A "sandwich" type active array antenna system architecture

Abstract

The present invention discloses a "sandwich" active array antenna system architecture in the field of antennas, comprising a ceramic active antenna board, a ceramic wave control board, and a metal heat dissipation cold plate. The ceramic active antenna board has an antenna mounted on its top surface, an active transceiver circuit and a feed network arranged internally, and a plurality of interface pads for port connections arranged on its bottom. The bottoms of the ceramic active antenna board and the ceramic wave control board are each mounted with a plurality of chips, and the ceramic wave control board has a beam control circuit and a secondary power supply circuit arranged internally. The metal heat dissipation cold plate is fixed between the ceramic active antenna board and the ceramic wave control board, and a first cavity window is formed on its surface corresponding to the chip of the ceramic active antenna board, and a second cavity window is formed on its surface corresponding to the interface pad. A third cavity window is formed on the surface of the ceramic wave control board corresponding to the second cavity window. The present invention has the characteristics of being thin, light, having low signal transmission loss, and having good heat dissipation.

Description

Technical Field

[0001] The present invention relates to the field of antennas, and in particular to a "sandwich" type active array antenna system architecture. Background Art

[0002] The design of an active array antenna system requires consideration not only of electrical performance but also of system size, weight, and heat dissipation. Traditional active array antenna systems design and manufacture the array antenna, active transceiver components, feed network, and beam steering module separately, then connect these components with cables to create a "brick" system, each with its own heat dissipation structure. Due to their large size, weight, and high signal transmission loss, these "brick" systems are gradually being replaced by "tile" systems.

[0003] The "tile" type active array antenna system designs and manufactures the array antenna, active transceiver components, feed network, etc. into an active antenna circuit board, and uses cables or connectors to connect the beam control module to the active antenna circuit board to form a system, in which the active antenna circuit board and the beam control module each include a heat dissipation structure.

[0004] The design of radio frequency systems for equipment such as spaceborne SAR and airborne radar requires active array antennas to be thinner, lighter, with lower signal transmission loss and higher transmission power. Currently, the commonly used "brick" and "tile" system architectures are no longer able to simultaneously meet the technical requirements for antenna systems in terms of thickness, weight, signal transmission loss, and transmission power.

[0005] The present invention proposes a "sandwich" type active array antenna system architecture that can solve the above technical problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a "sandwich" type active array antenna system architecture to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A "sandwich"-type active array antenna system architecture includes a ceramic active antenna board, a ceramic wave control board, and a metal heat dissipation cold plate; the ceramic active antenna board has an antenna mounted on its upper surface, an active transceiver circuit and a feed network arranged internally, and a plurality of interface pads for port connections arranged on its bottom; a plurality of chips are respectively mounted on the bottoms of the ceramic active antenna board and the ceramic wave control board, and a beam control circuit and a secondary power supply circuit are arranged internally on the ceramic wave control board; the metal heat dissipation cold plate is fixed between the ceramic active antenna board and the ceramic wave control board, and has a first cavity window formed through its surface corresponding to the chip of the ceramic active antenna board, and a second cavity window formed through its surface corresponding to the interface pad of the ceramic active antenna board; the ceramic wave control board has a third cavity window formed on its surface corresponding to the second cavity window, and the interface pad of the ceramic active antenna board is connected to the beam control circuit and the secondary power supply circuit on the ceramic wave control board via metal leads passing through the second and third cavity windows.

[0009] In some embodiments, the metal lead includes a metal lead pin and a metal wire. The metal lead pin is fixed on the interface pad of the ceramic active antenna board and extends into the second cavity window to form a signal interface. The metal lead pin is connected to the beam control circuit and the secondary power supply circuit on the ceramic wave control board through the metal wire.

[0010] In some embodiments, the chip at the bottom of the ceramic wave control board is packaged by a metal sealed housing.

[0011] In some embodiments, the ceramic active antenna board and the chip at the bottom of the ceramic wave control board are packaged using BGA, and the gap between the first cavity window of the metal heat dissipation cold plate and the chip at the bottom of the ceramic active antenna board is filled with thermal conductive glue.

[0012] In some embodiments, a cooling liquid channel is provided inside the metal heat dissipation cold plate.

[0013] In some embodiments, the metal heat dissipation cold plate is made of Kovar metal or a material having a thermal conductivity greater than 100 W / m·K and a thermal expansion coefficient within a range of 4 to 10 ppm / °C.

[0014] The ceramic active antenna board and the ceramic wave control board are LTCC multi-layer wiring ceramic boards or HTCC multi-layer wiring ceramic boards.

[0015] Beneficial effects: The present invention integrates the array antenna, active transceiver circuit, feed network, etc. into the ceramic active antenna board, and integrates the beam control circuit and secondary power supply circuit into the ceramic wave control board. A metal heat dissipation cold plate with integrated high and low frequency signal interfaces is welded between the two to form an active array antenna system with thin thickness, light weight, small signal transmission loss and good heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view of Example 1;

[0017] Figure 2 It is a bottom view of Example 1;

[0018] Figure 3 for Figure 2 AA cross-sectional view;

[0019] Figure 4 is a top view of Example 2;

[0020] Figure 5 It is a bottom view of Example 2;

[0021] Figure 6 for Figure 5 BB cross-sectional view.

[0022] In the figure: 1-ceramic active antenna board; 2-metal heat dissipation cold plate; 3-ceramic wave control board; 4-antenna; 5-chip; 6-metal lead pin; 701-first cavity window; 702-second cavity window; 703-third cavity window; 8-metal wire; 9-coaxial high-frequency connector; 10-low-frequency connector; 11-metal sealed housing; 12-thermal conductive adhesive. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1, see Figure 1 、 Figure 2 、 Figure 3 A "sandwich" type active array antenna system architecture includes a ceramic active antenna board 1, a ceramic wave control board 3 and a metal heat dissipation cold plate 2.

[0025] The ceramic active antenna board 1 is made of a 30mm×30mm×3mm LTCC multilayer wiring ceramic circuit board. An X-band 2x2 array antenna 4 is designed and fabricated on the top surface of the board. Four transceiver chips 5 are mounted on the bottom surface via solder pads. The board houses the active transceiver circuitry and a feed network, including an RF power combiner / distributor. The 2x2 array antenna 4 and the active transceiver circuitry are interconnected via metal vias within the board, eliminating the need for connectors. This shortens the signal transmission path and minimizes transmission loss. Two interface pads are also located on the bottom surface: one for the RF coaxial pad and the other for the low-frequency control 2x4 array pad. Metal pins 6 are soldered to each of these interface pads.

[0026] The metal cold plate 2 has dimensions of 40mm x 40mm x 2mm and is made of AlSiC, a material with a thermal expansion coefficient close to that of LTCC ceramics. It is welded to the bottom surface of the ceramic active antenna board 1. Four square first cavity windows 701 are defined on the metal cold plate 2, corresponding to the locations of the four transceiver chips 5 on the bottom of the ceramic active antenna board 1. The length and width of the first cavity windows 701 are larger than the length and width of the bonding wire interconnect pads surrounding the chips 5.

[0027] The metal heat sink cold plate 2 has a circular second cavity window 702 corresponding to the RF coaxial pad at the bottom of the ceramic active antenna board 1. The metal pins 6 on the RF coaxial pad extend into this second cavity window 702. The diameter of this second cavity window 702 is calculated to form an air coaxial high-frequency signal interface with a characteristic impedance, such as 50 ohms in this embodiment. The metal heat sink cold plate 2 also has a square second cavity window 702 corresponding to the low-frequency control 2×4 array pad. The length and width of this second cavity window 702 are larger than those of the array pad. Together with the metal pins 6 in the low-frequency control 2×4 array pad, it forms a 2×4 array low-frequency signal interface.

[0028] The ceramic wave control board 3 is a multilayer LTCC ceramic board, soldered to the lower surface of the metal heat sink cold plate 2. The beam control circuitry and secondary power supply circuit wiring are arranged within the ceramic wave control board 3. Four chips 5 are mounted on the lower surface of the ceramic wave control board 3 via solder pads, each encapsulated in a metal sealed housing 11. The lower surface of the ceramic wave control board 3 is also connected to a coaxial high-frequency connector 9 and an 8-pin 2×4 array low-frequency connector. Corresponding to the two second cavity windows 702 on the metal heat sink cold plate 2, a circular third cavity window 703 and a square third cavity window 703 are formed through the ceramic wave control board 3. These third cavity windows 703 match the dimensions of the circular and square second cavity windows 702 on the metal heat sink cold plate 2, respectively. The metal pins 6 in the two signal interfaces are connected to the beam control circuit and secondary power supply circuit on the ceramic wave control board 3 through metal wires 8. In this way, the interconnection path between the active transceiver circuit and the beam control circuit and the secondary power supply circuit is short, and the connection loss is small, ultimately forming a "sandwich" type X-band active array antenna system with a three-layer structure of LTCC ceramic-AlSiC metal-LTCC ceramic.

[0029] Example 2, see Figure 4 、 Figure 5 、 Figure 6 This embodiment differs from Example 1 in that the ceramic active antenna board 1 and ceramic wave control board 3 are AlN-HTCC multilayer wiring ceramic boards, and the metal heat sink cold plate 2 is made of Kovar metal, which has a similar thermal expansion coefficient, achieving similarly excellent heat dissipation performance. The chip 5 is packaged in a BGA package, and the gap between the first cavity window 701 of the metal heat sink cold plate 2 and the chip 5 on the bottom of the ceramic active antenna board 1 is filled with thermally conductive adhesive 12.

[0030] In other embodiments, the dimensions and materials of the ceramic active antenna board 1, ceramic wave control board 3, and metal heat sink cold plate 2 can be selected based on actual needs. To ensure good heat dissipation and installation, the metal heat sink cold plate 2 is preferably larger than the ceramic active antenna board 1 and ceramic wave control board 3. The number and location of the chips and interface pads mounted on the ceramic active antenna board 1 and ceramic wave control board 3 can be adjusted based on actual needs; it is sufficient to ensure that the interface pads on the ceramic active antenna board 1 and ceramic wave control board 3 are aligned.

[0031] In some preferred embodiments, a cooling liquid channel may be further provided in the metal heat dissipation cold plate 2 to achieve a better heat dissipation effect.

[0032] In the above embodiment, the antenna system utilizes a three-layer, "sandwich" architecture, utilizing a ceramic-metal-ceramic welded structure. Because it shares a central metal heat sink for heat dissipation, it boasts a compact structure and reduces the bulk of existing heat sink structures. This reduces the overall thickness and volume of the antenna system, resulting in a correspondingly lighter unit area for ease of use. Because the beam steering circuitry and secondary power supply circuitry on the ceramic wave control board, as well as the active transceiver circuitry within the ceramic active antenna board 1, are all tightly bonded to the metal heat sink, the heat dissipation path is short, resulting in effective heat dissipation.

[0033] Furthermore, the entire system utilizes highly stable materials such as metals and ceramics. The first cavity window effectively seals and protects the chip at the bottom of the ceramic active antenna board 1. The chip at the bottom of the ceramic wave control board 3 is also protected by a sealed metal housing or BGA package, resulting in high system stability. The modular design of the antenna system facilitates mass production and can be easily combined and expanded into larger array antenna systems.

[0034] Although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0035] Therefore, the above description is only a preferred embodiment of the present application and is not intended to limit the scope of implementation of the present application; that is, all equivalent modifications made according to the scope of the claims of the present application are within the scope of protection of the claims of the present application.

Claims

1. A "sandwich" type active array antenna system architecture, comprising a ceramic active antenna board (1), a ceramic wave control board (3) and a metal heat dissipation cold plate (2); an antenna (4) is mounted on the upper surface of the ceramic active antenna board (1), an active transceiver circuit and a feed network are arranged inside, and a plurality of interface pads for port connection are arranged on the bottom; a plurality of chips (5) are respectively installed on the bottom of the ceramic active antenna board (1) and the ceramic wave control board (3), characterized in that: The ceramic wave control board (3) is provided with a beam control circuit and a secondary power supply circuit inside; the metal heat dissipation cold plate (2) is fixed between the ceramic active antenna board (1) and the ceramic wave control board (3), and a first cavity window (701) is provided on its surface corresponding to the chip (5) of the ceramic active antenna board (1), and a second cavity window (702) is provided on its surface corresponding to the interface pad of the ceramic active antenna board (1); a third cavity window (703) is provided on the surface of the ceramic wave control board (3) corresponding to the second cavity window (702), and the interface pad of the ceramic active antenna board (1) is connected to the beam control circuit and the secondary power supply circuit on the ceramic wave control board (3) via metal leads passing through the second cavity window (702) and the third cavity window (703); a cooling liquid channel is provided inside the metal heat dissipation cold plate (2).

2. The "sandwich" type active array antenna system architecture according to claim 1, characterized in that: The metal lead comprises a metal lead pin (6) and a metal wire (8); the metal lead pin (6) is fixed on the interface pad of the ceramic active antenna board (1) and extends into the second cavity window (702) to form a signal interface; the metal lead pin (6) is connected to the beam control circuit and the secondary power supply circuit on the ceramic wave control board (3) through the metal wire (8).

3. The "sandwich" type active array antenna system architecture according to claim 1, characterized in that: The chip (5) at the bottom of the ceramic wave control board (3) is packaged by a metal sealing shell (11).

4. The "sandwich" type active array antenna system architecture according to claim 1, characterized in that: The ceramic active antenna board (1) and the chip (5) at the bottom of the ceramic wave control board (3) are packaged using BGA, and the gap between the first cavity window (701) of the metal heat dissipation cold plate (2) and the chip (5) at the bottom of the ceramic active antenna board (1) is filled with thermal conductive glue (12).

5. The "sandwich" type active array antenna system architecture according to claim 1, characterized in that: The material of the metal heat dissipation cold plate (2) is Kovar metal or a material with a thermal conductivity greater than 100 W / m·K and a thermal expansion coefficient within the range of 4 to 10 ppm / °C.

6. The "sandwich" type active array antenna system architecture according to claim 1, characterized in that: The ceramic active antenna plate (1) and the ceramic wave control plate (3) are LTCC multi-layer wiring ceramic plates or HTCC multi-layer wiring ceramic plates.

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