Electronic device including antenna module with dielectric sheet attached

Abstract

An electronic device is provided. The electronic device includes: a display having a first surface; a metal frame structure configured to form a side surface of the electronic device; a back plate having a second surface facing a third direction; at least one antenna module disposed within the side surface and having a radiating surface; at least one dielectric layer having at least a partial area attached to the radiating surface; and a wireless communication circuit configured to transmit or receive radio frequency (RF) signals to or from the at least one antenna module, wherein the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is made of a material having a second dielectric constant greater than the first dielectric constant.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an antenna module to which a dielectric sheet is attached. Background Art

[0002] The development of wireless communication technology has been accompanied by the widespread use of electronic devices (e.g., electronic devices used for communication), which has led to an exponential growth in content usage. This rapid growth in content usage has been accompanied by a rapid increase in demand for wireless traffic, resulting in a growing demand for high-speed data transmission.

[0003] This demand for high-speed data communication has led to a gradual increase in electronic devices supporting high-speed wireless communication technologies including next-generation wireless communication technologies (e.g., fifth-generation (5G) communication) using millimeter waves (mmWave) of 20 GHz or higher and the Wireless Gigabit Alliance (WIGIG) (e.g., 802.11AD).

[0004] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the Invention

[0005] Technical issues

[0006] Next-generation wireless communication technologies primarily utilize millimeter waves (mmWave) at frequencies of 20 GHz or higher. Consequently, array antennas with multiple antenna elements spaced apart can be used to overcome the high free-space loss caused by frequency characteristics and improve antenna gain. While the gain of array antennas increases proportionally with the number of element antenna elements, the increased size can make securing installation space difficult.

[0007] In order to ensure installation space for the array antenna, it has been proposed to install the array antenna on the inner wall of the side surface of the electronic device. This method can ensure installation space for the array antenna, but the metal frame forming the side surface of the electronic device will cover the area of ​​the radiation surface of the array antenna.

[0008] As a result, due to the electric field component reflected by the metal frame, the antenna beam radiated by the array antenna may be formed in a direction in which it is partially tilted toward the rear panel of the electronic device rather than in the boresight direction, thereby degrading antenna performance.

[0009] Furthermore, electronic devices supporting next-generation wireless communication technologies operate on large amounts of data and therefore include multiple active components (e.g., amplifiers and phase modulators in radio frequency (RF) front-ends) for high data transmission rates. In this case, array antennas generate heat during data transmission or reception.

[0010] Therefore, one approach has been to attach a dielectric sheet with a low dielectric constant to the surface of the metal frame to radiate the heat generated by the antenna array. However, to prevent degradation of antenna performance, this approach requires an air gap between the dielectric sheet and the antenna array. As a result, heat is transferred between the dielectric sheet and the array antenna through the air, reducing heat radiation efficiency.

[0011] Various aspects of the present disclosure are to at least address the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide an electronic device that can minimize the influence of a metal frame structure by using a dielectric sheet having a combination of low and high dielectric constants, thereby improving antenna coverage and effectively radiating heat generated by an array antenna.

[0012] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0013] Problem Solution

[0014] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device, wherein the side surface faces a second direction perpendicular to the first direction; a back panel having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface and having a radiating surface facing the second direction; at least one dielectric layer having at least a portion of the radiating surface attached to the at least one antenna module and disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit or receive RF signals in a predetermined frequency band to or from the at least one antenna module. The at least one dielectric layer may include a first dielectric sheet attached to at least a portion of the radiating surface of the antenna module and a second dielectric sheet disposed on the first dielectric sheet along the second direction. The first dielectric sheet may be made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet may be made of a material having a second dielectric constant greater than the first dielectric constant.

[0015] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device, wherein the side surface faces a second direction perpendicular to the first direction; a back panel having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface and having a radiating surface facing the second direction; at least one dielectric layer having at least a portion attached to an inner side of the side surface and disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit or receive RF signals in a predetermined frequency band to or from the at least one antenna module. The at least one dielectric layer may include a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is disposed on the radiating surface of the at least one antenna module along the second direction, and the second dielectric sheet is disposed between the first dielectric sheet and the side surface and has a surface attached to an inner side of the side surface. The first dielectric sheet may be made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet may be made of a material having a second dielectric constant greater than the first dielectric constant.

[0016] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device, wherein the side surface faces a second direction perpendicular to the first direction; a back panel having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface; at least one dielectric layer disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit or receive RF signals in a predetermined frequency band to or from the at least one antenna module. The at least one antenna module may include: a printed circuit board having a third surface facing a second direction and a fourth surface facing a direction opposite to the second direction; and a plurality of antenna elements disposed on the first surface of the printed circuit board. The at least one dielectric layer may include a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is attached to at least a portion of the third surface of the printed circuit board and is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is disposed on the first dielectric sheet along the second direction and is made of a material having a second dielectric constant greater than the first dielectric constant. The second dielectric sheet may include at least one first opening formed at a position corresponding to at least a partial area of ​​the plurality of antenna elements.

[0017] The electronic device according to the embodiment can alleviate the degradation of antenna radiation performance caused by the metal frame structure.

[0018] In addition, the electronic device according to the embodiment can ensure antenna beam coverage in the line-of-sight direction.

[0019] Furthermore, the electronic device according to the embodiment may diffuse heat generated by the antenna module to another element (eg, a metal frame structure) inside the electronic device, thereby improving heat radiation efficiency.

[0020] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure;

[0023] Figure 2 is a block diagram of an electronic device in a network environment including multiple cellular networks according to an embodiment of the present disclosure;

[0024] Figure 3A is a perspective view showing a front surface of an electronic device according to an embodiment of the present disclosure;

[0025] Figure 3B The present invention is shown in the embodiment of the present invention. Figure 3A a perspective view of a rear surface of the electronic device shown in ;

[0026] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0027] Figure 5 is a view illustrating an antenna module provided in an electronic device according to an embodiment of the present disclosure;

[0028] Figure 6A is a perspective view showing an antenna module according to an embodiment of the present disclosure, viewed from a side;

[0029] Figure 6B is a diagram showing an embodiment of the present disclosure viewed from the other side. Figure 6A A perspective view of the antenna module shown in FIG;

[0030] Figure 6C is taken along line A-A' according to an embodiment of the present disclosure Figure 6A A cross-sectional view of the antenna module shown in FIG.

[0031] Figure 7A is an amplification of an embodiment according to the present disclosure Figure 5 A view of the antenna module and dielectric sheet shown in FIG;

[0032] Figure 7B It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown in ;

[0033] Figure 8A is an amplification of an embodiment according to the present disclosure Figure 5 A view of the antenna module and dielectric sheet shown in FIG;

[0034] Figure 8B It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown in ;

[0035] Figure 8C It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown in ;

[0036] Figure 9A is a graph comparing radiation directions of antenna beams according to whether a dielectric sheet exists when a radio frequency (RF) signal in a first frequency band is transmitted or received according to an embodiment of the present disclosure;

[0037] Figure 9B is a graph comparing radiation directions of antenna beams according to whether a dielectric sheet is present when an RF signal in a second frequency band is transmitted or received according to an embodiment of the present disclosure;

[0038] Figure 10A is a view showing a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure;

[0039] Figure 10B is a view showing a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure;

[0040] Figure 10C is a view showing a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure;

[0041] Figure 11A is a perspective view showing an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure;

[0042] Figure 11B FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the side. Figure 11A A side view of the antenna module and a dielectric sheet attached to the antenna module shown in FIG.

[0043] Figure 12A is a perspective view showing an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure;

[0044] Figure 12B FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the side. Figure 12A A side view of the antenna module and a dielectric sheet attached to the antenna module shown in FIG.

[0045] Figure 12C is a perspective view showing an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure;

[0046] Figure 12D is a perspective view showing an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure; and

[0047] Figure 12E is a perspective view illustrating an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure.

[0048] Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures. DETAILED DESCRIPTION

[0049] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist understanding, but these details are to be regarded as exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0050] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustration purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0051] It will be understood that singular forms include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0052] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0053] Reference Figure 1 In the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). Depending on the embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. Depending on the embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0054] The processor 120 may run software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., hardware component or software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculations, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or integrated with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or be specifically configured for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0055] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0056] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0057] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0058] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0059] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0060] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0061] The audio module 170 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0062] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0063] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0064] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0065] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0066] The camera module 180 may capture images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0067] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0068] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0069] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0070] Antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device) outside of electronic device 101. Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Depending on the embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for the communication scheme used in a communication network (e.g., first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0071] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0072] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0073] Figure 2 is a block diagram illustrating an example electronic device in a network environment including multiple cellular networks according to an embodiment of the present disclosure.

[0074] Reference Figure 2 , block diagram 200 depicts an electronic device 101, wherein the electronic device 101 may include a first communication processor (e.g., including processing circuitry) 212, a second communication processor (e.g., including processing circuitry) 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may also include a processor (e.g., including processing circuitry) 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device may also include Figure 1, and the second network 199 may also include at least one other network. Depending on the embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

[0075] The first communication processor 212 may support the establishment of a communication channel having a frequency band to be used for wireless communication with the first cellular network 292 and conduct traditional network communication via the established communication channel. According to various embodiments, the first cellular network may be a traditional network including a second generation (2G), third generation (3G), fourth generation (4G), or long term evolution (LTE) network. The second communication processor 214 may support the establishment of a communication channel corresponding to a designated frequency band (e.g., approximately 6 GHz to approximately 60 GHz) among the frequency bands to be used for communication with the second cellular network 294 and conduct fifth generation (5G) network communication via the established communication channel. According to various embodiments, the second cellular network 294 may be a 5G network defined in the Third Generation Partnership Project (3GPP). Furthermore, depending on the embodiment, the first communication processor 212 or the second communication processor 214 may support the establishment of a communication channel corresponding to another designated frequency band (e.g., approximately 6 GHz or lower) among the frequency bands to be used for wireless communication with the second cellular network 294 and conduct 5G network communication via the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be provided in a single chip or a single package together with the processor 120, the auxiliary processor 123, or the communication module 190. According to an embodiment, the first communication processor 212 and the second communication processor 214 are directly or indirectly connected through an interface (not shown), thereby being able to provide or receive data or control signals in one direction or in both directions.

[0076] During transmission, the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal ranging from approximately 700 MHz to approximately 3 GHz for the first cellular network 292 (e.g., a legacy network). During reception, the RF signal may be obtained from the first cellular network 292 (e.g., a legacy network) via an antenna (e.g., the first antenna module 242) and pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal so that the pre-processed RF signal can be processed by the first communication processor 212.

[0077] The second RFIC 224 may convert baseband signals generated by the first communication processor 212 or the second communication processor 214 into RF signals in the Sub-6 frequency band (e.g., approximately 6 GHz or lower) for the second cellular network 294 (e.g., a 5G network) (hereinafter referred to as 5G Sub-6 RF signals). During reception, the 5G Sub-6 RF signals may be obtained from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., the second antenna module 244) and pre-processed by an RFFE (e.g., the second RFFE 234). The second RFIC 224 may convert the processed 5G Sub-6 RF signals into baseband signals so that they can be processed by the corresponding communication processor, either the first communication processor 212 or the second communication processor 214.

[0078] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal in the 5G Above 6 frequency band (e.g., approximately 6 GHz to approximately 60 GHz) for the second cellular network 294 (e.g., a 5G network) (hereinafter referred to as a 5G Above 6 RF signal). During reception, the 5G Above 6 RF signal may be obtained from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and pre-processed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal so that the pre-processed 5G Above 6 RF signal can be processed by the second communication processor 214. Depending on the embodiment, the third RFFE 236 may be provided as part of the third RFIC 226.

[0079] Depending on the embodiment, the electronic device 101 may include a fourth RFIC 228, either separate from or as part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an IF signal) in the intermediate frequency band (e.g., approximately 9 GHz to approximately 11 GHz), and then transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. During reception, the 5G Above 6 RF signal may be received from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal so that it can be processed by the second communication processor 214.

[0080] Depending on the embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least part of a single chip or a single package. Depending on the embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least part of a single chip or a single package. Depending on the embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module, and may process RF signals in multiple frequency bands.

[0081] According to an embodiment, the third RFIC 226 and antenna 248 may be disposed on a substrate, thereby forming the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (e.g., a main PCB). In this case, the third RFIC 226 may be disposed in a partial area (e.g., the bottom) of a second substrate (e.g., a sub-PCB) different from the first substrate, and the antenna 248 may be disposed in another partial area (e.g., the top) of the second substrate (e.g., the sub-PCB), thereby forming the third antenna module 246. By disposing the third RFIC 226 and antenna 248 on the same substrate, the length of the transmission line between them can be reduced. Consequently, signal loss (e.g., attenuation) caused by the transmission line can be reduced in high-frequency bands (e.g., approximately 6 GHz to approximately 60 GHz) used for 5G network communications, for example. Consequently, the electronic device 101 can improve the quality and speed of communications with the second cellular network 294 (e.g., a 5G network).

[0082] Depending on the embodiment, the antenna 248 may be an antenna array including multiple antenna elements that can be used for beamforming. In this case, the third RFIC 226 may include multiple phase shifters 238 (e.g., as part of the third RFFE 236) corresponding to the antenna elements. During transmission, the phase shifters 238 may shift the phase of a 5G Above 6 RF signal for transmission to an external device (e.g., to a base station of a 5G network) via the corresponding antenna elements. During reception, the phase shifters 238 may shift the phase of the 5G Above 6 RF signal received from the external device via the corresponding antenna elements to the same or substantially the same phase. This facilitates transmission or reception using beamforming between the electronic device 101 and the external device.

[0083] The second cellular network 294 (e.g., a 5G network) can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone (SA)) or can be connected and operated with the first cellular network 292 (e.g., a legacy network) (e.g., non-standalone (NSA)). For example, in a 5G network, only an access network (e.g., a 5G radio access network (RAN) or a next-generation RAN (NGRAN)) may exist, and no core network (e.g., a next-generation core (NGC)) may exist. In this case, the electronic device 101 can access the access network of the 5G network and then access an external network (e.g., the internet) under the control of the core network (e.g., the evolved packet core (EPC)) of the legacy network. Protocol information for communicating with the legacy network (e.g., LTE protocol information) or protocol information for communicating with the 5G network (e.g., new radio (NR) protocol information) can be stored in the memory 230 and accessed by another component (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0084] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to embodiments of the present disclosure, the electronic device is not limited to those described above.

[0085] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B, and C," and "at least one of A, B, or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0086] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0087] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0088] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (e.g., a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0089] According to various embodiments, each of the above-mentioned components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0090] Figure 3A is a perspective view illustrating a front surface of an electronic device according to an embodiment of the present disclosure.

[0091] Figure 3B The present invention is shown in the embodiment of the present invention. Figure 3A A perspective view of the rear surface of the electronic device shown in FIG.

[0092] Reference Figure 3A and Figure 3B , according to various embodiments of the electronic device 300 (eg, Figure 1 and Figure 2 The electronic device 101 shown in FIG may include a housing 310 having a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and side surfaces (or sidewalls) 310C surrounding a space between the first surface 310A and the second surface 310B. In another embodiment (not shown), the housing may represent a housing formed Figure 3A and Figure 3B The structures of some of the first surface 310A, the second surface 310B, and the side surfaces 310C shown in FIG.

[0093] According to an embodiment, the first surface 310A may be at least partially formed substantially by a transparent front plate 302 (e.g., a glass plate or a polymer plate including various coatings). According to an embodiment, the front plate 302 may have a curved portion that is curved at least at a side edge portion and seamlessly extends from the first surface 310A to the rear plate 311.

[0094] According to various embodiments, the second surface 310B may be formed of a substantially opaque rear panel 311. For example, the rear panel 311 may be made of coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of these materials. According to embodiments, the rear panel 311 may have a curved portion that curves at least at a side edge portion and seamlessly extends from the second surface 310B to the front panel 302.

[0095] According to an embodiment, the side surface 310C is combined with the front plate 302 and the rear plate 311 and may be formed by a side frame structure 318 (or "side member or sidewall") including metal and / or polymer. In an embodiment, the rear plate 311 and the side frame structure 318 may be integrated and may include the same material (e.g., a metal material such as aluminum).

[0096] According to various embodiments, the electronic device 300 may include at least one or more of a display 301, an audio module 303, a sensor module (not shown), camera devices 305, 312, 313, and 306, a key input device 317, and a connector hole 308. In embodiments, the electronic device 300 may not include at least one of the components (e.g., the key input device 317), or may further include other components. For example, the electronic device 300 may include a sensor module (not shown). For example, a sensor (such as a proximity sensor or an illumination sensor) may be integrated with the display 301 or may be provided adjacent to the display 301 in the area provided by the front panel 302. In embodiments, the electronic device 300 may further include a light emitting element, and the light emitting element may be provided adjacent to the display 301 in the area provided by the front panel 302. For example, the light emitting element may provide status information of the electronic device 300 by light type. In another embodiment, for example, the light emitting element may provide a light source that operates in conjunction with the camera device 305. Light emitting elements may include, for example, LEDs, IR LEDs, and xenon lamps.

[0097] For example, the display 301 may be visible through a large portion of the front panel 302. In an embodiment, the edge of the display 301 may be formed to substantially the same shape as the adjacent contour of the front panel 302 (e.g., a curved surface). In another embodiment (not shown), to expand the exposed area of ​​the display 301, the gap between the contours of the display 301 and the contours of the front panel 302 may be substantially uniform. In another embodiment (not shown), a groove or opening may be formed in a portion of the display area of ​​the display 301, and other electronic devices (such as the camera device 305 and a proximity sensor or an illumination sensor (not shown)) may be included in alignment with the groove or opening.

[0098] In another embodiment (not shown), at least one or more of a camera module (e.g., 312 and 313), a fingerprint sensor, and a flash may be provided on the rear surface of the display area of ​​the display 301. In another embodiment, the display 301 may be combined with or provided adjacent to a touch sensing circuit, a pressure sensor that can measure the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic stylus.

[0099] The audio module 303 may have a microphone hole or a speaker hole. A microphone for capturing external sound may be placed in the microphone hole. In embodiments, multiple microphones may be placed therein to sense the direction of the sound. In embodiments, the speaker hole and the microphone hole may be implemented as a single hole (e.g., in the audio module 303), or a speaker may be included without the speaker hole (e.g., a piezoelectric speaker). The speaker hole may include an external speaker hole for phone calls and a receiving hole 314.

[0100] The electronic device 300 includes a sensor module (not shown) that can generate electrical signals or data values ​​corresponding to internal operating states or external environmental states. For example, the sensor module may further include a proximity sensor provided on the first surface 310A of the housing 310, a fingerprint sensor integrated with or provided adjacent to the display 301, and / or a biometric sensor (e.g., an HRM sensor) provided on the second surface 310B of the housing 310. The electronic device 300 may further include a sensor module (not shown) such as at least one of a gesture sensor, a gyroscope sensor, a barometer sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0101] The camera devices 305, 312, 313, and 306 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and second camera devices 312 and 313 and / or a flash (e.g., camera device 306) disposed on a second surface 310B. The camera devices 305, 312, and 313 may include one or more lenses, image sensors, and / or image signal processors. The flash (e.g., camera device 306) may include, for example, a light-emitting diode (LED) or a xenon lamp. In embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on a single surface of the electronic device 300.

[0102] The key input device 317 may be provided on the side surface 310C of the housing 310. In another embodiment, the electronic device 300 may not include some or all of the key input devices 317 described above, and the key input devices 317 not included may be implemented in other types, such as software keys on the display 301. In an embodiment, the key input device may include at least a portion of the fingerprint sensor 316 provided on the second surface 310B.

[0103] The connector hole 308 can accommodate a connector for transmitting power and / or data to and receiving power and / or data from an external electronic device, and / or a connector for transmitting audio signals to and receiving audio signals from an external electronic device. For example, the connector hole 308 can include a USB connector or a headphone jack.

[0104] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0105] Reference Figure 4 , according to the electronic device 400 of the embodiment (eg, Figure 3A and Figure 3B The electronic device 300 shown in FIG. 3 may include a bracket 410 , a front plate 420 (eg, Figure 3A ), a display 430 (e.g., Figure 3A ), a printed circuit board 440, a battery 450, a support member 460 (eg, a rear case), an antenna 470, and a rear plate 480 (eg, Figure 3B ). According to an embodiment, the electronic device 400 may not include at least one component (eg, the support member 460) or more of the components, or may additionally include other components. At least one component of the components of the electronic device 400 according to an embodiment may be Figure 1 or Figure 2 At least one component of the electronic device 101 shown in Figure 3A and Figure 3B Components of the electronic device 300 shown in FIG. 3 are the same or similar, and repeated descriptions are omitted below.

[0106] According to an embodiment, the bracket 410 may include a metal frame structure 411 (eg, Figure 3A In an embodiment, the metal frame structure 411 is made of a metal material and can form a side surface of the electronic device 400 (eg, Figure 3A310C shown in FIG). In an embodiment, the support structure 412 has a metal region 4121 made of a metal material and a non-metal region 4122 formed by performing injection molding (e.g., insert injection molding) on ​​a non-metal material (e.g., a polymer) in at least a portion of the metal region 4121, and can provide an installation space in which electronic components can be provided in the electronic device 400. For example, the display 430 can be provided on a surface of the support structure 412, and the printed circuit board 340 can be provided on another surface of the support structure 412. According to an embodiment, the support structure 412 can be connected to the metal frame structure 411 or can be integrated with the metal frame structure 411. Although not shown in the drawings, at least one antenna module (e.g., Figure 2 The third antenna module 246 shown in FIG. 4 may be disposed inside the metal frame structure 411 or in a partial region of the support member 412 , which will be described in detail below.

[0107] According to an embodiment, a processor (e.g., Figure 1 ), memory (e.g., Figure 1 ) and / or an interface may be provided on the printed circuit board 440. For example, the processor may include one or more of a CPU, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0108] According to an embodiment, the battery 450, which is a device for supplying power to one or more components of the electronic device 400, may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 450 may be provided in substantially the same plane as the printed circuit board 340. The battery 450 may be integrally provided in the electronic device 400 and may be detachably attached to the electronic device 400.

[0109] Depending on the embodiment, antenna 470 may be disposed between rear panel 480 and battery 450. In embodiments, antenna 470 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, antenna 470 may perform near-field communication with an external device or wirelessly transmit and receive power for charging. In another embodiment, the antenna structure may be formed by a portion of the metal frame structure 411 and / or the support structure 412, or a combination thereof.

[0110] In an embodiment, the rear plate 480 may form a rear surface of the electronic device 400 (eg, Figure 3B The rear panel 480 may protect the electronic device 400 from external impact or foreign substances.

[0111] Figure 5 is a view illustrating an antenna module provided in an electronic device according to an embodiment of the present disclosure.

[0112] Reference Figure 5 , the electronic device 400 including the antenna module 500 according to the embodiment (eg, Figure 4 The electronic device 400 shown in FIG) may include: a metal frame structure 411 (eg, Figure 4 ) and a support structure 412 (e.g., Figure 4 4 and 5. The support structure 412 shown in FIG. 4 is a support structure 412 of FIG. 4. Figure 4 410 shown in FIG); a printed circuit board 440 (eg, Figure 4 PCB 440 shown in FIG); at least one antenna module 500 (eg, Figure 2 and at least one dielectric sheet 600. At least one of the components of the electronic device 400 according to the embodiment may be connected to Figure 3A and Figure 3B The electronic device 300 shown in FIG. Figure 4 At least one of the components of the electronic device 400 shown in FIG. 4 is the same or similar, and a repeated description is omitted below.

[0113] According to an embodiment, the metal frame structure 411 of the bracket 410 may have a first edge 411a, a second edge 411b, a third edge 411c, and a fourth edge 411d forming a side surface of the electronic device 400. In an embodiment, the first edge 411a may be along the top of the electronic device 400 (e.g., at Figure 5 The third edge 411c may be an edge extending in the y direction of the first edge 411a and the second edge 411b, and the second edge 411b may be an edge extending in parallel with the first edge 411a along the bottom of the electronic device 400 (for example, in the -y direction). The third edge 411c may be substantially perpendicular to the first edge 411a and / or the second edge 411b and extending from one end ( Figure 5 The fourth edge 411d may be an edge that is parallel to the third edge 411c and extends from the other end of the first edge 411a (for example, Figure 5The third edge 411c and the fourth edge 411d extend from one end in the x-direction of the second edge 411b to the other end (e.g., one end in the x-direction) of the second edge 411b. In an embodiment, the third edge 411c and the fourth edge 411d may be longer than the first edge 411a and the second edge 411b. However, the present disclosure is not limited thereto, and depending on the embodiment, the first edge 411a, the second edge 411b, the third edge 411c, and the fourth edge 411d may have the same length, or the first edge 411a and the second edge 411b may be longer than the third edge 411c and the fourth edge 411d.

[0114] According to an embodiment, the printed circuit board 440 may be disposed in at least a portion of the support structure 412 of the bracket 410 and supported by the support structure 412. The processor, memory and / or interface may be disposed on the printed circuit board 440. In an embodiment (not shown), the printed circuit board 440 may be a shape or However, the present disclosure is not limited to the above embodiment, and the printed circuit board 440 may include a first printed circuit board 441 and a second printed circuit board 442. The first printed circuit board 441 may be electrically connected to the second printed circuit board 442 through a connecting member 443 (e.g., a B-to-B connector (board-to-board connector)).

[0115] According to an embodiment, at least one antenna module 500 may be disposed in an internal space defined within the metal frame structure 411 of the bracket 410. In an embodiment, the at least one antenna module 500 may include a first antenna module 500a, a second antenna module 500b, and a third antenna module 500c. According to an embodiment, the first antenna module 500a and the second antenna module 500b may be vertically mounted in the internal space defined within the metal frame structure 411 to ensure radiation performance, and may be vertically mounted on other electronic components (e.g., Figure 4 The fact that the antenna module is vertically mounted in the present disclosure means that the antenna module is arranged so that its surface with a large width (eg, a radiation surface) faces the side surface (eg, Figure 3A ), and may be used with the same meaning in the following description.

[0116] According to an embodiment, the third antenna module 500c may be horizontally mounted in an area adjacent to the first edge 411a. In this case, the fact that the antenna module is vertically mounted in the present disclosure means that the antenna module is disposed so that its surface having a large width (e.g., a radiation surface) faces the rear panel (e.g., Figure 4 480 shown in FIG.

[0117] According to embodiments, at least one dielectric sheet 600 may be attached to the radiating surface of a vertically mounted antenna module (e.g., the first antenna module 500a and the second antenna module 500b), or may be attached to the inner side of a side surface of the electronic device 400 that faces the radiating surface of the vertically mounted antenna module. The at least one dielectric sheet 600 includes a dielectric sheet with a low dielectric constant and a dielectric sheet with a high dielectric constant, thereby improving the radiation performance of the antenna modules (e.g., the first antenna module 500a and the second antenna module 500b) and effectively dissipating heat generated by the antenna modules. However, the configuration and effects of the at least one dielectric sheet 600 will be described in detail below.

[0118] Figure 6A is a perspective view illustrating an antenna module from a side according to an embodiment of the present disclosure.

[0119] Figure 6B is shown from the other side according to an embodiment of the present disclosure Figure 6A A perspective view of the antenna module shown in FIG.

[0120] Figure 6C is taken along line A-A' according to an embodiment of the present disclosure Figure 6A A cross-sectional view of the antenna module is shown in FIG. Figures 6A to 6C Shown in this disclosure Figure 5 An embodiment of the structure of at least one antenna module 500 is shown.

[0121] Reference Figure 6A 、 Figure 6B and Figure 6C , at least one antenna module 500 may include a printed circuit board 510, an antenna array 530, a radio frequency integrated circuit (RFIC) 552, a power management integrated circuit 554 (PMIC), and a module interface 570. According to an embodiment, at least one antenna module 500 may further include a shielding member 590 in addition to the above configuration.

[0122] According to an embodiment, the printed circuit board 510 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 510 may use conductive lines and conductive vias formed in the conductive layers to provide electrical connections between various electronic components disposed on the printed circuit board 510 and / or disposed externally.

[0123] According to an embodiment, the antenna array 530 (e.g., Figure 2248 in FIG. 248 ) may include multiple antenna elements 532, 534, 536, or 538 configured to form a directional beam. As shown in FIG. 6 , antenna elements 532, 534, 536, or 538 may be disposed on the first surface 500-1 (or radiating surface) of the printed circuit board 510. According to another embodiment, the antenna array 530 may be disposed within the printed circuit board 510. Depending on the embodiment, the antenna array 530 may include multiple antenna arrays of the same or different shapes or types (e.g., patch antenna arrays and / or dipole antenna arrays).

[0124] According to an embodiment, the RFIC 552 (e.g., Figure 2 The third RFIC 226 (shown) may be disposed in another area spaced apart from the antenna array 530 of the printed circuit board 510 (e.g., on the second surface 500-2 opposite the first surface). The RFIC 552 described above may be configured to process signals in a predetermined frequency band transmitted or received via the antenna array 530. According to an embodiment, the RFIC 552 may convert baseband signals received from a communication processor (not shown) during transmission into RF signals in a predetermined frequency band. Furthermore, the RFIC 552 may convert RF signals received via the antenna array 530 into baseband signals during reception, and then transmit the converted signals to the communication processor.

[0125] According to another embodiment, the RFIC 552 may transmit data from an intermediate frequency integrated circuit (IFIC) (e.g., Figure 2 The RFIC 552 may up-convert an IF signal (e.g., approximately 9 GHz to approximately 11 GHz) obtained by the fourth RFIC 228 (shown in FIG) into an RF signal in a selected frequency band. Furthermore, during reception, the RFIC 552 may down-convert an RF signal received via the antenna array 530 into an IF signal and then transmit the converted signal to the aforementioned IFIC.

[0126] According to an embodiment, the PMIC 554 may be provided in another area spaced apart from the antenna array 530 of the printed circuit board 510 (e.g., on the second surface 500-2 of the printed circuit board 510). The PMIC may be supplied with voltage from a main PCB (not shown) and may provide necessary power to various components of the antenna module (e.g., the RFIC 552).

[0127] According to an embodiment, a shielding member 590 may be provided in a portion of the printed circuit board 510 (eg, on the second surface 500-2 of the printed circuit board 510) to electromagnetically shield at least one of the RFIC 552 or the PMIC 554. According to an embodiment, the shielding member 590 may include a shield case.

[0128] Although not shown, in various embodiments, at least one antenna module 500 may be connected to another printed circuit board (eg, Figure 5 The module interface may include a connection member, such as a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC 552 and / or PMIC 554 of at least one antenna module 500 may be connected to another printed circuit board (e.g., Figure 5 The first printed circuit board 441 shown in FIG.

[0129] Figure 7A is an amplification of an embodiment according to the present disclosure Figure 5 The antenna module and dielectric sheet are shown in FIG. Figure 7B It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown in FIG. Figure 7A and Figure 7B It shows Figure 5 The first antenna module shown in Figure 5 ) and a dielectric sheet (eg, a dielectric sheet attached to the first antenna module) as shown in FIG. Figure 5 FIG. 6 is a view of at least one dielectric sheet 600 shown in FIG. 1 , but a dielectric sheet having the same structure may be attached to Figure 5 The second antenna module shown in Figure 5 ). The second antenna module 500b is shown in FIG.

[0130] Reference Figure 7A and Figure 7B , according to the electronic device 400 of the embodiment (eg, Figure 4 and Figure 5 The electronic device 400 shown in FIG. 4 may include a bracket 410 (eg, Figure 4 and Figure 5 ), a front plate 420 (eg, Figure 4 ), a display 430 (e.g., a front panel 420 shown in FIG. Figure 4 ), a rear panel 480 (e.g., Figure 4 ), at least one antenna module 500 (eg, Figure 5 The first antenna module 500 shown in FIG), at least one dielectric sheet 600 (eg, Figure 5 At least one dielectric sheet 600) and an electrical connection member 700 are shown in FIG. Figure 7A and Figure 7B At least one of the components of the electronic device 400 shown in FIG. 4 may be connected to Figure 4 or Figure 5At least one of the components of the electronic device 400 shown in FIG. 4 is the same or similar, and a repeated description is omitted below.

[0131] According to an embodiment, the bracket 410 is disposed between the front plate 420 and the rear plate 480 and may include: forming a side surface (eg, Figure 3A The metal frame structure 411 (eg, Figure 4 and forming a support structure (eg, a metal frame structure 411 shown in FIG) for mounting components of the electronic device 400. Figure 4 When the metal frame structure 411 is provided on the radiation surface (eg, the first surface 500-1) of at least one antenna module 500 (eg, on the Figure 7A In the -x direction in FIG, the radiation direction of the antenna beam may be tilted by the metal frame structure 411, and thus the radiation performance of the antenna module 500 may be reduced. In order to reduce the reduction in the radiation performance of the antenna module 500 caused by the above-mentioned metal frame structure 411, the metal frame structure 411 according to the embodiment may be extended from the virtual center line of the electronic device 400 (for example, Figure 7B The M in FIG) is biased toward the front plate 420 or the rear plate 480. By configuring the metal frame structure 411, the area where the metal frame structure 411 and the radiation surface (e.g., the first surface 500-1) of the antenna module 500 overlap with each other can be reduced. Therefore, the degree of inclination of the antenna beam caused by the metal frame structure 411 can be reduced.

[0132] According to an embodiment, at least one antenna module 500 is vertically mounted on a partial area or a surface of the support structure 412 facing the metal frame structure 411, and thus, it can be arranged in the metal frame structure 411 forming the side surface of the electronic device 400. When the at least one antenna module 500 is vertically mounted, the at least one antenna module 500 has an antenna array (e.g., Figure 6A radiating surface of the antenna array 530 shown in FIG. Figure 6A The first surface 500 - 1 ) shown in FIG. 4 may be disposed to face the metal frame structure 411 .

[0133] In an embodiment, at least one antenna module 500 may be disposed in a partial area (area A) of the support structure 412 facing the metal frame structure 411 (eg, facing the metal frame structure 411). Figure 7A and Figure 7B(area in the -x direction in the support structure 412). In an embodiment, at least one antenna module 500 may be secured to the metal region 4121 of the support structure 412 via a metal plate 413. The metal plate 413 is disposed between the at least one antenna module 500 and the metal region 4121 of the support structure 412 and may function as a heat sink to dissipate heat generated by the antenna module 500. The metal plate 413 may be made of, but is not limited to, copper (Cu) with high thermal conductivity. In another embodiment (not shown), the at least one antenna module 500 may be attached to the metal plate 413 using an adhesive member (e.g., tape), and screws may be fastened to a portion of the metal plate 413. Thus, the at least one antenna module 500 attached to the metal plate 413 may be secured to at least a portion of the metal region 4121 of the support structure 412. The non-metal region 4122 of the support structure 412 and at least one dielectric sheet 600 may be disposed between the at least one antenna module 500 and the metal frame structure 411. The degradation of the radiation performance of the metal frame structure 411 may be reduced by the non-metal region 4122 and at least one dielectric sheet 600 disposed between the antenna module 500 and the metal frame structure 411 , which will be described in detail below.

[0134] According to an embodiment, as described above, at least one antenna module 500 may include an RFIC (eg, Figure 6B RFIC 552 shown in ) and PMIC (e.g., Figure 6B ), and the RFIC and / or PMIC may be electrically isolated by the shielding member 590. At least one antenna module 500 may be electrically connected to a printed circuit board (eg, Figure 5 The electrical connection member 700 may be, for example, a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB), but is not limited thereto.

[0135] According to an embodiment, at least one dielectric sheet 600 includes a first dielectric sheet 610 and a second dielectric sheet 620 , and may be attached to at least a partial region of at least one antenna module 500 .

[0136] According to an embodiment, the first dielectric sheet 610 may be attached to a radiation surface (eg, the first surface 500-1) of at least one antenna module 500 on which an antenna array (eg, Figure 6A In an embodiment, an adhesive member (not shown) may be attached to at least a portion of the first dielectric sheet 610, and the first dielectric sheet 610 may be attached to a radiation surface (e.g., first surface 500-1) of at least one antenna module 500 via the adhesive member.

[0137] In an embodiment, the first dielectric sheet 610 may be made of a thermally conductive material having a lower dielectric constant than the second dielectric sheet 620. For example, the first dielectric sheet 610 may be made of thermally conductive polyimide or polyethylene having a relative dielectric constant of 2.5 or less (e.g., a relative dielectric constant of 2 to 2.3). In an embodiment, the first dielectric sheet 610 is made of a material having a relatively low relative dielectric constant, thereby achieving the effect of forming an air gap between the metal frame structure 411 and the at least one antenna module 500. Therefore, the reflection loss generated on the radiation surface (e.g., the first surface 500-1) of the at least one antenna module due to impedance mismatch can be reduced. In an embodiment, the first dielectric sheet 610 may have a thickness of 0.5 mm or more (e.g., Figure 7A (T1 in FIG), thereby creating an air gap between the metal frame structure 411 and the at least one antenna module 500. However, the present disclosure is not limited to the above embodiment, and the thickness T1 of the first dielectric sheet 610 may depend on the size of the at least one antenna module 500. In an embodiment, the first dielectric sheet 610 is made of a thermally conductive material, thereby being able to operate as a heat sink to dissipate heat generated when the antenna module 500 transmits or receives RF signals.

[0138] According to an embodiment, the second dielectric sheet 620 is provided on one surface (eg, Figure 7A ) on a surface in the -x direction in the metal frame structure 411, thereby reducing the reduction in radiation performance of at least one antenna module 500 caused by the metal frame structure 411. In an embodiment, the second dielectric sheet 620 may be made of a material having a higher relative dielectric constant than the first dielectric sheet 610. The second dielectric sheet 620 may be made of, for example, a material having a relative dielectric constant of 7 or greater. Generally, the higher the dielectric constant of a dielectric sheet, the shorter the wavelength of an electromagnetic wave passing through the dielectric sheet. In an embodiment, the second dielectric sheet 620 is made of a material having a relatively high relative dielectric constant, thereby reducing the wavelength of an antenna beam passing through the second dielectric sheet 620. As described above, as the wavelength of the antenna beam passing through the second dielectric sheet 620 decreases, an image may be generated where the at least one antenna module 500 moves away from the metal frame structure 411 toward the center of the electronic device 400 (for example, in Figure 7B In other words, compared to the actual distance (e.g., L1) between the metal frame structure 411 and at least one antenna module 500, the electronic device 400 according to this embodiment can create the effect of the antenna module 500 being positioned away from the metal frame structure 411 by virtue of the second dielectric sheet 620 operating like a lens. This effect can reduce the degradation of the radiation performance of the antenna module 500 in the electronic device 400 according to this embodiment caused by the metal frame structure 411.

[0139] In an embodiment, the second dielectric sheet 620 has a higher relative permittivity than the first dielectric sheet 610, but the thickness T2 of the second dielectric sheet 620 may be smaller than the thickness T1 of the first dielectric sheet 610. For example, the first dielectric sheet 610 may have a thickness of 0.5 mm, and the second dielectric sheet 620 may have a thickness of 0.1 mm, which is smaller than the thickness of the first dielectric sheet 610. Since a higher dielectric constant of a dielectric sheet increases the transmission loss (e.g., loss tangent) of an antenna beam passing through the dielectric sheet, the second dielectric sheet 620, which has a higher dielectric constant than the first dielectric sheet 610, may be formed thinner than the first dielectric sheet 610.

[0140] Unlike the above embodiment in which at least one dielectric sheet 600 is attached to at least one antenna module 500 , according to another embodiment, at least one dielectric sheet 600 may be attached to a partial area of ​​the support structure 412 in the electronic device 400 .

[0141] According to another embodiment, the second dielectric sheet 620 may be attached to a portion of the non-metallic region 4122 of the support structure 412 that faces the radiating surface (e.g., the first surface 500-1) of the at least one antenna module 500. In an embodiment, the second dielectric sheet 620 may be attached to the surface of the non-metallic region 4122 that faces the radiating surface (e.g., the first surface 500-1) of the at least one antenna module 500 using an adhesive member (not shown). According to another embodiment, the first dielectric sheet 610 is disposed between the second dielectric sheet 620 and the at least one antenna module 500, thereby being able to operate as a heat sink to dissipate heat generated by the antenna module 500.

[0142] That is, according to an embodiment, at least one dielectric sheet 600 may be attached to a partial area of ​​at least one antenna module 500 or a partial area of ​​the bracket 410 (non-metal area 4122 ), thereby preventing a reduction in the radiation performance of the antenna module 500 and dissipating the heat generated by the antenna module 500 .

[0143] Figure 8A is an amplification of an embodiment according to the present disclosure Figure 5 A view of the antenna module and dielectric sheet shown in FIG.

[0144] Figure 8B It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown.

[0145] Figure 8C It is taken along line BB' according to an embodiment of the present disclosure. Figure 5 A cross-sectional view of the electronic device shown. Figure 8A、 Figure 8B and / or Figure 8C It shows Figure 5 The first antenna module shown in Figure 5 ) and a dielectric sheet (eg, a dielectric sheet attached to the first antenna module) as shown in FIG. Figure 5 FIG. 1 is a view of at least one dielectric sheet 600 shown in FIG.

[0146] Reference Figure 8A 、 Figure 8B and Figure 8C , according to the electronic device 400 of the embodiment (eg, Figure 4 and Figure 5 The electronic device 400 shown in FIG. 4 may include a bracket 410 (eg, Figure 4 and Figure 5 ), a front plate 420 (eg, Figure 4 ), a display 430 (e.g., a front panel 420 shown in FIG. Figure 4 ), a rear panel 480 (e.g., Figure 4 ), at least one antenna module 500 (eg, Figure 5 and / or Figure 6A 、 Figure 6B and Figure 6C at least one antenna module 500 shown in FIG), at least one dielectric sheet 600 (eg, Figure 5 The electronic device 400 according to the embodiment may be formed by adding a third dielectric sheet 630 to the Figure 7A and Figure 7B The electronic device 400 shown in FIG. 1 is obtained, and repeated description is omitted below.

[0147] According to an embodiment, the at least one dielectric sheet 600 may include a first dielectric sheet 610 (eg, Figure 7A ), the first dielectric sheet 610 shown in FIG), the second dielectric sheet 620 (eg, Figure 7A ) and a third dielectric sheet 630 are shown. As described above, at least one dielectric sheet 600 may be attached to a radiating surface (e.g., first surface 500-1) of at least one antenna module 500, or may be attached to a partial area of ​​the bracket 410 (e.g., non-metallic area 4122 of the support structure 412).

[0148] The first dielectric sheet 610 according to the embodiment may be provided on a radiation surface (eg, the first surface 500 - 1 ) of at least one antenna module 500 (eg, on the Figure 8A and Figure 8BThe first dielectric sheet 610 is made of a thermally conductive material having a relatively low relative dielectric constant, thereby creating an air gap between the at least one antenna module 500 and the metal frame structure 411 and dissipating heat generated by the antenna module 500.

[0149] The second dielectric sheet 620 according to the embodiment may be provided on the first dielectric sheet 610 at a position adjacent to the metal frame structure 411 ( Figure 8A and Figure 8B (-x direction in FIG). The second dielectric sheet 620 may be made of a material having a relatively high relative permittivity, thereby reducing the wavelength of the antenna beam passing through the second dielectric sheet 620. Therefore, degradation in the radiation performance of the antenna module 500 caused by the metal frame structure 411 may be reduced.

[0150] The third dielectric sheet 630 according to the embodiment may be disposed between the first dielectric sheet 610 and the second dielectric sheet 620. For example, one surface of the third dielectric sheet 630 may be attached to the first dielectric sheet 610, and the other surface of the third dielectric sheet 630 may be attached to the second dielectric sheet 620, thereby disposing the third dielectric sheet 630 between the first dielectric sheet 610 and the second dielectric sheet 620. That is, the first dielectric sheet 610, the third dielectric sheet 630, and the second dielectric sheet 620 may be sequentially disposed between the at least one antenna module 500 and the metal frame structure 411, starting from the at least one antenna module 500.

[0151] In an embodiment, the third dielectric sheet 630 may be made of a material having a relative permittivity higher than that of the first dielectric sheet 610 and lower than that of the second dielectric sheet 620. In an embodiment, when the first dielectric sheet 610 is made of a material having a relative permittivity of 2.5 or less and the second dielectric sheet 620 is made of a material having a relative permittivity of 7 or greater, the third dielectric sheet 630 may be made of a material having a relative permittivity of 2.5 or greater and 7 or less. The third dielectric sheet 630 is made of a material having a relative permittivity higher than that of the first dielectric sheet 610 and lower than that of the second dielectric sheet 620 between the first and second dielectric sheets 610, 620, thereby reducing rapid changes in the permittivity.

[0152] In an embodiment, the thickness T3 of the third dielectric sheet 630 may be smaller than the thickness T1 of the first dielectric sheet 610 and larger than the thickness T2 of the second dielectric sheet 620. However, the present disclosure is not limited to the above embodiment, and the third dielectric sheet 630 according to another embodiment (not shown) may have the same thickness as the first dielectric sheet 610 or the same thickness as the second dielectric sheet 620, depending on the frequency band of the RF signal transmitted or received by the at least one antenna module 500.

[0153] Reference Figure 8B , according to the embodiment, a partial area of ​​at least one dielectric sheet 600 (eg, Figure 8B Region A) in FIG4 may be in contact with at least a portion of the metal region 4121 of the support structure 412. Because a portion of the thermally conductive first dielectric sheet 610 is in contact with the metal region 4121 of the support structure 412 through the above structure, heat generated by the at least one antenna module 500 can be diffused to the metal region 4121 through the first dielectric sheet 610, thereby dissipating the heat generated by the at least one antenna module 500.

[0154] Reference Figure 8C ,and Figure 8B Unlike the at least one dielectric sheet 600 shown in FIG, at least one dielectric sheet 600 according to another embodiment may be spaced apart from a portion of the support structure 412 (see FIG. Figure 8C ). That is, the at least one dielectric sheet 600 may be attached to only a partial area of ​​the radiation surface (e.g., the first surface 500-1) of the at least one antenna module 500, and thus, the partial area of ​​the at least one dielectric sheet 600 may not be in contact with the metal area 4121. That is, according to embodiments, the at least one dielectric sheet 600 may be attached to the entire radiation surface (e.g., the first surface 500-1) of the antenna module 500, or may be attached to only a partial area of ​​the radiation surface (e.g., the first surface 500-1) of the antenna module 500.

[0155] Figure 9A is a graph comparing radiation directions of antenna beams according to whether a dielectric sheet exists when an RF signal in a first frequency band is transmitted or received according to an embodiment of the present disclosure.

[0156] Figure 9B is a graph comparing radiation directions of antenna beams according to whether a dielectric sheet exists when an RF signal in a second frequency band is transmitted or received according to an embodiment of the present disclosure.

[0157] Figure 9A Depicted is a diagram showing how an RF signal in the 28 GHz band passes through an antenna module (e.g., Figure 5 、 Figure 7A and Figure 8A ) is transmitting and / or receiving. Similarly, Figure 9B A graph showing the radiation direction of an antenna beam when an RF signal in the 39 GHz frequency band is transmitted and / or received through at least one antenna module is depicted. Figure 9A and Figure 9B , the solid line indicates the radiation direction of the antenna beam when the dielectric sheet is not attached to the radiation surface of the antenna module, and the dotted line indicates the radiation direction of the antenna beam when the dielectric sheet is attached to the radiation surface of the antenna module (see Figure 7A 、 Figure 7B 、 Figure 8A and / or Figure 8B ).

[0158] Reference Figure 9A and Figure 9B , when a dielectric sheet formed by mixing a dielectric sheet with a low dielectric constant and a dielectric sheet with a high dielectric constant is attached to the radiation surface of the antenna module, it can be seen that the antenna beam travels in the boresight direction and is not tilted in the other direction compared to when the dielectric sheet is not attached.

[0159] Therefore, it can be seen that the power consumption can be reduced compared to an electronic device without a dielectric sheet. Figure 7A and Figure 7B The electronic device and / or Figure 8A and Figure 8B The metal frame structure in the electronic device shown in FIG (for example, Figure 7B and Figure 8B Therefore, it can be seen that the beam coverage in the direction of the line of sight can be ensured.

[0160] Figure 10A is a view illustrating a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure.

[0161] Figure 10B is a view illustrating a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure.

[0162] Figure 10C is a view illustrating a first dielectric sheet operating as a heat sink according to an embodiment of the present disclosure.

[0163] Reference Figure 10A 、 Figure 10B and Figure 10C , showing the following according to various embodiments Figure 5 The cross section of the electronic device shown is taken along line BB'. Figure 10A 、 Figure 10B and / or Figure 10CVarious structures of the first dielectric sheet 610 operating as a heat sink are described.

[0164] Reference Figure 10A 、 Figure 10B and / or Figure 10C , according to the electronic device 400 of the embodiment (eg, Figure 4 and Figure 5 The electronic device 400 shown in FIG. 4 may include a bracket 410 (eg, Figure 4 and Figure 5 ), a front plate 420 (eg, Figure 4 ), a display 430 (e.g., a front panel 420 shown in FIG. Figure 4 ), a rear panel 480 (e.g., Figure 4 ), at least one antenna module 500 (eg, Figure 5 and / or Figure 6A 、 Figure 6B and Figure 6C at least one antenna module 500 shown in FIG) and at least one dielectric sheet 600 (eg, Figure 8A and Figure 8B At least one dielectric sheet 600 shown in FIG. 4 ). At least one of the components of the electronic device 400 according to the embodiment may be connected to Figure 7A and Figure 7B The electronic device 400 shown in FIG. 4 and / or Figure 8A and Figure 8B At least one of the components of the electronic device 400 shown in FIG. 4 is the same or similar, and repeated description is omitted below.

[0165] According to an embodiment, the at least one dielectric sheet 600 may include a first dielectric sheet 610 (eg, Figure 8A and Figure 8B ), the first dielectric sheet 610 shown in FIG), the second dielectric sheet 620 (eg, Figure 8A and Figure 8B ) and the third dielectric sheet 630 (eg, Figure 8A and Figure 8B As described above, at least one dielectric sheet 600 may be attached to at least one antenna module 500 on which an antenna array (eg, Figure 6A ) or may be attached to a radiating surface (eg, first surface 500 - 1 ) of an antenna array 530 as shown in FIG. 4 or may be attached to a support structure 412 (eg, Figure 4 The non-metallic region 4122 (e.g., Figure 4Although not shown in the drawings, some components of the at least one dielectric sheet 600 (eg, the third dielectric sheet 630 ) may be omitted according to an embodiment.

[0166] According to an embodiment, the first dielectric sheet 610 may be attached to a radiation surface (eg, the first surface 500-1) of at least one antenna module 500, or may be provided on the radiation surface (eg, the first surface 500-1) (eg, on the Figure 10A ). The first dielectric sheet 610 is made of a thermally conductive material, and thus can operate as a heat sink for dissipating heat generated by the antenna module 500.

[0167] Reference Figure 10A The first dielectric sheet 610 according to the embodiment may include a first portion 611 and a second portion 612 substantially perpendicular to the first portion 611. The first portion 611 of the first dielectric sheet 610 may be attached to at least a portion of the radiation surface (e.g., the first surface 500-1) of at least one antenna module 500. The second portion 612 of the first dielectric sheet 610 may be extended from one end (e.g., Figure 10A The end in the y direction in FIG. 6 is substantially perpendicular to the first portion 611 (eg, Figure 10A The second portion 612 of the first dielectric sheet 610 extends in the x-direction (in the x-direction) and may contact a portion of the support structure 412. In one embodiment, the second portion 612 of the first dielectric sheet 610 may contact at least a portion of the metal region 4121 of the support structure 412. In another embodiment, the second portion 612 of the first dielectric sheet 610 may contact at least a portion of the metal plate 413 (e.g., a copper plate) to secure at least one antenna module 500 to the support structure 412. Because the thermally conductive first portion 611 of the first dielectric sheet 610 contacts the radiating surface (e.g., first surface 500-1) of the antenna module 500, and the second portion 612 contacts the metal region 4121 and / or the metal plate 413, heat generated by the antenna module 500 when RF signals are transmitted and / or received can be dissipated to the metal region 4121 and / or the metal plate 413. That is, in the electronic device 400 according to the embodiment, the heat generated by the antenna module 500 is diffused to the metal region 4121 and / or the metal plate 413 through the first portion 611 and the second portion 612 of the first dielectric sheet 610, thereby dissipating the heat generated by the antenna module 500.

[0168] Reference Figure 10B, the first dielectric sheet 610 according to another embodiment may include a first portion 611 and a second portion 612 substantially perpendicular to the first portion 611. The electronic device 400 according to another embodiment may further include a graphite sheet 800 disposed between the support structure 412 of the bracket 410 and the rear plate 480. The graphite sheet 800 has high thermal conductivity, so it can dissipate heat generated by electronic components installed in the electronic device 400. In this configuration, a partial area of ​​the first dielectric sheet 610 is in contact with the graphite sheet 800, so the graphite sheet 800 can even dissipate heat generated by the at least one antenna module 500. In an embodiment, the first portion 611 of the first dielectric sheet 610 may be attached to at least a partial area of ​​the radiation surface (e.g., the first surface 500-1) of the at least one antenna module 500. The second portion 612 of the first dielectric sheet 610 may be extended from one end (e.g., Figure 10B The end in the -y direction in FIG. 1 is substantially perpendicular to the first portion 611 (eg, Figure 10B The second portion 612 of the first dielectric sheet 610 may contact at least a portion of a surface 800-1 of the graphite sheet 800 that faces the bracket 410. In another embodiment (not shown), the second portion 612 may contact at least a portion of a surface 800-2 of the graphite sheet 800 that faces the metal frame structure 411. Because the thermally conductive first portion 611 of the first dielectric sheet 610 contacts the radiating surface (e.g., first surface 500-1) of the antenna module 500 and the second portion 612 contacts the graphite sheet 800, heat generated by the antenna module 500 when transmitting and / or receiving RF signals can be dissipated to the graphite sheet 800. In other words, in the electronic device 400 according to another embodiment, heat generated by the antenna module 500 is dissipated to the graphite sheet 800 via the first dielectric sheet 610, thereby dissipating the heat generated by the antenna module 500.

[0169] As described above, in the electronic device 400 according to the embodiment, since heat generated by at least one antenna module 500 is diffused to the metal region 4121 having high thermal conductivity, the metal plate 413 and the graphite sheet 800 , heat dissipation efficiency may be improved.

[0170] Reference Figure 10C According to another embodiment, the first dielectric sheet 610 may have a first region 610a and a second region 610b. In an embodiment, the first region 610a of the first dielectric sheet 610 may be attached to at least a portion of the radiation surface (e.g., the first surface 500-1) of at least one antenna module 500. The second region 610b of the first dielectric sheet 610 may protrude from the first region 610a toward the rear plate 480 (e.g., at Figure 10C (in the -y direction in the first dielectric sheet 610), and therefore, the second region 610b may not overlap with the radiating surface of the antenna module 500 (e.g., the first surface 500-1). That is, because the second region 610b extends from the first region 610a, heat generated by the antenna module 500 can be diffused to the second region 610b via the first region 610a. Furthermore, the heat diffused to the second region 610b can be dissipated to the surrounding area of ​​the second region 610b. In other words, the second region 610b of the first dielectric sheet 610 can function as a heat sink, dissipating heat generated by the antenna module 500 to the surrounding area of ​​the first dielectric sheet 610.

[0171] Figure 11A is a perspective view illustrating an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure.

[0172] Figure 11B FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the side. Figure 11A A side view of the antenna module and the dielectric sheet attached to the antenna module shown in FIG. Figure 11A and Figure 11B Only the parts fixed to the bracket (e.g. Figure 7B The antenna module 500 includes a portion of the support 410 shown in FIG. 4 and at least one dielectric sheet 600 attached to the antenna module 500 .

[0173] Reference Figure 11A and Figure 11B , at least one dielectric sheet 600 (eg, Figure 7A and Figure 7B At least one dielectric sheet 600 shown in FIG. 5 may be attached to the antenna module 500 (eg, Figure 6A 、 Figure 7A and / or Figure 7B The antenna module 500 shown in FIG. 5 has an antenna array 530 (eg, Figure 6A radiating surface of the antenna array 530 shown in FIG. Figure 7B radiating surface 500 - 1 shown in FIG.

[0174] The antenna array 530 according to an embodiment may include a plurality of antenna elements 532 , 534 , 536 , and 538 , and the plurality of antenna elements 532 , 534 , 536 , and 538 may be arranged on a radiation surface of the antenna module 500 at predetermined intervals.

[0175] At least one dielectric sheet according to an embodiment may include a first dielectric sheet 610 (eg, Figure 7A and 7B ) and the second dielectric sheet 620 (eg, Figure 7A and Figure 7B ).

[0176] In an embodiment, the first dielectric sheet 600 (e.g., a low-dielectric-constant heat sink) may be made of a thermally conductive material having a low dielectric constant and may be attached to the radiating surface of the antenna module 500 provided with the antenna array 530. As described above, the first dielectric sheet 610 is attached to the radiating surface of the antenna module 500, thereby being able to operate as a heat sink for dissipating heat generated by the antenna module 500.

[0177] In an embodiment, the second dielectric sheet 620 may be disposed on the first dielectric sheet 610 and made of a material having a higher dielectric constant than the first dielectric sheet 610 , thereby being able to reduce the wavelength of an antenna beam radiated from the antenna module 500 .

[0178] As described above, the higher the dielectric constant of the dielectric sheet that transmits the antenna beam, the smaller the wavelength of the antenna beam can be and the greater the transmission loss (e.g., loss tangent) of the antenna beam can be. In the electronic device 400 according to an embodiment, at least one first opening 620a, 620b, 620c, and 620d is formed by removing a portion of the second dielectric sheet 620, which has a higher dielectric constant than the first dielectric sheet 610, thereby reducing the transmission loss of the antenna beam. In an embodiment, the at least one first opening 620a, 620b, 620c, and 620d can be formed in at least a portion of the second dielectric sheet 620 corresponding to the antenna elements 532, 534, 536, and 538. For example, the 1-1 opening 620a can be formed in at least a portion of the second dielectric sheet 620 corresponding to the first antenna element 532, and the 1-2 opening 620b can be formed in at least a portion of the second dielectric sheet 620 corresponding to the second antenna element 534. Similarly, a 1-3 opening 620c may be formed in at least a portion of the second dielectric sheet 620 corresponding to the third antenna element 536, and a 1-4 opening 620d may be formed in at least a portion of the second dielectric sheet 620 corresponding to the fourth antenna element 538. Since at least one opening 620a, 620b, 620c, and 620d is formed in the second dielectric sheet 620, a multi-operation structure may be formed between the first dielectric sheet 610 and the second dielectric sheet 620. The multi-operation structure formed between the first dielectric sheet 610 and the second dielectric sheet 620 can guide the radiation direction of the antenna beam so that the antenna beam radiated from the antenna array 530 travels in the line-of-sight direction.

[0179] In an embodiment, at least one first opening 620a, 620b, 620c, and 620d may be formed such that an outer surface thereof includes the outer surfaces of the antenna elements 532, 534, 536, and 538. However, the present disclosure is not limited thereto, and in another embodiment, the outer surface of the at least one first opening 620a, 620b, 620c, and 620d may include only a partial area of ​​the antenna elements 532, 534, 536, and 538, which will be described in detail below.

[0180] According to an embodiment, at least one first opening 620a, 620b, 620c, and 620d may be formed in a rectangular shape. However, the present disclosure is not limited thereto, and at least one first opening 620a, 620b, 620c, and 620d may be formed in various shapes such as an ellipse, a diamond, and a cross.

[0181] Figure 12A is a perspective view illustrating an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure.

[0182] Figure 12B FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the side. Figure 12A 00140] Side view of the antenna module and a dielectric sheet attached to the antenna module shown in .

[0183] Figure 12C is a perspective view illustrating an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure.

[0184] Figure 12D is a perspective view illustrating an antenna module and a dielectric sheet attached to the antenna module, as seen from a side, according to an embodiment of the present disclosure.

[0185] Figure 12E : is a perspective view showing an antenna module and a dielectric sheet attached to the antenna module according to an embodiment of the present disclosure, as seen from the side. 12A to 12D Only shown are fixed to the bracket (e.g. Figure 8B The antenna module 500 includes a portion of the support 410 shown in FIG. 4 and at least one dielectric sheet 600 attached to the antenna module 500 .

[0186] Reference Figure 12A 、 Figure 12B 、 Figure 12C 、 Figure 12D and Figure 12E , at least one dielectric sheet 600 (eg, Figure 8A and / or Figure 8B At least one dielectric sheet 600 shown in FIG. 5 may be attached to the antenna module 500 (eg, Figure 6A 、 Figure 8A and / or Figure 8B The antenna module shown in FIG) is provided with an antenna array 530 (eg, Figure 6A radiating surface of the antenna array 530 shown in FIG. Figure 8B 500 - 1 ).

[0187] The antenna array 530 according to an embodiment may include a plurality of antenna elements 532 , 534 , 536 , and 538 , and the plurality of antenna elements 532 , 534 , 536 , and 538 may be arranged on a radiation surface of the antenna module 500 at predetermined intervals.

[0188] At least one dielectric sheet 600 according to an embodiment may include a first dielectric sheet 610 (eg, Figure 8A and 8B ), the first dielectric sheet 610 shown in FIG), the second dielectric sheet 620 (eg, Figure 8A and 8B ) and the third dielectric sheet 630 (eg, Figure 8A and Figure 8B That is, at least one dielectric sheet 600 according to the embodiment may also include a third dielectric sheet 630. Figure 11A and Figure 11B The dielectric sheet of the third dielectric sheet 630 in the at least one dielectric sheet 600 shown in FIG.

[0189] In an embodiment, the first dielectric sheet 610 may be made of a thermally conductive material having a low dielectric constant and may be attached to the radiation surface of the antenna module 500 provided with the antenna array 530. As described above, the first dielectric sheet 610 is attached to the radiation surface of the antenna module 500, thereby being able to operate as a heat sink for dissipating heat generated by the antenna module 500.

[0190] In an embodiment, the second dielectric sheet 620 may be disposed on the first dielectric sheet 610 and made of a material having a higher dielectric constant than the first dielectric sheet 610 , thereby being able to reduce the wavelength of an antenna beam radiated from the antenna module 500 .

[0191] In an embodiment, the third dielectric sheet 630 may be disposed between the first dielectric sheet 610 and the second dielectric sheet 620 and may be made of a material having a higher dielectric constant than the first dielectric sheet 610 and lower dielectric constant than the second dielectric sheet 620. The third dielectric sheet 630 is made of a material having a dielectric constant between the dielectric constants of the first dielectric sheet 610 and the second dielectric sheet 620, thereby reducing rapid changes in dielectric constant.

[0192] Since the higher the dielectric constant of the dielectric sheet that transmits the antenna beam, the greater the transmission loss (e.g., loss tangent) of the antenna beam may be, according to an embodiment, at least one opening is formed in the second dielectric sheet 620 and the third dielectric sheet 630 in the electronic device 400, thereby reducing the transmission loss generated when the antenna beam passes through at least one dielectric sheet 600.

[0193] In an embodiment, at least one first opening 620a, 620b, 620c, and 620d may be formed in at least a portion of the region of the second dielectric sheet 620 corresponding to the antenna elements 532, 534, 536, and 538. Similarly, at least one second opening 630a, 630b, 630c, and 630d may be formed in at least a portion of the region of the third dielectric sheet 630 corresponding to the antenna elements 532, 534, 536, and 538. For example, the 1-1 opening 620a and the 2-1 opening 630a may be formed in at least a portion of the region of the second dielectric sheet 620 and the third dielectric sheet 630, respectively, corresponding to the first antenna element 532, and the 1-2 opening 620b and the 2-2 opening 630b may be formed in at least a portion of the region of the second dielectric sheet 620 and the third dielectric sheet 630, respectively, corresponding to the second antenna element 534. Similarly, the 1-3 opening 620c and the 2-3 opening 630c may be formed in at least a portion of the region corresponding to the third antenna element 536 of the second dielectric sheet 620 and the third dielectric sheet 630, respectively, and the 1-4 opening 620d and the 2-4 opening 630d may be formed in at least a portion of the region corresponding to the fourth antenna element 538 of the second dielectric sheet 620 and the third dielectric sheet 630, respectively.

[0194] Since at least one first opening 620a, 620b, 620c, and 620d is formed in the second dielectric sheet 620 and at least one second opening 630a, 630b, 630c, and 630d is formed in the third dielectric sheet 630, a multi-operation structure can be formed between the first dielectric sheet 610, the second dielectric sheet 620, and the third dielectric sheet 630. For example, a multi-operation structure can be formed between the first dielectric sheet 610 and the third dielectric sheet 630 by the at least one second opening 630a, 630b, 630c, and 630d. In addition, a multi-operation structure can also be formed between the third dielectric sheet 630 and the second dielectric sheet 620 by the at least one first opening 620a, 620b, 620c, and 620d. The multi-operation structure formed between the first dielectric sheet 610 , the second dielectric sheet 620 , and the third dielectric sheet 630 may guide the radiation direction of the antenna beam so that the antenna beam radiated from the antenna array 530 travels in a boresight direction.

[0195] In the Examples (see, for example, Figure 12A), at least one first opening 620a, 620b, 620c, and 620d and at least one second opening 630a, 630b, 630c, and 630d may be formed such that their outer surfaces each include the outer surface of the antenna elements 532, 534, 536, and 538. In another embodiment (e.g., see Figure 12C 、 Figure 12D and Figure 12E ), at least one first opening 620a, 620b, 620c and 620d and at least one second opening 630a, 630b, 630c and 630d can be formed so that their outer surfaces each include only a partial area of ​​the outer surface of the antenna elements 532, 534, 536 and 538.

[0196] The second dielectric sheet 620 is made of a material having a higher dielectric constant than the third dielectric sheet 630. Therefore, when the antenna beam radiated from the antenna module 500 passes through the second dielectric sheet 620, it may generate a greater transmission loss than when the antenna beam passes through the third dielectric sheet 630. Therefore, the at least one first opening 620a, 620b, 620c, and 620d may be formed to have a larger size than the at least one second opening 630a, 630b, 630c, and 630d. In an embodiment, the at least one first opening 620a, 620b, 620c, and 620d may be formed so that its outer surface includes the outer surface of the at least one second opening 630a, 630b, 630c, and 630d. According to an embodiment, the at least one first opening 620a, 620b, 620c, and 620d and the at least one second opening 630a, 630b, 630c, and 630d may be formed to have the same shape except for the size of the outer surface. However, the present disclosure is not limited thereto, and according to another embodiment (not shown), the at least one first opening 620a, 620b, 620c, and 620d and the at least one second opening 630a, 630b, 630c, and 630d may be formed in different shapes. For example, the at least one first opening 620a, 620b, 620c, and 620d may be formed in a rectangular shape, and the at least one second opening 630a, 630b, 630c, and 630d may be formed in an elliptical shape.

[0197] Reference Figure 12AAccording to an embodiment, at least one first opening 620a, 620b, 620c and 620d and / or at least one second opening 630a, 630b, 630c and 630d may be formed in a rectangular shape. However, the present disclosure is not limited thereto, and according to an embodiment, at least one first opening 620a, 620b, 620c and 620d and / or at least one second opening 630a, 630b, 630c and 630d may be formed in various shapes other than a rectangular shape. For example, according to an embodiment, at least one first opening 620a, 620b, 620c and 620d and / or at least one second opening 630a, 630b, 630c and 630d may be formed in an elliptical shape (e.g., see Figure 12C ), or rhombus-shaped (see, e.g., Figure 12D ), or a cruciform shape (see, e.g., Figure 12E ) is formed.

[0198] That is, in the electronic device 400 according to the embodiment, the first dielectric sheet 610 is attached to the radiation surface of the antenna module 500 and can dissipate heat generated by the antenna module 500. In addition, openings (e.g., first openings and second openings) are formed in partial areas of the second dielectric sheet 620 and / or the third dielectric sheet 630, thereby ensuring beam coverage in the line-of-sight direction.

[0199] An electronic device according to an embodiment includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device facing a second direction perpendicular to the first direction; a back plate having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface and having a radiating surface facing the second direction; at least one dielectric layer having at least a partial area attached to the radiating surface of the at least one antenna module and disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit or receive RF signals in a predetermined frequency band to or from the at least one antenna module, wherein the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is attached to at least a partial area of ​​the radiating surface of the antenna module and the second dielectric sheet is disposed on the first dielectric sheet along the second direction; and the first dielectric sheet is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is made of a material having a second dielectric constant greater than the first dielectric constant.

[0200] According to an embodiment, the electronic device may further include a third dielectric sheet disposed between the first dielectric sheet and the second dielectric sheet and having a third dielectric constant.

[0201] According to an embodiment, the third dielectric constant may be greater than the first dielectric constant and less than the second dielectric constant.

[0202] According to an embodiment, the thickness of the second dielectric sheet may be smaller than the thickness of the first dielectric sheet.

[0203] According to an embodiment, the at least one dielectric layer may be spaced apart from the metal frame structure.

[0204] According to an embodiment, the first dielectric sheet may have a first portion attached to at least a partial area of ​​the radiation surface of the antenna module and a second portion substantially perpendicular to the first portion and in contact with a metal area in the electronic device.

[0205] According to an embodiment, heat generated by the at least one antenna module may be diffused to a metal area in the electronic device through the second portion of the first dielectric sheet.

[0206] According to an embodiment, the electronic device may further include a graphite sheet disposed between the metal frame structure and the rear plate.

[0207] According to an embodiment, the first dielectric sheet may further have a first portion attached to at least a partial area of ​​the radiation surface of the antenna module and a second portion substantially perpendicular to the first portion and in contact with a partial area of ​​the graphite sheet.

[0208] According to an embodiment, heat generated by the at least one antenna module may be diffused to the graphite sheet through the second portion of the first dielectric sheet.

[0209] According to an embodiment, the first dielectric sheet may have a first region attached to the radiation surface of the at least one antenna module and a second region protruding from the first region in a first direction or a third direction, and the second region may operate as a heat sink configured to dissipate heat generated by the at least one antenna module to a surrounding of the second region.

[0210] According to an embodiment, the at least one antenna module may include a printed circuit board and an antenna array, wherein the antenna array is provided on the printed circuit board and includes a plurality of antenna elements configured to transmit or receive RF signals in a predetermined frequency band.

[0211] According to an embodiment, the second dielectric sheet may have at least one first opening formed at a position corresponding to at least a partial area of ​​the plurality of antenna elements.

[0212] According to an embodiment, the electronic device may further include a third dielectric sheet disposed between the first dielectric sheet and the second dielectric sheet and having a third dielectric constant, wherein the third dielectric sheet may have at least one second opening formed at a position corresponding to at least a portion of the region of the plurality of antenna elements.

[0213] According to an embodiment, an outer surface of the first opening may be formed in a shape including outer surfaces of the plurality of antenna elements.

[0214] According to an embodiment, an outer surface of the second opening may be formed in a shape including an outer surface of the first opening.

[0215] An electronic device according to an embodiment includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device facing a second direction perpendicular to the first direction; a back plate having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface and having a radiating surface facing the second direction; at least one dielectric layer having at least a partial area attached to an inner side of the side surface and disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit or receive RF signals in a predetermined frequency band to or from the at least one antenna module, wherein the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric is disposed on the radiating surface of the at least one antenna module along the second direction, and the second dielectric sheet is disposed between the first dielectric sheet and the side surface and has a surface attached to the inner side of the side surface, wherein the first dielectric sheet is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is made of a material having a second dielectric constant greater than the first dielectric constant.

[0216] According to an embodiment, the electronic device may further include a third dielectric sheet disposed between the first dielectric sheet and the second dielectric sheet and having a third dielectric constant.

[0217] According to an embodiment, the third dielectric constant may be greater than the first dielectric constant and less than the second dielectric constant.

[0218] According to an embodiment, the electronic device includes: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device facing a second direction perpendicular to the first direction; a back plate having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface; at least one dielectric layer disposed between the at least one antenna module and the side surface; and a wireless communication circuit configured to transmit an RF signal in a predetermined frequency band to the at least one antenna module or receive an RF signal in a predetermined frequency band from the at least one antenna module, wherein the at least one antenna module includes a printed circuit board and a dielectric layer disposed on the printed circuit board. A plurality of antenna elements on a first surface of a printed circuit board, wherein the printed circuit board has a third surface facing a second direction and a fourth surface facing a direction opposite to the second direction; the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is attached to at least a partial area of ​​the third surface of the printed circuit board and is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is arranged on the first dielectric sheet along the second direction and is made of a material having a second dielectric constant greater than the first dielectric constant; and the second dielectric sheet may have at least one first opening formed at a position corresponding to at least a partial area of ​​the plurality of antenna elements.

[0219] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: a display having a first surface facing a first direction; a metal frame structure configured to form a side surface of the electronic device, wherein the side surface faces a second direction perpendicular to the first direction; a rear plate having a second surface facing a third direction opposite to the first direction; at least one antenna module disposed within the side surface and having a radiating surface facing the second direction; at least one dielectric layer having at least a portion of an area attached to the radiation surface of the at least one antenna module and disposed between the radiation surface and the side surface; and a wireless communication circuit configured to transmit a radio frequency (RF) signal in a predetermined frequency band to the at least one antenna module or receive a radio frequency (RF) signal in a predetermined frequency band from the at least one antenna module; wherein the at least one dielectric layer comprises a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is attached to at least a portion of the radiation surface of the at least one antenna module, and the second dielectric sheet is arranged on the first dielectric sheet along the second direction, and The first dielectric sheet includes a thermally conductive material having a first dielectric constant, and the second dielectric sheet includes a material having a second dielectric constant greater than the first dielectric constant.

2. The electronic device according to claim 1, further comprising: The third dielectric sheet is provided between the first dielectric sheet and the second dielectric sheet and has a third dielectric constant.

3. The electronic device according to claim 2, wherein: The third dielectric constant is greater than the first dielectric constant and less than the second dielectric constant.

4. The electronic device according to claim 1, wherein The thickness of the second dielectric sheet is smaller than the thickness of the first dielectric sheet.

5. The electronic device according to claim 1, wherein The at least one dielectric layer is spaced apart from the metal frame structure. The electronic device according to claim 1 , wherein: The first dielectric sheet has a first portion attached to the at least a portion of the radiation surface of the at least one antenna module and a second portion substantially perpendicular to the first portion and in contact with a metal region in the electronic device.

7. The electronic device according to claim 6, wherein: Heat generated by the at least one antenna module is diffused to the metal area in the electronic device through the second portion of the first dielectric sheet.

8. The electronic device according to claim 1, further comprising: A graphite sheet is arranged between the metal frame structure and the rear plate.

9. The electronic device according to claim 8, wherein: The first dielectric sheet further includes a first portion attached to the at least a portion of the radiation surface of the at least one antenna module and a second portion substantially perpendicular to the first portion and in contact with a portion of the graphite sheet.

10. The electronic device according to claim 9, wherein: Heat generated by the at least one antenna module is diffused to the graphite sheet through the second portion of the first dielectric sheet.

11. The electronic device according to claim 1, in, a first dielectric sheet having a first region attached to the radiation surface of the at least one antenna module and a second region protruding from the first region in a first direction or a third direction, and The second region operates as a heat sink configured to dissipate heat generated by the at least one antenna module to a surrounding of the second region.

12. The electronic device according to claim 1, in, The at least one antenna module comprises: printed circuit boards; and An antenna array is provided on the printed circuit board and includes a plurality of antenna elements configured to transmit or receive RF signals in the predetermined frequency band.

13. The electronic device according to claim 12, wherein: The second dielectric sheet includes at least one first opening formed at a position corresponding to at least a partial area of ​​the plurality of antenna elements.

14. The electronic device according to claim 13, further comprising: a third dielectric sheet disposed between the first dielectric sheet and the second dielectric sheet and having a third dielectric constant, The third dielectric sheet has at least one second opening formed at a position corresponding to at least a portion of the plurality of antenna elements.

15. The electronic device according to claim 13, wherein: An outer surface of the at least one first opening is formed in a shape including outer surfaces of the plurality of antenna elements.

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