Attaching method and attaching device
Patent Information
- Application Number
- CN202310469351.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-27
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2043-04-27
AI Technical Summary
[0003]有鉴于此,本申请实施例提供了一种贴合方法和贴合装置,以解决现有技术中如何将显示面板与盖板的锥面区域贴合的问题
[0014] According to the bonding device and bonding method provided in the embodiments of this application, curved bonding surfaces of a first display panel and a cover plate are bonded together. The curved bonding surface is formed by rotating a straight generatrix around a predetermined axis. The curved bonding surface can be a conical surface. The bonding device includes: a bearing structure, including a bearing surface and a rotating shaft, with the bearing surface located at one end of the rotating shaft; a pressure applying structure, including a pressure line; and a first driving structure connected to the bearing structure and/or the pressure applying structure. The bonding device includes a first state and a second state. In the first state, the bearing surface forms a predetermined angle with the horizontal plane, so that any generatrix of the curved bonding surface of the cover plate supported by the bearing surface is on the horizontal plane; the pressure line is on the horizontal plane, and the pressure applied by the pressure applying structure is vertically downward. In the second state, the first driving structure drives one of the bearing structure and the pressure applying structure to rotate relative to the other. Therefore, the bonding device and bonding method provided in the embodiments of this application achieve bonding between the curved bonding surfaces of the first display panel and the cover plate, where the curved bonding surface can be a conical surface. Furthermore, in the second state, with the first driving structure driving the load-bearing structure to rotate and the pressure-applying structure remaining stationary, the bonding process acts on the horizontal surface, that is, bonding is performed on the horizontal surface. This is equivalent to transforming curved surface bonding into bonding of multiple planes connected sequentially in the horizontal direction, ensuring a good bonding effect.
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Figure CN116423959B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more specifically to a bonding method and bonding device for bonding a display panel and a cover plate. Background Technology
[0002] As market demands change, displays have evolved from two-curved to four-curved, and a demand for circular 3D displays has gradually emerged. Circular 3D displays not only require a circular display area on the front but also conical display areas on the sides. For this type of display, the bonding of the conical display areas during the lamination of the display panel and cover plate presents significant challenges to the lamination equipment and processes. Summary of the Invention
[0003] In view of this, embodiments of this application provide a bonding method and bonding device to solve the problem in the prior art of how to bond the conical area of the display panel and the cover plate.
[0004] This application provides a bonding device for bonding the curved bonding surfaces of a first display panel and a cover plate, the curved bonding surfaces being formed by rotating a straight generatrix around a predetermined axis. The bonding device includes: a support structure including a support surface and a rotating shaft, the support surface being located at one end of the rotating shaft; a pressure applying structure including a pressure line; and a first driving structure connected to the support structure and / or the pressure applying structure. The bonding device includes a first state and a second state. In the first state, the support surface forms a predetermined angle with a horizontal plane, such that any generatrix of the curved bonding surface of the cover plate supported by the support surface is on a horizontal plane; the pressure line is on a horizontal plane, and the pressure applied by the pressure applying structure is vertically downward. In the second state, the first driving structure drives one of the support structure and the pressure applying structure to rotate relative to the other. This achieves bonding between the curved bonding surfaces of the first display panel and the cover plate, the curved bonding surface being a conical surface. Furthermore, in the second state, with the first driving structure driving the load-bearing structure to rotate and the pressure-applying structure remaining stationary, the bonding process acts on the horizontal surface, that is, bonding is performed on the horizontal surface. This is equivalent to transforming curved surface bonding into bonding of multiple planes connected sequentially in the horizontal direction, ensuring a good bonding effect.
[0005] In conjunction with the first aspect, in one embodiment, the bearing surface includes a curved bearing surface; in a first state, any generatrix of the curved bearing surface is on a horizontal plane. On the horizontal plane, the generatrix of the curved bearing surface can be aligned with the generatrix of the curved mating surface, that is, the curved bearing surface and the curved mating surface have matching shapes, thereby ensuring that the curved bearing surface can provide better support for the curved mating surface.
[0006] In conjunction with the first aspect, in one embodiment, the bonding device further includes a guide structure, which includes a guide surface whose orthographic projection falls on a curved surface with the rotation axis as its axis and the pressure line as its generatrix. Preferably, the orthographic projection of the guide structure on the curved bearing surface lies within the curved bearing surface. The guide structure is used to achieve alignment between the first display panel guided by the guide surface and the curved bonding surface.
[0007] In conjunction with the first aspect, in one embodiment, the guiding structure includes grippers and guide rollers; in the second state, the grippers, guide rollers, and pressure-applying structure are arranged sequentially on the orthographic projections of the curved bearing surface. The structure is simple and easy to implement.
[0008] In conjunction with the first aspect, in one embodiment, the supporting surface includes an adsorption surface. This structure is simple, easy to implement, and provides more uniform adsorption force.
[0009] In conjunction with the first aspect, in one embodiment, the bonding device further includes: an image acquisition structure for acquiring an image of the first display panel on a horizontal plane; and an image processing chip for determining the positional relationship between the first display panel and the curved bonding surface based on the image. This works in conjunction with the guiding structure to ensure alignment accuracy.
[0010] In conjunction with the first aspect, in one embodiment, the image acquisition structure includes a camera and a prism. The camera acquires an image of the first display panel on a horizontal plane via the prism. This ensures more flexible selection of the camera's location and avoids the camera being unable to acquire an image of the target location due to obstruction by other components.
[0011] In conjunction with the first aspect, in one embodiment, the image processing chip is used to identify alignment marks in an image. At the alignment marks, the positional relationship between the first display panel and the curved bonding surface is determined based on the alignment marks. Between adjacent alignment marks, the positional relationship between the display panel and the curved bonding surface is determined based on the outer edge line of the first display panel and the outer edge line of the cover plate. Preferably, the alignment marks are arranged in pairs in the inner edge region of the first display panel and the outer edge region of the second display panel, with the second display panel attached to the planar bonding surface of the cover plate, the planar bonding surface being surrounded by the curved bonding surface. Different identification methods are used for the two cases—at the alignment marks and between adjacent alignment marks—to further ensure alignment accuracy.
[0012] In conjunction with the first aspect, in one embodiment, the bonding device further includes: a second driving structure connected to the guiding structure; the second driving structure is used to drive the guiding structure to perform posture adjustment based on the positional relationship when alignment deviation occurs between the first display panel and the curved bonding surface. This achieves real-time response to alignment deviation and improves the automation level of the bonding device.
[0013] A second aspect of this application provides a bonding method for bonding the curved bonding surfaces of a first display panel and a cover plate using the bonding apparatus provided in any of the above embodiments. The curved bonding surfaces are formed by rotating a straight generatrix around a predetermined axis. The bonding method includes: before bonding, controlling the bearing surface of the bearing structure to adhere to the cover plate, adjusting the angle of the rotating shaft so that any generatrix of the curved bonding surface of the cover plate is on a horizontal plane; after the first display panel and the curved bonding surfaces are aligned, controlling the pressure applying structure to press against the first display panel on the horizontal plane; controlling the first driving structure to drive one of the bearing structure and the pressure applying structure to rotate relative to the other, so as to bond the first display panel to the curved bonding surface.
[0014] According to the bonding device and bonding method provided in the embodiments of this application, curved bonding surfaces of a first display panel and a cover plate are bonded together. The curved bonding surface is formed by rotating a straight generatrix around a predetermined axis. The curved bonding surface can be a conical surface. The bonding device includes: a bearing structure, including a bearing surface and a rotating shaft, with the bearing surface located at one end of the rotating shaft; a pressure applying structure, including a pressure line; and a first driving structure connected to the bearing structure and / or the pressure applying structure. The bonding device includes a first state and a second state. In the first state, the bearing surface forms a predetermined angle with the horizontal plane, so that any generatrix of the curved bonding surface of the cover plate supported by the bearing surface is on the horizontal plane; the pressure line is on the horizontal plane, and the pressure applied by the pressure applying structure is vertically downward. In the second state, the first driving structure drives one of the bearing structure and the pressure applying structure to rotate relative to the other. Therefore, the bonding device and bonding method provided in the embodiments of this application achieve bonding between the curved bonding surfaces of the first display panel and the cover plate, where the curved bonding surface can be a conical surface. Furthermore, in the second state, with the first driving structure driving the load-bearing structure to rotate and the pressure-applying structure remaining stationary, the bonding process acts on the horizontal surface, that is, bonding is performed on the horizontal surface. This is equivalent to transforming curved surface bonding into bonding of multiple planes connected sequentially in the horizontal direction, ensuring a good bonding effect. Attached Figure Description
[0015] Figure 1 This is a structural schematic diagram of a circular three-dimensional display screen viewed from the side in related technologies.
[0016] Figure 2 This is a schematic diagram of the bonding device in a first state according to an embodiment of this application.
[0017] Figure 3 for Figure 2 The diagram shows the bonding device in its second state.
[0018] Figure 4 for Figure 3 A schematic diagram of the structure of the bonding device from a predetermined angle.
[0019] Figure 5 This is a schematic flowchart of an embodiment of the bonding method provided in this application. Detailed Implementation
[0020] Figure 1 This is a structural schematic diagram of a circular 3D display screen viewed from the side in related technologies. For example... Figure 1 As shown, the circular three-dimensional display screen 10 has a frustum structure, including a circular display surface 11 and a conical display surface 12, with the conical display surface 12 surrounding the circular display surface 11.
[0021] Those skilled in the art should know that a circular three-dimensional display screen 10 typically includes a display panel and a cover plate bonded together. Generally, the flexible display panel is bonded to the cover plate, and the shape of the cover plate determines the shape of the final display panel.
[0022] For the circular 3D display screen 10, as can be seen from its shape, the cover plate includes a conical surface. After the conical surface is bonded to the flexible display panel, a conical display surface 12 is formed. The shape of the flexible display panel and the shape of the conical surface are adapted to each other. Through long-term research, the inventors have discovered that during the bonding process between the conical surface and the flexible display panel, the flexible display panel is prone to problems such as wrinkles and bubbles, which affect the bonding effect.
[0023] In view of this, embodiments of this application provide a bonding device and a bonding method for bonding the curved bonding surfaces of a first display panel and a cover plate, wherein the curved bonding surface is formed by rotating a straight generatrix around a predetermined axis. The curved bonding surface can be... Figure 1 The tapered surface is shown. The bonding device includes: a bearing structure, including a bearing surface and a rotating shaft, with the bearing surface located at one end of the rotating shaft; a pressure applying structure, including a pressure line; and a first driving structure connected to the bearing structure and / or the pressure applying structure. The bonding device includes a first state and a second state. In the first state, the bearing surface forms a predetermined angle with the horizontal plane, so that any generatrix of the curved bonding surface of the cover plate supported by the bearing surface is on the horizontal plane; the pressure line is on the horizontal plane, and the pressure applied by the pressure applying structure is vertically downward. In the second state, the first driving structure drives one of the bearing structure and the pressure applying structure to rotate relative to the other. It can be seen that the bonding device and bonding method provided according to the embodiments of this application realize the bonding between the curved bonding surfaces of the first display panel and the cover plate, which can be a tapered surface. Furthermore, in the second state, with the first driving structure driving the bearing structure to rotate and the pressure applying structure remaining stationary, the bonding process acts on the horizontal plane, that is, bonding is performed on the horizontal plane, which is equivalent to transforming the curved bonding into the bonding of multiple planes connected sequentially in the horizontal direction, ensuring a good bonding effect.
[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0025] The bonding apparatus and bonding method provided in this application embodiment are used to bond the curved bonding surfaces of a first display panel and a cover plate. The cover plate includes a planar bonding surface and a curved bonding surface, with the curved bonding surface surrounding the planar bonding surface. The curved bonding surface is formed by rotating a straight generatrix around a predetermined axis. The first display panel is a flexible display panel. The first display panel is used to attach to the curved bonding surface of the cover plate. The first display panel can be an organic electroluminescent display panel or a quantum dot display panel.
[0026] Figure 2 This is a schematic diagram of the bonding device in a first state according to an embodiment of this application. Figure 3 for Figure 2 The diagram shows the bonding device in its second state. Figure 4 for Figure 3 The diagram shows a structural schematic of the fitting device at a predetermined viewing angle. This predetermined viewing angle L refers to the direction in which the human eye observes along the axis of rotation. Figure 4 The width of the first display panel is ignored, and the first display panel is represented as a line.
[0027] Combination Figure 2 , Figure 3 and Figure 4 As shown, the bonding device 20 is used to bond the curved bonding surfaces S of the first display panel 30 and the cover plate 40. The curved bonding surface S is formed by rotating a straight generatrix around a predetermined axis, and the curved bonding surface can be unfolded into a plane. The curved bonding surface S can be a conical surface or a cylindrical surface, etc. The bonding device 20 includes a load-bearing structure 21, a pressure-applying structure 22, and a first driving structure 24 that cooperate with each other.
[0028] The supporting structure 21 includes a supporting surface Q and a rotating shaft 211, with the supporting surface Q located at one end of the rotating shaft 211. The supporting surface Q can be an adsorption surface used to adsorb and support the cover plate 40. The supporting surface Q can be a plane, a curved surface, or both a plane and a curved surface, with the curved surface surrounding the plane. The curved supporting surface is adapted to the shape of the cover plate 40, and can provide support for the first display panel 30 during the bonding process.
[0029] The pressure-applying structure 22 includes a pressure-applying line 221, which is a line of action that applies pressure outward. That is, the pressure-applying structure 22 and the first display panel 30 are in line contact, and the contact position corresponds to the pressure-applying line 221. The pressure-applying structure 22 can be a pressing roller. In this case, the line at any position on the pressing roller is the pressure-applying line 221.
[0030] The first drive structure 24 can be connected to the load-bearing structure 21 and / or the pressure-applying structure 22.
[0031] The bonding device 20 includes a first state and a second state.
[0032] In the first state, the bearing surface Q forms a predetermined angle with the horizontal plane, such that any generatrix of the curved mating surface S of the cover plate 30 supported by the bearing surface Q is on the horizontal plane. The predetermined angle depends on the angle between the curved mating surface S of the cover plate 40 and the planar mating surface B. The pressure line 221 is on the horizontal plane, and the pressure applied by the pressure structure 22 is vertically downward. The first state is used for the initial alignment of the curved mating surfaces S of the first display panel 30 and the cover plate 40.
[0033] In the second state, the first driving structure 24 drives one of the bearing structure 21 and the pressure-applying structure 22 to rotate relative to the other. In one specific embodiment, the first driving structure 24 may drive the bearing structure 21 to rotate relative to the pressure-applying structure 22. It is understood that the pressure-applying structure 22 will rotate synchronously.
[0034] In one embodiment, the bonding device 20 further includes a guide structure 23, which includes a guide surface C. The guide surface C is the surface on which the guide structure 23 contacts the first display panel 20. For example, see [reference needed]. Figure 4 The guide structure 23 includes a gripper 231 and a guide roller 232. The gripper 231 is used to hold the first display panel 30 to move the first display panel 30. The guide roller 232 is used to limit the first display panel 30 at a predetermined position away from the curved surface S. It should be understood that the gripper 231 can be replaced by other structures with a gripping function, such as an adsorption element. The guide roller 232 can be replaced by other structures with a limiting function, such as a limiting block, the surface of which contacts the first display panel 30 is a smooth arc surface.
[0035] The orthographic projection of the guide surface C falls on a curved surface with the rotation axis 211 as its axis and the pressure line 221 as its generatrix, ensuring that the orthographic projection of the guide surface C falls on the curved mating surface S of the cover plate 40. For example, the bearing surface Q includes a curved bearing surface whose shape is adapted to the curved mating surface S of the cover plate 40. In the first state, any generatrix of the curved bearing surface is on a horizontal plane. The orthographic projection of the guide structure 23 on the curved bearing surface lies within the curved bearing surface.
[0036] In the second state, the gripper 231, guide roller 232 and pressure structure 22 are arranged in sequence on the curved bearing surface.
[0037] The bonding device 20 may also include an image acquisition structure 25 and an image processing chip (not shown in the figure).
[0038] The image acquisition structure 25 is used to acquire images of the first display panel 30 on a horizontal plane. Specifically, it can be an image of a specific location on the first display panel 30, such as an image of the inner edge region and / or an image of the outer edge region of the first display panel 30. The image acquisition structure 25 includes a camera 251. When it is necessary to acquire images of different locations on the first display panel 30, multiple cameras can be configured, each used to acquire images from different locations.
[0039] The image acquisition structure 25 may also include a prism 252, through which the camera 251 acquires images of the first display panel 30 on a horizontal plane. By setting the prism 252, other structures can be prevented from obstructing the light captured by the camera, and the position of the camera 251 can be set more flexibly.
[0040] The image processing chip is used to determine the positional relationship between the first display panel 30 and the curved bonding surface S based on an image. For example, the image processing chip is used to identify alignment marks in the image, and at the alignment marks, the positional relationship between the first display panel 30 and the curved bonding surface S is determined based on the alignment marks; between adjacent alignment marks, the positional relationship between the first display panel 30 and the curved bonding surface S is determined based on the outer edge line of the first display panel 30 and the outer edge line of the cover plate 40.
[0041] Alignment marks can be paired and disposed on the inner edge region of the first display panel 30 and the outer edge region of the second display panel 50. The second display panel 50 is attached to the planar bonding surface B of the cover plate 40, and the planar bonding surface B is surrounded by the curved bonding surface S. For example, the alignment marks include multiple first alignment marks and multiple second alignment marks, with each first alignment mark and second alignment mark corresponding one-to-one. The multiple first alignment marks are disposed circumferentially along the inner edge of the first display panel 30, and the multiple second alignment marks are disposed circumferentially along the outer edge of the second display panel 50. It should be understood that if the second display panel 50 is not attached to the planar bonding surface B of the cover plate 40, the second alignment marks can also be disposed circumferentially along the outer edge of the planar bonding surface B.
[0042] The image acquisition structure 25 may further include a second driving structure 26 connected to the guiding structure 23. The second driving structure 26 is used to drive the guiding structure 23 to adjust its posture based on its positional relationship when there is a misalignment between the first display panel 30 and the curved bonding surface S, ensuring that the first display panel 30 and the curved bonding surface S remain aligned during the bonding process. The second driving structure 26 may also be connected to the pressure applying structure 22 to drive the pressure applying structure 22 to adjust its position.
[0043] This application also provides a bonding method for bonding the curved bonding surfaces S of the first display panel 30 and the cover plate 40 using the bonding device 20 provided in any of the above embodiments. Figure 5 This is a schematic flowchart illustrating a bonding method provided in an embodiment of this application. Figure 5 As shown, the bonding method 500 includes:
[0044] Step S520: Before bonding, control the bearing surface Q of the bearing structure 21 to adhere to the cover plate 40. Adjust the angle of the rotating shaft 211 so that any generatrix of the curved bonding surface S of the cover plate 40 is on a horizontal plane.
[0045] In step S540, with the first display panel and the curved mating surface already aligned, the pressure applying structure 22 is controlled to press against the first display panel 30 on the horizontal surface.
[0046] In step S560, the first driving structure 24 is controlled to drive one of the bearing structure 21 and the pressure applying structure 22 to rotate relative to the other, so as to attach the display panel 30 to the curved bonding surface S. Specifically, the first driving structure 24 may be controlled to drive the bearing structure 21 to rotate relative to the pressure applying structure 22.
[0047] In one embodiment, the bonding method 500 further includes a step S530 performed before step S540, which controls the guide structure 23 to move the first display panel 30 until one end of the first display panel 30 is aligned with the curved bonding surface S on the horizontal plane. Specifically, the gripper 231 in the guide structure 23 is controlled to move the first display panel 30.
[0048] According to the bonding device and bonding method provided in any of the above embodiments, by controlling the pressure applying structure 22 to remain stationary while the cover plate 40 rotates around the pivot 221, bonding between the curved bonding surfaces S of the first display panel 30 and the cover plate 40 is achieved. Furthermore, in the second state, with the first driving structure driving the supporting structure to rotate and the pressure applying structure remaining stationary, the bonding process acts on the horizontal plane, i.e., bonding is performed on the horizontal plane. This is equivalent to transforming the curved bonding into bonding multiple planes sequentially connected in the horizontal direction, ensuring a good bonding effect.
[0049] It should be noted that, when using the bonding device provided in any of the above embodiments, the first driving structure 24 can also be connected to the pressure applying structure 22. In this case, in the second state, the cover plate 40 is kept stationary, and the pressure applying structure 22 is driven to rotate relative to the cover plate 40 around the rotation axis 211, while the guide structure 23 and the pressure applying structure 22 are driven to rotate synchronously. That is, the cover plate 40 is stationary, and the pressure applying structure 22 and the guide structure 23 rotate around the rotation axis 211 to bond the first display panel 30 and the curved bonding surface S.
[0050] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.
Claims
1. A bonding device, characterized in that, For bonding curved surfaces of a first display panel and a cover plate, the curved bonding surfaces being formed by rotating a straight generatrix around a predetermined axis; the bonding device includes: A load-bearing structure includes a load-bearing surface and a rotating shaft, wherein the load-bearing surface is located at one end of the rotating shaft; The pressure application structure includes pressure lines; and A first driving structure is connected to the load-bearing structure and / or the pressure-applying structure; The bonding device includes a first state and a second state; In the first state, the bearing surface forms a predetermined angle with the horizontal plane, so that any generatrix of the curved mating surface of the cover plate supported by the bearing surface is on the horizontal plane; the pressure line is on the horizontal plane, and the pressure applied by the pressure-applying structure is vertically downward; In the second state, the first driving structure drives one of the bearing structure and the pressure-applying structure to rotate relative to the other.
2. The bonding device according to claim 1, characterized in that, The bearing surface includes a curved bearing surface; in the first state, any generatrix of the curved bearing surface is on the horizontal plane.
3. The bonding device according to claim 2, characterized in that, It also includes a guiding structure, including a guiding surface, the orthographic projection of which falls on a curved surface with the axis of rotation as the axis and the pressure line as the generatrix.
4. The bonding device according to claim 3, characterized in that, The orthographic projection of the guide structure onto the curved bearing surface lies within the curved bearing surface.
5. The bonding device according to claim 3, characterized in that, The guiding structure includes a gripper and a guide roller; in the second state, the gripper, the guide roller, and the pressure applying structure are arranged sequentially on the orthographic projection of the curved bearing surface.
6. The bonding device according to any one of claims 1 to 5, characterized in that, The bearing surface includes an adsorption surface.
7. The bonding device according to any one of claims 1 to 5, characterized in that, Also includes: An image acquisition structure is used to acquire an image of the first display panel on the horizontal plane; An image processing chip is used to determine the positional relationship between the first display panel and the curved bonding surface based on the image.
8. The bonding device according to claim 7, characterized in that, The image acquisition structure includes a camera and a prism, and the camera acquires the image of the first display panel on the horizontal plane through the prism.
9. The bonding device according to claim 7, characterized in that, The image processing chip is used to identify alignment marks in the image. At the alignment marks, the positional relationship between the first display panel and the curved bonding surface is determined based on the alignment marks. Between adjacent alignment marks, the positional relationship between the first display panel and the curved bonding surface is determined based on the outer edge line of the first display panel and the outer edge line of the cover plate.
10. The bonding device according to claim 9, characterized in that, The alignment marks are arranged in pairs in the inner edge region of the first display panel and the outer edge region of the second display panel. The second display panel is attached to the planar bonding surface of the cover plate, and the planar bonding surface is surrounded by the curved bonding surface.
11. The bonding device according to claim 7, characterized in that, Also includes: Guiding structure; A second driving structure is connected to the guiding structure; The second driving structure is used to drive the guiding structure to adjust its posture based on the positional relationship when there is a misalignment between the first display panel and the curved bonding surface.
12. A bonding method, characterized in that, A bonding apparatus for bonding the curved bonding surfaces of a first display panel and a cover plate using any one of claims 1 to 11, wherein the curved bonding surface is formed by rotating a straight generatrix about a predetermined axis; the bonding method includes: Before bonding, the cover plate is adsorbed onto the bearing surface of the bearing structure, and the angle of the rotating shaft is adjusted so that any generatrix of the curved bonding surface of the cover plate is on the horizontal plane. With the first display panel and the curved mating surface aligned, the pressure-applying structure is controlled to press against the first display panel on the horizontal surface; The first driving structure is controlled to drive one of the supporting structure and the pressure-applying structure to rotate relative to the other, so as to attach the first display panel to the curved bonding surface.
Citation Information
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