Method and system for manufacturing electronic interface including array of fine needles

Abstract

There is provided a processing system comprising a substrate (80); an array of fine needles (81-85) on the substrate; a holding member (12) that holds the substrate; an electrolyte tank (21) configured to receive an electrolyte; at least one electrode plate (22-26) is located in the electrolyte tank; an actuator module (30) configured to move the array of fine needles held on the holder relative to the electrolyte bath; the measurement module (40) is used for detecting the positions of the fine needles in the electrolyte and generating measurement data according to the detection result, and the movement of the fine needle array is controlled according to the measurement data; and a power supply module (60) configured to apply current to the electrode plate and the fine needle array. The processing system can achieve the purpose of mass and rapid production.

Description

[0001] Priority claim

[0002] This application claims priority to U.S. Provisional Application No. 63 / 344,047, filed on May 20, 2022, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure relate to a system and method for fabricating an electronic interface having a fine needle array.

[0004] Prior Art

[0005] Electrochemical machining (ECM) has become a viable method for machining components in many modern industrial applications, especially when manufacturing components made of difficult-to-machine materials and with complex structures. ECM is a machining method that changes the shape of a workpiece by removing material from it through electrochemical dissolution. In ECM machining, a high current is passed between an electrode and the part, and material removal is performed using a negatively charged electrode (cathode), a conductive liquid (electrolyte), and an electrolyte material that is conductive to the workpiece (anode). At the anode surface, the surface metal is oxidized and dissolved in the electrolyte, causing the shape change. At the cathode, a reduction reaction occurs that usually produces hydrogen gas. The electrolyte carries away the metal hydroxides formed during machining.

[0006] The current electrochemical machining process can only process a single workpiece at a time, which cannot achieve the purpose of mass and rapid production. Therefore, it is expected to develop an electrochemical removal method that can avoid the above problems. Summary of the invention

[0007] One aspect of the present disclosure provides a processing system. The processing system includes: a substrate; a fine needle array located on the substrate; a holder configured to hold the substrate; an electrolyte tank configured to receive an electrolyte; at least one electrode plate located in the electrolyte tank; an actuator module configured to move the fine needle array held on the holder relative to the electrolyte tank; a measurement module configured to detect the position of the fine needle in the electrolyte and generate measurement data based on the detection result, wherein the movement of the fine needle array is controlled based on the measurement data; and a power module configured to apply current to the electrode plate and the fine needle array.

[0008] Another aspect of the present disclosure provides an electronic interface. The electronic interface includes: a substrate having a lower surface and an edge surrounding the lower surface; and a fine needle array located on the lower surface of the substrate, wherein each fine needle contains a conductive material and has a conical end away from the lower surface of the substrate, wherein the fine needle array includes: a first fine needle positioned around the center of the lower surface, and the lower end of the first fine needle has a first cone angle; a second fine needle disposed adjacent to the edge of the substrate, and the lower end of the second fine needle has a second cone angle, and the second cone angle is smaller than the first cone angle.

[0009] Another aspect of the present disclosure provides a processing method. The processing method includes: moving a fine needle array into an electrolyte received in an electrolyte tank; generating measurement data related to the position of the fine needles in the electrolyte; and when the measurement data meets a preset standard, applying a current to the fine needle array and an electrode plate in the electrolytic tank to change the shape of each fine needle by an electrochemical processing process.

[0010] The above summary is not intended to describe each embodiment or every implementation of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The various aspects of the embodiments of the present invention can be better understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, according to standard industrial practice, various structures are not drawn to scale. In fact, the dimensions of various structures may be arbitrarily increased or reduced for clarity of discussion.

[0012] Figure 1 A block diagram of a processing system according to one or more embodiments of the present disclosure is presented.

[0013] Figure 2 A schematic cross-sectional view of a processing system according to one or more embodiments of the present disclosure is shown.

[0014] Figure 3 Shown is a schematic view of a reaction zone in accordance with one or more embodiments of the present disclosure.

[0015] Figure 4 A top view of a reaction zone connected to a power module according to one or more embodiments of the present disclosure is shown.

[0016] Figure 5 A top view of an electronic interface before processing according to one or more embodiments of the present disclosure is shown.

[0017] Figure 6 Shown Figure 5 Side view of the electronic interface.

[0018] Figure 7 Shown Figure 6 A cross-sectional view of one of the plurality of needles shown.

[0019] Figure 8 A flow chart of a method for machining an electronic interface in various aspects according to one or more embodiments of the present disclosure is presented.

[0020] Fig. 9 A schematic diagram illustrating a stage in a method of performing electrochemical machining in which an array of fine needles is moved into contact with an electrolyte surface is shown.

[0021] Fig.10 Shown Fig. 9 Schematic diagram of the relative relationship between the tip of a fine needle and the electrolyte during operation, wherein the tip of one fine needle is not immersed in the electrolyte.

[0022] Fig.11 A schematic view illustrating a stage in a method of performing electrochemical machining in which an array of fine needles is placed at predetermined locations within an electrolyte bath is shown.

[0023] Fig.12 A schematic diagram showing the formation of a passivation layer at the interface between the fine needle and the electrolyte after a period of electrochemical processing.

[0024] Fig.13 A schematic view illustrating a stage of a method of performing electrochemical machining in which an array of fine needles is lifted is shown.

[0025] Fig.14 A schematic view illustrating a stage in a method of performing electrochemical machining, in which an array of fine needles is removed from an electrolyte bath, is shown.

[0026] Fig.15 A schematic view illustrating a stage in a method of performing electrochemical machining in which a fine needle array is rotated to face an image capture assembly is shown.

[0027] Fig.16 A schematic diagram of an electronic interface after processing according to one or more embodiments of the present disclosure is shown.

[0028] Fig.17 Shown is a schematic view of a reaction zone in accordance with one or more embodiments of the present disclosure.

[0029] Fig.18 Schematic views of electrode plates according to one or more embodiments of the present disclosure are shown.

[0030] Fig.19 Schematic views of electrode plates according to one or more embodiments of the present disclosure are shown.

[0031] Fig. 20A schematic view illustrating a stage in a method of performing electrochemical machining in which an array of fine needles is inserted into an electrode plate within an electrolyte bath is shown.

[0032] Fig.21 A flow chart of a method for machining an electronic interface in various aspects according to one or more embodiments of the present disclosure is presented.

[0033] Fig. 22 A schematic diagram of an electronic interface after processing according to one or more embodiments of the present disclosure is shown.

[0034] Fig.23 A schematic diagram of an electronic interface before processing according to one or more embodiments of the present disclosure is shown.

[0035] Fig.24 A flow chart of a method for machining an electronic interface in various aspects according to one or more embodiments of the present disclosure is presented.

[0036] Fig.25 A schematic diagram of an electronic interface after processing according to one or more embodiments of the present disclosure is shown.

[0037] Implementation

[0038] The following detailed description should be read with reference to the accompanying drawings, in which similar elements in different drawings are numbered the same. The detailed description and the accompanying drawings, which are not necessarily drawn to scale, depict exemplary embodiments and are not intended to limit the scope of the invention. The depicted exemplary embodiments are intended to be illustrative only. Selected features of any exemplary embodiment may be incorporated into additional embodiments unless expressly stated otherwise.

[0039] The terms used in this specification are intended to describe specific embodiments and are not intended to be limiting. The terms "a", "an", and "said" also include plural forms unless otherwise expressly indicated. When used in this specification, the terms "include" and / or "comprise" specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components.

[0040] Additionally, for ease of description, spatially relative terms, such as "below," "beneath," "below," "above," "on," "on," and the like may be used herein to describe the relationship of one element or feature to another element or feature(s), as shown in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0041] Figure 1 A block diagram of a processing system 1 according to one or more embodiments of the present disclosure is shown. According to some embodiments, the processing system 1 is configured to perform electrochemical processing on a workpiece and includes a processing assembly 3 and an operating station 7. The workpiece to be processed in the present disclosure may be an electronic interface, which is used as a probe card in a semiconductor testing process. In some embodiments, the electronic interface includes a microneedle array having a width of about 5 μm to about 500 μm. It should be understood that although the embodiments of the present disclosure disclose a system for processing an electronic interface, the present disclosure should not be limited thereto. The system and method can be used to process any workpiece that can initiate an oxidation reaction and / or a reduction reaction in an electrochemical process.

[0042] The processing assembly 3 is where manufacturing is performed, and includes a processing tool 10, a reaction area 20, an actuator module 30, a measurement module 40, an optical detection module 50, and a power module 60. The operation station 7 is used to control and monitor the operation of the processing assembly 3. The operation station 7 may include a processor 71, a memory 72, a controller 73, an input / output interface 74 (hereinafter referred to as "I / O interface"), a communication interface 75, and a power supply 76.

[0043] In some embodiments, the processing tool 10 includes a platform 11, a holder 12, a protective shell 13, and an exhaust member 14. The platform 11 is used to support the holder 12. Figure 2As shown, in an exemplary embodiment, the platform 11 includes a frame 114, a horizontal arm 112, and a vertical arm 113. The actuator 31 of the actuator module 30 is fixed to the top of the frame 114, and a ball screw 111 is connected to the actuator 31 and extends in the frame 114. The ball screw 111 is used to drive the horizontal arm 112 to move in the vertical direction (Z-axis direction). In addition, the actuator 32 of the actuator module 30 is fixed to the horizontal arm 112 to drive the vertical arm 113 to move in the horizontal direction (X-axis and / or Y-axis direction). In addition, the actuator 33 of the actuator module 30 is fixed at a pivot 115, and the pivot 115 connects the horizontal arm 112 and the vertical arm 113. The lower end of the vertical arm 113 is connected to the holder 12. When the actuator 33 is driven, the holder 12 rotates around the pivot 115. The platform 11 is disposed on the protective shell 13 , and the exhaust member 14 is installed on the top of the protective shell 13 to exhaust the gas generated in the electrochemical process.

[0044] The reaction zone 20 is placed below the holder 12 . Figure 3 shows a schematic view of a reaction zone 20 according to one or more embodiments of the present disclosure, and Figure 4 A top view of the reaction zone 20 is shown. In some embodiments, the reaction zone 20 includes an electrolyte tank 21, a plurality of electrode plates, such as electrode plates 22, 23, 24, 25 and 26. The electrolyte tank 21 may have a rectangular shape, with four lateral side walls 212, 213, 215 and 216 and a bottom wall 214. The electrolyte tank 21 defines an internal space for accommodating an electrolyte, and the top of the electrolyte tank 21 is formed with an open end. The electrode plates 22, 23, 24, 25 and 26 are located in the internal space of the electrolyte tank 21 and are connected to the inner surface of the wall of the electrolyte tank 21. Specifically, the electrode plates 22 and 23 are connected to the lateral side walls 212 and 213 opposite to each other. The electrode plates 25 and 26 are connected to the lateral side walls 215 and 216 opposite to each other. The electrode plate 24 is connected to the bottom wall 214. The electrode plates 22, 23, 24, 25 and 26 are made of a material having rust and corrosion resistance properties. For example, the electrode plates 22 , 23 , 24 , 25 and 26 may be made of stainless steel, but the present disclosure should not be limited thereto. More electrode plates arranged in different directions from the electrode plates 22 , 23 , 25 and 26 may be provided in the electrolyte tank 21 .

[0045] In some embodiments, electrode plates 22, 23, 24, 25 and 26 are electrically connected to a power module 60 to act as a cathode in an electrochemical process. The power module 60 is a DC power source and may include a power pulse generator configured to independently control the current supply to the electrode plates 22, 23, 24, 25 and 26. For example, electrode plates 22, 23 are electrically connected to the power module 60 via a wire, electrode plates 25, 26 are electrically connected to the power module 60 via another wire, and electrode plate 24 is electrically connected to the power module 60 via another wire. The pulse pattern of the current applied to electrode plates 22 and 23 is not the same as the pulse pattern of the current applied to electrode plates 25 and 26.

[0046] In some embodiments, during the electrochemical process, the power module 60 alternately applies current to the electrode plates 22 and 23 and the electrode plates 25 and 26. For example, the current applied to the electrode plates 22 and 23 is in an off state, while the current applied to the electrode plates 25 and 26 is in an on state. The pulse frequency of the current applied to the electrode plate 24 may be different from the pulse frequency of the current applied to the electrode plates 22, 23, 25 and 26. In some embodiments, the pulse frequency of the current applied to the electrode plate 24 is less than the pulse frequency of the current applied to the electrode plates 22, 23, 25 and 26. In some other embodiments, the power module 60 continuously applies current to the electrode plate 24 during the electrochemical process.

[0047] In some embodiments, Figure 2 As shown, the reaction zone 20 further includes a transducer 27. The transducer 27 is located in the inner space of the electrolyte tank 21. The transducer 27 may be an ultrasonic transducer, which converts electrical energy into mechanical (acoustic) energy and back again based on the piezoelectric effect. The electrolyte in the electrolyte tank 21 may vibrate in the electrochemical process by means of the transducer 27.

[0048] Reference Figure 2 The optical inspection module 50 is configured to capture images of a workpiece in the machining system 1 before, during, or after electrochemical machining. In some embodiments, the optical inspection module 50 includes a plurality of image capture components, such as image capture components 51 and 52.

[0049] The image capture assembly 51 is disposed below the reaction zone 20 and is configured to capture an image of a workpiece processed in the reaction zone 20. The electrode plate 24 is disposed on the bottom wall 214 ( Figure 3), the electrode plate 24 is located between the image capture component 51 and the holder 12 (or the workpiece held by the holder). In some embodiments, in order to facilitate the image capture component 51 to observe the workpiece, the electrode plate 24 is made of a transparent conductive oxide, such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), niobium-doped anatase TiO2 (NTO) or doped zinc oxide.

[0050] The image capture assembly 52 is located above the reaction area 20 and is configured to capture an image of the workpiece after the workpiece is removed from the reaction area 20. In some embodiments, the image capture assembly 52 is fixed to the side wall of the protective shell 13 and is located higher than the reaction area 20. In some embodiments, the light incident surface of the image capture assembly 52 is arranged vertically (i.e., arranged parallel to the Z axis). Data related to the images captured by the image capture assembly 51 and the image capture assembly 52 can be transmitted to the operation station 7 for further analysis.

[0051] Reference Figure 5-7 According to some embodiments of the present disclosure, the workpiece to be processed in the processing system 1 is an electronic interface 8. The electronic interface 8 is a part of a probe card used in a semiconductor test tool (not shown in the figure). In some embodiments, the electronic interface 8 includes a substrate 80 and an array of fine needles, such as fine needles 81, 82, 83, 84 and 85. The substrate 80 has a lower surface 801 and four edges 802 surrounding the lower surface 801. The fine needle 83 is located at the center C of the lower surface 801, and the fine needles 81 and 85 are located adjacent to the two edges 802. The fine needle 82 is located between the fine needles 81 and 83, and the fine needle 84 is located between the fine needles 83 and 85. The fine needles 81, 82, 83, 84 and 85 can be arranged along a straight line, which is perpendicular to the edge 802 or inclined relative to the edge, or can be arranged along the diagonal line of the lower surface 801.

[0052] The fine needles 81, 82, 83, 84 and 85 are arranged in a matrix pattern on the lower surface 801 of the substrate 80. Although in the embodiment of the accompanying drawings, there are 25 fine needles arranged in a 5×5 matrix on the substrate 80, the present disclosure is not limited to this embodiment. The electronic interface can accommodate any number of fine needles. In an exemplary embodiment, 1200 fine needles are provided on the substrate 80. The fine needles 81, 82, 83, 84 and 85 can be fixed to the lower surface 801 of the substrate 80 by any suitable method. For example, the fine needles 81, 82, 83, 84 and 85 can be fixed to the substrate by welding, bonding, fastening, etc.

[0053] In some embodiments, at least one of the fine needles 81, 82, 83, 84 and 85 comprises a composite structure. For example, the fine needle 85 extends along a longitudinal axis L perpendicular to the lower surface 801 of the substrate 80. The fine needle 85 includes an inner portion 8501 and an outer portion 8502. The outer portion 8502 is farther from the longitudinal axis L than the inner portion 8501. The inner portion 8501 and the outer portion 8502 are formed by different conductive materials. In some embodiments, the conductivity of the outer portion 8502 is greater than the conductivity of the inner portion 8501. In addition or alternatively, the hardness of the outer portion 8502 is less than the hardness of the inner portion 8501. With such a configuration, the fine needle 85 provides optimal conductivity without compromising its structural strength. In an exemplary embodiment, the inner portion 8501 includes tungsten (W), and the outer portion 8502 includes molybdenum (Mo). The substrate 80 can be made of conductive materials such as aluminum, stainless steel, etc. The fine needles 81, 82, 83, 84 and 85 are electrically connected to the substrate 80. When the substrate 80 is connected to the power module 60, the fine needles 81, 82, 83, 84 and 85 are energized and act as anodes in the electrochemical process.

[0054] Reference Figure 2 , the measurement module 40 is configured to monitor at least one parameter in the processing system 1 in real time. In some embodiments, the measurement module 40 is positioned in the processing assembly 3 and can provide real-time monitoring of the movement of the holder 12 (or the electronic interface 8 when it is mounted on the holder 12). For example, the measurement module 40 is connected to the actuator 31 for driving the holder 12 to move along the Z-axis direction, and includes a detector that can be used to detect force changes of the actuator 31. The measurement module 40 may include a strain gauge to measure the tension or compression of the ball screw 111. Alternatively, the measurement module 40 may include a pressure gauge to measure the pressure applied to the ball screw 111 by the actuator 31. Historical data representing force changes under normal and successful conditions are recorded in the memory 72 of the operation station 7. The processor 71 of the operation station 7 can perform abnormal diagnosis by comparing and analyzing historical data.

[0055] Reference again Figure 1 , the processor 71 may include any processing circuit system operable to process the measurement data generated by the measurement module 40 to determine whether an abnormality occurs. In various aspects, the processor 71 may be implemented as a general-purpose processor, a chip multiprocessor (CMP), a special-purpose processor, an embedded processor, a digital signal processor (DSP), a network processor, an input / output (I / O) processor, a media access control (MAC) processor, a radio baseband processor, a coprocessor, a microprocessor (e.g., a complex instruction set computer (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor and / or a very long instruction word (VLIW) microprocessor) or other processing devices.

[0056] In some embodiments, the memory 72 may include any machine-readable or computer-readable medium capable of storing data, including both volatile / non-volatile memory and removable / non-removable memory capable of storing one or more software programs. The software program may include, for example, an application program, user data, device data and / or configuration data, file data related to environmental parameters, or a combination thereof. The software program may include instructions that can be executed by various components of the operator station 7. For example, the memory 72 may include a read-only memory (ROM), a random access memory (RAM), a dynamic RAM (DRAM), a disk storage (e.g., a floppy disk, a hard drive, an optical disk, a magnetic disk) or a card (e.g., a magnetic card, an optical card) or any other type of medium suitable for storing information. In one embodiment, the memory 72 may include an instruction set stored in any acceptable form of machine-readable instructions. The instruction set may include a series of operations after an abnormality is found in the processing system 1 based on the signal obtained by the measurement module 40.

[0057] The controller 73 is configured to control one or more elements of the processing system 1. In some embodiments, the controller 73 is configured to drive the movement of the holder 12 of the processing tool 10, and to apply current to the electronic interface 8 and the electrode plates 22, 23, 24, 25 and 26. The controller 73 includes a control element, such as a microcontroller. The controller 73 sends a control signal to the actuator module 30 in response to a command from the processor 71.

[0058] In some embodiments, the I / O interface 74 may include any suitable mechanism or component to enable at least one user to provide input to the operator station 7 or to provide output to the user. For example, the I / O interface 74 may include any suitable input mechanism, including but not limited to buttons, keypads, keyboards, thumbwheels, touch screens, or motion sensors. In some embodiments, the I / O interface 74 may include a capacitive sensing mechanism, or a multi-touch capacitive sensing mechanism (e.g., a touch screen). In some embodiments, the I / O interface 74 may include a visual peripheral output device for providing a display visible to a user. For example, the visual peripheral output device may include a screen, such as, for example, a liquid crystal display (LCD) screen.

[0059] In some embodiments, the communication interface 75 may include any suitable hardware, software, or combination of hardware and software capable of coupling the operator station 7 to one or more networks and / or additional devices (such as the actuator module 30). The communication interface 75 may be configured to operate using any suitable technology for the required collection of control information signals for using a communication protocol, service, or operating program. The communication interface 75 may include an appropriate physical connector to connect to a corresponding communication medium (whether wired or wireless). In some embodiments, the operator station 7 may include a system bus that couples various system components, including the processor 71, the memory 72, the controller 73, and the I / O interface 74. The system bus may be any custom bus suitable for computing device applications.

[0060] Figure 8 A flowchart of a method S10 for processing an electronic interface according to various aspects of one or more embodiments of the present disclosure is shown. Figure 1 , Figure 2 as well as Figure 9-15 The attached Figure 1 In different embodiments, some of the described stages may be replaced or omitted.

[0061] In step S11, the fine needle array is placed in an electrolyte tank. In some embodiments, the fine needles (e.g., fine needles 81, 82, 83, 84, and 85) are first fixed to the substrate 80. Fig. 9 As shown, the substrate 80 is then mounted on the holder 12 ( Figure 2 ) so that its lower surface 801 faces downward. After the substrate 80 is fixed to the holder 12, the actuator 31 ( Figure 2 ) intervenes, drives the holder 12 downward and moves the fine needle into the electrolyte tank 21.

[0062] In step S12, measurement data related to the position of the fine needles in the electrolyte 90 is generated, wherein the electrolyte 90 is received in the electrolyte tank. In some embodiments, the measurement module 40 installed on the actuator 31 generates measurement data by measuring the force generated during the downward movement of the fine needles 81, 82, 83, 84 and 85. When in contact with the surface of the electrolyte, the surface tension generates an upward resistance, and the resistance is detected to determine whether all the fine needles are in contact with the surface of the electrolyte. Fig.10As shown, in an abnormal situation that may occur, the tips of some fine needles, such as the tip 840 of the fine needle 84, fail to be inserted into the electrolyte surface as expected. In this case, the detector will only detect the surface tensions f11, f12, f13 and f15 applied to the tips 810, 820, 830 and 850 of the other fine needles 81, 82, 83 and 85. If the measured data does not meet the preset standard after comparison with the historical data in step S13, step S14 is performed, which includes removing the array of fine needles 81, 82, 83, 84 and 85 from the electrolyte tank 21. After removal, the fine needles can be adjusted to a uniform height by, for example, grinding or compression. If the fine needles cannot be adjusted correctly, they may be discarded.

[0063] If no abnormality is found, the method proceeds to step S15, where the array of fine needles 81, 82, 83, 84 and 85 is moved to a predetermined position in the electrolyte tank 21, such as Fig.11 As shown. The above-mentioned predetermined position is the preset distance of the fine needles 81, 82, 83, 84, and 85 below the liquid surface of the electrolyte 90, which can be determined by experience or by analyzing the historical data generated in the previous processing procedure. Alternatively, the immersion distance can be determined according to the maximum chamfer (i.e., the minimum cone angle) formed along the diameter direction of the fine needle. In an embodiment in which the fine needle is processed by the immersion method (the fine needle and the electrode plate remain stationary), the immersion distance of the fine needles 81, 82, 83, 84, and 85 can be in the range of about 5μm to about 5mm according to the angle (i.e., the minimum cone angle) formed along the diameter direction of the fine needle. In an embodiment in which the fine needle is processed by the dynamic drawing method, the immersion distance is determined by the length of the bevel of the fine needle. The longer the bevel length (i.e., the smaller the cone angle), the larger the immersion distance is set.

[0064] In step S16, an electrochemical machining (ECM) process is performed. In the ECM process, the power module 60 applies direct current (DC) to the fine needles 81, 82, 83, 84 and 85 and the electrode plates 22, 23, 24, 25 and 26 to form a bias between the fine needles 81, 82, 83, 84 and 85 and the electrode plates 22, 23, 24, 25 and 26. In some embodiments, a positive bias is applied to the electrode plates 22, 23, 24, 25 and 26, and a negative bias is applied to the holder 12, so that the fine needles 81, 82, 83, 84, 85 are anodes and the electrode plates 22, 23, 24, 25 and 26 are cathodes. Therefore, when electrons flow from the fine needles 81, 82, 83, 84 and 85 to the electrode plates 22, 23, 24, 25 and 26 via the electrolyte 90, an oxidation reaction occurs on the surface of the fine needles 81, 82, 83, 84, 85. Generally speaking, the power module 60 can be a constant voltage power supply or a constant current power supply, capable of providing a power between about 0 watts and about 100 watts, a voltage between about 1V and about 60V, and a current between about 0 amperes and about 200 amperes. In addition, the power module 60 can apply a constant current or a periodic current pulse. The frequency of the periodic current pulse is less than 2.5KHz. The power module 60 can be a high-frequency pulse power supply with three power output modes of high-frequency square wave / sine wave / DC power supply. With a high-frequency pulse power supply, the migration speed of ions in the ionization reaction can be changed by controlling the power output mode. However, the specific operating specifications of the power supply may vary depending on the application. In an embodiment where the fine needles 81 , 82 , 83 , 84 and 85 are formed of different conductive materials having different redox potentials, the voltage applied to the fine needles 81 , 82 , 83 , 84 , 85 is greater than the maximum redox potential of the fine needles 81 , 82 , 83 , 84 , 85 .

[0065] In some embodiments, Fig.12 As shown, during the ECM processing of the fine needles 81, 82, 83, 84 and 85, the width of the fine needles gradually decreases, and passivation layers 91, 92, 93, 94 and 95 may be formed in the form of oxides around the lower ends of the fine needles 81, 82, 83, 84 and 85. These passivation layers will inhibit material removal and reduce the surface finish of the fine needles. It has been observed that the thickness of the passivation layer formed on the fine needle 83 located at the center C of the substrate 80 is greater than the thickness of the passivation layer formed on the fine needles 81 and 85 located at the edge 802 of the substrate 80. As a result, the oxidation reaction of the fine needle 83 located at the center of the substrate 80 is slower than that of the fine needles 81 and 85 located at the edge 802 of the substrate 80, resulting in a lower material removal rate. Therefore, as Fig.12As shown, the lower ends of the thin needles 81, 82, 83, 84, and 85 are chamfered at different angles. In an exemplary embodiment, chamfers 811, 821, 831, 841, and 851 are formed at the lower ends of the thin needles 81, 82, 83, 84, and 85. The angle formed between the chamfer 831 of the thin needle 83 and its adjacent surface is greater than the angle between the chamfer 821 of the thin needle 82 and its adjacent surface, and the angle between the chamfer 821 of the thin needle 82 and its adjacent surface is greater than the angle between the chamfer 811 of the thin needle 81 and its adjacent surface.

[0066] In some embodiments, the appearance of the fine needles 81, 82, 83, 84 and 85 during processing is checked by the image capture component 51. The image generated by the image capture component 51 is transmitted to the operation station 7 for analysis. If the image analysis results deviate from the expected standard, the operation station 7 will adjust the processing parameters to optimize the appearance of the fine needles. The adjustable processing parameters may include, but are not limited to, changing the applied voltage, adjusting the movement speed or mode of the fine needles, changing the temperature of the electrolyte 90, and changing the vibration frequency of the transducer 27.

[0067] In step S17, the height position of the fine needles 81, 82, 83, 84, and 85 is changed during the electrochemical machining process. In some embodiments, the fine needles 81, 82, 83, 84, and 85 are processed by the electrochemical machining process in combination with a dynamic drawing method, in which the fine needle height is gradually raised until the fine needle moves out of the surface of the electrolyte 90. The movement speed of the fine needles 81, 82, 83, 84, and 85 when moving upward can remain constant, or can be changed. For example, the fine needles 81, 82, 83, 84, and 85 may move slower in the early stage of the upward movement process and move faster in the later stage. That is, the closer the fine needles 81, 82, 83, 84, and 85 are to the surface of the electrolyte 90, the slower their movement speed.

[0068] In another embodiment, the fine needles 81, 82, 83, 84 and 85 are initially moved upward without separating the lower ends from the surface of the electrolyte 90, and then moved downward. This up and down movement can be repeated multiple times until the entire electrochemical machining process is completed, and can be performed simultaneously with the aforementioned speed change.

[0069] In some embodiments, the electrochemical machining process occurs during the downward low-speed movement of the thin needles 81, 82, 83, 84, and 85 after the lower ends thereof contact the surface of the electrolyte 90. However, it should be noted that the present disclosure is not limited to this embodiment. In other embodiments, the thin needles 81, 82, 83, 84, and 85 may remain stationary during the electrochemical machining process and may be removed from the electrolyte immediately after the electrochemical machining is completed.

[0070] In some embodiments, the speed at which the fine needles 81, 82, 83, 84 and 85 move is pre-set based on previously successful processing parameters. Alternatively, the speed at which the fine needles move can be determined based on parameters monitored in real time, including but not limited to: changes in power transmission energy between the cathode and the anode, changes in the power output waveform, and changes in the axial movement speed. In some embodiments, step S17 is omitted. The fine needles 81, 82, 83, 84, 85 are processed using an electrochemical processing process combined with an immersion method, in which the fine needles remain stationary for a predetermined time and are lifted to leave the electrolyte 90 after the electrochemical processing process is completed.

[0071] In step S18, the flow of electrolyte 90 is driven during the electrochemical machining process. In some embodiments, the flow of electrolyte can be driven by the up and down movement of fine needles 81, 82, 83, 84 and 85 as previously described. In other embodiments, the flow of electrolyte 90 can be driven by a transducer 27 located in the electrolyte tank 21. The transducer 27 can generate vibrations of a fixed or variable frequency to induce the flow of electrolyte 90 in the electrolyte tank 21. In still other embodiments, the flow of electrolyte 90 can be generated by changing the electric field generated by the applied direct current. For example, Figure 4 As shown, the power module 60 may first provide the current for the first time period to the electrode plates 22 and 23, and then stop supplying power, and then the power module 60 may supply power to the electrode plates 25 and 26 in the second time period. The second time period may be immediately after the first time period. In some embodiments, the flow of the electrolyte 90 in the electrolyte tank may minimize or eliminate the possibility of forming a passivation layer on the surface of the fine needles, thereby improving the consistency in appearance of adjacent fine needles.

[0072] In step S19, the array of fine needles 81, 82, 83, 84 and 85 is removed from the electrolyte tank 21. In some embodiments, Fig.14 As shown, after the ECM process is completed, the fine needles 81, 82, 83, 84 and 85 are removed from the electrolyte tank 21, and the supply of current to the fine needles 81, 82, 83, 84, 85 and the electrode plates 22, 23, 24, 25, 26 is stopped.

[0073] In step S20, an image of the array of fine needles 81, 82, 83, 84, and 85 is generated to check the geometric shapes of the fine needles 81, 82, 83, 84, and 85. In some embodiments, when the ECM process is completed, the image of the processed fine needles 81, 82, 83, 84, and 85 is captured by the image capture component 52 and transmitted to the operation station 7 for storage. Then, the data related to the image of the processed product is matched with the processing parameters used in the manufacturing process to optimize the subsequent processing parameters. In some embodiments, the processed fine needles can be photographed in the original position without removing them from the holder 12. For example, Fig.15 As shown, the holder 12 can be rotated 90 degrees around the pivot 115 so that the fine needle directly faces the light incident surface 521 of the image capture component 52. In addition, the distance between the holder 12 and the image capture component 52 can be adjusted by moving the horizontal arm 112 to achieve proper focus of the fine needle.

[0074] Fig.16 A schematic diagram of the electronic interface 8 after processing according to one or more embodiments of the present disclosure is shown. In some embodiments, each fine needle is tapered at its lower end away from the lower surface 801 of the substrate 80. Due to the formation of the passivation layer during the ECM processing, the cone angle of the fine needle close to the center C of the lower surface 801 is greater than the cone angle of the fine needle away from the center C of the lower surface 801. For example, the fine needle 83 located around the center C of the lower surface 801 has a first cone angle at its lower end, and the fine needle 81 positioned adjacent to the edge 802 of the substrate 80 has a second cone angle at its lower end. The second cone angle is smaller than the first cone angle. The inconsistency of the cone angle will not directly affect the performance of the electronic interface, as long as the length difference between adjacent fine needles is within the tolerance range. Compared with the traditional electronic interface, the electrical contacts (aluminum (copper) pads / copper pillars / bumps) of the electronic interface suitable for this embodiment can have a smaller area and a larger number (i.e., a higher spacing density). Therefore, the electronic interface of this embodiment can fully meet the strict requirements of advanced packaging technology.

[0075] Fig.17 A schematic view of reaction zone 20a according to one or more embodiments of the present disclosure is shown. Fig.17 Used in Figure 3 The same reference numerals are used to refer to the same or equivalent elements. To simplify the description, the details of these elements will not be repeated. The difference between reaction zone 20a and reaction zone 20 includes that electrode plates 22, 23, 24, 25 are replaced by electrode plate 28a.

[0076] In some embodiments, Fig.18As shown, the electrode plate 28a includes a plurality of through holes, each of which defines a processing area. The processing area, such as processing areas 281a, 282a, 283a, 284a, 285a, is arranged corresponding to the fine needles 81, 82, 83, 84 and 85 of the electronic interface 8. During ECM processing, the fine needles 81, 82, 83, 84 and 85 are inserted into the processing areas 281a, 282a, 283a, 284a, 285a, respectively. In some embodiments, the electric field in each processing area 281a, 282a, 283a, 284a, 285a is independently controlled by the power module 60. Therefore, the current density applied to two adjacent processing areas can be different. The electrode plate 28a can be fixed to the opening above the electrolyte tank 21 by a suitable fixture and electrically connected to the power module 60.

[0077] In some embodiments, the thickness of the electrode plate 28a is equal to or greater than the length of the portion of the fine needle immersed in the electrolyte. In this embodiment, the portion of the fine needle immersed in the electrolyte is completely surrounded by the processing area, which will increase the oxidation reaction rate. However, it should be noted that the present disclosure is not limited to this embodiment. In another embodiment, Fig.19 As shown, the electrode plate 28b has a relatively thin thickness, and when the fine needles are immersed in the electrolyte, they pass through the processed areas of the electrode plate 28b, such as through the processed areas 281b, 282b, 283b, 284b, 285b.

[0078] Fig.21 A flow chart of a method S30 for processing an electronic interface 8 using an electrode plate 28a according to various aspects of one or more embodiments of the present disclosure is shown. In the method S30, steps S31, S33, S34, S36, S38, S39 and S40 are similar to steps S11, S13, S14, S16, S18, S19 and S20, and thus will not be described in detail.

[0079] In step S32, in addition to the mechanism of determining whether all the fine needles are immersed in the electrolyte 90 at the same time by measuring the resistance as described in step S12, the immersion state of the fine needles can also be detected by monitoring the current changes in each processing area of ​​the electrode plate 28a. Since the power supply is applied to each processing area independently, when the fine needle enters therein, an electrical connection will be formed between the energized fine needle and the corresponding processing area. Therefore, by detecting the current of the processing area, it can be determined whether the fine needle has been successfully immersed in the electrolyte.

[0080] In step S35, the fine needle array is inserted into the processing area of ​​the electrode plate 28a. Depending on the desired geometry of the final product, the lower end of the fine needle away from the lower surface of the substrate 80 can be located in or below the processing area of ​​the electrode plate 28a. However, it should be understood that many changes and modifications can be made to the embodiments of the present disclosure. In some embodiments, the electrode plate 28a or 28b is placed in the electrolyte and maintained at a certain distance from the surface of the electrolyte. The lower end of the fine needle is immersed in the electrolyte, but is not inserted into the processing area of ​​the electrode plate 28a or 28b.

[0081] In step S37, after analyzing the image generated by the image capture component 51, if it is found that the appearance of some fine needles does not meet the expected standard, the mechanism described in step S17 can be adopted. In addition, the current intensity in the processing area receiving the fine needles can be adjusted to adjust their appearance, thereby increasing or decreasing the oxidation reaction rate of the fine needles. By independently controlling the oxidation reaction rate of each fine needle during the processing, Fig.16 Compared with the needles shown in FIG. 1 , the needles processed in this way show a higher degree of similarity in appearance. Fig. 22 As shown, the lower ends 815, 825, 835, 845 and 855 of the fine needles processed by this method present highly similar taper angles, which further enhances the uniformity and consistency of the final product.

[0082] Fig.23 A schematic diagram of an electronic interface 8c connected to a power module 60 in accordance with one or more embodiments of the present disclosure is shown. Fig.23 Used in Figure 6 The same reference numerals are used to refer to the same or equivalent elements. In order to simplify the description, the details about these elements will not be repeated. The difference between the electronic interface 8c and the electronic interface 8 includes replacing the substrate 80 with a substrate 80c. In some embodiments, the substrate 80c is a printed circuit board, on which a plurality of conductive paths are formed, such as conductive paths 861, 862, 863, 864 and 865. In some embodiments, each fine needle 81, 82, 83, 84 and 85 is electrically connected to a conductive path 861, 862, 863, 864 and 865 of the substrate 80c, respectively. However, it should be noted that the present disclosure is not limited to this embodiment. In another embodiment, two or more fine needles can be connected to the same conductive path and have the same current intensity during ECM processing.

[0083] Fig.24A flow chart of method S50 for processing an electronic interface 8c using a reaction zone 20 according to various aspects of one or more embodiments of the present disclosure is shown. In method S50, steps S51, S53, S54, S55, S57, S58, S59, and S60 are similar to steps S11, S13, S14, S15, S18, S19, and S20, and thus will not be described in detail.

[0084] In step S52, in addition to the mechanism of determining whether all the fine needles are immersed in the electrolyte 90 at the same time by measuring the resistance as described in step S12, the immersion state can also be detected. The state of the fine needles is controlled by monitoring the current change of each of the fine needles 81, 82, 83, 84 and 85. Since the power supply is independently applied to each fine needle 81, 82, 83, 84 and 85, when the fine needles are in contact with the electrolyte, an electrical connection will be established between the energized fine needles and the electrode plate. Therefore, by detecting the current of the fine needles 81, 82, 83, 84, 85, it is possible to identify which fine needles are not immersed in the electrolyte. The data collected in step S52 can be used in step S56, in which the identified fine needles are further processed.

[0085] In step S56, power is supplied to the fine needles for performing the electrochemical machining process. In some embodiments, the power module 60 applies current to the fine needles 81, 82, 83, 84, and 85 via the conductive paths 861, 862, 863, 864, and 865, so that the current intensity of the fine needles 81, 82, 83, 84, and 85 can be independently controlled during the ECM process. The current intensity of the fine needles 81, 82, 83, 84, and 85 can be determined based on the matching results of the appearance of the previous product and the parameters adopted. For example, if the image analysis results of the previous round of products show that the cone angle of the fine needle 83 is greater than the cone angle of the fine needle 81, the power module 60 can be controlled to provide a higher current intensity to the fine needle 83, while providing a lower current intensity to the fine needle 81, so as to enhance the uniformity and consistency of the final product.

[0086] With respect to the foregoing description, it should be understood that changes may be made to the details, especially in the construction materials employed and the shapes, sizes and arrangements of the parts, without departing from the scope of the invention. This specification and the described embodiments are exemplary only, with the true scope and spirit of the invention being defined by the following claims.

Claims

1. A processing system, characterized in that: It includes: a substrate; A fine needle array is located on the substrate; a holding member configured to hold the substrate; an electrolyte tank configured to receive an electrolyte; At least one electrode plate, located in the electrolyte tank; an actuator module configured to move the fine needle array held on the holding member relative to the electrolyte tank; a measuring module configured to detect the position of the fine needle in the electrolyte and generate measurement data according to the detection result, wherein the movement of the fine needle array is controlled according to the measurement data; as well as A power module is configured to apply current to the electrode plate and the fine needle array.

2. The processing system according to claim 1, characterized in that: The measuring module is used to measure the friction force generated between the fine needle and the electrolyte or to measure the current flowing through the fine needle.

3. The processing system according to claim 1, characterized in that: Also included is an image capture component located below a bottom wall of the electrolyte tank, wherein the image capture component is configured to monitor shape changes of the fine needle array during the electrochemical machining process.

4. The processing system according to claim 3, characterized in that: In the electrochemical machining process, the electrode plate is located between the image capture assembly and the fine needle array, wherein the electrode plate includes a transparent conductive oxide.

5. The processing system according to claim 1, characterized in that: Also included is an image capture assembly configured to inspect the shape of the fine needle array after the electrochemical machining process.

6. The processing system according to claim 1, characterized in that: The substrate includes a printed circuit board electrically connected to the power module, wherein at least two of the fine needles are electrically connected to two conductive paths formed in the printed circuit board, and the power module applies current to the two fine needles via the two conductive paths.

7. The processing system according to claim 1, characterized in that: It also includes two pairs of electrode plates, wherein the electrolyte tank includes a plurality of lateral side walls, and each pair of the two pairs of electrode plates is located at two lateral side walls that are oppositely arranged.

8. The processing system according to claim 1, characterized in that: The electrode plate is placed adjacent to the upper opening of the electrolyte tank and defines at least two different processing areas, wherein the power module independently controls the current applied to each of the processing areas.

9. The processing system according to claim 1, characterized in that: Also included is a transducer placed in the electrolyte tank and configured to generate vibrations of the electrolyte in the electrolyte tank.

10. An electronic interface, characterized in that: It includes: a substrate having a lower surface and an edge surrounding the lower surface; and A fine needle array is located on the lower surface of the substrate, wherein each of the fine needles comprises a conductive material and has a tapered end away from the lower surface of the substrate, Wherein, the fine needle array comprises: a first fine needle positioned around the center of the lower surface, and a lower end of the first fine needle has a first cone angle, A second fine needle is disposed adjacent to the edge of the substrate, and the lower end of the second fine needle has a second cone angle, which is smaller than the first cone angle.

11. The electronic interface according to claim 10, characterized in that: The substrate includes a printed circuit board, wherein at least two of the fine needles are electrically connected to two conductive paths formed in the printed circuit board.

12. The electronic interface according to claim 10, characterized in that: The substrate includes a conductive substrate, and the fine needle array is electrically connected to the conductive substrate.

13. The electronic interface according to claim 10, characterized in that: At least one of the fine needles extends along a longitudinal axis perpendicular to the lower surface of the substrate and includes an inner portion and an outer portion, wherein the outer portion is farther from the longitudinal axis than the inner portion, and the inner portion and the outer portion are formed of different conductive materials.

14. The electronic interface according to claim 10, characterized in that: The thin needle array further includes a third thin needle located between the first thin needle and the second thin needle, wherein the lower end of the third thin needle has a third cone angle which is smaller than the first cone angle but larger than the second cone angle.

15. A processing method, characterized in that: It includes: moving the fine needle array into an electrolyte received in an electrolyte tank; generating measurement data related to the position of the fine needle in the electrolyte; as well as When the measurement data meets a preset standard, current is applied to the fine needle array and an electrode plate in the electrolytic cell to change the shape of each of the fine needles through an electrochemical processing process.

16. The processing method according to claim 15, characterized in that: The measurement data is related to the friction force generated between the fine needle and the electrolyte.

17. The processing method according to claim 15, characterized in that: The current is applied to the fine needle array in a pulse form.

18. The processing method according to claim 15, characterized in that: The electrode plate has a plurality of processing areas, and the method further includes inserting the fine needle array into the processing areas in the electrode plate, wherein different current intensities are applied to the processing areas.

19. The processing method according to claim 15, characterized in that: The method also includes generating an image of the needle array to examine the geometry of the needles.

20. The processing method according to claim 15, characterized in that: At least one of the fine needles is formed of two conductive materials having different reduction potentials, wherein the power applied to at least the fine needle has a voltage greater than the maximum reduction potential of the two conductive materials.

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