Antenna, circuit board, and electronic device

Abstract

The application provides an antenna, a circuit board and an electronic device. The antenna comprises a first radiator and a second radiator arranged on a substrate. The substrate has a first structure layer and a second structure layer. The first structure layer is provided with a first hollow area, and the second structure layer is provided with a second hollow area. The first radiator is arranged in the first hollow area, and the second radiator is arranged in the second hollow area. The first radiator and the second radiator are arranged in a spaced manner along the thickness direction of the substrate. The substrate further has a ground layer. Two ends of the second radiator are connected to the ground layer for grounding. The first radiator is provided with a first gap, and a first end of the first radiator is connected to the ground layer for grounding. The antenna can effectively increase the aperture of the radiator, so that the magnetic field distribution of the antenna is more uniform, thereby effectively reducing the required clearance area of the antenna under the condition of meeting the same antenna performance, and further helping the miniaturization of the electronic device.

Description

Technical Field

[0001] This application relates to the field of antennas, and in particular to an antenna, a circuit board, and an electronic device. Background Technology

[0002] In order to meet market demands and add core selling points, the functional requirements for electronic devices (such as Bluetooth headsets) are increasing, which makes the internal space stacking of electronic devices (such as Bluetooth headsets) increasingly challenging. As an important medium for signal transmission in electronic devices, antennas are a crucial issue that needs to be addressed urgently: how to meet more functional requirements while miniaturizing antennas.

[0003] In existing technologies, high dielectric constant ceramic substrates can be used to reduce the size of the antenna, or laser direct forming technology can be used to bend the antenna and laser-etch it onto the support, thereby reducing the antenna's space occupancy.

[0004] However, using ceramic substrates with high dielectric constants or laser direct forming technology is costly, and the solution using ceramic substrates with high dielectric constants (or can be understood as on-board ceramic antennas) also requires a large clearance area to be reserved for the antenna.

[0005] It is evident that existing technologies suffer from high costs and stringent requirements for clearance area. Summary of the Invention

[0006] This application provides an antenna, circuit board, and electronic device that solves the problems of high cost and high clearance area requirements in the prior art.

[0007] This application provides an antenna, including a first radiator and a second radiator disposed on a substrate.

[0008] The substrate has a first structural layer and a second structural layer. The first structural layer has a first hollow area, and the second structural layer has a second hollow area. A first radiator is mounted in the first hollow area, and a second radiator is mounted in the second hollow area. The first radiator and the second radiator are arranged at intervals along the thickness direction of the substrate.

[0009] The substrate also has a grounding layer, and the two ends of the second radiator are respectively connected to the grounding layer for grounding.

[0010] The first radiator has a first gap, and the first end of the first radiator is connected to the grounding layer to be grounded.

[0011] In this embodiment, by mounting a first radiator in the first hollow area of ​​the substrate and a second radiator in the second hollow area of ​​the substrate, or in other words, by employing a double-layer trace structure on the substrate, the aperture of the radiator (or the length of the radiator) can be effectively increased, resulting in a more uniform magnetic field distribution of the antenna. This, in turn, effectively improves the antenna efficiency under a given clearance area. Alternatively, it can be understood that, while maintaining the same antenna performance, this application can effectively reduce the clearance area required for the antenna, thereby contributing to the miniaturization of electronic devices. Furthermore, this embodiment eliminates the need for metal vias between the first and second radiators. The connection method of grounding one end of the first radiator and both ends of the second radiator further simplifies the antenna structure.

[0012] Furthermore, the embodiments of this application do not require the use of a dielectric material with a high dielectric constant as a substrate, nor do they require the use of laser direct forming technology to form the antenna structure. Therefore, the antennas of the embodiments of this application have the advantages of simple structure and low cost.

[0013] In some embodiments, the second radiator is provided with a second slit.

[0014] In some embodiments, a first capacitor is connected in series on opposite sides of the first slit of the first radiator, and / or a second capacitor is connected in series on opposite sides of the second slit of the second radiator.

[0015] In some embodiments, 0.2pF ≤ the capacitance value of the first capacitor ≤ 3pF, and 0.2pF ≤ the capacitance value of the second capacitor ≤ 3pF.

[0016] In this embodiment of the application, by connecting a first capacitor in series on the first radiator and / or connecting a second capacitor in series on the second radiator and matching the corresponding capacitance values, the inductive impedance of the antenna can be effectively improved, the quality factor value (or Q value) of the antenna can be reduced, and thus the radiation efficiency and bandwidth of the antenna can be improved.

[0017] In some embodiments, the first gap forms a first notch and a second notch on two opposite sides of the first radiator, and the first notch and the second notch are staggered along the extension direction of the first radiator.

[0018] And / or, the second slit of the second radiator forms a third notch and a fourth notch on the two opposite sides of the second radiator, and the third notch and the fourth notch are staggered along the extension direction of the second radiator.

[0019] In this embodiment, by misaligning the first gap and the second gap generated on the two sides of the first radiator by the first gap, and by misaligning the third gap and the fourth gap generated on the two sides of the second radiator by the second gap, the relative area of ​​the radiators on both sides of the first gap (the relative parts of the radiators on both sides of the gap can be regarded as the plates of the equivalent capacitor) and the relative area of ​​the radiators on both sides of the second gap can be effectively increased. The distributed capacitance of the antenna can be constructed by utilizing the structure of the radiator itself, which can effectively deepen the resonance depth of the antenna and thus improve the efficiency bandwidth of the antenna.

[0020] In some embodiments, the first slit is serrated or finger-shaped, and the second slit is serrated or finger-shaped.

[0021] In some embodiments, along the extending direction of the first radiator, the first gap is located at the middle position of the first radiator; along the extending direction of the second radiator, the second gap of the second radiator is located at the middle position of the second radiator.

[0022] In some embodiments, the antenna further includes a feed point disposed on the substrate, wherein a second end of the first radiator is connected to the feed point, or a second end of the first radiator is coupled to the feed point.

[0023] In some possible embodiments, the antenna further includes a feed stub connected to the feed point and spaced apart from the first radiator to form a gap, with the second end of the first radiator coupled to the feed stub through the gap.

[0024] In some possible embodiments, the second end of the first radiator is connected to the feed point via a microstrip line.

[0025] In this embodiment, the method of directly connecting the radiator to the feed point using a microstrip line, compared with the method of connecting the feed point using a spring, can not only reduce material costs, but also avoid the problem of poor contact between the spring and the radiator or the feed point, effectively improving the reliability of the antenna feed connection.

[0026] In some embodiments, the electrical lengths of both the first radiator and the second radiator are less than or equal to 1 / 8 of the antenna's operating wavelength.

[0027] In some embodiments, the antenna operates in the frequency band of 2.4 GHz to 2.48 GHz, and the physical length of the first radiator is 6 mm ≤ 12 mm, and the physical length of the second radiator is 6 mm ≤ 12 mm.

[0028] This application also provides a circuit board, including a substrate, and the antenna involved in the above embodiments and possible embodiments.

[0029] This application also provides an electronic device, including the circuit board involved in the above embodiments and possible embodiments.

[0030] Because the antennas have smaller size, better efficiency and bandwidth, the electronic devices of the present application embodiments can arrange more antennas to meet more functional requirements compared with traditional electronic devices. Or it can be understood that, under the condition of meeting the same functional requirements, the electronic devices of the present application embodiments are more miniaturized.

[0031] In some embodiments, the substrate has multiple metal layers, including a first metal layer and a second metal layer, a first structural layer including the first metal layer, and a second structural layer including the second metal layer.

[0032] In some possible embodiments, the first structural layer is a first metal layer, and the second structural layer is a second metal layer.

[0033] In some possible embodiments, the second metal layer serves as a ground layer.

[0034] In some embodiments, the substrate has a first surface and a second surface, the second surface being disposed opposite to the first surface, the metal layer in the multilayer metal layers closest to the first surface being the first metal layer, and the metal layer in the multilayer metal layers closest to the second surface being the second metal layer.

[0035] In some embodiments, the first radiator includes at least a portion of a first metal layer, and the second radiator includes at least a portion of a second metal layer.

[0036] The electronic device of this application embodiment uses the metal layer inside the substrate as the radiator of the antenna, which helps to simplify the structure of the electronic device. Furthermore, since the radiator of the antenna is formed by at least a portion of the metal layer inside the substrate, it is an integral structure with the metal layer inside the substrate. Compared with electrical connection methods such as spring contact electrical connection and welding electrical connection, the electronic device of this application embodiment is simple to process and has high electrical connection reliability.

[0037] In some embodiments, the first radiator includes a microstrip line disposed on a substrate or a conductive element disposed on a substrate.

[0038] The second radiator includes a microstrip line disposed on a substrate or a conductive element disposed on a substrate.

[0039] In some embodiments, the electronic device further includes a dielectric structure for supporting the first radiator and the second radiator, the dielectric structure being disposed between the first radiator and the second radiator.

[0040] In some embodiments, the substrate is a PCB board, the PCB board includes a dielectric layer, and the dielectric structure includes at least a portion of the dielectric layer.

[0041] In some embodiments, the electronic device is a Bluetooth headset. Attached Figure Description

[0042] Figure 1a This is a top view of the antenna and substrate structure according to an embodiment of this application;

[0043] Figure 1b This is a three-dimensional structural diagram of the antenna and substrate according to an embodiment of this application;

[0044] Figure 1c This is a top-view enlarged structural diagram of the antenna and substrate according to an embodiment of this application;

[0045] Figure 2a This is a three-dimensional structural diagram of the antenna and substrate according to an embodiment of this application, wherein both the first gap and the second gap are serrated.

[0046] Figure 2b This is a three-dimensional structural diagram of the antenna and substrate according to an embodiment of the application, wherein the first gap is in the shape of an interdigitated finger;

[0047] Figure 3 This is a three-dimensional structural diagram of the antenna and substrate according to an embodiment of the application, wherein the dashed arrows indicate the current direction on the antenna and the ground plane;

[0048] Figure 4 The electric field distribution diagram is obtained by simulating the antenna of the embodiment of this application.

[0049] Figure 5 The above is a comparison curve of the S11 parameters obtained from the simulation effect analysis of the antenna of the embodiment of this application and the antenna of the first reference design.

[0050] Figure 6 The graph shows a comparison of radiation efficiency obtained from simulation analysis of the antennas in the embodiments of this application, the antennas in the second reference design, and the antennas in the third reference design.

[0051] Figure 7 The system efficiency comparison curves are obtained by performing simulation effect analysis on the antennas of the embodiments of this application, the antennas of the second reference design, and the antennas of the third reference design.

[0052] Figure 8 This is a three-dimensional structural diagram of the fourth reference design antenna;

[0053] Figure 9 The comparison curves of S11 parameters and system efficiency are obtained by performing simulation effect analysis on the antenna of the embodiment of this application and the antenna of the fourth reference design respectively.

[0054] Figure 10The graphs show the comparison of radiation efficiency obtained from simulation analysis of the antennas in the embodiments of this application and the antennas in the fourth reference design.

[0055] Figure 11 , Figure 12 The graphs show the energy dissipation effect curves obtained from simulation analysis of the antenna of the fourth reference design and the antenna of the embodiment of this application, respectively.

[0056] Figure 13 , Figure 14 The images show magnetic field distribution diagrams obtained from simulation analysis of the antenna of the fourth reference design and the antenna of the embodiment of this application, respectively.

[0057] Figure 15 This is an exploded three-dimensional view of the electronic device according to an embodiment of this application;

[0058] Figure 16 This is a partial structural diagram of the electronic device according to an embodiment of this application;

[0059] Figure 17a This is a partially enlarged structural diagram of the antenna and substrate in the electronic device of this application embodiment;

[0060] Figure 17b This is a partial three-dimensional structural diagram of the antenna and substrate in the electronic device of this application embodiment;

[0061] Figure 18 A partial three-dimensional structural diagram of the antenna and substrate for the fifth reference design;

[0062] Figure 19 This is a three-dimensional structural diagram of the electronic device in the head model scenario according to an embodiment of this application;

[0063] Figure 20 The above are comparison curves of S11 parameters obtained from simulation analysis of the antennas of the embodiments of this application and the antennas of the fifth reference design in the head model scenario.

[0064] Figure 21 The graphs show the system efficiency comparison results obtained from the simulation analysis of the antennas of the embodiments of this application and the antenna of the fifth reference design in the head model scenario.

[0065] Figures 22a-22c All of these are radiation direction comparison curves obtained from simulation effect analysis of the antennas of the embodiments of this application and the antenna of the fifth reference design in the head model scenario;

[0066] Figure 23 This is a partial structural diagram of the electronic device according to an embodiment of this application;

[0067] Figure 24aThis is a partially enlarged structural diagram of the antenna and substrate in the electronic device of this application embodiment;

[0068] Figure 24b This is a partial three-dimensional structural diagram of the antenna and substrate in the electronic device of this application embodiment;

[0069] Figure 25 A partial three-dimensional structural diagram of the antenna and substrate for the sixth reference design;

[0070] Figure 26 The above are comparison curves of S11 parameters obtained from simulation analysis of the antennas of the embodiments of this application and the antennas of the sixth reference design in the head model scenario.

[0071] Figure 27 The graphs show the system efficiency comparison results obtained from the simulation analysis of the antennas of the embodiments of this application and the antenna of the sixth reference design in the head model scenario.

[0072] Figure 28 The graph shows the comparison of radiation efficiency obtained from the simulation analysis of the antenna of the embodiment of this application and the antenna of the sixth reference design in the head model scenario.

[0073] Figures 29a-29c All of these are radiation direction comparison curves obtained from simulation effect analysis of the antennas of the embodiments of this application and the antenna of the sixth reference design in the head model scenario.

[0074] Explanation of reference numerals in the attached figures:

[0075] 1: Antenna;

[0076] 11: First radiator; 110: First slit; 1101: First gap; 1102: Second gap; 12: Second radiator; 120: Second slit; 1201: Third gap; 1202: Fourth gap;

[0077] 2: Circuit board;

[0078] 20: Substrate; 21: First structural layer; 210: First cutout area; 22: Second structural layer; 220: Second cutout area; 23: Dielectric structure component;

[0079] 3: Electronic equipment; 311: Earcup shell; 321: Front shell; 322: Back shell; 33: PCB board;

[0080] A0: Power supply connection point; B1: First terminal; B2: Second terminal; C1: First capacitor; C2: Second capacitor; d: Thickness direction; I: Current direction; L1: Extension direction; L2: Extension direction; S1: First surface; S2: Second surface. Detailed Implementation

[0081] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0082] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0083] The following explains the terms that may appear in the embodiments of this application.

[0084] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0085] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0086] Relative arrangement: This can be understood as an arrangement facing each other (opposite to, or face to face) or an arrangement where at least a portion of the area overlaps along a certain direction. In one embodiment, two radiators arranged in a relative manner are adjacent to each other and no other radiators are arranged between them.

[0087] Coupling can be understood as direct coupling and / or indirect coupling. "Coupled connection" can be understood as a direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection," which can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as electrical conduction between two conductors through a gap / non-contact method. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts.

[0088] Ground / Plug: This can broadly refer to at least a portion of any grounding layer, ground plane, or grounding metal layer within an electronic device (such as a mobile phone), or at least a portion of any combination of the aforementioned grounding layers, ground planes, or grounding components. "Ground / Plug" can be used for grounding components within an electronic device. In one embodiment, "Ground / Plug" may include any one or more of the following: a grounding layer of a circuit board of an electronic device, a ground plane formed by the frame of the electronic device, a grounding metal layer formed by a thin metal film beneath the screen, a conductive grounding layer of a battery, and conductive or metallic components electrically connected to the aforementioned grounding layer / ground plane / metal layer. In one embodiment, the circuit board may include a printed circuit board (PCB), such as an 8-layer, 10-layer, or 12-14-layer board having 8, 10, 12, 13, or 14 layers of conductive material, or components separated and electrically insulated by dielectric or insulating layers such as fiberglass or polymers. In one embodiment, the PCB includes a dielectric substrate (or can be understood as a dielectric layer mentioned later), a grounding layer, and a trace layer, with the trace layer and grounding layer electrically connected through vias. The dielectric substrate in the PCB board can be a flame-retardant material (FR-4) dielectric board, a Rogers dielectric board, or a hybrid dielectric board of Rogers and FR-4. In one embodiment, components such as displays, touch screens, input buttons, transmitters, processors, memory, batteries, charging circuits, and system-on-chip (SoC) structures can be mounted on or connected to the circuit board; or electrically connected to trace layers and / or ground layers in the circuit board. For example, an RF source is disposed on a trace layer.

[0089] Any of the aforementioned grounding layers, ground planes, or grounding metal layers are made of conductive materials. In one embodiment, the conductive material may be any of the following: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate and tin-plated copper, graphite-impregnated cloth, graphite-coated substrates, copper-plated substrates, brass-plated substrates, and aluminum-plated substrates. Those skilled in the art will understand that grounding layers / ground planes / grounding metal layers may also be made of other conductive materials.

[0090] Electrical length: Electrical length can be expressed as the ratio of physical length (i.e., mechanical length or geometric length) multiplied by the time it takes for an electrical or electromagnetic signal to travel in a medium to the time required for that signal to travel a distance in free space equal to the physical length of the medium. Electrical length can be expressed by the following formula:

[0091]

[0092] Where L is the physical length, a is the transmission time of the electrical or electromagnetic signal in the medium, and b is the transmission time in free space.

[0093] Alternatively, electrical length can also refer to the ratio of physical length (i.e., mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave, and electrical length can satisfy the following formula:

[0094]

[0095] Where L is the physical length and λ is the wavelength of the electromagnetic wave.

[0096] In embodiments of this application, the wavelength in a certain wavelength mode of the antenna (such as a half-wavelength mode) can refer to the wavelength of the signal radiated by the antenna. For example, the half-wavelength mode of a suspended metal antenna can generate resonance in a frequency band including 1.575 GHz, where the wavelength in the half-wavelength mode can refer to the wavelength of the signal radiated by the antenna in the 1.575 GHz frequency band. It should be understood that the wavelength of the radiated signal in air can be calculated as follows: air wavelength (or vacuum wavelength) = speed of light / frequency, where the frequency is the frequency of the radiated signal (e.g., 1575 MHz), and the speed of light can be taken as 3 × 10⁻⁶. 8 m / s. The wavelength of the radiated signal in the medium can be calculated as follows: Where ε is the relative permittivity of the medium, and the frequency is the frequency of the radiated signal. The gaps and grooves in the above embodiments can be filled with an insulating medium.

[0097] The terms collinearity, coaxiality, coplanarity, symmetry (e.g., axial symmetry, or central symmetry), parallelism, perpendicularity, and similarity (e.g., same length, same width, etc.) mentioned in the embodiments of this application are all relative to the current technological level, and not absolute and strict mathematical definitions. For two collinear radiators, there may be a deviation of less than a predetermined threshold (e.g., 1 mm, 0.5 m, or 0.1 mm) between their edges in the line width direction. For two coplanar radiators, there may be a deviation of less than a predetermined threshold (e.g., 1 mm, 0.5 m, or 0.1 mm) between their edges in the direction perpendicular to their coplanar plane. For two parallel or perpendicular radiators, there may be a deviation of a predetermined angle (e.g., ±5°, ±10°).

[0098] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0099] The technical solutions provided in this application are applicable to electronic devices that possess one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (WiFi) communication technology, Global System for Mobile Communications (GSM) technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, Sub-6G communication technology, and other future communication technologies. The electronic devices in the embodiments of this application can be mobile phones, tablets, laptops, smart speakers, smart home devices, smart bracelets, smartwatches, smart helmets, smart glasses, drones, wireless wearables, vehicle modules (e.g., in-vehicle T-BOX, Telematics BOX), Bluetooth headsets, etc. Specifically, Bluetooth headsets can be, for example, True Wireless Stereo (TWS) Bluetooth headsets. Electronic devices can also be handheld devices with wireless communication capabilities, computing devices or other processing devices connected to a wireless modem, vehicle-mounted devices, electronic devices in 5G networks, or electronic devices in future evolved public land mobile networks (PLMNs), wireless routers, or customer premise equipment (CPE), etc., and the embodiments of this application are not limited to these.

[0100] Please see Figures 1a to 1c , Figure 1a This is a top view of the antenna and substrate structure according to an embodiment of this application. Figure 1b This is a three-dimensional structural diagram of the antenna and substrate according to an embodiment of this application. Figure 1c This is a partially enlarged top view of the antenna and substrate according to an embodiment of this application. This application provides an antenna 1, including a first radiator 11 and a second radiator 12 disposed on a substrate 20.

[0101] The substrate 20 has a first structural layer 21 and a second structural layer 22. The first structural layer 21 has a first cutout region 210, and the second structural layer 22 has a second cutout region 220. A first radiator 11 is disposed within the first cutout region 210, and a second radiator 12 is disposed within the second cutout region 220. The first radiator 11 and the second radiator 12 are spaced apart along the thickness direction d of the substrate 20. In one embodiment, the first structural layer 21 is a first metal layer of the substrate 20, and the second structural layer 22 is a second metal layer of the substrate 20, with the first and second metal layers spaced apart along the thickness direction d of the substrate. Those skilled in the art will understand that in alternative embodiments, the first structural layer 21 and the second structural layer 22 may also be other structural layers of the substrate, such as dielectric layers.

[0102] It should be understood that the "cutout area" in this application refers to a space used to accommodate a radiator (e.g., the first radiator 11 or the second radiator 12), which may penetrate through the structural layer. For example, along the thickness direction of the first structural layer 21, the first cutout area 210 penetrates the first structural layer 21, and along the thickness direction of the second structural layer 22, the second cutout area 220 penetrates the second structural layer 22. The "cutout area" may also be a groove formed in the structural layer. For example, the first cutout area 210 is a groove formed in the first structural layer 21, and the second cutout area 220 is a groove formed in the second structural layer 22.

[0103] In one embodiment, the extension direction L1 of the first radiator 11 and the extension direction L2 of the second radiator 12 are in the same direction, or it can be understood that the first radiator 11 and the second radiator 12 are arranged in parallel. In other alternative embodiments, the first radiator 11 and the second radiator 12 may not be parallel.

[0104] In one embodiment, the first radiator 11 and the second radiator 12 are partially overlapping along the thickness direction d of the substrate 20. In other alternative embodiments, the first radiator 11 and the second radiator 12 may be misaligned along the thickness direction d of the substrate 20.

[0105] The substrate 20 also has a ground layer, and the two ends of the second radiator 12 are respectively connected to the ground layer for grounding. In one embodiment, the second structural layer 22 serves as the ground layer. In other alternative embodiments, the first structural layer 21 may also serve as the ground layer, and the first structural layer 21, the second structural layer 22, and the ground layer may also be three different structural layers in the substrate 20.

[0106] The first radiator 11 is provided with a first gap 110, and the first end B1 of the first radiator 11 is connected to the grounding layer for grounding.

[0107] In this embodiment, by mounting a first radiator 11 in the first cutout area 210 of the substrate 20 and a second radiator 12 in the second cutout area 220 of the substrate 20, the radiator aperture (or the length of the radiator) can be effectively increased, resulting in a more uniform magnetic field distribution of the antenna. This effectively improves the antenna efficiency under a given clearance area. Alternatively, it can be understood that, while maintaining the same antenna performance, this application can effectively reduce the clearance area required for the antenna, thus contributing to the miniaturization of electronic devices. In one embodiment, the first radiator 11 may include a first trace on the first layer of the substrate 20, and the second radiator 12 may include a second trace on the second layer of the substrate 20. Alternatively, the substrate 20 may employ a double-layer trace structure to implement the first radiator 11 and the second radiator 12. In one embodiment, the first and second radiators are grounded through the ground layer of the substrate 20, without the need for metal vias between them. Specifically, the connection method of grounding one end of the first radiator and both ends of the second radiator simplifies the antenna structure, simplifies the manufacturing process, and reduces costs.

[0108] The position of antenna 1 on substrate 20 is not limited; please refer to [link / reference]. Figure 1a To improve the outward radiation of the antenna, in one embodiment, the antenna 1 is located at the edge of the substrate 20. The substrate 20 may be, for example, a PCB board. The formation method of the first radiator 11 and the second radiator 12 is not limited. In one embodiment, the first radiator 11 and the second radiator 12 may be formed from metal microstrip lines disposed on the substrate 20. In another embodiment, the first radiator 11 and the second radiator 12 may be formed from metal conductive elements disposed on the substrate 20. Here, metal conductive elements refer to conductive elements other than metal microstrip lines that can be disposed on the substrate 20, such as metal patches, etc.

[0109] The shapes of the first radiator 11 and the second radiator 12 are not limited. They can be strip-shaped, L-shaped, U-shaped, arc-shaped, zigzag-shaped, curved, etc., or they can be irregular structures formed by any combination of the above shapes.

[0110] In one embodiment, the first radiator 11 and the second radiator 12 may be formed from at least a portion of a metal layer within the substrate 20 (e.g., a PCB board). Further, the first radiator 11 and the second radiator 12 may be formed from any two different metal layers within the substrate 20 (e.g., a PCB board). In one embodiment, the second radiator 12 is formed from a metal ground layer within the substrate 20 (e.g., a PCB board). In other alternative embodiments, the first radiator 11 or the second radiator 12 may also be formed by connecting different traces. For example, the first radiator 11 (or the second radiator 12) may be formed by splicing any two or more of the following: microstrip lines, metal conductive components, metal layers in a PCB board, etc. The width of the first radiator 11 and the second radiator 12 is not limited. Along the extension direction of the radiator, the width of the radiator may be uniform or non-uniform; for example, a portion of the radiator may be widened or narrowed. The width of the radiator is not limited; in one embodiment, the width of the radiator is approximately 0.2 mm to 0.5 mm, for example, 0.3 mm, 0.4 mm, etc.

[0111] The positions of the first radiator 11 and the second radiator 12 on the substrate 20 are not limited along the thickness direction d. Please refer to [link to relevant documentation]. Figure 1b The substrate 20 has a first surface S1 and a second surface S2 disposed opposite to each other. In one embodiment, the first radiator 11 is located in the plane containing the first surface S1 (or front side) of the substrate 20, and the second radiator 12 is located in the plane containing the second surface S2 (or back side) of the substrate 20. In one exemplary embodiment, the first radiator 11 is formed of a metal layer on the front side of the substrate 20, and the second radiator 12 is formed of a metal layer on the back side of the substrate 20. In other examples, the first radiator 11 and the second radiator 12 can be formed of any two different metal layers inside the substrate 20.

[0112] In one embodiment, the substrate 20 has multiple metal layers, wherein the metal layer closest to the first surface S1 is the first metal layer, and the metal layer closest to the second surface S2 is the second metal layer. In one embodiment, the first radiator 11 is located in the metal layer of the substrate 20 closest to the first surface S1 (or can be understood as the front side), and the second radiator 12 is located in the metal layer of the substrate 20 closest to the second surface S2 (or can be understood as the back side). In other alternative embodiments, the first radiator 11 and the second radiator 12 may also be located on any two different planes between the first surface S1 and the second surface S2 of the substrate.

[0113] In one implementation, please refer to Figure 2bA dielectric structure 23 is further provided between the first radiator 11 and the second radiator 12. The dielectric structure 23 is used to support the first radiator 11 and the second radiator 12. The material of the dielectric structure 23 is not limited. In one embodiment, the dielectric structure 23 is formed from at least a portion of the dielectric board in the substrate 20 (e.g., a PCB board), which results in a simple structure, simple process, and low cost. In other alternative embodiments, the dielectric structure 23 may also include at least a portion of the dielectric board in the PCB board as well as other dielectric boards with high dielectric constants (e.g., ceramic).

[0114] The power supply method of this application is not limited. For one embodiment, please refer to [link / reference]. Figure 1b The second end B2 of the first radiator 11 is provided with a feed connection point A0, and the first radiator 11 is connected to the feed point (not shown in the figure) through the feed connection point A0. In one embodiment, the antenna 1 further includes a feed stub (not shown in the figure), which is connected to the feed point (not shown in the figure) and is spaced apart from the first radiator 11 to form a gap. The second end B2 of the first radiator 11 is coupled to the feed stub (not shown in the figure) through the gap.

[0115] In one embodiment, the second end B2 of the first radiator 11 is connected to the feed point (not shown in the figure) via a microstrip line. Compared with the method of connecting the radiator directly to the feed point using a microstrip line, this method not only reduces material costs but also avoids the problem of poor contact between the spring and the radiator or the feed point, effectively improving the reliability of the antenna feed connection.

[0116] It should be noted that the power supply point in this application can be understood as a signal output terminal of the radio frequency source. For example, it can be the output pin of the radio frequency chip, or it can be one end of the signal transmission line used to connect the radio frequency source. As long as it can be electrically connected to the radio frequency source and receive radio frequency signals through the power supply point, it does not deviate from the scope of this embodiment.

[0117] Please see Figure 1b In one embodiment, the second radiator 12 is provided with a second slit 120. The positions of the first slit 110 and the second slit 120 on the radiator are not limited. In one embodiment, along the extending direction L1 of the first radiator 11, the first slit 110 is located at the middle position of the first radiator 11; along the extending direction L2 of the second radiator 12, the second slit 120 of the second radiator 12 is located at the middle position of the second radiator 12.

[0118] Those skilled in the art will understand that the middle position of a radiator (e.g., the first radiator 11, the second radiator 12) can be understood as including the midpoint of the geometric structure of the radiator, or the midpoint of the electrical length of the radiator, or a region within a certain range near the midpoint, such as the middle position of the radiator including a region of 1 mm or 2 mm near the midpoint.

[0119] In other alternative embodiments, the first gap 110 may also be located near the first end B1 or near the second end B2 of the first radiator 11, and the second gap 120 may be located near either end of the second radiator 12, and so on.

[0120] In one embodiment, a first capacitor C1 is connected in series on opposite sides of the first slit 110, and a second capacitor C2 is connected in series on opposite sides of the second radiator 120. In other alternative embodiments, only the first capacitor C1 may be connected in series on opposite sides of the first slit 110, or only the second capacitor C2 may be connected in series on opposite sides of the second radiator 120.

[0121] The parameters of the first capacitor C1 and the second capacitor C2 can be adjusted according to actual design needs. In one embodiment, the capacitance value of the first capacitor C1 is 0.2pF ≤ 3pF and the capacitance value of the second capacitor C2 is 0.2pF ≤ 3pF. Further, the capacitance value of the first capacitor C1 can be, for example, 0.2pF to 1.5pF and the capacitance value of the second capacitor C2 can be, for example, < 1pF.

[0122] In this embodiment of the application, by connecting a first capacitor C1 in series on the first radiator 11 and / or connecting a second capacitor C2 in series on the second radiator 12 and matching the corresponding capacitance values ​​(or it can be understood as connecting a lumped capacitor in series), the inductive impedance of the antenna can be effectively improved, the quality factor value (or Q value) of the antenna can be reduced, and thus the radiation efficiency and bandwidth of the antenna can be improved.

[0123] Those skilled in the art will understand that the larger the value of the parallel capacitor in the antenna matching network, the greater the device loss will be. The antenna in the embodiment of this application can effectively increase the real part of the antenna impedance, increase the convergence of the impedance, and thus reduce the loss caused by the matching device, thereby improving the radiation efficiency of the antenna.

[0124] In one embodiment, the electrical lengths of both the first radiator 11 and the second radiator 12 are less than or equal to 1 / 8 of the antenna's operating wavelength. In another embodiment, the antenna is used as a Bluetooth antenna, operating in the frequency band of 2.4 GHz to 2.48 GHz, with the physical lengths of both the first radiator 11 and the second radiator 12 being greater than 6 mm and less than 12 mm, or equal to 6 mm or 12 mm. In an exemplary embodiment, the antenna 1 is used in the Bluetooth frequency band, with the physical lengths of both the first radiator 11 and the second radiator 12 being 6.3 mm, approximately 1 / 16 of the antenna's operating wavelength. In other embodiments, the antenna can also be used as a Wi-Fi antenna, operating in the frequency band of, for example, 2.4 GHz to 2.5 GHz, with the corresponding physical lengths of the first radiator 11 and the second radiator 12 being other values. The antenna can also be used as a GPS antenna, operating in the frequency band of, for example, 1.5 GHz to 1.6 GHz, with the corresponding physical lengths of the first radiator 11 and the second radiator 12 being other values.

[0125] It should be noted that the physical length of the radiator (e.g., the first radiator 11 and the second radiator 12) is related to a variety of influencing factors, such as the operating frequency band of the antenna, the dielectric constant of the dielectric structure, etc. Those skilled in the art should understand that the physical length of the radiator mentioned above is just an example, and other values ​​may be used in other application scenarios.

[0126] Please see Figure 2a and Figure 2b , Figure 2a and Figure 2b These are all three-dimensional structural diagrams of the antenna and substrate according to embodiments of this application. In one embodiment, such as... Figure 2a As shown, the first slit 110 forms a first notch 1101 and a second notch 1102 on two opposite sides of the first radiator 11, respectively, with the first notch 1101 and the second notch 1102 offset along the extension direction L1 of the first radiator 11. The second slit 120 of the second radiator 12 forms a third notch 1201 and a fourth notch 1202 on two opposite sides of the second radiator 12, respectively, with the third notch 1201 and the fourth notch 1202 offset along the extension direction L2 of the second radiator 12. In one embodiment, as... Figure 2a As shown, both the first gap 110 and the second gap 120 are serrated. In one embodiment, as... Figure 2b As shown, both the first slit 110 and the second slit (not shown in the figure) are finger-shaped. In other alternative embodiments, the shapes of the first slit 110 and the second slit 120 can be different. For example, the first slit 110 is serrated and the second slit 120 is finger-shaped, or the first slit 110 is finger-shaped and the second slit 120 is serrated, etc.

[0127] In this embodiment, by misaligning the first notch 1101 and the second notch 1102 generated on the two sides of the first radiator 11 in the first slot 110, and by misaligning the third notch 1201 and the fourth notch 1202 generated on the two sides of the second radiator 12 in the second slot 120, the relative area of ​​the radiators on both sides of the first slot 110 (the relative portion of the radiators on both sides of the slot can be regarded as the plates of the equivalent capacitor) and the relative area of ​​the radiators on both sides of the second slot 120 can be effectively increased. By utilizing the structure of the radiators themselves to construct the distributed capacitance of the antenna, the resonance depth of the antenna can be effectively deepened, thereby improving the efficiency bandwidth of the antenna.

[0128] Those skilled in the art will understand that the capacitors provided on the first radiator 11 and the second radiator 12 can also be lumped capacitors or distributed capacitors, for example, a capacitor C1 is connected in series in the first gap 110 and the second gap 120 is serrated or finger-shaped, or a capacitor C2 is connected in series in the second gap 120 and the first gap 110 is serrated or finger-shaped, etc. This application does not limit this.

[0129] Please see Figures 1a to 3 This application also provides a circuit board 2, including a substrate 20, and an antenna 1 as described in the above embodiments and implementations.

[0130] Simulation software was used to simulate and analyze the antenna of this embodiment with a resonant frequency of 2.44 GHz, and the results were as follows: Figure 3 and Figure 4 The simulation effect diagram shown is as follows. Figure 3 This is a three-dimensional structural diagram of the antenna and substrate in an embodiment of the application. Figure 4 The electric field distribution diagram is obtained for simulation effect analysis of the antenna of the embodiment of this application.

[0131] exist Figure 3 In the image, the dashed arrow indicates the current direction I between the antenna and the floor. Figure 3 It can be seen that the current direction I on the radiator (or what can be understood as the antenna trace) and the ground current form a ring distribution. Figure 4 In the diagram, the darker the color, the stronger the electric field. Figure 4 It can be seen that the strong electric field of the antenna is concentrated at the capacitor connected in series with the radiator. Therefore, the electric field distribution of the antenna in this embodiment is generally relatively uniform, which helps to effectively improve the antenna efficiency under the condition of a fixed clearance area.

[0132] Simulation software was used to simulate and analyze the antenna provided in this embodiment and the antenna of the first reference design, and the results were as follows: Figure 5The effect curves shown indicate that the antenna structure of the first reference design is basically the same as the antenna structure of the embodiment of this application, except that no capacitor is connected in series on the radiator.

[0133] Get Figure 5 The simulation data for the curves shown are shown in Table 1 below (please refer to the table below). Figure 1c and Figure 3 (This is understood.)

[0134] Table 1

[0135]

[0136]

[0137] It should be noted that the above is only an example of antenna parameter selection. When the antenna of this application embodiment is applicable to other operating frequency bands, the parameter selection can be adjusted according to the actual application scenario. This application does not limit this.

[0138] exist Figure 5 In the diagram, the horizontal axis represents frequency in GHz, and the vertical axis represents the S11 amplitude in dB. S11 is one of the S-parameters. S11 represents the reflection coefficient, which characterizes the antenna's transmission efficiency. Specifically, the smaller the S11 value, the lower the antenna's return loss, meaning less energy is reflected back from the antenna, and more energy actually enters the antenna. It should be noted that in engineering, an S11 value of -6 dB is generally used as the standard. When the antenna's S11 value is less than -6 dB, the antenna is considered to be working normally, or its transmission efficiency is considered to be good.

[0139] from Figure 5 As can be seen, compared to the first reference design antenna without series capacitor, when series capacitors are connected to the first and second radiators, the overall electrical length of the radiators of the antenna in this application embodiment becomes longer, and the resonant frequency shifts to a lower frequency. It can be seen that, based on the same antenna structure, the antenna in this application embodiment can generate a smaller resonant frequency, or it can be understood that, under the operating conditions of generating the same resonant frequency, this application embodiment helps to miniaturize the antenna.

[0140] Simulation software was used to analyze the simulation effects of the antenna provided in this embodiment, the antenna of the second reference design, and the antenna of the third reference design, respectively, and the results are as follows: Figures 6-7 The simulation effect diagram shown is as follows. Figure 6 , Figure 7 The radiation efficiency comparison curves and system efficiency comparison curves are obtained by performing simulation effect analysis on the antennas of the embodiments of this application, the antennas of the second reference design, and the antennas of the third reference design.

[0141] Get Figure 6 , Figure 7 The simulation data of the curves shown are basically the same as those in Table 1 above (please refer to the table above). Figure 1c and Figure 3 (For your understanding). The simulation data of the antennas of the second and third reference designs are basically the same as those of the antennas in the embodiments of this application, except that the capacitance value of the first capacitor C1 of the antenna in the second reference design is 0.4pF, and the capacitance value of the first capacitor C1 of the antenna in the third reference design is 0.5pF.

[0142] exist Figure 6 In the diagram, the horizontal axis represents frequency in GHz, and the vertical axis represents the antenna's radiation efficiency. Radiation efficiency is a measure of an antenna's radiation capability, and metal loss and dielectric loss are both factors that affect radiation efficiency.

[0143] exist Figure 7 In the diagram, the horizontal axis represents frequency in GHz, and the vertical axis represents the antenna's system efficiency. System efficiency is the actual efficiency after considering antenna port matching; that is, the antenna's system efficiency is the antenna's actual efficiency (i.e., efficiency). Those skilled in the art will understand that efficiency is generally expressed as a percentage, and there is a corresponding conversion relationship between it and dB. The closer the efficiency is to 0 dB, the better the antenna's efficiency.

[0144] from Figure 6 It can be seen that increasing the capacitance value of the first capacitor C1 connected in series with the first radiator can effectively improve the radiation efficiency of the antenna. Figure 7 It can be seen that increasing the capacitance value of the first capacitor C1 connected in series on the first radiator can expand the system efficiency bandwidth of the antenna.

[0145] Those skilled in the art will understand that keeping the capacitance value of the second capacitor connected in series on the second radiator unchanged, while increasing the capacitance value of the first capacitor connected in series on the first radiator from 0.4pF to 0.6pF, can increase the inductiveness of the antenna input impedance, thereby reducing the quality factor Q value, thus increasing the bandwidth of the antenna, and the antenna will also improve its radiation efficiency due to the reduction in energy storage.

[0146] Please see Figure 8 , Figure 8 This is a three-dimensional structural diagram of the fourth reference design antenna. Figure 8 The antenna structure shown is basically the same as the antenna structure in the embodiment of this application, except that, Figure 8 The antenna shown is a single-layer wiring structure, consisting only of the first radiator.

[0147] Simulation software was used to analyze the simulation effects of the antenna provided in this embodiment and the antenna of the fourth reference design, and the results were as follows: Figures 9-12 The simulation effect diagram shown is as follows. Figure 9 The comparison curves of S11 parameters and system efficiency are obtained by performing simulation effect analysis on the antenna of the embodiment of this application and the antenna of the fourth reference design respectively. Figure 10 The graphs show the comparison of radiation efficiency obtained from simulation analysis of the antenna in the embodiment of this application and the antenna in the fourth reference design, respectively. Figure 9 In the diagram, the dashed line represents the system efficiency curve, and the solid line represents the S11 parameter curve. Figure 11 , Figure 12 The graphs show the energy dissipation effect curves obtained from the simulation effect analysis of the antenna of the fourth reference design and the antenna of the embodiment of this application, respectively.

[0148] Get Figures 9-12 The simulation data for the curves shown can be found in Table 1 above, and in conjunction with... Figure 1c and Figure 3 understand.

[0149] from Figure 9 As can be seen, compared to the antenna of the fourth reference design (antenna with a single-layer trace structure), the embodiment of this application has a better efficiency bandwidth, and the antenna of the embodiment of this application has an efficiency improvement of about 0.6dB compared to the antenna with a single-layer trace structure. Figure 10 As can be seen, the radiation efficiency of the embodiment of this application is 0.6 dB higher than that of the antenna of the fourth reference design (antenna with single-layer wiring structure).

[0150] from Figure 11 and Figure 12 As can be seen, the antenna of this embodiment has a combined dielectric and metal loss of 0.125W at the resonant frequency of 2.44GHz, while the antenna of the fourth reference design (single-layer trace structure) has a combined dielectric and metal loss of 0.176W at the resonant frequency of 2.44GHz. Therefore, the antenna of this embodiment can effectively reduce the dielectric and metal losses of the antenna, increase the radiated power of the antenna, and thus improve the radiation efficiency of the antenna.

[0151] As can be seen, the antenna in this embodiment has high system efficiency, high radiation efficiency, and better efficiency bandwidth, and its antenna performance is superior.

[0152] Simulation software was used to analyze the simulation effects of the antenna provided in this embodiment and the antenna of the fourth reference design, and the results were as follows: Figures 13-14 The simulation effect diagram shown is as follows. Figure 13 , Figure 14 The images show magnetic field distribution diagrams obtained from simulation analysis of the antenna of the fourth reference design and the antenna of the embodiment of this application, respectively; where the darker the color, the stronger the magnetic field strength.

[0153] from Figure 13 and Figure 14 It can be seen that the maximum magnetic field strength of the fourth reference design antenna (single-layer trace structure antenna) is 1366 A / m, which is greater than the maximum magnetic field strength of 1121 A / m of the antenna in the embodiment of this application. Furthermore, as shown by the dotted circle in the figure, i.e., the magnetic field strength at the clearance edge, the magnetic field strength of the fourth reference design antenna (single-layer trace structure antenna) is significantly stronger than that of the antenna in the embodiment of this application. A higher magnetic field strength will cause greater dielectric loss and metal loss. Therefore, it is evident that the performance of the antenna in the embodiment of this application is superior to that of the fourth reference design antenna (single-layer trace structure antenna).

[0154] This application also provides an electronic device 3, including the circuit board 2 described in the above embodiments and implementations. In one embodiment, the electronic device is a Bluetooth headset. The application of the circuit board 2 and the antenna 1 in the electronic device 3 will be explained below using a Bluetooth headset as an example.

[0155] Please see Figure 15 and Figure 16 , Figure 15 This is an exploded view of the three-dimensional structure of the electronic device according to an embodiment of this application. Figure 16 This is a partial structural diagram of the electronic device according to an embodiment of this application.

[0156] The Bluetooth headset includes a headset shell, which comprises an earcup shell 311, a front shell 321, and a rear shell 322, which are sequentially snapped together. The Bluetooth headset also includes a PCB board 33, which serves as the substrate mentioned above. The PCB board 33 and the dielectric structure component 23 are integrally formed, with the dielectric structure component 23 located on one edge of the PCB board 33.

[0157] Please see Figure 17a and Figure 17b , Figure 17a This is a partially enlarged structural diagram of the antenna and substrate in the electronic device of this application embodiment; Figure 17b This is a partial three-dimensional structural diagram of the antenna and substrate in the electronic device of this application embodiment.

[0158] The antenna structure in this embodiment is... Figure 1b The antenna structures shown are basically the same, except that the first radiator 11 and the second radiator 12 are both in the form of a broken line to further increase the length of the radiator.

[0159] Please see Figure 18 , Figure 18 A partial three-dimensional structural diagram of the antenna and substrate for the fifth reference design. Figure 18 The structure of the antenna shown is similar to Figure 17b The antenna structures shown are basically the same, except that the antenna has a single-layer wiring structure.

[0160] Simulation software was used to perform simulation analysis on electronic devices employing the antenna of this embodiment and electronic devices employing the fifth reference design antenna in a head-mounted scenario, and the results were as follows: Figures 20 to 22c The effect curve shown is shown.

[0161] For a schematic diagram of the head model scene, please refer to [link / reference]. Figure 19 All three electronic devices were worn on the left ear of the head model.

[0162] Get Figures 20 to 22c The simulation data for the curves shown are shown in Table 2 below (please refer to the table below). Figure 16 , Figure 17a , Figure 17b , Figure 18 (This is understood.)

[0163] Table 2

[0164]

[0165] It should be noted that the above is only an example of antenna parameter selection. When the antenna of this application embodiment is applicable to other operating frequency bands, the parameter selection can be adjusted according to the actual application scenario. This application does not limit this.

[0166] from Figure 20 As can be seen, compared with the antenna of the fifth reference design, the efficiency bandwidth of the antenna in this application embodiment is significantly improved. With -12.5dB as a reference, the efficiency bandwidth of the antenna in this application embodiment is increased by about 38%.

[0167] from Figure 21 As can be seen, compared to the antenna of the fifth reference design, the system efficiency of the antenna in this application embodiment is improved by about 0.2 dB.

[0168] Figures 22a-22c All of these are radiation direction comparison curves obtained from simulation effect analysis of the antennas of the embodiments of this application and the antenna of the fifth reference design in the head model scenario.

[0169] from Figures 22a-22c As can be seen, the radiation patterns of the two schemes are basically the same. Compared with the antenna of the fifth reference design, the minimum horizontal gain of the antenna in this application embodiment is improved by about 0.9dB, which helps to improve the overall radiation performance of the antenna.

[0170] Table 3 below summarizes the performance comparison between the antenna of the embodiment of this application and the antenna of the fifth reference design.

[0171] Table 3

[0172]

[0173] In Table 3, the efficiency bandwidth (-12.5dB) refers to the frequency range where the antenna efficiency is greater than -12.5dB.

[0174] As can be seen, the antenna of this application embodiment outperforms the antenna of the fifth reference design (single-layer trace structure) at different resonant frequencies. Because this application embodiment can weaken the strong magnetic field at the clearance edge, it also improves SAR performance, reducing the SAR value from 0.91 W / kg under the single-layer trace structure to 0.88 W / kg. Those skilled in the art will understand that SAR (Specific Absorption Rate) refers to the electromagnetic power absorbed by a unit mass of human tissue, measured in W / kg. Internationally, SAR values ​​are commonly used to measure the thermal effect of radiation from electronic devices. The normalized SAR values ​​in the table represent the SAR values ​​obtained when the antenna efficiency is normalized to -12 dB.

[0175] Please see Figures 23-24b , Figure 23 This is a partial structural diagram of the electronic device according to an embodiment of this application; Figure 24a This is a partially enlarged structural diagram of the antenna and substrate in the electronic device according to an embodiment of this application; Figure 24b This is a partial three-dimensional structural diagram of the antenna and substrate in the electronic device of this application embodiment.

[0176] The antenna structure in this embodiment is... Figure 17a The antenna structures shown are basically the same, the difference being that this embodiment further reduces the net area of ​​the antenna, making the net area relatively small. Figure 17a The structure shown is reduced by 60%, to 6.2mm x 1.5mm. The lengths of both the first and second radiators are reduced to 6.2mm.

[0177] Please see Figure 25 , Figure 25 A partial three-dimensional structural diagram of the antenna and substrate for the sixth reference design. Figure 25 The structure of the antenna shown is similar to Figure 24b The antenna structures shown are basically the same, except that the antenna has a single-layer wiring structure and only includes the first radiator.

[0178] Simulation software was used to perform simulation analysis on electronic devices employing the antenna of this embodiment and electronic devices employing the sixth reference design antenna in a head-mounted scenario, and the results were as follows: Figures 26 to 29c The effect curve shown is shown.

[0179] For a schematic diagram of the head model scene, please refer to [link / reference]. Figure 19All three electronic devices were worn on the left ear of the head model.

[0180] Get Figures 26 to 29c The simulation data for the curves shown are shown in Table 4 below (please refer to the table below). Figure 23 , Figure 24a , Figure 24b , Figure 25 (This is understood.)

[0181] Table 4

[0182]

[0183] It should be noted that the above is only an example of antenna parameter selection. When the antenna of this application embodiment is applicable to other operating frequency bands, the parameter selection can be adjusted according to the actual application scenario. This application does not limit this.

[0184] from Figure 26 As can be seen, compared with the antenna of the sixth reference design, the antenna of this application embodiment has a deeper S11 parameter value, better efficiency and can be applied to more operating frequency bands.

[0185] from Figure 27 As can be seen, compared to the antenna of the sixth reference design, the system efficiency of the antenna in this application embodiment is improved by approximately 1.7 dB. Therefore, by reducing the clearance area, the present application embodiment achieves greater benefits in terms of efficiency improvement. This can be understood as the antenna in the present application embodiment maintaining high antenna performance with a very small clearance area, which contributes to the miniaturization of electronic devices and allows for the placement of more antennas within electronic devices to meet more functional requirements.

[0186] from Figure 28 As can be seen, the matching device loss of the antenna in this embodiment is significantly less than that of the antenna in the sixth reference design. The matching device loss is the radiation efficiency minus the system radiation efficiency. Therefore, the system radiation efficiency of the antenna in this embodiment is superior to that of the antenna in the sixth reference design.

[0187] Figures 29a-29c All of these are radiation direction comparison curves obtained from simulation effect analysis of the antennas of the embodiments of this application and the antenna of the sixth reference design in the head model scenario.

[0188] from Figures 29a-29c As can be seen, the radiation pattern of the antenna in this embodiment basically covers the radiation pattern of the antenna of the sixth reference design in the XOY plane, XOZ plane and YOZ plane. The radiation direction coverage of the antenna in this embodiment is better. Moreover, compared with the antenna of the sixth reference design, the minimum gain of the antenna in this embodiment is improved by about 2.8dB in the horizontal plane, and the overall radiation performance is better.

[0189] Table 5 below summarizes the performance comparison between the antenna of the embodiment of this application and the antenna of the sixth reference design.

[0190] Table 5

[0191]

[0192] As can be seen, the antenna of this application embodiment outperforms the antenna of the sixth reference design (single-layer trace structure) at different resonant frequencies. Since the antenna of this application embodiment can weaken the strong magnetic field at the clearance edge, it also improves the SAR performance, reducing the SAR value from 0.9 W / kg under the single-layer trace structure to 0.87 W / kg.

[0193] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An antenna, characterized in that, Includes a first radiator and a second radiator disposed on a substrate; The substrate has a first structural layer and a second structural layer. The first structural layer has a first hollow area, and the second structural layer has a second hollow area. The first radiator is mounted in the first hollow area, and the second radiator is mounted in the second hollow area. The first radiator and the second radiator are spaced apart along the thickness direction of the substrate. The substrate also has a grounding layer, and the two ends of the second radiator are respectively connected to the grounding layer to be grounded; The first radiator has a first gap, and the first end of the first radiator is connected to the grounding layer to be grounded.

2. The antenna as described in claim 1, characterized in that, The second radiator has a second slit.

3. The antenna as described in claim 2, characterized in that, A first capacitor is connected in series on both sides of the first slit of the first radiator; and / or, a second capacitor is connected in series on both sides of the second slit of the second radiator.

4. The antenna as described in claim 3, characterized in that, 0.2pF ≤ the capacitance value of the first capacitor ≤ 3pF; 0.2pF ≤ the capacitance value of the second capacitor ≤ 3pF.

5. The antenna as described in claim 2, characterized in that, The first gap forms a first notch and a second notch on two opposite sides of the first radiator, and the first notch and the second notch are staggered along the extension direction of the first radiator. And / or, the second slit of the second radiator forms a third notch and a fourth notch on two opposite sides of the second radiator, respectively, and the third notch and the fourth notch are staggered along the extension direction of the second radiator.

6. The antenna as described in claim 5, characterized in that, The first slit is serrated or finger-shaped, and the second slit is serrated or finger-shaped.

7. The antenna as described in any one of claims 2 to 6, characterized in that, Along the extending direction of the first radiator, the first gap is located at the middle position of the first radiator; along the extending direction of the second radiator, the second gap of the second radiator is located at the middle position of the second radiator.

8. The antenna as described in any one of claims 1 to 6, characterized in that, The antenna further includes a feed point disposed on the substrate, wherein the second end of the first radiator is connected to the feed point, or the second end of the first radiator is coupled to the feed point.

9. The antenna according to any one of claims 1 to 6, characterized in that, The electrical lengths of both the first radiator and the second radiator are less than or equal to 1 / 8 of the operating wavelength of the antenna.

10. The antenna according to any one of claims 1 to 6, characterized in that, The antenna operates in the frequency band of 2.4GHz to 2.48GHz, and the physical length of the first radiator is 6mm ≤ 12mm, and the physical length of the second radiator is 6mm ≤ 12mm.

11. A circuit board, characterized in that, It includes a substrate and the antenna as described in any one of claims 1 to 10.

12. An electronic device, characterized in that, Includes the circuit board as described in claim 11.

13. The electronic device as claimed in claim 12, characterized in that, The substrate has multiple metal layers, including a first metal layer and a second metal layer, wherein the first structural layer includes the first metal layer and the second structural layer includes the second metal layer.

14. The electronic device as claimed in claim 13, characterized in that, The substrate has a first surface and a second surface, the second surface being disposed opposite to the first surface; the metal layer closest to the first surface in the multilayer metal layers is the first metal layer, and the metal layer closest to the second surface in the multilayer metal layers is the second metal layer.

15. The electronic device as claimed in claim 13, characterized in that, The first radiator includes at least a portion of the first metal layer, and the second radiator includes at least a portion of the second metal layer.

16. The electronic device as claimed in claim 13, characterized in that, The first radiator includes a microstrip line disposed on a substrate or a conductive element disposed on a substrate; The second radiator includes a microstrip line disposed on a substrate or a conductive element disposed on a substrate.

17. The electronic device according to any one of claims 12 to 16, characterized in that, The electronic device further includes a dielectric structure for supporting the first radiator and the second radiator, the dielectric structure being disposed between the first radiator and the second radiator.

18. The electronic device as claimed in claim 17, characterized in that, The substrate is a PCB board, the PCB board includes a dielectric layer, and the dielectric structure includes at least a portion of the dielectric layer.

19. The electronic device according to any one of claims 12 to 16, characterized in that, The electronic device is a Bluetooth headset.

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