In one possible implementation, if the thermal management system provides heating functionality, the solid-state refrigeration module 104 can be connected to the inlet of the compressor 101. That is, the solid-state refrigeration module 104 is placed at the inlet of the compressor 101, as shown in Figure 7C. Figure 7C is obtained by adding a warm air circuit Lh to Figure 7A. For details regarding the warm air circuit Lh and the heating process achieved through it, please refer to the relevant description in Figure 6 above; it will not be repeated here. By placing the solid-state refrigeration module 104 at the inlet of the compressor 101, heat can be released from the solid-state refrigeration module 104 to the first thermal management circuit L1, thereby increasing the temperature and / or pressure of the refrigerant at the compressor 101 inlet. This promotes efficient operation of the compressor 101. Especially when the ambient temperature is low, for example, below the aforementioned preset first temperature threshold, the heat released by the solid-state refrigeration module 104 to the first thermal management circuit L1 can raise the temperature and / or pressure at the compressor 101 inlet to reach the temperature and pressure range within which the compressor 101 can start and operate normally. This allows the compressor 101 to start normally in low-temperature environments. Placing the solid-state cooling module 104 at the inlet of the compressor 101 can more quickly increase the temperature and / or pressure at the inlet of the compressor 101. In other possible implementations, where the thermal management system performs a heating function, the solid-state cooling module 104 can also be placed at any position in the first thermal management loop L1.

[0088] In one possible implementation, if the thermal management system performs a cooling function, the solid-state refrigeration module 104 can be connected to the outlet of the compressor 101. That is, the solid-state refrigeration module 104 is placed at the outlet of the compressor 101, as shown in Figure 7B or Figure 7D. For example, the second heat exchanger 105 in the first thermal management loop L1 in Figure 7B can be an evaporator. In this case, the first thermal management loop L1 is the cooling loop, meaning that cooling is achieved by absorbing the temperature of the surrounding air through the second heat exchanger 105; the specific cooling process will not be elaborated further. Figure 7D is obtained by adding a warm air loop Lh and a cooling loop Lc to Figure 7B. For the implementation process of the warm air loop Lh, the cooling loop Lc, and the cooling achieved through the cooling loop Lc, please refer to the relevant descriptions in Figure 7 above; they will not be repeated here. Placing the solid-state refrigeration module 104 at the outlet of the compressor 101 allows the solid-state refrigeration module 104 to absorb heat from the first thermal management loop L1, thereby reducing the temperature in the first thermal management loop L1 and improving the operating efficiency of the compressor. Especially when the ambient temperature is high, such as above the aforementioned preset second temperature threshold, the solid-state refrigeration module 104 can absorb heat from the first thermal management circuit L1, ensuring that the temperature and / or pressure at the inlet of the compressor 101 are within the normal operating temperature and / or pressure range. This allows the compressor 101 to operate efficiently. Placing the solid-state refrigeration module 104 at the outlet of the compressor 101 allows for faster absorption of heat from the first thermal management circuit L1. In other possible implementations, where the thermal management system performs the cooling function, the solid-state refrigeration module 104 can be placed at any location within the first thermal management circuit L1.

[0089] For example, a thermal management system including the thermal management loops shown in Figures 7A, 7B, 7C, or 7D may further include a third thermal management loop L3. For ease of understanding, please refer to Figure 8. Figure 8 is derived from the thermal management loop shown in Figure 7C. Figures 7A, 7B, and 7D are similar and will not be described in detail again.

[0090] As shown in Figure 8, the third thermal management loop L3 includes a first water pump 103, a first heat exchange channel of a first heat exchanger 102, and a radiator 111. Exemplarily, the radiator 111 can be used to dissipate heat from the third thermal management loop L3 to the surrounding environment. Exemplarily, the radiator 111 may also include a fan 1111. The fan 1041 can be used to increase the airflow speed, thereby enhancing the heat dissipation effect. The flow direction of the third thermal management loop L3 is shown in Figure 8. Further details are omitted.

[0091] For example, in Figure 8, the solid-state refrigeration module 104 can be used to release heat to the first thermal management circuit L1 when the thermal management system is in heating mode. For ease of understanding, this is illustrated in conjunction with Figure 8. As shown in Figure 8, the aforementioned thermal management system may also include a warm air circuit Lh. The composition of this warm air circuit Lh can be found in the relevant description in Figure 6 above, and will not be repeated here. When the thermal management system is in heating mode, if the ambient temperature is low, for example, below the aforementioned first temperature threshold, the solid-state refrigeration module 104 can be activated. A current in the first direction is applied to the solid-state refrigeration module 104. This causes the solid-state refrigeration module 104 to release heat to the first thermal management circuit L1, thereby increasing the temperature of the refrigerant in the flow channel of the first metal plate 201. The refrigerant, now at a higher temperature, flows to the compressor 101, causing the temperature and pressure at the compressor 101 inlet to rise to the temperature and pressure range within which the compressor can start and operate normally. This allows the compressor 101 to start normally in low-temperature environments. After the compressor 101 starts, it can output high-temperature, high-pressure refrigerant. High-temperature, high-pressure refrigerant is introduced into the second heat exchanger 105 to exchange heat with the aforementioned warm air circuit Lh. In the warm air circuit Lh, the high-temperature coolant, after heat exchange in the second heat exchanger 105, flows to the warm air core under the drive of the second water pump 107. The warm air core then transfers heat to the surrounding air to achieve heating.

[0092] For example, in one possible implementation, if the ambient temperature is low and the thermal management system is in heating mode, the radiator 111 in the third thermal management loop L3 may not be turned on.

[0093] It is understood that Figure 8 above is merely an example and does not constitute a limitation on the embodiments of this application. The devices included in the first thermal management circuit L1, the third thermal management circuit L3, and the heater circuit Lh shown in Figure 8 are merely examples. In some possible implementations, these thermal management circuits may also include other devices, such as multi-way valves, one-way valves, expansion valves, or three-way interfaces, etc., and this application embodiment does not impose any limitations on this. Alternatively, in some possible implementations, if the above-mentioned thermal management system is a thermal management system in a vehicle, the third thermal management circuit L3 shown in Figure 8 may also include the vehicle's electric drive unit. In this case, the thermal management system can recover the heat generated by the operation of the electric drive unit for heating the passenger compartment. Specific implementation details are not elaborated in the embodiments of this application.

[0094] Exemplary examples are provided in other possible implementations where the solid-state cooling module 104 is not limited to being disposed in the first thermal management circuit L1. For example, it may be disposed in other thermal management circuits within the thermal management system, such as the heating circuit Lh or the cooling circuit Lc, etc. These will not be elaborated upon further in this application.

[0095] In one possible implementation, the solid-state cooling module 104 may further include a fan. For ease of understanding, please refer to Figure 9 as an example. Figure 9 is illustrated in conjunction with Figure 1; Figures 6, 7A to 7D, and 8 are similarly illustrated and will not be repeated. The fan 1041 shown in Figure 9 is the fan included in the solid-state cooling module 104. This fan 1041 can be used to increase the airflow rate, thereby accelerating the heat exchange between the second metal plate 202 and the air in the solid-state cooling module 104 and improving heat exchange efficiency.

[0096] In one possible implementation, the thermal management system shown in any of Figures 1, 6, or 7 may further include a fourth thermal management loop L4. For ease of understanding, please refer to Figure 10 as an example. Figure 10 is illustrated in conjunction with Figure 1; Figures 6 and 7 are similar and will not be described again. As shown in Figure 10, the fourth thermal management loop L4 includes a first water pump 103, a first heat exchange channel of a first heat exchanger 102, and a radiator 111. A description of the radiator 111 can be found in the relevant descriptions in the aforementioned figures and will not be repeated here.

[0097] For example, in Figure 10 above, the first thermal management circuit L1 and the fourth thermal management circuit L4 can be connected via a three-way valve 112 and a three-way port 113. For example, the ratio of coolant flowing to the solid-state cooling module 104 and to the radiator 111 can be controlled by adjusting the valve of the three-way valve 112. Alternatively, the circulation flow of the first thermal management circuit L1 and / or the fourth thermal management circuit L4 can be closed by adjusting the valve of the three-way valve 112. The specific implementation of adjusting the valve of the three-way valve 112 is based on actual application requirements, and this embodiment does not limit this.

[0098] One possible implementation can be illustrated by Figure 11. The solid-state cooling module 104 and the heat sink 111 can share a single fan 1111. In this case, the solid-state cooling module 104 can be located within the air intake duct of the heat sink. This saves one fan and the space required for fan placement. Figure 11 is an example based on Figure 1; Figures 6 and 7 are similar and will not be described in detail here.

[0099] In one possible implementation, the thermal management system shown in any of Figures 1, 6, or 7 above further includes a radiator 111 in the first thermal management loop L1. For ease of understanding, please refer to Figure 12 as an example. Figure 12 is illustrated in conjunction with Figure 1; Figures 6 and 7 are similarly illustrated and will not be repeated. As shown in Figure 12, the solid-state cooling module 104 and the radiator 111 can be connected in series in the first thermal management loop L1. This simplifies the coolant flow path and reduces the cost of a three-way valve compared to Figures 10 or 11.

[0100] In summary, in this embodiment, the solid-state cooler 203 in the solid-state cooling module 104 can absorb or release heat. Utilizing this principle, by setting the solid-state cooling module 104 in the first thermal management circuit L1, in the case of an excessively cold environment, the solid-state cooler 203 can release heat to the first metal plate 201. The first metal plate 201 can then transfer heat to the fluid in the thermal management circuit, increasing the fluid's temperature. This allows the thermal management system to start operating normally and provide heating. Alternatively, in the case of an excessively hot environment, the solid-state cooler 203 and the first metal plate 201 can absorb heat from the first thermal management circuit L1, lowering the temperature within the thermal management system. This allows the thermal management system to cool normally and improves cooling efficiency.

[0101] For example, to further demonstrate that the solution of this application embodiment can efficiently heat in low-temperature environments, please refer to Figure 13. Figure 13 is an exemplary schematic diagram comparing the operating temperature range and energy efficiency of the thermal management system provided by this solution with that of a traditional thermal management system. For example, in Figure 13, the horizontal axis represents the ambient temperature, and the vertical axis represents the coefficient of performance (COP). Under heating conditions, COP, also known as the heating energy efficiency ratio, refers to the ratio of the heating capacity per unit time to the power consumed per unit time. The higher the COP, the better the heating performance.

[0102] In Figure 13, the solid line represents a schematic curve showing the change in the energy efficiency ratio (EER) of the thermal management system provided by this solution with ambient temperature. The dashed line represents a schematic curve showing the change in the EER of a conventional thermal management system with ambient temperature. For example, the EER curve of the thermal management system provided by this solution can be obtained through simulation based on the thermal management system shown in Figure 14. Figure 14 is obtained by adding the heating loop Lh to Figure 10 above. The heating loop Lh can be found in the relevant description in Figure 6 above, and will not be repeated here.

[0103] For example, the two energy efficiency ratio curves shown in Figure 13 were obtained through simulation under the same ambient temperature and the same in-vehicle temperature conditions. Comparing the two curves, it can be seen that the thermal management system using this embodiment still has an energy efficiency ratio greater than 1 when the ambient temperature reaches -40°C, meaning it can still operate efficiently. In contrast, the energy efficiency ratio of a traditional thermal management system drops to 1 when the ambient temperature reaches -20°C, and if the ambient temperature drops further, the energy efficiency ratio is less than 1, resulting in very low efficiency, and it may even be unable to operate normally for heating. Furthermore, under operating conditions where the ambient temperature is between -20°C and 10°C, the energy efficiency ratio of the thermal management system using this solution is also significantly greater than that of the traditional thermal management system, for example, by 14% to 31%. It is evident that the thermal management system using this solution can still operate efficiently at temperatures reaching -40°C. The operable ambient temperature is 20° lower than that of the traditional thermal management system, and the system's energy efficiency ratio is also greatly improved.

[0104] It is understood that the devices included in each loop of the various possible thermal management systems shown above are merely examples and do not constitute a limitation on the embodiments of this application. In specific implementations, each loop may include more or fewer devices, and the embodiments of this application do not impose any limitations on this.

[0105] This application also provides a vehicle that may include the thermal management system described in any of the possible embodiments described above.

[0106] It should be understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0107] It should also be understood that the term “comprising” (also referred to as “includes”, “including”, “comprises” and / or “comprising”) as used in this specification specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0108] It should also be understood that the phrases "an embodiment," "an embodiment," and "a possible implementation" used throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment or implementation is included in at least one embodiment of this application. Therefore, the phrases "in an embodiment," "an embodiment," or "a possible implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thermal management system, characterized in that, The thermal management system includes a solid-state refrigeration module and a compressor; The solid-state refrigeration module is used to release heat to the thermal management circuit where the compressor is located when the thermal management system performs the heating function; and / or, the solid-state refrigeration module is used to absorb heat in the thermal management circuit where the compressor is located when the thermal management system performs the cooling function. The solid-state refrigeration module includes a first metal plate, a solid-state cooler, and a second metal plate. The first metal plate has a flow channel for fluid circulation, and the solid-state cooler is used to achieve heat exchange between the first metal plate and the second metal plate.

2. The thermal management system according to claim 1, characterized in that, The flow channel in the first metal plate of the solid-state refrigeration module is arranged in the first thermal management loop of the thermal management system. The first thermal management loop further includes a first heat exchange channel of a first heat exchanger; the first heat exchanger is used to realize heat exchange between the first thermal management loop and the second thermal management loop in the thermal management system, and the second thermal management loop includes the compressor and the second heat exchange channel of the first heat exchanger.

3. The thermal management system according to claim 1, characterized in that, The flow channel in the first metal plate of the solid-state refrigeration module is located in the thermal management circuit of the compressor.

4. The thermal management system according to claim 3, characterized in that, If the thermal management system performs a heating function, the flow channel in the first metal plate is connected to the inlet of the compressor; or, if the thermal management system performs a cooling function, the flow channel in the first metal plate is connected to the outlet of the compressor.

5. The thermal management system according to any one of claims 1-4, characterized in that, The solid-state cooler is any one of the following: thermoelectric semiconductor cooler, electric card cooler, magnetic cooler, piezoelectric cooler, torsional heat cooler, and elasto-thermal cooler.

6. The thermal management system according to any one of claims 1-5, characterized in that, The solid-state cooler may include multiple solid-state cooling modules, which are laid flat between the first metal plate and the second metal plate.

7. The thermal management system according to any one of claims 1-5, characterized in that, The solid-state cooler may include multiple solid-state cooling modules, which are stacked between the first metal plate and the second metal plate.

8. The thermal management system according to any one of claims 1-5, characterized in that, The solid-state cooler may include multiple solid-state cooling modules, which are arranged in a flat and stacked manner between the first metal plate and the second metal plate.

9. The thermal management system according to claim 2, characterized in that, The thermal management system also includes a third thermal management loop; The third thermal management loop includes the first water pump, the second heat exchange channel of the first heat exchanger, and the radiator.

10. The thermal management system according to claim 9, characterized in that, The solid-state cooling module is located inside the air intake duct of the radiator.

11. The thermal management system according to claim 2, characterized in that, The first thermal management circuit also includes a heat sink.

12. The thermal management system according to any one of claims 1-11, characterized in that, The solid-state cooling module also includes a fan.

13. The thermal management system according to claim 9 or 10, characterized in that, The thermal management system further includes a three-way valve; the first port of the three-way valve is connected to the second heat exchange channel of the first heat exchanger, the second port of the three-way valve is connected to the solid-state refrigeration module, and the third port of the three-way valve is connected to the radiator.

14. A vehicle, characterized in that, The vehicle includes a thermal management system as described in any one of claims 1-13.

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