Simulation method and device for deformation capability of flexible multi-layer structure, computer equipment

By establishing a planar geometric model and a carrier model of a flexible multilayer structure, and combining dynamic or static methods for simulation, the problems of accuracy and efficiency in detecting the bending deformation capacity of flexible multilayer structures are solved, and cost-effective deformation capacity calculation is achieved.

CN111079295BActive Publication Date: 2026-03-17INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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Patent Information

Application Number
CN201911323716.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-12-20
Publication Date
2026-03-17
Estimated Expiration
2039-12-20

AI Technical Summary

Technical Problem

Existing technologies for detecting the bending deformation capacity of flexible multilayer structures are not accurate enough, are costly, and have low detection efficiency.

Method used

By establishing a planar geometric model of a flexible multilayer structure, setting its structural properties, establishing a carrier model, and obtaining the deformation model of the planar geometric model attached to the carrier model, simulation is performed using dynamic or static methods to calculate the deformation capacity of the flexible multilayer structure.

Benefits of technology

It enables accurate calculation of the deformation capacity of flexible multilayer structures, reduces testing costs, and improves testing efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a flexible multilayer structure deformation capability simulation method and device, computer equipment and a storage medium. The method comprises the following steps: establishing a planar geometric model of a flexible multilayer structure; setting the structural attributes of the planar geometric model; establishing a carrier model; and obtaining a deformation model of the planar geometric model attached to the carrier model. The flexible multilayer structure deformation capability simulation method and device, computer equipment and storage medium are characterized in that: the planar geometric model of the flexible multilayer structure is established; the structural attributes of the planar geometric model are set; the carrier model is established; and the deformation model of the planar geometric model attached to the carrier model is obtained. The method is used for simulating the flexible multilayer structure, and the planar geometric model of the flexible multilayer structure and the carrier model are in contact during the simulation, so that the deformation model of the flexible multilayer structure is calculated. The method is accurate and effective, and can reduce the cost and improve the detection efficiency.
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Description

Technical Field

[0001] This application relates to the field of flexible structure technology, and in particular to a method, apparatus, computer equipment, and storage medium for simulating the deformation capacity of flexible multilayer structures. Background Technology

[0002] Today's electronic technology is constantly evolving towards greater intelligence and user-friendliness. Devices designed based on traditional electronic technology suffer from drawbacks such as poor deformability, susceptibility to brittle fracture, and extremely poor biocompatibility, making it difficult to meet people's higher demands. However, the emergence of flexible electronics technology is gradually breaking the deadlock in the development of electronic technology. Its core idea is to integrate high-performance circuits with flexible substrates, enabling electronic devices to have characteristics such as large deformability, light weight, and reconfigurable functions.

[0003] The combination of inorganic thin films and flexible substrates enables electronic devices to bend, representing one of the earliest technologies achieved in flexible electronics. Therefore, bending deformation is one of the most fundamental and important deformation capabilities of flexible electronic devices. The bendability of a device is often measured by the minimum radius of curvature it can withstand; a smaller radius indicates a stronger bending capability.

[0004] Furthermore, typical flexible electronic system designs require the integration of several different materials within a single platform. Therefore, flexible electronic devices are generally multilayer structures composed of multiple thin films and a substrate. When flexible devices or structures are subjected to frequent bending or stretching, harder materials are prone to cracking, while severe stress concentrations easily occur at hard / soft interfaces, leading to layer peeling and separation due to mismatched mechanical properties. Placing vulnerable thin film layers in neutral layers during structural design provides excellent protection for these layers. Therefore, understanding the bending deformation capability boundaries of flexible multilayer structures is crucial. However, relying on actual testing to detect the bending deformation capability of flexible multilayer structures is not only inaccurate and ineffective but also costly and inefficient. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, apparatus, computer equipment, and storage medium for simulating the deformation capacity of flexible multilayer structures, which is not only inaccurate and ineffective but also costly and inefficient, in order to address the technical problem that relying on actual testing to calculate the bending deformation capacity of flexible multilayer structures is not only inaccurate and ineffective but also costly and inefficient.

[0006] A method for simulating the deformation capacity of a flexible multilayer structure, the method comprising:

[0007] Establish a planar geometric model of the flexible multilayer structure;

[0008] Set the structural properties of the planar geometric model;

[0009] Establish a carrier model;

[0010] Obtain the deformed model of the planar geometric model attached to the carrier model.

[0011] In one embodiment, establishing the planar geometric model of the flexible multilayer structure includes:

[0012] The planar geometric model is established based on the in-plane geometric properties of the flexible multilayer structure.

[0013] or,

[0014] The planar geometric model is obtained by simplifying the three-dimensional model of the flexible multilayer structure.

[0015] In one embodiment, setting the structural properties of the planar geometric model includes:

[0016] The planar geometric model can be configured with one or more structural properties, including region selection, material settings, thickness, and reference surface rotation.

[0017] In one embodiment, establishing the carrier model includes:

[0018] Establish a cylindrical rigid rod carrier model.

[0019] In one embodiment, establishing the cylindrical rigid rod carrier model includes:

[0020] Choose either discrete rigid body or analytical rigid body type to establish multiple cylindrical rigid rod carrier models with different radii.

[0021] In one embodiment, obtaining the deformed model of the planar geometric model attached to the carrier model includes:

[0022] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model are in contact;

[0023] The deformable model of the planar geometric model attached to the carrier model is obtained using dynamic or static methods.

[0024] In one embodiment, establishing contact between the planar geometric model and the carrier model by using the bottom surface of the planar geometric model as the slave surface and the surface of the carrier model as the master surface includes:

[0025] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model have tangential frictionless surface-to-surface contact.

[0026] A device for simulating the deformation capacity of a flexible multilayer structure, the device comprising:

[0027] The planar geometry model creation module is used to create planar geometry models of flexible multilayer structures.

[0028] The settings module is used to set the structural properties of the planar geometric model;

[0029] The carrier model creation module is used to create carrier models;

[0030] The calculation module is used to obtain the deformed model of the planar geometric model attached to the carrier model.

[0031] A computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program performing the following steps:

[0032] Establish a planar geometric model of the flexible multilayer structure;

[0033] Set the structural properties of the planar geometric model;

[0034] Establish a carrier model;

[0035] Obtain the deformed model of the planar geometric model attached to the carrier model.

[0036] A computer-readable storage medium having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0037] Establish a planar geometric model of the flexible multilayer structure;

[0038] Set the structural properties of the planar geometric model;

[0039] Establish a carrier model;

[0040] Obtain the deformed model of the planar geometric model attached to the carrier model.

[0041] The aforementioned method, apparatus, computer equipment, and storage medium for simulating the deformation capacity of flexible multilayer structures simulate the flexible multilayer structure by establishing a planar geometric model of the flexible multilayer structure; setting the structural properties of the planar geometric model; establishing a carrier model; and obtaining a deformation model of the planar geometric model attached to the carrier model. In the simulation, the planar geometric model of the flexible multilayer structure is brought into contact with the carrier model to calculate the deformation model of the flexible multilayer structure. The calculation is accurate and effective, while reducing costs and improving detection efficiency. Attached Figure Description

[0042] Figure 1This is a flowchart illustrating a method for simulating the deformation capacity of a flexible multilayer structure according to an embodiment of the present invention.

[0043] Figure 2 This is a schematic diagram illustrating the simplification of a three-dimensional model to obtain a planar geometric model of a flexible multilayer structure according to an embodiment of the present invention.

[0044] Figure 3 This is a schematic diagram illustrating the simplified planar geometric model of a flexible multilayer structure according to another embodiment of the present invention, obtained from a three-dimensional model.

[0045] Figure 4 This is a schematic diagram of a cylindrical rigid rod carrier model representing an analytical rigid body and a discrete rigid body according to an embodiment of the present invention.

[0046] Figure 5 This is a schematic diagram showing the contact between a planar geometric model and a carrier model according to an embodiment of the present invention;

[0047] Figure 6 This is a simulation diagram illustrating the deformation capability of a flexible multilayer structure according to an embodiment of the present invention.

[0048] Figure 7 This is a simulation diagram illustrating the deformation capability of a flexible multilayer structure according to another embodiment of the present invention.

[0049] Figure 8 This is a structural block diagram of a flexible multilayer structure deformation capacity simulation device according to an embodiment of the present invention;

[0050] Figure 9 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0052] Please see Figure 1 , Figure 1 This is a flowchart illustrating a method for simulating the deformation capacity of a flexible multilayer structure according to an embodiment of the present invention.

[0053] In this embodiment, the simulation method for the deformation capacity of flexible multilayer structures includes:

[0054] Step 100: Establish a planar geometric model of the flexible multilayer structure.

[0055] For example, a planar geometric model corresponding to a flexible multilayer structure is established in the simulation system.

[0056] Specifically, the simulation system can use ABAQUS simulation software.

[0057] ABAQUS is a powerful finite element method (FEM) software for engineering simulation, capable of solving problems ranging from relatively simple linear analyses to many complex nonlinear problems. ABAQUS includes a rich library of elements capable of simulating arbitrary geometries and a wide range of material models to simulate the properties of typical engineering materials, including metals, rubber, polymers, composites, reinforced concrete, compressible hyperelastic foams, and geological materials such as soil and rock. As a general-purpose simulation tool, ABAQUS can solve numerous structural (stress / displacement) problems and simulate many other engineering problems, such as heat conduction, mass diffusion, thermoelectric coupling analysis, acoustic analysis, geotechnical analysis (fluid permeability / stress coupling analysis), and piezoelectric analysis.

[0058] Step 110: Set the structural properties of the planar geometric model.

[0059] It is understandable that the structural properties of each layer of the planar geometric model are set to match the characteristics of the actual flexible multilayer structure.

[0060] Step 120: Establish the carrier model.

[0061] Understandably, flexible multilayer structures need to be attached to a carrier when they bend and deform. Therefore, a carrier model is established to simulate the state of the flexible multilayer structure when it bends and deforms.

[0062] Step 130: Obtain the deformed model of the planar geometric model attached to the carrier model.

[0063] For example, the bending deformation of the planar geometric model attached to the carrier model is observed and calculated to obtain the deformation model, so as to simulate the deformation capacity of the flexible multilayer structure.

[0064] The aforementioned simulation method for the deformation capacity of flexible multilayer structures involves establishing a planar geometric model of the flexible multilayer structure; setting the structural properties of the planar geometric model; establishing a carrier model; and obtaining the deformation model of the planar geometric model attached to the carrier model. This method simulates the flexible multilayer structure by bringing the planar geometric model of the flexible multilayer structure into contact with the carrier model during the simulation to calculate the deformation model of the flexible multilayer structure. The calculation is accurate and effective, while reducing costs and improving detection efficiency.

[0065] In another embodiment, establishing a planar geometric model of the flexible multilayer structure includes establishing a planar geometric model based on the in-plane geometric characteristics of the flexible multilayer structure or simplifying the three-dimensional model of the flexible multilayer structure to obtain a planar geometric model. It is understood that when directly establishing a planar geometric model based on the actual flexible multilayer structure, the thickness dimension can be ignored, and only the in-plane geometric characteristics of the flexible multilayer structure need to be established. When the original geometric model is imported from external software, operations such as mid-surface extraction and Boolean operations can be used to simplify the three-dimensional model of the flexible multilayer structure to obtain a planar geometric model.

[0066] Please see Figure 2 and Figure 3 , Figure 2 and Figure 3 This is a schematic diagram illustrating the simplified planar geometric model of a flexible multilayer structure according to an embodiment of the present invention, obtained from a three-dimensional model.

[0067] In another embodiment, setting the structural properties of the planar geometric model includes setting one or more structural properties such as region selection, material settings, thickness, and reference surface rotation angle. Specifically, in the ABAQUS simulation software, the Composite Layups setting is performed in the Part subcommand of the planar geometric model. The number of Plies (layers) is set according to the actual number of layers in the multi-layer structure. For example, if the multi-layer flexible structure is a 3-layer model, from bottom to top, layer 1, layer 2, and layer 3, then the number of Plies needs to be set to 3. For each Ply, the structural properties that must be set include region selection, material settings, thickness, and reference surface rotation angle. Region selection is done by selecting the corresponding graphic for each layer in the planar model of the multi-layer structure; material properties and thickness settings are determined according to the actual model; the reference surface rotation angle is generally set to 0 degrees; the remaining parameters can be set using the default settings of the simulation software. In addition, sometimes it is necessary to set the reference plane and its offsets. If the plies are arranged in order from bottom to top, the offset method should be selected as the Bottomsurface option, otherwise select the Topsurface option.

[0068] In another embodiment, establishing the carrier model includes establishing a cylindrical rigid rod carrier model. Specifically, based on computational requirements, a discrete rigid body or analytical rigid body type is selected, and multiple cylindrical structures with different radii are established to serve as carriers for the flexible multilayer structure. It is understood that establishing multiple carrier models with different radii is to allow the planar geometric model corresponding to the flexible multilayer structure to be attached to carrier models with different radii, in order to test the range of bending deformation capabilities of the flexible multilayer structure.

[0069] Please see Figure 4 , Figure 4 This is a schematic diagram of a cylindrical rigid rod carrier model representing an analytical rigid body and a discrete rigid body according to an embodiment of the present invention, wherein... Figure 4 The left side shows a schematic diagram of a cylindrical rigid rod carrier model of an analytical rigid body. Figure 4 The right side shows a schematic diagram of a discrete rigid body cylindrical rigid rod carrier model.

[0070] For example, obtaining the deformed model of the planar geometric model attached to the carrier model involves using the bottom surface of the planar geometric model as the slave surface and the surface of the carrier model as the master surface, establishing contact between the planar geometric model and the carrier model. Specifically, this involves tangential, frictionless surface-to-surface contact between the planar geometric model and the carrier model. Specifically, a dynamic or static method is used to obtain the deformed model of the planar geometric model attached to the carrier model. Understandably, static methods are generally preferred for solving the problem. If the static method fails to converge, a dynamic method can be attempted. For rigid cylinders, the boundary conditions can be set in a uniform and fixed manner, i.e., setting a reference point for the rigid body and applying full constraints to it. However, for flexible multilayer structures, the application of boundary conditions is not uniform and can be set according to actual needs.

[0071] Please see Figure 5 , Figure 5 This is a schematic diagram of the contact between a planar geometric model and a carrier model according to an embodiment of the present invention.

[0072] Please see Figure 6 and Figure 7 , Figure 6 and Figure 7 This is a simulation diagram of the deformation capacity of a flexible multilayer structure according to an embodiment of the present invention. The planar geometric model of the flexible multilayer structure is attached to the carrier model, and the bending degree and deformation effect of the planar geometric model under the attached state are calculated to obtain the deformation capacity of the flexible multilayer structure.

[0073] Please refer to Table 1, which shows the method for applying boundary conditions in the bending analysis of square-type flexible multilayer structures.

[0074] Table 1. Methods for applying boundary conditions in the bending analysis of square-shaped flexible multilayer structures.

[0075]

[0076] Understandably, by using dynamic or static methods to calculate the deformation field of the planar geometric model attached to the carrier model, the bending deformation capacity of the flexible multilayer structure can be obtained.

[0077] It should be understood that, although Figure 1 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0078] In one embodiment, such as Figure 8 As shown, a simulation device for the deformation capacity of a flexible multilayer structure is provided, comprising: a planar geometric model establishment module 200, a setting module 210, a carrier model establishment module 220, and a calculation module 230, wherein:

[0079] The planar geometry model creation module 200 is used to create planar geometry models of flexible multilayer structures.

[0080] The planar geometry model building module 200 is also used for:

[0081] A planar geometric model is established based on the in-plane geometric properties of flexible multilayer structures;

[0082] or,

[0083] The three-dimensional model of the flexible multilayer structure is simplified to obtain a planar geometric model.

[0084] The setting module 210 is used to set the structural properties of the planar geometric model.

[0085] The setting module 210 is also used to set one or more structural properties of the planar geometric model, including region selection, material settings, thickness, and reference surface rotation.

[0086] The carrier model creation module 220 is used to create a carrier model.

[0087] The carrier model creation module 220 is also used to create a cylindrical rigid rod carrier model.

[0088] The carrier model establishment module 220 is also used to select discrete rigid body or analytical rigid body type and establish multiple cylindrical rigid rod carrier models with different radii.

[0089] The calculation module 230 is used to obtain the deformed model of the planar geometric model attached to the carrier model.

[0090] The computing module 230 is also used for:

[0091] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model are in contact;

[0092] The deformable model of the planar geometric model attached to the carrier model is obtained using dynamic or static methods.

[0093] The calculation module 230 is also used to take the bottom surface of the planar geometric model as the slave surface and the surface of the carrier model as the master surface, so that the planar geometric model and the carrier model have a tangential frictionless surface-to-surface contact.

[0094] Specific limitations regarding the simulation device for the deformation capacity of flexible multilayer structures can be found in the limitations of the simulation method for the deformation capacity of flexible multilayer structures mentioned above, and will not be repeated here. Each module in the aforementioned simulation device for the deformation capacity of flexible multilayer structures can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independently of the processor, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0095] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 9 As shown, the computer device includes a processor, memory, network interface, display screen, and input devices connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The network interface is used to communicate with external terminals via a network connection. When the computer program is executed by the processor, it implements a method for simulating the deformation capability of a flexible multilayer structure. The display screen can be a liquid crystal display (LCD) or an e-ink display. The input devices can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the computer device's casing, or an external keyboard, touchpad, or mouse.

[0096] Those skilled in the art will understand that Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0097] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0098] Establish a planar geometric model of the flexible multilayer structure;

[0099] Set the structural properties of the planar geometric model;

[0100] Establish a carrier model;

[0101] Obtain the deformed model of the planar geometric model attached to the carrier model.

[0102] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0103] A planar geometric model is established based on the in-plane geometric properties of flexible multilayer structures;

[0104] or,

[0105] The three-dimensional model of the flexible multilayer structure is simplified to obtain a planar geometric model.

[0106] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0107] Configure one or more structural properties of the planar geometric model, including region selection, material settings, thickness, and reference plane rotation.

[0108] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0109] Establish a cylindrical rigid rod carrier model.

[0110] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0111] Choose either discrete rigid body or analytical rigid body type to establish multiple cylindrical rigid rod carrier models with different radii.

[0112] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0113] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model are in contact;

[0114] The deformable model of the planar geometric model attached to the carrier model is obtained using dynamic or static methods.

[0115] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0116] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model have tangential frictionless surface-to-surface contact.

[0117] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0118] Establish a planar geometric model of the flexible multilayer structure;

[0119] Set the structural properties of the planar geometric model;

[0120] Establish a carrier model;

[0121] Obtain the deformed model of the planar geometric model attached to the carrier model.

[0122] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0123] A planar geometric model is established based on the in-plane geometric properties of flexible multilayer structures;

[0124] or,

[0125] The three-dimensional model of the flexible multilayer structure is simplified to obtain a planar geometric model.

[0126] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0127] Configure one or more structural properties of the planar geometric model, including region selection, material settings, thickness, and reference plane rotation.

[0128] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0129] Establish a cylindrical rigid rod carrier model.

[0130] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0131] Choose either discrete rigid body or analytical rigid body type to establish multiple cylindrical rigid rod carrier models with different radii.

[0132] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0133] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model are in contact;

[0134] The deformable model of the planar geometric model attached to the carrier model is obtained using dynamic or static methods.

[0135] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0136] The bottom surface of the planar geometric model is taken as the slave surface, and the surface of the carrier model is taken as the master surface, so that the planar geometric model and the carrier model have tangential frictionless surface-to-surface contact.

[0137] The aforementioned method, apparatus, computer equipment, and storage medium for simulating the deformation capacity of flexible multilayer structures simulate the flexible multilayer structure by establishing a planar geometric model of the flexible multilayer structure; setting the structural properties of the planar geometric model; establishing a carrier model; and obtaining the deformation model of the planar geometric model attached to the carrier model. The simulation involves bringing the planar geometric model of the flexible multilayer structure into contact with the carrier model to calculate the deformation model of the flexible multilayer structure. This method is accurate and effective, while reducing costs and improving detection efficiency.

[0138] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0139] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0140] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method of simulating the deformation capability of a flexible multilayer structure, characterized in that, The method comprises: establishing a planar geometric model of the flexible multilayer structure; the establishing of the planar geometric model of the flexible multilayer structure comprises: establishing the planar geometric model based on in-plane geometric characteristics of the flexible multilayer structure; or simplifying a three-dimensional model of the flexible multilayer structure to obtain the planar geometric model; setting structural attributes of the planar geometric model; establishing a carrier model, the carrier model being used for simulating a state of the flexible multilayer structure in a bending deformation; the establishing of the carrier model comprises: establishing a selection of discrete rigid bodies or analytical rigid body types, and establishing a plurality of cylindrical rigid rod carrier models with different radii; obtaining a deformation model of the planar geometric model attached to the carrier model; the obtaining of the deformation model of the planar geometric model attached to the carrier model comprises: taking a bottom surface of the planar geometric model as a slave surface and a surface of the carrier model as a master surface, and establishing contact between the planar geometric model and the carrier model; obtaining the deformation model of the planar geometric model attached to the carrier model by using a dynamic method or a static method.

2. The flexible multilayer structure deformability simulation method of claim 1, wherein, The setting of the structural attributes of the planar geometric model comprises: setting one or more structural attributes of the planar geometric model, such as region selection, material setting, thickness, and reference surface corner.

3. The method of claim 1, wherein The taking of the bottom surface of the planar geometric model as the slave surface and the surface of the carrier model as the master surface, and the establishing of the contact between the planar geometric model and the carrier model comprises: taking the bottom surface of the planar geometric model as the slave surface and the surface of the carrier model as the master surface, and establishing tangential frictionless surface-to-surface contact between the planar geometric model and the carrier model.

4. A flexible multilayer structure deformability simulation apparatus characterized by, The device comprises: a planar geometric model establishing module, configured to establish a planar geometric model of a flexible multilayer structure; the planar geometric model establishing module is further configured to establish the planar geometric model based on in-plane geometric characteristics of the flexible multilayer structure; or simplify a three-dimensional model of the flexible multilayer structure to obtain the planar geometric model; a setting module, configured to set structural attributes of the planar geometric model; a carrier model establishing module, configured to establish a carrier model, the carrier model being used for simulating a state of the flexible multilayer structure in a bending deformation; the establishing of the carrier model comprises: establishing a selection of discrete rigid bodies or analytical rigid body types, and establishing a plurality of cylindrical rigid rod carrier models with different radii; a calculation module, configured to obtain a deformation model of the planar geometric model attached to the carrier model; the calculation module is further configured to take a bottom surface of the planar geometric model as a slave surface and a surface of the carrier model as a master surface, and establish contact between the planar geometric model and the carrier model; obtain the deformation model of the planar geometric model attached to the carrier model by using a dynamic method or a static method. 5.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is configured to perform the method according to any one of claims 1-4 when the computer program is executed by the processor. The processor executes the computer program to implement the steps of the method in any one of claims 1 to 3.

6. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 3.

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