Multilayer device for carrying out a chemical analysis

Abstract

The invention relates to a method for the manufacture of a multilayer device (900, 1100, 1300, 1400) for carrying out a chemical analysis comprising at least one step for making, a first opening (37, 39, 41) and a second opening (43, 45, 47) in a dielectric substrate (35), a step for making in a carbon-containing substrate (3) a cut-out so as to form a distinct region (23, 25, 27) and electrically insulated from the remainder of said carbon-containing substrate (3). The distinct region (23, 25, 27) comprises a connection area (5, 7, 9) and a sampling area (11, 13, 15) electrically connected to each other. The method also comprises a step for superimposing the carbon-containing substrate (3) and the dielectric substrate (35) on an electrically insulating substrate (1). The invention also relates to a multilayer device (900, 1100, 1300, 1400) for carrying out a chemical analysis.

Description

Multilayer device to carry out a chemical analysisField of the invention

[0001] The present invention relates to the field of devices for chemical analysis and, in particular, relates to a method for producing a multilayer chemical analysis device as well as such a device.

[0002] Technological background

[0003] Many chemical diagnostic devices and instruments, in particular in the medical field, use chemical analysis devices. These chemical analysis devices allow simplified use due to their flatness. In fact, the device can simply be inserted by translation into the diagnostic device or instrument in order to carry out the analysis and diagnosis of a sample, in particular a biological sample. This may, for example, relate to the analysis of the level of glucose in a blood sample as part of the monitoring of a diabetic patient.

[0004] For this purpose, the devices comprise a first region made of a conductive material intended to be in electrical contact with the chemical diagnostic device or instrument, and a second region intended to receive and be in contact with the sample to be analysed. It is known to arrange these two different regions on two different and opposite sides of the device, in particular to physically separate the electrical and chemical functions of the device. However, this arrangement complicates the manufacture and use of the device, thereby increasing the analysis costs. The devices of the prior art also comprise numerous elements, including, in particular, an electrode module comprising metals, in particular in double-layer configurations, or electrical connections requiring methods such as etching or welding. These additional manufacturing steps significantly increase the manufacturing costs of the device. In addition, prior art devices use metals, in particular precious metals such as gold, as conductive materials, which further increases their manufacturing costs.

[0005] However, it is desirable to reduce manufacturing costs, especially in the case of disposable devices, as the industrial volumes required can be significant, particularly in the medical or pharmaceutical field.

[0006] Object of the invention

[0007] The aim of the present invention is to alleviate these problems by proposing a method for manufacturing a multilayer device for carrying out a chemical analysis at a lower manufacturing cost, in particular because it requires only a few steps. Furthermore, the invention also aims to minimise its environmental impact by limiting the number of components required and by giving preference to materials selected for their low environmental footprint.

[0008] The object of the invention is achieved by means of a method for manufacturing a multilayer device for carrying out a chemical analysis. The method for manufacturing a multilayer device for carrying out a chemical analysis comprises at least one step for making, in particular by punching, a first opening and a second opening in a dielectric substrate. The method further comprises a step for making, in particular by laser ablation, in a carbon-containing substrate, more particularly carbon nanotubes, a cut so as to form a distinct region that is electrically insulated from the remainder of said carbon-containing substrate. The distinct region comprises a connection area and a sampling area that are electrically connected to each other, in particular via the distinct region. The sampling area of the carbon-containing substrate is intended to be in contact with a sample to be analysed, in particular a fluid, more particularly a biological fluid. The method further comprises a step for superimposing the carbon-containing substrate and the dielectric substrate on an electrically insulating substrate, such that the carbon-containing substrate is arranged between the electrically insulating substrate and the dielectric substrate, and the first opening of the dielectric substrate is at least partially, in particular entirely, superimposed on the connection area of the distinct region of the carbon-containing substrate, and the second opening of the dielectric substrate is at least partially, in particular entirely, superimposed on the sampling area of the distinct region of the carbon-containing substrate.

[0009] The method according to the invention makes it possible to manufacture a multilayer device capable of carrying out a chemical analysis of a sample at a reduced manufacturing cost. Indeed, the simple and few steps of the method make it possible to reduce manufacturing costs. The use of a carbon-containing substrate rather than materials such as copper, nickel or gold, can reduce the ecological and environmental impact of the resulting device.

[0010] This method also allows for great freedom in the arrangement, the shape and the size of the connection and sampling areas, in particular thanks to the laser ablation. The device can therefore be easily adapted to many different industries, situations and uses.

[0011] In particular, the method according to the invention makes it possible to manufacture a multilayer device that simplifies access to the analysis data thanks to a connection area arranged on the same side of the multilayer device as the sampling area.

[0012] The samples analysed by the multilayer device according to the invention may be liquid samples, in particular biological samples. For example, the sample may be blood, saliva, or any other physiological or biological fluid. However, the samples that may be analysed by the present invention are not restricted to biological samples. The present invention can analyse any type of samples where an electrochemical reaction occurs.

[0013] The method may comprise a step for providing the carbon-containing substrate, more particularly carbon nanotubes. The method may comprise a step for providing the electrically insulating substrate. The method may comprise a step for providing the dielectric substrate.

[0014] In one embodiment of the invention, the method may further comprise a step for arranging an adhesive layer on the dielectric substrate.

[0015] The adhesive layer may be arranged so as to bond the dielectric substrate and the carbon-containing substrate. Alternatively or in combination, the adhesive layer may be arranged so as to bond the dielectric substrate and the electrically insulating substrate. The adhesive layer acts as a structural element enhancing the stability and integrity of the adhesion of the multilayer device. In particular, the adhesive layer makes it possible to increase the adhesion between the dielectric substrate and the carbon-containing substrate and / or between the dielectric substrate and the electrically insulating substrate.

[0016] In one embodiment of the invention, the adhesive layer may be discontinuous. The adhesive layer may comprise several portions. This makes it possible in particular to reduce the amount of material used while improving the adhesion between the dielectric substrate and the carbon-containing substrate and / or between the dielectric substrate and the electrically insulating substrate.

[0017] In one embodiment of the invention, the method may further comprise a step for plating the connection area of the distinct region of the carbon-containing substrate, in particular by a chemical bath, with a material comprising gold, or silver, or platinum, or a conductive polymer.

[0018] Plating the connection area of the distinct region makes it possible to mechanically consolidate the carbon-containing substrate, in particular if the carbon-containing substrate is made with a material comprising carbon nanotubes (CNTs). This step of the method makes it possible to manufacture a multilayer device that is mechanically stronger and resistant to handling and possible impacts. This also improves the electrical connection with the diagnostic device or instrument to which the multilayer device can be connected. Indeed, the electrical conductivity is increased thanks to the plating that enriches the connection areas with a highly conductive material.

[0019] Plating may be done by dipping the device directly into a plating bath. In particular, if the multilayer device comprises several distinct regions and therefore several connection areas, they may all be plated in a single step.

[0020] In one embodiment of the invention, the plating step may be carried out several times. This allows the connection areas to be plated with different metals. This allows the connectionareas to be plated with a multilayer structure. Thus, the device may be easily adapted to different diagnostic instruments.

[0021] The plating of the connection areas may also be carried out with materials other than metals. The plating may also have other objectives than increasing the conductivity of the connection areas.

[0022] In one embodiment of the invention, the cutting of the carbon-containing substrate may form a plurality, in particular more than two, of regions that are distinct and electrically insulated from each other as well as from the rest of the carbon-containing substrate. And, for each of the distinct regions, a corresponding first opening and a second opening are made in the dielectric substrate. Each first opening of the dielectric substrate is at least partially, in particular entirely, superimposed on the connection area of a corresponding distinct region, and each second opening of the distinct region of the dielectric substrate is at least partially, in particular entirely, superimposed on the sampling area of a corresponding distinct region.

[0023] Forming a plurality of distinct regions when cutting the carbon-containing substrate makes it possible to manufacture a multilayer device allowing the chemical analysis of several samples, in particular simultaneously. Thus, the costs of chemical analysis are reduced. This also makes it possible to easily adapt the multilayer device to allow it to carry out chemical analysis of samples at different volumes. In fact, distinct regions of the plurality of distinct regions may comprise sampling area with reduced sizes, in particular surface areas, or conversely increased sizes.

[0024] In one embodiment of the invention, the method may further comprise a step for producing a border, in particular made of PET, arranged on the dielectric substrate. The border may partially surround, in particular entirely, at least one second opening superimposed on a sampling area of a distinct region of the dielectric substrate, more particularly the border may surround each sampling region of the dielectric substrate.

[0025] The border makes it possible to retain the sample, in particular liquid, notably to prevent overflow.

[0026] In one embodiment of the invention, if there are several distinct regions in the carbon-containing substrate, each of the sampling areas may be partially surrounded, more particularly entirely surrounded, by a border. A border may then surround only one sampling area. In particular, there may be as many borders as sampling areas. It is also possible for a border to surround several sampling areas, in particular all sampling areas.

[0027] In one embodiment of the invention, the border may be discontinuous. The border may comprise a plurality of portions. This makes it possible, in particular, to reduce the amount of material used while improving the retention of the sample.

[0028] In one embodiment of the invention, the border may form a continuous contour surrounding each sampling area of the second set. In particular, the border may have a circular, elliptical or rectangular shape.

[0029] In one embodiment of the invention, the border may have a height equal to or greater than 1 millimetre. More particularly, the height of the border may have a height equal to or greater than 120 micrometres.

[0030] In one embodiment of the invention, the border may be made of silicone or polyethylene (PE) or polyethylene terephthalate (PET) or polyurethane (PU).

[0031] A border made of silicone or polyethylene (PE) or polyethylene terephthalate (PET) or polyurethane (PU), makes it possible to reduce the weight of the device. This also makes it possible to reduce manufacturing costs. The border may also be made of any other material suitable for delimiting and retaining the sample.

[0032] In one embodiment of the invention, the cutting of the distinct region of the carbon-containing substrate, in particular the cutting of the connection area and of the sampling area of the distinct region, is carried out by laser ablation.

[0033] Laser ablation makes it possible to reduce the manufacturing costs of the multilayer device. Indeed, this technique is relatively simple and fast. Thus, manufacturing times are reduced. Laser ablation further makes it possible to easily adapt the devices to the different conditions and requirements of industries. Indeed, with laser ablation, it is easy to precisely form several distinct regions. It is also easy to select and modify the sizes, shapes, arrangements of the different distinct regions as well as their connection and sampling areas.

[0034] In an embodiment of the invention, the carbon-containing substrate may be deposited on the electrically insulating substrate by screen printing or by chemical vapour deposition or by sputtering.

[0035] Screen printing makes it possible to deposit a wide variety of materials. Moreover, screen printing is a low-cost deposition method for producing medium and large quantities. This method also enables rapid deposition, thereby reducing manufacturing times and costs. Screen printing allows materials to be deposited in complex geometries with high precision. Moreover, screen printing is compatible with a wide variety of substrates. Screen printing makes it possible to reduce the amount of material required, in particular to reduce material waste.

[0036] Chemical Vapour Deposition (CVD) makes it possible to deposit a film or material on a substrate with high uniformity, in particular over a small thickness. Chemical vapour deposition allows a material to be deposited easily and quickly, and with high purity, over a large area, particularly during mass production. Thus, manufacturing costs may be reduced. Chemical vapour deposition also makes it possible to deposit a material with a constant thickness.Chemical vapour deposition makes it possible to precisely control the properties of the film of the deposited material, such as its chemical composition, crystalline structure or electrical properties.

[0037] Sputtering provides uniform and homogeneous deposition. In addition, the final thickness deposited on the substrate may be easily controlled, by adjusting the sputtering time for example. It is also a rapid deposition method, in particular for application on large surfaces.

[0038] The methods for depositing the carbon-containing substrate on the electrically insulating substrate are non-selective methods. In other words, the carbon-containing substrate is deposited homogeneously on all exposed and cut portions of the electrically insulating substrate. A non-selective deposition method makes it possible, in particular, to use a laser ablation technique to produce the distinct region(s) in the carbon-containing substrate.

[0039] The object of the invention is also achieved by means of a multilayer device for carrying out a chemical analysis. The multilayer device for carrying out chemical analysis comprises at least one carbon-containing substrate, in particular comprising carbon nanotubes, an electrically insulating substrate, and a dielectric substrate. The carbon-containing substrate is arranged, in particular directly arranged, between the electrically insulating substrate and the dielectric substrate. The carbon-containing substrate includes a cut-out forming a region of the carbon-containing substrate that is distinct and electrically insulated from the remainder of the carbon-containing substrate. The distinct region comprises a connection area and a sampling area electrically connected to each other, in particular via the distinct region, the sampling area of the carbon-containing substrate being intended to be in contact with a sample to be analysed, in particular a fluid, more particularly a biological fluid. The dielectric substrate comprises a first opening and a second opening. The first opening of the dielectric substrate is at least partially, in particular entirely, superimposed on the connection area of the distinct region of the carbon-containing substrate, and the second opening of the distinct region of the dielectric substrate is at least partially, in particular entirely, superimposed on the sampling area of the distinct region of the carbon-containing substrate.

[0040] The multilayer device makes it possible to carry out a chemical analysis of a sample at a reduced cost. Indeed, the simple structure of the device reduces manufacturing costs becauseits structure requires only a limited number of elements. The device according to the invention may in particular be disposable. Moreover, the required elements are made of relatively easily accessible and inexpensive materials.

[0041] The multilayer device does not require metals but a carbon-containing substrate, in particular carbon nanotubes (CNTs). However, in one embodiment of the invention, the carbon-containing substrate may comprise metals such as gold (Au), silver (Ag), platinum (Pt), nickel (Ni), palladium (Pa) or copper (Cu). This metal enrichment makes it possible to improve the conductivity of the carbon-containing substrate. This enrichment may also have a mechanically reinforcing effect in the case of a substrate comprising carbon nanotubes. However, if the carbon-containing substrate of the multilayer device according to the invention comprises metals, the total amount of metals in the multilayer device is reduced.

[0042] In one embodiment of the invention, the carbon-containing substrate may be made of a material comprising only carbon. In particular, the carbon-containing substrate may be made of a material comprising only carbon nanotubes.

[0043] The simple structure of the multilayer device according to the invention also allows the multilayer device to be easily adapted to different conditions and situations of use. In particular, the multilayer device according to the invention may thus be adapted to different diagnostic devices or instruments. Indeed, the distinct region of the carbon-containing substrate may be arranged in different ways. The distinct region of the carbon-containing substrate may have various shapes. In particular, in one embodiment of the invention, the connection area of the distinct region may be circular in shape, or elliptical in shape. The connection area of the distinct region may be rectangular in shape.

[0044] Similarly, in one embodiment of the invention, the sampling area of the distinct region may be circular in shape, or elliptical in shape. In one embodiment of the invention, the sampling area of the distinct region may be rectangular in shape.

[0045] In one embodiment of the invention, the sampling area of the distinct region may be rectangular in shape while the connection area of the distinct region may be circular in shape. Or, conversely, the sampling area of the distinct region may be circular in shape while the connection area of the distinct region may be rectangular in shape.

[0046] In one embodiment of the invention, the connection and sampling areas of the distinct region may have the same shape.

[0047] The connection area of the distinct region is accessible, in particular directly accessible, from the first opening of the dielectric substrate.

[0048] The sampling area of the distinct region is accessible, in particular directly accessible, from the second opening of the dielectric substrate.

[0049] The first and the second opening are holes passing entirely through the dielectric substrate in the direction of its thickness.

[0050] The thickness of the dielectric substrate is defined in a direction normal to a side of the dielectric substrate facing, in particular directly facing, the carbon-containing substrate.

[0051] The multilayer device according to the invention simplifies access to the analysis data thanks to a connection area arranged on the same side of the multilayer device as the sampling area.

[0052] In one embodiment of the invention, the electrically insulating substrate may be made of a material comprising polyethylene (PE), or polypropylene (PP), or polyester, or polyamide, or polyimide, or any combinations thereof. In particular, the electrically insulating substrate may be made of polyethylene terephthalate (PET), or polyetherketone (PEK), or polyetheretherketone (PEEK). The electrically insulating substrate may be made of any material that provides electrical insulation and sufficient mechanical support.

[0053] In one embodiment of the invention, the dielectric substrate may be made of a material comprising polyethylene (PE), or polypropylene (PP), or polyester, or polyamides, or polyimide, or vinyl ester polymer (VEP) or any combination thereof. In particular, the dielectric substrate may be made of polyethylene terephthalate (PET), or polyetherketone (PEK), or polyetheretherketone (PEEK). The dielectric substrate may be made of any material having dielectric properties.

[0054] In one embodiment of the invention, the multilayer device may furthermore comprise an adhesive layer, the adhesive layer being on the dielectric substrate.

[0055] The adhesive layer may be arranged so as to bond the dielectric substrate and the carbon-containing substrate. Alternatively or in combination, the adhesive layer may be arranged so as to bond the dielectric substrate and the electrically insulating substrate. The adhesive layer acts as a structural element improving the stability and integrity of the multilayer device. In particular, the adhesive layer makes it possible to increase the adhesion between the dielectric substrate and the carbon-containing substrate and / or between the dielectric substrate and the electrically insulating substrate.

[0056] The adhesive layer may be deposited on the dielectric substrate by coating. In particular, the adhesive layer may be deposited by slot-die coating. The coating allows a fast and inexpensive deposition. It also allows a uniform deposition, in particular in thickness, of the adhesive layer on the dielectric substrate.

[0057] In one embodiment of the invention, the multilayer device according to the invention may comprise only three layers. In particular, these three layers may be the dielectric substrate, the carbon-containing substrate and the electrically insulating substrate. In this case, the dielectric substrate may directly face the carbon-containing substrate. And, the electrically insulating substrate can directly face the carbon-containing substrate.

[0058] In one embodiment of the invention, the multilayer device of the invention may comprise only four layers. In particular, these four layers may be the dielectric substrate, the carbon-containing substrate, the electrically insulating substrate and the adhesive layer.

[0059] In one embodiment of the invention, the connection area of the discrete region of the carbon-containing substrate may be plated with a material comprising gold, or silver, or platinum, or a conductive polymer.

[0060] Plating the connection region of the distinct region makes it possible to obtain each of the aforementioned advantages with respect to the method according to the invention.

[0061] In particular, this makes it possible to mechanically consolidate the carbon-containing substrate and to increase its conductivity.

[0062] In one embodiment of the invention, the cutting of the carbon-containing substrate may form a plurality, in particular more than two, of regions that are distinct and electrically insulated from each other as well as from the rest of the carbon-containing substrate. For each of the distinct regions, the dielectric substrate may comprise a first opening and a second opening. Each first opening of the dielectric substrate is at least partially, in particular entirely, superimposed on the connection area of a corresponding distinct region. And each second opening of the distinct region of the dielectric substrate is at least partially, in particular entirely, superimposed on the sampling area of a corresponding distinct region.

[0063] A multi-layer device comprising a plurality of distinct regions makes it possible to obtain each of the aforementioned advantages over the method according to the invention.

[0064] In particular, this allows the chemical analysis of several samples, in particular simultaneously, with a single multilayer device. Thus, the costs of chemical analysis can be reduced.

[0065] In one embodiment of the invention, at least one second opening of the dielectric substrate may be partially surrounded, in particular fully surrounded, by a border disposed on the dielectric substrate.

[0066] A border makes it possible to retain the sample, in particular a liquid sample, notably to prevent overflow. Thus, this prevents a sample from polluting or interfering with another sample located next to it or with another sampling region. This also makes it possible to further securethe sample by keeping it in its sampling region, in particular when handling the device. For example, when the device is handled to be inserted into a diagnostic instrument, the sample is more secure and held in its sampling region by the surrounding border. The border acts as a structural element enhancing sample retention and holding.

[0067] The border also makes it easier for the user to correctly and precisely apply the sample on the sampling region.

[0068] In one embodiment of the invention, each connection area of the distinct regions of the carbon-containing substrate may be arranged in a first line. And, each sampling area of the distinct regions of the carbon-containing substrate may be arranged along a second line, the second line being parallel to the first line.

[0069] This arrangement of connection areas facilitates connection with a diagnostic instrument. Thus, the compatibility of the device according to the invention with different diagnostic instruments is increased. The arrangement of the sampling areas along a line parallel to the first line facilitate the deposition of samples in the sampling regions. In particular, the deposition is facilitated when it is carried out in a single step. Thus, handling times, and therefore analysis costs, are reduced. This also makes it possible to simplify the manufacture of the multilayer device and therefore reduce the manufacturing costs.

[0070] This arrangement of the sampling regions also makes it possible to produce multilayer devices having a smaller dimension in the axis perpendicular to the first and second lines. This makes it possible to reduce the size and therefore the amount of material required.

[0071] In one embodiment of the invention, each connection area of the distinct regions of the carbon-containing substrate may be arranged in a first line. And, each sampling area of the distinct regions of the carbon-containing substrate may be arranged along a second line, the second line being perpendicular to the first line.

[0072] The arrangement of the sampling areas along a line perpendicular to the first line allows them to facilitate the deposition of samples in the sampling regions. In particular, the deposition is facilitated when it is carried out in a single step. Thus, handling times, and therefore analysis costs, are reduced. This also simplifies the manufacture of the device, thereby reducing the manufacturing costs.

[0073] This arrangement of the sampling areas also makes it possible to produce multilayer devices having a smaller dimension in the axis of the first line. This makes it possible to reduce the size and therefore the amount of material required.

[0074] The drawings accompanying the invention are incorporated into and form an integral part of the description to illustrate several embodiments of the present invention. Thesedrawings, together with the description, serve to explain the principles of the invention. The sole purpose of the drawings is to illustrate the preferred and alternative examples of how the invention may be embodied and used, and should not be construed as limiting the invention solely to the embodiments illustrated and described. In addition, several aspects of the embodiments may constitute, individually or in different combinations, solutions in accordance with the present invention. The embodiments described below may therefore be considered alone or in an arbitrary combination.

[0075] Other features and advantages will become apparent from the more precise description that follows of the various embodiments of the invention, as illustrated in the attached drawings, in which similar references refer to similar elements, and where:

[0076] Fig. 1 is a schematic representation of three manufacturing steps of the method according to one embodiment of the invention.

[0077] Fig. 2 is a schematic representation of two other manufacturing steps of the method according to one embodiment of the invention.

[0078] Fig. 3 is a schematic representation of a top view of the multilayer device according to the invention.

[0079] Fig. 4 is a schematic representation of two further additional manufacturing steps of the method according to one embodiment of the invention.

[0080] Fig. 5 is a schematic representation of a top view of the multilayer device according to another embodiment.

[0081] Figure 1 shows three steps 100, 200, 300 according to one embodiment of the invention. In step 100, an electrically insulating substrate 1 is provided. Then, in step 200, a substrate 3 comprising carbon, in particular in this case carbon nanotubes, is directly arranged on a side 2 of the electrically insulating substrate 1. The substrate 3 comprising carbon nanotubes is in this case deposited on the electrically insulating substrate 1 by screen printing.

[0082] In step 200 of Figure 1 , the substrate 3 comprising carbon nanotubes is not deposited on the entire side 2 of the electrically insulating substrate 1. Indeed, the substrate 3 comprising the carbon nanotubes is deposited on the side 2 of the electrically insulating substrate 1 except on a margin 4 of the electrically insulating substrate 1.

[0083] Then, step 300 is carried out. In step 300, three distinct regions 23, 25, 27 are produced in the substrate 3 comprising the carbon nanotubes. The three distinct regions 23, 25, 27 are in this case produced by laser ablation. The three distinct regions 23, 25, 27 are distinct and electrically insulated from each other as well as from the remainder of the substrate 3 comprising the carbon nanotubes. In particular, the electrical insulation of the three distinctregions 23, 25, 27 is respectively obtained by means of an electrically insulating boundary 29, 31 , 33, resulting from the laser ablation step. The electrically insulating boundaries 29, 31 , 33 each have a width L1. In the electrically insulating boundaries 29, 31, 33, the substrate comprising the carbon nanotubes 3 has been entirely removed by laser ablation. Only the electrically insulating substrate 1 remains at the electrically insulating borders 29, 31, 33.

[0084] According to one embodiment, the electrically insulating boundaries 29, 31, 33 may be filled with a material, in particular an electrically insulating material. This makes it possible, in particular, to increase the electrical insulation of the distinct regions 23, 25, 27 of the remainder of the carbon-containing substrate nanotubes 3. Thus, the efficiency and accuracy of the resulting multilayer device may be improved.

[0085] According to another embodiment, the electrically insulating boundaries 29, 31, 33 may, in some embodiments of the invention, be filled with an electrically insulating material that is impermeable to liquids, in particular water. This makes it possible, in addition to increasing the electrical insulation of the distinct regions 23, 25, 27, to make the resulting multilayer device more resistant to humid environments, as well as to exposure to vapours or liquids, for example.

[0086] Each distinct region 23, 25, 27 respectively comprises a connection area 5, 7, 9. Each distinct region 23, 25, 27 further comprises respectively a sampling area 11, 13, 15. The connection areas 5, 7, 9 are each respectively connected to their sampling area 11, 13, 15 via a respective conductive track 17, 19, 21. The conductive tracks 17, 19, 21 are formed by the substrate 3 comprising carbon nanotubes.

[0087] In one embodiment of the invention, the conductive corridors 17, 1921 may be made of a material other than that of the substrate 3 comprising carbon nanotubes. In particular, the conductive tracks 17, 19, 21 may be made of metal so as to form an electrical connection between the connection areas 5, 7, 9 and the respective sampling areas 11, 13, 15.

[0088] In the embodiment of the invention described in Figure 1, the connection areas 5, 7, 9 are essentially rectangular in shape.

[0089] Similarly, in the embodiment of the invention described in Figure 1, the sampling areas 11, 13, 15 are essentially rectangular in shape.

[0090] At the end of step 300 of Figure 1 , a first multilayer structure 400 is obtained. The multilayer structure 400 particularly comprises a substrate 3 comprising carbon nanotubes deposited directly on the electrically insulating substrate 1.

[0091] Figure 2 shows two other steps 500, 600 according to one embodiment of the invention. The steps 500, 600 are distinct and different from the steps 100, 200, 300 of Figure 1. The steps 500, 600 of Figure 2 and the steps 100, 200, 300 of Figure 1 can be carried out in parallel andsimultaneously. Thus, the manufacturing time and the manufacturing cost of the multilayer device may be reduced.

[0092] In step 500, an electrically dielectric substrate 100 is provided. Then, in step 600, three first openings 37, 39, 41 are made in the dielectric substrate 35. In particular, the first three openings 37, 39, 41 are made in this case by punching. The first three openings 37, 39, 41 are made so that, when the dielectric substrate 35 is superimposed with the multilayer structure 400, the first three openings 37, 39, 41 are respectively superimposed on the connection areas 5, 7, 9.

[0093] Furthermore in step 600, three second openings 43, 45, 47 are made in the dielectric substrate 35. In particular, the three second openings 43, 45, 47 are in this case also made by punching. The three second openings 43, 45, 47 are made so that, when the dielectric substrate 35 is superimposed with the multilayer structure 400, the three second openings 43, 45, 47 are respectively superimposed on the sampling areas 11, 13, 15.

[0094] In the embodiment of the invention described in Figure 2, the first openings 37, 39, 41 are essentially rectangular in shape.

[0095] In the embodiment of the invention described in Figure 2, the second openings 43, 45, 47 are essentially circular or oval in shape. Moreover, the second openings 43, 45, 47 do not have the same diameters. Indeed, the diameter of the opening 45 is greater than the diameter of the opening 47 and the diameter of the opening 43. And, the diameter of the opening 47 is greater than the diameter of the opening 43.

[0096] At the end of step 600 of Figure 2, a second structure 700 is obtained. The structure 700 corresponds to the punched dielectric substrate 35. The structure 700 therefore comprises the first three openings 37, 39, 41 and the three second openings 43, 45, 47.

[0097] Figure 3 schematically shows a top view of a multilayer device 900 according to the invention, which corresponds to the product of a step 800 according to the method of the invention.

[0098] In step 800, the multilayer structure 400 and the punched structure 700 are superimposed on each other. In particular, the multilayer structure 400 and the punched structure 700 are superimposed so that the first openings 37, 39, 41 of the dielectric substrate 35 are superimposed, at least partially, respectively on the connection areas 5, 7, 9 of the substrate 3 comprising carbon nanotubes. Similarly, the multilayer structure 400 and the punched structure 700 are superimposed so that the second openings 43, 45, 47 of the dielectric substrate 35 are superimposed, at least partially, respectively on the sampling areas 11, 13, 15 of the substrate 3 comprising carbon nanotubes.

[0099] In the multilayer device 900 of Figure 3, the first openings 37, 39, 41 respectively are entirely superimposed on the connection areas 5, 7, 9 of the substrate 3 comprising carbon nanotubes.

[0100] In particular, in this embodiment of the invention, the first openings 37, 39, 41 are not respectively superimposed on the insulating boundaries 29, 31, 33. This means that by orthogonal projection onto the multilayer structure 400, the first openings 37, 39, 41 fit into the connection areas 5, 7, 9. In particular, this means that by orthogonal projection onto the multilayer structure 400, the first openings 37, 39, 41 do not intersect with the insulating boundaries 29, 31, 33, respectively.

[0101] In the multilayer device 900 of Figure 3, the second openings 43, 45, 47 respectively are entirely superimposed on the sampling areas 11, 13, 15 of the substrate 3 comprising carbon nanotubes.

[0102] In particular, in this embodiment of the invention, the second openings 43, 45, 47 are not respectively superimposed on the insulating boundaries 29, 31, 33. This means that by orthogonal projection onto the multilayer structure 400, the second openings 43, 45, 47 fit into the sampling areas 11, 13, 15. In particular, this means that by orthogonal projection onto the multilayer structure 400, the second openings 43, 45, 47 do not intersect with the insulating boundaries 29, 31, 33, respectively.

[0103] Orthogonal projection onto the multilayer structure 400 should be understood as a projection along a normal to the substrate 3 comprising carbon nanotubes. This also corresponds to a projection along the direction of the thickness of the multilayer structure 400, otherwise along an axis orthogonal to the electrically insulating substrate 1 and to the substrate 3 comprising carbon nanotubes.

[0104] In the multilayer device 900, the dielectric substrate 35 is slightly larger than the substrate, comprising carbon nanotubes. Thus, the dielectric substrate 35 is slightly superimposed on the margin 4 of the electrically insulating substrate 1.

[0105] In one embodiment of the invention, it is possible to arrange an adhesive layer (not shown) on the dielectric substrate 35. In particular, this adhesive layer is arranged on a face of the dielectric substrate 35 that faces the multilayer structure 400 during the superimposition step 800. The adhesive layer, not visible in the Figures, can be arranged so as to increase the adhesion between the dielectric substrate 35 and the substrate 3 comprising carbon nanotubes. To this end, the adhesive layer is arranged so as to be directly between and directly in contact with the dielectric substrate 35 and the substrate 3 comprising carbon nanotubes.

[0106] In one embodiment of the invention, the adhesive layer, not visible in the Figures, may also be arranged so as to increase the adhesion between the dielectric substrate 35 and the electrically insulating substrate 1. To this end, the adhesive layer is arranged so as to be directly between and directly in contact with the dielectric substrate 35 and the electrically insulating substrate 1. For example, the adhesive layer can in this case be arranged on the part of the dielectric substrate 35 which is superimposed on the margin 4 of the electrically insulating substrate.

[0107] Figure 4 shows two additional steps 1000, 1200 according to one embodiment of the invention.

[0108] Step 1000 is carried out from, for example, the multilayer device 900 obtained at the end of step 800 of Figure 3. The product of step 1000 is the multilayer device 1100.

[0109] During step 1000, the connection areas 5, 7, 9 are plated with metal. In Figure 4, three plated areas 49, 51, 53 can be seen. This plating is carried out, for example, by immersing the multilayer device 900 in a chemical bath. The metal plating is carried out directly on the connection areas 5, 7, 9, in particular via the first openings 37, 39, 41. The plating may, in some embodiments of the invention, fill a portion of the void formed by the first openings 37, 39, 41. However, preferably, the plating does not exceed the thickness of the dielectric substrate 35.

[0110] Step 1200 is carried out from the multilayer device 1100 obtained at the end of step 1000. The product of step 1200 is the multilayer device 1300.

[0111] During step 1200, a border 55 is arranged on a side 57 of the dielectric substrate 35. The side 57 is opposite to the side of the dielectric substrate 35 which faces the multilayer structure 400.

[0112] The border 55 is in this case essentially rectangular in shape. The border 55 entirely surrounds the second openings 43, 45, 47. The border 55 is, in this embodiment of the invention, continuous. The border 55 has a thickness L2. Preferably, the thickness L2 is comprised between 3 millimetres and 5 millimetres.

[0113] The edge has a height, in the direction of the thickness of the dielectric substrate 35, of between 50 micrometres and 110 micrometres. The height of the border 55 is not visible in the view of Figure 4.

[0114] It is possible to add steps to add layers, elements or treatments to any of the devices 900, 1100, 1200.

[0115] Figure 5 shows a multilayer device 1400 according to another embodiment other than those described in Figures 1 to 4. Indeed, compared to the devices 900, 1100, 1200, themultilayer device 1400 comprises five first openings 77, 79, 81, 83, 85, and not three, respectively entirely superimposing five connection areas 59, 61, 63, 65, 67, and not three.

[0116] Similarly, compared to the devices 900, 1100, 1200, the multilayer device 1400 comprises five second openings 87, 89, 91, 93, 95, and not three, respectively entirely superimposing five sampling areas 69, 71 , 72, 73, 75, and not three.

[0117] In addition, the five connection areas 59, 61, 63, 65, 67 are arranged along a first straight line. And, the five sampling areas 69, 71, 72, 73, 75 are arranged in a second straight line. The second straight line is parallel to the first straight line. In this embodiment, the second straight line is distinct from the first straight line. In some embodiments of the invention, the second straight line may be confused with the first straight line.

[0118] In the devices 900, 1100, 1200, the connection areas 5, 7, 9 are arranged in a first straight line. And, the sampling areas 11, 13, 15 are arranged in a second straight line. In this embodiment of the invention, the second straight line is perpendicular to the first straight line.

[0119] According to another embodiment of the invention not shown in this case, it is possible to arrange the connection areas and the sampling areas differently.

[0120] List of reference signs:1 : electrically insulating substrate2: side of the electrically insulating substrate3: carbon-containing substrate4: margin of the electrically insulating substrate5, 7, 9: connection area11, 13, 15: sampling area17, 19, 21: conductive track23, 25, 27: distinct region29, 31, 33: insulating boundary 35: dielectric substrate37, 39, 40: first opening43, 45, 47: second opening49, 51: plated area55: border57: side of the dielectric substrate59, 61, 63, 65, 67: connection area69, 71, 72, 73, 75: sampling area77, 79, 81 , 83, 85: first opening87, 89, 91, 93, 95: second opening100, 200, 300, 500, 600, 800, 1000, 1200: step400: multilayer structure700: punched dielectric substrate 900, 1100, 1300, 1400: multilayer device L1 : width of the borderL2: width of the border

Claims

CLAIMS1. A method for manufacturing a multilayer device (900, 1100, 1300, 1400) for carrying out a chemical analysis comprising at least:- a step for making, in particular by punching, a first opening (37, 39, 41) and a second opening (43, 45, 47) in a dielectric substrate (35), and- a step for carrying out, in particular by laser ablation, in a carbon-containing substrate (3), more particularly carbon nanotubes, a cut so as to form a distinct region (23, 25, 27) and electrically insulated from the remainder of said carbon-containing substrate (3), the distinct region (23, 25, 27) comprising a connection area (5, 7, 9) and a sampling area (11, 13, 15) electrically connected to each other, in particular via the distinct region, the sampling area (11, 13, 15) of the carbon-containing substrate (3) being intended to be in contact with a sample to be analysed, in particular a fluid, more particularly a biological fluid, and- a step for superimposing the carbon-containing substrate (3) and the dielectric substrate (35) on an electrically insulating substrate (1), such that the carbon-containing substrate (3) is arranged between the electrically insulating substrate (1) and the dielectric substrate (35), and the first opening (37, 39, 41) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the connection area (5, 7, 9) of the distinct region (23, 25, 27) of the carbon-containing substrate (3), and the second opening (43, 45, 47) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the sampling area (11, 13, 15) of the distinct region (23, 25, 27) of the carbon-containing substrate (3).

2. The manufacturing method according to claim 1 , further comprising a step for arranging an adhesive layer on the dielectric substrate (35).

3. The manufacturing method according to claim 1 or 2, further comprising a step for plating the connection area (5, 7, 9) of the distinct region (23, 25, 27) of the carbon-containing substrate (3), in particular by a chemical bath, with a material comprising gold, or silver, or platinum, or a conductive polymer.

4. The manufacturing method according to any one of claims 1 to 3, wherein the cutting of the carbon-containing substrate (3) forms a plurality, in particular more than two, of distinct regions (23, 25, 27) and electrically insulated from each other as well as from the remainder of the carbon-containing substrate (3), and, where, for each of the distinct regions (23, 25, 27), acorresponding first opening (37, 39, 41) and a corresponding second opening (43, 45, 47) are made in the dielectric substrate (35), each first opening (37, 39, 41) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the connection area (5, 7, 9) of a corresponding distinct region (23, 25, 27), and each second opening (43, 45, 47) of the distinct region (23, 25, 27) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the sampling area (11, 13, 15) of a corresponding distinct region (23, 25, 27).

5. The manufacturing method according to any one of claims 1 to 4, comprising a step for producing a border (55), in particular made of PET, arranged on the dielectric substrate (35), the border (55) partially surrounding, in particular entirely, at least one second opening (43, 45, 47) superimposed on a sampling area (11, 13, 15) of a distinct region (23, 25, 27) of the dielectric substrate (35), more particularly surrounding each sampling region of the dielectric substrate.

6. The manufacturing method according to any one of claims 1 to 5, wherein the cutting of the distinct region (23, 25, 27) of the carbon-containing substrate (3), in particular the cutting of the connection area (5, 7, 9) and the sampling area (11, 13, 15) of the distinct region (23, 25, 27), is carried out by laser ablation.

7. The manufacturing method according to any one of claims 1 to 6, wherein the carbon- containing substrate (3) is deposited on the electrically insulating substrate (1) by screen printing or by chemical vapour deposition.

8. A multilayer device (900, 1100, 1300, 1400) to carry out a chemical analysis comprising at least:- a carbon-containing substrate (3), in particular comprising carbon nanotubes, and- an electrically insulating substrate (1), and- a dielectric substrate (35), andthe carbon-containing substrate (3) is arranged, in particular directly arranged, between the electrically insulating substrate (1) and the dielectric substrate (35), andthe carbon-containing substrate (3) comprises a cut-out forming a region of said carbon- containing substrate (3) distinct (23, 25, 27) and electrically insulated from the remainder of said carbon-containing substrate (3), the distinct region (23, 25, 27) comprises a connection area (5, 7, 9) and a sampling area (11, 13, 15) electrically connected to each other, in particular via the distinct region, the sampling area (11, 13, 15) of the carbon-containing substrate (3) being intended to be in contact with a sample to be analysed, in particular a fluid, more in particularly a biological fluid, and the dielectric substrate (35) comprises a first opening (37, 39, 41) and a second opening (43, 45, 47), andthe first opening (37, 39, 41 ) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the connection area (5, 7, 9) of the distinct region (23, 25, 27) of the carbon- containing substrate (3), and the second opening (43, 45, 47) of the distinct region (23, 25, 27) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the sampling area (11, 13, 15) of the distinct region (23, 25, 27) of the carbon-containing substrate (3).

9. The multilayer device (900, 1100, 1300, 1400) according to claim 8, wherein the multilayer device (900, 1100, 1300, 1400) further comprises an adhesive layer, the adhesive layer is on the dielectric substrate (35).

10. The multilayer device (900, 1100, 1300, 1400) according to claim 8 or 9, wherein the connection area (5, 7, 9) of the distinct region (23, 25, 27) of the carbon-containing substrate (3) is plated with a material comprising gold, or silver, or platinum, or a conductive polymer.

11. The multilayer device (900, 1100, 1300, 1400) according to any one of claims 8 to 10, wherein the cutting of the carbon-containing substrate (3) forms a plurality, in particular more than two, of distinct regions (23, 25, 27) and electrically insulated from each other as well as from the remainder of the carbon-containing substrate (3), and, for each of the distinct regions (23, 25, 27), the dielectric substrate (35) comprises a first opening (37, 39, 41 ) and a second opening (43, 45, 47), each first opening (37, 39, 41) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the connection area (5, 7, 9) of a corresponding distinct region (23, 25, 27), and each second opening (43, 45, 47) of the distinct region (23, 25, 27) of the dielectric substrate (35) is at least partially, in particular entirely, superimposed on the sampling area (11, 13, 15) of a corresponding distinct region (23, 25, 27).

12. The multilayer device (900, 1100, 1300, 1400) according to any one of claims 8 to 11, wherein at least one second opening (43, 45, 47) of the dielectric substrate (35) is partially surrounded, in particular entirely surrounded, by a border (55) arranged on the dielectric substrate (35).

13. The multilayer device (900, 1100, 1300, 1400) according to claim 11 or 12, wherein each connection area (5, 7, 9) of the distinct regions (23, 25, 27) of the carbon-containing substrate (3) is arranged in a first line and, each sampling area (11, 13, 15) of the distinct regions (23, 25, 27) of the carbon-containing substrate (3) is arranged in a second line, the second line being parallel to the first line.

14. The multilayer device (900, 1100, 1300, 1400) according to claim 11 or 12, wherein each connection area (5, 7, 9) of the distinct regions (23, 25, 27) of the carbon-containing substrate (3) is arranged in a first line and, each sampling area (11, 13, 15) of the distinct regions (23, 25, 27) of the carbon-containing substrate (3) is arranged in a second line, the second line being perpendicular to the first line.

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