An AI intelligent monitoring system for reflow furnace

Abstract

The present invention belongs to the field of management, and discloses an AI intelligent monitoring system for a reflow furnace, including a temperature acquisition module, a temperature calculation module, a temperature monitoring module, and an early warning prompt module; the temperature acquisition module is used to acquire the temperature of each temperature zone of the reflow furnace; the temperature calculation module is used to calculate the temperature of the PCB board in each temperature zone based on the temperature of each temperature zone; the temperature monitoring module is used to determine whether the temperature of the PCB board in each temperature zone is within the temperature interval corresponding to the temperature zone; the early warning prompt module is used to send an alarm prompt to the staff when the temperature of the PCB board exceeds the temperature interval corresponding to the temperature zone. The present invention can combine the furnace temperature test of the reflow furnace with the daily normal production activities, which not only improves the monitoring frequency of the furnace temperature of the reflow furnace, but also does not need to stop production, thereby ensuring the production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of management, and in particular to an AI intelligent monitoring system for a reflow furnace. Background Art

[0002] The reflow furnace refers to a device that passes the PCB board through high temperature to melt the solder paste attached to the PCB board and then cool it down, ultimately achieving a stable combination of the parts after the PCB is placed.

[0003] In the prior art, the reflow furnace is usually tested manually and periodically to ensure that the temperature of the reflow furnace on the PCB is in a normal operating state. However, if the reflow furnace has problems before the next test, it will result in more unqualified PCBs, affecting the quality of the produced PCBs. Moreover, each time the furnace temperature test is performed, production needs to be stopped, which affects production efficiency. Summary of the invention

[0004] The purpose of the present invention is to disclose an AI intelligent monitoring system for a reflow furnace to solve the problem of how to increase the monitoring frequency of the furnace temperature of the reflow furnace without affecting the production efficiency.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] The present invention provides an AI intelligent monitoring system for a reflow furnace, including a temperature acquisition module, a temperature calculation module, a temperature monitoring module and an early warning prompt module;

[0007] The temperature acquisition module is used to obtain the temperature of each temperature zone of the reflow furnace;

[0008] The temperature calculation module is used to calculate the temperature of the PCB board in each temperature zone based on the temperature of each temperature zone;

[0009] The temperature monitoring module is used to determine whether the temperature of the PCB board in each temperature zone is within the temperature range corresponding to the temperature zone;

[0010] The early warning prompt module is used to send an alarm prompt to the staff when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone.

[0011] Optionally, the temperature acquisition module includes a sensor unit, a data processing unit and a calculation unit;

[0012] The sensor unit is used to obtain the original temperature of each temperature zone using a fixed acquisition cycle;

[0013] The data processing unit is used to pre-process the original temperature obtained by the sensor unit to obtain a pre-processed temperature;

[0014] The calculation unit is used to calculate the temperature of the temperature zone according to the preprocessed temperature.

[0015] Optionally, the sensor unit includes thermocouple sensors arranged in each temperature zone for acquiring temperature, and the length of each temperature zone is the same.

[0016] Optionally, the reflow furnace is divided into a preheating area, a heat preservation area, a reflow area and a cooling area which are adjacent to each other in sequence;

[0017] The preheating area, the holding area, the reflow area and the cooling area all contain multiple temperature zones.

[0018] Optionally, the temperature of the PCB board is calculated based on the temperature of each temperature zone, including:

[0019] Determine the zone type corresponding to the temperature zone, the zone type includes any one of a preheating zone, a heat preservation zone, a reflow zone and a cooling zone;

[0020] The temperature of the PCB board is calculated based on the temperature of the temperature zone and the temperature modeling formula of the area type corresponding to the temperature zone.

[0021] Optionally, a curve display module is also included, and the curve display module is used to generate an oven temperature curve of the PCB board during the time period between entering the reflow oven and leaving the reflow oven.

[0022] Optionally, judging whether the temperature of the PCB board in each temperature zone is within a temperature range corresponding to the temperature zone includes:

[0023] Get the highest and lowest temperatures of the PCB board in the temperature zone;

[0024] Determine whether the maximum temperature and the minimum temperature are both within the temperature range corresponding to the temperature zone.

[0025] Optionally, the early warning prompt module includes a sound early warning device and a text early warning device;

[0026] The sound warning device is used to play a preset warning sound when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone;

[0027] The text warning device is used to provide a pop-up prompt on the device with a display screen used by the staff.

[0028] Optionally, a pop-up window prompt is displayed on the device with a display screen used by the staff, including:

[0029] The first step is to obtain the number of the temperature zone where the PCB board is located when the temperature of the PCB board exceeds the temperature range;

[0030] In the second step, a prompt box pops up on the device with a display screen used by the staff, and the prompt box displays prompt content consisting of the temperature zone number obtained in the first step and a preset prompt text.

[0031] Optionally, it further includes a heating device arranged in the preheating area, the heating device including a heating control unit and heating units arranged in each temperature zone of the preheating area;

[0032] The heating control unit is used to periodically calculate the process temperature of each temperature zone according to the position of the PCB board;

[0033] The heating unit is used to heat the temperature zone according to the process temperature of the temperature zone where the heating unit is located.

[0034] Beneficial effects:

[0035] Compared with the prior art, the present invention divides the interior of the reflow furnace into multiple temperature zones, and then obtains the temperature of each temperature zone to calculate the temperature of the PCB board in each temperature zone of the reflow furnace, thereby being able to combine the furnace temperature test of the reflow furnace with daily normal production activities, which not only improves the monitoring frequency of the furnace temperature of the reflow furnace, but also does not need to stop production, thereby ensuring production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0037] Figure 1 A schematic diagram of an AI intelligent monitoring system for a reflow furnace of the present invention.

[0038] Figure 2 A schematic diagram of the temperature zone division of the preheating area of ​​the present invention.

[0039] Figure 3 It is a schematic diagram of the furnace temperature curve of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figure 1In one embodiment shown, the present invention provides an AI intelligent monitoring system for a reflow furnace, including a temperature acquisition module, a temperature calculation module, a temperature monitoring module and an early warning prompt module;

[0042] The temperature acquisition module is used to obtain the temperature of each temperature zone of the reflow furnace;

[0043] The temperature calculation module is used to calculate the temperature of the PCB board in each temperature zone based on the temperature of each temperature zone;

[0044] The temperature monitoring module is used to determine whether the temperature of the PCB board in each temperature zone is within the temperature range corresponding to the temperature zone;

[0045] The early warning prompt module is used to send an alarm prompt to the staff when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone.

[0046] The present invention divides the interior of the reflow furnace into multiple temperature zones, and then obtains the temperature of each temperature zone to calculate the temperature of the PCB board in each temperature zone of the reflow furnace, so that the furnace temperature test of the reflow furnace and the daily normal production activities can be combined together, which not only improves the monitoring frequency of the furnace temperature of the reflow furnace, but also does not need to stop production, thereby ensuring production efficiency.

[0047] Specifically, in the reflow furnace, the length of each temperature zone is 30 cm, and there is a gap area between two adjacent temperature zones, and the length of the gap area is 5 cm.

[0048] Optionally, the temperature acquisition module includes a sensor unit, a data processing unit and a calculation unit;

[0049] The sensor unit is used to obtain the original temperature of each temperature zone using a fixed acquisition cycle;

[0050] The data processing unit is used to pre-process the original temperature obtained by the sensor unit to obtain a pre-processed temperature;

[0051] The calculation unit is used to calculate the temperature of the temperature zone according to the preprocessed temperature.

[0052] Specifically, since the original temperature may be affected by the circuit noise of the sensor during the acquisition process, the acquired temperature is not accurate enough. Therefore, the present invention can improve the accuracy of the acquired temperature by preprocessing the original temperature, so that the generated furnace temperature curve is more accurate when the furnace temperature of the reflow furnace is monitored.

[0053] Optionally, the sensor unit includes thermocouple sensors arranged in each temperature zone for acquiring temperature, and the length of each temperature zone is the same.

[0054] Optionally, each temperature zone includes at least two thermocouple sensors, and the thermocouple sensors are dispersedly arranged at the upper end and the lower end of the temperature zone.

[0055] By setting up multiple thermocouple sensors and calculating the average value, the accuracy of the obtained temperature can be improved.

[0056] Optionally, the temperature of the temperature zone is calculated based on the preprocessed temperature, including:

[0057] The average value of the preprocessed temperatures corresponding to the original temperatures collected by all the thermocouple sensors in the thermocouple sensors is taken as the temperature of the temperature zone.

[0058] Optionally, preprocessing the original temperature obtained by the sensor unit to obtain a preprocessed temperature includes:

[0059] Get the set tempU of original temperatures obtained by all thermocouple sensors in the temperature zone at the same time;

[0060] For the original temperature i in tempU, the preprocessing formula is:

[0061] afi=α×ordtim i +β×sametim i

[0062] afi represents the preprocessed temperature obtained after preprocessing the original temperature i, ordtim i represents the first reference value of the original temperature i, sametim i represents a second reference value of the original temperature i, α and β represent the weight of the first reference value and the weight of the second reference value respectively;

[0063] The calculation formula for the first reference value is:

[0064]

[0065] ordtu represents the thermocouple sensor corresponding to the original temperature i in the time interval [t i -T,t i ) corresponds to the set of pre-processed temperatures obtained in the original temperature, t i represents the time when the original temperature i is obtained, T represents the set duration, timitr i,j =t i -t j , t j Indicates the acquisition time of the original temperature corresponding to the preprocessed temperature j;

[0066] The calculation formula for the second reference value is:

[0067]

[0068] sametu means that all thermocouple sensors in the temperature zone where the thermocouple sensor corresponding to the original temperature i is located are i The collection of raw temperatures obtained, range i,k represents the difference coefficient of the original temperature k to the original temperature i, (x i ,y i ,z i ) represents the coordinate of the thermocouple sensor corresponding to the original temperature i in real space, (x k ,y k ,z k ) represents the coordinates of the thermocouple sensor corresponding to the original temperature k in real space, x, y, z represent the coordinates of the X-axis, Y-axis and Z-axis respectively, range vr i represents the cumulative difference coefficient of the original temperature in sametu, temp vri represents the cumulative difference between the original temperature in sametu and the original temperature i, nmsametu represents the total number of original temperatures in sametu,

[0069] In the process of preprocessing the original temperature i, the present invention does not only rely on the preprocessed temperature corresponding to the original temperature obtained by the thermocouple sensor corresponding to the original temperature i in the previous time to calculate, but also combines all the original temperatures obtained by the thermocouple sensor currently belonging to the same temperature zone to calculate, and finally combines the preprocessed results, so that the present invention can obtain a more accurate preprocessing result. Because if the original temperature i is preprocessed only based on historical data, that is, the preprocessed temperature corresponding to the original temperature obtained by the thermocouple sensor in the previous time, then, in the scheme of the present invention, when the PCB board is away from or close to the current temperature zone, the temperature of the temperature zone will decrease or increase. If the temperature change amplitude of the temperature zone is relatively large, the result obtained by preprocessing based on historical data is not accurate enough, and the result obtained by preprocessing based on historical data cannot be fully applicable to the process of temperature change. Therefore, the present invention performs preprocessing by adding all the original temperatures obtained by the thermocouple sensor currently belonging to the same temperature zone, adding more current temperatures, thereby improving the accuracy of the preprocessing result and obtaining a more accurate preprocessing result.

[0070] In addition, in the process of calculating the first reference value, if the acquisition time of the original temperature corresponding to the preprocessed temperature j is farther away from the acquisition time of the original temperature i, its contribution to the first reference value is smaller, thereby further improving the accuracy of the results obtained by preprocessing based on historical data when the temperature changes.

[0071] In the process of calculating the second reference value, the present invention not only considers the difference coefficient, but also considers the difference between the original temperatures. For the original temperature k, if the difference coefficient between it and the original temperature i is smaller, the temperature difference is smaller, then in the process of calculating the second reference value, its contribution to the second reference value is greater. In this way, the reference ratio of other thermocouple sensors close to the thermocouple sensor corresponding to the original temperature i is larger, so that the calculated second reference value is more accurate.

[0072] Finally, the present invention can obtain a more accurate preprocessing result by performing weighted calculation on the first reference value and the second reference value.

[0073] Specifically, the preprocessing in the present invention is mainly to reduce the influence of noise and obtain a more accurate temperature.

[0074] Optionally, the weight of the first reference value and the weight of the second reference value are 0.4 and 0.6 respectively.

[0075] Optionally, the reflow furnace is divided into a preheating area, a heat preservation area, a reflow area and a cooling area which are adjacent to each other in sequence;

[0076] The preheating area, the holding area, the reflow area and the cooling area all contain multiple temperature zones.

[0077] Specifically, the PCB board enters the reflow furnace from the preheating area and then leaves the reflow furnace from the cooling area.

[0078] In one embodiment, the interior of the reflow furnace is divided into 17 temperature zones, each temperature zone is 30 cm long, and there is a 5 cm gap area between two adjacent temperature zones.

[0079] The first to fourth temperature zones belong to the preheating area;

[0080] The 5th to 9th temperature zones belong to the insulation area;

[0081] The 10th to 13th temperature zones belong to the reflow area;

[0082] The 14th to 17th temperature zones belong to the cooling area.

[0083] The specific number of temperature zones of various types of regions can be set according to the different heating requirements of the PCB boards to be processed. The above embodiments are only examples and do not mean that the present invention can only determine the number of temperature zones of the region according to the above scheme.

[0084] The division of preheating area is as follows Figure 2 shown.

[0085] Optionally, the temperature of the PCB board is calculated based on the temperature of each temperature zone, including:

[0086] Determine the zone type corresponding to the temperature zone, the zone type includes any one of a preheating zone, a heat preservation zone, a reflow zone and a cooling zone;

[0087] The temperature of the PCB board is calculated based on the temperature of the temperature zone and the temperature modeling formula of the area type corresponding to the temperature zone.

[0088] Specifically, taking the 17 temperature zones divided above as an example, the temperature modeling formulas for the preheating zone, insulation zone, and reflow zone are as follows:

[0089] If the PCB is in the temperature zone, the temperature modeling formula is:

[0090]

[0091] T2 represents the temperature of the PCB at time p in the temperature zone, T1 represents the temperature of the PCB at time p-1, the time interval between two adjacent moments is 0.25 seconds, Ta represents the ambient temperature, A represents the modeling coefficient, t1 represents the cumulative time of entering the current temperature zone, t0 represents the moment when the PCB enters the current temperature zone, and V represents the chain speed;

[0092] The value of ambient temperature Ta is as follows:

[0093] If the PCB is in any temperature zone between the 1st and 4th temperature zones, the calculation formula for the ambient temperature Ta is:

[0094] Npre represents the total number of temperature zones in the preheating area, tembk represents the set of temperature zones in the preheating area, and temp u Indicates the temperature in temperature zone u;

[0095] If the PCB is in any temperature zone between the 5th and 13th temperature zones, the ambient temperature Ta is the temperature of that temperature zone;

[0096] The values ​​of A are as follows:

[0097] If the PCB board is between the 1st and 4th temperature zones, A is 0.88; if the PCB board is between the 5th and 9th temperature zones, A is 0.836; if the PCB board is between the 10th and 13th temperature zones, A is 0.924.

[0098] If the PCB is in the gap area, T b and T b-1 They represent the temperatures of the bth and b-1th temperature zones respectively, and t2 represents the cumulative time of entering the gap area between the bth and b-1th temperature zones.

[0099] Specifically, the temperature modeling formula of the cooling area is as follows:

[0100] T3=T2-h×t3×(T2-Ta)

[0101] T3 represents the temperature of the PCB at time k in the temperature zone of the cooling area, T2 represents the temperature of the PCB at time k-1 in the temperature zone of the cooling area, the time length between time k and time k-1 is t3, t3 is 0.25 seconds, and Ta represents the ambient temperature;

[0102] If the PCB is in the gap area, T b and T b-1 They represent the temperatures of the bth and b-1th temperature zones respectively, and t2 represents the cumulative time of entering the gap area between the bth and b-1th temperature zones.

[0103] If the PCB is in a temperature zone, the ambient temperature is the temperature of that temperature zone.

[0104] Optionally, the values ​​of h in the 14th temperature zone to the 17th temperature zone are 0.012, 0.019, 0.022, and 0.018, respectively.

[0105] Optional,

[0106] s represents the area of ​​the PCB board, in square meters; h represents the average convection heat transfer coefficient, in degrees Celsius*square meters; σ represents the set circuit board density, with a value range of 1.8-2.2g / cm 3 , Cρ represents the mass of the hot plate of the reflow furnace at constant pressure.

[0107] Optionally, a curve display module is also included, and the curve display module is used to generate an oven temperature curve of the PCB board during the time period between entering the reflow oven and leaving the reflow oven.

[0108] The furnace temperature curve here refers to the curve corresponding to the temperature of the PCB board.

[0109] By generating the furnace temperature curve, parameters such as the heating time, reflow time, heating slope, and reflow slope can be calculated. These parameters can be used to further monitor the status of the reflow furnace.

[0110] Specifically, the generated furnace temperature curve is as follows Figure 3 shown.

[0111] Optionally, judging whether the temperature of the PCB board in each temperature zone is within a temperature range corresponding to the temperature zone includes:

[0112] Get the highest and lowest temperatures of the PCB board in the temperature zone;

[0113] Determine whether the maximum temperature and the minimum temperature are both within the temperature range corresponding to the temperature zone.

[0114] Specifically, different temperature zones have different temperature intervals due to the different corresponding zone types. Taking the preheating zone as an example, the temperature intervals from the first to the fourth temperature zones in the preheating zone can be set to [40°C, 70°C], [70°C, 100°C], [100°C, 130°C], and [130°C, 160°C], respectively. The temperature intervals of temperature zones in other zone types can be set according to actual needs.

[0115] Optionally, the early warning prompt module includes a sound early warning device and a text early warning device;

[0116] The sound warning device is used to play a preset warning sound when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone;

[0117] The text warning device is used to provide a pop-up prompt on the device with a display screen used by the staff.

[0118] Specifically, the sound warning device may include a speaker.

[0119] The devices with display screens used by staff include smartphones, tablets, desktop computers, etc.

[0120] Optionally, a pop-up window prompt is displayed on the device with a display screen used by the staff, including:

[0121] The first step is to obtain the number of the temperature zone where the PCB board is located when the temperature of the PCB board exceeds the temperature range;

[0122] In the second step, a prompt box pops up on the device with a display screen used by the staff, and the prompt box displays prompt content consisting of the temperature zone number obtained in the first step and a preset prompt text.

[0123] For example, the preset prompt text is "The furnace temperature in temperature zone No. xx is abnormal", and then "xx" is replaced with the number obtained in the first step to generate the prompt content.

[0124] Optionally, it further includes a heating device arranged in the preheating area, the heating device including a heating control unit and heating units arranged in each temperature zone of the preheating area;

[0125] The heating control unit is used to periodically calculate the process temperature of each temperature zone according to the position of the PCB board;

[0126] The heating unit is used to heat the temperature zone according to the process temperature of the temperature zone where the heating unit is located.

[0127] In the prior art, different temperature zones of the reflow furnace are maintained at the target temperature at the beginning, which obviously wastes electricity. However, the present invention can avoid heating the temperature zone to an excessively high temperature before the PCB board reaches the temperature zone by calculating the process temperature, thereby reducing power consumption and reducing production costs. In a temperature zone, as the distance between the PCB boards gets closer, the process temperature becomes higher and higher, so that the temperature in the temperature zone can be quickly raised to the target temperature before the PCB board enters the temperature zone.

[0128] Specifically, each temperature zone is set with a corresponding target temperature.

[0129] In one embodiment, the target temperature of each temperature zone in the preheating area is set to the same temperature. In the heat preservation area, the target temperature of the temperature zone increases as the number of the temperature zone increases, and in the reflow area, the target temperature of the temperature zone increases first and then decreases, and in the cooling area, the target temperature of the temperature zone decreases as the number of the temperature zone increases.

[0130] Furthermore, taking 17 temperature zones as an example, the target temperatures can be arranged from small to large according to the temperature zone numbers, namely 160℃, 160℃, 160℃, 160℃, 160℃, 165℃, 170℃, 195℃, 210℃, 243℃, 297℃, 297℃, 200℃, 70℃, 50℃, 40℃, and 30℃.

[0131] Specifically, heating the temperature zone according to the process temperature of the temperature zone in which the temperature zone is located includes:

[0132] If the current temperature of the temperature zone is lower than the process temperature, the temperature zone is heated until the temperature of the temperature zone is equal to the process temperature. If the current temperature of the temperature zone is greater than or equal to the process temperature, the temperature zone is not heated.

[0133] Optionally, when the PCB board approaches the temperature zone, the process temperature is calculated as follows:

[0134]

[0135] protemp represents the process temperature, δ represents the process temperature calculation coefficient, distmid represents the distance between the center of the PCB board and the center of the temperature zone, distmax represents the distance between the center of the temperature zone and the front area of ​​the reflow furnace, V represents the chain speed, Vmax represents the maximum chain speed of the reflow furnace, and aimtemp represents the target temperature;

[0136] When the PCB is away from the temperature, the process temperature is calculated as follows:

[0137]

[0138] F represents a preset positive integer.

[0139] Specifically, in the process of calculating the process temperature of the present invention, not only the distance between the PCB board and the center of the temperature zone is considered, but also the chain speed is considered. The smaller the distance between the PCB board and the center of the temperature zone and the greater the chain speed, the higher the process temperature. The larger the distance between the PCB board and the center of the temperature zone and the smaller the chain speed, the higher the process temperature. This design method enables the calculation method of the process temperature of the present invention to be applicable to reflow furnaces of different lengths and to different chain speeds, thereby improving the scope of application of the process temperature control scheme of the present invention, so that the present invention can be used in more models of reflow furnaces to save the power consumption of the reflow furnaces.

[0140] Moreover, the pretreatment scheme of the present invention cooperates with the process temperature control scheme of the present invention. The two cooperate with each other, so that the present invention can not only reduce power consumption, but also obtain accurate pretreatment results.

[0141] Optionally, δ∈(0.2,0.7).

[0142] Optionally, the process temperature calculation coefficient has a value of 0.6.

[0143] The optional value of F is 2.

[0144] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0145] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition they may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this manner may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0146] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0147] The various component embodiments of the present invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or digital signal processor (DSP) may be used in practice to implement some or all of the functions of some or all of the components in the hardware configuration device for request messages according to an embodiment of the present invention. The present invention may also be implemented as a device or device program (e.g., a computer program and a computer program product) for executing part or all of the methods described herein. Such a program implementing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals. Such a signal may be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0148] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0149] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An AI intelligent monitoring system for reflow furnace, It is characterized in that It includes temperature acquisition module, temperature calculation module, temperature monitoring module and early warning prompt module; The temperature acquisition module is used to obtain the temperature of each temperature zone of the reflow furnace; The temperature calculation module is used to calculate the temperature of the PCB board in each temperature zone based on the temperature of each temperature zone; The temperature monitoring module is used to determine whether the temperature of the PCB board in each temperature zone is within the temperature range corresponding to the temperature zone; The early warning prompt module is used to send an alarm prompt to the staff when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone; The temperature acquisition module includes a sensor unit, a data processing unit and a calculation unit; The sensor unit is used to obtain the original temperature of each temperature zone using a fixed acquisition cycle; The data processing unit is used to pre-process the original temperature obtained by the sensor unit to obtain a pre-processed temperature; The calculation unit is used to calculate the temperature of the temperature zone according to the preprocessed temperature; The raw temperature obtained by the sensor unit is preprocessed to obtain a preprocessed temperature, including: Get the set tempU of original temperatures obtained by all thermocouple sensors in the temperature zone at the same time; For the original temperature i in tempU, the preprocessing formula is: fire=α×ordtim i +β×sametim i afi represents the preprocessed temperature obtained after preprocessing the original temperature i, ordtim i represents the first reference value of the original temperature i, sametim i represents a second reference value of the original temperature i, α and β represent the weight of the first reference value and the weight of the second reference value respectively; The calculation formula for the first reference value is: ordtu represents the thermocouple sensor corresponding to the original temperature i in the time interval [t i -T,t i ) corresponds to the set of pre-processed temperatures obtained in the original temperature, t i represents the time when the original temperature i is obtained, T represents the set duration, timitr i,j =t i -t j , t j Indicates the acquisition time of the original temperature corresponding to the preprocessed temperature j; The calculation formula for the second reference value is: sametu means that all thermocouple sensors in the temperature zone where the thermocouple sensor corresponding to the original temperature i is located are i The collection of raw temperatures obtained, range i,k represents the difference coefficient of the original temperature k to the original temperature i, (x i ,y i ,z i ) represents the coordinate of the thermocouple sensor corresponding to the original temperature i in real space, (x k ,y k ,z k ) represents the coordinates of the thermocouple sensor corresponding to the original temperature k in real space, x, y, z represent the coordinates of the X-axis, Y-axis and Z-axis respectively, range vri represents the cumulative difference coefficient of the original temperature in sametu, temp vri represents the cumulative difference between the original temperature in sametu and the original temperature i, nmsametu represents the total number of original temperatures in sametu, 2. According to claim 1, a reflow furnace AI intelligent monitoring system, It is characterized in that The sensor unit includes thermocouple sensors arranged in each temperature zone for acquiring temperature, and the length of each temperature zone is the same.

3. According to claim 1, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that The reflow furnace is divided into a preheating area, a holding area, a reflow area and a cooling area which are adjacent to each other in sequence; The preheating area, the holding area, the reflow area and the cooling area all contain multiple temperature zones.

4. According to claim 3, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that Calculate the temperature of the PCB board based on the temperature of each temperature zone, including: Determine the zone type corresponding to the temperature zone, the zone type includes any one of a preheating zone, a heat preservation zone, a reflow zone and a cooling zone; The temperature of the PCB board is calculated based on the temperature of the temperature zone and the temperature modeling formula of the area type corresponding to the temperature zone.

5. According to claim 1, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that It also includes a curve display module, which is used to generate an oven temperature curve of the PCB board during the time period from entering the reflow oven to leaving the reflow oven.

6. According to claim 1, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that Determine whether the temperature of the PCB board in each temperature zone is within the temperature range corresponding to the temperature zone, including: Get the highest and lowest temperatures of the PCB board in the temperature zone; Determine whether the maximum temperature and the minimum temperature are both within the temperature range corresponding to the temperature zone.

7. According to claim 1, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that The early warning prompt module includes a sound early warning device and a text early warning device; The sound warning device is used to play a preset warning sound when the temperature of the PCB board exceeds the temperature range corresponding to the temperature zone; The text warning device is used to provide a pop-up prompt on the device with a display screen used by the staff.

8. According to claim 7, a reflow furnace AI intelligent monitoring system, It is characterized in that Pop-up prompts are displayed on the devices with display screens used by staff, including: The first step is to obtain the number of the temperature zone where the PCB board is located when the temperature of the PCB board exceeds the temperature range; In the second step, a prompt box pops up on the device with a display screen used by the staff, and the prompt box displays prompt content consisting of the temperature zone number obtained in the first step and a preset prompt text.

9. According to claim 4, the AI ​​intelligent monitoring system for reflow furnace, It is characterized in that It also includes a heating device arranged in the preheating area, the heating device including a heating control unit and heating units arranged in each temperature zone of the preheating area; The heating control unit is used to periodically calculate the process temperature of each temperature zone according to the position of the PCB board; The heating unit is used to heat the temperature zone according to the process temperature of the temperature zone where the heating unit is located.

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