Circuit board and electronic equipment

Abstract

The embodiment of the present application provides a circuit board and an electronic device, wherein the circuit board includes a substrate, wherein a first component and a second component at a certain distance from the first component are provided on a first surface of the substrate; the first component is connected to the second component through a plurality of first leads; the region through which the plurality of first leads pass forms a first lead region; and a second lead is arranged in at least one sub-lead region sparsely arranged in the first lead region. The above structure can achieve the purpose of reducing the visual difference between different sub-lead regions.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to a circuit board and electronic equipment. Background Art

[0002] At present, in the design of the circuit board of electronic equipment, there is often a problem that the visual difference between multiple sub-lead areas in the same lead area is large due to the uneven arrangement density of the leads. For example, on the touch screen of the electronic device, the circuit board corresponding to the touch screen is provided with multiple electrodes, and each motor needs to be connected to the drive controller, which will cause the lead arrangement in the sub-lead area close to the drive controller to be denser, while the lead arrangement in the sub-lead area far from the drive controller is sparser, so that different sub-lead areas in the lead area have large visual differences, resulting in poor visual effects. Summary of the invention

[0003] In response to one or more aspects of the above technical problems, the present application provides a circuit board and an electronic device.

[0004] The present application embodiment provides a circuit board, including:

[0005] substrate;

[0006] The first board surface of the substrate includes a first component and a second component that is a certain distance away from the first component;

[0007] The first component is connected to the second component via a plurality of first leads;

[0008] The areas through which the first leads pass form a first lead area;

[0009] A second lead is arranged in at least one sub-lead region where the first lead region is sparsely arranged.

[0010] In some embodiments, there are a plurality of second leads, and the plurality of second leads are arranged at intervals, and an arrangement direction of the second leads is the same as or perpendicular to that of the first leads.

[0011] In some embodiments, two ends of the second lead are respectively connected to the first lead located in the same sub-lead region as the second lead to reduce the resistance value of the first lead.

[0012] In some embodiments, at least one sub-lead region among the multiple sub-lead regions that is relatively far away from the second component is a first sub-lead region, and at least one sub-lead region among the multiple sub-lead regions that is relatively close to the second component is a second sub-lead region. Multiple second leads are provided in the first sub-lead region and the second sub-lead region, and the number of second leads in the first sub-lead region is greater than the number of second leads in the second sub-lead region.

[0013] In some embodiments, the first board surface of the circuit board has a first functional area for setting the first component, an insulating layer set on the first functional area, a second functional area set on the insulating layer, and a second lead area set near the second functional area, a third component is set on the second functional area, and a plurality of third leads are set in the second lead area to enable the third component to be connected to a fourth component.

[0014] In some embodiments, at least one second lead is disposed between adjacent third leads.

[0015] In some embodiments, the circuit board further includes a light shielding layer disposed on the first board surface of the substrate, and the light shielding layer is disposed corresponding to the first lead area and is located below the first lead area.

[0016] In some embodiments, the first component is configured as a first touch electrode, and a plurality of first touch electrodes are arranged in parallel along a first direction on the first functional area; the second component is configured as a driving controller connected to the plurality of first touch electrodes through a plurality of first leads respectively; the third component is configured as a second touch electrode connected to the fourth component through a plurality of third leads respectively, and a plurality of second touch electrodes are arranged in parallel along a second direction on the second functional area, wherein the first direction is perpendicular to the second direction.

[0017] In some embodiments, a spacing between adjacent second leads is less than 5 microns, a spacing between adjacent first leads is less than 5 microns, and a spacing between the second lead adjacent to the first lead and the first lead is less than 5 microns.

[0018] The present application also provides an electronic device, including a circuit board, wherein the circuit board includes:

[0019] substrate;

[0020] The first board surface of the substrate includes a first component and a second component that is a certain distance away from the first component;

[0021] The first component is connected to the second component via a plurality of first leads;

[0022] The areas through which the first leads pass form a first lead area;

[0023] A second lead is arranged in at least one sub-lead region where the first lead region is sparsely arranged.

[0024] Compared with the prior art, the beneficial effect of the embodiments of the present application is that: by arranging at least one second lead in at least one sub-lead area that is sparsely arranged in the first lead area, the present application can make the routing density in the sub-lead area relatively close to the second component and the sub-lead area relatively far away from the second component closer, thereby achieving the purpose of reducing the visual difference between different sub-lead areas, making it difficult for the naked eye to see the visual difference caused by the different arrangement density of the first lead, thereby improving the visual effect of the electronic device using the circuit board and enhancing the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the drawings, which are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar parts. The accompanying drawings generally illustrate various embodiments by way of example and not limitation, and together with the specification and claims, are used to illustrate the disclosed embodiments. When appropriate, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Such embodiments are illustrative and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method.

[0026] Figure 1 This is a first structural schematic diagram of a circuit board according to an embodiment of the present application;

[0027] Figure 2 This is a second structural schematic diagram of the circuit board of an embodiment of the present application;

[0028] Figure 3 This is a third structural schematic diagram of the circuit board of the embodiment of the present application;

[0029] Figure 4 for Figure 3 Middle AA section view;

[0030] Figure 5 This is a fourth structural schematic diagram of the circuit board of an embodiment of the present application;

[0031] Figure 6 This is a cross-sectional view of the circuit board of an embodiment of the present application, in which a light-shielding layer is shown.

[0032] The components indicated by the reference numerals in the figures are:

[0033] 1-substrate; 11-first functional area; 12-insulating layer; 13-second functional area; 2-first component; 3-second component; 4-first lead area; 41-first lead; 42-second lead; 43-first sub-lead area; 44-second sub-lead area; 5-third component; 6-second lead area; 61-third lead; 7-light shielding layer. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific implementation examples. The embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and specific implementation examples, but are not intended to limit the present application.

[0035] The words "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] In the present application, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0037] All terms (including technical terms or scientific terms) used in this application have the same meaning as those understood by ordinary technicians in the field to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0039] The present application embodiment provides a circuit board, such as Figure 1As shown, the circuit board includes a substrate 1, and the first board surface of the substrate 1 includes a first component 2 and a second component 3 that is a certain distance away from the first component 2; the first component 2 is connected to the second component 3 through a plurality of first leads 41; the area through which the plurality of first leads 41 pass forms a first lead area 4; and a second lead 42 is arranged in at least one sub-lead area that is sparsely arranged in the first lead area 4.

[0040] The first component 2 and the second component 3 may be at least one of various components such as a resistor, a capacitor, an inductor, a transistor, a touch electrode, a controller, and an electron tube.

[0041] The circuit board can be applied to electronic devices, including but not limited to mobile phones, tablet computers, laptop computers, personal computers (PCs), wearable devices, augmented reality (AR) / virtual reality (VR) devices and other terminal devices.

[0042] In one embodiment, the first lead 41 and the second lead 42 may both be made of metal, such as copper foil, and the line width, line spacing and specific materials of the first lead 41 and the second lead 42 may be adjusted to achieve a similar brightness value between the first lead region 4 and other regions on the substrate 1, thereby achieving a uniform visual effect. The brightness value is related to the material of the first lead 41 and the second lead 42. When both are made of metal, the brightness value of the first lead region 4 will be increased accordingly. The brightness value can be adjusted by changing the lead made of metal material.

[0043] In one embodiment, the first component 2 may be multiple, and the first component 2 is connected to the second component 3 through at least one first lead 41. Figure 1 , Figure 1 Three first components 2 are shown, and the three first components 2 are connected to the second component 3 through the first lead 41 respectively. Figure 1 The lead arrangement method in the embodiment makes the arrangement density of the first lead 41 in the sub-lead area close to the second component 3 greater than the arrangement density of the first lead 41 in the sub-lead area far from the second component 3, that is, the lead arrangement density of each sub-lead area in the first lead area 4 is different. The difference in lead arrangement density will cause brightness difference. For example, the brightness value of the area with denser lead arrangement will be relatively high, and the brightness value of the area with sparser lead arrangement will be relatively low. The brightness difference caused by different lead arrangement density will affect the visual effect when the user uses it.

[0044] Furthermore, at least one second lead 42 is arranged in a sparsely arranged sub-lead area in the first lead area 4. The second lead 42 can be connected to the first lead 41, or may not be connected to the first lead 41. By adding the second lead 42, the lead arrangement density of each sub-lead area in the first lead area 4 can be close.

[0045] In one embodiment, the direction from the first component 2 to the second component 3 may be a first layout direction, such as Figure 1 As shown, the first layout direction may be a vertical direction, the first lead 41 may include a first portion extending along a lateral direction and a second portion extending along a vertical direction, and the length direction of the second lead 42 may be the same as the first layout direction, or may be the same as a second layout direction perpendicular to the first layout direction. Figure 1 The length direction of the second lead 42 shown in FIG. 4 is the same as the first layout direction, but the present application is not limited thereto.

[0046] In one embodiment, the first lead area 4 can be divided into a plurality of sub-lead areas along the first layout direction, and the first lead area 4 can also be divided into a plurality of sub-lead areas along the second layout direction. Figure 1 , Figure 1 The sub-lead regions shown in FIG. 4 are obtained by dividing the first lead region 4 along the first layout direction.

[0047] In one embodiment, a sub-lead area in which the lead arrangement is sparser than other sub-lead areas can be determined by machine recognition or based on the wiring design of the circuit board. After determining at least one sub-lead area in which the lead arrangement density is sparse among multiple sub-lead areas, the visual effect of the lead arrangement of the at least one sub-lead area identified by the human eye can be adjusted, such as adding or reducing the second lead, or adjusting the shape and setting position of the second lead, etc., so as to achieve the purpose of close lead arrangement density in each sub-lead area.

[0048] In one embodiment, the second lead 42 may be in the shape of a strip, an L-shape, a U-shape or other shapes, so that the lead arrangement density of each sub-lead area within the first lead area 4 is similar, thereby achieving the effect of reducing visual differences.

[0049] By arranging at least one second lead 42 in at least one sub-lead area sparsely arranged in the first lead area 4, the wiring density in the sub-lead area relatively close to the second component 3 and the sub-lead area relatively far from the second component 3 can be made closer, thereby achieving the purpose of reducing the visual difference between different sub-lead areas, making it difficult for the naked eye to see the visual difference caused by the different arrangement density of the first lead 41, thereby improving the visual effect of the electronic device using the circuit board and enhancing the user experience.

[0050] In some embodiments, Figure 1 As shown, there are multiple second leads 42, which are arranged at intervals, and the arrangement direction of the second leads 42 is the same as or perpendicular to the first leads 41. The line width of the second leads 42 can be the same as or different from the line width of the first leads 41.

[0051] In one embodiment, if Figure 1 As shown, the first lead 41 is L-shaped, and multiple first leads 41 are arranged in sequence along the transverse direction. The multiple second leads 42 are strip-shaped, and multiple second leads 42 are vertically arranged and arranged at intervals along the transverse direction. Of course, the second leads 42 can also be arranged along an arrangement direction perpendicular to the first leads 41, that is, multiple second leads 42 are arranged horizontally and arranged at intervals along the vertical direction.

[0052] Furthermore, the arrangement direction of the second leads 42 may also be the first arrangement direction. Alternatively, there are multiple second leads 42, several of which are arranged along the first arrangement direction, and the other second leads 42 are arranged along the second arrangement direction.

[0053] In some embodiments, Figure 2 As shown, two ends of the second lead 42 are respectively connected to the first lead 41 located in the same sub-lead region as the second lead 42 to reduce the resistance value of the first lead 41 .

[0054] Since the lengths of the multiple first leads 41 are different, the resistance of the first leads 41 is different (the widths of the multiple first leads 41 are the same), that is, the resistance of the longer first lead 41 will be greater than the resistance of the shorter first lead 41, thereby affecting the consistency of the functional signals of each first lead 41. For example, if the first component 2 is a touch electrode, then since the lengths of the first leads 41 are different, the touch sensitivity of the first components 2 respectively connected to the first leads 41 will also be affected. Connecting the second lead 42 to the first lead 41 can reduce the width of the first lead 41 to reduce the resistance of the first lead 41, thereby reducing the resistance difference of each first lead 41, thereby improving the touch sensitivity of the first component 2.

[0055] In one embodiment, the length of the first lead 41 may correspond to the length of the second lead 42, that is, the first lead 41 with a longer length may be connected to the second lead 42 with a first length, and the first lead 41 with a shorter length may be connected to the second lead 42 with a second length, and the first length is greater than the second length, thereby achieving the purpose of reducing the resistance difference of each first lead 41.

[0056] In one embodiment, the second lead 42 may include a plurality of first portions arranged in parallel and having a length direction in a first arrangement direction, and a second portion connected to one end of the plurality of first portions located on one side, that is, the plurality of first portions of the second lead 42 are all connected to the second portion thereof, such as Figure 2 The two first portions extending in the longitudinal direction shown in FIG. 4 are connected to a second portion extending in the transverse direction, so that both ends of the second lead 42 can be connected to the first lead 41. Figure 2 As shown, Figure 2 It is shown that the first part of the second lead 42 connected to the longest first lead 41 is two, and the second part is one, which can further reduce the resistance of the first lead 41, and the arrangement of the second lead 42 can reduce the difference in visual effects of each sub-lead area, so that the structural design of the circuit board can better enhance the user experience.

[0057] In some embodiments, Figure 1 and Figure 2 As shown, at least one sub-lead area among the multiple sub-lead areas that is relatively far away from the second component 3 is a first sub-lead area 43, and at least one sub-lead area among the multiple sub-lead areas that is relatively close to the second component 3 is a second sub-lead area 44. Multiple second leads 42 are provided in the first sub-lead area 43 and the second sub-lead area 44, and the number of second leads 42 in the first sub-lead area 43 is greater than the number of second leads 42 in the second sub-lead area 44.

[0058] In one embodiment, the sub-lead area can be divided into a first sub-lead area 43, a second sub-lead area 44, a third sub-lead area,...the Nth sub-lead area along the direction from the first component 2 to the second component 3, and the lead arrangement density of the above multiple sub-lead areas is gradually increased, that is, the lead arrangement density of the first sub-lead area 43 is smaller than that of the second sub-lead area 44, the lead arrangement density of the second sub-lead area 44 is smaller than that of the third sub-lead area...the lead arrangement density of the N-1th sub-lead area is smaller than that of the Nth sub-lead area. Therefore, if the second lead 42 is set in the first sub-lead area 43, the second sub-lead area 44 and the third sub-lead area, the number of second leads 42 in the first sub-lead area 43, the second sub-lead area 44 and the third sub-lead area is reduced successively, so that the lead arrangement density in each sub-lead area is close, thereby achieving the purpose of significantly reducing the visual difference between each sub-lead area.

[0059] In some embodiments, Figure 3 and Figure 4As shown, the first board surface of the circuit board has a first functional area 11 for setting the first component 2, an insulating layer 12 arranged on the first functional area 11, a second functional area 13 arranged on the insulating layer 12, and a second lead area 6 arranged near the second functional area 13, a third component 5 is arranged on the second functional area 13, and a plurality of third leads 61 for connecting the third component 5 to a fourth component are arranged in the second lead area 6.

[0060] In one embodiment, the first functional area 11 and the first lead area 4 are located on a first layer on the substrate 1 , the second functional area 13 and the second lead area 6 are located on a substantially second layer, and the insulating layer 12 is located between the first layer and the second layer.

[0061] In one embodiment, the fourth component may be the same component as the second component 3 , or may be a different component from the second component 3 , and this application does not make any specific limitation on this. Figure 3 The second component 3 and the fourth component shown in FIG. 3 are the same component.

[0062] In some embodiments, Figure 3 and Figure 4 As shown, at least one second lead 42 is disposed between adjacent third lead 61 .

[0063] Furthermore, if Figure 5 As shown, two ends of the second lead 42 are respectively connected to the first lead 41 located in the same sub-lead region as the second lead 42 to reduce the resistance value of the first lead 41 .

[0064] In one embodiment, the second lead 42 disposed between the third lead 61 is not connected to the third lead 61 , and a plurality of second lead 42 may be disposed between adjacent third lead 61 .

[0065] In one embodiment, the plurality of second lead lines 42 may all be in a strip shape, and the plurality of second lead lines 42 may be arranged in parallel at certain intervals.

[0066] In some embodiments, the second lead 42 disposed between adjacent third leads 61 may also be connected to the third lead 61 so that the resistance difference of each third lead 61 can be reduced, thereby allowing the functional signals of each third lead 61 to remain consistent.

[0067] In some embodiments, Figure 6 As shown, the circuit board further includes a light shielding layer 7 disposed on the first board surface of the substrate 1 . The light shielding layer 7 is disposed corresponding to the first lead area 4 and is located below the first lead area 4 .

[0068] In one embodiment, the above-mentioned shading layer 7 is located between the substrate 1 and the insulating layer 12, and the shading layer 7 can be an ink layer. When the line width and line spacing of the first lead 41, the second lead 42 and the third lead 61 are large, the human eye can easily identify the leads. By providing the above-mentioned shading layer 7, the first lead 41, the second lead 42 and the third lead 42 can be shading, thereby achieving a better visual effect.

[0069] In some embodiments, the circuit board can be applied to a touch display component of an electronic device, the first component 2 is constructed as a first touch electrode, and multiple first touch electrodes are arranged in parallel along a first direction on the first functional area 11, the second component 3 is constructed as a driving controller connected to the multiple first touch electrodes through multiple first leads 41 respectively, the third component 5 is constructed as a second touch electrode connected to the fourth component through multiple third leads 61 respectively, and the multiple second touch electrodes are arranged in parallel along a second direction on the second functional area 13, wherein the first direction is perpendicular to the second direction.

[0070] In this way, the arrangement of the above-mentioned multiple first components 2 and second components 3, and the arrangement of the second lead 42 in the sub-lead area where the first lead area 4 is sparsely arranged, can solve the visual difference problem of the touch display component using the circuit board, and the second lead 42 can be connected to the first lead 41 or the third lead 61 close to it, so that the resistance difference of each first lead 41 can be reduced, so as to improve the touch sensitivity of the touch display component.

[0071] In some embodiments, the spacing between adjacent second leads 42 is less than 5 microns, the spacing between adjacent first leads 41 is less than 5 microns, and the spacing between a second lead 42 adjacent to a first lead 41 and the first lead 41 is less than 5 microns.

[0072] Preferably, the spacing between adjacent first leads 41 along their arrangement direction may be less than 3 microns, the spacing between second leads 42 adjacent to the first leads 41 may also be less than 3 microns, and the spacing between adjacent second leads 42 may also be less than 3 microns, so as to increase the lead arrangement density in the first lead area 4 and further improve the problem of visual difference.

[0073] The present application also provides an electronic device, such as Figure 1 As shown, the electronic device includes a circuit board, the circuit board includes a substrate 1, the first board surface of the substrate 1 includes a first component 2 and a second component 3 that is a certain distance away from the first component 2; the first component 2 is connected to the second component 3 through a plurality of first leads 41; the area through which the plurality of first leads 41 pass forms a first lead area 4; and a second lead 42 is arranged in at least one sub-lead area that is sparsely arranged in the first lead area 4.

[0074] The electronic device using the above-mentioned circuit board can arrange at least one second lead 42 in at least one sub-lead area sparsely arranged in the first lead area 4, so that the routing density in the sub-lead area relatively close to the second component 3 and the sub-lead area relatively far from the second component 3 are closer, thereby achieving the purpose of reducing the visual difference between different sub-lead areas, making it difficult for the naked eye to see the visual difference caused by the different arrangement density of the first lead 41, thereby improving the visual effect of the electronic device using the circuit board and enhancing the user experience.

[0075] In addition, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present application with equivalent elements, modifications, omissions, combinations (e.g., various embodiments intersecting schemes), adaptations or changes. The elements in the claims will be interpreted broadly based on the language adopted in the claims, and are not limited to the examples described in this specification or during the implementation of the application, and the examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0076] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. For example, those of ordinary skill in the art can use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the application. This should not be interpreted as an intention that a disclosed feature that does not require protection is necessary for any claim. On the contrary, the subject matter of the present application may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently used as a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present application should be determined with reference to the attached claims and the full scope of equivalent forms granted by these claims.

[0077] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A circuit board, characterized in that: include: substrate; The first board surface of the substrate includes a first component and a second component that is a certain distance away from the first component; The first component is connected to the second component via a plurality of first leads; The areas through which the first leads pass form a first lead area; A second lead is arranged in at least one sub-lead region where the first lead region is sparsely arranged; and The two ends of the second lead are respectively connected to the first lead located in the same sub-lead area as the second lead to reduce the resistance value of the first lead; wherein the first component is configured as a first touch electrode, and the second component is configured as a driving controller connected to the plurality of first touch electrodes respectively through the plurality of first leads; The first lead is in an L-shape, the second lead includes a first portion extending in a longitudinal direction and a second portion extending in a transverse direction, and one end of the first portion is connected to the second portion.

2. The circuit board according to claim 1, characterized in that: At least one sub-lead area among the multiple sub-lead areas that is relatively far away from the second component is a first sub-lead area, and at least one sub-lead area among the multiple sub-lead areas that is relatively close to the second component is a second sub-lead area. Multiple second leads are provided in the first sub-lead area and the second sub-lead area, and the number of second leads in the first sub-lead area is greater than the number of second leads in the second sub-lead area.

3. The circuit board according to claim 2, characterized in that: The first surface of the circuit board has a first functional area for setting the first component, an insulating layer set on the first functional area, a second functional area set on the insulating layer, and a second lead area set near the second functional area, a third component is set on the second functional area, and a plurality of third leads are set in the second lead area to enable the third component to be connected to a fourth component.

4. The circuit board according to claim 3, characterized in that: The circuit board further includes a light shielding layer disposed on the first board surface of the substrate, wherein the light shielding layer is disposed corresponding to the first lead area and is located below the first lead area.

5. The circuit board according to claim 3, characterized in that: A plurality of first touch electrodes are arranged in parallel on the first functional area along a first direction, the third component is constructed as a second touch electrode connected to the fourth component through a plurality of third leads respectively, and a plurality of second touch electrodes are arranged in parallel on the second functional area along a second direction, wherein the first direction is perpendicular to the second direction.

6. The circuit board according to claim 1, characterized in that: The spacing between adjacent second leads is less than 5 micrometers, the spacing between adjacent first leads is less than 5 micrometers, and the spacing between the second lead adjacent to the first lead and the first lead is less than 5 micrometers.

7. An electronic device, characterized in that: A circuit board is included, and the circuit board includes: substrate; The first board surface of the substrate includes a first component and a second component that is a certain distance away from the first component; The first component is connected to the second component via a plurality of first leads; The areas through which the first leads pass form a first lead area; A second lead is arranged in at least one sub-lead region where the first lead region is sparsely arranged; and The two ends of the second lead are respectively connected to the first lead located in the same sub-lead area as the second lead to reduce the resistance value of the first lead; wherein the first component is configured as a first touch electrode, and the second component is configured as a driving controller connected to the plurality of first touch electrodes respectively through the plurality of first leads; The first lead is in an L-shape, the second lead includes a first portion extending in a longitudinal direction and a second portion extending in a transverse direction, and one end of the first portion is connected to the second portion.

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