Wave-transparent unit and radiation device

Abstract

The invention provides a wave-transparent unit and a radiation device, the wave-transparent unit comprises a PCB substrate, one surface of the PCB substrate is provided with an outer loop circuit and an inner loop circuit, the other surface of the PCB substrate is provided with a common edge circuit and an interdigital coupling structure, the common edge circuit and the inner loop circuit jointly form an equivalent first LC network, and the interdigital coupling structure is connected with the outer loop circuit and the inner loop circuit. The common side line, the outer loop line and the interdigital coupling structure are mutually coupled to form a virtual closed line so as to form a cascade structure of multiple coupling capacitors, and the cascade structure of the multiple coupling capacitors and the outer loop line jointly form an equivalent second LC network. The first LC network is coupled and conducted with the second LC network through the interdigital coupling structure; a reliable technical path is provided for the design of a miniaturized, common-caliber and multi-band radiation device, the wave-transparent performance of the wave-transparent unit at a high band is enhanced, and the problem of electromagnetic coupling among multiple bands is effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile communication antennas, and in particular to a wave-transmitting unit and a radiation device. Background Art

[0002] With the continuous advancement of wireless communication technology, the performance requirements of wireless communication devices for wave-transmitting units are also increasing. As a key component in wireless communication systems, the performance of wave-transmitting units is directly related to signal transmission efficiency, communication quality, and the overall performance of the system. Especially in the field of high-frequency communication and multi-band communication, the design of wave-transmitting units faces greater challenges.

[0003] Traditional wave-transmitting unit designs are mostly based on simple PCB board structures, and signal transmission is achieved by laying out metal lines on the PCB board. However, this design often has the problem of insufficient wave-transmitting performance in high-frequency bands, and the signal attenuation is large, resulting in a decrease in communication quality. In addition, as the frequency bands of wireless communication systems continue to increase, the problem of electromagnetic coupling between multiple frequency bands has become increasingly prominent. Traditional wave-transmitting unit designs often find it difficult to effectively deal with electromagnetic interference between multiple frequency bands, resulting in mutual influence between signals in different frequency bands, further reducing the stability and reliability of the communication system.

[0004] In order to improve the performance of the wave-transmitting unit, the industry has conducted a lot of research and exploration. On the one hand, by optimizing the material, circuit layout and parameter configuration of the PCB board, attempts are made to improve the wave-transmitting performance and electromagnetic compatibility of the wave-transmitting unit. On the other hand, attempts are also made to introduce new coupling structures and transmission line types, such as microstrip lines, coplanar waveguides, etc., in the hope of obtaining better performance. However, although these improvement measures have improved the performance of the wave-transmitting unit to a certain extent, it is still difficult to meet the high requirements of modern wireless communication systems for high-frequency wave-transmitting performance and multi-band electromagnetic compatibility.

[0005] Especially in the design of miniaturized, common aperture and multi-band radiation devices, the design difficulty of the wave-transmitting unit is further increased. Miniaturization requires the wave-transmitting unit to have a smaller size and lighter weight, while the common aperture requires radiation devices of different frequency bands to share the same aperture. These requirements require the design of the wave-transmitting unit to ensure performance while taking into account the limitations of size and weight. In addition, multi-band radiation devices require the wave-transmitting unit to maintain good wave-transmitting performance and electromagnetic compatibility in different frequency bands, which further increases the complexity of the design.

[0006] The disclosure of the above background technology content is only used to assist in understanding the inventive concept and technical solution of the present invention. It does not necessarily belong to the prior art of this patent application, nor does it necessarily provide technical guidance. In the absence of clear evidence that the above content has been disclosed before the filing date of this patent application, the above background technology should not be used to evaluate the novelty and creativity of the present application. Summary of the invention

[0007] In order to solve the above technical problems, the present invention proposes a wave-transmitting unit and a radiating device, which provide a reliable technical path for the design of miniaturized, common-aperture and multi-band radiating devices, which not only enhances the wave-transmitting performance of the wave-transmitting unit in the high-frequency band, but also effectively solves the electromagnetic coupling problem between multiple frequency bands, thereby meeting the requirements of modern wireless communication systems for high-frequency wave-transmitting performance.

[0008] In order to achieve the above object, the technical solution of the present invention is as follows:

[0009] The present invention provides a wave-transmitting unit, comprising: a PCB substrate, an outer ring circuit and an inner ring circuit are arranged on one surface of the PCB substrate, a common side circuit and an interdigital coupling structure are arranged on the other surface of the PCB substrate, the common side circuit and the inner ring circuit together constitute an equivalent first LC network, the common side circuit, the outer ring circuit and the interdigital coupling structure are coupled to each other to form a virtual closed circuit to form a cascade structure of multiple coupling capacitors, the cascade structure of multiple coupling capacitors and the outer ring circuit together constitute an equivalent second LC network, and the first LC network is coupled and conducted with the second LC network through the interdigital coupling structure.

[0010] The present invention proposes a wave-transmitting unit and a radiating device, which provide a reliable technical path for the design of miniaturized, common-aperture and multi-band radiating devices. It not only enhances the wave-transmitting performance of the wave-transmitting unit in the high-frequency band, but also effectively solves the electromagnetic coupling problem between multiple frequency bands, thus meeting the requirements of modern wireless communication systems for high-frequency wave-transmitting performance.

[0011] As an optimal technical solution, the outer loop circuit and the inner loop circuit form a loop structure, the outer loop circuit is a non-closed structure, and the outer loop circuit includes: a circuit extending outward from the lower horizontal side of the outer loop circuit, an upper horizontal side circuit of the outer loop circuit, a right vertical side circuit of the outer loop circuit, and a left vertical side circuit of the outer loop circuit, wherein the upper horizontal side circuit of the outer loop circuit, the right vertical side circuit of the outer loop circuit, and the left vertical side circuit of the outer loop circuit are directly connected to form a first inductive structure, and the first inductive structure and the cascade structure of the multiple coupling capacitors together form an equivalent second LC network.

[0012] As an optimal technical solution, the inner loop circuit is a closed structure, and the inner loop circuit includes: a lower horizontal side of the inner loop circuit, an upper horizontal side of the inner loop circuit, a right vertical side of the inner loop circuit, and a left vertical side of the inner loop circuit. The lower horizontal side of the inner loop circuit, the upper horizontal side of the inner loop circuit, the right vertical side of the inner loop circuit, and the left vertical side of the inner loop circuit are directly connected to form a second inductive structure.

[0013] As a preferred technical solution, a lower horizontal side of the inner loop circuit and the common side circuit have a stacked region to form a capacitive structure, and the capacitive structure and the second inductive structure together constitute an equivalent first LC network.

[0014] As a preferred technical solution, the common side line is an open line, and the common side line includes: a middle line, and common side line extension lines are provided on both sides of the middle line respectively, and the middle line is coupled and connected with the common side line extension lines through an interdigital coupling structure.

[0015] As a preferred technical solution, the outwardly extending line of the lower lateral side of the outer ring line and the outwardly extending line of the common side line are overlapped structures to additionally form a coupling capacitive structure.

[0016] As a preferred technical solution, the PCB substrate is provided with metallized vias, and the metallized vias are used to conduct the cross-digital coupling structure and the common side line.

[0017] As a preferred technical solution, a plurality of interdigital coupling structures are provided between the common side line and the lower horizontal side of the inner ring line;

[0018] A plurality of metallized vias are provided on the lower lateral sides of the common side circuit and the inner ring circuit and / or on the outwardly extending circuit of the lower lateral side of the outer ring circuit and the outwardly extending circuit of the common side circuit.

[0019] The present invention provides a radiation device, comprising: a feeding balun, one end of which is coupled to a radiation plate, the other end of which is connected to one end of a supporting pad, the other end of which is connected to a radio frequency coaxial cable, the radiation plate comprising: a wave-transmitting unit as described in any of the above items and a line segment of the radiation plate, the line segment of the radiation plate being conductively connected to a line extending outward from the common edge line.

[0020] As a preferred technical solution, the feed balun comprises: a double-sided PCB substrate and a feed line, wherein the feed line and a first part of a reference ground plane are distributed on one side of the double-sided PCB substrate, and a second part of a reference ground plane is distributed on the other side of the double-sided PCB substrate, and the first part of the reference ground plane and the second part of the reference ground plane together constitute a complete reference ground plane of the feed line by coupling.

[0021] The present invention provides a wave-transmitting unit and a radiation device, which have the following beneficial effects:

[0022] 1) It provides a reliable technical path for the design of miniaturized, common-aperture and multi-band radiation devices, which not only enhances the wave-transmitting performance of the wave-transmitting unit in the high-frequency band, but also effectively solves the electromagnetic coupling problem between multiple frequency bands, meeting the requirements of modern wireless communication systems for high-frequency wave-transmitting performance;

[0023] 2) The wave-transmitting unit in the present invention realizes coupling and conduction of the two networks by designing a first LC network and a second LC network, and utilizing an interdigital coupling structure; in the high frequency band, these LC networks will produce a resonance effect, so that the signal can pass through the wave-transmitting unit more efficiently, and the resonance effect can reduce the attenuation of the signal during the transmission process, thereby improving the wave-transmitting performance; the interdigital coupling structure enhances the electromagnetic coupling between different lines by providing a capacitive coupling path, so that the signal can be effectively transmitted between different lines; the wave-transmitting unit in the present invention forms a virtual closed circuit by designing a cascade structure of multiple coupling capacitors, and this structure can effectively reduce the electromagnetic coupling problem between multiple frequency bands, and the cascade structure of the coupling capacitors can absorb and disperse the electromagnetic interference between different frequency bands, thereby reducing the mutual influence between them;

[0024] The wave-transmitting unit design in the present invention adopts a compact structure, so that the size of the entire unit can be reduced; this helps to meet the needs of modern wireless communication systems for miniaturized equipment; by designing a wave-transmitting unit shared by multiple frequency bands, a common aperture for radiating devices in different frequency bands can be achieved; this helps to reduce the number of devices and the occupied space, and improve the integration and reliability of the system; the wave-transmitting unit design in the present invention can support signal transmission in multiple frequency bands, and therefore can be used to design multi-band radiating devices, which helps to meet the needs of modern wireless communication systems for multi-band communication. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Front and side views of a wave-transmitting unit provided by the present invention ( The other side of the PCB substrate is provided with a common edge line and an interdigital coupling structure. ) ;

[0026] Figure 2 A schematic top view of a wave-transmitting unit provided by the present invention (a common edge line and an interdigital coupling structure are provided on the other side of the PCB substrate);

[0027] Figure 3 The front and side views of a wave-transmitting unit provided by the present invention (an outer ring circuit and an inner ring circuit are provided on one side of the PCB substrate);

[0028] Figure 4 A bottom view schematic diagram of a wave-transmitting unit provided by the present invention (an outer ring circuit and an inner ring circuit are provided on one side of a PCB substrate);

[0029] Figure 5 This is a performance simulation effect diagram of a wave-transmitting unit provided by the present invention;

[0030] Figure 6 A side view of a radiation device provided by the present invention;

[0031] Figure 7 A schematic top view of a radiation sheet in a radiation device provided by the present invention;

[0032] Figure 8 A schematic top view of a single-quadrant radiation sheet in a radiation device provided by the present invention;

[0033] Fig. 9 This is a simulation verification effect diagram of the wave transmission performance of a single-quadrant radiation sheet in a radiation device provided by the present invention;

[0034] Fig.10 A side view of a feeding balun in a radiation device provided by the present invention;

[0035] Fig.11 A schematic diagram of VSWR simulation results of a radiation device provided by the present invention;

[0036] Fig.12 A top view of a co-aperture combination model of a “low-frequency radiator + FAD radiator” provided in an embodiment of the present invention;

[0037] Fig.13 A summary table of simulation verification effects of the "low-frequency radiator + FAD radiator" co-aperture combination model provided in an embodiment of the present invention;

[0038] Among them: 1-PCB substrate; 2-outer ring line; 21-outer ring line lower horizontal side extension line; 22-outer ring line upper horizontal side line; 23-outer ring line right vertical side line; 24-outer ring line left vertical side line; 3-inner ring line; 31-inner ring line lower horizontal side; 32-inner ring line upper horizontal side; 33-inner ring line right vertical side; 34-inner ring line left vertical side; 4-common side line; 41-middle line; 42-common side line extension line; 5-metallized via; 6-interdigital coupling structure; 7-radiator; 71-wave-transmitting unit; 72-radiator line segment; 8-feed balun; 81-double-sided PCB substrate; 82-feeding line; 83-first part reference ground plane; 84-second part reference ground plane; 9-support pad; 10-RF coaxial cable; 11-low frequency radiator; 12-FAD radiator. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0040] Frequency band description: low frequency (690MHz-960MHz), high frequency (1700MHz-2700MHz), FAD (1885MHz-1915MHz\2010MHz-2025MHz\2515MHz-2675MHz).

[0041] like Figure 1-4 As shown, the present invention provides a wave-transmitting unit, comprising: a PCB substrate 1, an outer ring line 2 and an inner ring line 3 are provided on one surface of the PCB substrate 1, a common side line 4 and an interdigital coupling structure 6 are provided on the other surface of the PCB substrate 1, the common side line 4 and the inner ring line 3 together constitute an equivalent first LC network, the common side line 4, the outer ring line 2 and the interdigital coupling structure 6 are coupled with each other to form a virtual closed circuit to form a cascade structure of multiple coupling capacitors, the cascade structure of multiple coupling capacitors and the outer ring line 2 together constitute an equivalent second LC network, and the first LC network is coupled and conducted with the second LC network through the interdigital coupling structure 6.

[0042] The present invention proposes a wave-transmitting unit and a radiating device, which provide a reliable technical path for the design of miniaturized, common-aperture and multi-band radiating devices. It not only enhances the wave-transmitting performance of the wave-transmitting unit in the high-frequency band, but also effectively solves the electromagnetic coupling problem between multiple frequency bands, thus meeting the requirements of modern wireless communication systems for high-frequency wave-transmitting performance.

[0043] The wave-transmitting unit in the present invention realizes coupling and conduction of the two networks by designing a first LC network and a second LC network, and utilizing an interdigital coupling structure; in the high frequency band, these LC networks will produce a resonance effect, so that the signal can pass through the wave-transmitting unit more efficiently, and the resonance effect can reduce the attenuation of the signal during the transmission process, thereby improving the wave-transmitting performance; the interdigital coupling structure 6 enhances the electromagnetic coupling between different lines by providing a capacitive coupling path, so that the signal can be effectively transmitted between different lines; the wave-transmitting unit in the present invention forms a virtual closed circuit by designing a cascade structure of multiple coupling capacitors, and this structure can effectively reduce the electromagnetic coupling problem between multiple frequency bands, and the cascade structure of the coupling capacitors can absorb and disperse the electromagnetic interference between different frequency bands, thereby reducing the mutual influence between them;

[0044] The wave-transmitting unit design in the present invention adopts a compact structure, so that the size of the entire unit can be reduced; this helps to meet the needs of modern wireless communication systems for miniaturized equipment; by designing a wave-transmitting unit shared by multiple frequency bands, a common aperture for radiating devices in different frequency bands can be achieved; this helps to reduce the number of devices and the occupied space, and improve the integration and reliability of the system; the wave-transmitting unit design in the present invention can support signal transmission in multiple frequency bands, and therefore can be used to design multi-band radiating devices, which helps to meet the needs of modern wireless communication systems for multi-band communication.

[0045] Preferably, if Figure 1-4As shown, the outer loop line 2 and the inner loop line 3 form a loop structure, the outer loop line 2 is a non-closed structure, and the outer loop line 2 includes: a lower horizontal side outward extension line 21 of the outer loop line, an upper horizontal side line 22 of the outer loop line, a right vertical side line 23 of the outer loop line, and a left vertical side line 24 of the outer loop line, wherein the upper horizontal side line 22 of the outer loop line, the right vertical side line 23 of the outer loop line, and the left vertical side line 24 of the outer loop line are directly connected to form a first inductive structure, and the first inductive structure and the cascade structure of the multiple coupling capacitors together form an equivalent second LC network, which can greatly improve the high-frequency wave transmission effect.

[0046] Preferably, if Figure 1-4 As shown, the outer loop circuit 2 and the inner loop circuit 3 form a loop structure, the inner loop circuit 3 is a closed structure, and the inner loop circuit 3 includes: a lower horizontal side 31 of the inner loop circuit, an upper horizontal side 32 of the inner loop circuit, a right vertical side 33 of the inner loop circuit, and a left vertical side 34 of the inner loop circuit. The lower horizontal side 31 of the inner loop circuit, the upper horizontal side 32 of the inner loop circuit, the right vertical side 33 of the inner loop circuit, and the left vertical side 34 of the inner loop circuit are directly connected to form a second inductive structure; the lower horizontal side 31 of the inner loop circuit and The common side line 4 has a laminated area to form a capacitive structure, and the capacitive structure and the second inductive structure together constitute an equivalent first LC network. The capacitive structure (formed by the laminated area of ​​the lower horizontal side 31 of the inner loop line and the common side line 4) and the inductive structure (formed by the direct connection of other parts of the inner loop line 3) play a role of filtering and impedance matching in the circuit. They together constitute an equivalent first LC network, and the high-frequency wave transmission effect is improved through the interaction between the capacitive structure and the inductive structure.

[0047] Preferably, if Figure 1-4 As shown, the common side line 4 is an open line, preferably divided into three sections, and the common side line 4 includes: a middle line 41, and common side line outward extension lines 42 are correspondingly arranged at both ends of the middle line 41, and the middle line 41 is coupled and connected with the common side line outward extension line 42 through two sections of cross-finger coupling structures 6. The common side line 4 is an open line, and the middle line 41 is coupled and connected with the common side line outward extension line 42 through the cross-finger coupling structure 6. In this way, the signal can be transmitted between the middle line 41 and the common side line outward extension line 42, thereby realizing signal coupling and transmission between multiple lines.

[0048] Preferably, if Figure 1-4As shown, the middle line 41 is the longitudinal overlapping area between the inner ring line 3 and the common side line 4, the common side line outward extension line 42 is the common side line 4 outward extension line, which is convenient for integrated design with other module lines, and the lower horizontal side outward extension line 21 of the outer ring line and the common side line outward extension line 42 are overlapping structures to additionally form a coupling capacitive structure; the overlapping structure forms an additional capacitive coupling path between the outer ring line 2 and the common side line 4; this capacitive coupling enhances the electromagnetic coupling of lines between different layers, and contributes to the efficient transmission of signals between different layers; the additional coupling capacitive structure helps to reduce the attenuation of signals during transmission and improve the wave transmission efficiency.

[0049] As a preferred technical solution, Figure 1-4 As shown, the PCB substrate 1 is provided with a metallized via 5, and the metallized via 5 is used to conduct the cross-finger coupling structure 6 and the common side line 4, thereby ensuring the normal operation and performance optimization of the circuit in the high-speed PCB board.

[0050] As a preferred technical solution, Figure 1-4 As shown, a plurality of interdigital coupling structures 6 are provided between the common side line 4 and the lower horizontal side 31 of the inner ring line;

[0051] A plurality of metallized vias 5 are provided on the common side line 4 and the lower horizontal edge 31 of the inner ring line and / or on the line 21 extending outward from the lower horizontal edge of the outer ring line and the line 42 extending outward from the common side line; in order to prevent the working bandwidth of the wave-transmitting radiation device in subsequent examples from being greatly affected, a plurality of interdigital coupling structures 6 and a plurality of metallized vias 5 are provided, and the introduction of the metallized vias 5 has no effect on the wave-transmitting performance of the wave-transmitting unit of the entire loop-shaped structure.

[0052] Since the wave-transmitting unit provided by the present invention adopts multiple coupling structures of the upper and lower surface lines of the PCB substrate 1, its thickness will directly affect the value of the equivalent coupling capacitance, and thus affect the wave-transmitting effect; in this example, considering the wave-transmitting performance and the stability of the structure, the preferred thickness of the PCB substrate 1 is 0.254 mm.

[0053] In order to verify the wave transmission characteristics of the entire wave-transmitting unit in the high frequency band, the professional three-dimensional electromagnetic simulation software HFSS is used to simulate and verify the wave-transmitting unit. The results are as follows Figure 5 As shown; it can be seen that in the entire high frequency band, the radar scattering cross section (RCS) is less than -46dB, and the wave-transmitting unit provided by the present invention exhibits very good wave-transmitting performance.

[0054] like Figure 6-8As shown, the present invention provides a radiation device, comprising: a feeding balun 8, one end of the feeding balun 8 is coupled to a radiation plate 7, the other end of the feeding balun 8 is connected to one end of a supporting pad 9, the other end of the supporting pad 9 is connected to a radio frequency coaxial cable 10, the radiation plate 7 comprises: a wave-transmitting unit 71 as described in any of the above items and a line segment 72 of the radiation plate, the line segment 72 of the radiation plate is conductively connected to the line 42 extending outward from the common edge line.

[0055] Preferably, if Figure 7 As shown, the radiation plate is composed of four symmetrically rotated quadrant radiation plates, forming a ±45° dual-polarization radiator.

[0056] In order to verify the wave transmission characteristics of the radiation plate of the radiation device in the high frequency band, the single quadrant radiation plate was simulated and verified using the professional three-dimensional electromagnetic simulation software HFSS. The results are as follows: Fig. 9 It can be seen that in the entire high frequency band, the radar cross section (RCS) is less than -29dB, showing very good wave transmission performance.

[0057] Preferably, the side view of the feeding balun of the radiation device is as follows: Fig.10 As shown (the feeding balun of the whole radiation device includes two feeding baluns with ±45° polarization. Because their composition structure and implementation principle are consistent, only one of the feeding baluns with one polarization is used for illustration), the feeding balun 8 includes: a double-sided PCB substrate 81 and a feeding line 82. The feeding line 82 and a first part of the reference ground plane 83 are distributed on one side of the double-sided PCB substrate 81, and the second part of the reference ground plane 84 is distributed on the other side of the double-sided PCB substrate 81. The first part of the reference ground plane 83 and the second part of the reference ground plane 84 together constitute a complete reference ground plane of the feeding line through coupling. This coupling method can effectively broaden the working bandwidth of the radiation device.

[0058] In order to verify the performance of the radiation device in the low frequency band, the professional three-dimensional electromagnetic simulation software HFSS is used to simulate and verify the radiation device. The VSWR results are as follows Fig.11 As shown in the figure, it can be seen that in the entire low frequency band, VSWR is less than 1.5, showing a very good working bandwidth.

[0059] In order to further verify the wave transmission performance of the low-frequency radiator to the high-frequency radiator, the present invention uses the 4488 antenna model tendered by a domestic operator as an example for simulation verification. Its core technology lies in the co-aperture design of the low-frequency radiator and the FAD band radiator. The top view of the "low-frequency radiator + FAD radiator" co-aperture combination model provided by the present invention is as follows: Fig.12As shown (Note: FAD radiator is not within the scope of the example requirements provided by the present invention, so it is replaced by a simple model). Among them, the distance between the two FAD radiators 12 is 2*d=105mm, and the low-frequency radiator 11 is placed in the middle of the two FAD radiators 12, that is, the distance between the low-frequency radiator 11 and each FAD radiator 12 is d=52.5mm, and the low-frequency radiator 11 and the two FAD radiators 12 are arranged in the same line. The professional three-dimensional electromagnetic simulation software HFSS is used to simulate and verify the "low-frequency radiator + FAD radiator" co-caliber combination model, and the results are as follows Fig.11 As shown;

[0060] Description: If Fig.13 As shown in the statistical table, the layout corresponding to the column "FAD radiator" consists of only two FAD radiators without a low-frequency radiator; the layout corresponding to the column "FAD radiator + low-frequency radiator" consists of two FAD radiators and one low-frequency radiator;

[0061] From the above results, it can be seen that due to the influence of the low-frequency radiator, the average gain decrease of the FAD radiator is 0.28dB, and the average 3dB lobe width widening in the horizontal plane is 1.25°. The low-frequency radiator shows very good wave transmission performance.

[0062] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all various changes or equivalent substitutions falling within the scope of the claims of the present application are included. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the scope protected by the present invention.

Claims

1. A wave-transmitting unit, characterized in that: include: A PCB substrate, wherein an outer loop circuit and an inner loop circuit are arranged on one surface of the PCB substrate, and a common side circuit and an interdigital coupling structure are arranged on the other surface of the PCB substrate, wherein the common side circuit and the inner loop circuit together constitute an equivalent first LC network, wherein the common side circuit, the outer loop circuit and the interdigital coupling structure are mutually coupled to form a virtual closed circuit to form a cascade structure of multiple coupling capacitors, wherein the cascade structure of multiple coupling capacitors and the outer loop circuit together constitute an equivalent second LC network, and wherein the first LC network is coupled and conducted with the second LC network via the interdigital coupling structure.

2. The wave-transmitting unit according to claim 1, characterized in that: The outer loop circuit and the inner loop circuit form a loop structure, the outer loop circuit is a non-closed structure, and the outer loop circuit includes: a circuit extending outward from the lower horizontal side of the outer loop circuit, an upper horizontal side circuit of the outer loop circuit, a right vertical side circuit of the outer loop circuit, and a left vertical side circuit of the outer loop circuit, wherein the upper horizontal side circuit of the outer loop circuit, the right vertical side circuit of the outer loop circuit, and the left vertical side circuit of the outer loop circuit are directly connected to form a first inductive structure, and the first inductive structure and the cascade structure of the multiple coupling capacitors together form an equivalent second LC network.

3. The wave-transmitting unit according to claim 2, characterized in that: The inner loop circuit is a closed structure, and the inner loop circuit includes: a lower horizontal side of the inner loop circuit, an upper horizontal side of the inner loop circuit, a right vertical side of the inner loop circuit, and a left vertical side of the inner loop circuit. The lower horizontal side of the inner loop circuit, the upper horizontal side of the inner loop circuit, the right vertical side of the inner loop circuit, and the left vertical side of the inner loop circuit are directly connected to form a second inductive structure.

4. The wave-transmitting unit according to claim 3, characterized in that: A stacking region exists between the lower horizontal side of the inner loop circuit and the common side circuit to form a capacitive structure, and the capacitive structure and the second inductive structure together constitute an equivalent first LC network.

5. The wave-transmitting unit according to claim 2, characterized in that: The common side line is an open line, and the common side line includes: a middle line, and common side line outward extension lines are provided on both sides of the middle line, and the middle line is coupled and connected with the common side line outward extension lines through an interdigital coupling structure.

6. The wave-transmitting unit according to claim 5, characterized in that: The outwardly extending circuit of the lower horizontal side of the outer ring circuit and the outwardly extending circuit of the common side circuit are in an overlapping structure to additionally form a coupling capacitive structure.

7. The wave-transmitting unit according to claim 1, characterized in that: The PCB substrate is provided with metallized vias, and the metallized vias are used to conduct the cross-digital coupling structure and the common side line.

8. The wave-transmitting unit according to claim 5, characterized in that: A plurality of interdigital coupling structures are provided between the common side circuit and the lower lateral side of the inner ring circuit; A plurality of metallized vias are provided on the lower lateral sides of the common side circuit and the inner ring circuit and / or on the outwardly extending circuit of the lower lateral side of the outer ring circuit and the outwardly extending circuit of the common side circuit.

9. A radiation device, characterized in that: include: A feeding balun, one end of which is coupled to a radiating plate, the other end of which is connected to one end of a supporting pad, the other end of which is connected to a radio frequency coaxial cable, the radiating plate comprising: a wave-transmitting unit as described in any of the above items and a line segment of the radiating plate, the line segment of the radiating plate being conductively connected to a line extending outward from a common side line.

10. The radiation device according to claim 9, characterized in that The feed balun comprises: a double-sided PCB substrate and a feed line, wherein the feed line and a first part of a reference ground plane are distributed on one side of the double-sided PCB substrate, and a second part of a reference ground plane is distributed on the other side of the double-sided PCB substrate, and the first part of the reference ground plane and the second part of the reference ground plane together constitute a complete reference ground plane of the feed line by coupling.

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