Laser direct structuring antenna assembly for in vivo devices

Abstract

A laser direct structuring (LDS) antenna assembly for an in vivo device includes a carrier and one or more electrical contacts disposed on a first outer surface of the carrier and configured to electrically couple a PCB to a power source. The LDS antenna assembly also includes a helical antenna having a plurality of loops disposed on and coiled around the second outer surface of the carrier. The helical antenna includes a first feed connection configured to be connected to a first portion of the PCB and a second feed connection configured to be connected to a second portion of the PCB. The first feed connection and the second feed connection are configured to increase an impedance of the helical antenna. An antenna loop is embedded on the PCB and is configured to operate as one of the plurality of loops of the helical antenna to increase the electrical length of the helical antenna.

Description

Technical Field

[0001] The present disclosure relates generally to antennas, and more particularly to a helical antenna structure suitable for embedding within a compact in-vivo device. Background Art

[0002] Capsule endoscopy (CE) allows visual inspection of the entire gastrointestinal tract (GIT) using a swallowable capsule endoscope that captures images as it naturally passes through the GIT. For a typical CE procedure, a capsule approximately the size of a multivitamin is swallowed by the patient under the supervision of a health professional and the patient is provided with a wearable device, such as a sensor band, a recorder placed in a pouch, and a belt to be placed around the patient's shoulders. The wearable device typically includes a storage device. The capsule captures images as it naturally travels through the GIT. The images and additional data (e.g., metadata) are then transmitted to the recorder worn by the patient. The capsule is typically disposable and is naturally expelled with bowel movements. The procedure data (e.g., the captured images or a portion thereof and additional metadata) is stored on the storage device of the wearable device and downloaded to a computing device for processing.

[0003] The capsule may include an imaging device for imaging the GIT, a light source (e.g., one or more light emitting diodes ("LEDs")) for illuminating the GIT, a power source (e.g., a battery), and a radio frequency (RF) power transmitter coupled to an antenna for transmitting data (e.g., image data) to an external device, such as a recorder worn by the patient. Conventional swallowable capsules typically use linearly polarized antennas, which means that the polarization is confined to a single plane for the orientation of the electric field. Using such linearly polarized antennas to transmit data from a swallowable capsule is not without disadvantages. For example, as the capsule travels through the GIT, it must undergo many changes in direction of movement and spatial (3D) orientation, which may result in degradation of the performance of the communication channel between the capsule and the external device due to occasional misalignment between the capsule's antenna and the external device's receiving antenna. However, the small size of the swallowable capsule does not leave much room for a larger antenna, and the capsule battery may need to power the entire capsule for several hours (e.g., a typical CE procedure may last 7 to 10 hours). Therefore, increasing the transmission power of the capsule to reduce the communication gap may result in a reduction in the capsule's operating time (assuming that the power consumption of other components within the capsule remains unchanged).

[0004] To overcome some of the disadvantages of linearly polarized antennas, some capsule endoscopy systems employ helical antennas. Helical antennas can operate in two primary radiation modes – a normal mode and an axial mode. For very small helical antennas (e.g., helical antennas whose dimensions are much smaller than the radio frequency (“RF”) wavelength (λ) used), the maximum RF radiation occurs in a plane perpendicular to the axis of the helical antenna. This mode of operation is referred to as the “normal mode.” Typically, the RF radiation field produced by a normal mode helical antenna is elliptically polarized in all directions, although under certain conditions, the RF radiation field may be circularly polarized. Due to their small size compared to the RF wavelength, normal mode helical antennas are generally considered to have low efficiency and narrow bandwidth. Furthermore, in normal mode helical antennas, it may be difficult to achieve the desired input impedance for matching the input impedance to the feed line impedance (e.g., 50 ohms) due to limitations on the size of the antenna.

[0005] When the circumference of the helical antenna approaches the RF operating wavelength (λ), the helical antenna operates in an axial mode. This is a non-resonant traveling wave mode in which, instead of standing waves, current and voltage waves travel in one direction toward the helix. Under certain conditions, a helical antenna operating in an axial mode may also beneficially radiate RF waves having circular polarization along the axis of the antenna in a direction away from the end of the antenna. Circularly polarized waves are less susceptible to multipath fading and have less polarization dependence than linearly polarized waves. However, in contrast to the relatively small normal mode helical antenna, the relatively large size of the axial mode helical antenna makes it difficult to use the axial mode helical antenna in small devices such as swallowable devices (and other in vivo devices), implantable devices, and the like.

[0006] Although certain properties of helical antennas may be beneficial for in vivo or implantable devices, some disadvantages associated with such antennas need to be overcome in order to incorporate them into implantable or ingestible devices. Therefore, it would be beneficial to have an antenna structure that overcomes the above-mentioned disadvantages with respect to power consumption, size, and impedance matching. Summary of the invention

[0007] As used herein, terms including "typically," "about," "substantially," etc. are intended to encompass variations up to and including plus or minus 10%, such as manufacturing tolerances, material tolerances, usage and environmental tolerances, measurement variations, design variations, and / or other variations.

[0008] As used herein, "exemplary" does not necessarily mean "preferred," and may simply indicate an example. As used herein, the term "clinician" refers to any medical professional (e.g., physician, surgeon, nurse, etc.) or other user involved in the operation of the surgical systems described herein.

[0009] Although the present disclosure is not limited in this respect, discussions utilizing terms such as, for example, "processing," "computing," "determining," "establishing," "analyzing," "examining," and the like may refer to operations and / or processes of a computer, computing platform, computing system, or other electronic computing device that manipulate and / or transform data represented as physical (e.g., electronic) quantities within a computer's registers and / or memories into other data similarly represented as physical quantities within a computer's registers and / or memories or other non-transitory information storage media that may store instructions to perform the operations and / or processes.

[0010] According to various aspects of the present disclosure, a laser direct structuring (LDS) antenna assembly for an in-vivo device is provided. The LDS antenna assembly includes a carrier, a first metal trace, and a second metal trace. The first metal trace is disposed on a first outer surface of the carrier and includes one or more electrical contacts configured to be electrically coupled to a power source. The second metal trace is disposed on a second outer surface of the carrier, separated from the first metal trace. The second metal trace includes a plurality of loops that are coiled around the second outer surface of the carrier to form a helical antenna. The second metal trace also includes a first feed connection and a second feed connection. The first feed connection is connected to a first loop of the plurality of loops of the helical antenna, and the second feed connection is connected to a second loop of the plurality of loops of the helical antenna. The first feed connection and the second feed connection are configured to electrically couple the helical antenna to a radio frequency (RF) power transmitter.

[0011] In one aspect of the present disclosure, at least a portion of the second metal trace is disposed on an inner surface of the carrier.

[0012] In another aspect of the disclosure, the first feed connection and the second feed connection extend from a third outer surface of the carrier.

[0013] In another aspect of the disclosure, the first feed connection and the second feed connection are configured to increase an impedance of the helical antenna for enabling the helical antenna to receive signals from the RF transmitter.

[0014] In yet another aspect of the disclosure, the first feed connection and the second feed connection are configured to be electrically coupled to a printed circuit board (PCB) having an antenna loop configured to operate as one of the plurality of loops of the helical antenna.

[0015] In yet another aspect of the present disclosure, the antenna loop of the PCB is configured to increase an electrical length of the helical antenna.

[0016] In another aspect of the present disclosure, the helical antenna includes a first vertical step and a second vertical step. The first vertical step interconnects the first loop and the second loop of the plurality of loops and is configured to vertically space the first loop from the second loop. The second vertical step interconnects the second loop and the third loop of the plurality of loops to vertically space the second loop from the third loop.

[0017] In yet another aspect of the present disclosure, the plurality of loops are parallel to each other, and the first vertical step and the second vertical step are perpendicular to the plurality of loops.

[0018] In one aspect of the disclosure, the helical antenna includes a through hole received through the second outer surface of the carrier. The through hole is configured to couple the second feed connection to the second loop of the plurality of loops.

[0019] In another aspect of the present disclosure, the first metal trace includes a through-hole received through the first outer surface of the carrier. The through-hole is configured to electrically couple the one or more electrical contacts to a mounting member for mounting to a PCB.

[0020] In yet another aspect of the present disclosure, the first feed connection and the second feed connection are configured to be soldered to a PCB to electrically couple the helical antenna to the RF power transmitter.

[0021] The in-vivo imaging device provided according to the present disclosure includes a PCB, an RF transmitter electrically coupled to the PCB, a power supply configured to supply power to the PCB and the RF transmitter, and an LDS antenna assembly electrically coupled to the PCB and the RF transmitter. The LDS antenna assembly includes a carrier, one or more electrical contacts and a helical antenna. The one or more electrical contacts are arranged on a first outer surface of the carrier and are configured to electrically couple the power supply to the PCB. The helical antenna has a plurality of loops arranged on a second outer surface of the carrier and coiled around the second outer surface of the carrier. The helical antenna includes a first feed connection connected to a first portion of the PCB and a second feed connection connected to a second portion of the PCB. The first feed connection and the second feed connection are configured to increase the impedance of the helical antenna for enabling the RF transmitter to send or receive RF signals through the helical antenna. The in-vivo imaging device also includes an antenna loop, which is embedded on the PCB and is configured to operate as one of the plurality of loops of the helical antenna to increase the electrical length of the helical antenna.

[0022] In one aspect of the present disclosure, the power source includes at least one battery.

[0023] In another aspect of the present disclosure, the antenna loop embedded on the PCB includes a first feed point and a second feed point. The first feed point is configured to electrically interconnect the RF transmitter and the first feed connection of the helical antenna. The second feed point is configured to electrically interconnect the RF transmitter and the second feed connection of the helical antenna.

[0024] In yet another aspect of the present disclosure, the PCB includes a first connection pad and a second connection pad. The first connection pad is electrically coupled to the antenna loop and is configured to be soldered to the first feed connection of the helical antenna. The second connection pad is electrically coupled to the antenna loop embedded on the PCB and is configured to be soldered to the second feed connection of the helical antenna.

[0025] In still yet another aspect of the present disclosure, the first outer surface of the carrier includes at least one aperture therethrough, the at least one aperture configured to enable inspection of a portion of the PCB disposed beneath the LDS antenna assembly.

[0026] In another aspect of the disclosure, the helical antenna includes a through-hole received through the second outer surface of the carrier and configured to electrically couple the second feed connection to the plurality of loops.

[0027] In yet another aspect of the present disclosure, the second feed connection is electrically coupled to the via by a metallization trace disposed on an inner surface of the carrier.

[0028] In still yet another aspect of the present disclosure, the first feed connection and the second feed connection extend from a third outer surface of the carrier.

[0029] Another LDS antenna assembly for an in-vivo device provided according to the present disclosure includes a carrier, a PCB, one or more electrical contacts and a helical antenna. The one or more electrical contacts are disposed on a first outer surface of the carrier and are configured to electrically couple the PCB to a power source. The helical antenna has a plurality of loops disposed on a second outer surface of the carrier and coiled around the second outer surface of the carrier. The helical antenna includes a first feed connection configured to be connected to a first portion of the PCB and a second feed connection configured to be connected to a second portion of the PCB. The first feed connection and the second feed connection are configured to increase the impedance of the helical antenna. The LDS antenna assembly also includes an antenna loop, which is embedded on the PCB and is configured to operate as one of the plurality of loops of the helical antenna to increase the electrical length of the helical antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features of the present disclosure will become more apparent when the following detailed description is considered in conjunction with the accompanying drawings, wherein like reference numerals designate similar or identical elements.

[0031] Figure 1 An in vivo imaging system according to aspects of the present disclosure is shown;

[0032] Figure 2A and Figure 2B is a top perspective view of an LDS antenna assembly according to aspects of the present disclosure;

[0033] Figure 3A and Figure 3B According to various aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of an LDS antenna assembly;

[0034] Figure 4A and Figure 4B According to various aspects of the present disclosure Figure 2A and Figure 2B A bottom perspective view of the LDS antenna assembly;

[0035] Figure 5A According to various aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of a carrier of an LDS antenna assembly;

[0036] Figure 5B According to various aspects of the present disclosure Figure 2A and Figure 2B A bottom perspective view of a carrier of an LDS antenna assembly;

[0037] Fig. 6A According to various aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of a power contact portion of an LDS antenna assembly;

[0038] Figure 6B According to various aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of a helical antenna of an LDS antenna assembly;

[0039] Fig. 7A yes Figure 2A and Figure 2B A side perspective view of the power contacts, helical antenna and feed connections of the LDS antenna assembly;

[0040] Figure 7B According to various aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of a carrier of an LDS antenna assembly;

[0041] Fig. 8A is coupled to a PCB according to aspects of the present disclosure Figure 2A and Figure 2B A side perspective view of an LDS antenna assembly;

[0042] Figure 8B is coupled to the Fig. 8A PCB and power supply Figure 2A and Figure 2B A side view of an LDS antenna assembly;

[0043] Fig.9A and Fig. 9B is coupled to the Fig. 8A and Figure 8B The antenna traces and connection pads of the PCB Figure 2A and Figure 2B A bottom perspective view of the LDS antenna assembly;

[0044] Fig. 10A is coupled to the Fig.9A and Fig. 9B The antenna traces and connection pads Figure 2A and Figure 2B a bottom perspective view of the helical antenna of the LDS antenna assembly; and

[0045] Fig. 10B is coupled to the Fig.9A and Fig. 9B The antenna traces and connection pads Figure 2A and Figure 2B A side perspective view of the helical antenna of the LDS antenna assembly. DETAILED DESCRIPTION

[0046] According to aspects of the present disclosure, a laser direct structuring ("LDS") antenna assembly is provided for use with an in-vivo device, such as, for example, an ingestible capsule for a CE system. The LDS antenna assembly typically includes a three-dimensional ("3D") carrier and a helical antenna formed by metal traces applied to the carrier by an LDS process, whereby the metal traces may be directly transferred to the 3D surface of an injection molded structure by manipulation of a laser beam. Utilizing LDS technology makes the production process more efficient and enables the antenna design to be easily mass-produced for customer-specific tooling at a lower cost. The LDS technology may include injection molding of a thermoplastic material to form a 3D carrier, onto which the metal traces are deposited by a metallization process. Because it is difficult to adhere metal to a thermoplastic material, special treatment of the 3D carrier by laser facilitates the metallization process on the surface of the thermoplastic material. More specifically, by blending special chemical additives in the thermoplastic material prior to injection molding, laser activation can be used to initiate a chemical reaction to form very fine metal particles on the laser-treated surface of the injection-molded 3D carrier so that the deposited metal traces can properly adhere to the treated surface during the metallization process.

[0047] The disclosed LDS antenna assembly is configured to be received and housed within an in vivo device, such as, for example, a swallowable capsule of a CE system (see Figure 1 ). The LDS antenna assembly may be coupled to a printed circuit board (PCB) by any suitable method, including but not limited to surface mount technology (SMT). For example, the LDS antenna assembly may be a surface mount device (SMD) mounted directly on the surface of the PCB. In this regard, in some embodiments of the present disclosure, the PCB may be considered to be part of the LDS antenna assembly. The LDS antenna assembly may include a metallized helical antenna disposed on a carrier for transmitting signals from a radio frequency (RF) power transmitter housed within an in-vivo device and coupled to the PCB. The metallized helical antenna may include a plurality of loops (e.g., three loops) disposed on an outer surface of the carrier and coiled around the outer surface of the carrier. In various aspects of the present disclosure, at least a portion of the helical antenna may be disposed on an inner surface of a hollow interior of the carrier.

[0048] Small or compact in-vivo devices have only a small space to accommodate a communication antenna. Therefore, the size of the antenna embedded in such a small device must be on the order of millimeters, and when a helical antenna is used, the number of antenna turns is limited to a few turns of coil wire (e.g., three turns or less). Therefore, a helical antenna designed under the strict space constraints of such a small or compact device may have a very low impedance (e.g., 1 to 4 ohms). An antenna with such a low impedance may not be able to effectively interoperate with an RF power transmitter, for example because of increased power losses. To alleviate this problem, the disclosed helical antenna is constructed as an autotransformer having two antenna feed connections, which are connections on the helical antenna through which the RF transmitter transmits (or receives) RF signals. By controlling the position of the two antenna feed connections of the helical antenna relative to the PCB, the two antenna feed connections are used to increase the impedance of the helical antenna, thereby making the helical antenna suitable for operation with an RF power transmitter. In aspects of the present disclosure, the trace antenna may be embedded in a PCB to which the LDS antenna assembly is coupled and act as an additional loop for the helical antenna when the helical antenna is coupled to the PCB, further increasing the impedance of the helical antenna.

[0049] The LDS antenna assembly may also include a metallized electrical contact configured to contact a power source (e.g., a battery) for powering the PCB and / or the LDS antenna assembly. The power source may also be used to power other components within the in-vivo device and / or mounted on the PCB, such as, for example, an illumination source, an RF power transmitter, an imaging device, etc.

[0050] Those skilled in the art will appreciate that, although described in conjunction with an in vivo device of a CE system, the disclosed LDS antenna assembly may also be applicable to a variety of small and / or compact devices, such as, for example, implants, tools, toys, electronic devices, etc.

[0051] refer to Figure 1 , a block diagram of an exemplary in vivo imaging system 10 is shown as an example of a system in which the LDS antenna assembly of the present disclosure may be implemented. Figure 1 In the example shown, the in-vivo imaging system 10 generally includes an in-vivo imaging device 40, a receiver 12, and a workstation 13. The in-vivo imaging device 40 may be embodied as a swallowable capsule, such as Figure 1 , but other suitable implementations may also be used. FIG. 2A to FIG. 10AAs described in detail, the LDS antenna assembly of the present disclosure may be implemented as part of an in-vivo imaging device (e.g., imaging device 40), and is generally indicated throughout the drawings by reference numeral 100. Imaging device 40 includes power source 48 and PCB 50. Power source 48 may include one or more batteries or power cells. For example, power source 145 may include a silver oxide battery, a lithium battery, other suitable electrochemical battery with high energy density, etc. Other suitable power sources may be used. For example, power source 145 may receive power or energy from an external power source (e.g., an electromagnetic field generator), which may be used to send power or energy to imaging device 40. Imaging device 40 also includes one or more imagers 46 (e.g., two imagers—one on each side of imaging device 40) for capturing images in a body cavity (e.g., in the GIT), one or more illumination sources 42 for illuminating the body cavity, and RF transmitter 44, which may be positioned anywhere on PCB 50 and is configured to transmit images captured by imager 46 in-vivo (in the form of data frames) to receiver 12 using LDS antenna assembly 100. In aspects of the present disclosure, the RF transmitter 44 may be or include an RF power amplifier.

[0052] As described in detail below, power source 48 and PCB 50 may be electrically and physically coupled to LDS antenna assembly 100 such that LDS antenna assembly 100 electrically couples power source 48 to PCB 50. This arrangement serves to minimize the number of components within an in-vivo device in which LDS antenna assembly 100 is implemented.

[0053] The receiver 12 includes a storage unit 16 (e.g., a computer memory or hard drive) for storing image data received from the imaging device 40, and in various aspects, the receiver 12 can be portable and wearable on the patient's body during the reception (and recording) of images. The receiver 12 can transmit the image data originating from the imaging device 40 to the workstation 13. The workstation 13 can include or be connected to an image display device 18 for displaying images originating from the imaging device 40, etc.

[0054] The workstation 13 may include a data processor 14 and a storage unit 15. The storage unit 15 may be used to store image data received from the receiver 12. The data processor 14 may be configured to execute software instructions stored in the storage unit 15. The data processor 14 may be or include any standard data processor, such as a microprocessor, a multiprocessor, an accelerator board, or any other serial or parallel high performance data processor. The display device 18 may be a computer screen, a conventional video display, or any other device capable of providing images and / or other data.

[0055] During operation, images are captured by imager 46 and image data representing the images are transmitted by RF transmitter 44 using, for example, radio frequency (RF) waves via LDS antenna assembly 100 to receiver 12. Receiver 12 communicates the image data to workstation 13 for storage, processing and display.

[0056] Reference now FIG. 2A to FIG. 7B , an LDS antenna assembly 100 is shown and generally includes a carrier 110 having metal traces disposed thereon. In aspects of the present disclosure, the LDS antenna assembly 100 may include a first metal trace forming a power contact 150 and a second metal trace separate from the first metal trace forming a helical antenna 120. The carrier 110 includes a top outer surface 112a, a side outer surface 114a, and a bottom outer peripheral surface 116. In the examples shown throughout the figures, the carrier 110 is generally cylindrical, however, other suitable shapes (e.g., rectangular) are also contemplated. Figure 4A and Figure 4B As shown, the carrier 110 includes a hollow interior having a top inner surface 112b and a side inner surface 114b. The top inner surface 112b is the inner side of the top outer surface 112a, and the side inner surface 114b is the inner side of the side outer surface 114a. A pair of apertures 118a and 118b are formed through the top outer surface 112a and the top inner surface 112a of the carrier 110 and are used to allow visual inspection of the PCB 50 and / or components on the PCB 50 disposed below the carrier 110 once the LDS antenna assembly 100 is secured to the PCB 50 (see FIG. 8a).

[0057] The helical antenna 120 includes a plurality of antenna loops, including a first loop 122, a second loop 124, and a third loop 126, which are disposed on the side outer surface 114a of the carrier 110 and are coiled horizontally around the side outer surface of the carrier. The first loop 122 extends from a first mounting member 128 to a first vertical step 121. The first vertical step 121 interconnects and vertically extends between the first loop 122 and the second loop 124, so that the second loop 124 is parallel to the first loop 122 and is vertically spaced apart from the first loop around the entire outer side surface 114a of the carrier 110. The first mounting member 128 is metallized onto a first protrusion 104 extending from the bottom surface 116 of the carrier 110, so that the first mounting member 128 also protrudes from the bottom surface 116. The first mounting member 128 may be, for example, a conductive pin configured to be soldered to a connection pad 56 ( 9A to 10B). The second loop 124 extends from the first vertical step 121 to the second vertical step 123. The second vertical step 123 interconnects and extends vertically between the second loop 124 and the third loop 126, so that the third loop 126 is parallel to the second loop 124 and is vertically spaced apart from the second loop around the entire outer side surface 114a of the carrier 110. It will be appreciated that maximizing the vertical spacing between the loops 122, 124, 126 serves to minimize self-capacitance and / or proximity effect losses.

[0058] The second loop 124 of the helical antenna 120 includes a through hole 130 that extends through the aperture 102 ( Figure 5A and Figure 7B ) is received. The through hole 130 is coupled to a vertically extending antenna trace 132 disposed on the side inner surface 114b of the carrier 110. The antenna trace 132 interconnects the through hole 130 to a second mounting member 134. The second mounting member 134 is metallized onto a second protrusion 106 extending from the bottom surface 116 of the carrier 110 so that the second mounting member 134 also protrudes from the bottom surface 116. In various aspects of the present disclosure, the first mounting member 128 and the second mounting member 134 can be used as a first feed connection and a second feed connection of the helical antenna 120, respectively, for receiving RF power from the RF transmitter 44.

[0059] refer to 9A to 10B , an additional PCB antenna loop 52 (eg, a trace antenna) is embedded in the PCB 50 ( Fig. 8A and Figure 8B ), and is configured to be coupled to mounting members 128 and 134 of helical antenna 120 via connection pads 56 and 58, respectively, such that helical antenna 120 includes a total of four (4) loops (loops 122, 124, and 126 in addition to PCB antenna loop 52) to increase the effective electrical length and efficiency of helical antenna 120, thereby enabling a stronger signal from RF transmitter 44 to be transmitted from helical antenna 120.

[0060] The carrier 110 includes additional protrusions 103, 105, 107 ( Figure 5B ), which extends from the bottom surface 116 and is configured to receive (eg, by metallization) additional mounting members 125, 127, 129 thereon, respectively ( Figure 4A and Figure 4B ). The first and second mounting members 128, 134 and additional mounting members 125, 127, 129 are configured to be received within suitable holes "H" in the PCB 50, an example of which is shown in FIG. Fig. 8A50 and is secured (e.g., via soldering) to the connection pads of PCB 50 to couple LDS antenna assembly 100 to PCB 50. In various aspects of the present disclosure, any one or more of mounting members 125, 127, 128, 129, 134, and 164 may include a specific shape or configuration that is only suitable for fitting within a specific hole "H" in PCB 50 to indicate the radial orientation of LDS antenna assembly 100 on PCB 50 during assembly. This arrangement helps avoid errors when assembling LDS antenna assembly 100 on PCB 50. FIG. 4A to FIG. 5B In the example shown, the mounting members 127 and 164 include additional protrusions 127a and 164a, respectively, relative to the other mounting members 125, 128, 129, and 134. Figure 5B ), these additional protrusions 127a and 164a may be formed during metallization.

[0061] refer to FIG. 2A to FIG. 3B and Fig. 6A , the power contact portion 150 is disposed on the top outer surface 112a and includes electrical contacts 152, 154 and 156 interconnected by an intermediate portion 158 disposed between the apertures 118a, 118b. The electrical contacts 152, 154 and 156 are disposed on protrusions 115a, 115b and 115c extending from the top outer surface 112a of the carrier 110, respectively (FIG. 5a), such that the electrical contacts 152, 154 and 156 protrude outward from the top outer surface 112a to facilitate contact between the power contact portion 150 and the power source 48 ( Figure 8B ). The arrangement of the intermediate portion 158 and the electrical contacts 152, 154, and 156 branching from the intermediate portion 158 is used to provide a non-metallized portion 117 of the top outer surface 112a of the carrier 110 (e.g., an area between the contacts 154 and 156 and partially surrounded by the intermediate portion 158) to allow operation of the LDS antenna assembly 100 without requiring an operator to contact the metallized helical antenna 120 or the metallized power contact 150. The power contact 150 also includes a through hole 160 that is received by an aperture 113 extending through the top surfaces 112a, 112b of the carrier 110. The through hole 160 is interconnected with a third mounting member 164 via a vertically extending antenna trace 162 disposed on the side inner surface 114b of the carrier 110. The third mounting member 164 is metallized onto the third protrusion 108 extending from the bottom surface 116 of the carrier 110 , such that the third mounting member 164 also protrudes from the bottom surface 116 .

[0062] Reference now FIG. 8A to FIG. 10B, the LDS antenna assembly 100 is configured to be coupled to the PCB 50 ( Fig. 8A ) and Power Supply 48 ( Figure 8B ). The PCB 50 includes a first connection pad 56 configured to be coupled to the first mounting member 128 and a second connection pad 58 configured to be coupled to the second mounting member 134. The PCB 50 also includes a third connection pad 60 ( Fig.9A and Fig. 9B ), which is configured to be coupled to third mounting member 164. In various aspects of the present disclosure, mounting members 128, 134, 164 may be soldered to connection pads 56, 58, 60, respectively. First mounting member 128 and second mounting member 134 are coupled to connection pads 56, 58 of PCB 50, respectively, for enabling electrical communication between helical antenna 120 and PCB 50 and / or components mounted to PCB 50 (e.g., imager 46, illumination source 42, RF transmitter 44, etc.). When power source 48 is connected to electrical contacts 152, 154, 156, coupling of third mounting member 164 to connection pads 60 of PCB 50 is used to enable power to be delivered from power source 48 to PCB 50 and / or components mounted to PCB 50 (e.g., imager 46, illumination source 42, RF transmitter 44, etc.). The power source 48 may be biased toward the LDS antenna assembly 100 by a suitable mechanical arrangement, such as a spring (e.g., a conical spring) disposed within the imaging device 40 and configured to impart a spring force on the power source 48 toward the electrical contacts 152, 154, and 156 to maintain connection therebetween.

[0063] PCB 50 also includes a first feed point 54a coupled to PCB antenna loop 52 embedded in PCB 50 and a second feed point 54b electrically coupled to second mounting member 134 via connection pad 58. First feed point 54a and second feed point 54b are configured to electrically couple helical antenna 120 to an integrated circuit (not shown) mounted on PCB 50, and are configured to enable helical antenna 120 to transmit signals from transmitter 44 of in-vivo imaging device 40 to receiver 12 ( Figure 1 ).

[0064] Although not explicitly shown, RF transmitter 44 may be mounted on PCB 50 and include output terminals (not shown) electrically connected to first feed point 54a and second feed point 54b. First feed point 54a may be electrically connected to first mounting member 128 via connection pad 56, and second feed point 54b may be electrically connected to second mounting member 134 via connection pad 58. As described above, first mounting member 128 and second mounting member 134 may serve as first and second feed connections, respectively, for helical antenna 120 for receiving RF power from RF transmitter 44.

[0065] As described above, a helical antenna designed under the strict space constraints of a compact device such as imaging device 40 may have a very low impedance (e.g., 1 to 4 ohms). Antennas with such low impedance may not effectively interoperate with an RF power transmitter (e.g., RF transmitter 44), for example, because of increased power losses. To alleviate this problem, two antenna feed connections - first mounting member 128 and second mounting member 134 - are used as points on helical antenna 120 through which RF transmitter 44 transmits (or receives) RF signals. By electrically coupling first mounting member 128 and second mounting member 134 to PCB antenna loop 52 embedded in PCB 50, the helical antenna effectively includes four loops (e.g., loops 122, 124, 126, and 52) to increase the effective electrical length and efficiency of helical antenna 120. In this way, the impedance of helical antenna 120 is further increased, which enables a stronger signal from RF transmitter 44 to be transmitted from helical antenna 120.

[0066] It should be understood that the various aspects disclosed herein may be combined in combinations different from those specifically presented above and in the accompanying drawings. Although various aspects of the disclosure have been shown in the accompanying drawings, it is not intended to limit the disclosure to these aspects, as the disclosure is intended to be as broad as the art allows and the specification should be read in the same manner. Therefore, the above description should not be interpreted as limiting, but merely as an illustration of specific aspects. Those skilled in the art will be able to envision other modifications within the scope and spirit of the claims appended hereto.

Claims

1. A laser direct structuring (LDS) antenna assembly for an in vivo device, the LDS antenna assembly comprising: Carrier; a first metal trace disposed on a first outer surface of the carrier and comprising at least one electrical contact configured to be electrically coupled to a power source; A second metal trace, the second metal trace being disposed on a second outer surface of the carrier and being separated from the first metal trace, the second metal trace comprising: a plurality of loops coiled around the second outer surface of the carrier to form a helical antenna; a first feed connection connected to a first loop of the plurality of loops of the helical antenna; and A second feed connection is connected to a second loop of the plurality of loops of the helical antenna, the first feed connection and the second feed connection being configured to electrically couple the helical antenna to a radio frequency (RF) power transmitter. 2 . The LDS antenna assembly of claim 1 , wherein at least a portion of the second metal trace is disposed on an inner surface of the carrier. 3 . The LDS antenna assembly of claim 1 , wherein the first feed connection and the second feed connection extend from a third outer surface of the carrier.

4. The LDS antenna assembly of claim 1, wherein the first feed connection and the second feed connection are configured to increase an impedance of the helical antenna for enabling the helical antenna to receive signals from the RF transmitter.

5. The LDS antenna assembly of claim 1, wherein the first feed connection and the second feed connection are configured to be electrically coupled to a printed circuit board (PCB), the PCB having an antenna loop configured to operate as one of the plurality of loops of the helical antenna. 6 . The LDS antenna assembly of claim 5 , wherein the antenna loop of the PCB is configured to increase an electrical length of the helical antenna.

7. The LDS antenna assembly of claim 1, wherein the helical antenna comprises: a first vertical step interconnecting the first loop and the second loop of the plurality of loops and configured to vertically space the first loop from the second loop; and A second vertical step interconnects the second circuit and a third circuit of the plurality of circuits to vertically space the second circuit from the third circuit. 8 . The LDS antenna assembly of claim 7 , wherein the plurality of loops are parallel to each other, and the first vertical step and the second vertical step are perpendicular to the plurality of loops.

9. The LDS antenna assembly of claim 1, wherein the helical antenna includes a through hole received through the second outer surface of the carrier and configured to couple the second feed connection to the second loop of the plurality of loops.

10. The LDS antenna assembly of claim 1, wherein the first metal trace comprises a via received through the first outer surface of the carrier and configured to electrically couple the at least one electrical contact to a mounting feature for mounting to a PCB.

11. The LDS antenna assembly of claim 1, wherein the first feed connection and the second feed connection are configured to be soldered to a PCB to electrically couple the helical antenna to the RF power transmitter.

12. An in-vivo imaging device, comprising: Printed Circuit Board (PCB); a radio frequency (RF) transmitter electrically coupled to the PCB; a power supply configured to supply power to the PCB and the RF transmitter; An LDS antenna assembly, the LDS antenna assembly being electrically coupled to the PCB and the RF transmitter, the LDS antenna assembly comprising: Carrier; at least one electrical contact disposed on a first outer surface of the carrier and configured to electrically couple the power source to the PCB; and a helical antenna having a plurality of loops disposed on and winding around a second outer surface of the carrier, the helical antenna comprising a first feed connection connected to a first portion of the PCB and a second feed connection connected to a second portion of the PCB, wherein the first feed connection and the second feed connection are configured to increase an impedance of the helical antenna for enabling the RF transmitter to transmit or receive RF signals through the helical antenna; and An antenna loop is embedded on the PCB and is configured to operate as one of the plurality of loops of the helical antenna to increase the electrical length of the helical antenna.

13. The in-vivo imaging device of claim 12, wherein the power source comprises at least one battery.

14. The in-vivo imaging device of claim 12, wherein the antenna loop embedded on the PCB comprises: a first feed point configured to electrically interconnect the RF transmitter and the first feed connection of the helical antenna; and A second feed point is configured to electrically interconnect the RF transmitter and the second feed connection of the helical antenna.

15. The in-vivo imaging device of claim 12, wherein the PCB comprises: a first connection pad electrically coupled to the antenna loop embedded on the PCB and configured to be soldered to the first feed connection of the helical antenna; and A second connection pad is electrically coupled to the antenna loop embedded on the PCB and is configured to be soldered to the second feed connection of the helical antenna.

16. The in-vivo imaging device of claim 12, wherein the first outer surface of the carrier includes at least one aperture therethrough, the at least one aperture configured to enable inspection of a portion of the PCB disposed beneath the LDS antenna assembly.

17. The in vivo imaging device of claim 12, wherein the helical antenna includes a through hole received through the second outer surface of the carrier and configured to electrically couple the second feed connection to the plurality of loops.

18. The in-vivo imaging device of claim 17, wherein the second feed connection is electrically coupled to the via by a metallization trace disposed on an inner surface of the carrier.

19. The in-vivo imaging device of claim 12, wherein the first feed connection and the second feed connection extend from a third outer surface of the carrier.

20. A laser direct structuring (LDS) antenna assembly for an in-vivo device, the LDS antenna assembly comprising: Carrier; Printed Circuit Board (PCB); at least one electrical contact disposed on the first outer surface of the carrier and configured to electrically couple the PCB to a power source; and a helical antenna having a plurality of loops disposed on and winding around a second outer surface of the carrier, the helical antenna comprising a first feed connection configured to connect to a first portion of the PCB and a second feed connection configured to connect to a second portion of the PCB, wherein the first feed connection and the second feed connection are configured to increase an impedance of the helical antenna; and An antenna loop is embedded on the PCB and is configured to operate as one of the plurality of loops of the helical antenna to increase the electrical length of the helical antenna.

21. The LDS antenna assembly of claim 20, wherein at least a portion of the helical antenna is disposed on an inner surface of the carrier.

22. The LDS antenna assembly of claim 20, wherein the first feed connection and the second feed connection extend from a third outer surface of the carrier.

23. The LDS antenna assembly of claim 20, wherein the first feed connection and the second feed connection are configured to increase an impedance of the helical antenna for enabling the helical antenna to receive a signal from the RF transmitter connected thereto.

24. The LDS antenna assembly of claim 20, wherein the helical antenna comprises: a first vertical step interconnecting the first loop and the second loop of the plurality of loops and configured to vertically space the first loop from the second loop; and A second vertical step interconnects the second circuit and a third circuit of the plurality of circuits to vertically space the second circuit from the third circuit. 25 . The LDS antenna assembly of claim 24 , wherein the plurality of loops are parallel to each other, and the first vertical step and the second vertical step are perpendicular to the plurality of loops.

26. The LDS antenna assembly of claim 20, wherein the helical antenna includes a through hole received through the second outer surface of the carrier and configured to couple the second feed connection to the second loop of the plurality of loops.

27. The LDS antenna assembly of claim 20, wherein the at least one electrical contact comprises a through hole received through the first outer surface of the carrier and configured to electrically couple the at least one electrical contact to a mounting member for mounting the at least one electrical contact to the PCB.

28. The LDS antenna assembly of claim 20, wherein the first feed connection and the second feed connection are soldered to the PCB to electrically couple the helical antenna to an RF power transmitter.

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