A stamp hole guide fixed connection type radar induction device and T8 lamp tube

Abstract

The application provides a stamp hole guide fixed connection type radar sensing device and a T8 lamp tube, comprising: a radar module fixed on a non-upright plug-in component PCB surface of a power module and welded with a solder pad tin paste of the power module through a plurality of stamp hole guide fixed connection modes; the stamp hole comprises a plurality of performance holes and a plurality of positioning holes; the power module at least comprises a power board, one end of the power board is electrically connected with the radar module through the external interface, and the power board is also electrically connected with an external adapter through a serial port; the other end of the power board is electrically connected with an LED lamp. The application uses a stamp hole as a contact point of a radar sensing system and a power system, and realizes soldering through tin paste, thereby reducing the occurrence of problems such as assembly or incoming materials of a row of pins or terminal wires, realizing that side projection of the radar sensing system and the power system is on the same horizontal line, thereby balancing the detection performance of the radar sensing system in respective directions, and further improving the experience of a user.

Description

Technical Field

[0001] This application relates to the field of radar sensing technology, and more specifically, to a stamp hole conductive fixed connection type radar sensing device and a T8 lamp tube. Background Technology

[0002] Currently, radar sensing systems on the market are connected to power systems via pin headers or direct soldering of terminal wires. This can lead to assembly and material handling issues, such as floating pin headers, misaligned pin headers, misaligned terminal wires, and pin burrs. Consequently, the side projections of the radar sensing system and power system may not be on the same horizontal line, affecting the performance of the radar sensing system. The most obvious manifestation is a significant distance deviation in one direction compared to a very short distance in another, resulting in a discrepancy in sensing distance across different directions. This severely reduces product performance and provides a poor user experience. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a stamp hole conductive fixed connection radar sensing device and a T8 lamp tube. This application uses a stamp hole as the contact point between the radar sensing system and the power supply system. By soldering with solder paste, the occurrence of problems caused by the assembly or incoming materials of the connector pins or terminal wires is reduced. This ensures that the side projections of the radar sensing system and the power supply system are on the same horizontal line, thereby balancing the detection performance of the radar sensing system in their respective directions. A T8 lamp tube adopts this stamp hole conductive fixed connection radar sensing device. The radar module converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module. The output voltage of the power supply module is controlled through the stamp hole to control the output power and brightness of the LED in the T8 lamp tube, so that the T8 lamp tube can automatically adjust its brightness according to changes in the surrounding target environment, improving the user experience.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] A stamp-perforation conductive fixed-connection radar sensing device, used to detect moving or slightly moving targets within a preset range, includes:

[0006] The radar module is fixed on the non-vertical plug-in component PCB surface of the power module and is aligned and soldered to the pads of the power module through solder paste via multiple stamp holes; the stamp holes include multiple performance holes and multiple positioning holes.

[0007] In this application, the stamp hole may include multiple performance holes and multiple pin holes, or it may only include multiple performance holes; the performance hole may also be referred to as a functional stamp hole, and the positioning hole may be a combination of a reinforcing positioning hole and an auxiliary positioning hole.

[0008] The radar module includes a PCB board, a radar chip for sensing radar waves mounted on the PCB board, a radar wave sensing signal transceiver control circuit mounted on the PCB board and bidirectionally connected to the radar chip for sensing radar waves, and an MCU control chip mounted on the PCB board and bidirectionally connected to the radar chip for sensing radar waves. The MCU control chip controls the radar chip for sensing radar waves to transmit and receive radar wave sensing signals.

[0009] In this application, the radar chip may include at least a transmitting antenna for transmitting radar wave sensing signals and a receiving antenna for receiving radar wave sensing signals. When the radar module is powered on, the radar module begins to detect within a predetermined range. When it senses a moving or slightly moving target within the predetermined detection range, the MCU control chip, as the control center of the radar module, controls and processes these sensing signals and converts them into adjustable electrical signals.

[0010] The PCB board uses an external interface with multiple stamp holes for conductive fixing.

[0011] The power supply module includes at least a power board. One end of the power board is electrically connected to the radar module through the external interface and also electrically connected to an external adapter through a serial port. The other end of the power board is electrically connected to an LED light.

[0012] In this application, components that are relatively tall on the power board in the power module need to be moved to the middle position of the power board when designing the PCB circuit routing.

[0013] The radar module converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module. This signal is then connected via the stamp hole and controls the output voltage of the power supply to control the output power and brightness of the LED light.

[0014] In this application, the output power and brightness of the LED lamp can be determined by the driving power supply of the power module, which can be controlled by the radar module through processing the inductive signal into an electrical signal. This electrical signal is transmitted via a perforated stamp.

[0015] Furthermore, the fixed connection method for the stamp hole specifically includes:

[0016] The performance hole is a through hole opened at the center of the perimeter on one side of the PCB board;

[0017] The performance holes are arranged in a straight line; the straight line is parallel to one side perimeter of the PCB board.

[0018] In this application, the diameter of each performance hole is 1 mm, and the center-to-center distance of each performance hole is 2 mm.

[0019] And, the positioning holes are opened in the same direction as the performance holes, and the positioning holes are arranged around the perimeter of the side of the straight line perpendicular to the PCB board.

[0020] In this application, the diameter of the positioning holes is 1mm, and the distance between the center of the positioning hole and the edge of the plate closest to one side is ≥1mm.

[0021] Furthermore, the pin header holes are opened in the same direction as the performance holes, and the distance between the pin header holes and the center of one side of the performance holes is 1.3mm; the performance holes and the pin header holes are arranged in two straight rows, aligned or staggered in electrical performance; the two straight rows are parallel to each other and parallel to one side of the PCB board.

[0022] In this application, the performance holes and the pin holes can be electrically aligned and connected, and can also be flexibly arranged asymmetrically as needed.

[0023] The center of the performance hole and the center of the pin row hole are on a straight line; the distance between the center of the pin row hole and the edge of the plate closest to one side is 1.3mm.

[0024] In this application, the diameter of each pin header hole is 1 mm; and the center-to-center distance of each pin header hole is 2 mm.

[0025] Furthermore, the stamp hole conductive fixing connection method specifically includes:

[0026] The performance holes and the positioning holes are arranged in a straight line in the same column; the same straight line is parallel to one side of the perimeter of the PCB board.

[0027] The performance holes are located at the center of one side of the PCB board; the positioning holes are located at one end of one side of the PCB board near the corner.

[0028] In this application, the center-to-center distance between the positioning hole and the closest performance hole in the same column is 3.5 mm;

[0029] The diameter of each performance hole is 1 mm, and the center-to-center distance of each performance hole is greater than 2 mm.

[0030] The diameter of each positioning hole is 1mm, and the distance between the center of the positioning hole and the end closest to the corner is ≥1mm.

[0031] Furthermore, the pin header holes are opened in the same direction as the performance holes, and the distance between the pin header holes and the center of one side of the performance holes is 1.3mm; the performance holes and the pin header holes are arranged in two straight rows, aligned and connected in an electrical manner; the two straight rows are parallel to each other and parallel to one side of the PCB board.

[0032] In this application, the performance holes and the pin holes can be electrically aligned and connected, and can also be flexibly arranged asymmetrically as needed.

[0033] The center of the performance hole and the center of the pin row hole are on a straight line; the distance between the center of the pin row hole and the edge of the plate closest to one side is 1.3mm;

[0034] In this application, the diameter of each pin header hole is 1 mm; and the center-to-center distance of each pin header hole is greater than 2 mm.

[0035] Furthermore, the radar module is fixed on the non-vertical plug-in component PCB surface of the power module, and is soldered to the pads of the power module via solder paste through multiple stamp holes for conductive connection. Specifically:

[0036] The side of the radar module with the external interface integrated on the non-vertical plug-in component PCB surface and the side of the power module with the corresponding solder pad on the non-vertical plug-in component PCB surface are connected and fixed by soldering with solder paste through multiple stamp holes.

[0037] In this application, the PCB surface of the non-vertical plug-in components of the radar module and the PCB surface of the non-vertical plug-in components of the power supply module are fixedly overlapped, forming an upper and lower connection relationship between the PCB boards.

[0038] Furthermore, the PCB surfaces of the non-vertical plug-in components of the power module all use SMT devices;

[0039] Furthermore, the height of the SMT device is consistent with the thickness of the PCB board in the radar module, as well as the height of the antenna surface components mounted on the PCB board.

[0040] In this application, the radar module and the power supply module constitute a combined module, and the side projection of the combined module is on the same horizontal line.

[0041] In this application, the radar module is fixed at the center line position of the non-vertical plug-in component PCB surface of the power module, and the overlapping part is ≥1.8mm through the stamp hole for conductive connection.

[0042] To achieve the above objectives, this application also adopts the following technical solution:

[0043] A T8 lamp tube employs a stamp-hole conductive fixed radar sensing device, specifically:

[0044] The T8 lamp tube includes a T8 lamp tube housing and a sealed cavity formed by the T8 lamp tube housing and a plug cover plate; a detachable semi-circular press-type baffle plate is installed above the T8 lamp tube housing.

[0045] Furthermore, a radar module and a power module are fixedly installed in the sealed cavity; the power module includes at least a power board; one end of the power board is electrically connected to an LED lamp.

[0046] In this application, the radar module is fixed on the non-vertical plug-in component PCB surface of the power module, and is aligned and soldered to the pads on the power board by solder paste through a multiple stamp holes for conductive connection; the stamp holes include multiple performance holes and multiple positioning holes.

[0047] In this application, the stamp hole may include multiple performance holes and multiple pin holes, or it may only include multiple performance holes; the performance hole may also be referred to as a functional stamp hole, and the positioning hole may be a combination of a reinforcing positioning hole and an auxiliary positioning hole.

[0048] Furthermore, the power supply module is electrically connected to the radar module through the stamp hole, and also electrically connected to an external adapter through a serial port.

[0049] In this application, the radar module converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module, which is then connected via the stamp hole to control the output voltage of the power supply module, thereby controlling the output power and brightness of the LED light.

[0050] Furthermore, the radar module is fixed to the non-vertical plug-in component PCB surface of the power module, and is soldered to the power module's pads via solder paste through multiple stamp holes for conductive connection. Specifically:

[0051] The side of the radar module with the external interface integrated on the non-vertical plug-in component PCB surface and the side of the power module with the corresponding solder pad on the non-vertical plug-in component PCB surface are connected and fixedly soldered with solder paste through multiple stamp holes.

[0052] In this application, the PCB surface of the non-vertical plug-in components of the radar module and the PCB surface of the non-vertical plug-in components of the power supply module are fixedly overlapped, forming an upper and lower connection relationship between the PCB boards.

[0053] Furthermore, SMT components are used on the PCB surface of the non-vertical plug-in components of the power module;

[0054] Furthermore, the height of the SMT device is consistent with the thickness of the PCB board in the radar module, as well as the height of the antenna surface components mounted on the PCB board.

[0055] In this application, the radar module and the power supply module constitute a combined module, and the side projection of the combined module is on the same horizontal line.

[0056] In this application, the radar module is fixed at the center line position of the non-vertical plug-in component PCB surface of the power module, and the overlapping part is ≥1.8mm through the stamp hole for conductive connection.

[0057] Furthermore, a locking pair is provided inside the T8 lamp tube housing, and a buckle is provided inside the end cap plate. The end cap plate can be rotated 180 degrees counterclockwise or clockwise to allow the buckle to engage or disengage with the locking pair, thereby enabling installation or disassembly.

[0058] In this application, a crosshair for calibration is provided at the center of the bottom of the inner shell of the T8 lamp tube housing. The intersection of the crosshair with the center of the plate edge of the combined module after the power module and the radar module are electrically connected through the stamp hole is spatially coincident with the center of the plate edge near the end cap.

[0059] Furthermore, the T8 lamp tube may also include one or more fixed limiting grooves;

[0060] In this application, the power board of the power module is installed and fixed in the horizontal direction inside the T8 lamp tube housing according to the fixed limiting slide groove; the fixed limiting slide groove is located on the inner side of the end cap or at the inner reinforcing rib of the semi-arc press-type shield.

[0061] Furthermore, the T8 lamp tube may also include a bottom support boss for fixing the combined module; the bottom support boss is located inside the end cap or at the inner reinforcing rib of the semi-circular press-type baffle.

[0062] In this application, the center of the bottom support boss and the intersection of the cross lines coincide in space.

[0063] In this application, the combined module consisting of the radar module and the power module in the T8 lamp tube can be positioned in the front-to-back horizontal direction and the up-to-down vertical direction by means of one or more fixed sliding grooves and bottom support bosses.

[0064] In this application, the control design ensures that the alignment height of the crosshairs of the combined module in the horizontal and vertical directions within the T8 lamp tube is consistent.

[0065] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0066] This application proposes a stamp hole conductive fixed connection radar sensing device and a T8 lamp tube. It proposes to use the stamp hole as the contact point between the radar sensing system and the power system, and to perform alignment soldering through solder paste. This reduces the occurrence of problems caused by the assembly or incoming materials of pin headers or terminal wires, reduces design costs, processing complexity and processing time, and improves the stability of the fixed connection effect. This application also proposes that the PCB surfaces of the non-vertical plug-in components of the radar module and the non-vertical plug-in components of the power supply module are fixedly overlapped, forming an upper and lower connection between the PCB boards. Moreover, SMT components are used on the PCB surfaces of the non-vertical plug-in components of the power supply module. The height of the SMT components is consistent with the thickness of the PCB board in the radar module and the height of the antenna components set on the PCB board in the radar module. This avoids the limitation that the antenna surface of the radar module must be higher than the component surface inside the T8 lamp tube, and also makes the side projection of the combined module composed of the radar module and the power supply module on the same horizontal line. This balances the detection performance of the radar sensing system in their respective directions and improves the ease of assembly of the T8 lamp tube, thereby improving the user experience. Attached Figure Description

[0067] Figure 1 This is a schematic diagram of a preferred embodiment of a stamp hole conductive fixed connection type radar sensing device.

[0068] Figure 2 This is a schematic diagram of another visual structure of a stamp hole conductive fixed connection radar sensing device according to a preferred embodiment of this application.

[0069] Figure 3 This is a schematic diagram of another preferred embodiment of the stamp hole conductive fixed connection type radar sensing device in this application.

[0070] Figure 4 This is a schematic diagram of a T8 lamp tube structure according to a preferred embodiment of this application.

[0071] Figure 5 This is a partial structural diagram of a T8 lamp tube according to a preferred embodiment of this application.

[0072] In the diagram: 1-Radar module; 2-Power supply module; 3-Performance hole; 4-Positioning hole; 5-Pin header hole; 6-SMT component; 7-T8 lamp housing; 8-End cover plate; 9-Semi-arc press-type baffle plate; 10-Fixed limit slide groove; 11-Bottom support boss. Detailed Implementation

[0073] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the application. However, this application can be implemented in many different forms and is not limited to the embodiments described herein.

[0074] Example 1:

[0075] As attached Figure 1 As shown, in order to solve the above-mentioned technical problems, this application proposes a stamp hole conduction fixed connection type radar sensing device, comprising:

[0076] A stamp-perforation conductive fixed-connection radar sensing device, used to detect moving or slightly moving targets within a preset range, includes:

[0077] The radar module 1 is fixed on the non-vertical plug-in component PCB surface of the power module 2, and is aligned and soldered to the pads of the power module 2 by solder paste through multiple stamp holes; the stamp holes include multiple performance holes 3 and multiple positioning holes 4.

[0078] In this application, the stamp hole may include multiple performance holes 3 and multiple pin holes 5, or it may only include multiple performance holes 3; the performance hole 3 may also be referred to as a functional stamp hole, and the positioning hole 4 may be a combination of a reinforcing positioning hole and an auxiliary positioning hole.

[0079] Preferably, there can be 5 stamp holes, including 3 performance holes 3 and 2 positioning holes 4; wherein, the 3 performance holes 3 correspond to the V\O\G interfaces of the radar module 1 respectively, and the O interface is located between the other two middle performance holes 3, and is not limited to this.

[0080] The radar module 1 includes a PCB board, a radar chip for sensing radar waves disposed on the PCB board, a radar wave sensing signal transceiver control circuit disposed on the PCB board and bidirectionally connected to the radar chip for sensing radar waves, and an MCU control chip disposed on the PCB board and bidirectionally connected to the radar chip for sensing radar waves. The MCU control chip controls the radar chip for sensing radar waves to transmit and receive radar wave sensing signals.

[0081] In this application, the radar chip may include at least a transmitting antenna for transmitting radar wave sensing signals and a receiving antenna for receiving radar wave sensing signals. When the radar module 1 is powered on, the radar module 1 begins to detect within a predetermined range. When it senses and acquires sensing signals of moving or slightly moving targets within the predetermined detection range, the MCU control chip, as the control center of the radar module 1, controls and processes these sensing signals and converts them into adjustable electrical signals.

[0082] Preferably, the transmitting antenna can be a Tx onboard micro-antenna, and the receiving antenna can be an Rx onboard micro-antenna, but neither is limited to these.

[0083] The PCB board uses an external interface with multiple stamp holes for conductive fixing.

[0084] The power module 2 includes at least a power board. One end of the power board is electrically connected to the radar module 1 through the external interface and also electrically connected to the external adapter through a serial port. The other end of the power board is electrically connected to an LED light.

[0085] In this application, the relatively tall components on the power board of the power module 2 need to be moved to the middle position of the power board when designing the PCB circuit routing.

[0086] Preferably, relatively tall components such as inductors and capacitors are used to avoid damage to these components during packaging, but this is not an exclusive case.

[0087] Preferably, components that are relatively tall on the power board can also be placed upside down, but this is not the only option.

[0088] The radar module 1 converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module 2. This signal is then connected via the stamp hole and controls the output voltage of the power supply to control the output power and brightness of the LED light.

[0089] In this application, the output power and brightness of the LED lamp can be determined by the driving power supply of the power module 2, which can be controlled by the radar module 1 through processing the inductive signal into an electrical signal. This electrical signal is transmitted via a perforated stamp.

[0090] Furthermore, the fixed connection method for the stamp hole specifically includes:

[0091] The performance hole 3 is a through hole opened at the center of the perimeter on one side of the PCB board;

[0092] The performance holes 3 are arranged in a straight line; the straight line is parallel to one side of the perimeter of the PCB board.

[0093] Preferably, the diameter of the performance stamp holes in the stamp perforation can all be 1mm, and the center-to-center spacing of the performance stamp holes can all be 2mm, but these are not limited to these.

[0094] And, the positioning holes 4 are opened in the same direction as the performance holes 3, and the positioning holes 4 are arranged around the periphery of the side of the straight line perpendicular to the PCB board.

[0095] Preferably, the positioning hole 4 can be a reinforced positioning hole, the diameter of which can be 1mm, and the distance between the center of the positioning hole 4 and the edge of the plate closest to one side can be 2mm, but is not limited to these.

[0096] Furthermore, pin holes 5 are opened in the same direction as the performance holes 3; the performance holes 3 and the pin holes 5 are arranged in two straight rows, aligned and connected in an electrical manner; the two straight rows are parallel to each other and parallel to one side of the PCB board.

[0097] Preferably, the performance holes and pin header holes can also be cross-aligned and connected in terms of electrical performance, or can be arranged flexibly and asymmetrically as needed, and are not limited thereto.

[0098] Preferably, the distance between the center of the pin row hole 5 and the center of the performance hole 3 on one side can be 1.3mm, and the distance between the center of the pin row hole 5 and the edge of the plate closest to one side can be 1.3mm, but neither is limited to these.

[0099] Preferably, the diameter of the pin holes 5 can all be 1mm; and the center-to-center spacing of the pin holes 5 can all be 2mm, but is not limited to these.

[0100] As attached Figure 2 As shown, furthermore, the radar module 1 is fixed on the non-vertical plug-in component PCB surface of the power module 2, and is soldered to the pads of the power module 2 via solder paste through multiple stamp holes for conductive connection. Specifically:

[0101] The side of the radar module 1 with the external interface integrated on the non-vertical plug-in component PCB surface is connected to the side of the power module 2 with the corresponding solder pad on the non-vertical plug-in component PCB surface by soldering through multiple stamp holes.

[0102] In this application, the PCB surface of the non-vertical plug-in components of the radar module 1 and the PCB surface of the non-vertical plug-in components of the power module 2 are fixedly overlapped, forming an upper and lower connection relationship between the PCB boards.

[0103] Preferably, the radar module 1 is fixed at the center line of the non-vertical plug-in component PCB surface of the power module 2, and the overlapping part of the connection through the stamp hole can be 2mm, but is not limited to this.

[0104] Furthermore, the PCB surfaces of the non-vertical plug-in components of the power module 2 all use SMT components 6;

[0105] Furthermore, the height of the SMT device 6 is consistent with the thickness of the PCB board in the radar module 1, as well as the height of the antenna surface components disposed on the PCB board.

[0106] In this application, the radar module 1 and the power supply module 2 constitute a combined module, and the side projection of the combined module is on the same horizontal line.

[0107] Preferably, the thickness of the PCB board in radar module 1 plus the height of the antenna surface components can reach about 2.2mm, while the height of the SMT components 6 on the non-vertical plug-in components PCB of power module 2 is also about 2.0mm. It can be basically assumed that the heights of the two are consistent, and it can also be assumed that the side projection of this combined module is on the same horizontal line.

[0108] Example 2:

[0109] As attached Figure 3 As shown, in order to solve the above-mentioned technical problems, this application also proposes another stamp hole conductive fixed connection radar sensing device, wherein the stamp hole conductive fixed connection method specifically includes:

[0110] The performance holes 3 and the positioning holes 4 are arranged in a straight line in the same column; the same straight line is parallel to one side of the perimeter of the PCB board.

[0111] The performance holes 3 are arranged in the center of one side of the PCB board; the positioning holes 4 are arranged at one end of one side of the PCB board near the corner.

[0112] Preferably, the positioning hole 4 can be an auxiliary positioning hole, and the center-to-center distance between the auxiliary positioning hole and the closest performance stamp hole in the same column can be 3.5 mm, but is not limited to this.

[0113] Preferably, the diameter of the performance holes 3 can all be 1mm, and the center-to-center distance of the performance holes 3 can all be 2.5mm, but is not limited to these.

[0114] Preferably, the diameter of the positioning hole 4 can be 1mm, and the distance between the center of the positioning hole 4 and the edge of the upper or lower plate can be 2mm, but is not limited to these.

[0115] Furthermore, the pin holes 5 are opened in the same direction as the performance holes 3. The performance holes 3 and the pin holes 5 are arranged in two straight rows, aligned and connected in an electrical manner; the two straight rows are parallel to each other and parallel to one side of the PCB board.

[0116] Preferably, the performance holes and pin header holes can also be cross-aligned and connected in terms of electrical performance, or can be arranged flexibly and asymmetrically as needed, and are not limited thereto.

[0117] Preferably, the distance between the center of the pin hole 5 and the edge of the plate near one side can be 1.3mm, but it is not limited to this.

[0118] Preferably, the diameter of the pin holes 5 can all be 1mm; and the center-to-center spacing of the pin holes 5 can all be 3mm, but is not limited to these.

[0119] Example 3:

[0120] As attached Figure 4 As shown, in order to solve the above-mentioned technical problems, this application also proposes a T8 lamp tube, which adopts a stamp hole conductive fixed radar sensing device, specifically as follows:

[0121] The T8 lamp tube includes a T8 lamp tube housing 7 and a sealed cavity formed by the T8 lamp tube housing 7 and a plug cover plate 8; a detachable semi-circular press-type baffle plate 9 is installed above the T8 lamp tube housing 7.

[0122] Furthermore, a radar module 1 and a power module 2 are fixedly installed in the sealed cavity; the power module 2 includes at least a power board; one end of the power board is electrically connected to an LED lamp.

[0123] Preferably, the T8 lamp tube is powered by a single-ended power supply. The housing 7 of the T8 lamp tube can be made of plastic or glass. The LED lamp can also be replaced by other lamps, such as energy-saving lamps, and is not limited to these.

[0124] Furthermore, the radar module 1 is fixed on the non-vertical plug-in component PCB surface of the power module 2, and is aligned and soldered to the pads on the power board by solder paste through a multiple stamp hole conductive connection; the stamp hole includes multiple performance holes 3 and multiple positioning holes 4.

[0125] In this application, the stamp hole may include multiple performance holes 3 and multiple pin holes 5, or it may only include multiple performance holes 3; the performance hole 3 may also be referred to as a functional stamp hole, and the positioning hole 4 may be a combination of a reinforcing positioning hole and an auxiliary positioning hole.

[0126] Preferably, the semi-circular press-type shield 9 can be made of plastic or glass. The semi-circular press-type shield 9 is used to facilitate the inspection and adjustment of the power board installation. Its size can be 5cm in side length and 3cm in arc length, but is not limited to these.

[0127] Preferably, there can be 5 stamp holes, including 3 performance holes 3 and 2 positioning holes 4; wherein, the 3 performance holes 3 correspond to the V\O\G interfaces of the radar module 1 respectively, and the O interface is located between the other two middle performance holes 3, and is not limited to this.

[0128] Furthermore, the power supply module 2 is electrically connected to the radar module 1 through the stamp hole, and is also electrically connected to the external adapter through a serial port.

[0129] In this application, the relatively tall components on the power board of the power module 2 need to be moved to the middle position of the power board when designing the PCB circuit routing.

[0130] Preferably, relatively tall components such as inductors and capacitors are used to avoid damage to these components during packaging, but this is not an exclusive case.

[0131] Preferably, components that are relatively tall on the power board can also be placed upside down, but this is not the only option.

[0132] In this application, the radar module 1 converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module 2, which is then connected via the stamp hole to control the output voltage of the power supply module 2, thereby controlling the output power and brightness of the LED light.

[0133] Preferably, radar module 1 only outputs a high or low level conversion control signal greater than 3.5V. For example, radar module 1 outputs a 4V high level conversion control signal based on the radar wave sensing signal, but it is not limited to this.

[0134] Preferably, in addition to ensuring that the LED beads meet the required power, the power supply module 2 must also ensure that it provides the radar module 1 with a power of not less than 100mW (5V / 20mA), such as 200mW (5V / 40mA), and is not limited to this.

[0135] Furthermore, the radar module 1 is fixed to the non-vertical plug-in component PCB surface of the power module 2, and is soldered to the pads of the power module 2 via solder paste through multiple stamp holes for conductive connection. Specifically:

[0136] The side of the radar module 1 with the external interface integrated on the non-vertical plug-in component PCB surface is connected to the side of the power module 2 with the corresponding solder pad on the non-vertical plug-in component PCB surface by soldering through multiple stamp holes.

[0137] In this application, the PCB surface of the non-vertical plug-in components of the radar module 1 and the PCB surface of the non-vertical plug-in components of the power module 2 are fixedly overlapped, forming an upper and lower connection relationship between the PCB boards.

[0138] Preferably, the radar module 1 is fixed at the center line of the non-vertical plug-in component PCB surface of the power module 2, and the overlapping part of the connection through the stamp hole can be 2mm, but is not limited to this.

[0139] Furthermore, SMT components 6 are used on the PCB surface of the non-vertical plug-in components of the power module 2;

[0140] Furthermore, the height of the SMT device 6 is consistent with the thickness of the PCB board in the radar module 1, as well as the height of the antenna surface components disposed on the PCB board.

[0141] In this application, the radar module 1 and the power supply module 2 constitute a combined module, and the side projection of the combined module is on the same horizontal line.

[0142] Preferably, the thickness of the PCB board in radar module 1 plus the height of the antenna surface components can reach about 2.2mm, while the height of the SMT components 6 on the non-vertical plug-in components PCB of power module 2 is also about 2.0mm. It can be basically assumed that the heights of the two are consistent, and it can also be assumed that the side projection of this combined module is on the same horizontal line.

[0143] Furthermore, a locking pair is provided inside the T8 lamp tube housing 7, and a buckle is provided inside the plug cover plate 8. The plug cover plate 8 can be rotated 180 degrees counterclockwise or clockwise to allow the buckle to engage or disengage with the locking pair, thereby enabling installation or disassembly.

[0144] As attached Figure 5 As shown in this application, a crosshair for calibration is also provided at the center of the bottom of the inner shell of the T8 lamp tube housing 7. The intersection of the crosshair with the center of the plate edge of the combined module after the power module 2 and the radar module 1 are electrically connected through the stamp hole coincides in space.

[0145] Preferably, the locking position, the end cap 8, and the buckle can all be made of plastic. The end cap 8 with the buckle needs to be rotated 180 degrees before the buckle can be aligned with the original locking position and can be connected to the L / N pins on the power board. Otherwise, the end cap cannot be installed. However, this is not the only option.

[0146] Furthermore, the T8 lamp tube may also include one or more fixed limiting grooves 10;

[0147] In this application, the power board of the power module 2 is installed and fixed in the horizontal direction inside the T8 lamp tube housing 7 according to the fixed limiting slide groove 10; the fixed limiting slide groove 10 is placed inside the end cap 8 or at the inner reinforcing rib of the semi-arc press-type shield 9.

[0148] Preferably, two plastic fixing and limiting slide grooves 10 can be installed in the T8 lamp tube, installed at the reinforcing ribs on the inner side of the semi-circular press-type baffle 9, to fix the power board of the power module 2 at the front and rear positions respectively, but not limited to this.

[0149] Furthermore, the T8 lamp tube may also include a bottom support boss 11 for fixing the combined module; the bottom support boss 11 is located inside the end cap 8 or at the inner reinforcing rib of the semi-arc press-type baffle 9.

[0150] Preferably, the bottom support boss 11 can be made of metal or plastic and installed inside the end cap 8, but is not limited to either.

[0151] Preferably, the center of the bottom support boss 11 and the intersection of the cross line coincide in space.

[0152] In this application, the combined module consisting of the radar module 1 and the power module 2 in the T8 lamp tube can achieve the position control design of the combined module in the front-back horizontal direction and the up-down vertical direction by means of one or more fixed sliding grooves 10 and bottom support bosses 11 in the spatial position control method within the T8 lamp tube housing 7.

[0153] In this application, the control design ensures that the horizontal and vertical crosshair alignment height of the combined module within the T8 lamp housing 7 is consistent.

[0154] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0155] In the description of the application, it should be understood that terms such as “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0156] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0157] Although the description of this application has been made in conjunction with the specific embodiments described above, it will be apparent to those skilled in the art that many substitutions, modifications, and variations can be made based on the foregoing. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A fixed-connection radar sensing device for stamp perforation, characterized in that, include: The radar module (1) is fixed on the non-vertical plug-in component PCB surface of the power module (2) and is soldered to the pads of the power module (2) by solder paste through multiple stamp holes for conductive connection; the stamp holes include multiple performance holes (3) and multiple positioning holes (4). The radar module (1) includes a PCB board, a radar chip for radar wave sensing disposed on the PCB board, a radar wave sensing signal transceiver control circuit disposed on the PCB board and bidirectionally connected to the radar chip for radar wave sensing, and an MCU control chip disposed on the PCB board and bidirectionally connected to the radar chip for radar wave sensing signal transceiver control. The MCU control chip controls the radar chip for radar wave sensing to transmit and receive radar wave sensing signals. The PCB board is used as an external interface by integrating multiple stamp holes for conductive fixing. The power module (2) includes at least a power board. One end of the power board is electrically connected to the radar module (1) through the external interface and is also electrically connected to the external adapter through a serial port. The other end of the power board is electrically connected to an LED lamp. The radar module (1) converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module (2), which is then connected via the stamp hole and controls the output voltage of the power supply to control the output power and brightness of the LED light. The non-vertical plug-in components PCB surface of the power module (2) all use SMT components (6); The height of the SMT device (6) is consistent with the thickness of the PCB board in the radar module (1) and the height of the antenna surface components set on the PCB board. The radar module (1) is fixed at the center line of the non-vertical plug-in component PCB surface of the power module (2), and the overlapping part of the PCB board connected by the stamp hole is ≥1.8mm.

2. The stamp-perforation conductive fixed connection radar sensing device according to claim 1, characterized in that, The stamp hole conductive fixing connection method specifically includes: The performance hole (3) is a through hole opened at the center of the periphery on one side of the PCB board; The performance holes (3) are arranged in a straight line; the straight line is parallel to one side of the perimeter of the PCB board; The diameter of each performance hole (3) is 1 mm, and the center-to-center distance of each performance hole (3) is 2 mm. And, the positioning holes (4) are opened in the same direction as the performance holes (3), and the positioning holes (4) are arranged around the periphery of the side of the straight line perpendicular to the PCB board; The diameter of the positioning holes (4) is 1 mm, and the distance between the center of the positioning hole (4) and the corner of the plate edge near one side is ≥1.5 mm; The pin header hole (5) is opened in the same direction as the performance hole (3), and the distance between the pin header hole (5) and the center of the hole on one side of the performance hole (3) is 1.3mm; the performance hole (3) and the pin header hole (5) are arranged in two straight rows and are electrically aligned or staggered; the two straight rows are parallel to each other and parallel to one side of the PCB board. The center of the performance hole (3) and the center of the pin hole (5) are on a straight line; the distance between the center of the pin hole (5) and the edge of the plate closest to one side is ≥1.3mm; The diameter of each of the pin holes (5) is 1 mm; and the center-to-center distance of each of the pin holes (5) is 2 mm.

3. The stamp-perforation conductive fixed connection radar sensing device according to claim 2, characterized in that, The stamp hole conductive fixing connection method further includes: The performance holes (3) and the positioning holes (4) are arranged in a straight line in the same column; the straight line is parallel to one side of the PCB board. The performance holes (3) are arranged in the center of one side periphery of the PCB board; the positioning holes (4) are arranged at one end of one side periphery of the PCB board near the corner; the center-to-center distance between the positioning holes (4) and the closest performance holes (3) in the same column is 3.5 mm; The diameter of each performance hole (3) is 1 mm, and the center-to-center distance of each performance hole (3) is greater than 2 mm. The diameter of the positioning hole (4) is 1mm, and the distance between the center of the positioning hole (4) and the end near the corner is ≥1mm; The pin header holes (5) are opened in the same direction as the performance holes (3), and the distance between the pin header holes (5) and the center of the holes on one side of the performance holes (3) is 1.3mm; the pin header holes (5) are arranged in another straight line; the other straight line is parallel to the periphery of one side of the PCB board; the performance holes (3) and the pin header holes (5) are arranged in two straight lines and are aligned or staggered in electrical performance; the two straight lines are parallel to each other and parallel to the periphery of one side of the PCB board; The center of the performance hole (3) and the center of the pin hole (5) are on a straight line; the distance between the center of the pin hole (5) and the edge of the plate closest to one side is 1.3 mm; The diameter of each of the pin holes (5) is 1 mm; and the center-to-center distance of each of the pin holes (5) is greater than 2 mm.

4. The stamp perforation conductive fixed connection radar sensing device according to claim 3, characterized in that, The radar module (1) is fixed on the non-vertical plug-in component PCB surface of the power module (2), and is soldered to the pads of the power module (2) through multiple stamp holes for conductive connection. Specifically: The side of the radar module (1) with the external interface integrated on the non-vertical plug-in component PCB surface and the side of the power module (2) with the corresponding solder pad on the non-vertical plug-in component PCB surface are connected by solder paste through multiple stamp holes.

5. A T8 lamp tube, the T8 lamp tube comprising a T8 lamp tube housing (7) and a sealed cavity formed by the T8 lamp tube housing (7) and a plug cover plate (8); a detachable semi-circular press-type baffle plate (9) is installed above the T8 lamp tube housing (7); characterized in that, Specifically: A radar module (1) and a power supply module (2) are fixedly installed in the sealed cavity; the power supply module (2) includes at least a power supply board; one end of the power supply board is electrically connected to an LED lamp; The radar module (1) is fixed on the non-vertical plug-in component PCB surface of the power module (2) and is soldered to the pads on the power board by solder paste through a multiple stamp hole conductive connection method; the stamp hole includes multiple performance holes (3) and multiple positioning holes (4). The power module (2) is electrically connected to the radar module (1) through the stamp hole, and is also electrically connected to the external adapter through a serial port; The radar module (1) includes a PCB board, a radar chip for radar wave sensing disposed on the PCB board, a radar wave sensing signal transceiver control circuit disposed on the PCB board and bidirectionally connected to the radar chip for radar wave sensing, and an MCU control chip disposed on the PCB board and bidirectionally connected to the radar chip for radar wave sensing. The MCU control chip controls the radar chip for radar wave sensing to transmit and receive radar wave sensing signals. The radar module (1) converts the radar wave sensing signal into an electrical signal that adjusts the output voltage of the power supply module (2), which is then connected via the stamp hole and controls the output voltage of the power supply module (2) to control the output power and brightness of the LED light. The power module (2) uses SMT components (6) on the PCB surface of the non-vertical plug-in components. The height of the SMT device (6) is consistent with the thickness of the PCB board in the radar module (1) and the height of the antenna surface components set on the PCB board. The radar module (1) is fixed at the center line of the non-vertical plug-in component PCB surface of the power module (2), and the overlapping part of the PCB board connected by the stamp hole is ≥1.8mm.

6. A T8 lamp tube according to claim 5, characterized in that, The radar module (1) is fixed on the non-vertical plug-in component PCB surface of the power module (2), and is soldered to the pads of the power module (2) via solder paste through multiple stamp holes for conductive connection. Specifically: The side of the radar module (1) with an external interface integrated on the non-vertical plug-in component PCB surface is connected to the side of the power module (2) with a corresponding solder pad on the non-vertical plug-in component PCB surface, and is soldered with solder paste through multiple stamp holes for connection and fixation.

7. A T8 lamp tube according to claim 6, characterized in that, The T8 lamp tube housing (7) is provided with a locking pair, and the end cap (8) is provided with a buckle. The end cap (8) can be rotated 180 degrees counterclockwise or clockwise to allow the buckle to engage or disengage with the locking pair, so as to achieve installation or disassembly.

8. A T8 lamp tube according to claim 7, characterized in that, A crosshair for calibration is provided at the center of the bottom of the inner shell of the T8 lamp tube housing (7). The intersection of the crosshair with the center of the plate edge of the combined module after the power module (2) and the radar module (1) are electrically connected through the stamp hole coincides in space.

9. A T8 lamp tube according to claim 8, characterized in that, The T8 lamp tube may also include one or more fixed limiting grooves (10). According to the fixed limiting groove (10), the power board of the power module (2) is installed and fixed in the horizontal direction inside the T8 lamp tube housing (7); the fixed limiting groove (10) is placed inside the end cap (8) or at the reinforcing rib inside the semi-arc press-type baffle (9).

10. A T8 lamp tube according to claim 9, characterized in that, The T8 lamp tube may also include a bottom support boss (11) for fixing the combined module; the bottom support boss (11) is placed inside the end cap (8) or at the inner reinforcing rib of the semi-arc press-type shield (9); The center of the bottom support boss (11) and the intersection of the cross lines coincide in space.

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