A self-positioning wafer clamping mechanism and wafer transfer device

Abstract

The application discloses a self-positioning wafer clamping mechanism and a wafer conveying device, and the self-positioning wafer clamping mechanism comprises a base, a positioning roller arranged on the base, a clamping pin eccentrically arranged on the upper portion of the positioning roller, and a driving assembly for driving the positioning roller to rotate so as to drive the clamping pin to approach or move away from the edge of a wafer, thereby realizing clamping or releasing of the wafer; the driving assembly comprises a gear and a rack, the gear is arranged on the lower portion of the positioning roller, and the rack engaged with the gear can move horizontally to drive the positioning roller to rotate.

Description

Technical Field

[0001] This invention belongs to the field of wafer transfer technology, and more specifically, relates to a self-positioning wafer clamping mechanism and a wafer transfer device. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, dicing, packaging, and testing.

[0003] In the wafer manufacturing process, wafer clamping and transport are crucial. Existing wafer clamping mechanisms have the following problems or shortcomings:

[0004] (1) Wafer clamping mechanisms usually use vacuum adsorption to clamp wafers, but the back of the wafer is in direct contact with the vacuum adsorption surface, which poses a risk of particulate matter contamination; at the same time, the wafer is in contact with the hard vacuum adsorption surface, which also poses a risk of scratches.

[0005] (2) The wafer clamping mechanism has high requirements for wafer positioning accuracy and cannot clamp wafers that are horizontally conveyed by the conveying mechanism. If the conveying mechanism uses belt roller drive, the position accuracy of the conveyed wafer is not high. The existing wafer clamping mechanism cannot clamp wafers conveyed by belt roller.

[0006] (3) The wafer clamping mechanism cannot adjust the clamping force and cannot be used for clamping wafers of different materials. It is very easy to cause problems such as insecure clamping or clamping fragments. At the same time, the wafer clamping mechanism cannot be used for clamping wafers of different sizes and cannot be used for clamping wafers of various sizes such as 6-inch, 8-inch and 12-inch at the same time. Summary of the Invention

[0007] This invention provides a self-positioning wafer clamping mechanism and a wafer transfer device, aiming to at least solve one of the technical problems existing in the prior art.

[0008] A first aspect of the present invention provides a self-positioning wafer clamping mechanism, comprising:

[0009] Base;

[0010] A positioning roller is disposed on the base, and a clamping pin is eccentrically disposed on the upper part of the positioning roller;

[0011] The drive assembly drives the positioning roller to rotate, thereby moving the clamping pins closer to or away from the edge of the wafer to clamp or release the wafer.

[0012] The drive assembly includes a gear and a rack. The gear is located at the lower part of the positioning roller, and the rack meshing with the gear can move horizontally to drive the positioning roller to rotate.

[0013] In some embodiments, the clamping pin is disposed above the base, and a groove for clamping the wafer is provided on its upper part.

[0014] In some embodiments, the drive assembly further includes a spring, one end of which is connected to a rack and the other end to a base; the spring is compressed when the clamping pin approaches the wafer.

[0015] In some embodiments, the drive assembly further includes a limiting member, a guide rail, and an adapter. The limiting member is vertically disposed below the base, the guide rail is horizontally disposed below the base, one end of the adapter is connected to the limiting member, and the other end is fixed to the rack and slidably connected to the guide rail.

[0016] In some embodiments, the outer periphery of the limiting member is provided with a guide groove, the adapter is provided with a movable pin, and the movable pin is engaged with the guide groove; the limiting member can move vertically to drive the adapter and the rack to move along the guide rail.

[0017] In some embodiments, the guide groove is inclinedly disposed on the outer periphery of the limiting member, and the horizontal length of the guide groove matches the distance of horizontal movement of the rack.

[0018] In some embodiments, a vertical guide post is disposed below the base, and the central hole of the limiting member is sleeved on the outside of the guide post, so that the limiting member can move along the length direction of the guide post.

[0019] In some embodiments, a linear drive module is disposed below the limiting member, which can drive the limiting member to move vertically, so that the adapter and rack can move horizontally.

[0020] In some embodiments, there are multiple positioning rollers, which are distributed above the base; the clamping pins can form a circular support area, which is tangent to the groove of the clamping pins.

[0021] A second aspect of the present invention provides a wafer transfer device, which includes a transfer mechanism and the wafer clamping mechanism described above, wherein the wafer clamping mechanism is connected to the transfer mechanism and has a wafer to be transferred loaded thereon.

[0022] A third aspect of the present invention provides a wafer post-processing apparatus, which includes a spraying assembly and the wafer clamping mechanism described above. The spraying assembly is disposed above the wafer clamping mechanism to spray chemical liquid toward the wafer. It also includes a rotation and lifting mechanism connected to the wafer clamping mechanism to drive the wafer to lift and / or rotate.

[0023] A fourth aspect of the present invention provides a wafer post-processing system, comprising:

[0024] Wafer transmission module;

[0025] And the wafer post-processing apparatus described above;

[0026] The wafer transfer module includes a lateral transfer component and a sliding component, with the lateral transfer component positioned above the sliding component. The lateral transfer component laterally transfers the wafer via a rotating roller and is capable of moving along the length of the sliding component to move the lateral transfer component and the wafer on it toward the wafer post-processing device. A wafer clamping mechanism can clamp the wafer on the lateral transfer component, and a rotary lifting mechanism drives the wafer to rotate. A liquid spraying component sprays chemical liquid toward the rotating wafer to achieve wafer cleaning and / or drying.

[0027] The beneficial effects of this invention include:

[0028] a. By using clamping pins biased against the positioning rollers to clamp and release the wafer, the requirements for wafer positioning accuracy are effectively reduced, adaptive positioning can be achieved, and the applicability of the wafer clamping mechanism is effectively expanded.

[0029] b. The wafer clamping mechanism adopts a mechanical transmission form composed of gears, racks and pinions and cam sliding mechanisms to drive the positioning rollers to rotate smoothly, which has the advantage of stable operation;

[0030] c. A spring is placed between the rack and the base. By adjusting the initial compression of the spring, the clamping force of the clamping pin on the wafer can be adjusted to make it suitable for clamping wafers of different materials.

[0031] d. The phase of the clamping pins on the positioning rollers is adjusted by rotating the rollers, thereby forming support areas of different sizes to accommodate the clamping of wafers of various sizes and specifications;

[0032] e. The support area formed by the clamping pins of multiple positioning rollers is located above the base, so that the clamped wafer will not come into contact with the base, thereby reducing contamination or physical damage to the wafer by the base.

[0033] f. The wafer transfer module realizes the lateral and longitudinal transfer of wafers through the lateral transfer component and the sliding component. Furthermore, the wafer clamping mechanism can adaptively clamp the wafer on the lateral transfer component, effectively reducing the impact of wafer clamping on the wafer position accuracy and improving the ease of use of the wafer post-processing system. Attached Figure Description

[0034] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0035] Figure 1 This is a schematic diagram of a self-positioning wafer clamping mechanism provided in an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of a positioning roller provided in an embodiment of the present invention;

[0037] Figure 3 yes Figure 2 A 3D view of the corresponding positioning roller;

[0038] Figure 4 This is a top view of a wafer clamping mechanism provided in an embodiment of the present invention;

[0039] Figure 5 This is a perspective view of a wafer clamping mechanism provided in an embodiment of the present invention;

[0040] Figure 6 This is a bottom view of a wafer clamping mechanism provided in an embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of a limiting member provided in an embodiment of the present invention;

[0042] Figure 8 This is a schematic diagram of an adapter provided in an embodiment of the present invention;

[0043] Figure 9 yes Figure 6 The corresponding AA section view;

[0044] Figure 10 This is a schematic diagram of a wafer transmission device provided in an embodiment of the present invention;

[0045] Figure 11 This is a schematic diagram of a wafer post-processing apparatus provided in an embodiment of the present invention;

[0046] Figure 12 This is a schematic diagram of a wafer post-processing system provided in an embodiment of the present invention. Detailed Implementation

[0047] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0048] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0049] In this invention, a wafer (W) is also called a substrate, with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0050] Figure 1 This is a schematic diagram of a self-positioning wafer clamping mechanism 100 provided in an embodiment of the present invention. The wafer clamping mechanism 100 includes:

[0051] Base 10;

[0052] Positioning roller 20 is mounted on base 10, and clamping pin 21 is eccentrically mounted on the upper part of positioning roller 20;

[0053] The drive assembly 30 drives the positioning roller 20 to rotate. The rotating positioning roller 20 can move the clamping pin 21 closer to or away from the edge of the wafer to achieve wafer clamping or release.

[0054] Figure 1 In the embodiment shown, the base 10 is a circular disc structure, and the positioning roller 20 is vertically fixed to the base 10. At the same time, the positioning roller 20 is movably connected to the base 10, that is, the positioning roller 20 can rotate around its center line to change the phase of the clamping pin 21 on it, so that the clamping pin 21 can move closer to or away from the edge of the wafer.

[0055] Specifically, the clamping pin 21 is located above the base 10, and a groove 21a is provided on the upper part of the clamping pin 21, such as... Figure 2 As shown, a wafer is held in a card holder. In some embodiments, trench 21a is formed by the intersection of inclined slopes, wherein a vertical surface is provided between the upper inclined surface and the lower inclined surface, and the height of the vertical surface is slightly greater than the thickness of the wafer. Figure 1 The wafer clamping mechanism shown typically holds the wafer in place when clamping it. Figure 2 The vertical surface of the groove 21a is shown.

[0056] Figure 2 In the illustrated embodiment, the length of the lower inclined surface is greater than the length of the upper inclined surface, and the lower inclined surface can be used to assist in supporting the wafer. Specifically, when the wafer is horizontally constrained by multiple positioning rollers 20, the wafer can be briefly supported by the lower inclined surface first, and then the wafer can be moved from the lower inclined surface to the vertical surface when the clamping pin 21 of the positioning roller 20 rotates to a predetermined phase.

[0057] Figure 3 This is a three-dimensional view of the positioning roller 20. The clamping pin 21 is set off from the center of the positioning roller 20, so that when the positioning roller 20 rotates around its center line, the phase of the clamping pin 21 relative to the center of the positioning roller 20 can be changed, so that the clamping pin 21 can move closer to or away from the edge of the wafer.

[0058] In this invention, there are multiple positioning rollers 20, which are distributed on the base 10; the clamping pins 21 can form a circular support area 20a, such as... Figure 4 As shown; the support region 20a is tangent to the groove 21a of the clamping pin 21, so that the wafer W is horizontally confined in the support region 20a by the friction between the clamping pin 21 and the wafer W, as shown. Figure 5 As shown.

[0059] In this invention, the phase of the clamping pin 21 on the positioning roller 20 is adjusted by driving the rotation of the positioning roller 20, thereby forming a circular support area 20a. Therefore, the support pin 21 of the positioning roller 20 can form support areas 20a with different radii to be suitable for clamping various wafer sizes, such as simultaneously suitable for clamping 6-inch, 8-inch, or 12-inch wafers, effectively expanding the applicability of the wafer clamping mechanism described in this invention.

[0060] Figure 5In the illustrated embodiment, there are four positioning rollers 20, which are arranged in pairs on the base 10 to define the position of the wafer using clamping pins 21. That is, the rotating positioning rollers 20 can change the phase of the clamping pins 21 to automatically position and clamp the wafer. It is understood that the number of positioning rollers 20 can also be other, such as three, five, or six, as long as the positioning rollers 20 do not interfere with interactive devices such as robotic arms. The number of positioning rollers 20 can also be odd.

[0061] In this invention, since the support area 20a defined by the clamping pin 21 is located above the base 10, the wafer defined by the trench 21a is positioned on the upper side of the base 10 without contacting the base 10. This prevents particles on the base 10 from adhering back to the wafer surface, thus avoiding contamination problems during substrate transport to a certain extent. Simultaneously, the clamped wafer does not contact the base 10 made of rigid material, thereby preventing physical damage such as scratches on the wafer surface.

[0062] Figure 6 yes Figure 1 The bottom view of the corresponding wafer clamping mechanism shows some components deliberately hidden to better illustrate the components of the drive assembly and their connections. The drive assembly 30 includes a gear 31 and a rack 32, which mesh with each other. The moving rack 32 can drive the gear 31 to rotate, thereby driving the positioning roller 20 to rotate.

[0063] In this invention, gear 31 is disposed at the lower part of positioning roller 20; specifically, gear 31 is disposed at the lower end face of positioning roller 20, and gear 31 is located below base 10, so as to prevent fluid from dripping or splashing onto the drive component 30 on the surface of the wafer to be clamped, and to ensure the stability of the operation of drive component 30 in wafer clamping mechanism 100.

[0064] Furthermore, the rack 32 is horizontally positioned below the base 10 and meshes with the gear 31; the horizontally moving rack 32 can drive the positioning roller 20 to rotate via the gear 31, thereby adjusting the phase of the clamping pin 21 on it.

[0065] In this invention, the drive assembly 30 further includes a limiting member 33 and a guide rail 34. Figure 6 (shown) and adapter 35, wherein the limiting member 33 is vertically disposed below the base 10, the guide rail 34 is horizontally disposed below the base 10, and one end of the adapter 35 is connected to the limiting member 33, and the other end is connected to the rack 32 (shown). Figure 6 (As shown) and slidably connected to guide rail 34.

[0066] Furthermore, a guide groove 33a is provided on the outer periphery of the limiting member 33. Figure 7 As shown), adapter 35 is equipped with movable pin 35a ( Figure 8(As shown), the movable pin 35a of the adapter 35 is engaged with the guide groove 33a of the limiting member 33. In this invention, the limiting member 33, the guide rail 34 and the adapter 35 form a cam groove mechanism. The vertically moving limiting member 33 can drive the adapter 35 to move horizontally, thereby driving the rack 32, which is fixed to the adapter 35, to move horizontally.

[0067] In this invention, there is a pair of guide grooves 33a, which are provided on two opposite sides of the limiting member 33; each guide groove 33a of the limiting member 33 is provided with a connecting member 35, so that the horizontal movement of the pair of connecting members 35 can be driven by one limiting member 33, so as to simplify the structure and reduce the space occupied by the drive assembly 30. Figure 7 In the middle, the shape of the limiting member 33a is a cuboid; it is understood that the limiting member 33a can also be other shapes.

[0068] Figure 6 In this configuration, two racks 32 are fixed to the left and right sides of the adapter 35, respectively. The racks 32 mesh with the gears 31 at the lower part of the positioning rollers 20, thereby driving a pair of positioning rollers 20 to rotate simultaneously through the adapter 25. This arrangement helps to ensure the synchronicity of the rotation of the positioning rollers 20, so that the clamping pins 21 can abut against the edge of the wafer approximately simultaneously. It is understood that the adapter 35 could also be equipped with a rack 32 to independently drive the rotation of one positioning roller 20.

[0069] When the limiting member 33 moves in the vertical direction, the adapter 35 can drive the rack 32 on it to move in the horizontal direction, thereby driving the gear 31 meshing with the rack 32 to rotate, so as to adjust the phase of the clamping pin 21 and realize the clamping or release of the wafer.

[0070] Figure 7 In this configuration, the guide groove 33a is inclinedly disposed on the outer periphery of the limiting member 33, and the inclination angle of the guide groove 33a is related to the horizontal movement distance of the rack 32. Specifically, the horizontal length corresponding to the inclined guide groove 33a matches the horizontal movement distance of the rack 32. Preferably, the angle between the guide groove 33a and the horizontal plane is 35° to 55°, so that the horizontal movement range of the rack 32 can cover wafers of commonly used sizes.

[0071] Furthermore, a vertical guide post 11 is disposed below the base 10, and the limiting member 33 is provided with a central hole 33b. Figure 7 As shown, the limiting member 33 is concentrically sleeved on the outside of the guide post 11 through the central hole 33b, so that the limiting member 33 can move along the length direction of the guide post 11 to prevent the limiting member 33 from deflecting during the upward movement and affecting the horizontal movement state of the adapter 35, or even causing the clamping pin 21 on the positioning roller 20 to not rotate to the predetermined phase and thus fail to clamp the wafer.

[0072] In this invention, the guide post 11 is detachably connected to the lower part of the base 10. Specifically, the guide post 11 is vertically mounted to the lower part of the base 10. It can be understood that the guide post 11 can also be integrally machined with the base 10 to ensure the perpendicularity of the two directly through machining.

[0073] Figure 1 In the illustrated embodiment, a linear drive module 36 is disposed below the limiting member 33, which can drive the limiting member 33 to move vertically, thereby causing the adapter 35 and its connected rack 32 to move horizontally. In some embodiments, the linear drive module 36 can be a device such as a cylinder, linear motor, or electric cylinder, which is disposed below the limiting member 33, thereby driving the limiting member 33 to move vertically. Figure 1 In the middle, the linear drive module 36 drives the limiting member 33 to move upward, and the adapter 35 moves along the guide rail 34 to the inside of the base 10. At this time, the positioning roller 20 rotates to adjust the phase of the clamping pin 21 to release the wafer.

[0074] In the embodiments described above, the positioning roller 20 is driven to rotate by a combination of gear 31, rack 32 and cam slide structure (a mechanism formed by components such as limit member 33, guide rail 34 and adapter 35). The above mechanical transmission structure has the advantage of high stability, which is beneficial to ensuring the reliability of wafer clamping.

[0075] Understandably, it can also be directly... Figure 6 The rack 32 shown is configured with a linear module to drive the rack 32 to move in the horizontal direction, and then drive the positioning roller 20 to rotate through the gear 31 to change the phase of the clamping pin 21, so that the clamping pin 21 can move closer to or further away from the wafer to be clamped.

[0076] In this invention, the drive assembly 30 further includes a spring 37, such as Figure 6 and Figure 9 As shown, one end of the spring 37 is connected to the rack 32, and the other end is connected to the base 10; when the clamping pin 21 on the positioning roller 20 approaches the wafer, the spring 37 is in a compressed state. That is, when the positioning roller 20 clamps the wafer, the spring 37 is in a compressed state to ensure the reliability of wafer clamping and realize smooth wafer interaction.

[0077] In some embodiments, one end of the spring 37 is fixed to the adapter 35, and the other end of the spring 37 is fixed to the vertical plate at the lower part of the base 10. The spring 37 has a certain amount of compression in its initial state, enabling it to drive the adapter 35 to move outwards. At this time, the positioning roller 20 rotates around its central axis to clamp the wafer via the clamping pin 21. It should be noted that the initial compression of the spring 37 is adjustable, thereby adjusting the clamping force of the clamping pin 21 on the wafer to accommodate wafers of different materials, such as hard wafers like silicon carbide, ensuring the reliability of wafer clamping.

[0078] In this invention, the main function of spring 37 is to provide a certain clamping force for the wafer. Spring 37 is a compression spring, that is, a spring that is initially in a compressed state. The amount of compression of spring 37 is related to the clamping force of clamping pin 21 on the wafer. When the linear drive module 36 drives the limiting member 33 to lift, the adapter 35 moves inward, and spring 37 is further compressed. When the linear drive module 36 retracts, the linear drive module 36 does not contact the lower end face of the limiting member 33. At this time, the compressed spring 37 pushes the adapter 35 and its connected rack 32 outward, so that the clamping pin 21 on the positioning roller 20 moves toward the edge of the wafer to clamp the wafer.

[0079] Understandably, the linear drive module 36 acts as a switch for the wafer clamping mechanism 100, controlling the opening and closing of the clamping pin 21. Specifically, when the linear drive module 36 moves upward against the limiting member 33, the adapter 35 moves inward, and the spring 37 is further compressed, so that the clamping pin 21 of the positioning roller 20 is in the open state, forming a support area larger than the outer diameter of the wafer; when the linear drive module 36 moves downward and is no longer in contact with the limiting member 33, the spring 37 drives the adapter 35 to move outward, so that the clamping pin 21 of the positioning roller 20 is in the closed state, clamping the wafer.

[0080] The following is combined with Figure 1 and Figure 6 Briefly explain the working principle of the wafer clamping mechanism 100:

[0081] In the initial state, the linear drive module 36 abuts against the limiting member 33 and drives it to move upward, and the support area 20a formed by the clamping pin 21 on the positioning roller 20 ( Figure 4 (As shown) The diameter is larger than the outer diameter of the wafer to be clamped. At this time, the spring 37 is in a compressed state.

[0082] When the wafer is positioned between the positioning rollers 20 on the base 10, the linear drive module 36 moves downwards and does not contact the limiting member 33. Since the adapter 35 is movably connected to the guide groove 33a of the limiting member 33 via the movable pin 35a, the compressed spring 37 pushes the adapter 35 to move outwards from the base 10, thereby driving the positioning rollers 20 to rotate via the rack 32. This causes the support area 20a formed by the clamping pin 21 to gradually shrink until the groove 21a of the clamping pin 21 abuts against the outer edge of the wafer. The wafer clamping mechanism 100 is used to clamp the wafer. After the clamped wafer moves to the next process, the wafer clamping mechanism 100 needs to release the wafer. Since the limiting member 33, the guide rail 34 and the adapter 35 form a cam groove structure, the linear drive module 36 moves upward, which pushes the limiting member 33 to move upward, so that the adapter 35 moves towards the inside of the base 10. Then, the positioning roller 20 is driven to rotate through the rack 32, so that the support area 20a formed by the clamping pin 21 gradually expands, so as to realize the release or unloading of the wafer.

[0083] In this invention, when the moving end of the linear drive module 36 separates from the limiting member 33, the clamping pin 21 of the positioning roller 20 clamps the wafer. That is, when the wafer rotates around the central axis, the linear drive module 36 separates from the limiting member 33 and the components above it, which helps to improve the rotational stability of the wafer clamping mechanism 100.

[0084] Meanwhile, the present invention also provides a wafer transfer device 1000, the schematic diagram of which is shown below. Figure 10 As shown, the wafer transfer device 1000 includes a transfer mechanism 200 and the wafer clamping mechanism 100 described above. The wafer clamping mechanism 100 is connected to the transfer mechanism 200, and the wafer clamping mechanism 100, which is loaded with wafers, can transfer the wafers to the next processing station through the transfer mechanism 200.

[0085] It should be noted that the wafer clamping mechanism 100 provided by the present invention uses the transmission of gear 31 and rack 32 to drive the positioning roller 20 to rotate. It has high requirements for the positional accuracy of the wafer, which enables it to interact smoothly with wafers transported by belt drive, effectively expanding the applicability of the wafer clamping mechanism 100.

[0086] It should be noted that the transmission mechanism 200 can be a linear module drive, or a belt drive, roller drive, etc. Since the wafer clamping mechanism 100 provided by the present invention does not have high requirements for wafer placement accuracy, it can automatically position and achieve reliable clamping, and can be applied to wafer transmission under different working conditions.

[0087] Figure 11 This is a schematic diagram of a wafer post-processing apparatus 2000 provided in an embodiment of the present invention. The wafer post-processing apparatus 2000 includes... Figure 1The wafer clamping mechanism 100 and the liquid spraying assembly 300 are shown, wherein the liquid spraying assembly 300 is disposed above the wafer clamping mechanism 100 to spray chemical liquid toward the wafer to achieve cleaning and / or drying of the wafer surface.

[0088] Furthermore, the wafer post-processing apparatus 2000 also includes a rotary lifting mechanism 400, which is connected to the wafer clamping mechanism 100 to drive the wafer to lift and / or rotate.

[0089] Specifically, the rotary lifting mechanism 400 includes a main shaft 410, which is disposed on the wafer clamping mechanism 100. A rotary drive motor 420 is disposed below the main shaft 410. The rotary drive motor 420 drives the main shaft 410 and the wafer clamping mechanism 100 thereon to rotate via belt drive.

[0090] Furthermore, the rotary lifting mechanism 400 also includes a lifting mechanism 430, which is connected to the spindle 410 to drive the spindle 410 and the wafer clamping mechanism 100 above it to move in the vertical direction to cooperate in completing the post-processing of the substrate.

[0091] Figure 11 In the middle, the main shaft 410 has a hollow structure for placing... Figure 1 The linear drive module 36 is shown. Specifically, the linear drive module 36 is arranged along the length direction of the spindle 410 to control the vertical movement of the limiting member 33, thereby changing the phase of the clamping pin 21 so that the clamping pin 21 can move closer to or further away from the wafer to be clamped.

[0092] Figure 11 In the illustrated embodiment, the outer edge of the base 10 of the wafer clamping mechanism 100 extends downward, forming a gap structure with the component disposed below it. When the rotary lifting mechanism 400 rotates the base 10 and the wafer on it, the outer edge of the base and the component below it can form a dynamic sealing structure to prevent particulate matter from entering the interior of the rotary lifting mechanism 400, which helps to ensure the stability of the wafer post-processing device 2000.

[0093] Furthermore, the present invention also provides a wafer post-processing system 10000, which includes the wafer post-processing device 2000 and the wafer transport module 3000 described above, such as... Figure 12 As shown, the wafer transfer module 3000 can transfer the wafer to the wafer post-processing unit 2000 to complete the cleaning and / or drying of the wafer surface.

[0094] Furthermore, the wafer transfer module 3000 includes a lateral transfer component 3100 and a sliding component 3200. The lateral transfer component 3100 is disposed above the sliding component 3200. The lateral transfer component 3100 laterally transfers the wafer via a rotating roller. The lateral transfer component 3100 is also capable of moving along the length of the sliding component 3200 to move the lateral transfer component 3100 and the wafer thereon toward the wafer post-processing device 2000. The wafer clamping mechanism 100 is capable of clamping the wafer of the lateral transfer component 3100. The rotary lifting mechanism 400 drives the wafer to rotate. The liquid spraying component 300 sprays chemical liquid toward the rotating wafer to achieve wafer cleaning and / or drying.

[0095] The following is a brief description of the general working steps of the 10000 wafer post-processing system:

[0096] First, the wafer is transported laterally by a transfer roller (not shown), wherein the transfer roller and... Figure 12 The lateral transmission component 3100 shown is approximate;

[0097] Before the wafer is transferred to the interaction position of the lateral transfer assembly 3100, the rotary lifting mechanism 400 drives the wafer clamping mechanism 100 to move downward in advance, so that the positioning roller 20 will not interfere with the wafer; at the same time, Figure 11 The linear drive module 36 shown drives the limiting member 33 to move upward, causing the positioning roller 20 to move outward in order to clamp the wafer on the transverse transfer assembly 3100.

[0098] When the wafer is transferred to the interaction position of the lateral transfer component 3100, the rotary lifting mechanism 400 drives the wafer clamping mechanism 100 to move upward, so that the groove 21a of the clamping pin 21 of the positioning roller 20 is approximately in the same horizontal plane as the wafer.

[0099] Next, the moving end of the linear drive module 36 separates from the bottom surface of the limiting member 33, causing the positioning roller 20 to move inward and the clamping pin 21 to clamp the wafer.

[0100] Next, the rotary lifting mechanism 400 drives the wafer clamping mechanism 100 to continue moving upward, so that the clamped wafer is separated from the rotating roller of the lateral transfer component 3100; then, the sliding component 3200 drives the lateral transfer component 3100 to move longitudinally, so as to separate the rotating roller from the wafer held by the wafer clamping mechanism 100.

[0101] Next, the rotary lifting mechanism 400 lowers the wafer clamping mechanism 100 into the interior of the protective cover. The rotary lifting mechanism 400 rotates the wafer, and the liquid spraying assembly 300 sprays chemical liquid toward the rotating wafer to clean and / or dry the substrate and remove particulate matter from the substrate surface.

[0102] The wafer clamping mechanism 100 of the wafer post-processing system 10000 provided by the present invention reduces the positional accuracy requirements of the wafer. The wafer conveyed by the rotating roller can accurately interact with the wafer clamping mechanism 100, effectively ensuring the smooth operation of the wafer post-processing system.

[0103] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A self-positioning wafer clamping mechanism, characterized in that, include: Base; Multiple positioning rollers are distributed above the base. The upper part of the positioning rollers is eccentrically provided with a clamping pin. The upper part of the clamping pin is provided with a groove for clamping the edge of the wafer. The clamping pins of the multiple positioning rollers can form a circular support area. This support area is located above the base, so that the clamped wafer does not contact the base. The drive assembly drives the positioning roller to rotate, thereby moving the clamping pins closer to or away from the edge of the wafer to clamp or release the wafer. The driving component includes: Gears are located at the lower part of the positioning rollers; The rack meshes with the gear and can move horizontally to drive the positioning roller to rotate; A spring is connected at one end to a rack and at the other end to a base, and the initial compression of the spring is adjustable to adjust the clamping force of the clamping pin on the wafer. The limiting component is vertically positioned below the base and can move vertically. The guide rail is horizontally positioned below the base; The adapter is connected to the limiting member at one end and fixed to the rack and slidably connected to the guide rail at the other end. When the clamping pin approaches the wafer, the spring is in a compressed state. The compression force of the spring drives the rack to move horizontally, thereby causing the clamping pin to clamp the wafer. The limiting member has a guide groove on its outer periphery, and the adapter has a movable pin that engages with the guide groove. The limiting member can move vertically to drive the adapter and rack to move along the guide rail. The guide groove is inclined on the outer periphery of the limiting member, and the horizontal length of the guide groove matches the horizontal movement distance of the rack.

2. The wafer clamping mechanism as described in claim 1, characterized in that, A vertical guide post is disposed below the base, and the center hole of the limiting member is sleeved on the outside of the guide post, so that the limiting member can move along the length direction of the guide post.

3. The wafer clamping mechanism as described in claim 1, characterized in that, A linear drive module is configured below the limiting member, which can drive the limiting member to move vertically, so that the adapter and rack can move horizontally.

4. A wafer transport device, characterized in that, It includes a transmission mechanism and a wafer clamping mechanism as described in any one of claims 1 to 3, wherein the wafer clamping mechanism is connected to the transmission mechanism and has a wafer to be transmitted mounted thereon.

5. A wafer post-processing apparatus, characterized in that, The device includes a liquid spraying assembly and a wafer clamping mechanism as described in any one of claims 1 to 3, wherein the liquid spraying assembly is disposed above the wafer clamping mechanism to spray chemical liquid toward the wafer; it also includes a rotary lifting mechanism connected to the wafer clamping mechanism to drive the wafer to lift and / or rotate.

6. A wafer post-processing system, characterized in that, include: Wafer transmission module; And the wafer post-processing apparatus as described in claim 5; The wafer transfer module includes a lateral transfer component and a sliding component. The lateral transfer component is disposed above the sliding component. The lateral transfer component transfers the wafer laterally via a rotating roller and can move along the length of the sliding component to move the lateral transfer component and the wafer on it toward the wafer post-processing device. The wafer clamping mechanism can clamp the wafer of the lateral transfer component, and the rotary lifting mechanism drives the wafer to rotate. The spraying assembly sprays a chemical solution toward a rotating wafer to clean and / or dry the wafer.

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