Interface device, wafer loading and unloading device, and semiconductor process equipment

Abstract

An interface device of a semiconductor process equipment, a wafer loading and unloading device comprising the interface device and the semiconductor process equipment, the interface device being used for connecting the wafer loading and unloading device of the semiconductor process equipment and a wafer transfer box, the interface device comprising: a main plate, the main plate being provided with an opening for transmitting a wafer; a shell, the shell being arranged at the opening of the main plate and being communicated with the opening; a panel, the panel being arranged at the opening and being capable of moving along a direction perpendicular to the main plate; a driving mechanism, the driving mechanism being arranged in the shell, the driving mechanism comprising a driving device and a sealing structure for accommodating the driving device, the center axis of the driving device being deviated from the center axis of the panel along the moving direction of the panel, the driving device being in transmission connection with the panel and being used for driving the panel to move to close or open the opening, the driving device being sealed in the sealing structure when the opening is opened. The interface device can avoid causing particle pollution to the internal environment of the FOUP connected therewith.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of semiconductor equipment, and more particularly, relates to an interface device of a semiconductor process equipment, a wafer loading and unloading device comprising the interface device and the semiconductor process equipment. BACKGROUND

[0002] The Front-opening Interface Mechanical Standard (FIMS) is an important part of the mechanical wafer transfer system of a vertical heat treatment equipment or even a semiconductor equipment. At present, a Front Opening Unified Pod (FOUP) is often used as a container for wafer transfer and temporary storage in the semiconductor industry. In the process of putting in and taking out wafers, the FIMS is used to fix, purge, open and close the FOUP, so as to ensure the sealing of the FOUP before and after opening, and to enable the wafers to be transferred between the wafer loading area and the FOUP in a clean manner.

[0003] As shown in Figure 1 and Figure 2 , the FOUP mainly comprises a box body 3 and a door plate 4. The FIMS mainly comprises a main plate 1, an outer door frame 2, a unlocking panel 5, a suction cup 6, a push rod 7, a screw 8, an air cylinder 9 and a fixing piece 10. The air cylinder 9 is fixed in the outer door frame 2 through the fixing piece 10, the push rod 7 is connected with the unlocking panel 5 through the screw 8, and the suction cup 6 is used to adsorb the door plate 4. Referring to Figure 1 , in the closed state of the FIMS, the door plate 4 seals the box body 3, and the internal environment a of the FIMS formed by the unlocking panel 5 and the outer door frame 2 is also sealed from the external atmospheric environment. Referring to Figure 2 and 3 , in the open state of the FIMS, the air cylinder 9 drives the push rod 7 to pull the unlocking panel 5 and the door plate 4. Since the air cylinder 9 is located directly behind the unlocking panel 5, the particles generated by the movement of the air cylinder 9 will be wrapped in the gas disturbed by the unlocking panel 5 in the opening process, and will flow into the internal environment b of the FOUP from the internal environment a of the FIMS along with the air flow, thereby causing product surface quality problems. Figure 4 shows a schematic diagram of particle diffusion in the open state. In the open state, the particles flow into the internal environment b of the FOUP from the internal environment a of the FIMS. SUMMARY

[0004] The purpose of the present application is to provide an interface device of a semiconductor process equipment, so as to solve the problem that the particles generated by the existing FIMS enter the internal environment of the FOUP and affect the quality of the wafers.

[0005] In order to achieve the above object, the application provides an interface device of a semiconductor process equipment, which is used for connecting a wafer loading and unloading device of the semiconductor process equipment and a wafer transfer box, and comprises:

[0006] a main plate, which is provided with an opening for transmitting a wafer;

[0007] a shell, which is arranged at the opening of the main plate and communicates with the opening;

[0008] a panel, which is arranged at the opening and can move in a direction perpendicular to the main plate;

[0009] a driving mechanism, which is arranged in the shell and comprises a driving device and a sealing structure for accommodating the driving device, the center axis of the driving device deviates from the center axis of the panel in a direction perpendicular to the moving direction of the panel, the driving device is in transmission connection with the panel and is used for driving the panel to move to close or open the opening, and the driving device is sealed in the sealing structure when the opening is opened.

[0010] Preferably, the driving device comprises a cylinder and a push rod in transmission connection with the cylinder, and the push rod is in transmission connection with the panel; the projection of the center axis of the cylinder on the panel is located outside the area where the panel is located.

[0011] Preferably, the sealing structure comprises:

[0012] a box body, which is used for accommodating the cylinder, and one end of the box body is an open end;

[0013] a cover plate, which is arranged at the open end of the box body, and the cover plate is provided with a through hole through which the push rod passes, and a sealing element is arranged between the push rod and the through hole;

[0014] a sealing cover, one side of which is connected with the panel and the other side of which is connected with the push rod, when the push rod drives the panel to move to open the opening, the sealing cover is sealingly connected to the side of the cover plate facing the panel, and the edge of the sealing cover surrounds the through hole, so that the sealing cover and the box body form a sealing space for accommodating the driving device.

[0015] Preferably, the cover plate is connected with a first side wall of the shell, and the first side wall is connected with the main plate; and / or

[0016] the cover plate is connected with a top wall and / or a bottom wall of the shell.

[0017] Preferably, the sealing cover is connected with one end of the panel close to the first side wall through a connecting piece.

[0018] Preferably, the sealing cover comprises a sealing plate, a sealing frame arranged at the edge of the sealing plate, and a sealing ring arranged in a sealing groove of the sealing frame.

[0019] Preferably, the cover plate is further provided with a device mounting hole, the cylinder is connected to the cover plate through the device mounting hole, and the edge of the sealing cover surrounds the device mounting hole.

[0020] Preferably, the driving device, the box body, the cover plate and the sealing cover are coaxially arranged.

[0021] Preferably, the box body is provided with a vacuum port for connecting a vacuum device.

[0022] Another aspect of the present application provides a wafer loading and unloading device, comprising a main box and the interface device, the main box has an open end, and the main plate of the interface device is arranged at the open end of the main box to close the main box.

[0023] Still another aspect of the present application provides a semiconductor process equipment, comprising a process chamber and the wafer loading and unloading device, and the wafer loading and unloading device is connected to the process chamber.

[0024] The present application has the following advantages:

[0025] 1. The cylinder of the prior art is located on the motion track of the panel, so that the particles generated by the driving of the cylinder are easily disturbed by the motion of the panel. In the embodiment of the present application, the central axis of the driving device deviates from the central axis of the panel, and thus deviates from the motion track of the panel. Therefore, the particles generated by the motion of the driving device are not easily carried by the airflow disturbed by the panel into the environment of the FOUP, thereby avoiding the particle pollution of the environment of the FOUP.

[0026] 2. When the interface device is in the open state, the driving device is sealed in the sealed space, and all the particles generated by the driving of the driving device are also sealed in the sealed space. The particles will not diffuse to the environment of the FOUP due to the motion and the change of air pressure, and the diffusion of the particles in the interface device is reduced, thereby prolonging the service life of the driving device and improving the cleanliness of the wafer loading area.

[0027] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which like reference characters refer to like parts throughout the figures, and in which:

[0029] Figure 1 A schematic diagram of the existing FIMS in a closed door state is shown.

[0030] Figure 2 A schematic diagram of the existing FIMS in an open door state is shown.

[0031] Figure 3 A top view of the existing FIMS in an open door state is shown.

[0032] Figure 4 A schematic diagram of particle diffusion in the existing FIMS in an open door state is shown.

[0033] Figure 5 An installation schematic diagram of an interface device according to one embodiment of the present application is shown.

[0034] Figure 6 A front view of the interface device according to one embodiment of the present application is shown.

[0035] Figure 7 A side view of the interface device according to one embodiment of the present application is shown.

[0036] Figure 8 A top view of the interface device according to one embodiment of the present application is shown.

[0037] BRIEF DESCRIPTION OF DRAWINGS

[0038] 1 main plate; 2 outer door frame; 3 box body; 4 door plate; 5 unlocking panel; 6 suction cup; 7 push rod; 8 screw; 9 air cylinder; 10 fixing piece;

[0039] 11 housing; 111 first side wall; 12 panel; 13 air cylinder; 14 push rod; 15 box body; 16 cover plate; 17 sealing cover; 171 sealing frame; 172 sealing ring; 173 connecting piece; 18 suction cup; 19 FOUP box body; 20 FOUP door plate; 21 main plate; 211 opening; 22 main box; 23 rear door;

[0040] a represents the environment inside the FIMS; b represents the environment inside the FOUP; c represents the environment of the wafer loading area; d represents the sealed space. DETAILED DESCRIPTION

[0041] Preferred embodiments of the present application will be described in more detail below. Although the following describes preferred embodiments of the present application, it is to be understood that the present application can be carried out in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and fully convey the scope of the present application to those skilled in the art.

[0042] The interface device of the semiconductor processing equipment according to an embodiment of the present application comprises:

[0043] a main plate, the main plate being provided with an opening for transmitting a wafer;

[0044] a housing, the housing being arranged at the opening of the main plate and being in communication with the opening;

[0045] a panel, the panel being arranged at the opening and being movable along a direction perpendicular to the main plate;

[0046] a driving mechanism, the driving mechanism being arranged in the housing, the driving mechanism comprising a driving device and a sealing structure for accommodating the driving device, a central axis of the driving device being deviated from a central axis of the panel along a direction perpendicular to the moving direction of the panel, the driving device being in transmission connection with the panel for driving the panel to move to close or open the opening, the driving device being sealed in the sealing structure when the opening is opened.

[0047] The interface device of the present application improves the existing FIMS, deviates the driving device arranged at the back of the panel, so that the central axis of the driving device is deviated from the central axis of the panel along a direction perpendicular to the moving direction of the panel, so that when the panel moves to open the opening, the particles generated by the movement of the driving device are not easily carried by the airflow disturbed by the panel and flow into the environment of the FOUP. In addition, when the opening is opened, the driving device is sealed in the sealing structure, and the particles generated by the movement of the driving device are also sealed in the sealing structure, and cannot flow into the environment of the FOUP, thereby avoiding the particle pollution to the environment of the FOUP.

[0048] Figure 5 a schematic diagram of the installation of the interface device according to an embodiment of the present application is shown, Figure 6 to Figure 8 a front view, a side view and a top view of the interface device according to an embodiment of the present application are shown respectively. Referring to Figure 5 to Figure 8 The interface device of the semiconductor processing equipment comprises:

[0049] a main plate 21, the main plate 21 being provided with an opening 211;

[0050] a housing 11, the housing 11 being arranged at the opening 211 of the main plate 21 and being in communication with the opening 211;

[0051] Panel 12 is located at opening 211 and can move in a direction perpendicular to motherboard 21;

[0052] The drive mechanism is located inside the housing 11. The drive mechanism includes a drive device and a sealing structure for accommodating the drive device. Along the direction of movement perpendicular to the panel, the central axis I of the drive device is offset from the central axis II of the panel. The drive device is connected to the panel 12 for driving the panel 12 to move to close or open the opening 211. When the opening 211 is open, the drive device is sealed inside the sealing structure.

[0053] In this embodiment, the drive mechanism is located at one end of the panel 12, such as... Figure 6 As shown, the drive mechanism is located at the right end of panel 12. However, the drive mechanism can also be located at the left or lower end of panel 12. The drive device includes a cylinder 13 and a push rod 14 driven to the cylinder 13. The push rod 14 is driven to the panel 12, and the projection of the central axis of the cylinder 13 onto the panel 12 is outside the area where panel 12 is located. With this arrangement, without significantly increasing the volume of the housing, the drive mechanism is positioned as far away from the central axis II of the panel as possible, i.e., avoiding the movement trajectory of panel 12 as much as possible. Therefore, when the panel moves and opens the opening, particles generated by the drive device's movement are less likely to be carried by the disturbed airflow of the panel and enter the FOUP environment through the opening.

[0054] The sealing structure includes:

[0055] The housing 15 is used to house the cylinder 13, and one end of the housing 15 is an open end;

[0056] A cover plate 16 is provided on the open end of the box body 15. The cover plate 16 has a through hole for the push rod 14 to pass through, and a sealing element is provided between the push rod 14 and the through hole.

[0057] A sealing cover 17 is connected to the panel 12 on one side and to the push rod 14 on the other side via a connector 173, such as a screw. When the push rod 14 moves the panel 12 to open the opening 211, the sealing cover 17 is sealed to the side of the cover plate 16 facing the panel 12 under the action of the push rod 14, and the edge of the sealing cover 17 surrounds the through hole, thereby forming a sealed space d between the sealing cover 17 and the housing 15 for accommodating the drive device. The sealed space d can seal all particles generated during the operation of the drive device, preventing them from diffusing into the FOUP environment b through airflow exchange due to movement and air pressure changes, thus avoiding particle contamination within the FOUP and ensuring wafer quality. In addition, this arrangement can also reduce particle diffusion inside the interface device, extend the life of the drive device, and improve the cleanliness of the wafer loading area.

[0058] In this embodiment, the housing 11 may include a first sidewall 111, a second sidewall, and a third sidewall (not shown) connected in sequence, and also includes a top wall and a bottom wall. The first sidewall 111 is connected to the motherboard 21. Figure 5 and Figure 7 As shown, the main unit chassis 22 has an open end, and the size of the motherboard 21 matches the size of the open end of the main unit chassis 22 to achieve installation and connection. The motherboard 21 has an opening 211 for transferring wafers. When the opening 211 is open, the wafer can enter the main unit chassis 22 from the FOUP box 19 through the opening 211, that is, from the FOUP internal environment b to the wafer loading area environment c. This is easily understood by those skilled in the art and will not be elaborated further here.

[0059] Panel 12 is located at opening 211 and can be positioned in a direction perpendicular to motherboard 21 (i.e. Figure 7 Left and right directions in the middle Figure 8 The panel 12 moves in the vertical direction. A suction cup 18 is provided on the side of the panel 12 facing the outside of the housing 11. The suction cup 18 is used to adhere to the FOUP door panel 20. When the panel 12 moves, it drives the FOUP door panel 20 to move synchronously. This movement occurs along a direction perpendicular to the direction of movement of the panel 12 (i.e., vertical direction). Figure 8 (In the left-right direction), the central axis I of the drive device deviates from the central axis II of the panel, that is, the two are not on the same straight line. In particular, the projection of the central axis I of the cylinder 13 onto the panel 12 is outside the area where the panel 12 is located, that is, far away from the central axis II of the panel. With this arrangement, when the drive device drives the panel 12 to move to open the opening 211, the particles generated by the movement of the drive device are not easily carried by the airflow disturbed by the panel and rush into the FOUP internal environment b through the opening 211, thereby avoiding particulate pollution of the FOUP internal environment b.

[0060] The housing 15 houses the cylinder 13, and the cover 16 closes the open end of the housing 15. The cover 16 has a through hole for the push rod 14 to pass through. To prevent particles generated at the cylinder end from passing through the through hole, a sealing element, typically a sealing ring, is provided between the push rod 14 and the through hole to achieve a seal between the push rod 14 and the through hole. However, relying solely on this sealing element cannot completely prevent particles generated by the driving device from spreading towards the opening 211. Therefore, in this embodiment, a sealing cover 17 is provided, with one side connected to the panel 12 and the other side connected to the push rod 14. When the cylinder 13 drives the push rod 14 to retract, it moves the sealing cover 17 to seal the side of the cover 16 facing the panel 12 (i.e., the side facing the panel 12). Figure 8The edge of the sealing cover 17 encloses the through hole, and at the same time, the sealing cover 17 also drives the panel 12 to move synchronously to open the opening 211. Since the edge of the sealing cover 17 encloses the through hole, the sealing cover 17 forms a sealed space d with the box body 15 for accommodating the driving device, and all particles generated by the driving device during driving are sealed in the sealed space d and cannot diffuse to the FOUP internal environment b through air exchange due to movement and air pressure change, thereby avoiding causing particle pollution in the FOUP and ensuring wafer quality. In addition, this arrangement can also reduce the diffusion of particles in the interface device, prolong the service life of the driving device, and improve the cleanliness in the wafer loading area.

[0061] The cover plate 16 can be connected to the first side wall 111 of the shell 11, which is adjacent to the main plate 21, or the cover plate 16 can also be connected to the top wall and / or bottom wall of the shell 11, as long as it is convenient for fixing the cover plate 16.

[0062] The sealing cover 17 can be connected to one end of the panel 12 close to the first side wall 111 by a connecting member such as a bolt.

[0063] In this embodiment, the sealing cover 17 includes a sealing plate, a sealing frame 171 provided at the edge of the sealing plate, and a sealing ring 172 provided in a sealing groove on the side of the sealing frame 171 facing the cover plate 16, so as to realize reliable sealing between the sealing cover 17 and the cover plate 16 and form the sealed space d.

[0064] Since the central axis of the driving device deviates from the central axis of the panel, in order to ensure that the panel 12 does not deviate during movement, a guide device such as a guide rail can be provided in the shell. In addition, the air cylinder 13 can be connected to the cover plate 16. The installation of the guide device, the installation of the air cylinder, or the installation of other auxiliary devices can be realized by means of the equipment mounting hole on the cover plate. In order to avoid the diffusion of particles generated by the driving device through the equipment mounting hole to the FOUP internal environment b, the edge of the sealing cover 17 also encloses the equipment mounting hole, so that when the sealing cover 17 is sealingly connected to the side of the cover plate 16 facing the panel 12, the sealing cover 17 forms a sealed space d with the box body 15 for accommodating the driving device.

[0065] Preferably, the box body 15 is a cuboid, and the cover plate 16 and the sealing cover 17 are rectangular, and the driving device, the box body 15, the cover plate 16, and the sealing cover 17 are coaxially arranged and all deviate from the central axis II of the panel 12.

[0066] In order to further avoid the diffusion of particles generated by the driving device to the FOUP internal environment b, the box body 15 can be provided with a vacuum port for connecting a vacuum device to form a negative pressure in the box body 15.

[0067] The wafer loading and unloading device also includes a main box 22 and the interface device. The main box 22 has an open end, and the main plate 21 of the interface device is arranged at the open end of the main box 22 to close the main box 22.

[0068] The wafer loading and unloading device also includes a main box 22 and the interface device. The main box 22 has an open end, and the main plate 21 of the interface device is arranged at the open end of the main box 22 to close the main box 22.

[0069] The wafer loading and unloading device also includes a main box 22 and the interface device. The main box 22 has an open end, and the main plate 21 of the interface device is arranged at the open end of the main box 22 to close the main box 22. The above has described the embodiments of the present application. The above description is exemplary and is not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. An interface device for semiconductor process equipment, used to connect the wafer loading / unloading device of the semiconductor process equipment to a wafer transfer box, characterized in that, The interface device includes: A motherboard, wherein the motherboard has an opening for transferring wafers; A housing is disposed at the opening of the motherboard and communicates with the opening; A panel, located at the opening, is movable in a direction perpendicular to the motherboard; A drive mechanism is disposed within the housing. The drive mechanism includes a drive device and a sealing structure for accommodating the drive device. Along a direction of movement perpendicular to the panel, the central axis of the drive device is offset from the central axis of the panel. The drive device is drively connected to the panel and is used to drive the panel to perform the movement to close or open the opening. When the opening is open, the drive device is sealed within the sealing structure. The driving device includes a cylinder and a push rod that is driven to the cylinder, and the push rod is driven to the panel. The sealing structure includes: A housing for containing the cylinder, with one end of the housing being open. A cover plate is provided on the open end of the box body, the cover plate is provided with a through hole for the push rod to pass through, and a sealing element is provided between the push rod and the through hole; A sealing cover is provided, with one side connected to the panel and the other side connected to the push rod. When the push rod moves the panel to open the opening, the sealing cover is sealed to the side of the cover plate facing the panel, and the edge of the sealing cover surrounds the through hole, thereby forming a sealed space between the sealing cover and the housing for accommodating the drive device.

2. The interface device according to claim 1, characterized in that, The projection of the central axis of the cylinder onto the panel is outside the area where the panel is located.

3. The interface device according to claim 1, characterized in that, The cover plate is connected to the first sidewall of the housing, and the first sidewall is connected to the main board; and / or The cover plate is connected to the top wall and / or bottom wall of the housing.

4. The interface device according to claim 3, characterized in that, The sealing cap is connected to the end of the panel near the first sidewall via a connector.

5. The interface device according to claim 1, characterized in that, The sealing cover includes a sealing plate, a sealing frame, and a sealing ring. The sealing frame is located at the edge of the sealing plate, and a sealing groove is provided on the side of the sealing frame facing the cover plate. The sealing groove is used to accommodate the sealing ring.

6. The interface device according to claim 1, characterized in that, The cover plate is also provided with equipment mounting holes, and the cylinder is connected to the cover plate through the equipment mounting holes. The edge of the sealing cover surrounds the equipment mounting holes.

7. The interface device according to claim 1, characterized in that, The drive device, the housing, the cover plate, and the sealing cover are arranged coaxially.

8. The interface device according to claim 1, characterized in that, The box is equipped with a vacuum port for connecting a vacuum pump.

9. A wafer loading and unloading device, characterized in that, The device includes a main unit chassis and an interface device according to any one of claims 1-8, wherein the main unit chassis has an open end, and the motherboard of the interface device is disposed at the open end of the main unit chassis to close the main unit chassis.

10. A semiconductor process apparatus, characterized in that, It includes a process chamber and a wafer loading / unloading device according to claim 9, wherein the wafer loading / unloading device is connected to the process chamber.

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