A semiconductor cleaning apparatus

Abstract

The application discloses a kind of semiconductor cleaning equipment, belongs to semiconductor cleaning technical field, including workbench, with the edge of workbench upper surface fixed connection several cleaning warehouses, cleaning warehouse inside hollow forms cleaning space and is equipped with cleaning entrance in front side, cleaning warehouse left and right sides are equipped with cleaning liquid connector, and cleaning liquid connector two ends are respectively equipped with cleaning liquid interface and several cleaning liquid nozzles;Workbench bottom is equipped with recovery warehouse, and cleaning warehouse bottom is equipped with fluid pipe being communicated with cleaning space and extending into recovery warehouse;Cleaning warehouse top is equipped with gas connector, and gas connector top end and bottom end are respectively equipped with gas interface and several gas nozzles;Cleaning warehouse bottom is equipped with rotary table, and rotary table top edge is equipped with several mechanical arms, and mechanical arm is away from rotary table one end and is equipped with sealing cover matched with cleaning entrance, and sealing cover is close to one end of cleaning entrance and is equipped with wafer clamp;The application can avoid that semiconductor wafer cleaning process chemical cleaning liquid is polluted and improve cleaning efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and more specifically to a semiconductor cleaning device. Background Technology

[0002] Semiconductor cleaning is a crucial step in semiconductor manufacturing, aiming to remove contaminants from the surface and interior of semiconductor wafers to ensure the quality and performance of semiconductor devices. A common method is RCA cleaning, which uses one or more cleaning solutions such as SC1, SC2, SPM, DHF, and BHF to clean the semiconductor wafers, depending on the requirements. Currently, common semiconductor cleaning equipment typically has multiple cleaning tanks arranged side-by-side, with cleaning solutions and deionized water alternately injected into the tanks. After removing impurities from the semiconductor wafer surface with the first cleaning solution, the cleaning solution is removed with deionized water. Then, a second cleaning solution is used to remove another type of impurity, and the cleaning solution is removed with deionized water again, and so on. However, semiconductor wafers carry the cleaning solution adhering to their surface into the deionized water, and then carry the deionized water mixed with a small amount of the first cleaning solution into the second cleaning solution, easily leading to gradual contamination of the cleaning solution. Although some cleaning equipment only performs one rinse with deionized water in the cleaning tanks before draining and refilling with clean deionized water, as long as deionized water remains on the semiconductor wafer surface, the cleaning solution will still be contaminated, and a large amount of deionized water will be consumed.

[0003] Chinese Patent Publication No. CN217009129U discloses a semiconductor cleaning device, including: a wafer cleaning unit, a drying unit, and a loading / unloading unit. The loading / unloading unit is used for loading and unloading wafers. It also includes a first robotic arm, a second robotic arm, and a handwashing unit. The handwashing unit is used for cleaning and / or drying the first robotic arm. The handwashing unit has a wafer temporary storage structure for temporarily storing wafers to be cleaned. The first robotic arm is used to transfer the wafers to be cleaned from the loading / unloading unit to the wafer temporary storage structure. After cleaning by the handwashing unit, it is also used to transfer the cleaned wafers from the wafer cleaning unit to the drying unit. After drying by the handwashing unit, it is also used to transfer the dried wafers from the drying unit to the loading / unloading unit. The second robotic arm is used to transfer the wafers to be cleaned from the wafer temporary storage structure to the wafer cleaning unit.

[0004] The aforementioned semiconductor cleaning equipment uses four parallel cleaning sub-units to clean semiconductor wafers with four different cleaning solutions. However, the cleaning solution used earlier in the cleaning process can easily contaminate the cleaning solution used later in the cleaning process. Contamination of the cleaning solution can lead to unsatisfactory cleaning results, so there is still room for improvement. Summary of the Invention

[0005] To address the technical deficiencies in the background art, this invention proposes a semiconductor cleaning device that solves the aforementioned technical problems and meets practical needs. The specific technical solution is as follows: A semiconductor cleaning device includes a workbench and several cleaning chambers. The cleaning chambers are fixedly connected to the edge of the upper surface of the workbench and are evenly distributed in a circular pattern. Each cleaning chamber is hollow to form a cleaning space. A cleaning inlet is provided on the front side of each cleaning chamber, extending into the cleaning space. Cleaning fluid connectors are provided on both the left and right sides of each cleaning chamber. One end of each cleaning fluid connector has a cleaning fluid interface, and the other end extends into the cleaning space and is provided with several cleaning fluid nozzles. A channel is provided inside the cleaning fluid connector to connect the cleaning fluid interface and the cleaning fluid nozzles. A recovery chamber is provided at the bottom of the workbench, and a fluid pipe is provided at the bottom of each cleaning chamber, communicating with the cleaning space and extending into the recovery chamber. The top of the cleaning chamber is equipped with a gas connector, the top of the gas connector is equipped with a gas interface, the other end extends into the cleaning space and is equipped with several gas nozzles, and the inside of the gas connector is equipped with a channel connecting the gas interface and the gas nozzles. The bottom of the cleaning chamber is equipped with a rotary table, and the top edge of the rotary table is equipped with several robotic arms. The end of the robotic arm away from the rotary table is equipped with a sealing cover that matches the cleaning inlet, and the end of the sealing cover near the cleaning inlet is equipped with a wafer clamp.

[0006] As a further technical solution of the present invention, the recycling bin is hollow inside and forms several independent recycling spaces. Each recycling space corresponds to a cleaning bin. A recycling port is provided on one side of each recycling space. The recycling port is connected to one of the fluid pipes. Several exhaust holes penetrating to each recycling space are provided on the top of the recycling bin.

[0007] As a further technical solution of the present invention, a plurality of recycling pipes are provided above the recycling bin, which are connected to each recycling space one by one, and the bottom of the recycling pipes extends to near the bottom of the recycling space.

[0008] As a further technical solution of the present invention, a sealing gasket matching the sealing cover is provided around the edge of the cleaning inlet.

[0009] As a further technical solution of the present invention, electromagnets are provided at the top and bottom of the cleaning chamber, respectively, and the electromagnets are located near the top and bottom of the cleaning inlet. Locking blocks matching the electromagnets are provided at the top and bottom of the sealing cover.

[0010] As a further technical solution of the present invention, an electric push rod is provided between the end of the robotic arm and the sealing cover. The fixed end of the electric push rod is fixedly connected to the robotic arm, and the movable end is fixedly connected to the sealing cover.

[0011] As a further technical solution of the present invention, a rotary joint is provided between the end of the robotic arm and the fixed end of the electric push rod.

[0012] As a further technical solution of the present invention, the wafer is clamped with two clamping claws that are distributed vertically and extend toward the cleaning space, and the end of the clamping claw is provided with a limiting groove on one side opposite to the other clamping claw.

[0013] The beneficial effects of this invention are as follows: This invention uses several cleaning chambers to perform alternating chemical cleaning and deionized water cleaning on semiconductor wafers. Both the chemical cleaning solution and deionized water are sprayed onto the semiconductor wafers. After cleaning, high-pressure gas is sprayed through gas nozzles to remove the chemical cleaning solution or deionized water adhering to the surface of the semiconductor wafers. This method can more efficiently remove impurities and residual chemical cleaning solution from the surface of the semiconductor wafers and avoid contamination of the chemical cleaning solution. A rotary table and a robotic arm allow multiple semiconductor wafers held in wafer holders to be cleaned simultaneously and in different steps. During the cleaning process, the semiconductor wafers do not interfere with each other and proceed in an orderly manner, improving cleaning efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a semiconductor cleaning device.

[0015] Figure 2 This is a schematic diagram of the cleaning state of a semiconductor cleaning device.

[0016] Figure 3 This is a schematic diagram of the cleaning chamber of a semiconductor cleaning device.

[0017] Figure 4 This is a schematic diagram of the sealing cover and wafer clamp of a semiconductor cleaning device.

[0018] Figure 5 This is a schematic diagram of the recycling chamber of a semiconductor cleaning device.

[0019] The components include: workbench 1, cleaning chamber 2, cleaning space 21, cleaning inlet 22, cleaning fluid connector 23, cleaning fluid interface 231, cleaning fluid nozzle 232, fluid pipe 24, gas connector 25, gas interface 251, gas nozzle 252, sealing gasket 26, electromagnet 27, recovery chamber 3, recovery space 31, recovery port 32, exhaust port 33, recovery pipe 34, rotary table 4, robotic arm 5, electric push rod 51, rotary joint 52, sealing cover 6, locking block 61, wafer clamp 7, clamping claw 71, and limiting groove 72. Detailed Implementation

[0020] The embodiments of the present invention will be described below with reference to the accompanying drawings and related examples. The embodiments of the present invention are not limited to the following examples, and the present invention relates to the relevant necessary components in this technical field, which should be regarded as well-known technology in this technical field and can be known and mastered by those skilled in this technical field.

[0021] like Figure 1-4 As shown, a semiconductor cleaning device includes a workbench 1 and several cleaning chambers 2. The cleaning chambers 2 are fixedly connected to the edge of the upper surface of the workbench 1 and are evenly distributed in a circle. The interior of each cleaning chamber 2 is hollow, forming a cleaning space 21. A cleaning inlet 22 is provided on the front side of the cleaning chamber 2, which extends into the cleaning space 21. Cleaning fluid connectors 23 are provided on both the left and right sides of the cleaning chamber 2. One end of each cleaning fluid connector 23 is provided with a cleaning fluid interface 231, and the other end extends into the cleaning space 21 and is provided with several cleaning fluid nozzles 232. A channel is provided inside the cleaning fluid connector 23 to connect the cleaning fluid interface 231 and the cleaning fluid nozzles 232. A recovery chamber 3 is provided at the bottom of the workbench 1, and a fluid pipe 24 is provided at the bottom of the cleaning chamber 2, which communicates with the cleaning space 21 and extends into the recovery chamber 3. The top of the cleaning chamber 2 is provided with a gas connector 25, the top of the gas connector 25 is provided with a gas interface 251, the other end extends into the cleaning space 21 and is provided with a number of gas nozzles 252, and the gas connector 25 is provided with a channel connecting the gas interface 251 and the gas nozzles 252. The bottom of the cleaning chamber 2 is provided with a rotary table 4, and the top edge of the rotary table 4 is provided with several robotic arms 5. The end of the robotic arm 5 away from the rotary table 4 is provided with a sealing cover 6 that matches the cleaning inlet 22, and the end of the sealing cover 6 near the cleaning inlet 22 is provided with a wafer clamp 7.

[0022] This invention relates to the cleaning of semiconductor wafers using the RCA cleaning method. A worktable 1 is used to fix several cleaning chambers 2. The upper surface of the worktable 1 is circular, and several cleaning chambers 2 are fixed near the edge. The cleaning chambers 2 are arranged in an array with the center of the upper surface of the worktable 1 as the center. The number of cleaning chambers 2 is at least four and is an even number, preferably eight. The cleaning chambers 2 can clean the semiconductor wafers using either chemical cleaning solutions or deionized water. The cleaning chambers 2 cleaned with chemical cleaning solutions are designated as chemical cleaning chambers, and the cleaning chambers 2 cleaned with deionized water are designated as impurity removal cleaning chambers. The chemical cleaning chambers and the impurity removal cleaning chambers... The cleaning chambers 2 are staggered on the upper surface of the worktable 1. Semiconductor wafers can be cleaned with chemical cleaning solution and deionized water through several cleaning chambers 2 in an alternating manner. Each chemical cleaning chamber uses a different chemical cleaning solution. The required chemical cleaning solution is selected according to the type of impurities on the surface of the semiconductor wafer. The order of setting different types of chemical cleaning chambers is set according to the cleaning process. The semiconductor wafer is chemically cleaned at least twice to remove impurities such as organic matter, particulate matter, metal contaminants, photoresist, and oxide film from the surface of the semiconductor wafer. After each chemical cleaning, it is rinsed with deionized water to remove the residual chemical cleaning solution from the surface of the semiconductor wafer.

[0023] The cleaning inlet 22 is located on the side of the cleaning chamber 2 away from the center of the upper surface of the workbench 1. The semiconductor wafer enters the cleaning space 21 through the cleaning inlet 22 for cleaning. The cleaning fluid connector 23 is connected to the pipeline for conveying chemical cleaning fluid or deionized water through the cleaning fluid interface 231. The chemical cleaning fluid or deionized water is sprayed out through the cleaning fluid nozzle 232 at the other end of the cleaning fluid connector 23, spraying the chemical cleaning fluid or deionized water onto the surface of the semiconductor wafer to remove impurities or residual chemical cleaning fluid. The two cleaning fluid connectors 23 can clean both sides of the semiconductor wafer at the same time. The chemical cleaning fluid or deionized water that has been cleaned will flow from the fluid pipe 24 at the bottom of the cleaning space 21 to the recovery chamber 3. The chemical cleaning fluid that has been cleaned still contains a large number of effective components. After impurity removal, it is recovered and sprayed back onto the surface of the semiconductor wafer for cleaning. The deionized water that has been cleaned contains a small amount of chemical cleaning fluid components. After impurity removal, it can be used to prepare the corresponding chemical cleaning fluid.

[0024] It should be noted that in conventional cleaning processes, semiconductor wafers are immersed in chemical cleaning solutions. As the number of cleaning cycles increases, the concentration of the chemical cleaning solution gradually decreases, leading to reduced cleaning efficiency. Therefore, it is difficult to ensure consistent cleaning results using a standard cleaning time, and a longer cleaning time than the standard time is usually required, resulting in reduced cleaning efficiency. In this invention, however, cleaning the semiconductor wafers by spraying chemical cleaning solutions ensures a consistent chemical cleaning solution concentration, achieving consistent cleaning results within the standard cleaning time and improving cleaning efficiency. In addition, spraying deionized water removes residual chemical cleaning solutions from the semiconductor wafer surface. The chemical cleaning solutions are washed away by the deionized water and flow to the bottom of the cleaning space 21, thus completely removing residual chemical cleaning solutions from the semiconductor wafer surface. Ultimately, the deionized water remaining on the semiconductor wafer surface will not contain any chemical cleaning solution components, thereby avoiding contamination of the chemical cleaning solutions used in subsequent cleaning processes.

[0025] The gas connector 25 at the top of the cleaning chamber 2 can be connected to a pipeline for conveying high-pressure gas through the gas interface 251. After the semiconductor wafer is cleaned in the cleaning space 21, the high-pressure gas can be sprayed onto both sides of the semiconductor wafer through the gas nozzle 252. This can blow the chemical cleaning liquid or deionized water adhering to the surface of the semiconductor wafer into the fluid pipe 24, thereby reducing the amount of chemical cleaning liquid or deionized water adhering to the surface of the semiconductor wafer and maximizing the recovery of chemical cleaning liquid or deionized water. This can avoid the recovered deionized water containing too much chemical cleaning liquid and can also avoid the recovered chemical cleaning liquid being diluted to a large extent.

[0026] In this invention, the rotary table 4 is coaxial with the worktable 1. The rotary table 4 rotates along its axis, causing the robotic arm 5 to move in a circular motion around the edge of the worktable. The number of robotic arms 5 is the same as that of the cleaning chamber 2. One side of the cleaning device of this invention is equipped with a first robotic arm that transports the semiconductor wafer to be cleaned and a second robotic arm that removes the cleaned wafer. The robotic arm 5 located at the first cleaning step clamps and fixes the semiconductor wafer on the first robotic arm using a wafer clamp 7. Then, the semiconductor wafer is placed into the cleaning space 21 through the cleaning inlet 22. When the sealing cover 6 just covers the cleaning inlet 22, the semiconductor wafer is positioned in the cleaning space 21. Next, the cleaning chamber 2 cleans the semiconductor wafer. After cleaning, the robotic arm... Arm 5 removes the semiconductor wafer, and then the rotary table 4 continues to rotate, moving the semiconductor wafer to the next cleaning chamber 2 for the next cleaning step. This process continues until the semiconductor wafer completes the final cleaning step, at which point the second robotic arm removes the semiconductor wafer. The rotary table 4 then continues to rotate, moving robotic arm 5 to the next cleaning chamber 2, which is the cleaning chamber 2 located at the first cleaning step. The next semiconductor wafer is then cleaned. This invention can clean the same number of semiconductor wafers simultaneously according to the number of robotic arms 5 or cleaning chambers 2. Each semiconductor wafer is in a different cleaning step, and the cleaning process is carried out in an orderly manner without interference, thus improving cleaning efficiency.

[0027] This invention uses several cleaning chambers 2 to perform alternating chemical cleaning and deionized water cleaning on semiconductor wafers. Both the chemical cleaning solution and deionized water are sprayed onto the semiconductor wafers. After cleaning, high-pressure gas is sprayed through gas nozzles 252 to remove the chemical cleaning solution or deionized water adhering to the surface of the semiconductor wafers. This can more efficiently remove impurities and residual chemical cleaning solution from the surface of the semiconductor wafers and avoid contamination of the chemical cleaning solution. The rotary table 4 and the robotic arm 5 enable multiple semiconductor wafers held on wafer clamps 7 to be cleaned simultaneously and in different steps. During the cleaning process, the semiconductor wafers do not interfere with each other and proceed in an orderly manner, improving the cleaning efficiency.

[0028] like Figure 5 As shown, in one of the preferred embodiments of the present invention, the recycling bin 3 is hollow inside and forms several independent recycling spaces 31. The recycling spaces 31 correspond one-to-one with the cleaning bin 2. A recycling port 32 is provided on one side of the recycling space 31. The recycling port 32 is connected to one of the fluid pipes 24. The top of the recycling bin 3 is provided with several exhaust holes 33 that penetrate to each recycling space 31.

[0029] The present invention has several recycling spaces 31 for recycling chemical cleaning solutions and deionized water with different components that have been cleaned. The chemical cleaning solutions and deionized water that have been cleaned are collectively referred to as waste liquid. The waste liquids with different components are recycled separately to avoid mixing of the recycled waste liquids and making the composition unclear, which would lead to recycling difficulties. After being transported through the fluid pipe 24, the waste liquid enters the corresponding recycling space 31 through the recycling port 32. The exhaust port 33 at the top of the recycling chamber 3 is used to discharge the high-pressure gas sprayed from the gas nozzle 252. The air flowability ensures that the high-pressure gas can blow away the liquid on the surface of the semiconductor wafer normally.

[0030] like Figure 5 As shown, in one of the preferred embodiments of the present invention, a plurality of recycling pipes 34 are provided above the recycling bin 3, which are connected to each recycling space 31 one by one, and the bottom of the recycling pipes 34 extends to near the bottom of the recycling space 31.

[0031] The recovery pipe 34 of the present invention is provided with a fluid pump for extracting liquid at the end away from the recovery space 31. The fluid pump extracts the waste liquid in the recovery space 31 into a container for temporary storage. After the waste liquid is recovered to a certain amount, it is processed in a centralized manner. A water level sensor can be installed in the recovery space 31 to detect the amount of waste liquid in the recovery space 31. When the waste liquid reaches the set amount, it is extracted by the fluid pump. The fluid pump only needs to be turned on intermittently to avoid the risk of the fluid pump burning out due to dry running.

[0032] like Figure 3 As shown, in one of the preferred embodiments of the present invention, the edge of the cleaning inlet 22 is provided with a sealing gasket 26 that matches the sealing cover 6.

[0033] The sealing gasket 26 of the present invention is made of elastic materials such as silicone and rubber. When the sealing cover 6 covers the cleaning inlet 22, it will squeeze the sealing gasket 26. The sealing gasket 26 can improve the sealing performance of the gap between the sealing cover 6 and the cleaning inlet 22, prevent the chemical cleaning liquid or deionized water sprayed in the cleaning chamber 2 from spraying out from the gap, and ensure the cleanliness of the workshop floor.

[0034] like Figure 3 , 4 As shown, in one of the preferred embodiments of the present invention, electromagnets 27 are provided at the top and bottom of the cleaning chamber 2, respectively, and the electromagnets 27 are located near the top and bottom of the cleaning inlet 22. Locking blocks 61 matching the electromagnets 27 are provided at the top and bottom of the sealing cover 6.

[0035] The electromagnet 27 of this invention is used to lock the sealing cover 6. The locking block 61 is made of magnetic material. When the sealing cover 6 covers the cleaning inlet 22, the electromagnet 27 is energized. The electromagnet 27 will generate magnetism and firmly attract the locking block 61. At the same time, the sealing cover 6 will exert greater pressure on the sealing gasket 26, thereby further improving the sealing performance between the sealing cover 6 and the cleaning inlet 22, preventing the chemical cleaning liquid or deionized water sprayed in the cleaning chamber 2 from spraying out from the gaps, and ensuring the cleanliness of the workshop floor.

[0036] like Figure 1 , 2 As shown, in one of the preferred embodiments of the present invention, an electric push rod 51 is provided between the end of the robotic arm 5 and the sealing cover 6. The fixed end of the electric push rod 51 is fixedly connected to the robotic arm 5, and the movable end is fixedly connected to the sealing cover 6.

[0037] When the electric push rod 51 of the present invention is working, the fixed end is fixed and the movable end reciprocates along its extension direction, thereby causing the semiconductor wafer held by the wafer clamp 7 to move toward the cleaning chamber 2 or toward a direction away from the cleaning chamber 2. The electric push rod 51 is used to push the semiconductor wafer to be cleaned into the cleaning space 21 or to remove the semiconductor wafer that has been cleaned from the cleaning space 21.

[0038] like Figure 1 , 2 As shown, in one of the preferred embodiments of the present invention, a rotary joint 52 is provided between the end of the robotic arm 5 and the fixed end of the electric push rod 51.

[0039] The rotating joint 52 of the present invention can make the electric push rod 51 rotate around the rotating joint 52 as an axis, so that the wafer clamp 7 can rotate to the side away from the cleaning chamber 2, thereby clamping the semiconductor wafer to be cleaned into the cleaning chamber 2, or clamping the cleaned semiconductor wafer to the side away from the cleaning chamber 2 and removing the semiconductor wafer by the second robotic arm.

[0040] like Figure 1 , 4 As shown, in one of the preferred embodiments of the present invention, the wafer clamp 7 is provided with two clamping claws 71 that are distributed vertically and extend toward the cleaning space 21, and a limiting groove 72 is provided on the side of the clamping claw 71 opposite to the other clamping claw 71.

[0041] The wafer clamp 7 of the present invention achieves clamping or releasing action through the clamping mechanism at the intersection of two clamping claws 71. The clamping mechanism causes the two clamping claws 71 to rotate in opposite directions through mechanical transmission. When the two clamping claws 71 move towards each other, the clamping claws 71 can hold the semiconductor wafer through the limiting groove 72 at the end, thereby clamping the semiconductor wafer and preventing it from falling. When the two clamping claws 71 move away from each other, the wafer clamp 7 releases the semiconductor wafer.

[0042] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A semiconductor cleaning apparatus, comprising a workbench (1) and a plurality of cleaning chambers (2), characterized in that, The cleaning chamber (2) is fixedly connected to the edge of the upper surface of the workbench (1) and is evenly distributed in a circle. The cleaning chamber (2) is hollow inside to form a cleaning space (21). The front side of the cleaning chamber (2) is provided with a cleaning inlet (22) that extends into the cleaning space (21). The left and right sides of the cleaning chamber (2) are provided with cleaning fluid connectors (23). One end of the cleaning fluid connector (23) is provided with a cleaning fluid interface (231), and the other end extends into the cleaning space (21) and is provided with several cleaning fluid nozzles (232). The cleaning fluid connector (23) is provided with a channel connecting the cleaning fluid interface (231) and the cleaning fluid nozzles (232). The bottom of the workbench (1) is provided with a recovery chamber (3). The bottom of the cleaning chamber (2) is provided with a fluid pipe (24) that communicates with the cleaning space (21) and extends into the recovery chamber (3). The cleaning chamber (2) is provided with a gas connector (25) at the top. The gas connector (25) is provided with a gas interface (251) at the top and extends into the cleaning space (21) at the other end and is provided with a number of gas nozzles (252). The gas connector (25) is provided with a channel connecting the gas interface (251) and the gas nozzles (252) inside. The bottom of the cleaning chamber (2) is provided with a rotary table (4), and the top edge of the rotary table (4) is provided with several robotic arms (5). The end of the robotic arm (5) away from the rotary table (4) is provided with a sealing cover (6) that matches the cleaning inlet (22), and the end of the sealing cover (6) near the cleaning inlet (22) is provided with a wafer clamp (7). An electric push rod (51) is provided between the end of the robotic arm (5) and the sealing cover (6). The fixed end of the electric push rod (51) is fixedly connected to the robotic arm (5), and the movable end is fixedly connected to the sealing cover (6). A rotary joint (52) is provided between the end of the robotic arm (5) and the fixed end of the electric push rod (51).

2. The semiconductor cleaning equipment according to claim 1, characterized in that, The recycling bin (3) is hollow inside and forms several independent recycling spaces (31). The recycling spaces (31) correspond one-to-one with the cleaning bin (2). A recycling port (32) is provided on one side of the recycling space (31). The recycling port (32) is connected to one of the fluid pipes (24). The top of the recycling bin (3) is provided with several exhaust holes (33) that penetrate to each recycling space (31).

3. The semiconductor cleaning equipment according to claim 2, characterized in that, Above the recycling bin (3) are several recycling pipes (34) that extend one by one into each recycling space (31), with the bottom of the recycling pipes (34) extending to near the bottom of the recycling space (31).

4. The semiconductor cleaning equipment according to claim 1, characterized in that, The edge of the cleaning inlet (22) is surrounded by a sealing gasket (26) that matches the sealing cap (6).

5. The semiconductor cleaning equipment according to claim 1, characterized in that, The cleaning chamber (2) is equipped with electromagnets (27) at the top and bottom. The electromagnets (27) are located near the top and bottom of the cleaning inlet (22). The sealing cover (6) is equipped with locking blocks (61) that match the electromagnets (27) at the top and bottom.

6. The semiconductor cleaning equipment according to claim 1, characterized in that, The wafer clamp (7) is provided with two clamping claws (71) that are distributed vertically and extend toward the cleaning space (21). The end of the clamping claw (71) is provided with a limiting groove (72) on one side opposite to the other clamping claw (71).

Images