Key assembly and electronic equipment

Abstract

The invention relates to a key assembly and electronic equipment. The key assembly comprises a circuit board and a key body, the circuit board comprises a wiring layer, a metal layer and a dielectric layer located between the wiring layer and the metal layer. The wiring layer comprises a functional wire and a reinforcing wire, the reinforcing wire is connected with the metal layer through a first via hole, and the metal layer is grounded; and the key body is in contact with the function wire under the action of an external force, and is separated from the function wire when the external force is cancelled. According to the electronic equipment provided by the embodiment of the invention, the influence of the reinforcing line on the antenna around the key assembly can be reduced, and the performance of the antenna around the key assembly is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a key assembly and an electronic device. Background Art

[0002] With the development of communication technology, mobile phones and other electronic devices have become indispensable tools in daily life, and people's requirements for the quality of communication signals are getting higher and higher; at the same time, mobile phones have more and more functions, and the internal environment of mobile phones has become more and more complex, but the relatively complex internal environment will inevitably lead to a decrease in mobile phone signals.

[0003] At present, in order to reasonably arrange the space for the antenna in the mobile phone, the mobile phone shell is usually reused as the antenna radiator. However, the antenna radiator set in this way is too close to the wiring near the mobile phone shell, which makes it easy for these wirings to generate clutter in the antenna band radiated by the antenna radiator, affecting the performance of the antenna radiator. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a key assembly and an electronic device, which can reduce the influence of the reinforcement line on the antenna around the key assembly and effectively improve the performance of the antenna around the key assembly.

[0005] In a first aspect of an embodiment of the present disclosure, a key assembly is provided, comprising at least:

[0006] Circuit board and key body;

[0007] The circuit board comprises: a wiring layer, a metal layer and a dielectric layer located between the wiring layer and the metal layer;

[0008] The routing layer includes: functional routing and reinforcement wires, the reinforcement wires are connected to the metal layer through a first via, and the metal layer is grounded;

[0009] The button body contacts the functional wiring when an external force is applied, and is separated from the functional wiring when the external force is removed.

[0010] In some embodiments, the functional wiring includes: a ground line and a signal line, and the ground line is connected to the metal layer through a second via.

[0011] In some embodiments, the button body is disposed on a side of the circuit board close to the wiring layer.

[0012] In some embodiments, the circuit board further comprises:

[0013] A metal reinforcing plate, located on a side of the metal layer away from the dielectric layer;

[0014] The metal layer is connected to the metal reinforcement plate.

[0015] In some embodiments, the metal layer is connected to the metal reinforcement plate via a conductive adhesive.

[0016] In some embodiments, the button body is disposed on a side of the circuit board close to the metal layer.

[0017] In some embodiments, the metal layer is provided with an avoidance zone corresponding to the position where the button body contacts the functional wiring, and when the external force acts on the button body, the functional wiring is connected to the button body through a third via hole in the avoidance zone.

[0018] In some embodiments, there are multiple reinforcement lines, and the multiple reinforcement lines are distributed along the edge of the dielectric layer. A second aspect of the embodiments of the present disclosure provides an electronic device, comprising at least:

[0019] A conductive housing configured to transmit and receive wireless signals under the action of a feed signal;

[0020] The key assembly as described in the first aspect;

[0021] The circuit board of the key assembly is located in the space surrounded by the conductive shell;

[0022] The key body of the key assembly is at least partially exposed through the opening of the conductive shell; wherein the opening is parallel to the circuit board.

[0023] In some embodiments, the electronic device further comprises:

[0024] A conductive middle frame is located in the conductive housing and connected to the metal reinforcement plate of the key assembly; wherein the conductive middle frame is grounded.

[0025] In some embodiments, the electronic device further comprises:

[0026] The conductive adhesive member is located between the metal reinforcement plate and the conductive middle frame and is configured to bond the metal reinforcement plate and the conductive middle frame.

[0027] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0028] The embodiments of the present disclosure provide a key assembly and an electronic device, wherein the key assembly includes: a circuit board and a key body; the circuit board includes: a routing layer, a metal layer and a dielectric layer located between the routing layer and the metal layer; the routing layer includes: a functional routing line and a reinforcement line, the reinforcement line is connected to the metal layer through a first via hole, and the metal layer is grounded; the key body contacts the functional routing line when an external force acts, and separates from the functional routing line when the external force is removed. Through the key assembly proposed in the present disclosure, without changing the original structure of the key assembly, the reinforcement line in the routing layer is connected to the metal layer through the first via hole and the metal layer is grounded, so that the reinforcement line arranged on the dielectric layer can be grounded, thereby reducing the clutter generated by the reinforcement line in the antenna band around the key body, thereby reducing the influence of the reinforcement line on the antenna around the key body, and effectively improving the performance of the antenna around the key body.

[0029] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0031] Figure 1 is a schematic diagram of the structure of a key assembly provided according to an exemplary embodiment Figure 1 .

[0032] Figure 2 is a schematic diagram of the structure of a key assembly provided according to an exemplary embodiment Figure 2 .

[0033] Figure 3 is a schematic diagram of the structure of a key assembly provided according to an exemplary embodiment Figure 3 .

[0034] Figure 4 is a schematic diagram of a structure of an electronic device provided according to an exemplary embodiment Figure 1 .

[0035] Figure 5 is a schematic diagram of the structure of a key assembly provided according to an exemplary embodiment Figure 4 .

[0036] Figure 6 is a schematic diagram of a key assembly according to an exemplary embodiment. Figure 5 .

[0037] Figure 7 is a schematic diagram of a structure of an electronic device provided according to an exemplary embodiment Figure 2 .

[0038] Figure 8 is a schematic diagram of a structure of an electronic device provided according to an exemplary embodiment Figure 3 .

[0039] Fig. 9 is a schematic diagram of a structure of an electronic device provided according to an exemplary embodiment Figure 4 .

[0040] Fig.10a It is a schematic diagram of the effect of a conventional electronic device and a conductive housing in the electronic device of the present disclosure sending and receiving wireless signals according to an exemplary embodiment.

[0041] Fig.10b It is a schematic diagram of the radiation efficiency of a conventional electronic device and a conductive housing in the electronic device of the present disclosure when sending and receiving wireless signals according to an exemplary embodiment.

[0042] Fig.11 The present invention is a structural block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0043] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure. Instead, they are merely examples of structures and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0044] In the related art, in order to reasonably arrange the space of the antenna in electronic devices such as mobile phones, the mobile phone shell is usually reused as the antenna radiator. However, the antenna radiator set in this way will be too close to the wiring near the mobile phone shell, such as the wiring in the key assembly, which makes it easy for these wiring to generate clutter in the antenna band radiated by the antenna radiator, affecting the radiation efficiency of the antenna radiator.

[0045] Based on this, an embodiment of the present disclosure provides a button assembly. Figure 1 is a schematic diagram of a key assembly according to an exemplary embodiment. Figure 1 , Figure 2 is a schematic diagram of a key assembly according to an exemplary embodiment. Figure 2 ,like Figure 1 and Figure 2 As shown, the button assembly 20 may include:

[0046] Circuit board 200 and key body 23;

[0047] The circuit board 200 includes: a wiring layer 201, a metal layer 202 and a dielectric layer 21 located between the wiring layer 201 and the metal layer 202;

[0048] The routing layer 201 includes: functional routing lines 22 and reinforcement lines 24, the reinforcement lines 24 are connected to the metal layer 202 through the first vias 214, and the metal layer 202 is grounded;

[0049] The button body 23 contacts the functional wiring 22 when an external force is applied, and separates from the functional wiring 22 when the external force is removed.

[0050] In the disclosed embodiments, the button assembly may be a functional device corresponding to the side button of the electronic device; for example, the button assembly may be a power functional device corresponding to the power button of a mobile phone, or the button assembly may be a volume increase or decrease functional device corresponding to the volume button of a mobile phone, etc.

[0051] Among them, the above-mentioned electronic devices may include: mobile phones, tablet computers, smart watches, digital cameras, head mounted display devices (Head Mounted Display, HMD), etc., which are not limited in the embodiments of the present disclosure.

[0052] Here, the button body can be a pressing block for realizing the function of the button assembly. For example, when an external force acts on the power pressing block on the side of the mobile phone, the function of the power button assembly of the mobile phone can be realized; or when an external force acts on the volume pressing block on the side of the mobile phone, the function of the volume button assembly of the mobile phone can be realized, etc.

[0053] The circuit board may be a flexible printed circuit (FPC). FPC is a printed circuit board made of polyimide or polyester film as a substrate and has high reliability and excellent flexibility.

[0054] It can be understood that when the key body is not acted upon by an external force, the key body can be spaced apart from the circuit board, and the distance between the key body and the circuit board can be the movable distance when the key body is acted upon by an external force.

[0055] It should be noted that the specific shape and size of the above-mentioned circuit board can be set according to the actual application scenario, and the embodiments of the present disclosure are not limited thereto.

[0056] The routing layer may be a layer for wiring in the circuit board; the metal layer may be a layer for grounding in the circuit board; the dielectric layer may be a layer for carrying the routing layer and insulating in the circuit board. The routing layer and the metal layer may be arranged on opposite sides of the dielectric layer.

[0057] For example, the above-mentioned dielectric layer can be a flexible dielectric board; the above-mentioned metal layer can be a metal coating covered on one side of the flexible dielectric board, for example, copper or other metal materials are coated on one side of the flexible dielectric board; the above-mentioned routing layer can include functional routing and reinforcement lines arranged on the other side of the flexible dielectric board.

[0058] The functional wiring may be a connection line that the button body contacts when an external force is applied; for example, the functional wiring may include a ground line and a signal line.

[0059] Exemplarily, the above-mentioned functional wiring may include a ground wire and a signal wire, and the above-mentioned key body may include two contact points. When an external force acts on the above-mentioned key body, one contact point of the above-mentioned key body may contact the signal wire of the above-mentioned functional wiring, and the other contact point of the above-mentioned key body may contact the ground wire of the above-mentioned functional wiring; when the external force is removed, one contact point of the above-mentioned side key body may be separated from the signal wire, and the other contact point of the above-mentioned key body may be separated from the ground wire, thereby realizing the key function of the key assembly.

[0060] It should be noted that the specific position of the above-mentioned functional routing on the above-mentioned dielectric layer can be set according to the actual application situation, as long as the signal line and the ground line of the above-mentioned functional routing can be arranged at intervals on the above-mentioned dielectric layer, and the embodiment of the present disclosure is not limited thereto.

[0061] In the disclosed embodiment, the reinforcement line may be a component for increasing the structural strength of the dielectric layer; for example, the reinforcement line may be a metal reinforcement line spaced at an edge of the dielectric layer.

[0062] Here, the material of the reinforcing wire may be a conductive material with high hardness, for example, a metal material such as iron, steel, chromium, etc. For example, the reinforcing wire may include iron wire, steel wire, or chromium wire.

[0063] It can be understood that the reinforcement line can be arranged along the edge shape of the dielectric layer; for example, if the edge shape of the dielectric layer is irregular, the shape of the reinforcement line can also be an irregular shape matching the dielectric layer.

[0064] It should be noted that the specific structure of the above-mentioned dielectric layer can be set according to the actual application scenario, and the embodiments of the present disclosure are not limited thereto.

[0065] The first via hole may be a through hole provided on the dielectric layer and connected to the reinforcement line; the surface of the first via hole may be covered with a layer of conductive material such as copper or aluminum so that the reinforcement line can be conductive with the metal layer.

[0066] It can be understood that one end of the first via hole can be electrically connected to the reinforcement line, and the other end of the first via hole can be electrically connected to the metal layer to achieve grounding of the reinforcement line.

[0067] In one embodiment of the present disclosure, Figure 1 As shown, there are multiple reinforcement lines 24 , and the multiple reinforcement lines 24 are distributed along the edge of the dielectric layer 21 .

[0068] In this way, a plurality of reinforcement lines can be arranged to be distributed along the edge of the dielectric layer, thereby better increasing the structural strength of the dielectric layer without affecting the functional wiring on the dielectric layer.

[0069] Wherein, the plurality of reinforcing lines may be arranged at intervals at the edge of the dielectric layer, and also arranged at intervals from the functional wiring on the dielectric layer.

[0070] It should be noted that the specific number and size of the above-mentioned reinforcement lines can be set according to the size of the above-mentioned dielectric layer in actual application conditions, and the embodiments of the present disclosure are not limited thereto.

[0071] In the embodiments of the present disclosure, the reinforcement wire can be grounded in various ways. For example, in the case where the button body is arranged on the side of the circuit board close to the wiring layer, a first via is arranged on the dielectric layer, and the reinforcement wire can be connected to the metal layer through the first via for grounding; in the case where the button body is arranged on the side of the circuit board close to the metal layer, the reinforcement wire can be directly connected to the conductive middle frame of the electronic device where the button assembly is located for grounding, or the reinforcement wire can also be connected to the metal layer through the first via, and then connected to the conductive middle frame for grounding; and so on.

[0072] It should be noted that the specific number of the above-mentioned first vias can be set according to the number of the above-mentioned reinforcement lines in actual application situations, and the embodiments of the present disclosure do not limit it. For example, in the case where one of the above-mentioned reinforcement lines corresponds to at least one of the above-mentioned first vias, the number of the above-mentioned first vias can be greater than or equal to the number of the above-mentioned reinforcement lines; or, in the case where two adjacent reinforcement lines among the multiple above-mentioned reinforcement lines are connected to the same first via, the number of the above-mentioned first vias can be less than the number of the above-mentioned reinforcement lines.

[0073] It can be understood that the multiple reinforcement lines mentioned above can be connected to the metal layer through the first via holes on the above-mentioned dielectric layer for grounding, and two adjacent reinforcement lines among the multiple reinforcement lines mentioned above can also be connected to the metal layer through the same first via hole to reduce the number of first via holes set on the above-mentioned dielectric layer, thereby improving the manufacturing process efficiency of the key assembly.

[0074] In one embodiment of the present disclosure, the key assembly may further include a coating covering the circuit board to protect the wiring layer, dielectric layer, metal layer, etc. in the circuit board.

[0075] An electronic device provided by an embodiment of the present disclosure comprises: a circuit board and a button body; the circuit board comprises: a routing layer, a metal layer and a dielectric layer located between the routing layer and the metal layer; the routing layer comprises: a functional routing line and a reinforcement line, the reinforcement line is connected to the metal layer through a first via hole, and the metal layer is grounded; the button body contacts the functional routing line when an external force acts, and separates from the functional routing line when the external force is removed. Through the button assembly proposed in the present disclosure, without changing the original structure of the button assembly, the reinforcement line in the routing layer is connected to the metal layer through the first via hole and the metal layer is grounded, so that the reinforcement line arranged on the dielectric layer can be grounded, thereby reducing the clutter generated by the reinforcement line in the antenna band around the button body, thereby reducing the influence of the reinforcement line on the antenna around the button body, and effectively improving the performance of the antenna around the button body.

[0076] In some embodiments, Figure 2 As shown, the functional wiring 22 includes: a ground line 222 and a signal line 221 , and the ground line 222 is connected to the metal layer 202 through a second via 215 .

[0077] In this way, a second via hole connected to the ground wire can be set on the dielectric layer so that the ground wire can be connected to the metal layer through the second via hole to increase the grounding area of ​​the ground wire, so that the ground wire located on the same side of the dielectric layer as the reinforcement wire can be better grounded, thereby reducing the noise generated by the ground wire in the antenna band around the button body, and effectively improving the performance of the antenna around the button body.

[0078] The ground wire may be a conductor for grounding the key body; the signal wire may be a conductor for transmitting the functional signal of the key assembly. The second via may be a through hole provided on the dielectric layer and connected to the ground wire; the surface of the second via may be covered with a layer of conductive material such as copper or aluminum, so that the ground wire can be connected to the metal layer.

[0079] It can be understood that one end of the second via hole can be electrically connected to the ground line, and the other end of the second via hole can be electrically connected to the metal layer to achieve further grounding of the ground line.

[0080] In the disclosed embodiment, the first via hole may be the same as or different from the second via hole; that is, the reinforcement line may be connected to the metal layer through the same via hole as the ground line, or may be connected to the metal layer through a different via hole than the ground line.

[0081] In some embodiments, Figure 3 As shown, the button body 23 is arranged on a side of the circuit board 200 close to the wiring layer 201 .

[0082] In this way, the function of the key assembly can be not affected, and the clutter generated by the reinforcement line in the antenna band around the key body can be reduced by connecting the reinforcement line to the metal layer for grounding, thereby effectively improving the performance of the antenna around the key body.

[0083] Here, the button body and the wiring layer are both located on the same side of the dielectric layer, and the metal layer is located on the dielectric layer at the opposite side to the button body and the wiring layer.

[0084] In one embodiment of the present disclosure, Figure 4 As shown, the circuit board 200 may further include:

[0085] A metal reinforcing plate 25, located on a side of the metal layer 202 away from the dielectric layer 21;

[0086] The metal layer 202 is connected to the metal reinforcing plate 25 .

[0087] In this way, a metal reinforcement plate can be arranged on the side of the metal layer away from the dielectric layer, which can enhance the structural strength of the key assembly while better realizing the grounding of the reinforcement line through the metal layer and the metal reinforcement plate.

[0088] The metal reinforcement plate can reinforce the structure of the circuit board in the key assembly, and the metal reinforcement plate can match the size of the dielectric layer.

[0089] It can be understood that when an external force acts on the above-mentioned key body, the above-mentioned metal reinforcement plate can support the above-mentioned circuit board without deformation under the action of the external force, thereby enhancing the structural strength of the key assembly; and the above-mentioned metal reinforcement plate can connect the above-mentioned metal layer, so that the reinforcement line can be grounded through the first via hole, the metal layer and the metal reinforcement plate, so as to improve the performance of the antenna around the key body.

[0090] It should be noted that the specific size of the above-mentioned metal reinforcement plate can be set according to the size of the above-mentioned dielectric layer in actual application conditions, and the embodiment of the present disclosure does not limit this.

[0091] In the present disclosure, Figure 4 As shown, the metal layer 202 is connected to the metal reinforcing plate 25 via a conductive adhesive 26 .

[0092] The conductive adhesive may be a conductive material that can bond the metal layer and the metal reinforcement plate.

[0093] In this way, conductive adhesive may be provided between the metal layer and the metal reinforcing plate, thereby improving the stability of the connection between the metal layer and the metal reinforcing plate.

[0094] In some embodiments, Figure 5 As shown, the button body 23 is arranged on a side of the circuit board 200 close to the metal layer 202 .

[0095] In this way, the metal layer can be set close to the button body so that the wiring layer can be kept away from the button body, so that the metal layer can shield the interference of the wiring layer on the antenna around the button body, thereby reducing the influence of the wiring layer on the antenna around the button body and effectively improving the performance of the antenna around the button body.

[0096] Here, the button body and the metal layer are both located on the same side of the dielectric layer, and the wiring layer is located on the dielectric layer at the opposite side to the button body and the metal layer; that is, the wiring layer is far away from the button body.

[0097] In one embodiment of the present disclosure, Figure 5 and Fig. 9 The metal layer 202 is provided with an avoidance zone corresponding to the position where the button body 23 contacts the functional wiring 22 , and when the external force acts on the button body 23 , the functional wiring 22 is connected to the button body 23 through the third via 213 in the avoidance zone.

[0098] In this way, an avoidance zone can be set at the position where the metal layer corresponds to the button body contacting the functional wiring, so that the functional wiring can be set away from the conductive shell while ensuring that the button body can be connected to the functional wiring through the third via when external force acts, thereby ensuring the button function of the button assembly.

[0099] The avoidance area may be an area in the metal layer corresponding to the contact between the key body and the functional wiring, and the avoidance area may be an insulating area. The third via may be a through hole provided on the dielectric layer and connected to the functional wiring; the surface of the third via may be covered with a layer of conductive material such as copper or aluminum, so that the functional wiring can be connected to the key body when an external force acts on the key body.

[0100] Here, the above-mentioned third via has a first hole end arranged on the routing layer and a second hole end arranged on the metal layer; the above-mentioned first hole end contacts with the contact point of the above-mentioned key body when the above-mentioned key body is acted upon by external force, and is separated from the contact point of the above-mentioned key body when the external force is removed; the above-mentioned second hole end is electrically connected to the above-mentioned functional routing.

[0101] In some embodiments, Figure 5As shown, the button body 23 and the third via hole 213 are both multiple;

[0102] The contact point of each button body 23 corresponds to at least one third via hole 213 , and different button bodies 23 correspond to different third via holes 213 .

[0103] In this way, by making the contact point of each key body correspond to at least one third via hole, and different key bodies correspond to different third via holes, the key function of the key assembly can be realized when the functional wiring is far away from the key body.

[0104] Here, the number of the key bodies may be less than or equal to the number of the third via holes. For example, when one key body has two contact points, one key body may correspond to two third via holes; when one key body has four contact points, one key body may correspond to four third via holes.

[0105] It should be noted that the specific number of the button body and the third via hole can be set according to the actual application situation, and the embodiment of the present disclosure does not limit it. For example, the button body can be 2 and the third via hole can be 4; or the button body can be 2 and the third via hole can be 6; and so on.

[0106] In some embodiments, in combination Figure 1 and Figure 6 The functional wiring 22 in the key assembly 20 provided in the present disclosure may include a signal line 221 and a ground line 222; wherein the signal line 221 and the ground line 222 are respectively located on different surfaces of the dielectric layer 21, and the ground line 222 and the reinforcement line 24 can be located on the same surface of the dielectric layer 21. At this time, the signal line 221 is set at a position in the dielectric layer 21 away from the key body 23, and the reinforcement line 24 can be grounded through the first via 214.

[0107] In this way, the signal line and the ground line can be arranged on both sides of the dielectric layer, and the signal line can be arranged at a position of the dielectric layer away from the key body, so that the signal line is away from the conductive shell, thereby further reducing the noise generated by the signal line in the antenna band of the conductive shell for sending and receiving wireless signals, thereby improving the efficiency of the conductive shell in sending and receiving wireless signals.

[0108] In the present disclosure, in combination Figure 1 and Figure 6The reinforcement line 24 may be located on the surface of the dielectric layer 21 facing the button body 23, and the ground line 222 may be spaced apart from the reinforcement line 24; at this time, a fourth via hole 216 may be provided on the dielectric layer 21, and when an external force acts on the button body 23, the signal line 221 may contact one contact point of the button body 23 through the fourth via hole 216, and the ground line 222 may directly contact another contact point of the button body 23.

[0109] It is understandable that the metal layer can be coated on the side of the dielectric layer away from the reinforcement line and on the projection position of the reinforcement line and the ground line onto the dielectric layer to avoid affecting the conduction between the signal line and the key body in the key assembly.

[0110] It should be noted that the specific area of ​​the metal layer coated on the dielectric layer can be set according to the sizes of the reinforcement wire and the ground wire in actual application, and the embodiment of the present disclosure does not limit this.

[0111] The present disclosure provides an electronic device, combined with Figure 1 and Figure 7 , the electronic device 1 may include:

[0112] The conductive housing 10 is configured to receive and send wireless signals under the action of a feeding signal;

[0113] The key assembly 20 described in the above embodiment of the present disclosure;

[0114] The circuit board 200 of the key assembly 20 is located in the space surrounded by the conductive housing 10;

[0115] The key body 23 of the key assembly 20 is at least partially exposed to the outside through the opening 110 of the conductive housing 10 ; wherein the opening 110 is parallel to the circuit board 200 .

[0116] In this way, the reinforcement wire in the routing layer of the circuit board can be connected to the metal layer through the first via hole and the metal layer can be grounded, so that the reinforcement wire arranged on the dielectric layer of the circuit board can be grounded, thereby reducing the noise generated by the reinforcement wire in the antenna band of the conductive shell receiving and transmitting wireless signals around the key body, thereby reducing the influence of the reinforcement wire on the conductive shell receiving and transmitting wireless signals, and effectively improving the performance of the conductive shell receiving and transmitting wireless signals.

[0117] The conductive shell may be a metal part having a conductive area; the conductive shell may be an outer frame of the electronic device such as a mobile phone, and is used to protect functional components inside the electronic device.

[0118] In the electronic device provided by the embodiment of the present disclosure, the above-mentioned conductive shell can be used to send and receive wireless signals under the stimulation of the feeding signal; when the conductive shell is used to transmit wireless signals, the electronic device can perform wireless signal transmission, such as wireless communication or wireless charging.

[0119] Specifically, the electronic device provided by the embodiments of the present disclosure is active in actual wireless communication scenarios.

[0120] Exemplarily, the wireless communication scenario may be a multi-device scenario. For example, in a scenario of configuring a network for a smart device, the network configuration for the smart device is completed through the interaction of multiple machines such as a router and different electronic devices.

[0121] The electronic device provided by the embodiment of the present disclosure can improve the radiation frequency band of the wireless signal and optimize the performance of wireless communication in the field of wireless signal transmission by changing the frequency of the wireless signal received and sent by the conductive shell.

[0122] Here, at least part of the key body may be exposed outside the conductive shell through the opening of the conductive shell, so that the user can press it to use the function corresponding to the key assembly; the circuit board of the key assembly may be located inside the conductive shell.

[0123] In some embodiments, in combination Figure 4 and Figure 8 , the electronic device 1 may further include:

[0124] The conductive middle frame 30 is located in the conductive housing 10 and connected to the metal reinforcement plate 25 of the key assembly 20 ; wherein the conductive middle frame 30 is grounded.

[0125] In this way, the metal reinforcement plate can be set between the conductive middle frame and the metal layer, so that the conduction between the first via and the conductive middle frame can be better achieved, so that the ground wire in the reinforcement wire or functional wire can be grounded through the first via, the metal layer, the metal reinforcement plate and the conductive middle frame, thereby improving the performance of the conductive shell in sending and receiving wireless signals.

[0126] The conductive middle frame may be a frame that supports functional components inside the electronic device and is located inside the conductive housing.

[0127] In some embodiments, Figure 4 As shown, the electronic device 1 may further include:

[0128] The conductive adhesive member 40 is located between the metal reinforcement plate 25 and the conductive middle frame 30 , and is configured to bond the metal reinforcement plate 25 and the conductive middle frame 30 .

[0129] In this way, the conductive adhesive member may be provided between the metal reinforcement plate and the conductive middle frame, thereby improving the stability of the conduction between the metal reinforcement plate and the conductive middle frame.

[0130] The conductive adhesive member may be a conductive material capable of bonding the metal reinforcing plate and the conductive middle frame.

[0131] It should be noted that the specific material of the above-mentioned conductive adhesive can be selected according to the actual application situation, and the embodiments of the present disclosure are not limited thereto.

[0132] In one embodiment of the present disclosure, the conductive adhesive member includes conductive foam or conductive glue.

[0133] It can be understood that the metal reinforcement plate and the conductive middle frame are connected by conductive foam or conductive glue, so that the metal reinforcement plate and the conductive middle frame become one and are grounded, so that the reinforcement line can be better grounded through the first via, the metal layer, the metal reinforcement plate and the conductive middle frame, so as to improve the performance of the conductive shell in sending and receiving wireless signals.

[0134] like Figure 8 and Fig. 9 As shown, the electronic device 1 may further include: a button bracket 120, located between the conductive shell 10 and the conductive middle frame 30, and used to enclose an accommodating space between the conductive shell 10 and the conductive middle frame 30, and the button assembly 20 is located in the accommodating space.

[0135] An electronic device provided by an embodiment of the present disclosure, without changing the original structure of a key assembly, grounds a reinforcement wire in a routing layer through a first via, a metal layer, a metal reinforcement plate and a conductive middle frame, so as to reduce the noise generated by the reinforcement wire in an antenna band for receiving and transmitting wireless signals by a conductive shell, thereby reducing the influence of the reinforcement wire on the performance of transmitting and receiving wireless signals by the conductive shell; or, arranges a functional routing wire at a position of the dielectric layer away from the key body, so as to keep the functional routing wire away from the conductive shell, thereby further reducing the noise generated by the functional routing wire in the antenna band for receiving and transmitting wireless signals by the conductive shell, thereby improving the efficiency of transmitting and receiving wireless signals by the conductive shell corresponding to the key assembly.

[0136] Specifically, Fig.10a 1 is a schematic diagram of the effect of a conventional electronic device and a conductive housing in the electronic device of the present disclosure sending and receiving wireless signals according to an exemplary embodiment. Fig.10a As shown, the dotted line is the S11 parameter when the key component is set in the traditional electronic device, and the solid line is the S11 parameter when the key component is set in the electronic device of the embodiment of the present disclosure; Fig.10aIt can be seen that after the traditional electronic device structure is changed to the electronic device structure set in the embodiment of the present disclosure, the clutter at the frequency of 2.17 GHz for transmitting and receiving wireless signals disappears. Among them, the S11 parameter represents the input return loss. When S11 is lower, the loss caused by reflection on the antenna radiator is less, the more signals are radiated into space, and the stronger the radiation performance of the antenna radiator is.

[0137] in addition, Fig.10b is a schematic diagram of radiation efficiency when a conductive housing in a conventional electronic device and an electronic device of the present disclosure sends and receives wireless signals according to an exemplary embodiment. Fig.10b As shown, the dotted line is the radiation efficiency of the conductive housing when the key assembly is set in the traditional electronic device, and the solid line is the radiation efficiency of the conductive housing when the key assembly is set in the electronic device of the embodiment of the present disclosure; Fig.10b It can be seen that there is an efficiency dip in the conductive shell of a traditional electronic device when sending and receiving wireless signals at 2.15 GHz, while the efficiency dip in the conductive shell of the electronic device set in the embodiment of the present invention disappears, and the radiation efficiency at this position is improved by 5 dB, which can effectively improve the performance of the conductive shell corresponding to the key assembly in sending and receiving wireless signals.

[0138] Fig.11 1 is a block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device may be a mobile phone, a computer, a digital broadcast terminal, a message transceiver device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0139] Reference Fig.11 , the electronic device may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0140] The processing component 802 generally controls the overall operation of the electronic device, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0141] The memory 804 is configured to store various types of data to support the operation of the electronic device. Examples of such data include instructions for any application or method operating on the electronic device, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0142] The power supply component 806 provides power to various components of the electronic device. The power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device.

[0143] The multimedia component 808 includes a screen that provides an output interface between the electronic device and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0144] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0145] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0146] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device. For example, the sensor assembly 814 can detect the on / off state of the electronic device, the relative positioning of components, such as the display and keypad of the electronic device, and the sensor assembly 814 can also detect the position change of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device and the temperature change of the electronic device. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0147] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0148] In an exemplary embodiment, the electronic device may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0149] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in this disclosure. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0150] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A button assembly, characterized in that: include: Circuit board and key body; The circuit board comprises: a wiring layer, a metal layer and a dielectric layer located between the wiring layer and the metal layer; The routing layer includes: functional routing and reinforcement wires, the reinforcement wires are connected to the metal layer through a first via, and the metal layer is grounded; The button body contacts the functional wiring when an external force is applied, and is separated from the functional wiring when the external force is removed.

2. The key assembly according to claim 1, characterized in that: The functional wiring includes: a ground line and a signal line, and the ground line is connected to the metal layer through a second via hole.

3. The key assembly according to claim 1, characterized in that: The button body is arranged on a side of the circuit board close to the wiring layer.

4. The key assembly according to claim 3, characterized in that: The circuit board also includes: A metal reinforcing plate, located on a side of the metal layer away from the dielectric layer; The metal layer is connected to the metal reinforcement plate.

5. The key assembly according to claim 4, characterized in that: The metal layer is connected to the metal reinforcement plate through conductive adhesive.

6. The key assembly according to claim 1, characterized in that: The button body is arranged on a side of the circuit board close to the metal layer.

7. The key assembly according to claim 6, characterized in that: The metal layer is provided with an avoidance area corresponding to the position where the button body contacts the functional wiring. When the external force acts on the button body, the functional wiring is connected to the button body through the third via hole in the avoidance area.

8. The key assembly according to claim 1, characterized in that: There are multiple reinforcement lines, and the multiple reinforcement lines are distributed along the edge of the dielectric layer.

9. An electronic device, characterized in that: include: A conductive housing configured to transmit and receive wireless signals under the action of a feed signal; The key assembly according to any one of claims 1 to 8; The circuit board of the key assembly is located in the space surrounded by the conductive shell; The key body of the key assembly is at least partially exposed through the opening of the conductive shell; wherein the opening is parallel to the circuit board.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises: A conductive middle frame is located in the conductive housing and connected to the metal reinforcement plate of the key assembly; wherein the conductive middle frame is grounded.

11. The electronic device according to claim 10, characterized in that: The electronic device further comprises: The conductive adhesive member is located between the metal reinforcement plate and the conductive middle frame and is configured to bond the metal reinforcement plate and the conductive middle frame.

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