Groove machining method, laser machining apparatus, control device, and program

Abstract

According to the present invention, a groove machining method executed by a control device of a laser machining apparatus comprises controlling a rotation device configured to tilt a nozzle about a tilting axis so as to tilt the nozzle to an instructed rotation angle, and controlling a second movement device configured to move the nozzle in a second direction perpendicular to a first direction such that, when the nozzle is tilted to the instructed rotation angle, a separation distance between the nozzle and a long material in the second direction is a predetermined target separation distance. The method further comprises obtaining an observation position of a machining point in a machine coordinate system of the laser machining apparatus on the basis of a position of the nozzle in the machine coordinate system, the rotation angle of the nozzle about the tilting axis, and the separation distance, when the nozzle is moved by the second movement device.

Description

Beveling method, laser processing machine, control device, and program

[0001] This specification relates to a beveling method, a laser processing machine, a control device, and a program.

[0002] Patent Document 1 discloses a technique for beveling long materials such as pipes by tilting a gas cutting torch. It is also known that such long materials can be processed by a laser processing machine (for example, Patent Document 2), and even when beveling is performed with a laser processing machine, it is necessary to tilt the nozzle that emits the laser. However, when tilting the nozzle in this way, it is necessary to prevent the nozzle from interfering with the workpiece and to control it so that the processing point does not change even when tilted. Such control is called tracing control. Patent Documents 3 and 4 disclose examples of tracing control when the workpiece is a plate-shaped member.

[0003] Japanese Patent Publication No. 2014-085743, Japanese Patent No. 7116817, Japanese Patent Publication No. 2004-174586, Japanese Patent Publication No. 2005-081434

[0004] In a typical laser processing machine like the one shown in Patent Document 2, the longitudinal movement of a long material is performed by a feed device. Therefore, in order to perform tracing control, the workpiece must be moved and controlled so that the processing point does not change, as in the example in Patent Document 3. However, in laser processing machines that process long materials, when the long material is fed during tracing control, the workpiece vibrates compared to the example in Patent Document 3. This vibration can lead to a decrease in the processing accuracy of beveling, depending on the processing program.

[0005] The problem that the technology disclosed in this application has to solve is to improve the processing accuracy of beveling in a laser processing machine that processes long materials.

[0006] A beveling method according to a first aspect of the present disclosure is performed by a control device of a laser processing machine. The method includes receiving commands to specify the position of a laser processing point on a long material extending in a first direction and the specified rotation angle of the nozzle of the laser processing machine around the tilt axis when processing the processing point, and controlling a feed device configured to move the long material in the first direction according to the specified position. The method further includes controlling a rotating device configured to tilt the nozzle around the tilt axis to tilt the nozzle to the specified rotation angle, and controlling a second moving device configured to move the nozzle in a second direction such that when the nozzle is tilted to the specified rotation angle, the separation distance between the nozzle and the long material in a second direction perpendicular to the first direction becomes a predetermined target separation distance. The method further includes, when moving the nozzle by the second moving device, determining the observed position of the processing point in the machine coordinate system based on the position of the nozzle in the machine coordinate system of the laser processing machine, the rotation angle around the tilt axis of the nozzle, and the separation distance, and controlling the first moving device, which is configured to move the nozzle in a first direction, so that the observed position approaches a target position, which is a position corresponding to the indicated position in the machine coordinate system.

[0007] A beveling method according to a second aspect of the present disclosure is performed by a control device of a laser processing machine. The method includes receiving commands to specify the position of a laser processing point on a long material extending in a first direction and the specified rotation angle of the nozzle of the laser processing machine around the tilt axis when processing the processing point, and controlling a feed device configured to move the long material in the first direction according to the specified position. The method further includes controlling a rotating device configured to tilt the nozzle around the tilt axis to tilt the nozzle to the specified rotation angle, and controlling a second moving device configured to move the nozzle in the second direction such that when the nozzle is tilted to the specified rotation angle, the separation distance between the nozzle and the long material in the second direction perpendicular to the first direction becomes a predetermined target separation distance. The method further includes, when moving the nozzle by the second moving device, determining the observed position of the processing point in the machine coordinate system based on the position of the nozzle in the machine coordinate system of the laser processing machine, the rotation angle of the nozzle around the tilt axis, and the distance between them, and selectively controlling the first moving device and the feed device configured to move the nozzle in a first direction so that the observed position approaches a target position which corresponds to the indicated position in the machine coordinate system.

[0008] According to a third aspect of this disclosure, a laser processing machine is provided with means for performing a beveling method according to the first or second aspect. According to a fourth aspect of this disclosure, a program is provided with instructions for the control device of the laser processing machine to perform a beveling method according to the first or second aspect when the control device is running the program. According to a fifth aspect of this disclosure, a control device is provided with means for performing a beveling method according to the first or second aspect.

[0009] According to the sixth aspect of this embodiment, the beveling method according to the first or second aspect includes controlling the feed device to cause the long material to protrude from the chuck, in a configuration where the portion of the long material opposite to the feed device is not supported by the laser processing machine, with respect to the chuck configured to guide the movement of the long material in a first direction between the nozzle and the feed device, before receiving a command. According to the seventh aspect of this embodiment, the laser processing machine is equipped with means for executing the beveling method according to the sixth aspect. According to the eighth aspect of this embodiment, the program includes an instruction to the control device to execute the beveling method according to the sixth aspect when the control device of the laser processing machine is executed. According to the ninth aspect of this embodiment, the control device is equipped with means for executing the beveling method according to the sixth aspect.

[0010] According to the tenth aspect of this embodiment, in the beveling method according to any of the first, second, and sixth aspects, controlling the feed device according to the indicated position includes controlling the feed device according to the displacement of the indicated position in a first direction between the command immediately preceding the command including the indicated position and the command in question. According to the eleventh aspect of this embodiment, it is a laser processing machine equipped with means for executing the beveling method according to the tenth aspect. According to the twelfth aspect of this embodiment, it is a program that, when executed by the control device of the laser processing machine, includes an instruction to cause the control device to execute the beveling method according to the tenth aspect. According to the thirteenth aspect of this embodiment, it is a control device equipped with means for executing the beveling method according to the tenth aspect.

[0011] According to the 14th aspect of this embodiment, in the beveling method according to any of the 1st, 2nd, 6th, and 10th aspects, controlling the feed device according to the indicated position includes determining the target position according to the indicated rotation angle and controlling the feed device according to the target position. According to the 15th aspect of this embodiment, this is a laser processing machine equipped with means for executing the beveling method according to the 14th aspect. According to the 16th aspect of this embodiment, this is a program that, when executed by the control device of the laser processing machine, includes an instruction to cause the control device to execute the beveling method according to the 10th aspect. According to the 17th aspect of this embodiment, this is a control device equipped with means for executing the beveling method according to the 10th aspect.

[0012] According to the 18th aspect of the present embodiment, in the grooving method according to the 14th aspect of the present embodiment, controlling the feeding device according to the target position includes determining the target position of the immediately preceding command from the immediately preceding command of the command including the instruction position and the instruction rotation angle according to the instruction rotation angle of the immediately preceding command, and controlling the feeding device according to the displacement in the first direction of the instruction position between the immediately preceding command and the command and the displacement in the first direction of the target position between the immediately preceding command and the command. According to the 19th aspect of the present embodiment, a laser processing machine includes means for executing the grooving method according to the 18th aspect. According to the 20th aspect of the present embodiment, a program includes an instruction for causing the control device of the laser processing machine to execute the grooving method according to the 18th aspect when executed by the control device. According to the 21st aspect of the present embodiment, a control device includes means for executing the grooving method according to the 18th aspect.

[0013] According to the 22nd aspect of the present embodiment, in the grooving method according to any one of the 2nd aspect, or the 6th aspect, the 10th aspect, the 14th aspect, and the 18th aspect including the grooving method according to the 2nd aspect, selectively controlling the first moving device and the feeding device includes controlling the feeding device to move the long material in the first direction so that the observation position approaches the target position when the instruction rotation angle is within a first range indicating that the angle at which the tip of the nozzle is tilted from the downward direction of the laser processing machine toward the feeding device is greater than a predetermined angle, and controlling the first moving device to move the nozzle in the first direction so that the observation position approaches the target position when the instruction rotation angle is not within the first range. According to the 23rd aspect of the present embodiment, a laser processing machine includes means for executing the grooving method according to the 22nd aspect. According to the 24th aspect of the present embodiment, a program includes an instruction for causing the control device of the laser processing machine to execute the grooving method according to the 22nd aspect when executed by the control device. According to the 25th aspect of the present embodiment, a control device includes means for executing the grooving method according to the 22nd aspect.

[0014] According to the 26th aspect of the present embodiment, in the groove machining method according to the 22nd aspect, controlling the feed device according to the instructed position means that when the instructed rotation angle is within the first range, among the positions of the nozzle movable by the first moving device, the farthest position of the nozzle with respect to the feed device is set as the position of the nozzle in the machine coordinate system, and the target position is determined based on the instructed rotation angle, the target separation distance, and the length of the nozzle. According to the 27th aspect of the present embodiment, there is a laser processing machine including means for executing the groove machining method according to the 26th aspect. According to the 28th aspect of the present embodiment, there is a program including an instruction for causing the control device of the laser processing machine to execute the groove machining method according to the 26th aspect when the program is executed by the control device. According to the 29th aspect of the present embodiment, there is a control device including means for executing the groove machining method according to the 26th aspect.

[0015] In the groove machining method according to the 1st aspect or the 2nd aspect, the laser processing machine according to the 3rd aspect including means for executing the groove machining method according to the 1st aspect or the 2nd aspect, the program according to the 4th aspect including an instruction for causing the groove machining method according to the 1st aspect or the 2nd aspect to be executed, and the control device according to the 5th aspect including means for executing the groove machining method according to the 1st aspect or the 2nd aspect, when moving the nozzle by the second moving device so that the separation distance becomes a predetermined target separation distance, the observed position of the machining point in the machine coordinate system is obtained based on the position of the nozzle in the machine coordinate system of the laser processing machine, the rotation angle around the tilting axis of the nozzle, and the separation distance, and the first moving device configured to move the nozzle in the first direction is controlled so that the observed position approaches the target position corresponding to the instructed position in the machine coordinate system.

[0016] In laser processing machines that process long materials, the observation position is prone to fluctuations in the tracing control due to vibrations of the long material caused by its movement by the feed device. Nevertheless, if the control is performed to further move the long material with the feed device so that the observation position approaches the target position, mechanical vibrations are generated by the feed device. The inventors of this invention have discovered that this mechanical vibration, which makes the processing point prone to shifting from the target position, is the main cause of the decrease in processing accuracy of beveling. In the beveling method according to the first and second embodiments, the device that moves the long material so that the observation position approaches the target position can be a first moving device configured to move the nozzle in a first direction, thereby suppressing the mechanical vibrations and improving the processing accuracy of beveling.

[0017] A beveling method according to a second embodiment, a laser processing machine according to a third embodiment equipped with means for executing the beveling method according to the second embodiment, a program according to a fourth embodiment equipped with instructions for executing the beveling method according to the second embodiment, and a control device according to a fifth embodiment equipped with means for executing the beveling method according to the second embodiment can improve the processing accuracy of beveling by executing the beveling method according to the first embodiment when tracing control at an indicated rotation angle can be achieved within the movable range of the first moving device, and when tracing control at an indicated rotation angle cannot be achieved within the movable range of the first moving device, it can improve the processing accuracy of beveling as much as possible even if there are mechanical limitations of the first moving device by executing tracing control with a feed device.

[0018] The beveling method according to the sixth aspect of this embodiment, the laser processing machine according to the seventh aspect, the program according to the eighth aspect, and the control device according to the ninth aspect can greatly improve the processing accuracy of beveling by performing tracing control with the first moving device, because the vibration of the long material becomes large due to the long material being supported in a cantilevered manner.

[0019] The beveling method according to the 10th aspect of this embodiment, the laser processing machine according to the 11th aspect, the program according to the 12th aspect, and the control device according to the 13th aspect enable the feeding device 20 to feed long materials without excess or deficiency by controlling the feeding device according to the displacement of the indicated position in the first direction.

[0020] The beveling method according to the 14th aspect of this embodiment, the laser processing machine according to the 15th aspect, the program according to the 16th aspect, and the control device according to the 17th aspect can improve the processing accuracy of beveling by changing the target position according to the indicated rotation angle, even when it is not possible to control the target position to the same target position at all indicated rotation angles due to limitations in the movable range of the first moving device 17.

[0021] The beveling method according to the 18th aspect of this embodiment, the laser processing machine according to the 19th aspect, the program according to the 20th aspect, and the control device according to the 21st aspect can feed long materials by the feeding device without excess or deficiency, even when the target position is changed according to the indicated rotation angle.

[0022] The beveling method according to the 22nd aspect of this embodiment, the laser processing machine according to the 23rd aspect, the program according to the 24th aspect, and the control device according to the 25th aspect can reduce the risk of the nozzle tip contacting the chuck during tracing control by not performing tracing control using the first moving device when the indicated rotation angle is greater than the threshold angle in the laser processing machine 1 in which the movable range of the first moving device is limited.

[0023] The beveling method according to the 26th aspect of this embodiment, the laser processing machine according to the 27th aspect, the program according to the 28th aspect, and the control device according to the 29th aspect can further reduce the risk of the nozzle tip contacting the chuck in tracing control that utilizes the feed device when the indicated rotation angle is greater than the threshold angle in a laser processing machine in which the movable range of the first moving device is limited.

[0024] Figure 1 is a diagram showing the external configuration of a laser processing machine according to an embodiment. Figure 2 is a diagram showing the schematic configuration around the saddle according to an embodiment. Figure 3 is a configuration diagram showing the internal configuration of the control device and peripheral equipment electrically connected to the control device. Figure 4 is a flowchart showing the processing flow of the beveling method according to the first and second embodiments. Figure 5 is an example of program code for a processing program. Figure 6 is a diagram showing the tracing control method according to the first embodiment. Figure 7 is a flowchart showing the detailed processing flow of step S4 in Figure 4 according to the first embodiment. Figure 8 is a diagram for explaining the conditions for coordinate values ​​representing the range of motion of the u-axis and the target position of the processing point in the coordinate system of the U-axis according to the first embodiment. Figure 9 is a flowchart showing the detailed processing flow of step S4 in Figure 4 according to the second embodiment. Figure 10 is a diagram showing the tracing control method according to the second embodiment. Figure 11 is a flowchart showing the detailed processing flow of step S44 in Figure 9 according to the second embodiment. Figure 12 is a diagram for explaining the conditions for the range of motion of the u-axis according to the second embodiment. Figure 13 is a diagram showing the tracing control method according to the third embodiment. Figure 14 is a flowchart showing the processing flow of the beveling method according to the third embodiment. Figure 15 is a flowchart showing the detailed processing flow of step S4A in Figure 14 according to the third embodiment. Figure 16 is a flowchart showing the detailed processing flow of step S43A in Figure 15 according to the third embodiment. Figure 17 is a flowchart showing the detailed processing flow of step S44A in Figure 15 according to the third embodiment. Figure 18 is a flowchart showing the detailed processing flow of step S8A in Figure 14 according to the third embodiment.

[0025] The present invention will now be described in detail based on the drawings illustrating its embodiments. In the figures, the same reference numerals indicate corresponding or substantially identical components. <First Embodiment> <Configuration of Laser Processing Machine 1> Figure 1 shows an external configuration diagram of a laser processing machine 1 according to an embodiment of the present invention. The laser processing machine 1 comprises a base 10, a column 11, a chuck 12, a nozzle 14, a rotating device 15, a saddle 16, a first moving device 17, a second moving device 18, a third moving device 19, a feeder 20, a spindle 22, an additional chuck 24, a steady rest 26, a workpiece support member 28, and a machine control unit (MCU) 30. The chuck 12 is configured to grip the workpiece W so that the workpiece W can rotate around the rotation axis Ax. The laser processing machine 1 may further include one or more chucks between the chuck 12 and the additional chuck 24. In that case, chuck 12 is the chuck closest to the nozzle 14 among a plurality of chucks configured to grip the workpiece W so that the workpiece W can rotate around the rotation axis Ax. In other words, chuck 12 is the chuck closest to the nozzle 14 among at least one chuck configured to grip the workpiece W so that the workpiece W can rotate around the rotation axis Ax.

[0026] The workpiece W is a long material and includes, for example, round pipes, square pipes, round bars, square bars, angle steel, channel steel, rail steel, joist steel, and etched steel. The cross-section of square pipes and square bars is preferably square, but any polygonal shape is acceptable. The workpiece W is also gripped by an additional chuck 24 provided on the spindle 22. The spindle 22 is configured to rotate around the rotation axis Ax with the workpiece W, with one end of the workpiece W attached via the additional chuck 24. In other words, the additional chuck 24 is configured to rotate around the rotation axis Ax with the spindle 22. The workpiece W has a rear end face RS that is mounted on the chuck (additional chuck 24) of the laser processing machine 1 and a first direction D of the pipe along the rotation axis Ax. Ｌ It has a front end face FS opposite to it. In other words, the workpiece W (long material) is in the first direction D ＬIt extends to [location].

[0027] The feed device 20 supports the spindle 22 so as to be rotatable around the rotation axis Ax. The feed device 20 is provided at one end of the base 10. The feed device 20 is guided by a rail (not shown) provided on the base 10 and moves in the axial direction Dx (first direction D) along the rotation axis Ax. Ｌ The feed device 20 is a linear actuator comprising, for example, a fourth motor 20m and a fourth rotation-to-linear conversion mechanism 20c. The fourth rotation-to-linear conversion mechanism 20c includes mechanisms such as a rack and pinion, a ball screw, a slider-crank mechanism, and a cam mechanism. The spindle 22 and the additional chuck 24 are movable in the axial direction Dx together with the feed device 20. The stabilizer 26 is configured to support the workpiece W so that it can rotate around the rotation axis Ax between the chuck 12 and the additional chuck 24 in the axial direction Dx. In subsequent embodiments, the axis of the machine coordinate system of the laser processing machine 1, represented by the amount of rotation (°) around the rotation axis Ax by which the spindle 22 rotates the workpiece W, is referred to as the C axis. The feed device 20, the spindle 22, the additional chuck 24, and the stabilizer 26 are provided on the second side S2 opposite to the first side S1 shown with respect to the chuck 12. Note that the laser processing machine 1 does not necessarily have to include the vibration damper 26.

[0028] The workpiece W is gripped by the chuck 12 so as to pass through it. The feed device 20 moves in the forward direction Df from the feed device 20 toward the chuck 12 within the axial direction Dx, so that the workpiece W is pushed out of the chuck 12 in the forward direction Df. In other words, the feed device 20 moves the workpiece W (long material) in the first direction D Ｌ The chuck 12 is configured to move the workpiece W (long material) in the first direction D between the nozzle 14 and the feeding device 20. ＬIt is configured to guide the movement thereto. In the following embodiments, the axis of the machine coordinate system of the laser processing machine 1 in which the feeding device 20 moves is referred to as the X-axis. When the workpiece W is rotated by the spindle 22, the processing surface of the workpiece W protruding from the chuck 12 is directed toward the nozzle 14. The nozzle 14 is provided on the first side S1 opposite to the additional chuck 24 with respect to the chuck 12 in the axial direction Dx, and is configured to manufacture a product by processing the workpiece W with laser light. The nozzle 14 can be inclined in a direction inclined from the downward Dd of the laser processing machine 1 toward the axial direction Dx, as indicated by the B-axis in FIG. 1. Note that the downward Dd of the laser processing machine 1 is a direction substantially coinciding with the direction of gravity or a direction substantially perpendicular to the placement floor of the laser processing machine 1. Further, the nozzle 14 may be inclined in a direction inclined from the downward Dd toward the third direction Dw perpendicular to both the axial direction Dx and the downward Dd. [[ID=!]]

[0029] The rotating device 15 is configured to tilt the nozzle 14 around the tilting axis A represented by the Y-axis perpendicular to the X-axis of the machine coordinate system. Ｙ The rotating device 15 is, for example, a motor. The rotating device 15 may be referred to as a rotary actuator. The saddle 16 supports the nozzle 14 so as to be rotatable around the tilting axis A. Ｙ In the following embodiments, the axis of the machine coordinate system of the laser processing machine 1 represented by the amount of rotation (°) around the tilting axis A by which the rotating device 15 rotates the nozzle 14 is referred to as the B-axis. As shown in the upper figure of FIG. 1, the value of the B-axis is set such that the downward Dd of the laser processing machine 1 is 0, the angle formed in the direction opposite to the chuck 12 from the downward Dd is a positive value, and the angle formed in the direction toward the chuck 12 from the downward Dd is a negative value. The saddle 16 supports the rotating device 15. The saddle 16 instructs the nozzle 14 to be movable in the first direction D Ｙ and the second direction Dh. The second direction Dh is the first direction D Ｌ and the second direction Dh. The second direction Dh is the first direction D ＬThis refers to a bilateral direction perpendicular to the laser processing machine 1, either pointing downward Dd or upward Du. Column 11 supports the saddle 16 so that it can move in the third direction Dw.

[0030] Figure 2 is a diagram showing the schematic configuration around the saddle 16 according to the embodiment. Referring to Figures 1 and 2, the first moving device 17 is provided on the saddle 16 and moves the nozzle 14 in the first direction D Ｌ The first moving device 17 is configured to move the nozzle 14 in a second direction Dh. The second moving device 18 is provided on the saddle 16 and is configured to move the nozzle 14 in a second direction Dh. The third moving device 19 is provided on the column 11 or the saddle 16 and is configured to move the nozzle 14 in a third direction Dw. The first moving device 17 comprises a first motor 17m and a first rotation-to-linear conversion mechanism 17c configured to convert the rotational motion of the first motor 17m into linear motion. The first rotation-to-linear conversion mechanism 17c includes mechanisms such as a rack and pinion, a ball screw, a slider-crank mechanism, and a cam mechanism. The first moving device 17 may also be called a first linear actuator. In the following embodiments, the axis of the machine coordinate system of the laser processing machine 1 on which the first moving device 17 moves the nozzle 14 is called the U-axis.

[0031] The second moving device 18 comprises a second motor 18m and a second rotation-to-linear conversion mechanism 18c configured to convert the rotational motion of the second motor 18m into linear motion. The second rotation-to-linear conversion mechanism 18c includes mechanisms such as a rack and pinion, a ball screw, a slider-crank mechanism, and a cam mechanism. In subsequent embodiments, the axis of the machine coordinate system of the laser processing machine 1 on which the second moving device 18 moves the nozzle 14 is referred to as the Z-axis. The second moving device 18 may also be referred to as a second linear actuator. The third moving device 19 comprises a third motor 19m and a third rotation-to-linear conversion mechanism 19c configured to convert the rotational motion of the third motor 19m into linear motion. The third rotation-to-linear conversion mechanism 19c includes mechanisms such as a rack and pinion, a ball screw, a slider-crank mechanism, and a cam mechanism. The third moving device 19 may also be referred to as a third linear actuator. In subsequent embodiments, the axis of the machine coordinate system of the laser processing machine 1 on which the third moving device 19 moves the nozzle 14 is referred to as the Y-axis.

[0032] Referring to the enlarged cross-sectional view of the nozzle 14 on the left side of Figure 2, the laser processing machine 1 further includes a distance sensor 13 configured to detect the distance Ld between the nozzle 14 and the workpiece W (long material). In this enlarged cross-sectional view, the distance sensor 13 is shown with hatching. The distance sensor 13 is, for example, a capacitive sensor. The distance sensor 13 is electrically insulated from the nozzle 14 and is positioned to surround the nozzle 14.

[0033] The workpiece support member 28 is provided on the first side S1. The workpiece support member 28 is preferably a roller. The workpiece support member 28 rotates counterclockwise in Figure 1, enabling the product processed by the nozzle 14 to be discharged in the forward direction Df. However, the workpiece support member 28 may be a plate-shaped member. <Configuration of the control device 30 and operation of the program installed in the control device 30> Figure 3 is a configuration diagram showing the internal configuration of the control device 30 and peripheral devices electrically connected to the control device 30. The control device (Machine Control Unit) 30 is a computer that controls the operation of the laser processing machine 1. The control device 30 includes a monitor 31, input devices 32, a first input / output interface 33, at least one processor 34, memory 35, system bus 36, and a second input / output interface 37. Each of the at least one processor 34 is a hardware processor and may include, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or an FPGA (Field-Programmable Gate Array). The first input / output interface 33, at least one processor 34, memory 35, system bus 36, and second input / output interface 37 are an example of an electrical circuit 30C. The system bus 36 electrically connects the at least one processor 34, memory 35, first input / output interface 33, and second input / output interface 37 in a manner that enables them to send and receive data and commands to and from each other.

[0034] The first input / output interface 33 is an interface for connecting the monitor 31 and input device 32 to the processor 34, and includes, for example, a video card and various serial / parallel communication interfaces. The second input / output interface 37 refers to an interface for sending signals to the drivers of actuators such as the rotating device 15, the first moving device 17, the second moving device 18, and the third moving device 19, and the laser oscillator, and for receiving signals related to the separation distance Ld transmitted by the distance sensor 13 to the control device 30, and includes, for example, various serial / parallel communication interfaces. The actuators mentioned above refer to, for example, motors that move the chuck 12, nozzle 14, feed device 20, spindle 22, additional chuck 24, and workpiece support member 28. The laser oscillator mentioned above is configured to output a laser to the nozzle 14.

[0035] The monitor 31 is typically located on the control panel of the control device 30. The input device 32 typically includes keys and buttons located on the control panel of the control device 30. Furthermore, if the monitor 31 has a touch panel, the input device 32 also includes the touch panel. However, the monitor 31 and input device 32 are not limited to the examples described above and may be any monitor and input device connected to the control device 30 via the processor 34.

[0036] The laser processing machine 1 further comprises an angle detector 15S, a first position detector 17S, a second position detector 18S, a third position detector 19S, and a fourth position detector 40S. The angle detector 15S controls the tilt axis A Ｙ It is configured to detect the rotation angle of the surrounding nozzles 14 and transmit it to the control device 30. The angle detector 15S is one of the following: a servo driver for the motor of the rotating device 15, an encoder configured to detect the rotation angle of the motor of the rotating device 15, or a resolver configured to detect the rotation angle of the motor of the rotating device 15. Figure 3 shows the rotating device 15 and the angle detector 15S in separate blocks, but if the angle detector 15S is the servo driver for the motor of the rotating device 15, the rotating device 15 and the angle detector 15S may be substantially the same servo driver.

[0037] The first position detector 17S, the second position detector 18S, and the third position detector 19S are configured to detect the position of the nozzle 14 in a mechanical coordinate system and transmit it to the control device 30. Specifically, the first position detector 17S is configured to detect the U coordinate position of the nozzle 14. The second position detector 18S is configured to detect the Z coordinate position of the nozzle 14. The third position detector 19S is configured to detect the Y coordinate position of the nozzle 14.

[0038] The first position detector 17S is one of the following: a servo driver for the first motor 17m, an encoder configured to detect the rotation angle of the first motor 17m, or a resolver configured to detect the rotation angle of the first motor 17m. The second position detector 18S is one of the following: a servo driver for the second motor 18m, an encoder configured to detect the rotation angle of the second motor 18m, or a resolver configured to detect the rotation angle of the second motor 18m. The third position detector 19S is one of the following: a servo driver for the third motor 19m, an encoder configured to detect the rotation angle of the third motor 19m, or a resolver configured to detect the rotation angle of the third motor 19m.

[0039] Figure 3 shows the first moving device 17 and the first position detector 17S in separate blocks, but if the first position detector 17S is a servo driver for the first motor 17m, then the first moving device 17 and the first position detector 17S may be substantially the same servo driver. Figure 3 shows the second moving device 18 and the second position detector 18S in separate blocks, but if the second position detector 18S is a servo driver for the second motor 18m, then the second moving device 18 and the second position detector 18S may be substantially the same servo driver. Figure 3 shows the third moving device 19 and the third position detector 19S in separate blocks, but if the third position detector 19S is a servo driver for the third motor 19m, then the third moving device 19 and the third position detector 19S may be substantially the same servo driver.

[0040] The fourth position detector 20S is configured to detect the position of the feeder 20 in a mechanical coordinate system and transmit it to the control device 30. Specifically, the fourth position detector 20S is configured to detect the X-coordinate position of the feeder 20. The fourth position detector 20S is either a servo driver for the fourth motor 20m, an encoder configured to detect the rotation angle of the fourth motor 20m, or a resolver configured to detect the rotation angle of the fourth motor 20m. Figure 3 shows the feeder 20 and the fourth position detector 20S in separate blocks, but if the fourth position detector 20S is the servo driver for the fourth motor 20m, the feeder 20 and the fourth position detector 20S may be substantially the same servo driver.

[0041] Memory 35 stores the beveling control program 5, correspondence data 6, machining point data 7, and machining program 9. Memory 35 may also be called a storage device. Correspondence data 6 is data representing the correspondence between the output of the distance sensor 13, which is a capacitive sensor, and the output of the angle detector 15S, representing the separation distance Ld. The correspondence between the output of the distance sensor 13, which is a capacitive sensor, and the separation distance Ld differs depending on the rotation angle of the nozzle 14 and cannot be determined analytically. Therefore, correspondence data 6 is used to find an approximate solution of the separation distance Ld from the output of the distance sensor 13 and the output of the angle detector 15S based on this correspondence. In other words, memory 35 stores the correspondence representing the separation distance Ld, which corresponds to the output of the distance sensor 13, which is a capacitive sensor, and the output of the angle detector 15S. When the beveling control program 5 is executed by at least one processor 34, it includes an instruction to refer to this correspondence and detect the separation distance Ld from the output of the distance sensor 13, which is a capacitive sensor, and the output of the angle detector 15S. This allows at least one processor 34 to determine the separation distance Ld from the output of the distance sensor 13, which is a capacitance sensor, and the output of the angle detector 15S when executing the beveling control program 5.

[0042] The machining point data 7 stores the target position Pt of the machining point Pp. Details of the machining point data 7 will be described later. The machining program 9 is written, for example, in EIA / ISO program code and includes code that defines a toolpath for performing beveling on the workpiece W (long material). The beveling control program 5 has a software library for generating various signals output via the second input / output interface 37 in order to control the actuators and laser oscillators described above, based on the EIA / ISO program code written in the machining program 9. In other words, the memory 35 includes instructions to cause the control device 30 to execute the beveling process defined by the beveling control program 5 when executed by at least one processor 34. <Beveling process executed by the beveling control program> The processing of the beveling process defined by the beveling control program 5 will be described below. Figure 4 is a flowchart showing the processing flow of the beveling method according to the first and second embodiments. Figure 5 shows an example of the program code of the machining program 9. In Figure 5, the description of processing that is not specific to the present invention is omitted. At least one processor 34 that executes the beveling process of the processing program 9 reads, as a preprocessing step, a code that sets the parameters for tracing control in beveling, as shown in (Process 1) of the processing program 9. The code in (Process 1) is generally an M code that can be freely determined by the manufacturer of the laser processing machine 1. Details of these parameters will be described later.

[0043] Next, in step S1 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 reads the code shown in (process 2) of Figure 5 and controls the feed device 20 to make the workpiece W (long material) protrude from the chuck 12. The feed amount defined by the code in (process 2) can be arbitrarily determined depending on the size of the product and the programmer's preference. However, the feed amount is often defined so that the workpiece W (long material) protrudes from the chuck 12 in an arrangement where the part of the workpiece W (long material) opposite the feed device 20 to the chuck 12 is not supported by the laser processing machine 1 (workpiece support member 28). The feed amount of the workpiece W (long material) by the feed device 20 in the subsequent step S4 is generally smaller than the feed amount in step S1. Therefore, if, in step S1, the workpiece W (long material) protrudes from the chuck 12 in a configuration where the portion of the workpiece W (long material) opposite to the feed device 20 is not supported by the laser processing machine 1 (workpiece support member 28), the workpiece W (long material) will be cantilevered, which is likely to cause vibration during subsequent tracing.

[0044] Next, in step S2 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 determines whether or not it has received a trace control start command to set trace control in beveling, as shown in (process 3) of Figure 5. From step S2 until it receives a trace control end command to cancel the trace control setting in beveling, as shown in (process 5) of Figure 5 in step S9 of Figure 4, which will be described later, at least one processor 34 that executes the beveling process of the machining program 9 will execute trace control by the first moving device 17 along the U axis based on the X axis and B axis settings, even if U axis movement is not set in the program code. At other points, the at least one processor 34 will not execute the nozzle 14 movement process by the first moving device 17 unless U axis movement is set in the program code. Note that the trace control start command and trace control end command described above are generally M codes that can be freely determined by the manufacturer of the laser processing machine 1.

[0045] Next, in step S3 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 receives a command Ci to execute the beveling process and the tracing control process shown in (process 4) of Figure 5. This command Ci includes the X, Y, Z, B, and C coordinates on the toolpath. The coordinate position defined by the X, Y, and Z coordinates specified in this command Ci is called the indicated position Pi of the laser machining point Pp of the workpiece W (long material). The tilt axis A of the nozzle 14 is defined by the B coordinate specified in this command Ci. Ｙ The rotation angle around the object is called the indicated rotation angle Bi. Note that in each command, part of the coordinates may be omitted, in which case it means that the coordinate values ​​specified in the previous code are continued as they are. In other words, in step S3, at least one processor 34 that executes the beveling process of the machining program 9 specifies the indicated position Pi of the laser machining point Pp of the workpiece W (long material) and the tilt axis A of the nozzle 14 of the laser machining machine 1 when machining the machining point Pp. Ｙ It receives commands to specify the surrounding rotation angle Bi.

[0046] Note that at least one processor 34 that executes the beveling process of the machining program 9 has already received a command Cc that includes the indicated position Pc immediately before command Ci, before executing step S3. In the following description, the X, Y, Z, B, and C coordinates of command Ci will be Xi, Yi, Zi, Bi, and Ci, respectively. The X, Y, Z, B, and C coordinates of the preceding command Cc will be Xc, Yc, Zc, Bc, and Cc, respectively. When command Ci is the first toolpath of the beveling process, the coordinate values ​​of the G09G01 command, which is a command to move to the beveling start position, will be assumed to be the X, Y, Z, B, and C coordinates of the preceding command Cc.

[0047] Next, at least one processor 34 that executes the beveling process of the machining program 9 executes steps S4, S5, S6, and steps S7 and S8 synchronously as parallel processes. That is, at least one processor 34 starts and ends the control of the feed device 20 in step S4 corresponding to Xc→Xi, the rotation device 15 in step S5 corresponding to Yc→Yi, and the second moving device 18 in step S6 corresponding to Zc→Zi at the same time. During these processes, at least one processor 34 simultaneously executes the control of the first moving device 17 in step S8 based on the observed position obtained in step S7.

[0048] To perform such control, for example, the at least one processor 34 divides the displacement of the X, Y, Z, B, and C coordinates into N values ​​obtained by dividing the time duration T from the indicated position Pc of the previous command Cc to the indicated position Pi of the command Ci by the sampling interval Ts. The at least one processor 34 then controls the feed device 20, the rotating device 15, the second moving device 18, and the first moving device 17 to match the target position and orientation of the nozzle 14 determined from the divided values. The processes of steps S4, S5, S6, and S7 and S8 will be described in detail below. <Tracing control and target position of machining point in the first embodiment> Figure 6 is a diagram illustrating the tracing control method according to the first embodiment, schematically showing the processes of steps S4, S5, S6, and S7 and S8. In the first embodiment, as the simplest example, regardless of whether the X-coordinate (Xi) of the indicated position Pi of command Ci changes from the X-coordinate (Xc) of the indicated position Pc of command Cc, the first direction D in the machine coordinate system of the laser processing point Pp of the workpiece W (long material) ＬAt least one processor 34 performs a tracking control process to keep the target position Pt constant. In the example in Figure 6, the movement of the Y-axis and C-axis is not shown, but this is the same as in the prior art, so the explanation is omitted. The control in steps S41 and S42 and the control in step S5, which will be described later, can be applied similarly to the movement of the Y-axis and C-axis.

[0049] In Figure 6, the tilt axis A Ｙ Let L be the distance from the tip of the nozzle 14. Of the time length T described above, let Xt be the command value of the X coordinate of the instruction position Pit corresponding to a certain sampling time t, and let θ be the command value of the B coordinate. Let (Xt+Δx) be the command value of the X coordinate of the instruction position Pitt corresponding to the next sampling time (t+Δt), and let (θ+Δθ) be the command value of the B coordinate. Note that the tilt axis A at sampling time t and sampling time (t+Δt) is detected by the angle detector 15S. Ｙ The rotation angle of the surrounding nozzles 14 is controlled by the rotation device 15 so that it matches the instructed rotation angles θ and (θ+Δθ), respectively. Furthermore, Ld is defined as the distance between the nozzle 14 and the workpiece W (long material) in the second direction Dh, which is determined from the output of the distance sensor 13 and the output of the angle detector 15S at sampling time t. The command values ​​of the Z coordinate of the instructed position Pit and the command values ​​of the Z coordinate of the instructed position Pitt are generally set by the machining program 9 before the start of the tracing control (in the example of Figure 5, the Z coordinate of the code (move to the groove machining start position)), and in tracing control, the command value of the Z coordinate is usually constant. The distance between the nozzle 14 and the workpiece W (long material) in the second direction Dh, which is set based on the command value of the Z coordinate, is defined as the target distance Lt.

[0050] In step S4 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 according to the instruction position Pi. Figure 7 is a flowchart showing the detailed processing flow of step S4 of Figure 4. In step S41 of Figure 7, at least one processor 34 that executes the beveling process of the machining program 9 controls the first direction D of the instruction position between the instruction Cc immediately preceding the instruction Ci that includes the instruction position Pc and the instruction Ci. ＬThe displacement (Xi - Xc) is determined. In step S42, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 according to the displacement (Xi - Xc). Specifically, referring to Figure 6, with Δx = (Xi - Xc) / N, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 to feed by a feed amount Δx between sampling time t and sampling time (t + Δt).

[0051] In step S5 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 controls the rotating device 15 to tilt the nozzle 14 to the instructed rotation angle Bi while executing the process in step S4. Specifically, referring to Figure 6, at least one processor 34 that executes the beveling process of the machining program 9 controls the nozzle 14 by a rotation amount Δθ on the tilt axis A between sampling time t and sampling time (t+Δt), with Δθ = (Bi - Bc) / N. Ｙ The rotating device 15 is controlled to rotate around it.

[0052] In step S6 of Figure 4, at least one processor 34 executing the beveling process of the machining program 9 controls the second moving device 18 so that the distance Ld between the nozzle 14 and the workpiece W (long material) in the second direction Dh becomes the target distance Lt when the nozzle 14 is tilted to the instructed rotation angle Bi. Specifically, referring to Figure 6, at least one processor 34 executing the beveling process of the machining program 9 controls the second moving device 18 so that the value of the Z coordinate changes by (Lt-Ld) between sampling time t and sampling time (t+Δt).

[0053] In step S7 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 determines the tilt axis A at sampling time t. ＹThe position u, expressed in the coordinate system of the U axis, is determined from the output of the first position detector 17S. At least one processor 34 that executes the beveling process of the machining program 9 determines the tilt axis A of the nozzle 14 at sampling time t. Ｙ The rotation angle θ is determined from the output of the angle detector 15S. At least one processor 34 that executes the beveling process of the processing program 9 determines the separation distance Ld at sampling time t from the output of the distance sensor 13. Then, when the nozzle 14 is moved by the second moving device 18, the position u of the nozzle 14 in the machine coordinate system of the laser processing machine 1, and the tilt axis A of the nozzle 14 are determined. Ｙ Based on the rotation angle θ and the separation distance Ld, the observed position Po of the machining point Pp in the machine coordinate system is determined. Specifically, the coordinate value (Ut + e) ​​of the observed position Po at sampling time t, expressed in the U-axis coordinate system, is expressed by the following (Equation 1): Ut + e = u + L・sinθ + Ld・tanθ (Equation 1) In (Equation 1), Ut is the coordinate value of the target position Pt of the machining point Pp expressed in the U-axis coordinate system. e represents the deviation from the target position Pt at sampling time t. In the first embodiment, the coordinate value Ut does not change even when the sampling time elapses from t to (t + Δt). Ut is stored in advance as machining point data 7.

[0054] In step S8 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 moves the nozzle 14 in the first direction D Ｌ The first moving device 17, which is configured to move to the observation position Po, is controlled to approach the target position Pt, which is the position corresponding to the indicated position Pi in the machine coordinate system. Specifically, the following processing is performed. From (Equation 1), the displacement e at sampling time t is expressed by the following (Equation 2): e = u + L・sinθ + Ld・tanθ - Ut (Equation 2) On the other hand, at sampling time (t+Δt), the tilt axis A of the nozzle 14 ＹThe position u + Δu of the control target, expressed in the U-axis coordinate system, is given by the following equation (3): u + Δu = Ut - L・sin(θ+Δθ) - Lt・tan(θ+Δθ) (Equation 3) In equation (3), Δu is the control quantity that controls the first moving device 17 between sampling time t and sampling time (t+Δt). Eliminating u from equations (2) and (3), Δu is given by the following equation (4): Δu = L・sinθ + Ld・tanθ - L・sin(θ+Δθ) - Lt・tan(θ+Δθ) - e (Equation 4) In step S8, at least one processor 34 that executes the beveling process of the machining program 9 controls the first moving device 17 so that the displacement Δu, expressed in the U-axis coordinate system, changes between sampling time t and sampling time (t+Δt).

[0055] In order to perform the tracing control described above, the coordinate value Ut, which represents the range of motion of the u-axis by the first moving device 17 and the target position Pt of the machining point Pp in the U-axis coordinate system, must satisfy the following conditions. Figure 8 is a diagram illustrating these conditions. Referring to Figures 1 and 8, the tilt axis A of the nozzle 14 that is permissible in groove machining. Ｙ The rotation angle θ is predetermined to be θmin ≤ θ ≤ θmax. If θ < θmin or θmax < θ is set, at least one processor 34 that executes the beveling process of the machining program 9 notifies the operator of an error and forcibly terminates the machining program 9.

[0056] The tilt axis A of nozzle 14 when θ = θmax Ｙ Let Umax be the coordinate value of the U-axis, and the tilt axis A of nozzle 14 when θ = θmin. Ｙ If we let Umin be the coordinate value of the U-axis, then in order to make the target position Pt of the machining point Pp the same, the tilt axis A of the nozzle 14 ＹThe coordinate value of the U-axis will change between Umax and Umin. The distance D between Umax and Umin is expressed by the following equation (Equation 5): D = L・sinθmax + Lt・tanθmax - L・sinθmin - Lt・tanθmin (Equation 5) Here, it is assumed that the range of motion of the u-axis by the first moving device 17 is from the U-axis origin (U=0) to the limit value Ulim. On the other hand, considering that the observation position Po of the machining point Pp fluctuates due to the vibration of the workpiece W, and that the height of the nozzle 14 is changed in order to keep the separation distance Ld constant, Umax must be expressed as a coordinate value M2 that has a margin M2min or more to accommodate the fluctuation. The coordinate value of the U-axis at Umin must be a coordinate value that is M1 smaller than the limit value Ulim by a margin M1min or more to accommodate the fluctuation. Furthermore, Ulim must be greater than the sum of D, M1min and M2min mentioned above. When Ulim is of this magnitude, the coordinate value Ut, which represents the target position Pt in the U-axis coordinate system, is expressed by the following (Equation 6): Ut = M2 + L・sinθmax + Lt・tanθmax (Equation 6) <Second Embodiment> In the first embodiment, a beveling method usable with a laser processing machine 1 is shown, which is configured such that Ulim is greater than the sum of D, M1min and M2min, expressed in (Equation 4). However, due to structural constraints, there are cases where it is desirable to make Ulim smaller than the sum of D, M1min and M2min, expressed in (Equation 4). In such cases, the target position Pt of the processing point Pp is set to the tilt axis A of the nozzle 14. Ｙ It is effective to change it according to the surrounding rotation angle θ. In the second embodiment, the target position Pt of the machining point Pp is set to the tilt axis A of the nozzle 14. Ｙ This describes a beveling method that is changed according to the surrounding rotation angle θ. However, the beveling method of the second embodiment is also applicable when Ulim is greater than the sum of D, M1min and M2min, represented by (Equation 4). In the second embodiment, the explanation will focus on processes that differ from the beveling method of the first embodiment, and the explanation of processes that are the same as those in the beveling method of the first embodiment will be omitted.

[0057] In the second embodiment, the machining point data 7 is the tilt axis A of the nozzle 14. ＹThe system stores the relationship between the surrounding rotation angle θ and the target position Pt of the machining point Pp. Note that the machining point data 7 is the tilt axis A of the nozzle 14. Ｙ The range of the surrounding rotation angle θ and the target position Pt of the machining point Pp corresponding to that range may be stored. As shown in the first embodiment, the larger θ becomes, the more the coordinate value of the U-axis of the target position Pt corresponds to the tilt axis A of the nozzle 14. Ｙ The coordinate value of the U axis becomes larger. Therefore, as θ increases, it is preferable to make the U axis coordinate value of the target position Pt smaller so that the variation of the target position Pt with respect to θ becomes smaller. In the second embodiment below, for the sake of explanation, the target position Pt corresponding to the indicated rotation angle Bi of command Ci will be denoted as Pti, and the target position Pt corresponding to the indicated rotation angle Bc of command Cc will be denoted as Ptc.

[0058] The flowchart showing the processing flow of the beveling method in the second embodiment is generally the same as that in Figure 4. However, steps S4 and S8 differ from those in the first embodiment, so their contents will be explained in detail. Figure 9 is a flowchart showing the detailed processing flow of step S4 in Figure 4 according to the second embodiment. Figure 10 is a diagram illustrating the tracing control method according to the second embodiment, schematically showing the processing of steps S4, S5, S6, S7 and S8. In Figure 10, the explanation of the same parameters as in Figure 6 is omitted.

[0059] In step S43 of Figure 9, at least one processor 34 that executes the beveling process of the machining program 9 determines the target position Pti according to the instructed rotation angle Bi. Specifically, the at least one processor 34 obtains the coordinate value Ui, expressed in the U-axis coordinate system of the target position Pti of the nozzle 14 of command Ci, from the machining point data 7 based on the instructed rotation angle Bi.

[0060] In step S44, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 according to the target position Pti. Figure 11 is a flowchart showing the detailed processing flow of step S44 in Figure 9. In step S45 of Figure 11, at least one processor 34 that executes the beveling process of the machining program 9 determines the target position Ptc of the preceding command Cc from the command Cc immediately preceding the command Cc that includes the indicated position Pc and the indicated rotation angle Bc, according to the indicated rotation angle Bc of the preceding command Cc. Specifically, the at least one processor 34 obtains the coordinate value Uc of the target position Ptc of the nozzle 14 of command Cc, expressed in the U-axis coordinate system, from the machining point data 7 based on the indicated rotation angle Bc.

[0061] In step S46 of Figure 11, at least one processor 34 that executes the beveling process of the machining program 9 controls the first direction D of the instructed position between the previous command Cc and command Ci. Ｌ The displacement (Xi - Xc) and the first direction D of the target position between the previous command Cc and command Ci. Ｌ The feed device is controlled according to the displacement (Ui - Uc). Specifically, referring to Figure 6, with Δx = (Xc - Xi) / N and ΔUt = (Ui - Uc) / N, at least one processor 34 that executes the beveling process of the machining program 9 between sampling time t and sampling time (t + Δt) controls the feed device 20 according to the indicated position Pi so as to feed by a feed amount Δx + ΔUt. In Figure 10, the target position at sampling time t is represented as Ptt, and the target position at sampling time (t + Δt) is represented as Pttt.

[0062] From this point onward, the operations from steps S5 to S7 in Figure 4 are the same as in the first embodiment. In step S8 of Figure 4, at least one processor 34 that executes the beveling process of the machining program 9 controls the first moving device 17 so that the displacement Δu, expressed in the coordinate system of the U axis and determined as follows, changes between sampling time t and sampling time (t+Δt).

[0063] Referring to Figure 10, the shift e at sampling time t is as shown by (Equation 2) above. Next, the tilt axis A of the nozzle 14 at sampling time (t+Δt) Ｙ The position u + Δu of the control target, expressed in the coordinate system of the U axis, is given by the following (Equation 3'): u + Δu = Ut + ΔUt - L・sin(θ + Δθ) - Lt・tan(θ + Δθ) (Equation 3') Eliminating u from (Equation 2) and (Equation 3'), Δu is given by the following (Equation 4'): Δu = L・sinθ + Ld・tanθ - L・sin(θ + Δθ) - Lt・tan(θ + Δθ) + ΔUt - e (Equation 4') Figure 12 is a diagram illustrating the conditions for the range of motion of the u axis according to the second embodiment. In order to perform tracking control as in the second embodiment, the range of motion of the u axis by the first moving device 17 must satisfy the following conditions. Figure 12 is a diagram illustrating these conditions. Referring to Figure 12, the tilt axis A of the nozzle 14 when θ = θmin Ｙ If the coordinate value of the U axis is Umin, then the coordinate value of the U axis of the processing point Pp at this time, Utmin, is expressed as follows (Equation 7): Utmin = Umin + L・sinθmin + Lt・tanθmin (Equation 7) The position of this processing point Pp must be at a position away from the position where the laser does not hit the chuck 12 by a margin M2min corresponding to the variation. If the coordinate value of the U axis at this position is Uslim, then Utmin ≥ Uslim must be satisfied. Note that Uslim = M2min is also acceptable. <Third Embodiment> The second embodiment shows a beveling method that can be used with a laser processing machine 1 configured such that Utmin is greater than or equal to Uslim. However, there are cases where it is desirable to make Utmin less than Uslim due to structural constraints. In such cases, the tracing control shown in the second embodiment is performed within the range in which tracing control is possible with the first moving device 17, and tracing control using the feed device 20 is performed within the range in which tracing control is not possible with the first moving device 17. In the third embodiment, the explanation will focus on processes that differ from the beveling method of the second embodiment, and the explanation of processes that are the same as those in the second embodiment will be omitted.

[0064] Referring to Figure 13, the tilt axis A of the nozzle 14 ＹWhen the U-axis coordinate value of the nozzle is smaller than the limit value Ulim by a margin M1min corresponding to the variation, and the U-axis coordinate value of the machining point Pp coincides with Uslim in Figure 12 (this machining point Pp is shown as Ptth in Figure 13), the rotation angle of the nozzle 14 is defined as the threshold angle θth. This threshold angle θth is set, for example, by the code shown in (Process 1). When the rotation angle θ of the nozzle 14 falls within the first range less than the threshold angle θth, the workpiece W (long material) is moved in the first direction D so that the observation position Po approaches the target position Pti. Ｌ The feed device 20 is controlled to move the nozzle 14 to the feed device 20. At this time, the position of the nozzle 14 furthest from the feed device 20 among the positions of the nozzle 14 that can be moved by the first moving device 17 is taken as the nozzle position in the machine coordinate system, and the target position Pti is determined based on the indicated rotation angle Bi, the target separation distance Lt, and the length L of the nozzle 14. The rotation angle θ of the nozzle 14 being within the first range means that the angle at which the tip of the nozzle 14 is tilted from the downward Dd of the laser processing machine 1 toward the feed device 20 is greater than a predetermined angle (-θth).

[0065] Figure 14 is a flowchart showing the processing flow of the beveling method according to the third embodiment. In Figure 14, the same reference numerals are used for the same processes as in Figure 4, and their explanation is omitted. In step S4A of Figure 14, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 according to the instructed position Pi. Figure 15 is a flowchart showing the detailed processing flow of step S4A of Figure 14 according to the third embodiment. In step S43A of Figure 15, at least one processor 34 that executes the beveling process of the machining program 9 determines the target position Pti according to the instructed rotation angle Bi. Figure 16 is a flowchart showing the detailed processing flow of step S43A of Figure 15 according to the third embodiment.

[0066] In step S47 of Figure 16, at least one processor 34 that executes the beveling process of the machining program 9 determines whether the indicated rotation angle Bi is within a first range. In step S48 of Figure 16, when the indicated rotation angle Bi is within a first range (YES in step S47), the at least one processor 34 that executes the beveling process of the machining program 9 determines the target position Pti based on the indicated rotation angle Bi, the target separation distance Lt, and the length L of the nozzle 14, using the position of the nozzle 14 furthest from the feed device 20 among the positions of the nozzle 14 that can be moved by the first moving device 17 as the position of the nozzle 14 in the machine coordinate system. Referring to Figure 13, the coordinate value Ui, which represents the target position Pti of the machining point Pp in the U-axis coordinate system, is expressed by the following (Equation 7). Ui = Umin + L・sinBi + Lt・tanBi (Equation 7) When the indicated rotation angle Bi is not within the first range (YES in step S47), at least one processor 34 that executes the beveling process of the machining program 9 performs the same process as in step S43 of the second embodiment. Returning to Figure 15, in step S44A, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 according to the target position Pti. Figure 17 is a flowchart showing the detailed processing flow of step S44A in Figure 15. In step S45A of Figure 17, at least one processor 34 that executes the beveling process of the machining program 9 determines the target position Ptc of the preceding command Cc from the preceding command Cc that includes the indicated position Pc and the indicated rotation angle Bc of the preceding command Cc. This method of determining the U coordinate Uc is performed by applying step S43A to the indicated rotation angle Bc. Subsequently, at least one processor 34 that executes the beveling process of the machining program 9 performs the same process as in the second embodiment, step S46.

[0067] From this point onward, the operations from steps S5 to S7 in Figure 14 are the same as in the first and second embodiments. In step S8A of Figure 14, at least one processor 34 that executes the beveling process of the machining program 9 moves the nozzle 14 in the first direction D so that the observation position Po determined in step S7 approaches the target position Pti, which is the position corresponding to the instructed position Pi in the machine coordinate system. Ｌ The first moving device 17 and the feed device 20, which are configured to move to the third location, are selectively controlled. Figure 18 is a flowchart showing the detailed processing flow of step S8A in Figure 14 according to the third embodiment.

[0068] In step S81 of Figure 18, at least one processor 34 that executes the beveling process of the machining program 9 determines whether the indicated rotation angle Bi is within a first range. In step S81 of Figure 16, when the indicated rotation angle Bi is within the first range (YES in step S81), at least one processor 34 that executes the beveling process of the machining program 9 moves the workpiece W (long material) in the first direction D so that the observation position Po approaches the target position Pti. Ｌ The feed device 20 is controlled to move the workpiece W (long material) in the first direction D, with Δu, represented by (Equation 4'), as the feed amount. Specifically, at least one processor 34 that executes the beveling process of the machining program 9 controls the feed device 20 to move the workpiece W (long material) in the first direction D. Ｌ The feeder 20 is controlled to move the object.

[0069] When the indicated rotation angle Bi is not within the first range (NO in step S81), at least one processor 34 executing the beveling process of the machining program 9 moves the nozzle 14 in the first direction D so that the observed position Po approaches the target position Pti. Ｌ The first moving device 17 is controlled to move in the first direction D. Specifically, at least one processor 34 that executes the beveling process of the processing program 9 executes the process of step S8 shown in the second embodiment. <Effects of the embodiment> The beveling method according to the first aspect of this embodiment is executed by the control device 30 of the laser processing machine 1. The method is performed in the first direction D ＬThe indicated position Pi of the laser processing point Pp of the workpiece W (long material) being stretched, and the tilt axis A of the nozzle 14 of the laser processing machine 1 when processing the processing point Pp. Ｙ The system receives a command Ci to specify the surrounding rotation angle Bi, and moves the workpiece W (long material) in the first direction D Ｌ The method includes controlling a feeder 20 configured to move the nozzle 14 to the tilt axis A according to the indicated position Pi. Ｙ A rotating device 15, configured to tilt around the nozzle, is controlled to tilt the nozzle 14 to the indicated rotation angle Bi, and when the nozzle 14 is tilted to the indicated rotation angle Bi, the first direction D between the nozzle 14 and the workpiece W (long material) Ｌ The method further includes controlling a second moving device 18 configured to move the nozzle 14 in the second direction Dh such that the separation distance Ld in the second direction Dh perpendicular to the first direction becomes a predetermined target separation distance Lt. When the nozzle 14 is moved by the second moving device 18, the method determines the observed position Po of the processing point Pp in the machine coordinate system based on the position of the nozzle 14 in the machine coordinate system of the laser processing machine 1, the indicated rotation angle Bi, and the separation distance Ld, and moves the nozzle 14 in the first direction D Ｌ The first moving device 17, which is configured to move to a specific location, is further controlled to approach a target location Pt, where the observation location Po is the location corresponding to the indicated location Pi in the machine coordinate system.

[0070] The beveling method according to the second aspect of this embodiment is performed by the control device 30 of the laser processing machine 1. This method is performed in the first direction D Ｌ The indicated position Pi of the laser processing point Pp of the workpiece W (long material) being stretched, and the tilt axis A of the nozzle 14 of the laser processing machine 1 when processing the processing point Pp. Ｙ The system receives a command Ci to specify the surrounding rotation angle Bi, and moves the workpiece W (long material) in the first direction D Ｌ The method includes controlling a feeder 20 configured to move the nozzle 14 to the tilt axis A according to the indicated position Pi. ＹA rotating device 15, configured to tilt around the nozzle, is controlled to tilt the nozzle 14 to the indicated rotation angle Bi, and when the nozzle 14 is tilted to the indicated rotation angle Bi, the first direction D between the nozzle 14 and the workpiece W (long material) Ｌ The method further includes controlling a second moving device 18 configured to move the nozzle 14 in the second direction Dh such that the separation distance Ld in the second direction Dh perpendicular to the laser is equal to a predetermined target separation distance Lt. When the nozzle 14 is moved by the second moving device 18, the method determines the observed position Po of the processing point Pp in the machine coordinate system based on the position of the nozzle 14 in the machine coordinate system of the laser processing machine 1, the indicated rotation angle Bi, and the separation distance Ld, and moves the nozzle 14 in the first direction D Ｌ The system further includes selectively controlling a first moving device 17 and a feeder 20, which are configured to move the device to a certain position.

[0071] According to a third aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the first or second aspect. According to a fourth aspect of this embodiment, the program (beveling control program 5) includes instructions for the control device 30 of the laser processing machine 1 to execute the beveling method according to the first or second aspect when the control device 30 is running. According to a fifth aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the first or second aspect.

[0072] The beveling method according to the first aspect of this embodiment, the laser processing machine according to the third aspect which includes means for executing the beveling method according to the first aspect, the program according to the fourth aspect which includes instructions for executing the beveling method according to the first aspect, and the control device according to the fifth aspect which includes means for executing the beveling method according to the first aspect, when the nozzle 14 is moved by the second moving device 18 so that the separation distance Ld becomes a predetermined target separation distance Lt, the observed position Po of the processing point Pp in the machine coordinate system is determined based on the position of the nozzle 14 in the machine coordinate system of the laser processing machine 1, the indicated rotation angle Bi, and the separation distance Ld, and the nozzle 14 is moved in the first direction DＬ The first moving device 17, which is configured to move to the next location, is controlled.

[0073] In a laser processing machine 1 that processes a workpiece W (long material), the observed position Po is prone to fluctuation in the tracing control due to vibrations of the workpiece W (long material) caused by the movement of the workpiece W (long material) by the feed device 20. Nevertheless, if the control is performed to move the workpiece W (long material) further with the feed device 20 so that the observed position Po approaches the target position Pt, instead of the operation in step S8 of Figure 4, mechanical vibrations will occur in the feed device 20. The inventors of this invention have discovered that this mechanical vibration makes the processing point Pp prone to shifting from the target position Pt, which is the main cause of the decrease in processing accuracy of beveling. In the beveling method according to the first and second embodiments, the laser processing machine 1 according to the third embodiment, the beveling control program 5 according to the fourth embodiment, and the control device 30 according to the fifth embodiment, the device that moves the workpiece W (long material) so that the observed position Po approaches the target position Pt moves the nozzle 14 in the first direction D Ｌ The first moving device 17 can be configured to move the machine, thereby suppressing machine vibrations and improving the machining accuracy of the beveling process.

[0074] A beveling method according to a second embodiment, a laser processing machine according to a third embodiment equipped with means for executing the beveling method according to the second embodiment, a program according to a fourth embodiment equipped with instructions for executing the beveling method according to the second embodiment, and a control device according to a fifth embodiment equipped with means for executing the beveling method according to the second embodiment can improve the processing accuracy of beveling by executing the beveling method according to the first embodiment when tracing control at the indicated rotation angle Bi can be achieved within the movable range of the first moving device 17, and can execute tracing control with the feed device 20 when tracing control at the indicated rotation angle Bi cannot be achieved within the movable range of the first moving device 17. This makes it possible to improve the processing accuracy of beveling as much as possible even if there are mechanical limitations of the first moving device 17.

[0075] According to the sixth aspect of this embodiment, the beveling method according to the first or second aspect involves, before receiving the command Ci, the first direction D of the workpiece W (long material) between the nozzle 14 and the feeding device 20 ＬThe method includes controlling the feed device 20 to cause the workpiece W (long material) to protrude from the chuck 12, in a configuration where the portion of the workpiece W (long material) opposite to the feed device 20 is not supported by the laser processing machine 1 with respect to the chuck 12, which is configured to guide movement toward the chuck 12. According to the seventh aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the sixth aspect. According to the eighth aspect of this embodiment, the program (beveling control program 5) includes instructions to the control device 30 to execute the beveling method according to the sixth aspect when the control device 30 of the laser processing machine 1 is executed. According to the ninth aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the sixth aspect.

[0076] The beveling method according to the sixth aspect of this embodiment, the laser processing machine according to the seventh aspect, the program according to the eighth aspect, and the control device according to the ninth aspect can greatly improve the processing accuracy of beveling by performing tracing control with the first moving device 17, because the vibration of the workpiece W (long material) becomes large due to the workpiece W (long material) being supported in a cantilevered manner.

[0077] According to the tenth aspect of this embodiment, in the beveling method according to any of the first, second, and sixth aspects, the feed device 20 is controlled according to the instruction position Pi, which is the first direction D of the instruction position Pi between the command Cp immediately preceding the command Ci that includes the instruction position Pi and the command Ci. Ｌ This includes controlling the feed device 20 in accordance with the displacement. According to the 11th aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the 10th aspect. According to the 12th aspect of this embodiment, the program (beveling control program 5) includes instructions for the control device 30 to execute the beveling method according to the 10th aspect when the control device 30 of the laser processing machine 1 is running. According to the 13th aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the 10th aspect.

[0078] The beveling method according to the 10th aspect of this embodiment, the laser processing machine according to the 11th aspect, the program according to the 12th aspect, and the control device according to the 13th aspect are in the first direction D of the indicated position Pi. ＬBy controlling the feed device 20 in accordance with the displacement, the workpiece W (long material) can be fed by the feed device 20 without any excess or deficiency.

[0079] According to the 14th aspect of this embodiment, in the beveling method according to any of the 1st, 2nd, 6th, and 10th aspects, controlling the feed device 20 according to the indicative position Pi includes determining the target position Pt according to the indicative rotation angle Bi and controlling the feed device 20 according to the target position Pt. According to the 15th aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the 14th aspect. According to the 16th aspect of this embodiment, the program (beveling control program 5) includes an instruction to the control device 30 to execute the beveling method according to the 10th aspect when the control device 30 of the laser processing machine 1 is running. According to the 17th aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the 10th aspect.

[0080] The groove processing method according to the 14th aspect of this embodiment, the laser processing machine according to the 15th aspect, the program according to the 16th aspect, and the control device according to the 17th aspect can improve the processing accuracy of groove processing by changing the target position Pt according to the indicated rotation angle Bi, even when it is not possible to control the target position Pt to the same target position Pt at all indicated rotation angles Bi due to limitations in the movable range of the first moving device 17.

[0081] According to the eighteenth aspect of this embodiment, in the beveling method according to the fourteenth aspect of this embodiment, the feed device 20 is controlled according to the target position Pt by determining the target position Pt of the preceding command Cp from the command Cp immediately preceding the command Ci which includes the indicated position Pi and the indicated rotation angle Bi, according to the indicated rotation angle Bi of the preceding command Cp, and the first direction D of the indicated position Pi between the preceding command Cp and command Ci Ｌ The displacement and the first direction D of the target position Pt between the previous command Cp and command Ci. ＬThis includes controlling the feed device 20 in accordance with the displacement. According to the 19th aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the 18th aspect. According to the 20th aspect of this embodiment, the program (beveling control program 5) includes instructions for the control device 30 to execute the beveling method according to the 18th aspect when the control device 30 of the laser processing machine 1 is running. According to the 21st aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the 18th aspect.

[0082] The beveling method according to the 18th aspect of this embodiment, the laser processing machine according to the 19th aspect, the program according to the 20th aspect, and the control device according to the 21st aspect enable the workpiece W (long material) to be fed by the feeding device 20 without excess or deficiency, even when the target position Pt is changed according to the indicated rotation angle Bi.

[0083] According to the 22nd aspect of this embodiment, in the beveling method according to the second aspect, or any of the sixth, tenth, fourteenth, and eighteenth aspects including the beveling method according to the second aspect, selectively controlling the first moving device 17 and the feed device 20 means that when the indicated rotation angle Bi is within a first range indicating that the angle at which the tip of the nozzle 14 is tilted from the downward Dd of the laser processing machine 1 toward the feed device 20 is greater than a predetermined angle (threshold angle θth), the workpiece W (long material) is moved in the first direction D so that the observation position Po approaches the target position Pt. Ｌ The feeder 20 is controlled to move to the first position, and when the indicated rotation angle Bi is not within the first range, the nozzle 14 is directed in the first direction D so that the observation position Po approaches the target position Pt. Ｌ This includes controlling the first moving device 17 to move it to the specified location.According to the 23rd aspect of this embodiment, the laser processing machine 1 is equipped with means for performing the beveling method according to the 22nd aspect.According to the 24th aspect of this embodiment, the program (beveling control program 5) includes instructions for the control device 30 to perform the beveling method according to the 22nd aspect when the control device 30 of the laser processing machine 1 is running.According to the 25th aspect of this embodiment, the control device 30 is equipped with means for performing the beveling method according to the 22nd aspect.

[0084] The beveling method according to the 22nd aspect of this embodiment, the laser processing machine according to the 23rd aspect, the program according to the 24th aspect, and the control device according to the 25th aspect reduce the risk of the tip of the nozzle 14 contacting the chuck 12 during tracing control by not performing tracing control using the first moving device 17 when the indicated rotation angle Bi is greater than the threshold angle θth in the laser processing machine 1 in which the movable range of the first moving device 17 is limited.

[0085] According to the 26th aspect of this embodiment, in the beveling method according to the 22nd aspect, controlling the feed device 20 according to the indicated position Pi includes, when the indicated rotation angle Bi is within a first range, determining the target position Pt based on the indicated rotation angle Bi, the target separation distance Lt, and the length of the nozzle 14, with the position of the nozzle 14 furthest from the feed device 20 among the positions of the nozzle 14 that can be moved by the first moving device 17 as the position of the nozzle 14 in the machine coordinate system. According to the 27th aspect of this embodiment, the laser processing machine 1 is equipped with means for executing the beveling method according to the 26th aspect. According to the 28th aspect of this embodiment, the program (beveling control program 5) includes instructions to cause the control device 30 to execute the beveling method according to the 26th aspect when the control device 30 of the laser processing machine 1 is running. According to the 29th aspect of this embodiment, the control device 30 is equipped with means for executing the beveling method according to the 26th aspect.

[0086] The groove processing method according to the 26th aspect of this embodiment, the laser processing machine according to the 27th aspect, the program according to the 28th aspect, and the control device according to the 29th aspect can further reduce the risk of the tip of the nozzle 14 contacting the chuck 12 in tracing control that utilizes the feed device 20 when the indicated rotation angle Bi is greater than the threshold angle θth in a laser processing machine 1 in which the movable range of the first moving device 17 is limited. <Modified Example> The processing point data 7 is not limited to the value of the coordinate value Ut of the U axis of the target position Pt, but also the tilt axis A for each rotation angle. Ｙ Alternatively, the position represented in the U-axis coordinate system may be stored, and Ut may be calculated.

[0087] In the third embodiment, an example is shown in which the operation of the second embodiment is performed when the indicated rotation angle does not fall within the first range, but the operation of the first embodiment may also be performed. In that case, the threshold angle θth shown in Figure 13 can be determined by replacing the machining point Pt defined by θmax with the machining point Ptth in Figure 13.

[0088] Step S8 described above illustrates the simplest form of feedback control, but it may also involve a combination of P control, D control, I control, etc.

[0089] Some or all of the logic functions of the beveling control program 5 described above may be implemented by a dedicated processor or integrated circuit. The beveling control program 5 may be stored not only in the memory 35, but also on a storage medium that is removable from the computer and readable by the computer, such as a floppy disk, optical disk, CD-ROM and magnetic disk, SD card, USB memory, or external hard disk.

[0090] In this application, “equipped with” and its derivatives are non-restrictive terms that describe the existence of a component and do not exclude the existence of other components not described. This also applies to “having,” “including,” and their derivatives.

[0091] The terms "component," "part," "element," "body," and "structure" can have multiple meanings, such as a single part or multiple parts.

[0092] Ordinal numbers such as "first" and "second" are simply terms used to identify components and do not carry any other meaning (such as a specific order). For example, the existence of a "first element" does not implicitly mean the existence of a "second element," nor does the existence of a "second element" implicitly mean the existence of a "first element."

[0093] Unless otherwise specifically stated in the embodiments, terms such as "substantially," "about," and "approximately" can mean a reasonable deviation that does not significantly alter the final result. All numerical values ​​described in this application may be interpreted as including terms such as "substantially," "about," and "approximately."

[0094] In this application, the phrase "at least one of A and B" should be interpreted to include A only, B only, and both A and B.

[0095] Based on the above disclosure, it is clear that various changes and modifications to the present invention are possible. Therefore, the present invention may be implemented in a manner different from the specific disclosures of this application, without departing from the spirit of the invention.

Claims

1. A beveling method performed by a control device of a laser processing machine, comprising: receiving a command to specify the position of a laser processing point on a long material extending in a first direction and the specified rotation angle of the nozzle of the laser processing machine around the tilt axis when processing the processing point; controlling a feed device configured to move the long material in the first direction according to the specified position; controlling a rotating device configured to tilt the nozzle around the tilt axis to tilt the nozzle to the specified rotation angle; controlling a second moving device configured to move the nozzle in a second direction such that when the nozzle is tilted to the specified rotation angle, the separation distance between the nozzle and the long material in a second direction perpendicular to the first direction becomes a predetermined target separation distance; and determining the observed position of the processing point in the machine coordinate system based on the position of the nozzle in the machine coordinate system of the laser processing machine, the rotation angle of the nozzle around the tilt axis, and the separation distance when the nozzle is moved by the second moving device.

2. The method according to claim 1, further comprising controlling a first moving device configured to move the nozzle in the first direction so that it approaches a target position where the observation position corresponds to the indicated position in the machine coordinate system.

3. The method according to claim 1, further comprising selectively controlling a first moving device and a feeding device configured to move the nozzle in a first direction so that the observation position approaches a target position which corresponds to the indicated position in the machine coordinate system.

4. The method according to any one of claims 1 to 3, further comprising, before receiving the command, controlling the feed device to cause the elongated material to protrude from the chucks in a configuration in which the portion of the elongated material opposite to the feed device is not supported by the laser processing machine with respect to the chuck closest to the nozzle among at least one chuck configured to guide the movement of the elongated material in the first direction between the nozzle and the feed device.

5. The method according to any one of claims 1 to 4, wherein controlling the feed device according to the indicated position includes controlling the feed device according to the displacement of the indicated position in the first direction between the command immediately preceding the command including the indicated position and the command.

6. The method according to any one of claims 1 to 5, wherein controlling the feed device according to the indicated position includes determining the target position according to the indicated rotation angle and controlling the feed device according to the target position.

7. The method according to claim 6, wherein controlling the feed device according to the target position includes determining the target position of the preceding command from the command immediately preceding the command which includes the indicated position and the indicated rotation angle, according to the indicated rotation angle of the preceding command, and controlling the feed device according to the displacement of the indicated position in the first direction between the preceding command and the command and the displacement of the target position in the first direction between the preceding command and the command.

8. The method according to claim 3 and any of claims 4 to 7 dependent on claim 3, wherein the selective control of the first moving device and the feed device includes controlling the feed device to move the elongated material in a first direction so that the observation position approaches the target position when the indicated rotation angle is within a first range indicating that the angle at which the tip of the nozzle is tilted from the downward direction of the laser processing machine toward the feed device is greater than a predetermined angle, and controlling the first moving device to move the nozzle in a first direction so that the observation position approaches the target position when the indicated rotation angle is not within the first range.

9. The method according to claim 8, wherein controlling the feeder according to the indicated position includes, when the indicated rotation angle is within the first range, determining the target position based on the indicated rotation angle, the target separation distance, and the length of the nozzle, with the position of the nozzle furthest from the feeder among the positions of the nozzle movable by the first moving device being the position of the nozzle in the machine coordinate system.

10. A laser processing machine comprising means for performing the beveling method described in any one of claims 1 to 9.

11. The laser processing machine according to claim 10, further comprising a position detector configured to detect the position of the nozzle in the machine coordinate system and transmit it to the control device, wherein the first moving device comprises a motor and a rotation-to-linear conversion mechanism configured to convert the rotational motion of the motor into linear motion, and the position detector is one of a servo driver for the motor, an encoder configured to detect the rotation angle of the motor, or a resolver configured to detect the rotation angle of the motor.

12. The laser processing machine according to claim 10 or 11, further comprising an angle detector configured to detect the rotation angle of the nozzle around the tilt axis and transmit it to the control device, wherein the rotating device is a motor, and the angle detector is one of a servo driver for the motor, an encoder configured to detect the rotation angle of the motor, or a resolver configured to detect the rotation angle of the motor.

13. The laser processing machine according to claim 12, further comprising a distance sensor and a storage device configured to detect the separation distance between the nozzle and the long material and transmit it to the control device, wherein the distance sensor is a capacitive sensor, the storage device stores a correspondence relationship representing the separation distance corresponding to the output of the capacitive sensor and the output of the angle detector, and the separation distance is detected from the output of the capacitive sensor and the output of the angle detector by referring to the correspondence relationship.

14. A program that, when executed by the control device of a laser processing machine, provides an instruction to the control device to perform the beveling method described in any one of claims 1 to 9.

15. A control device comprising means for performing the beveling method described in any one of claims 1 to 9.

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