Display module FPC conductive adhesive testing method

By setting open holes on the release film of the conductive adhesive, the resistance value detection of the conductive adhesive without tearing the film is achieved, and the problems of tape contamination and viscosity reduction in the test process in the prior art are solved, and the testing efficiency and conductive effect are improved .

CN119269583APending Publication Date: 2025-01-07GANZHOU TXO TECH CO LTD
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Patent Information

Application Number
CN202411416764.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-11
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

In the prior art, when manually tearing off the blue release film on the conductive adhesive to test the resistance, the tape is easily contaminated and the viscosity decreases, resulting in subsequent release film falling off, which cannot effectively protect the module, affecting the test results and efficiency.

Method used

Design a conductive adhesive test method. The conductive adhesive includes a body and a covered release film. There are holes on the release film to add holes according to the predetermined area. The test pen connects the exposed copper area of ​​the module FPC through the opening to detect Resistance value to avoid tearing and filming process.

Benefits of technology

The test process is simplified, production usability is improved, dirt problems during testing are reduced, testing efficiency is improved, and the conductive effect and anti-ESD interference function is ensured.

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Abstract

The invention discloses a display module FPC (flexible printed circuit) conductive adhesive testing method, which comprises the following steps: step 1, providing a conductive adhesive which comprises a body and a release film covering the body, the release film is provided with at least one hole, and one hole is correspondingly added when the area of the body is increased by a preset value, and the preset value is 15mm < 2 >-30mm < 2 >; step 2, attaching the prepared conductive adhesive to a corresponding position of a module PFC (Power Factor Correction); and step 3, a test meter pen is sequentially connected with the body at each hole and the copper exposure area of the module FPC, the resistance value between the body at each hole and the corresponding copper exposure area is detected, and whether the resistance value is qualified or not is judged. The conductive adhesive has the beneficial effects that the design and manufacturing process is simple, the conductive adhesive can be produced and used in a large scale, the working procedures of tearing and pasting the film when a worker performs testing can be reduced, the test efficiency can be improved, and the problems that the conductive adhesive body is dirty due to the fact that the release film falls off and the like can also be avoided.
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Description

Technical Field

[0001] The present invention relates to the technical field of display modules, and in particular to a method for testing FPC conductive adhesive of a display module. Background Art

[0002] At present, the performance requirements of the mobile phone and other industries are becoming more and more stringent. In order to meet the requirements of ESD protection and interference protection, the design of conductive tape will be added to the module FPC. The performance between the conductive tape and the exposed copper grounding determines the module's ability to prevent ESD and interference. In the existing test method, the blue release film on the conductive adhesive is usually manually torn off and the resistance is tested with a multimeter. Usually, the conductive tape or conductive adhesive grounding on the module FPC is required to be ≤5Ω. The blue release film on the conductive adhesive is manually torn off to test the resistance. After the blue release film is applied, the conductive tape will be contaminated and the viscosity will decrease, which is easy to cause the subsequent release film to fall off and fail to play a protective role.

[0003] Therefore, the prior art has defects and needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a method for testing the conductive adhesive of a display module FPC.

[0005] The technical solution of the present invention is as follows: The present invention provides a display module FPC conductive adhesive testing method, comprising the following steps: Step 1: Provide a conductive adhesive, the conductive adhesive comprises a body and a release film covering the body, the release film is provided with at least one opening, and an opening is added correspondingly for each predetermined value increase in the body area, and the predetermined value is 15mm 2 -30mm 2 ;

[0006] Step 2: Attach the prepared conductive adhesive to the corresponding position of the module PFC;

[0007] Step 3: Connect the test leads to the body at each opening and the exposed copper area of ​​the module FPC in turn, and detect the resistance between the body at each opening and the corresponding exposed copper area. When the resistance between the body at each opening and the corresponding exposed copper area is less than or equal to the standard value, it is qualified, otherwise it is unqualified.

[0008] Optionally, the predetermined value is 30 mm 2 .

[0009] Optionally, the predetermined value is 15 mm 2 .

[0010] Furthermore, the diameter of the opening is 0.3 mm-0.6 mm.

[0011] By adopting the above scheme, the beneficial effects of the present invention are: the design and production process are simple, it can be mass-produced and used, and the film tearing and film sticking steps when the staff are testing can be reduced, which helps to improve the test efficiency and avoid the occurrence of problems such as dirt caused by the falling off of the release film. DETAILED DESCRIPTION

[0012] The present invention is described in detail below in conjunction with specific embodiments.

[0013] In this embodiment, the present invention provides a display module FPC conductive adhesive testing method, comprising the following steps:

[0014] Step 1: Provide a conductive adhesive, which includes a body and a release film covering the body. The release film is provided with at least one opening, and one opening is provided for each predetermined value increase in the area of ​​the body. In this embodiment, the diameter of the opening is 0.5 mm, and the predetermined value is 30 mm. 2 In other embodiments of this solution, in order to obtain a higher standard test result, the predetermined value is also selected as 15mm. 2 .

[0015] Step 2: Attach the prepared conductive adhesive to the corresponding position of the module PFC.

[0016] Step 3: Connect the test probe to the main body of each opening and the exposed copper area of ​​the module FPC in turn, and detect the resistance between the conductive glue main body at each opening and the corresponding exposed copper area. Due to the existence of the opening, the test probe can easily contact the conductive glue main body without tearing off the release film. When the resistance between the main body of each opening and the corresponding exposed copper area is less than or equal to the standard value, it means that the resistance is qualified, and the conductive effect and anti-ESD interference function are good. If the resistance between the main body of any opening and the corresponding exposed copper area exceeds the standard value, it means that the conductive effect and anti-ESD interference function are unqualified.

[0017] In summary, the beneficial effects of the present invention are: the design and production process are simple, it can be mass-produced and used, and it can reduce the film tearing and film sticking steps when the staff conducts the test, which helps to improve the test efficiency and avoid the occurrence of problems such as dirt caused by the falling off of the release film.

[0018] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A display module FPC conductive adhesive testing method, characterized in that: The following steps are involved: Step 1: Provide a conductive adhesive, which includes a body and a release film covering the body, the release film is provided with at least one opening, and one opening is provided correspondingly for each predetermined value increase in the area of ​​the body, the predetermined value being 15mm 2 -30mm 2 ; Step 2: Attach the prepared conductive adhesive to the corresponding position of the module PFC; Step 3: Connect the test leads to the body at each opening and the exposed copper area of ​​the module FPC in turn, and detect the resistance between the body at each opening and the corresponding exposed copper area. When the resistance between the body at each opening and the corresponding exposed copper area is less than or equal to the standard value, it is qualified, otherwise it is unqualified.

2. The display module FPC conductive adhesive testing method according to claim 1, characterized in that: The preset value is 30mm 2 .

3. The display module FPC conductive adhesive testing method according to claim 1, characterized in that: The preset value is 15mm 2 .

4. The display module FPC conductive adhesive testing method according to any one of claims 1 to 3, characterized in that: The diameter of the opening is 0.3mm-0.6mm.