Camera module

Abstract

A camera module is provided. A camera module according to one aspect of the present invention may comprise: a base including a resin and a filler; and a substrate disposed on the base, wherein the resin includes heterogeneous resins having different molecular weights.

Description

Camera module

[0001] The present invention relates to a camera module.

[0002] A camera is a device that captures subjects in photos or videos, and it is mounted on portable devices, drones, vehicles, etc. To improve image quality, camera modules may feature Image Stabilization (IS) to correct or prevent image shake caused by user movement, Auto Focusing (AF) to automatically adjust the distance between the image sensor and the lens to align the lens focal length, and Zooming to increase or decrease the magnification of distant subjects using a zoom lens.

[0003] To implement the above-described function, the camera module includes a substrate, and at least one electronic component is disposed on the surface of the substrate. The substrate is coupled to a body that forms the outer shape of the camera module. However, as the camera module becomes increasingly slimmer, the thickness of the body also decreases; consequently, as the mechanical strength of the body weakens, a problem arises where it breaks due to impact.

[0004] In addition, as the thickness of the body decreases, there is a problem in that it becomes difficult to implement the precise shape of the body for the attachment of substrates, etc. If only the thickness of the body is reduced and flowability is not controlled, shape control is not achieved during the manufacturing process in the mold, resulting in a problem where the reliability of the camera module is reduced during the assembly process. In the case of cameras, preparation for vibration and shock in the operating environment is required, and ensuring stability in this regard is urgent.

[0005] The problem that the present invention aims to solve is to provide a camera module that can improve the adhesion between a base and a substrate by utilizing a filler without a separate surface modification process.

[0006] A camera module according to one aspect of the present invention for achieving the above objective comprises: a base including a resin and a filler; and a substrate disposed on the base; wherein the resin may include heterogeneous resins having different molecular weights.

[0007] Through this embodiment, the camera module not only has increased mechanical strength of the base but also enables flow control, allowing for the implementation of complex shapes, thereby ensuring the reliability of the camera product.

[0008] In particular, by composing the base of the injection-molded product with heterogeneous resins having high and low molecular weights, the viscosity resulting from the combination of different resins is lower compared to cases where the base consists of high molecular weight resins. This enables flow control during the production of the injection-molded product, thereby allowing for the realization of desired or composite shapes. Specifically, it has the effect of enabling the realization of the surface area shape of the region where the substrate is assembled or attached into a desired form.

[0009] In addition, since the filler of the injection-molded product not only has a plate-like structure but also an aspect ratio within a set numerical range, it has the effect of high mechanical strength despite the mixing of low molecular weight resin. As a result, it is possible to provide a base with low deformation and resistance to external impact.

[0010] FIG. 1 is a perspective view of a camera module according to the present embodiment.

[0011] FIG. 2 is an exploded perspective view of a camera module according to the present embodiment.

[0012] FIG. 3 is a perspective view of a base according to the present embodiment.

[0013] FIG. 4 is a perspective view of an AF carrier according to the present embodiment.

[0014] FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1.

[0015] FIG. 6 is a diagram illustrating a magnetic levitation operation according to another embodiment of the present invention.

[0016] FIG. 7 is a cross-sectional view of a camera module according to the present embodiment.

[0017] FIG. 8 is an enlarged view of areas A and B of FIG. 7.

[0018] FIG. 9 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0019] FIG. 10 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0020] FIG. 11 is a cross-sectional view of FIG. 10 seen from a different angle.

[0021] FIG. 12 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0022] FIG. 13 is an enlarged view of regions P and Q of FIG. 12.

[0023] FIG. 14 is a perspective view of a base according to an embodiment of the present invention.

[0024] FIG. 15 is an image showing a 2D cross-section of a base according to an embodiment of the present invention.

[0025] FIG. 16 is an image showing a 3D cross-section of a base according to an embodiment of the present invention.

[0026] FIG. 17 is a graph showing the results of measuring the mechanical strength characteristics of the base injection molded part of a camera module according to an embodiment of the present invention.

[0027] FIG. 18 is a graph showing the result of measuring the viscosity relative to the shear rate of a base injection molded product of a camera module according to an embodiment of the present invention.

[0028] FIG. 19 is an exploded perspective view of a camera device according to the present embodiment.

[0029] FIG. 20 is a perspective view of a mobile terminal with a camera module applied according to the present embodiment.

[0030] FIG. 21 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0033] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0034] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0035] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0036] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0037] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0038] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0039] As used below, the 'Optical Axis Direction' is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0040] As used below, the 'vertical direction' may be a direction parallel to or the same as the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0041] As used below, the 'Auto Focus (AF) function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through the movement of the lens along the optical axis according to the distance to the subject, so that a sharp image of the subject can be obtained on the image sensor. Additionally, 'Closed-loop Auto Focus (CLAF) control' is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment.

[0042] The 'optical image stabilization (OIS) function' used below is defined as a function that moves or tilts the lens in a direction perpendicular to the optical axis to offset hand shake in order to prevent the image or video from shaking due to the user's hand shake. Additionally, 'closed-loop auto focus (CLAF) control' is defined as a function that detects the position of the lens relative to the image sensor and provides real-time feedback control of the lens position to improve the accuracy of image stabilization.

[0043] In the following, either "AF moving part" or "OIS moving part" may be referred to as "first moving part" and the other as "second moving part".

[0044] In the following, either the "AF drive unit" or the "OIS drive unit" may be referred to as the "first drive unit" and the other as the "second drive unit."

[0045] In the following, any one of the "AF drive unit," "OIS-x drive unit," and "OIS-y drive unit" may be referred to as the "first drive unit," the other as the "second drive unit," and the other as the "third drive unit."

[0046] In the following, one of "AF magnet (410)", "OIS-x magnet (510)" and "OIS-y magnet (610)" may be referred to as "first magnet", another as "second magnet", and the other as "third magnet".

[0047] In the following, one of the “AF coil (420)”, “OIS-x coil (520)”, and “OIS-y coil (620)” may be referred to as the “first coil”, another as the “second coil”, and the other as the “third coil”.

[0048] In the following, one of "AF magnet (410)", "OIS-x magnet (510)", "OIS-y magnet (610)", "AF coil (420)", "OIS-x coil (520)", and "OIS-y coil (620)" may be referred to as the "first driving unit", another as the "second driving unit", another as the "third driving unit", another as the "fourth driving unit", another as the "fifth driving unit", and another as the "sixth driving unit".

[0049] In the following, one of the “AF sensor (430),” “OIS-x sensor (530)” and “OIS-y sensor (630)” may be referred to as the “first sensor,” the other as the “second sensor,” and the other as the “third sensor.”

[0050] FIG. 1 is a perspective view of a camera module according to the present embodiment, FIG. 2 is an exploded perspective view of a camera module according to the present embodiment, FIG. 3 is a perspective view of a base according to the present embodiment, FIG. 4 is a perspective view of an AF carrier according to the present embodiment, FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1, FIG. 6 is a drawing for explaining magnetic levitation operation according to another embodiment of the present invention, FIG. 7 is a cross-sectional view of a camera module according to the present embodiment, FIG. 8 is an enlarged view of regions A and B of FIG. 7, FIG. 9 is a cross-sectional view of a camera module according to another embodiment of the present invention, FIG. 10 is a cross-sectional view of a camera module according to yet another embodiment of the present invention, FIG. 11 is a cross-sectional view taken from a different angle of FIG. 10, FIG. 12 is a cross-sectional view of a camera module according to yet another embodiment of the present invention, and FIG. 13 is an enlarged view of regions P and Q of FIG. 12.

[0051] The lens driving device (10) according to the present embodiment is a lens driving actuator using a voice coil motor (VCM) method and can perform auto-focusing (AF) and optical image stabilization (OIS) functions.

[0052] The lens driving device (10) according to the present embodiment may include a fixed part and a moving part that can move in the direction of the optical axis (Z-axis) or in a direction perpendicular to the optical axis (X-axis, Y-axis) within the fixed part.

[0053] The lens driving device (10) may largely include a base (110) that supports the lower part of the moving part, a substrate (120) that surrounds the outer surface of the base (110) and forms a circuit, a cover (700) that is coupled to the base (110) and protects the interior, an AF carrier (210) that accommodates the lens and moves in the direction of the optical axis, an OIS carrier (310) that is accommodated inside the AF carrier (210) and moves in a direction perpendicular to the optical axis, and an elastic member (150) that elastically supports the moving part.

[0054] Additionally, the lens driving device (10) may include an AF magnet (410) placed in the AF carrier (210) for driving, a corresponding AF coil (420) and AF sensor (430), an AF yoke (160), an OIS-x magnet (510) and an OIS-y magnet (610) placed in the OIS carrier (310), and corresponding OIS-x coil (520), OIS-x sensor (530), OIS-y coil (620), and OIS-y sensor (630).

[0055] Furthermore, the lens driving device (10) may further include a first guide magnet part (Ma) (including first, third, fifth, and seventh guide magnets (M1, M3, M5, M7)) disposed on the AF carrier (210) for guiding and controlling the posture of the moving part, and a second guide magnet part (Mb) (including second, fourth, sixth, and eighth guide magnets (M2, M4, M6, M8)) or a guide coil part (Ca) (including first and second guide coils (C1, C2)) disposed on the base (110).

[0056] Each component is explained below.

[0057] The base (110) is configured to be positioned at the bottom of the lens driving device (10) to support the moving part. The base (110) may include a square plate-shaped bottom plate (190) and four side plates (170) protruding upward from the edge of the bottom plate (190). An opening (192) that penetrates in the direction of the optical axis is formed in the center of the bottom plate (190) to provide an optical path between the image sensor and the lens. A first hole (113), a second hole (112), and a third hole (111) that are penetrated or recessed may be formed in the side plates (170) so that a coil can be placed therein. The third hole (111) may correspond to the AF coil (420), the second hole (112) to the OIS-x coil (520), and the first hole (113) to the OIS-y coil (620), respectively. A stepped portion (180) protruding outward is formed at the lower outer surface of the base (110) to provide a seating guide for the cover (700) and the substrate (120).

[0058] The substrate (120) includes a flexible printed circuit board (FPCB) and may be arranged to wrap around the outer surface of the side plate (170) of the base (110). The substrate (120) may include a first substrate (121), a second substrate (122), a third substrate (123), and a fourth substrate (124) arranged sequentially corresponding to the four sides of the base (110). A second adhesive portion (125) may be disposed at one end of the substrate (120). The substrate (120) may be electrically connected to each coil (420, 520, 620) and sensor (430, 530, 630).

[0059] The cover (700) is a shield can that is coupled to the base (110) to protect internal components and block electromagnetic waves. The cover (700) may include a top plate (710) that covers the upper surface and a side plate (720) that extends downward from the top plate (710) and is coupled to a stepped portion (180) of the base (110).

[0060] The elastic member (150) includes a plate spring, etc., and can elastically support the movement of the moving part. The elastic member (150) is formed to support OIS driving, and can prevent mechanical play and ensure driving stability by pressing the OIS guide member, etc., in the direction of the AF moving part.

[0061] The AF carrier (210) is a housing that accommodates a lens and can be positioned inside the base (110) so as to be movable in the direction of the optical axis. The AF carrier (210) includes a bottom plate and a side wall, and various magnets can be placed on the side wall.

[0062] The AF magnet (410) is a permanent magnet means disposed on the first side wall of the AF carrier (210). The AF coil (420) is disposed on the substrate (120) and exposed through the third hole (111) of the base (110), and can cause electromagnetic interaction with the AF magnet (410). The AF sensor (430) includes a Hall sensor and is disposed on the inside of the AF coil (420), etc., to detect changes in the position of the AF magnet (410) and perform feedback control (CLAF). The AF yoke (160) can assist the driving force or prevent leakage magnetic flux by exerting an attractive force with the AF magnet (410). Z-axis driving can be achieved by the AF magnet (410), AF coil (420), AF sensor (430), and AF yoke (160).

[0063] The OIS carrier (310) is accommodated in the inner space of the AF carrier (210) and is a means having a space (311) on which a lens is seated. The OIS carrier (310) can be positioned to be movable in a direction perpendicular to the optical axis.

[0064] An OIS-x magnet (510) may be disposed on the second side of the OIS carrier (310). Correspondingly, an OIS-x coil (520) and an OIS-x sensor (530) are disposed on the substrate (120) at the location of the second hole (112) of the base (110) to perform X-axis direction driving and position detection.

[0065] An OIS-y magnet (610) may be disposed on the third side of the OIS carrier (310). Correspondingly, an OIS-y coil (620) and an OIS-y sensor (630) may be disposed on the substrate (120) at the location of the first hole (113) of the base (110) to perform Y-axis direction driving and position detection. The OIS sensors (530, 630) can detect the position of the magnet and be utilized for hand shake correction feedback control.

[0066] The lens driving device (10) of the present embodiment may adopt a magnetic levitation guide method using repulsive or attractive forces between magnets without using ball bearings. To this end, a first guide magnet part (Ma) and a second guide magnet part (Mb) may be used.

[0067] The first guide magnet part (Ma) may be placed on the outer surface of the side wall of the AF carrier (210). It may include a first guide magnet (M1) and a third guide magnet (M3) symmetrically placed on both sides with respect to the AF magnet (410).

[0068] The second guide magnet part (Mb) can be placed on the inner side wall of the base (110). The second guide magnet (M2) can be placed facing the first guide magnet (M1), and the fourth guide magnet (M4) can be placed facing the third guide magnet (M3).

[0069] The optical axis direction length (Lb) of the second guide magnet part (Mb) on the base (110) side can be formed to be longer than the optical axis direction length (La) of the first guide magnet part (Ma) on the AF carrier (210) side (Lb > La). This allows the overlap state between the guide magnets to be maintained even when the AF carrier (210) moves over the entire stroke section.

[0070] When the first guide magnet part (Ma) and the second guide magnet part (Mb) are arranged to have the same polarity, mutual repulsion is generated, so that the AF carrier (210) is guided without friction while floating from the base (110), and operation due to magnetic levitation can be achieved.

[0071] In addition, if the polarities of the first guide magnet part (Ma) and the second guide magnet part (Mb) are arranged differently along the optical axis direction (e.g., NSNS), AF driving driving force can be generated through the combined action of attraction and repulsion, thereby increasing the driving speed.

[0072] Additionally, magnets may be added to enhance the anti-tilting force. A fifth guide magnet (M5) and a seventh guide magnet (M7) are added to the AF carrier (210), and a corresponding sixth guide magnet (M6) and an eighth guide magnet (M8) are added to the base (110) so as to be arranged to maintain balance in diagonal directions, etc.

[0073] The opposing surfaces of the base (110) and the AF carrier (210) have a stepped structure in the form of an uneven surface rather than a simple flat surface, which can act as a mechanical stopper when tilting excessively.

[0074] The inner surface of the side wall of the base (110) has a shape in which a second surface (116a) on which a second guide magnet (M2) is placed and a third surface (116b) on which a fourth guide magnet (M4) is placed protrude inward, based on the first surface (115) on which a third hole (111) is formed. A first stepped surface (117a) may be connected between the first surface (115) and the second surface (116a), and a second stepped surface (117b) may be connected between the first surface (115) and the third surface (116b).

[0075] The outer surface of the side wall of the AF carrier (210) may have a shape in which the fifth surface (212a) where the first guide magnet (M1) is placed and the sixth surface (212b) where the third guide magnet (M3) is placed are recessed inward, based on the fourth surface (211) where the AF magnet (410) is placed. A third stepped surface (213a) may be connected between the fourth surface (211) and the fifth surface (212a), and a fourth stepped surface (213b) may be connected between the fourth surface (211) and the sixth surface (212b).

[0076] The stepped surfaces (117a, 117b) of the base (110) and the stepped surfaces (213a, 213b) of the AF carrier (210) may be arranged facing each other and spaced apart at a certain distance. This structure does not interfere during normal operation, but if tilting occurs due to external impact, they come into contact with each other to prevent excessive tilting or detachment of the carrier.

[0077] The guide coil portion (Ca) may include a first guide coil (C1) and a second guide coil (C2) positioned at a location corresponding to the existing first guide magnet portion position on the inner side wall of the base (110). This may correspond to the P region and Q region shown in FIG. 12.

[0078] In this case, the second guide magnet part (Mb) is positioned on the side of the base (110) or AF carrier (210) and can be positioned to face the guide coil part (Ca).

[0079] When power is applied to the guide coil part (Ca), electromagnetic interaction occurs, generating a force that moves the AF carrier (210) in a specific direction or controls its attitude, thereby reinforcing the AF driving force and controlling tilting.

[0080] Below, a method for improving adhesion through the bonding structure of the base (110) and the substrate (120) and the surface structure of the base (110) is explained.

[0081] FIG. 14 is a perspective view of a base according to an embodiment of the present invention.

[0082] Referring to FIG. 14, the base (110) according to an embodiment of the present invention may include a bottom plate (190), a side plate (170), and a stepped portion (180) as described above.

[0083] An opening (192) is positioned in the center of the lower plate (190), and an image sensor and a lens can be positioned facing each other in the direction of the optical axis through the opening (192). The lower plate (190) can support the lower surface of the AF moving unit. The lower plate (190) may include an upper surface (137) that supports the lower surface of the AF moving unit and an inner surface (136) that forms the inner wall of the opening (192). The upper surface (137) and the inner surface (136) may be positioned perpendicular to each other.

[0084] The side plate (170) may have a shape that protrudes upward from the upper surface of the bottom plate (190). The side plate (170) includes four side plates, and the four side plates may include a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned opposite each other. Each of the four side plates may be positioned perpendicularly to an adjacent side plate. The side plate (170) may have a rectangular cross-sectional shape due to the four side plates.

[0085] The side plate (170) may include an outer surface (131) and an inner surface (135) opposite to the outer surface (131). A substrate (120) may be attached to the outer surface (131) of the side plate (170). The substrate (120) may be positioned to surround the outer surface (131) of the side plate (170). The outer surface of the side plate (170) may be surrounded by the substrate (120).

[0086] A portion of the outer surface (131) of the side plate (170) may have a shape that protrudes outwardly in a direction perpendicular to the optical axis direction compared to other areas. For example, the outer surface (131) of the side plate (170) may include a first outer surface (132) positioned in a corner area and a second outer surface (133) positioned between a plurality of corner areas. The first outer surface (132) may be positioned in a corner area of ​​the side plate (170) to connect a plurality of second outer surfaces (133). The first outer surface (132) may protrude outwardly in a direction perpendicular to the optical axis direction compared to the second outer surface (133). The first outer surface (132) and the second outer surface (133) may be positioned in a stepped manner in a direction perpendicular to the optical axis direction.

[0087] In this case, the substrate (120) may have regions of different thicknesses in a direction perpendicular to the optical axis. For example, the substrate (120) may include a first region and a second region that is thicker than the first region. The first region of the substrate (120) may be in contact with the first outer surface (132). The inner surface of the second region of the substrate (120) may have a shape that protrudes inwardly relative to the inner surface of the first region, so as to be in contact with the outer surface of the second region (133).

[0088] The base (110) may include an injection molded product. For example, the base (110) may include an injection molded product produced by a mold. The side plate (170) of the base (110) may include an injection molded product. The injection molded product may include a resin and a filler. The injection molded product may further include an additive. In this case, the injection molded product may include 45 to 80 weight% of resin, 15 to 50 weight% of filler, and 2 to 10 weight% of additive.

[0089] The resin (910) may be a covalent composite polymer used as the main material of the injection molded product. The resin (910) may be a non-hydrophilic covalent composite polymer. The resin may include a semi-crystalline polymer and / or an amorphous polymer. In the case of a crystalline polymer, it is not included in the resin because it has the disadvantage of not being able to maintain the rigidity or flexibility of the injection molded product due to the complete lack of internal fluidity.

[0090] Semicrystalline polymers are polymers in which regular crystallized regions are formed in some regions and disordered amorphous regions are formed in other regions, and are resins with high flexibility and impact resistance along with improved strength. Semicrystalline polymers may include one or more of LCP (Liquid crystal polymer), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PET (Polyethylene terephthalate), PBT (Polyphenylene terephthalate), PA66 (Polyamide 66, Nylon 66), PP (Polyphenylene), PE (Polyethylene), and PEN (Phenol Ester Naphthalenol).

[0091] Amorphous polymers are resins that maintain a non-crystalline amorphous state in which polymer chains are irregularly arranged in all regions, and thus lack a crystalline structure, making them transparent or translucent as well as flexible and deformable. Amorphous polymers may include one or more of PSU (Polysulfone), PEI (Polyetherimide), PC (Polycarbonate), PPO (Poly(p-phenylene oxide)), PMMA (Poly(methyl methacrylate)), and ABS (Acrylonitrile butadiene styrene).

[0092] The resin (910) may include a first resin and a second resin with different molecular weights. The first resin may have a molecular weight greater than that of the second resin. The first resin may have a molecular weight of 20,000 to 30,000 g / mol. The second resin may have a molecular weight of 450 to 650 g / mol. In this case, the second resin may have a molecular weight of 2 to 5% of the molecular weight of the first resin. As the first resin and the second resin have different molecular weights, the first resin with a relatively large molecular weight and the second resin with a relatively small molecular weight are mixed, resulting in relatively lower flowability compared to a single molecular weight resin, making it easier to control flowability in the injection molding process and thus making it easier to control surface roughness.

[0093] The filler (920) is a composition added to the resin to improve the mechanical properties of the resin and serves to increase the durability and strength of the base (110). The filler (920) may include an inorganic filler. The filler (920) may include a glass material filler and a mineral material filler. For example, the glass material filler may include one or more of glass fiber, glass flake, glass beads, and glass balloon, and the mineral material filler may include one or more of wollastonite, potassium, titanate, talc, mica, silica, and BaSO4 (barium sulfate).

[0094] The filler (920) may include a plate-shaped filler. In this case, the filler (920) may have a plate-shaped form with a longitudinal length of 15 to 40 µm, a unidirectional length of 5 to 25 µm, and a thickness of 0.8 to 1.2 µm.

[0095] The filler (920) may have an aspect ratio of 1.2 to 2.2, where the length in the unidirectional direction is divided by the length in the longitudinal direction. Preferably, the aspect ratio of the filler (920) may be 1.3 to 1.9. Specifically, when the length in the longitudinal direction is divided by the length in the unidirectional direction, the aspect ratio may be 1.3 to 1.9. As the aspect ratio is a limited value, the mechanical strength may be increased, and accordingly, the strength of the injection molded product may be improved.

[0096] The filler (920) may include BaSO4. BaSO4 is desirable in terms of maintaining the strength of the base (110) and improving adhesion because it is a material with high compatibility with resin and specialized rigidity. However, the material of the filler is not limited to BaSO4, and the above-mentioned filler material can be used without restriction.

[0097] FIG. 15 is an image showing a 2D cross-section of a base according to an embodiment of the present invention, and FIG. 16 is an image showing a 3D cross-section of a base according to an embodiment of the present invention. Referring to FIG. 15, a 2D image of an injection-molded product manufactured by adding a filler (920) to the resin (910) of the base (110) used in an embodiment of the present invention can be seen. When examining the cross-section of the injection-molded product, it can be seen that the filler (920) forms a grain and forms a hard skeleton in all directions on the surface of the injection-molded product as shown in the drawing. Specifically, based on one area of ​​the injection-molded product, for example, the center area of ​​the injection-molded product, the longitudinal direction and the surface direction of the filler (920) are formed to form an acute angle along the surface direction of the injection-molded product, so that the filler (920) is spaced apart from the center area of ​​the injection-molded product and surrounds it in a manner that forms an acute angle in the longitudinal direction. In this case, structurally exceptional areas may be formed depending on the arrangement of some fillers (920), but at least 70% of the area where the fillers (920) are arranged may be arranged so that the longitudinal and planar directions of the fillers (920) form an acute angle. As the fillers (920) within the resin (910) in the injection molded product overlap each other, the mechanical strength may be improved. This structure can be confirmed more clearly by referring to FIG. 16. When examining the 3D cross-section in FIG. 16, it can be seen that the fillers (920) are arranged to surround a region of the cross-section based on the longitudinal direction, and that adjacent fillers (920) are arranged to overlap each other with the longitudinal directions forming an acute angle. It can also be seen that the fillers (920) are arranged to have a unidirectional and a longitudinal direction, and that they are formed in the shape of long hair or needles because the longitudinal length is 15 to 40 times the thickness.

[0098] Additives are used to maintain the strength or surface wettability characteristics of the injection-molded product, and one or more of the following may be used: a dispersant for uniform dispersion of the filler; a thixotropic agent for controlling the viscosity of the resin and filler and improving dispersibility; a leveling agent for controlling the surface roughness of the injection-molded product and forming a uniform thickness; a crosslinking agent for increasing the crosslinkability of the resin; a plasticizer for increasing the flexibility of the resin and improving processability; and a characterizing additive for increasing heat resistance, chemical resistance, and conductivity. However, additives may be omitted as necessary.

[0099] The base (110) can be bonded to the substrate (120). The side plate (170) of the base (110) can be bonded to the substrate (120). The outer surface (131) of the side plate (170) of the base (110) can be bonded to the substrate. The base (110) and the substrate (120) can be bonded by an adhesive.

[0100] Below, experimental results regarding mechanical properties according to the aspect ratio of the filler in the resin in an injection molded product constituting the base (110) of a camera module according to an embodiment of the present invention are described. FIG. 17 is a graph showing the results of measuring the mechanical strength properties of the injection molded product of the base of a camera module according to an embodiment of the present invention.

[0101] Liquid Crystal Polymer (LCP) was used as the resin in the base (110), and BaSO4 material was used as the filler. The filler content was adjusted to 25 wt% relative to the total weight of the injection molded product to form the injection molded product. The ratio of the molecular weight of the second resin, which has a relatively low molecular weight, to the molecular weight of the first resin, which has a relatively high molecular weight in the filler, was set to 3%, and the strength was measured by varying the aspect ratios of the fillers. Experimental Example 1 was manufactured with a filler aspect ratio of 1.3, and Experimental Example 2 was manufactured with a filler aspect ratio of 1.9. Comparative Example 1 was conducted with a filler aspect ratio of 1.1, and Comparative Example 2 was conducted with a filler aspect ratio of 2.4.

[0102] Mechanical strength was measured using Shore D hardness. Shore D hardness is a method for measuring the surface hardness of a polymer; using a Shore D hardness tester, pressure was applied to the surfaces of Experimental Examples 1 and 2 and Comparative Examples 1 and 2 with a tip, and the depth was measured and converted into a numerical value. The measured values ​​range from 0 to 100, with higher values ​​indicating greater hardness. For the experiment, surface contamination was removed from the Experimental Examples and Comparative Examples. Then, the Shore D hardness tester was positioned vertically on the molded product, and a constant pressure was applied while the tip pressed against the product. The experiment duration was set to 15 seconds. The experiment was repeated a total of 5 times, and the average value was calculated.

[0103] Target Minimum Hardness Value Maximum Hardness Value Average Hardness Value Experimental Example 181.884.983.7 Experimental Example 283.885.884.6 Comparative Example 180.881.281.1 Comparative Example 276.979.279.1

[0104] The experimental results are presented in Table 1 and Figure 17 above. In the case of Experimental Example 1, it was confirmed to have a hardness value of 81.8 to 84.9 and an average hardness value of 83.7. In the case of Experimental Example 2, it was confirmed to have a hardness value of 83.8 to 85.8 and an average hardness value of 84.6. In contrast, Comparative Example 1 had a hardness value of 80.8 to 81.2 and an average hardness value of 81.1, which was confirmed to have a lower hardness value compared to the experimental examples, and Comparative Example 2 had a hardness value of 76.9 to 79.2 and an average hardness value of 79.1, which was confirmed to have a significantly lower hardness value compared to the experimental examples. That is, when the aspect ratio of the filler in the resin of the injection molded product is 1.2 to 2.2, preferably 1.3 to 1.9, it was confirmed that the average hardness value exceeds 83, which is a meaningful value. Below, experimental results regarding flowability control characteristics of the experimental example and comparative example of the present invention, in which the resin constituting the injection molded product forming the base (110) of a camera module other than the embodiment of the present invention includes the first resin and the second resin, are described. FIG. 18 is a graph showing the results of measuring viscosity relative to shear rate of the base injection molded product of a camera module according to an embodiment of the present invention.

[0105] In the experiment, the filler content in the base (110) was adjusted to 25 wt% relative to the total weight of the injection molded product to form the injection molded product, and BaSO4 was used as the filler. Experimental Example 3 used a first resin with a relatively high molecular weight and a second resin with a relatively low molecular weight, and the first resin was LCP and the second resin was a silane-based resin. The molecular weight of the first resin was 24271 g / mol and the molecular weight of the second resin was 577 g / mol, so the ratio of the molecular weight of the second resin to the first resin was maintained at 2.3%. Comparative Example 3 used only the first resin used in Experimental Example 3 and did not mix the second resin separately. An injection molded product made of only the second resin was excluded because it not only had weak strength but also could not function as an injection molded product due to the practically impossible control of flowability.

[0106] In the experiment, the results were measured with the X-axis representing shear rate and the Y-axis representing viscosity. When the shear rate was between 0.01 and less than 1000 (1 / s), a rotational viscometer was used to measure viscosity, and when it was 1000 (1 / s) or greater, a capillary viscometer was used. This is because it is interpreted that flow control is smoother when the viscosity relative to the shear rate is lower.

[0107] Looking at FIG. 18 according to the experimental results, (a) to (d) are the results of measuring viscosity versus shear rate of Comparative Example 3, and (e) to (h) are the results of measuring viscosity versus shear rate of Example 3. Specifically, in Comparative Example 3, viscosity versus shear rate was measured at temperatures of 325°C for (a), 331.7°C for (b), 338.3°C for (c), and 345°C for (d); and in Example 3, viscosity versus shear rate was measured at temperatures of 325°C for (e), 331.7°C for (f), 338.3°C for (g), and 345°C for (h). Upon examination, it can be confirmed that the measured values ​​(e) to (h) of Example 3 show lower viscosity at all shear rates at the same temperature compared to the measured values ​​(a) to (d) of Comparative Example 3. The meaning of low viscosity at the same shear rate is that the internal flowability is low in that state, so flowability control can be performed smoothly. In other words, it can be confirmed that flowability control is smoother in Experimental Example 3 compared to Comparative Example 3.

[0108] Hereinafter, a camera device according to the present embodiment will be described with reference to the drawings.

[0109] FIG. 19 is an exploded view of a camera device according to the present embodiment.

[0110] The camera device (10A) may include a camera module.

[0111] The camera device (10A) may include a lens module (20). The lens module (20) may include at least one lens. The lens may be positioned at a location corresponding to the image sensor (60). The lens module (20) may include a lens and a barrel. The lens module (20) may be coupled to the OIS carrier (310) of the lens drive device (10). The lens module (20) may be coupled to the OIS carrier (310) by screw coupling and / or adhesive. The lens module (20) may move integrally with the OIS carrier (310).

[0112] The camera device (10A) may include a filter (30). The filter (30) may serve to block light of a specific frequency band from passing through the lens module (20) from entering the image sensor (60). The filter (30) may be positioned parallel to the xy plane. The filter (30) may be positioned between the lens module (20) and the image sensor (60). The filter (30) may be positioned on the sensor base (40). As a variation, the filter (30) may be positioned on the base (110). The filter (30) may include an infrared filter. The infrared filter may block light in the infrared region from entering the image sensor (60).

[0113] The camera device (10A) may include a sensor base (40). The sensor base (40) may be positioned between the lens driving device (10) and the printed circuit board (50). The sensor base (40) may include a protrusion (41) on which a filter (30) is positioned. An opening may be formed in the portion of the sensor base (40) on which the filter (30) is positioned so that light passing through the filter (30) can be incident on the image sensor (60). An adhesive member may bond or bond the base (110) of the lens driving device (10) to the sensor base (40). The adhesive member may additionally serve to prevent foreign substances from entering the interior of the lens driving device (10). The adhesive member may include one or more of epoxy, thermosetting adhesive, and UV-curing adhesive.

[0114] The camera device (10A) may include a printed circuit board (PCB) (50). The printed circuit board (50) may be a board or a circuit board. A lens driving device (10) may be placed on the printed circuit board (50). A sensor base (40) may be placed between the printed circuit board (50) and the lens driving device (10). The printed circuit board (50) may be electrically connected to the lens driving device (10). An image sensor (60) may be placed on the printed circuit board (50). The printed circuit board (50) may be equipped with various circuits, components, control units, etc., to convert an image formed on the image sensor (60) into an electrical signal and transmit it to an external device.

[0115] The camera device (10A) may include an image sensor (60). The image sensor (60) may be configured such that an image is formed when light passing through a lens and a filter (30) is incident. The image sensor (60) may be mounted on a printed circuit board (50). The image sensor (60) may be electrically connected to the printed circuit board (50). For example, the image sensor (60) may be coupled to the printed circuit board (50) by Surface Mounting Technology (SMT). As another example, the image sensor (60) may be coupled to the printed circuit board (50) by flip chip technology. The image sensor (60) may be positioned so that its optical axis aligns with that of the lens. That is, the optical axis of the image sensor (60) and the optical axis of the lens may be aligned. The image sensor (60) can convert light irradiated onto an effective image area of ​​the image sensor (60) into an electrical signal. The image sensor (60) may be any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0116] The camera device (10A) may include a motion sensor (70). The motion sensor (70) may be mounted on a printed circuit board (50). The motion sensor (70) may be electrically connected to a control unit (80) through a circuit pattern provided on the printed circuit board (50). The motion sensor (70) may output rotational angular velocity information based on the movement of the camera device (10A). The motion sensor (70) may include a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

[0117] The camera device (10A) may include a control unit (80). The control unit (80) may be placed on a printed circuit board (50). The control unit (80) may be electrically connected to a coil (330) of a lens driving device (10). The control unit (80) may individually control the direction, strength, and amplitude of the current supplied to the coil (330). The control unit (80) may control the lens driving device (10) to perform an autofocus function and / or a hand image correction function. Furthermore, the control unit (80) may perform autofocus feedback control and / or hand image correction feedback control for the lens driving device (10).

[0118] The camera device (10A) may include a connector (90). The connector (90) may be electrically connected to a printed circuit board (50). The connector (90) may include a port for electrically connecting to an external device.

[0119] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0120] FIG. 20 is a perspective view of a mobile terminal with a camera module applied according to the present embodiment, and FIG. 21 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0121] The optical device (1) may include one or more of a mobile phone, mobile phone, portable terminal, mobile terminal, smartphone, smart pad, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation. The optical device (1) may include any device for capturing images or photographs.

[0122] The optical device (1) may include a main body (20). The optical device (1) may include a camera device (10A). The camera device (10A) may be placed on the main body (20). The camera device (10A) may photograph a subject. The optical device (1) may include a display. The display may be placed on the main body (20). The display may output one or more of the video and images captured by the camera device (10A). The display may be placed on a first surface of the main body (20). The camera device (10A) may be placed on one or more of the first surface of the main body (20) and a second surface opposite the first surface. As shown in FIG. 18, the camera device (10A) may have a triple camera arranged vertically. As shown in FIG. 21, the camera device (10A-1) may have a triple camera arranged horizontally.

[0123] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0124] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. A base comprising a resin and a filler; and A substrate disposed on the above base; comprising The above resin is a camera module containing heterogeneous resins having different molecular weights.

2. In Paragraph 1, The above resin is a camera module comprising a first resin and a second resin having a lower molecular weight than the first resin.

3. In Paragraph 2, A camera module in which the ratio of the molecular weight of the second resin to the molecular weight of the first resin is 2 to 5%.

4. In Paragraph 2, The above first resin is a camera module having a molecular weight of 20,000 to 30,000 g / mol.

5. In Paragraph 2, The above second resin is a camera module having a molecular weight of 450 to 650 g / mol.

6. In Paragraph 1, The above-mentioned filler is a camera module formed in a plate shape having a long axis and a short axis.

7. In Paragraph 6, A camera module in which the aspect ratio of the major axis of the above-mentioned pillar, divided by the minor axis, is 1.3 to 1.

9.

8. In Paragraph 7, The above filler is a camera module having a major axis length of 15 to 40 µm and a minor axis length of 5 to 2.5 µm.

9. In Paragraph 8, A camera module in which the thickness of the above-mentioned filler is 1.8 to 1.2 µm.

10. In Paragraph 9, The above-mentioned filler is a camera module arranged in layers with spaced apart, such that the plane direction and the major axis direction of the base form an acute angle.

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