Thermal imaging temperature measurement dynamic scene device

Abstract

The invention relates to the technical field of thermal imaging equipment, and discloses a thermal imaging temperature measurement dynamic scene device which comprises a metal backboard and a base, one side of the metal backboard is fixedly connected with the base, and a main control board is fixedly installed on the surface of the metal backboard. The surface of the metal back plate is divided into three heating areas, and heat conduction hollow areas used for preventing the heating areas at different temperatures are arranged among the heating areas. The three heating areas are divided into the metal back plate, and the hollow areas are designed to prevent the heating areas at different temperatures from conducting heat; the first silica gel heating piece, the second silica gel heating piece and the third silica gel heating piece are attached to the areas, marked by laser, in the fan-shaped areas respectively, different temperatures are set through the main control board, so that a picture can have richer thermal scenes, and zero shielding, partial shielding and full shielding are achieved on the three heating areas in the rotating process of the metal fan blades; and shielding of different temperature areas realizes a dynamic temperature change scene in a thermal imaging picture.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal imaging equipment, and more specifically, to a thermal imaging temperature measurement dynamic scene device. Background Art

[0002] When current thermal imaging equipment is tested in a single temperature and low temperature difference scene for a long time, image adjustment abnormalities, temperature measurement offset and low bit rate will occur. Therefore, a dynamically changing temperature scene is needed to achieve dynamic temperature changes and the conversion between dynamic and static scenes.

[0003] The existing thermal imaging image testing devices mainly include the following solutions:

[0004] Existing solution 1: Use black fonts to place in the picture. The main drawbacks are: the picture is single and there is no dynamic scene;

[0005] Existing solution 2: placing leaves to increase richness, the main drawback is that the leaves have no heat and are not clear in the thermal imaging picture;

[0006] Existing Solution 3: Adding heat-generating sheets to the blades of low-speed blades has the main drawbacks of being unable to shield and expose temperature points in the image and being unable to simulate scenes without heat sources.

[0007] Therefore, we propose a thermal imaging temperature measurement dynamic scene device. Summary of the invention

[0008] In order to solve the problems raised in the above background technology, the present invention provides a thermal imaging temperature measurement dynamic scene device.

[0009] The present invention provides a thermal imaging temperature measurement dynamic scene device that adopts the following technical solutions:

[0010] A thermal imaging temperature measurement dynamic scene device, comprising a metal back plate and a base, one side of the metal back plate is fixedly connected to the base, the surface of the metal back plate is fixedly mounted with a main control board, the surface of the metal back plate is divided into three heating areas and a heat-conducting hollow area is opened between the heating areas to prevent heating areas of different temperatures from being heated;

[0011] The main control board is fixedly mounted on the surface of the metal back plate, the output end of the main control board is connected to the control end wire of the motor assembly, the main control board is used to control the movement of the motor assembly, the motor assembly is connected to the metal fan blade, and the motor assembly is used to provide power for the metal fan blade

[0012] Preferably, the surface of the heating area is adhered with a first silicone heating sheet, a second silicone heating sheet, and a third silicone heating sheet located in the laser marked area in a clockwise order.

[0013] Preferably, the hollow area includes hollow one, hollow two, and hollow three, the hollow two and hollow three are respectively opened between every two heating areas, and the hollow one is opened in a circle surrounding the three heating areas.

[0014] Preferably, the motor assembly includes a motor bracket, a motor, and a coupling. The mounting plate of the motor bracket is fixedly mounted on the surface of the metal back plate, the motor is mounted inside the motor bracket, the output shaft of the motor is transmission-connected with a coupling, and the other end of the coupling is transmission-connected with the metal fan blade.

[0015] Preferably, the input end of the main control board is electrically connected to the output end of the button, the input end of the main control board is electrically connected to the output ends of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3 respectively, the output end of the main control board is electrically connected to the digital tube, the output end of the main control board is electrically connected to the control end of the motor assembly, the output end of the main control board is connected to the RS485 interface end by wire, and the output end of the main control board is electrically connected to the control ends of the first silicone heating plate, the second silicone heating plate, and the third silicone heating plate respectively.

[0016] Preferably, the main control board includes an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip.

[0017] Preferably, the control method steps of the thermal imaging temperature measurement dynamic scene are as follows:

[0018] Step 1: The main control board is connected to a thermal imaging camera via the RS485 interface;

[0019] Step 2: The temperature of the corresponding heating area is collected by temperature sensor 1, temperature sensor 2, and temperature sensor 3, and transmitted to the MCU chip. The MCU chip controls the corresponding first silicone heating sheet, second silicone heating sheet, and third silicone heating sheet to start through heating drive module 1, heating drive module 2, and heating drive module 3, respectively, to heat the respective heating areas, so that the three heating areas are heated to different temperatures;

[0020] Step 3: Set the start, stop, low speed, medium speed and high speed options of the motor speed through the buttons. The buttons transmit the analog signals of the options to the MCU chip. The MCU chip uses four-phase eight-beat control of the motor. The start, stop, low speed, medium speed and high speed of the motor are adjusted by controlling the conversion of the four-phase level.

[0021] Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs it to the digital tube to display the motor speed level and the temperature in different areas;

[0022] Step 5. The level conversion signal is transmitted to the motor drive chip to control the motor speed or start and stop. The motor rotation drives the metal blades to rotate, so that the metal blades sequentially cover the rear heating area. When the first heating area is covered, only the second and third heating areas are shown in the picture. When the first and second heating areas are covered, only the third heating area is shown in the picture. After all are covered, there is no heating area in the picture. The first, second and third heating areas are exposed in turn during the continuous rotation. During the rotation process, due to the covering and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set at different temperatures, only high temperature / low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

[0023] In summary, the present invention includes the following beneficial technical effects:

[0024] The present invention divides the three heating areas into three heating areas through a metal back plate and designs a hollow area to prevent heat conduction in heating areas with different temperatures. The first silicone heating plate, the second silicone heating plate, and the third silicone heating plate are respectively attached to the areas marked by lasers in the fan-shaped areas. Different temperatures are set by the main control board to make the picture have richer thermal scenes. During the rotation of the metal fan blades, zero shielding, partial shielding, and full shielding are achieved for the three heating areas. The shielding of different temperature areas realizes a dynamic temperature change scene in the thermal imaging picture. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of the front three-dimensional structure in an embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of the front structure of an embodiment of the present invention;

[0027] Figure 3 It is a schematic diagram of a flow chart in an embodiment of the present invention.

[0028] Explanation of the accompanying drawings: 1. Metal back plate; 2. Hollow area; 21. Hollow one; 22. Hollow two; 23. Hollow three; 3. Heating area; 31. First silicone heating plate; 32. Second silicone heating plate; 33. Third silicone heating plate; 4. Motor assembly; 41. Motor bracket; 42. Motor; 43. Coupling; 5. Metal fan blades; 6. Base; 7. Main control board. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-3 The present invention is described in further detail.

[0030] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0031] The embodiment of the present invention discloses a thermal imaging temperature measurement dynamic scene device. Figure 1-3 A thermal imaging temperature measurement dynamic scene device comprises a metal back plate 1 and a base 6, one side of the metal back plate 1 is fixedly connected to the base 6, a main control board 7 is fixedly installed on the surface of the metal back plate 1, and the surface of the metal back plate 1 is divided into three heating areas 3 and a heat-conducting hollow area 2 is opened between the heating areas 3 to prevent the heating areas 3 of different temperatures from heating;

[0032] There are three heating areas 3, namely the first heating area, the second heating area, and the third heating area. The surfaces of the heating areas 3 are sequentially pasted with the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 located in the laser marked area in clockwise order.

[0033] The hollow area 2 includes a hollow 1 21, a hollow 22, and a hollow 3 23. The hollow 22 and the hollow 3 23 are respectively opened between every two heating areas 3, and the hollow 1 21 is opened in a circle around the three heating areas 3.

[0034] The hollow area 2 is arranged between the three heating areas 3, so as to effectively prevent the heating areas 3 with different temperatures from conducting heat;

[0035] A main control board 7 is fixedly mounted on the surface of the metal back plate 1. The output end of the main control board 7 is connected to the control end wire of the motor assembly 4. The main control board 7 is used to control the movement of the motor assembly 4. The motor assembly 4 includes a motor bracket 41, a motor 42, and a coupling 43. The mounting plate of the motor bracket 41 is fixedly mounted on the surface of the metal back plate 1. The motor 42 is mounted inside the motor bracket 41. The output shaft of the motor 42 is drivingly connected to the coupling 43. The other end of the coupling 43 is drivingly connected to the metal blade 5. The motor assembly 4 is connected to the metal blade 5. The motor assembly 4 is used to provide power for the metal blade 5.

[0036] The main control board 7 includes an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip. The heating drive module 1, the heating drive module 2, and the heating drive module 3 are respectively connected to the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33, so that the MCU chip controls the heating of the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33. The input end of the main control board 7 is electrically connected to the output end of the key, and the input end of the main control board 7 is electrically connected to the output end of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3, respectively. The output end of the main control board 7 is electrically connected to the digital tube, and the output end of the main control board 7 is electrically connected to the control end of the motor assembly 4. The output end of the main control board 7 is connected to the RS485 interface end by wire, and the output end of the main control board 7 is electrically connected to the control end of the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33;

[0037] Specifically, the main control board 7 controls the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 to heat the corresponding heating areas 3, so that the three heating areas 3 transmit the temperatures in the corresponding three heating areas 3 to the main control board 7 through the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3, and controls the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 to heat the corresponding heating areas 3 to different temperatures, so that the video screen has richer thermal scenes, and then the main control board 7 controls the motor 42 to start and drive the coupling 43 to rotate, and the coupling 43 rotates to drive the metal fan blades 5 to rotate, and the three heating areas 3 are zero-blocked, partially blocked, and fully blocked. The blocking of different temperature areas realizes a dynamic temperature change scene in the thermal imaging screen;

[0038] Through the above structural design, the effect of long-term dynamic temperature change scene is achieved;

[0039] Control method steps for dynamic scenes of thermal imaging temperature measurement:

[0040] Step 1: The main control board is connected to a thermal imaging camera via the RS485 interface;

[0041] Step 2: The temperature of the corresponding heating area 3 is collected by temperature sensor 1, temperature sensor 2, and temperature sensor 3, and transmitted to the MCU chip. The MCU chip controls the corresponding first silicone heating sheet 31, second silicone heating sheet 32, and third silicone heating sheet 33 to start through heating drive module 1, heating drive module 2, and heating drive module 3, respectively, to heat the respective heating areas 3, so that the three heating areas 3 are heated to different temperatures;

[0042] Step 3: Set the start, stop, low speed, medium speed and high speed options of the motor speed through the buttons. The buttons transmit the analog signals of the options to the MCU chip. The MCU chip uses four-phase eight-beat to control the motor speed. The start, stop, low speed, medium speed and high speed of the motor speed are adjusted through the conversion interval of the four-phase level.

[0043] Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs it to the digital tube to display the motor speed level and the temperature in different areas;

[0044] Step five, the MCU chip transmits 4-phase high and low electrical signals to the motor driver chip to control the rotation of the motor. The rotation of the motor drives the metal blades to rotate, so that the metal blades sequentially cover the rear heating area. When the first heating area is covered, only the second and third heating areas are in the picture. When the first and second heating areas are covered, only the third heating area is in the picture. After all the heating areas are covered, there is no heating area in the picture. The first, second and third heating areas are exposed in turn during the rotation process. During the rotation process, due to the covering and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set at different temperatures, only high temperature or low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

[0045] Finally, a few points should be explained: First, in the description of the present invention, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0046] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0047] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal imaging temperature measurement dynamic scene device, comprising a metal back plate (1) and a base (6), characterized in that: A base (6) is fixedly connected to one side of the metal back plate (1); a main control board (7) is fixedly mounted on the surface of the metal back plate (1); the surface of the metal back plate (1) is divided into three heating areas (3) and a heat-conducting hollow area (2) is provided between the heating areas (3) to prevent heating areas (3) of different temperatures from being heated; A main control board (7) is fixedly mounted on the surface of the metal back plate (1); an output end of the main control board (7) is connected to a control end of a motor assembly (4) by wires; the main control board (7) is used to control the movement of the motor assembly (4); the motor assembly (4) is connected to a metal fan blade (5); and the motor assembly (4) is used to provide power to the metal fan blade (5).

2. A thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: A first silicone heating sheet (31), a second silicone heating sheet (32), and a third silicone heating sheet (33) located in the laser marked area are adhered to the surface of the heating area (3) in clockwise order.

3. A thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The hollow area (2) comprises a hollow area 1 (21), a hollow area 2 (22), and a hollow area 3 (23); the hollow area 2 (22) and the hollow area 3 (23) are respectively arranged between every two heating areas (3); and the hollow area 1 (21) is arranged in a circle around the three heating areas (3).

4. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The motor assembly (4) comprises a motor bracket (41), a motor (42), and a coupling (43); the mounting plate of the motor bracket (41) is fixedly mounted on the surface of the metal back plate (1); the motor (42) is mounted inside the motor bracket (41); the output shaft of the motor (42) is drivingly connected to the coupling (43); and the other end of the coupling (43) is drivingly connected to the metal fan blade (5).

5. A thermal imaging temperature measurement dynamic scene device according to claim 4, characterized in that: The input end of the main control board (7) is electrically connected to the output end of the key, the input end of the main control board (7) is electrically connected to the output ends of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3 respectively, the output end of the main control board (7) is electrically connected to the digital tube, the output end of the main control board (7) is electrically connected to the control end of the motor assembly (4), the output end of the main control board (7) is connected to the RS485 interface end by wire, and the output end of the main control board (7) is electrically connected to the control ends of the first silicone heating plate (31), the second silicone heating plate (32), and the third silicone heating plate (33).

6. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The main control board (7) comprises an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip.

7. A thermal imaging temperature measurement dynamic scene device according to claims 1-6, characterized in that: The control method steps of the thermal imaging temperature measurement dynamic scene: Step 1: The main control board is connected to a thermal imaging camera via the RS485 interface; Step 2: The temperature of the corresponding heating area (3) is collected by the temperature sensor 1, the temperature sensor 2 and the temperature sensor 3 respectively, and transmitted to the MCU chip; the MCU chip controls the corresponding first silicone heating sheet (31), the second silicone heating sheet (32) and the third silicone heating sheet (33) to start respectively through the heating drive module 1, the heating drive module 2 and the heating drive module 3, and heats the heating area (3) respectively, so that the three heating areas (3) are heated to different temperatures; Step 3: Set the start, stop, low speed, medium speed and high speed options of the motor speed through the buttons. The buttons transmit the analog signals of the options to the MCU chip. The MCU chip uses four-phase eight-beat control of the motor. The motor start, stop, low speed, medium speed and high speed are adjusted by controlling the conversion of the 4-phase pin level. Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs it to the digital tube to display the motor speed level and the temperature in different areas; Step five, four-phase level signals are transmitted to the motor drive chip to control the motor speed or start and stop. The rotation of the motor drives the metal blades to rotate, so that the metal blades cover the rear heating area in turn. When the first heating area is covered, only the second and third heating areas are in the picture. When the first and second heating areas are covered, only the third heating area is in the picture. After all the heating areas are covered, there is no heating area in the picture. The first, second and third heating areas are exposed in turn during the rotation process. During the rotation process, due to the covering and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set at different temperatures, only high temperature / low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

Images