Forming method and forming system

Abstract

This forming method comprises: supplying, to at least a part of a first formed layer that has been formed, a forming material containing nickel, chromium, and cobalt and further containing aluminum and titanium in a total amount of 4.5% by mass or more; and forming a second formed layer on the first formed layer by irradiating the forming material with an energy beam, thereby forming a formed article including the first formed layer and the second formed layer. The irradiation with the energy beam in forming the formed article includes irradiation with an energy beam having an energy density of 70 (J / mm2) or less.

Description

Molding method and molding system

[0001] The present invention relates, for example, to the technical field of a molding method and a molding system capable of forming a molded object.

[0002] An example of a fabrication system for creating objects is described in Patent Document 1. Such a fabrication system is required to create appropriate objects.

[0003] U.S. Patent Publication No. 2016 / 0375521

[0004] According to the first embodiment, the process includes supplying a molding material containing nickel, chromium, and cobalt, and further containing aluminum and titanium in a total mass of 4.5% or more, to at least a portion of the formed first molding layer, and irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first and second molding layers, wherein the irradiation of the energy beam in forming the molded object has an energy density of 70 (J / mm²). ２ A fabrication method is provided which includes irradiation with the energy beam described above.

[0005] According to the second aspect, the process includes supplying a molding material containing nickel, chromium, and cobalt, and further containing aluminum and titanium in a total mass of 4.5% or more, in at least a portion of the formed first molding layer; irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first and second molding layers; and performing heat treatment on the molded object, wherein the irradiation of the energy beam in forming the molded object has an energy density of 60 (J / mm²). ２ A fabrication method is provided which includes irradiation with the energy beam described above.

[0006] According to a third embodiment, a molding method is provided which includes supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer formed by a molding apparatus, and irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first molding layer and the second molding layer, wherein forming the molded object includes adjusting the output of the energy beam emitted by the beam source to a range of 50 W or more and 300 W or less, and adjusting the relative movement speed of the energy beam with respect to the first molding layer in a direction intersecting the direction of propagation of the energy beam to a range of 1 mm / second or more and 30 mm / second.

[0007] A fourth embodiment provides a fabrication method that includes receiving input of specification information for specifying fabrication conditions for fabricating a fabricated object; displaying information regarding the energy density of an energy beam calculated based on the input specification information; supplying a fabrication material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more of aluminum and titanium by mass, to at least a portion of a first fabrication layer which is part of the fabricated object; and irradiating the fabrication material with the energy beam in such a way as to satisfy the fabrication conditions indicated by the input specification information, thereby fabricating a second fabrication layer on the first fabrication layer and fabricating the fabricated object.

[0008] According to a fifth aspect, a fabrication method is provided which includes receiving input of designation information for specifying the energy density of an energy beam; setting fabrication conditions for fabricating a fabricated object that can realize the energy density indicated by the input designation information; supplying a fabrication material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first fabrication layer which is part of the fabricated object; and irradiating the fabrication material with the energy beam in a manner that satisfies the set fabrication conditions, thereby fabricating a second fabrication layer which is part of the fabricated object on the first fabrication layer.

[0009] According to the sixth aspect, the molding apparatus comprises a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of the molded first molding layer, and an irradiation optical system capable of emitting an energy beam, and a control device that controls the molding apparatus to irradiate the molding material with the energy beam to form a second molding layer, which is part of the molded object, on the first molding layer, thereby forming a molded object including the first molding layer and the second molding layer, wherein the control device has an energy density of 70 (J / mm²). ２ A molding system is provided that controls the molding apparatus to irradiate the molding material with the energy beam having the following characteristics.

[0010] According to the seventh aspect, the molding apparatus comprises a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of the molded first molding layer, and an irradiation optical system capable of emitting an energy beam; a control device that controls the molding apparatus to irradiate the molding material with the energy beam to form a second molding layer, which is part of the molded object, on the first molding layer, and to form a molded object including the first molding layer and the second molding layer; and a heat treatment device that performs heat treatment on the molded object, wherein the control device has an energy density of 60 (J / mm²). ２ A system is provided to control the molding apparatus so as to irradiate the molding material with the energy beam having the following characteristics:

[0011] According to the eighth aspect, a molding system is provided comprising a molding apparatus comprising a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molded layer formed by the molding apparatus, and an irradiation optical system capable of emitting an energy beam, and a control device that controls the molding apparatus to form a second molded layer on the first molded layer by irradiating the molding material with the energy beam, wherein the control device adjusts the output of the energy beam emitted by the beam source in the range of 50 W or more and 300 W or less, and adjusts the relative movement speed of the energy beam with respect to the first molded layer in the direction along the direction of propagation of the energy beam in the range of 1 mm / s or more and 30 mm / s.

[0012] According to the ninth aspect, a molding system is provided comprising a molding apparatus comprising a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer which is part of a molded object, and an irradiation optical system capable of emitting an energy beam, and a control device that controls the molding apparatus to mold a second molding layer which is part of the molded object on the first molding layer by irradiating the molding material with the energy beam, wherein the control device receives input of specification information for specifying molding conditions for molding the molded object, controls a display device to display information regarding the energy density of the energy beam calculated based on the input specification information, and controls the molding apparatus to mold the molded object by irradiating the energy beam to satisfy the molding conditions indicated by the input specification information.

[0013] According to the tenth aspect, a molding apparatus is provided which comprises a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer which is part of a molded object, and an irradiation optical system capable of emitting an energy beam, and a control device that controls the molding apparatus to form a second molding layer which is part of the molded object on the first molding layer by irradiating the molding material with the energy beam, wherein the control device receives input of specification information for specifying the energy density of the energy beam, sets molding conditions for forming the molded object which can achieve the energy density indicated by the input specification information, and controls the molding apparatus to form the molded object by irradiating the energy beam which satisfies the set molding conditions.

[0014] The effects and other benefits of the present invention will be revealed from the embodiments described below.

[0015] Figure 1 is a block diagram showing the configuration of the molding system of this embodiment. Figure 2 shows an example of an alloy that constitutes the molding material. Figure 3 is a cross-sectional view showing the configuration of the molding apparatus of this embodiment. Figure 4 is a block diagram showing the configuration of the molding apparatus of this embodiment. Figure 5 is a block diagram showing the configuration of the heat treatment apparatus of this embodiment. Figure 6 is a block diagram showing the configuration of the control device of this embodiment. Figure 7 is a flowchart showing the flow of the molding operation performed by the molding system of this embodiment. Figures 8A to 8C are cross-sectional views showing the state when a molding light is irradiated onto a certain area on the workpiece and the molding material is supplied. Figures 9A to 9C are cross-sectional views showing the process of forming a three-dimensional structure. Figure 10 is a cross-sectional view showing the molding surface where a molten pool has been formed by the molding light during the molding period, and the molding surface where the molded object has been formed as the molten pool has solidified. Figure 11 is a phase diagram showing the relationship between the temperature of an alloy called Inconel 738LC, which is an example of a molding material, and the phase of the alloy. Figure 12 is a graph showing the relationship between the output power of the build light, the scanning speed of the build light, and the energy density of the build light when the beam spot size of the build light is 0.5 mm (i.e., 500 μm). Figure 13 shows a cross-section of an object actually built by the build device in an experiment conducted by the inventors of the present invention to build an object under conditions where the beam spot size of the build light is 0.5 mm and the energy density is 70 or less. Figure 14 shows the optical density of an object actually built by the build device in an experiment conducted by the inventors of the present invention to build an object under conditions where the beam spot size of the build light is 0.5 mm. Figure 15 is a graph showing the relationship between the output power of the build light, the scanning speed of the build light, and the energy density of the build light when the beam spot size of the build light is 0.5 mm. Figure 16 shows the crystal structure of an object actually fabricated by the fabrication device in an experiment conducted by the inventors of the present invention, under the condition that the size of the fabrication light beam spot is 0.5 mm. Figure 17 is a graph showing the relationship between the output of the fabrication light, the scanning speed of the fabrication light, and the energy density of the fabrication light when the size of the fabrication light beam spot is 0.5 mm.Figure 18 is a graph showing the tensile strength of an object actually fabricated by the 3D printer. Figures 19A and 19B show the density adjustment GUI, respectively. Figures 20A to 20C show the operation to repair cracks that occurred during the fabrication period. Figures 21A to 21C show a first example of the operation to repair cracks that occurred during the fabrication period. Figures 22A to 22C show a first example of the operation to repair cracks that occurred during the fabrication period. Figures 23A to 23C show a second example of the operation to repair cracks that occurred during the fabrication period. Figure 24 is a graph showing the relationship between the output of the fabrication light, the scanning speed of the fabrication light, and the energy density of the fabrication light when the beam spot size of the fabrication light is 0.5 mm. Figure 25 is a graph showing the relationship between the output of the fabrication light, the scanning speed of the fabrication light, and the energy density of the fabrication light when the beam spot size of the fabrication light is 0.5 mm. Figure 26 is a block diagram showing the configuration of the fabrication system in a modified example.

[0016] The following describes embodiments of the fabrication method and fabrication system with reference to the drawings. In the following, embodiments of the fabrication method and fabrication system will be described using the SYS fabrication system, which is capable of fabricating objects by performing additive processing.

[0017] The following explanation describes the positional relationships of the various components that make up the SYS molding system using the XYZ Cartesian coordinate system, defined by the mutually orthogonal X, Y, and Z axes. For the sake of clarity, the X and Y axes are assumed to be horizontal directions (i.e., predetermined directions within the horizontal plane), and the Z axis is assumed to be vertical directions (i.e., directions perpendicular to the horizontal plane, essentially the up-and-down direction or the direction of gravity). The rotational directions (in other words, tilt directions) around the X, Y, and Z axes are referred to as the θX direction, θY direction, and θZ direction, respectively. The Z axis may also be considered the direction of gravity. The XY plane may also be considered the horizontal direction.

[0018] (1) Configuration of the SYS molding system First, the configuration of the SYS molding system of this embodiment will be described.

[0019] (1-1) Overall Configuration of the SYS Printing System First, the overall configuration of the SYS printing system of this embodiment will be described with reference to Figure 1. Figure 1 is a block diagram showing the overall configuration of the SYS printing system of this embodiment.

[0020] As shown in Figure 1, the SYS molding system comprises a molding device 1, a heat treatment device 2, and a control device 3. However, the SYS molding system does not necessarily have to include the heat treatment device 2.

[0021] The molding device 1 is capable of forming objects. In particular, the molding device 1 is capable of forming objects under the control of the control device 3.

[0022] The molding apparatus 1 can create a molded object that is integrated with (or separable from) the workpiece W by performing additional processing on the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds a molded object that is integrated with (or separable from) the workpiece W to the workpiece W. For this reason, the molding apparatus 1 may be called a processing apparatus, and the molding system SYS may be called a processing system. In this embodiment, the molded object may refer to any object that the molding apparatus 1 molds.

[0023] If the workpiece W is the stage 131 described later, the molding apparatus 1 can perform additional processing on the stage 131. If the workpiece W is a placed object that is placed on the stage 131, the molding apparatus 1 can perform additional processing on the placed object. The placed object that is placed on the stage 131 may be another object (i.e., an existing structure) that has been fabricated by the molding system SYS. Figure 1 shows an example where the workpiece W is an existing structure placed on the stage 131. Furthermore, the following explanation will also proceed using the example where the workpiece W is an existing structure placed on the stage 131.

[0024] The molding apparatus 1 may sequentially mold multiple molding layers SL (see Figure 8, etc., described later), each of which is also a molded object, thereby creating a molded object containing multiple molding layers SL. In other words, the molding apparatus 1 may sequentially mold multiple molding layers SL, each of which is a first molded object, thereby creating a second molded object in which multiple molding layers SL are stacked.

[0025] The molding apparatus 1 performs additive processing by processing the molding material M using a molding light EL, which is an energy beam. Specifically, the molding apparatus 1 performs additive processing by irradiating the molding material M with the molding light EL. The molding material M is a material that can be melted by irradiation with molding light EL at a predetermined intensity or higher. For example, metallic materials can be used as such a molding material M. The molding material M is a powdered material. In other words, the molding material M is a powder. However, the molding material M does not have to be a powder. For example, at least one of a wire-shaped molding material and a gaseous molding material may be used as the molding material M.

[0026] In this embodiment, an example is described in which a molding material M is used that contains nickel (Ni), chromium (Cr), and cobalt (Co), and also contains aluminum (Al) and titanium (Ti) in a total mass of 4.5% or more. In other words, in this embodiment, an example is described in which a molding material M is used that is composed of an alloy containing nickel, chromium, and cobalt, and also contains aluminum and titanium in a total mass of 4% or more.

[0027] The nickel content of the molding material M is 45-80% by mass. The upper limit of the nickel content is preferably 78%, more preferably 75%. The lower limit of the nickel content is preferably 46%, more preferably 48%. The chromium content of the molding material M is 5-25% by mass. The upper limit of the chromium content is preferably 30%, more preferably 27%. The lower limit of the chromium content is preferably 6%, more preferably 7%. The cobalt content of the molding material M is 3-20% by mass. The lower limit of the cobalt content is preferably 4%, more preferably 4.5%. The upper limit of the cobalt content is preferably 20%, more preferably 19%. The total content of aluminum and titanium (Ti + Al) in the molding material M is 4.5-12% by mass. The lower limit of the total content of aluminum and titanium is preferably 4.5%, and more preferably 4.7%. The upper limit of the total content of aluminum and titanium is preferably 11%, and more preferably 10%. The molding material M may further contain at least one of the following elements: tungsten (W), molybdenum (Mo), tantalum (Ta), niobium (Nb), iron (Fe), hafnium (Hf), zirconium (Zr), vanadium (V), carbon (C), silicon (Si), manganese (Mn), and boron (B).

[0028] An example of such an alloy is shown in Figure 2.

[0029] One example of an alloy is a nickel-based superalloy containing nickel as the base material (i.e., the main component or primary element), which contains 16% (±1%) of chromium by mass, 8.5% (±0.5%) of cobalt by mass, 3.4% (±0.5%) of aluminum by mass, and 3.5% (±0.5%) of titanium by mass. An example of this first alloy is an alloy called "Inconel 738LC". As shown in Figure 2, the alloy referred to as "Inconel 738LC" may contain 61.36% by mass of nickel, 16.00% by mass of chromium, 8.50% by mass of cobalt, 3.40% by mass of aluminum, approximately 3.50% by mass of titanium, 2.70% by mass of tungsten, 1.70% by mass of molybdenum, 1.70% by mass of tantalum, 0.85% by mass of niobium, 0.21% by mass of iron, 0.05% by mass of zirconium, 0.10% by mass of carbon, 0.01% by mass of silicon, 0.10% by mass of manganese, and 0.01% by mass of boron.

[0030] Another example of such alloys is a nickel-based superalloy containing nickel as the base material, which contains 12.3% (±1%) of chromium by mass, 18.2% (±1%) of cobalt by mass, 4.9% (±0.5%) of aluminum by mass, and 4.2% (±0.5%) of titanium by mass. An example of this second alloy is the alloy called "IN100". As shown in Figure 2, the alloy referred to as "IN100" may contain 56.33% by mass of nickel, 12.30% by mass of chromium, 18.20% by mass of cobalt, 4.90% by mass of aluminum, 4.20% by mass of titanium, 3.20% by mass of molybdenum, 0.07% by mass of zirconium, 0.71% by mass of vanadium, 0.07% by mass of carbon, and 0.02% by mass of boron.

[0031] Another example of such alloys is a nickel-based superalloy containing nickel as the base material, which contains 22.10% (±1%) of chromium by mass, 18.8% (±1%) of cobalt by mass, 1.76% (±0.5%) of aluminum by mass, and 3.8% (±0.5%) of titanium by mass. An example of this third alloy is the alloy known as "IN939". As shown in Figure 2, the alloy referred to as "IN939" may contain 48.95% by mass of nickel, 22.10% by mass of chromium, 18.80% by mass of cobalt, 1.76% by mass of aluminum, 3.80% by mass of titanium, 1.96% by mass of tungsten, 1.37% by mass of tantalum, 0.97% by mass of niobium, 0.01% by mass of hafnium, 0.11% by mass of zirconium, 0.16% by mass of carbon, and 0.01% by mass of boron.

[0032] Another example of such alloys is a fourth alloy, which is a nickel-based superalloy containing nickel as a base material, and which contains 19% (±1%) of chromium by mass, 11% (±1%) of cobalt by mass, 3.2% (±0.5%) of aluminum by mass, and 1.5% (±0.5%) of titanium by mass. An example of this fourth alloy is an alloy called "Rene 41". As shown in Figure 2, the alloy referred to as "Rene 41" may contain 50.20% by mass of nickel, 19.00% by mass of chromium, 11.00% by mass of cobalt, 3.20% by mass of aluminum, 1.50% by mass of titanium, 9.50% by mass of molybdenum, 5.00% by mass of iron, 0.50% by mass of silicon, and 0.10% by mass of manganese.

[0033] Another example of such alloys is a nickel-based superalloy containing nickel as the base material, which contains 9% (±1%) of chromium by mass, 10% (±1%) of cobalt by mass, 2.0% (±0.5%) of aluminum by mass, and 5.0% (±0.5%) of titanium by mass. An example of this fifth alloy is an alloy called "MAR-M-200". As shown in Figure 2, the alloy referred to as "MAR-M-200" may contain 60.29% by mass of nickel, 9.00% by mass of chromium, 10.00% by mass of cobalt, 2.00% by mass of aluminum, 5.00% by mass of titanium, 12.50% by mass of tungsten, 1.00% by mass of niobium, 0.05% by mass of zirconium, 0.15% by mass of carbon, and 0.02% by mass of boron.

[0034] Another example of such alloys is a sixth alloy, which is a nickel-based superalloy containing nickel as a base material, and which contains 8.9% (±1%) of chromium by mass, 10.1% (±1%) of cobalt by mass, 1.5% (±0.5%) of aluminum by mass, and 5.8% (±0.5%) of titanium by mass. An example of this sixth alloy is an alloy called "MAR-M-002". As shown in Figure 2, the alloy referred to as "MAR-M-002" may contain 59.54% by mass of nickel, 8.90% by mass of chromium, 10.10% by mass of cobalt, 1.50% by mass of aluminum, 5.80% by mass of titanium, 9.90% by mass of tungsten, 0.10% by mass of molybdenum, 2.50% by mass of tantalum, 1.50% by mass of hafnium, 0.03% by mass of zirconium, and 0.13% by mass of carbon.

[0035] Another example of such alloys is a nickel-based superalloy containing nickel as a base material, which contains 8% (±1%) of chromium by mass, 4.6% (±1%) of cobalt by mass, 1.0% (±0.5%) of aluminum by mass, and 5.6% (±0.5%) of titanium by mass. An example of the seventh alloy is an alloy called "CMSX-2". As shown in Figure 2, the alloy called "CMSX-2" may contain 74.20% by mass of nickel, 8.00% by mass of chromium, 4.60% by mass of cobalt, 1.00% by mass of aluminum, 5.60% by mass of titanium, 0.60% by mass of molybdenum, and 6.00% by mass of tantalum.

[0036] Another example of such alloys is a nickel-based superalloy containing nickel as the base material, which contains 8.1% (±1%) of chromium by mass, 9.2% (±1%) of cobalt by mass, 5.6% (±0.5%) of aluminum by mass, and 0.7% (±0.5%) of titanium by mass. An example of this eighth alloy is an alloy called "CM247LC". As shown in Figure 2, the alloy referred to as "CM247LC" may contain 61.70% by mass of nickel, 8.10% by mass of chromium, 9.20% by mass of cobalt, 5.60% by mass of aluminum, 0.70% by mass of titanium, 9.50% by mass of tungsten, 0.50% by mass of molybdenum, 3.20% by mass of tantalum, 1.40% by mass of hafnium, 0.02% by mass of zirconium, 0.07% by mass of carbon, and 0.02% by mass of boron.

[0037] The molding apparatus 1 is capable of performing additive processing using a desired additive processing method. For example, the molding apparatus 1 may be capable of performing additive processing using laser metal deposition (LMD), which is a first example of an additive processing method. Additive processing using laser metal deposition is an additive processing method in which a molding material M is supplied to the molding surface MS (i.e., the surface of the workpiece W or the surface of the already molded molding layer SL) and the supplied molding material M is melted with a molding light EL to form the molding layer SL. Laser metal deposition (LMD) may also be called directed energy deposition (DED). For example, the molding apparatus 1 may be capable of performing additive processing using powder bed fusion (PBF), which is a second example of an additive processing method. Additive processing using powder bed fusion is an additive processing method in which a material layer, which is a layer of molding material M, is formed on the surface of the workpiece W or on the surface of a molded molding layer SL, and then molding light EL is irradiated onto the molding surface MS, which corresponds to at least a part of the surface of the material layer, to form the molding layer SL. In the following explanation, for the sake of explanation, an example in which the molding apparatus 1 performs additive processing using laser cladding welding will be described.

[0038] When the molding apparatus 1 performs additive processing using the laser cladding method, the workpiece W may be an object containing a material that can be melted by irradiation with molding light EL of a predetermined intensity or higher, similar to the molding material M. The material of the workpiece W may be the same as or different from the molding material M.

[0039] The heat treatment apparatus 2 performs a predetermined heat treatment on the shaped object shaped by the shaping apparatus 1 after the shaping apparatus 1 shapes the shaped object. The predetermined heat treatment may include a process of heating the shaped object shaped by the shaping apparatus 1. The predetermined heat treatment may include a heat treatment for relaxing the residual stress (in other words, internal stress) of the shaped object shaped by the shaping apparatus 1. The predetermined heat treatment may include a heat treatment for improving the mechanical properties (for example, at least one of tensile strength, ductility, and toughness) of the shaped object shaped by the shaping apparatus 1. The predetermined heat treatment may include a heat treatment for homogenizing the crystal structure of the shaped object shaped by the shaping apparatus 1. The predetermined heat treatment may include a heat treatment for enhancing the dimensional accuracy of the shaped object shaped by the shaping apparatus 1.

[0040] The control device 3 controls at least one of the shaping apparatus 1 and the heat treatment apparatus 2. For example, the control device 3 may control the shaping apparatus 1 to shape a shaped object. For example, the control device 3 may control the heat treatment apparatus 2 to perform a heat treatment on the shaped object.

[0041] (1-2) Configuration of the shaping apparatus 1 Next, the configuration of the shaping apparatus 1 of the present embodiment will be described while referring to FIGS. 3 to 4. FIG. 3 is a cross-sectional view schematically showing the configuration of the shaping apparatus 1 of the present embodiment. FIG. 4 is a block diagram showing the configuration of the shaping apparatus 1 of the present embodiment.

[0042] As described above, in the present embodiment, an example in which the shaping apparatus 1 performs additive processing using the laser cladding welding method will be described. For this reason, FIGS. 3 and 4 show an example of the configuration of the shaping apparatus 1 that performs additive processing using the laser cladding welding method.

[0043] As shown in FIGS. 3 to 4, the shaping device 1 includes a material supply source 11, a shaping unit 12, a stage unit 13, a light source 14, a gas supply device 15, a housing 16, and an imaging device 17. At least a part of each of the shaping unit 12, the stage unit 13, and the imaging device 17 is accommodated in a chamber space (in other words, an accommodation space) 163IN inside the housing 16. However, the shaping device 1 may not include at least one of the material supply source 11, the shaping unit 12, the stage unit 13, the light source 14, the gas supply device 15, the housing 16, and the imaging device 17.

[0044] The material supply source 11 supplies the shaping material M to the shaping unit 12. The material supply source 11 supplies a desired amount of the shaping material M corresponding to the required amount so that the amount of the shaping material M required per unit time for shaping an object is supplied to the shaping unit 12. The material supply source 11 may include a storage device (for example, a container such as a tank) for storing the shaping material M.

[0045] The shaping unit 12 processes the shaping material M supplied from the material supply source 11 to shape an object. In order to shape an object, the shaping unit 12 includes a shaping head 121 and a head drive system 122. Further, the shaping head 121 includes an irradiation optical system 1211 and a material nozzle 1212. The shaping head 121 and the head drive system 122 are accommodated in the chamber space 163IN. However, at least a part of the shaping head 121 and the head drive system 122 may be arranged in an external space 164OUT which is a space outside the housing 16. The external space 164OUT may be a space accessible to an operator of the shaping device 1.

[0046] The illumination optical system 1211 is an optical system (optical component) for emitting EL (electroluminescent light) for shaping. Specifically, the illumination optical system 1211 is optically connected to a light source 14 that emits EL for shaping via an optical transmission member 141 which includes at least one of the following: an optical fiber and a light pipe. The illumination optical system 1211 emits EL for shaping that propagates from the light source 14 via the optical transmission member 141. The illumination optical system 1211 irradiates EL for shaping downwards (i.e., towards the -Z side). For this reason, the optical axis AX of the illumination optical system 1211 may be an axis along the Z axis.

[0047] A stage 131 is positioned below the irradiation optical system 1211. When a workpiece W is placed on the stage 131, the irradiation optical system 1211 irradiates the surface of the workpiece W or the molded surface MS (or, in the case of powder bed fusion fusion, the molded surface MS which is the surface of the material layer as described above) with luminescence light (EL). Specifically, the irradiation optical system 1211 can irradiate luminescence light towards a target irradiation area EA set on the molded surface MS as the area where the luminescence light is irradiated (typically focused). In other words, the irradiation optical system 1211 irradiates luminescence light towards the position where the target irradiation area EA is set (i.e., the target irradiation position of the luminescence light). Furthermore, the state of the irradiation optical system 1211 can be switched between a state in which luminescence light is irradiated towards the target irradiation area EA and a state in which luminescence light is not irradiated towards the target irradiation area EA, under the control of the control device 3.

[0048] Furthermore, the irradiation optical system 1211 may include a scanning optical element, which may include at least one of a galvanometer mirror, a polygon mirror, and a resonant mirror, in order to move the irradiation position of the EL (electroluminescent light) on the molding surface MS relative to the irradiation optical system 1211. In this case, a moving target irradiation area EA may be set.

[0049] The material nozzle 1212 supplies the molding material M (for example, by injecting, spraying, ejecting, or blowing). For this reason, the material nozzle 1212 may also be called a material supply member or supply device (material supply device). The material nozzle 1212 is physically connected to a material supply source 11, which is the source of the molding material M, via a supply pipe 111 and a mixing device (in other words, a mixer) 112. The material nozzle 1212 supplies the molding material M supplied from the material supply source 11 via the supply pipe 111 and the mixing device 112. The material nozzle 1212 may also pressurize the molding material M supplied from the material supply source 11 via the supply pipe 111.

[0050] The material nozzle 1212 supplies the molding material M toward the target irradiation area EA, which is irradiated by the molding light EL from the irradiation optical system 1211. For this reason, the material nozzle 1212 and the irradiation optical system 1211 are aligned so that the target supply area MA, which is set on the molding surface MS as the area to which the material nozzle 1212 supplies the molding material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In this case, since the molding material M is supplied to the irradiation position of the molding light EL on the molding surface MS, the molding material M supplied from the material nozzle 1212 is irradiated with the molding light EL emitted by the irradiation optical system 1211. As a result, the molding material M melts. In other words, a molten pool MP containing the molten molding material M is formed on the molding surface MS.

[0051] Furthermore, since a molten pool MP is formed at the irradiation position of the luminous light (EL), the material nozzle 1212 may be considered to be supplying the molten material M to the molten pool MP formed by the luminous light (EL) ejected from the irradiation optical system 1211. Alternatively, for example, the molding apparatus 1 may melt the molten material M from the material nozzle 1212 with the luminous light (EL) before it reaches the molten surface MS, and then adhere the molten material M to the molten surface MS.

[0052] Furthermore, when powder bed fusion is used, as described above, the material nozzle 1212 may supply the molding material M to form a material layer. When powder bed fusion is used, the molding apparatus 1 may be equipped with a material layer forming member (e.g., a recoater) capable of forming a material layer in addition to or instead of the material nozzle 1212.

[0053] The head drive system 122 moves (i.e., moves) the build head 121. For this reason, the head drive system 122 may also be called a moving device. The head drive system 122 moves the build head 121 along, for example, the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction, at least one of these. Since the build head 121 is equipped with an illumination optical system 1211 and a material nozzle 1212, when the head drive system 122 moves the build head 121, the illumination optical system 1211 and the material nozzle 1212 equipped with the build head 121 also move. In this embodiment, the drive system may mean a device equipped with an actuator (in other words, a motor) capable of generating power to move the object being moved.

[0054] When the head drive system 122 moves the build head 121, the relative positional relationship between the build head 121 and the stage 131, the workpiece W placed on the stage 131, and the completed build object on the workpiece W changes in the direction of movement of the build head 121. In other words, the relative positional relationship between the irradiation optical system 1211 and the material nozzle 1212 of the build head 121 and the stage 131, the workpiece W, and the completed build object changes in the direction of movement of the build head 121. For this reason, the head drive system 122 may be considered to function as a position-changing device (drive device) capable of changing the relative positional relationship between the build head 121 (the irradiation optical system 1211 and the material nozzle 1212) and the stage 131, the workpiece W, and the completed build object. Furthermore, when the relative positional relationship between the build head 121 (the irradiation optical system 1211 and the material nozzle 1212, respectively) and the stage 131, workpiece W, and build object changes, the target irradiation position on the build surface MS where the build light EL should be irradiated (i.e., the target irradiation area EA described above) and the target supply position on the build surface MS where the build material M should be supplied (i.e., the target supply area MA described above) move relative to the build surface MS. For this reason, the head drive system 122 may be considered to function as a moving device that moves the target irradiation area EA and the target supply area MA relative to the build surface MS.

[0055] The stage unit 13 comprises a stage 131 and a stage drive system 132.

[0056] A workpiece W is placed on the stage 131. For this reason, the stage 131 may also be called a placement device. The stage 131 is capable of supporting the workpiece W placed on it. The stage 131 may also be capable of holding the workpiece W placed on it.

[0057] The stage drive system 132 moves (i.e., moves) the stage 131. For this reason, the stage drive system 132 may also be called a moving device. The stage drive system 132 moves the stage 131 along, for example, the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction, at least one of these directions. When the stage drive system 132 moves the stage 131, the workpiece W placed on the stage 131 and the printed object formed on the workpiece W also move.

[0058] When the stage drive system 132 moves the stage 131, the relative positional relationship between the build head 121 (the illumination optical system 1211 and the material nozzle 1212, respectively) and the stage 131, the workpiece W placed on the stage 131, and the completed build object on the workpiece W changes in the direction of movement of the stage 131. For this reason, the stage drive system 132 may be considered to function as a position-changing device (drive device) capable of changing the relative positional relationship between the build head 121 (the illumination optical system 1211 and the material nozzle 1212, respectively) and the stage 131, the workpiece W, and the completed build object. Furthermore, when the relative positional relationship between the build head 121 (the irradiation optical system 1211 and the material nozzle 1212, respectively) and the stage 131, the workpiece W, and the built object changes, the target irradiation position on the build surface MS where the build light EL should be irradiated (i.e., the target irradiation area EA described above) and the target supply position on the build surface MS where the build material M should be supplied (i.e., the target supply area MA described above) move relative to the build surface MS. For this reason, the stage drive system 132 may be considered to function as a moving device that moves the target irradiation area EA and the target supply area MA relative to the build surface MS.

[0059] The light source 14 emits, for example, at least one of infrared light, visible light, and ultraviolet light as a luminescent beam (EL) light for shaping. However, other types of light may be used as the luminescent beam. The luminescent beam may include multiple pulsed light (i.e., multiple pulsed beams). The luminescent beam may include continuous wave (CW). The luminescent beam may also be laser light. In this case, the light source 14 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). The laser light source may be a fiber laser, CO2 laser, etc. ２ It may include at least one of the following: a laser, a YAG laser, and an excimer laser. However, the EL light for shaping does not have to be laser light. The light source 14 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0060] The gas supply device 15 is a source of purge gas for purging the chamber space 163IN. The purge gas includes an inert gas. Examples of inert gases include at least one of nitrogen gas and argon gas. The gas supply device 15 is connected to the chamber space 163IN via a supply port 162 formed in the partition wall member 161 of the housing 16 and a supply pipe 151 connecting the gas supply device 15 and the supply port 162. The gas supply device 15 supplies purge gas to the chamber space 163IN via the supply pipe 151 and the supply port 162. As a result, the chamber space 163IN becomes a space purged by the purge gas. The purge gas supplied to the chamber space 163IN may be discharged from an outlet (not shown) formed in the partition wall member 161.

[0061] When the material nozzle 1212 supplies the molding material M together with purge gas, the gas supply device 15 may supply purge gas to the mixing device 112, which is supplied with the molding material M from the material supply source 11, in addition to the chamber space 163IN. Specifically, the gas supply device 15 may be connected to the mixing device 112 via a supply pipe 152 that connects the gas supply device 15 to the mixing device 112. As a result, the gas supply device 15 supplies purge gas to the mixing device 112 via the supply pipe 152. In this case, the molding material M from the material supply source 11 may be supplied (specifically, pressurized) towards the material nozzle 1212 through the supply pipe 111 by the purge gas supplied from the gas supply device 15 via the supply pipe 152. In other words, the gas supply device 15 may be connected to the material nozzle 1212 via the supply pipe 152, the mixing device 112, and the supply pipe 111. In that case, the material nozzle 1212 will supply the molding material M along with a purge gas for pressurizing the molding material M.

[0062] The housing 16 is a housing device that houses at least a portion of each of the molding unit 12 and the stage unit 13 in the chamber space 163IN, which is the internal space of the housing 16. The housing 16 includes a partition member 161 that defines the chamber space 163IN. The partition member 161 is a member that separates the chamber space 163IN from the external space 164OUT of the housing 16. The partition member 161 faces the chamber space 163IN via its inner wall surface 1611 and faces the external space 164OUT via its outer wall surface 1612. In this case, the space enclosed by the partition member 161 (more specifically, the space enclosed by the inner wall surface 1611 of the partition member 161) becomes the chamber space 163IN.

[0063] The imaging device 17 is a camera capable of capturing images of an object to be imaged. The imaging device 17 may be attached to the build head 121. However, the imaging device 17 does not have to be attached to the build head 121.

[0064] In this embodiment, an example is described in which the imaging device 17 images the molding surface MS, which is an example of an object to be imaged. In this case, the imaging device 17 may image the molding surface MS. In particular, by imaging the molding surface MS, the imaging device 17 may also image the molten pool MP formed on the molding surface MS.

[0065] (1-3) Configuration of the heat treatment apparatus 2 Next, the configuration of the heat treatment apparatus 2 of this embodiment will be described with reference to Figure 5. Figure 5 is a block diagram showing the configuration of the heat treatment apparatus 2 of this embodiment.

[0066] As shown in Figure 5, the heat treatment apparatus 2 comprises a chamber 21 and a heating device 22.

[0067] Chamber 21 is a housing with a chamber space (in other words, a storage space) formed inside on which the object created by the molding apparatus 1 is placed. After the molding apparatus 1 has created the object, an operator of a transport device or molding system SYS capable of transporting the object may remove the object from the chamber space 163IN of the molding apparatus 1 and then place the removed object into the chamber space of the heat treatment apparatus 2.

[0068] The heating device 22 is a device capable of heating the molded object placed in the chamber space of the chamber 21. The heating device 22 is a device capable of performing heat treatment on the molded object by heating the molded object placed in the chamber space of the chamber 21. The heating device 22 may have any configuration as long as it is capable of heating the molded object. For example, the heating device 22 may be equipped with a heater.

[0069] (1-4) Configuration of the control device 3 Next, the configuration of the control device 3 of this embodiment will be described with reference to Figure 6. Figure 6 is a block diagram showing the configuration of the control device 3 of this embodiment.

[0070] As shown in Figure 6, the control device 3 comprises an arithmetic unit 31 and a storage device 32. Furthermore, the control device 3 may also comprise a communication device 33, an input device 34, and an output device 35. However, the control device 3 does not have to comprise at least one of the communication device 33, the input device 34, and the output device 35. The arithmetic unit 31, the storage device 32, the communication device 33, the input device 34, and the output device 35 may be connected via a data bus 36.

[0071] The arithmetic unit 31 is hardware that includes at least one circuit (for example, at least one of an electronic circuit and an electrical circuit). For this reason, the arithmetic unit 31 may be referred to as a circuit group. The arithmetic unit 31 may be referred to as a control circuit. The control device 3, which includes the arithmetic unit 31, may be referred to as a control circuit.

[0072] The arithmetic unit 31 includes at least one processor (i.e., one or more processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may also include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). The processor may be implemented by a group of circuits (e.g., at least one of an electronic circuit and an electrical circuit).

[0073] The arithmetic unit 31 reads a computer program 321 which includes at least one computer program code and a computer program instruction. The arithmetic unit 31 executes the read computer program 321. As a result, logical functional blocks for executing the processing that the control device 3 should perform (for example, processing and control methods for controlling the operation of the molding device 1) are realized within the arithmetic unit 31.

[0074] The arithmetic unit 31 may include a single processor. In this case, the arithmetic unit 31 may use a single processor to perform the following operations (for example, processing to control the operation of the SYS molding system). For example, if the arithmetic unit 31 performs a first operation (for example, a first process to control the operation of the SYS molding system) and a second operation (for example, a second process to control the operation of the SYS molding system), the arithmetic unit 31 may use a single processor to perform both the first and second operations. Alternatively, the arithmetic unit 31 may include multiple processors. In this case, the arithmetic unit 31 may use any one of the multiple processors to perform each of the following operations. For example, if the arithmetic unit 31 includes a first and a second processor and performs the first and second operations, the arithmetic unit 31 may use any one of the first and second processors to perform the first and second operations, respectively. For example, the arithmetic unit 31 may perform a first operation using the first processor, or a second operation using the first processor, or a first operation using the second processor, or a second operation using the second processor.

[0075] The arithmetic unit 31 may implement a computational model that can be constructed by machine learning by executing a computer program 321. An example of a computational model that can be constructed by machine learning is a computational model that includes a neural network (so-called artificial intelligence (AI)). The recording medium for recording the computer program 321 executed by the arithmetic unit 31 may be at least one of the following: optical discs such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark); magnetic media such as magnetic tape; magneto-optical discs; semiconductor memory such as USB memory; and any other medium capable of storing a program.

[0076] The storage device 32 includes at least one memory capable of storing desired data. In other words, the storage device 32 includes at least one memory containing desired data. The memory may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit).

[0077] The communication device 33 can communicate with devices outside the control device 3 (for example, at least one of the molding device 1 and the heat treatment device 2) via a communication network (not shown).

[0078] The input device 34 is a device that receives information input to the control device 3 from outside the control device 3. For example, the input device 34 may include an operating device that can be operated by the user of the control device 3 (for example, at least one of a keyboard, mouse, and touch panel). For example, the input device 34 may include a recording medium reader that can read information recorded as data on a recording medium that can be attached externally to the control device 3.

[0079] Furthermore, information can be input as data to the control device 3 from an external device via the communication device 33. In this case, the communication device 33 may function as an input device that receives information input to the control device 3 from an external source.

[0080] The output device 35 is a device that outputs information to the outside of the control device 3. For example, the output device 35 may output information as an image. That is, the output device 35 may include a display device (so-called display) capable of displaying images. For example, the output device 35 may output information as sound. That is, the output device 35 may include an audio device (so-called speaker) capable of outputting sound. For example, the output device 35 may output information onto paper. That is, the output device 35 may include a printing device (so-called printer) capable of printing desired information onto paper. For example, the output device 35 may output information as data to a recording medium that can be attached externally to the control device 3.

[0081] Furthermore, the control device 3 can output information as data to an external device via the communication device 33. In this case, the communication device 33 may function as an output device that outputs information to an external device of the control device 3.

[0082] (2) Molding operations performed by the SYS molding system Next, with reference to Figure 7, the molding operations performed by the SYS molding system of this embodiment (that is, the operations of forming an object by performing additional processing on the workpiece W) will be described. Figure 7 is a flowchart showing the flow of the molding operations performed by the SYS molding system of this embodiment.

[0083] As shown in Figure 7, first, the molding device 1 of the molding system SYS fabricates an object under the control of the control device 3 (step S1). As described above, the molding device 1 fabricates an object by performing additional processing based on the laser cladding welding method. For this reason, the molding device 1 may fabricate an object by performing additional processing in accordance with the laser cladding welding method. Specifically, the molding device 1 may fabricate an object containing multiple molded layers SL by repeatedly performing the operation of fabricating a molded layer SL by performing additional processing in accordance with the laser cladding welding method.

[0084] Here, the operation of creating each build layer SL will be explained with reference to Figures 8A to 8E. Under the control of the control device 3, the build apparatus 1 moves at least one of the build head 121 and the stage 131 so that the target irradiation area EA is set in a desired area on the build surface MS corresponding to the surface of the workpiece W or the surface of the already built build layer SL. Then, the build apparatus 1 irradiates the target irradiation area EA with build light EL from the irradiation optical system 1211. As a result, as shown in Figure 8A, a molten pool (i.e., a pool of metal, etc., molten by the build light EL) MP is created on the build surface MS. Furthermore, under the control of the control device 3, the build apparatus 1 supplies build material M from the material nozzle 1212. As a result, as shown in Figure 8B, the build material M is supplied to the molten pool MP. The build material M supplied (put into) the molten pool MP is melted by the build light EL irradiating the molten pool MP. Alternatively, the molding material M supplied from the material nozzle 1212 may be melted by the molding light EL before reaching the molten pool MP, and the molten molding material M may be supplied to the molten pool MP. Subsequently, as the molding head 121 and the stage 131 move, the molding light EL is no longer irradiated onto the molten pool MP, and the molding material M that has melted in the molten pool MP cools and solidifies (i.e., solidifies). As a result, as shown in Figure 8C, the solidified molding material M is deposited on the molding surface MS.

[0085] The molding apparatus 1 repeats a series of molding processes, including molding a molten pool MP by irradiation with molding light EL, supplying molding material M to the molten pool MP, melting the supplied molding material M, and solidifying the molten molding material M, while controlling at least one of the head drive system 122 and the stage drive system 132 so that the target irradiation area EA moves on the molding surface MS (i.e., the target irradiation area EA moves along at least one of the X-axis and Y-axis directions), as shown in Figure 8D. During the period when the target irradiation area EA is moving, the molding apparatus 1 irradiates the molding light EL to the area on the molding surface MS where it wants to mold an object, while not irradiating the area on the molding surface MS where it does not want to mold an object. As a result, the molten pool MP also moves on the molding surface MS along a movement trajectory corresponding to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is sequentially formed on the build surface MS in the areas along the movement trajectory of the target irradiation area EA that are irradiated by the build light EL. As a result, as shown in Figure 8E, a build layer SL, which corresponds to an aggregate of objects made of the build material M that has solidified after melting, is formed on the build surface MS.

[0086] The molding device 1 repeatedly performs the operation to create such a molding layer SL under the control of the control device 3. Specifically, as shown in Figure 9A, the control device 3 controls the molding device 1 to create the first molding layer SL#1 on a molding surface MS corresponding to at least a part of the surface of the workpiece W. Subsequently, the molding device 1 sets at least a part of the surface (i.e., the top surface) of the molding layer SL#1 as a new molding surface MS, and then creates the second molding layer SL#2 on this new molding surface MS. In this case, before performing the molding operation shown in Figures 8A to 8E, the control device 3 controls at least one of the head drive system 122 and the stage drive system 132 so that the molding head 121 moves relative to the stage 131 along the Z axis. Specifically, the control device 3 controls at least one of the head drive system 122 and the stage drive system 132 to move the build head 121 toward the +Z side and / or the stage 131 toward the -Z side so that the target irradiation area EA is set on the surface of the build layer SL#1 (i.e., the new build surface MS). In this case, the amount of relative movement of the build head 121 with respect to the stage 131 may be an amount of movement corresponding to the thickness (height) of the build layer SL. Subsequently, the control device 3 controls the build apparatus 1 to build the build layer SL#2. As a result, as shown in Figure 9B, the build layer SL#2 is built. Thereafter, the same operation is repeated until all the build layers SL that constitute the object to be built on the workpiece W are built. As a result, as shown in Figure 9C, the object is built by a laminated structure in which multiple build layers SL are stacked.

[0087] In Figure 7, the heat treatment apparatus 2 then performs a predetermined heat treatment on the object created by the molding apparatus 1 in step S1 under the control of the control device 3 (step S2). As a result, the molding operation is completed. In other words, the heat-treated object is then manufactured by the molding system SYS as the final object created by the molding operation.

[0088] (3) Prevention of crack occurrence during the molding process In step S1 of Figure 7 described above, during the molding process in which the molding apparatus 1 molds an object, there is a possibility that cracks (i.e., fissures or cracks) may occur in the object molded by the molding apparatus 1 (for example, the completed object or the object in the process of being molded). In this embodiment, the molding apparatus 1 may mold the object under the control of the control device 3 in a manner that reduces the possibility of cracks occurring in the object during the molding process. In other words, the molding apparatus 1 may mold the object in a manner that prevents cracks from occurring in the object during the molding process. The following describes the operation to prevent cracks from occurring in the object during the molding process.

[0089] (3-1) Technical reasons why cracks occur in the fabricated object during the fabrication period First, as a prerequisite for the operation to prevent cracks from occurring in the fabricated object during the fabrication period, the technical reasons why cracks occur in the fabricated object during the fabrication period will be explained with reference to Figure 10. Figure 10 is a cross-sectional view showing the fabrication surface MS on which the molten pool MP was formed by the fabrication light EL during the fabrication period, and the fabrication surface MS on which the fabricated object BO was formed as the molten pool MP solidified.

[0090] As shown in the upper part of Figure 10, during the printing process, the printing surface MS is irradiated with printing light EL, causing a portion of the already printed printing layer SL on which the printing surface MS is set to melt. As a result, a molten pool MP is formed on the printing surface MS, as shown in the upper part of Figure 10. Furthermore, the printing material M is supplied to the molten pool MP. Consequently, a molten pool MP is formed on the printing surface MS, rising from the printing surface MS. As this molten pool MP cools and solidifies, a new object BO (i.e., an object BO rising from the printing surface MS) is printed on the printing surface MS, as shown in the lower part of Figure 10.

[0091] Here, as shown in the upper part of Figure 10, during the period when the build surface MS is irradiated with build light EL, a heat-affected zone (HAZ) is formed in the build layer SL on which the build surface MS is set, where the energy of the build light EL (especially thermal energy) is transferred, even though it does not melt due to the build light EL. For example, as shown in the upper part of Figure 10, a heat-affected zone HAZ is formed around the molten pool MP. For example, as shown in the upper part of Figure 10, a heat-affected zone HAZ is formed that at least partially surrounds the molten pool MP.

[0092] The heat-affected zone (HAZ) may refer to the region where the temperature of the build surface MS falls within a predetermined temperature range during the period when the build light EL is irradiated onto the build surface MS. For example, Figure 11 is a phase diagram showing the relationship between the temperature of the build material M and the phase of the build material M. Since the build layer SL, on which the build surface MS is set, is formed from the build material M, Figure 11 can be said to show the relationship between the temperature of the build layer SL and the phase of the build layer SL.

[0093] As shown in Figure 11, when the temperature of the molding material M is below a predetermined final phase change temperature, the phase of the molding material M is solid. Furthermore, the phase fraction of the γ phase and the γ' phase (γ prime phase) within the molding material M hardly changes. Note that when the molding material M is composed of the alloy called "Inconel 738LC" mentioned above, the final phase change temperature is approximately 851°C. On the other hand, when the temperature of the molding material M exceeds the predetermined final phase change temperature, the phase of the molding material M remains solid, while the phase fraction of the γ phase and the γ' phase within the molding material M changes in accordance with the change in temperature of the molding material M. Specifically, the higher the temperature of the molding material M, the larger the proportion of the γ phase within the molding material M becomes. Furthermore, when the temperature of the molding material M exceeds a predetermined solidus temperature, a portion of the molding material M melts. That is, a portion of the phase of the molding material M becomes liquid, while the remaining portion of the phase of the molding material M becomes solid. Furthermore, if the molding material M is composed of the alloy referred to as "Inconel 738LC" as described above, the solidus temperature is approximately 1150°C. When the temperature of the molding material M exceeds the solidus temperature, the phase fraction of solid and liquid phases within the molding material M changes in accordance with the change in temperature. Specifically, the higher the temperature of the molding material M, the larger the proportion of liquid phase within the molding material M becomes. Furthermore, when the temperature of the molding material M exceeds a predetermined liquidus temperature, the entire molding material M melts. In other words, the phase of the molding material M becomes the liquid phase. If the molding material M is composed of the alloy referred to as "Inconel 738LC" as described above, the liquidus temperature is approximately 1372°C. In this case, the heat-affected zone (HAZ) may refer to the temperature range where the temperature is above the final phase change temperature and below the solidus temperature. In other words, the thermal-affected zone (HAZ) may refer to a portion of the build layer SL being irradiated with the build light (EL) that falls within a temperature range where the temperature during the period of EL irradiation is above the final phase change temperature and below the solidus temperature.

[0094] In Figure 10 again, the heat-affected zone (HAZ) is one of the causes of crack formation in the fabricated object during the fabrication process. Below is an example of the technical reasons for this. The heat-affected zone (HAZ) is rapidly heated by irradiation with the EL (electroluminescent light) and then cooled. As a result, residual stress tends to concentrate in the heat-affected zone (HAZ). If this residual stress exceeds the allowable stress of the fabricated layer SL (SL), cracks may occur, as shown in the lower part of Figure 10. In addition, heating and cooling of the heat-affected zone (HAZ) can cause changes in the properties of the HAZ (e.g., at least one of physical and chemical properties). In particular, the crystal structure of the HAZ may become brittle. As a result, cracks may occur in the HAZ with altered properties (e.g., a brittle crystal structure), as shown in the lower part of Figure 10. Furthermore, cracks that originate in the heat-affected zone (HAZ) can grow, potentially extending to areas outside the HAZ (for example, the fabricated object BO formed by the solidification of the molten pool MP), as shown in the lower part of Figure 10.

[0095] (3-2) Actions to prevent crack formation during the molding process The larger the size of the heat-affected zone (HAZ), the higher the probability that minute cracks that could develop into larger cracks will grow within the HAZ. Considering that minute cracks can grow into larger cracks, the larger the size of the HAZ, the higher the probability that cracks will occur in the molded object during the molding process. Conversely, it is expected that the smaller the size of the HAZ, the lower the probability that cracks will occur in the molded object during the molding process.

[0096] In this embodiment, the size of the heat-affected zone (HAZ) may mean the thickness of the heat-affected zone (HAZ). The thickness of the heat-affected zone (HAZ) may mean the thickness of the heat-affected zone (HAZ) in the radial direction centered on the molten pool MP. Alternatively, the size of the heat-affected zone (HAZ) may mean the volume of the heat-affected zone (HAZ), in addition to or instead of the thickness of the heat-affected zone (HAZ).

[0097] Therefore, in this embodiment, the molding apparatus 1 may prevent cracks from occurring in the molded object during the molding period by appropriately controlling (in other words, adjusting) the size of the heat-affected zone (HAZ) during the molding period. For example, the molding apparatus 1 may prevent cracks from occurring in the molded object during the molding period by controlling the size of the heat-affected zone (HAZ) so that the size of the HAZ does not become excessively large during the molding period. For example, the molding apparatus 1 may prevent cracks from occurring in the molded object during the molding period by controlling the size of the heat-affected zone (HAZ) so that the size of the HAZ does not become excessively large enough to cause cracks. For example, the molding apparatus 1 may prevent cracks from occurring in the molded object during the molding period by controlling the size of the heat-affected zone (HAZ) so that the size of the HAZ does not become larger than a predetermined upper limit during the molding period. For example, the molding apparatus 1 may prevent cracks from occurring in the molded object during the molding period by controlling the size of the heat-affected zone (HAZ) so that the size of the HAZ is less than or equal to a predetermined upper limit size that satisfies the condition of not causing cracks.

[0098] As a result, when the size of the heat-affected zone (HAZ) is controlled, the likelihood of the HAZ becoming excessively large enough to cause cracks is reduced compared to when the size of the HAZ is not controlled. Therefore, the molding apparatus 1 can reduce the possibility of cracks occurring in the molded object during the molding process. In other words, the molding apparatus 1 can reduce the possibility of cracks occurring in the molded object during the molding process.

[0099] The following provides further explanation on how controlling the size of the heat-affected zone (HAZ) prevents cracks from forming in the printed object during the printing process.

[0100] (3-2-1) Controlling the size of the thermally affected region (HAZ) by adjusting the output of the EL photovoltaic light The size of the thermally affected region (HAZ) increases as the output of the light source 14 that generates the EL photovoltaic light increases. In other words, the size of the thermally affected region (HAZ) decreases as the output of the light source 14 that generates the EL photovoltaic light decreases. In other words, the size of the thermally affected region (HAZ) increases as the output (in other words, intensity) of the EL photovoltaic light output by the light source 14 increases. In other words, the size of the thermally affected region (HAZ) decreases as the output (in other words, power or intensity) of the EL photovoltaic light output by the light source 14 decreases. This is because as the output of the light source 14 (i.e., the output of the EL photovoltaic light output by the light source 14) decreases, the amount of energy transferred from the EL photovoltaic light to the printed surface MS decreases, and as a result, the thermally affected region (HAZ), which is the region where the energy of the EL photovoltaic light is transferred, also decreases. Furthermore, the output of the EL light used for shaping may be not only the magnitude of the output from the light source 14, but also the output of the EL light used for shaping from the irradiation optical system 1211 toward the workpiece W.

[0101] Therefore, the molding apparatus 1 may control the size of the heat-affected zone (HAZ) by adjusting the output of the EL (electroluminescent light) under the control of the control device 3. In other words, the control device 3 may control the molding apparatus 1 so as to control the size of the heat-affected zone (HAZ) by adjusting the output of the EL.

[0102] For example, the molding apparatus 1 may control the size of the heat-affected zone (HAZ) so that it does not become excessively large enough to cause cracks by adjusting the output of the EL (electroluminescent beam) within a range below a predetermined upper output threshold. In this case, the upper output threshold may be set to a desired value that can distinguish between the output of the EL that forms a heat-affected zone (HAZ) that is large enough to cause cracks and the output of the EL that forms a heat-affected zone (HAZ) that is not large enough to cause cracks. Such an upper output threshold may be generated using the results of an experiment in which the EL is actually irradiated onto a test sample (or an actual workpiece W or actual build layer SL, hereinafter the same) with the same characteristics as the workpiece W or build layer SL using the molding apparatus 1 to create a molded object (or, without creating a molded object, the size of the heat-affected zone (HAZ) formed by irradiation with the EL is measured, hereinafter the same), while changing the output of the EL. Alternatively, the upper limit output threshold may be generated, in addition to or instead of experimentation, using the results of a simulation in which the operation of irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 is virtually repeated while changing the output of the build light EL.

[0103] As a result, when the output of the EL (electroluminescent beam) for printing is adjusted to a range below the upper output threshold, the likelihood of the HAZ (heat-affected zone) becoming excessively large enough to cause cracks is reduced compared to when the output of the EL for printing is adjusted to a range above the upper output threshold. Therefore, the printing apparatus 1 can reduce the possibility of cracks occurring in the printed object during the printing process. In other words, the printing apparatus 1 can reduce the possibility of cracks occurring in the printed object during the printing process.

[0104] (3-2-2) Controlling the size of the thermal-affected zone (HAZ) by adjusting the scanning speed of the EL printing light As described above, in order to print the build layer SL, the build apparatus 1 irradiates the build surface MS with the EL printing light while moving the target irradiation area EA on the build surface MS. In other words, in order to print the build layer SL, the build apparatus 1 irradiates the build surface MS with the EL printing light while moving the EL printing light relative to the build surface MS in a direction intersecting the direction of travel of the EL printing light (for example, a direction intersecting the Z axis).

[0105] Here, the slower the relative movement speed of the EL (electroluminescent beam) relative to the build surface MS in a direction intersecting the direction of the EL's movement (i.e., the movement speed of the target irradiation area EA on the build surface MS, the same applies hereafter), the longer the time that a certain part of the build surface MS is irradiated by the EL. As a result, the amount of energy transferred from the EL per unit time to a certain part of the build surface MS increases. Consequently, the thermally affected region (HAZ), which is the region where the energy of the EL is transferred, also increases. Therefore, the slower the relative movement speed of the EL relative to the build surface MS, the larger the size of the thermally affected region (HAZ). In other words, the faster the relative movement speed of the EL relative to the build surface MS, the smaller the size of the thermally affected region (HAZ).

[0106] Therefore, the molding apparatus 1 may control the size of the heat-affected zone (HAZ) by adjusting the movement speed of the EL (electroluminescent beam) under the control of the control device 3. In other words, the control device 3 may control the molding apparatus 1 so as to control the size of the heat-affected zone (HAZ) by adjusting the movement speed of the EL (electroluminescent beam).

[0107] For the purposes of the following explanation, the relative movement speed of the EL light source with respect to the build surface MS will be referred to as the "scanning speed (scanning speed of the EL light source)". When the build device 1 moves the build head 121 without moving the stage 131, thereby moving the target illumination area EA over the build surface MS (i.e., moving the EL light source relative to the build surface MS, the same applies hereinafter), the scanning speed may be equivalent to the movement speed of the build head 121. When the build device 1 moves the stage 131 without moving the build head 121, thereby moving the target illumination area EA over the build surface MS, the scanning speed may be equivalent to the movement speed of the stage 131. When the build device 1 moves the build head 121 and the stage 131 to move the target illumination area EA on the build surface MS, the scanning speed may be equivalent to the relative movement speed of the other of the build head 121 and the stage 131 with respect to either the build head 121 or the stage 131. When the build device 1 moves the target illumination area EA on the build object by driving a scanning optical member such as a galvanometer mirror provided in the build head 121 to move the build light EL without moving the build head 121 and the stage 131, the scanning speed may be equivalent to the movement speed of the build light EL by the scanning optical member. Furthermore, when the target illumination area EA of the build light EL is also moved using the scanning optical member, and the stage 131 moves relative to the build head 121, the scanning speed becomes the relative speed with respect to the relative movement speed of the other of the build light EL and the stage 131 with respect to either the build light EL or the stage 131.

[0108] The target value or adjustment range for the scanning speed may be generated using the results of an experiment in which the process of actually irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to create a printed object, is repeated while changing the scanning speed of the build light EL. Alternatively, the target value or adjustment range for the scanning speed may be generated using the results of a simulation in which the process of virtually irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to create a printed object, is repeated while changing the scanning speed of the build light EL, in addition to or instead of the experiment.

[0109] (3-2-3) Controlling the size of the thermal affected area HAZ by adjusting the size of the beam spot BS of the luminescent beam The luminescent beam irradiated onto the build surface MS forms a beam spot BS on the build surface MS. The beam spot BS may mean the region where the portion of the luminescent beam irradiated onto the build surface MS that has an intensity of a predetermined level or higher is irradiated. In particular, the beam spot BS may mean a circular region where the portion of the luminescent beam irradiated onto the build surface MS that has an intensity of a predetermined level or higher is irradiated. For example, the beam spot BS may mean a circular region (a region corresponding to the so-called full width at half maximum) where the portion of the luminescent beam irradiated onto the build surface MS that has an intensity of 1 / 2 times or more the peak intensity of the luminescent beam irradiated onto the build surface MS is irradiated. For example, the beam spot BS may mean 1 / e of the peak intensity of the luminescent beam irradiated onto the build surface MS ２ It may also mean a circular area illuminated by a light portion having more than twice the intensity. Alternatively, when the imaging device 17 described above images the fabrication surface MS (especially the molten pool MP), the size of the molten pool MP captured in the image generated by the imaging device 17 imaging the molten pool MP may be used as the beam spot BS.

[0110] Here, assuming that the output of the EL (electroluminescent beam) is constant, the larger the size of the EL beam spot BS, the larger the area on the build surface MS to which energy is transferred from the EL. Note that the size of the beam spot BS may also refer to the diameter of the beam spot BS. As a result, the thermal-affected zone (HAZ), which is the area to which energy from the EL is transferred, also increases. Therefore, the larger the size of the EL beam spot BS, the larger the size of the thermal-affected zone (HAZ). In other words, the smaller the size of the EL beam spot BS, the smaller the size of the thermal-affected zone (HAZ).

[0111] Therefore, the molding apparatus 1 may control the size of the thermally affected region (HAZ) by adjusting the size of the beam spot BS of the luminescent light (EL) under the control of the control device 3. In other words, the control device 3 may control the molding apparatus 1 so as to control the size of the thermally affected region (HAZ) by adjusting the size of the beam spot BS of the luminescent light (EL).

[0112] For example, the 3D printer 1 may control the size of the thermally affected region (HAZ) by adjusting the size of the beam spot BS of the 3D light (EL) within a range below a predetermined upper spot threshold, so that the HAZ does not become excessively large enough to cause cracks. In this case, the upper spot threshold may be set to a desired value that can distinguish between the size of the beam spot BS of the 3D light (EL) that forms a thermally affected region (HAZ) that is large enough to cause cracks, and the size of the beam spot BS of the 3D light (EL) that forms a thermally affected region (HAZ) that is not large enough to cause cracks. Such an upper spot threshold may be generated using the results of experiments in which the 3D printer 1 is used to actually irradiate a test sample having the same characteristics as the workpiece W or the 3D layer SL with the EL and fabricate an object, while repeatedly changing the size of the beam spot BS of the 3D light (EL). Alternatively, the upper spot threshold may be generated, in addition to or instead of experimentation, using the results of a simulation in which the process of irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to build an object is virtually repeated while changing the size of the beam spot BS of the build light EL.

[0113] As a result, when the size of the beam spot BS of the EL printing device is adjusted to be below the upper spot threshold, the likelihood of the heat-affected zone (HAZ) becoming excessively large enough to cause cracks is reduced compared to when the size of the beam spot BS of the EL printing device is adjusted to be above the upper spot threshold. Therefore, the printing device 1 can reduce the possibility of cracks occurring in the printed object during the printing process. In other words, the printing device 1 can reduce the possibility of cracks occurring in the printed object during the printing process.

[0114] (3-2-4) Control of the size of the heat affected zone HAZ by adjusting the energy density E of the shaping light EL (3-2-4-1) Adjustment of the energy density E of the shaping light EL The size of the heat affected zone HAZ increases as the energy density E of the shaping light EL increases. That is, the size of the heat affected zone HAZ decreases as the energy density E of the shaping light EL decreases. This is because as the energy density E of the shaping light EL decreases, the amount of energy transmitted from the shaping light EL to the shaping surface MS decreases, and as a result, the heat affected zone HAZ, which is the region where the energy of the shaping light EL is transmitted, also decreases.

[0115] Therefore, the shaping apparatus 1 may control the size of the heat affected zone HAZ by adjusting the energy density E of the shaping light EL under the control of the control apparatus 3. In other words, the control apparatus 3 may control the shaping apparatus 1 so as to control the size of the heat affected zone HAZ by adjusting the energy density E of the shaping light EL.

[0116] Similar to the general definition, the energy density E of the shaping light EL may mean the amount of energy of the shaping light EL per unit area within a plane intersecting the traveling direction of the shaping light EL (for example, a plane intersecting the Z axis, and as an example, the shaping surface MS). In this case, the energy density E of the shaping light EL may be regarded as equivalent to the fluence of the shaping light EL. When calculating the preferable shaping conditions using (J / m ２ ) as the unit of fluence, it is calculated by conversion from the energy density (J / mm ２ ) shown below.

[0117] In particular, in this embodiment, an example in which the energy density E of the shaping light EL is a parameter that can be calculated based on the output of the shaping light EL, the scanning speed of the shaping light EL with respect to the shaped object, and the size of the beam spot BS of the shaping light EL will be described. Specifically, in this embodiment, the energy density E (unit: J / mm ２An example in which the method shown by ( ) is used will be described. In this case, the molding apparatus 1 may adjust the energy density E of the molding light EL by adjusting at least one of the output of the molding light EL, the scanning speed of the molding light EL, and the size of the beam spot BS of the molding light EL. For example, the molding apparatus 1 may adjust at least one of the output of the molding light EL, the scanning speed of the molding light EL with respect to the molded object, and the size of the beam spot BS of the molding light EL so that the energy density E of the molding light EL is less than or equal to a predetermined first upper limit density threshold. In this case, adjusting at least one of the output of the molding light EL, the relative speed of the molding light EL with respect to the molded object, and the size of the beam spot BS of the molding light EL may be considered equivalent to adjusting the energy density E of the molding light EL.

[0118] For example, if the unit of output of the lithography EL is "W (watts)", the unit of scanning speed of the lithography EL is "mm / s (speed in millimeters per second)", and the unit of size of the beam spot BS of the lithography EL is "mm (millimeters)", then the lithography apparatus 1 sets the energy density E of the lithography EL to "70 (J / mm)", which is an example of a predetermined first upper limit density threshold. ２ The size of the heat-affected zone (HAZ) can be controlled by adjusting it within the range below ) to prevent the HAZ from becoming excessively large enough to cause cracks. In the following explanation, energy density E refers to the energy density E calculated from the above formula when the unit of output of the EL printer is "W (watts)", the unit of scanning speed of the EL printer is "mm / m (speed in millimeters per minute)", and the unit of size of the beam spot BS of the EL printer is "mm (millimeters)". At least one experiment and simulation conducted by the inventors of this application confirmed that when the energy density E is adjusted to be 70 or less, the possibility of the HAZ becoming excessively large enough to cause cracks is lower compared to when the energy density E is adjusted to be greater than 70.

[0119] Specifically, Figure 12 is a graph showing the relationship between the output of the EL printer, the scanning speed of the EL printer, and the energy density E of the EL printer when the size of the beam spot BS of the EL printer is 0.5 mm (i.e., 500 μm). As shown in Figure 12, the molding apparatus 1 may control the size of the thermally affected region (HAZ) so that the HAZ does not become excessively large to the extent that cracks occur, by adjusting the energy density E of the EL printer within a range of 70 or less, which is an example of a predetermined first upper limit density threshold. In other words, the molding apparatus 1 may control the size of the thermally affected region (HAZ) so that the HAZ does not become excessively large to the extent that cracks occur, by adjusting the energy density E of the EL printer within the "range in which the energy density E is 70 or less," which is shown as a hatched area in Figure 12. As a result of experiments conducted by the inventors of the present invention to fabricate an object under the conditions that the size of the beam spot BS of the EL printing light is 0.5 mm and the energy density E is 70 or less (furthermore, the amount of printing material M supplied from the material nozzle 1212 is 4 g / m and the thickness of the printing layer SL is 0.15 mm), the fabrication device 1 can fabricate an object without cracks, as shown in Figure 13, which shows a cross-section of the object actually fabricated by the fabrication device 1 in the experiment.

[0120] Figure 13 shows the cross-section of an object actually fabricated by the 3D printer 1 when (i) the output of the 3D printer EL is set to 100W, the scanning speed of the 3D printer EL is set to 5mm / s, 10mm / s, and 15mm / s, and as a result the energy density E of the 3D printer EL is set to approximately 40, approximately 20, and approximately 13, respectively, and (ii) the cross-section of an object actually fabricated by the 3D printer 1 when the output of the 3D printer EL is set to 120W, the scanning speed of the 3D printer EL is set to 5mm / s, 10mm / s, and 15mm / s, and as a result the energy density E of the 3D printer EL is set to approximately 49, approximately 24, and approximately 16, respectively. The cross-sections are shown, and (iii) the cross-sections of the objects actually printed by the printing device 1 when the output of the EL printing light was set to 160W, the scanning speed of the EL printing light was set to 5mm / s, 10mm / s, and 15mm / s, resulting in the energy density E of the EL printing light being set to approximately 64, 32, and 21, respectively, and (iv) the cross-sections of the objects actually printed by the printing device 1 when the output of the EL printing light was set to 200W, the scanning speed of the EL printing light was set to 10mm / s and 15mm / s, resulting in the energy density E of the EL printing light being set to approximately 40 and 27, respectively. As shown in Figure 13, it can be seen that no cracks occurred in any of the printed objects.

[0121] Thus, when the energy density E is adjusted to be 70 or less, the molding apparatus 1 can reduce the possibility of cracks occurring in the molded object during the molding period, compared to when the energy density E is adjusted to be greater than 70. In other words, when the energy density E is adjusted to be 70 or less, the molding apparatus 1 can reduce the possibility of cracks occurring in the molded object during the molding period, compared to when the energy density E is adjusted to be greater than 70.

[0122] Prior to the experiments conducted by the present inventor, the inventor virtually calculated (in this case, estimated) the size of the heat-affected zone (HAZ) by performing a simulation in which the molding apparatus 1 fabricates an object under conditions where the energy density E is 70 or less. In this simulation as well, it was confirmed that by adjusting the energy density E to a range of 70 or less, the size of the heat-affected zone (HAZ) does not become excessively large to the extent that cracks occur.

[0123] (3-2-4-2) Adjustment of the output of the EL printer in conjunction with the adjustment of the energy density E of the EL printer The output of the EL printer is not particularly limited, as long as the energy density E is adjusted to be below the predetermined first upper limit density threshold (for example, 70 or less) described above. Specifically, the output of the EL printer may be 2 kW or less, 1 kW or less, 500 W or less, 300 W or less, or 100 W. The output of the EL printer may be 50 W or more, or 100 W or more. The output of the EL printer may be 50 W or more and 300 W or less, or 100 W or more and 200 W or less. When the output of the EL printer is large, such as 2 kW or 1 kW, the energy density can be reduced to below the first upper limit density threshold not only by moving the stage 131, but also by scanning the EL printer using a galvanometer mirror and irradiating it.

[0124] (3-2-4-3) Adjustment of the scanning speed of the EL printer in conjunction with the adjustment of the energy density E of the EL printer The scanning speed of the EL printer is not particularly limited, as long as the energy density E is adjusted to be below the predetermined first upper limit density threshold (for example, 70 or less) described above. As described above, the scanning speed is the moving speed of the printing head 121, the moving speed of the stage 131, the relative moving speed of the other of the printing head 121 and the stage 131 with respect to either the printing head 121 or the stage 131, the moving speed of the EL printer, and the relative speed with respect to the relative moving speed of the other of the EL printer and the stage 131 with respect to either the EL printer and the stage 131.

[0125] For example, when the movement speed of stage 131 is set to the scanning speed, the movement speed of the stage may be adjusted to a range of 1 mm / s or more in order to reduce the possibility of crack formation. To improve throughput while reducing the possibility of crack formation, the movement speed of stage 131 may be set to 5 mm / s.

[0126] On the other hand, if the movement speed of the stage 131 is excessively fast, the amount of energy transferred per unit time from the luminescence light (EL) to a certain part of the build surface MS may become unnecessarily low. As a result, the time required to melt the build material M using the luminescence light may become longer. Consequently, the time required for the build apparatus 1 to build an object may become unnecessarily long. In other words, the throughput of the build apparatus 1 may decrease. Alternatively, it may become impossible to melt the build material M using the luminescence light. As a result, the build apparatus 1 may become unable to build an object. Therefore, the build apparatus 1 may adjust the movement of the stage 131 within a range below a predetermined upper speed threshold so that the energy density E is below a predetermined first upper density threshold (for example, 70 or less).

[0127] As an example, the movement speed of the stage 131 may be set to 30 mm / s or less in order to increase the likelihood of fabricating an object with appropriate throughput and to melt the fabrication material M. More preferably, the movement speed of the stage 131 may be set to 15 mm / s or less. In this way, when the movement speed of the stage 131 is adjusted to a range of 15 mm / s or less, the likelihood of the fabrication apparatus 1 being able to fabricate an object with appropriate throughput increases compared to when the scanning speed of the fabrication light EL is adjusted to a range exceeding 15 mm / s.

[0128] Furthermore, the molding apparatus 1 may adjust the movement speed of the stage 131 within a range of 1 mm / s or more and 30 mm / s or less. For example, the molding apparatus 1 may adjust the movement speed of the stage 131 within a range of 1 mm / s or more and 15 mm / s or less. For example, the molding apparatus 1 may adjust the movement speed of the stage 131 within a range of 5 mm / s or more and 30 mm / s or less. For example, the molding apparatus 1 may adjust the movement speed of the stage 131 within a range of 5 mm / s or more and 15 mm / s or less. The same applies when the movement speed of the molding head 121, or the relative movement speed of the other of the molding head 121 and the stage 131 with respect to either the molding head 121 or the stage 131, is used as the scanning speed.

[0129] When the scanning speed is defined as the movement speed of the EL (electroluminescent) printer using a galvanometer mirror, for example, the movement speed of the EL printer can be adjusted to be between 0 mm / s and 4000 mm / s. The movement speed of the EL printer can be adjusted according to the object being printed and the printing conditions.

[0130] Furthermore, the target value or adjustment range for the scanning speed may be generated using the results of an experiment in which the process of actually irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to create a printed object, while repeatedly changing the scanning speed. Alternatively, the target value or adjustment range for the scanning speed may be generated using the results of a simulation in which the process of virtually irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to create a printed object, while repeatedly changing the scanning speed, in addition to or instead of experimentation.

[0131] (3-2-4-4) Adjustment of the size of the beam spot BS of the lithography EL in conjunction with the adjustment of the energy density E of the lithography EL The size of the beam spot BS of the lithography EL is not particularly limited, as long as the energy density E is adjusted to be below the predetermined first upper limit density threshold (for example, 70 or less) described above. Even if the energy density E is adjusted to be below the predetermined first upper limit density threshold (for example, 70 or less) described above, if the size of the beam spot BS of the lithography EL is excessively large, the thermal affected area (HAZ) may unintentionally become large. Therefore, the lithography apparatus 1 may adjust the size of the beam spot BS of the lithography EL to be below the predetermined first upper limit spot threshold described above so that the energy density E is below the predetermined first upper limit density threshold (for example, 70 or less) described above.

[0132] As an example, the molding apparatus 1 may adjust the size of the beam spot BS of the EL printing light to a range of 1 mm or less in order to reduce the possibility of crack formation. More preferably, the molding apparatus 1 may adjust the size of the beam spot BS of the EL printing light to a range of 0.7 mm (i.e., 700 μm) or less in order to reduce the possibility of the heat-affected zone (HAZ) becoming excessively large. Even more preferably, the size of the beam spot BS may be adjusted to a range of 0.5 mm (i.e., 500 μm) or more in order to print the object with appropriate throughput while reducing the possibility of crack formation.

[0133] (3-2-5) Adjustment of the energy density E of the EL printer for purposes other than controlling the size of the thermal-affected zone (HAZ) In the above description, the 3D printer 1 adjusts the energy density E of the EL printer for the purpose of controlling the size of the thermal-affected zone (HAZ) (and thereby preventing cracks from occurring in the printed object during the printing period). However, the 3D printer 1 may also adjust the energy density E of the EL printer for purposes other than controlling the size of the thermal-affected zone (HAA) (and thereby preventing cracks from occurring in the printed object during the printing period). The following describes other examples of purposes for adjusting the energy density E of the EL printer.

[0134] (3-2-5-1) Controlling the optical density of a fabricated object by adjusting the energy density E of the EL light The fabrication apparatus 1 may adjust the energy density E of the EL light for the purpose of controlling (in other words, adjusting) the optical density of the fabricated object. In this embodiment, the optical density of the fabricated object may mean an index value for evaluating the density of the interior of the fabricated object. The optical density of the fabricated object may be an index value that increases as the internal structure of the fabricated object becomes denser. The optical density of the fabricated object may be an index value that decreases as the internal structure of the fabricated object becomes less dense. For example, the more defects (e.g., voids or pores) there are inside the fabricated object, the less dense the internal structure of the fabricated object is, and therefore the lower the optical density of the fabricated object. For this reason, the optical density of the fabricated object may mean an index value for evaluating the defects inside the fabricated object. The optical density of the fabricated object may also be called absorbance.

[0135] Specifically, if the energy density E of the EL (electroluminescent beam) becomes excessively low, the amount of energy transferred from the EL per unit time to a certain part of the printed surface MS may become unnecessarily low. As a result, the amount of unmelted material M supplied from the material nozzle 1212 to the molten pool MP may increase. In this case, the solid material M that remains unmelted in the molten pool MP will be mixed into the printed object formed by solidifying after melting in the molten pool MP. As a result, defects (e.g., voids or pores) may occur inside the printed object due to this unmelted solid material M. Therefore, if the energy density E of the EL becomes excessively low, the optical density of the printed object may become lower than the target density.

[0136] Therefore, the molding apparatus 1 may adjust the energy density E of the EL light used for molding within a range greater than or equal to a predetermined first lower limit density threshold so that the optical density of the molded object is equal to or equal to the target density. In this case, the first lower limit density threshold may be set to a desired value that can distinguish between the energy density E of the EL light used for molding an object whose optical density is equal to or equal to the target density and the energy density E of the EL light used to mold an object whose optical density is less than the target density. In other words, the first lower limit density threshold may be set based on the target density, which is the target value of the optical density of the molded object. Such a first lower limit density threshold may be generated using the results of experiments in which the molding apparatus 1 is used to actually irradiate a test sample having the same characteristics as the workpiece W or molding layer SL with the EL light and mold an object, while repeatedly changing the energy density E of the EL light used for molding. Alternatively, the first lower limit density threshold may be generated, in addition to or instead of experiments, using the results of a simulation in which the process of irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 is virtually repeated while changing the energy density E of the build light EL.

[0137] As a result, when the energy density E of the EL light used for printing is adjusted to a range above the first lower limit density threshold, the likelihood of the optical density of the printed object falling below the target density is lower compared to when the energy density E of the EL light used for printing is adjusted to a range below the first lower limit density threshold. Therefore, the printing apparatus 1 can print objects with an appropriate optical density.

[0138] As a specific example, Figure 14 shows the optical density of the object actually fabricated by the fabrication apparatus 1 in an experiment conducted by the inventors of the present invention, in which the fabrication apparatus 1 fabricates an object under the conditions that the size of the beam spot BS of the fabrication light EL is 0.5 mm (furthermore, the supply amount of fabrication material M from the material nozzle 1212 is 4 g / m, and the thickness of the fabrication layer SL is 0.15 mm). Figure 14 shows that (i) when the output of the EL printer is set to 100W and the scanning speed of the EL printer is set to 5mm / s, 10mm / s, and 15mm / s, the optical density is 99.67%, 99.27%, and 98.88%, respectively, and (ii) when the output of the EL printer is set to 120W and the scanning speed of the EL printer is set to 5mm / s, 10mm / s, and 15mm / s, the optical density is 99.84%, 99.5%, and 98.9%, respectively. The optical density is 8%, and (iii) when the output of the EL photovoltaic is set to 160W and the scanning speed of the EL photovoltaic is set to 5mm / s, 10mm / s, and 15mm / s, the optical density is 99.97%, 99.63%, and 99.38%, respectively. (iv) when the output of the EL photovoltaic is set to 200W and the scanning speed of the EL photovoltaic is set to 10mm / s and 15mm / s, the optical density is 99.93% and 99.88%, respectively. Note that the optical density shown in Figure 14 was calculated by measuring the cross-section of the printed object shown in Figure 13.

[0139] As shown in Figure 14, the experimental results indicate that, as a first example, when the target value of the optical density of the fabricated object (target density) is 98.9%, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL to a range of 15 or more, which is an example of a predetermined first lower limit density threshold, as shown in Figure 15. Figure 15 shows, in a hatched area, the range of output and scanning speed of the fabrication light EL that satisfies the condition that the energy density E is 15 or more, under the condition that the size of the beam spot BS of the fabrication light EL is 0.5 mm (i.e., 500 μm). At least one experiment and simulation conducted by the inventors of this application confirmed that when the energy density E is adjusted to be 15 or more, the possibility of the optical density of the fabricated object falling below 98.9%, an example of the target density, is lower compared to when the energy density E is adjusted to be less than 15. In other words, when combined with the first upper density threshold mentioned above, when the target density is 98.9%, the molding device 1 should create the object by adjusting the energy density within the range of 15 or more and 70 or less.

[0140] As shown in Figure 14, as a second example, when the target value of the optical density of the fabricated object (target density) is 99%, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL to a range of 20 or more, which is an example of a predetermined first lower limit density threshold. When the energy density E is adjusted to be 20 or more, it has been confirmed by at least one experiment and simulation conducted by the inventors of the present invention that the possibility of the optical density of the fabricated object falling below 99, an example of the target density, is lower compared to when the energy density E is adjusted to be less than 20. In other words, when combined with the first upper limit density threshold described above, when fabricating an object so that cracks do not occur during fabrication by the fabrication apparatus 1 and the target density of the fabricated object is 99%, the fabrication apparatus 1 should fabricate the object by adjusting the energy density to a range of 20 or more and 70 or less. More preferably, it is set to 20 or more and 65 or less, and even more preferably to 20 or more and 60 or less.

[0141] As shown in Figure 14, as a third example, when the target value of the optical density of the fabricated object (target density) is 99.5%, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL to a range of 24 or more, which is an example of a predetermined first lower limit density threshold. When the energy density E is adjusted to be 24 or more, the possibility of the optical density of the fabricated object falling below 99.5%, an example of the target density, is lower, compared to when the energy density E is adjusted to be less than 24, as confirmed by at least one experiment and simulation conducted by the inventors of the present invention. In other words, when combined with the first upper limit density threshold described above, when fabricating an object so that cracks do not occur in the fabricated object during fabrication by the fabrication apparatus 1 and the target density of the fabricated object is 99.5%, the fabrication apparatus 1 should fabricate the object by adjusting the energy density to a range of 24 or more and 70 or less. More preferably, it is set to 24 or more and 65 or less, and even more preferably to 24 or more and 60 or less.

[0142] Furthermore, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 1 or more above the first lower limit density threshold and 1 or less below the first upper limit density threshold described above. For example, when printing an object in a way that prevents cracks from occurring in the object during printing by the 3D printer 1, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 15 or more and 70 or less. For example, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 20 or more and 70 or less, or within a range of 15 or more and 65 or less. Figure 15 shows the range of output and scanning speed of the 3D light EL that satisfy the condition that the energy density E is 15 or more and 70 or less, under the condition that the size of the beam spot BS of the 3D light EL is 0.5 mm (i.e., 500 μm), in the hatched area. For example, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 24 or more and 70 or less. In this case, the molding apparatus 1 can create a molded object with appropriate optical density while preventing cracks from occurring in the molded object during the molding process.

[0143] (3-2-5-2) Control of the crystal structure of the fabricated object by adjusting the energy density E of the EL light The fabrication apparatus 1 may adjust the energy density E of the EL light for the purpose of controlling (in other words, adjusting) the crystal structure of the fabricated object.

[0144] Specifically, the objects fabricated by the fabrication device 1 are often required to have high resistance to creep. In other words, the objects fabricated by the fabrication device 1 are often required to have high creep properties. In this case, the creep properties (i.e., resistance to creep) of the fabricated object depend on the crystal structure of the fabricated object. Specifically, the creep properties of the fabricated object increase as the orientation of the crystal structure (i.e., the uniformity of crystal orientation) increases. For this reason, because the orientation of single crystals (single crystal particles) is higher than that of columnar crystals (columnar particles), the creep properties of a fabricated object with a high proportion of single crystals in its crystal structure will be higher than those of a fabricated object with a high proportion of columnar crystals in its crystal structure. Also, because the orientation of columnar crystals is higher than that of equiaxed crystals (equaxed particles), the creep properties of a fabricated object with a high proportion of columnar crystals in its crystal structure will be higher than those of a fabricated object with a high proportion of equiaxed crystals in its crystal structure. On the other hand, due to the characteristics of the molding apparatus 1, which forms objects by melting and then solidifying the molding material M, it is not always easy to form objects in which single crystals occupy a high proportion in the crystal structure. For this reason, in order to form objects with high creep properties, the molding apparatus 1 may form objects in which columnar crystals occupy a high proportion in the crystal structure.

[0145] In this case, the higher the energy density E of the EL (electroluminescent beam), the higher the proportion of columnar crystals in the crystal structure of the fabricated object. This is because, as the energy density E increases, more energy is transferred from the EL to the fabrication surface MS. As a result, the temperature of the molten pool MP increases, and the cooling rate, which corresponds to the rate of change in the temperature of the molten pool MP during the cooling and solidification period, slows down. In other words, the cooling rate, which corresponds to the rate of change in the temperature of the fabricated material M during the cooling and solidification period of the molten material M in the molten pool MP, slows down. As a result, the molten pool MP cools over a longer period of time. In this case, the time for crystal growth during the cooling and solidification process of the molten pool MP increases. As a result, the proportion of columnar crystals that grow in a certain direction (i.e., elongate) in the crystal structure increases.

[0146] Thus, it is expected that the higher the energy density E of the EL (electroluminescent beam) used for printing, the higher the proportion of columnar crystals in the crystal structure of the printed object. Therefore, the printing apparatus 1 may adjust the energy density E of the EL used for printing within a range greater than or equal to a predetermined second lower density threshold so that the crystal structure of the printed object becomes a predetermined target structure. An example of a predetermined target structure is a structure that satisfies the condition that "the proportion of columnar crystals in the crystal structure of the printed object is greater than or equal to a predetermined proportion." In this case, the second lower density threshold may be set to a desired value that can distinguish between the energy density E of the EL used for printing an object whose crystal structure becomes the predetermined target structure and the energy density E of the EL used for printing an object whose crystal structure does not become the predetermined target structure. In other words, the second lower density threshold may be set based on the target structure, which is the target value of the crystal structure of the printed object. Such a second lower density threshold may be generated using the results of an experiment in which the process of actually irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1 to create a printed object, is repeated while changing the energy density E of the build light EL. Alternatively, the second lower density threshold may be generated in addition to or instead of the experiment using the results of a simulation in which the process of virtually repeating the process of irradiating a test sample having the same characteristics as the workpiece W or build layer SL with the build light EL using the build device 1, is repeated while changing the energy density E of the build light EL.

[0147] As a result, when the energy density E of the EL light used for shaping is adjusted to a range above the second lower limit density threshold, the likelihood of the crystalline structure of the shaping object differing from the target structure is lower compared to when the energy density E of the EL light used for shaping is adjusted to a range below the second lower limit density threshold. Therefore, the shaping apparatus 1 can create objects with an appropriate crystalline structure.

[0148] As a specific example, Figure 16 shows the crystal structure of an object actually fabricated by the fabrication apparatus 1 in an experiment conducted by the inventors of the present invention, in which the fabrication apparatus 1 fabricated an object under the conditions that the size of the beam spot BS of the fabrication light EL is 0.5 mm (furthermore, the supply amount of fabrication material M from the material nozzle 1212 is 4 g / m, and the thickness of the fabrication layer SL is 0.15 mm). Figure 16 shows the crystal structure of the object actually fabricated by the fabrication apparatus 1 when (i) the output of the EL printing device is set to 100W, the scanning speed of the EL printing device is set to 5mm / s, 10mm / s, and 15mm / s, and as a result the energy density E of the EL printing device is set to approximately 40, approximately 20, and approximately 13, respectively, and (ii) the crystal structure of the object actually fabricated by the fabrication apparatus 1 when the output of the EL printing device is set to 120W, the scanning speed of the EL printing device is set to 5mm / s, 10mm / s, and 15mm / s, and as a result the energy density E of the EL printing device is set to approximately 49, approximately 24, and approximately 16, respectively. Figure 16 shows the structure and the crystal structure of the object actually fabricated by the fabrication device 1 when (iii) the output of the EL printing light is set to 160W, the scanning speed of the EL printing light is set to 5mm / s, 10mm / s, and 15mm / s, and as a result the energy density E of the EL printing light is set to approximately 64, approximately 32, and approximately 21, respectively. The figure also shows the crystal structure of the object actually fabricated by the fabrication device 1 when (iv) the output of the EL printing light is set to 200W, the scanning speed of the EL printing light is set to 10mm / s and 15mm / s, and as a result the energy density E of the EL printing light is set to approximately 40 and approximately 27, respectively. The crystal structure shown in Figure 16 was calculated by measuring the cross-section of the object shown in Figure 13.

[0149] As shown in Figure 16, the experimental results confirmed that the crystal structure of all fabricated objects in the experiment was the target structure. Therefore, as shown in Figure 17, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL to a range of 10 or more, which is an example of a predetermined second lower limit density threshold. Figure 17 shows the range of output and scanning speed of the fabrication light EL that satisfy the condition that the energy density E is 10 or more, under the condition that the size of the beam spot BS of the fabrication light EL is 0.5 mm (i.e., 500 μm), in the hatched area. However, if the target structure of the crystal structure of the fabricated object changes, the second lower limit density threshold may also change.

[0150] Furthermore, Figure 18 shows the creep characteristics (specifically, tensile strength) of the object actually fabricated by the fabrication device 1 when (i) the output of the EL printing light was set to 120W, the scanning speed of the EL printing light was set to 10 mm / s, and as a result the energy density E of the EL printing light was set to approximately 24, and (vi) the creep characteristics (specifically, tensile strength) of the object actually fabricated by the fabrication device 1 when the output of the EL printing light was set to 160W, the scanning speed of the EL printing light was set to 10 mm / s, and as a result the energy density E of the EL printing light was set to approximately 32. As shown in Figure 18, it was also confirmed by experiment that the creep characteristics of the fabricated object were sufficiently high.

[0151] Furthermore, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 10 or more and 70 or less than the second lower limit density threshold and the first upper limit density threshold described above. For example, the 3D printer 1 may adjust the energy density E of the 3D light EL to be within a range of 10 or more and 70 or less. Figure 17 shows, in a hatched area, the range of output and scanning speed of the 3D light EL that satisfies the condition that the energy density E is 10 or more and 70 or less, under the condition that the size of the beam spot BS of the 3D light EL is 0.5 mm (i.e., 500 μm). In this case, the 3D printer 1 can print a 3D object with an appropriate crystal structure while preventing cracks from occurring in the 3D object during the printing process.

[0152] Alternatively, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL within a range of 10 or more, while adjusting the energy density E of the fabrication light EL without considering the first upper density threshold. For example, the fabrication apparatus 1 may adjust the energy density E of the fabrication light EL within a range of 10 or more without considering the first upper density threshold. In this case, the fabrication apparatus 1 can fabricate a fabricated object having an appropriate crystal structure.

[0153] Alternatively, the molding apparatus 1 may adjust the energy density E of the EL light used for molding within a range below the first upper density threshold, while adjusting the energy density E of the EL light used for molding without considering the second lower density threshold. For example, the molding apparatus 1 may adjust the energy density E of the EL light used for molding within a range of 70 or less without considering the second lower density threshold. In this case, the molding apparatus 1 can prevent cracks from occurring in the molded object during the molding process.

[0154] (3-2-6) The GUI display control device 3 for adjusting the energy density E of the lithography EL may control an output device 35 that can function as a display device to display a density adjustment GUI (Graphical User Interface) 4 in order to adjust the energy density E of the lithography EL.

[0155] (3-2-6-1) First Example of Density Adjustment GUI 4 A first example of density adjustment GUI 4 for adjusting the energy density E of the EL (electroluminescent) photon is shown in Figure 19A. In the following description, the first example of density adjustment GUI 4 will be referred to as density adjustment GUI 4a.

[0156] As shown in Figure 19A, the density adjustment GUI 4a may include an input GUI 41a that accepts input of specification information for specifying the printing conditions for the printing apparatus 1 to print an object. In the example shown in Figure 19A, the input GUI 41a is a GUI (e.g., a text box) that can accept input of specification information for specifying at least one of the following: the output of the printing light EL, which is a first example of the printing conditions; the scanning speed of the printing light EL, which is a second example of the printing conditions; and the size of the beam spot BS of the printing light EL, which is a third example of the printing conditions.

[0157] The user may use the input device 34 to input specification information to the input GUI 41a to specify the printing conditions. For example, the user may use the input device 34 to input a numerical value that specifies the output of the printing light EL as specification information for specifying the output of the printing light EL. For example, the user may use the input device 34 to input a numerical value that specifies the scanning speed of the printing light EL as specification information for specifying the scanning speed of the printing light EL. For example, the user may use the input device 34 to input a numerical value that specifies the size of the beam spot BS of the printing light EL as specification information for specifying the size of the beam spot BS of the printing light EL.

[0158] The arithmetic unit 31 of the control device 3 may calculate the energy density E based on the specified information input to the input GUI 41a. For example, the arithmetic unit 31 may calculate the energy density E using the above-described formula based on the specified information for specifying at least one of the following: the output of the lithography light EL, the scanning speed of the lithography light EL, and the size of the beam spot BS of the lithography light EL.

[0159] The density adjustment GUI 4a may include a display GUI 42a for displaying information regarding the energy density E calculated by the arithmetic unit 31. For example, the display GUI 42a may display a numerical value indicating the energy density E calculated by the arithmetic unit 31 as information regarding the energy density E.

[0160] In this case, the user may determine whether the energy density E calculated from the molding conditions specified by the user is appropriate, based on the information about the energy density E displayed on the display GUI 42a. For example, the user may determine whether the energy density E calculated from the molding conditions specified by the user is less than or equal to the first upper limit density threshold described above, based on the information about the energy density E displayed on the display GUI 42a.

[0161] If the energy density E calculated from the build conditions specified by the user is not appropriate (for example, it exceeds the first upper density threshold), the user may re-enter the information for specifying the build conditions. In other words, the user may re-specify the build conditions. As a result, the user can appropriately specify the build conditions so that the energy density E becomes appropriate (for example, it becomes below the first upper density threshold).

[0162] On the other hand, if the energy density E calculated from the printing conditions specified by the user is appropriate, the control device 3 may control the printing device 1 to satisfy the printing conditions specified by the user. In other words, under the control of the control device 3, the printing device 1 may print an object by irradiating the printing surface MS (for example, the printing material M supplied to the printing surface MS) with printing light EL to satisfy the printing conditions specified by the user. In other words, under the control of the control device 3, the printing device 1 may print an object using the printing conditions specified by the user. As a result, the printing device 1 can print an object under conditions where the energy density E is appropriate. For example, the printing device 1 can print an object while preventing cracks from occurring in the object during the printing period.

[0163] (3-2-6-2) Second example of density adjustment GUI 4 A second example of density adjustment GUI 4 for adjusting the energy density E of the EL (electroluminescent) light used in fabrication is shown in Figure 19B. In the following description, the second example of density adjustment GUI 4 will be referred to as density adjustment GUI 4b.

[0164] As shown in Figure 19B, the density adjustment GUI 4b may include an input GUI 41b (e.g., a text box) that accepts input of specification information for specifying the energy density E. The user may use the input device 34 to input the specification information for specifying the energy density E into the input GUI 41b. For example, the user may use the input device 34 to input a numerical value for specifying the energy density E as the specification information for specifying the energy density E.

[0165] The arithmetic unit 31 of the control device 3 may calculate the molding conditions that can realize the energy density E indicated by the specified information input to the input GUI 41a. For example, the arithmetic unit 31 may calculate at least one of the following as molding conditions that can realize the energy density E indicated by the specified information input to the input GUI 41a: the output of the molding light EL, the scanning speed of the molding light EL, and the size of the beam spot BS of the molding light EL.

[0166] The density adjustment GUI 4b may include a display GUI 42b for displaying information regarding the molding conditions calculated by the computing device 31. For example, the display GUI 42b may display a numerical value indicating at least one of the following: the output of the molding light EL, the scanning speed of the molding light EL, and the size of the beam spot BS of the molding light EL, as information regarding the molding conditions calculated by the computing device 31.

[0167] Furthermore, the control device 3 may control the molding apparatus 1 to satisfy the molding conditions calculated based on the energy density E specified by the user. In other words, the molding apparatus 1 may, under the control of the control device 3, irradiate the molding surface MS (for example, the molding material M supplied to the molding surface MS) with molding light EL to satisfy the molding conditions calculated based on the energy density E specified by the user, thereby molding an object. In other words, the molding apparatus 1 may, under the control of the control device 3, mold an object using the molding conditions calculated based on the energy density E specified by the user. As a result, the molding apparatus 1 can mold an object under conditions where the energy density E is appropriate. For example, the molding apparatus 1 can mold an object while preventing cracks from occurring in the object during the molding period.

[0168] Furthermore, the user may use the input device 34 to input not only the specification information for specifying the energy density E, but also specification information for specifying part of the molding conditions to the input GUI 41b. For example, the user may use the input device 34 to input specification information for specifying at least one of the following: the output of the molding light EL, the scanning speed of the molding light EL, and the size of the beam spot BS of the molding light EL. In this case, the calculation device 31 may calculate the remaining part of the molding conditions that can realize the energy density E indicated by the specification information input to the input GUI 41a. For example, the calculation device 31 may calculate at least one other of the following as molding conditions that can realize the energy density E indicated by the specification information input to the input GUI 41a: the output of the molding light EL, the scanning speed of the molding light EL, and the size of the beam spot BS of the molding light EL.

[0169] (4) Repairing cracks that occur during the molding process If cracks occur in the molded object (especially the molded object in the process of being molded) during the molding process as described in step S1 of Figure 7 above, the molding device 1 may repair the cracks that have occurred in the molded object during the molding process.

[0170] Specifically, Figure 20A is a cross-sectional view showing a crack that occurred in the build layer SL#n (or the build layer SL#n-1 below the build layer SL#n) during the build period in which the build layer SL#n is built. In this case, during the build period, the build apparatus 1 further irradiates the build light EL onto the build object including the build layer SL#n (and further including other build layers SL below the build layer SL#n (e.g., build layer SL#n-1), the same applies hereinafter) in order to build the remaining part of the build layer SL#n or build layer SL#n+1 on top of the build layer SL#n. In this case, as shown in Figure 20B, the molding apparatus 1 may irradiate the molded object containing the molding layer SL#n with molding light EL, thereby melting the crack-forming region SLp in the molding layer SL#n (and further, in other molding layers SL below the molding layer SL#n (for example, molding layer SL#n-1)) where cracks are formed. In other words, the molding apparatus 1 may melt the crack-forming region SLp again. As a result, as shown in Figure 20C, the melted crack-forming region SLp cools and solidifies, eliminating the cracks that were formed in the crack-forming region SLp. In other words, the cracks that were formed in the crack-forming region SLp are repaired (or removed).

[0171] Thus, even if cracks occur during the printing process, the printing device 1 can repair the cracks during the printing process. As a result, the printing device 1 can print objects that are free of cracks.

[0172] (4-1) First example of operation for repairing cracks that occur during the molding period The molding apparatus 1 may repair cracks that occur during the first molding period in which the molding layer SL#n is molded during the same first molding period in which the molding layer SL#n is molded. In addition, any parts of the molding material M that have not melted sufficiently during the first molding period in which the molding layer SL#n is molded may be remelted during the same first molding period in which the molding layer SL#n is molded.

[0173] Specifically, in order to fabricate the fabrication layer SL#n, the fabrication apparatus 1 irradiates the fabrication surface MS, which is the surface of the fabrication layer SL#n-1 located below the fabrication layer SL#n, with fabrication light EL. In particular, the fabrication apparatus 1 irradiates the fabrication light EL onto the target irradiation area EA while moving the target irradiation area EA relative to the fabrication surface MS along one direction, thereby fabricating a linear fabricated object (bead BD) that extends along one direction and is part of the fabrication layer SL#n. This is done by alternately repeating a scanning operation and a stepping operation in which the target irradiation area EA is moved relative to the fabrication surface MS by a predetermined step travel distance SD along another direction that intersects the one direction, thereby fabricating a fabrication layer SL#n containing multiple adjacent beads BD (more specifically, a fabrication layer SL#n in which multiple adjacent beads BD are integrated).

[0174] In this case, the molding apparatus 1 may repair cracks that occurred during the molding of one bead BD during the molding of another bead BD that is different from the first bead BD. Specifically, the molding apparatus 1 may repair cracks formed in the crack formation region SLp by melting the crack formation region SLp, where cracks occurred during the molding of one bead BD, with the molding light EL that is irradiated onto the molding surface MS for molding the other bead BD.

[0175] For example, Figure 21A shows a scanning operation for fabricating a bead BD#1, which is part of the build layer SL#n. Specifically, Figure 21A shows a build light EL scanning the build surface MS, which is the surface of the build layer SL#n-1, along the X-axis direction in order to fabricate the bead BD#1. In particular, the left side of Figure 21A is a cross-sectional view showing the build light EL scanning the build surface MS along the X-axis direction, and the right side of Figure 21A is a top view showing the build light EL scanning the build surface MS along the X-axis direction. In this case, as shown in Figure 21A, the beam spot BS formed by the build light EL on the build surface MS scans the build region MSR#1 that extends along the X-axis direction on the build surface MS. As a result, molten pools MP are sequentially formed in the build region MSR#1.

[0176] As the molten pool MP formed in the build area MSR#1 cools and solidifies, a bead BD#1 is formed in the build area MSR#1, as shown in Figure 21B. The left side of Figure 21B is a cross-sectional view showing the bead BD#1 formed on the build surface MS, and the right side of Figure 21B is a top view showing the bead BD#1 formed on the build surface MS.

[0177] Subsequently, as shown in Figure 21C, in order to fabricate the bead BD#2, which is another part of the fabrication layer SL#n, the fabrication apparatus 1 performs a step operation in which it moves the target irradiation area EA relative to the fabrication surface MS by a predetermined step movement distance SD along the Y-axis direction intersecting the X-axis direction. The left side of Figure 21C is a cross-sectional view showing the target irradiation area EA moving relative to the fabrication surface MS by a predetermined step movement distance SD along the Y-axis direction, and the right side of Figure 21C is a top view showing the target irradiation area EA moving relative to the fabrication surface MS by a predetermined step movement distance SD along the Y-axis direction.

[0178] Subsequently, as shown in Figure 22A, the molding apparatus 1 performs a scanning operation to fabricate the bead BD#2. Specifically, the left side of Figure 22A is a cross-sectional view showing the molding light EL scanning the molding surface MS along the X-axis direction, and the right side of Figure 22A is a top view showing the molding light EL scanning the molding surface MS along the X-axis direction. In this case, as shown in Figure 22A, the beam spot BS formed by the molding light EL on the molding surface MS scans the molding region MSR#2 that extends along the X-axis direction on the molding surface MS. As a result, molten pools MP are sequentially formed in the molding region MSR#2.

[0179] As the molten pool MP formed in the build area MSR#2 cools and solidifies, a bead BD#2 is formed in the build area MSR#2, as shown in Figure 22B. The left side of Figure 22B is a cross-sectional view showing the bead BD#2 formed on the build surface MS, and the right side of Figure 22B is a top view showing the bead BD#2 formed on the build surface MS.

[0180] In the process of forming beads BD#1 and BD#2, if a crack occurs during the formation of bead BD#1, as shown in Figure 21B, the molding apparatus 1 may repair the crack that occurred during the formation of bead BD#1 during the formation of bead BD#2, which is adjacent to bead BD#1.

[0181] Specifically, in order to correct cracks that occur during the formation of bead BD#1 during the formation of bead BD#2, the step travel distance SD in the step movement performed to form bead BD#2 may be set based on the size of the beam spot BS formed by the build light EL on the build surface MS. Specifically, the step travel distance SD may be set to a distance obtained by multiplying the size of the beam spot BS formed by the build light EL on the build surface MS by a predetermined percentage of less than 100%. In this case, as shown in Figure 22A, the build area MSR#2 where bead BD#2 is formed overlaps at least partially with the build area MSR#1 where bead BD#1 is formed. That is, the build light EL irradiated onto the build surface MS to form bead BD#2 irradiates at least a portion of the build area MSR#1 where bead BD#1 is formed. As a result, as shown in Figure 22A, the molten pool MP formed to create bead BD#2 at least partially encompasses the crack formation region SLp where cracks occurred during the formation of bead BD#1. Consequently, the crack formation region SLp melts. Subsequently, as the crack formation region SLp cools and solidifies, the cracks that had formed in the crack formation region SLp are repaired, as shown in Figure 22B.

[0182] The step travel distance SD may be determined by the ratio of the width of the overlapping region OL in the direction parallel to the build surface MS (the Y direction in Figure 22A) to the size of the beam spot BS (or the width of the build area MSR#1 or the width of the bead BD#1). The overlapping region OL refers to the area of ​​bead BD#2 that overlaps with bead BD#1. In other words, the overlapping region OL refers to the area where bead BD#1 and bead BD#2 overlap. The larger the ratio of the width of the overlapping region OL in the direction parallel to the build surface MS to the beam spot size BS, the smaller the width of the built object including beads BD#1 and BD#2 (for example, the width in the Y-axis direction in Figures 21 to 22). In other words, the width of the built object created by repeating the scan operation and step operation a predetermined number of times becomes smaller. For this reason, the number of beads BD required to build the entire build layer SL increases. In other words, the number of scan and step operations required to create the entire build layer SL increases. As a result, the time required to create the build layer SL increases. In short, the throughput of the build device 1 deteriorates.

[0183] Therefore, the ratio of the width of the overlapping region OL in the direction parallel to the build surface MS relative to the beam spot size BS may be set to a predetermined ratio that satisfies the condition that "the build apparatus 1 can build objects with appropriate throughput." For example, the ratio of the width of the overlapping region OL in the direction parallel to the build surface MS relative to the beam spot size BS may be set to 40% or more, and more preferably to 45% or more. The upper limit of the ratio of the step travel distance SD may be set to 60% or less, and more preferably to 55% or less, in order to repair cracks while ensuring a desirable throughput. In this case, the ratio of the width of the overlapping region OL in the direction parallel to the build surface MS relative to the beam spot size BS may be set to 40% or more and 60% or less, and more preferably to 45% or more and 55% or less.

[0184] (4-2) Second example of operation for repairing cracks that occur during the molding period The molding apparatus 1 may repair cracks that occur during the first molding period in which the molding layer SL#n is molded during the second molding period in which the molding layer SL#n+1 is molded on top of the molding layer SL#n. The molding apparatus 1 may also repair any insufficient melting of the molding material M in the molding layer SL#n during the second molding period in which the molding layer SL#n+1 is molded on top of the molding layer SL#n.

[0185] Specifically, Figure 23A shows the printing light EL irradiated onto the printing surface MS, which is at least a part of the surface of the printing layer SL#n-1, in order to print the printing layer SL#n on top of the printing layer SL#n-1. As a result, a molten pool MP is formed on the printing surface MS. The printing apparatus 1 scans the printing surface MS with the printing light EL according to the printing pattern of the printing layer SL#n by moving the target irradiation area EA on the printing surface MS according to the printing pattern of the printing layer SL#n. As a result, the printing layer SL#n is printed as shown in Figure 23B.

[0186] Subsequently, as shown in Figure 23C, the molding apparatus 1 irradiates the molding surface MS, which is at least a part of the surface of the molding layer SL#n, with molding light EL in order to fabricate a molding layer SL#n+1 on top of the molding layer SL#n. As a result, a molten pool MP is formed on the molding surface MS. The molding apparatus 1 scans the molding surface MS with molding light EL according to the molding pattern of the molding layer SL#n+1 by moving the target irradiation area EA on the molding surface MS according to the molding pattern of the molding layer SL#n+1. As a result, as shown in Figure 23D, the molding layer SL#n+1 is fabricated.

[0187] Here, as shown in Figure 23B, if a crack occurs during the period in which the build layer SL#n is built, the build apparatus 1 may repair the crack that occurred during the first build period in which the build layer SL#n is built during the second build period in which the build layer SL#n+1 is built. Specifically, as shown in Figure 23C, the build apparatus 1 may irradiate the build surface MS with build light EL so that the molten pool MP formed to build the build layer SL#n+1 penetrates at least the lower build layer SL#n below the build layer SL#n+1. In other words, the build apparatus 1 may irradiate the build surface MS with build light EL so that the molten pool MP formed to build the build layer SL#n+1 encompasses at least a portion of the build layer SL#n. As a result, at least a portion of the crack-forming region SLp in the build layer SL#n melts. Subsequently, as the crack-forming region SLp cools and solidifies, the cracks that had formed in the crack-forming region SLp are repaired, as shown in Figure 23D.

[0188] In this embodiment, the depth to which the molten pool MP formed to create the build layer SL#n+1 penetrates the build layer SL#n along the Z-axis direction, which is the incident direction of the build light EL, may be set based on the thickness LT of the build layer SL#n. For the purposes of the following explanation, the depth to which the molten pool MP formed to create the build layer SL#n+1 penetrates the build layer SL#n will be referred to as the penetration depth D of the molten pool MP. Specifically, the larger the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n, the larger the proportion of the build layer SL#n contained in the molten pool MP formed to create the build layer SL#n+1. As a result, the molten pool MP formed to create the build layer SL#n+1 is more likely to include at least a portion of the crack formation region SLp where cracks occurred during the build of the build layer SL#n. Therefore, the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n may be set to a ratio less than or equal to a predetermined second upper limit ratio that satisfies the condition that "the molten pool MP formed to build the build layer SL#n+1 can encompass at least a portion of the crack formation region SLp where cracks occurred when building the build layer SL#n." As an example, the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n may be set to a ratio of 47% or more, which is an example of the predetermined second upper limit ratio.

[0189] On the other hand, the larger the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n, the deeper the molten pool MP will be formed, which may unintentionally melt other build layers SL located below the build layer SL#n that have not yet cracked. Considering that the output of the build light EL required to form the molten pool MP increases with increasing depth, if the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n becomes too large, it will no longer be worth the cost required to emit a high-output build light EL. For this reason, the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n may be set to a predetermined second lower limit ratio or higher that satisfies the condition that "the molten pool MP formed to build build layer SL#n+1 can include at least a portion of the crack formation region SLp where cracks occurred when building build layer SL#n". As an example, the ratio of the penetration depth D of the molten pool MP to the thickness LT of the molded layer SL#n may be set to a ratio of 160% or less, which is an example of a predetermined second lower limit ratio.

[0190] Furthermore, when the ratio of the penetration depth D of the molten pool MP to the thickness LT of the build layer SL#n exceeds 100% (i.e., the penetration depth D of the molten pool MP exceeds the thickness LT of the build layer SL#n), it means that the molten pool MP formed to build build layer SL#n+1 penetrates through build layer SL#n and enters another build layer SL below build layer SL#n (for example, build layer SL#n-1). Therefore, when the ratio of the penetration depth D of the molten pool MP to the thickness LT of build layer SL#n exceeds 100%, the build apparatus 1 can repair cracks that occurred not only in build layer SL#n but also in other build layers SL below build layer SL#n during the first build period for building build layer SL#n, during the second build period for building build layer SL#n+1.

[0191] (5) Prevention of crack occurrence during heat treatment During the heat treatment period in step S2 of Figure 7 described above, there is a possibility that cracks may occur in the molded object. In this embodiment, the molding apparatus 1 may, under the control of the control device 3, mold the object in such a way that the possibility of cracks occurring in the molded object during the heat treatment period is reduced. In other words, the molding apparatus 1 may mold an object that has the characteristic of being less likely to crack during the heat treatment period. That is, the molding apparatus 1 may mold an object in such a way that cracks do not occur in the molded object during the heat treatment period. In other words, the molding apparatus 1 may mold an object that has the characteristic of not cracking during the heat treatment period. The operation of molding an object in such a way that cracks do not occur in the molded object during the heat treatment period will be described below.

[0192] (5-1) Technical reasons for crack formation in the fabricated object during heat treatment First, as a prerequisite for actions to prevent crack formation in the fabricated object during heat treatment, we will explain the technical reasons for crack formation in the fabricated object during heat treatment. Specifically, when a fabricated object is created using a high energy density E EL printing light, there is a possibility that cracks will form in the fabricated object during the heat treatment period in which heat is applied to the fabricated object. For this reason, we will explain below the technical reasons for crack formation in the fabricated object during the heat treatment period in which heat is applied to the fabricated object when it is created using a high energy density E EL printing light.

[0193] The first reason is that when an object is fabricated using a high energy density E EL (electroluminescent beam), the object is fabricated from a fabrication material M that is rapidly heated by the EL irradiation and then cooled. As a result, there is a possibility that residual stress will accumulate in the fabricated object. If this residual stress exceeds the allowable stress of the fabricated object, cracks may occur during the fabrication period, as described above. On the other hand, if this residual stress does not exceed the allowable stress of the fabricated object, the possibility of cracks occurring during the fabrication period is low, as described above. However, even if no cracks occur during the fabrication period, strain occurs in the fabricated object during the process of returning it to a stable state through heat treatment, and as a result, new cracks may occur in the fabricated object due to the residual stress accumulated in it. In other words, there is a possibility of strain aging cracking occurring.

[0194] The second reason is that when a molten object is fabricated using a high energy density E EL (electroluminescent beam), the molten pool MP becomes larger, and the amount of heat stored in the molten pool MP (i.e., the amount of heat stored in the metal molten in the molten pool MP) also increases. As a result, the cooling rate, which corresponds to the rate of change in the temperature of the molten pool MP during the cooling and solidification period, becomes slower. Consequently, the molten pool MP cools over a longer period of time. In this case, the amount of precipitates that precipitate at the grain boundaries of the fabricated object as the molten pool MP cools and solidifies increases. As a result, the grain boundaries of the fabricated object may become brittle. In this case, even if no cracks occur during the fabrication process, strain occurs in the fabricated object during the process of returning to a stable state through heat treatment, and as a result, new cracks may occur in the fabricated object where the grain boundaries were already brittle. In other words, strain aging cracks may occur.

[0195] As mentioned above, the third reason is that when an object is fabricated using a high energy density E EL (electroluminescent light), the proportion of columnar crystals in the crystal structure of the fabricated object increases. In this case, strain occurs in the fabricated object during the process of returning it to a stable state through heat treatment, and as a result, minute cracks may occur along the growth direction of the columnar crystals. Here, the higher the proportion of equiaxed crystals in the crystal structure of the fabricated object, the higher the likelihood that the growth of minute cracks occurring along the growth direction of the columnar crystals will be hindered by the equiaxed crystals. In other words, the growth of minute cracks occurring along the growth direction of the columnar crystals is more likely to stop at the location where equiaxed crystals are present. As a result, the likelihood of minute cracks growing into large cracks (i.e., fissures) is low. However, if the proportion of equiaxed crystals in the crystal structure of the fabricated object is low, the likelihood of the growth of cracks occurring along the growth direction of the columnar crystals being hindered by the equiaxed crystals decreases. In other words, the likelihood of the growth of minute cracks occurring along the growth direction of the columnar crystals stopping at the location where equiaxed crystals are present decreases. As a result, tiny cracks are more likely to grow into larger cracks (i.e., fissures).

[0196] (5-2) Actions to prevent crack formation during heat treatment As described above, the higher the energy density E of the EL light used to create the object, the higher the possibility of cracks forming in the object during the heat treatment period. For this reason, if the energy density E of the EL light used to create the object is reasonably low, it is expected that the possibility of cracks forming in the object during the heat treatment period will be reduced.

[0197] Therefore, the molding apparatus 1 may, under the control of the control device 3, adjust the energy density E of the molding light EL to a range below a predetermined second upper limit density threshold to prevent cracks from occurring in the molded object during the heat treatment period. In this case, the second upper limit density threshold may be set to a desired value that can distinguish between the energy density E of the molding light EL that produces a molded object in which cracks occur during the heat treatment period and the energy density E of the molding light EL that produces a molded object in which cracks do not occur during the heat treatment period. Such a second upper limit density threshold may be generated using the results of an experiment in which the molding apparatus 1 is used to actually irradiate a test sample having the same characteristics as the workpiece W or molded layer SL with the molding light EL to produce a molded object, and then heat treatment is performed on the molded object, while repeatedly changing the energy density E of the molding light EL. Alternatively, the second upper limit density threshold may be generated in addition to or instead of experiments by using the results of a simulation in which the process of irradiating a test sample having the same characteristics as the workpiece W or build layer SL with build light EL using the build apparatus 1 to build an object and then performing heat treatment on the built object is virtually repeated while changing the energy density E of the build light EL.

[0198] As a result, when the energy density E of the EL light used for printing is adjusted to a range below the second upper limit density threshold, the likelihood of cracks occurring in the printed object during the heat treatment period is lower compared to when the energy density E of the EL light used for printing is adjusted to a range above the second upper limit density threshold. Therefore, the printing apparatus 1 can print objects in a way that prevents cracks from occurring in the printed object during the heat treatment period.

[0199] As an example, in the experiment shown in Figure 13, the output of the EL photon flux was set to 160W, the scanning speed of the EL photon flux was set to 5 mm / s, and as a result, the energy density E of the EL photon flux was set to approximately 64. The printed object was heated at a heating rate of 30°C / m, heated at 1120°C for 2 hours, then the temperature was lowered to 850°C, and heated at 850°C for 24 hours. When such heat treatment was performed on an object actually printed by the printing apparatus 1, it was confirmed that cracks occurred in the object. On the other hand, in other examples, even when heat treatment was performed on an object actually printed by the printing apparatus 1, no cracks occurred in the object. For this reason, as shown in Figure 24, the energy density E of the EL photon flux of the printing apparatus 1 may be adjusted to a range of "60" or less, which is an example of a predetermined second upper limit density threshold. At least one experiment and simulation conducted by the inventors of the present invention confirmed that when the energy density E is adjusted to be 60 or less, the likelihood of being able to fabricate an object in a way that prevents cracks from occurring in the fabricated object during the heat treatment period is higher compared to when the energy density E is adjusted to be greater than 60.

[0200] As another example, the molding apparatus 1 may adjust a predetermined second upper limit density threshold, which is the energy density E of the molding light EL, to a range of "55" or less, and more preferably to a range of "50" or less, in order to increase the likelihood that it can mold the molded object in a way that prevents cracks from occurring in the molded object during the heat treatment period.

[0201] In other words, to prevent cracks from forming in the molded object after heat treatment with a heat treatment device, it is preferable to set the energy density E to a range of 15 or more and 60 or less, more preferably 15 or more and 55 or less, and even more preferably 15 or more and 50 or less.

[0202] Furthermore, in order to create a molded object that does not develop cracks even after heat treatment with a heat treatment device, and to achieve an optical density of 99% or more, it is preferable that the energy density E be set to a range of 20 to 60, more preferably 20 to 55, and even more preferably 20 to 50.

[0203] Furthermore, in order to create a molded object that does not develop cracks even after heat treatment with a heat treatment device, and to achieve an optical density of 99.5% or higher, it is preferable that the energy density E be set to a range of 24 to 60, more preferably 24 to 55, and even more preferably 24 to 50.

[0204] Furthermore, as mentioned above, one of the technical reasons why cracks occur in the molded object during the heat treatment period is that the cooling rate, which corresponds to the rate of change in the temperature of the molten pool MP during the period in which the molten pool MP is cooled and solidified, becomes slow. In this case, the molding apparatus 1 may mold the object by adjusting the energy density E so that the cooling rate falls within a predetermined speed range. The molding apparatus 1 may mold the object by adjusting the energy density E within a range below the second upper limit density threshold so that the cooling rate falls within a predetermined speed range. In other words, the molding apparatus 1 may mold the object by adjusting the energy density E so that the cooling rate falls within a predetermined speed range. The molding apparatus 1 may mold the object by adjusting the energy density E within a range below the second upper limit density threshold so that the cooling rate falls within a predetermined speed range.

[0205] The predetermined speed range may be set to a desired value that can distinguish between a cooling rate that produces a molded object in which cracks occur during the heat treatment period and a cooling rate that produces a molded object in which cracks do not occur during the heat treatment period. Such a predetermined speed range may be generated using the results of an experiment in which the operation of actually irradiating a test sample having the same characteristics as the workpiece W or the build layer SL with the build light EL using the build device 1 to produce a molded object and then performing heat treatment on the molded object is repeated while changing the cooling rate. Alternatively, the second upper limit density threshold may be generated using the results of a simulation in which the operation of virtually repeating the operation of irradiating a test sample having the same characteristics as the workpiece W or the build layer SL with the build light EL using the build device 1 to produce a molded object and then performing heat treatment on the molded object is repeated while changing the cooling rate, in addition to or instead of the experiment.

[0206] As a result, when the cooling rate is adjusted within a predetermined speed range, the likelihood of cracks occurring in the molded object during the heat treatment period is lower compared to when the cooling rate is adjusted outside the predetermined speed range. Therefore, the molding apparatus 1 can mold objects in a way that prevents cracks from occurring in the molded object during the heat treatment period.

[0207] As an example, the molding apparatus 1 may fabricate an object by adjusting the energy density E within a range below the second upper limit density threshold so that the cooling rate is 3500°C / second or more and 40000°C / second or less. As another example, the molding apparatus 1 may fabricate an object by adjusting the energy density E within a range below the second upper limit density threshold so that the cooling rate is 3620°C / second or more and 39310°C / second or less.

[0208] Furthermore, the second upper density threshold is a threshold that determines the upper limit of the energy density E, similar to the first upper density threshold described above. Therefore, the explanation of the first upper density threshold described above can be reused as an explanation of the second upper density threshold by replacing the phrase "first upper density threshold" with the phrase "second upper density threshold." For example, the molding apparatus 1 may adjust the output of the molding light EL to be below the upper output threshold and / or above the lower output threshold, similar to how the molding apparatus 1 adjusts the output of the molding light EL to be below the upper output threshold and / or above the lower output threshold, so that the energy density E is below the second upper density threshold. For example, the molding apparatus 1 may adjust the scanning speed of the molding light EL to be below the upper speed threshold and / or above the lower speed threshold, similar to how the scanning speed of the molding light EL to be adjusted to be below the upper speed threshold and / or above the lower speed threshold, so that the energy density E is below the second upper density threshold. For example, the molding apparatus 1 may adjust the size of the beam spot BS of the molding light EL to be below the upper spot threshold and / or above the lower spot threshold, similar to how the molding apparatus 1 adjusts the size of the beam spot BS of the molding light EL to be below the upper spot threshold and / or above the lower spot threshold, so that the energy density E is below the second upper density threshold. The control device 3 may display the density adjustment GUI4 to adjust the energy density E of the molding light EL to be below the second upper density threshold, similar to how the density adjustment GUI4 is displayed to adjust the energy density E of the molding light EL to be below the first upper density threshold, so that the energy density E is below the second upper density threshold and / or above the first lower density threshold. For example, the molding apparatus 1 may adjust the energy density E to be below the second upper density threshold and / or above the first lower density threshold and / or below the second lower density threshold, similar to how the molding apparatus 1 adjusts the energy density E to be below the first upper density threshold and / or above the first lower density threshold and / or below the second lower density threshold.

[0209] As an example, Figure 25 shows, in a hatched area, the range of output and scanning speed of the EL that satisfies the following conditions under the condition that the size of the beam spot BS of the EL is 0.5 mm (i.e., 500 μm): (i) the energy density E is 50 or less, which is an example of a second upper density threshold; (ii) the energy density E is 20 or more, which is an example of a first lower density threshold; (iii) the output of the EL is 200 W or less, which is an example of an upper output threshold; (iv) the output of the EL is 100 W or more, which is an example of a lower output threshold; (v) the scanning speed of the EL is 15 mm / s or less, which is an example of an upper speed threshold; and (v) the scanning speed of the EL is 5 mm / s or more, which is an example of a lower speed threshold. The EL printing apparatus 1 may print an object using the printing conditions included in the hatched area in Figure 25.

[0210] The second upper density threshold may be smaller than the first upper density threshold. In this case, adjusting the energy density E to be within the range of the second upper density threshold is equivalent to adjusting the energy density E to be within the range of the first and 22 upper density thresholds. Therefore, in this case, the molding apparatus 1 can mold the object in a way that prevents cracks from occurring in the object during the molding period and prevents cracks from occurring in the object during the heat treatment period. However, the second upper density threshold does not have to be smaller than the first upper density threshold.

[0211] (6) Modification In the above description, the supply amount of the molding material M supplied by the material nozzle 1212 was set to 4 g / m. By adjusting the supply amount of the molding material M supplied by the material nozzle 1212, variations in the optical density of the molded object can be suppressed. If the supply amount is too small, variations in optical density will occur for each molded object when molding multiple objects. Therefore, the target value or adjustment range of the supply amount of the molding material M may be determined using the results of an experiment in which the molding device 1 is used to irradiate a test sample (or an actual workpiece W or an actual molded layer SL, hereinafter the same) with the same characteristics as the workpiece W or molded layer SL, with the molding light EL being used to mold an object, and the amount of the supply amount of the molding material M is changed repeatedly. Alternatively, the target value or adjustment range for the supply amount of the molding material M may be determined, in addition to or instead of experimentation, by using the results of a simulation in which the molding device 1 is used to virtually repeat the operation of irradiating a test sample having the same characteristics as the workpiece W or molding layer SL with molding light EL to create a molded object, while changing the supply amount of the molding material M.

[0212] In the above description, the heat treatment device 2 performs heat treatment on the fabricated object to relieve the residual stress of the fabricated object fabricated by the fabrication device 1. However, the residual stress of the fabricated object fabricated by the fabrication device 1 may also be relieved by performing a predetermined stress relief treatment on the fabricated object that is different from heat treatment. In this case, as shown in Figure 26, the fabrication system SYS may be equipped with a stress relief device 4 that can perform a predetermined stress relief treatment on the fabricated object in addition to or instead of the heat treatment device 2.

[0213] One example of a predetermined stress relaxation treatment is a process of polishing the surface of the molded object. In this case, the molding system SYS may be equipped with a polishing device capable of polishing the surface of the molded object as an example of a stress relaxation device 4. The polishing device may, for example, be equipped with a grinding wheel, and the surface of the molded object may be polished by bringing the grinding wheel into contact with the molded object. The polishing device may, for example, be equipped with a supply pipe that supplies abrasive grains to the surface of the molded object, and a tool that is pressed against the molded object to which the abrasive grains have been supplied, and the surface of the molded object may be polished by pressing the tool against the molded object to which the abrasive grains have been supplied and rubbing it.

[0214] A second example of a predetermined stress relaxation treatment is a process of cutting off the surface of the fabricated object. In this case, the fabrication system SYS may be equipped with a cutting device capable of cutting off the surface of the fabricated object as an example of a stress relaxation device 4. The cutting device may be equipped with a cutting tool such as a cutting tool bit, and the surface of the fabricated object may be cut off by bringing the cutting tool into contact with the fabricated object.

[0215] A third example of a predetermined stress relief treatment is a process of cutting the fabricated object into at least two parts. For example, a third example of a predetermined stress relief treatment is a process of cutting the fabricated object into at least two parts from the middle. In this case, the fabrication system SYS may include a cutting device capable of cutting the fabricated object into at least two parts as an example of a stress relief device 4. The cutting device may include, for example, a cutting tool such as a milling cutter or a wire saw, and may cut the fabricated object into at least two parts by bringing the cutting tool into contact with the fabricated object.

[0216] In the above description, the molding apparatus 1 melts the molding material M by irradiating it with molding light EL. However, the molding apparatus 1 may also melt the molding material M by irradiating it with any energy beam. In this case, the molding apparatus 1 may be equipped with a beam irradiation device capable of irradiating any energy beam in addition to or instead of the irradiation optical system 1211. Examples of any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of a charged particle beam include at least one of an electron beam and an ion beam.

[0217] At least some of the constituent elements of each embodiment described above can be appropriately combined with at least some other constituent elements of each embodiment described above. Some of the constituent elements of each embodiment described above may not be used. Furthermore, to the extent permitted by law, all of the published patents and U.S. patent disclosures cited in each embodiment described above shall be incorporated into the text.

[0218] The present invention is not limited to the embodiments described above, and can be modified as appropriate without contradicting the gist or idea of ​​the invention as can be read from the claims and specification as a whole. Such modifications to the molding method and molding system are also included within the technical scope of the present invention.

[0219] SYS (Modeling System) 1. Modeling device 121. Modeling head 1212. Material nozzle 122. Head drive system 131. Stage 132. Stage drive system 2. Heat treatment device 21. Chamber 22. Heating device 3. Control device 31. Calculation unit 32. Memory device 321. Computer program 4. Stress relief device W: Workpiece M: Modeling material SL: Modeling layer MS: Modeling surface MP: Molten pool EL: Modeling light HAZ: Heat-affected zone

Claims

1. The process involves supplying a molding material containing nickel, chromium, and cobalt in at least a portion of the formed first molding layer, and further containing aluminum and titanium in a total mass of 4.5% or more; and irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first and second molding layers, wherein the irradiation of the energy beam in forming the molded object has an energy density of 70 (J / mm²). ２ A fabrication method including irradiation with the energy beam, wherein the method is as follows:

2. The process includes supplying a molding material containing nickel, chromium, and cobalt in at least a portion of the formed first molding layer, and further containing aluminum and titanium in a total mass of 4.5% or more; irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first and second molding layers; and performing heat treatment on the molded object, wherein the irradiation of the energy beam in forming the molded object has an energy density of 60 (J / mm²). ２ A fabrication method including irradiation with the energy beam, wherein the method is as follows:

3. The molding method according to claim 2, wherein the heat treatment applied to the molded object includes one of the following: heat treatment to relieve residual stress in the molded object, heat treatment to improve the mechanical properties of the molded object, heat treatment to homogenize the crystal structure of the molded object, or heat treatment to improve the dimensional accuracy of the molded object.

4. The fabrication method according to any one of claims 1 to 3, wherein the irradiation of the energy beam in fabricating the fabricated object includes irradiation of the energy beam having an energy density of 50 or less.

5. A method for fabricating an object according to any one of claims 1 to 4, comprising: melting the molding material by irradiating it with an energy beam such that the energy density is 60 or less; and solidifying the molten molding material such that the cooling rate corresponding to the rate of change of the temperature of the molding material during the period in which the molten molding material solidifies is 3500°C / second or more and 40000°C / second or less.

6. The molding method according to claim 5, comprising molding the molded object by irradiating the molding material with the energy beam such that the energy density is 60 or less, thereby melting the molding material, and solidifying the melted molding material such that the cooling rate corresponding to the rate of change of the temperature of the molding material during the period in which the melted molding material solidifies is 3620°C / second or more and 39310°C / second or less.

7. A fabrication method according to any one of claims 1 to 6, comprising adjusting the output of the energy beam emitted by the beam source so that the energy density of the energy beam is 60 or less.

8. The molding method according to claim 7, wherein adjusting the output of the energy beam is to adjust the output of the energy beam within a range of 50 W or more and 300 W or less.

9. The molding method according to claim 7 or 8, wherein adjusting the output of the energy beam is to adjust the output of the energy beam within the range of 100 W or more and 200 W.

10. A fabrication method according to any one of claims 1 to 9, comprising adjusting the relative movement speed of the energy beam with respect to the first fabrication layer in a direction intersecting the direction of propagation of the energy beam, such that the energy density of the energy beam is 60 or less.

11. The molding method according to claim 10, wherein adjusting the relative movement speed of the energy beam is within a range of 1 mm / second or more and 30 mm / second.

12. The fabrication method according to claim 10 or 11, wherein adjusting the relative movement speed of the energy beam is within the range of 5 mm / second or more and 15 mm / second.

13. A fabrication method according to any one of claims 1 to 12, comprising adjusting the size of the beam spot formed by the energy beam on the first fabrication layer or the fabrication material supplied on the first fabrication layer, such that the energy density of the energy beam is 60 or less.

14. The molding method according to claim 13, wherein adjusting the size of the beam spot includes adjusting the size of the beam spot within a range of 1 mm or less.

15. The fabrication method according to claim 13 or 14, wherein adjusting the size of the beam spot is performed within a range of 500 μm or more and 700 μm or less.

16. The fabrication method according to any one of claims 1 to 13, wherein the energy density can be calculated based on the formula: "Energy density = Output of the energy beam emitted by the beam source / (Relative velocity of the energy beam with respect to the first fabrication layer in a direction intersecting the direction of propagation of the energy beam × Size of the beam spot formed by the energy beam on the first fabrication layer or on the fabrication material supplied to the first fabrication layer." 17. The molding method according to any one of claims 13 to 16, wherein the size of the beam spot formed by the energy beam on the first molding layer or on the molding material supplied on the first molding layer includes the diameter of the region on the first molding layer or on the molding material supplied on the first molding layer that is irradiated with a beam portion of the energy beam with an intensity of a predetermined value or higher.

18. A fabrication method according to any one of claims 1 to 17, comprising fabricating the fabricated object by irradiating the fabrication material with the energy beam such that the energy density of the energy beam is 60 or less and above a predetermined lower threshold.

19. The fabrication method according to claim 18, wherein the lower threshold is set based on an energy density value that makes it possible to raise the optical density of the fabricated object to a desired density or higher.

20. The fabrication method according to claim 18 or 19, wherein the lower threshold is set based on the energy density value that makes it possible to increase the proportion of columnar crystals in the crystal structure of the fabricated object to a predetermined proportion or more.

21. The molding method according to any one of claims 18 to 20, wherein the lower threshold value is 10.

22. The molding method according to any one of claims 18 to 21, wherein the lower threshold value is 15.

23. The molding method according to any one of claims 18 to 21, wherein the lower threshold value is 20.

24. A molding method according to any one of claims 1 to 22, comprising: receiving input of specification information for specifying molding conditions for molding the aforementioned molded object; and displaying information relating to the energy density calculated based on the input specification information.

25. A molding method according to any one of claims 1 to 24, comprising: receiving input of designation information for specifying the energy density; and setting molding conditions for molding the molded object that can realize the energy density indicated by the input designation information.

26. The molding method according to claim 23 or 24, wherein the molding conditions include at least one of the following: the output of the energy beam emitted by the beam source; the relative speed of the energy beam relative to the first molding layer in a direction along the direction of propagation of the energy beam; and the size of the beam spot formed by the energy beam on the first molding layer or on the molding material supplied to the first molding layer.

27. A method for fabricating an object according to any one of claims 1 to 26, comprising: fabricating a first partial fabrication layer which is part of the second fabrication layer by irradiating the fabrication material with the energy beam while at least one of the first fabrication layer and the energy beam is moving; moving at least one of the first fabrication layer and the energy beam along a direction intersecting the direction of propagation of the energy beam to move the irradiation position of the energy beam irradiated onto the first fabrication layer or the fabrication material supplied to the first fabrication layer; and after the relative movement of the irradiation position of the energy beam, irradiating the fabrication material with the energy beam to fabricate a second partial fabrication layer which is part of the second fabrication layer and has an overlapping region that overlaps with the first partial fabrication layer, wherein in fabricating the second partial fabrication layer, the overlapping region is fabricated such that it occupies 40% or more and 60% or less of the size of the beam spot of the first partial fabrication layer.

28. The fabrication method according to claim 26, wherein fabricating the second partial fabrication layer includes irradiating a part of the first partial fabrication layer with the energy beam to melt a specific region of the first partial fabrication layer in which cracks occurred when the first partial fabrication layer was fabricated.

29. A molding method according to any one of claims 1 to 28, wherein forming the molded object includes forming the second molded layer by irradiating the first molded layer or the molding material supplied onto the first molded layer with the energy beam, and forming the third molded layer by irradiating the second molded layer or the molding material supplied onto the second molded layer with the energy beam, thereby irradiating the surface of the second molded layer with the energy beam, and further comprising forming the third molded layer by forming the molten pool such that, in the direction of incidence of the energy beam, the ratio of the depth to which the molten pool formed for forming the third molded layer enters the second molded layer to the thickness of the second molded layer is 47% or more.

30. The fabrication method according to claim 29, wherein fabricating the third fabrication layer is further comprising forming the molten pool such that, in the direction of incidence of the energy beam, the ratio of the depth to which the molten pool formed for fabricating the third fabrication layer penetrates the second fabrication layer to the thickness of the second fabrication layer is 160% or less.

31. A molding method comprising: supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer formed by a molding device; and irradiating the molding material with an energy beam to form a second molding layer on the first molding layer, thereby forming a molded object including the first molding layer and the second molding layer, wherein forming the molded object includes adjusting the output of the energy beam emitted by the beam source within a range of 50 W or more and 300 W or less, and adjusting the relative movement speed of the energy beam with respect to the first molding layer in a direction intersecting the direction of propagation of the energy beam within a range of 1 mm / second or more and 30 mm / second.

32. The fabrication method according to claim 31, comprising adjusting the output of the energy beam emitted by the beam source to a range of 100 W or more and 200 W or less, and adjusting the relative movement speed of the energy beam with respect to the first fabrication layer in a direction intersecting the direction of propagation of the energy beam to a range of 5 mm / second or more and 15 mm / second.

33. The fabrication method according to claim 31 or 32, wherein fabrication of the fabricated object is further comprising adjusting the output of the energy beam and the relative movement speed of the energy beam so that the energy density of the energy beam is 70 or less, by irradiating the fabrication material with the energy beam.

34. A fabrication method comprising: accepting input of specification information for specifying fabrication conditions for fabricating a fabricated object; displaying information regarding the energy density of an energy beam calculated based on the input specification information; supplying a fabrication material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first fabrication layer which is part of the fabricated object; and irradiating the fabrication material with the energy beam in such a way as to satisfy the fabrication conditions indicated by the input specification information, thereby fabricating a second fabrication layer on the first fabrication layer and fabricating the fabricated object.

35. A fabrication method comprising: receiving input of specification information for specifying the energy density of an energy beam; setting fabrication conditions for fabricating a fabricated object that can realize the energy density indicated by the input specification information; supplying a fabrication material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first fabrication layer which is part of the fabricated object; and irradiating the fabrication material with the energy beam in a manner that satisfies the set fabrication conditions, thereby fabricating a second fabrication layer which is part of the fabricated object on the first fabrication layer.

36. A molding apparatus comprising a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molded layer, and an irradiation optical system capable of emitting an energy beam; and a control device that controls the molding apparatus to irradiate the molding material with the energy beam to form a second molding layer, which is part of the molded object, on the first molding layer, thereby forming a molded object including the first and second molding layers, wherein the control device has an energy density of 70 (J / mm²). ２ A molding system that controls the molding apparatus to irradiate the molding material with the energy beam having the following characteristics:

37. A molding apparatus comprising: a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a formed first molding layer; and an irradiation optical system capable of emitting an energy beam; a control device that controls the molding apparatus to irradiate the molding material with the energy beam to form a second molding layer, which is part of the molded object, on the first molding layer, thereby forming a molded object including the first and second molding layers; and a heat treatment apparatus that performs heat treatment on the molded object, wherein the control device has an energy density of 60 (J / mm²). ２ A system for controlling the molding apparatus to irradiate the molding material with the energy beam having the following characteristics:

38. A molding apparatus comprising a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molded layer formed by a molding apparatus, and an irradiation optical system capable of emitting an energy beam, and a control device that controls the molding apparatus to form a second molded layer on the first molded layer by irradiating the molding material with the energy beam, wherein the control device adjusts the output of the energy beam emitted by the beam source within a range of 50 W or more and 300 W or less, and adjusts the relative movement speed of the energy beam with respect to the first molded layer in a direction along the direction of propagation of the energy beam within a range of 1 mm / s or more and 30 mm / s.

39. A molding apparatus comprising: a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer which is part of a molded object; and an irradiation optical system capable of emitting an energy beam; and a control device that controls the molding apparatus to mold a second molding layer which is part of a molded object on the first molding layer by irradiating the molding material with the energy beam, wherein the control device receives input of specification information for specifying molding conditions for molding the molded object; controls a display device to display information regarding the energy density of the energy beam calculated based on the input specification information; and controls the molding apparatus to mold the molded object by irradiating the energy beam to satisfy the molding conditions indicated by the input specification information.

40. A molding apparatus comprising a material supply member capable of supplying a molding material containing nickel, chromium, and cobalt, and further containing a total of 4.5% or more by mass of aluminum and titanium, to at least a portion of a first molding layer which is part of a molded object, and an irradiation optical system capable of emitting an energy beam; and a control device that controls the molding apparatus to form a second molding layer which is part of the molded object on the first molding layer by irradiating the molding material with the energy beam, wherein the control device receives input of specification information for specifying the energy density of the energy beam, sets molding conditions for forming the molded object which are capable of realizing the energy density indicated by the input specification information, and controls the molding apparatus to form the molded object by irradiating the energy beam which is capable of satisfying the set molding conditions.

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