Laminated molding device and method for manufacturing three-dimensional molded article

Abstract

The present application provides a kind of layered modeling device and the manufacturing method of three-dimensional modeling object, which can realize the unmanned of the extraction of modeling object by more appropriately removing the remaining material on modeling workbench.In the layered modeling device of the present application, the modeling workbench is configured to be able to move up and down by a workbench driving mechanism, the material layer forming device is configured to supply material powder to the bottom plate placed on the modeling area to form a material layer, the chuck device is configured to be able to freely attach and detach the bottom plate and be fixed in the modeling area, the material recycling device includes a suction nozzle capable of suctioning the remaining material on the modeling workbench, the moving device is configured to be able to move the suction nozzle, the robot is configured to be able to take out the bottom plate and the modeling object from the chamber, and the control device alternately and repeatedly controls the workbench driving mechanism to make the modeling workbench rise by a specified rising amount and simultaneously moves the suction nozzle to suction the remaining material powder.

Description

Technical Field

[0001] This invention relates to a layered modeling device and a method for manufacturing three-dimensional models. Background Technology

[0002] Various methods are known in the layering and molding of three-dimensional objects. For example, a layering and molding apparatus that implements powder bed fusion bonding places a base plate on a molding worktable located within a chamber. Material powder is supplied to the molding area to form a material layer. By irradiating a predetermined location on the material layer with a laser or electron beam, the material powder is sintered or melted to form a solidified layer. By repeatedly forming material layers and solidified layers, a solidified layer is layered on the base plate. As needed, cutting is performed during or after molding using a cutting mechanism, thereby manufacturing the desired three-dimensional object.

[0003] In powder bed molding, where material powders are layered and bonded together, not all the powder supplied to the molding area is cured. After molding, uncured powder may remain on the molded object, base plate, or molding table. Therefore, the remaining material needs to be removed when the molded object is removed from the chamber.

[0004] As disclosed in Patent Document 1, it is known to provide suction nozzles in a stacking molding apparatus for removing residual material. Before removing the molded object, the operator operates the suction nozzles to suction out the remaining material, thereby removing it. There is a need to automatically remove the molded object from the chamber after molding. For example, in the case of secondary processing of the molded object, there is a need to automate a series of steps to remove the molded object from the stacking molding apparatus and automatically transport it to the secondary processing apparatus. When automatically removing the molded object from the chamber, it is necessary to automatically remove the residual material after molding. Patent Document 2 discloses a structure that uses suction nozzles to automatically remove residual material remaining after molding.

[0005] [Existing technical documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent No. 6132962

[0008] [Patent Document 2] Japanese Patent Application Publication No. 2002-205339 Summary of the Invention

[0009] [The problem the invention aims to solve]

[0010] In existing layering molding devices, such as those shown in Patent Document 2, which automatically extract and remove residual material, residual material easily remains in the recesses or other areas of the molded object, resulting in insufficient removal. When residual material remains on the molding worktable, the molded object cannot be retrieved, hindering unmanned operation.

[0011] The present invention was made in view of the above-mentioned circumstances, and its object is to provide a layered modeling device and a method for manufacturing three-dimensional models, which can achieve unmanned removal of models by more appropriately removing the remaining material on the modeling worktable.

[0012] [Technical means to solve the problem]

[0013] According to the present invention, the following invention is provided.

[0014] [1] A layered molding apparatus includes: a molding worktable, a chamber, a material layer forming device, a chuck device, a material recovery device, a moving device, a robot, and a control device. In the layered molding apparatus, the molding worktable is configured to move up and down via a worktable drive mechanism. The chamber covers the area on the molding worktable where a molded object is formed, i.e., the molding area. The material layer forming device supplies material powder to a base plate placed on the molding area to form a material layer. The chuck device is disposed on the molding worktable and configured to be able to detach the base plate and fix it in the molding area. The material recovery device includes: a suction nozzle capable of sucking up the remaining material powder on the molding worktable. The moving device is configured to be able to move the suction nozzle. The robot is configured to be able to remove the base plate and the molded object on the base plate from the chamber. The control device alternately and repeatedly controls the worktable drive mechanism to raise the molding worktable by a predetermined amount and to suck up the remaining material powder while moving the suction nozzle.

[0015] [2] The layered molding device according to [1] includes: a detection component, which is capable of detecting the proportion of the material powder in the material being sucked by the suction nozzle.

[0016] [3] According to the stacking molding device described in [2], the detection component is a flow sensor.

[0017] [4] According to the layered molding device described in [2] or [3], wherein the control device controls the worktable drive mechanism to lower the molding worktable by a predetermined amount when the proportion of the material powder in the suctioned material is greater than a predetermined value.

[0018] [5] The layering modeling apparatus according to any one of [1] to [4], wherein the control device controls the moving device based on the shape data of the desired three-dimensional model so that the suction nozzle takes a predetermined posture at a predetermined position.

[0019] [6] The layering molding apparatus according to any one of [1] to [5] includes: a powder holding wall surrounding the molding worktable and configured to hold the material powder on the molding worktable; and a material recovery bin configured to contain the remaining material powder discharged to the outside of the powder holding wall, the material recovery device including a recovery mode and a suction mode as operating modes, the control device configured to switch the operating modes, the material recovery device being configured to: in the recovery mode, recover the material powder in the material recovery bin and supply the material powder to the material layer forming apparatus after removing impurities; and in the suction mode, move the suction nozzle using the moving device and suction the remaining material powder on the molding worktable using the suction nozzle.

[0020] [7] The stacking molding apparatus according to any one of [1] to [6], wherein the side of the chuck device is covered by a chuck cover, the chuck cover including an outer cover and an inner cover, the outer cover covering at least a portion of the side of the inner cover, the inner cover covering the side of the chuck device.

[0021] [8] The stacking molding apparatus according to any one of [1] to [7], wherein the chuck device fixes the base plate via a mounting plate.

[0022] [9] The stacking molding apparatus according to any one of [1] to [8], wherein the suction nozzle includes a suction part on the front end side, the suction part having a cylindrical shape formed by cutting off the end face of the front end side with an inclined surface, and an opening is provided on the inclined surface.

[0023]

[10] The stacking modeling apparatus according to any one of [1] to [9], wherein the robot also serves as the mobile device.

[0024]

[11] According to the stacked molding device of

[10] , the robot moves the base plate into the cavity.

[0025]

[12] According to the layered modeling device of

[11] , the robot reverses the model after removing it from the chamber.

[0026]

[13] A manufacturing method for a three-dimensional model includes: a placement process, a curing layer formation process, a suction process, and a removal process. In the placement process, a base plate is fixed by means of a chuck device disposed on a modeling worktable, and the base plate is placed on the modeling worktable in an area where a model is formed, i.e., a modeling area. In the curing layer formation process, a material layer formation process is repeated, in which material powder is supplied to the base plate to form a material layer, and a curing process is repeated, in which a curing layer is formed by irradiating a predetermined irradiation area of ​​the material layer with a laser or electron beam, thereby stacking the curing layer. In the suction process, the modeling worktable is alternately and repeatedly raised by a predetermined amount by means of a worktable drive mechanism, and the remaining material powder is suctioned while the suction nozzle is moved by means of a moving device. In the removal process, the base plate and the three-dimensional model formed on the base plate are removed from the chamber covering the modeling area.

[0027] [The effects of the invention]

[0028] In the layered molding apparatus of the present invention, a suction nozzle capable of being moved by a moving device is provided. While the control device controls the worktable drive mechanism to gradually raise the molding worktable, the suction nozzle removes remaining material, thus applying vibration to the molded object, causing the remaining material on the object to fall onto the base plate or the molding worktable. This allows for more appropriate removal of remaining material from the molding worktable. Since the removal of remaining material using the suction nozzle is automatic, unmanned removal of the molded object is achieved. Attached Figure Description

[0029] Figure 1 This is a schematic structural diagram of a layered molding device 100 according to an embodiment of the present invention.

[0030] Figure 2 This is a three-dimensional view of the material layer forming device 2 of the layered modeling device 100.

[0031] Figure 3 This is a perspective view above the coating head 22 of the material layer forming apparatus 2.

[0032] Figure 4 This is a perspective view of the coating head 22 of the material layer forming apparatus 2 from below.

[0033] Figure 5 This is a perspective view showing the state in which the base plate 83 is fixed to the chuck device 5.

[0034] Figure 6 yes Figure 5 A cross-sectional view of line AA.

[0035] Figure 7 This is a perspective view showing the disassembled state of the tray 85, positioning plate 86, and shaft 87.

[0036] Figure 8 This is a perspective view showing the state in which the chuck cover 53 has been removed from the chuck assembly 5.

[0037] Figure 9A and Figure 9B This is a diagram showing the front end of the suction section 79a of the suction nozzle 79. Figure 9A This is a front view. Figure 9B This is the right-side view.

[0038] Figure 10 This is a diagram used to illustrate the suction pattern of the remaining material in the remaining material layer 81a using the suction nozzle 79.

[0039] Figure 11 This is a structural diagram of the control device 9 of the layered modeling device 100.

[0040] Figure 12 This is a flowchart of a method for manufacturing a three-dimensional model W using a layered modeling device 100.

[0041] Figure 13 This is a diagram used to illustrate the manufacturing method of a three-dimensional model W using the layered modeling device 100.

[0042] Figure 14 This diagram is used to illustrate the process of forming the cured layer.

[0043] Figure 15 This is a diagram used to illustrate the suction process.

[0044] [Explanation of Symbols]

[0045] 1: Chamber

[0046] 1a: Window

[0047] 2: Material layer forming apparatus

[0048] 3: Irradiation device

[0049] 4: Styling workbench

[0050] 5: Chuck device

[0051] 6: Robot

[0052] 7: Material recycling device

[0053] 9: Control device

[0054] 10: Material Supply Unit

[0055] 11: Material Tank

[0056] 12: Main pipeline

[0057] 13: Intermediate pipe

[0058] 13a: Intermediate pipe outlet

[0059] 14: Opening and closing device

[0060] 17: Pollution prevention device

[0061] 17a: Frame

[0062] 17b: Diffusion component

[0063] 21: Base

[0064] 22: Coating head

[0065] 22a: Materials Storage Department

[0066] 22b: Material supply port

[0067] 22c: Material discharge outlet

[0068] 22fb: Blade

[0069] 22rb: Blade

[0070] 23: Coating head drive device

[0071] 41: Worktable drive mechanism

[0072] 42: Powder retaining wall

[0073] 51: Chuck base

[0074] 52: Clamping unit

[0075] 52a: First convex part

[0076] 52b: Second convex part

[0077] 52c: Contact recess

[0078] 52d: Ball bearing

[0079] 52e: Insertion hole

[0080] 53: Chuck Cover

[0081] 54: Outer cover

[0082] 54a: Outer covering portion

[0083] 54b: Upper surface portion

[0084] 55: Inner cover

[0085] 55a: Inner covering part

[0086] 55b: Flange portion

[0087] 70: Material recycling bin

[0088] 70a: Powder discharge section

[0089] 70b: Powder discharge section

[0090] 70c: Inclined groove guide

[0091] 70d: Inclined groove guide

[0092] 70e: Inclined groove

[0093] 71: Material recycling conveying device

[0094] 71a: Exhaust port

[0095] 71b: Suction port

[0096] 72: Switching valve

[0097] 73: Impurity Removal Device

[0098] 74: Suction device

[0099] 75: Switching valve

[0100] 76: Material Supply Barrel

[0101] 77: Material drying device

[0102] 78: Material supply conveying device

[0103] 78a: Exhaust port

[0104] 79: Suction Nozzle

[0105] 79a: Suction section

[0106] 79b: Opening

[0107] 81: Material layer

[0108] 81a: Remaining material layer

[0109] 82: Curing layer

[0110] 83: Base Plate

[0111] 84: Mounting plate

[0112] 85: Pallet

[0113] 86: Positioning plate

[0114] 86a: First opening

[0115] 86b: Second opening

[0116] 86c: Support foot

[0117] 86d: Mounting shaft

[0118] 87: Axis

[0119] 87a: Locking bolt

[0120] 87b: Locking part

[0121] 87c: Concave

[0122] 90a: CAD device

[0123] 90b: CAM device

[0124] 91: Numerical Control Department

[0125] 91a: Storage Unit

[0126] 91b: Arithmetic Unit

[0127] 91c: Memory

[0128] 92: Operation Door Control Department

[0129] 93: Material layer formation control section

[0130] 94: Irradiation Control Department

[0131] 95: Workbench Control Department

[0132] 96: Chuck Control Unit

[0133] 97: Robot Control Department

[0134] 98: Materials Supply / Recycling Control Department

[0135] 100: Layered Design Installation

[0136] B: Laser

[0137] G: Gap

[0138] R: Design Area

[0139] W: Three-dimensional model Detailed Implementation

[0140] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The features shown in the embodiments described below can be combined with each other. Furthermore, the invention is independent of each feature.

[0141] 1. Layered modeling device 100

[0142] Figure 1 This is a schematic structural diagram of the layered modeling apparatus 100 according to this embodiment. The layered modeling apparatus 100 includes: a chamber 1, a material layer forming apparatus 2, an irradiation apparatus 3, a modeling worktable 4, a chuck apparatus 5, a robot 6, a material recovery apparatus 7, a moving device, and a control device 9. In the modeling area R provided on the modeling worktable 4 disposed in the chamber 1, the desired three-dimensional model W can be formed by repeatedly forming material layers 81 and curing layers 82.

[0143] 1.1. Chamber 1

[0144] Chamber 1 covers the area where the desired three-dimensional shape W is formed, namely the shaping area R. The interior of chamber 1 is filled with an inert gas of a specified concentration supplied by an inert gas supply device (not shown). In this specification, inert gas refers to a gas that does not substantially react with material layer 81 or cured layer 82, and is selected depending on the type of material; for example, nitrogen, argon, or helium can be used. The inert gas containing fumes generated during the formation of cured layer 82 is discharged from chamber 1, and after fumes are removed in a fume collector (not shown), it is supplied back to chamber 1 for reuse. The fume collector is, for example, an electrostatic precipitator or a filter.

[0145] On the upper surface of chamber 1, a window 1a is provided, serving as a transmission window for laser B. Window 1a is formed of a material that allows laser B to pass through. Specifically, the material of window 1a is selected from quartz glass, borosilicate glass, or crystals of germanium, silicon, zinc selenide, or potassium bromide, depending on the type of laser B. For example, in the case where laser B is a fiber laser or a yttrium aluminum garnet (YAG) laser, window 1a may comprise quartz glass.

[0146] Additionally, a contamination prevention device 17 is provided on the upper surface of chamber 1 to cover window 1a. The contamination prevention device 17 includes a cylindrical frame 17a and a cylindrical diffusion member 17b disposed within the frame 17a. Clean, inert gas supplied to the space between the frame 17a and the diffusion member 17b passes through fine holes formed on the wall of the diffusion member 17b and fills the interior of the diffusion member 17b, then passes through an opening on the bottom surface of the frame 17a and is ejected downwards. This structure prevents smoke from adhering to window 1a, thereby removing smoke from the irradiation path of laser B.

[0147] Additionally, a working door (not shown) controlled by a control device 9 is provided in chamber 1. When the base plate 83 is moved into chamber 1, or when the base plate 83 and the model W are removed from chamber 1, the working door opens, and the robot 6 enters and exits chamber 1 to perform loading and unloading operations. When loading and unloading operations are not performed, especially during modeling, the working door is closed.

[0148] 1.2. Material layer forming apparatus 2

[0149] The material layer forming apparatus 2 supplies material powder to the base plate 83 placed in the molding area R to form a material layer 81. For example... Figures 1 to 4 As shown, the material layer forming apparatus 2 is disposed inside the chamber 1 and includes: a base 21 and a coating head 22 disposed on the base 21. The coating head 22 is configured to reciprocate in a horizontal single-axis direction via a coating head drive device 23.

[0150] like Figure 3 and Figure 4 As shown, the coating head 22 includes a material receiving section 22a, a material supply port 22b, and a material discharge port 22c. The material supply port 22b is located on the upper surface of the material receiving section 22a and is rectangular in shape extending along the length of the material receiving section 22a, serving as a receiving port for material powder supplied from the material supply unit 10 to the material receiving section 22a. The material discharge port 22c is located on the bottom surface of the material receiving section 22a, discharging the material powder within the material receiving section 22a. The material discharge port 22c has a slit shape extending along the length of the material receiving section 22a. Flat blades 22fb and 22rb are provided on both sides of the coating head 22. The blades 22fb and 22rb flatten the material powder discharged from the material discharge port 22c, forming a material layer 81.

[0151] 1.3. Irradiation device 3

[0152] like Figure 1 As shown, the irradiation device 3 is positioned above the chamber 1. The irradiation device 3 irradiates the irradiation area of ​​the material layer 81 formed within the molding area R with laser B, causing the material powder to melt or sinter and solidify, forming a solidified layer 82. Laser B can be any laser capable of sintering or melting the material powder, such as a fiber laser, CO2 laser, or YAG laser. Alternatively, the irradiation device 3 can be configured to use an electron beam instead of laser B to solidify the material layer 81.

[0153] 1.4. Modeling Workbench 4

[0154] A modeling worktable 4 is disposed within the chamber 1, and a modeling area R is provided on its upper surface. The modeling worktable 4 is configured to move up and down via a worktable drive mechanism 41. In this embodiment, the worktable drive mechanism 41 is configured using a motor as the drive source. Furthermore, the structure of the worktable drive mechanism 41 is not limited to the example of this embodiment; it can be of other forms as long as it enables the modeling worktable 4 to move in the vertical direction.

[0155] 1.5. Chuck assembly 5

[0156] The chuck device 5 is disposed on the molding worktable 4 and is configured to allow the base plate 83 to be freely loaded and unloaded and fixed within the molding area R. The base plate 83 is held and fixed by the chuck device 5, and is placed within the molding area R.

[0157] The base plate 83 can be directly fixed by the chuck device 5, or it can be fixed by other components such as the mounting plate 84. In this embodiment, for example... Figure 1 , Figure 5 ,and Figure 6 As shown, the base plate 83 is detachably fixed by the chuck device 5 via the mounting plate 84 and the tray 85. Specifically, a shaft 87 is mounted on the bottom surface of the tray 85 in a downward-facing manner, and the chuck device 5 holds the shaft 87, thereby detachably fixing the tray 85. Furthermore, the mounting plate 84 is fixed to the tray 85 using bolts or other fixing components, and the base plate 83 is fixed to the mounting plate 84 using bolts or other fixing components. That is, the chuck device 5, tray 85, mounting plate 84, and base plate 83 are arranged sequentially from the bottom, and a three-dimensional object W is formed on the upper surface of the base plate 83.

[0158] like Figures 6 to 8 As shown, the chuck device 5 of this embodiment includes: a chuck base 51 disposed on the molding worktable 4, and a clamping unit 52 disposed on the chuck base 51.

[0159] The chuck base 51 is used to fix the chuck device 5 to the molding worktable 4. In this embodiment, the four corners of the chuck base 51, which is quadrilateral in shape when viewed from above, are fixed to the molding worktable 4 by fixing components such as bolts.

[0160] The clamping unit 52 has a generally bottomed cylindrical shape. On the upper surface of the clamping unit 52, a plurality of (four in one example) first protrusions 52a and second protrusions 52b are respectively provided in a concentric circle shape when viewed from above. Furthermore, a plurality of (four in one example) abutment recesses 52c are provided, radially formed from the center when viewed from above. Additionally, as... Figure 6 As shown, inside the clamping unit 52, a plurality of balls 52d are arranged at equal intervals along the circumference of the shaft 87 as locking members to lock the shaft 87.

[0161] like Figure 6 and Figure 7As shown, shaft 87 includes a locking bolt 87a and a locking portion 87b disposed on the outside of the locking bolt 87a. A threaded portion is formed on the upper end of the locking bolt 87a. By screwing the threaded portion into a threaded hole formed on the bottom surface of the tray 85, the locking bolt 87a is installed on the tray 85. Furthermore, the lower end of the locking bolt 87a is inserted into the insertion hole 52e of the clamping unit 52, and the ball 52d of the clamping unit 52 engages with the recess 87c of the locking portion 87b, thereby locking the shaft 87. Thus, the tray 85 is fixed to the chuck assembly 5.

[0162] Furthermore, in this embodiment, a positioning plate 86 is clamped between the tray 85 and the clamping unit 52. The positioning plate 86 is fixed to the bottom surface of the tray 85 using bolts or other fixing components. The positioning plate 86 is provided with a plurality of (four in one example) first openings 86a and second openings 86b. The first openings 86a and second openings 86b are positioned to overlap with the first protrusions 52a and second protrusions 52b of the clamping unit 52 when viewed from above. The positioning plate 86 is positioned horizontally by the first protrusion 52a penetrating to the first opening 86a and the second protrusion 52b penetrating to the second opening 86b.

[0163] Additionally, multiple (four in one example) support feet 86c are mounted on the lower surface of the positioning plate 86 using a mounting shaft 86d. The support feet 86c are mounted at a position overlapping the abutment recess 52c when viewed from above. The positioning plate 86 is positioned vertically by the bottom surface of the support feet 86c abutting against the abutment recess 52c. By mounting the positioning plate 86 onto the tray 85, when the tray 85 is secured using the chuck device 5, the mounting plate 84 and the base plate 83 fixed to the tray 85 can be precisely positioned in predetermined positions in both the horizontal and vertical directions.

[0164] In this embodiment, the base plate 83 is fixed to the chuck assembly 5 via other components (mounting plate 84 and tray 85). In this structure, mounting portions such as threaded holes for mounting the shaft 87 or positioning plate 86 can be formed on the other components. Furthermore, these other components can be partially or completely removed from the base plate 83 and reused after molding. Therefore, it is not necessary to provide mounting portions on the base plate 83 according to the shape of the chuck assembly 5, thus enabling the base plate 83 to be manufactured more cost-effectively.

[0165] like Figure 5 and Figure 6 As shown, in this embodiment, the side of the chuck assembly 5 is covered by a chuck cover 53. The chuck cover 53 includes an outer cover 54 and an inner cover 55. The outer cover 54 covers at least a portion of the side of the inner cover 55, and the inner cover 55 covers the side of the chuck assembly 5. Metal or resin, etc., can be used as the raw material for the chuck cover 53.

[0166] Specifically, such as Figure 6 and Figure 8 As shown, the inner cover 55 includes a cylindrical inner covering portion 55a and a flange portion 55b extending radially outward from the lower end of the inner covering portion 55a. The inner covering portion 55a covers the side of the clamping unit 52 of the chuck assembly 5. The inner cover 55 is fixed to the chuck base 51 in the flange portion 55b. The outer cover 54 includes a cylindrical outer covering portion 54a and an upper surface portion 54b extending radially inward from the upper end of the outer covering portion 54a. The outer covering portion 54a covers a portion of the upper side of the side of the inner covering portion 55a. The outer cover 54 is fixed to the tray 85 in the upper surface portion 54b, with the upper surface of the upper surface portion 54b in contact with the bottom surface of the tray 85. Furthermore, the outer cover 54 and the inner cover 55 are arranged coaxially with the outer covering portion 54a and the inner covering portion 55a. With this structure, when the chuck device 5 is released from fixing the base plate 83 during or after the shaping process, residual material can be prevented from entering the interior of the chuck device 5, especially the clamping unit 52.

[0167] In addition, such as Figure 6 As shown, a gap G is provided between the outer cover 54 and the inner cover 55. Specifically, the outer cover 54 and the inner cover 55 are designed to satisfy the condition D1 > D2, and the gap G is provided accordingly. Furthermore, the gap G is preferably provided such that the distance between the inner surface of the outer cover 54a and the outer surface of the inner cover 55a (in this embodiment, (D1-D2) / 2) is 1 mm to 10 mm. In this structure, the path of residual material or other powder falling from the base plate 83 to the inside of the chuck cover 53 is curved, thus more effectively preventing powder intrusion.

[0168] Furthermore, the structure of the chuck cover 53 is not limited to the example of this embodiment. For example, the inner covering portion 55a and the outer covering portion 54a may also be cylindrical. Figures 6 to 8 The chuck device 5 of the embodiment shown can reduce the possibility of the molding process being unable to continue due to the remaining material powder intruding into the clamping unit 52, regardless of the process by which the robot 6 sucks up and removes the remaining material powder, thus supporting unmanned operation of continuous molding.

[0169] 1.6. Robot 6

[0170] The robot 6 is configured to remove the base plate 83 and the molded object W molded on the base plate 83 from the chamber 1. In this embodiment, after molding is completed, the ball bearing 52d of the clamping unit 52 engages / disengages from the recess 87c, thereby releasing the chuck device 5 from fixing the tray 85. In this state, the robot 6 grips a designated part of the tray 85, or inserts a support rod into a support hole (not shown) provided on the side of the tray 85 and lifts it, thereby removing the base plate 83 and the molded object W from the chamber 1 via the mounting plate 84, the tray 85, the shaft 87, the outer cover 54, and the operating door.

[0171] Alternatively, the robot 6 can be configured to move the model W to a predetermined position and reverse its vertical direction after removing it from the chamber 1. By reversing the model W, any remaining material attached to the model W or the base plate 83 can fall off and be removed. At this time, the reversed model W can be placed on a finishing device (not shown) installed on the outside of the chamber 1 for automatic or manual finishing removal of the remaining material. Examples of finishing removal methods include: using a suction nozzle to suction the material powder, vibrating the model W to make the material powder fall off, or transporting the model W to a suction chamber (not shown) outside the chamber 1 for powder suction removal.

[0172] When the model W is being processed, the robot 6 moves the base plate 83 and the model W, which are taken out of the chamber 1, to the secondary processing device (not shown).

[0173] Furthermore, the robot 6 in this embodiment is also used to move the base plate 83 into the chamber 1 before molding begins. Specifically, the base plate 83, mounting plate 84, tray 85, shaft 87, and outer cover 54 are integrated into a base plate assembly in a storage container (not shown) located outside the chamber 1. The robot 6 moves the base plate assembly into the chamber 1 by grasping a designated part of the tray 85 or by inserting a support rod into a support hole provided on the side of the tray 85 and lifting it, and inserts the lower end of the shaft 87 into the clamping unit 52. The tray 85 is fixed by the chuck device 5 by engaging the ball bearing 52d with the recess 87c of the inserted shaft 87.

[0174] 1.7. Material powder supply and recovery system

[0175] Next, the material powder supply and recovery system, including the material recovery device 7, will be described. For example... Figure 1 As shown, a material supply unit 10 is provided near the wall of chamber 1. The material supply unit 10 includes a material tank 11, a main pipe 12, and an intermediate pipe 13. The material tank 11 contains novel material powder, which is supplied to the intermediate pipe 13 through the main pipe 12.

[0176] The intermediate conduit 13 is movable in the vertical direction and is configured to discharge material powder from the intermediate conduit outlet 13a. In this embodiment, the intermediate conduit outlet 13a is a rectangular shape extending in approximately the same direction as the material supply port 22b of the coating head 22. Furthermore, the intermediate conduit outlet 13a is configured to be openable and closed by the opener 14. The intermediate conduit outlet 13a is normally closed by the opener 14. When replenishing material powder, the coating head 22 moves to directly below the intermediate conduit 13, and the intermediate conduit 13 moves to a position where the intermediate conduit outlet 13a is lower than the upper end of the material receiving section 22a. In this state, the opener 14 is opened, and material powder is replenished.

[0177] In this embodiment, a powder holding wall 42 is provided around the molding worktable 4. The powder material is held on the molding worktable 4 by the powder holding wall 42. In addition, a material recycling bin 70 is provided, which is configured to collect the remaining material discharged to the outside of the powder holding wall 42.

[0178] At least one powder discharge section 70b, communicating with a material recovery bin 70, is provided on the base 21 of the material layer forming apparatus 2. Residual material or impurities extruded by the moving coating head 22 are discharged from the powder discharge section 70b, guided by the chute guide 70d to the chute 70e, and collected in the material recovery bin 70. Furthermore, the powder discharge section 70b may also be configured to be openable / closeable by an opener / closer (not shown). Alternatively, a powder discharge section 70a, capable of discharging material powder from the inner side of the powder holding wall 42, may be provided on the lower side of the powder holding wall 42. After the layering molding is completed, the molding table 4 is lowered, thereby discharging a portion of uncured material powder or impurities such as cutting chips from the powder discharge section 70a. In this case, the material powder discharged from the powder discharge section 70a is guided by the chute guide 70c to the chute 70e and collected in the material recovery bin 70.

[0179] like Figure 1As shown, the material recovery apparatus 7 of this embodiment includes: a material recovery conveying device 71, an impurity removal device 73, a suction device 74, a material supply tank 76, a material drying device 77, a material supply conveying device 78, and a suction nozzle 79. The suction port 71b of the material recovery conveying device 71 is connected to the material recovery tank 70 via a switching valve 72 and piping, etc. Material powder containing impurities in the material recovery tank 70 is conveyed to the impurity removal device 73 by the material recovery conveying device 71. Examples of impurities include sputtering deposition generated during irradiation, or machining chips generated during cutting. The impurity removal device 73 removes impurities from the material powder conveyed from the material recovery conveying device 71. The material powder with impurities removed is contained in the material supply tank 76. The material drying device 77 dries the material powder in the material supply tank 76. The material powder dried by the material drying device 77 is supplied to the main pipeline 12 and reused through the material supply conveying device 78 connected to the upper part of the main pipeline 12.

[0180] Both the material recycling conveying device 71 and the material supply conveying device 78 have internal cyclone filters. The exhaust ports 71a and 78a of the filters are connected to the suction device 74 via a switching valve 75 and piping. The suction device 74 has suction power capable of simultaneously suctioning both gas and solids, and is configured, for example, using a cleaner. When the suction device 74 simultaneously suctions solids such as material powder or impurities and gas, the filter uses the difference in specific gravity to separate the solids from the airflow and cause them to fall. Thus, the solids are conveyed, and the gas is drawn from the exhaust ports 71a and 78a to the suction device 74. Furthermore, one suction device 74 can be switched between the material recycling conveying device 71 and the material supply conveying device 78 via the switching valve 75, or one suction device 74 can be independently connected to each of the material recycling conveying device 71 and the material supply conveying device 78.

[0181] The suction nozzle 79 is configured to suction any remaining material powder on the molding worktable 4. Furthermore, the suction nozzle 79 is movable via a moving device. In this embodiment, the robot 6 also functions as the moving device. Specifically, the suction nozzle 79 is housed in a storage section (not shown) outside the chamber 1. The robot 6 can hold the suction nozzle 79 and move it from the work door into the chamber 1, positioning it at any location. Additionally, the robot 6 can be used to tilt the suction nozzle 79, thus changing its posture relative to the molding object W.

[0182] In this embodiment, the suction nozzle 79 is connected to the suction port 71b of the material recycling conveying device 71 via a switching valve 72 and piping. For example, the suction nozzle 79 can be installed at one end of a flexible hose, and the other end of the hose can be connected to the suction port 71b via the switching valve 72. The material powder sucked from the suction nozzle 79 is then subjected to impurity removal and drying processes using the same method described above, and then supplied to the main pipeline 12.

[0183] The layering molding apparatus 100 of this embodiment includes a detection component (not shown) capable of detecting the proportion of material powder in a material being sucked by a suction nozzle 79. The proportion of material powder in the material being sucked can be, for example, the volumetric flow rate ratio, the mass flow rate ratio, or the area ratio within a defined detection region. The detection component can be, for example, a flow sensor or a camera. In this embodiment, a flow sensor is installed inside the suction nozzle 79 or the hose on which the suction nozzle 79 is installed as the detection component. As an example, the flow sensor is configured to detect the volumetric flow rate of the powder in the material being sucked. Specifically, the flow sensor emits microwaves at a predetermined position inside the suction nozzle 79 or the hose and receives their reflected waves. The frequency and amplitude of the reflected waves change according to the amount of powder in the material being sucked through the predetermined position, and therefore the volumetric flow rate of the material powder in the material being sucked can be detected based on these changes to obtain the volumetric flow rate ratio of the material powder. The detection result obtained by the detection component is output to the control device 9. Furthermore, the detection component can be configured to directly detect the proportion of material powder in the aspirated material, or it can be configured to indirectly detect the proportion of material powder. In the case of indirect detection, for example, the proportion of gas in the aspirated material can also be detected, and the proportion of material powder can be obtained based on the detection result.

[0184] Figure 9A and Figure 9B This is a diagram showing the front end of the suction section 79a of the suction nozzle 79. Figure 9A This is a front view. Figure 9B This is the right-side view. The suction nozzle 79 of this embodiment includes a suction section 79a on its front end side. Additionally, in... Figure 9A and Figure 9B The illustration is omitted, but a gripping part, which can be held by the robot 6 as a moving device, is provided on the base end side of the suction nozzle 79. The suction part 79a has a cylindrical shape formed by cutting off the end face of the front end with an inclined surface, and an opening 79b is provided on the inclined surface. The remaining material is sucked out from the opening 79b.

[0185] In this structure, such as Figure 10As shown, when the suction nozzle 79 is brought close to the layer containing the remaining material (remaining material layer 81a) and a portion of the opening 79b is embedded in the remaining material layer 81a, the material powder is drawn from the opening 79b. At this time, the gas is drawn from the portion of the opening 79b that is not embedded in the remaining material layer 81a. By drawing both the material powder and the gas simultaneously, situations where an excessive proportion of solids in the material being drawn reduces the suction force or causes blockage inside the suction nozzle 79 and the hose can be avoided.

[0186] The material recovery device 7 of this embodiment includes a recovery mode and a suction mode as operating modes, which are switched by the material supply / recovery control unit 98 of the control device 9 (described later). In the recovery mode, the material recovery device 7 recovers the material powder in the material recovery bin 70 and supplies the material powder to the material layer forming apparatus 2 after removing impurities. On the other hand, in the suction mode, the material recovery device 7 uses the robot 6, which is a moving device, to move the suction nozzle 79 and use the suction nozzle 79 to suction the remaining material powder on the molding worktable 4. In this embodiment, the material supply / recovery control unit 98 switches the switching valve 72, thereby switching between the recovery mode, in which the material powder is transported by the material recovery conveying device 71 with the material recovery bin 70 as the transport source, and the suction mode, in which the transport source is the suction nozzle 79.

[0187] 1.8. Control Device 9

[0188] like Figure 11 As shown, the control system of the stacked modeling apparatus 100 includes: a Computer-Aided Design (CAD) device 90a, a Computer-Aided Manufacturing (CAM) device 90b, and a control device 9. These devices are constructed by arbitrarily combining hardware and software such as a Central Processing Unit (CPU), Random Access Memory (RAM), Read Only Memory (ROM), auxiliary storage devices, and input / output interfaces. Hereinafter, the description will focus on control actions performed by the control system that are most closely related to the present invention.

[0189] CAD device 90a creates three-dimensional shape data (CAD data) that defines the shape and dimensions of a symmetrical three-dimensional model W. CAM device 90b creates a project file based on the CAD data, specifying instructions for the stacked modeling device 100. CAM device 90b transmits the project file to control device 9 via a communication line or storage medium.

[0190] The control device 9 controls the constituent elements of the layered modeling device 100, including the material layer forming device 2, the irradiation device 3, the modeling worktable 4, the chuck device 5, the robot 6, the material recycling device 7, and the moving device, to perform layered modeling according to the project documents. The control device 9 includes: a numerical control unit 91 and control units 92, 93, 94, 95, 96, 97, and 98 for the constituent elements of the layered modeling device 100.

[0191] The numerical control unit 91 outputs operation commands for the constituent elements of the stacked modeling apparatus 100 to the respective control units 92, 93, 94, 95, 96, 97, and 98 according to the project file created by the CAM device 90b. These control units include a storage unit 91a, an arithmetic unit 91b, and a memory 91c. The storage unit 91a stores the project file obtained from the CAM device 90b. The arithmetic unit 91b performs arithmetic processing for numerical control of the constituent elements of the stacked modeling apparatus 100 according to the project file. The memory 91c temporarily stores numerical values ​​or data during the arithmetic processing performed by the arithmetic unit 91b.

[0192] The control units 92, 93, 94, 95, 96, 97, and 98 of the constituent elements of the layering molding apparatus 100 control the operation of each constituent element based on action commands from the numerical control unit 91. Specifically, the work door control unit 92 controls the work door to open / close it in a timely manner. The material layer forming control unit 93 controls the coating head drive device 23 to reciprocate the coating head 22 along a horizontal single axis. The irradiation control unit 94 controls the irradiation device 3 to irradiate a predetermined position within the irradiation area under predetermined conditions using laser B.

[0193] The worktable control unit 95 controls the worktable drive mechanism 41, causing the modeling worktable 4 to move vertically and be positioned at a predetermined location. The chuck control unit 96 controls the clamping unit 52 of the chuck device 5 to switch between fixing and releasing the base plate 83.

[0194] The robot control unit 97 controls the robot 6 to move the base plate 83 into the chamber 1, remove the base plate 83 and the molded object W from the chamber 1, and, as needed, reverse the molded object W after it has been removed from the chamber 1 and move it to the secondary processing device. In this embodiment, the robot 6 also functions as a moving device for the suction nozzle 79. Therefore, the robot control unit 97 controls the robot 6, which acts as a moving device, to move the suction nozzle 79 and position it in a predetermined posture.

[0195] The material supply / recycling control unit 98 controls the material recycling device 7 and the material supply unit 10. It also switches the operating mode of the material recycling device 7.

[0196] In addition to the aforementioned structure, the layering molding apparatus 100 may also include within the chamber 1 a machining device (not shown) for machining the cured layer 82 and the molded object W as needed, such as cutting. The machining device may be configured such that a tool for cutting (e.g., an end mill) is mounted on a machining head, allowing the machining head to move appropriately in both the horizontal and vertical directions to machine the cured layer 82 or the molded object W. Alternatively, the tool may be configured to rotate via a spindle mounted on the machining head.

[0197] 2. Manufacturing method of three-dimensional model W

[0198] Next, refer to Figure 12 The manufacturing method of a three-dimensional model W using the layered modeling apparatus 100 of this embodiment will be described.

[0199] 2.1. Loading process S1

[0200] In the placement process S1, the base plate 83 is placed on the molding area R of the molding worktable 4. Specifically, firstly, the work door control unit 92 controls the work door to open. Additionally, the robot control unit 97 controls the robot 6 to move the base plate assembly from the storage container outside the chamber 1 into the chamber 1. The robot 6 moves the base plate assembly into the chamber 1 through the open work door and inserts the lower end of the shaft 87 into the insertion hole 52e of the clamping unit 52. In this state, the chuck control unit 96 controls the clamping unit 52 of the chuck device 5 to engage the ball bearing 52d with the locking part 87b of the shaft 87. Thus, as... Figure 13 As shown, the base plate 83 is placed in the shaping area R in a state where it is easily fixed to the chuck assembly 5. In addition, the sides of the chuck assembly 5 are covered by a chuck cover 53, which includes an outer cover 54 and an inner cover 55.

[0201] After the base plate 83 is placed, the robot control unit 97 controls the robot 6 to retreat outside the chamber 1, and the work door control unit 92 closes the work door. Then, inert gas is supplied to and fills the chamber 1 from the inert gas supply device. This creates a state where molding can begin.

[0202] 2.2. Material supply process S2

[0203] In the material supply process S2, material powder is supplied to and contained in the material receiving section 22a of the material layer forming apparatus 2. Specifically, the material layer forming control unit 93 controls the coating head drive device 23 to move the coating head 22 directly below the intermediate pipe 13. In this state, the material supply / recovery control unit 98 controls the material supply unit 10 to open the switch 14 and supply material powder into the material receiving section 22a. When a sufficient amount of material powder has been supplied, the material supply / recovery control unit 98 closes the switch 14 to stop the supply. Thereafter, the material layer forming control unit 93 controls the coating head drive device 23 to move the coating head 22 to the molding area R. Furthermore, the material supply process S2 is performed multiple times during the period from the start to the end of molding to replenish material powder to the material receiving section 22a.

[0204] 2.3. Curing layer formation process S3

[0205] Next, the curing layer formation process S3 is performed. In the curing layer formation process S3, the curing layer 82 is stacked by repeatedly performing the material layer formation process S3-1, which forms the material layer 81 by supplying material powder to the base plate 83, and the curing process S3-2, which forms the curing layer 82 by irradiating a specified irradiation area of ​​the material layer 81 with laser B.

[0206] Specifically, firstly, the worktable control unit 95 controls the worktable drive mechanism 41 to position the molding worktable 4 at a predetermined height. In this state, the material layer forming control unit 93 controls the coating head drive device 23 to move the coating head 22 from... Figure 13 The material moves from the left to the right. This forms a first material layer 81 on the base plate 83. Next, the irradiation control unit 94 controls the irradiation device 3 to irradiate a predetermined irradiation area of ​​the first material layer 81 with laser B or an electron beam. Thus, as... Figure 14 As shown, the first material layer 81 is cured to obtain the first cured layer 82.

[0207] Next, the second material layer formation process S3-1 is performed. After the first cured layer 82 is formed, the worktable control unit 95 controls the worktable drive mechanism 41 to lower the height of the molding worktable 4 by an amount equivalent to one layer of material layer 81. In this state, the material layer formation control unit 93 controls the coating head drive device 23 to move the coating head 22 from... Figure 14 The right side of the shaping area R is moved to the left side. This forms a second material layer 81, covering the first cured layer 82. Then, a second curing process S3-2 is performed. Using the same method as described above, the second material layer 81 is cured by irradiating a designated irradiation area with laser B, thus obtaining the second cured layer 82.

[0208] The material layer formation process S3-1 and the curing process S3-2 are repeated repeatedly to stack multiple cured layers 82 until the desired three-dimensional object W is obtained. Adjacent cured layers 82 are firmly bonded to each other. In addition, during or after molding, cutting or machining operations are performed as needed.

[0209] 2.4. Material recycling process S4

[0210] The material recycling process S4 is performed in parallel with the curing layer formation process S3. In the material recycling process S4, the material recycling device 7 operates in recycling mode. Specifically, the material supply / recycling control unit 98 switches the switching valve 72 so that the material powder being transported by the material recycling conveying device 71 becomes the material recycling bin 70. In addition, the material recycling conveying device 71, the impurity removal device 73, the suction device 74, the material supply bin 76, the material drying device 77, and the material supply conveying device 78 are operated to remove impurities and dry the material powder containing impurities in the material recycling bin 70, and then supply it to the main pipeline 12.

[0211] 2.5. Suction process S5

[0212] After the molding process is completed, a suction process S5 is performed. In the suction process S5, the remaining material on the molding worktable 4 is suctioned using the suction nozzle 79. Specifically, firstly, the work door control unit 92 controls the work door to open. Next, the robot control unit 97 controls the robot 6, which is a moving device, to grasp the suction nozzle 79 and move it from the work door into the chamber 1. In addition, during the suction process S5, the material recovery device 7 operates in suction mode. The material supply / recovery control unit 98 switches the switching valve 72 so that the material powder transport source using the material recovery conveying device 71 becomes the suction nozzle 79.

[0213] like Figure 15 As shown, during the period from the start to the completion of the molding process, the molding worktable 4 descends to a height equivalent to the total thickness of the formed material layers 81. In this state, the robot control unit 97 controls the robot 6 to move the suction nozzle 79, which then suctions the remaining material from the upper surface of the remaining material layer 81a.

[0214] At the point in time when the suction is completed from the upper surface of the remaining material layer 81a to a predetermined thickness, the worktable control unit 95 controls the worktable drive mechanism 41 to raise the molding worktable 4 by a predetermined amount. As a result, the upper surface of the remaining material layer 81a rises. In this state, the robot control unit 97 controls the robot 6 to move the suction nozzle 79, suctioning the remaining material from the upper surface side.

[0215] The control device 9 alternately and repeatedly controls the worktable drive mechanism 41 to raise the molding worktable 4 by a predetermined amount, and simultaneously moves the suction nozzle 79 to suction out the remaining material powder until all the remaining material is removed. By raising the molding worktable 4, vibration is applied to the molded object W on the molding worktable 4, and the remaining material in the pits, etc., of the molded object W falls onto the base plate 83 or the molding worktable 4, thus more efficiently removing the remaining material on the molding worktable 4.

[0216] In the suction process S5, the lifting amount of the molding worktable 4 during one lifting motion is preferably 5mm to 30mm, more preferably 7mm to 20mm. If the lifting amount during one lifting motion is too small, in addition to insufficient vibration applied to the molded object W, the lifting motion becomes frequent, and sometimes the efficiency of the suction process S5 will decrease. On the other hand, if the lifting amount is too large, the height of the upper surface of the remaining material layer 81a exceeds the upper end of the powder holding wall 42, and sometimes it cannot be held on the molding worktable 4.

[0217] In the suction process S5 of this embodiment, the robot control unit 97 of the control device 9 controls the robot 6, which is a moving device, based on the shape data of the desired three-dimensional model W, so that the suction nozzle 79 takes a predetermined posture at a predetermined position. Specifically, the robot 6 reads data representing the outline of the model W, and moves the suction nozzle 79 while adjusting the position of the suction nozzle 79 and its posture relative to the model W, so that the suction nozzle 79 does not come into contact with the model W, or can efficiently suction out the remaining material remaining in the pits or other recesses of the model W.

[0218] Furthermore, the worktable control unit 95 of the control device 9 controls the worktable drive mechanism 41 based on the detection results of the flow sensor, which serves as a detection component. This control causes the molding worktable 4 to descend by a predetermined amount if the proportion of material powder in the material being sucked by the suction nozzle 79 exceeds a predetermined value r. If the proportion of material powder in the material being sucked is too high, it can easily lead to a decrease in the suction force of the suction nozzle 79 or blockage inside the suction nozzle 79 and the hose. By lowering the molding worktable 4, the amount of gas drawn into the remaining material layer 81a by the opening 79b of the suction nozzle 79 can be reduced, thereby increasing the amount of gas drawn and preventing the situation described above.

[0219] As an example, when using a flow sensor as a detection component to obtain the volumetric flow rate ratio of the material powder in the suction nozzle 79 or hose, suction can be performed efficiently when the volumetric flow rate ratio of the material powder is around 0.7 to 0.8, and blockage of the suction nozzle 79 and hose is less likely to occur. Therefore, in the structure of this detection component, the specified value r is preferably set to satisfy 0.8 < r.

[0220] Furthermore, in this embodiment, the control device 9 determines whether the suction of remaining material is complete based on the detection results of the detection component. Specifically, when the proportion of material powder in the material being suctioned by the suction nozzle 79 is approximately 0, it is determined that all remaining material on the molding worktable 4 has been suctioned. After suction is completed, the robot control unit 97 controls the robot 6 to move the suction nozzle 79 from the work door to outside the chamber 1 and store it in the storage unit. Thus, the suction process S5 ends.

[0221] Furthermore, the method for determining whether the removal of remaining material is complete is not limited to the example described above. For instance, image data of the base plate 83 and the shape W can be acquired using a camera or other imaging device, and the removal can be determined to be complete by confirming from the image data whether any remaining material is left.

[0222] 2.6. Removal process S6

[0223] After the suction process S5 is completed, the removal process S6 is performed to remove the base plate 83 and the molded object W on the base plate 83 from the chamber 1. Specifically, firstly, the chuck control unit 96 controls the clamping unit 52 of the chuck device 5 to engage / disengage the ball bearing 52d from the locking part 87b, thereby releasing the fixation of the base plate 83 by the chuck device 5. Next, the robot control unit 97 controls the robot 6 to remove the base plate 83 and the molded object W from the mounting plate 84, tray 85, shaft 87, outer cover 54, and chamber 1.

[0224] After the model W is removed from chamber 1, the robot control unit 97 can also control the robot 6 to reverse the model W in the vertical direction to allow the remaining material to fall, or to place the reversed model W on a finishing device for finishing and removal of the remaining material. Furthermore, in the case of secondary processing, after the robot control unit 97 controls the robot 6 to move the model W to the secondary processing device, the secondary processing step S7 is performed. In this case, by introducing a fixing device with the same structure as the chuck device 5 into the secondary processing device, the robot 6 can be controlled, and similarly to the fixing of the chuck device 5 in the placement step S1, the base plate 83 and the model W are fixed and positioned on the fixing device via the mounting plate 84 and the tray 85. This automates the placement of the model W in the secondary processing device and ensures the same placement accuracy as in the modeling area R, enabling high-precision secondary processing.

[0225] After the removal process S6 is completed, the three-dimensional model W is manufactured sequentially by repeating the process. In this structure, after the modeling is completed, the remaining material is automatically removed using the suction nozzle 79, thus enabling unmanned removal of the model W from the chamber 1.

[0226] The foregoing has described various embodiments of the present invention, but these are merely examples and are not intended to limit the scope of the invention. The novel embodiments described can be implemented in various other ways, with various omissions, substitutions, and modifications made without departing from the spirit of the invention. These embodiments and their variations are included within the scope or spirit of the invention, and are also included within the scope of the invention as set forth in the claims and its equivalents.

Claims

1. A layered molding device, comprising: The modeling device comprises a modeling worktable, a chamber, a material layer forming apparatus, a chuck apparatus, a material recovery apparatus, a moving apparatus, a robot, and a control apparatus. The layering modeling apparatus is characterized in that... The modeling worktable is configured to move up and down via a worktable drive mechanism. The chamber covers the area on the modeling worktable where the modeled objects are formed, which is the modeling area. The material layer forming apparatus supplies material powder to a base plate placed in the molding area to form a material layer. The chuck device is disposed on the molding worktable, and is configured to allow the base plate to be easily mounted and detached and fixed within the molding area. The material recovery device includes a suction nozzle capable of sucking up the remaining material powder on the molding worktable. The moving device is configured to move the suction nozzle. The robot is configured to remove the base plate and the shaped object formed on the base plate from the cavity. The control device performs the following actions alternately and repeatedly: The worktable drive mechanism is controlled to raise the modeling worktable by a specified amount, and The remaining material powder is drawn in while the suction nozzle is moved.

2. The layered molding device according to claim 1, characterized in that, Also includes: Detection components, The detection component can detect the proportion of the material powder in the material being aspirated by the suction nozzle.

3. The layered molding device according to claim 2, characterized in that, The detection component is a flow sensor.

4. The layered molding device according to claim 3, characterized in that, The proportion of the material powder in the extracted material is the volumetric flow rate proportion of the material powder in the extracted material.

5. The layered molding device according to claim 4, characterized in that, The control device controls the worktable drive mechanism to lower the modeling worktable by a predetermined amount when the proportion of the material powder in the suctioned material is greater than a predetermined value r, wherein the predetermined value r is greater than 0.

8.

6. The layered molding device according to claim 2, characterized in that, The control device controls the worktable drive mechanism to lower the molding worktable by a predetermined amount when the proportion of the material powder in the suctioned material is greater than a predetermined value.

7. The layered molding device according to claim 1, characterized in that, The control device controls the moving device based on the shape data of the desired three-dimensional object, so that the suction nozzle takes a predetermined posture at a predetermined position.

8. The layered molding device according to claim 1, characterized in that, The specified rise in a single upward movement of the modeling worktable is between 5mm and 30mm.

9. The layered molding apparatus according to claim 4 or 5, characterized in that, The flow sensor is disposed in the suction nozzle or the hose in which the suction nozzle is installed. It emits microwaves at a predetermined position inside the suction nozzle or the hose and receives the reflected waves of the microwaves. The volumetric flow rate of the material powder in the suctioned material is detected according to the frequency and amplitude of the reflected waves, which change based on the amount of powder in the suctioned material at the predetermined position, and the volumetric flow rate ratio is obtained.

10. The layered molding apparatus according to claim 3 or 4, characterized in that, The control device controls the worktable drive mechanism to lower the molding worktable by a predetermined amount when the proportion of the material powder in the suctioned material is greater than a predetermined value.

11. The layering molding apparatus according to any one of claims 2 to 6, characterized in that, The control device controls the moving device based on the shape data of the desired three-dimensional object, so that the suction nozzle takes a predetermined posture at a predetermined position.

12. The layering molding apparatus according to any one of claims 2 to 7, characterized in that, The specified rise in a single upward movement of the modeling worktable is between 5mm and 30mm.

13. The layering molding apparatus according to any one of claims 1 to 8, characterized in that, Also includes: A powder holding wall surrounds the molding worktable and is configured to hold the material powder on the molding worktable; as well as The material recycling bin is configured to contain any remaining material powder that has been discharged to the outside of the powder holding wall. The material recovery device includes a recovery mode and a suction mode as its operating modes. The control device is configured to switch the operating mode. The material recycling device is configured as follows: In the recycling mode, the material powder in the material recycling bin is recycled, and after impurities are removed, the material powder is supplied to the material layer forming device. In the suction mode, the moving device is used to move the suction nozzle, and the suction nozzle is used to suction the remaining material powder on the molding worktable.

14. The layering molding apparatus according to any one of claims 1 to 8, characterized in that, The sides of the chuck device are covered by a chuck cover. The chuck cover includes an outer cover and an inner cover. The outer cover covers at least a portion of the side surface of the inner cover. The inner cover covers the side of the chuck assembly.

15. The layering molding apparatus according to any one of claims 1 to 8, characterized in that, The chuck device secures the base plate via a mounting plate.

16. The layering molding apparatus according to any one of claims 1 to 8, characterized in that, The suction nozzle includes a suction section on its front end side. The suction section has a cylindrical shape formed by cutting off the end face of the front end with an inclined surface. An opening is provided on the inclined surface.

17. The layering molding apparatus according to any one of claims 1 to 8, characterized in that, The robot also serves as the mobile device.

18. The layered molding apparatus according to claim 17, characterized in that, The robot moves the base plate into the chamber.

19. The layered molding apparatus according to claim 18, characterized in that, After the robot removes the sculpture from the chamber, it flips the sculpture over.

20. A manufacturing method for a three-dimensional model, characterized in that, include: The process includes the placement process, the curing layer formation process, the material recovery process, the suction process, and the removal process. The material recycling process is performed in parallel with the curing layer formation process. The suction process is performed after the curing layer formation process and the material recycling process. In the loading process, the base plate is fixed in place by means of a chuck device configured on the molding worktable, and the base plate is placed on the molding worktable in the area where the shaped object is formed, i.e., the molding area. In the curing layer formation process, a material layer formation process is repeatedly performed, which involves supplying material powder to the substrate to form a material layer, and a curing process is performed, which involves irradiating a predetermined area of ​​the material layer with a laser or electron beam to form a curing layer, thereby stacking the curing layers. In the material recycling process, residual materials generated in the material layer formation process and impurities generated in the curing process are recycled. In the suction process, a control device controls the worktable drive mechanism and the suction nozzle to alternately and repeatedly raise the molding worktable by a predetermined amount using the worktable drive mechanism, and simultaneously suction the remaining material powder by moving the suction nozzle using a moving device. In the removal process, the base plate and the three-dimensional object shaped on the base plate are removed from the cavity covering the shaped area.

21. The manufacturing method according to claim 20, characterized in that, In the suction process, the proportion of the material powder in the material being suctioned by the suction nozzle is detected.

22. The manufacturing method according to claim 21, characterized in that, In the suction process, the worktable drive mechanism is controlled so that when the proportion of the material powder in the suctioned material is greater than a specified value, the molding worktable is lowered by a specified amount.

23. The manufacturing method according to claim 21, characterized in that, The proportion of the material powder in the extracted material is the volumetric flow rate proportion of the material powder in the extracted material.

24. The manufacturing method according to claim 23, characterized in that, In the suction process, the worktable drive mechanism is controlled so that when the volume flow rate ratio of the material powder in the suctioned material is greater than a specified value, the molding worktable is lowered by a specified amount.

25. The manufacturing method according to claim 23, characterized in that, In the suction process, the worktable drive mechanism is controlled so that when the proportion of the material powder in the suctioned material is greater than a specified value r, the molding worktable is lowered by a specified amount, wherein the specified value r is greater than 0.

8.

26. The manufacturing method according to claim 20, characterized in that, In the suction process, the moving device is controlled based on the desired shape data of the three-dimensional object so that the suction nozzle takes a predetermined posture at a predetermined position.

27. The manufacturing method according to claim 20, characterized in that, The specified rise in a single upward movement of the modeling worktable is between 5mm and 30mm.

28. The manufacturing method according to any one of claims 21 to 25, characterized in that, In the suction process, the moving device is controlled based on the desired shape data of the three-dimensional object so that the suction nozzle takes a predetermined posture at a predetermined position.

29. The manufacturing method according to any one of claims 21 to 26, characterized in that, The specified rise in a single upward movement of the modeling worktable is between 5mm and 30mm.

30. The manufacturing method according to any one of claims 20 to 27, characterized in that, The loading process involves moving the base plate into the cavity.

31. The manufacturing method according to claim 30, characterized in that, The removal process involves reversing the object after it has been removed from the chamber.

Images