Semiconductor cleaning apparatus and pipe assembly thereof

Abstract

A pipe assembly (10) applied to a semiconductor cleaning apparatus, the pipe assembly (10) being configured to be placed in a cleaning tank (20) of the semiconductor cleaning apparatus. The pipe assembly (10) comprises a gas injection pipe assembly (100), the gas injection pipe assembly (100) comprising a plurality of gas injection pipes (110) distributed at intervals; each gas injection pipe (110) is used for separately introducing oxygen purging gas into the cleaning tank (20); in an extension direction of the gas injection pipes (110), each gas injection pipe (110) is provided with a plurality of gas outlet holes (110a) arranged at intervals. The oxygen purging gas is introduced into the cleaning tank (20) through the gas injection pipes (110), so as to change an oxygen dissolution equilibrium between a gas phase and a liquid phase, drive dissolved oxygen to transfer from the liquid phase to the gas phase, and reduce the oxygen content, thereby establishing a new dissolution equilibrium state having a lower oxygen content, avoiding insufficient contact between a cleaning liquid and a wafer due to an excessively high oxygen content, and improving the wafer cleaning effect and process effect. Further provided is a semiconductor cleaning apparatus.

Description

Semiconductor cleaning equipment and its piping components Technical Field

[0001] This application belongs to the field of semiconductor cleaning technology, specifically relating to a semiconductor cleaning device and its piping components. Background Technology

[0002] In semiconductor cleaning processes, wafers are placed in a cleaning tank, and the cleaning solution reacts with the thin film on the wafer surface to achieve the etching process and thus the desired process effect.

[0003] During the wafer cleaning process, oxygen is inevitably generated in the cleaning solution in the cleaning tank. If the oxygen content is too high, the cleaning solution will not make sufficient contact with the wafer, resulting in poor cleaning effect and poor etching uniformity of the wafer. Summary of the Invention

[0004] The purpose of this application is to provide a semiconductor cleaning device and its piping components, which can solve the problem in the related art that the cleaning effect of wafers is poor due to the high oxygen content in the cleaning tank.

[0005] In a first aspect, embodiments of this application provide a piping assembly for use in a semiconductor cleaning equipment, for insertion into the cleaning tank of the semiconductor cleaning equipment, the piping assembly comprising:

[0006] The gas injection pipeline assembly includes a plurality of gas injection pipes spaced apart, each of which introduces oxygen venting gas into the cleaning tank, and each of the gas injection pipes has a plurality of air outlets spaced apart along the direction in which the gas injection pipes extend.

[0007] Secondly, embodiments of this application also provide a semiconductor cleaning apparatus, including a cleaning tank and the aforementioned pipeline assembly, wherein the pipeline assembly can be placed inside the cleaning tank.

[0008] In this embodiment, the piping assembly includes a gas injection piping assembly comprising multiple gas injection pipes. By introducing oxygen-removing gas into the cleaning tank through these multiple pipes, the oxygen dissolution balance between the gas and liquid phases can be altered, driving dissolved oxygen to transfer from the liquid phase to the gas phase, reducing the oxygen content, and thus establishing a new, relatively low oxygen content dissolution balance. This avoids insufficient contact between the cleaning solution and the wafer due to excessively high oxygen content in the cleaning tank, thereby improving the cleaning effect and process performance. Furthermore, each gas injection pipe is equipped with multiple vent holes, allowing for more uniform introduction of oxygen-removing gas into the cleaning tank, which improves the uniformity of oxygen removal. Attached Figure Description

[0009] Figure 1 is a schematic diagram of the structure of the gas injection pipeline assembly disclosed in an embodiment of this application;

[0010] Figure 2 is a top view of the gas injection pipeline assembly disclosed in an embodiment of this application;

[0011] Figure 3 is a schematic diagram of the structure of the pipeline assembly disclosed in the embodiment of this application;

[0012] Figure 4 is a top view of the piping assembly disclosed in an embodiment of this application;

[0013] Figure 5 is a front view of the piping assembly disclosed in an embodiment of this application;

[0014] Figure 6 is a schematic diagram of the structure of the injection pipeline assembly disclosed in the embodiment of this application;

[0015] Figure 7 is a top view of the injection pipeline assembly disclosed in an embodiment of this application;

[0016] Figure 8 is a partial structural schematic diagram of the liquid equalization tube and the gas injection tube disclosed in the embodiments of this application;

[0017] Figure 9 is a partial structural cross-sectional view of the pipeline assembly disclosed in an embodiment of this application;

[0018] Figure 10 is a cross-sectional view of the liquid equalization tube disclosed in an embodiment of this application;

[0019] Figure 11 is a cross-sectional view along the CC direction in Figure 5;

[0020] Figure 12 is a flow field simulation diagram of the liquid equalization tube disclosed in the embodiment of this application;

[0021] Figure 13 is a cross-sectional view along the BB direction in Figure 5;

[0022] Figure 14 is a schematic diagram of the cooperation between the gas injection pipeline assembly and the cleaning tank disclosed in the embodiment of this application;

[0023] Figure 15 is a schematic diagram showing the connection between each gas injection tube and the corresponding control element disclosed in the embodiments of this application;

[0024] Figure 16 is a schematic diagram of a partial structure of the semiconductor process equipment and the wafer disclosed in the embodiments of this application;

[0025] Figure 17 is a cross-sectional view at point DD in Figure 7;

[0026] Figure 18 is a cross-sectional view of EE in Figure 7;

[0027] Figure 19 is a schematic diagram of the structure of the air outlet disclosed in the embodiment of this application;

[0028] Figure 20 is a schematic diagram of the cleaning tank and its internal structure disclosed in an embodiment of this application.

[0029] Figure 21 is an exploded view of the semiconductor process equipment disclosed in an embodiment of this application.

[0030] Explanation of reference numerals in the attached drawings: 10-Pipeline assembly, 100-Injection pipeline assembly, 110-Injection pipe, 110a-Outlet, 1101-Airflow section, 1102-Jet section, 111-First injection pipe, 112-Second injection pipe, 112a-Injection channel, 121-First control element, 122-Second control element, 130-Connector, 131-First injection port, 132-Second injection port, 140-Connecting pipe, 150-Main pipeline, 160-Branch pipeline, 170-Exhaust pipeline, 200-Liquid injection pipeline assembly, 210-Liquid injection pipe, 220-Equalization pipe, 221-Inner pipe, 221a-First liquid outlet, 222-Outer pipe, 222a-Second liquid outlet, 223-Flow gap, 230-Connecting plate, 231-Connecting channel, 240-Blind plate. 310-Nitrogen supply device, 320-Manual valve, 330-Pressure regulating valve, 341-First pneumatic valve, 342-Flow meter, 343-Filter, 344-Pressure gauge, 345-Check valve, 346-Second pneumatic valve, 347-Normally open pneumatic valve, A-First direction, B-Second direction, 20-Cleaning tank, 21-Inner tank, 22-Outer tank, 30-Lifting device, 41-First fixing block, 42-First fixing support, 43-Second fixing block, 44-Second fixing support, S-Wafer. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0032] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] The semiconductor cleaning equipment and its piping assembly 10 provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0034] Please refer to Figures 1-21. The pipeline assembly 10 disclosed in this application embodiment is applied to a semiconductor cleaning equipment. The pipeline assembly 10 can be placed into the cleaning tank 20 of the semiconductor process equipment.

[0035] The piping assembly 10 includes an injection piping assembly 100, through which oxygen venting gas can be introduced into the cleaning tank 20. The oxygen venting gas can be nitrogen, or other gases besides nitrogen.

[0036] Specifically, referring to Figures 1 and 2, the gas injection pipeline assembly 100 includes a plurality of gas injection pipes 110 spaced apart, each gas injection pipe 110 being used to introduce oxygen-expelling gas, and each gas injection pipe 110 having a plurality of vent holes 110a spaced apart along its extension direction. The gas injection pipes 110 can be square pipes, round pipes, etc., and the specific structure of the gas injection pipes 110 is not limited in this embodiment; the vent holes 110a can be square holes, round holes, etc., and the specific structure of the vent holes 110a is not limited in this embodiment. When the gas injection pipeline assembly 100 is placed in the cleaning tank 20, the axis of the vent holes 110a can be parallel to the height direction of the cleaning tank 20; of course, the axis of the vent holes 110a can also be in other directions.

[0037] In some embodiments, a gas source (which may be a nitrogen supply device 310 or a plant maintenance unit) providing the venting gas is connected to each injection pipe 110 via a gas supply pipeline. That is, one end of the gas supply pipeline is connected to the outlet end of the gas source, and the other end of the gas supply pipeline is connected to the injection pipe 110. The gas source provides venting gas to the injection pipe 110 through the gas supply pipeline. This embodiment does not limit the position of the gas source relative to the injection pipe 110. When the injection pipeline assembly 100 is placed in the cleaning tank 20, the gas source and a portion of the gas supply pipeline are located outside the cleaning tank 20, while the other portion of the gas supply pipeline is placed inside the cleaning tank 20 to supply gas to the injection pipe 110.

[0038] In this embodiment, the piping assembly 10 includes a gas injection piping assembly 100, which includes multiple gas injection pipes 110. By using the multiple gas injection pipes 110 to introduce oxygen-expelling gas into the cleaning tank 20, the oxygen dissolution balance between the gas and liquid phases can be changed, driving dissolved oxygen to transfer from the liquid phase to the gas phase, reducing the oxygen content, thereby establishing a new dissolution balance state with a relatively low oxygen content. This avoids insufficient contact between the cleaning solution and the wafer due to excessive oxygen content in the cleaning tank 20, which is beneficial to improving the cleaning effect and process effect of the wafer.

[0039] In some embodiments, the gas injection pipe 110 is a straight pipe, and the direction in which the gas injection pipe 110 extends is parallel to the axial direction of the gas injection pipe 110. Each gas injection pipe 110 can extend in the same direction, that is, the axial directions of each gas injection pipe 110 are parallel, and multiple air outlet holes 110a are provided at intervals on each gas injection pipe 110 along the axial direction. The multiple air outlet holes 110a provided on each gas injection pipe 110 can be evenly distributed or unevenly distributed, and the multiple gas injection pipes 110 can be evenly distributed or unevenly distributed.

[0040] With this configuration, multiple air injection pipes 110 are spaced apart, and each air injection pipe 110 is provided with multiple air outlets 110a. Through multiple air injection pipes 110, oxygen-releasing gas can be introduced into the cleaning tank 20 relatively evenly. The oxygen-releasing gas is evenly distributed, the oxygen-releasing uniformity is high, and the oxygen-releasing effect is better.

[0041] In the scheme of this application, referring to Figure 3, the pipeline assembly 10 further includes a liquid injection pipeline assembly 200, which is used to introduce cleaning fluid into the cleaning tank 20. Thus, by adding the liquid injection pipeline assembly 200, cleaning fluid can be introduced into the cleaning tank 20 at the same time as oxygen venting gas.

[0042] In some embodiments, the gas injection pipeline assembly 100 is located below the liquid injection pipeline assembly 200. Since the mass of the venting gas is small, after the gas injection pipeline assembly 100 introduces the venting gas into the cleaning liquid, the venting gas will float upwards, that is, float towards the surface of the cleaning liquid. Therefore, when the gas injection pipeline assembly 100 is located below the liquid injection pipeline assembly 200, the position where the venting gas is introduced into the gas injection pipe 110 is lower, which is beneficial to prolong the residence time of the venting gas in the cleaning liquid, so as to reach a new, low-oxygen-content dissolution equilibrium state as soon as possible, which is more conducive to the precipitation of oxygen from the cleaning liquid and further reduces the oxygen content in the cleaning liquid.

[0043] Specifically, as shown in Figures 3 to 7, the liquid injection pipeline assembly 200 includes a liquid injection pipe 210 and a plurality of spaced liquid distribution pipes 220. The liquid injection pipe 210 is used to introduce cleaning fluid into the cleaning tank 20. The liquid injection pipe 210 is connected to each liquid distribution pipe 220. In some embodiments, the first port of the liquid injection pipe 210 is used to introduce cleaning fluid, and the second port of the liquid injection pipe 210 is connected to each liquid distribution pipe 220. The liquid injection pipe 210 can be directly connected to each liquid distribution pipe 220 or indirectly connected to each liquid distribution pipe 220.

[0044] The distribution of liquid equalization tubes 220 is spaced apart, with the direction of each tube intersecting the direction of its extension. In some embodiments, the direction of the spaced-apart distribution of liquid equalization tubes 220 is perpendicular to the direction of their extension. Alternatively, the direction of the spaced-apart distribution of liquid equalization tubes 220 may intersect the direction of their extension but not be perpendicular. Furthermore, each liquid equalization tube 220 has multiple outlet holes spaced apart along its extension direction. The liquid equalization tubes 220 can be square tubes, round tubes, etc., and the specific structure of the liquid equalization tubes 220 is not limited in this application embodiment. Similarly, the outlet holes can be square holes, round holes, etc., and the specific structure of the outlet holes is not limited in this application embodiment.

[0045] In some embodiments, the liquid distribution pipe 220 is a straight pipe, and the direction in which the liquid distribution pipe 220 extends is parallel to its axial direction. All liquid distribution pipes 220 extend in the same direction, that is, their axial directions are parallel. Furthermore, each liquid distribution pipe 220 has a plurality of outlet holes spaced apart along its axial direction. These outlet holes can be evenly or unevenly distributed, and the multiple liquid distribution pipes 220 can also be evenly or unevenly distributed.

[0046] With this configuration, multiple liquid distribution pipes 220 are spaced apart, and each liquid distribution pipe 220 is equipped with multiple liquid outlet holes. Therefore, each liquid distribution pipe 220 can introduce cleaning liquid into different areas within the cleaning tank 20, which is beneficial for the cleaning liquid to be distributed throughout the entire space of the cleaning tank 20. Thus, the cleaning liquid can be introduced into the cleaning tank 20 relatively evenly through the liquid injection pipeline assembly 200, making the flow field within the cleaning tank 20 relatively stable. The stable flow field creates conditions for the smooth release of oxygen from the cleaning liquid, which is beneficial for reducing the oxygen content in the cleaning liquid.

[0047] In a further embodiment, referring to FIG4, the plurality of gas injection tubes 110 include a plurality of spaced-apart first gas injection tubes 111. The arrangement direction of the first gas injection tubes 111 is the same as the arrangement direction of the liquid equalization tubes 220. The arrangement direction of the first gas injection tubes 111 is the direction in which the plurality of first gas injection tubes 111 are spaced-apart, and the arrangement direction of the liquid equalization tubes 220 is the direction in which the plurality of liquid equalization tubes 220 are spaced-apart. The axial direction of the first gas injection tubes 111 is parallel to the axial direction of the liquid equalization tubes 220, that is, the extension direction of the first gas injection tubes 111 is parallel to the extension direction of the liquid equalization tubes 220. Referring to FIG3 and FIG4, both the first gas injection tubes 111 and the liquid equalization tubes 220 are arranged along a first direction A, and both the first gas injection tubes 111 and the liquid equalization tubes 220 extend along a second direction B. The first direction A and the second direction B are perpendicular.

[0048] Of course, in other embodiments, the arrangement direction of the first gas injection tube 111 may be different from the arrangement direction of the liquid equalization tube 220, and the extension direction of the first gas injection tube 111 may intersect with the extension direction of the liquid equalization tube 220.

[0049] In some embodiments, the injection tube 210 is indirectly connected to the equalization tube 220. The injection tube assembly 200 also includes a connecting plate 230 and a blind plate 240. The connecting plate 230 and the blind plate 240 are respectively disposed at both ends of the equalization tube 220. The injection tube 210 and each equalization tube 220 are respectively connected to the connecting plate 230. Moreover, the connecting plate 230 is provided with a connecting channel 231 inside, and the injection tube 210 is connected to each equalization tube 220 through the connecting channel 231. The blind plate 240 is disposed at the end of the equalization tube 220 away from the connecting plate 230, and the blind plate 240 is respectively connected to each equalization tube 220.

[0050] In some embodiments, the injection tube 210 and the connecting plate 230, the connecting plate 230 and the liquid equalization tube 220, and the liquid equalization tube 220 and the blind plate 240 can be connected by welding, bonding or other means. Of course, the injection tube 210, the connecting plate 230, the liquid equalization tube 220 and the blind plate 240 can also be an integral structure.

[0051] In the scheme of this application, as shown in Figures 8 to 11, each liquid equalization pipe 220 includes an inner pipe 221 and an outer pipe 222. The inner pipe 221 is connected to the injection pipe 210. In some embodiments, the inner pipe 221 is connected to the injection pipe 210 through the connecting channel 231 of the connecting plate 230. The outer pipe 222 is sleeved on the outside of the inner pipe 221, and a flow gap 223 is provided between the inner wall surface of the outer pipe 222 and the outer wall surface of the inner pipe 221. Both the inner pipe 221 and the outer pipe 222 can be square pipes, round pipes, etc. The embodiments of this application do not limit the specific structure of the inner pipe 221 and the outer pipe 222; their structures can be the same or different.

[0052] The liquid outlet includes a first liquid outlet 221a and a second liquid outlet 222a. Along the extension direction of the liquid equalization pipe 220, the inner pipe 221 is provided with a plurality of first liquid outlets 221a at intervals, and the outer pipe 222 is provided with a plurality of second liquid outlets 222a at intervals. The first liquid outlets 221a communicate with the second liquid outlets 222a through a flow gap 223. Both the first liquid outlets 221a and the second liquid outlets 222a can be square holes, round holes, etc. This application embodiment does not limit the specific structure of the first liquid outlets 221a and the second liquid outlets 222a; their structures can be the same or different.

[0053] In some embodiments, as shown in FIG10, each liquid distribution pipe 220 extends in the same direction. In the axial direction of each liquid distribution pipe 220, the inner pipe 221 is provided with a plurality of first liquid outlet holes 221a at intervals, and the outer pipe 222 is provided with a plurality of second liquid outlet holes 222a at intervals. The plurality of first liquid outlet holes 221a provided in the inner pipe 221 can be evenly distributed or unevenly distributed, and the plurality of second liquid outlet holes 222a provided in the outer pipe 222 can be evenly distributed or unevenly distributed.

[0054] In this embodiment, the equalization pipe 220 is configured as a double-layer pipe structure, so that the cleaning fluid introduced into the injection pipe 210 first flows into the inner pipe 221, then passes through the first outlet hole 221a and the flow gap 223 in sequence, and finally sprays out from the second outlet hole 222a. Compared with the outer pipe 222, the flow area of ​​the inner pipe 221 and the flow area of ​​the flow gap 223 are both smaller. Therefore, the cleaning fluid first flows to the inner pipe 221 with a smaller flow area, which is conducive to the cleaning fluid quickly filling the entire inner pipe 221 in the direction of the extension of the equalization pipe 220. Then, by passing through the flow gap 223 with a smaller flow area, it is conducive to the cleaning fluid being sprayed out evenly from each of the second outlet holes 222a.

[0055] Of course, in other embodiments, the liquid equalization tube 220 may not have an inner tube 221 and an outer tube 222, and the liquid equalization tube 220 may be configured as a single-layer tube structure.

[0056] In some embodiments, the sum of the flow areas of all injection tubes 210 is the first flow area, and the sum of the flow areas of each first outlet hole 221a of all inner tubes 221 is the second flow area. The first flow area is greater than the second flow area. That is, the sum of the flow areas of all injection tubes 210 is greater than the sum of the flow areas of each first outlet hole 221a of each inner tube 221. In some embodiments, the number of injection tubes 210 is one, and the flow area of ​​this injection tube 210 is the first flow area; or, the number of injection tubes 210 is multiple, and the sum of the flow areas of each injection tube 210 is the first flow area.

[0057] In this embodiment, since the first flow area is larger and the second flow area is smaller, the flow velocity of the cleaning fluid in the injection pipe 210 is smaller when the flow rate is constant, while the flow velocity of the cleaning fluid flowing out of each inner pipe 221 is larger. Therefore, the cleaning fluid encounters resistance during the process of flowing out of the inner pipe 221, and the cleaning fluid flows rapidly along the extension direction of the inner pipe 221. This is conducive to the cleaning fluid smoothly filling the entire inner pipe 221 along the extension direction of the inner pipe 221, avoiding the situation where there is no cleaning fluid in some areas of the inner pipe 221.

[0058] In a further embodiment, the sum of the flow areas of each of the second liquid outlet holes 222a of all outer tubes 222 is the third flow area, and the second flow area is smaller than the third flow area. That is, the sum of the flow areas of each of the liquid outlet holes of all inner tubes 221 is smaller than the sum of the flow areas of each of the second liquid outlet holes 222a of all outer tubes 222.

[0059] With this configuration, since the second flow area is smaller and the third flow area is larger, the flow velocity of the cleaning fluid flowing out of each inner pipe 221 is relatively high and the flow velocity of the cleaning fluid flowing out of each outer pipe 222 is relatively low when the flow rate is constant. Therefore, the flow velocity of the cleaning fluid is reduced as it flows from the first outlet hole 221a to the second outlet hole 222a. This avoids the problem of the cleaning fluid colliding with the tank wall of the cleaning tank 20 due to the high outflow velocity, which would lead to an unstable flow field of the cleaning fluid near the tank wall. Therefore, reducing the flow velocity is more conducive to improving the stability of the flow field. A stable flow field creates conditions for the oxygen-removing gas to fully dissolve in the cleaning fluid, which is conducive to the precipitation of oxygen from the cleaning fluid and further improves the oxygen removal effect.

[0060] Of course, in other embodiments, the second flow area may be larger than the third flow area.

[0061] In some embodiments, the first flow area is smaller than the third flow area. That is, the total flow area of ​​all injection pipes 210 is less than the sum of the flow areas of each of the second outlet holes 222a of all outer pipes 222.

[0062] In this embodiment, the third flow area is not only larger than the second flow area but also larger than the first flow area. That is, the flow rate of the cleaning fluid exiting each outer tube 222 is lower than the flow rate of the cleaning fluid inside the injection tube 210. This further reduces the flow rate, which is beneficial for improving flow field stability. A stable flow field is more conducive to the dissolution of oxygen-removing gas into the cleaning fluid, allowing it to reach a new, low-oxygen-content dissolution equilibrium state as quickly as possible, thus further improving the oxygen removal effect. Simultaneously, impurities are generated on the wafer surface during the cleaning process; a cleaning fluid with a certain flow rate is more effective in removing these impurities from the wafer surface.

[0063] Of course, in other embodiments, the first flow area may be greater than the third flow area. That is, the total flow area of ​​the injection pipe 210 is greater than the sum of the flow areas of each of the second outlet holes 222a of each outer pipe 222.

[0064] In an embodiment where there are two injection tubes 210 and four equalization tubes 220, the injection tubes 210 are circular tubes with an inner diameter of 16 mm, and the flow area of ​​each injection tube 210 is π·8. 2 =201mm 2 Therefore, the first flow area is 2 × 201 = 402 mm². 2 The first outlet hole 221a is a circular hole with a diameter of 1 mm, and is arranged along the axial direction of the inner tube 221. There are 51 first outlet holes 221a in total. Therefore, the second flow area is 4 × 51 × π × 0.5. 2 =160mm 2 160mm 2 <402mm2 The second outlet hole 222a is a square hole with a length of 18.5 mm and a width of 1 mm. The length of the square hole is the circumferential dimension of the square hole on the outer tube 222. Furthermore, it is arranged axially along the outer tube 222. There are 52 second outlet holes 222a. Therefore, the third flow area is 4 × 52 × 18.8 × 1 = 3848 mm². 2 3848mm 2 >402mm 2 .

[0065] Based on the above conditions, the simulation diagram of the flow field formed by the liquid equalization pipe 220 is shown in Figure 12. In the figure, the color on the left side represents the flow velocity of the cleaning liquid at different stages, and the unit of flow velocity is m / s. The flow velocity of the cleaning liquid at the first outlet 221a is close to 1 m / s, and the flow velocity of the cleaning liquid at the second outlet 222a is reduced to 0.1-0.2 m / s.

[0066] With this configuration, the third flow area is 9-10 times that of the first flow area. Therefore, the flow rate of the cleaning fluid in the second outlet hole 222a is 1 / 10 to 1 / 9 of the flow rate of the cleaning fluid in the injection pipe 210. The flow rate of the cleaning fluid is effectively reduced, which is more conducive to improving the stability of the flow field and also more conducive to improving the oxygen removal effect.

[0067] In some embodiments, referring to Figures 9 and 10, the second outlet hole 222a and the first outlet hole 221a are misaligned in the circumferential direction of the equalization tube 220. That is, the second outlet hole 222a and the first outlet hole 221a are not directly opposite each other in the circumferential direction of the equalization tube 220. In some embodiments, the axis of the first outlet hole 221a extends radially along the inner tube 221, and the axis of the second outlet hole 222a extends radially along the outer tube 222. The axes of the inner tube 221 and the outer tube 222 are collinear. The axes of the first outlet hole 221a and the second outlet hole 222a are parallel, and the directions of the axes of the first outlet hole 221a and the second outlet hole 222a are both vertical. That is, the angle between the axes of the first outlet hole 221a and the second outlet hole 222a in the circumferential direction of the equalization tube 220 is 180°.

[0068] In this embodiment, the second outlet hole 222a and the first outlet hole 221a are staggered. During the process of the cleaning liquid flowing out of the first outlet hole 221a passing through the flow gap 223 and being sprayed out of the second outlet hole 222a, the cleaning liquid flows a certain path in the circumferential direction of the liquid distribution pipe 220. The cleaning liquid stays in the flow gap 223 for a longer time, which is more conducive to the full flow and diffusion of the cleaning liquid in the flow gap 223. This avoids the cleaning liquid flowing out of the first outlet hole 221a being sprayed out directly through the second outlet hole 222a, which is conducive to the uniform spraying of the cleaning liquid from each second outlet hole 222a, which is beneficial to improving the flow uniformity effect and making the flow field more stable.

[0069] Of course, in other embodiments, the second liquid outlet 222a and the first liquid outlet 221a can be directly opposite each other.

[0070] In some embodiments, referring to FIG8, the orthographic projection of the vent 110a and the orthographic projection of the second liquid outlet 222a are offset, and the orthographic projection is the projection along the axial direction of the vent 110a. That is, the vent 110a and the second liquid outlet 222a are not directly opposite each other. In some embodiments, the orthographic projections of the vent 110a and the second liquid outlet 222a are offset in the arrangement direction of the liquid equalization pipe 220, that is, the orthographic projections of the vent 110a and the second liquid outlet 222a do not completely overlap in the arrangement direction of the liquid equalization pipe 220.

[0071] In this embodiment, the orthographic projection of the vent 110a and the orthographic projection of the second liquid outlet 222a are staggered to avoid mutual interference between the oxygen-exhausting gas at the vent 110a and the cleaning liquid at the second liquid outlet 222a. This facilitates the smooth flow of oxygen-exhausting gas from the vent 110a and the smooth flow of cleaning liquid from the second liquid outlet 222a, thereby allowing the oxygen-exhausting gas and oxygen to mix fully in the cleaning liquid, which helps to improve the oxygen exhaust effect.

[0072] Of course, in other embodiments, the orthographic projection of the vent 110a is directly opposite to the orthographic projection of the second liquid outlet 222a.

[0073] In the scheme of this application, referring to Figure 4, the first air injection pipe 111 and the liquid distribution pipe 220 are staggered, that is, in the height direction of the pipeline assembly 10, the first air injection pipe 111 and the liquid distribution pipe 220 are not directly opposite each other. This arrangement avoids the liquid distribution pipe 220 from affecting the process of the first air injection pipe 111 introducing oxygen-expelling gas into the cleaning tank 20, and at the same time, avoids the first air injection pipe 111 from affecting the process of the liquid distribution pipe 220 injecting cleaning fluid into the cleaning tank 20.

[0074] Furthermore, a liquid equalization pipe 220 is provided between any two adjacent first air injection pipes 111. That is, each liquid equalization pipe 220 has a first air injection pipe 111 on the side close to the adjacent liquid equalization pipe 220, and each liquid equalization pipe 220 also has a first air injection pipe 111 on the side away from the adjacent liquid equalization pipe 220, and each liquid equalization pipe 220 is arranged adjacent to at least two first air injection pipes 111. In this way, the number of air injection pipes 110 increases, and multiple air injection pipes 110 can simultaneously introduce oxygen-expelling gas into the cleaning tank 20, improving the efficiency of introducing oxygen-expelling gas and further enhancing the oxygen extraction effect.

[0075] It should be noted that since the air injection pipeline assembly 100 and the liquid injection pipeline assembly 200 are arranged vertically within the cleaning tank 20, there is a height difference between the liquid equalization pipe 220 and the first air injection pipe 111. In some embodiments, referring to Figure 9, the first air injection pipe 111 is located below the liquid equalization pipe 220.

[0076] In this embodiment, each liquid equalization pipe 220 is adjacent to at least two first gas injection pipes 111. Each first gas injection pipe 111 is relatively close to the liquid equalization pipe 220. Therefore, the flow field of the cleaning liquid corresponding to the gas outlet position of each first gas injection pipe 111 tends to be consistent, which is more conducive to improving the uniformity of oxygen removal and enhancing the oxygen removal effect. It avoids insufficient contact between the cleaning liquid and the wafer S due to excessive oxygen content in the cleaning tank 20, which is conducive to improving the cleaning effect and process effect of the wafer S.

[0077] Of course, in other embodiments, the first air injection pipe 111 and the liquid equalization pipe 220 are directly opposite each other in the height direction of the pipeline assembly 10; or, the first air injection pipe 111 and the liquid equalization pipe 220 are staggered, and the first air injection pipe 111 is provided between every two adjacent liquid equalization pipes 220.

[0078] In this embodiment, each liquid equalization tube 220 is provided with a first air injection tube 111 on the side close to the adjacent liquid equalization tube 220, and each liquid equalization tube 220 is also provided with a first air injection tube 111 on the side away from the adjacent liquid equalization tube 220. The number of liquid equalization tubes 220 is 4, and the number of first air injection tubes 111 is 8. Of course, the number of first air injection tubes 111 and liquid equalization tubes 220 can be set to other numbers.

[0079] In a further embodiment, the axis of the equalization tube 220 is the first axis, and the axes of the two adjacent first gas injection tubes 111 of the equalization tube 220 are the first axis and the second axis, respectively. Referring to Figure 9, in the arrangement direction of the equalization tube 220, the distance between the first axis and the second axis is the first distance L1, and the distance between the first axis and the third axis is the second distance L2. The first distance L1 and the second distance L2 are equal.

[0080] In this embodiment, the first distance and the second distance are equal, and the distance between each first gas injection pipe 111 and the corresponding liquid equalization pipe 220 in the arrangement direction of the liquid equalization pipe 220 is equal. Therefore, the flow field at the gas outlet 110a of each first gas injection pipe 111 is more consistent, and the mixing effect of the oxygen exhaust gas and oxygen flowing out of different first gas injection pipes 111 is also more consistent, which is more conducive to improving the uniformity of oxygen exhaust.

[0081] In some embodiments, when the wafer S is placed in the cleaning tank 20, the distance between the axis of each first gas injection pipe 111 and the edge of the wafer S is equal along the radial direction of the wafer S. Therefore, there is a height difference between each first gas injection pipe 111. Referring to FIG9, in the height direction of the piping assembly 10, that is, in the direction perpendicular to the plane where the plurality of liquid equalization pipes 220 are located, the distance between the first axis and the second axis is a third distance, and the distance between the first axis and the third axis is a fourth distance. The third distance and the fourth distance are not equal. That is, the heights of two adjacent first gas injection pipes 111 of the same liquid equalization pipe 220 are not equal.

[0082] Of course, in other embodiments, the first distance L1 and the second distance L2 may not be equal.

[0083] In some embodiments, referring to FIG13, there are at least two injection tubes 210, which are spaced apart and each injection tube 210 is connected to a liquid equalization tube 220. The number of injection tubes 210 is less than the number of liquid equalization tubes 220. In some embodiments, the injection tubes 210 may be uniformly distributed or non-uniformly distributed.

[0084] In this embodiment, the number of injection tubes 210 is increased, and multiple injection tubes 210 simultaneously introduce cleaning fluid, which helps to improve the efficiency of cleaning fluid introduction. Moreover, the number of injection tubes 210 is less than the number of equalization tubes 220. In other words, the cleaning fluid is supplied to the larger number of equalization tubes 220 through a smaller number of injection tubes 210, which helps to achieve the diversion effect of cleaning fluid.

[0085] Of course, in other embodiments, the number of injection tubes 210 is one.

[0086] In this embodiment, when the lifting device 30 carries the wafer S into the cleaning tank 20, the distance between the lifting device 30 and the liquid injection pipeline assembly 200 is relatively short. Referring to Figure 19, to avoid the liquid injection pipeline assembly 200 affecting the lifting device 30, multiple liquid equalization pipes 220 are spaced apart. The space between two adjacent liquid equalization pipes 220 can avoid the part of the lifting device 30 supporting the bottom of the wafer S, thus preventing interference between the liquid equalization pipe 220 and the part of the lifting device 30 supporting the bottom of the wafer S. Of course, the number of liquid equalization pipes 220 can also be set to other numbers.

[0087] In the scheme of this application, referring to Figures 14-15 and Figures 1 and 2, the plurality of gas injection tubes 110 include a plurality of first gas injection tubes 111 arranged at intervals, and the direction of extension of the first gas injection tubes 111 can be parallel to the direction of extension of the liquid equalization tube 220.

[0088] The gas injection pipeline assembly 100 further includes a plurality of first control elements 121, each of which is connected to a corresponding first gas injection pipe 111. Each first control element 121 is used to control the flow rate of oxygen gas discharged within the corresponding first gas injection pipe 111. The first control element 121 may be, but is not limited to, a flow controller. In some embodiments, the first control element 121 may be directly connected to the corresponding first gas injection pipe 111 or directly connected to the pipeline connected to the corresponding first gas injection pipe 111, as long as it can control the flow rate of oxygen gas discharged within the corresponding first gas injection pipe 111.

[0089] In this embodiment, multiple first control elements 121 can control the flow rate of oxygen venting gas in each first air injection pipe 111. When the flow field in a certain area of ​​the cleaning tank 20 is unstable, the first control element 121 corresponding to the first air injection pipe 111 in that area is controlled to adjust the flow rate of oxygen venting gas in that area, which is more conducive to improving the stability of the flow field.

[0090] In some embodiments, referring to FIG16, when multiple liquid distribution pipes 220 spray cleaning fluid into the cleaning tank 20, the cleaning fluid sprayed from the liquid distribution pipes 220 located in the edge region will be sprayed onto the side wall of the cleaning tank 20. The cleaning fluid will generate an unstable flow field due to the impact of the side wall. At this time, the first control element 121 corresponding to the first air injection pipe 111 near the side wall of the tank is controlled to increase the flow rate of the oxygen exhaust gas. More oxygen exhaust gas is introduced into the cleaning tank 20, which is more conducive to stabilizing the flow field in the edge region of the cleaning tank 20 and improving the overall stability of the flow field.

[0091] In a further embodiment, referring to FIG17, the plurality of air injection pipes 110 further includes a second air injection pipe 112. The second air injection pipe 112 is located at the end of the first air injection pipe 111 along the extending direction of the first air injection pipe 111. When the air injection pipeline assembly 100 is placed into the cleaning tank 20, the second air injection pipe 112 is closer to the sidewall of the cleaning tank 20 than the first air injection pipe 111. Along the extending direction of the first air injection pipe 111, the cleaning tank 20 has two opposing sidewalls, and the second air injection pipe 112 is disposed adjacent to one of these sidewalls. In some embodiments, the second air injection pipe 112 contacts the sidewall of the cleaning tank 20.

[0092] Furthermore, referring to Figure 18, the second gas injection pipe 112 is provided with at least two gas injection channels 112a at intervals along its own extending direction. Each gas injection channel 112a extends along the extending direction of the second gas injection pipe 112, and each gas injection channel 112a is connected to a plurality of gas outlets 110a. In some embodiments, the second gas injection pipe 112 extends along a first direction A, which is the direction in which the liquid equalization pipes 220 are arranged at intervals.

[0093] In some embodiments, a second air injection pipe 112 may be provided only at one end of the first air injection pipe 111 along its axial direction, or a second air injection pipe 112 may be provided at both ends of the first air injection pipe 111.

[0094] With this configuration, the gas injection pipeline assembly 100 is equipped with a second gas injection pipe 112. The second gas injection pipe 112 can be used to introduce oxygen-releasing gas into areas that the first gas injection pipe 111 cannot reach, thereby improving the uniformity of the oxygen-releasing gas distribution and also improving the oxygen-releasing effect.

[0095] In some embodiments, referring to FIG14, the gas injection pipeline assembly 100 further includes a plurality of second control elements 122, each corresponding to a gas injection channel 112a and connected to a second gas injection pipe 112. Each second control element 122 is used to control the flow rate of gas in the corresponding gas injection channel 112a. The second control element 122 may be, but is not limited to, a flow controller. In some embodiments, the second control element 122 may be directly connected to the second gas injection pipe 112 or directly connected to the pipeline connected to the corresponding gas injection channel 112a, as long as it can control the flow rate of gas in the corresponding gas injection channel 112a.

[0096] In this embodiment, the second gas injection pipe 112 is divided into multiple gas injection channels 112a, and multiple second control elements 122 are used to control the gas flow rate in each gas injection channel 112a respectively. Within the gas injection range of the second gas injection pipe 112, when the flow field in a local area of ​​the cleaning tank 20 is unstable, the second control element 122 corresponding to the gas injection channel 112a in that area can be controlled to adjust the gas flow rate in that area, which is more conducive to improving the stability of the flow field.

[0097] In some embodiments, the number of first gas injection tubes 111 can be eight, the number of second gas injection tubes 112 can be one, and the second gas injection tube 112 is provided with two gas injection channels 112a. Of course, the number of first gas injection tubes 111, second gas injection tubes 112, and gas injection channels 112a can also be set to other numbers.

[0098] Of course, in other embodiments, the plurality of gas injection tubes 110 may only include a plurality of first gas injection tubes 111 and a plurality of first control elements 121, that is, the gas injection line assembly 100 may not include a second gas injection tube 112 and a second control element 122.

[0099] In some embodiments, referring to Figures 14 and 15, the gas source mentioned above is a nitrogen supply device 310 or a plant utility. The gas supply pipeline mentioned above may include a main pipeline 150 and multiple branch pipelines 160. The inlet end of the main pipeline 150 is connected to the outlet end of the nitrogen supply device 310, or the inlet end of the main pipeline 150 is connected to the plant utility. A portion of the branch pipelines 160 is connected to the first gas injection pipe 111 in a one-to-one correspondence, and another portion of the branch pipelines 160 is connected to the gas injection channel 112a of the second gas injection pipe 112 in a one-to-one correspondence. The outlet end of the main pipeline 150 is connected to the inlet end of each branch pipeline 160. In this way, the nitrogen supplied by the nitrogen supply device 310 flows through the main pipeline 150 to each branch pipeline 160, and then to each gas injection pipe 110, so as to inject nitrogen into each gas injection pipe 110 respectively. Each first control element 121 is respectively disposed in the branch pipe 160 connected to the corresponding first gas injection pipe 111, and each second control element 122 is respectively disposed in the branch pipe 160 connected to the corresponding gas injection channel 112a.

[0100] In some embodiments, the main pipeline 150 is provided with a hand valve 320 and a pressure regulating valve 330. The hand valve 320 controls the opening and closing of the main pipeline 150, and the pressure regulating valve 330 adjusts the pressure value of the main pipeline 150 to meet the process requirements. Each branch pipeline 160 is also provided with a first pneumatic valve 341, a flow meter 342, a filter 343, a pressure gauge 344, a check valve 345, and a second pneumatic valve 346. Each branch pipeline 160 is connected to an exhaust pipeline 170. The connection between the exhaust pipeline 170 and the branch pipeline 160 is located between the check valve 345 and the second pneumatic valve 346, and the exhaust pipeline 170 is provided with a normally open pneumatic valve 347.

[0101] The first pneumatic valve 341 is used to control the opening and closing of the corresponding branch pipe 160, the flow meter 342 is used to monitor the flow rate of the gas in the corresponding branch pipe 160, the filter 343 is used to filter impurities contained in the exhaust gas and improve the cleanliness of the exhaust gas; the pressure gauge 344 is used to detect the air pressure of the corresponding branch pipe 160, the one-way valve 345 is used to prevent the cleaning liquid in the cleaning tank 20 from flowing into the air injection pipeline assembly 100 due to high pressure, and the second pneumatic valve 346 is used to control whether the exhaust gas enters the air injection pipe 110; when the air injection pipe 110 does not need to inject exhaust gas into the cleaning tank 20, the exhaust gas enters the exhaust system through the exhaust pipe 170.

[0102] Specifically, when it is necessary to inject oxygen-releasing gas into the cleaning tank 20, the hand valve 320 is opened and the pressure regulating valve 330 is adjusted. The first control element 121 and the second control element 122 are further adjusted to make the branch pipe 160 output a set stable flow rate. Then, the first pneumatic valve 341 and the second pneumatic valve 346 are opened, and the normally open pneumatic valve 347 is closed, so that the oxygen-releasing gas enters the cleaning tank 20 through the branch pipe 160 and the air injection pipe 110. When it is not necessary to inject oxygen-releasing gas, the second pneumatic valve 346 is closed and the normally open pneumatic valve 347 is opened.

[0103] In the scheme of this application, referring to Figures 1 and 2, the gas injection pipeline assembly 100 further includes a connector 130, which is used to connect each of the first gas injection tubes 111. In the direction of extension of the first gas injection tubes 111, the connector 130 and the second gas injection tube 112 are respectively located at both ends of the first gas injection tubes 111. The first end of each first gas injection tube 111 is connected to the connector 130, and the second end of each first gas injection tube 111 is connected to the second gas injection tube 112. In some embodiments, in the axial direction of the first gas injection tube 111, the connector 130 and the second gas injection tube 112 are respectively located at both ends of the first gas injection tube 111. The connector 130 has a certain length and extends along the extension direction of the second gas injection tube 112.

[0104] In some embodiments, the first end of the first gas injection tube 111 and the connector 130, and the first gas injection tube 111 and the second gas injection tube 112 can be connected by welding, bonding or other means.

[0105] In this embodiment, the first air injection pipes 111 are connected into a single structure by the connector 130, and the air injection pipeline assembly 100 is a single structure. This makes it convenient for the air injection pipeline assembly 100 to be placed into the cleaning tank 20 and installed, without the need to control each first air injection pipe 111 to be placed into the cleaning tank 20 and installed separately.

[0106] Of course, in other embodiments, the gas injection pipeline assembly 100 may not have the connector 130, and each of the first gas injection pipes 111 and the second gas injection pipes 112 may be set up separately and placed separately into the cleaning tank 20.

[0107] In a further embodiment, referring to Figures 1 and 2, the connector 130 is provided with a plurality of first air injection holes 131 and a plurality of second air injection holes 132 at intervals. Each first air injection hole 131 is connected to each first air injection pipe 111 in a one-to-one correspondence, and each second air injection hole 132 is connected to each air injection channel 112a. In some embodiments, each first air injection port 131 and each second air injection port 132 are respectively connected to the air supply pipeline mentioned above. Each first air injection port 131 and each second air injection port 132 are respectively connected to an external air source (which may be a nitrogen supply device 310 or a plant) through the air supply pipeline. The air source is located outside the cleaning tank 20. Specifically, each first air injection port 131 and each second air injection port 132 are respectively connected to a plurality of branch pipelines 160 mentioned above. Each first air injection pipe 111 is respectively connected to the corresponding branch pipeline 160 through the corresponding first air injection port 131. Each air injection channel 112a is respectively connected to the corresponding branch pipeline 160 through the corresponding second air injection port 132, so that the air source provides oxygen exhaust gas to each first air injection port 131 and each second air injection port through the air supply pipeline.

[0108] Thus, oxygen-expelling gas can be introduced into the corresponding first air injection pipe 111 through the first air injection hole 131, and oxygen-expelling gas can be introduced into the corresponding air injection channel 112a of the second air injection pipe 112 through the second air injection hole 132. In some embodiments, the first air injection holes 131 are spaced apart along the extending direction of the connector 130, and the second air injection holes 132 are spaced apart. Further in some embodiments, there are two second air injection holes 132 and two air injection channels 112a, and these two second air injection holes 132 are located at both ends of the connector 130, respectively.

[0109] The first air injection hole 131 and the second air injection hole 132 can be square holes, round holes, etc. The embodiments of this application do not limit the shape of the first air injection hole 131 and the second air injection hole 132.

[0110] Specifically, referring to Figure 1, the gas injection pipeline assembly 100 further includes a plurality of connecting pipes 140. The first end of each connecting pipe 140 is connected to the connector 130, and the second end of each connecting pipe 140 is connected to the second gas injection pipe 112. In some embodiments, the axial direction of the connecting pipe 140 is parallel to the axial direction of the first gas injection pipe 111. The first end of the connecting pipe 140 and the connector 130, and the second end of the connecting pipe 140 and the second gas injection pipe 112, can be connected by welding, bonding, or other methods. The connecting pipe 140 corresponds one-to-one with the gas injection channel 112a, and each gas injection channel 112a is connected to each corresponding second gas injection hole 132 through the corresponding connecting pipe 140.

[0111] In some embodiments, there are two second air injection holes 132, two air injection channels 112a, and two connecting pipes 140, which are respectively connected to the two ends of the connector 130.

[0112] In this embodiment, the gas injection pipeline assembly 100 is equipped with a connecting pipe 140. Each gas injection channel 112a can be connected to the second gas injection hole 132 of the connector 130 through the corresponding connecting pipe 140. This facilitates the introduction of oxygen-expelling gas into the gas injection channel 112a through the second gas injection hole 132 of the connector 130. The connector 130 does not need to be provided with a separate gas injection hole to introduce oxygen-expelling gas into the gas injection channel 112a. Moreover, the first gas injection hole 131 and the second gas injection hole 132 are both provided on the connector 130. That is, gas can be supplied to each first gas injection pipe 111 and each second gas injection pipe 112 through only the connector 130, without the need to provide oxygen-expelling gas to each first gas injection pipe 111 and each second gas injection pipe 112 separately, which makes gas supply more convenient.

[0113] In some embodiments, referring to FIG2, there are two gas injection channels 112a and two connecting pipes 140, and eight first gas injection pipes 111, namely 111a, 111b, 111c, 111d, 111e, 111f, 111g, and 111h in the figure; and eight first gas injection holes 131, namely 131a, 131b, 131c, 131d, 131e, 131f, 131g, and 131h in the figure, wherein 111a and 131a is connected to 131b, 111c to 131c, 111d to 131d, 111e to 131e, 111f to 131f, 111g to 131g, and 111h to 131h. 111a and 111h are respectively connected to two connecting pipes 140. There are two second air injection holes 132, namely 132a and 132b in the figure, which are connected to two connecting pipes 140. When the flow field in the region corresponding to the liquid equalization pipes 220 on both sides is unstable, the gas flow rate in the four first air injection pipes 111a, 111b, 111g, and 111h is increased to introduce more oxygen-expelling gas to maintain flow field stability.

[0114] In some embodiments, the first gas injection pipe 111 and the corresponding first gas injection hole 131 can be staggered. That is, each first gas injection pipe 111 does not need to be directly opposite to the corresponding first gas injection hole 131, so that some of the first gas injection holes 131 can be set closer together. In this way, some of the first gas injection holes 131 are more concentrated, which is beneficial for the external gas supply device to supply gas to multiple first gas injection holes 131 in the same area.

[0115] In some embodiments, referring to FIG2, 111a and 131a are directly opposite each other, 111d and 131d are directly opposite each other, 111e and 131e are directly opposite each other, and 111h and 131h are directly opposite each other; 111b and 131b are staggered, and 131b is adjacent to 111a; 111c and 131c are staggered, and 131c is adjacent to 111b (to avoid 131c affecting the communication channel between 131b and 111b); 111f and 131f are staggered, and 131f is adjacent to 111g (to avoid 131f affecting the communication channel between 131g and 111g); 111g and 131g are staggered, and 131g is adjacent to 111h. Thus, 131a, 131b, and 131c are grouped together, and 131f, 131g, and 131h are grouped together.

[0116] Of course, in other embodiments, the gas injection pipeline assembly 100 may not have a connecting pipe 140, the connector 130 may not have a second gas injection hole 132, and the second gas injection pipe 112 may have a separate gas injection hole that communicates with the gas injection channel 112a, through which oxygen exhaust gas is introduced into the gas injection channel 112a.

[0117] In some embodiments, referring to FIG19, the air outlet 110a includes an airflow section 1101 and an injection section 1102. The airflow section 1101 communicates with the injection section 1102, and the flow area of ​​the injection section 1102 gradually increases along the air outlet direction of the air outlet 110a.

[0118] In some embodiments, the flow area of ​​the spray section 1102 can increase uniformly along the air outlet direction of the air outlet 110a; or, the flow area of ​​the spray section 1102 can increase non-uniformly along the air outlet direction of the air outlet 110a. Further, in some embodiments, the cross-sectional shape of the spray section 1102 along the axial direction of the air outlet 110a is a fan-shaped structure, with a corresponding central angle of 90°. Of course, the corresponding central angle can also be other values, and the cross-section of the spray section 1102 can also be other shapes.

[0119] In some embodiments, the diameter of the vent 110a is 0.2 mm, and the distance between two adjacent vents 110a is 5 mm.

[0120] In this embodiment, the air outlet 110a adopts a special structure, and the flow area is increased by the spray section 1102. Therefore, the area of ​​each air outlet 110a spraying gas into the cleaning tank 20 is increased, which is more conducive to the uniform spraying of oxygen exhaust gas into the cleaning tank 20 by the air outlet 110a, improving the uniformity of oxygen exhaust gas and further enhancing the oxygen exhaust effect.

[0121] Of course, in other embodiments, the vent 110a can be configured with other structures. In some embodiments, the flow area of ​​the vent 110a is constant along the venting direction.

[0122] In this embodiment, the air outlet 110a of the first air injection pipe 111 and the air outlet 110a of the second air injection pipe 112 both include an airflow section 1101 and a jet section 1102.

[0123] Based on the pipeline assembly 10 disclosed in this application, and referring to Figures 20-21, this application also discloses a semiconductor cleaning device. The semiconductor cleaning device includes a cleaning tank 20 and the pipeline assembly 10 in the above embodiments, with the pipeline assembly 10 placed inside the cleaning tank 20. The pipeline assembly 10 includes a gas injection pipeline assembly 100 and a liquid injection pipeline assembly 200. The gas injection pipeline assembly 100 is located below the liquid injection pipeline assembly 200. The gas injection pipeline assembly 100 includes a first gas injection pipe 111, a second gas injection pipe 112, a first control element 121, a second control element 122, a connector 130, and a connecting pipe 140. The liquid injection pipeline assembly 200 includes a liquid injection pipe 210, a liquid equalization pipe 220, a connecting plate 230, and a blind plate 240.

[0124] In some embodiments, when the piping assembly 10 is placed in the cleaning tank 20, the gas injection piping assembly 100 and the liquid injection piping assembly 200 can be separately disposed. The gas injection piping assembly 100 and the liquid injection piping assembly 200 are respectively installed in the cleaning tank 20 through separate connection structures. Further in some embodiments, the liquid injection piping assembly 200 can be fixed by the first fixing support 42 and the first fixing block 41 described below, and the gas injection piping assembly 100 can be fixed by the second fixing block 43 and the second fixing support 44 described below. Of course, the gas injection pipeline assembly 100 and the liquid injection pipeline assembly 200 can be connected or in contact. Referring to Figures 1-3, after the gas injection pipeline assembly 100 is fixed in the cleaning tank 20, the liquid injection pipeline assembly 200 is placed above the gas injection pipeline assembly 100. The first gas injection pipe 111 directly supports the liquid equalization pipe 220, and the first gas injection pipe 111 is in direct contact with the liquid equalization pipe 220. At this time, the liquid injection pipeline assembly 200 does not need to be fixed separately to the cleaning tank 20.

[0125] In this embodiment, the piping assembly 10 of the semiconductor cleaning equipment includes an air injection piping assembly 100 and a liquid injection piping assembly 200. The two piping assemblies work together to make the flow field in the cleaning tank 20 more stable, creating conditions for oxygen removal, effectively improving the uniformity of oxygen removal, and enhancing the oxygen removal effect. This avoids insufficient contact between the cleaning liquid and the wafer S due to excessive oxygen content in the cleaning tank 20, which is beneficial to improving the cleaning effect of the semiconductor cleaning equipment.

[0126] In some embodiments, referring to FIG14, the cleaning tank 20 includes an inner tank 21 and an outer tank 22. The outer tank 22 is located outside the inner tank 21. The aforementioned pipeline assembly 10 can be placed in the inner tank 21 to pass the cleaning fluid and oxygen exhaust gas into the inner tank 21. When the inner tank 21 is full of cleaning fluid, the cleaning fluid can overflow into the outer tank 22. The outer tank 22 can further guide the cleaning fluid to the inner tank 21 through a circulation system.

[0127] In some embodiments, referring to FIG20, the semiconductor process equipment further includes a lifting device 30, which can drive the wafer S to rise and fall, so that the wafer S is placed into or removed from the cleaning tank 20.

[0128] In some embodiments, referring to FIG21, the semiconductor process equipment further includes a first fixing block 41 and a first fixing support 42. The first fixing support 42 is disposed on the inner wall of the cleaning tank 20. The first fixing support 42 cooperates with the first fixing block 41 to fix the injection tube 210, thereby fixing the injection pipeline assembly 200. In some embodiments, the first fixing support 42 and the side wall of the cleaning tank 20 can be fixedly connected by welding, bonding or other methods. The first fixing support 42 and the first fixing block 41 together clamp the injection tube 210 and are further connected by threaded fasteners such as screws and bolts to fix the injection pipeline assembly 200. There are multiple first fixing supports 42 and first fixing blocks 41, and the first fixing supports 42, first fixing blocks 41 and injection tubes 210 correspond one-to-one.

[0129] In some embodiments, referring to FIG21, the semiconductor process equipment further includes a second fixing block 43 and a second fixing support 44. The second fixing support 44 is disposed on the inner wall of the cleaning tank 20. The second fixing support 44 cooperates with the second fixing block 43 to fix the gas injection pipe 110, thereby fixing the gas injection pipeline assembly 100. In some embodiments, the second fixing support 44 and the bottom wall of the cleaning tank 20 can be fixedly connected by welding, bonding or other methods; the second fixing support 44 and the second fixing block 43 together clamp the gas injection pipe 110, and are further connected by threaded fasteners such as screws and bolts to fix the gas injection pipeline assembly 100.

[0130] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A piping assembly for use in a semiconductor cleaning equipment, for insertion into the cleaning tank (20) of the semiconductor cleaning equipment, characterized in that, The piping assembly (10) includes: The gas injection pipeline assembly (100) includes a plurality of gas injection pipes (110) spaced apart, each of the gas injection pipes (110) being used to introduce oxygen venting gas into the cleaning tank (20), and in the direction in which the gas injection pipes (110) extend, each of the gas injection pipes (110) is provided with a plurality of air outlet holes (110a) spaced apart.

2. The piping assembly according to claim 1, characterized in that, The pipeline assembly (10) further includes a liquid injection pipeline assembly (200), which includes a liquid injection pipe (210) and a plurality of spaced liquid distribution pipes (220). The liquid injection pipe (210) is used to introduce cleaning fluid into the cleaning tank (20). The liquid injection pipe (210) is connected to each of the liquid distribution pipes (220). The direction of the spaced liquid distribution pipes (220) intersects the direction of extension of each liquid distribution pipe (220). In the direction of extension of the liquid distribution pipes (220), each liquid distribution pipe (220) is provided with a plurality of liquid outlet holes spaced apart.

3. The piping assembly according to claim 2, characterized in that, Each of the liquid equalization tubes (220) includes an inner tube (221) and an outer tube (222). The inner tube (221) is connected to the injection tube (210). The outer tube (222) is sleeved outside the inner tube (221), and a flow gap (223) is provided between the inner wall surface of the outer tube (222) and the outer wall surface of the inner tube (221). The liquid outlet includes a first liquid outlet (221a) and a second liquid outlet (222a). In the extension direction of the liquid equalization tube (220), the inner tube (221) is provided with a plurality of first liquid outlets (221a) at intervals, and the outer tube (222) is provided with a plurality of second liquid outlets (222a) at intervals. The first liquid outlet (221a) is connected to the second liquid outlet (222a) through the flow gap (223).

4. The piping assembly according to claim 3, characterized in that, The sum of the flow areas of all the injection tubes (210) is the first flow area; the sum of the flow areas of each of the first outlet holes (221a) of all the inner tubes (221) is the second flow area; and the sum of the flow areas of each of the second outlet holes (222a) of all the outer tubes (222) is the third flow area. The first flow area is larger than the second flow area, and the second flow area is smaller than the third flow area.

5. The piping assembly according to claim 4, characterized in that, The first flow area is smaller than the third flow area.

6. The piping assembly according to claim 3, characterized in that, In the circumferential direction of the liquid distribution tube (220), the second liquid outlet (222a) is offset from the first liquid outlet (221a).

7. The piping assembly according to claim 3, characterized in that, The orthographic projection of the vent (110a) is offset from the orthographic projection of the second liquid outlet (222a), and the orthographic projection is the projection along the axial direction of the vent (110a).

8. The piping assembly according to claim 2, characterized in that, The plurality of gas injection tubes (110) include a plurality of first gas injection tubes (111) arranged at intervals. The direction in which the first gas injection tubes (111) extend is parallel to the direction in which the liquid equalization tube (220) extends. The first gas injection tubes (111) and the liquid equalization tube (220) are staggered, and a liquid equalization tube (220) is provided between any two adjacent first gas injection tubes (111).

9. The piping assembly according to claim 8, characterized in that, The axis of the liquid equalization tube (220) is the first axis, and the axes of the two adjacent first gas injection tubes (111) of the liquid equalization tube (220) are the second axis and the third axis, respectively. In the arrangement direction of the equalization tube (220), the distance between the first axis and the second axis is the first distance, and the distance between the first axis and the third axis is the second distance. The first distance and the second distance are equal.

10. The piping assembly according to claim 2, characterized in that, The number of injection tubes (210) is at least two, and the injection tubes (210) are spaced apart. Each injection tube (210) is connected to each of the liquid equalization tubes (220), and the number of injection tubes (210) is less than the number of liquid equalization tubes (220).

11. The piping assembly according to claim 1, characterized in that, The plurality of gas injection tubes (110) includes a plurality of first gas injection tubes (111) arranged at intervals. The gas injection pipeline assembly (100) further includes a plurality of first control elements (121), each of which is connected to a first gas injection pipe (111) in a one-to-one correspondence. Each of the first control elements (121) is used to control the flow rate of the oxygen gas discharged in the corresponding first gas injection pipe (111).

12. The piping assembly according to claim 11, characterized in that, The plurality of gas injection tubes (110) further includes a second gas injection tube (112). In the direction in which the first gas injection tube (111) extends, the second gas injection tube (112) is located at the end of the first gas injection tube (111). The second gas injection tube (112) is provided with at least two gas injection channels (112a) at intervals along its own extension direction. Each gas injection channel (112a) extends along the extension direction of the second gas injection tube (112), and each gas injection channel (112a) is connected to the plurality of gas outlets (110a).

13. The piping assembly according to claim 12, characterized in that, The gas injection pipeline assembly (100) further includes a plurality of second control elements (122), each of which corresponds to a gas injection channel (112a) and is connected to a second gas injection pipe (112). Each second control element (122) is used to control the flow rate of gas in the corresponding gas injection channel (112a).

14. The piping assembly according to claim 12, characterized in that, The gas injection pipeline assembly (100) further includes a connector (130). In the direction in which the first gas injection pipe (111) extends, the connector (130) and the second gas injection pipe (112) are respectively located at both ends of the first gas injection pipe (111). The first end of each first gas injection pipe (111) is connected to the connector (130), and the second end of each first gas injection pipe (111) is connected to the second gas injection pipe (112).

15. The piping assembly according to claim 14, characterized in that, The connector (130) is provided with a plurality of first air injection holes (131) and a plurality of second air injection holes (132) at intervals. Each first air injection hole (131) is respectively connected to each first air injection pipe (111). The gas injection pipeline assembly (100) further includes a plurality of connecting pipes (140), each of which corresponds to a gas injection channel (112a). The first end of each connecting pipe (140) is connected to the connector (130), and the second end of each connecting pipe (140) is connected to the second gas injection pipe (112). Each gas injection channel (112a) is connected to each of the second gas injection holes (132) through the corresponding connecting pipe (140).

16. The piping assembly according to claim 1, characterized in that, The air outlet (110a) includes an airflow section (1101) and a jet section (1102). Along the air outlet direction of the air outlet (110a), the airflow section (1101) and the jet section (1102) are connected, and the flow area of ​​the jet section (1102) increases progressively.

17. A semiconductor cleaning apparatus, characterized in that, Includes a cleaning tank (20) and a piping assembly (10) as described in any one of claims 1-16, the piping assembly (10) being fit into the cleaning tank (20).

Images