Magnetic ring, circuit board, and power converter

Abstract

A magnetic ring, a circuit board, and a power converter. An inner hole passing through the magnetic ring in the axial direction of the magnetic ring is provided at the center of the magnetic ring of the present solution, and the magnetic ring is attached to a board body by means of a connecting layer. In the circuit board of the present disclosure, the magnetic ring is attached to the board body by means of the connecting layer. Compared with connection methods in the prior art, the attachment method facilitates automation, thereby improving the mounting efficiency of the magnetic ring on the board body.

Description

A magnetic ring, a circuit board and a power converter

[0001] This disclosure claims priority to the following Chinese patent application, the entire contents of which are incorporated herein by reference. Application No.: 2025203043905, Application Date: February 24, 2025, Applicant: Sungrow Power Supply Co., Ltd., Invention Title: A Magnetic Ring, Circuit Board and Electronic Equipment. Technical Field

[0002] This disclosure relates to a magnetic ring, a circuit board, and a power converter. Background Technology

[0003] Currently, magnetic rings are manually fitted onto circuit wiring harnesses or electronic components. When the number of magnetic rings in a circuit is too large or the size of the magnetic rings is too small, the manual fitting method is cumbersome and has low production efficiency.

[0004] Therefore, how to improve the installation efficiency of magnetic rings has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This disclosure presents a magnetic ring, a circuit board, and a power converter to improve the installation efficiency of the magnetic ring.

[0006] To achieve the above objectives, the present disclosure provides the following technical solutions:

[0007] In a first aspect, this disclosure provides a magnetic ring, including an inner hole and a protrusion. The inner hole extends through the end face of the magnetic ring along the axial direction of the magnetic ring, and the protrusion protrudes outward from the end face of the magnetic ring. A connecting layer is disposed on the surface of the protrusion, and the magnetic ring can be attached to the board body of a circuit board through the connecting layer.

[0008] In some instances, the bonding layer includes a plating layer, through which the magnetic ring can be soldered to the plate.

[0009] In some instances, the distance between the outer and inner walls of the protrusion is no greater than the distance between the hole wall and the side wall of the magnetic ring.

[0010] In some instances, the protrusions are annular structures arranged around the inner hole.

[0011] In some instances, the protrusion includes a first protrusion section and a second protrusion section disposed on both sides of the inner hole.

[0012] In some instances, the first protruding segment and the second protruding segment are arranged along a first direction, and the first protruding segment has a first end wall and a second end wall arranged opposite to each other in a second direction. The first end wall and the second end wall are arranged in parallel, and the second direction is perpendicular to the first direction.

[0013] In some instances, the surface where the magnetic ring contacts the plate also includes an outwardly protruding support.

[0014] In some examples, the support includes a first support section and a second support section, which are arranged opposite to each other along a second direction.

[0015] In some instances, the coating is applied to two opposite end faces of the magnetic ring.

[0016] In some instances, the connecting layer includes an adhesive layer, through which the magnetic ring can be bonded to the plate.

[0017] In some instances, the connecting layer includes a riveting portion disposed near the surface of the plate, and the plate is provided with riveting holes, with the riveting portion and the riveting holes riveted together.

[0018] Secondly, this disclosure provides a circuit board, including a board body, electronic components, and a magnetic ring as described above. The magnetic ring is attached to the board body via a connecting layer, and the magnetic ring is sleeved on the conductive part of the electronic components and disposed on the board body.

[0019] Secondly, this disclosure provides a power converter including a circuit board as described in any of the above.

[0020] As can be seen from the above technical solution, the magnetic ring of this disclosure is attached to the plate through a connecting layer. Compared with the connection method of the prior art, the attachment method is easier to automate, thereby improving the installation efficiency of the magnetic ring and the plate.

[0021] Brief description of the attached figures

[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this disclosure can be applied to other similar scenarios based on the provided drawings. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0023] Figure 1 is a perspective view of a circuit board provided in an embodiment of this disclosure;

[0024] Figure 2 is an exploded view of a circuit board provided in an embodiment of this disclosure;

[0025] Figures 3 to 5 are perspective views of the three types of magnetic rings provided in the embodiments of this disclosure;

[0026] Figure 6 is a perspective view of the second type of circuit board provided in the embodiments of this disclosure;

[0027] Figure 7 is an exploded view of the second type of circuit board provided in the embodiments of this disclosure;

[0028] Figures 8 to 14 are perspective views of the seven types of magnetic rings provided in the embodiments of this disclosure;

[0029] Figure 15 is a perspective view of the third type of circuit board provided in the embodiments of this disclosure;

[0030] Figure 16 is an exploded view of the third type of circuit board provided in the embodiments of this disclosure;

[0031] Figures 17 to 19 are perspective views of the three types of magnetic rings provided in the embodiments of this disclosure;

[0032] Figures 20 and 21 are perspective views of two types of magnetic rings provided in the embodiments of this disclosure;

[0033] Figure 22 is a perspective view of the fourth type of circuit board provided in the embodiments of this disclosure;

[0034] Figure 23 is an exploded view of the fourth type of circuit board provided in the embodiments of this disclosure;

[0035] In the figure: 1-plate; 2-electronic components; 3-magnetic ring; 1a-first plate; 1b-second plate; 3a-first end face; 3b-second end face; 3c-side face; 11-insertion hole; 12-riveting hole; 31-inner hole; 32-connecting layer; 321-plating layer; 322-adhesive layer; 323-riveting part; 33-protrusion part; 34-support part; 331-first protrusion section; 3321-second protrusion section; 341-first support section; 342-second support section. Detailed Implementation

[0036] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant disclosure and not intended to limit the disclosure. The described embodiments are only a part of the embodiments of the present disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without inventive effort are within the scope of protection of the present disclosure.

[0037] A ferrite core is an electromagnetic compatibility (EMC) component widely used in electronic devices to suppress or filter high-frequency noise, improve signal quality, and enhance the EMC of electronic equipment. For example, currently, ferrite cores are manually fitted onto circuit wiring harnesses, pins, or pins. When the number of ferrite cores on a circuit board is large or the cores are small, this manual fitting method becomes cumbersome and inefficient.

[0038] To improve the installation efficiency of magnetic rings, this disclosure describes the structure of the magnetic ring in detail with reference to the accompanying drawings:

[0039] Referring to Figures 1 to 3, in order to achieve the above objectives, the present disclosure provides the following technical solutions:

[0040] A magnetic ring 3 has an inner hole 31 extending through the magnetic ring 3 along its axial direction, and a connecting layer 32 that is attached to the board body of a circuit board. Compared with the connection methods of related technologies, the magnetic ring 3 of the present disclosure is attached to the board body 1 by attaching it, which is easier to automate, thereby improving the installation efficiency of the magnetic ring 3.

[0041] The bonding methods here can include soldering, pasting, and riveting. Soldering, for example, involves using surface mount technology (SMT) to connect the magnetic ring 3 and the board 1. SMT is a technology that directly mounts electronic components onto the surface of a printed circuit board (PCB). SMT offers higher component density, better electrical performance, and higher production efficiency. Specifically, the connecting layer 32 includes a plating layer 321 disposed on the surface of the magnetic ring 3 near the board 1, and is soldered to the board 1 via the plating layer 321.

[0042] For example, the formation of the above-mentioned plating layer 321 is specifically achieved by applying silver paste to the surface of the magnetic ring 3 near the plate 1, then sintering it, and then electroplating a layer of nickel and a layer of tin to form plating layer 321.

[0043] To improve the compactness of the circuit board, the surface of the magnetic ring 3 that is in contact with the board body 1 includes an outwardly protruding protrusion 33, and a plating layer 321 is disposed on the surface of the protrusion 33. Because of the protrusion 33, the distance between the magnetic ring 3 and adjacent conductive parts is within the allowable safety distance range, which reduces the distance between the magnetic ring 3 and adjacent electronic components 2, thereby improving the compactness of the circuit board, as shown in Figure 4a.

[0044] The safety distance for electronic components 2 on the circuit board refers to the shortest path measured along the insulating surface between two conductive parts or between a conductive part and the protective interface of the equipment. It takes into account the influence of factors such as contamination and humidity on the insulating material surface on the insulation performance. For example, in a 220V circuit, the safety distance is generally required to be greater than 2.5mm.

[0045] As shown in Figures 4b and 4c, the magnetic ring 3 in Figure 4b does not have a protrusion 33. The electronic component 2 includes three conductive parts 21. The magnetic ring 3 is arranged on the conductive part 21 on the right. The shortest path between the conductive part 21 in the middle and the conductive part 21 on the left is the safety distance, denoted by L1. The shortest path between the conductive part 21 in the middle and the magnetic ring 3 is the safety distance, denoted by L2. Both L1 and L2 meet the industry requirements for safety distances.

[0046] The magnetic ring 3 in Figure 4c is provided with a protrusion 33. The electronic component 2 includes three conductive parts 21. The magnetic ring 3 is arranged on the conductive part 21 on the right. The shortest path between the conductive part 21 in the middle and the conductive part 21 on the left is the safety distance, denoted by L1. The shortest path between the conductive part 21 in the middle and the protrusion 33 is the safety distance, denoted by L2'. Both L1 and L2' meet the industry requirements for safety distances.

[0047] When L1 = L2 = L2', the distance between the conductive part 21 in the middle and the conductive part 21 on the right side in the structure shown in Figure 4c is smaller than that in the structure shown in Figure 4b. Therefore, it can be seen that by providing the protrusion 33, the compactness between the conductive parts 21 of the electronic component 2 can be improved.

[0048] The protrusion 33 may be formed by protruding outward from one side of the magnetic ring 3 or by being recessed inward from one side of the magnetic ring 3. For example, if it is formed by protruding outward from one side of the magnetic ring 3, the outward protruding structure of the magnetic ring 3 can be considered as the protrusion 33; if it is formed by being recessed inward from one side of the magnetic ring 3, that side of the magnetic ring 3 can be considered as the protrusion 33.

[0049] The protrusion 33 can be formed, for example, by additive manufacturing on the surface of the magnetic ring 3. Specifically, by adding components to the overall surface of the magnetic ring 3 to form a structure that protrudes from the overall surface of the magnetic ring 3, the protruding structure is the protrusion 33; or it can be cut from the magnetic ring 3, for example, by cutting out excess structure from the surface of the magnetic ring 3 to form a protruding structure that protrudes relative to the recessed position, the protruding structure is the protrusion 33.

[0050] The distance between the outer and inner walls of the protrusion 33 is no greater than the distance between the hole wall and the side wall of the magnetic ring 3. The distance between the outer and inner walls of the protrusion 33 can be understood as the width of the protrusion 33, and the distance between the hole wall and the side wall of the magnetic ring 3 can be understood as the thickness of the magnetic ring 3. Since the surface of the protrusion 33 is coated with a plating layer 321, by controlling the width of the protrusion 33 within the thickness range of the magnetic ring 3, the area of ​​the plating layer 321 can be controlled, thereby making it easy to adjust the shortest path between the conductive part 21 of the adjacent electronic component 2 and the magnetic ring 3.

[0051] Here, the magnetic ring 3 is typically formed by a first end face 3a, a second end face 3b, and a side face 3c. The first end face 3a and the second end face 3b are arranged opposite each other. The side face 3c connects the outer edges of the first end face 3a and the second end face 3b. The hole wall connects the inner edges of the first end face 3a and the second end face 3b. The side face 3c can be formed by multiple planes, such as three planes, four planes, five planes, etc. The side face 3c can also be formed by curved surfaces, such as cylindrical surfaces, elliptical cylindrical surfaces, etc. The protrusion 33 is typically formed by an upper surface, an outer side wall, and an inner side wall. The inner side wall and the outer side wall are arranged opposite each other, and the inner side wall is closer to the inner hole 31 than the outer side wall.

[0052] The inner wall of the protrusion 33 coincides with the wall of the inner hole 31, as shown in Figures 4a, 5, 9, 10, 11 and 14. In some examples, the inner wall of the protrusion 33 does not coincide with the wall of the inner hole 31, as shown in Figures 12 and 13.

[0053] The protrusion 33 is a ring-shaped structure arranged around the inner hole 31. For example, the ring-shaped structure is a circular ring structure or a rectangular ring structure, as shown in Figures 4 and 9. The protrusion 33 shown in Figure 4 is a circular ring structure, and the protrusion 33 shown in Figure 9 is a rectangular ring structure.

[0054] To further improve compactness, in some examples of this disclosure, the protrusion 33 includes a first protrusion section 331 and a second protrusion section 3321 arranged on both sides of the inner hole 31, as shown in Figures 5, 10 to 14.

[0055] In some embodiments, the first protrusion 331 and the second protrusion 3321 are arranged along a first direction. The first protrusion 331 has a first end wall 331a and a second end wall 331b arranged opposite each other in a second direction. The first end wall 331a and the second end wall 331b are arranged in parallel, and the second direction is perpendicular to the first direction. In some examples, the first direction corresponds to a safety distance, so the distance between the outer side wall and the inner side wall can reflect the width of the first protrusion 331, and thus affect the shortest path between the first protrusion 331 and the adjacent conductive part 21. In other examples, the second direction corresponds to a safety distance, so the distance between the first end wall 331a and the second end wall 331b can reflect the length of the first protrusion 331, and thus affect the shortest path between the first protrusion 331 and the adjacent conductive part 21.

[0056] The first and second directions mentioned above can be perpendicular to the axis z, or they can be non-perpendicular. Their specific arrangement is related to the arrangement of the magnetic ring 3 on the circuit board.

[0057] Similarly, the first direction mentioned above corresponds to a safety distance, and thus the distance between the outer and inner sidewalls reflects the width of the second protrusion 3321, thereby affecting the shortest path between the second protrusion 3321 and the adjacent conductive portion. In some other examples, the second direction mentioned above corresponds to a safety distance, and thus the distance L3 between the first end wall 3321a and the second end wall 3321b reflects the length of the second protrusion 3321, thereby affecting the shortest path between the second protrusion 3321 and the adjacent conductive portion.

[0058] Taking the safety distance corresponding to the second direction as an example, in order to balance connection strength and structural compactness, in some examples, the distance L3 between the first end wall 3321a and the second end wall 3321b in the second direction is not less than the maximum aperture D of the inner hole 31 in the second direction, as shown in Figures 10 to 13. In some embodiments, the distance between the first end wall 3321a and the second end wall 3321b in the second direction is less than the maximum distance of the inner hole 31's hole wall in the second direction. When the inner hole 31 is a cuboid structure, the distance between the inner hole 31's hole walls in the second direction is equal. When the inner hole 31 is a cylindrical structure, the distance between the inner hole 31's hole walls in the second direction gradually decreases towards both ends as it passes through the center of the circle.

[0059] In addition, to enhance the connection strength between the magnetic ring 3 and the plate 1 in this case, the surface where the magnetic ring 3 and the plate 1 are in contact also includes an outwardly protruding support portion 34, as shown in Figure 14. The figure shows that there are two support portions 34, which include a first support section 341 and a second support section 342. The first support section 341 and the second support section 342 are arranged opposite to each other along a second direction.

[0060] In this disclosure, the cross-section of the inner hole 31 perpendicular to the axial direction is rectangular, circular, or elliptical. Specifically, the inner hole 31 in Figures 3, 4, 5, 11, 12, 13, and 18 is circular, while the inner hole 31 in Figures 8, 9, 10, 14, 17, and 19 is rectangular.

[0061] In this example, the inner hole 31 is designed as a circle: see the following formulas (I) to (III):

[0062] Impedance Z = 2πfL (Formula 1)

[0063] Where f is the frequency (Hz) and L is the inductance (H).

[0064] Inductance L=N 2 A L Formula (II)

[0065] Where N is the number of revolutions, A L It is the inductance coefficient.

[0066] Inductance

[0067] Where u0 is the air permeability, u r It is the effective permeability, A e It is the cross-sectional area of ​​the magnetic circuit, L e It is the effective magnetic circuit length.

[0068] From formulas (I) to (III), the effective magnetic circuit length L can be determined. e The larger the value, the higher the inductance coefficient A. L The smaller the value, the smaller the inductance L, and the smaller the impedance Z. Impedance Z is positively correlated with EMC performance. Therefore, when the inner hole 31 is circular, the effective magnetic circuit length L... e If the inductance L is lower, the impedance Z will increase, resulting in better EMC performance.

[0069] The shape of the inner hole 31 has been described above. In some examples disclosed herein, the outer periphery of the magnetic ring 3 in the cross-section perpendicular to the axial direction is a regular shape such as a circle, ellipse, rectangle, triangle, pentagon, or hexagon. It can also be an irregular shape, which will not be described in detail here. As shown in Figures 3 to 4, the side 3c of the magnetic ring 3 is circular and the magnetic ring 3 has an axial direction z. In Figure 5, the side 3c of the magnetic ring 3 is elliptical. In Figures 8 to 14 and Figures 17 to 19, the side 3c of the magnetic ring 3 is rectangular and the magnetic ring 3 has an axial direction z, a width direction x, and a length direction y, wherein the axial direction z, the width direction x, and the length direction y are all perpendicular to each other.

[0070] Furthermore, the surface on which the magnetic ring 3 is welded to the plate 1 is either the end face or the side face 3c of the magnetic ring 3. The end faces of the magnetic ring 3 are arranged opposite each other along the axial direction of the magnetic ring 3, as shown in Figures 1 to 14. The end faces of the magnetic ring 3 are welded to the plate 1. As shown in Figures 15 to 19, the side face 3c of the magnetic ring 3 is welded to the plate 1. The plate 1 includes a first plate 1a and a second plate 1b, which are arranged at an angle. The first plate 1a is provided with a socket 11 for cooperating with the electronic component 2, and the side face 3c of the magnetic ring 3 is welded to the second plate 1b.

[0071] Referring to Figures 20 and 21, taking the magnetic ring 3 bonded to the plate 1 as an example, the connecting layer 32 includes an adhesive layer 322 disposed on the surface of the magnetic ring 3 near the plate 1, and is bonded to the plate 1 through the adhesive layer 322. Similarly, the surface of the magnetic ring 3 bonded to the plate 1 is either the end face of the magnetic ring 3 or the side face 3c of the magnetic ring 3. The adhesive layer 322 can be understood as applying a layer of adhesive to the surface of the magnetic ring 3 to make the surface of the magnetic ring 3 sticky. Other methods that can make the surface of the magnetic ring 3 sticky are also possible, such as using adhesive backing.

[0072] Referring to Figures 22 and 23, the magnetic ring 3 is riveted to the plate 1. The plate 1 has riveting holes 12. The connecting layer 32 includes a riveting portion 323 disposed on the surface of the magnetic ring 3 near the plate 1. The magnetic ring 3 can be riveted to the plate 1 through the riveting portion 323. Similarly, the surface of the magnetic ring 3 riveted to the plate 1 is either the end face of the magnetic ring 3 or the side face 3c of the magnetic ring 3.

[0073] The aforementioned plating layer 321, adhesive layer 322, and riveting part 323 can be arranged on any surface of the magnetic ring 3, and the aforementioned plating layer 321, adhesive layer 322, and riveting part 323 can be arranged on two opposite surfaces of the magnetic ring 3. In this way, the time required to determine the plating layer 321, adhesive layer 322, and riveting part 323 during installation can be reduced, further improving installation efficiency.

[0074] The material of the magnetic ring 3 can be ferrite, magnetic powder core (one or more mixed materials such as iron-silicon, iron-silicon-aluminum, iron-nickel, etc.), nanocrystal, silicon steel and other soft magnetic materials.

[0075] This disclosure provides a circuit board, including a board body 1, electronic components 2, and a magnetic ring 3 as described in the above embodiments. The magnetic ring 3 is attached to the board body 1 via a connecting layer 32, and is sleeved on the conductive portion 21 of the electronic components 2 and disposed on the board body 1. Since the magnetic ring 3 has the aforementioned effects, the circuit board including the magnetic ring 3 has corresponding effects, which will not be elaborated further here.

[0076] The conductive part 21 can be a conductive component such as a pin, wire harness, or pin of the electronic component 2.

[0077] This disclosure provides a power converter including a circuit board as described above. Since the circuit board has the aforementioned effects, the power converter including the circuit board has corresponding effects, which will not be elaborated further here.

[0078] The aforementioned power converters can be inverters, converters, frequency converters, and grid simulators, etc.

[0079] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0080] In the description of the embodiments of this disclosure, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this document is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0081] For ease of description, only the parts relevant to the disclosure are shown in the accompanying drawings. Unless otherwise specified, embodiments and features described herein can be combined with each other.

[0082] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed, and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. The scope of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this disclosure.

Claims

1. A magnetic ring, wherein, The magnetic ring includes an inner hole (31) and a protrusion (33). The inner hole (31) passes through the end face of the magnetic ring along the axial direction of the magnetic ring. The protrusion (33) protrudes outward from the end face of the magnetic ring. A connecting layer (32) is arranged on the surface of the protrusion (33). The magnetic ring can be attached to the board body (1) of the circuit board through the connecting layer (32).

2. The magnetic ring as described in claim 1, wherein, The connecting layer (32) includes a plating layer (321), and the magnetic ring can be welded to the plate (1) through the plating layer (321).

3. The magnetic ring as described in claim 2, wherein, The distance between the outer sidewall and the inner sidewall of the protrusion (33) is not greater than the distance between the hole wall and the sidewall of the magnetic ring.

4. The magnetic ring as described in claim 2, wherein, The protrusion (33) is an annular structure and is arranged around the inner hole (31).

5. The magnetic ring as described in claim 1, wherein, The protrusion (33) includes a first protrusion section (331) and a second protrusion section (332) disposed on both sides of the inner hole (31).

6. The magnetic ring as described in claim 5, wherein, The first protruding segment (331) and the second protruding segment (332) are arranged along a first direction. The first protruding segment (331) has a first end wall and a second end wall arranged opposite to each other in a second direction. The first end wall and the second end wall are arranged in parallel. The second direction is perpendicular to the first direction.

7. The magnetic ring as claimed in claim 6, wherein, The surface of the magnetic ring that is in contact with the plate (1) also includes an outwardly protruding support portion (34).

8. The magnetic ring as claimed in claim 7, wherein, The support portion (34) includes a first support section (341) and a second support section (342), wherein the first support section (341) and the second support section (342) are arranged opposite to each other along the second direction.

9. The magnetic ring according to any one of claims 2 to 8, wherein, The coating (321) is arranged on the two opposite end faces of the magnetic ring.

10. The magnetic ring as claimed in claim 1, wherein, The connecting layer (32) includes an adhesive layer (322), through which the magnetic ring can be bonded to the plate (1).

11. The magnetic ring as claimed in claim 1, wherein, The connecting layer (32) includes a riveting part (323) disposed on the surface near the plate (1), the plate (1) is provided with a riveting hole, and the riveting part (323) and the riveting hole are riveted together.

12. A circuit board, wherein, The device includes a plate (1), electronic components (2), and a magnetic ring as described in any one of claims 1 to 11, wherein the magnetic ring is attached to the plate (1) via a connecting layer (32) and is sleeved on the conductive part of the electronic components (2).

13. A power converter, wherein, Includes the circuit board as described in claim 12.

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