Surface liquid evaporation refrigeration apparatus and consumer electronic product

Abstract

Disclosed in the present utility model are a surface liquid evaporation refrigeration apparatus and a consumer electronic product. The surface liquid evaporation refrigeration apparatus comprises a housing, an inner container, a fan, a heat dissipation panel and a water absorption member; the bottom of the housing is provided with an open cavity, and first through holes extending through the open cavity is formed on the top of the housing; the inner container is provided with a second through hole passing through two end walls, a water containing cavity circumferentially provided around the second through hole, and water delivery ports extending from the bottom of the inner container to the water containing cavity; the inner container is arranged in the open cavity; the fan is arranged in the second through hole; the second through hole is in communication with the first through holes; the heat dissipation panel is arranged at the bottom of the housing; the water absorption member is arranged on the side surface of the heat dissipation panel close to the inner container; and the water absorption member is connected to the water delivery ports. In the present utility model, the fan, the heat dissipation panel and the water absorption member work in conjunction to transfer the heat of an electronic device to the water absorption member by means of the heat dissipation panel, so that the liquid evaporates to generate water vapor. Under the action of the airflow of the fan, the evaporation rate of the liquid is accelerated, and the water vapor dissipates the heat to the outside by means of the through holes, so that the temperature of the device is quickly reduced, thereby achieving efficient heat dissipation of the electronic device.

Description

A surface liquid evaporation cooling device and consumer electronics product Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a surface liquid evaporation refrigeration device and a consumer electronics product. Background Technology

[0002] With the widespread use of mobile electronic devices, such as smartphones, tablets, and laptops, these products have become indispensable tools in daily life and work. These devices offer users great convenience due to their high performance, versatility, and portability. However, as the hardware performance of these devices continues to improve, the heat generated during operation also increases significantly, especially in high-load application scenarios such as gaming, video editing, or long online meetings, where overheating becomes increasingly apparent. To address this overheating issue, external or internal cooling auxiliary devices have emerged to ensure the normal operation of the devices and extend their lifespan.

[0003] Currently, common external heat dissipation devices include traditional electric fans and heat sinks based on semiconductor cooling technology. Electric fans remove heat from the surface of the device through airflow and are characterized by their simple structure and low cost; while semiconductor heat sinks utilize the thermoelectric effect, using a cooling element to conduct heat from one side to the other, and further dissipating the heat to the surrounding environment in conjunction with the heat sink and fan. These technologies have alleviated the problem of heat buildup in electronic devices to some extent and have been applied in many scenarios.

[0004] However, existing heat dissipation solutions have many shortcomings. Taking electric fans as an example, due to the low heat capacity and limited conductivity of air, their heat dissipation efficiency is relatively low. Furthermore, fans are large and not very portable, making them unsuitable for small devices. Semiconductor heat sinks, on the other hand, typically require a heatsink and a fan, resulting in an overall thickness of several centimeters or even tens of centimeters. They are bulky, inconvenient to use, require an external power supply, and consume more power and generate more noise. In addition, the cooling efficiency of semiconductor cooling chips heavily depends on the heat dissipation effect of the heat dissipation surface. Insufficient surface performance not only leads to low efficiency but may even exacerbate overheating problems due to heat backflow. Therefore, existing technologies cannot fully meet the needs of small electronic devices and human comfort for portable, efficient, and low-noise heat dissipation. Summary of the Invention

[0005] This invention provides a surface liquid evaporation cooling device to solve the technical problem that existing cooling devices have low heat dissipation efficiency and are unable to meet the rapid heat dissipation requirements of electronic devices.

[0006] To solve the above-mentioned technical problems, this utility model provides a surface liquid evaporation cooling device, including a shell, an inner liner, a fan, a heat sink, and a water suction component. The bottom of the shell has an opening, and the top of the shell has a first through hole extending to the opening. The inner liner is provided with a second through hole penetrating both end walls, a water-containing cavity circumferentially opened along the second through hole, and multiple water inlets penetrating the bottom of the inner liner to the water-containing cavity. The inner liner is disposed in the opening, the fan is disposed in the second through hole, and the second through hole communicates with the first through hole. The heat sink is disposed at the bottom of the shell, and the water suction component is disposed on the surface of the heat sink near the inner liner, and the water suction component is connected to the water inlets.

[0007] Furthermore, an evaporation chamber is formed at the bottom of the inner liner and the top of the water-absorbing component, and a plurality of heat dissipation holes are circumferentially opened along the side wall of the outer shell, extending into the evaporation chamber, and the heat dissipation holes are evenly arranged on the side wall of the outer shell.

[0008] Furthermore, a water conveying component is provided on the water inlet. One end of the water conveying component is disposed in the water-containing cavity, and the other end extends through the water inlet into the evaporation chamber and is connected to the water-absorbing component, for conveying the liquid in the water-containing cavity to the water-absorbing component.

[0009] Furthermore, the water supply component includes a water supply pipe and a guide column disposed inside the water supply pipe. One end of the water supply pipe is fixed to the surface of the heat dissipation plate, and the other end extends through the water inlet into the water-containing cavity. The two ends of the water supply pipe are respectively provided with a first notch and a second notch that penetrate through the side wall of the water supply pipe to the outer wall of the guide column. The first notch is located inside the water-containing cavity, and the second notch is located inside the evaporation chamber and connected to the water-absorbing component.

[0010] Furthermore, the outer diameter of the guide column is smaller than the diameter of the water supply pipe, and the length of the guide column is greater than or equal to the length of the water supply pipe.

[0011] Furthermore, the guide column can be made of one or more of the following materials: rubber, glass fiber, plastic fiber, or cotton fiber.

[0012] Furthermore, the first notch extends from the end of the water pipe to the bottom of the water-containing cavity.

[0013] Furthermore, the heat dissipation plate has an annular groove on the side near the water-absorbing component, and a magnetic suction ring is embedded in the annular groove.

[0014] Furthermore, the outer shell sidewall is provided with a first water inlet, and the inner liner sidewall is provided with a second water inlet that extends into the water-containing cavity. The first water inlet corresponds to the second water inlet, and a water inlet plug is provided on the first water inlet to close the first water inlet.

[0015] On the other hand, this utility model also provides a consumer electronic product that uses the above-mentioned surface liquid evaporation cooling device for heat dissipation.

[0016] Compared with the prior art, the surface liquid evaporation cooling device of this utility model has the following advantages:

[0017] This utility model embodiment, by setting up a fan, heat sink, and water-absorbing component that cooperate with each other, allows for auxiliary heat dissipation when the device is used. Simply place the side with the heat sink against the surface of the electronic device requiring heat dissipation. The water-containing chamber inside the liner will deliver liquid to the water-absorbing component through a water outlet at its bottom, keeping the component moist. The heat generated by the electronic device will be conducted to the water-absorbing component through the heat sink, causing the liquid in the water-absorbing component to evaporate and generate water vapor. Under the auxiliary airflow of the fan, the evaporation rate of the liquid on the water-absorbing component is significantly accelerated. The water vapor, further propelled by the airflow, will efficiently expel the heat from the heat sink to the outside through the second and first through holes, causing the temperature of the electronic device to drop rapidly, ultimately achieving the purpose of heat dissipation. This effectively avoids the backheating phenomenon caused by water vapor condensation inside the device, optimizes the heat conduction path of the heat sink, and significantly enhances the evaporation rate of the liquid through forced airflow circulation, greatly improving the cooling effect of the device. Thanks to its rational structural design and liquid evaporation refrigeration principle, this device not only achieves efficient heat dissipation but also features energy saving, environmental protection, and convenient maintenance. Only a small amount of liquid needs to be added during use, significantly reducing operating costs. Its green and environmentally friendly design demonstrates broad application value. Furthermore, the device is compact and lightweight, with low energy consumption and low noise, making it easy to carry and install, and possessing strong adaptability.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0019] The accompanying drawings are provided for a better understanding of this solution and do not constitute a limitation on this utility model. Wherein:

[0020] Figure 1 is a structural schematic diagram of the surface liquid evaporation cooling device provided in an embodiment of the present invention from one angle.

[0021] Figure 2 is a structural schematic diagram of the surface liquid evaporation cooling device provided in an embodiment of the present invention from another angle;

[0022] Figure 3 is a structural schematic diagram of the surface liquid evaporation cooling device provided in an embodiment of the present invention from another angle;

[0023] Figure 4 is an exploded structural diagram of the surface liquid evaporation cooling device provided in an embodiment of this utility model;

[0024] Figure 5 is a structural schematic diagram of the inner liner at one angle in the surface liquid evaporation cooling device provided in this embodiment of the present invention.

[0025] Figure 6 is a cross-sectional view of the inner liner along direction AA in Figure 5;

[0026] Figure 7 is a partial cross-sectional view of the inner liner at one angle in the surface liquid evaporation cooling device provided in this embodiment of the present invention;

[0027] Figure 8 is a magnified view of part B in Figure 7;

[0028] Figure 9 is a structural schematic diagram of the outer shell at an angle in the surface liquid evaporation cooling device provided in an embodiment of the present invention;

[0029] Figure 10 is a schematic diagram of the water supply component in the surface liquid evaporation cooling device provided in this embodiment of the present invention.

[0030] Figure 11 is a schematic diagram of the structure of the heat sink plate with magnetic ring in the surface liquid evaporation cooling device provided in the embodiment of the present invention;

[0031] Figure 12 is a schematic diagram of the structure of the general-purpose heat sink in the surface liquid evaporation cooling device provided in the embodiment of this utility model.

[0032] In the diagram, 10 is the outer shell; 11 is the opening; 12 is the first through hole; 13 is the heat dissipation hole; 14 is the first water inlet; 15 is the water inlet plug; 20 is the inner liner; 21 is the second through hole; 22 is the water-containing cavity; 23 is the water inlet; 24 is the second water inlet; 25 is the mounting groove; 26 is the waterproof cover; 30 is the water supply component; 31 is the water supply pipe; 311 is the first notch; 312 is the second notch; 32 is the guide column; 40 is the heat dissipation plate; 41 is the annular groove; 42 is the magnetic ring; 43 is the magnetic component; 50 is the fan; 60 is the water suction component; 70 is the driving component; 71 is the battery; 72 is the circuit board; 73 is the switch; and 74 is the indicator light. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] In the description of this utility model, it should be noted that the directional terms such as "middle", "upper", "lower", "inner", and "outer" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature, and in this description of the utility model, "at least" means one or more, unless otherwise explicitly specified.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] As shown in Figures 1-9, this utility model embodiment provides a surface liquid evaporation cooling device, including a shell 10, an inner liner 20, a fan 50, a heat dissipation plate 40, and a water-absorbing component 60. The bottom of the shell 10 has an opening 11, and the top of the shell 10 has a first through hole 12 that extends to the opening 11. The inner liner 20 is provided with a second through hole 21 that extends through both end walls, a water-containing cavity 22 that is circumferentially opened along the second through hole 21, and a plurality of water inlets 23 that extend from the bottom of the inner liner 20 to the water-containing cavity 22. The inner liner 20 is disposed in the opening 11, the fan 50 is disposed in the second through hole 21, the second through hole 21 is connected to the first through hole 12, the heat dissipation plate 40 is disposed at the bottom of the shell 10, and the water-absorbing component 60 is disposed on the side surface of the heat dissipation plate 40 near the inner liner 20, and the water-absorbing component 60 is connected to the water inlets 23.

[0038] This embodiment of the invention, by setting up a fan 50, a heat sink 40, and a water-absorbing component 60 that cooperate with each other, allows for auxiliary heat dissipation when the device is used. Simply place the side with the heat sink 40 against the surface of the electronic device requiring heat dissipation. The water-containing cavity 22 inside the inner tank 20 will deliver internal liquid to the water-absorbing component 60 through the water inlet 23 at its bottom, keeping the water-absorbing component 60 moist. The heat generated by the electronic device is conducted to the water-absorbing component 60 through the heat sink 40, causing the liquid in the water-absorbing component 60 to evaporate and generate water vapor. Under the auxiliary airflow of the fan 50, the evaporation rate of the liquid on the water-absorbing component 60 is significantly accelerated. The water vapor, further propelled by the airflow, will efficiently expel the heat from the heat sink 40 to the outside through the second through-hole 21 and the first through-hole 12, causing the temperature of the electronic device to drop rapidly, ultimately achieving the purpose of heat dissipation. This effectively avoids the backheating phenomenon caused by water vapor condensation inside the device, optimizes the heat conduction path of the heat sink 40, and significantly enhances the evaporation rate of the liquid through forced airflow circulation, greatly improving the cooling effect of the device. Thanks to its rational structural design and liquid evaporation refrigeration principle, this device not only achieves efficient heat dissipation but also features energy saving, environmental protection, and convenient maintenance. Only a small amount of liquid needs to be added during use, significantly reducing operating costs. Its green and environmentally friendly design demonstrates broad application value. Furthermore, the device is compact and lightweight, with low energy consumption and low noise, making it easy to carry and install, and possessing strong adaptability.

[0039] The heat sink 40 is made of materials with good thermal conductivity, such as aluminum, copper, and aluminum alloys. These materials have relatively ordered molecular arrangements, and according to the law of thermal conduction, heat always flows from a hotter object to a cooler one. The heat sink 40 effectively transfers heat from the electronic device to the absorbent component 60 and other parts. To achieve rapid wetting and evaporation, the absorbent component 60 can be made of highly absorbent materials such as absorbent cotton, non-woven fabric, fibrous materials, or capillary materials. The liquid in the absorbent component 60 is evenly distributed through the capillary action of the absorbent cotton, effectively storing the liquid and releasing it promptly when needed, thus promoting evaporation. The absorbent component 60 is typically sheet-like and adhered to the surface of the heat sink 40. The absorbent cotton is in close contact with the heat sink 40, enabling more efficient transfer of heat absorbed by the heat sink 40 to the absorbent component 60. This makes it easier for the liquid in the absorbent component 60 to absorb the heat conducted by the heat sink 40, thereby accelerating evaporation.

[0040] The outer shell 10 and the inner liner 20 can be manufactured as a single piece, that is, directly produced as an integral component through processes such as injection molding and die casting. On one hand, this integrated structure eliminates connection points found in traditional designs, reducing potential problems such as weak connections and inadequate sealing. Under high temperatures or prolonged use, it prevents loosening and leakage caused by material expansion, contraction, or vibration, effectively enhancing the overall stability and durability of the device. On the other hand, the integrated molding of the outer shell 10 and the inner liner 20 reduces or completely eliminates seams or connections between the inner liner 20 and the outer shell 10, avoiding potential sealing or leakage problems that might occur with traditional connection methods between the inner liner 20 and the outer shell 10. Especially in liquid transfer systems (such as the water chamber 22 and the water inlet 23), this structural design effectively prevents liquid leakage and vapor overflow, ensuring the device's sealing and normal operation.

[0041] Furthermore, to improve the stability of liquid transfer to the suction element 60 and ensure reliable operation of the device under various usage conditions, multiple water inlets 23 are distributed at the bottom of the water chamber 22. Even if the device tilts at a large angle, the liquid in the water chamber 22 can still flow out through one or more of the water inlets 23 under the influence of gravity, avoiding the problem of water interruption in the suction element 60 due to the inability of a single water inlet 23 to supply water in time. At the same time, the flow path of the liquid in the water chamber 22 may change under different usage environments (such as uneven placement surfaces, vibration conditions, etc.). The design of multiple water inlets 23 provides multiple flow paths for the liquid, and multiple water inlets 23 can disperse the liquid flow pressure, avoiding uneven flow rate or blockage caused by single-point water outlet. This not only makes more efficient use of the liquid in the water chamber 22, but also ensures uniform wetting of the suction element 60, thereby improving the overall cooling effect.

[0042] It should be noted that liquid evaporation is an endothermic process, meaning that a liquid absorbs energy when it changes from a liquid to a gaseous state. During evaporation, high-energy molecules on the liquid surface detach and carry away heat, thus lowering the liquid's temperature. At this time, the liquid absorbs heat from the surrounding environment, typically through heat transfer from contact surfaces (such as heat sink 40). The main reason for accelerating liquid evaporation and removal via fan 50 is that if water vapor is not removed promptly and instead remains inside the device or on its surface, it will cool and condense into water droplets. The potential heat released during condensation can have a counter-effect on the heat dissipation system, reducing the device's heat dissipation efficiency and even causing the device temperature to rise. By promptly removing water vapor, the backheating phenomenon of heat sink 40 can be effectively avoided, achieving rapid heat dissipation.

[0043] As shown in Figures 1-4, in an optional embodiment of this utility model, an evaporation chamber is formed at the bottom of the inner liner 20 and the top of the water-absorbing member 60, and a plurality of heat dissipation holes 13 extending into the evaporation chamber are provided circumferentially along the side wall of the outer shell 10, and the heat dissipation holes 13 are evenly arranged on the side wall of the outer shell 10.

[0044] Specifically, an evaporation chamber is formed between the bottom of the inner liner 20 and the top of the absorbent 60, providing sufficient flow space for liquid evaporation. Water vapor can be effectively released and its accumulation avoided. This effective water vapor release space allows for smooth airflow, enhancing the efficiency of the evaporation process and ensuring that water vapor can quickly and effectively carry away heat, resulting in better heat dissipation for the electronic device. Simultaneously, multiple evenly arranged heat dissipation holes 13 on the side walls of the outer casing 10 increase airflow channels, allowing airflow to circulate fully between the evaporation chamber and the outside environment, carrying away the generated water vapor. This enhances the overall heat dissipation of the device, preventing localized water vapor accumulation that could obstruct airflow, thereby improving the liquid evaporation rate and the efficiency of heat removal.

[0045] It should be noted that the liquid in the water-receiving cavity 22 can be selected according to different application requirements. The selected liquid should have good evaporation characteristics, be able to evaporate rapidly at a low temperature and absorb heat, thereby effectively removing the heat generated by the electronic equipment. Common liquids such as water, ethanol, and acetone have good evaporation characteristics and can be used for efficient heat dissipation.

[0046] As shown in Figures 6, 7 and 8, in an optional embodiment of this utility model, a water conveying component 30 is provided on the water inlet 23. One end of the water conveying component 30 is disposed in the water holding chamber 22, and the other end extends through the water inlet 23 into the evaporation chamber and is connected to the water suction component 60, for conveying the liquid in the water holding chamber 22 to the water suction component 60.

[0047] Specifically, because the device is arranged at varying angles during use, the liquid may not flow stably due to gravity. By installing water delivery components 30 between the water-receiving chamber 22 and the suction component 60, with the number of components 30 matching the number of inlets 23, the liquid flows more stably and evenly from the water-receiving chamber 22 to the suction component 60. This promotes capillary action in the suction component 60, effectively preventing poor liquid flow or uneven distribution. This allows the device to operate stably under different operating conditions, reducing liquid waste, enhancing its adaptability, and lowering energy consumption, aligning with the principles of energy conservation and environmental protection. The water delivery components 30 can be made of different materials, such as water pipes 31 or suction rods. These materials not only effectively absorb liquid but also provide better evaporation, further enhancing heat dissipation efficiency. In particular, absorbent rods, such as those made of polypropylene, cotton fiber, and polyurethane foam, have good liquid adsorption and flow guiding capabilities. Even when the device is tilted at a large angle or even inverted, they can still deliver the liquid evenly to the surface of the absorbent 60. They can adapt to different usage environments, have strong stability and adaptability, and are not prone to uneven liquid flow or stagnation due to gravity or tilt angle.

[0048] It should be noted that, in order to further improve the stability and reliability of liquid delivery, the liquid supply process is optimized by setting a water delivery component 30 at the water inlet 23 and introducing a liquid delivery device. The introduction of a liquid delivery device (such as a micro pump, liquid level control device, etc.) in conjunction with the water delivery component 30 (such as a water delivery pipe 31) can provide additional power support for the flow of liquid, solving the problem of insufficient gravity caused by excessive device tilt angle or low liquid level in water chamber 22 leading to poor water delivery. The liquid delivery device can directionally drive the liquid through the water delivery component 30 to the water suction component 60, thereby ensuring that the water suction component 60 is always wet to maintain its normal capillary action.

[0049] As shown in Figures 8 and 10, in an optional embodiment of this utility model, the water supply component 30 includes a water supply pipe 31 and a guide column 32 disposed in the water supply pipe 31. One end of the water supply pipe 31 is fixed to the surface of the heat dissipation plate 40, and the other end extends through the water inlet 23 into the water-containing cavity 22. The two ends of the water supply pipe 31 are respectively provided with a first notch 311 and a second notch 312 that penetrate the side wall of the water supply pipe 31 to the outer wall of the guide column 32. The first notch 311 is located in the water-containing cavity 22, and the second notch 312 is located in the evaporation chamber and connected to the water absorption component 60.

[0050] Specifically, the guide column 32 is installed inside the water supply pipe 31 to guide the liquid along the wall of the water supply pipe 31 or a specific path, avoiding turbulence or stagnation within the water supply pipe 31. This effectively regulates the liquid flow rate within the water supply pipe 31, preventing excessively rapid flow and ensuring that the liquid enters the water-containing chamber 22 and the evaporation chamber at a uniform flow rate, thereby guaranteeing the stability and reliability of the system. Simultaneously, the water supply pipe 31 has a first notch 311 and a second notch 312 penetrating from the side wall of the water supply pipe 31 to the outer wall of the guide column 32 at both ends. The number of first notches 311 and second notches 312 is typically multiple. The first notch 311 is located inside the water-receiving chamber 22, serving as the inlet of the water supply pipe 31. This notch ensures that the liquid in the water-receiving chamber 22 can smoothly enter the water supply pipe 31, preventing flow obstruction due to a single opening, improving the efficiency and uniformity of liquid inflow, and reducing resistance during the flow process. The second notch 312 is located inside the evaporation chamber and connects to the water-absorbing component 60. Liquid can flow through the second notch 312 from all directions to the water-absorbing component 60, accelerating its wetting speed and ensuring it remains relatively moist, thus improving the overall system efficiency. Uniform liquid distribution prevents localized drying or over-wetting, ensuring normal operation of the equipment.

[0051] By incorporating a flow-limiting guide column 32 within the water pipe 31, combined with the ingenious design of the first notch 311 and the second notch 312, the water flow velocity can be precisely adjusted. This effectively controls the water flow during transport, preventing waste caused by excessively fast flow and ineffective transport due to excessively slow flow. The guide column 32 regulates the water flow by narrowing the flow channel and limiting the velocity, ensuring a reasonable speed during transport. This regulation allows the system to guarantee stable water transport while avoiding energy loss and potential resource waste caused by excessive flow velocity.

[0052] As shown in Figure 10, in an optional embodiment of this utility model, the outer diameter of the guide column 32 is smaller than the diameter of the water supply pipe 31, and the length of the guide column 32 is greater than or equal to the length of the water supply pipe 31.

[0053] Specifically, the outer diameter of the guide column 32 is smaller than the diameter of the water supply pipe 31. This allows the liquid to form a flow space around the guide column 32, enabling the liquid to smoothly enter the water supply pipe 31 through the first notch 311 and flow along the pipe, eventually reaching the second notch 312 to avoid obstruction. This ensures a smoother and more uniform flow, improving the system's operating efficiency. Simultaneously, because there is a sufficient gap between the guide column 32 and the water supply pipe 31, the liquid can flow freely and be effectively regulated within this space, maintaining a uniform flow rate. This reduces the impact or instability caused by uneven liquid flow, ensuring stable system operation.

[0054] The length of the guide column 32 is greater than or equal to the length of the water supply pipe 31, effectively preventing the liquid flow direction from being affected when the device is tilted. The length of the guide column 32 ensures smooth liquid flow at any angle, avoiding irregular liquid flow that could affect the normal operation of the system. Simultaneously, the sufficient length of the guide column 32 facilitates easy insertion and removal for replacement and also makes it easy to clean the inner wall of the water supply pipe 31. Since impurities are inevitably present in the liquid used, these impurities accumulate and contaminate the pipe wall over time. The design of the guide column 32 allows for easy disassembly and cleaning of the water supply pipe 31 when cleaning is needed, extending the service life of the equipment. Furthermore, the length of the guide column 32 being greater than or equal to the length of the water supply pipe 31 avoids the risk of the guide column 32 falling out of the pipe due to being too short, ensuring its stability and reliability throughout use.

[0055] It should be noted that the height of the water pipe 31 inside the water chamber 22 is usually required to be 3 / 4 of the height of the water chamber 22. This height design can ensure that the liquid level in the water chamber 22 is maintained within a relatively stable range, and the water pipe 31 can smoothly absorb and transport liquid under most working conditions, thereby ensuring the sufficiency and stability of the liquid supply.

[0056] As shown in Figure 10, in an optional embodiment of this utility model, the guide column 32 may be made of one or more of the following materials: rubber, glass fiber, plastic fiber, or cotton fiber.

[0057] Specifically, when the device does not require excessively high flow rates, the flow guide column 32, made of rubber, fiberglass, or plastic fiber materials, can effectively regulate the liquid flow rate. Rubber, with its good flexibility and elasticity, can adapt to different working conditions and is particularly suitable for applications requiring lower flow rates. Fiberglass, with its strong temperature resistance, corrosion resistance, and strength, is suitable for applications requiring higher durability and stability. It can maintain stable performance under high flow rates or high temperatures, preventing damage to the flow guide column 32. Plastic fiber materials typically have lighter weight and higher strength, allowing the flow guide column 32 to maintain sufficient structural stability while reducing the overall weight of the device. This is significant for ease of installation, handling, and cost savings. When the device requires higher flow rates, cotton fiber materials, such as absorbent cotton swabs, can be used. Cotton fibers have good absorbency and breathability, allowing for better regulation and distribution of flow rate under higher flow rates, ensuring smooth and uniform liquid flow. Cotton fiber materials are particularly suitable for applications with high flow rates and high humidity.

[0058] It should be noted that, depending on the actual needs, the flow guide column 32 can be made of a combination of rubber, glass fiber, plastic fiber, and cotton fiber materials. For example, in applications requiring both low flow rates and a certain level of strength, rubber and glass fiber materials can be combined; while in scenarios requiring rapid moisture absorption and high flow rates, cotton fiber and rubber materials can be combined. This multi-material combination allows for more flexible adaptation to different working environments, improving the performance and stability of the equipment.

[0059] As shown in Figure 8, in an optional embodiment of the present invention, the first notch 311 extends from the end of the water supply pipe 31 to the bottom of the water-containing cavity 22.

[0060] Specifically, the first notch 311 serves as a water inlet, gradually extending from the end of the water supply pipe 31 to the bottom of the water-receiving cavity 22. This maximizes the smooth flow of liquid from the water-receiving cavity 22 into the water supply pipe 31, preventing situations where liquid cannot flow into the pipe due to an unsuitable notch position. This ensures the continuity and stability of liquid flow, reducing the possibility of liquid stagnation or obstructed flow in the water-receiving cavity 22. After entering through the first notch 311 and flowing to the second notch 312, the liquid effectively wets the absorber 60. The absorber 60 uniformly absorbs the liquid, ensuring it remains moist, thereby improving the heat dissipation efficiency of the device and achieving the expected performance.

[0061] As shown in Figure 11, in an optional embodiment of this utility model, the heat sink 40 has an annular groove 41 on the side near the water absorption member 60, and a magnetic ring 42 is embedded in the annular groove 41.

[0062] Specifically, by setting an annular groove 41 on the heat sink 40 and embedding a magnetic ring 42, the device can be conveniently and directly adsorbed onto the surface of electronic devices during use. Users can easily adsorb the device in the desired position, allowing it to be firmly attached to the electronic device without the need for additional support or fixing devices. This avoids the troublesome fixing or installation required by traditional devices, simplifies the operation process, and greatly improves the convenience and efficiency of the device. The magnetic ring 42 provides strong adsorption force, ensuring that the device will not easily slip or fall off during use. Even with slight vibrations on the device surface, the magnetic ring 42 maintains the stability of the device, ensuring good contact between the water-absorbing component 60 and the surface of the electronic device. The heat sink 40 with built-in magnetic ring 42 is typically suitable for electronic components, metal casings, magnetic supports, and other devices with built-in magnetic components 43. These devices are usually magnetic or can be adsorbed by additional magnetic components 43, allowing the heat sink 40 to be firmly adsorbed onto the surface of the electronic product requiring heat dissipation via the magnetic ring 42.

[0063] In order to make the surface liquid evaporation cooling device adaptable to more heat dissipation products, a universal heat dissipation plate 40 without magnetic ring 42 is also designed. The specific structure is as follows: multiple magnetic parts 43 are provided on the heat dissipation plate 40. When the device is used for heat dissipation, some of the magnetic parts 43 can be attached to the surface or back of the product that needs to be cooled. Then, with the remaining magnetic parts 43 on the heat dissipation plate 40, the surface liquid evaporation cooling device can also be firmly attached to the surface of the heat dissipation product.

[0064] It should be noted that different heat dissipation devices or electronic devices may have different surface materials and shapes. To improve the applicability of the device and accommodate various types of heat dissipation devices, in addition to the design of the magnetic ring 42, other fixing components can be set on the housing 10 or heat sink 40, such as fixing straps, fixing buckles, adhesive tapes, or PU nano anti-slip pads, etc., to ensure that the device can adapt to various surfaces and provide more fixing methods. Whether it is a smooth metal surface or a surface of other materials, the device can be firmly fixed by these additional fixing components.

[0065] As shown in Figures 2, 3 and 4, in an optional embodiment of this utility model, the outer shell 10 has a first water inlet 14 on its side wall, and the inner liner 20 has a second water inlet 24 that extends to the water-containing cavity 22 on its side wall. The first water inlet 14 corresponds to the second water inlet 24, and a water inlet plug 15 is provided on the first water inlet 14 for closing the first water inlet 14.

[0066] Specifically, by providing a first water inlet 14 and a second water inlet 24, the user can inject liquid through the first water inlet 14 when needed, and the liquid will flow into the water-containing chamber 22 through the second water inlet 24. The water inlet plug 15 can effectively seal the first water inlet 14 after water injection, preventing liquid leakage and ensuring that the system is not affected by liquid overflow during use, thus maintaining the stability and safety of the equipment.

[0067] It should be noted that the water inlet plug 15 prevents liquid leakage during equipment transportation or storage, ensuring the equipment remains sealed under various conditions. This design not only ensures stability during long-term storage and use but also effectively prevents liquid loss during equipment movement, enhancing the safety of the device.

[0068] As shown in Figures 2, 3 and 4, in an optional embodiment of this utility model, a drive component 70 and a waterproof cover 26 are also included. The drive component 70 is connected to the fan 50, and the waterproof cover 26 is disposed on the top of the inner liner 20. The top of the inner liner 20 is also provided with a mounting groove 25 corresponding to the waterproof cover 26, and the drive component 70 is disposed in the mounting groove 25.

[0069] Specifically, the waterproof cover 26 effectively prevents electronic components such as the battery 71 and circuit board 72 from being corroded by moisture, ensuring the device's long-term stable operation in humid environments. Especially when the fan 50 is operating, it may carry water vapor or droplets from the air; the waterproof cover 26 provides additional protection for internal components, preventing short circuits or corrosion caused by moisture. The drive unit 70 provides a continuous power source for the fan 50, and includes the battery 71 and circuit board 72. The battery 71 and circuit board 72 are housed within the mounting slot 25, ensuring their stable position and effectively reducing the impact of external vibrations on them, thereby improving the device's durability and safety. The integrated installation of the battery 71 and circuit board 72, in conjunction with the waterproof cover 26, makes the entire device more compact, effectively protecting the internal components. Simultaneously, the design of the waterproof cover 26 makes the device more aesthetically pleasing, enhancing both functionality and appearance, making it more suitable for modern consumers. Among them, the battery 71 can be a 500mAh lithium battery 71, and the fan 50 can be an electric fan 50 with a power of 0.35w. The theoretical battery life is 7 hours. After deducting the normal loss during operation, the actual test device battery life is more than 4.5 hours.

[0070] For convenient charging, the outer casing 10 and inner liner 20 are equipped with corresponding USB / Type-C charging ports, connecting the circuit board 72 to supply power to the battery 71. Users can charge the battery 71 simply through a standard USB or Type-C port, avoiding cumbersome operations and making the charging process more convenient. Due to the widespread availability of USB and Type-C ports, this design is compatible with a wide range of charging devices, improving the device's compatibility. To facilitate the operation of the fan 50, the drive unit 70 also includes a switch 73 and a corresponding indicator light 74. The switch 73 allows users to easily turn the fan 50 on or off as needed, controlling its operating status; while the indicator light 74 displays the fan 50's operating status in real time, allowing users to clearly understand the device's current operating condition. This design facilitates user operation and improves the device's usability.

[0071] Furthermore, this surface liquid evaporation cooling device can be further extended to intelligent operation. For example, with a built-in temperature and humidity sensor, the device can monitor the ambient temperature and humidity in real time and automatically adjust its operating mode to achieve the best cooling effect. For instance, when the temperature exceeds a preset threshold, the device can automatically turn on the fan 50 and the liquid evaporation system to increase the evaporation rate; if the ambient humidity is high, it will automatically reduce the fan speed to avoid excessive evaporation. Users can view the device's battery level, temperature, and humidity in real time via a smart app, ensuring that the device's status is always controllable during use. Through the app, users can remotely adjust the operating speed of the fan 50 and precisely control the device's operation based on changes in ambient temperature and humidity. The water chamber 22 has a built-in water level sensor that can detect the water level. When the water level is lower than the preset standard, the system will notify the user via the indicator light 74 and the app to replenish the water in time, preventing a decrease in cooling effect or damage to the device due to insufficient water.

[0072] This utility model embodiment also provides a consumer electronic product, such as a mobile phone, tablet computer, laptop computer and computer host, which can use the surface liquid evaporation cooling device for heat dissipation. When using it, you only need to attach the side of the surface liquid evaporation cooling device with the heat dissipation plate 40 to the surface of the consumer electronic product that needs to be cooled, and then turn on the switch 73 to make the fan 50 run, so that the heat of the consumer electronic product can be conducted to the outside, thereby realizing the rapid cooling of the consumer electronic product.

[0073] The surface liquid evaporation cooling device provided in this embodiment is applicable to the working scenario of surface heat dissipation for consumer electronic devices, providing users with a highly efficient, portable, simple, and effective cooling device. When using this surface liquid evaporation cooling device, the actual working process, which enables the heat sink 40 to quickly dissipate heat from the object surface by turning on the fan 50, is as follows: When using this device for auxiliary heat dissipation, the side with the heat sink 40 is first placed tightly against the surface of the electronic device requiring heat dissipation. The water-containing cavity 22 inside the inner tank 20 continuously delivers internal liquid to the absorber 60 through the water inlet 23 (or water delivery component 30) at its bottom, keeping the absorber 60 moist. The heat generated by the electronic device is then conducted to the absorber 60 through the heat sink 40, causing the liquid in the absorber 60 to evaporate. The process generates water vapor, which, with the assistance of the fan 50, significantly accelerates the evaporation of the liquid on the absorber 60. The water vapor, further propelled by the airflow, passes through the second through-hole 21, the first through-hole 12, and multiple heat dissipation holes 13 on the side wall of the outer casing 10, efficiently expelling heat from the heat sink 40 to the outside. This rapidly reduces the temperature of the electronic device, effectively preventing backheating caused by water vapor condensation inside the device, optimizing the heat conduction path of the heat sink 40, and significantly enhancing the liquid evaporation rate through forced airflow circulation, thus greatly improving the cooling effect. This device, with its rational structural design and liquid evaporation cooling principle, not only achieves efficient heat dissipation but also features energy saving, environmental protection, and convenient maintenance. Only a small amount of liquid needs to be added during use, significantly reducing operating costs. It is green and environmentally friendly, demonstrating broad application value.

[0074] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit the scope of protection of this utility model. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model by those skilled in the art should be included within the scope of protection of this utility model.

Claims

1. A surface liquid evaporation refrigeration device, characterized in that, The device includes an outer shell, an inner liner, a fan, a heat sink, and a water-absorbing component. The outer shell has an opening at its bottom and a first through hole at its top that extends through the opening. The inner liner has a second through hole extending through both end walls, a water-containing cavity circumferentially formed along the second through hole, and multiple water outlets extending from the bottom of the inner liner to the water-containing cavity. The inner liner is disposed within the opening. The fan is disposed within the second through hole, which communicates with the first through hole. The heat sink is disposed at the bottom of the outer shell. The water-absorbing component is disposed on the surface of the heat sink near the inner liner and is connected to the water outlets.

2. The surface liquid evaporation cooling device according to claim 1, characterized in that, An evaporation chamber is formed at the bottom of the inner liner and at the top of the water-absorbing component. The outer shell has a plurality of heat dissipation holes that extend to the evaporation chamber along its sidewall. The heat dissipation holes are evenly arranged on the sidewall of the outer shell.

3. The surface liquid evaporation cooling device according to claim 2, characterized in that, A water conveying component is provided on the water inlet. One end of the water conveying component is located in the water-containing cavity, and the other end extends through the water inlet into the evaporation chamber and is connected to the water-absorbing component, for conveying the liquid in the water-containing cavity to the water-absorbing component.

4. The surface liquid evaporation cooling device according to claim 3, characterized in that, The water supply component includes a water supply pipe and a guide column disposed inside the water supply pipe. One end of the water supply pipe is fixed to the surface of the heat dissipation plate, and the other end extends through the water inlet into the water holding chamber. The two ends of the water supply pipe are respectively provided with a first notch and a second notch that penetrate through the side wall of the water supply pipe to the outer wall of the guide column. The first notch is located in the water holding chamber, and the second notch is located in the evaporation chamber and connected to the water absorption component.

5. The surface liquid evaporation cooling device according to claim 4, characterized in that, The outer diameter of the guide column is smaller than the diameter of the water supply pipe, and the length of the guide column is greater than or equal to the length of the water supply pipe.

6. The surface liquid evaporation cooling device according to claim 5, characterized in that, The guide column can be made of one or more of the following materials: rubber, glass fiber, plastic fiber, or cotton fiber.

7. The surface liquid evaporation cooling device according to claim 4, characterized in that, The first notch extends from the end of the water pipe to the bottom of the water-containing cavity.

8. The surface liquid evaporation cooling device according to claim 1, characterized in that, The heat sink has an annular groove on the side near the water-absorbing component, and a magnetic ring is embedded in the annular groove.

9. The surface liquid evaporation cooling device according to claim 1, characterized in that, The outer shell sidewall has a first water inlet, and the inner liner sidewall has a second water inlet that extends into the water-containing cavity. The first water inlet and the second water inlet are opposite to each other, and the first water inlet is provided with a water inlet plug for closing the first water inlet.

10. A consumer electronics product, characterized in that: Heat dissipation is achieved using a surface liquid evaporation cooling device, including any one of claims 1-9.

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